Induction heating device comprising laminate on which heating coil and container detection coil are printed

Abstract

According to an embodiment of the present disclosure, the disclosed induction heating device includes a container detection coil layer patterned by printing a plurality of container detection coils in order to detect a cooking container. An induction heating device according to one embodiment of the present invention may comprise: a plurality of heating coil pattern layers patterned by printing heating coils; and an insulating layer between the plurality of heating coil pattern layers and the container detection coil layer to insulate the plurality of heating coil pattern layers and the container detection coil layer, in which the container detection coil layer, the plurality of heating coil pattern layers, and the insulating layer may be laminated and pressed to form a heating coil plate.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an induction heating device including a plurality of stacked plates on which a heating coil and a container detection coil are printed. BACKGROUND

[0002] Various types of heating devices for cooking are used to heat food at home or in a restaurant. Gas stoves fueled by gas are widely used, but recently, heating devices for cooking using electric power instead of gas to heat an object to be heated, for example, a cooking container, have been widely popularized.

[0003] A method of heating an object to be heated by using electric power is roughly classified into resistance heating and induction heating. Resistance heating is a method of heating an object to be heated, for example, a cooking container, by radiating or conducting heat generated when electric current flows through a metal resistance wire or a non-metallic heating element such as silicon carbide. Induction heating is a method of heating an object by generating an eddy current in an object to be heated including a metal component using a magnetic field generated around a coil when a high-frequency power of a certain size is applied to the coil. In such a heating device, an electromagnetic range, which applies induction heating, generally has working coils (heating coils) respectively corresponding to a plurality of objects to be heated (cooking containers) in their respective regions to individually heat the objects.

[0004] An electromagnetic range is a heating device for cooking using the principle of induction heating, and is generally referred to as an electromagnetic range, an induction heating device, or an induction cooking device. Compared to a gas stove, an electromagnetic range does not consume oxygen and does not emit exhaust gas, thus reducing indoor air pollution and reducing the increase in indoor temperature. In addition, an electromagnetic range uses an indirect method of inducing heat to the object to be heated itself, and has the advantages of high energy efficiency and stability and low burn risk (because heat is generated only from the object to be heated and the contact surface is not heated), and thus, the demand for electromagnetic ranges continues to grow recently.

[0005] Recently, an electromagnetic range allowing an object to be heated to be placed at an arbitrary position (hereinafter referred to as "arbitrary position") on a top plate has been developed. Such an electromagnetic range enables an object to be heated placed in a region in which a plurality of heating coils are disposed to be inductively heated regardless of the size and position of the object to be heated.

[0006] Generally, an induction cooktop includes a heating coil wound with copper wire and a container detection sensor capable of detecting a cooking container. However, in order to improve productivity, it is necessary to print a structure of the heating coil on a plate. Because the heating coil in the induction cooktop needs to be capable of conducting a large current, when manufacturing the heating coil printed on the plate, it is necessary to precisely design a thickness and a width of a pattern, a stacking thickness, etc. at the time of printing the heating coil. Further, in a structure in which the heating coil is printed on the plate, a container detection coil can be substituted for the container detection sensor, so that the container detection coil can also be provided on the printed plate. SUMMARY

[0007] TECHNICAL SOLUTION According to an embodiment of the disclosure, an induction heating apparatus includes a container detection coil layer patterned with a plurality of container detection coils printed thereon to detect a cooking container placed on the induction heating apparatus, a plurality of heating coil pattern layers patterned with heating coils printed thereon, and an insulation layer between the plurality of heating coil pattern layers and the container detection coil layer to insulate the plurality of heating coil pattern layers from the container detection coil layer, wherein the container detection coil layer, the plurality of heating coil pattern layers, and the insulation layer form a heating coil plate stacked and hot-pressed, and a thickness of the insulation layer is 140 µm or less.

[0008] According to an embodiment of the disclosure, a method of producing a heating coil plate for an induction heating apparatus, the heating coil plate including a container detection coil layer, includes forming a multi-layer plate including a container detection coil layer patterned with a container detection coil printed thereon, a plurality of heating coil pattern layers patterned with heating coils printed thereon, and an insulation layer between the plurality of heating coil pattern layers and the container detection coil layer to insulate and join between the plurality of heating coil pattern layers and the container detection coil layer, and forming a heating coil plate by hot-pressing the multi-layer plate, wherein a thickness of the insulation layer after hot-pressing the multi-layer plate is 140 µm or less. BRIEF DESCRIPTION OF DRAWINGS

[0009] The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0010] Figure 1a is a diagram for describing an induction heating apparatus according to an embodiment of the disclosure.

[0011] Figure 1b is a diagram for describing an induction heating apparatus according to an embodiment of the disclosure.

[0012] Figure 2 is a cross-sectional view showing a state in which a cooking container is placed on an induction heating device according to an embodiment of the disclosure.

[0013] Figure 3 is a circuit diagram of an inverter for operating a plurality of heating coils of an induction heating device according to an embodiment of the disclosure.

[0014] Figure 4a An induction heating device using a quadrangular heating coil according to an embodiment of the disclosure is illustrated.

[0015] Figure 4b An induction heating device using a quadrangular heating coil according to an embodiment of the disclosure is illustrated.

[0016] Figure 5 is a diagram illustrating an induction heating device and a heating coil according to an embodiment of the disclosure.

[0017] Figure 6 is a diagram illustrating an arbitrary position induction heating device having a heating coil wound therearound.

[0018] Figure 7a is a diagram illustrating an appearance of a wound heating coil.

[0019] Figure 7b is a diagram of an example of an induction heating device equipped with a container detection sensor.

[0020] Figure 8 A heating coil plate of an induction heating device according to an embodiment of the disclosure is illustrated.

[0021] Figure 9a is a plan view of a heating coil plate according to an embodiment of the disclosure.

[0022] Figure 9b is a cross-sectional view illustrating an interlayer connection of a heating coil plate according to an embodiment of the disclosure.

[0023] Figure 9c is a cross-sectional view illustrating a series-parallel connection between a 16-layer heating coil plate and layers of the heating coil plate according to an embodiment of the disclosure.

[0024] Figure 9d is a cross-sectional view illustrating an interlayer connection in a heating coil plate including a container detection coil layer according to an embodiment of the disclosure.

[0025] Figure 10a A pattern layer including a container detection coil according to an embodiment of the disclosure is illustrated.

[0026] Figure 10b is a diagram illustrating a container detection coil layer according to an embodiment of the disclosure.

[0027] Figure 10c FIG. 1 is a diagram illustrating a heating coil pattern layer according to an embodiment of the present disclosure.

[0028] Figure 11 FIG. 2 illustrates a process of producing a heating coil plate of an induction heating device according to an embodiment of the present disclosure.

[0029] Figure 12 FIG. 3 is a diagram illustrating a heating coil plate according to an embodiment of the present disclosure, layer by layer.

[0030] Figure 13 FIG. 4 is a diagram illustrating a specification for a heating coil pattern width according to an embodiment of the present disclosure.

[0031] Figure 14 FIG. 5 is a diagram illustrating a partial cross-section of a multi-layer plate according to an embodiment of the present disclosure.

[0032] Figure 15 FIG. 6 illustrates a characteristic curve of a temperature sensor according to an embodiment of the present disclosure.

[0033] Figure 16 FIG. 7 illustrates a characteristic curve of a temperature sensor according to an embodiment of the present disclosure.

[0034] Figure 17 FIG. 8 illustrates a temperature sensing circuit according to an embodiment of the present disclosure.

[0035] Figure 18 FIG. 9 illustrates a temperature sensing circuit according to an embodiment of the present disclosure.

[0036] Figure 19 FIG. 10 illustrates a structure in which plates of an induction heating device are connected to each other according to an embodiment of the present disclosure.

[0037] Figure 20 FIG. 11 is a diagram illustrating a structure in which a connector is connected to a heating coil plate in an induction heating device according to an embodiment of the present disclosure.

[0038] Figure 21 FIG. 12 is a diagram illustrating a structure in which a connector is mounted on a rear surface of a heating coil plate in an induction heating device according to an embodiment of the present disclosure.

[0039] Figure 22 FIG. 13 is a block diagram of an induction heating device according to an embodiment of the present disclosure.

[0040] Figure 23 FIG. 14 is a flowchart of producing a heating coil plate according to an embodiment of the present disclosure.

[0041] Figure 24 FIG. 15 illustrates a container detection coil detecting a material of a cooking container according to an embodiment of the present disclosure. Detailed Implementation

[0042] The terminology used herein will be briefly described, followed by a detailed description of embodiments of this disclosure.

[0043] Although the terms used herein have been selected from commonly used terms that are currently widely used in consideration of their function in the embodiments of this disclosure, these terms may vary depending on the intent of those skilled in the art, precedent, or the emergence of new technologies. Furthermore, in certain cases, these terms are chosen at the discretion of the applicant of this disclosure, in which case the meaning of these terms will be described in detail in the corresponding description of the embodiments of this disclosure. Therefore, the terms used herein are not merely designations, but are defined based on their meaning and content throughout the disclosure.

[0044] As used herein, the expression “at least one of a, b or c” may indicate only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c, or variations thereof.

[0045] Throughout this disclosure, when a component "includes" an element, it should be understood that, unless otherwise stated otherwise, the component may additionally include other elements without excluding them. Furthermore, as used herein, terms such as "...unit," "...module," etc., denote a unit that performs at least one function or operation, which may be implemented in hardware or software or a combination thereof.

[0046] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings to enable those skilled in the art to readily implement the embodiments. However, embodiments of the present disclosure may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. Furthermore, portions in the drawings that are not relevant to the detailed description have been omitted to ensure clarity of the embodiments of the present disclosure, and the same reference numerals in the drawings denote the same elements.

[0047] Induction heating devices heat a cooking container by inducing a magnetic field in a heating coil to cause eddy currents to flow within the container. Here, assembly is simplified and the durability of the induction heating device is increased by printing the heating coil and the container detection coil (which detects the cooking container) on a printed circuit board (PCB). However, with the heating coil and container detection coil printed on the board, a large alternating current flows through the heating coil, causing interference to the low-power container detection coil. Therefore, it is necessary to design the container detection coil to minimize interference from the heating coil. Additionally, when patterning the heating coil to form multiple pattern layers, appropriate insulation is required.

[0048] Therefore, according to embodiments of this disclosure, an induction heating device is disclosed that includes a patterned layer and multiple heating coil patterned layers, the patterned layer including a container detection coil. In this disclosure, the board may be a PCB on which patterned circuitry is printed. When multiple heating coil patterned layers are stacked, an insulating layer may be arranged between them.

[0049] Figure 1a This is a diagram illustrating an induction heating apparatus according to an embodiment of the present disclosure.

[0050] Reference Figure 1a The induction heating device 2000 according to embodiments of the present disclosure may include a plurality of heating zones 201, 202 and 203. Hereinafter, the induction heating device 2000 may be referred to as an induction heating device, an induction cooking device or simply a heating device. Figure 1a The components shown are not all necessary. The induction heating device 2000 can be implemented with more or fewer components than those shown.

[0051] The cooking container 101 can be a device for heating the contents inside the cooking container 101. The contents of the cooking container 101 can be liquids (such as water, tea, coffee, soup, juice, wine, oil, etc.) or solids (such as butter, meat, vegetables, bread, rice, etc.), but are not limited thereto.

[0052] According to embodiments of this disclosure, the cooking container 101 can wirelessly receive power from the induction heating device 2000 using electromagnetic induction. Therefore, the cooking container 101 according to embodiments of this disclosure may not require a power cord for connection to a power outlet.

[0053] According to embodiments of this disclosure, the type of cooking container 101 that wirelessly receives power from the induction heating device 2000 can vary. The cooking container 101 can be a general induction heating (IH) container (hereinafter referred to as an "IH container") comprising magnetic materials. A magnetic field can be induced within the cooking container 101 (IH metal) itself.

[0054] Cooking container 101 can be a general IH container, such as a pot, frying pan, or steamer. Cooking container 101 may include a cooking appliance. The cooking appliance may be a device that can insert into or remove a typical IH container. According to embodiments of this disclosure, the cooking appliance may be a device capable of automatically cooking the contents according to a recipe. Depending on its intended use, the cooking appliance may be referred to as a pot, rice cooker, or steamer. For example, a cooking appliance in which an inner pot for cooking rice is inserted may be referred to as a rice cooker. Hereinafter, the cooking appliance may be defined as a smart pot.

[0055] According to embodiments of this disclosure, when the cooking container 101 includes a communication interface, the cooking container 101 can communicate with the induction heating device 2000. The communication interface may include a short-range wireless communication interface, a long-range communication interface, etc. The short-range wireless communication interface may include, but is not limited to, Bluetooth communication units, Bluetooth Low Energy (BLE) communication units, Near Field Communication (NFC) units, Wireless Local Area Network (WLAN) (e.g., Wi-Fi) communication units, Zigbee communication units, Infrared Data Association (IrDA) communication units, Wi-Fi Direct (WFD) communication units, Ultra Wideband (UWB) communication units, Ant+ communication units, etc. When the cooking container 101 is remotely controlled by a server (not shown) in an Internet of Things (IoT) environment, a long-range communication interface can be used to communicate with the server. The long-range communication interface may include the Internet, computer networks (e.g., Local Area Network (LAN) or Wide Area Network (WAN)), and mobile communication units. Mobile communication units may include, but are not limited to, third-generation (3G) modules, fourth-generation (4G) modules, fifth-generation (5G) modules, long-term evolution (LTE) modules, narrowband IoT (NB-IoT) modules, and machine-type LTE (LTE-M) modules.

