Composition for heat transfer fluid, heat transfer fluid, heat transfer device, and heat transfer method

Abstract

The present invention provides a composition for a heat transfer fluid, which contains hexafluoropropylene trimers represented by formulae (I) to (III), and which contains 10 mass% or more and less than 85 mass% of the compound represented by formula (I) with respect to the total amount of the compounds represented by formulae (I) to (III).

Description

Technical Field

[0001] This invention relates to compositions for heat transfer fluids, heat transfer fluids, heat transfer apparatuses, and heat transfer methods. Background Technology

[0002] Trimers of hexafluoropropylene (HFP) are known to be used as heat transfer fluids (Patent Document 1).

[0003] HFP trimers have low Global Warming Potential (GWP) and low toxicity, making them a promising alternative to chlorofluorocarbons (CFCs) and hydrochlorofluorocarbons (HCFCs).

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Publication No. 2020-514420 Patent Document 2: Chinese Patent Application Publication No. 11354894 Summary of the Invention

[0005] The technical problem that the invention aims to solve In semiconductor manufacturing processes, heat transfer fluids are considered for heat removal, but if the boiling point is low, there is a possibility that the vaporized heat transfer fluid may leak from the device.

[0006] The purpose of this invention is to provide a heat transfer fluid with a high boiling point.

[0007] Technical solutions for solving technical problems The present invention includes the following solutions.

[0008] [1] A composition for heat transfer fluids comprising hexafluoropropylene trimer as shown in formulas (I) to (III): The total amount of the compounds shown in formulas (I) to (III) above includes 10% by mass and less than 85% by mass of the compound shown in formula (I) above.

[0009] [2] The heat transfer fluid composition as described in [1] above, wherein, relative to the total amount of the compounds shown in formulas (I) to (III) above, it contains 30% by mass and less than 85% by mass of the compounds shown in formula (I) above.

[0010] [3] The heat transfer fluid composition as described in [1] or [2] above is used in a semiconductor manufacturing process.

[0011] [4] A heat transfer fluid comprising any one of the heat transfer fluid compositions described in any one of [1] to [3] above.

[0012] [5] The heat transfer fluid described in [4] above also contains a stabilizer.

[0013] [6] The heat transfer fluid described in [4] or [5] above is used in semiconductor manufacturing processes.

[0014] [7] The heat transfer fluid composition described in any one of [1] to [3] above, or the heat transfer fluid described in [4] or [5] above, is used for heat transfer.

[0015] [8] A heat transfer device, comprising: Devices; and A unit for transferring heat to or from the aforementioned device, the unit comprising any one of the heat transfer fluid compositions described in [1] to [3] above, or the heat transfer fluid described in [4] or [5] above.

[0016] [9] The heat transfer device as described in [8] above, wherein the device is a wafer used to manufacture semiconductors.

[0017]

[10] A semiconductor manufacturing apparatus having the heat transfer apparatus described in [8] or [9] above.

[0018]

[11] A heat transfer method comprising: The process of preparing components; and The process of transferring heat to or from the device using the heat transfer fluid composition described in any one of [1] to [3] above, or the heat transfer fluid described in [4] or [5] above.

[0019]

[12] The heat transfer method as described in

[11] above, wherein the device is a wafer used to manufacture semiconductors.

[0020] Invention Effects According to the present invention, a heat transfer fluid with a high boiling point can be provided. Detailed Implementation

[0021] When mentioned in this specification, the numerical range "A~B" also includes the lower and upper limits themselves. That is, the numerical range "A~B" means above A and below B.

[0022] The heat transfer fluid composition of the present invention will be described below.

[0023] (Composition for heat transfer fluids) The heat transfer fluid composition of the present invention comprises hexafluoropropylene trimer represented by the following formulas (I) to (III): The total amount of the compounds shown in formulas (I) to (III) above includes 10% by mass and less than 85% by mass of the compound shown in formula (I) above.

[0024] The compounds shown in formulas (I) to (III) are so-called hexafluoropropylene trimers.

[0025] In this specification, unless otherwise specified, the compounds represented by the above formula (I) include both the diastereomers E and Z.

