Probe station vacuum automatic detection system and detection method

Abstract

The invention discloses a probe station vacuum automatic detection system and detection method. The probe station vacuum automatic detection system comprises a mechanical platform unit, a sensing and identifying unit, a vacuum control unit and a central control unit. According to the probe station vacuum automatic detection system and detection method, the multi-mode sensor is regularly arranged in the vacuum pipeline of the vacuum chuck, the multi-mode sensor detects the vacuum pressure change value in the vacuum pipeline in real time, and therefore the size of a wafer is automatically obtained in a non-contact measurement mode. Meanwhile, the system transmits the judgment result to the vacuum control unit in a digital signal mode in real time, the vacuum control unit automatically activates a vacuum adsorption area and adsorption force parameters which are accurately matched with the vacuum control unit according to the size of the wafer, and it is ensured that the wafers of different sizes are stably and safely fixed to the vacuum suction cup. Therefore, the fragment or displacement risk caused by mismatching of the adsorption range can be avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor and integrated circuit testing technology, and specifically to a probe station vacuum automatic detection system and detection method. Background Technology

[0002] In the current semiconductor testing industry, the probe station, as a core device for wafer electrical testing, has a significant impact on testing efficiency and wafer safety due to the automation and accuracy of its operation process. The industry standard is as follows: operators place wafers of different sizes (e.g., 6-inch, 8-inch, or 12-inch) onto the probe station's Chuck (adsorption stage), then manually determine the wafer size based on experience, manually select the corresponding vacuum adsorption area, and finally manually operate the control panel to move the Chuck into the probe station for positioning and testing. This process is highly dependent on the operator's skill and subjective judgment, introducing the risk of human error and resulting in a slow operating pace and overall low efficiency.

[0003] The existing technology has the following defects and shortcomings: First, manual identification of wafer size is prone to misjudgment due to visual errors or fatigue. Especially in scenarios where multiple wafer sizes are mixed for testing, size misidentification may cause mismatch in vacuum adsorption range, resulting in unstable wafer adsorption, positional displacement, or even the risk of fragmentation, which seriously affects test yield and equipment safety.

[0004] Secondly, manually selecting the vacuum region and pushing the Chuck increases operational complexity and time costs, making it unsuitable for the high throughput and fast response requirements of modern semiconductor testing. This bottleneck is particularly evident in high-volume, multi-batch production line testing.

[0005] Furthermore, the existing system lacks intelligent integration and adaptive capabilities. Vacuum control and position pushing are mostly independent operations, failing to achieve process continuity and coordination, which limits the improvement of the overall automation level of the equipment.

[0006] In addition, although some high-end devices have attempted to introduce visual assistance or basic sensing functions, they have not yet achieved full closed-loop automation from recognition to execution, and their level of intelligence is limited. They also lack compatibility with various wafer sizes and irregular samples.

[0007] Therefore, the industry urgently needs a highly integrated and reliable solution that can automatically identify wafer size, intelligently adjust the vacuum adsorption range, and autonomously complete Chuck positioning in order to improve testing accuracy, operational efficiency, and automation level, and adapt to the higher requirements of future semiconductor manufacturing for testing flexibility and intelligence. Summary of the Invention

[0008] The technical problem solved by the present invention is to provide a probe station vacuum automatic detection system and detection method for automatically detecting wafer size.

