Heat dissipation plate, terminal equipment and preparation method

Abstract

The invention relates to a heat dissipation plate, terminal equipment and a preparation method. The heat dissipation plate comprises a first cover plate and a second cover plate which are oppositely arranged, a sealed working medium phase change space is formed between the first cover plate and the second cover plate, and the working medium phase change space is filled with a working medium; the blocking part is located in the working medium phase change space, connected with the first cover plate and the second cover plate and used for dividing the working medium phase change space into a first phase change area and a second phase change area which are arranged in parallel; the first phase change area is used for allowing the liquid working medium to circulate; the second phase change area is used for allowing the vapor-state working medium to circulate; wherein the material of the first cover plate and / or the material of the second cover plate comprise at least two different materials. The heat dissipation plate is provided with the space for working media in different states to circulate, so that the heat dissipation plate has efficient heat dissipation performance; and the heat dissipation plate is made of at least two different materials, so that the preparation flexibility is realized.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation plate and terminal device, and a method for its preparation. Background Technology

[0002] With the rapid development of microelectronics technology and the information industry, mobile phones, tablets and other terminal devices have gradually become the mainstream devices used in daily life. In the use of these terminal devices, the pursuit of functional effects will lead to a significant increase in device temperature. For example, the pursuit of high frame rate and high performance in mobile games will lead to high power consumption and high temperature of the phone, which seriously affects the user experience of mobile phones and other terminal devices.

[0003] In related technologies, heat sinks can be installed in terminal devices to conduct heat released by the heat-generating components in the terminal devices, thereby achieving effective heat dissipation of the terminal devices. However, the heat sinks installed in related technologies are all made of a single material, which has poor flexibility. Due to the limitations of the single material, there are also a series of problems such as cost-effectiveness and thinness. Furthermore, in current heat sinks, steam and liquid working fluids share the same cavity and flow in opposite directions at high speed. There is a carrying effect between them, which hinders each other, resulting in poor heat dissipation effect of the heat sink. Summary of the Invention

[0004] To overcome the problems existing in related technologies, this disclosure provides a heat sink, a terminal device, and a manufacturing method. The heat sink of this disclosure has space for the flow of working fluids in different states, thus possessing high-efficiency heat dissipation performance; and the heat sink is formed from at least two different materials, thus providing manufacturing flexibility.

[0005] According to a first aspect of the present disclosure, a heat sink is provided, the heat sink comprising:

[0006] A first cover plate and a second cover plate are arranged opposite to each other, and a sealed working fluid phase change space is formed between the first cover plate and the second cover plate, and the working fluid phase change space is filled with working fluid;

[0007] A blocking section, located within the working fluid phase change space and connected to the first cover plate and the second cover plate respectively, is used to divide the working fluid phase change space into a first phase change region and a second phase change region arranged in parallel; the first phase change region is used for the flow of the liquid working fluid; the second phase change region is used for the flow of the vapor working fluid.

[0008] The material of the first cover plate and / or the material of the second cover plate includes at least two different materials.

[0009] In some embodiments, the first cover plate includes a first aluminum layer and a first copper layer, and the second cover plate includes a second aluminum layer and a second copper layer;

[0010] The working fluid phase transition space is enclosed by the first copper layer and the second copper layer;

[0011] The first aluminum layer covers the first copper layer;

[0012] The second aluminum layer covers the second copper layer.

[0013] In some embodiments, the heat sink further includes:

[0014] The first capillary layer is located in the first phase transition region;

[0015] The second capillary layer is located in the second phase transition region;

[0016] The thickness of the first capillary layer is greater than the thickness of the second capillary layer.

[0017] In some embodiments, the first capillary layer and the second capillary layer are disposed on the surface of the second cover plate facing the first cover plate;

[0018] or,

[0019] The first capillary layer and the second capillary layer are formed by etching the surface of the second cover plate facing the first cover plate.

[0020] In some embodiments, the heat sink further includes a plurality of support columns;

[0021] The multiple support columns are spaced apart within the working fluid phase change space and are spaced apart from the blocking part;

[0022] One end of the support column is connected to the first cover plate, and the other end is connected to the first capillary layer and the second capillary layer. The support column is used to support the working fluid phase change space.

[0023] In some embodiments, the materials of both the first capillary layer and the second capillary layer include metallic materials.

[0024] In some embodiments, the working fluid phase change space has a first side and a second side disposed opposite to each other;

[0025] The blocking portion is located between the first side and the second side, and the extending direction of the blocking portion is the same as the extending direction of both the first side and the second side.

[0026] Wherein, the extension length of the blocking portion is less than the extension length of the first side and the extension length of the second side; the first phase transition region is formed at least by the region between the blocking portion and the first side; the second phase transition region is formed at least by the region between the blocking portion and the second side.

[0027] In some embodiments, the distance between the blocking portion and the first side is less than the distance between the blocking portion and the second side.

[0028] In some embodiments, the outer edge of the first cover plate is welded to the outer edge of the second cover plate.

[0029] In some embodiments, the heat sink further has a liquid injection port, which is located at the connection between the outer edge of the first cover plate and the outer edge of the second cover plate, and communicates with the working fluid phase change space to guide the working fluid into the working fluid phase change space.

[0030] In some embodiments, the thickness of the heat sink is between 0.2 mm and 1 mm.

[0031] In some embodiments, the working medium includes water, an ethanol solution, or a fluorinated liquid.

[0032] According to a second aspect of the present disclosure, a terminal device is provided, the terminal device comprising:

[0033] A middle frame, on which a heating element is disposed;

[0034] The heat sink provided in any of the embodiments of the first aspect above; the heat sink is located between the heat-generating component and the middle frame, or the heat sink and the heat-generating component are located on opposite sides of the middle frame;

[0035] The second phase change region of the heat sink is aligned with the heat-generating component.

[0036] In some embodiments, the heat sink is attached to the middle frame, or the heat sink overlaps the middle frame.

[0037] According to a third aspect of the present disclosure, a method for preparing the heat sink plate proposed in the first aspect is provided, the method comprising:

[0038] A first cover plate and a second cover plate are obtained based on at least two different materials and a rolling process.

[0039] A blocking portion is formed on the first cover plate;

[0040] Injection ports are formed at the outer edges of the first cover plate and the second cover plate;

[0041] Align the first cover plate and the second cover plate, and weld the outer edge of the first cover plate to the outer edge of the second cover plate to form a working fluid phase change space; wherein, the blocking part divides the working fluid phase change space into a first phase change region and a second phase change region arranged in parallel;

[0042] The working fluid is injected into the working fluid phase change space through the injection port, and the injection port is sealed to obtain the heat sink.

[0043] In some embodiments, forming a blocking portion on the first cover plate includes:

[0044] The first cover plate is etched to form the blocking portion; or the first cover plate is stamped to form the blocking portion.

[0045] In some embodiments, the method further includes:

[0046] A target area is defined on the connecting surface of the second cover plate; wherein, when aligning the first cover plate and the second cover plate, the connecting surface of the second cover plate faces the first cover plate, and the target area is aligned with the blocking portion;

[0047] A first capillary layer and a second capillary layer are formed on opposite sides of the target area on the connecting surface of the second cover plate, respectively.