[0056] According to embodiments of this disclosure, the cooking container 101 can transmit information to a server (not shown) via the induction heating device 2000. For example, the cooking container 101 can transmit information acquired from the cooking container 101 (e.g., temperature information of the contents) to the induction heating device 2000 via short-range wireless communication (e.g., Bluetooth or BLE). Here, the induction heating device 2000 can connect to the server using a WLAN (Wi-Fi) communication unit or a long-range communication unit (e.g., the Internet) to transmit information acquired from the cooking container 101 to the server. Furthermore, the server can provide the user with the information received from the induction heating device 2000 from the cooking container 101 via a mobile terminal (not shown) connected to the server. According to embodiments of this disclosure, the induction heating device 2000 can directly transmit information acquired from the cooking container 101 to the user's mobile terminal via device-to-device (D2D) communication (e.g., WFD communication or BLE communication).

[0057] Additionally, according to embodiments of this disclosure, the cooking container 101 can directly transmit information (e.g., temperature information of the contents) to a server via a communication interface (e.g., a WLAN (Wi-Fi) communication unit). Furthermore, the cooking container 101 can directly transmit information obtained from the cooking container 101 (e.g., temperature information of the contents) to a user's mobile terminal via short-range wireless communication (e.g., Bluetooth or BLE) or D2D communication.

[0058] The induction heating device 2000 according to embodiments of the present disclosure may be a means of wirelessly transmitting electricity to a cooking container 101 located on a top plate of the induction heating device 2000 by means of electromagnetic induction. The induction heating device 2000 may include a working coil that generates a magnetic field for inductively heating the cooking container 101. The working coil is a coil for generating a magnetic field by means of an electric current and may be referred to as a heating coil throughout the disclosure.

[0059] Generating a magnetic field through a heating coil can include transmitting electricity by utilizing a magnetic field induced in an IH metal (e.g., iron) using magnetic induction. For example, an induction heating device 2000 can generate eddy currents in a cooking container 101 by flowing an electric current through a heating coil to create a magnetic field.

[0060] According to embodiments of this disclosure, the induction heating device 2000 may include a plurality of heating coils. For example, if the top plate of the induction heating device 2000 includes multiple cooking zones, the induction heating device 2000 may include a plurality of heating coils corresponding to the plurality of cooking zones respectively. Furthermore, the induction heating device 2000 may include a high-power cooking zone having a first heating coil disposed on an inner side and a second heating coil disposed on an outer side. The high-power cooking zone may include two or more heating coils.

[0061] The top plate of the induction heating device 2000 according to an embodiment of the present disclosure may be made of tempered glass, such as ceramic glass, so that it is not easily broken. In addition, the top plate of the induction heating device 2000 may include guide marks for guiding the cooking container 101 to the cooking zone where it needs to be positioned.

[0062] According to an embodiment of the present disclosure, the induction heating device 2000 can detect whether a cooking container 101, including a magnet, is placed on a top plate. For example, the induction heating device 2000 can detect that the cooking container 101 is on the top plate of the induction heating device 2000 based on the change in the current value (inductance) of the heating coil caused by the proximity of the cooking container 101. Additionally, when the cooking container 101 is placed on the top plate, the container detection coil of the induction heating device 2000 can detect the cooking container 101.

[0063] According to embodiments of this disclosure, the induction heating device 2000 may include a communication interface for communicating with external devices. For example, the induction heating device 2000 may communicate with the cooking container 101 or a server via the communication interface. The communication interface may include a short-range communication unit (e.g., an NFC communication unit, a Bluetooth communication unit, or a BLE communication unit), a mobile communication unit, etc.

[0064] According to embodiments of this disclosure, the induction heating device 2000 can detect the cooking container 101 located on the top plate via a communication interface. For example, the induction heating device 2000 can detect the cooking container 101 by receiving data packets sent from the cooking container 101 located on the top plate using short-range wireless communication (e.g., BLE mesh network or Bluetooth).

[0065] According to embodiments of this disclosure, even if the cooking container 101 does not include a communication interface, the induction heating device 2000 can detect whether the cooking container 101 is placed on the top plate of the induction heating device 2000 via a container detection coil.

[0066] According to embodiments of this disclosure, the induction heating device 2000 can display information related to the cooking container 101 via a user interface. For example, when the cooking container 101 is detected, the induction heating device 2000 can display information such as identification information of the cooking container 101, location information of the cooking container 101, presence or absence of the cooking container 101, or material of the cooking container 101 on a display included in the user interface.

[0067] Reference Figure 1a When a user places a cooking container 101 (e.g., a pot) on the top plate of the induction heating device 2000, the induction heating device 2000 can provide the user with identification information of the cooking container 101 (e.g., "pot"), position information of the cooking container 101 (e.g., "located on the right heating zone"), and material information of the cooking container 101 on a display 2411, which serves as an output interface. The material information of the cooking container 101 can be detected by changes in inductance when the cooking container 101 is placed on the top plate and heated, and the material information of the cooking container 101 can be information related to the degree to which the cooking container 101 is heated when the same heating power is applied. For example, there may be a case where the cooking container 101 is made of material A, in which 1 liter of water boils to 100°C in 1 minute at a heating power of 1.5 kW, and there may be a case where the cooking container 101 is made of material B, in which 1 liter of water boils to 100°C in 2 minutes at a heating power of 1.5 kW. Instructions stored in memory, executed by at least one processor of the induction heating device 2000, can cause the induction heating device 2000 to display these materials on a display in grades (e.g., grades 1 to 7), making it easy for consumers to determine whether their current cooking container 101 is made of materials with good heating efficiency.

[0068] Figure 1b This is a diagram illustrating an induction heating apparatus according to an embodiment of the present disclosure.

[0069] Figure 1b yes Figure 1aA 3D view of an induction heating device 2000 without a cooking container. Figure 1b The induction heating device 2000 may include multiple heating zones 201, 202, and 203, thereby enabling simultaneous heating of multiple cooking containers. When the induction heating device 2000 simultaneously heats multiple cooking containers, heating coils corresponding to the respective heating zones are operable. Figure 1a and Figure 1b The induction heating device 2000 is an induction heating device whose heating zone is preset to correspond to the corresponding cooking container.

[0070] Figure 2 This is a cross-sectional view showing a cooking container placed on an induction heating device according to an embodiment of the present disclosure.

[0071] Reference Figure 2 The cooking container 101 may include a magnetic material (e.g., IH metal) that is responsive to magnetic fields.

[0072] The cooking container 101 can be induction heated by the induction heating device 2000 and can be any type of container including magnetic materials. IH refers to a method of heating an IH metal using electromagnetic induction. For example, when an alternating current is supplied to the heating coil 2120 of the induction heating device 2000, a time-varying magnetic field is induced inside the heating coil 2120. The magnetic field generated by the heating coil 2120 passes through the bottom surface of the cooking container 101. When the time-varying magnetic field passes through the IH metal (e.g., iron, steel, nickel, or various types of alloys) included in the bottom surface of the cooking container 101, a current rotating around the magnetic field is generated in the IH metal. This rotating current is called an "eddy current," and the phenomenon of a current being induced by a time-varying magnetic field is called "electromagnetic induction." Heat is generated at the bottom surface of the cooking container 101 through the eddy currents and the resistance of the IH metal (e.g., iron). The contents of the cooking container 101 can then be heated by the generated heat.

[0073] Figure 3 This is an inverter circuit diagram of an induction heating device for operating multiple heating coils according to an embodiment of the present disclosure.

[0074] Reference Figure 3 The input power supply 2211 is an AC power supply. The AC voltage of the input power supply 2211 is rectified by the rectifier circuit 2112 through the electromagnetic interference (EMI) filter 2111. The rectifier circuit 2112 may use diodes as components for converting AC voltage to DC voltage. Diodes are used as components of the rectifier circuit 2112, but thyristors or other types of switching components may also be used. When the AC voltage is converted to DC voltage by the rectifier circuit 2112, the DC voltage is smoothed by DC link capacitors 2117_1 and 2117_2.

[0075] Figure 3 Two resonant circuits are shown assuming the presence of two heating coils 2120_1 and 2120_2. However, in cases where there are three heating zones and therefore three heating coils are required, additional resonant circuits can be added.

[0076] The DC voltage, smoothed by DC link capacitor 2117_1, generates a magnetic field in the first heating coil 2120_1 due to the resonance between the first heating coil 2120_1 and resonant capacitors 1 2114_1 and 22114_2, caused by the switching operation of two switching elements SW1 2113_1 and SW2 22113_2. This magnetic field generates eddy currents in the cooking container placed on the first heating coil 2120_1, thereby heating the contents of the cooking container. CT1 2115_1 is a current sensor used to detect the current flowing through the first heating coil 2120_1.

[0077] Similarly, the DC voltage smoothed by the DC link capacitor 2117_2 located on the lower side, through the switching operation of the two switching elements SW3 2113_3 and SW4 2113_4, generates a magnetic field in the second heating coil 2120_2 due to the resonance between the second heating coil 2120_2 and the resonant capacitors 3 2114_3 and 4 2114_4. The magnetic field generated in the second heating coil 2120_2 induces eddy currents in the cooking container placed on the second heating coil 2120_2, thereby heating the contents of the cooking container. CT2 2115_2 is a current sensor used to detect the current flowing through the second heating coil 2120_2.

[0078] Figure 4a and Figure 4b An induction heating device using a quadrilateral heating coil is shown according to an embodiment of the present disclosure.

[0079] Reference Figure 4a and Figure 4b The induction heating device 2000 according to embodiments of the present disclosure may include a circular first heating region 201 operated by a circular heating coil and a quadrilateral heating region 204 formed by a quadrilateral heating coil. The quadrilateral may be rectangular, and the quadrilateral heating region 204 may have a plurality of rectangular heating coils formed on its bottom surface. Optionally, the bottom surface of the quadrilateral heating region 204 may use a plurality of circular heating coils.

[0080] For example, when a quadrilateral pot is placed on the induction heating device 2000, the use of a quadrilateral heating coil in the induction heating device 2000 has the advantage of eliminating non-cooking zones. Furthermore, regardless of where the user of the induction heating device 2000 places the cooking container on the quadrilateral heating zone 204, the induction heating device 2000 can identify the cooking container and operate the quadrilateral heating coil required to heat the contents of the cooking container. Although Figure 4a and Figure 4b The illustration shows a configuration where a circular first heating zone 201 and a quadrilateral heating zone 204 are arranged together; however, the induction heating device 2000 according to embodiments of this disclosure may include only the quadrilateral heating zone. In this case, the induction heating device 2000 is referred to as an arbitrary position induction heating device because it detects the cooking container and operates the heating coil regardless of where the cooking container is placed.

[0081] Figure 5 This is a diagram illustrating an induction heating device and a heating coil according to an embodiment of the present disclosure.

[0082] Figure 5 The appearance of the induction heating device 2000 and the heating coil wound within it are shown. The wound heating coil is actually not visible from the outside. Figure 5 As shown, in the induction heating device 2000 according to an embodiment of the present disclosure, four quadrilateral heating coils 2120_3, 2120_4, 2120_5, and 2120_6 corresponding to the quadrilateral heating area 204 are sequentially wound from the upper part of the induction heating device 2000. This is only an embodiment of the present disclosure, and the number of quadrilateral heating coils 2120_3, 2120_4, 2120_5, and 2120_6 corresponding to the quadrilateral heating area 204 can be four or more, or less than four. Furthermore, in the case where the induction heating device 2000 is an induction heating device at any of the above-described locations, the first heating coil 2120_1 can also be replaced by one or more quadrilateral heating coils.

[0083] exist Figure 5 On the right side of the top plate of the induction heating device 2000, a circular first heating coil 2120_1 corresponding to the circular first heating zone 201 shown in Figure 1 is wound.

[0084] Figure 6 This is a diagram showing an induction heating device with a heating coil wound around it at any position.

[0085] Reference Figure 6The heating coil 2120 of the induction heating device 2000 is made of litz wire wound into a circle and densely arranged below the top plate of the induction heating device 2000, so that there is no heating gap regardless of where the cooking container 101 is placed. Figure 6 The induction heating device 2000 shown can be referred to as an arbitrary position induction heating device. In, for example... Figure 6 In the induction heating device shown at any location, the heating coils are densely arranged so that there are no blind spots between them. Furthermore, at least one container detection coil can also be arranged at the location where the heating coils are located.

[0086] In embodiments of this disclosure, a temperature sensor 2600 for sensing the temperature of the cooking container 101 may be arranged at the center of each heating coil 2120.

[0087] When the heating coil is as Figure 6 When the cooking container 101 is densely arranged on the induction heating device 2000 as shown, the container detection coils can also be densely arranged, and the multiple container detection coils can detect the presence of the cooking container 101 based on the current change on the container detection coils, and if present, detect where the cooking container 101 is located on the top plate of the induction heating device 2000. For example, in Figure 6 In this process, the current value flowing in the container detection coil below the location where the cooking container 101 is placed may differ from the current value flowing in the container detection coil at other locations where the cooking container 101 is not placed. Based on this difference in current value, the induction heating device 2000 can first detect the presence of the cooking container 101 and identify its position. Once the position of the cooking container 101 is determined, the induction heating device 2000 can heat the container using only the heating coil below it.

[0088] Figure 7a This is a diagram showing the appearance of a wound heating coil.

