Power converter for industrial processing assembly, preferably plasma processing assembly or heating assembly

Abstract

It is proposed a power converter (4) for an industrial processing component (1), preferably a plasma processing component or a heating component, comprising: a heat sink (5, 85); and-a unit (10) to be cooled, in particular an electrical unit, preferably a semiconductor component, preferably comprising a power semiconductor component, in which the unit (10) to be cooled has a fixed connection, in particular an integrally joined connection, with the heat sink (5), and in which the heat sink (5, 85) is configured to dissipate heat from the unit (10, 80) to be cooled and comprises:-a cooling channel (35, 95); and-a coolant inlet (40) and a coolant outlet (45) which are both fluidically connected to the cooling channel (35, 95) for supplying and discharging a coolant, in particular a coolant, preferably cooling water, in which the radiator (5, 85) is constructed in unitary form from a material and, when the radiator (5, 85) is fastened to the cooling unit (22), the coolant inlet (40) and the coolant outlet (45) are fluidically connected to the cooling channel (35, 95). The first fluid connection is simultaneously fluid-tightly sealed.

Description

Technical Field

[0001] This invention relates to a power converter for use in industrial processing components, preferably plasma processing components or heating components. Furthermore, this invention relates to a method for assembling such a power converter. Background Technology

[0002] The improved scheme belongs to the field of power conversion for special power-intensive and unstable industrial processes, such as plasma excitation, plasma coating processes, gas laser excitation, particle accelerators, charging and discharging systems for large batteries such as flow batteries, solid melting, and heating and / or vaporization of liquids by means of, for example, microwave energy or induction heating. All these processes share the characteristic of being designed to generate and accelerate charged atomic particles in a gaseous and / or plasma environment or liquid. All these processes also share the characteristic of having high power consumption in the range of 1 kW or higher, particularly 10 kW or higher, preferably 100 kW or higher. Many of these processes also have very high requirements for the stability of the power supply because the processes are highly complex, such as those using plasma processing and / or semiconductor manufacturing heated by electromagnetic fields. Typically, power is converted from a power supply frequency in the range of about 50 Hz to 60 Hz to different frequencies in the range of 1 kHz to 200 MHz. Conversion to direct current (DC) power is also conceivable. Converting electricity to other frequencies requires multiple electronic components and modules, particularly power semiconductor components such as transistors or diodes designed for currents ≥10 A and voltages ≥400 V. These electronic components and modules generate waste heat during operation. Waste heat typically occurs in areas only a few square millimeters (mm²). 2 In a very limited area, dissipating the waste heat to protect components and / or modules from damage due to overheating is a particular challenge. Typically, very large and material-dense heat sinks are used for this purpose, which are very expensive to manufacture.

[0003] In existing technologies, heat dissipation is achieved through cooling using cooling plates. When using such conventional cooling plates, heat is dissipated by applying a material such as thermal paste to the thermal interface, enabling heat transfer from electrical components, which may have copper layers, to the cooling medium. However, such thermal interface materials have proven disadvantageous. First, they represent another form of heat transfer with thermal resistance; second, they are susceptible to wear, which gradually degrades their effectiveness during operation. Increasing the area of ​​the cooling plate or reducing the number and performance of components to dissipate more heat or generate less heat has also proven insufficient. The cooling area cannot be expanded indefinitely due to the limited installation space within the housing of such a power supply. Reducing the performance of individual components is also not advantageous. Overall, inadequate cooling of electrical components incurs costs.

[0004] In many technological applications, particularly in power electronics, it is necessary to detach a unit to be cooled, such as a semiconductor element or assembly, from the rest of the module when necessary. To enable the unit to be cooled to be removably attached to a heat sink, it is typically done using thermal paste, for example. This results in a relatively low thermal coupling between the unit and the heat sink.

[0005] Purpose of the invention The purpose of this invention is to provide a power converter that improves the thermal coupling between the heat sink and the unit to be cooled, and enhances the ease of maintenance. Summary of the Invention

[0006] The objective is achieved by the power converter according to claim 1. Therefore, a power converter for an industrial processing assembly, preferably a plasma processing assembly or a heating assembly, is disclosed. This power converter has: - heat sink, - The unit to be cooled, particularly an electrical unit, preferably a semiconductor assembly, and preferably having power semiconductor components. - Circuit board, - Additional electronic components, wherein these additional electronic components and the unit to be cooled are arranged on or against the circuit board and connected to electrical contacts. The unit to be cooled and the radiator are fixedly connected, especially integrally joined, and The radiator is configured to dissipate heat from the unit to be cooled, particularly electrical units, preferably semiconductor components. The radiator includes a cooling channel and a first cooling wall, particularly disposed on the side of the cooling channel facing the unit to be cooled. Furthermore, the radiator includes a coolant inlet and a coolant outlet, both fluidly connected to the cooling channel, for supplying and discharging coolant, particularly coolant liquid, preferably cooling water. The radiator is constructed integrally from a single material. The radiator is mechanically and thermally connected to the unit to be cooled. Additionally, the radiator is detachably fastened to the cooling unit, which includes a first fluid port and, particularly, a second fluid port. When the radiator is fastened to the cooling unit, a first fluid connection is formed between the coolant inlet of the radiator and the first fluid port of the cooling unit, and, particularly, a second fluid connection is formed between the coolant outlet of the radiator and the second fluid port of the cooling unit. The radiator is preferably also designed such that when the radiator is fastened to the cooling unit, the first fluid connection and, particularly, the second fluid connection are simultaneously fluid-tightly sealed.

[0007] In one respect, the power converter also has: - Another heatsink, - Additional units to be cooled, particularly electrical units, preferably semiconductor components, and preferably having power semiconductor parts. Among them, the other units to be cooled are fixedly connected to the other heat sinks, especially integrally joined, and The additional heat sink is configured to dissipate heat from other units to be cooled.

[0008] In one respect, the power converter also has: - Multiple heat sinks, - Multiple units to be cooled, particularly electrical units, preferably semiconductor components, each unit preferably having one or more power semiconductor components. Each of the units to be cooled is fixedly connected to one of the heat sinks, particularly through an integral connection. The radiator is configured to dissipate heat from the unit to be cooled that is connected to the radiator.