[0048] The first capillary layer is located in the first phase transition region, the second capillary layer is located in the second phase transition region, and the thickness of the first capillary layer is greater than the thickness of the second capillary layer.

[0049] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0050] The heat sink proposed in this embodiment has a blocking portion that divides the working fluid phase change space formed by the first cover plate and the second cover plate into different phase change regions. This achieves effective isolation and flow between working fluids in different states within the heat sink, mitigating the adverse effects of mutual carryover and convection between working fluids in different phase change states on heat dissipation and improving the heat sink's efficient heat conduction performance. Simultaneously, because the blocking portion connects the first cover plate and the second cover plate respectively, the working fluid phase change space is divided into a first phase change region and a second phase change region arranged longitudinally side-by-side. This reduces the thickness of the heat sink itself, achieving a thinner and lighter design. Furthermore, both the first cover plate and the second cover plate can be made of two different materials, allowing for consideration of material selection and manufacturing from multiple perspectives, such as thinness and economy, effectively improving the flexibility and practicality of heat sink fabrication.

[0051] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0052] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0053] Figure 1 This is a schematic diagram of the structure of a first cover plate according to an exemplary embodiment. Figure 1 ;

[0054] Figure 2 This is a schematic diagram of the structure of a second cover plate according to an exemplary embodiment;

[0055] Figure 3 This is a schematic diagram of a heat sink according to an exemplary embodiment;

[0056] Figure 4 This is a schematic diagram of the structure of a first cover plate according to an exemplary embodiment. Figure 2 ;

[0057] Figure 5 This is a schematic diagram of the heat dissipation direction of a terminal device in related technologies;

[0058] Figure 6 This is a schematic diagram showing the placement of a heat sink in a related technology.

[0059] Figure 7 It is a schematic diagram illustrating the principle of working fluid circulation in related technologies;

[0060] Figure 8 This is a schematic diagram illustrating a working fluid flow path according to an exemplary embodiment;

[0061] Figure 9 This is a schematic cross-sectional view of a working fluid phase transition space according to an exemplary embodiment;

[0062] Figure 10 This is a schematic diagram of the structure of a terminal device according to an exemplary embodiment. Figure 1 ;

[0063] Figure 11 This is a schematic flowchart illustrating a preparation method according to an exemplary embodiment;

[0064] Figure 12 This is a schematic diagram illustrating the principle of manufacturing a first cover plate and a second cover plate according to an exemplary embodiment;

[0065] Figure 13 This is a schematic diagram of the structure of a terminal device according to an exemplary embodiment. Figure 2 ;

[0066] Figure 14 This is a structural block diagram of a terminal device according to an exemplary embodiment. Detailed Implementation

[0067] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0068] See Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a first cover plate according to an exemplary embodiment. Figure 1 ; Figure 2 This is a schematic diagram of the structure of a second cover plate according to an exemplary embodiment; Figure 3 This is a schematic diagram of a heat sink according to an exemplary embodiment.

[0069] Combination Figures 1 to 3 As shown, the heat sink 1 proposed in this embodiment includes:

[0070] The first cover plate 11 and the second cover plate 12 are arranged opposite to each other, and a sealed working fluid phase change space 13 is formed between the first cover plate 11 and the second cover plate 12. The working fluid phase change space 13 is filled with working fluid.

[0071] The blocking part 14 is located in the working fluid phase change space 13 and is connected to the first cover plate 11 and the second cover plate 12 respectively. It is used to divide the working fluid phase change space 13 into a first phase change region 131 and a second phase change region 132 arranged in parallel. The first phase change region 131 is used for the flow of liquid working fluid. The second phase change region 132 is used for the flow of vapor working fluid.

[0072] The materials of the first cover plate 11 and / or the second cover plate 12 include at least two different materials.

[0073] The heat sink proposed in this embodiment is disposed in a terminal device, and the second phase change region of the heat sink is disposed close to the main heat-generating component in the terminal device. The heat sink absorbs the heat released by the heat-generating component through the vaporization of the working fluid in the second phase change region, and liquefies it through the flow of the working fluid to the first phase change region, so that the heat can diffuse to a more distant location, thereby improving the heat dissipation performance and user experience of the terminal device.

[0074] Here, the terminal device where the aforementioned heat sink is located includes a fixed terminal, a mobile terminal, or a portable device; a fixed terminal includes, but is not limited to, vehicle-mounted terminals; a mobile terminal includes, but is not limited to, mobile phones, tablets, etc.; and a portable device includes, but is not limited to, smartwatches, etc. This disclosure does not impose further limitations on these aspects.

[0075] In this embodiment of the present disclosure, the first cover plate and the second cover plate are arranged opposite to each other and stacked. Thus, in this embodiment of the present disclosure, the first cover plate and the second cover plate can be fixedly connected so that the first cover plate and the second cover plate enclose a sealed working fluid phase change space.

[0076] In some examples, embodiments of this disclosure may set the size of the first cover plate to be smaller than the size of the second cover plate, so that the first cover plate can cover the second cover plate and form a gap area between them. The outer periphery of the gap area is then sealed with a sealant. This not only achieves a fixed connection between the first cover plate and the second cover plate, but also forms a sealed working fluid phase change space between the first cover plate and the second cover plate.

[0077] In other examples, embodiments of this disclosure may also be provided with the first cover plate and the second cover plate having the same and symmetrical shape. In this way, after aligning the first cover plate and the second cover plate, the edges of the first cover plate and the second cover plate can be directly sealed and fixed, thereby forming a sealed working fluid phase change space between the first cover plate and the second cover plate.

[0078] Taking the matching shapes of the first and second cover plates as an example, the shapes of the first and second cover plates can be set as needed; for example, both the first and second cover plates can be set as regular shapes such as rectangles and squares, or they can both be set as irregular shapes to avoid interference with other devices in the terminal equipment. For example, combined with Figures 1 to 3 As shown, both the first cover plate 11 and the second cover plate 12 are irregular shapes.

[0079] In some embodiments, the outer edge of the first cover plate is welded to the outer edge of the second cover plate.

[0080] Here, when the first cover plate and the second cover plate have the same shape and are symmetrical, the embodiments of this disclosure can provide sealing areas on the outer edges of both the first cover plate and the second cover plate, and the size and position of the two sealing areas are also the same. In this way, after aligning the first cover plate and the second cover plate, the two sealing areas can be welded to achieve a fixed connection between the first cover plate and the second cover plate and form an edge-sealed working fluid phase change space.

[0081] See Figure 4 , Figure 4 This is a schematic diagram of the structure of a first cover plate according to an exemplary embodiment. Figure 2 It should be noted that, Figure 1 and Figure 4 The two opposite surfaces of the first cover plate are shown, in which Figure 1 The connecting surface of the first cover plate is shown, that is, the surface facing the second cover plate in the molded heat sink. Figure 4 The non-connecting surface of the first cover plate is shown, i.e., the surface in the molded heat sink that is away from the second cover plate. Here Figures 2 to 4 The edge sealing area S is shown in both cases.

[0082] It should be noted that the welding method for the edge sealing area described above can be any one of diffusion welding, brazing, resistance welding, ultrasonic welding, friction welding, or laser welding, and this disclosure does not limit this method.