[0009] The technical solution adopted by this invention to solve its technical problem is: An automatic vacuum detection system for a probe station includes a mechanical platform unit, a sensing and identification unit, a vacuum control unit, and a central control unit; The mechanical platform unit includes a Chuck platform, which in turn includes a vacuum chuck, a temperature control plate regularly arranged at the lower end of the vacuum chuck, and a metal protective ring regularly arranged around the vacuum chuck. The vacuum chuck has several vacuum channels regularly arranged inside, and several vacuum adsorption holes regularly arranged in the several vacuum channels. The several vacuum adsorption holes penetrate the upper surface of the vacuum chuck, forming a vacuum adsorption area on the upper surface of the vacuum chuck for adsorbing wafers. The sensing and recognition unit includes several signal detection terminals and a signal acquisition unit. The several signal detection terminals are disposed in several vacuum lines of the vacuum suction cup for collecting vacuum pressure signals in the vacuum lines. The several signal detection terminals are electrically connected to the signal acquisition unit via cables to transmit the collected vacuum pressure signals to the signal acquisition unit, which then processes and displays the signals. The vacuum control unit includes several vacuum generators, several solenoid valves, and a compressed air source. The outlet of the compressed air source is connected to the inlet of the vacuum generator via an air pipe. The vacuum outlet of the vacuum generator is connected to the vacuum pipeline in the vacuum chuck via an air pipe. The vacuum chuck is evacuated by the compressed air source and the vacuum generator, so that the wafer is adsorbed and fixed on the upper surface of the vacuum chuck through several vacuum adsorption holes. The solenoid valves are regularly arranged between the compressed air source and the vacuum generator, serving as vacuum switches for the vacuum pipeline, and are used to control the on / off state of the compressed air source and the vacuum generator, thereby controlling the on / off state of the vacuum pipeline in the vacuum chuck. The central control unit includes a computer, control software installed in the computer, and a display, keyboard, and mouse for human-computer interaction. As the brain of the probe station vacuum automatic detection system, the central control unit receives data from the sensing and recognition units and runs a built-in intelligent recognition algorithm to instantly complete the automatic detection and decision-making regarding wafer dimensions. The central control unit controls the solenoid valve group in the vacuum control unit to precisely open or close channels leading to specific vacuum lines in the vacuum chuck, enabling on-demand adsorption by the vacuum chuck. The intelligent recognition algorithm is as follows: ; Where i is a natural number representing the size of different wafers; Xi is the pressure value when the vacuum switch is closed when the vacuum tube is i; Yi is the pressure value when the vacuum switch is open when the vacuum tube is i; |Xi-Yi| is the comparison value of the i-th iteration; This is a preset threshold.

[0010] Furthermore, the lower surface of the vacuum suction cup is regularly grooved to form several concentric vacuum loops. Each vacuum loop has a regularly arranged vacuum adsorption hole penetrating the vacuum suction cup. The several vacuum adsorption holes on the upper surface of the vacuum suction cup form a vacuum adsorption area with the same shape and path as the vacuum loop. The side of the vacuum suction cup is perforated inward within a certain angle range to form several vacuum channels. The several vacuum channels are regularly perforated and connected to the several vacuum loops to form several interconnected vacuum pipelines.

[0011] Furthermore, the lower surface of the vacuum suction cup is sealed to the plurality of vacuum loops by a sealing plate and a sealing ring.

[0012] Furthermore, on the outer side of the plurality of vacuum channels, a vacuum connector for connecting an air pipe is fixedly provided. The vacuum connector has regular through holes at the positions of the plurality of vacuum channels to form a plurality of vacuum interfaces. One end of the air pipe is connected to the vacuum interface through the air pipe connector, and the other end is connected to the vacuum generating port of the vacuum generator through the air pipe connector. The vacuum generating port of the vacuum generator is connected to the vacuum interface on the vacuum connector through the air pipe, and is connected to the vacuum channel in the vacuum suction cup through the vacuum interface on the vacuum connector.

[0013] Furthermore, the vacuum loops are regularly arranged from the inside to the outside of the mainstream wafer size, including 0-inch vacuum loops, 2-inch vacuum loops, 4-inch vacuum loops, 6-inch vacuum loops, 8-inch vacuum loops, and 12-inch vacuum loops; the vacuum channels are also regularly arranged, including 0-inch vacuum channels, 2-inch vacuum channels, 4-inch vacuum channels, 6-inch vacuum channels, 8-inch vacuum channels, and 12-inch vacuum channels; The 0-inch vacuum channel extends into the 0-inch vacuum loop and is interconnected by perforations to form a 0-inch vacuum pipeline; the 2-inch vacuum channel extends into the 2-inch vacuum loop and is interconnected by perforations to form a 2-inch vacuum pipeline; the 4-inch vacuum channel is connected to the 4-inch vacuum loop to form a 4-inch vacuum pipeline; the 6-inch vacuum channel is connected to the 6-inch vacuum loop to form a 6-inch vacuum pipeline; the 8-inch vacuum channel is connected to the 8-inch vacuum loop to form an 8-inch vacuum pipeline; and the 12-inch vacuum channel is connected to the 12-inch vacuum loop to form a 12-inch vacuum pipeline.