[0089] Figure 7aHeating coil 2120 is shown connected to inverter board 30 via wire 660. Inverter board 30 may include an inverter connector to which wire 660 can be connected. Heating coil 2120 can be manufactured by winding Litz wire into a circular shape, or for quadrilateral heating coils 2120_3, 2120_4, 2120_5, and 2120_6, by winding Litz wire into a quadrilateral shape. Wire can be used as Litz wire. Copper wire is often used as Litz wire. One end of each heating coil 2120 can be connected to inverter board 30 via wire 660. In the case of manufacturing all heating coils 2120 using Litz wire, in an induction heating device in which the cooking container 101 can be freely placed anywhere on the top plate, there may be blind spots between multiple heating coils; therefore, it is necessary to manufacture the heating coils small and place them densely. Furthermore, when manufacturing the heating coil 2120 using Litz wire, the process is time-consuming because the Litz wire needs to be wound manually or semi-automatically, and there is also the possibility of inconsistent quality in the heating coil products. When the quality of the heating coil products is inconsistent, the inductance determined by the heating coil may not be constant. Additionally, as... Figure 7a As shown, when using heating coils made with Litz wire, multiple wires 660 are required to connect the heating coil 2120 and the inverter board 30. This not only complicates the operation process but also makes the assembly process inefficient and increases manufacturing costs. Furthermore, wire damage can occur when long wires become tangled together. This can lead to poor quality of the wires and the induction heating device 2000.

[0090] Recently, induction heating devices 2000 and their components have become increasingly smaller, slimmer, and thinner, and consistent with this trend, the problem of reducing heat generation in circuit components has become increasingly prominent. Various cooling structures have been developed to address the issue of heat generation in circuit components, but as the number of heating coils increases, the connections between circuit components become more complex, and the space for arranging heating coils, the wires connected to the heating coils, and the inverter board becomes narrower, making it difficult to design circuit components and cooling structures.

[0091] Therefore, to solve this problem, the plurality of heating coils of the induction heating device 2000 according to embodiments of the present disclosure can be manufactured by printing a plurality of heating coils on a heating coil plate instead of by winding Litz wire. Furthermore, the heating coil plate can be manufactured by hot-pressing a multilayer board, on which a plurality of heating coil pattern layers printed with heating coils are stacked. In addition, the multilayer board may include an insulating material for insulation, and the respective heating coil pattern layers made using the printed heating coils.

[0092] Alternatively, the heating coil board produced in this manner can be connected to the inverter board 30 via wire 660, but a method of connecting the boards (board-to-board connection) using fixed vertical connectors mounted on each board can also be used. According to embodiments of this disclosure, the heating coil board can be connected to the inverter board or intermediate board via connectors.

[0093] Heating coils 2120 printed in the heating coil plate resonate with resonant capacitors (not shown) on the inverter board 30 due to the drive of the inverter, thereby heating the cooking container 101. The inverter board 30 may also be referred to as an inverter printed circuit board assembly (PBA).

[0094] Figure 7b This is an illustration of an example of an induction heating device equipped with a container detection sensor.

[0095] The heating coil 2120 may include a first heating coil 2120_1 wound on the inside and a second heating coil 2120_2 wound on the outside. The container detection sensor 2710 may be located in the center of the first heating coil 2120_1 to detect whether the cooking container is placed on the top plate of the induction heating device 2000. Figure 7b An example is shown where the container detection sensor 2710 is installed in the induction heating device 2000 without using the heating coil plate 10 and using a heating coil wound with Litz wire. In use Figure 7b In the case of the container detection sensor 2710 shown, manual work is required to wind the first heating coil 2120_1 and the second heating coil 2120_2, as well as an assembly work to integrate the heating coil 2120 with the container detection sensor 2710. Figure 7b Unlike other heating coil boards, which are produced by patterning heating coils onto a plate, the plate can also be patterned with a printed container detection coil capable of detecting the container. This reduces assembly processes and the number of parts, thus lowering manufacturing costs. Furthermore, using a heating coil board reduces the number of parts and eliminates the need for coil winding, preventing quality problems that may arise from wire winding.

[0096] Figure 8 A heating coil plate of an induction heating device according to an embodiment of the present disclosure is shown.

[0097] Figure 8 A heating coil plate 10 with a patterned heating coil 2120 is shown.

[0098] The heating coil can be arranged in the form of a conductor printed on the heating coil plate 10. In embodiments of this disclosure, a heating coil plate 10 having two or more layers of heating coil patterns stacked thereon can be used as a heating coil plate 10. In order to achieve a high-power (maximum exceeding 3kW) induction heating device by using a heating coil plate 10 having two or more layers of heating coil patterns stacked thereon, the thickness of the copper in the first layer (the thickness of the coil pattern) needs to be about 500μm. This may increase the skin effect, thereby increasing coil losses. In order to achieve high heating power while reducing the skin effect, a method can be considered to reduce the thickness and width of the heating coil pattern and ensure current capacity by connecting multiple heating coil patterns in parallel. In this case, the number of interlayer connections for connecting multiple heating coils in parallel may increase, and the heating coil losses due to line length may also increase. Therefore, according to embodiments of this disclosure, a multilayer board having multiple layers of heating coil patterns stacked thereon (which can reduce the number of interlayer connections and reduce heating coil losses) and a heating coil plate 10 manufactured by hot pressing the multilayer board can be used. Here, "multilayer" may include four or more layers. In embodiments of this disclosure, the patterned layer having the heating coil 2120 can be disposed on the heating coil plate 10 in sheet form. For example, the heating coil 2120 can be in the form of a printed circuit board formed on the heating coil plate 10 using a patterning process with a photoresist or the like. In embodiments of this disclosure, multiple heating coils may have the same shape and size. Multiple heating coils do not necessarily have the same shape and size. For example, at least one of the multiple heating coils may differ from the other heating coils in at least one aspect of shape and size.

[0099] The heating coil plate 10 can replace the one set in the heating coil plate 10. Figure 6 The induction heating device 2000 shown contains multiple heating coils. In this way, an induction heating device 2000 with heating coil plate 10 at any position can be produced.

[0100] Figure 9a This is a plan view of a heating coil plate according to an embodiment of the present disclosure.

[0101] Reference Figure 9aThe heating coil board 10 can be a printed circuit board formed by stacking four or more heating coil pattern layers (PL) on which coil patterns CP are formed. Insulating layers can be interposed between the heating coil pattern layers. According to the induction heating device 2000 having the heating coil board 10, because the heating coil board 10 has a stacked structure containing four or more layers, the thickness of the heating coil in one layer (e.g., the thickness of copper) can be significantly reduced, the width of the pattern can be reduced, and therefore the effect of the skin effect can be reduced to reduce coil losses. This is only an embodiment of the present disclosure, and the heating coil board 10 may have a stacked structure of five or more layers.

[0102] In the heating coil plate 10, one or more coil patterns are formed in each of the multiple heating coil pattern layers. For example, the coil pattern CP can be helical. Figure 8 As shown, the coil pattern CP can be formed from multiple coil elements that are approximately rectangular in plan view. For example, the coil pattern CP can be formed from multiple coil elements that are circular in plan view. The shape of the coil elements forming the coil pattern CP is not limited to the above-described shapes. The heating coil plate 10 can have multiple series pattern groups. The multiple series pattern groups can be connected in parallel with each other. The multiple series pattern groups can have multiple coil patterns CP connected in series respectively. The multiple series pattern groups can be configured such that the coil patterns formed on adjacent pattern layers in multiple pattern layers are connected in parallel with each other. As a result, the coils formed in multiple pattern layers can form a parallel connection relationship, and a large current capacity can be achieved while reducing heating coil losses. The multiple coil patterns CP that form multiple series pattern groups can be formed in four or more pattern layers. At least one of the multiple series pattern groups can have a combination of multiple pattern layers that are different from the other series pattern groups. Due to these configurations, the wiring structure can be simplified, the number of interlayer connections can be reduced, and therefore, power losses can be reduced. In other words, the impedance mismatch between parallel-connected series pattern groups is reduced through the mutual impedance in each pattern layer. Therefore, theoretically, the efficiency characteristics can be maintained equivalent to those of a full-layer series connection structure. Furthermore, compared to a full-layer series connection structure, the number of inter-layer connections is reduced, thus reducing inter-layer wiring resistance and enabling designs with lower losses than a full-layer series connection structure. At least two of the multiple series pattern groups can have the same combination of multiple pattern layers. As a result, the number of inter-layer connections can be reduced.

[0103] In embodiments of this disclosure, in the heating coil plate 10, two terminals (input terminal 2a and output terminal 2b) for parallel connection of multiple series pattern groups included in each stacked layer can be formed outside the coil pattern CP. Additionally, electrical connections between pattern layers can be achieved by conductors (through holes TH or vias) formed through the heating coil plate 10. The through holes TH penetrate all pattern layers (PL) and enable electrical connections between layers.

[0104] Furthermore, in the heating coil plate 10 according to an embodiment of the present disclosure, the coil pattern CP can be connected such that the input terminal 2a is located on the uppermost layer of the plurality of pattern layers (PL), and the output terminal 2b is located on the lowermost layer of the plurality of pattern layers (PL). According to this configuration, when the multilayer coil pattern CP is formed, a low-power sensor can be mounted on the upper layer, and the low-power sensor can be easily formed into a thin-film structure.

[0105] Figure 9b This is a cross-sectional view showing the interlayer connection of the heating coil plate according to an embodiment of the present disclosure.

[0106] Figure 9b This is a cross-sectional view showing the interlayer connections in an eight-layer heating coil plate 10 according to an embodiment of the present disclosure. (Refer to...) Figure 9b The heating coil board 10 can be a PCB formed by stacking four or more patterned layers (PLs) on which coil patterns (CPs) are formed. Insulating layers with two or more prepreg insulating layers stacked on top can be arranged between the patterned layers.

[0107] Figure 9b A heating coil plate 10, formed by stacking eight heating coil pattern layers (layer 1 through layer 8) according to an embodiment of the present disclosure, is shown. According to an embodiment of the present disclosure, the heating coil plate 10 includes four heating coil pattern layers 11, 12, 13, and 14, and four other heating coil pattern layers 15, 16, 17, and 18. In an embodiment of the present disclosure, the four heating coil patterns 11, 12, 13, and 14 may each have four coil patterns CP connected in series. The four heating coil pattern layers 11, 12, 13, and 14 are connected in parallel to each other via through-holes 2c (TH).

[0108] exist Figure 9b In the above, it is assumed that multiple heating coil pattern layers 11, 12, ..., 18 are, from top to bottom, the first heating coil pattern layer 11, the second heating coil pattern layer 12, the third heating coil pattern layer 13, the fourth heating coil pattern layer 14, the fifth heating coil pattern layer 15, the sixth heating coil pattern layer 16, the seventh heating coil pattern layer 17, and the eighth heating coil pattern layer 18.

[0109] Reference Figure 9bThe first heating coil pattern layer 11 can be connected in series with the eighth heating coil pattern layer 18 formed in the eighth layer through the through hole 2d. The second heating coil pattern layer 12 can be connected in series with the seventh heating coil pattern layer 17 formed in the seventh layer through the through hole 2d. The third heating coil pattern layer 13 in the third layer can be connected in series with the sixth heating coil pattern layer 16 formed in the sixth layer through the through hole 2d. The fourth heating coil pattern layer 14 in the fourth layer can be connected in series with the fifth heating coil pattern layer 15 formed in the fifth layer through the through hole 2d.

[0110] therefore, Figure 9a and Figure 9b The heating coil pattern layers 11, 12, 13, and 14 shown have different combinations of pattern layers connected in series. When the four heating coil pattern layers 11, 12, 13, and 14 are connected in parallel, the coil patterns CP formed on different pattern layers can be connected in parallel.

[0111] Furthermore, in the heating coil plate 10 according to an embodiment of this disclosure, the coil pattern CP can be connected such that the input terminal 2a is located on the uppermost layer of the plurality of heating coil pattern layers, and the output terminal 2b is located on the lowermost layer of the plurality of heating coil pattern layers. According to this structure, when a low-power sensor is mounted in the upper layer when forming the plurality of heating coil pattern layers, it is easy to form the low-power sensor as a thin-film structure. The low-power sensor may include a container detection coil.

[0112] The multi-layer structure of the heating coil plate 10 is not limited to the above-mentioned eight-layer structure.

[0113] Figure 9c This is a cross-sectional view showing the series-parallel connections between the layers of the 16-layer heating coil plate and the heating coil plate according to an embodiment of the present disclosure.

[0114] Figure 9c The connection section diagram is related to the stacking method. Figure 9b The similarities lie in the fact that multiple coil patterns connected in series can be arranged in a single heating coil pattern layer.

[0115] A heating coil plate 10 may have multiple series pattern groups. These multiple series pattern groups may be connected in parallel. Each series pattern group may have multiple coil patterns CP connected in series. The multiple series pattern groups may be configured such that adjacent pattern layers within the multiple heating coil pattern layers are connected in parallel. As a result, the coils formed in the multiple heating coil pattern layers can form a parallel connection, and a large current capacity can be achieved. The multiple coil patterns CP forming multiple series pattern groups may be formed in four or more pattern layers. At least one of the multiple series pattern groups may have a combination of multiple heating coil pattern layers different from the other series pattern groups. Accordingly, the wiring structure can be simplified, the number of interlayer connections can be reduced, and therefore, power loss can be reduced. In other words, the impedance mismatch between the parallel-connected series pattern groups is reduced through the mutual impedance in each heating coil pattern layer; therefore, theoretically, efficiency characteristics equivalent to those of a full-layer series connection structure can be maintained. Furthermore, compared to a full-layer series connection structure, the number of interlayer connections is reduced, thus reducing interlayer wiring resistance, enabling a design with lower losses than a full-layer series connection structure. At least two of the multiple series-connected pattern groups may have the same combination of multiple heating coil pattern layers. As a result, the number of interlayer connections can be reduced.