[0083] In this embodiment, the first cover plate and the second cover plate can be made of the same or different materials. Here, heat sinks in related technologies are typically made of a single material, generally copper or aluminum. Because copper has a high density, copper heat sinks are difficult to adapt to requirements such as light weight and small size, making it impossible to achieve a thin and light design. Aluminum heat sinks are difficult to encapsulate and have high manufacturing costs, affecting their practicality. Therefore, this embodiment can provide at least one of the first and second cover plates, formed from at least two different materials. In actual material selection, a combination of materials with low manufacturing cost, low density, good thermal conductivity, and high chemical inertness (no chemical reaction with the working fluid, or minimal chemical reaction) is chosen to manufacture the cover plate.

[0084] Among them, at least two different materials can be a combination of copper and aluminum, a combination of copper and steel, or a combination of copper, aluminum and carbon, etc., and this disclosure does not limit this; thus, by setting the materials of the first cover plate and the second cover plate to include at least two different materials, it is possible to make a more suitable and practical heat sink from many aspects such as economy, thinness, improved thermal conductivity, and increased service life, thereby improving many problems of heat sinks made of a single material and enhancing the flexibility of heat sink manufacturing.

[0085] It should be noted that the working fluid is filled in the working fluid phase change space formed between the first cover plate and the second cover plate. The working fluid can conduct heat through phase change, thereby realizing the heat dissipation function of the heat sink.

[0086] See Figures 5 to 7 ,in, Figure 5 This is a schematic diagram of the heat dissipation direction of a terminal device in related technologies; Figure 6 This is a schematic diagram showing the placement of a heat sink in a related technology. Figure 7 This is a schematic diagram illustrating the principle of working fluid circulation in related technologies. For example, Figures 5 to 7 As shown, the heat source area of ​​current terminal devices is mainly concentrated in the motherboard area, and heat is often conducted to the battery compartment and small board area through some highly thermally conductive materials or components such as graphite, heat pipes, and ultra-thin vapor chambers (VCs). However, in current ultra-thin VCs, such as... Figure 7As shown, the working fluids of steam and liquid share the same cavity and flow in opposite directions at high speed, resulting in a carrying effect between them and mutual obstruction. The thinner the thickness, the larger the area, and the greater the load, the stronger the carrying effect, which severely limits the heat and temperature uniformity of ultrathin VC.

[0087] Thus, in this embodiment of the present disclosure, a blocking part is provided between the first cover plate and the second cover plate. The blocking part divides the phase change space of the working fluid and reduces the contact area and convection of the gaseous working fluid and the liquid working fluid to a certain extent, thereby improving the effectiveness of liquefaction and vaporization of the working fluid in different areas and improving the heat conduction effect of the heat sink.

[0088] Here, the blocking portion of the present disclosure embodiment can be formed on the first cover plate or the second cover plate, and extend to be connected to another cover plate. In this way, the blocking portion can divide the working fluid phase change space between the first cover plate and the second cover plate into two regions that are longitudinally distributed and arranged in parallel: the first phase change region and the second phase change region.

[0089] In practical implementation, different liquid-absorbing cores, such as liquid-absorbing cores of different materials or liquid-washing cores of different areas, can be filled in the first phase change region and the second phase change region respectively to support the flow of gaseous working fluid in the second phase change region and support the storage and flow of liquid working fluid in the first phase change region.

[0090] It is understandable that, because one end of the blocking part is connected to the first cover plate and the other end of the extension is connected to the second cover plate, the thickness of the first phase change region and the second phase change region formed by the blocking part is the same as or similar to the thickness of the entire working fluid phase change space. Compared with two phase change regions distributed laterally (i.e., one phase change region can be laid flat and close to the first cover plate, and the other phase change region can be laid flat and close to the second cover plate), the flow path of the working fluid in different phase change states in their respective phase change regions is longer, which can better realize heat conduction. At the same time, setting the first phase change region and the second phase change region in a vertical distribution and parallel arrangement can effectively reduce the thickness of the entire heat sink compared with two phase change regions distributed laterally, and improve the thin and light design of the heat sink.

[0091] Here, the blocking portion in this embodiment may be formed by stamping the connecting surface of the first cover plate, or by etching the non-connecting surface of the first cover plate toward the connecting surface. In this example, when the heat sink is disposed inside the terminal device, the non-connecting surface of the second cover plate is close to the heat-generating component, the connecting surface of the second cover plate is away from the heat-generating component, and the second cover plate is disposed on the side of the first cover plate away from the heat-generating component.

[0092] It should be noted that the connection between the first phase change region and the second phase change region is partially blocked by the blocking part and partially connected, with the connected parts located at opposite ends of the blocking part, including, for example... Figure 3 The first connected position 151 and the second connected position 152 are shown.

[0093] In this design, when the heat sink is installed within the terminal device, the heating element is positioned in the second phase change region away from the first connecting position. Thus, after the working fluid absorbs heat released by the heating element and vaporizes in the second phase change region, it flows towards the distant first connecting position due to the obstruction effect of the blocking part and the guiding effect of the wick within the second phase change region, conducting and dissipating heat during this flow. Meanwhile, the working fluid undergoes a liquefaction phase change upon entering the first phase change region at the first connecting position. The liquid working fluid can be stored in the first phase change region, or, based on the obstruction effect of the blocking part and the guiding effect of the wick within the first phase change region, it can flow towards the second connecting position at the other end, allowing the liquid working fluid to flow back to the second phase change region through the second connecting position, completing one phase change cycle of the working fluid. Through this phase change cycle of the working fluid in the heat sink, heat dissipation is effectively achieved.

[0094] The heat sink proposed in this embodiment has a blocking portion that divides the working fluid phase change space formed by the first cover plate and the second cover plate into different phase change regions. This achieves effective isolation and flow between working fluids in different states within the heat sink, mitigating the adverse effects of mutual carryover and convection between working fluids in different phase change states on heat dissipation and improving the heat sink's efficient heat conduction performance. Simultaneously, because the blocking portion connects the first cover plate and the second cover plate respectively, the working fluid phase change space is divided into a first phase change region and a second phase change region arranged longitudinally side-by-side. This reduces the thickness of the heat sink itself, achieving a thinner and lighter design. Furthermore, both the first cover plate and the second cover plate can be made of two different materials, allowing for consideration of material selection and manufacturing from multiple perspectives, such as thinness and economy, effectively improving the flexibility and practicality of heat sink fabrication.

[0095] In some embodiments, at least two different materials include metallic materials and non-metallic materials; wherein the metallic materials include at least one of the following: copper, aluminum, iron, and titanium.

[0096] Here, the materials of the first cover plate and the second cover plate can both be composite materials formed from a metal and a non-metal; the metal material can be copper, aluminum, iron, titanium, etc.; the non-metal material can be silicon, sulfur, carbon, etc. For example, the materials of the first cover plate and the second cover plate can be steel, which is formed from iron and carbon; thus, the first cover plate and the second cover plate can be obtained by cutting, stamping and other processes from a sheet made of composite material.

[0097] The materials of the first cover plate and the second cover plate can also be metal alloys formed from various metal materials, such as copper alloys, aluminum alloys, titanium alloys, etc. Thus, the first cover plate and the second cover plate can be obtained by cutting, stamping, and other processes from sheet metal made of metal alloy materials.