[0014] Furthermore, the plurality of vacuum loops are regularly arranged on wafers of mainstream size, and their outer diameter is smaller than that of wafers of mainstream size, so that wafers of corresponding sizes can be adsorbed and fixed on the upper surface of the vacuum chuck through a plurality of vacuum adsorption holes.

[0015] Preferably, the signal detection terminal includes a miniature pressure sensor, which collects the vacuum pressure change signals in the plurality of vacuum pipelines in real time.

[0016] Furthermore, the signal acquisition unit includes a voltage conversion unit, a signal amplification unit, a signal filtering unit, an AD conversion unit, a communication unit, and a display unit. The voltage conversion unit is used to convert the input voltage, transforming it into the operating voltage required by the signal detection terminal and other units in the signal acquisition unit. The signal amplification unit, the signal filtering unit, and the AD conversion unit are respectively used to amplify, filter, and convert the vacuum pressure analog signal acquired by the signal detection terminal into a digital vacuum pressure signal. The communication unit transmits the processed digital vacuum pressure signal to the central control unit for signal analysis and display. The display unit is used for real-time status display of the signal acquisition unit.

[0017] Preferably, the vacuum adsorption hole adopts a stepped or conical design, with a small upper port diameter and a large lower port diameter, thereby forming a small inner diameter adsorption micropore at the upper end of the vacuum suction cup.

[0018] The beneficial effects of this invention are: 1. The present invention discloses a probe station vacuum automatic detection system and method. By regularly arranged multimodal sensors in the vacuum pipeline of a vacuum chuck, the multimodal sensors detect real-time changes in vacuum pressure within the vacuum pipeline, thereby automatically acquiring the wafer size through a non-contact measurement method. Simultaneously, the system transmits this determination result in real-time as a digital signal to the vacuum control unit. Based on the wafer size, the vacuum control unit automatically activates a precisely matched vacuum adsorption area and adsorption force parameters, ensuring that wafers of different sizes are stably and safely fixed on the vacuum chuck. This avoids the risk of fragmentation or displacement due to mismatched adsorption ranges.

[0019] 2. The present invention provides a probe station vacuum automatic detection system and method. After automatically acquiring the wafer dimensions, the central control unit drives a high-precision sliding stage mechanism to smoothly and automatically transport the Chuck platform to the predetermined testing position inside the probe station. The entire process, including wafer dimension identification, vacuum adsorption, and platform transport, is seamlessly integrated, requiring no manual intervention, significantly improving operational accuracy, safety, and production efficiency. Attached Figure Description

[0020] Figure 1 This is a system module diagram of the present invention; Figure 2 This is a structural diagram of the mechanical platform unit and the sensing and identification unit in this invention; Figure 3 for Figure 2 Installation diagram of the signal detection terminal; Figure 4 This is a schematic diagram of the automatic detection system of the present invention. Figure 5 This is a flowchart of the automatic detection system of the present invention; The diagram is marked as follows: 1. Vacuum suction cup, 2. Vacuum connector, 3. Signal detection terminal, 4. Signal acquisition unit, 5. Vacuum generator, 6. Solenoid valve, 7. Compressed air source, 8. Central control unit, 9. Wafer; 101. Vacuum tubing; 102. Vacuum adsorption port; 201. Vacuum interface. 11. Vacuum loop; 12. Vacuum channel; 111.0-inch vacuum loop, 121.0-inch vacuum channel; 112.2-inch vacuum loop; 122.2-inch vacuum channel; 113-inch and 4-inch vacuum loops; 123-inch and 4-inch vacuum channels; 114.6-inch vacuum loop, 124.6-inch vacuum channel; 115-inch and 8-inch vacuum loops; 125-inch and 8-inch vacuum channels; 116-inch and 12-inch vacuum loops, 126-inch and 12-inch vacuum channels. Detailed Implementation

[0021] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] like Figure 1-4 As shown, the present invention provides a probe station vacuum automatic detection system, including a mechanical platform unit, a sensing and identification unit, a vacuum control unit and a central control unit.

