Adhesion detection method, intelligent power distribution module and electric equipment

Abstract

The invention discloses an adhesion detection method, an intelligent power distribution module and electric equipment, the adhesion detection method is used for detecting a power distribution switch in the intelligent power distribution module, and the adhesion detection method comprises the following steps: when a power supply system connected with the intelligent power distribution module and the intelligent power distribution module meet an adhesion detection condition of a target power distribution switch, the target power distribution switch is detected; determining the adhesion state of the target power distribution switch based on the change condition of the voltage value of the target voltage acquisition point of the target power distribution switch or the relative voltage difference; wherein the relative voltage difference is the voltage difference between the voltage value of the target voltage sampling point and the voltage value of the power supply side of the power supply system. According to the method, the adhesion state of the power distribution switch can be accurately detected, the method does not need to depend on a test current injection function or other special diagnosis hardware of an Efuse chip in the intelligent power distribution module, the detection logic is simple and reliable, and the cost is low.

Description

Technical Field

[0001] This invention relates to the field of vehicle technology, and in particular to an adhesion detection method, an intelligent power distribution module, and electrical equipment. Background Technology

[0002] With the continuous development and application of drive-by-wire chassis and advanced intelligent driving, the power distribution safety of these functions is receiving increasing attention. As electrification technologies advance, traditional fuse-based power distribution schemes are gradually being replaced by intelligent electronic fuse-based power distribution schemes. Overcurrent protection mechanisms using electronic fuse-based power distribution require periodic self-checks to confirm the normal operation of the intelligent power distribution module's isolation protection function (such as disconnecting switches to isolate electrical faults and protect the power grid under overcurrent, overvoltage, and undervoltage fault conditions).

[0003] In existing technologies, the detection of switch adhesion in smart power distribution modules mainly relies on Efuse chips or other dedicated diagnostic hardware. For example, the switch status is determined by injecting a transient current into the switch and measuring the Vds voltage difference (i.e., the voltage difference between the drain and source of the switching transistor). However, this method has the following problems: strong chip function dependence, complex control logic, high cost, and susceptibility to load characteristics and system interference, making it difficult to achieve simple, reliable, and low-cost adhesion detection. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of this invention is to propose an adhesion detection method that can accurately detect the adhesion state of power distribution switches without relying on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low-cost.

[0005] The second objective of this invention is to provide an intelligent power distribution module.

[0006] The third objective of this invention is to provide an electrical device.

[0007] To achieve the above objectives, a adhesion detection method according to a first aspect of the present invention is used to detect a power distribution switch in an intelligent power distribution module. The adhesion detection method includes: when the power supply system connected to the intelligent power distribution module and the intelligent power distribution module meet the adhesion detection conditions of the target power distribution switch, determining the adhesion state of the target power distribution switch based on the change in voltage value of the target voltage sampling point or the relative voltage difference; wherein, the relative voltage difference is the voltage difference between the voltage value of the target voltage sampling point and the voltage value on the power supply side of the power supply system.

[0008] According to the adhesion detection method of this invention, when the power supply system and power distribution module connected to the intelligent power distribution module meet the adhesion detection conditions of the target power distribution switch, the adhesion state of the target power distribution switch is determined by acquiring the voltage change of the target voltage sampling point of the target power distribution switch, or by calculating the relative voltage difference between the voltage value of the target voltage sampling point and the voltage value of the power supply side of the power supply system. Specifically, when the target power distribution switch is normally disconnected, the voltage value of the target voltage sampling point will change significantly or the relative voltage difference will be large as the switch is disconnected; while when the target power distribution switch is stuck, the voltage value of the target voltage sampling point will change very little or the relative voltage difference will be small as the switch is disconnected. Therefore, by analyzing the voltage change or relative voltage difference, this method can identify the adhesion state of the target power distribution switch, thereby achieving accurate detection of the adhesion state of the target power distribution switch. It does not rely on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware, and the detection logic is simple, reliable, and low-cost.

[0009] In some embodiments, the target power distribution switch includes a first type of power distribution switch, which is adapted to be connected between the power supply side of the power supply system and a non-electrical load; the voltage change includes the rate of change of the voltage value on the load side of the first type of power distribution switch over time.

[0010] In some embodiments, determining the sticking state of the target distribution switch based on the change in voltage value at the target voltage acquisition point of the target distribution switch includes: determining that the disconnection protection mechanism of the first type of distribution switch is normal when the rate of change is greater than or equal to a rate of change threshold; and / or determining that the first type of distribution switch has a disconnection and sticking fault when the rate of change is less than a rate of change threshold.

[0011] In some embodiments, for the first type of power distribution switch, the adhesion detection conditions include the power supply system entering OFF power mode and the first type of power distribution switch being in an open state.

[0012] In some embodiments, the target power distribution switch includes a second type of power distribution switch, the first end of which is adapted to be connected between the power supply side of the power supply system and a constant-voltage load, and the load side of the second type of power distribution switch is also adapted to be connected to the power supply side via a bypass module; the voltage value change includes a first voltage deviation, which is the voltage deviation between a first voltage value and a second voltage value of the second type of power distribution switch; the first voltage value is the voltage value of the load side of the second type of power distribution switch under a first adhesion detection condition, and the second voltage value is the voltage value of the load side of the second type of power distribution switch under a second adhesion detection condition; wherein, the first adhesion detection condition includes the bypass module being in a conducting state, and the second adhesion detection condition includes the bypass module being in a disconnected state.

[0013] In some embodiments, determining the sticking state of the target power distribution switch based on the change in voltage value at the target voltage acquisition point of the target power distribution switch includes: determining that the disconnection protection mechanism of the second type of power distribution switch is normal when the first voltage deviation is greater than the first voltage deviation threshold; and / or determining that the second type of power distribution switch has a disconnection sticking fault when the first voltage deviation is less than or equal to the first voltage deviation threshold.

[0014] In some embodiments, the first adhesion detection conditions further include the power supply system entering OFF power mode, the second type of power distribution switch being in an open state, and the isolating switch of the intelligent power distribution module being in an open state; and / or, the second adhesion detection conditions further include the power supply system entering OFF power mode, the second type of power distribution switch being in a closed state, and the isolating switch of the intelligent power distribution module being in a closed state.

[0015] In some embodiments, the power supply side includes a first power supply side and a second power supply side, and the load of the second type of power distribution switch is adapted to be connected to the second power supply side through the bypass module; the adhesion detection method further includes: under the second adhesion detection conditions, determining the fault state of the sampling circuit corresponding to the second type of power distribution switch based on a second voltage deviation; wherein, the second voltage deviation is the voltage deviation between the voltage value of the load side of the second type of power distribution switch and the voltage value of the first power supply side; the voltage value of the first power supply side is the upper limit of the allowable voltage range output by the first power supply side.

[0016] In some embodiments, determining the fault status of the sampling circuit corresponding to the second type of power distribution switch based on the second voltage deviation includes: determining that the sampling circuit is normal when the second voltage deviation is less than the second voltage deviation threshold; or determining that the sampling circuit has a fault when the second voltage deviation is greater than or equal to the second voltage deviation threshold.

[0017] In some embodiments, the target power distribution switch includes a third type of power distribution switch, which is adapted to be disposed between multiple power distribution networks and is also connected between a first power supply side and a second power supply side of the power supply system. The third type of power distribution switch includes two transistor units disposed back-to-back. The voltage value of the target voltage acquisition point of the target power distribution switch is the voltage value between the two transistor units, and the voltage value between the two transistor units is used as an intermediate voltage value. The relative voltage difference includes a first relative voltage difference between the voltage value of the first power supply side and the intermediate voltage value, and / or, the relative voltage difference includes a second relative voltage difference between the intermediate voltage value and the voltage value of the second power supply side.

[0018] In some embodiments, determining the sticking state of the target power distribution switch based on the relative voltage difference of the voltage values ​​at the target voltage acquisition point of the target power distribution switch includes: under a third sticking detection condition, determining the sticking state of a first transistor based on the first relative voltage difference, wherein the first transistor is the transistor connected to the first power supply side among the two transistors; and / or, when the first transistor has a disconnection and sticking fault, under the third sticking detection condition, determining the sticking state of a second transistor based on the second relative voltage difference, wherein the second transistor is the transistor connected to the second power supply side among the two transistors; and / or, when the first transistor does not have a disconnection and sticking fault, under a fourth sticking detection condition, determining the sticking state of a second transistor based on the second relative voltage difference, wherein the second transistor is the transistor connected to the second power supply side among the two transistors.