[0026] The heat transfer fluid composition of the present invention may contain less than 85% by mass, preferably less than 80% by mass, for example less than 75% by mass, less than 70% by mass, less than 60% by mass, less than 50% by mass, or less than 40% by mass, relative to the total amount of the compounds shown in formulas (I) to (III) above. By keeping the content of the compound shown in formula (I) within the above range, the boiling point of the heat transfer fluid composition is increased. In other words, the vapor pressure of the heat transfer fluid composition becomes lower. If the vapor pressure of the heat transfer fluid composition becomes higher, it becomes easier to vaporize, and for example, in the case of use in a semiconductor manufacturing apparatus, leakage from the apparatus will increase. In addition, cavitation occurs, and flow control becomes unstable. Since the heat transfer fluid composition of the present invention has a low vapor pressure, leakage from the apparatus is suppressed, which is advantageous both environmentally and economically. In addition, cavitation can also be suppressed.

[0027] In the heat transfer fluid composition of the present invention, relative to the total amount of the compounds shown in formulas (I) to (III) above, it is preferable to include 10% by mass or more, more preferably 20% by mass or more, further preferably 30% by mass or more, even more preferably 40% by mass or more, for example, 45% by mass or more, 50% by mass or more, 55% by mass or more, 60% by mass or more, or 65% by mass or more of the compounds shown in formula (I). By making the content of the compounds shown in formula (I) within the above range, the kinematic viscosity is reduced, and for example, in the case of use in a semiconductor manufacturing apparatus, the pressure for circulating the heat transfer fluid composition can be reduced. By reducing the pressure for circulating the heat transfer fluid composition, pressure loss can be reduced, leakage from the apparatus can be reduced, and operating costs can be reduced.

[0028] In the heat transfer fluid composition of the present invention, relative to the total amount of the compounds shown in formulas (I) to (III) above, the compound shown in formula (I) can be, for example, 10% or more by mass and less than 85% by mass, 20% or more by mass and less than 85% by mass, 30% or more by mass and less than 85% by mass, 35% or more by mass and less than 85% by mass, 40% or more by mass and less than 85% by mass, 50% or more by mass and less than 85% by mass, 50% or more by mass and less than 80% by mass, 50% or more by mass and less than 70% by mass, 50% or more by mass and less than 60% by mass, 55% or more by mass and less than 80% by mass, 60% or more by mass and less than 75% by mass, or 65% or more by mass and less than 70% by mass. In the heat transfer fluid composition of the present invention, relative to the total amount of compounds shown in formulas (I) to (III) above, the compound shown in formula (I) is preferably 30% by mass or more and less than 85% by mass, more preferably 35% by mass or more and less than 80% by mass, further preferably 35% by mass or more and less than 60% by mass, and even more preferably 50% by mass or more and less than 60% by mass.

[0029] In the heat transfer fluid composition of the present invention, the mass ratio of the compound shown in formula (II) to the compound shown in formula (III) is not particularly limited, and for example it can be 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0030] The compounds shown in formulas (I) to (III) can be manufactured by conventional methods, for example, without particular limitation, by the method described in International Publication No. 2018 / 172919. Alternatively, they can be obtained by trimerization using hexafluoropropylene as a raw material by conventional methods.

[0031] The heat transfer fluid composition of the present invention may contain C9F compounds other than those shown in formulas (I) to (III). 18 The hexafluoropropylene trimer shown.

[0032] The heat transfer fluid composition of the present invention may contain hexafluoropropylene dimer.

[0033] Hexafluoropropylene dimers may contain (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0034] The heat transfer fluid composition of the present invention may contain hexafluoropropylene tetramer.

[0035] Hexafluoropropylene tetramers can contain 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0036] In addition to hexafluoropropylene trimer, the heat transfer fluid composition of the present invention also contains C m F 2m and / or C n F (2n－2) [In the formula, m is an integer greater than or equal to 4 and less than or equal to 12, excluding 9, and n is an integer greater than or equal to 4 and less than or equal to 12.]

[0037] m is an integer of 4 or higher, preferably an integer of 5 or higher, and more preferably an integer of 6 or higher. Additionally, n is an integer of 12 or lower, preferably an integer of 11 or lower, and more preferably an integer of 10 or lower. However, m does not include 9.

[0038] n is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Additionally, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. Furthermore, n is particularly preferably 9.

[0039] C m F 2m It can be a chain compound or a cyclic compound that can have substituted structures. Chain compounds can be so-called alkenes, and can be straight-chain or branched.

[0040] C n F （2n－2） It can be a chain compound or a cyclic compound with substituted structures. Chain compounds can be dienes or alkynes, and can be straight-chain or branched.