[0023] The mechanical platform unit includes a Chuck platform, which in turn includes a vacuum chuck 1, a temperature control plate regularly positioned at the lower end of the vacuum chuck 1, and a metal protective ring regularly positioned around the vacuum chuck 1. The vacuum chuck 1 has several vacuum channels 101 regularly arranged inside, and several vacuum adsorption holes 102 regularly arranged within these channels. These holes penetrate the upper surface of the vacuum chuck, forming a vacuum adsorption area on the upper surface for adsorbing wafers. An isolation plate is regularly arranged between the lower end of the vacuum chuck 1 and the temperature control plate. The temperature control plate simulates different temperature environments for the vacuum chuck 1 through electrical or fluid control. The metal protective ring surrounds the vacuum chuck 1 and is grounded along with the isolation plate to shield against external interference signals, reducing or preventing external interference signals from affecting the wafer testing results.

[0024] The sensing and identification unit includes several signal detection terminals 3 and a signal acquisition unit 4. The signal detection terminals 3 are installed in several vacuum lines of the vacuum suction cup 1 for collecting vacuum pressure signals in the vacuum lines. The signal detection terminals 3 are electrically connected to the signal acquisition unit 4 via cables, transmitting the collected vacuum pressure signals to the signal acquisition unit 4 for signal processing and display.

[0025] The vacuum control unit includes several vacuum generators 5, several solenoid valves 6, and a compressed air source 7. The outlet of the compressed air source 7 is connected to the inlet of the vacuum generator 5 via an air pipe, and the suction port (vacuum generation port) of the vacuum generator 5 is connected to the vacuum pipeline in the vacuum chuck 1 via an air pipe. Thus, the vacuum chuck 1 is evacuated by the compressed air source 7 and the vacuum generator 5, and the wafer is adsorbed and fixed onto the upper surface of the vacuum chuck through several vacuum adsorption holes. The solenoid valves 6 are regularly arranged between the compressed air source 7 and the vacuum generator 5, acting as vacuum switches to control the on / off state of the compressed air source and the vacuum generator, thereby controlling the on / off state of the vacuum pipeline in the vacuum chuck.

[0026] Furthermore, a number of vacuum generators 5 and solenoid valves 6 are arranged in equal numbers to the number of vacuum lines in the vacuum suction cup 1, and are connected to each other through air pipes, thereby realizing individual control of the on / off state of the vacuum lines. Several vacuum generators are integrated together to form a vacuum generating module; several solenoid valves are integrated together to form a solenoid valve group. Alternatively, several vacuum generators and several solenoid valves can be integrated together.

[0027] The central control unit 8 includes a computer, control software installed in the computer, and a display, keyboard, and mouse for human-computer interaction. As the brain of the probe station's automatic vacuum detection system, the central control unit receives data from the sensing and recognition units, runs the built-in intelligent recognition algorithm, and instantly completes automatic detection and decision-making regarding wafer size. It also controls the solenoid valve assembly in the vacuum control unit to precisely open or close channels leading to specific vacuum lines in the vacuum chuck, enabling on-demand suction of the vacuum chuck.

[0028] Furthermore, touchscreen displays are preferred for the monitors to facilitate operator interaction with the system. Simultaneously, automatically detected statuses (e.g., vacuum adsorption, wafer transport), identification results (e.g., identified: 12-inch wafer), and other error alarms are displayed in real time.

[0029] like Figure 2 As shown, the lower surface of the vacuum suction cup 1 has regularly spaced grooves, forming several concentric vacuum loops 11. Each vacuum loop 11 has several vacuum adsorption holes 102 that penetrate the vacuum suction cup 1. These vacuum adsorption holes 102 form a vacuum adsorption area on the upper surface of the vacuum suction cup 1, with the same shape and path as the vacuum loops 11. The sides of the vacuum suction cup 1 have inwardly perforated holes within a certain angle range, forming several vacuum channels 12. These vacuum channels 12 are regularly perforated and connected to the vacuum loops 11, forming several mutually cooperating vacuum pipelines 101.

[0030] Furthermore, the lower surface of the vacuum suction cup 1 is sealed to several vacuum loops 11 by a sealing plate and a sealing ring.