[0019] In some embodiments, determining the sticking state of the first transistor based on the first relative voltage difference includes: when the first relative voltage difference is less than or equal to a third voltage deviation threshold, the first transistor has a disconnection and sticking fault; or, when the first relative voltage difference is greater than the third voltage deviation threshold, the disconnection protection mechanism of the first transistor is normal. And / or, determining the sticking state of the second transistor based on the second relative voltage difference includes: when the second relative voltage difference is less than or equal to a fourth voltage deviation threshold, the second transistor has a disconnection and sticking fault; or, when the second relative voltage difference is the voltage drop across the body diode of the second transistor, the disconnection protection mechanism of the second transistor is normal.

[0020] In some embodiments, the third adhesion detection condition includes the power supply system entering an OFF power mode and both transistors being in an off state; or, the third adhesion detection condition includes the power supply system entering an OFF power mode and both transistors being in an off state, and the voltage difference between the first power supply side and the second power supply side being greater than a fifth voltage deviation threshold; and / or, the fourth adhesion detection condition includes the power supply system entering an OFF power mode and the first transistor being in a closed state and the second transistor being in an off state; or, the fourth adhesion detection condition includes the power supply system entering an OFF power mode and the first transistor being in a closed state and the second transistor being in an off state, and the voltage difference between the first power supply side and the second power supply side being greater than a fifth voltage deviation threshold.

[0021] To achieve the above objectives, a smart power distribution module according to a second aspect of the present invention includes: a plurality of power distribution switch assemblies, the plurality of power distribution switch assemblies being adapted to be distributed in a plurality of power distribution networks, each power distribution switch assembly including at least one first type power distribution switch and / or at least one second type power distribution switch, the first type power distribution switch being adapted to be connected between the power supply side of the power supply system and a non-electrical load, and the first end of the second type power distribution switch being adapted to be connected between the power supply side of the power supply system and a constant-electrical load, wherein the power supply side of the power supply system includes a first power supply side and a second power supply side; a bypass module, the first end of the bypass module being connected to the load side of each second type power distribution switch, and the second end of the bypass module being connected to the second power supply side; and a third type power distribution switch, the third type power distribution switch being adapted to be disposed among the plurality of power distribution networks and also connected between the first power supply side and the second power supply side, the third type power distribution switch including at least one transistor group, each transistor group including two transistor units disposed back-to-back.

[0022] According to the intelligent power distribution module of the present invention, since the module is provided with multiple power distribution switch components distributed in different power distribution networks, and each power distribution switch component is respectively configured with a first type of power distribution switch suitable for supporting non-electrical loads, a second type of power distribution switch suitable for supporting constant power loads, and a third type of power distribution switch that can be connected between multiple power distribution networks and between the first power supply side and the second power supply side, and a bypass module corresponding to the second type of power distribution switch is provided, so that different types of power distribution branches can meet the requirements of working state switching and load power supply, and can directly obtain clear voltage value changes or relative voltage differences based on the target voltage acquisition points corresponding to various types of power distribution switches when the adhesion detection conditions are met, thereby supporting the adhesion detection method described in the above embodiment. Specifically: The first type of switch is located between the power supply side and the non-electrical load. When it is disconnected, the load voltage can be rapidly released or dropped, so the sticking state can be directly determined by the voltage change at the target voltage acquisition point; the second type of switch is located between the power supply side and the constant-electrical load, and forms a dual-path structure of isolation and bypass with the second power supply side through a bypass module. This allows the load voltage to form a discernible change or remain stable in different states of the bypass module being open or closed, thereby achieving sticking detection by the change in voltage value; the third type of switch adopts a back-to-back transistor structure, which has bidirectional conduction and bidirectional isolation characteristics. When it is disconnected, the electrical isolation in both directions can be reflected as an observable relative voltage difference through the voltage acquisition points at its two ends, thereby enabling the detection of the sticking state by using the relative voltage difference. Furthermore, this invention does not rely on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. It can naturally form voltage change differences that can be used for adhesion determination when the detection conditions are met, simply through the electrical topology of the module structure itself and the load power supply relationship. Therefore, this intelligent power distribution module can not only fully support adhesion detection of the first type of power distribution switch, the second type of power distribution switch and the third type of power distribution switch, but also seamlessly cooperate with the adhesion detection method described in the above embodiments. Structurally, it achieves the technical effects of simple detection logic, comprehensive diagnostic coverage, no reliance on the test current injection capability inside the chip and no need for additional hardware support, thereby improving the overall diagnostic reliability of the intelligent power distribution module.

[0023] To achieve the above objectives, the electrical device of the third aspect of the present invention is used to implement the adhesion detection method described in the above embodiments, or the electrical device includes the intelligent power distribution module described in the above embodiments.

[0024] According to the embodiments of the present invention, the electrical equipment can accurately detect the adhesion state of the power distribution switch by using the adhesion detection method described in the above embodiments, or the intelligent power distribution module described in the above embodiments. It does not rely on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low in cost.

[0025] This invention also proposes a vehicle, which includes the electronic equipment described in the above embodiments, or the vehicle includes an intelligent power distribution module, a controller, a constant power load, a non-constant power load, and a power supply system.

[0026] According to the vehicle of the present invention, by executing the adhesion detection method described in the above embodiments, the adhesion state of the power distribution switch can be accurately detected without relying on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low in cost.

[0027] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of an intelligent power distribution module according to an embodiment of the present invention; Figure 2 This is a flowchart of an adhesion detection method according to an embodiment of the present invention; Figure 3 This is a flowchart of the adhesion state detection of a first type of power distribution switch according to an embodiment of the present invention; Figure 4 This is a graph showing the voltage change over time on the load side of a first type of power distribution switch according to an embodiment of the present invention. Figure 5 This is a flowchart of the adhesion state detection of a second type of power distribution switch according to an embodiment of the present invention; Figure 6 This is a block diagram of an electrical appliance according to an embodiment of the present invention; Figure 7 This is a block diagram of an electronic device according to an embodiment of the present invention; Figure 8 This is a block diagram of a vehicle according to an embodiment of the present invention; Figure 9 This is a block diagram of a vehicle according to yet another embodiment of the present invention.

[0029] Figure label: Vehicles 100; Electrical equipment 200; 1. Electronic equipment; 2. Intelligent power distribution module; 3. Controller; 4. Constant power load; 5. Non-constant power load; 6. Power supply system; 7. Power distribution network; Processor 11; Memory 12; Power distribution switch assembly 21; Bypass module 22; Third type power distribution switch 23; First power supply side 61; Second power supply side 62; Class I power distribution switch 211; Class II power distribution switch 212; Transistor group 231; Transistor unit 2311. Detailed Implementation

[0030] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0031] In existing technologies, the detection of switch adhesion in smart power distribution modules mainly relies on Efuse chips or other dedicated diagnostic hardware. For example, the switch status is determined by injecting a transient current into the switch and measuring the Vds voltage difference (i.e., the voltage difference between the drain and source of the switching transistor). However, this method has the following problems: strong chip function dependence, complex control logic, high cost, and susceptibility to load characteristics and system interference, making it difficult to achieve simple, reliable, and low-cost adhesion detection.

[0032] To address the aforementioned issues, this invention proposes an adhesion detection method that can accurately detect the adhesion status of power distribution switches without relying on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low-cost.

[0033] To facilitate the explanation of the technical solution, the intelligent power distribution module of the present invention will be described first below.

[0034] Figure 1 This is a schematic diagram of an intelligent power distribution module according to an embodiment of the present invention, as shown below. Figure 1 As shown, the intelligent power distribution module 2 includes: multiple power distribution switch components 21, a bypass module 22, and a third type of power distribution switch 23.

[0035] In some embodiments, multiple power distribution switch assemblies 21 are adapted to be distributed across multiple power distribution networks 7, wherein a power distribution network 7 can be understood as a power distribution grid, i.e., an independent electrical circuit composed of wires, busbars, switches, etc., inside a vehicle or equipment. Each power distribution network 7 can be responsible for supplying power to a specific type of load or system module, such as a body control domain, chassis domain, infotainment domain, or powertrain domain, thereby achieving power zone management and fault isolation.