[0098] Of course, in this embodiment, the first cover plate and the second cover plate can also be composite plates obtained by stacking different material layers; for example, the first cover plate is formed by stacking copper alloy layers and aluminum alloy layers, and the second cover plate is formed by stacking copper layers and silicon layers. Of course, the first cover plate and the second cover plate are not limited to copper-aluminum double-layer composite plates, but can also be double-layer or multi-layer composite plates formed of copper alloys, aluminum alloys, steel, titanium alloys, non-metallic materials, etc.

[0099] The embodiments disclosed herein utilize at least two types of materials, namely metallic and non-metallic materials, to form the first or second cover plate, thereby enhancing the diversity and flexibility of heat sink design and providing design possibilities for achieving thinner and lighter heat sinks at an economical cost.

[0100] In some embodiments, the first cover plate includes a first aluminum layer and a first copper layer, and the second cover plate includes a second aluminum layer and a second copper layer;

[0101] The working fluid phase transition space is enclosed by the first copper layer and the second copper layer;

[0102] The first aluminum layer covers the first copper layer;

[0103] The second aluminum layer covers the second copper layer.

[0104] In this embodiment, both the first cover plate and the second cover plate are formed of a copper layer and an aluminum layer. The first copper layer is located on the connecting surface of the first cover plate (facing the surface of the second cover plate), and the first aluminum layer covers the first copper layer and is located on the non-connecting surface of the first cover plate (away from the surface of the second cover plate). The second copper layer is located on the connecting surface of the second cover plate (facing the surface of the first cover plate), and the second aluminum layer covers the second copper layer and is located on the non-connecting surface of the second cover plate (away from the surface of the first cover plate).

[0105] In this embodiment of the disclosure, the copper layer can also be a copper alloy layer, and the aluminum layer can also be an aluminum alloy layer.

[0106] Thus, since the connecting surfaces of the first and second cover plates together enclose the working fluid phase change space, serving as the inner wall of this space, and given copper's high thermal conductivity and good chemical inertness (it does not chemically react with working fluids such as water and ethanol), the above design effectively improves the thermal conductivity and heat dissipation performance of the heat sink. Furthermore, since both the first and second cover plates are formed of copper and aluminum layers, this design overcomes the problems of heavy weight of heat sinks made of a single material (copper) and poor heat transfer performance, difficult manufacturing, and high cost of heat sinks made of a single material (aluminum). It effectively achieves a lightweight design for the heat sink, improves heat dissipation, and reduces manufacturing costs.

[0107] In some embodiments, see Figure 2 and Figure 3 The heat sink 1 also includes:

[0108] The first capillary layer 161 is located in the first phase transition region 131;

[0109] The second capillary layer 162 is located in the second phase transition region 132;

[0110] The thickness of the first capillary layer 161 is greater than the thickness of the second capillary layer 162.

[0111] Here, both the first and second capillary layers can serve as the liquid-absorbing cores mentioned above. Both the first and second capillary layers are capillary structures, capable of guiding the flow of the working fluid through capillary action.

[0112] See Figure 8 , Figure 8 This is a schematic diagram illustrating a working fluid flow path according to an exemplary embodiment; it should be noted that... Figure 8 The diagram shows the connecting surface of the first cover plate 11. The right side of the blocking portion 14 serves as a surface of the second phase change region, and the left side of the blocking portion serves as a surface of the first phase change region. Here, the portion of the second phase change region furthest from the first connecting position 151 is closer to the heating element, i.e., closer to the heat source. Therefore, within the second phase change region, the second capillary layer maintains the liquid level through the liquid column effect and propels the heat-absorbing vaporized working fluid to flow towards the first connecting position 151 (i.e., along...). Figure 8 The steam path A is shown. In the first phase change region, the vapor working fluid liquefies at a pressure lower than the saturated vapor pressure. Since the liquefied liquid working fluid maintains a certain liquid level in the first capillary layer, the first capillary layer can guide the liquid working fluid to flow towards the second connecting position 152 (i.e., along...). Figure 8 The return water path B is shown.

[0113] In this embodiment, the thickness of the first capillary layer is set to be greater than that of the second capillary layer, which can make the adsorption force of the first phase change region on the liquid working fluid better. Therefore, when the heat sink is not working, the liquid working fluid can be stored in the first capillary layer. When the heat sink is working, the first capillary layer can also more effectively guide the liquid working fluid back to the second phase change region, thereby improving the smoothness of the working fluid circulation.

[0114] It should be noted that the materials of the first capillary layer and the second capillary layer in the embodiments of this disclosure can be the same or different, and the embodiments of this disclosure do not impose any restrictions on this.

[0115] This embodiment of the present disclosure provides a first capillary layer in a first phase change region and a second capillary layer in a second phase change region, wherein the thickness of the first capillary layer is greater than the thickness of the second capillary layer. This effectively improves the smoothness of the working fluid circulation and thus enhances the heat dissipation performance of the heat sink.

[0116] In some embodiments, the first capillary layer and the second capillary layer are disposed on the surface of the second cover plate facing the first cover plate;

[0117] or,

[0118] The first capillary layer and the second capillary layer are formed by etching the surface of the second cover plate toward the first cover plate.

[0119] Here, the present disclosure forms the first capillary layer and the second capillary layer on the connecting surface of the second cover plate, that is, in the molded heat sink, with the surface of the second cover plate facing the first cover plate. It should be noted that before forming the capillary structure, a target area is also defined on the connecting surface of the second cover plate. This target area is used to fit and match with the blocking part when the first cover plate and the second cover plate are aligned and welded together. Thus, in the embodiment of the present disclosure, the first capillary layer and the second capillary layer are formed on opposite sides of the target area on the connecting surface of the second cover plate, so that the first capillary layer and the second capillary layer can be located in the first phase change region and the second phase change region in the molded heat sink, respectively.

[0120] In this embodiment, the first capillary layer and the second capillary layer are formed on the connecting surface of the second cover plate. Specifically, this can be achieved by superimposing capillary structures on the connecting surface of the second cover plate, or by performing a process on the connecting surface of the second cover plate.

[0121] In some examples, on the connecting surface of the second cover plate, on opposite sides of the target area, a mesh-laying and sintering process is performed to obtain a mesh capillary structure; or a powder brushing and capillary sintering process is performed to obtain a powder sintered capillary structure or a foam-like capillary structure; wherein, the capillary structure obtained on opposite sides of the target area is a first capillary layer and a second capillary layer superimposed on the connecting surface of the second cover plate; in other examples, trench etching processes of different depths are performed on opposite sides of the target area on the connecting surface of the second cover plate to form a first capillary layer and a second capillary layer of a trench capillary structure.

[0122] The embodiments disclosed herein can form a first capillary layer and a second capillary layer on the surface of the second cover plate in different ways, thereby improving the flexibility and versatility of fabricating capillary structures.

[0123] In some embodiments, the materials of the first capillary layer and the second capillary layer both include metallic materials.

[0124] Here, the capillary structure of the metal material can be a single metal, or a metal oxide, metal alloy, etc.; among which, the aforementioned metal materials include copper, aluminum, steel, or titanium alloys, etc.