[0031] Furthermore, on the outer side of several vacuum channels 12, vacuum connectors 2 for connecting air pipes are fixedly installed. The vacuum connectors 2 have regularly perforated holes at the locations of the several vacuum channels 12, forming several vacuum interfaces 201. One end of the air pipe is connected to the vacuum interface 201 via the air pipe connector, and the other end is connected to the vacuum generating port (suction port) of the vacuum generator 5 via the air pipe connector. The vacuum generating port of the vacuum generator 5 is connected to the vacuum interface 201 on the vacuum connector 2 via the air pipe, and is also connected to the vacuum channel 12 in the vacuum suction cup 1 via the vacuum interface 201 on the vacuum connector 2.

[0032] Furthermore, such as Figure 2As shown, several vacuum loops 11 are regularly arranged from the inside to the outside of the mainstream wafer size, including 0-inch vacuum loop 111, 2-inch vacuum loop 112, 4-inch vacuum loop 113, 6-inch vacuum loop 114, 8-inch vacuum loop 115, and 12-inch vacuum loop 116. Several vacuum channels 12 are also regularly arranged, including 0-inch vacuum channel 121, 2-inch vacuum channel 122, 4-inch vacuum channel 123, 6-inch vacuum channel 124, 8-inch vacuum channel 125, and 12-inch vacuum channel 126.

[0033] Among them, the 0-inch vacuum channel 121 extends into the 0-inch vacuum loop 111 and is interconnected by perforation to form a 0-inch vacuum pipeline; the 2-inch vacuum channel 122 extends into the 2-inch vacuum loop 112 and is interconnected by perforation to form a 2-inch vacuum pipeline... and so on, the 4-inch vacuum channel 123 is connected to the 4-inch vacuum loop 113 to form a 4-inch vacuum pipeline; the 6-inch vacuum channel is connected to the 6-inch vacuum loop to form a 6-inch vacuum pipeline; the 8-inch vacuum channel is connected to the 8-inch vacuum loop to form an 8-inch vacuum pipeline; and the 12-inch vacuum channel is connected to the 12-inch vacuum loop to form a 12-inch vacuum pipeline.

[0034] Furthermore, the 2-inch vacuum loop 112, 4-inch vacuum loop 113, 6-inch vacuum loop 114, 8-inch vacuum loop 115, and 12-inch vacuum loop 116 correspond to the mainstream 2-inch, 4-inch, 6-inch, 8-inch, and 12-inch wafers, respectively. Their outer diameters are set smaller than the outer diameter of the wafer, so that the wafers of the corresponding sizes can be adsorbed and fixed on the upper surface of the vacuum chuck 1 through a number of vacuum adsorption holes.

[0035] Furthermore, such as Figure 2 As shown, several signal detection terminals 3 are regularly arranged in several vacuum channels 12 or several vacuum interfaces 201 of vacuum connectors 2, for collecting vacuum pressure signals from each vacuum pipeline.

[0036] Furthermore, the signal detection terminal 3 includes a miniature pressure sensor, which collects vacuum pressure change signals in several vacuum channels 12 in real time.

[0037] Furthermore, several signal detection terminals 3 are connected to the signal acquisition unit 4 via cables. The signal acquisition unit 4 processes and displays the vacuum pressure signals acquired by the signal detection terminals 3.

[0038] Furthermore, the signal acquisition unit 4 includes a voltage conversion unit, a signal amplification unit, a signal filtering unit, an AD conversion unit, a communication unit, and a display unit. The voltage conversion unit converts the input voltage to the required operating voltage for the signal detection terminal 3 and other units in the signal acquisition unit 4. The signal amplification unit, signal filtering unit, and AD conversion unit amplify, filter, and convert the vacuum pressure analog signal acquired by the signal detection terminal 3 into a digital vacuum pressure signal, respectively. The communication unit transmits the processed digital vacuum pressure signal to the central control unit 8 for signal analysis and display. The display unit is used for real-time status display of the signal acquisition unit 4.

[0039] Furthermore, the vacuum adsorption hole 102 adopts a stepped or conical design, with a small upper port diameter and a large lower port diameter, thereby forming a small inner diameter adsorption micropore at the upper end of the vacuum suction cup 1.

[0040] like Figure 5 The diagram shows the workflow of the automatic detection system of the present invention: 1. Click the start button, and the Chuck platform will move to the wafer loading position via the multi-axis motorized slide at its lower end. Alternatively, the wafer handling robot can directly send a start signal to the probe station system. Upon receiving the signal from the wafer handling robot, the probe station system will drive the Chuck platform to move to the wafer loading position.