[0116] Figure 9c A heating coil plate 10, formed by stacking 16 heating coil pattern layers (first to sixteenth layers) according to an embodiment of the present disclosure, is shown. For example, the heating coil plate 10 includes four heating coil pattern layers 11, 12, 13, and 14. According to an embodiment of the present disclosure, the four heating coil pattern layers 11, 12, 13, and 14 may each include four coil patterns CP connected in series. The four heating coil pattern layers 11, 12, 13, and 14 are connected in parallel to each other via through-holes 2c.

[0117] For example, refer to Figure 9c The first heating coil pattern layer 11 in the first layer can be connected in series with the heating coil pattern (CP) layer formed in the eighth layer. The second heating coil pattern layer 12 in the second layer can be connected in series with the heating coil pattern (CP) layers formed in the seventh, tenth, and fifteenth layers. The third heating coil pattern layer 13 in the third layer can be connected in series with the heating coil pattern (CP) layers formed in the sixth, eleventh, and fourteenth layers. The fourth heating coil pattern layer 14 in the fourth layer can be connected in series with the heating coil pattern (CP) layers formed in the fifth, twelfth, and thirteenth layers.

[0118] therefore, Figure 9cThe heating coil pattern layers 11, 12, 13, and 14 shown have different combinations of heating coil pattern layers connected in series. In the case where the four heating coil pattern layers 11, 12, 13, and 14 are connected in parallel, the coil patterns CP formed on different heating coil pattern layers are connected in parallel.

[0119] According to an embodiment of this disclosure, the electrical connection between the heating coil pattern layers is formed by a conductor (through-hole TH) formed through the heating coil plate 10. The through-hole TH is formed through all the heating coil pattern layers. The four coil patterns CP forming the respective heating coil pattern layers 11, 12, 13 and 14 can be connected in series via an intermediate terminal 2c and a plurality of connecting terminals 2d. The intermediate terminal 2c is formed using a conductor and installed on the outside of the coil pattern CP, and the plurality of connecting terminals 2d are formed using conductors and installed inside the coil pattern CP.

[0120] Furthermore, in the heating coil plate 10 of the embodiments of this disclosure, the coil pattern CP can be connected such that the input terminal 2a is located on the uppermost layer of the plurality of heating coil pattern layers and the output terminal 2b is located on the lowermost layer of the plurality of heating coil pattern layers. According to this structure, when a low-power sensor is mounted in the upper layer when forming multiple heating coil pattern layers, it is easy to form the low-power sensor as a thin-film structure. According to embodiments of this disclosure, the low-power sensor may include a container detection coil as a container detection sensor.

[0121] Figure 9d This is a cross-sectional view showing the interlayer connection in a heating coil plate including a container detection coil layer according to an embodiment of the present disclosure.

[0122] Figure 9d The heating coil plate 10 includes a container detection coil layer 33 in its uppermost layer, and the container detection coil layer 33 includes a container detection coil.

[0123] According to an embodiment of the present disclosure, the container detection coil layer 33 is a pattern layer on which a plurality of container detection coils are printed for detecting a cooking container 101 placed on the top plate of the induction heating device 2000.

[0124] According to embodiments of the present disclosure, at least two prepreg insulation layers may be included between the container detection coil layer 33 and the first heating coil pattern layer 11 to insulate the two layers while bonding them together. According to embodiments of the present disclosure, each of the two prepreg insulation layers may be an insulation layer comprising 60% to 80% of the total composition of a resin content.

[0125] According to embodiments of this disclosure, Figure 9dThe heating coil plate 10 is manufactured by hot-pressing a multilayer board comprising a container detection coil layer 33, a first heating coil pattern layer to a sixteenth heating coil pattern layer, and a connector connection signal layer 35 located at the bottom. According to embodiments of the present disclosure, during the hot-pressing process, the conductors of the container detection coil layer 33 in the uppermost layer of the multilayer board, or the conductors included in any of the first to sixteenth heating coil pattern layers, do not come into contact with the reinforcing fibers of the prepreg insulation layer, thus maintaining insulation.

[0126] In embodiments of this disclosure, a first end of each of a plurality of container detection coils included in the container detection coil layer 33 can penetrate the heating coil plate 10 to connect to the lowermost connector connection signal layer 35 via a through-hole 2e. The first end of the container detection coil connected to the connector connection signal layer 35 via the through-hole 2e can be connected to a connector mounted on the connector connection signal layer 35. Furthermore, a second end of each of the container detection coils can be connected on the container detection coil layer 33 to a terminal of a connector disposed on the heating coil plate 10. The first and second ends of each of the plurality of container detection coils can be connected via connectors to a processor included in the inverter board 30 or the intermediate board 20.

[0127] In embodiments of this disclosure, a minimum space through which a through hole 2e can be vertically passed through can be provided in the coil pattern of the heating coil, such that the through hole 2e at the first end of each of the container detection coils connected to the container detection coil layer 33 does not contact the conductors of the first heating coil pattern layer to the sixteenth heating coil pattern layer when passing through the first heating coil pattern layer to the sixteenth heating coil pattern layer.

[0128] Figure 10a A patterned layer including a container detection coil is shown according to an embodiment of the present disclosure.

[0129] Figure 10a The container detection coil layer 33, which includes the container detection coil 2700, is shown in the heating coil plate 10.

[0130] Figure 10aThe container detection coil layer 33 includes eight container detection coils 2700 patterned as a pattern. Additionally, according to embodiments of this disclosure, the container detection coil layer 33 includes holes 25 through which a temperature sensor capable of sensing the temperature of the cooking container can pass. In some cases, the holes 25 through which the temperature sensor can pass may not be included in the container detection coil layer 33. In the container detection coil layer 33 of FIG. 10, the pattern of the container detection coils 2700 has a circular shape and can be arranged in a planar space with as little vertical overlap as possible with heating coils patterned in another layer. The reason why the container detection coils 2700 and the heating coils need to be vertically overlapped with each other as little as possible is because the heating coils have a high power level. Heating coils with high power levels can affect the detection operation of container detection coils 2700 with relatively low power levels. Therefore, in embodiments of this disclosure, the container detection coils can be printed as close as possible to the edge of the diagonal of the plate on which the container detection coils are printed, and the heating coils can be printed at the center of the plate on which the heating coils are printed.

[0131] The container detection coil 2700 may include: a first end 2701 extending downwards through a through-hole and a via hole in the center of a circle in which the container detection coil 2700 is patterned, to a connector connection signal layer 35 (the lowest layer of the heating coil plate 10); and a second end 2703 for connection to a connector or wire disposed on the container detection coil layer 33. The induction heating device 2000 can detect whether a container is on the top plate 5 of the induction heating device 2000 by measuring the change in inductance of the container detection coil 2700 through the first end 2701 and the second end 2703. This is merely an example, and in the case where the heating coil plate 10 does not include a separate connector connection signal layer 35 and the lower part of the lowest heating coil pattern layer can be used as a printed pattern, the first end extending downwards through the through-hole to the lowest layer of the heating coil plate 10 can be connected to a connector or wire located at the lower part of the lowest heating coil pattern layer.

[0132] Figure 10b This is a diagram illustrating a container detection coil layer according to an embodiment of the present disclosure.

[0133] Figure 10b The container detection coil 2700 is shown printed on the container detection coil layer 33.

[0134] Figure 10c This is a diagram illustrating a heating coil pattern layer according to an embodiment of the present disclosure.

[0135] Assumption Figure 10c The heating coil pattern layer is the first heating coil pattern layer 11, which is one of a plurality of heating coil pattern layers. Figure 10b The container detection coil layer 33 and Figure 10cThe first heating coil pattern layer 11 can be stacked to form part of a multilayer board. When the multilayer board is hot-pressed, the heating coil board 10 can be produced.

[0136] Figure 10b The container detection coil 2700 on the container detection coil layer 33 can be printed on Figure 10c In the region 2707 where the heating coils of the first heating coil pattern layer 11 are stacked vertically as little as possible. Because Figure 10b The container detection coil 2700 is printed on Figure 10c In the region 2707 where the heating coils are stacked vertically as little as possible, the container detection coil 2700 with a low power level can minimize electrical interference from the heating coil with a high power level.

[0137] Figure 11 The process of producing a heating coil plate for an induction heating device according to an embodiment of the present disclosure is illustrated.

[0138] Figure 11 The final manufacturing process of copper clad laminate (CCL) 1110 is shown. CCL is a PCB substrate formed by stacking multiple heating coil pattern layers. CCL can be produced using copper foil bonded to one or both sides of the PCB core. CCL is formed by stacking copper foil on a prepreg (pre-impregnated material) 1120.

[0139] Precursor 1120 is a sheet resin product in which a matrix is ​​pre-impregnated into reinforcing fibers 1130 and becomes semi-cured by permeating the reinforcing fibers 1130 with a thermosetting resin 1140. The precursor is an insulating material, but is also used as an adhesive to bond individual heating coil pattern layers.

[0140] Figure 12 This is a diagram showing the heating coil plate according to an embodiment of the present disclosure, layer by layer.

[0141] Reference Figure 12 The multilayer board 300 according to embodiments of the present disclosure may include a plurality of heating coil pattern layers (e.g., eight heating coil pattern layers 11, 12, ..., 18) and a plurality of insulating layers (e.g., nine insulating layers 311, 312, ..., 319). An insulating layer 312 includes, for example, two prepreg insulating layers 312a and 312b. The heating coil board 10 is produced by hot-pressing the multilayer board 300.

[0142] exist Figure 12In this paper, the PCB substrate used to produce the board forming a heating coil pattern layer 11 has dimensions of 1020 (mm) × 1200 (mm) or 1020 (mm) × 1020 (mm). When producing the board by printing the heating coil pattern on the PCB substrate, in order to provide high power while reducing the skin effect, it is necessary to reduce the thickness of the copper patterned as a conductor and the width of the heating coil pattern. Meanwhile, the current capacity can be achieved by connecting multiple heating coil pattern layers 11, 12, ..., 18 in parallel. However, in order to connect multiple heating coil pattern layers 11, 12, ..., 18 in parallel, the number of interlayer connections increases, and the coil loss caused by the wiring length also increases. In order to reduce the number of interlayer connections while reducing coil loss, multiple series patterns can be provided between the multiple heating coil pattern layers 11, 12, ..., 18. Alternatively, multiple series patterns can be connected in parallel with each other. In embodiments of this disclosure, it is preferable that at least one series pattern is stacked into four or more layers.

[0143] According to embodiments of this disclosure, the upper four layers 11, 12, 13, and 14 of the plurality of heating coil pattern layers 11, 12, ..., 18 can be electrically connected in parallel with each other. Additionally, the lower four layers 15, 16, 17, and 18 of the plurality of heating coil pattern layers 11, 12, ..., 18 can be electrically connected in parallel with each other. Here, although "upper" and "lower" are relative terms, "upper heating coil pattern layer" can refer to those heating coil pattern layers 11, 12, ..., 18 that are closer to the top plate of the induction heating device 2000.

[0144] The four heating coil pattern layers, which are electrically connected in parallel, can be connected in series. The series connection between the heating coil pattern layers can be located between the first heating coil pattern layer 11 and the eighth heating coil pattern layer 18, between the second heating coil pattern layer 12 and the seventh heating coil pattern layer 17, between the third heating coil pattern layer 13 and the sixth heating coil pattern layer 16, and between the fourth heating coil pattern layer 14 and the fifth heating coil pattern layer 15. (Refer to the above.) Figure 10b A detailed description of it is provided.

[0145] However, this is only an embodiment of the present disclosure, and when only the first heating coil pattern layer 11 to the fourth heating coil pattern layer 14 are provided, the first heating coil pattern layer 11 and the second heating coil pattern layer 12 can be electrically connected in parallel with each other, and the third heating coil pattern layer 13 and the fourth heating coil pattern layer 14 can be electrically connected in parallel with each other. Alternatively, the first heating coil pattern layer 11 and the fourth heating coil pattern layer 14 can be electrically connected in series with each other, and the second heating coil pattern layer 12 and the third heating coil pattern layer 13 can be electrically connected in series with each other.

[0146] In embodiments of this disclosure, the thickness of each of the plurality of heating coil pattern layers 11, 12, ..., 18 may be from about 60 μm to about 82 μm.

[0147] In embodiments of this disclosure, the thickness of the heating coil plate 10 formed by hot-pressing a multilayer board 300 comprising a container detection coil layer 33, a connector connection signal layer 35, and 18 heating coil pattern layers can be 3.3 mm or less. However, this is only an embodiment of this disclosure, and the thickness of the heating coil plate 10 formed by hot-pressing the multilayer board 300 can be from about 2.5 mm to about 4.0 mm.

[0148] When the manufacturer of the induction heating device 2000 orders a CCL, the CCL can be produced as comprising two heating coil pattern layers and an insulating layer between them. In this case, an insulating layer can be inserted between multiple CCLs to produce a multilayer board 300. Here, the insulating layer can be produced by stacking two prepreg insulating layers.

[0149] Reference Figure 12 The first CCL 3001 may include a first heating coil pattern layer 11, an insulating layer 312, and a second heating coil pattern layer 12. The second CCL 3002 may include a third heating coil pattern layer 13, an insulating layer 314, and a fourth heating coil pattern layer 14. When the manufacturer of the induction heating device 2000 receives the ordered CCLs, insulating layers may be stacked between the CCLs to produce the multilayer board 300. For example, the insulating layer 313 may be interposed between the first CCL 3001 and the second CCL 3002. The insulating layer 313 may be produced by stacking two prepreg insulating layers.