[0125] In some examples of this disclosure, a metal mesh or metal powder can be laid on the surface of the second cover plate facing the first cover plate and then sintered to obtain a first capillary layer and a second capillary layer of metal material. Thus, the first capillary layer and the second capillary layer can be a composite capillary structure composed of any one or more of metal mesh capillary, metal powder sintering capillary, and foam metal capillary.

[0126] In other examples of this disclosure, the surface of the second cover plate facing the first cover plate is set as a copper layer (or other metal layer, of course). This disclosure obtains the etched trench capillary structure of the metal material by performing trench etching on this surface of the second cover plate.

[0127] It should be noted that the materials and structural forms of the first capillary layer and the second capillary layer can be the same or different, and this disclosure does not impose any limitations on this. For example, because the thickness of the first capillary layer is greater than the thickness of the second capillary layer, the first capillary layer can be a double-layer metal mesh structure, and the second capillary layer can be a single-layer metal mesh structure.

[0128] Thus, due to the good thermal conductivity and machinability of metallic materials, the efficient heat conduction and dissipation performance of capillary structures in heat sinks is improved.

[0129] In other embodiments of this disclosure, the materials of the first capillary layer and the second capillary layer can also be non-metallic materials, such as some polymer materials. These polymer materials can be carbon fiber, graphite, ceramic fiber, etc., and this disclosure does not limit the specific materials used.

[0130] In some embodiments, the heat sink further includes a plurality of support columns;

[0131] Multiple support columns are spaced apart within the working fluid phase change space and are spaced apart from the blocking part;

[0132] One end of the support column is connected to the first cover plate, and the other end is connected to the first capillary layer and the second capillary layer. The support column is used to support the working fluid phase change space.

[0133] See Figure 9 , Figure 9 This is a schematic cross-sectional view of a working fluid phase transition space according to an exemplary embodiment; combined with Figure 1 and Figure 9 As shown, the support column 17 is disposed on the first cover plate 11, and the other end is connected to the capillary structure (corresponding to...). Figure 2 and Figure 3 The first capillary layer 161 and the second capillary layer 162 shown); and the support column 17 and the blocking part ( Figure 9 (Not shown) are spaced apart on the connecting surface of the first cover plate 11.

[0134] In this structure, one end of each of the multiple support columns is attached to the first cover plate, for example, by welding, bonding, or by forming an integral structure with the first cover plate. The support columns extend away from the connection surface of the first cover plate, and in the formed heat dissipation plate, the other end of the support column contacts the first capillary layer and the second capillary layer to support the second cover plate.

[0135] In this embodiment, the multiple support columns can be evenly distributed; and one end of some support columns is connected to the first cover plate and the other end is connected to the first capillary layer, i.e., they are distributed in the first phase change region; another part of the support columns is connected to the first cover plate and the other end is connected to the second capillary layer, i.e., they are distributed in the second phase change region; in this way, the multiple support columns can uniformly support the entire working fluid phase change space, ensuring the structural stability of the heat sink.

[0136] In some embodiments, the working fluid phase change space has a first side and a second side disposed opposite to each other;

[0137] The blocking part is located between the first side and the second side, and the extending direction of the blocking part is the same as the extending direction of the first side and the extending direction of the second side.

[0138] Wherein, the extension length of the blocking portion is less than the extension length of the first side and the extension length of the second side; the first phase change region is formed by at least the region between the blocking portion and the first side; the second phase change region is formed by at least the region between the blocking portion and the second side.

[0139] Here, the working fluid phase change space has two oppositely arranged sides. The blocking part extends in the same direction as the sides and is spaced apart from both sides. See also... Figure 2 and Figure 3 The extension direction of the blocking part 14, the extension direction of the first side and the second side are both the length direction h of the heat sink 1. Because the extension length of the blocking part 14 is less than the length of the side of the working fluid phase change space 13, the first connecting position 151 and the second connecting position 152 can be formed at the opposite ends of the blocking part 14.

[0140] In some examples of this disclosure, the region between the blocking portion and the first side forms a first phase transition region; the region between the blocking portion and the second side, the region between the second connecting position and the first side and the second side respectively, and the region between the first connecting position and the first side and the second side respectively, together form a second phase transition region. In other examples of this disclosure, the region between the blocking portion and the first side, and the region between the second connecting position and the first side, are used together to form the first phase transition region; the region between the blocking portion and the second side, the region between the second connecting position and the second side, and the region between the first connecting position and the first side and the second side respectively, are used together to form the second phase transition region, such as... Figure 2 and Figure 3 The structure shown is illustrated. In other examples of this disclosure, the blocking portion, the first connecting position, and the second connecting position, together with the area between the first side, form a first phase transition region; the blocking portion, the first connecting position, and the second connecting position, together with the area between the second side, form a second phase transition region.

[0141] It should be noted that the first capillary layer completely covers the bottom of the first phase transition region, and the second capillary layer completely covers the bottom of the second phase transition region. When the first phase transition region and the second phase transition region are in the form of any of the above examples, the dimensions of the first capillary layer and the second capillary layer are also adapted accordingly.

[0142] It is understandable that, because the first and second sides of the blocking part and the working fluid phase change space extend in the same direction and have a shorter extension length, the working phase change space can be divided into two different areas that are arranged in parallel (rather than side by side), reducing the overall thickness of the heat sink. It can also reserve a connection position to achieve effective flow of the working fluid and ensure the effectiveness of the working fluid phase change and circulation.

[0143] In some embodiments, the distance between the blocking portion and the first side is less than the distance between the blocking portion and the second side.

[0144] Here, the distance between the blocking part and the first side is smaller than the distance between the blocking part and the second side, meaning the volume of the first phase change region is smaller than the volume of the second phase change region. This allows the working fluid to fully evaporate and vaporize in the second phase change region, improving heat dissipation effectiveness. Furthermore, because liquid molecules are more condensed, they can circulate and be stored in the smaller first phase change region, thus ensuring the effectiveness of the working fluid circulation within the heat sink and the rationality of the structural design.

[0145] In some embodiments, such as Figure 1 and 3 As shown, the heat sink 1 also has a liquid injection port 18, which is located at the connection between the outer edge of the first cover plate 11 and the outer edge of the second cover plate 12, and is connected to the working fluid phase change space 13, for guiding the working fluid into the working fluid phase change space 13.

[0146] Here, the liquid injection port 18 of the heat sink 1 is located on the sealing area S of the first cover plate 11 and the second cover plate 12, and is connected to a liquid injection pipe. The liquid injection pipe injects liquid working medium into the working medium phase change space 13 through the liquid injection port 18. The liquid working medium can be distributed throughout the entire working medium phase change space 13.

[0147] It should be noted that when the heat sink is not working, the liquid working fluid is stored in the first phase change region because the first capillary layer in the first phase change region is thicker. When the heat sink is working, the liquid working fluid inside is heated and vaporized, and it circulates internally in a state of gas-liquid exchange.

[0148] Thus, by providing an injection port, the present embodiment can effectively guide the working fluid into the heat sink to achieve the heat dissipation function of the heat sink.

[0149] In some embodiments, the thickness of the heat sink is between 0.2 mm and 1 mm.

