Heat exchange module and electronic equipment

Abstract

The embodiment of the invention discloses a heat exchange module and electronic equipment, the heat exchange module comprises a circuit board and a micropump, the circuit board comprises a substrate layer, and a flow channel is arranged in the substrate layer; the micropump is connected with the substrate layer in a sealed mode, the micropump is provided with a working medium inlet and a working medium outlet, and the working medium inlet and the working medium outlet are respectively communicated with the flow channel. Therefore, a flow channel can be formed in the circuit board, and the working medium in the flow channel is driven by the micropump to flow so as to realize heat exchange. The flow channels are directly designed in the circuit board, a heat exchange plate does not need to be additionally designed, the production cost can be reduced, and the assembly difficulty of the electronic equipment applying the heat exchange module is also reduced.

Description

Technical Field

[0001] This invention relates to the field of heat transfer technology, and more specifically, to a heat exchange module and electronic device. Background Technology

[0002] As electronic devices become increasingly integrated, heat exchange has become a key factor limiting their performance improvement. Currently, most electronic devices rely on built-in liquid cooling plates for heat exchange. These plates have flow channels that utilize the flow of a working fluid to transfer heat and thus cool the electronic device.

[0003] However, while installing liquid cooling plates inside electronic devices solves the heat dissipation problem, it also increases production and processing costs, making the assembly of electronic devices more difficult. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a novel heat exchange module and electronic device.

[0005] According to one aspect of the present invention, a heat exchange module is provided.

[0006] The heat exchange module includes:

[0007] A circuit board, the circuit board including a substrate layer having flow channels therein;

[0008] A micropump is sealed to the substrate layer and has a working fluid inlet and a working fluid outlet, which are respectively connected to the flow channel.

[0009] Optionally, the circuit board includes a first circuit board and a second circuit board, the first circuit board includes a first substrate layer, the second circuit board includes a second substrate layer, and the first substrate layer and the second substrate layer are stacked together.

[0010] The first substrate layer and the second substrate layer form the flow channel, and one of the micropumps is hermetically connected to one of the first substrate layer and the second substrate layer.

[0011] Optionally, the first circuit board further includes a first functional layer, and the second circuit board further includes a second functional layer. One side of the first substrate layer is connected to the first functional layer, one side of the second substrate layer is connected to the second functional layer, and the other side of the first substrate layer is connected to the other side of the second substrate layer. A gap exists between the first functional layer or the second functional layer and the micropump.

[0012] Optionally, a flow channel groove is formed on the first substrate layer or the second substrate layer, and the first substrate layer and the second substrate layer are sealed together and form the flow channel at the flow channel groove.

[0013] Optionally, a first flow channel groove is formed on the side of the first substrate layer near the second substrate layer, and a second flow channel groove is formed on the side of the second substrate layer near the first substrate layer. The second substrate layer is sealed to the first substrate layer and forms the flow channel at the first flow channel groove and the second flow channel groove.

[0014] Optionally, the first flow channel and the second flow channel are positioned opposite each other along the thickness direction of the heat exchange module.

[0015] Optionally, the first flow channel and the second flow channel are at least partially offset along the thickness direction of the heat exchange module.

[0016] Optionally, the first flow channel has a first opening at the end near the second flow channel, and the second flow channel has a second opening at the end near the first flow channel, with the second opening communicating with the first opening.

[0017] Optionally, a groove is formed on the side of the first substrate layer near the second substrate layer, and a support portion is formed on the side of the second substrate layer near the first substrate layer. The second substrate layer is sealed to the first substrate layer, and the support portion forms the flow channel in the groove.

[0018] Optionally, a flow channel is formed in the substrate layer, the substrate layer surrounds the flow channel to form a closed flow channel, and there are gaps between the flow channel and the top wall of the substrate layer and between the flow channel and the bottom wall of the substrate layer.

[0019] Optionally, the first circuit board is located above the second circuit board, and the micropump is sealed to the first substrate layer.