[0041] In the heat transfer fluid composition of the present invention, by making C m F 2m and / or C n F （2n－2） The coexistence with hexafluoropropylene trimer enhances its function as a heat transfer fluid. Furthermore, the heat transfer fluid composition of the present invention, by containing C... m F 2m and / or C n F （2n－2） The stability of hexafluoropropylene trimer is improved.

[0042] In the heat transfer fluid composition of the present invention, C is lower than that of hexafluoropropylene trimer. m F 2m and / or C n F （2n－2）The content of [specific component] is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 1% by mass or less. Furthermore, in the heat transfer fluid composition of the present invention, relative to hexafluoropropylene trimer, C [specific component]... m F 2m and / or C n F （2n－2） The content of [C] is preferably 0.0001% by mass or more, more preferably 0.001% by mass or more. Furthermore, C m F 2m and / or C n F （2n－2） The heat transfer fluid composition of the present invention is not an essential component and may be omitted.

[0043] In addition to hexafluoropropylene trimer, the heat transfer fluid composition of the present invention may also contain perfluorotripropylamine. The heat transfer fluid composition containing hexafluoropropylene trimer and perfluorotripropylamine can be an azeotropic liquid. By making the heat transfer fluid composition an azeotropic liquid, even when the heat transfer fluid composition is vaporized, the change in composition is small, and operation becomes easier.

[0044] Here, a near-azeotropic liquid refers to a liquid in which the difference in mole fraction between the gas phase and the liquid phase of each component is within 10%.

[0045] Perfluorotripropylamine is also known as tri(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine, as in the general formula: N(CF2CF2CF3). a (CF(CF3)CF3) 3－a (where a is an integer from 0 to 3). Perfluorotripropylamine may contain only one or more of the compounds shown in the above general formula. Preferably, it contains N(CF₂CF₂CF₃)₃, which may be included as an impurity. a (CF(CF3)CF3) 3－a (a is an integer from 0 to 2). Specifically, examples include product names such as "Fluorinert (registered trademark)" (made by 3M) (FC-3283).

[0046] The heat transfer fluid composition of the present invention may further include perfluoropolyether, a mixture of methoxytridecylfluoroheptene isomers, perfluorotributylamine, etc.

[0047] Perfluoropolyethers are preferably those with the general formula: RO-Rf 1 -R' indicates, In the formula, R and R' are the same or different, and the value is -C. m F 2m＋1 The monovalent group shown here, where m is an integer from 1 to 8, and Rf1 It is a divalent fluorinated polyoxyalkylene group containing 2 to 20 repeating units, as shown below: (i) -CFXO- (where X is F or CF3); (ii) -CF2CFXO- (where X is F or CF3); (iii) -CFXCF2O- (where X is F or CF3); (iv) -CF2CF2CF2O-; or (v) -CF2CF2CF2CF2O- or Rf 1 The divalent group shown in (vi) (vi) - (CF2) n -CFY-O- (where n is an integer from 0 to 3, Y is the general formula -ORf) 2 Z represents a monovalent group, where Rf 2 It is a divalent fluorinated polyoxyalkylene group containing 2 to 20 repeating units as shown in -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X may be the same or different, and can be F or CF3, and Z is a monovalent C. 1－5 (perfluoroalkyl).

[0048] Specific examples of perfluoropolyethers include GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by Solvay).

[0049] The mixture of methoxytridecylfluoroheptene isomers specifically includes methyl-perfluoroheptene ether (MPHE) (C7F 13 OCH3). Specifically, examples include product names such as "Opteon SF10" (manufactured by Chemours).

[0050] When the heat transfer fluid composition of the present invention comprises a mixture of perfluorotripropylamine, perfluoropolyether, and methoxytridecylfluoroheptene isomers, it reacts with C9F 18 The compounds shown have similar properties as heat transfer fluids; therefore, regardless of their proportions, the overall properties of the heat transfer fluid composition remain essentially unchanged. Therefore, in this case, the heat transfer fluid composition of the present invention preferably contains 40% to 99.9% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the overall heat transfer fluid composition. 18 The compound shown.

