Multi-parameter plant life information integrated sensing device

Abstract

The invention discloses a multi-parameter plant life information integrated sensing device, and relates to the technical field of plant physiological information sensing. The sensor comprises a composite dielectric layer flexible sensing substrate, a gradient honeycomb isolation cavity arranged on the composite dielectric layer flexible sensing substrate, and a multi-parameter signal isolation acquisition module arranged in the gradient honeycomb isolation cavity, wherein the gradient honeycomb isolation cavity has a gradient honeycomb structure based on hexagonal topology; the multi-parameter signal isolation acquisition module comprises an electrochemical sensor, a micro spectrum chip and a flexible temperature and humidity film; and the electrochemical sensor, the micro spectrum chip and the flexible temperature and humidity film are physically isolated in independent chambers by the gradient honeycomb isolation cavity. According to the invention, through a three-layer structure of gradient honeycomb sub-bins and composite bin walls and a multi-isolation design, electromagnetic, thermal, chemical and optical quadruple non-interference monitoring is realized, and the core pain point of multi-parameter integration of an existing device is solved.

Description

Technical Field

[0001] This invention belongs to the field of plant physiological information sensing technology, and in particular relates to a multi-parameter plant life information integrated sensing device. Background Technology

[0002] Precise monitoring of plant life information is a core supporting technology for modern agricultural precision management, forestry research, and environmental monitoring. The reliability of the data directly affects the scientific nature of related decisions. Traditional monitoring methods generally rely on independent measurement devices for single parameters: detecting stem sap ion concentration using independent electrochemical sensors, obtaining leaf chlorophyll content using handheld spectrometers, and assessing plant transpiration intensity using dedicated temperature and humidity recorders. These decentralized monitoring schemes suffer from problems such as large size, cumbersome operation, and inability to collect data synchronously in situ, resulting in misaligned data over time and difficulty in reflecting the real-time correlation of plant life status.

[0003] A more prominent problem is that existing multi-parameter integrated sensing devices have failed to effectively address the interference issues between sensing modules based on different principles, becoming a core bottleneck restricting monitoring accuracy. For example, the electrolyte in electrochemical sensors is prone to diffusion and penetration with moisture in the working environment of temperature and humidity sensors, causing ion concentration measurement errors exceeding 15%. Furthermore, the optical detection process of miniature spectroscopic chips is susceptible to electromagnetic radiation interference from other electronic components, leading to a decrease in chlorophyll content detection accuracy of over 20%. Essentially, when devices based on different sensing principles, such as electrochemistry, spectroscopy, and temperature and humidity, are integrated onto the same carrier, multiple cross-interferences inevitably occur, including electromagnetic coupling, thermal conduction, chemical media migration, and optical stray light. This ultimately results in distorted measurement data, failing to meet the core requirement of data reliability for accurate monitoring. Summary of the Invention

[0004] The purpose of this invention is to provide a multi-parameter plant life information integrated sensing device, which solves the problem of signal crosstalk and electromagnetic interference between devices with different sensing principles in existing devices by using gradient honeycomb compartments, a three-layer structure of composite compartment walls and multiple isolation designs.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: This invention relates to a multi-parameter plant life information integrated sensing device, comprising a flexible sensing substrate with a composite dielectric layer, a gradient honeycomb isolation cavity disposed on the flexible sensing substrate, the gradient honeycomb isolation cavity having a gradient honeycomb structure based on hexagonal topology, and a multi-parameter signal isolation and acquisition module disposed within the gradient honeycomb isolation cavity; the multi-parameter signal isolation and acquisition module includes an electrochemical sensor, a micro-spectral chip, and a flexible temperature and humidity film; the gradient honeycomb isolation cavity physically isolates the electrochemical sensor, the micro-spectral chip, and the flexible temperature and humidity film in independent chambers; the gradient honeycomb isolation cavity, through the gradient honeycomb structure based on hexagonal topology, achieves physical isolation and environmental adaptation of different sensing elements in the multi-parameter signal isolation and acquisition module, ensuring interference-free monitoring of each parameter.

[0006] Furthermore, the cell size of the gradient honeycomb isolation cavity satisfies the formula D(r) = 5 + 0.7r², where 0≤r≤6mm, r is the distance from the center of the electrochemical sensor chamber, and D is the diameter of the inscribed circle of the cell, in mm. The gradient size design of the gradient honeycomb structure aims to balance structural strength, isolation effect, and the need for lightweight device.

[0007] Furthermore, the composite dielectric layer flexible sensing substrate includes a polyimide substrate and a composite dielectric layer connected by a hot-pressing-UV curing composite process. The composite dielectric layer has an average pore size ≤100nm, a porosity ≤3%, and a surface roughness ≤0.65nm.