[0036] In some embodiments, each power distribution switch assembly 21 includes at least one first-type power distribution switch 211 and / or at least one second-type power distribution switch 212. The first-type power distribution switch 211 can control the distribution of power to the non-electrical load 5. In the event of overcurrent, overvoltage, short circuit, or other abnormal conditions, the first-type power distribution switch 211 can promptly disconnect the non-electrical load 5, thereby protecting the circuit and upstream power supply. The second-type power distribution switch 212 can control the distribution of power to the constant-electrical load 4. Its function is to provide a stable and continuous power supply to the critical constant-electrical load in the vehicle or equipment, while disconnecting the constant-electrical load 4 in abnormal conditions to protect the system and power grid, achieving fault isolation and stable system operation.

[0037] In some embodiments, such as Figure 1 As shown, the power distribution switch assembly 21 includes two first-type power distribution switches 211 and two second-type power distribution switches 212. The first-type power distribution switches 211 are adapted to be connected between the power supply side of the power supply system and the non-electrical load 5, and the first end of the second-type power distribution switches 212 is adapted to be connected between the power supply side of the power supply system and the constant-electrical load 4.

[0038] The power supply side of the power supply system can be the upstream power supply side to which the intelligent power distribution module 2 is connected, including the battery side and the DC-DC (direct current to direct current) converter side. The power supply side of the power supply system can be used to provide a stable voltage for the intelligent power distribution module 2 and the load, and provide a reference voltage during adhesion detection or fault isolation to determine the adhesion status of the target power distribution switch.

[0039] In some embodiments, such as Figure 1 As shown, the power supply system includes a first power supply side 61 and a second power supply side 62. The first power supply side 61 can be the output terminal of a DC-DC converter, i.e., the main power supply side, used to supply power to the constant power load 4 and the non-constant power load 5; the second power supply side 62 can be the battery power output terminal, used for redundant power supply and to maintain power supply to critical loads when the first power supply side 61 is disconnected, ensuring system safety and reliability.

[0040] In some embodiments, the constant electrical load 4 can be a resistive load, whose impedance characteristics are mainly pure resistance, so that the current and voltage across the load are always in phase and have the same waveform. This type of load can convert the input electrical energy into almost complete useful work (such as heat or light energy), with a power factor close to 1, thereby providing a stable and reliable energy terminal for basic functions such as lighting and heating.

[0041] In some embodiments, the non-electrical load 5 includes inductive and capacitive loads, whose impedance characteristics are dominated by inductance or capacitance, respectively, causing a phase shift in the alternating current relative to the voltage that is either lagging (inductive) or leading (capacitive). The core function of this type of load is to establish and maintain the magnetic (inductive) or electric (capacitive) field in the circuit. Although this process does not directly consume active power, it generates reactive power that is continuously exchanged with the power source. Its direct impact is to cause a decrease in the system power factor, increasing the apparent power demand of the grid and transmission losses. However, by appropriately compensating the inductive load with capacitive loads, system energy efficiency and grid stability can be improved.

[0042] In some embodiments, such as Figure 1 As shown, the first end of the bypass module 22 is connected to the load side of each of the second type of power distribution switches 212, and the second end of the bypass module is connected to the second power supply side. The bypass module is used to provide a current path under specific operating conditions. Specifically, when the constant-power load 4 of the intelligent power distribution module 2 is in a dormant or standby state, the bypass module 22 provides the necessary low-power power supply to the constant-power load 4 to maintain the static operation or memory function of critical circuits, thereby ensuring that the basic functions of the vehicle or equipment remain available in the OFF state. For example, the vehicle's body control module, infotainment module, or sensor control module may still need to maintain clock timing, status holding, or low-power communication functions when the vehicle is in the OFF state, and the bypass module 22 can provide such a low-power power path. By setting the bypass module 22, the intelligent power distribution module 2 can maintain the static power consumption of the constant power load 4 when the second type of power distribution switch 212 is open, thus achieving safe and reliable sleep power supply management. At the same time, when it is necessary to detect the adhesion of the second type of power distribution switch 212, the adhesion status of the switch can still be determined by detecting the change in the voltage value of the target voltage acquisition point of the second type of power distribution switch 212. This does not require relying on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low in cost.

[0043] In some embodiments, such as Figure 1 As shown, the third-class power distribution switch 23 can be understood as an isolating switch, suitable for installation between multiple power distribution networks 7. The third-class power distribution switch 23 is also connected between the first power supply side 61 and the second power supply side 62, used to achieve electrical isolation or connection between different power distribution networks 7. The main function of the third-class power distribution switch 23 is to achieve isolation and redundant protection, ensuring that when one power distribution network 7 fails or malfunctions, another power distribution network 7 can still operate independently, thereby avoiding cascading failures of the power distribution networks 7 and improving the safety and reliability of the vehicle or equipment power supply system.

[0044] In some embodiments, such as Figure 1As shown, the third type of power distribution switch 23 includes at least one transistor group 231, and each transistor group 231 includes two transistor units 2311 arranged back-to-back. The purpose of the back-to-back arrangement is to achieve bidirectional conduction and bidirectional isolation functions, that is, when conduction is required, current can be allowed to flow through the switch from either direction; when disconnection or isolation is required, the current can be effectively blocked regardless of the current direction, ensuring the isolation effect.

[0045] In some embodiments, the sticking state detection of the third type of power distribution switch 23 can be determined by the relative voltage difference described in the following embodiments. That is, by analyzing the voltage difference between the voltage value of the target voltage sampling point and the voltage value on the power supply side of the power supply system, the sticking state of the third type of power distribution switch 23 can be determined. The specific diagnostic strategy will be described in detail in subsequent embodiments.

[0046] According to the intelligent power distribution module 2 of the present invention, since the module is provided with multiple power distribution switch assemblies 21 distributed in different power distribution networks 7, and each power distribution switch assembly 21 is respectively configured with a first type of power distribution switch 211 suitable for supporting non-electrical load 5, a second type of power distribution switch 212 suitable for supporting constant power load 4, and a third type of power distribution switch 23 that can be connected between multiple power distribution networks 7 and between the first power supply side 61 and the second power supply side 62, and a bypass module 22 corresponding to the second type of power distribution switch 212 is provided, so that different types of power distribution branches can meet the working state switching and load power supply requirements, and can directly obtain clear voltage value changes or relative voltage differences based on the target voltage acquisition points corresponding to various types of power distribution switches when the adhesion detection conditions are met, thereby supporting the adhesion detection method described in the above embodiment.

[0047] In some embodiments, the first type of power distribution switch 211 is arranged between the power supply side and the non-electrical load 5. When it is disconnected, the voltage at the load end can be rapidly released or dropped, so the sticking state can be directly determined by the voltage change at the target voltage acquisition point. The second type of power distribution switch 212 is arranged between the power supply side and the constant power load 4, and forms a dual-path structure of isolation and bypass with the second power supply side 62 through the bypass module 22. This allows the load end voltage to form a discernible change or remain stable in different states of the bypass module 22 being open or closed, thereby achieving sticking detection by the change in voltage value. The third type of power distribution switch 23 adopts a back-to-back transistor structure, which has bidirectional conduction and bidirectional isolation characteristics. When it is disconnected, the electrical isolation in both directions can be reflected as an observable relative voltage difference through the voltage acquisition points at its two ends, thereby enabling the detection of the sticking state by using the relative voltage difference.

[0048] Furthermore, this invention does not rely on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. It can naturally form voltage change differences that can be used for adhesion determination when the detection conditions are met, simply through the electrical topology of the module structure itself and the power supply relationship with the load. Therefore, the intelligent power distribution module 2 can not only fully support the adhesion detection of the first type of power distribution switch 211, the second type of power distribution switch 212 and the third type of power distribution switch 23, but also seamlessly cooperate with the adhesion detection method described in the above embodiment. Structurally, it achieves the technical effects of simple detection logic, comprehensive diagnostic coverage, no reliance on the test current injection capability inside the chip and no need for additional hardware support, thereby improving the overall diagnostic reliability of the intelligent power distribution module 2.