[0009] In all the aspects mentioned above and below, the radiator has the following characteristics: - Cooling passage - A coolant inlet and a coolant outlet, both of which are fluidly connected to the cooling passage, for supplying and discharging coolant, particularly coolant liquid, preferably cooling water. in, - Each radiator is constructed as a single unit using a single material. - The radiators are mechanically and thermally connected to the unit to be cooled. - Each radiator is removably fastened to a cooling unit that includes multiple fluid ports. - When the radiator is secured to the cooling unit, a fluid connection is formed between the coolant inlet of the radiator and the associated fluid port of the cooling unit, and - When the radiator is fastened to the cooling unit, the fluid connection is simultaneously sealed tightly by the fluid.

[0010] The characteristics of the “radiator” and “unit to be cooled” disclosed below, as well as their connections and interactions with other units or devices, also apply similarly to all other and multiple radiators and units to be cooled disclosed herein.

[0011] Monolithic means that the heat sink is made of a single material with atomic bonds at all connection points. This can be achieved through various methods. One manufacturing process is additive manufacturing, such as using laser melting. In another method, the heat sink can be produced by pressing multiple layers together under very high pressure. In yet another method, the heat sink can be produced entirely by pressing it into a mold. Such components allow for the dissipation of very high power within a very small space. This allows the dimensions, especially the dimensions of the conductor tracks, to remain very short. The components are also particularly easy to maintain.

[0012] The radiator allows it to be removably secured within the cooling unit. The cooling unit is designed to supply and discharge coolant to the radiator. For example, the radiator can be designed such that a fluid-tight fluid connection can be formed between the radiator and the cooling unit when the radiator is secured within it. If necessary, the radiator, along with the unit to be cooled attached to it, can be removed from the cooling unit. This is particularly advantageous for maintenance and repair. According to the described embodiment, for example, the unit to be cooled can be removed from the cooling unit together with the radiator.

[0013] This improvement allows, for example, the unit to be cooled to be mechanically fixedly connected to the radiator. The result of this improvement is preferably a connection between the unit to be cooled and the radiator achieved using as little additional material as possible and with the thinnest possible thickness. Through consideration, simulation, and experimentation with this improvement, it becomes clear that this is particularly feasible when the radiator, through which fluid flows, is fixedly connected, especially integrally joined, to the unit to be cooled. This can be accomplished, for example, by brazing, sintering, pressing, or direct copper bonding (DCB). The term "fixed" here can mean "destructively removable." This means using a connection that cannot be disassembled even with tools without damaging the unit to be cooled 10 or the radiator 5, or either of these components. In this case, the unit to be cooled can also be removed from the cooling unit along with the radiator, for example, for maintenance purposes. By mechanically fixing the unit to be cooled to the radiator, improved thermal coupling between the unit to be cooled and the radiator, as well as better heat transfer from the unit to the radiator, can be achieved.

[0014] In addition, the power converter may have an electronic module that includes a heat sink as described above and a cooling unit mechanically fixed to the heat sink.

[0015] The electronic module, including the heat sink and the unit to be cooled, which is mechanically fixed to the heat sink, can, for example, be inserted entirely into the cooling unit and then removed from the cooling unit again. This makes it possible to access the unit to be cooled.

[0016] The power converter may also include a cooling unit for supplying a coolant, particularly a coolant liquid, preferably cooling water, to a radiator having a coolant inlet and a coolant outlet. The cooling unit may have a first flow channel and a second flow channel. Furthermore, the cooling unit may have a first fluid port fluidly connected to the first flow channel and a second fluid port particularly fluidly connected to the second flow channel. The cooling unit may be designed such that the radiator can be detachably fastened to the cooling unit, and when the radiator is fastened to the cooling unit, a first fluid connection can be formed between the coolant inlet of the radiator and the first fluid port of the cooling unit, and a second fluid connection can be formed between the coolant outlet of the radiator and the second fluid port of the cooling unit. Furthermore, the radiator may be specifically designed such that when the radiator is fastened to the cooling unit, both the first and second fluid connections are simultaneously fluid-tightly sealed.

[0017] The cooling unit can be designed, for example, to supply coolant to a single radiator, but it can also be designed, for example, to supply coolant to multiple radiators and to discharge coolant again after it has flowed through the radiators. In this way, a cooling system is created that allows the unit to be cooled to be accessed when needed.

[0018] The power converter may include a cooling device comprising a cooling unit as described above and a radiator detachably connected to the cooling unit as described above.

[0019] The power converter may also have: - Circuit board, - Other electronic components, Other electronic components and cooling units are arranged on or against the circuit board and connected to electrical contacts.

[0020] The preferred outcome of the improved design is to achieve the connection between the unit to be cooled and the radiator using as little additional material as possible and as thin as possible. Through consideration, simulation, and experimentation with this improved design, it becomes clear that this is particularly feasible when the radiator, through which fluid flows, is fixedly connected, especially integrally joined, to the unit to be cooled. This can be accomplished, for example, by brazing, sintering, pressing, or direct copper bonding (DCB). The term "fixed" here can mean "destructively removable." This refers to a connection method that cannot be disassembled even with tools without damaging the unit to be cooled or the radiator, or either of these components.

[0021] This objective is achieved by a method for assembling a power converter for industrial processing components, preferably plasma processing components or heating components, particularly as described above or below, the method beginning with: a heat sink for dissipating heat from a unit to be cooled, particularly an electrical unit, preferably a semiconductor component; and a cooling unit. The heat sink has a cooling channel, a coolant inlet fluidly connected to the cooling channel, and a coolant outlet fluidly connected to the cooling channel. The cooling unit includes a first fluid port and a second fluid port. The method includes the step of: removably securing the heat sink to the cooling unit, wherein, when the heat sink is secured to the cooling unit, a first fluid connection is formed between the coolant inlet of the heat sink and the first fluid port of the cooling unit, and a second fluid connection is formed between the coolant outlet of the heat sink and the second fluid port of the cooling unit. When the heat sink is secured to the cooling unit, the first fluid connection and the second fluid connection are simultaneously fluid-tightly sealed.

[0022] Advantageous embodiments and improvements that can be used alone or in combination are the subject of the dependent claims and the following description.

[0023] Power converters can be specifically used for power conversion in particularly power-intensive and unstable industrial processes, such as plasma excitation, plasma coating processes, gas laser excitation, particle accelerators, charging and discharging systems for large batteries such as flow batteries, solid melting, and heating and / or vaporization of liquids by means of, for example, microwave energy or induction heating. All these processes share the common feature of being designed to generate and accelerate charged atomic particles in a gaseous and / or plasma environment or liquid. Power converters can be specifically designed for high power consumption in the range of 1 kW or higher, particularly 10 kW or higher, preferably 100 kW or higher. For this type of load, there are very high requirements for the stability of the power supply because the processes are highly complex, such as those using plasma processing and / or semiconductor manufacturing heated by electromagnetic fields. Typically, power is converted from a power supply frequency in the range of about 50 Hz to 60 Hz to different frequencies in the range of 1 kHz to 200 MHz. Conversion to direct current (DC) power is also conceivable. Converting electricity to other frequencies requires multiple electronic components and modules, particularly power semiconductor components such as transistors or diodes designed for currents ≥10 A and voltages ≥400 V. These electronic components and modules generate significant amounts of waste heat during operation. Efficiently dissipating this waste heat has always been a major challenge, which is advantageously addressed using the described apparatus and method.