[0150] Here, combined Figures 1 to 3 As shown, the lengths of the first cover plate 11 and the second cover plate 12 in the longitudinal direction h of the heat sink 1 are between 50 mm and 150 mm; the widths of the first cover plate 11 and the second cover plate 12 in the width direction c of the heat sink 1 are between 30 mm and 70 mm.

[0151] In this embodiment, the thickness of the heat sink is between 0.2 mm and 1 mm. Since the thickness of the heat sink is formed by the thickness of the first cover plate, the thickness of the second cover plate, and the thickness of the working fluid phase change space, this disclosure can provide a thin first cover plate and a thin second cover plate so that the thickness of the working fluid phase change space is between 0.1 mm and 0.9 mm, thereby enabling the working fluid to undergo effective phase change and circulation; wherein, the thickness of the first capillary layer and the second capillary layer in the working fluid phase change space is between 0.03 mm and 0.3 mm.

[0152] In this embodiment of the disclosure, the thickness of the heat sink is between 0.2mm and 1mm, which can meet the requirements of the heat sink design to be thin and light. This allows it to be used in terminal devices with small structural space utilization while meeting the heat dissipation effect, thus improving the practicality of the heat sink.

[0153] In some embodiments, the working medium includes water, an ethanol solution, or a fluorinated liquid.

[0154] Water has a high specific heat capacity, enabling it to carry more heat and thus effectively improving the heat dissipation efficiency of the heat sink. Furthermore, water is a readily available and low-cost liquid in nature, and it also has excellent environmental performance.

[0155] Ethanol solutions have a lower boiling point and can undergo phase transitions at lower temperatures, thereby increasing the rate of heat transfer. Furthermore, ethanol solutions have good chemical stability and are not prone to chemical reactions with the materials of the first and second cover plates.

[0156] Fluorinated liquids are insulating and chemically inert, and have excellent thermal conductivity, enabling them to conduct and diffuse heat during phase transitions.

[0157] Thus, the embodiments of this disclosure can be configured with different forms of working fluid, such as water, ethanol, or fluorinated liquid, which can effectively realize the phase change and flow of the working fluid in the heat sink, ensure the heat conduction and heat dissipation performance of the heat sink, and improve the design diversity and flexibility of the heat sink.

[0158] In other embodiments of this disclosure, the working fluid filled in the heat sink can also be acetone, low-melting-point metal, etc., and this disclosure does not limit this.

[0159] This disclosure also proposes a terminal device. See also Figure 10 , Figure 10 This is a schematic diagram of the structure of a terminal device according to an exemplary embodiment. Figure 1 The terminal device 2 includes:

[0160] The middle frame 21 has a heating element 22 mounted on it.

[0161] The heat sink 1 proposed in the above embodiment is located between the heat-generating component 22 and the middle frame 21, or the heat sink 1 and the heat-generating component 22 are located on opposite sides of the middle frame 21.

[0162] The second phase change region of the heat sink 1 is aligned with the heat-generating component 22.

[0163] Here, the second phase change region of the heat sink is aligned with the heating element in the thickness direction of the terminal device. The evaporation and vaporization of the working fluid in the second phase change region can carry away the heat released by the heating element, resulting in better heat dissipation. The heat sink can be flexibly positioned between the heating element and the middle frame, or on opposite sides of the middle frame, depending on the needs.

[0164] Combination Figure 10 As shown, the arrows indicate the heat conduction path. The heat-generating component 22 releases heat along the thickness direction of the terminal device 2, and with the help of the heat sink 1, the heat can be guided to a more distant location, such as to the battery component 23 of the terminal device 2.

[0165] It should be noted that the heat-generating component proposed in this embodiment may be a central processing unit, a system-on-a-chip, etc.

[0166] exist Figure 10 The terminal device 2 shown also includes a screen 24 and a back cover 25. Functional components and structures within the terminal device (such as the aforementioned mid-frame 21, heat sink 1, central processing unit, and battery assembly 23) are located between the screen 24 and the back cover 25. The terminal setup also includes the following components and structures: a heat dissipation structure 26 (e.g., foam and / or graphite sheet), a thermal interface assembly 27, a circuit board 28, and a shielding cover 29. The central processing unit, heat dissipation structure 26, thermal interface assembly 27, shielding cover 29, and circuit board 28 are located between the mid-frame 21 and the back cover 25, and are distributed in the top area of ​​the terminal device 2; the battery assembly 23 and some wireless charging components that may be installed in the terminal device are located between the mid-frame 21 and the back cover 25, and are distributed in the bottom area of ​​the terminal device 2.

[0167] This embodiment of the disclosure, by setting a heat sink in the terminal device, can quickly guide and dissipate the heat released by the central processing unit in the terminal device to a lower temperature location, thereby improving the user experience of the terminal device.

[0168] In some embodiments, the heat sink is attached to the middle frame or overlapped with the middle frame.

[0169] Here, in this embodiment, adhesive such as self-adhesive can be used to attach the heat sink to the middle frame; alternatively, the heat sink can be directly overlapped onto the middle frame and fixed using nearby components in the terminal device. Thus, this embodiment provides different installation methods for the heat sink in the terminal device, improving installation flexibility.

[0170] This disclosure also provides a preparation method for preparing the heat sink proposed in the above embodiments of this disclosure; see also Figure 11 , Figure 11 This is a schematic flowchart illustrating a preparation method according to an exemplary embodiment; wherein the preparation method includes:

[0171] S1101. Based on at least two different materials and a rolling process, a first cover plate and a second cover plate are obtained;

[0172] S1102, A blocking portion is formed on the first cover plate;

[0173] S1103. An injection port is formed at the outer edge of the first cover plate and the second cover plate;

[0174] S1104. Align the first cover plate and the second cover plate, and weld the outer edge of the first cover plate to the outer edge of the second cover plate to form a working fluid phase change space.

[0175] The blocking section divides the working fluid phase change space into a first phase change region and a second phase change region arranged in parallel.

[0176] S1105. Inject the working fluid into the phase change space through the injection port and seal the injection port to obtain the heat sink.

[0177] Here, S1101 to S1105 can be used to prepare the heat sink proposed in the above embodiments of this disclosure.

[0178] In S1101, the first cover plate and the second cover plate can be manufactured using either hot rolling or cold rolling processes. See [link to S1101] Figure 12 , Figure 12 This is a schematic diagram illustrating the principle of manufacturing a first cover plate and a second cover plate according to an exemplary embodiment; Figure 12Schematically shows the process of preparing the first cover plate and the second cover plate by a cold rolling process; specifically: First, prepare copper alloy and aluminum alloy strip materials, and use a four-high asynchronous rolling mill to roll the copper alloy strip material and the aluminum alloy strip material. In this process, the speeds of the rollers are set to V1 < V2, that is, the speed of the front roller is slower than that of the rear roller to achieve the deformation of the material; at the same time, differential temperature furnace cavities are used for isolation, specifically, after the rolling deformation zone, the material is heated by a differential temperature inert gas heating furnace. The differential temperature furnace has the function of preventing the material to be heated from oxidizing, so that the material will not oxidize during the heating process. After going through the above stages, the heated strip material enters the stamping process for stamping; the stamped sheet is sheared by a shearing machine based on the size and shape of the required heat dissipation plate; then the sheared sheet is leveled by a leveling finishing roller; and a multi-directional bending and micro-spinning process is used to perform multi-directional bending and micro-spinning on the sheet to enhance the structural performance of the sheet; the two sheets obtained after being processed through all the above processes are respectively cleaned and inspected to obtain the above-mentioned first cover plate and second cover plate.