[0150] Finally, when the multilayer board 300 is hot-pressed, the CCLs are hardly hot-pressed (because they have already been hot-pressed), while the insulating layers between the CCLs (e.g., insulating layer 313) have a high compressibility. In embodiments of this disclosure, the insulating layers inside the CCLs (e.g., insulating layer 312) may have a thickness of 140 μm or less after hot-pressing. In contrast, the insulating layers between the CCLs (e.g., insulating layer 313) may have a thickness of 120 μm or less after hot-pressing.

[0151] Figure 12 Eight heating coil pattern layers are shown, but this is only an embodiment of the present disclosure, and the number of heating coil pattern layers can be adjusted according to the design, based on embodiments of the present disclosure. For example, the number of heating coil pattern layers may be four. Alternatively, in embodiments of the present disclosure, a heating coil board may be used in which eight CCLs are stacked, each CCL comprising two heating coil pattern layers and an insulating layer between them, to form a total of 16 heating coil pattern layers.

[0152] likeFigure 12 As shown, compared to producing heating coils by winding Litz wire, applying heating coils to pattern the PCB simplifies the manufacturing process and reduces manufacturing costs. Furthermore, when using heating coils to pattern the PCB, the inductance accuracy of the heating coil is higher than that of heating coils produced by winding Litz wire, thus enabling a constant heating level.

[0153] Furthermore, for the same heating output, using heating coils to pattern the PCB reduces copper usage by one-third compared to producing heating coils by winding Litz wire, thus reducing copper consumption.

[0154] When using 1 ounce (oz) of copper on a PCB substrate (1020 mm × 1200 mm or 1020 mm × 1020 mm) used for producing the heating coil pattern layers, insulation can be achieved between multiple insulating layers 311, 312, ..., 319 and multiple heating coil pattern layers 11, 12, ..., 18 when a multilayer board on which the PCB substrate is stacked is hot-pressed, however, the amount of copper may be insufficient for heating coils requiring high power. Insufficient copper can lead to overheating in the heating coil pattern and increased heat loss. To reduce the heat generated by the heating coil pattern, the width of the heating coil pattern can be increased; however, increasing the pattern width makes it difficult to achieve a large number of turns, thus making it difficult to achieve an appropriate inductance, and increasing the pattern width is challenging in terms of design. Therefore, there is an option to increase the thickness of the heating coil pattern.

[0155] Figure 13 This is a diagram illustrating the specifications for the pattern width of a heating coil according to an embodiment of the present disclosure.

[0156] Unlike copper patterns on a regular PCB, heating coil patterns need to handle high power capacity. Therefore, because a large current needs to flow through the patterned heating coil, the width of the pattern needs to be greater than that of a normal copper pattern, or the thickness (height) of the pattern needs to be greater.

[0157] To increase the thickness of the heating coil pattern, 2 ounces (oz) of copper can be used on the PCB substrate instead of the 1 ounce (oz) of copper used in the prior art.

[0158] Figure 13 A cross-sectional view of a copper pattern with 2 ounces of copper on a PCB substrate is shown. Figure 13As shown, when using 1 ounce of copper, the height of the copper pattern is 35 μm, while when using 2 ounces of copper, the height is 60 μm or greater. The width (Gerber width) is the width required by the customer producing the induction heating unit 2000, and the upper part of the pattern can be between 95% and 125% of the ordered width A, while the lower part of the pattern can be between 100% and 130% of the ordered width A. Typically, when liquid copper melts, as... Figure 13 As shown, it is trapezoidal in shape and the widths of the top and bottom are slightly different.

[0159] However, when using 2 ounces or more (e.g., 2 to 3 ounces) of copper on a PCB substrate, the copper becomes too thick, therefore, during hot pressing... Figure 12 When using a multilayer board 300, a problem may occur where a semi-cured insulating layer 312a is pressed and comes into contact with a copper coil in a liquefied state.

[0160] Figure 14 It shows Figure 12 The partial cross-section 37 of the heating coil shown.

[0161] Figure 14 This is a diagram showing a partial cross-section of a multilayer board according to an embodiment of the present disclosure.

[0162] Referring to a partial cross-section 37 of the heating coil, due to thermal pressure, copper comes into contact with reinforcing fibers included in the intermediate insulating material. Therefore, according to embodiments of this disclosure, in order to prevent such... Figure 14 The copper-reinforcing fiber contact shown is achieved using an insulating layer with at least two prepreg layers stacked. In embodiments of this disclosure, the thickness of the at least two prepreg layers before hot pressing may be less than or equal to about 140 μm. In embodiments of this disclosure, the at least two prepreg layers need to have a thickness of 130 μm or less or 140 μm or less before hot pressing, such that the thickness of the heating coil plate after hot pressing is 3.3 mm or less.

[0163] A prepreg insulating layer 312a includes a resin component that may leak out during the fabrication and thermosetting of the PCB. As described above, the leaked resin component comes into contact with the reinforcing fibers included in the prepreg insulating layer 312a, resulting in areas of reduced adhesion. When bonding between patterned layers through the prepreg insulating layer 312a is not properly performed, the heating coil pattern may warp internally when current flows through the heating coil, and when the heating coil pattern warps, moisture or air can seep in, causing the PCB to swell. To prevent this phenomenon, such as... Figure 12 As shown, a method can be used to stack two prepreg insulating layers 312a and 312b as insulating layers between heating coil pattern layers.

[0164] An insulating layer with a resin content of 60% (RC60) to 80% (RC80) is used as a prepreg insulating layer, and two or more prepreg insulating layers 312a and 312b are stacked. The thickness of either prepreg insulating layer 312a or 312b before hot pressing can be 70 μm or less. Therefore, prepreg insulating layers 312a and 312b can have a thickness of 130 μm or less, or 140 μm or less, before hot pressing. "Resin content of 60% (RC60) to 80% (RC80)" means that the resin accounts for 60% to 80% of the total composition of the compounds included in the prepreg insulating layer.

[0165] In the following text, reference will be made to Figure 12 Provide a description.

[0166] Each layer of the multilayer board 300 constituting an embodiment of the present disclosure may include a hole 25 through which a temperature sensor can pass. The temperature sensor can sense the temperature of a cooking container 101 placed on the top plate of the induction heating device 2000.

[0167] According to embodiments of the present disclosure, the uppermost layer of the multilayer board 300 may include a container detection coil layer 33, which includes only a container detection coil for detecting whether a cooking container is placed on the top plate 5 of the induction heating device 2000. This is only one embodiment of the present disclosure, and the container detection coil may be applied together with the heating coil for patterning and included in a first heating coil pattern layer 11, which is the uppermost of a plurality of heating coil pattern layers 11, 12, ..., 18. When the container detection coil is applied together with the heating coil for patterning, inductive power can be transmitted to the container detection coil through the heating coil. Therefore, according to embodiments of the present disclosure, the multilayer board 300 may be designed such that the container detection coil is included in a container detection coil layer 33 separate from the heating coil pattern layer. According to embodiments of the present disclosure, the container detection coil layer 33 may have a thickness of 110 μm or less after hot pressing.

[0168] An insulating layer 311 comprising two prepreg insulating layers may be disposed between the container detection coil layer 33 and the first heating coil pattern layer 11 for insulation and adhesion. The insulating layer 311 disposed between the container detection coil layer 33 and the first heating coil pattern layer 11 may be thinner than the insulating layer 312 comprising two prepreg insulating layers disposed between the first heating coil pattern layer 11 and the second heating coil pattern layer 12. In embodiments of this disclosure, the thickness of the insulating layer 311 disposed between the container detection coil layer 33 and the first heating coil pattern layer 11 may be 130 μm or less. Furthermore, the amount of copper used in the PCB substrate used to produce the container detection coil layer 33 (0.5 oz to 1 oz) may be less than the amount of copper used in the heating coil pattern layer (2 oz to 3 oz). This is because the container detection coil of the container detection coil layer 33 is used to sense the cooking container; therefore, the amount of copper used in the container detection coil may be less than the amount of copper used in the high-power heating coil.

[0169] The container detection coil included in the container detection coil layer 33 can detect whether the cooking container 101 is placed on the top plate of the induction heating device 2000. When the container detection coil of the induction heating device 2000 detects the cooking container 101, the processor of the induction heating device 2000 can display the information detected by the container detection coil on the display included in the user interface, such as the identification information of the cooking container 101, the location information of the cooking container 101, the presence or absence of the cooking container 101, or the material of the cooking container 101.

[0170] Reference Figure 24 A method for detecting the material of cooking container 101 is described.

[0171] Figure 24 A container detection coil for detecting the material of a cooking container according to an embodiment of the present disclosure is shown.

[0172] When the cooking container 101 is placed on the container detection coil 2700, the magnetic field generated by the container detection coil 2700 changes. At this time, as the cooking container 101, which has a high permeability (μ1), approaches the container detection coil 2700, the total inductance generated by the container detection coil 2700 increases, and therefore, the current i1 flowing in the container detection coil 2700 decreases. When the permeability of the cooking container 101 is relatively low (μ2 < μ1), the total inductance generated by the container detection coil 2700 decreases relatively, and therefore, the current i2 flowing in the container detection coil 2700 increases compared to the current i1 in the above case. Based on this change in current, the induction heating device 2000 can determine the material of the cooking container 101 through the container detection coil 2700.

[0173] According to embodiments of the present disclosure, the container detection coil layer 33 may include a temperature sensor for sensing the temperature of the heating coil plate 10 when the induction heating device 2000 heats the cooking container 101.

[0174] The memory included in the induction heating device 2000 can store instructions that, when executed individually or jointly by one or more processors included in the induction heating device 2000, cause the induction heating device 2000 to determine the material of the cooking container 101. When executed individually or jointly by one or more processors included in the induction heating device 2000, the instructions can also cause the induction heating device 2000 to determine the position of the cooking container 101 on the top plate, or the presence or absence of the cooking container 101.

[0175] Figure 15 and Figure 16 Characteristic curves of a temperature sensor according to an embodiment of the present disclosure are shown.

[0176] Temperature sensors may include positive temperature coefficient (PTC) thermistors or negative temperature coefficient (NTC) thermistors. Figure 15 Characteristic curves of a PTC thermistor according to an embodiment of the present disclosure are shown.

[0177] Reference Figure 15 PTC thermistors have the characteristic that their resistance increases with the temperature of the area where they are attached. For example, when the detected temperature is approximately 130°C, the PTC thermistor has a resistance of 1 kΩ. Furthermore, when the detected temperature is approximately 100°C, the PTC thermistor has a resistance of 100 Ω or less. Figure 15 The PTC thermistor shown is just an example, and the temperature-resistance characteristic curve of a PTC thermistor can vary depending on the type of PTC thermistor.

[0178] Figure 16 These are characteristic curves of NTC thermistors according to embodiments of the present disclosure.

[0179] Reference Figure 16 NTC thermistors have the characteristic that their resistance decreases as the temperature of the area where they are attached increases. For example, when the detected temperature is approximately 100°C, the NTC thermistor has a resistance of 973 Ω. Furthermore, when the detected temperature is approximately 25°C, the NTC thermistor has a resistance of 10 kΩ. Figure 16 The NTC thermistor shown is just an example, and the temperature-resistance characteristic curve of an NTC thermistor can vary depending on the type of NTC thermistor.

[0180] Figure 17 A temperature sensing circuit according to an embodiment of the present disclosure is shown.

[0181] Figure 17 A temperature sensing circuit using a thermistor as a temperature sensor according to an embodiment of the present disclosure is shown.

[0182] Figure 17 The temperature sensing circuit may include a voltage divider resistor 1710 and a PTC thermistor 1720 as a temperature sensor, and the output point A of the temperature sensing circuit may be input to an analog-to-digital converter input port. This is only an embodiment of this disclosure, and the output point A of the temperature sensing circuit may be directly input to, for example, a processor (not shown) with an analog-to-digital converter input port, or may be input to a comparator for comparison with a specific value. The PTC thermistor 1720 detects the temperature of the heating coil plate 10.

[0183] Reference Figure 17 The +5V input voltage is distributed by a 1kΩ voltage divider resistor 1710 and a PTC thermistor 1720. The voltage divider resistor 1710, together with the PTC thermistor 1720, distributes the +5V input voltage. Additionally, in... Figure 17 As can be seen, voltage divider resistor 1710 is a pull-up voltage divider resistor. Point A between voltage divider resistor 1710 and PTC thermistor 1720 is connected to the analog-to-digital converter input port or comparator input. Figure 17 One voltage divider resistor 1710 is shown, but multiple voltage divider resistors 1710 can be used. Figure 17 The diagram shows that the PTC thermistor 1720 has a resistance of 1 kΩ at 130°C, but the resistance can vary depending on the type of PTC thermistor 1720 and the temperature. (See reference...) Figure 17 At 130°C, the voltage applied to point A is 2.5V. Assume that the heating coil plate 10 is determined to be overheated at 130°C. When the resistance of the PTC thermistor 1720 at 130°C is 1kΩ, the voltage applied to point A is 2.5V. Therefore, a processor (not shown) that has detected a digital value corresponding to 2.5V can determine that the heating coil plate 10 is overheated. The processor that has determined that the heating coil plate 10 is overheated can then perform overheat protection operations. The designer can arbitrarily select the temperature at which the heating coil plate 10 is determined to be overheated based on the material specifications of the heating coil plate 10. Thus, point A, which reads the voltage value that changes due to the change in the resistance of the PTC thermistor 1720 with temperature variations, can be referred to as the output of the temperature sensing circuit.