[0041] 2. Subsequently, the operator or robotic arm transfers the wafer to the vacuum chuck 1.

[0042] 3. The central control unit performs a loading operation, sequentially turning on the flow controller and solenoid valve. The signal detection terminal 3 collects signals from the sensor, and the signal acquisition unit 4 processes the signals collected by the signal detection terminal.

[0043] 4. Subsequently, the signal acquisition unit 4 transmits the processed vacuum pressure data to the central control unit for signal analysis.

[0044] 5. The central control unit calculates the wafer size: when the confidence level meets the standard, the wafer size is calculated and displayed in real time on the screen; when the confidence level does not meet the standard, the next set of flow controllers and solenoid valves is activated, and the above process is repeated. Thus, through the built-in intelligent recognition algorithm, the wafer size can be calculated instantly.

[0045] Based on the above-mentioned automatic probe station detection system, this invention also provides an automatic probe station detection algorithm: ; Where i is a natural number, representing the size of different wafers.

[0046] Xi is the pressure value when the vacuum switch (solenoid valve) is closed when the switch size (vacuum line) is i; Yi is the pressure value when the vacuum switch (solenoid valve) is open when the switch size (vacuum line) is i; |Xi-Yi| is the comparison value of the i-th iteration; This is a preset threshold.

[0047] Furthermore, in one embodiment, When i=0, it represents the central bare die, and the corresponding vacuum switch is solenoid valve No. 0; When i=1, it means a 2-inch vacuum tube / 2-inch vacuum loop, and the corresponding vacuum switch is solenoid valve No. 1. When i=2, it means a 4-inch vacuum tube / 4-inch vacuum loop, and the corresponding vacuum switch is solenoid valve No. 2. When i=3, it indicates a 6-inch vacuum tube / 6-inch vacuum loop, and the corresponding vacuum switch is solenoid valve No. 3. When i=4, it indicates an 8-inch vacuum tube / 8-inch vacuum loop, and the corresponding vacuum switch is solenoid valve No. 4. When i=5, it indicates a 12-inch vacuum tube / 12-inch vacuum loop, and the corresponding vacuum switch is solenoid valve No. 5.

[0048] like Figure 4 As shown, after a wafer of unknown size is mounted onto vacuum chuck 1, the system sequentially opens solenoid valves 0-5. When solenoid valve 0 is opened, the center of the die is covered by the wafer, the Y0 value increases, and |X0-Y0|> This indicates that the wafer size is greater than 0 inches. Subsequently, solenoid valve 1 is opened, and the 2-inch vacuum loop remains covered by the wafer. The Y1 value increases, |X1-Y1| > This indicates that the wafer size is greater than 2 inches. Therefore, by analogy, when solenoid valve #3 is opened, the 6-inch vacuum loop is covered by the wafer, the Y3 value increases, and |X3-Y3| > This indicates that the wafer size is greater than 6 inches. However, when solenoid valve #4 is opened, the 8-inch vacuum loop is opened, but the wafer does not cover the 8-inch vacuum loop. At this time, the value of Y4 remains unchanged, and |X4-Y4| < This indicates that the wafer size is less than 8 inches. Therefore, it can be determined that the wafer detected on the vacuum chuck is a 6-inch wafer.

[0049] Furthermore, once the wafer size is detected on the vacuum chuck 1, the vacuum switch (solenoid valve) corresponding to the wafer size remains open, while the vacuum switch (solenoid valve) corresponding to the wafer size is closed.

[0050] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A probe station vacuum automatic detection system, characterized in that: The mechanical platform unit, the sensing and identifying unit, the vacuum control unit and the central control unit are included. The mechanical platform unit includes a Chuck platform, which includes a vacuum chuck, a temperature control disc regularly arranged at the lower end of the vacuum chuck, and a metal protection ring regularly arranged at the periphery of the vacuum chuck. The sensing and identifying unit includes a plurality of signal detection terminals and a signal collector. The vacuum control unit includes a plurality of vacuum generators, a plurality of electromagnetic valves and a compressed air source. The central control unit includes a computer, control software installed in the computer, a display, a keyboard and a mouse for human-computer interaction. The intelligent identification algorithm is as follows: ; Wherein, i is a natural number, which represents the size of different wafers; Xi is the pressure value when the vacuum switch corresponding to the vacuum pipeline i is closed; Yi is the pressure value when the vacuum switch corresponding to the vacuum pipeline i is opened; |Xi-Yi| is the comparison value of the ith iteration; is a preset threshold value.