[0024] The power converter is preferably designed to excite plasma processing, particularly for plasma processing used in semiconductor manufacturing.

[0025] In one respect, as disclosed, for example, in DE 10 2013 226 537A1, EP 3 317 964 B1, and EP3 317 965B1, such power converters will improve the characteristics of power supply systems with LDMOS transistors as cooling elements. The load capacity of LDMOS transistors in such power supply systems is typically limited due to overheating, even when their maximum rated voltage and maximum rated current are not reached. This means that, through improvements in cooling as described above and below, such power supply systems can operate more reliably.

[0026] In one respect, such power converters will improve the characteristics of power supply systems that provide very high voltages at their outputs, particularly greater than or equal to 1 kV, especially preferably greater than or equal to 2 kV, and particularly greater than or equal to 4 kV. Particularly preferred are those provided also in a pulsed manner, such as those described in EP 4 235737 A1 as high-power generators. The losses from these switching operations are particularly high because the switching elements described herein must be switched on even when a voltage is applied to their power terminals. EP 4 235 737 A1 describes a very complex cooling process that can be improved using the devices and / or methods described herein.

[0027] Patent publications DE 10 2013 226 537A1, EP 3 317 964 B1, EP3 317 965 B1 and EP 4 235737 A1 are incorporated herein by reference in their entirety.

[0028] In one aspect, the coolant inlet and coolant outlet of the radiator are arranged on the side of the radiator away from the unit to be cooled. For example, this allows fluid to contact the radiator on the side away from the unit to be cooled.

[0029] In one aspect, the radiator can be detachably fastened to the cooling unit by means of at least one fastening device, preferably at least one screw. The at least one fastening device can preferably be designed to form a fluid connection between the radiator and the cooling unit, thereby achieving a tight fluid seal.

[0030] It is advantageous if a tight fluid seal between the first fluid connection and the second fluid connection can be achieved by at least one fastening device accessible from one side of the first cooling wall. For example, the fact that at least one fastening device is accessible from one side of the first cooling wall makes it easier to handle the radiator when inserting it into the cooling unit and removing it from the cooling unit.

[0031] In one aspect, the radiator can be pressed against the cooling unit by means of at least one fastening device, such that a liquid-sealed fluid connection is formed between the first fluid port of the cooling unit and the coolant inlet of the radiator, and between the second fluid port of the cooling unit and the coolant outlet of the radiator. For example, at least one fastening device can be designed such that when the radiator is fastened to the cooling unit, a pressing pressure is generated that presses the first and second fluid ports of the cooling unit against the coolant inlet and coolant outlet of the radiator.

[0032] It is advantageous if the cooling device includes a first sealing element designed to liquid seal the first fluid connection when the radiator is fastened to the cooling unit. A fluid-sealed first fluid connection can be formed by means of the first sealing element, for example, when the radiator is fastened to the cooling unit. For example, when the radiator is pressed against the cooling unit, the sealing element can deform to seal the connection between the first cooling port and the coolant inlet. Preferably, the first sealing element is a first sealing ring surrounding the first fluid port.

[0033] In one aspect, the cooling device includes a second sealing element designed to create a liquid seal for the second fluid connection when the radiator is fastened to the cooling unit. By means of the second sealing element, for example, when the radiator is fastened to the cooling unit, a fluid-sealed second fluid connection can be formed. Preferably, the second sealing element is a second sealing ring surrounding the second fluid port.

[0034] In one aspect, the radiator is designed such that, when the radiator is secured to the cooling unit, a cooling flow can be formed from a first fluid port to a coolant inlet, through a cooling channel, and from a coolant outlet to a second fluid port. In this way, the radiator can, for example, be supplied with coolant from the cooling unit.

[0035] In one aspect, the heat sink is preferably made of copper. Copper's high thermal conductivity enables effective heat dissipation from the unit to be cooled.

[0036] The components to be cooled, particularly semiconductor components, may have power semiconductor parts. The power converter is designed so that the power semiconductor parts can operate in switching or amplifier mode at frequencies greater than 20 kHz and can generate electrical power losses of ≥500 W.

[0037] In one aspect, the radiator has a cooling channel through which a coolant, particularly a liquid coolant, preferably cooling water, can flow in a desired flow direction. The cooling channel may preferably have a first cooling wall on the side facing the unit to be cooled. A plurality of cooling needles may preferably be arranged in or within the cooling channel, extending specifically from the first cooling wall into the cooling channel. The plurality of cooling needles may also preferably include at least one first category of cooling needles oriented in a first inclination direction, the first inclination direction being obliquely inclined relative to the perpendicular of the first cooling wall. The cooling needles among the plurality of cooling needles may also preferably be arranged such that one of the cooling needles does not intersect with another of the plurality of cooling needles.

[0038] Such a device is described, for example, in German patent application filed on September 1, 2023, with official document number 10 2023 123 660.1 and entitled “Heat sink with pressure loss-optimized arrangement of cooling pins within the cooling channel”, which is incorporated herein by reference in its entirety.

[0039] In one aspect, in the case of a radiator, multiple cooling pins may be arranged in or within a cooling channel and extend from a first cooling wall into the cooling channel. A cooling pin is a cooling element whose length is greater than the average width or diameter of a cooling element. Specifically, the cooling pin may be designed, for example, to have a cylindrical or conical geometry. The directional extension of the cooling pin can preferably be indicated by a centerline of the cooling pin. According to an exemplary embodiment, to determine such a centerline, for example, a line may be laid along the center of the cross-section through which the cooling pin passes. For example, the centerline of the cooling pin may be straight, but it may also be slightly curved or slightly bent.

[0040] In one respect, the cooling needles of the first category may be oriented at an angle relative to the vertical line of the first cooling wall. The term "angled" here means that the cooling needles of the first category are neither parallel nor perpendicular to the first cooling wall. It has been found that the angled arrangement of the cooling needles allows for particularly good flow of coolant around the cooling system and improved thermal contact between the cooling needles and the coolant.