[0184] According to embodiments of this disclosure, when the temperature detected by a temperature sensor included in the heating coil plate 10 is greater than or equal to a preset temperature (e.g., when the temperature detected in the heating coil pattern layer is 130°C), the induction heating device 2000 can reduce its output. Assuming the output of the induction heating device 2000 is divided into 10 levels, and the induction heating device 2000 is currently performing heating operation at level 10, for example, when the temperature of the heating coil pattern layer is detected by the temperature sensor as 130°C, the induction heating device 2000 can automatically reduce its output to level 9. Even if the induction heating device 2000 has already reduced its output to level 9, if the temperature of the heating coil pattern layer does not decrease to 130°C or lower within a preset time period (e.g., 30 seconds), the induction heating device 2000 can automatically further reduce its output to level 8.

[0185] Conversely, when the temperature of the heating coil pattern layer drops to a second preset temperature (e.g., 90°C) or lower while the output is at level 8, the induction heating device 2000 can raise the output back to level 9. In this way, the output of the induction heating device 2000 can be adjusted by a temperature sensor based on the temperature of the heating coil pattern layer. In embodiments of this disclosure, the adjustment of the output of the induction heating device 2000 can be performed by a processor (not shown) of the induction heating device 2000.

[0186] Figure 18 A temperature sensing circuit according to an embodiment of the present disclosure is shown.

[0187] Figure 18 The temperature sensing circuit may include a voltage divider resistor 1710 and an NTC thermistor 1730 as a temperature sensor, and the output point B of the temperature sensing circuit may be input to an analog-to-digital converter input port or a comparator.

[0188] The NTC thermistor 1730 can be used to detect the temperature of the heating coil plate 10. The voltage divider resistor 1710 is a resistor that, together with the NTC thermistor 1730, distributes the +5V input voltage.

[0189] Reference Figure 18 The +5V input voltage is distributed by a 973Ω voltage divider resistor 1710 and an NTC thermistor 1730. Figure 18 In this circuit, voltage divider resistor 1710 is a pull-up voltage divider resistor. Point B between voltage divider resistor 1710 and NTC thermistor 1730 is connected to the analog-to-digital converter input port, or, if the processor (not shown) has an analog-to-digital converter input port, to the analog-to-digital converter input port of the processor (not shown) or the input of the comparator. Figure 18 One voltage divider resistor 1710 is shown, but multiple voltage divider resistors 1710 can be used. Figure 18The NTC thermistor 1730 is shown to have a resistance of 973Ω at 100°C, but the resistance can vary depending on the type of NTC thermistor 1730 and the temperature. It is assumed that the heating coil plate 10 is determined to be overheated at a temperature of 100°C. (Refer to...) Figure 18 When the resistance of the NTC thermistor 1730 is 973Ω at 100°C, the voltage applied to point B is 2.5V. Therefore, the processor, having detected a digital value corresponding to 2.5V, can determine that the heating coil plate 10 is overheating. When overheating is determined, the processor can optionally perform an overheat protection operation. The designer can arbitrarily select the temperature at which the heating coil plate 10 is determined to be overheating, according to the specifications of the heating coil plate 10. Thus, point B, which reads the voltage value that varies according to the NTC thermistor 1730, can be referred to as the output of the temperature sensing circuit.

[0190] According to embodiments of this disclosure, when the temperature detected by a temperature sensor included in the container detection coil layer 33 is greater than or equal to a preset temperature (e.g., when the temperature detected in the heating coil pattern layer is 100°C), the induction heating device 2000 can reduce its output. Assuming the output of the induction heating device 2000 is divided into 10 levels, and the induction heating device 2000 is currently performing heating operation at level 8, for example, when the temperature of the heating coil pattern layer is detected as 100°C by the temperature sensor, the induction heating device 2000 can automatically reduce its output to level 7. Even if the induction heating device 2000 has already reduced its output to level 7, if the temperature of the heating coil pattern layer does not decrease to 100°C or lower within a preset time period, the induction heating device 2000 can automatically further reduce its output to level 6.

[0191] Conversely, when the temperature of the heating coil pattern layer drops to a second preset temperature (e.g., 80°C) or lower while the output is at level 7, the induction heating device 2000 can raise the output back to level 8. In this way, the output of the induction heating device 2000 can be adjusted by a temperature sensor based on the temperature of the heating coil pattern layer. In embodiments of this disclosure, the adjustment of the output of the induction heating device 2000 can be performed by a processor (not shown) of the induction heating device 2000.

[0192] Refer again Figure 12According to embodiments of the present disclosure, the lowest layer of the multilayer board 300 may include a connector connection signal layer 35, on which a connector is mounted to connect the heating coil board 10 to the inverter board of the induction heating device 2000. According to embodiments of the present disclosure, the connector connection signal layer 35 may have a thickness of 110 μm or less after hot pressing. An insulating layer 319 with two stacked prepreg insulating layers for insulation and adhesion may be arranged between the connector connection signal layer 35 and the eighth heating coil pattern layer 18. The insulating layer 319 with two stacked prepreg insulating layers arranged between the connector connection signal layer 35 and the eighth heating coil pattern layer 18 may be thinner than the insulating layer 318 with two stacked prepreg insulating layers arranged between the seventh heating coil pattern layer 17 and the eighth heating coil pattern layer 18. In embodiments of this disclosure, when the thickness of the insulating layer 319 disposed between the connector connection signal layer 35 and the eighth heating coil pattern layer 18 is 120 μm or less, the thickness of the insulating layer 318 disposed between the seventh heating coil pattern layer 17 and the eighth heating coil pattern layer 18 can be slightly larger, 130 μm or less. Furthermore, the amount of copper used in the PCB substrate used to manufacture the connector connection signal layer 35 (0.5 oz to 1 oz) can be less than the amount of copper used in the heating coil pattern layer (2 oz to 3 oz). This is because the signal coil of the connector connection signal layer 35 is used for signal transmission; therefore, the amount of copper used in the connector connection signal layer 35 can be less than the amount of copper used in the high-power heating coil.

[0193] Reference Figures 19 to 21 The installation of connectors for connecting between boards, such as heating coil board 10 and inverter board, is described.

[0194] Figure 19 The diagram illustrates the structure in which the plates of an induction heating device according to an embodiment of the present disclosure are connected to each other.

[0195] Reference Figure 19 An induction heating device 2000 according to an embodiment of the present disclosure may include a top plate 5 and a heating coil plate 10. A cooking container 101 is placed on the top plate 5. The heating coil plate 10 is patterned with a plurality of heating coils stacked thereon and is arranged below the top plate 5. An induction heating device 2000 according to an embodiment of the present disclosure may include an intermediate plate 20, which includes relays, resonant capacitors, etc., and is arranged below the heating coil plate 10. In an embodiment of the present disclosure, the intermediate plate 20 may include a memory storing a program for controlling the operation of the induction heating device 2000, and a processor configured to execute the program stored in the memory to control the induction heating device 2000.

[0196] An induction heating device 2000 according to an embodiment of the present disclosure may include an inverter board 30, which includes an inverter and a power conversion device and is disposed below an intermediate board 20. According to an embodiment of the present disclosure, a resonant capacitor may be included in the inverter board 30. In an embodiment of the present disclosure, the intermediate board 20 and the inverter board 30 may be integrated into a single inverter board, depending on design specifications. The inverter board 30 may include a plurality of electronic switches constituting the inverter. The plurality of electronic switches perform pulse width modulation (PWM) switching operation. The PWM switching operation induces eddy currents in the cooking container 101 by inducing resonance between a heating coil 2120 included in the heating coil board 10 and a resonant capacitor. The inverter board 30 may include a power conversion device configured to generate low-voltage DC power for a processor, memory, etc., included in the intermediate board 20. The power conversion device may also generate a +15V or +12V voltage for switching the plurality of electronic switches of the inverter. In this disclosure, the power conversion device may be referred to as a switch-mode power supply (SMPS).

[0197] In embodiments of this disclosure, the intermediate plate 20 can be electrically connected to the inverter board 30 when a first connector 110, vertically mounted on the lower surface of the intermediate plate 20, is accommodated in a second connector 120, vertically mounted on the upper surface of the inverter board 30. In embodiments of this disclosure, the electrical connection between the intermediate plate 20 and the inverter board 30 can be made solely through the connection between the first connector 110 and the second connector 120.

[0198] In embodiments of this disclosure, the first connector 110, vertically mounted on the lower surface of the intermediate plate 20, can be a male connector, and the second connector 120, vertically mounted on the upper surface of the inverter board 30, can be a female connector.

[0199] When the heating coil plate 10, intermediate plate 20 and inverter plate 30 are as follows Figure 19 When the boards are connected as shown, no more wires are needed for connecting them, thus eliminating product defects caused by wires. Furthermore, no inconvenience in assembly or increased manufacturing costs are caused by wires. Therefore, as... Figure 19 The structure shown, which connects the boards to each other via connectors, simplifies product assembly and minimizes product defects. This structure is feasible because heating coils are used for patterning; therefore, the heating coil board 10 can be connected to the inverter board 30 simply via connectors, as shown. Figure 19 As shown in the image.

[0200] Figure 20This is a diagram illustrating the structure of a connector connected to a heating coil plate in an induction heating apparatus according to an embodiment of the present disclosure.

[0201] Figure 20 The lower surface of the heating coil plate 10, on which the heating coil plate connector 130 is mounted, is shown, rather than the upper surface on which the top plate 5 is arranged. The heating coil plate connector 130 is vertically mounted on the lower surface of the heating coil plate 10, such that each heating coil 2120 is electrically connected to the inverter 2113. The heating coil plate connector 130 can be a male connector or a female connector. In this disclosure, the heating coil plate connector 130 may be referred to as a third connector for connection to… Figure 19 The first connector 110 and the second connector 120 shown are distinct. In embodiments of this disclosure, the heating coil plate connector 130 may have a... Figure 19 The holes in the intermediate plate 20 are directly connected to a connector mounted vertically on the inverter board 30. Optionally, in embodiments of this disclosure, the heating coil plate connector 130 may be connected to a fourth connector mounted on the intermediate plate 20. In embodiments of this disclosure, when the intermediate plate 20 has a resonant capacitor 2114 mounted thereon, the heating coil plate connector 130 is connected to the fourth connector of the intermediate plate 20.

[0202] Figure 21 This is a diagram illustrating the structure of a connector mounted on the rear surface of a heating coil plate in an induction heating apparatus according to an embodiment of the present disclosure.

[0203] and Figure 20 similar, Figure 21 The lower surface of the heating coil plate 10 is shown. Figure 21 The heating coil plate 10 has a hole running through the entire heating coil plate 10 in the central portion of the printed patterned heating coil 2120, and a temperature sensor 2600 is installed in this hole. The temperature sensor 2600 can be used to measure the temperature of the cooking container 101 placed on the top plate 5 of the induction heating device 2000.

[0204] The heating coil plate 10 has a heating coil plate connector 130 mounted vertically thereon for electrical connection to an intermediate plate 20 and / or an inverter plate 30 arranged below the heating coil plate 10.

[0205] This method of using connector boards eliminates complex wire connections, increases assembly convenience, reduces the possibility of product defects, and lowers manufacturing costs.

[0206] Figure 22 This is a block diagram of an induction heating device according to an embodiment of the present disclosure.

[0207] like Figure 22As shown, the induction heating device 2000 according to an embodiment of the present disclosure may include a top plate 5, a heating coil plate 10, an intermediate plate 20, and an inverter plate 30.

[0208] In the induction heating device 2000 according to an embodiment of the present disclosure, the top plate 5 is a plate on which a cooking container 101 will be placed, and is typically made of heat-resistant tempered glass. The top plate 5 may include an output interface 2410 such as a display, and an input interface 2420 such as a touch button. In embodiments of the present disclosure, the actual operation of the output interface 2410 such as the display and the input interface 2420 such as the touch button can be performed under the control of a processor 2200 included in the intermediate plate 20, as described below. Additionally, in embodiments of the present disclosure, the display panel or the actual touch button may be mounted on the intermediate plate 20, and only the interface may be mounted on the top plate 5.

[0209] The user interface 2400, which may be included in the top panel 5, may include an output interface 2410 and an input interface 2420. The output interface 2410 is used to output audio or video signals and may include a display, an audio output unit, etc.

[0210] In the case where the display and touchpad form a layered structure to create a touchscreen, the display can also be used as an input interface 2420 in addition to the output interface 2410. The display may include at least one of a liquid crystal display, a thin-film transistor liquid crystal display, a light-emitting diode (LED) display, an organic LED display, a flexible display, a three-dimensional (3D) display, and an electrophoretic display. Furthermore, depending on the design, the induction heating device 2000 may include two or more displays.

[0211] The audio output unit can output audio data received from the communication interface 2300 or stored in the memory 2500. Additionally, the audio output unit can output audio signals related to the functions performed by the induction heating device 2000. The audio output unit may include a speaker, a buzzer, etc.

[0212] According to embodiments of this disclosure, the output interface 2410 can display information about the cooking container 101. For example, the output interface 2410 can output a graphical user interface (GUI) corresponding to the identification information or product type information of the cooking container 101. Furthermore, the output interface 2410 can output information about the current location of the cooking container 101 or the material of the cooking container 101.

