Appearance translation detection equipment for semiconductor silicon wafer rack

Abstract

The invention relates to the technical field of semiconductor detection, and discloses semiconductor silicon wafer rack appearance translation detection equipment, which comprises an external support and a bottom conveyor belt assembly arranged on the external support, two transmission rollers are arranged on the external support, and the two transmission rollers are positioned at two ends of the bottom conveyor belt assembly and drive the bottom conveyor belt assembly. According to the invention, the first metal turnover plate and the second metal turnover plate which are turned over are arranged, then the semiconductor silicon wafer to be detected is placed in the placement groove, and in the conveying process of the multilateral transmission body, when the first metal turnover plate and the second metal turnover plate are conveyed to the position of the multilateral transmission body, the semiconductor silicon wafer to be detected is placed in the placement groove. At the moment, the first metal overturning plate and the second metal overturning plate are bent, the semiconductor silicon wafer to be detected is leaked out, and the overturning of the semiconductor silicon wafer to be detected is completed in cooperation with the sliding reversing of the arc-shaped plate, so that the cooperative operation of translation conveying and overturning of the semiconductor silicon wafer to be detected is realized, and the overall detection efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor inspection technology, and in particular to a semiconductor silicon wafer carrier appearance translation inspection device. Background Technology

[0002] In the field of semiconductor manufacturing and back-end packaging and testing, wafer carriers are the key carriers for holding and transporting silicon wafers. Therefore, visual inspection of semiconductors during the wafer transport process is an indispensable part of production and material management. Timely visual inspection of the semiconductor wafers to be inspected on the wafer carrier during the translational transport process is required. However, the following problems exist in this inspection process: Firstly, during the translational transport and inspection of the semiconductor silicon wafers to be inspected, the wafers need to be flipped to achieve double-sided inspection. However, existing flipping methods usually involve manual flipping, and these wafers are typically placed on a conveyor belt. Therefore, continuous and timely flipping is required, and translational transport and flipping inspection operate independently, which undoubtedly reduces the overall inspection efficiency of the semiconductor silicon wafers to be inspected.

[0003] To address this, we designed a semiconductor silicon wafer holder appearance translation inspection device. Summary of the Invention

[0004] The purpose of this invention is to solve the problem that in the prior art, translation and flipping detection operate independently, which will undoubtedly reduce the overall detection efficiency of the semiconductor silicon wafers to be tested. Therefore, this invention proposes a semiconductor silicon wafer rack appearance translation detection device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor silicon wafer rack appearance translation inspection device includes an external support and a bottom conveyor belt assembly mounted on the external support. Two drive rollers are mounted on the external support and are located at both ends of the bottom conveyor belt assembly to drive the bottom conveyor belt assembly. A flip plate drive assembly is mounted directly above the bottom conveyor belt assembly. Two polygonal drive bodies are mounted on the external support and are used to transport the flip plate drive assembly. Multiple semiconductor silicon wafers to be inspected are placed on the flip plate drive assembly. The flip-plate drive assembly is equipped with multiple sensor components for detecting the semiconductor silicon wafer to be detected. A reversing mechanism and a stacking mechanism are provided between the bottom conveyor belt assembly and the flip-plate drive assembly, and the reversing mechanism and the stacking mechanism are located on both sides of the flip-plate drive assembly, respectively.

[0006] Preferably, the external support is provided with a first driving member, a second driving member and a third driving member, the output ends of the first driving member and the second driving member are coaxially fixed with the transmission roller and the polygonal transmission body respectively, and the third driving member is provided on the stacking mechanism.

[0007] Preferably, the tilting plate drive assembly includes multiple mounting components, which are connected end to end by hinges to form a ring, and a gap is left between the tilting plate drive assembly and the bottom conveyor belt assembly.

[0008] Preferably, the mounting assembly includes: a first metal flip plate and a second metal flip plate, each having a mounting groove on its opposite side, the first metal flip plate and the second metal flip plate being rotatably connected by a hinge, and the bottom edges of the opposite ends of the first metal flip plate and the second metal flip plate being connected by a hinge. The semiconductor silicon wafer to be tested is placed in a mounting groove, and the depth of the mounting groove is less than the thickness of the semiconductor silicon wafer to be tested.