[0179] It should be noted that the first cover plate obtained through the above process includes a first aluminum alloy layer and a first copper alloy layer stacked up and down, and the second cover plate includes a second copper alloy layer and a second aluminum alloy layer stacked up and down.

[0180] For S1102, in the embodiments of the present disclosure, a blocking portion can be set by using an inert material and welded to the first cover plate; or a blocking portion can be directly formed based on the first cover plate. Among them, in S1102, support columns spaced from the blocking portion are also provided on the connection surface of the first cover plate.

[0181] In some embodiments, forming the blocking portion on the first cover plate includes:

[0182] Etching the first cover plate to form the blocking portion; or stamping the first cover plate to form the blocking portion.

[0183] The blocking portion in the embodiments of the present disclosure can be formed by stamping the connection surface of the first cover plate or etched from the non-connection surface of the first cover plate towards the connection surface, so that the structural stability of the blocking portion in the heat dissipation plate is better.

[0184] In S1103, determine the edge-sealing regions of the first cover plate and the second cover plate respectively, and set liquid injection ports based on the edge-sealing regions; among them, the edge-sealing regions are used for resistance welding positioning.

[0185] In S1104, the first cover plate and the second cover plate are aligned and joined together. Resistance welding is performed based on the sealing areas of the first cover plate and the sealing areas of the second cover plate to fix the edges of the first cover plate and the second cover plate together. Due to the blocking part on the connecting surface of the first cover plate and the supporting column, a working fluid phase change space is formed between the first cover plate and the second cover plate. During this welding process, the position of the injection port is reserved so that the injection port is connected to the working fluid phase change space.

[0186] In step S1105, a liquid injection pipe connected to the injection port is provided, and liquid working fluid is injected into the working fluid phase change space through the injection pipe and the injection port. During the injection process, it is necessary to ensure a certain vacuum level is reached within the working fluid phase change space so that the working fluid can smoothly fill the space and expel excess air. After injection, a first vacuum treatment is performed, and the injection pipe is sealed to ensure no leakage of the working fluid. Furthermore, to further improve the vacuum level inside the heat sink, a second degassing process can be performed to remove any air that may remain in the working fluid phase change space. This step helps improve the thermal efficiency and performance of the heat sink. After completing the second degassing process, the injection port can be finally sealed to obtain the final heat sink.

[0187] After S1105, the performance and reliability of the manufactured heat sink can be tested. After passing the test, the heat sink can be installed in the terminal equipment for use.

[0188] In some embodiments, the above preparation method further includes:

[0189] A target area is defined on the connecting surface of the second cover plate; wherein, when aligning the first cover plate and the second cover plate, the connecting surface of the second cover plate faces the first cover plate, and the target area is aligned with the blocking part;

[0190] A first capillary layer and a second capillary layer are respectively formed on opposite sides of the target area on the connecting surface of the second cover plate;

[0191] The first capillary layer is located in the first phase transition region, and the second capillary layer is located in the second phase transition region. The thickness of the first capillary layer is greater than the thickness of the second capillary layer.

[0192] Prior to S1104, in this embodiment of the present disclosure, a capillary structure is also formed on the second cover plate. Here, a target area is first defined on the connecting surface of the second cover plate, and the setting of the target area can match the blocking part set in S1102; wherein, when the first cover plate and the second cover plate are aligned and welded together, the target area can be fitted and matched with the blocking part.

[0193] After determining the target area, metal mesh laying and capillary sintering, metal powder brushing and capillary sintering, or trench etching are performed on the connecting surface of the second cover plate at positions on both sides of the target area to obtain a first capillary layer and a second capillary layer. The obtained first and second capillary layers can be composite capillary structures composed of any one or more of the following: metal mesh capillary, metal powder sintered capillary, and foamed metal capillary.

[0194] It should be noted that the thickness of the first capillary layer needs to be greater than that of the second capillary layer, so that the first capillary layer can guide the flow of liquid working fluid in the first phase change region of the final heat sink, and the second capillary layer can guide the flow of gaseous working fluid in the second phase change region of the heat sink.

[0195] The following description uses a mobile phone as an example of the terminal device proposed in the above embodiments of this disclosure to illustrate the heat dissipation of the heat sink in the mobile phone.

[0196] See Figure 13 , Figure 13 This is a schematic diagram of the structure of a terminal device according to an exemplary embodiment. Figure 2 The heat source of the mobile phone is the location of the central processing unit (CPU), which is located in the motherboard area of ​​the mobile phone. The heat sink 1 is set on the middle frame 21. Part of the second phase change area is located in the motherboard area and corresponds to the location of the CPU. Another part of the second phase change area is located in the battery compartment area. The first phase change area is also partially located in the motherboard area, but far away from the CPU. Another part is located in the battery compartment area.

[0197] Here, the working fluid in the heat sink absorbs the heat released by the central processing unit and vaporizes in the second phase change region. Due to the obstruction effect of the blocking part and the guiding effect of the second capillary layer in the second phase change region, it flows to the first connecting position at the far end, conducting and dissipating heat during the flow. Meanwhile, the working fluid undergoes a liquefaction phase change after entering the first phase change region at the first connecting position. The liquid working fluid can flow to the second connecting position at the other end based on the obstruction effect of the blocking part and the guiding effect of the wick in the first phase change region, thus allowing the liquid working fluid to flow back to the second phase change region through the second connecting position, completing one phase change cycle of the working fluid. Through the continuous phase change cycle of the working fluid in the heat sink, the heat released by the central processing unit can be conducted and diffused, thereby achieving heat dissipation for the mobile phone.

[0198] Thus, the heat sink proposed in this disclosure can take into account both high thermal conductivity and lightweight design through a composite board made of at least two different types of materials. This aims to improve the overall temperature control experience of the mobile phone while reducing its weight.

[0199] Figure 14This is a structural block diagram illustrating a terminal device according to an exemplary embodiment. For example, the terminal device 1400 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0200] Reference Figure 14 The terminal device 1400 may include one or more of the following components: processing component 1402, memory 1404, power supply component 1406, multimedia component 1408, audio component 1410, input / output interface 1412, sensor component 1414, and communication component 1416.

[0201] Processing component 1402 typically controls the overall operation of terminal device 1400, such as operations associated with at least one of display, telephone call, data communication, camera operation, and recording operation. Processing component 1402 may include one or more processors 1420 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 1402 may include one or more modules to facilitate interaction between processing component 1402 and other components. For example, processing component 1402 may include a multimedia module to facilitate interaction between multimedia component 1408 and processing component 1402.

[0202] Memory 1404 is configured to store various types of data to support operation on terminal device 1400. Examples of such data include at least one of the following: instructions for any application or method operating on terminal device 1400, contact data, phonebook data, messages, pictures, and videos. Memory 1404 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0203] Power supply component 1406 provides power to various components of terminal device 1400. Power supply component 1406 may include at least one of the following: a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to terminal device 1400.