[0213] Input interface 2420 is used to receive input from a user. Input interface 2420 may be, but is not limited to, at least one of a keyboard, dome switch, touchpad (e.g., a capacitive touchpad, a pressure-resistive overlay touchpad, an infrared sensor touchpad, a surface acoustic wave conduction touchpad, an integrated tension measurement touchpad, a piezoelectric effect touchpad), knob, and rotary switch.

[0214] Input interface 2420 may include a speech recognition module. For example, induction heating device 2000 may receive a speech signal as an analog signal via a microphone and convert the speech portion into computer-readable text using an Automatic Speech Recognition (ASR) model. Induction heating device 2000 may interpret the text using a Natural Language Understanding (NLU) model to obtain the user's utterance intent. Here, the ASR model or NLU model may be an artificial intelligence model. The artificial intelligence model may be processed by an AI-specific processor designed with a hardware architecture dedicated to processing artificial intelligence models. The artificial intelligence model may be generated via a training process. Here, generation via a training process may mean generating a predefined operating rule or artificial intelligence model set to perform a desired characteristic (or purpose) by training a base artificial intelligence model using a learning algorithm that utilizes a large amount of training data. The artificial intelligence model may include multiple neural network layers. Each neural network layer has multiple weight values ​​and performs neural network arithmetic operations via arithmetic operations between the arithmetic results of the previous layer and the multiple weight values.

[0215] Language understanding is a technology used to recognize and apply / process human language / characters, and includes natural language processing, machine translation, dialogue systems, question answering, speech recognition / synthesis, etc.

[0216] In the induction heating device 2000 according to an embodiment of the present disclosure, the heating coil plate 10 may include heating coils 2120 printed on a first heating coil pattern layer 11 for patterning. The heating coil plate 10 may have a structure with multiple stacked heating coil pattern layers. Multiple heating coils 2120 may be provided, and the multiple heating coil pattern layers may include a first heating coil pattern layer 11, a second heating coil pattern layer 12, ..., an nth heating coil pattern layer 19 (n is a natural number greater than or equal to 2, and n may be 4, 8, 12, or 16). The heating coil plate 10 may include a connector connection signal layer 35, on which the connector may be vertically mounted, thereby connecting to the intermediate board 20 and / or the inverter board 30 via the connector without wires.

[0217] A patterned heating coil 2120 applied to the heating coil plate 10 generates a magnetic field for heating the cooking container 101. For example, when current is supplied to the heating coil 2120, a magnetic field is induced around the heating coil 2120. When a current (e.g., alternating current) with amplitude and direction varying over time is supplied to the heating coil 2120, a magnetic field with amplitude and direction varying over time is induced around the heating coil 2120. The magnetic field around the heating coil 2120 can pass through the top plate 5 made of tempered glass and reach the cooking container 101 placed on the top plate 5. Due to the magnetic field with amplitude and direction varying over time, eddy currents rotating around the magnetic field are generated in the cooking container 101, and resistance heat is generated in the cooking container 101 due to the eddy currents. Resistance heat is the heat generated in a resistor when current flows through it, and is also known as Joule heating. The cooking container 101 is heated by resistance heat, and therefore, the contents of the cooking container 101 can be heated.

[0218] In the induction heating device 2000 according to an embodiment of the present disclosure, the heating coil plate 10 may further include a temperature sensor 2600. The temperature sensor 2600 can sense the temperature of the top plate 5 or the cooking container 101 placed on the top plate 5. The processor 2200 can determine whether the cooking container 101 is dry-heating or overheating based on the temperature of the cooking container 101 sensed by the temperature sensor 2600. In an embodiment of the present disclosure, the temperature sensor 2600 may be installed in a hole penetrating the heating coil plate 10.

[0219] The heating coil plate 10 of the induction heating device 2000 according to an embodiment of the present disclosure may further include a container detection coil layer 33. In an embodiment of the present disclosure, the container detection coil layer 33 may include a container detection coil. In an embodiment of the present disclosure, the container detection coil may be printed as a pattern on the first heating coil pattern layer 11. The processor 2200 of the induction heating device 2000 may detect whether the cooking container 101 is placed on the top plate 5 of the induction heating device 2000 by means of the container detection coil included in the container detection coil layer 33 or the first heating coil pattern layer 11.

[0220] Inverter board 30 may include drive unit 2110. Drive unit 2110 may receive power from input power and supply current to heating coil 2120 according to drive control signals from processor 2200. Drive unit 2110 may include, but is not limited to, EMI filter 2111, rectifier circuit 2112, inverter 2113, and resonant capacitor 2114. In embodiments of this disclosure, according to design specifications, resonant capacitor 2114 may be located on intermediate board 20 instead of inverter board 30.

[0221] The EMI filter 2111 filters out high-frequency noise included in the AC voltage supplied from the input power supply and allows AC voltage and current with a predetermined frequency (e.g., 50Hz or 60Hz) to pass through. A fuse and relay for preventing overcurrent can be provided between the EMI filter 2111 and the input power supply. The AC voltage with high-frequency noise filtered out by the EMI filter 2111 is supplied to the rectifier circuit 2112.

[0222] Rectifier circuit 2112 converts alternating current (AC) voltage to direct current (DC) voltage. For example, rectifier circuit 2112 can convert an AC voltage (e.g., positive or negative voltage) whose amplitude and polarity change over time into a DC voltage with constant amplitude and polarity, and can convert an AC current (e.g., positive or negative current) whose amplitude and direction change over time into a DC current whose polarity does not change over time. Rectifier circuit 2112 may include diodes as rectification elements. For example, rectifier circuit 2112 may include four diodes. Diodes can convert AC voltages whose polarity changes over time into positive voltages with constant polarity, and can convert AC currents whose direction changes over time into positive currents with constant direction. Rectifier circuit 2112 may be connected to a DC link capacitor to smooth the rectified DC voltage.

[0223] Inverter 2113 may include a switching circuit for supplying or cutting off drive current to heating coil 2120. Inverter 2113 can induce resonance between heating coil 2120 and resonant capacitor 2114 through switching operation of the switching circuit. In embodiments of this disclosure, resonant capacitor 2114 may be included in inverter board 30 or may be included in intermediate board 20. The switching circuit may include two switches for each heating zone, such as... Figure 3 As shown in the image. Figure 3 The first switch 2113_1 and the second switch 2113_2 shown can be turned on or off according to the drive control signal of the processor 2200. In embodiments of this disclosure, in addition to the processor 2200, the induction heating device 2000 may also include a separate drive processor to generate the drive control signal.

[0224] Inverter 2113 can control the current supplied to heating coil 2120. For example, the amplitude and direction of the current flowing in the first heating coil 2120_1 can be changed by turning on or off the first switch 2113_1 and the second switch 2113_2 included in inverter 2113. Furthermore, the amplitude and direction of the current flowing in the second heating coil 2120_2 can be changed by turning on or off another pair of switches included in inverter 2113. In this case, alternating current can be supplied to the first heating coil 2120_1 and the second heating coil 2120_2.

[0225] The inverter board 30 may include a connector (not shown) for connection to the intermediate board 20.

[0226] In the induction heating device 2000 according to an embodiment of the present disclosure, an intermediate plate 20 may be arranged between the heating coil plate 10 and the inverter plate 30. When the inverter plate 30 is the second plate, the intermediate plate 20 may be the first plate. According to an embodiment of the present disclosure, the intermediate plate 20 may include, but is not limited to, a processor 2200, a communication interface 2300, and a memory 2500. For example, the intermediate plate 20 may also include a resonant capacitor 2114. In addition, components included in the intermediate plate 20 may be electrically connected to components included in the inverter plate 30 via connectors of the inverter plate 30.

[0227] According to an embodiment of this disclosure, the intermediate plate 20 may include a resonant capacitor 2114. This is an embodiment, and the resonant capacitor 2114 may be included in the inverter plate 30 according to design specifications. The resonant capacitor 2114 can resonate with the heating coil 2120 through the switching of the inverter 2113, inducing eddy currents in the cooking container 101 placed on the top plate 5 of the induction heating device 2000. Figure 3 As shown, when multiple heating coils 2120 are provided, multiple resonant capacitors 2114 can be provided to correspond to the heating coils 2120 respectively.

[0228] The processor 2200 of the intermediate board 20 can determine the switching frequency (e.g., on / off frequency) of the switching circuitry included in the inverter 2113 based on the output intensity (power level) of the induction heating device 2000. The processor 2200 can generate drive control signals for turning the switching circuitry on or off according to the determined switching frequency. The induction heating device 2000 may include a drive processor separate from the processor 2200 for controlling the operation of the drive unit 2110 including the inverter 2113 during operation of the processor 2200. However, this is merely an embodiment, and the operation of the drive processor may be performed by the processor 2200.

[0229] The processor 2200 controls the overall operation of the induction heating device 2000.

[0230] The processor 2200 is a hardware device that controls the overall operation of the induction heating device 2000. The processor 2200 may include one processor or multiple processors. According to an embodiment of the present disclosure, the processor 2200 may be a hardware processing circuit including at least one of a central processing unit (CPU), a graphics processing unit (GPU), an accelerated processing unit (APU), an integrated many-core (MIC), a digital signal processor (DSP), an integrated circuit, and a neural processing unit (NPU). The processor 2200 may be implemented in the form of an integrated system-on-chip (SoC) including one or more electronic components. In the case where the processor 2200 includes multiple processors, each processor may be implemented as separate hardware (H / W). The processor 2200 may be referred to as a microprocessor controller (MICOM), a microprocessor unit (MPU), or a microcontroller unit (MCU). According to an embodiment of the present disclosure, the processor 2200 is a hardware device that can be implemented as a single-core processor or a multi-core processor. The processor 2200 may execute a program stored in the memory 2500 to control the drive unit 2110, the communication interface 2300, the user interface 2400, and the memory 2500.

[0231] According to an embodiment of the present disclosure, the induction heating device 2000 may be equipped with an artificial intelligence (AI) processor. The AI processor may be manufactured in the form of a dedicated hardware chip for AI, or may be manufactured as part of an existing general-purpose processor (e.g., a CPU or an application processor) or a dedicated graphics processor (e.g., a GPU), and then installed on the induction heating device 2000.

[0232] In the case where the unique identification information of the cooking container 101 is stored in the memory 2500, the processor 2200 may establish a short-range wireless communication channel (e.g., a BLE communication channel) with the cooking container 101 through the communication interface 2300.

[0233] The processor 2200 may perform asymmetric control between multiple heating coils 2120. In an embodiment of the present disclosure, when Figure 3 the operating frequency of the first heating coil 2120_1 is f1 and the operating frequency of the second heating coil 2120_2 is f2 (f1 < f2), the processor 2200 may control the operating frequency of the second heating coil 2120_2 such that f2 = f1. At the same time, the processor 2200 may perform asymmetric control to set the on / off duty ratios of the third switch 2113_3 and the fourth switch 2113_4 to be different at the operating frequency of f1, so that the output of the heating zone corresponding to the second heating coil 2120_2 when the operating frequency of the second heating coil 2120_2 is f2 is the same as the output of the heating zone corresponding to the second heating coil 2120_2 when the operating frequency of the second heating coil 2120_2 is f1.

[0234] The communication interface 2300 of the intermediate board 20 may include one or more components enabling communication between the induction heating device 2000 and the cooking container 101, between the induction heating device 2000 and a server (not shown), or between the induction heating device 2000 and a user terminal (not shown). For example, the communication interface 2300 may include a short-range wireless communication interface 2310 and a long-range communication interface 2320. The short-range wireless communication interface 2310 may include, but is not limited to, a Bluetooth communication unit, a BLE mesh network communication unit, an NFC unit, a WLAN (e.g., Wi-Fi) communication unit, a Zigbee communication unit, an IrDA communication unit, a WFD communication unit, a UWB communication unit, an Ant+ communication unit, etc. In cases where the cooking container 101 is remotely controlled by a server (not shown) in an Internet of Things (IoT) environment, the long-range communication interface 2320 can be used to communicate with the server. The long-range communication interface 2320 may include the Internet, a computer network (e.g., a LAN or WAN), and a mobile communication unit. The mobile communication unit transmits radio signals to at least one of a base station, an external terminal, or a server on the mobile communication network, and receives radio signals from at least one of the base station, external terminal, or server on the mobile communication network. Here, the radio signals may include voice call signals, video call signals, and various types of data sent and received according to text / multimedia messages. The mobile communication unit may include, but is not limited to, 3G modules, 4G modules, LTE modules, 5G modules, 6th generation (6G) modules, NB-IoT modules, LTE-M modules, etc.

[0235] The memory 2500 may store programs for the processor 2200 to execute the operation and control of the induction heating device 2000, and may store input / output data (e.g., unique identification information of the cooking container 101, variable identification information of the cooking container 101, multiple power transmission modes, cooking progress information of the cooking container 101, or material information of the cooking container 101). The memory 2500 may store coded commands for the switching operation of the inverter 2113. In addition, the memory 2500 may also store AI models.

[0236] The memory 2500 may include at least one of flash memory, hard disk storage media, multimedia card micro storage media, card-type memory (e.g., SD or XD memory), random access memory (RAM), static RAM (SRAM), read-only memory (ROM), electrically erasable programmable ROM (EEPROM), programmable ROM (PROM), magnetic memory, magnetic disk, and optical disk. Furthermore, the induction heating device 2000 can operate on a network storage device or cloud server that performs storage functions over the Internet.

[0237] Figure 23This is a flowchart of the production of a heating coil plate according to an embodiment of the present disclosure.