[0049] The following is for reference. Figures 2-5 An adhesion detection method according to an embodiment of the present invention is described, which is used to detect a power distribution switch in a smart power distribution module.

[0050] Figure 2 This is a flowchart of an adhesion detection method according to an embodiment of the present invention, as follows: Figure 2 As shown, the adhesion detection method of this invention includes at least the following steps: S1, when the power supply system connected to the intelligent power distribution module and the intelligent power distribution module meet the adhesion detection conditions of the target power distribution switch, the adhesion state of the target power distribution switch is determined based on the change of voltage value of the target voltage acquisition point or the relative voltage difference.

[0051] In some embodiments of the present invention, the target power distribution switch may be a first type of power distribution switch for controlling the power supply to non-electrical loads, a second type of power distribution switch for controlling the power supply to constant-electrical loads, or a third type of power distribution switch for controlling the conduction or isolation of multiple power distribution networks. The sticking state is determined by detecting the voltage characteristics of the target power distribution switch, thus eliminating the need to rely on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low-cost.

[0052] In some embodiments, the current injection test requires the power distribution device (such as an eFuse or smart switch) to support the diagnostic function of "injecting test current and measuring the Vds voltage difference," and the device must be placed in a dedicated self-diagnostic mode to execute safely (to avoid interference with the current injection function or damage to the circuit during normal operation). Therefore, this method has strict requirements on device selection and requires additional control logic (MCU initiation, switching to the diagnostic state machine, managing the current injection timing and safety interlocks, etc.), resulting in complex overall implementation and high software / hardware coupling. In contrast, this invention uses the detection of the voltage characteristics of the target power distribution switch to determine its adhesion state. This method does not rely on the diagnostic loop or special chip functions within the smart power distribution module, and its control logic is simpler and more compatible.

[0053] In some embodiments, the voltage change can include the rate and magnitude of the voltage change. Specifically, for a target switch that is either a Class I or Class II switch, when the target switch is in a normally open state, the voltage value at the target voltage acquisition point will change rapidly and significantly, and / or the change amplitude will be large, as the switch opens. However, when the target switch is stuck, the voltage value at the target voltage acquisition point changes very little, and the rate of change is also significantly slower. Therefore, by comparing the rate and magnitude of voltage change, it is possible to accurately determine whether the target switch is stuck.

[0054] In some embodiments, the relative voltage difference is the voltage difference between the target voltage sampling point and the voltage value on the power supply side of the power supply system. For the detection of adhesion of the third type of distribution switch, this invention can determine the adhesion state by calculating the relative voltage difference between the target voltage sampling point and the power supply side of the power supply system. Specifically, when the third type of distribution switch is normally open, the relative voltage difference between the target voltage sampling point and the power supply side of the power supply system will be relatively large; while when the third type of distribution switch is adhered, the relative voltage difference between the target voltage sampling point and the power supply side of the power supply system will be relatively small, even close to 0. Therefore, by determining the magnitude of the relative voltage difference, the adhesion detection of the third type of distribution switch can be achieved.

[0055] According to the adhesion detection method of this invention, when the power supply system and power distribution module connected to the intelligent power distribution module meet the adhesion detection conditions of the target power distribution switch, the adhesion state of the target power distribution switch is determined by acquiring the voltage change of the target voltage sampling point of the target power distribution switch, or by calculating the relative voltage difference between the voltage value of the target voltage sampling point and the voltage value of the power supply side of the power supply system. Specifically, when the target power distribution switch is normally disconnected, the voltage value of the target voltage sampling point will change significantly or the relative voltage difference will be large as the switch is disconnected; while when the target power distribution switch is stuck, the voltage value of the target voltage sampling point will change very little or the relative voltage difference will be small as the switch is disconnected. Therefore, by using software algorithms to logically judge the acquired voltage changes or relative voltage differences, this method can identify the adhesion state of the target power distribution switch, thereby achieving accurate detection of the adhesion state of the target power distribution switch. This method does not rely on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware, and the detection logic is simple, reliable, and low-cost.

[0056] In some embodiments, the target power distribution switch includes a first type of power distribution switch, which is adapted to be connected between the power supply side of the power supply system and a non-electrical load; the voltage change includes the rate of change of the voltage value on the load side of the first type of power distribution switch over time.

[0057] The first type of switchgear can be used to control the distribution of power to non-electrical loads. The sticking detection of the first type of switchgear can be achieved by detecting the rate of change of the voltage value on the load side of the switch over time, rather than simply relying on the magnitude of the voltage change. This is because non-electrical loads include inductive or capacitive loads, and their voltage response may be affected by the load characteristics. For example, when a non-electrical load has a large capacitance, even if the first type of switchgear is open, the voltage drop rate on the load side may be slow due to the capacitance, and the voltage amplitude change may be small. Therefore, relying solely on the voltage amplitude change to determine the switch status may lead to misjudgments.

[0058] This invention, by analyzing the rate of change of the voltage value on the load side of the first type of power distribution switch over time, can more sensitively capture the dynamic voltage characteristics brought about by switch operation. For example, when the first type of power distribution switch is normally disconnected, the voltage on the load side changes significantly and rapidly over time, i.e., the rate of change is large. When the first type of power distribution switch experiences disconnection and adhesion, the rate of change of the voltage on the load side slows down significantly, i.e., the rate of change is small. By using the rate of change of voltage rather than the simple amplitude for adhesion detection of the first type of power distribution switch, false judgments caused by capacitive loads or other dynamic characteristics can be effectively avoided, thereby improving the reliability and accuracy of adhesion detection.

[0059] In some embodiments, determining the sticking state of the target distribution switch based on the change in voltage value at the target voltage acquisition point of the target distribution switch includes: determining that the disconnection protection mechanism of the first type of distribution switch is normal when the rate of change is greater than or equal to the rate of change threshold; and / or determining that the first type of distribution switch has a disconnection sticking fault when the rate of change is less than the rate of change threshold.

[0060] Specifically, if the rate of change of voltage on the load side of the first-class power distribution switch is greater than or equal to a preset rate of change threshold, it indicates that the first-class power distribution switch can quickly disconnect under a disconnection command, its disconnection protection mechanism is normal, the first-class power distribution switch has not experienced a sticking fault, and the switch operation is reliable. If the rate of change of voltage on the load side of the first-class power distribution switch is less than the preset rate of change threshold, it indicates that the voltage change is slow during the disconnection operation, suggesting that the first-class power distribution switch has a disconnection sticking fault, which may cause non-electrical loads to fail to disconnect the power supply normally, posing a safety hazard.

[0061] In some embodiments, the rate of change can be calculated as follows: A sequence of voltage values ​​on the load side of the first type of distribution switch during the disconnection operation is collected; the maximum and minimum voltage values ​​within this time period are obtained; then, the difference between the maximum and minimum values ​​is divided by the collection time to obtain the rate of change of the voltage value on the switch load side. The formula can be expressed as: ; in, This represents the maximum voltage value during the data acquisition period. This represents the minimum voltage value during the data acquisition period. This represents the data collection time interval.

[0062] In some embodiments, the rate of change threshold can be set according to the switch type, load characteristics, and voltage level of the power supply system. The rate of change threshold can be set through experimental testing or simulation analysis, or it can be dynamically optimized based on historical operating data to adapt to different load types and working environments, thereby ensuring the accuracy and reliability of adhesion detection.

[0063] In some embodiments, for the first type of power distribution switch, the adhesion detection conditions include the power supply system entering the OFF power mode and the first type of power distribution switch being in the open state.

[0064] In some embodiments, within the power supply system connected to the intelligent power distribution module, the OFF power mode can refer to the system switching to a hibernation or low-power state after the vehicle or equipment shuts off its main power. In this mode, most loads cease operation, and the power supply system only maintains the operation of necessary control circuits and monitoring modules.

[0065] In some embodiments, when the power supply system enters the OFF power mode, the reference voltage on the power supply side is relatively stable, the system load is small, and interference factors are reduced, providing a reliable voltage measurement environment for judging the sticking state of the first type of distribution switch.