[0009] Preferably, the width of one side of the polygonal transmission body is the same as the width of the first metal flip plate and the second metal flip plate. The bottom surface of the first metal flip plate and the second metal flip plate are provided with multiple hooks. The hooks are made of velvet. The outer wall of the polygonal transmission body is provided with a hook surface that matches the velvet surface.

[0010] Preferably, a placement base fixed to an external bracket is interspersed on the flip plate transmission assembly. The flip plate transmission assembly is slidably connected to the top of the placement base. A U-shaped pressing frame slides vertically on the placement base. A compression spring is provided between the placement base and the U-shaped pressing frame, which drives the U-shaped pressing frame to press down. Side pressing blocks are symmetrically arranged on the top of the U-shaped pressing frame, and the side pressing blocks are squeezed against the top of the flip plate transmission assembly by the compression spring. The side pressing blocks are not in contact with the semiconductor silicon wafer to be tested.

[0011] Preferably, a top crossbar is fixedly provided between the two side pressure blocks. The sensor assembly includes a side vision sensor and a top vision sensor. Multiple side vision sensors are linearly fixed at the opposite ends of the two side pressure blocks, and the side vision sensors are tangent to the bottom of the side pressure blocks. The top vision sensor is fixed at the bottom of the top crossbar.

[0012] Preferably, the reversing mechanism includes an arc-shaped plate, which is coaxially fixed to a polygonal transmission body facing the arc-shaped plate via a connecting bracket, and a gap is left between the arc-shaped plate and the flip-plate transmission assembly. The side of the arc-shaped plate facing the polygonal transmission body is mirrored, and the other end of the arc-shaped plate is tangent to the top of the bottom conveyor belt assembly.

[0013] Preferably, the stacking mechanism includes: a vertical sliding frame, which is vertically arranged, a lifting platform that slides up and down on the vertical sliding frame, a rotating screw that passes through the lifting platform on the vertical sliding frame, and the output end of the third driving member being fixed coaxially with the rotating screw; A horizontal push plate slides vertically to the bottom of the lifting platform. An electric push rod is installed on the lifting platform, and the output end of the electric push rod is connected to one end of the horizontal push plate. An electric suction cup for adsorbing the semiconductor silicon wafer to be tested is installed at the other end of the horizontal push plate.

[0014] Preferably, the flip plate transmission assembly is provided with a semiconductor silicon wafer storage box connected to the external bracket, and the bottom of the semiconductor silicon wafer storage box is connected to the top of the flip plate transmission assembly. The bottom of the semiconductor silicon wafer storage box facing the sensor assembly is provided with a side sliding hole. Multiple semiconductor silicon wafers to be tested are stacked in the semiconductor silicon wafer storage box, and the inner diameter of the semiconductor silicon wafer storage box is adapted to the placement groove.

[0015] The beneficial effects of the present invention are as follows: 1. The present invention sets up a first metal flip plate and a second metal flip plate for flipping, and then places the semiconductor silicon wafer to be tested in the placement groove. During the transportation process by the polygonal transmission body, when the first metal flip plate and the second metal flip plate are transported to the position of the polygonal transmission body, the first metal flip plate and the second metal flip plate bend, exposing the semiconductor silicon wafer to be tested. With the sliding reversal of the arc plate, the flipping of the semiconductor silicon wafer to be tested is completed, thereby realizing the coordinated operation of translational transportation and flipping of the semiconductor silicon wafer to be tested, and improving the overall detection efficiency.