[0008] Furthermore, the wall of the gradient honeycomb isolation cavity is a three-layer composite structure, comprising a substrate layer, a functional layer, and a shielding layer from the inside out; the substrate layer is composed of TPU material mixed with 30wt% glass fiber reinforcement material, with a thickness of 0.8 mm to 1.5 mm; the functional layer has a thickness of 50 ± 5 μm; the shielding layer is composed of 120-mesh corrugated copper mesh, embedded on the outside of the substrate layer, with a corrugation height of 0.1 mm and a wavelength of 0.5 mm.

[0009] Furthermore, the functional layer is specifically configured as follows: the inner side of the electrochemical sensor compartment is a hydrophilic acrylate coating with a contact angle <30°; the inner side of the micro-spectral chip compartment is an optical-grade PET film with a transmittance ≥95%@400-800nm; and the inner side of the flexible temperature and humidity film compartment is a hydrophobic nano-SiO2 coating with a contact angle >150°.

[0010] Furthermore, the bottom of the electrochemical sensor compartment is provided with a TPU sealing layer to prevent electrolyte penetration and an annular flow-guiding sealing ring; the bottom of the micro-spectral chip compartment is provided with a black PET substrate to suppress stray light; and the bottom of the flexible temperature and humidity film compartment is provided with a microporous PTFE breathable membrane.

[0011] Furthermore, the center lines connecting the electrochemical sensor compartment, the micro-spectral chip compartment, and the flexible temperature and humidity film compartment form an equilateral triangle, the minimum distance between the centers of adjacent compartments is 11.7 mm to 14 mm, and a shielding layer is provided between adjacent compartments.

[0012] Furthermore, the electromagnetic shielding frequency range of the shielding layer is DC-10GHz, with an attenuation greater than 62dB.

[0013] Furthermore, the composite dielectric layer flexible sensing substrate can be spirally wound to adapt to plant stems with diameters of 5 mm to 50 mm, and its electrical performance attenuation is less than 5% when the bending radius is ≤30 mm.

[0014] A method for monitoring plant life information involves wrapping the aforementioned multi-parameter plant life information integrated sensing device around the stem of a plant to simultaneously monitor the ion concentration of the plant stem sap, the chlorophyll content of the leaves, and the intensity of transpiration; the composite dielectric layer flexible sensing substrate is fixed to the plant stem by a detachable snap-fit ​​or adhesive patch.

[0015] The present invention has the following beneficial effects: This invention achieves interference-free monitoring of electromagnetic, thermal, chemical, and optical signals through gradient honeycomb compartments, a three-layer composite wall structure, and multiple isolation designs, reducing signal sampling rate errors and solving the core pain point of multi-parameter integration in existing devices.

[0016] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a multi-parameter plant life information integrated sensing device according to the present invention; The attached diagram lists the components represented by each number as follows: 1- Composite dielectric layer flexible sensing substrate, 2- Electrochemical sensor, 3- Micro-spectral chip, 4- Flexible temperature and humidity film. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.

[0021] Please see Figure 1 As shown, the present invention is a multi-parameter plant life information integrated sensing device, including a composite dielectric layer flexible sensing substrate 1, a gradient honeycomb isolation cavity disposed on the composite dielectric layer flexible sensing substrate 1, the gradient honeycomb isolation cavity having a gradient honeycomb structure based on hexagonal topology, and a multi-parameter signal isolation acquisition module disposed within the gradient honeycomb isolation cavity; the multi-parameter signal isolation acquisition module includes an electrochemical sensor 2, a micro-spectral chip 3, and a flexible temperature and humidity film 4; the gradient honeycomb isolation cavity physically isolates the electrochemical sensor 2, the micro-spectral chip 3, and the flexible temperature and humidity film 4 into three independent chambers.

[0022] The flexible sensing substrate with a composite dielectric layer serves as the carrier of the device. A thermosetting-UV curing composite process is used to firmly bond the polyimide substrate to the composite dielectric layer. The composite dielectric layer possesses extremely high flatness and density, with an average pore size ≤100nm, porosity ≤3%, and surface roughness ≤0.65nm. This provides a stable and reliable electrical foundation for the arrangement of the precision sensors on the upper layer. The substrate exhibits excellent flexibility, allowing it to be tightly adhered to plant stems with diameters ranging from 5mm to 50mm via helical winding. Testing shows that under bending radii ≤30mm, its electrical performance degradation is less than 5%, ensuring stable operation on complex curved surfaces.