[0041] In one aspect, the cooling needles in a plurality of cooling needles can be arranged such that no cooling needle intersects with any other cooling needle in the plurality of cooling needles. This non-overlapping arrangement of the cooling needles in a cooling channel or a portion thereof improves flow through the cooling channel and reduces pressure loss. During the improvement process, the pressure required to deliver coolant through the cooling channel proved to be particularly low.

[0042] In one aspect, each of the multiple cooling needles is arranged such that the coolant can flow completely around it. This allows for high heat transfer from the cooling needle to the coolant.

[0043] It is advantageous if the cooling needles in a plurality of cooling needles are arranged such that one cooling needle does not contact another cooling needle. This creates a gap between the cooling needles. This facilitates flow through the cooling channels and reduces pressure loss.

[0044] In one respect, the cooling needle is rod-shaped. More preferably, the cooling needle preferably has a substantially cylindrical shape. The rod-shaped or cylindrical design of the cooling needle creates a large contact surface for heat transfer from the cooling needle to the coolant.

[0045] In one aspect, the cooling needles have a circular or elliptical cross-section. This can further reduce flow resistance.

[0046] It is advantageous if the cooling channel has a second cooling wall on the side opposite to the first cooling wall.

[0047] In one aspect, the cooling pins of the plurality of cooling pins extend continuously from the first cooling wall to the second cooling wall. In this way, heat can be supplied to the cooling pins from both the first and second cooling walls. This improves heat dissipation.

[0048] In one respect, the first cooling wall is arranged substantially parallel to the second cooling wall. The parallel orientation of the first and second cooling walls ensures uniform flow through the cooling channels under internal turbulent conditions.

[0049] It is advantageous if the cooling channels have a substantially constant cross-section across the entire radiator. This ensures a constant flow rate of coolant through the cooling channels. This is advantageous for the local dependence of flow rate, thus resulting in the desired turbulent system.

[0050] In one respect, the cooling channels have a substantially rectangular cross-section. Furthermore, it is advantageous if the cooling channels are designed to be substantially cubic. Such geometry simplifies the formation of a flat contact area for thermal contact with the unit being cooled.

[0051] It is advantageous if the heat sink is a miniature heat sink and the unit to be cooled is an electronic component. According to this embodiment, a separate miniature heat sink can be provided for each electronic component. This achieves heat dissipation for each individually adapted electronic component. Preferably, the unit to be cooled is an electronic module.

[0052] In one aspect, the radiator has an inlet through which coolant can be supplied at a first end of a cooling channel. More preferably, the radiator has an outlet through which coolant can be discharged at a second end of a cooling channel, the second end of which is arranged opposite to the first end of the cooling channel. This ensures that coolant flows through the entire radiator.

[0053] In one aspect, the radiator is made of metal. Metals generally have high thermal conductivity. According to a preferred embodiment, the radiator is composed of copper. Copper is a metal with very high thermal conductivity and is therefore preferred for constructing radiators. According to an alternative preferred embodiment, the radiator is composed of one of molybdenum, stainless steel, and nickel.

[0054] In one aspect, the cooling pins of the radiator are produced using additive manufacturing processes, particularly selective laser melting (SLM). Using such additive manufacturing processes, the cooling pins can be applied to the first cooling wall of the radiator in almost any orientation. Even in additive manufacturing, certain limitations regarding the structure must be considered, such as internal constraints, such as the build angle, which in particular should be less than 45°, otherwise a supporting structure would be impossible.

[0055] In one aspect, the unit to be cooled is mechanically and thermally connected to the radiator.

[0056] In one aspect, the unit to be cooled is connected to the heat sink by at least one of the following methods: by at least one brazing connection, by at least one welding connection, or by sintering. For example, if the heat sink is fixedly brazed to the unit to be cooled, brazing enables improved thermal coupling. For example, improved thermal coupling between the heat sink and the unit to be cooled can also be achieved by means of welding or by sintering.

[0057] In one aspect, the unit to be cooled is connected to the heat sink by means of a layer of thermal paste. Also in this case, it can be advantageous to be able to remove the heat sink from the cooling unit if necessary.

[0058] In one aspect, the electronic module described above has a circuit board, to which the unit to be cooled has a fixed mechanical connection. This fixed mechanical connection can be achieved, for example, by soldering the electrical connections of the unit to be cooled to the circuit board. In this embodiment, the circuit board, the unit to be cooled, and the heat sink form a structural unit, which can be used integrally within the cooling unit, for example.

[0059] In one aspect, the electronic module includes multiple units to be cooled and multiple heat sinks, the multiple units to be cooled having a fixed mechanical connection to a circuit board. The electronic module and its multiple heat sinks can be integrally inserted into the cooling unit. The cooling unit preferably has multiple receiving portions designed to accommodate the multiple heat sinks. For example, the fact that the electronic module can be removed from the cooling unit makes maintenance easier.

[0060] In one aspect, the cooling unit has at least one receiving device for at least one fastening device.

[0061] In one aspect, the radiator can be fastened by means of at least one fastening device that is accessible from one side of the first cooling wall and engaged in at least one receiving device. If the at least one fastening device is engaged in at least one receiving device on one side of the cooling unit, the radiator can, for example, be fastened to the cooling unit.

[0062] In one aspect, a fluid tight seal between the first fluid connection and the second fluid connection can be achieved by at least one fastening device accessible from one side of the unit to be cooled. If at least one fastening device is accessible from one side of the unit to be cooled, it facilitates the insertion of the radiator into and removal from the cooling unit.

[0063] It is advantageous if the cooling unit has a receiving portion for a heat sink into which the heat sink can be inserted. For example, this allows the heat sink to be precisely secured within the cooling unit.

[0064] In one aspect, the cooling unit is designed to supply coolant to multiple radiators and discharge coolant from multiple radiators.

[0065] In one aspect, the cooling unit has multiple accommodating portions into which multiple heat sinks can be inserted. For example, this allows an electronic module having multiple heat sinks to be inserted integrally into the accommodating portions of the cooling unit.

[0066] In one respect, the cooling unit is made entirely or partially of metal, or entirely or partially of plastic.

[0067] In one aspect, a recess is provided within the cooling unit, into which a pipe can be pressed. For example, the pipe may include a first flow channel for supplying coolant and a second flow channel for discharging coolant.

[0068] In one respect, the walls of the pipe are entirely or primarily composed of a material, preferably copper, that has higher thermal conductivity compared to other areas of the cooling unit. For example, the high thermal conductivity of the pipe walls can further improve heat dissipation from the unit being cooled.