[0016] 2. The present invention uses a side vision sensor installed on the side wall of the side pressure block and tangent to the bottom of the side pressure block. The semiconductor silicon wafer to be tested located in the flip plate transmission assembly is in a protruding state. Therefore, the side vision sensor can detect the side wall of the semiconductor silicon wafer to be tested that is being translated, and can detect whether the protruding state of the semiconductor silicon wafer to be tested is abnormal, thereby enabling the unqualified semiconductor silicon wafer to be tested to be screened and rejected. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a semiconductor silicon wafer frame appearance translation inspection device proposed in this invention; Figure 2 for Figure 1 Enlarged structural diagram at point A; Figure 3 This is a front view of a semiconductor silicon wafer carrier appearance translation inspection device proposed in this invention; Figure 4 for Figure 3 Enlarged structural diagram at point B; Figure 5These are the left and right isometric views of a semiconductor silicon wafer holder appearance translation inspection device proposed in this invention; Figure 6 This is a schematic diagram of the flip-plate transmission assembly in a semiconductor silicon wafer rack appearance translation inspection device proposed in this invention; Figure 7 This is a detailed structural diagram of the flip-plate transmission assembly in a semiconductor silicon wafer rack appearance translation inspection device proposed in this invention; Figure 8 This is an isometric view of the upper and lower isometric angles of the flip plate transmission assembly in a semiconductor silicon wafer frame appearance translation inspection device proposed in this invention.

[0018] In the diagram: 1. Bottom conveyor belt assembly; 2. Drive roller; 3. Tilting plate drive assembly; 31. First metal tilting plate; 32. Second metal tilting plate; 33. Placement slot; 34. Rotating hinge; 35. Hook and loop fastener; 4. Polygonal transmission body; 5. Connecting bracket; 6. Arc plate; 7. Semiconductor silicon wafer to be tested; 8. U-shaped pressure frame; 9. Placement base; 10. Side pressure block; 11. Top crossbar; 12. Side vision sensor; 13. Vertical sliding frame; 14. Lifting platform; 15. Rotating lead screw; 16. Horizontal push plate; 17. Electric push rod; 18. Electric suction cup; 19. Semiconductor silicon wafer temporary storage box; 20. Side sliding hole. Detailed Implementation

[0019] Reference Figures 1-8 A semiconductor silicon wafer pallet appearance translation inspection device includes an external support frame and a bottom conveyor belt assembly 1 mounted on the external support frame. Two transmission rollers 2 are mounted on the external support frame, located at both ends of the bottom conveyor belt assembly 1 and driving it. A flip-plate transmission assembly 3 is mounted directly above the bottom conveyor belt assembly 1. Two polygonal transmission bodies 4 are mounted on the external support frame, and a first drive member, a second drive member, and a third drive member are also mounted on the external support frame. The output ends of the first and second drive members are coaxially fixed with the transmission rollers 2 and the polygonal transmission bodies 4, respectively. The third drive member is mounted on a stacking mechanism. Therefore, activating the first and second drive members drives the transmission rollers 2 and the polygonal transmission bodies 4, allowing the rotating transmission rollers 2 and the polygonal transmission bodies 4 to drive the bottom conveyor belt assembly 1 and the flip-plate transmission assembly 3 to transport the semiconductor silicon wafer 7 to be inspected, facilitating the translational transmission inspection of the semiconductor silicon wafer 7.

[0020] Reference Figure 1As shown, the flip-plate transmission assembly 3 includes multiple mounting components. These components are connected end-to-end by hinges and form a ring. A gap is left between the flip-plate transmission assembly 3 and the bottom conveyor belt assembly 1. This facilitates the conveying of the semiconductor silicon wafer 7 to be inspected on the flip-plate transmission assembly 3 and the translational inspection of the appearance of the semiconductor silicon wafer 7 during the conveying process. After passing through the reversing mechanism, the semiconductor silicon wafer 7 to be inspected that has fallen off the flip-plate transmission assembly 3 is flipped and slides onto the bottom conveyor belt assembly 1. Then, under the action of the stacking mechanism, the semiconductor silicon wafer 7 to be inspected on the bottom conveyor belt assembly 1 is picked up again and put back onto the flip-plate transmission assembly 3. It then passes through the sensor assembly again to inspect the other side, thereby realizing the overall translational inspection of the appearance of the semiconductor silicon wafer 7 to be inspected.