[0051] The heat transfer fluid composition of the present invention may further contain water. The water content in the heat transfer fluid composition is 1 ppm by mass or more, preferably 5 ppm by mass or more. By ensuring the water content is at least a certain level, for example, 1 ppm by mass or more, it is possible to suppress the charging of the composition due to a decrease in the stability of the heat transfer fluid composition. Furthermore, the water content in the heat transfer fluid composition is 1000 ppm by mass or less, preferably 500 ppm by mass or less, more preferably 100 ppm by mass or less, and even more preferably 20 ppm by mass or less. By ensuring the water content is at least a certain level, for example, 1000 ppm by mass or less, it is possible to suppress C9F during heating. 18 The decomposition of the HFP trimer shown can thus suppress the increase of fluoride ions and the rise in acidity.

[0052] In one approach, relative to C9F 18 Of the total 100 parts by mass of the compound shown, the water content is preferably 0.0001 parts by mass or more, more preferably 0.0005 parts by mass or more, and even more preferably 0.001 parts by mass or more.

[0053] On the other hand, compared to C9F 18 Of the total 100 parts by mass of the compound shown, the water content is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less.

[0054] The heat transfer fluid composition of the present invention may also contain fluoride ions. The amount of fluoride ions in the heat transfer fluid composition is preferably 0.000001% by mass or more, more preferably 0.00001% by mass or more, relative to the overall heat transfer fluid composition.

[0055] Furthermore, relative to the overall heat transfer fluid composition, the amount of fluoride ions contained in the heat transfer fluid composition of the present invention is preferably 5% by mass or less, more preferably 1% by mass or less, further preferably 0.1% by mass or less, particularly preferably 0.01% by mass or less, and even more particularly preferably 0.001% or less.

[0056] As a fluoride ion source, widely known fluoride ion sources can be used without particular limitation. Specifically, examples include hydrogen fluoride, sodium fluoride, sodium bifluoride, potassium fluoride, potassium bifluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride. These may include only one or more. Hydrogen fluoride is preferred as the fluoride ion source.

[0057] (Heat transfer fluid) The heat transfer fluid of the present invention may contain other components besides the heat transfer fluid composition of the present invention. In one embodiment, the heat transfer fluid composition itself may be a heat transfer fluid. In another embodiment, the heat transfer fluid composition may contain other components.

[0058] Other components besides the heat transfer fluid composition contained in the heat transfer fluid of the present invention can be any components, as long as they do not impair the effects and objectives of the present invention. Examples of such other components include water, stabilizers, etc.

[0059] Stabilizers function as acid scavengers or antioxidants by exerting a stabilizing effect. Their stabilizing effects can be exemplified by: preventing the decomposition of hexafluoropropylene trimer by capturing free radicals generated within the system; and preventing further decomposition of hexafluoropropylene trimer due to acids generated within the system, thus achieving an acid-removing effect.

[0060] Well-known stabilizers can be widely used as such stabilizers. Among them, considering the ability to effectively inhibit metal corrosion caused by the composition, it is preferable to use one or more stabilizers selected from unsaturated alcohol stabilizers, nitro stabilizers, amine stabilizers, phenol stabilizers, and epoxy stabilizers.

[0061] As an unsaturated alcohol stabilizer, widely known substances can be used. For example, one or more of the following can be used: 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadien-1-ol, and oleyl alcohol.

[0062] As nitro stabilizers, widely known substances can be used. Examples of aliphatic nitro compounds include nitromethane, nitrobenzene, 1-nitropropane, and 2-nitropropane. Examples of aromatic nitro compounds include one or more selected from nitrobenzene, o-dinitrobenzene, m-dinitrobenzene or p-dinitrobenzene, o-nitrotoluene, m-nitrotoluene or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-nitrophenol, m-nitrophenol or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole.

[0063] As an amine stabilizer, widely known substances can be used. For example, one or more substances selected from pentamidine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dipentylamine, tripentylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine, and diethylhydroxylamine can be used.

[0064] As a phenolic stabilizer, a wide range of well-known substances can be used. For example, one or more of the following can be used: 2,6-di-tert-butyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol.

[0065] As an epoxy stabilizer, widely known substances can be used. For example, one or more selected from epoxide, 1,2-epoxide, 1,2-epoxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0066] For the reason that the decomposition of hexafluoropropylene trimer caused by various reasons can be more effectively prevented by using stabilizers with different stabilizing effects in combination, it is preferable to include the above-mentioned epoxy stabilizer and one or more selected from unsaturated alcohol stabilizers, nitro stabilizers and phenol stabilizers.