[0204] Multimedia component 1408 includes a screen that provides an output interface between terminal device 1400 and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a Touch Panel, the screen may be implemented as a touchscreen to receive input signals from the user. The Touch Panel includes one or more touch sensors to sense touches, swipes, and gestures on the Touch Panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 1408 includes a front-facing camera and / or a rear-facing camera. When terminal device 1400 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0205] Audio component 1410 is configured to output and / or input audio signals. For example, audio component 1410 includes a microphone (MIC) configured to receive external audio signals when terminal device 1400 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 1404 or transmitted via communication component 1416. In some embodiments, audio component 1410 also includes a speaker for outputting audio signals.

[0206] Input / output interface 1412 provides an interface between processing component 1402 and peripheral interface modules, such as keyboards, click wheels, and buttons. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0207] Sensor assembly 1414 includes one or more sensors for providing status assessments of various aspects of terminal device 1400. For example, sensor assembly 1414 may detect the on / off state of terminal device 1400, the relative positioning of components such as the display and keypad of terminal device 1400, changes in position of terminal device 1400 or one of its components, the presence or absence of user contact with terminal device 1400, orientation or acceleration / deceleration of terminal device 1400, and temperature changes of terminal device 1400. Sensor assembly 1414 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 1414 may also include an optical sensor, such as a complementary metal-oxide-semiconductor (CMOS) or charge-coupled device (CCD) image sensor, for use in imaging applications. In some embodiments, sensor assembly 1414 may also include, but is not limited to, at least one of the following: an accelerometer, a gyroscope, a magnetometer, a pressure sensor, and a temperature sensor.

[0208] Communication component 1416 is configured to facilitate wired or wireless communication between terminal device 1400 and other devices. Terminal device 1400 can access wireless networks based on communication standards, such as Wi-Fi, 4G, 5G, or combinations thereof. In one exemplary embodiment, communication component 1416 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 1416 also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wide Band (UWB), Bluetooth (BT), and other technologies.

[0209] In an exemplary embodiment, the terminal device 1400 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0210] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 1404 including executable instructions or a computer program, which can be executed by the processor 1420 of the terminal device 1400 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), a compact disc read-only memory (CD-ROM), magnetic tape, floppy disk, and optical data storage device, etc.

[0211] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims. It should be understood that this disclosure is not limited to the precise structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A heat spreader, characterized by, The heat dissipation plate comprises: oppositely arranged first and second cover plates, a sealed working medium phase change space being formed between the first and second cover plates, and the working medium phase change space being filled with a working medium; a barrier portion located in the working medium phase change space and connected to the first and second cover plates, for dividing the working medium phase change space into first and second phase change regions arranged side by side, the first phase change region being used for the circulation of the working medium in liquid state, and the second phase change region being used for the circulation of the working medium in gaseous state; wherein the material of the first cover plate and / or the material of the second cover plate comprises at least two different materials.

2. The heat spreader of claim 1, wherein, The first cover plate comprises a first aluminum layer and a first copper layer, and the second cover plate comprises a second aluminum layer and a second copper layer; the working medium phase change space is surrounded by the first and second copper layers; the first aluminum layer covers the first copper layer; the second aluminum layer covers the second copper layer.

3. The heat spreader of claim 1, wherein, The heat dissipation plate further comprises: a first capillary layer located in the first phase change region; a second capillary layer located in the second phase change region; wherein the thickness of the first capillary layer is greater than the thickness of the second capillary layer.

4. The heat spreader of claim 3, wherein, The first and second capillary layers are arranged on the surface of the second cover plate facing the first cover plate. Alternatively, the first and second capillary layers are formed by etching the surface of the second cover plate facing the first cover plate.

5. The heat spreader of claim 4, wherein, The heat dissipation plate further comprises a plurality of support columns; the plurality of support columns are arranged in the working medium phase change space and spaced apart from the barrier portion; wherein one end of the support column is connected to the first cover plate, and the other end of the support column is connected to the first and second capillary layers, and the support column is used to support the working medium phase change space.

6. The heat spreader of claim 4, wherein, The material of the first capillary layer and the material of the second capillary layer both comprise a metal material.

7. The heat sink of any one of claims 1 to 6, wherein, The working medium phase change space has first and second opposite side edges; the barrier portion is located between the first and second side edges, and the extension direction of the barrier portion is the same as the extension direction of the first side edge and the extension direction of the second side edge; wherein the extension length of the barrier portion is less than the extension length of the first side edge and the extension length of the second side edge; the first phase change region is formed at least by the region between the barrier portion and the first side edge; and the second phase change region is formed at least by the region between the barrier portion and the second side edge.

8. The heat spreader of claim 7, wherein, The distance between the barrier portion and the first side edge is less than the distance between the barrier portion and the second side edge.

9. The heat sink of any one of claims 1 to 6, wherein, The outer edge of the first cover plate is welded to the outer edge of the second cover plate.

10. The heat spreader of claim 9, wherein, The heat dissipation plate further has a liquid injection port arranged at the connection position of the outer edge of the first cover plate and the outer edge of the second cover plate and in communication with the working medium phase change space, for guiding the working medium to be injected into the working medium phase change space.

11. The heat sink of any one of claims 1 to 6, wherein, The thickness of the heat dissipation plate is between 0.2 mm and 1 mm.

12. The heat sink of any one of claims 1 to 6, wherein, The working medium comprises water, an ethanol solution, or a fluorinated liquid.

13. A terminal device, comprising: The heat dissipation plate comprises: a middle frame, and a heat generating component arranged on the middle frame; The heat dissipation plate according to any one of claims 1 to 12; the heat dissipation plate is located between the heat generating component and the middle frame, or the heat dissipation plate and the heat generating component are located on opposite sides of the middle frame. The second phase change region of the heat dissipation plate is arranged in alignment with the heat generating component.

14. The terminal device according to claim 13, characterized by The heat dissipation plate is attached to the middle frame, or the heat dissipation plate is overlapped on the middle frame.

15. A production method for producing the heat dissipation sheet according to any one of claims 1 to 12, characterized by, The method comprises: Obtaining a first cover plate and a second cover plate based on at least two different materials and rolling treatment; Forming a blocking part on the first cover plate; Forming a liquid injection port on the outer edge of the first cover plate and the second cover plate; Aligning the first cover plate and the second cover plate, and welding the outer edge of the first cover plate and the outer edge of the second cover plate to form a working medium phase change space; wherein the blocking part divides the working medium phase change space into a first phase change region and a second phase change region arranged side by side; Injecting working medium into the working medium phase change space based on the liquid injection port, and sealing the liquid injection port to obtain the heat dissipation plate.

16. The method of claim 15, wherein, The method further comprises: Etching the first cover plate to form the blocking part; or, stamping the first cover plate to form the blocking part.

17. The method of claim 15, wherein, The method further comprises: Determining a target region on the connecting surface of the second cover plate; wherein, when aligning the first cover plate and the second cover plate, the connecting surface of the second cover plate faces the first cover plate, and the target region is aligned with the blocking part; Forming a first capillary layer and a second capillary layer on the connecting surface of the second cover plate respectively on opposite sides of the target region; Wherein, the first capillary layer is located in the first phase change region, the second capillary layer is located in the second phase change region, and the thickness of the first capillary layer is greater than the thickness of the second capillary layer.

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