[0021] A placement base 9, which is fixed to an external bracket, is inserted into the flip plate transmission assembly 3. The flip plate transmission assembly 3 is slidably connected to the top of the placement base 9. Therefore, the flip plate transmission assembly 3, which slides on the top of the placement base 9, is in a horizontal state. A U-shaped pressing frame 8 slides vertically on the placement base 9. A compression spring is provided between the placement base 9 and the U-shaped pressing frame 8, which drives the U-shaped pressing frame 8 to press down. Side pressing blocks 10 are symmetrically arranged on the top of the U-shaped pressing frame 8, and the side pressing blocks 10 are pressed against the top of the flip plate transmission assembly 3 by the compression spring. Multiple semiconductor silicon wafers 7 to be tested are placed on the flip plate transmission assembly 3. The side pressing blocks 10 are not in contact with the semiconductor silicon wafers to be tested. This ensures that the U-shaped pressing frame 8, under the action of the compression spring, presses the two side pressing blocks 10 on the top of the flip plate transmission assembly 3. This ensures that the flip plate transmission assembly 3 in this area is in a horizontal state and that the flip plate transmission assembly 3 in this area is in a stable conveying state.

[0022] A top crossbeam 11 is fixedly installed at the top between the two side pressure blocks 10. The flip plate transmission assembly 3 is equipped with multiple sensor assemblies for detecting the semiconductor silicon wafer 7 to be tested. The sensor assemblies include side vision sensors 12 and top vision sensors. The multiple side vision sensors 12 are linearly fixed at the opposite ends of the two side pressure blocks 10, and the side vision sensors 12 are tangent to the bottom of the side pressure blocks 10. The top vision sensors are fixed at the bottom of the top crossbeam 11. It should be noted that the side vision sensors 12 tangent to the bottom of the side pressure blocks 10 are used to detect the side of the semiconductor silicon wafer 7 to be tested. Since the semiconductor silicon wafer 7 to be tested protrudes from the upper surface of the flip plate transmission assembly 3, the side vision sensors 12 can detect the parallel movement of the side of the semiconductor silicon wafer 7 to be tested, and can detect whether there are undulations on the upper surface of the semiconductor silicon wafer 7 to be tested. If there are undulations, it means that the semiconductor silicon wafer 7 to be tested at that location is a defective product. The top vision sensor fixed to the top crossbeam 11 is used for visual inspection of the upper surface of the semiconductor silicon wafer 7 to be tested.

[0023] Reference Figures 6-8 In the state, the mounting components include a first metal flip plate 31 and a second metal flip plate 32. Each of the first metal flip plate 31 and the second metal flip plate 32 has a mounting groove 33 on its opposite side. It should be noted that when the mounting grooves 33 on the opposite ends of the first metal flip plate 31 and the second metal flip plate 32 are closed, they are adapted to the semiconductor silicon wafer 7 to be tested, that is, the semiconductor silicon wafer 7 to be tested can be placed in the two mounting grooves 33 on the opposite ends of the first metal flip plate 31 and the second metal flip plate 32.

[0024] The semiconductor silicon wafer 7 to be tested is placed in the mounting groove 33, and the depth of the mounting groove 33 is less than the thickness of the semiconductor silicon wafer 7 to be tested. Therefore, when the first metal flip plate 31 and the second metal flip plate 32 are flush and not flipped, the semiconductor silicon wafer 7 to be tested placed in the mounting groove 33 protrudes from the upper surface of the first metal flip plate 31 and the second metal flip plate 32. This facilitates the subsequent detection of the sensor assembly. The first metal flip plate 31 and the second metal flip plate 32 are rotatably connected by a hinge 34. The bottom edges of the opposite ends of the first metal flip plate 31 and the second metal flip plate 32 are connected by the hinge 34. It should be noted that this arrangement can ensure that no obstruction occurs during the flipping process of the first metal flip plate 31 and the second metal flip plate 32. Then, through the flipping operation between the first metal flip plate 31 and the second metal flip plate 32, it is convenient to expose the semiconductor silicon wafer 7 to be tested, which was originally stuck in the placement groove 33, so that it can be easily picked up.