[0069] In one aspect, the cooling unit includes a distribution unit having a first fluid port and a second fluid port. The distribution unit is preferably designed to supply coolant to at least one radiator and discharge returned coolant.

[0070] It is advantageous if the distribution unit is designed as a cooling insert, which is made of a material with higher thermal conductivity, preferably copper, compared to other areas of the cooling unit. For example, the cooling insert can come into thermal contact with the heat sink, thereby improving the heat dissipation of the heat sink through this thermal contact. This saves cost and weight because the entire support unit does not have to be made of more expensive and typically heavier materials such as copper.

[0071] In one aspect, the cooling unit includes a support unit. A distribution unit can be inserted into this support unit.

[0072] In one respect, the supporting unit is composed entirely or partially of metal, preferably aluminum.

[0073] In one aspect, within a cooling device, a cooling flow can be formed from a first fluid port to a coolant inlet via a cooling channel and from a coolant outlet to a second fluid port. For example, this cooling flow can be used to remove heat generated by the unit to be cooled.

[0074] In one aspect, the cooling unit is designed to supply coolant, particularly coolant, preferably cooling water, to the radiator via a first fluid port and discharge it from the radiator via a second fluid port. Attached Figure Description

[0075] Further advantageous embodiments will now be described in more detail with reference to several exemplary embodiments shown in the accompanying drawings; however, improvements are not limited thereto. In the drawings, each case is illustrated schematically: Figure 1 An electric converter is shown in an industrial processing assembly, preferably a plasma processing assembly or a heating assembly.

[0076] Figure 2 The longitudinal section of the unit to be cooled, the radiator, and the cooling unit that supplies coolant to the radiator is shown.

[0077] Figure 3 A circuit board with two units to be cooled is shown, the two units to be cooled are arranged on the circuit board, which is detachably attached to the cooling units.

[0078] Figure 4a A cross-sectional view of the circuit board on which the cooling unit is arranged and the supporting unit is shown.

[0079] Figure 4b A view of the entire carrier unit on which the circuit board is arranged is shown.

[0080] Figure 5 Another longitudinal section view of the load-bearing unit is shown.

[0081] Figure 6 A cross-sectional view of the support unit, viewed obliquely from below, is shown, in which the cooling insert and the conduit for the fluid supply to the cooling insert can be seen.

[0082] Figure 7 A cross-sectional view of the entire load-bearing unit, viewed obliquely from below, is shown, revealing the cooling inserts, pipes, and coolant connections. Detailed Implementation

[0083] In the following description of the preferred embodiments of this improvement, the same reference numerals denote the same or similar parts.

[0084] Figure 1An industrial processing component 1 is shown, preferably a plasma processing component or a heating component.

[0085] Industrial processing component 1 has: - Power converter 4, - Load 2, preferably subjected to plasma treatment or heating treatment such as induction or microwave heating treatment, wherein load 2 is electrically connected to power converter 4, such that power converter 4 can supply the required power to load 2. - Optionally, an additional adapter unit 3 is connected between the power converter 4 and the load 2.

[0086] Power converter 4 has: - As described above and below, radiator 5 and additional radiator 85, - As described above and below, the cooling unit 22 has one or more distribution units 20 and support units 21. - Circuit board 75, - The unit to be cooled 10, which is particularly an electrical unit, preferably a semiconductor component, and preferably has power semiconductor components. - Other electronic components 8a, 8b, and 8c, The other electronic components 8a, 8b, 8c and the cooling unit 10 are arranged on or abut against the circuit board 75 and connected to the electrical contacts. The unit to be cooled 10 is fixedly connected to the radiators 5 and 85, especially integrally joined.

[0087] Figure 2 It is shown that a plurality of cooling needles 65 may be arranged in or in a portion of the cooling channel 35, the plurality of cooling needles extending from the first cooling wall 50 into the cooling channel 35.

[0088] Figure 2 It is also shown that a plurality of cooling needles 65 may include at least one first type of cooling needle, which is oriented in a first tilting direction, which is obliquely inclined relative to the vertical line of the first cooling wall 50.

[0089] Figure 2 It is also shown that the cooling needles of the plurality of cooling needles 65 can be arranged such that the cooling needles of the plurality of cooling needles 65 do not intersect with another cooling needle of the plurality of cooling needles 65.

[0090] from Figure 2It can also be seen that the plurality of cooling needles 65 may include at least one second type of cooling needle, which is oriented in a second inclined direction, which is obliquely inclined relative to the vertical line of the first cooling wall, and is different from the first inclined direction. In this embodiment, the plurality of needles includes 65 first-type cooling needles oriented in the first inclined direction and second-type cooling needles oriented in the second inclined direction. The different orientations of the cooling needles create flow patterns in the cooling channel 35 that have been proven to be beneficial for efficient heat dissipation.

[0091] Figure 2 It is also shown that a plurality of cooling needles 65 can be arranged such that cooling needles of a first category overlap with cooling needles of a second category at a view parallel to the cooling wall, particularly at a view in the direction of coolant flow. "Overlap" here means that at least one cooling needle of the first category at least partially covers another cooling needle of the second category in a given viewing direction. Such an assembly can improve coolant turbulence at the cooling needles and thus improve heat transfer from the cooling needles to the coolant.

[0092] Figure 2 It is also shown that a plurality of cooling needles 65 can be arranged such that a first category of cooling needles and two second category of cooling needles interweave at a view parallel to the cooling wall, particularly at a view in the direction of coolant flow. The term "interweave" here means that at least one first category of first cooling needle at least partially covers a second category of second cooling needles in a given viewing direction, and that the first cooling needle itself is also at least partially covered by another second category of cooling needles in the same viewing direction. Such an assembly can further improve coolant turbulence at the cooling needles, and thus improve heat transfer from the cooling needles to the coolant.

[0093] Figure 2 A longitudinal section of the cooling device is shown. The cooling device includes heat sinks 5 and 85, which are designed to cool the unit 10 attached to them. The unit 10 to be cooled may be, in particular, an electrical unit, preferably a semiconductor component.

[0094] Radiators 5 and 85 are detachably connected to cooling unit 22. In the example shown, cooling unit 22 includes a dispensing unit 20 designed to supply coolant to radiators 5 and 85. Furthermore, cooling unit 22 includes a support unit 21 into which the dispensing unit 20 is inserted. Cooling unit 22 has a receiving portion 23 into which radiators 5 and 85 can be detachably inserted. Radiators 5 and 85 are then fastened to cooling unit 22 by means of at least one fastening device 15, preferably by means of one or more screws. Cooling unit 22 has at least one receiving device 16 for at least one fastening device 15. To separate radiator 5 from cooling unit 22 again, at least one fastening device 15 is first removed. Radiator 5, along with the unit 10 to be cooled fastened thereto, can then be removed from receiving portion 23 of cooling unit 22.