[0238] In operation S2301, a multilayer board is manufactured, comprising: a container detection coil layer patterned with a container detection coil; multiple heating coil pattern layers patterned with heating coils printed thereon; and an insulating layer for insulating and bonding between the container detection coil layer and the multiple heating coil pattern layers. The insulating layer can be produced by stacking at least two prepreg insulating layers. The thickness of the insulating layer during hot pressing can be 130 μm or less, or 140 μm or less. Furthermore, the thickness of the container detection coil layer during hot pressing can be 110 μm or less.

[0239] The container detection coil layer can be arranged in the top layer of the multilayer board, and an insulating layer can be inserted between the container detection coil layer and the top layers of multiple heating coil pattern layers. The insulating layer may include two prepreg insulating layers. Additionally, at least two prepreg insulating layers can be inserted between the multiple heating coil pattern layers. The thickness of the prepreg insulating layer before hot pressing may be 65 μm or less. Furthermore, the bottom layer of the multilayer board may include a connector connection signal layer. An insulating layer can be inserted between the connector connection signal layer and the bottom layers of multiple heating coil pattern layers. The insulating layer can be produced by stacking at least two prepreg insulating layers. The thickness of the insulating layer during hot pressing may be 130 μm or less, or 140 μm or less. Additionally, the thickness of the connector connection signal layer during hot pressing may be 110 μm or less.

[0240] Here, the PCB substrate used for producing multilayer boards may have dimensions of 1020 (mm) × 1200 (mm) or 1020 (mm) × 1020 (mm), and 2 ounces or more of copper may be used in the PCB substrate used for producing heating coil boards. 0.5 ounces to 1 ounce of copper may be used in the PCB substrate used for container detection coil layers and signal layers for connector connections.

[0241] Each prepreg insulation layer contains 60% to 80% resin content.

[0242] Each layer of the multilayer board may include holes through which temperature sensors used to detect the temperature of the cooking container can pass.

[0243] In operation S2303, heating coil boards are produced by hot-pressing multilayer boards. Because two prepreg insulation layers are provided, the conductors of the multiple heating coil pattern layers and the reinforcing fibers of the prepreg insulation layers do not come into contact with each other even when the multilayer board is hot-pressed, thus maintaining insulation. The thickness of the heating coil board produced by hot pressing can be 3.3 mm or less.

[0244] According to embodiments of this disclosure, an induction heating device including a container detection coil layer is disclosed. The container detection coil layer is patterned with a plurality of container detection coils printed thereon for detecting cooking containers. According to embodiments of this disclosure, the induction heating device may include: a plurality of heating coil pattern layers with heating coils patterned thereon; and an insulating layer disposed between the plurality of heating coil pattern layers and the container detection coil layers to insulate the plurality of heating coil pattern layers from the container detection coil layers. According to embodiments of this disclosure, the container detection coil layer, the plurality of heating coil pattern layers, and the insulating layer may be stacked and hot-pressed to form a heating coil plate. According to embodiments of this disclosure, the thickness of the insulating layer after hot-pressing may be 140 μm or less.

[0245] According to embodiments of this disclosure, the insulating layer may include 60% to 80% of the total composition of resin.

[0246] According to embodiments of this disclosure, the height of the conductors of the plurality of heating coil pattern layers can be 60 μm or greater. According to embodiments of this disclosure, in a heating coil plate formed by stacking container detection coil layers, plurality of heating coil pattern layers, and an insulating layer and then hot-pressing them, the conductor of the uppermost layer of the plurality of heating coil pattern layers or the conductor of the container detection coil may not contact the reinforcing fibers of the insulating layer, thereby maintaining insulation.

[0247] According to embodiments of this disclosure, the heating coil plate may include a hole through which a temperature sensor configured to detect the temperature of the cooking container passes.

[0248] According to embodiments of this disclosure, the insulating layer can be formed by stacking at least two prepreg insulating layers.

[0249] According to embodiments of the present disclosure, a first end of each of the plurality of container detection coils can be connected to the lowest layer of the heating coil plate via a via hole. According to embodiments of the present disclosure, a second end of each of the plurality of container detection coils can be connected to connector terminals arranged on the container detection coil layer.

[0250] According to embodiments of the present disclosure, the induction heating device may further include at least one processor. According to embodiments of the present disclosure, the induction heating device may include at least one processor having processing circuitry and a memory storing instructions, which, when executed individually and jointly by the at least one processor, cause the induction heating device to detect at least one of the following via a plurality of container detection coils: the material of a cooking container placed on the top plate of the induction heating device, the position of the cooking container, and the presence or absence of the cooking container.

[0251] According to embodiments of this disclosure, at least one processor may also be configured to detect the material of the cooking container by means of changes in inductance caused by the cooking container detected by the container detection coil.

[0252] According to embodiments of this disclosure, the induction heating device may further include a display. According to embodiments of this disclosure, the induction heating device controls the display to show the grade of the cooking container based on the detected material of the cooking container.

[0253] According to embodiments of this disclosure, the plurality of heating coil pattern layers may be eight or more layers.

[0254] According to embodiments of this disclosure, the thickness of the heating coil plate may be 3.3 mm or less.

[0255] According to embodiments of this disclosure, the container detection coil layer may further include a temperature sensor configured to measure the temperature of the heating coil plate.

[0256] According to embodiments of the present disclosure, instructions stored in a memory, when executed individually or jointly by at least one processor included in the induction heating device, cause the induction heating device to reduce the heating output through the heating coil plate based on the temperature of the heating coil plate measured by a temperature sensor being greater than or equal to a preset overheating reference temperature.

[0257] According to embodiments of this disclosure, the temperature sensor may include a PTC thermistor or an NTC thermistor.

[0258] According to embodiments of the present disclosure, the induction heating device may further include an inverter board connected to the heating coil board via a connector. According to embodiments of the present disclosure, the heating coil board may further include a connector connection signal layer in its lowest layer, connected to the inverter board via a connector.

[0259] According to embodiments of the present disclosure, a first end of each of the plurality of container detection coils can be connected via a via hole to a connector connection signal layer for connection to a heating plate connector vertically connected to the connector connection signal layer. According to embodiments of the present disclosure, a second end of each of the plurality of container detection coils can be connected to a terminal of a heating plate connector on the container detection coil layer.

[0260] According to embodiments of this disclosure, the inverter board may include at least one inverter board connector that is connected to the heating plate connector and is vertically mounted on the inverter board.

[0261] According to embodiments of the present disclosure, the induction heating device may further include: an intermediate plate disposed between a heating coil plate and an inverter plate and including a memory storing a program for controlling the operation of the induction heating device; and at least one processor configured to execute the program stored in the memory to control the induction heating device. According to embodiments of the present disclosure, the intermediate plate may also include a hole through which a heating plate connector passes.

[0262] According to embodiments of this disclosure, at least two prepreg insulation layers may be arranged between multiple heating coil pattern layers to insulate and bond the multiple heating coil pattern layers.

[0263] According to embodiments of this disclosure, a method for producing a heating coil plate for an induction heating apparatus is disclosed, the heating coil plate including a container detection coil layer patterned with a container detection coil. According to embodiments of this disclosure, the method may include forming a multilayer board including a plurality of heating coil pattern layers and an insulating layer, the plurality of heating coil pattern layers being patterned with heating coils printed thereon, and the insulating layer being disposed between the plurality of heating coil pattern layers and the container detection coil layer to insulate and bond between the plurality of heating coil pattern layers and the container detection coil layer. According to embodiments of this disclosure, a method for producing a heating coil plate for an induction heating apparatus including a container detection coil layer patterned with a container detection coil may include forming the heating coil plate by hot pressing the multilayer board. According to embodiments of this disclosure, the thickness of the insulating layer after hot pressing may be 140 μm or less.

[0264] The methods according to embodiments of this disclosure can be embodied as program instructions executable by various computer devices and recorded on a computer-readable medium. The computer-readable medium may include program instructions, data files, data structures, etc., individually or in combination. The program instructions recorded on the medium may be specifically designed and configured for this disclosure, or may be well known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media (such as hard disks, floppy disks, or magnetic tapes), optical media (such as compact disc ROMs (CD-ROMs) or digital video discs (DVDs)), magneto-optical media (such as floppy disks), and hardware devices (such as ROMs, RAMs, or flash memory) specifically configured to store and execute program instructions. Examples of program instructions include not only machine code (such as code generated by a compiler), but also high-level language code executable by a computer using an interpreter, etc.

[0265] Embodiments of this disclosure can be implemented as a recording medium including computer-readable instructions such as computer-executable program modules. The computer-readable medium can be any available medium accessible by a computer and can include volatile or non-volatile media as well as removable or non-removable media. Furthermore, the computer-readable medium can include computer storage media and communication media. Computer storage media includes volatile and non-volatile, removable and non-removable media implemented with any method or technology for storing information such as computer-readable instructions, data structures, program modules, or other data. Communication media generally include computer-readable instructions, data structures, program modules, other data or other transmission mechanisms that modulate data signals, and examples include any information transmission medium. Furthermore, embodiments of this disclosure can be implemented as a computer program or computer program product including computer-executable instructions, such as a computer program executed by a computer.

[0266] Machine-readable storage media may be provided in the form of non-transitory storage media. Here, the term "non-transitory storage media" refers to a tangible device and does not include signals (e.g., electromagnetic waves), and the term "non-transitory storage media" does not distinguish between cases where data is stored semi-permanently in the storage medium and cases where data is temporarily stored. For example, "non-transitory storage media" may include buffers for temporarily storing data.

[0267] According to embodiments of this disclosure, the methods disclosed herein may be included in a computer program product and then provided. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., CD-ROM), or may be distributed online through an app store (e.g., downloaded or uploaded) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product (e.g., a downloadable application) may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a relay server).

Claims

1. An induction heating device, comprising: A container detection coil layer, patterned with a plurality of container detection coils printed on the container detection coil layer, for detecting cooking containers placed on the induction heating device; Multiple heating coil pattern layers, wherein heating coils are patterned and printed on the multiple heating coil pattern layers; as well as An insulating layer is located between the plurality of heating coil pattern layers and the container detection coil layer to insulate the plurality of heating coil pattern layers from the container detection coil layer. The container detection coil layer, the plurality of heating coil pattern layers, and the insulating layer form a stacked and hot-pressed heating coil plate, wherein the thickness of the insulating layer is 140 μm or less.

2. The induction heating device according to claim 1, wherein, The insulating layer comprises 60% to 80% resin content of the total composition.

3. The induction heating device according to claim 1 or claim 2, wherein, The insulating layer includes reinforcing fibers. The plurality of heating coil pattern layers include conductors with a height of 60 μm or greater, and The reinforcing fibers of the insulating layer do not contact the conductor of the uppermost heating coil pattern layer of the plurality of heating coil pattern layers or the conductor of the container detection coil layer.

4. The induction heating device according to any one of claims 1 to 3, wherein, The stacked, hot-pressed heating coil plate includes holes through which a temperature sensor configured to detect the temperature of the cooking container can pass.

5. The induction heating device according to any one of claims 1 to 4, wherein, The insulating layer comprises at least two semi-cured sheet insulating layers.

6. The induction heating device according to any one of claims 1 to 5, wherein the induction heating device further comprises: The connector terminals are located on the container detection coil layer. In this configuration, the first end of each of the plurality of container detection coils is connected via a through-hole to the bottom layer of the stacked, hot-pressed heating coil plate, and The second end of each of the plurality of container detection coils is connected to the connector terminal located on the container detection coil layer.

7. The induction heating device according to any one of claims 1 to 6, wherein the induction heating device further comprises: Top panel, used to place cooking containers; At least one processor, including processing circuitry and a memory storing instructions, which, when executed individually or jointly by the at least one processor, cause the induction heating device to detect, via the plurality of container detection coils, at least one of the material of a cooking container placed on the top plate, the position of the cooking container on the top plate, and the presence or absence of the cooking container.

8. The induction heating device according to claim 7, wherein, When executed by the at least one processor, the instruction causes the induction heating device to detect the material of the cooking container by means of changes in inductance caused by the cooking container detected by the plurality of container detection coils.

9. The induction heating device according to claim 7 or claim 8, further comprising: monitor, When the instruction is executed by the at least one processor, it causes the display to show the grade of the cooking container based on the detected material of the cooking container.

10. The induction heating device according to any one of claims 1 to 9, wherein, The plurality of heating coil pattern layers includes eight or more heating coil pattern layers.

11. The induction heating device according to any one of claims 1 to 10, wherein, The thickness of the stacked, hot-pressed heating coil plate is 3.3 mm or less.

12. The induction heating device according to any one of claims 1 to 11, wherein, The container detection coil layer includes a temperature sensor configured to measure the temperature of the stacked, hot-pressed heating coil plates.

13. The induction heating device according to claim 12, further comprising: At least one processor, including processing circuitry and a memory storing instructions, which, when executed individually or jointly by the at least one processor, cause the induction heating device to reduce the heating output through the stacked, hot-pressed heating coils based on a measured temperature of the stacked, hot-pressed heating coils being greater than a preset overheating reference temperature.

14. The induction heating device according to any one of claims 1 to 13, wherein the induction heating device further comprises: The inverter board is connected to the stacked, hot-pressed heating coil board via a connector. The stacked, hot-pressed heating coil plate includes a signal layer in the bottom layer that is connected to the inverter board via the connector.

15. The induction heating device according to claim 14, wherein, The first end of each of the plurality of container detection coils is connected to the signal layer through a via hole to connect to the heating plate connector vertically connected to the signal layer, and The second end of each of the plurality of container detection coils is connected to a terminal of the heating plate connector on the container detection coil layer.

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