[0066] In some embodiments, the first type of power distribution switch is mainly used to control the power supply to non-electrical loads. Its sticking detection needs to be performed when the switch has received a disconnect command and should theoretically be in the disconnected state. When the switch is normally disconnected, the load-side voltage of the first type of power distribution switch should drop rapidly or change significantly over time; however, if the switch is stuck, the load-side voltage change is slight or almost constant. Based on these two points, this invention first confirms that the power supply system has entered the OFF power mode and determines that the current state of the first type of power distribution switch is disconnected. Only when both conditions are met simultaneously is the sticking detection logic of the first type of power distribution switch executed. The core purpose of this design is that if detection is performed when the system is working or the switch is on, the large fluctuations in load current or system voltage may lead to abnormal voltage change rates, resulting in an incorrect judgment that the switch is stuck. In the OFF power mode, the load is reduced and voltage interference is small, allowing the load-side voltage change to more accurately and reliably reflect the switch state, thus accurately identifying sticking.

[0067] Figure 3 This is a flowchart of the adhesion state detection of a first type of power distribution switch according to an embodiment of the present invention, as shown below. Figure 3As shown, the process for detecting the adhesion status of the first type of power distribution switch in this embodiment of the invention includes at least the following steps: S10, Begin.

[0068] S11, the power supply system enters OFF power mode.

[0069] S12, disconnect the first type of power distribution switch.

[0070] S13, after waiting for time T0, collect the voltage value sequence of the load side of the first type of distribution switch during the disconnection operation, obtain the maximum and minimum voltage values ​​during this time period, divide the difference between the maximum and minimum values ​​by the collection time, and obtain the rate of change of the load side voltage value of the first type of distribution switch.

[0071] S14. Determine whether the rate of change is greater than or equal to the rate of change threshold. If yes, proceed to step S15; otherwise, proceed to step S16.

[0072] Specifically, such as Figure 1 and Figure 4 As shown, the intelligent power distribution module includes two Class I power distribution switches, and the rate of change of the load-side voltage values ​​of the two Class I power distribution switches can be set to... and By judgment The relationship between the magnitude of the change rate threshold and the value of the change rate threshold. The relationship between the magnitude of the change rate threshold and the value of the switch can be used to determine whether two Class I distribution switches have a disconnection / adhesion fault. Figure 4 The slopes of the two voltage-time curves in the figure correspond to respectively and .

[0073] S15, confirming that the disconnection protection mechanism of the first type of power distribution switch is normal.

[0074] S16, if it is determined that there is a disconnection and sticking fault in the first type of power distribution switch, report the fault.

[0075] S17, End.

[0076] In summary, this invention, by disconnecting the first type of power distribution switch after the power supply system enters the OFF power mode, and judging whether the switch has a disconnection and sticking fault based on the rate of change of the load side voltage value of the first type of power distribution switch over time, can effectively avoid misjudgment caused by the slow voltage drop due to the large load capacitance, thereby improving the accuracy and reliability of sticking detection.

[0077] In some embodiments, the target power distribution switch includes a second type of power distribution switch, which can be used to control the distribution of power to a constant-current load. The first end of the second type of power distribution switch is adapted to be connected between the power supply side of the power supply system and the constant-current load. The load side of the second type of power distribution switch is also adapted to be connected to the power supply side via a bypass module, thereby creating two voltage measurement conditions under different states, facilitating the detection of whether the second type of power distribution switch has become stuck.

[0078] In some embodiments, a bypass module can refer to a low-power path that can provide a small current path to the load side when the load enters a sleep or low-power state, thereby maintaining a stable system voltage and reducing static power consumption.

[0079] In some embodiments, the change in voltage value at the target voltage acquisition point is a first voltage deviation, which is the voltage deviation between a first voltage value and a second voltage value of the second type of power distribution switch. The first voltage value is the voltage value on the load side of the second type of power distribution switch under a first adhesion detection condition, and the second voltage value is the voltage value on the load side of the second type of power distribution switch under a second adhesion detection condition. The first adhesion detection condition includes the bypass module being in a conducting state, and the second adhesion detection condition includes the bypass module being in a disconnected state.

[0080] In some embodiments, whether the second type of power distribution switch has stuck is determined by comparing the voltage deviation (i.e., the first voltage deviation) between a first voltage value and a second voltage value. This method does not rely on the current injection function of the Efuse chip inside the intelligent power distribution module or dedicated diagnostic hardware; it can complete the sticking detection simply through voltage measurement and deviation calculation. The detection logic is simple, reliable, and low-cost.

[0081] In some embodiments, determining the sticking state of the target power distribution switch based on the change in voltage value at the target voltage acquisition point of the target power distribution switch includes: determining that the disconnection protection mechanism of the second type of power distribution switch is normal when the first voltage deviation is greater than the first voltage deviation threshold; and / or determining that the second type of power distribution switch has a disconnection sticking fault when the first voltage deviation is less than or equal to the first voltage deviation threshold.

[0082] Specifically, if the disconnection protection mechanism of the second-type power distribution switch is normal, the difference between the load-side voltage of the second-type power distribution switch and the bypass module's on and off states will be significant, i.e., the first voltage deviation will be greater than the preset threshold (first voltage deviation threshold). This indicates that the switch can effectively isolate the load in the off state, distinguishing it from the static power supplied by the bypass module, and the disconnection protection mechanism is working normally. If the second-type power distribution switch has a disconnection sticking fault, the change in the load-side voltage of the second-type power distribution switch between the bypass module's on and off states will be very small, i.e., the first voltage deviation will be less than or equal to the preset threshold (first voltage deviation threshold). This indicates that the second-type power distribution switch has failed to disconnect effectively, and there is a sticking phenomenon in the second-type power distribution switch, which may lead to risks such as overcurrent, short circuit, or mistransmission of power.

[0083] In some embodiments, the first voltage deviation threshold can be preset according to the load characteristics, bypass module turn-on voltage, system power supply voltage and detection accuracy to adapt to different types of constant power loads, without specific limitations.

[0084] In some embodiments, the first adhesion detection conditions further include the power supply system entering OFF power mode, the second type of power distribution switch being in an open state, and the isolating switch (i.e., the third type of power distribution switch) of the intelligent power distribution module being in an open state; and / or, the second adhesion detection conditions further include the power supply system entering OFF power mode, the second type of power distribution switch being in a closed state, and the isolating switch of the intelligent power distribution module being in a closed state.

[0085] Specifically, for the first adhesion detection condition, the power supply system entering OFF power mode indicates that the device is in a shut-off state, the power output stops or enters a low-power mode, ensuring that the load is free from voltage interference. The second type of power distribution switch being in an open state indicates that the main power supply path for the constant-power load is cut off. At this time, the bypass module is in a conducting state, and the load-side voltage of the second type of power distribution switch is mainly provided by the second power supply side (battery power supply side), serving as the first voltage value. The disconnecting switch of the intelligent power distribution module (i.e., the third type of power distribution switch) being in an open state indicates that different power distribution networks are isolated (i.e., the power supply side of the second type of power distribution switch is isolated), avoiding mutual interference.

[0086] For the second adhesion detection condition, the power supply system entering OFF power mode indicates that the equipment is in a shut-off state, the power output stops or enters a low-power mode, ensuring that the load is free from voltage interference; the second type of power distribution switch being in a closed state indicates that the main power supply path of the constant-power load is open. At this time, the bypass module is in a disconnected state, and the load-side voltage of the second type of power distribution switch is mainly provided by the first power supply side (DC-DC converter side), serving as the second voltage value. The isolating switch of the intelligent power distribution module (i.e., the third type of power distribution switch) is in a closed state, enabling conduction between different power distribution networks.

[0087] Therefore, when the tripping protection mechanism of the second type of power distribution switch is normal, there should be a significant difference between the first voltage value and the second voltage value, that is, the first voltage deviation between the first voltage value and the second voltage value should be greater than the first voltage deviation threshold. When the second type of power distribution switch has a tripping sticking fault, it cannot effectively cut off the main continuity path between the power supply side and the load side. In other words, even if the second type of power distribution switch is tripped, the voltage on the load side of the second type of power distribution switch is still mainly provided by the first power supply side (DC-DC converter side), that is, the first voltage value and the second voltage value have a small difference, resulting in the first voltage deviation between the first voltage value and the second voltage value being less than or equal to the first voltage deviation threshold. Therefore, by detecting the comparison result of the first voltage deviation and the first voltage threshold, the sticking state of the second type of power distribution switch can be deduced.