[0025] Furthermore, in this embodiment, through the conveying method of the flip plate transmission assembly 3 itself, the appearance translation detection of the semiconductor silicon wafer 7 placed on the flip plate transmission assembly 3 is first realized; secondly, when the first metal flip plate 31 and the second metal flip plate 32, on which the semiconductor silicon wafer 7 is placed, pass through the polygonal transmission body 4, the first metal flip plate 31 and the second metal flip plate 32 are flipped in accordance with the structural shape of the polygonal transmission body 4 itself, so that the semiconductor silicon wafer 7 originally located in the placement groove 33 is exposed. Compared with the traditional method of directly picking it by hand, the flipping efficiency can be effectively improved.

[0026] It should be noted that, referring to Figure 8 In this state, the polygonal transmission body 4 is used to transmit the flip plate transmission assembly 3. The width of one side of the polygonal transmission body 4 is the same as the width of the first metal flip plate 31 and the second metal flip plate 32. The bottom surfaces of the first metal flip plate 31 and the second metal flip plate 32 are provided with multiple hooks 35. The hooks 35 are made of velvet. The outer wall of the polygonal transmission body 4 is provided with hooks that are adapted to the velvet. This arrangement ensures that the first metal flip plate 31 and the second metal flip plate 32, which were originally in a flat state, are bent in the process of passing through the polygonal transmission body 4. At the same time, because the bottom surfaces of the first metal flip plate 31 and the second metal flip plate 32 are bonded to the outer wall of the polygonal transmission body 4 with the velvet and hooks, the first metal flip plate 31 and the second metal flip plate 32 can be transmitted without slipping.

[0027] A reversing mechanism and a stacking mechanism are provided between the bottom conveyor belt assembly 1 and the tilting plate transmission assembly 3, and the reversing mechanism and the stacking mechanism are located on both sides of the tilting plate transmission assembly 3.

[0028] The reversing mechanism includes an arc-shaped plate 6, which is coaxially fixed to a polygonal transmission body 4 facing the arc-shaped plate 6 via a connecting bracket 5. A gap is left between the arc-shaped plate 6 and the tilting plate transmission assembly 3. The side of the arc-shaped plate 6 facing the polygonal transmission body 4 is mirrored, and the other end of the arc-shaped plate 6 is tangent to the top of the bottom conveyor belt assembly 1. (Refer to...) Figure 3 and Figure 4 In the first metal flip plate 31 and the second metal flip plate 32, after flipping, the semiconductor silicon wafer 7 to be tested is detached and flipped up and down. After sliding and reversing through the arc plate 6, the semiconductor silicon wafer 7 to be tested, after the upper surface has been tested, is flipped down and then slid onto the bottom conveyor belt assembly 1, and then conveyed to the stacking mechanism through the bottom conveyor belt assembly 1.

[0029] The stacking mechanism includes a vertical sliding frame 13, which is vertically arranged. A lifting platform 14 is slidably raised and lowered on the vertical sliding frame 13. A rotating screw 15 is provided on the vertical sliding frame 13 and passes through the lifting platform 14. The output end of the third driving member is coaxially fixed with the rotating screw 15. Therefore, the lifting platform 14 can be driven to slide up and down on the vertical sliding frame 13 by rotating the screw 15.

[0030] The stacking mechanism also includes a horizontal push plate 16, which slides vertically to the bottom of the lifting platform 14. An electric push rod 17 is provided on the lifting platform 14, and the output end of the electric push rod 17 is connected to one end of the horizontal push plate 16. An electric suction cup 18 is provided at the other end of the horizontal push plate 16 to adsorb the semiconductor silicon wafer 7 to be tested. The electric suction cup 18 is used to adsorb the semiconductor silicon wafer 7 to be tested that has been flipped on the bottom conveyor belt assembly 1.