[0095] Preferably, the unit to be cooled 10 is mechanically and thermally connected to the radiators 5, 85. The unit to be cooled 10 can be connected to the radiators 5, 85, for example, by means of one or more brazing connections. Another possibility is to connect the unit to be cooled 10 to the radiators 5, 85, for example, by means of sintering. Alternatively, the unit to be cooled 10 can be welded to the radiators 5, 85. As another, although less advantageous, alternative, the unit to be cooled 10 can also be connected to the radiators 5, 85 by means of a layer of thermal paste. However, the result of this improvement is to achieve the connection between the unit to be cooled 10 and the radiators 5, 85 using as little additional material as possible and as thin as possible. Through consideration, simulation, and experimentation with this improvement, it becomes clear that this is particularly feasible when the radiator through which fluid flows is fixedly connected, especially integrally joined, to the unit to be cooled 10. This can be accomplished, for example, by brazing, sintering, pressing, or direct copper bonding (DCB). The term "fixed" here can mean "destructively removable only." This refers to using a connection method that cannot be disassembled even with tools, without damaging the cooling unit 10 or the heat sink 5, 85, or both components. It is also recognized that such a solution is feasible only if new solutions can be found for the interchangeability of the circuit board components and electronic components, and particularly for the interchangeability of the cooling unit 10 to which it is fastened. This is achieved through the proposed heat sink 5.

[0096] The heat sinks 5 and 85 and the cooling unit 10, which is mechanically fixed to the heat sinks 5 and 85, together form an electronic module 24. The electronic module 24 can be inserted into the receiving portion 23 of the cooling unit 22 and then removed from the receiving portion 23.

[0097] Cooling unit 22 is designed to supply coolant to radiators 5 and 85 attached to it and to discharge coolant again after it has flowed through radiators 5 and 85. Within cooling unit 22, a first flow channel 25 is visible through which coolant can be supplied to radiators 5 and 85. Within cooling unit 22, a second flow channel 30 is visible through which coolant can be discharged. Radiators 5 and 85 have cooling channels 35 through which coolant can flow. A coolant inlet 40 is provided at a first end of cooling channel 35, and a coolant outlet 45 is provided at a second end of cooling channel 35 opposite to the first end. Coolant inlet 40 and coolant outlet 45 are in fluid connection with cooling channel 35.

[0098] The cooling unit 22 includes a first fluid port 41 fluidly connected to a first flow channel 25 and a second fluid port 46 fluidly connected to a second flow channel 30. When the radiator 5 is inserted into and subsequently secured in the receiving portion 23, a first fluid connection is formed between the first fluid port 41 and the coolant inlet 40, and a second fluid connection is formed between the second fluid port 46 and the coolant outlet 45.

[0099] To seal the first fluid connection, a first sealing ring 42 is arranged in a groove 43 between the cooling unit 22 and the radiator 5, completely surrounding the first fluid port 41. Similarly, a second sealing ring 44 is provided at the second fluid port 46 and arranged in the groove 43 between the cooling unit 22 and the radiator 5. When at least one fastening device 15 is tightened, for example, at least one screw is tightened, the radiator 5 presses against the first fluid port 41 and the first sealing ring 42, and against the second fluid port 46 and the second sealing ring 44. Due to this pressing, a liquid-sealed first fluid connection and a liquid-sealed second fluid connection are formed between the cooling unit 22 and the radiator 5.

[0100] like Figure 2 As shown, a cooling flow 36 can be formed within the cooling device. Coolant flows into the cooling channel 35 from the first flow channel 25 via the first fluid port 41 and the coolant inlet 40. The coolant flows through the cooling channel 35 and is discharged again via the coolant outlet 45, the second fluid port 46, and the second flow channel 30.

[0101] The radiator 5 has a first cooling wall 50 on the side facing the unit 10 to be cooled. On the side of the radiator 5 away from the unit 10 to be cooled, a cooling channel 35 is defined by a second cooling wall 55 opposite to the first cooling wall 50. Preferably, the second cooling wall 55 is designed to be parallel to the first cooling wall 50.

[0102] exist Figure 2In the example shown, the unit 10 to be cooled includes components of transistor 60. Heat generated during operation of transistor 60 is dissipated via coolant flowing in cooling channel 35.

[0103] To improve heat exchange between the coolant flowing through the cooling channel 35 and the radiator 5, a plurality of cooling pins 65 may be arranged inside the cooling channel 35, extending from the first cooling wall 50 and / or from the second cooling wall 55 into the cooling channel 35. The coolant flows around the cooling pins 65, and the cooling pins ensure that the thermal coupling between the radiator 5 and the coolant is improved.

[0104] exist Figure 2 In the diagram, it can also be seen that the unit to be cooled 10 and the heat sink 5 arranged below it are arranged together in the first recess 70 of the circuit board 75.

[0105] exist Figure 3 In the image, the arrangement of the unit to be cooled 10 within the first recess 70 of the circuit board 75 can be clearly seen. Figure 3 A circuit board 75 arranged on the cooling unit 22 is shown. Within the first recess 70 of the circuit board 75, the unit 10 to be cooled, together with its associated heat sink 5, is shown in a longitudinal section. The heat sink 5 is inserted into the receiving portion 23 of the cooling unit 22.

[0106] In addition to the unit 10 to be cooled, Figure 3 Another unit 80 to be cooled and another heat sink 85 disposed below it can also be seen. The other unit 80 to be cooled is disposed in another recess 90 provided in the circuit board 75, and the associated other heat sink 85 is inserted into another receiving portion 92 of the cooling unit 22. The other heat sink 85 has another cooling channel 95 through which coolant flows. In addition, an electrical connection terminal 105 can be seen on the other unit 80 to be cooled, which is provided for forming an electrical connection between the other unit 80 to be cooled and the circuit board 75. The unit 10 to be cooled also has an electrical connection terminal for connecting to the circuit board 75, which is not in Figure 3 As shown in the image.

[0107] Figure 3 The cooling unit 22 shown is designed to supply coolant to multiple radiators and discharge coolant after it has flowed through the radiators. Figure 3 In the example, cooling unit 22 is designed to supply coolant to both radiator 5 and the additional radiator 85, and then discharge coolant from both radiator 5 and the additional radiator 85 again. Cooling unit 22 is specifically designed to distribute coolant evenly among the various radiators.