[0067] From the viewpoint of effectively suppressing acid ionization from hexafluoropropylene trimer and suppressing metal corrosion caused by the liquid composition, the content of stabilizer in the overall heat transfer fluid is preferably 0.0001% by mass or more, more preferably 0.01% by mass or more. On the other hand, considering the avoidance of undesirable changes in the physical properties of the heat transfer fluid due to excessive addition of stabilizer, the content of stabilizer in the overall heat transfer fluid is preferably 10% by mass or less, more preferably 5% by mass or less.

[0068] (Use of heat transfer fluid composition or heat transfer fluid) The heat transfer fluid composition and heat transfer fluid of the present invention are used to remove heat from various objects to which heat is transferred, or to provide heat to objects to which heat is transferred. Objects to which heat is transferred in the present invention include articles, devices, and atmospheres that are cooled, heated, or maintained at a controlled temperature. Examples of such objects include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of objects to which heat is transferred in the present invention are not particularly limited, but include wafers used in the manufacture of semiconductor devices, microprocessors, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, packaged and unpackaged semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, missile components, etc.

[0069] The heat transfer fluid composition or heat transfer fluid of the present invention is suitable for applications requiring large heat transfer due to its low pressure loss during circulation. In a preferred embodiment, the heat transfer fluid composition or heat transfer fluid of the present invention is used in a semiconductor manufacturing process. The object to be heated in the semiconductor manufacturing process is a wafer used to manufacture semiconductor devices.

[0070] The heat transfer fluid composition or heat transfer fluid of the present invention can also be used as a two-phase immersion cooling fluid, a chiller fluid, or a Rankine cycle working fluid.

[0071] The heat transfer fluid composition or heat transfer fluid of the present invention can be used in a device designed to transfer heat using the heat transfer fluid composition or heat transfer fluid, replacing the heat transfer fluid used in the aforementioned device.

[0072] The heat transfer fluid composition or heat transfer fluid of the present invention can achieve direct replacement, near-direct replacement, or modified replacement of the heat transfer fluid in use. "Direct replacement" refers to replacement without any changes to the equipment. "Near-direct replacement" refers to replacement with almost no changes to the equipment. "Modified replacement" refers to replacement with minimal changes to the equipment (not significant changes). Preferably, the heat transfer fluid composition or heat transfer fluid of the present invention can achieve direct replacement or near-direct replacement of the aforementioned heat transfer fluids.

[0073] Whether direct substitution, near-direct substitution, or modified substitution can be achieved can be determined by whether all of the following conditions are met.

[0074] (i) The boiling point of the heat transfer fluid is at least about 80%, preferably at least about 85%, of the boiling point of the previous heat transfer fluid.

[0075] (ii) The pour point of the heat transfer fluid is the same as or below that of the previous heat transfer fluid.

[0076] (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% of the kinematic viscosity of the heat transfer fluid before replacement, preferably at least about 150%.

[0077] (iv) The heat transfer fluid is compatible with the previous heat transfer fluid in any proportion.

[0078] By setting the boiling point of the heat transfer fluid composition or heat transfer fluid of the present invention to at least about 80%, preferably at least about 85%, of the boiling point of the previous heat transfer fluid, cavitation and leakage from the device can be suppressed. The upper limit of the boiling point of the heat transfer fluid is not particularly limited; for example, it can be at least about 130% of the boiling point of the previous heat transfer fluid.

[0079] By making the pour point of the heat transfer fluid composition or heat transfer fluid of the present invention equal to or lower than the pour point of the previous heat transfer fluid, it can be used even below the existing operating temperature, thus expanding the operating temperature range. There is no particular upper limit to the pour point of the heat transfer fluid; for example, it can be 30°C or lower than the pour point of the previous heat transfer fluid.

[0080] By making the kinematic viscosity of the heat transfer fluid composition or heat transfer fluid of the present invention at at least about 200%, preferably at least about 150%, of the kinematic viscosity of the heat transfer fluid before replacement, it is possible to suppress the increase or decrease in power consumption. The kinematic viscosity is preferably compared with the kinematic viscosity at the operating temperature, but is not limited thereto. For example, it can be compared with the kinematic viscosity at any temperature from -20°C to -40°C, specifically at -20°C.

[0081] The heat transfer fluid composition or heat transfer fluid of the present invention is compatible with the previous heat transfer fluid in any proportion, making replacement operations easy.

[0082] Furthermore, by making the heat transfer fluid composition or heat transfer fluid of the present invention meet the following conditions, it is more suitable for direct replacement, near-direct replacement or modified replacement.