[0088] In some embodiments, the power supply side includes a first power supply side and a second power supply side. The first power supply side may be the output terminal of a DC-DC converter, and the second power supply side may be a battery power output terminal. The load of the second type of power distribution switch is adapted to be connected to the second power supply side via a bypass module to maintain power supply to the load when the first power supply side is disconnected.

[0089] In some embodiments, the adhesion detection method further includes: under the second adhesion detection condition, determining the fault state of the sampling circuit corresponding to the second type of power distribution switch based on the second voltage deviation; wherein, the second voltage deviation is the voltage deviation between the voltage value on the load side of the second type of power distribution switch and the voltage value on the first power supply side; the voltage value on the first power supply side is the upper limit of the allowable range of the voltage output by the first power supply side.

[0090] Specifically, the voltage value on the first power supply side is set to the upper limit of the allowable voltage range of the first power supply side output. This is to establish a sufficiently large voltage difference between the first and second power supply sides during the adhesion detection of the second type of power distribution switch. During the adhesion detection process of the second type of power distribution switch, if the voltage on the first power supply side (such as the output voltage of a DC-DC converter) is not boosted, its output voltage may be relatively close to the voltage on the second power supply side (the battery output voltage). In this case, even if the second type of power distribution switch is in a normally open state, the first voltage deviation between the first voltage value and the second voltage value of the second type of power distribution switch may be too small, resulting in an indistinct voltage deviation characteristic during the adhesion detection process, making it difficult to effectively distinguish between the "normally open state" and the "adhesion state."

[0091] In some embodiments, determining the fault status of the sampling circuit corresponding to the second type of power distribution switch based on the second voltage deviation includes: determining that the sampling circuit is normal when the second voltage deviation is less than the second voltage deviation threshold; or determining that the sampling circuit has a fault when the second voltage deviation is greater than or equal to the second voltage deviation threshold.

[0092] In some embodiments, when the voltage on the first power supply side is increased to the upper limit of its allowable output voltage range, the voltage value on the load side of the second type of power distribution switch can be observed to rise accordingly. Based on this, the operating status of the sampling circuit can be determined by comparing the voltage deviation (second voltage deviation) between the load side voltage value of the second type of power distribution switch and the voltage value on the first power supply side. Theoretically, since both voltages rise synchronously, the second voltage deviation should be small. When the second voltage deviation is less than the second voltage deviation threshold, the sampling circuit is considered to be operating normally; when the second voltage deviation is greater than or equal to the second voltage deviation threshold, it indicates that the acquisition of the load side voltage of the second type of power distribution switch fails to accurately reflect the true voltage rise. Such anomalies may be caused by sensor offset, signal distortion, poor wiring or terminal contact, etc., thus indicating a fault in the sampling circuit.

[0093] Figure 5 This is a flowchart of the adhesion state detection of a second type of power distribution switch according to an embodiment of the present invention, such as... Figure 5 As shown, the process for detecting the adhesion status of the second type of power distribution switch in this embodiment of the invention includes at least the following steps: S100, begin.

[0094] S101, the power supply system enters OFF power mode.

[0095] S102, control the voltage value of the first power supply side to rise to the upper limit of the allowable range of the voltage output of the first power supply side.

[0096] S103, collect the voltage value of the load side of the second type of power distribution switch N times, and calculate the average of the absolute values ​​of the voltage deviations between the voltage value of the load side of the second type of power distribution switch and the voltage value of the first power supply side N times, as the second voltage deviation.

[0097] S104. Determine whether the second voltage deviation is less than the second voltage deviation threshold. If yes, proceed to step S106; otherwise, proceed to step S105.

[0098] S105, there is a fault in the sampling circuit, report the fault.

[0099] S106, close the bypass module, disconnect the second type of power distribution switch, and disconnect the isolating switch of the intelligent power distribution module.

[0100] S107, After waiting for time T1, start collecting the voltage value on the load side of the second type of power distribution switch under the first adhesion detection condition, collect N times, and calculate the average of the absolute values ​​of the voltage deviations between the voltage value on the load side of the second type of power distribution switch under the first adhesion detection condition and the voltage value on the load side of the second type of power distribution switch under the second adhesion detection condition, as the first voltage deviation.

[0101] S108, determine whether the first voltage deviation is greater than the first voltage deviation threshold. If yes, proceed to step S110; otherwise, proceed to step S109.

[0102] S109, the second type of power distribution switch has a disconnection and sticking fault, report the fault.

[0103] S110, the tripping protection mechanism of the second type of power distribution switch is normal.

[0104] S111, End.

[0105] In summary, the above process enables accurate detection of the adhesion status of the second type of power distribution switch without relying on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low-cost.

[0106] In some embodiments, the target power distribution switch includes a third type of power distribution switch, which may be an isolating switch of the intelligent power distribution module described in the above embodiments. It is suitable for being set between multiple power distribution networks and is also connected between the first power supply side and the second power supply side of the power supply system. It is used to realize the isolation or conduction of different power distribution networks and the first power supply side and the second power supply side. Its main function is to ensure the independence of the two power distribution networks during normal operation, and at the same time realize redundant power supply or grid interconnection when necessary, thereby avoiding the overall power supply interruption of the system caused by the failure of the cascaded power distribution network.

[0107] In some embodiments, the third type of power distribution switch includes two transistor units (e.g., two MOSFETs, or Metal-Oxide Semiconductor Field Effect Transistors) arranged back-to-back, forming a bidirectional conduction capability. The two transistor units arranged back-to-back can achieve bidirectional current control, while preventing current from flowing in the opposite direction in the open state, thus improving isolation performance and reliability.

[0108] Therefore, since the third type of power distribution switch has bidirectional conduction and bidirectional isolation functions, it is necessary to perform adhesion detection on the two transistor units set back to back in the third type of power distribution switch.

[0109] In some embodiments, the voltage value of the target voltage acquisition point of the target power distribution switch is the voltage value between the two transistor units. The voltage value between the two transistor units is used as an intermediate voltage value, which is an important basis for determining whether the two transistor units are stuck together.

[0110] In some embodiments, the relative voltage difference includes a first relative voltage difference between the voltage value on the first power supply side and an intermediate voltage value, and / or, the relative voltage difference includes a second relative voltage difference between the intermediate voltage value and the voltage value on the second power supply side. By calculating the first relative voltage difference and / or the second relative voltage difference, it is possible to accurately determine whether two transistor units are in a stuck state, without relying on external dedicated diagnostic hardware and without being limited by the function of the isolation switch pre-driver chip, thereby achieving a simple, reliable, and low-cost sticking detection logic.

[0111] In some embodiments, determining the adhesion state of the target power distribution switch based on the relative voltage difference of the voltage values ​​at the target voltage acquisition point of the target power distribution switch includes: under a third adhesion detection condition, determining the adhesion state of the first transistor based on a first relative voltage difference, wherein the first transistor is the transistor connected to the first power supply side among the two transistors; and / or, when the first transistor has a disconnection adhesion fault, under the third adhesion detection condition, determining the adhesion state of the second transistor based on a second relative voltage difference, wherein the second transistor is the transistor connected to the second power supply side among the two transistors; and / or, when the first transistor does not have a disconnection adhesion fault, under a fourth adhesion detection condition, determining the adhesion state of the second transistor based on a second relative voltage difference, wherein the second transistor is the transistor connected to the second power supply side among the two transistors.

[0112] In some embodiments, determining the sticking state of the first transistor based on the first relative voltage difference includes: when the first relative voltage difference is less than or equal to a third voltage deviation threshold, the first transistor has a disconnection-sticking fault, that is, the first transistor should have disconnected but failed to disconnect completely, resulting in an intermediate voltage value close to the voltage value of the first power supply side with a small change range. Alternatively, when the first relative voltage difference is greater than the third voltage deviation threshold, the disconnection protection mechanism of the first transistor is normal, that is, the first transistor can disconnect normally, and there is a sufficient difference between the intermediate voltage value and the voltage value of the first power supply side, proving that the switching action is normal.