[0031] Therefore, under the action of rotating screw 15, the lifting platform 14, along with the horizontal push plate 16 and the electric suction cup 18 that has been adsorbed with the flipped semiconductor silicon wafer 7 to be tested, is lifted together. Then, the electric push rod 17 is turned on to drive the electric suction cup 18 on the horizontal push plate 16 to move towards the semiconductor silicon wafer temporary storage box 19. Then, the electric suction cup 18 that has been adsorbed with the semiconductor silicon wafer 7 to be tested moves to the top of the semiconductor silicon wafer temporary storage box 19. Then, the electric suction cup 18 is turned off, and the semiconductor silicon wafer 7 to be tested is placed in the semiconductor silicon wafer temporary storage box 19.

[0032] The flip-plate transmission assembly 3 is equipped with a semiconductor silicon wafer storage box 19 connected to the external bracket. The bottom of the semiconductor silicon wafer storage box 19 is connected to the top of the flip-plate transmission assembly 3. The bottom of the semiconductor silicon wafer storage box 19 facing the sensor assembly has a side sliding hole 20. Multiple semiconductor silicon wafers 7 to be tested are stacked in the semiconductor silicon wafer storage box 19, and the inner diameter of the semiconductor silicon wafer storage box 19 is adapted to the mounting groove 33. It should be noted that, referring to Figure 3 In this state, the semiconductor silicon wafer temporary storage box 19 is located on the right side of the polygonal transmission body 4. The flip plate transmission assembly 3 at this position is in a stable state, which facilitates the movement of the stacked semiconductor silicon wafers 7 to be tested along with the flip plate transmission assembly 3, allowing them to fall into the placement groove 33 and then slide out from the side sliding hole 20 without obstruction. Thus, the semiconductor silicon wafers 7 to be tested, after being flipped, are placed back on the flip plate transmission assembly 3, thereby realizing the two-fold flipping and testing of the semiconductor silicon wafers 7.

[0033] The working principle of this invention is as follows: Since the peripheral bracket is equipped with a first driving component, a second driving component and a third driving component, the first driving component and the second driving component are turned on, and the transmission roller 2 and the polygonal transmission body 4 are driven, so that the rotating transmission roller 2 and the polygonal transmission body 4 drive the bottom conveyor belt assembly 1 and the flip plate transmission assembly 3 to transmit the semiconductor silicon wafer 7 to be tested, which facilitates the translational transmission test of the semiconductor silicon wafer 7 to be tested. A placement base 9, which is fixed to an external bracket, is inserted into the flip plate transmission assembly 3. The flip plate transmission assembly 3 is slidably connected to the top of the placement base 9. Therefore, the flip plate transmission assembly 3, which slides on the top of the placement base 9, is in a horizontal state. The U-shaped lower pressure frame 8, under the action of the compression spring, presses the top of the flip plate transmission assembly 3 with the two side pressure blocks 10 set on the top. This ensures that the flip plate transmission assembly 3 in this area is in a horizontal state and that the flip plate transmission assembly 3 in this area is in a stable conveying state. The side vision sensor 12, which is tangent to the bottom of the side pressure block 10, is used to detect the side of the semiconductor silicon wafer 7 to be tested. Since the semiconductor silicon wafer 7 to be tested protrudes from the upper surface of the flip plate transmission assembly 3, the side vision sensor 12 can detect the side state of the parallel-moving semiconductor silicon wafer 7 to be tested, and can detect whether there are undulations on the upper surface of the semiconductor silicon wafer 7 to be tested. If there are undulations, it means that the semiconductor silicon wafer 7 to be tested at that location is a defective product. The top vision sensor fixed to the top crossbar 11 is used to visually detect the upper surface of the semiconductor silicon wafer 7 to be tested. Then, the conveying method of the flip plate transmission assembly 3 itself first realizes the appearance translation inspection of the semiconductor silicon wafer 7 to be tested placed on the flip plate transmission assembly 3; secondly, when the first metal flip plate 31 and the second metal flip plate 32, on which the semiconductor silicon wafer 7 to be tested is placed, pass through the polygonal transmission body 4, the first metal flip plate 31 and the second metal flip plate 32 are flipped in accordance with the structural shape of the polygonal transmission body 4 itself, so that the semiconductor silicon wafer 7 to be tested, which was originally located in the placement groove 33, is exposed. Compared with the traditional method of directly picking it by hand, the flipping efficiency can be effectively improved. The outer wall of the polygonal transmission body 4 is provided with hook surfaces that are compatible with the velvet surface. This arrangement ensures that the first metal flip plate 31 and the second metal flip plate 32, which were originally in a flat state, are bent during the process of passing through the polygonal transmission body 4. At the same time, because the bottom surfaces of the first metal flip plate 31 and the second metal flip plate 32 are bonded to the outer wall of the polygonal transmission body 4 by the velvet surface and hook surfaces, the first metal flip plate 31 and the second metal flip plate 32 can be driven without slipping. The semiconductor silicon wafer 7 to be tested is detached and flipped up and down. After the arc plate 6 slides and reverses, the semiconductor silicon wafer 7 to be tested after the upper surface has been tested is flipped down and then slid onto the bottom conveyor belt assembly 1. It is then conveyed to the stacking mechanism through the bottom conveyor belt assembly 1. Under the action of rotating screw 15, the lifting platform 14, along with the horizontal push plate 16 and the electric suction cup 18 that has been adsorbed with the flipped semiconductor silicon wafer 7 to be tested, is lifted together. Then, the electric push rod 17 is turned on to drive the electric suction cup 18 on the horizontal push plate 16 to move towards the semiconductor silicon wafer temporary storage box 19. Then, the electric suction cup 18 that has been adsorbed with the semiconductor silicon wafer 7 to be tested moves to the top of the semiconductor silicon wafer temporary storage box 19. Then, the electric suction cup 18 is turned off, and the semiconductor silicon wafer 7 to be tested is placed in the semiconductor silicon wafer temporary storage box 19. Finally, multiple semiconductor silicon wafers 7 to be tested are stacked in the semiconductor silicon wafer storage box 19. The stacked semiconductor silicon wafers 7 to be tested are moved by the flip plate transmission assembly 3 and fall into the placement groove 33. Then they slide out from the side sliding hole 20 without being obstructed. The semiconductor silicon wafers 7 to be tested after being flipped are placed on the flip plate transmission assembly 3, thereby realizing the two flipping and testing of the semiconductor silicon wafers 7 to be tested.