[0108] When the additional radiator 85 is secured in the additional receiving portion 92, the additional radiator is also in fluid connection with the cooling unit 22. Figure 3 As can be seen in the cross-sectional view, the additional cooling channel 95 is connected to the second flow channel 30 via the additional coolant outlet 100 and the additional second fluid port 102, through which the coolant is discharged.

[0109] Figure 3 The circuit board 75 shown, together with the cooling units 10 and 80 fastened to the circuit board 75 and the heat sinks 5 and 85, forms a structural unit that can be placed on and removed from the cooling unit 22, and is thus detachably connected to the cooling unit 22. When the structural unit is placed on the cooling unit 22, the heat sinks 5 and 85 attached to the cooling units 10 and 80 are inserted into the associated receiving portions 23 and 92 of the cooling unit 22. Subsequently, the heat sinks 5 and 85 are fastened to the cooling unit 22 by means of at least one fastening device 15, and when the heat sinks 5 and 85 are fastened to the cooling unit 22, a fluid connection is formed for supplying and discharging coolant between the heat sinks 5 and 85 and the cooling unit 22. The cooling unit 22 is designed to uniformly supply coolant to all the heat sinks 5 and 85 of the structural unit and to discharge coolant again after the coolant has flowed through the heat sinks 5 and 85.

[0110] Figure 4a Another view of the circuit board 75, taken from an angle above, is shown, in which... Figure 4a In the image, a portion of the supporting unit 21 can be seen. Furthermore, in... Figure 4a In the cross-sectional view, pipe 110 can be seen, which is fitted into a groove 115 provided on the lower side of the support unit 21 for this purpose.

[0111] Radiators 5 and 85 are preferably made of metal, more preferably of copper. Alternatively, radiators 5 and 85 may be made of, for example, stainless steel, nickel, or molybdenum. The support unit 21 may be made wholly or partially of metal, but may also be made wholly or partially of plastic. Preferably, the support unit 21 is wholly or partially of aluminum. The walls of the conduit 110 are preferably made of copper.

[0112] Figure 4b and Figure 5 The entire support unit 21 is shown, in which the circuit board 75 and the units 10 and 80 to be cooled can be seen. The support unit 21 is provided with a first coolant connector 120 for supplying coolant and a second coolant connector 122 for discharging coolant. Figure 5 In the longitudinal section of the unit 10 to be cooled shown, the radiator 5, the first flow channel 25, and the second flow channel 30 can also be seen. Furthermore, in... Figure 5 The cross-sectional view shows some of the pipes 110 arranged on the lower side of the bearing unit 21.

[0113] Figure 6 and Figure 7 Two views of the support unit 21 are shown, viewed from below at an angle. Figure 6 The units to be cooled, 10 and 80, and the heat sinks, 5 and 85, are shown. Figure 6 and Figure 7 The distribution unit is shown to be designed as a cooling insert 132, wherein the cooling insert 132 is preferably made of a metal with high thermal conductivity, preferably copper. The cooling insert 132 is inserted into the support unit 21.

[0114] The receiving portion 23 for the heat sink 5 and the additional receiving portion 92 for the other heat sink 85 are designed as part of the cooling insert 132. The heat sink 5 is fastened to the cooling insert 132 by means of at least one fastening device 15. Preferably, the heat sink 5 is screwed onto the cooling insert 132. Using the copper cooling insert 132 in the area where the heat sinks 5 and 85 are arranged can improve the heat dissipation of the heat sinks 5 and 85.

[0115] When a cooling insert 132 made of copper is used, a structure for fluid contact between the heat sinks 5 and 85 is arranged within the cooling insert 132. In this respect, a first flow channel 25, a first fluid port 41, a second flow channel 30, a second fluid port 46, and a further second fluid port 102 are formed within the cooling insert 132. Furthermore, in Figure 6 and Figure 7 In the image, a conduit 110 can be seen, which is pressed into a groove 115 provided on the underside of the support unit 21 for this purpose. Preferably, the wall of the conduit 110 is made of a metal with high thermal conductivity, preferably copper. More preferably, the conduit 110 is connected to a cooling insert 132 and is designed to supply cold coolant to the cooling insert 132 and discharge heated coolant.

[0116] Figure 7 The entire support unit 21 is shown from below. Figure 7 In addition to the cooling insert 132 and the pipe 110 pressed into the groove 115, coolant connectors 120 and 122 for supplying and discharging coolant can also be seen.

[0117] The features disclosed in the foregoing description, claims and drawings can be important for implementing improvements in its various embodiments, both individually and in any combination.

Claims

1. A power converter (4) for an industrial processing assembly (1), preferably a plasma processing assembly or a heating assembly, said power converter having: - Radiator (5), - The unit to be cooled (10), particularly an electrical unit, preferably a semiconductor component, and preferably having power semiconductor components, - Circuit board (75) - Other electronic components (8a, 8b, 8c), among which, The additional electronic components (8a, 8b, 8c) and the unit to be cooled (10) are arranged on or against the circuit board (75) and connected to electrical contacts. The unit to be cooled (10) and the radiator (5) are fixedly connected, particularly integrally joined, and The radiator (5) is configured to dissipate heat from the unit to be cooled (10). The radiator (5) has: - Cooling channel (35) - A coolant inlet (40) and a coolant outlet (45), both of which are fluidly connected to the cooling passage (35) for supplying and discharging coolant, particularly coolant liquid, preferably cooling water. in, - The radiator (5) is constructed of a single material in an integral form. - The radiator (5) is mechanically and thermally connected to the unit to be cooled (10). - The radiator (5) is detachably fastened to the cooling unit (22), which includes a first fluid port (41). - When the radiator (5) is fastened to the cooling unit (22), a first fluid connection is formed between the coolant inlet (40) of the radiator (5) and the first fluid port (41) of the cooling unit (22). - When the radiator (5) is fastened to the cooling unit (22), the first fluid connection is simultaneously sealed tightly by the fluid.

2. The power converter (4) according to claim 1, characterized in that, The radiator (5) can be detachably fastened to the cooling unit (22) by means of at least one fastening device (15), preferably at least one screw.

3. The power converter (4) according to claim 1 or claim 2, characterized in that, The fluid tight seal of the first fluid connection can be generated by at least one fastening device (15) accessible from one side of the first cooling wall (50).