[0113] And / or, in some embodiments, determining the sticking state of the second transistor based on the second relative voltage difference includes: when the second relative voltage difference is less than or equal to a fourth voltage deviation threshold, the second transistor has a disconnection-sticking fault, i.e., the second transistor fails to disconnect normally, resulting in an intermediate voltage value close to the voltage value of the second power supply side, with a small change range. Alternatively, when the second relative voltage difference is the voltage drop across the body diode of the second transistor, the disconnection protection mechanism of the second transistor is normal. This is because if the second transistor disconnects normally, current can only flow through the body diode of the second transistor, and the body diode can generate a forward voltage drop of approximately 0.7V. Therefore, if the disconnection protection mechanism of the second transistor is normal, the second relative voltage difference is the voltage drop across the body diode of the second transistor, approximately equal to 0.7V. If the second transistor has a disconnection-sticking fault, the intermediate voltage value is very close to the voltage value of the second power supply side, and the second relative voltage difference is very small.

[0114] Therefore, by comparing the first relative voltage difference with the third voltage deviation threshold, the sticking state of the first transistor can be determined; similarly, by comparing the second relative voltage difference with the fourth voltage deviation threshold, the sticking state of the second transistor can be determined. The third and fourth voltage deviation thresholds can be set based on the device characteristics of the target power distribution switch, the voltage fluctuation range of the power supply system, and the system safety margin, and are not specifically limited here.

[0115] In some embodiments, the third sticking detection condition includes the power supply system entering OFF power mode and both transistors being in the off state. This condition assumes that the voltage difference between the first power supply side and the second power supply side is greater than the fifth voltage deviation threshold. Alternatively, if the voltage difference between the first power supply side and the second power supply side does not meet the requirement of being greater than the fifth voltage deviation threshold, then the third sticking detection condition includes the power supply system entering OFF power mode, both transistors being in the off state, and the voltage difference between the first power supply side and the second power supply side being greater than the fifth voltage deviation threshold. That is, the voltage of the first power supply side (the output voltage of the DC-DC converter) needs to be continuously increased until the requirement is met. The purpose of this is to ensure that, under normal off-state conditions, there should be a natural and significant voltage difference between the voltage of the first power supply side and the intermediate voltage value. If the voltage difference is too small, regardless of whether the first transistor is sticking or not, the voltage of the first power supply side and the intermediate voltage value will be very close, making it difficult to distinguish between the normal off-state and the sticking state of the switch. Therefore, by increasing the voltage of the first power supply side to create a sufficiently large voltage difference between the two sides, it is possible to ensure that subsequent voltage sampling can accurately determine whether the first transistor is sticking.

[0116] And / or, the fourth adhesion detection condition includes the power supply system entering the OFF power mode and the first transistor being closed and the second transistor being open, or the fourth adhesion detection condition includes the power supply system entering the OFF power mode and the first transistor being closed and the second transistor being open, and the voltage difference between the first power supply side and the second power supply side being greater than the fifth voltage deviation threshold.

[0117] The fact that the first transistor is in a closed state can be understood as a result of artificial setting. The purpose is to simulate the sticking state of the first transistor, so that the relationship between the intermediate voltage value and the voltage on the second power supply side is mainly determined by the state of the second transistor and its body diode characteristics, thereby meeting the sticking diagnosis conditions of the second transistor and realizing the effective detection of the second transistor.

[0118] This invention also proposes an electrical device 200 for implementing the adhesion detection method described in the above embodiments.

[0119] Or, such as Figure 6 As shown, the electrical equipment 200 includes the intelligent power distribution module 2 described in the above embodiment.

[0120] According to the embodiments of the present invention, the electrical equipment 200 can accurately detect the adhesion state of the power distribution switch by using the adhesion detection method described in the above embodiments, or the intelligent power distribution module 2 described in the above embodiments. It does not rely on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low in cost.

[0121] In some embodiments, electrical equipment 200 may include electronic devices, computer-readable storage media, computer program products, and vehicles.

[0122] Figure 7 This is a block diagram of an electronic device according to an embodiment of the present invention, such as... Figure 7 As shown, the electronic device 1 includes a memory 12 and at least one processor 11.

[0123] In some embodiments, at least one processor 11 can be one processor 11, or multiple processors 11, such as two processors 11, three processors 11, five processors 11, etc. The processors 11 can be single-core or multi-core processors. These processors 11 can be various types of general-purpose or special-purpose processors, such as central processing units (CPUs), digital signal processors (DSPs), or field-programmable gate arrays (FPGAs), depending on the design and purpose of the electronic device 1.

[0124] In some embodiments, memory 12 may be random access memory (RAM), read-only memory (ROM), flash memory, or other storage media. It is communicatively connected to at least one processor 11 for providing computing programs and storing runtime data.

[0125] In some embodiments, the memory 12 stores a computer program that can be executed by at least one processor 11, and the at least one processor 11 executes the computer program to implement the adhesion detection method described in the above embodiments.

[0126] According to the present invention, the electronic device 1 can accurately detect the adhesion state of the power distribution switch by adopting the adhesion detection method described in the above embodiment. It does not rely on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable and low cost.

[0127] In some embodiments, a computer-readable storage medium stores a computer program thereon, which, when executed, implements the adhesion detection method described in the above embodiments. The specific implementation process of the adhesion detection method can be referred to the description in the above embodiments, and will not be elaborated further here.

[0128] The computer-readable storage medium in the embodiments of the present invention may include, but is not limited to: phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other optical and magnetic storage media, which will not be described in detail here.

[0129] According to the computer-readable storage medium of the present invention, by employing the adhesion detection method described in the above embodiments, the adhesion state of the power distribution switch can be accurately detected without relying on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low in cost.

[0130] In some embodiments, a computer program product may refer to a complete package of software that exists in software form and can be distributed, installed, and run, and can be regarded as a "product".

[0131] In some embodiments, the computer program product includes a computer program stored on a computer-readable storage medium, the computer program including program instructions that, when executed by a computer, cause the computer to perform the adhesion detection method described in the above embodiments.

[0132] In some embodiments, the program instructions of a computer program product may take various forms, including but not limited to: raw machine code, assembly language, bytecode (such as JVM bytecode, Python intermediate code), high-level language code (such as C++, Python, JavaScript), etc.

[0133] According to the computer program product of the present invention, by using a computer to execute program instructions to implement the adhesion detection method described in the above embodiments, the adhesion state of the power distribution switch can be accurately detected without relying on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low in cost.

[0134] The following is for reference. Figures 8-9 A vehicle according to an embodiment of the present invention is described.

[0135] Figure 8 This is a block diagram of a vehicle according to an embodiment of the present invention, such as... Figure 8 As shown, the vehicle 100 includes the electronic device 1 described in the above embodiment.

[0136] Figure 9 This is a block diagram of a vehicle according to yet another embodiment of the present invention, such as Figure 9 As shown, vehicle 100 includes: intelligent power distribution module 2, controller 3, constant power load 4, non-constant power load 5, and power supply system 6.

[0137] In some embodiments, the intelligent power distribution module 2 may include multiple power distribution switch components, a bypass module 22 and a third type of power distribution switch 23, and the intelligent power distribution module 2 is used to distribute power to multiple loads in the vehicle 100.

[0138] In some embodiments, controller 3 may be a vehicle controller, body domain controller, power management controller, or central computing platform. Controller 3 is used to execute the adhesion detection method described in the above embodiments to determine the adhesion state of the target power distribution switch.

[0139] In some embodiments, the constant power load 4 can be a device in the vehicle 100 that requires continuous power supply, such as an in-vehicle anti-theft system, a keyless entry module, a T-BOX (remote communication module), a body control unit, a headlight control circuit, and some monitoring cameras.

[0140] In some embodiments, the non-electrical load 5 may be a device in the vehicle 100 that is powered only under specific conditions, such as window regulators, power seats, wiper motors, lighting loads (interior lights / headlights), air conditioning blowers, power tailgate systems, heating loads (steering wheel heaters / seat heaters), etc.

[0141] In some embodiments, the power supply system 6 includes a first power supply side and a second power supply side for supplying power to the intelligent power distribution module 2, the non-electric load 5, and the constant load 4.

[0142] According to the vehicle 100 of the present invention, by executing the adhesion detection method described in the above embodiment, the adhesion state of the power distribution switch can be accurately detected without relying on the test current injection function of the Efuse chip inside the intelligent power distribution module or other dedicated diagnostic hardware. The detection logic is simple, reliable, and low in cost.