[0034] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor silicon wafer appearance translation detection apparatus, comprising an external device support, and a bottom conveyor belt assembly (1) arranged on the external device support, characterized in that, The peripheral support is provided with two transmission rollers (2), the two transmission rollers (2) are located at two ends of the bottom conveying belt assembly (1) and drive the bottom conveying belt assembly (1), a turnover plate transmission assembly (3) is arranged above the bottom conveying belt assembly (1), the peripheral support is provided with two multi-edge transmission bodies (4), and the multi-edge transmission bodies (4) are used for conveying the turnover plate transmission assembly (3), and a plurality of semiconductor silicon wafers (7) to be detected are placed on the turnover plate transmission assembly (3); The turnover plate transmission assembly (3) is provided with a plurality of sensor assemblies for detecting the semiconductor silicon wafers (7) to be detected, and a reversing mechanism and a stacking mechanism are arranged between the bottom conveying belt assembly (1) and the turnover plate transmission assembly (3), and the reversing mechanism and the stacking mechanism are respectively located on both sides of the turnover plate transmission assembly (3).

2. The apparatus according to claim 1, wherein, The peripheral support is provided with a first driving member, a second driving member and a third driving member, the output ends of the first driving member and the second driving member are coaxially fixed with the transmission rollers (2) and the multi-edge transmission bodies (4) respectively, and the third driving member is arranged on the stacking mechanism.

3. The apparatus according to claim 1, wherein, The turnover plate transmission assembly (3) comprises a plurality of mounting assemblies, the mounting assemblies are sequentially connected through hinges in a head-to-tail mode and form a ring shape, and a gap is left between the turnover plate transmission assembly (3) and the bottom conveying belt assembly (1).