[0083] (v) The heat transfer fluid composition or heat transfer fluid of the present invention has a dielectric constant of less than 120% of that of the previous heat transfer fluid.

[0084] (vi) The heat transfer fluid composition or heat transfer fluid of the present invention has a dielectric strength of 90% or more of the previous heat transfer fluid.

[0085] (vii) The heat transfer fluid composition or heat transfer fluid of the present invention has a specific heat of 90% or more of the previous heat transfer fluid.

[0086] (viii) The heat transfer fluid composition or heat transfer fluid of the present invention has a thermal conductivity of 90% or more compared to the previous heat transfer fluid.

[0087] By making the dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present invention less than 120% of the dielectric constant of the previous heat transfer fluid, it can be suitable for use as a replacement composition. The lower limit of the dielectric constant of the heat transfer fluid is not particularly limited; for example, it can be more than 80% of the dielectric constant of the previous heat transfer fluid.

[0088] By making the dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present invention at 90% or more of the dielectric strength of the previous heat transfer fluid, it can be suitable for use as a replacement composition. There is no particular upper limit to the dielectric strength of the heat transfer fluid; for example, it can be 120% or less of the dielectric strength of the previous heat transfer fluid.

[0089] By making the specific heat of the heat transfer fluid composition or heat transfer fluid of the present invention more than 90% of the specific heat of the previous heat transfer fluid, it can be suitable for use as a replacement composition. There is no particular upper limit to the specific heat of the heat transfer fluid; for example, it can be less than 120% of the specific heat of the previous heat transfer fluid.

[0090] By making the thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present invention more than 90% of the thermal conductivity of the previous heat transfer fluid, it can be suitable as a replacement composition. There is no particular upper limit to the thermal conductivity of the heat transfer fluid; for example, it can be less than 120% of the thermal conductivity of the previous heat transfer fluid.

[0091] The boiling point of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably 105°C or higher, more preferably 108°C or higher. Furthermore, the upper limit of the boiling point of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited, and may be, for example, 150°C or lower, 130°C or lower, or 120°C or lower.

[0092] The pour point of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably -80°C or less, more preferably -100°C or less, and even more preferably -110°C or less. Furthermore, the lower limit of the pour point of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited; for example, it can be -180°C or more, or -160°C or more.

[0093] The kinematic viscosity of the heat transfer fluid composition or heat transfer fluid of the present invention at 25°C is preferably 5.0 cSt or less, more preferably 4.5 cSt or less, further preferably 4.0 cSt or less, and even more preferably 2.0 cSt or less. Additionally, the kinematic viscosity of the heat transfer fluid composition of the present invention at 25°C can be 0.1 cSt or more, for example, 0.2 cSt or more, 0.5 cSt or more, 0.7 cSt or more, or 0.9 cSt or more.

[0094] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.0 or less. Furthermore, the lower limit of the dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited, and for example, it can be 1.1 or more.

[0095] The dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably 40 kV or more, more preferably 50 kV or more. Furthermore, the upper limit of the dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited, and for example, it can be 150 kV or less or 100 kV or less.

[0096] The specific heat of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably 800 J / kg·K or more, more preferably 900 J / kg·K or more, and even more preferably 1000 J / kg·K or more at 30°C. Furthermore, the upper limit of the specific heat of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited, and for example, it can be 2000 J / kg·K or less or 1500 J / kg·K or less.

[0097] The thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present invention at 25°C is preferably 0.0570 W / (m·K) or more, more preferably 0.0600 W / (m·K) or more, further preferably 0.0620 W / (m·K) or more, and even more preferably 0.0650 W / (m·K) or more. Furthermore, the thermal conductivity of the heat transfer fluid composition of the present invention at 25°C can be 0.0750 W / (m·K) or less.

[0098] The boiling point of the heat transfer fluid composition or heat transfer fluid of the present invention is the temperature of the endothermic peak observed using DSC (differential scanning calorimetry) when the temperature is increased from 25°C at a rate of 5°C / min.

[0099] The pour point of the heat transfer fluid composition or heat transfer fluid of the present invention is the temperature of the endothermic peak observed when the temperature is increased at 5°C / min after cooling to below the freezing point using liquid nitrogen with DSC.

[0100] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present invention is a value observed at a frequency of 1 kHz in an environment with a temperature of 25°C and a humidity of 60% using the capacitance method.