[0023] Hot-pressed-UV-cured composites include: Pretreatment: The surface of the polyimide substrate is subjected to plasma etching at 300W power for 60s to form a micro-rough surface with Ra=0.3μm-0.5μm. This process increases the contact area between the substrate and the adhesive layer, enhances the interfacial physical adsorption force and subsequent bonding strength, and avoids the risk of interlayer delamination. Adhesive layer: A 5μm thick UV-curable polyimide adhesive (model PI-UV400) is selected, with a glass transition temperature >250℃, dielectric constant 3.2±0.1, and elongation at break >200%, avoiding the dielectric interference and aging problems of ordinary adhesives; Composite process: Hot pressing for 30s under 0.5MPa pressure and 80℃ heating, followed by 60s curing under 365nm ultraviolet light. The final interface peel strength is >15N / cm, with no bubble residue. It maintains dielectric stability and structural integrity for a long time in an environment of -20℃ to 60℃.

[0024] The gradient honeycomb isolation cavity is built on a flexible sensing substrate, and its core feature is the adoption of a gradient honeycomb structure based on hexagonal topology. The diameter of the inscribed circle of the honeycomb cell is precisely controlled by the formula D(r)=5+0.7r² (0≤r≤6mm), where r is the distance from the central chamber (the electrochemical sensor chamber in this embodiment). This gradient design achieves optimal material distribution and minimizes weight while ensuring the mechanical strength of the structure.

[0025] The warehouse walls have a three-layer composite structure: from the inside out, they consist of a base layer, a functional layer, and a shielding layer.

[0026] The matrix layer is composed of TPU material mixed with 30wt% glass fiber reinforcement material, with a thickness of 0.8mm to 1.5mm, providing support and toughness for the main structure; and has a tensile strength ≥30MPa, a bending resistance of >1000 times (bending radius 30mm), and the TPU substrate is resistant to plant sap corrosion, ensuring long-term stability.

[0027] The thickness is 50±5μm, and it is customized according to the functional requirements of different compartments. The inside of the electrochemical sensor chamber is coated with a hydrophilic acrylic coating with a contact angle of <30° to promote the uniform spread of the electrolyte and guide the plant juice to evenly cover the sensor probe.

[0028] Inside the micro-spectral chip compartment, an optical-grade PET film with a transmittance of ≥95%@400-800nm ​​is attached to ensure high-fidelity transmission of spectral signals.

[0029] The inside of the flexible temperature and humidity membrane chamber is coated with a hydrophobic nano-SiO2 coating with a contact angle >150°, which effectively prevents condensation interference.

[0030] The shielding layer is composed of a 120-mesh corrugated copper mesh, embedded on the outside of the substrate layer. The corrugated structure has a wave height of 0.1 mm and a wavelength of 0.5 mm. This design increases the ductility of the copper mesh, allowing it to bend in tandem with the flexible substrate. The electromagnetic shielding effectiveness of this layer covers the DC-10 GHz frequency range, with an attenuation greater than 62 dB, effectively isolating electromagnetic interference between the sensors.

[0031] The centers of the three compartments form an equilateral triangle. The minimum distance between the centers of adjacent compartments is controlled between 11.7 mm and 14 mm, and the aforementioned shielding layer is installed between adjacent compartments. The minimum distance is determined based on the signal interference threshold of each sensor and the installation space requirements. The bottom of the electrochemical sensor compartment is equipped with a TPU sealing layer to prevent electrolyte penetration and an annular flow-guiding sealing ring. The bottom of the micro-spectral chip compartment is equipped with a black PET substrate to suppress stray light, providing a dark field environment for spectral measurement. The bottom of the flexible temperature and humidity film compartment is equipped with a microporous PTFE breathable membrane, which not only ensures that water vapor on the stem surface can pass through efficiently, but also plays a role in dust prevention.

[0032] In this application, the bottom of the chamber is provided with radial microchannels that are 0.2 mm deep and 0.5 mm wide, which guide the liquid / gas to flow in a directional manner to an independent outlet.

[0033] In this invention, such as Figure 1 As shown, the electrochemical sensor 2 is located in the right compartment, the micro-spectral chip 3 in the left compartment, and the flexible temperature and humidity film 4 in the lower compartment, forming an equilateral triangle at their centers. The electrochemical sensor compartment is a circular structure with a diameter of 8 mm and an outer wall thickness of 1.5 mm. A shallow annular hydrophilic sealing ring surrounds the top, and radial flow channels with a depth of 0.2 mm are visible at the bottom. An anti-corrosion TPU sealing layer is installed at the bottom. The micro-spectral chip compartment is a circular structure with a diameter of 12 mm and an outer wall thickness of 1 mm. The top is a semi-transparent dome, and the bottom is a black PET substrate. The flexible temperature and humidity film compartment is a circular structure with a diameter of 10 mm and an outer wall thickness of 0.8 mm. Eight 0.5 mm diameter vent holes are evenly distributed on the sidewalls. A microporous PTFE breathable membrane is installed at the bottom, and a hydrophobic nano-SiO2 coating is applied to the top.