4. The apparatus according to claim 3, wherein the apparatus further comprises a plurality of light emitting diodes (LEDs) arranged on the first surface of the base plate, and a plurality of light receiving elements arranged on the second surface of the base plate. The mounting assembly comprises: a first metal turnover plate (31) and a second metal turnover plate (32), opposite sides of the first metal turnover plate (31) and the second metal turnover plate (32) are provided with a mounting groove (33), the first metal turnover plate (31) and the second metal turnover plate (32) are rotationally connected through a rotating hinge (34), and bottom surfaces of opposite ends of the first metal turnover plate (31) and the second metal turnover plate (32) are connected through the hinge (34); the semiconductor silicon wafer (7) to be detected is placed in the mounting groove (33), and a groove depth of the mounting groove (33) is less than a thickness of the semiconductor silicon wafer (7) to be detected.

5. The apparatus according to claim 3, wherein the apparatus is characterized by: The single-side width of the multi-edge transmission body (4) is the same as the width of the first metal turnover plate (31) and the second metal turnover plate (32), the bottom surfaces of the first metal turnover plate (31) and the second metal turnover plate (32) are provided with a plurality of sticky buckles (35), the sticky buckles (35) adopt a velvet surface, and the outer side wall of the multi-edge transmission body (4) is provided with a hook surface matched with the velvet surface.

6. The apparatus according to claim 1, wherein, The turnover plate transmission assembly (3) is provided with a placing base (9) fixed with the peripheral support, the turnover plate transmission assembly (3) and the top of the placing base (9) slide and connect, the placing base (9) is vertically slidably provided with a U-shaped pressing frame (8), a compression spring is arranged between the placing base (9) and the U-shaped pressing frame (8) and drives the U-shaped pressing frame (8) to move downward, the top of the U-shaped pressing frame (8) is symmetrically provided with side pressing blocks (10), the side pressing blocks (10) are pressed against the top of the turnover plate transmission assembly (3) through the compression spring, and the side pressing blocks (10) do not contact the semiconductor silicon wafer (7) to be detected.

7. The apparatus according to claim 6, wherein, The top of the two side pressing blocks (10) is fixedly provided with a top cross beam (11), and the sensor assembly comprises side visual sensors (12) and a top visual sensor.

8. The apparatus according to claim 1, wherein, The reversing mechanism comprises an arc-shaped plate (6) coaxially fixed with the multi-sided transmission body (4) on the side facing the arc-shaped plate (6) through a connecting support (5), and a gap is left between the arc-shaped plate (6) and the turnover plate transmission assembly (3), and a mirror surface is arranged on the side of the arc-shaped plate (6) facing the multi-sided transmission body (4), and the other end of the arc-shaped plate (6) is tangent to the top of the bottom conveying belt assembly (1).

9. The apparatus according to claim 2, wherein, The stacking mechanism comprises a vertical sliding frame (13) vertically arranged, a lifting platform (14) slidingly arranged on the vertical sliding frame (13), a rotating lead screw (15) penetrating through the lifting platform (14) and arranged on the vertical sliding frame (13), and an output end of the third driving element coaxially fixed with the rotating lead screw (15); A horizontal push plate (16) vertically slidingly arranged on the bottom of the lifting platform (14), an electric push rod (17) arranged on the lifting platform (14), and an output end of the electric push rod (17) connected with one end of the horizontal push plate (16), and the other end of the horizontal push plate (16) is provided with an electric suction disc (18) for suctioning the semiconductor silicon wafer (7) to be detected.

10. The apparatus according to claim 4, wherein, The turnover plate transmission assembly (3) is provided with a semiconductor silicon wafer temporary storage box (19) connected with the external support, the bottom of the semiconductor silicon wafer temporary storage box (19) is connected with the top of the turnover plate transmission assembly (3), the bottom of the semiconductor silicon wafer temporary storage box (19) on the side facing the sensor assembly is provided with a side sliding hole (20), a plurality of semiconductor silicon wafers (7) to be detected are stacked in the semiconductor silicon wafer temporary storage box (19), and the inner diameter size of the semiconductor silicon wafer temporary storage box (19) is matched with the accommodating groove (33).

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