[0101] The kinematic viscosity and density of the heat transfer fluid composition or heat transfer fluid of the present invention are values ​​measured using an Anton Paar SVM3001 kinematic viscometer.

[0102] The dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present invention is the insulation breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a specified interval and the voltage is increased at a constant rate. The measurement conditions are as follows.

[0103] Electrode shape: spherical (φ12.5mm) Electrode spacing: 2.5mm Voltage boost rate: 2kV / second Measurement atmosphere: air (22°C, 57% RH) The specific heat of the heat transfer fluid composition or heat transfer fluid of the present invention is a value obtained using DSC under the following conditions.

[0104] Measuring apparatus: Perkin-Elmer differential scanning calorimeter DSC8500 Heating rate: 10℃ / minute Standard sample: Sapphire (-Al2O3) Atmosphere gas: in a dry nitrogen gas stream Sample container: Aluminum sealed container The thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present invention is a value obtained by the transient hot wire method.

[0105] The compatibility of the heat transfer fluid composition or heat transfer fluid of the present invention is determined by whether it is compatible with the target solvent when mixed. Here, compatibility means that when the two are mixed, a homogeneous state is formed, that is, no phase separation occurs.

[0106] (Heat transfer device) The present invention also provides a heat transfer apparatus comprising: a device; and a unit for transferring heat to or from the device, the unit comprising the aforementioned heat transfer fluid composition or heat transfer fluid.

[0107] Devices can be components (assemblies), workpieces, assemblies, etc., that need to be cooled, heated, or maintained at a specified temperature or temperature range. Examples of devices include electrical components, mechanical components, and optical components. Examples include: wafers used in the manufacture of semiconductors; semiconductor elements; computers; server computers, including blade servers; disk arrays / storage systems; storage area networks; network-attached storage; storage communication systems; workstations; routers; electrical communication infrastructure / switches; wired, optical, and wireless communication devices; unit processing devices; printers; power supply devices; displays; optical devices; measurement systems including handheld systems; military electronic equipment; chemical reactors; fuel cells; heat exchangers; electrochemical cells; microprocessors; power control semiconductors; power distribution switchgear; power transformers; circuit boards; multi-chip modules; packaged or unpackaged semiconductor devices; lasers, etc., preferably wafers used in the manufacture of semiconductors.

[0108] Semiconductor components are heat-generating components mounted on devices, such as CPUs, GPUs, and SSDs. These semiconductor components are composed of elemental silicon, germanium, and compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), and silicon carbide (SiC).

[0109] When the device is a server computer, it has one or more logic boards configured within its internal space. Each logic board contains multiple heat-generating electronic components, including at least one processor such as a CPU or GPU. In addition, other heat-generating components of the computer can also be used, such as: chipsets; memory, graphics chips, network chips, RAM, power supplies, daughter cards; and storage drives such as solid-state drives and hard disk drives.

[0110] A heat transfer device is used to move heat between itself and the object being transferred using the aforementioned heat transfer fluid. Heat exchange (transfer) occurs through thermal contact with the object. For example, removing heat from the object is cooling, while providing heat is heating. Depending on the situation, different units can be configured, or a single heat transfer device can perform both cooling and heating.

[0111] As a heat transfer device, there are no particular limitations. Examples include pumps, valves, fluid storage systems, pressure control systems, coolers, heat exchangers, heat sources, radiators, refrigeration systems, active temperature control systems, and passive temperature control systems.

[0112] More specifically, as a heat transfer device, examples include temperature-controlled wafer chucks in plasma-enhanced chemical deposition (PECVD) equipment, temperature-controlled test heads for mold performance testing, temperature-controlled operating areas in semiconductor process equipment, thermal shock test baths, and constant temperature baths, with the temperature-controlled operating areas in semiconductor process equipment being the preferred option.

[0113] The object being heated in contact with the heat transfer device is the same as described above.

[0114] In addition, the present invention also provides a semiconductor manufacturing apparatus having the heat transfer device of the present invention.

[0115] (Heat transfer method) This invention discloses a heat transfer method, comprising a step of preparing a device; and a step of transferring heat to or from the device using the aforementioned heat transfer fluid composition or heat transfer fluid. Heat can be transferred by configuring a heat transfer device in thermal contact with the device. When configured in thermal contact with the device, the heat transfer device removes heat from the device, provides heat to the device, or maintains the device at a selected temperature or temperature range. The direction of heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer device.