2. The probe station vacuum auto-detection system of claim 1, wherein: The lower surface of the vacuum chuck is regularly grooved and arranged with a plurality of concentric vacuum loops.

3. The probe station vacuum auto-detection system of claim 2, wherein: The lower surface of the vacuum chuck is sealed by a sealing plate and a sealing ring.

4. The probe station vacuum auto-detection system of claim 2, wherein: The outer side of the several vacuum channels is fixedly provided with a vacuum connector for connecting an air pipe, the vacuum connector is regularly perforated at the positions of the several vacuum channels to form several vacuum interfaces; one end of the air pipe is connected in the vacuum interface through an air pipe connector, and the other end is connected in a vacuum generating port of the vacuum generator through an air pipe connector, the vacuum generating port of the vacuum generator is communicated with the vacuum interfaces on the vacuum connector through the air pipe, and the vacuum interfaces on the vacuum connector are communicated with the vacuum channels in the vacuum chuck.

5. The probe station vacuum automated inspection system of claim 2, wherein: The several vacuum loops are regularly arranged from inside to outside according to the size of the main flow wafer, including a 0-inch vacuum loop, a 2-inch vacuum loop, a 4-inch vacuum loop, a 6-inch vacuum loop, an 8-inch vacuum loop and a 12-inch vacuum loop; the several vacuum channels are also regularly arranged, including a 0-inch vacuum channel, a 2-inch vacuum channel, a 4-inch vacuum channel, a 6-inch vacuum channel, an 8-inch vacuum channel and a 12-inch vacuum channel; The 0-inch vacuum channel penetrates into the 0-inch vacuum loop and is perforated to communicate with each other to form a 0-inch vacuum pipeline; The 2-inch vacuum channel penetrates into the 2-inch vacuum loop and is perforated to communicate with each other to form a 2-inch vacuum pipeline; the 4-inch vacuum channel is communicated with the 4-inch vacuum loop to form a 4-inch vacuum pipeline; The 6-inch vacuum channel is communicated with the 6-inch vacuum loop to form a 6-inch vacuum pipeline; the 8-inch vacuum channel is communicated with the 8-inch vacuum loop to form an 8-inch vacuum pipeline; and the 12-inch vacuum channel is communicated with the 12-inch vacuum loop to form a 12-inch vacuum pipeline.

6. The probe station vacuum automated inspection system of claim 2, wherein: The several vacuum loops are regularly arranged according to the size of the wafer in the main flow, and the outer diameter is smaller than the outer diameter of the wafer in the main flow, so that the wafer of the corresponding size is adsorbed and fixed on the upper surface of the vacuum chuck through the several vacuum adsorption holes therein.

7. The probe station vacuum automated inspection system of claim 1, wherein: The signal detection terminal includes a micro pressure sensor, which collects the vacuum pressure change signal in the several vacuum pipelines in real time.

8. The probe station vacuum automated inspection system of claim 1, wherein: The signal collector includes a voltage conversion unit, a signal amplification unit, a signal filtering unit, an AD conversion unit, a communication unit and a display unit; the voltage conversion unit is used for converting the input voltage into the required working voltage of other units in the signal detection terminal and the signal collector; the signal amplification unit, the signal filtering unit and the AD conversion unit are respectively used for amplifying, filtering and AD converting the vacuum pressure analog signal collected by the signal detection terminal to form a vacuum pressure digital signal; the communication unit transmits the processed vacuum pressure digital signal to the central control unit for signal analysis and display; and the display unit is used for real-time state display of the signal collector.

9. The probe station vacuum automated inspection system of claim 1, wherein: The vacuum adsorption hole adopts a stepped or conical design, which is a vacuum adsorption hole with a small upper port diameter and a large lower port diameter, so as to form an adsorption micropore with a small inner diameter at the upper end of the vacuum chuck.

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