[0034] A method for monitoring plant life information involves wrapping the aforementioned multi-parameter plant life information integrated sensing device around the stem of a plant to simultaneously monitor the ion concentration of the plant's stem sap, the chlorophyll content of the leaves, and the intensity of transpiration.

[0035] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A multi-parameter plant life information integrated sensing device, characterized in that: The system includes a flexible sensing substrate with a composite dielectric layer, a gradient honeycomb isolation cavity disposed on the flexible sensing substrate with a composite dielectric layer, the gradient honeycomb isolation cavity having a gradient honeycomb structure based on a hexagonal topology, and a multi-parameter signal isolation and acquisition module disposed within the gradient honeycomb isolation cavity. The multi-parameter signal isolation and acquisition module includes an electrochemical sensor, a micro-spectral chip, and a flexible temperature and humidity film. The gradient honeycomb isolation cavity physically isolates the electrochemical sensor, the micro-spectral chip, and the flexible temperature and humidity film in separate compartments.

2. The multi-parameter plant life information integrated sensing device according to claim 1, characterized in that, The cell unit size of the gradient cellular isolation cavity satisfies the formula D(r) = 5 + 0.7r. 2 , where 0≤r≤6mm, r is the distance from the center of the electrochemical sensor compartment, and D is the diameter of the inscribed circle of the cell unit, in mm.

3. The multi-parameter plant life information integrated sensing device according to claim 1, characterized in that, The composite dielectric layer flexible sensing substrate includes a polyimide substrate and a composite dielectric layer connected by a hot-pressing-UV curing composite process. The average pore size of the composite dielectric layer is ≤100nm, the porosity is ≤3%, and the surface roughness is ≤0.65nm.

4. The multi-parameter plant life information integrated sensing device according to claim 1, characterized in that, The walls of the gradient honeycomb isolation cavity are a three-layer composite structure, consisting of a base layer, a functional layer, and a shielding layer from the inside out. The matrix layer is composed of TPU material mixed with 30wt% glass fiber reinforcement material, and has a thickness of 0.8 mm to 1.5 mm. The thickness of the functional layer is 50±5μm; The shielding layer is composed of a 120-mesh corrugated copper mesh, which is embedded on the outside of the substrate layer. The wave height of the corrugated structure is 0.1 mm and the wavelength is 0.5 mm.

5. The multi-parameter plant life information integrated sensing device according to claim 4, characterized in that, The functional layer is specifically configured as follows: The inner side of the electrochemical sensor compartment is a hydrophilic acrylate coating with a contact angle of <30°; the inner side of the micro-spectral chip compartment is an optical-grade PET film with a transmittance of ≥95%@400-800nm; and the inner side of the flexible temperature and humidity film compartment is a hydrophobic nano-SiO2 coating with a contact angle of >150°.

6. The multi-parameter plant life information integrated sensing device according to claim 4, characterized in that, The bottom of the electrochemical sensor compartment is provided with a TPU sealing layer to prevent electrolyte penetration and an annular flow-guiding sealing ring. The bottom of the micro-spectral chip compartment is provided with a black PET substrate to suppress stray light. The bottom of the flexible temperature and humidity film compartment is provided with a microporous PTFE breathable membrane.

7. The multi-parameter plant life information integrated sensing device according to claim 4, characterized in that, The center lines connecting the electrochemical sensor compartment, the micro-spectral chip compartment, and the flexible temperature and humidity film compartment form an equilateral triangle. The minimum distance between the centers of adjacent compartments is 11.7 mm to 14 mm, and a shielding layer is provided between adjacent compartments.

8. The multi-parameter plant life information integrated sensing device according to claim 7, characterized in that, The electromagnetic shielding frequency range of the shielding layer is DC-10GHz, with an attenuation greater than 62dB.

9. The multi-parameter plant life information integrated sensing device according to claim 1, characterized in that, The composite dielectric layer flexible sensing substrate can be spirally wound to fit plant stems with diameters of 5 mm to 50 mm, and its electrical performance attenuation is less than 5% when the bending radius is ≤30 mm.

10. A method for monitoring plant life information, characterized in that, Using the multi-parameter plant life information integrated sensing device as described in any one of claims 1-9, the ion concentration of plant stem sap, chlorophyll content of leaves, and transpiration intensity are monitored simultaneously; the composite dielectric layer flexible sensing substrate is fixed to the plant stem by a detachable snap-on or adhesive patch.

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