[0116] The present invention has been described above, but the present invention is not limited to the above content and can be implemented in various ways without departing from the essential points of the present invention.

[0117] Example Hereinafter, the present invention will be described in the embodiments, but the present invention is not limited to the following embodiments.

[0118] (Manufacturing Example 1) The HFP trimer was obtained according to the method described in Chem Ber (1973), Vol. 106, pp2950-2959. The obtained HFP trimer was purified by distillation to remove impurities such as hexafluoropropylene dimers and tetramers. Then, the purified HFP trimer was separated into compounds represented by formulas (I), (II) and (III) by distillation.

[0119] The compounds represented by formulas (I), (II), and (III) obtained above were mixed in proportions shown in the table below to obtain trimer mixtures 1 to 5. Examples 1 to 3 are trimer mixtures 1 to 3, and Comparative Examples 1 to 2 are trimer mixtures 4 to 5.

[0120] [Table 1] (Determination of boiling point) For boiling point, DSC was used to determine the temperature at which the endothermic peak was observed when the temperature increased from 25°C to 5°C / min.

[0121] (Kinematic viscosity) Density and kinematic viscosity at 25°C were determined using the SVM-3001 kinematic viscosity analyzer manufactured by Anton Paar.

[0122] (thermal conductivity) Thermal conductivity at 25°C was determined by transient hot wire method.

[0123] (Pressure loss) The inner diameter of the piping is set to 7.5 cm, the length of the piping is set to 10 m, and the average flow velocity is set to 2.35 m / s. The pressure loss is calculated using the Hagen-Poisson formula.

[0124] [Table 2] Compared to the composition described in Comparative Example 1, the compositions of Examples 1-3 have lower kinematic viscosity and less pressure loss. Furthermore, compared to the composition described in Comparative Example 2, the compositions of Examples 1-3 have higher boiling points and less loss due to vaporization. Additionally, the compositions of Examples 1-3 have sufficient thermal conductivity.

[0125] Industrial availability The heat transfer fluid and heat transfer fluid composition of the present invention are applicable to a variety of applications requiring heat transfer, especially semiconductor manufacturing processes.

Claims

1. A composition for a heat transfer fluid, characterized in that: It contains hexafluoropropylene trimers represented by formulas (I) to (III) below. The compound represented by formula (I) contains 10% by mass and less than 85% by mass of the compound represented by formula (I) relative to the total amount of the compounds represented by formulas (I) to (III).

2. The composition for heat transfer fluid as claimed in claim 1, characterized in that: The compound represented by formula (I) comprises 30% by mass and less than 85% by mass of the compound represented by formula (I) relative to the total amount of the compounds represented by formulas (I) to (III).

3. The heat transfer fluid composition as described in claim 1 or 2, characterized in that: The compound represented by formula (I) comprises 50% by mass and less than 60% by mass of the compound represented by formula (I) relative to the total amount of the compounds represented by formulas (I) to (III).

4. The composition for heat transfer fluid according to any one of claims 1 to 3, characterized in that: Used in semiconductor manufacturing processes.

5. A heat transfer fluid, characterized in that: A composition comprising any one of claims 1 to 4 for heat transfer fluids.

6. The heat transfer fluid as described in claim 5, characterized in that: It also contains stabilizers.

7. The heat transfer fluid as described in claim 5 or 6, characterized in that: Used in semiconductor manufacturing processes.

8. Use of the heat transfer fluid composition according to any one of claims 1 to 4 or the heat transfer fluid according to any one of claims 5 to 7 for heat transfer.

9. A heat transfer device, characterized in that, include: Devices; and A unit for transferring heat to or from the device, the unit comprising a heat transfer fluid composition according to any one of claims 1 to 4 or a heat transfer fluid according to any one of claims 5 to 7.

10. The heat transfer apparatus as described in claim 9, characterized in that: The device is a wafer used to manufacture semiconductors.

11. A semiconductor manufacturing apparatus, characterized in that: The heat transfer device as described in claim 9 is provided.

12. A heat transfer method, characterized in that, include: The process of preparing components; and The process of transferring heat to or from the device using the heat transfer fluid composition of any one of claims 1 to 4 or the heat transfer fluid of any one of claims 5 to 7.

13. The heat transfer method as described in claim 12, characterized in that: The device is a wafer used to manufacture semiconductors.

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