[0143] In some embodiments, the electrical equipment 200 may also include, but is not limited to: industrial equipment, household or commercial electrical equipment, aerospace equipment, marine equipment, energy storage systems, communication base stations, etc.

[0144] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0145] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A method for detecting adhesion, characterized in that, The adhesion detection method is used to detect power distribution switches in a smart power distribution module, and includes: When the power supply system connected to the intelligent power distribution module and the intelligent power distribution module meet the adhesion detection conditions of the target power distribution switch, the adhesion state of the target power distribution switch is determined based on the change of voltage value at the target voltage acquisition point or the relative voltage difference. The relative voltage difference is the voltage difference between the voltage value at the target voltage sampling point and the voltage value on the power supply side of the power supply system.

2. The adhesion detection method according to claim 1, characterized in that, The target power distribution switch includes a first type of power distribution switch, which is adapted to be connected between the power supply side of the power supply system and the non-electrical load. The voltage change includes the rate of change of the voltage on the load side of the first type of power distribution switch over time.

3. The adhesion detection method according to claim 2, characterized in that, Determining the adhesion state of the target distribution switch based on the voltage change at the target voltage acquisition point includes: If the rate of change is greater than or equal to the rate of change threshold, it is determined that the disconnection protection mechanism of the first type of power distribution switch is normal. And / or, if the rate of change is less than the rate of change threshold, it is determined that the first type of power distribution switch has a disconnection and sticking fault.

4. The adhesion detection method according to claim 2, characterized in that, For the first type of power distribution switch, the adhesion detection conditions include the power supply system entering the OFF power mode and the first type of power distribution switch being in the open state.

5. The adhesion detection method according to claim 1, characterized in that, The target power distribution switch includes a second type of power distribution switch, the first end of which is adapted to be connected between the power supply side of the power supply system and the constant power load, and the load side of the second type of power distribution switch is also adapted to be connected to the power supply side through a bypass module. The voltage value change includes a first voltage deviation, which is the voltage deviation between the first voltage value of the second type of power distribution switch and the second voltage value of the second type of power distribution switch; The first voltage value is the voltage value on the load side of the second type of power distribution switch under the first adhesion detection condition, and the second voltage value is the voltage value on the load side of the second type of power distribution switch under the second adhesion detection condition. The first adhesion detection condition includes the bypass module being in a conducting state, and the second adhesion detection condition includes the bypass module being in a disconnected state.

6. The adhesion detection method according to claim 5, characterized in that, Determining the adhesion state of the target distribution switch based on the voltage change at the target voltage acquisition point includes: If the first voltage deviation is greater than the first voltage deviation threshold, it is determined that the disconnection protection mechanism of the second type of power distribution switch is normal. And / or, if the first voltage deviation is less than or equal to the first voltage deviation threshold, it is determined that the second type of power distribution switch has a disconnection and sticking fault.

7. The adhesion detection method according to claim 5, characterized in that, The first adhesion detection conditions also include the power supply system entering OFF power mode, the second type of power distribution switch being in the open state, and the isolation switch of the intelligent power distribution module being in the open state; And / or, the second adhesion detection conditions also include the power supply system entering OFF power mode, the second type of power distribution switch being in a closed state, and the isolation switch of the intelligent power distribution module being in a closed state.

8. The adhesion detection method according to claim 5, characterized in that, The power supply side includes a first power supply side and a second power supply side, and the load of the second type of power distribution switch is adapted to be connected to the second power supply side through the bypass module. The adhesion detection method further includes: Under the second adhesion detection condition, the fault state of the sampling circuit corresponding to the second type of power distribution switch is determined based on the second voltage deviation; Wherein, the second voltage deviation is the voltage deviation between the load side voltage value of the second type of power distribution switch and the voltage value of the first power supply side; the voltage value of the first power supply side is the upper limit of the allowable range of the voltage output by the first power supply side.

9. The adhesion detection method according to claim 8, characterized in that, The step of determining the fault state of the sampling circuit corresponding to the second type of power distribution switch based on the second voltage deviation includes: If the second voltage deviation is less than the second voltage deviation threshold, the sampling circuit is determined to be normal. Alternatively, if the second voltage deviation is greater than or equal to the second voltage deviation threshold, it is determined that the sampling circuit is faulty.

10. The adhesion detection method according to claim 1, characterized in that, The target power distribution switch includes a third type of power distribution switch, which is suitable for being installed between multiple power distribution networks and is also connected between the first power supply side and the second power supply side of the power supply system. The third type of power distribution switch includes two transistor units arranged back to back. The voltage value of the target voltage acquisition point of the target power distribution switch is the voltage value between the two transistor units, and the voltage value between the two transistor units is used as the intermediate voltage value; The relative voltage difference includes a first relative voltage difference between the voltage value on the first power supply side and the intermediate voltage value, and / or, the relative voltage difference includes a second relative voltage difference between the intermediate voltage value and the voltage value on the second power supply side.

11. The adhesion detection method according to claim 10, characterized in that, Determining the adhesion state of the target distribution switch based on the relative voltage difference of the voltage values ​​at the target voltage acquisition points of the target distribution switch includes: Under the third adhesion detection condition, the adhesion state of the first transistor is determined based on the first relative voltage difference, wherein the first transistor is the transistor connected to the first power supply side among the two transistors. And / or, when the first transistor has a disconnection and sticking fault, under the third sticking detection condition, the sticking state of the second transistor is determined based on the second relative voltage difference, wherein the second transistor is the transistor among the two transistors connected to the second power supply side; And / or, when the first transistor does not have a disconnection / adhesion fault, under the fourth adhesion detection condition, the adhesion state of the second transistor is determined based on the second relative voltage difference, wherein the second transistor is the transistor among the two transistors connected to the second power supply side.

12. The adhesion detection method according to claim 11, characterized in that, Determining the sticking state of the first transistor based on the first relative voltage difference includes: when the first relative voltage difference is less than or equal to the third voltage deviation threshold, the first transistor has a disconnection and sticking fault; or when the first relative voltage difference is greater than the third voltage deviation threshold, the disconnection protection mechanism of the first transistor is normal. And / or, determining the sticking state of the second transistor based on the second relative voltage difference includes: when the second relative voltage difference is less than or equal to a fourth voltage deviation threshold, the second transistor has a disconnection and sticking fault; or, when the second relative voltage difference is the voltage drop of the body diode of the second transistor, the disconnection protection mechanism of the second transistor is normal.

13. The adhesion detection method according to claim 11, characterized in that, The third adhesion detection condition includes the power supply system entering the OFF power mode and both transistors being in the off state, or the third adhesion detection condition includes the power supply system entering the OFF power mode and both transistors being in the off state and the voltage difference between the first power supply side and the second power supply side being greater than the fifth voltage deviation threshold. And / or, the fourth adhesion detection condition includes the power supply system entering OFF power mode and the first transistor being closed and the second transistor being open, or the fourth adhesion detection condition includes the power supply system entering OFF power mode and the first transistor being closed and the second transistor being open, and the voltage difference between the first power supply side and the second power supply side being greater than the fifth voltage deviation threshold.

14. An intelligent power distribution module, characterized in that, include: Multiple power distribution switch assemblies are provided, which are adapted to be distributed in multiple power distribution networks. Each power distribution switch assembly includes at least one first-type power distribution switch and / or at least one second-type power distribution switch. The first-type power distribution switch is adapted to be connected between the power supply side of the power supply system and a non-electrical load. The first end of the second-type power distribution switch is adapted to be connected between the power supply side of the power supply system and a constant-electrical load. The power supply side of the power supply system includes a first power supply side and a second power supply side. A bypass module, wherein the first end of the bypass module is connected to the load side of each of the second type of power distribution switches, and the second end of the bypass module is connected to the second power supply side; The third type of power distribution switch is adapted to be installed between multiple power distribution networks and is also connected between the first power supply side and the second power supply side. The third type of power distribution switch includes at least one transistor group, and each transistor group includes two transistor units arranged back to back.

15. An electrical appliance, characterized in that, The electrical equipment is used to implement the adhesion detection method according to any one of claims 1-13, or the electrical equipment includes the intelligent power distribution module according to claim 14.

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