4. The power converter (4) according to any one of the preceding claims, characterized in that, The radiator (5) is designed such that when the radiator (5) is fastened to the cooling unit (22), a cooling flow (36) can be formed from the first fluid port (41) to the coolant inlet (40) and via the cooling channel (35).

5. The power converter (4) according to any one of the preceding claims, characterized in that, The power converter (4) is designed to excite plasma processing, particularly plasma processing for semiconductor manufacturing.

6. The power converter (4) according to any one of the preceding claims, characterized in that, The radiator (5) has a cooling channel (35) through which a coolant, particularly a coolant liquid, preferably cooling water, can flow in the intended flow direction. The cooling channel (35) has a first cooling wall (50) on the side of the cooling channel (35) facing the unit to be cooled. A plurality of cooling needles (65) are arranged in or in a portion thereof, the plurality of cooling needles extending specifically from the first cooling wall (50) into the cooling channel (35). The plurality of cooling needles (65) includes at least one first-category cooling needle, which is oriented in a first inclined direction, the first inclined direction being obliquely inclined relative to the perpendicular line of the first cooling wall (50). The cooling needles among the plurality of cooling needles (65) are preferably arranged such that the cooling needles among the plurality of cooling needles (65) do not intersect with any other cooling needle among the plurality of cooling needles (65).

7. The power converter (4) according to any one of the preceding claims, characterized in that, The cooling pins of the radiator (5) are produced by means of additive manufacturing processes, particularly by means of selective laser melting (SLM).

8. The power converter (4) according to any one of the preceding claims, characterized in that, The heat sink (5) is produced by means of additive manufacturing processes, particularly by means of selective laser melting (SLM).

9. The power converter (4) according to any one of the preceding claims, characterized in that, The unit to be cooled (10) has at least one LDMOS transistor, preferably two identical LDMOS transistors.

10. The power converter (4) according to any one of the preceding claims, characterized in that, The power converter (4) is designed to generate a high voltage greater than or equal to 1 kV, particularly a high voltage greater than or equal to 2 kV, and preferably a pulsed high voltage.

11. The power converter (4) according to any one of the preceding claims, characterized in that, The unit to be cooled (10) is connected to the radiator (5) by at least one of the following: by at least one brazing connection; by at least one welding connection; and by sintering.

12. The power converter (4) according to any one of the preceding claims further comprises a circuit board (75), wherein the unit to be cooled (10) has a fixed mechanical connection to the circuit board.

13. A power converter (4) for an industrial processing assembly (1), preferably a plasma processing assembly or a heating assembly, particularly according to any one of the preceding claims, the power converter having a cooling unit (22) for supplying a coolant, particularly a coolant liquid, preferably cooling water, to a radiator (5), the radiator having a coolant inlet (40) and a coolant outlet (45), wherein, The cooling unit (22) has: - First flow channel (25) and second flow channel (30); - A first fluid port (41) that is fluidly connected to the first flow channel (25). - A second fluid port (46) that is fluidly connected to the second flow channel (30). The cooling unit (22) is designed such that: - The radiator (5) can be detachably fastened to the cooling unit (22). - When the radiator (5) is fastened to the cooling unit (22), a first fluid connection can be formed between the coolant inlet (40) of the radiator (5) and the first fluid port (41) of the cooling unit (22), and in particular, additionally, a second fluid connection can be formed between the coolant outlet (45) of the radiator (5) and the second fluid port (46) of the cooling unit (22). - When the radiator (5) is fastened to the cooling unit (22), the first fluid connection and, particularly, additionally, the second fluid connection are simultaneously fluid-tightly sealed. The power converter (4) further comprises: - Circuit board (75) - Additional electronic components (8a, 8b, 8c), wherein the additional electronic components (8a, 8b, 8c) and the unit to be cooled (10) are arranged on the circuit board (75) or arranged to abut against the circuit board and connected to electrical contacts.

14. The power converter (4) according to any one of the preceding claims, comprising: - Additional radiator (85). - An additional unit to be cooled (80), said additional unit to be cooled being, particularly an electrical unit, preferably a semiconductor assembly, preferably having power semiconductor components, in, The additional cooling unit (80) and the additional radiator (85) are fixedly connected, particularly integrally joined, and The additional radiator (85) is configured to dissipate heat from the additional unit to be cooled (80). The additional radiator (85) has the following features: - Cooling channel (95) - A coolant inlet and a coolant outlet, both of which are fluidly connected to the cooling passage (95) for supplying and discharging coolant, particularly coolant liquid, preferably cooling water. in, - The additional radiator (85) is constructed of a single material in a monolithic form. The additional radiator (85) is mechanically and thermally connected to the additional unit to be cooled (80). - The additional radiator (85) is removably fastened to the cooling unit (22) which includes an additional fluid port. - When the additional radiator (85) is fastened to the cooling unit (22), a first fluid connection is formed between the coolant inlet (40) of the additional radiator (85) and the additional fluid port of the cooling unit (22). - When the additional radiator (85) is fastened to the cooling unit (22), the additional fluid connection is simultaneously sealed tightly by the fluid.

15. The power converter (4) according to claim 14, wherein, The additional radiator (85) is designed to have one or more features of the radiator (5) according to any one of the preceding claims.

16. The power converter (4) according to claim 14 or 15, wherein, The additional cooling unit (80) is designed to have one or more features of the cooling unit (10) according to any one of the preceding claims.

17. A method for assembling a power converter (4) for an industrial processing assembly (1), preferably a plasma processing assembly or a heating assembly, particularly a power converter according to any one of the preceding claims, the method beginning with: - Heat sinks (5, 85) are used to dissipate heat from the unit (10, 80) to be cooled, particularly electrical units, preferably semiconductor components, wherein, The radiator (5, 85) includes cooling channels (35, 95), a coolant inlet (40) fluidly connected to the cooling channels (35, 95), and a coolant outlet (45) fluidly connected to the cooling channels (35, 95). - Cooling unit (22), the cooling unit includes a first fluid port (41) and a second fluid port (46). The method includes: - The radiator (5, 85) is detachably fastened to the cooling unit (22), wherein when the radiator (5, 85) is fastened to the cooling unit (22), a first fluid connection is formed between the coolant inlet (40) of the radiator (5, 85) and the first fluid port (41) of the cooling unit (22), and in particular, a second fluid connection is formed between the coolant outlet (45) of the radiator (5, 85) and the second fluid port (46) of the cooling unit (22), wherein when the radiator (5, 85) is fastened to the cooling unit (22), the first fluid connection and in particular the second fluid connection are simultaneously fluid-tightly sealed.

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