[0020] Optionally, the circuit board has a connection hole that passes through the first circuit board and the second circuit board, and makes the first functional layer and the second functional layer electrically connected.

[0021] Optionally, two through holes are formed on the substrate layer, one end of the through hole is connected to the flow channel, and the working fluid inlet and the working fluid outlet are respectively connected to the other ends of the two through holes.

[0022] According to another aspect of the present invention, an electronic device is provided, comprising the heat exchange module described above.

[0023] One technical advantage of the embodiments disclosed herein is that:

[0024] The heat exchange module includes a circuit board and a micropump. The circuit board includes a substrate layer with flow channels within it. The micropump is sealed to the substrate layer and has a working fluid inlet and an outlet, both of which are connected to the flow channels. This allows a flow channel to be formed inside the circuit board, and the micropump drives the flow of the working fluid within the channel to achieve heat exchange. Designing the flow channel directly inside the circuit board eliminates the need for a separate heat exchange plate, reducing production costs and simplifying the assembly of electronic devices using this heat exchange module.

[0025] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0026] The accompanying drawings, which form part of this specification, illustrate embodiments of the invention and, together with the specification, serve to explain the principles of the invention.

[0027] Figure 1 This is a schematic diagram of a heat exchange module according to an embodiment of the present disclosure;

[0028] Figure 2 This is a cross-sectional view of a heat exchange module according to an embodiment of this disclosure;

[0029] Figure 3 This is a cross-sectional view of another heat exchange module according to an embodiment of this disclosure;

[0030] Figure 4 This is a cross-sectional view of another heat exchange module according to an embodiment of the present disclosure;

[0031] Figure 5 This is a cross-sectional view of another heat exchange module according to an embodiment of the present disclosure.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Circuit board; 11. First circuit board; 111. First substrate layer; 112. First functional layer; 12. Second circuit board; 121. Second substrate layer; 122. Second functional layer; 13. Flow channel; 1111. First flow channel; 1211. Second flow channel; 14. Connecting hole; 15. Through hole; 2. Micro pump. Detailed Implementation

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0035] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0036] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0037] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0038] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0039] This invention provides a heat exchange module that can be applied to heat exchange in small electronic devices such as tablets, laptops, VR (Virtual Reality) products, AR (Augmented Reality) products, and watches.

[0040] like Figures 1 to 5 As shown, the heat exchange module provided in this embodiment of the invention includes:

[0041] Circuit board 1, the circuit board 1 includes a substrate layer, the substrate layer having a flow channel 13;

[0042] Micropump 2 is sealed to the substrate layer. Micropump 2 has a working fluid inlet and a working fluid outlet, and the working fluid inlet and the working fluid outlet are respectively connected to the flow channel 13.

[0043] Specifically, circuit board 1 can be a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit), which can meet the usage requirements of different electronic devices. Circuit board 1 can include a substrate layer and a functional layer. The substrate layer is used to provide stable support. The functional layer is located on the substrate layer and includes structures such as conductive patterns and pads, which are used to form electrical connections with electronic devices.

[0044] In this embodiment, a flow channel 13 can be designed within the substrate layer of the circuit board 1. That is, the inner wall of the substrate layer is used as the inner wall of the flow channel groove, which facilitates the subsequent formation of a sealed flow channel 13. The flow channel 13 is used to supply the working fluid flow, thereby enabling the heat exchange function of the heat exchange module.

[0045] In this way, circuit board 1 can be reused. On the one hand, electronic devices can be arranged on circuit board 1 to achieve corresponding functions; on the other hand, by designing flow channels 13 in the substrate layer to achieve heat exchange effect, the heat exchange plate can be eliminated, thereby saving production and processing costs, and also reducing the assembly difficulty of electronic devices using this heat exchange module.

[0046] Furthermore, since there is no need to design heat exchange plates or other heat exchange structures, the internal space occupied by electronic devices using this heat exchange module can be reduced, which facilitates the miniaturization of electronic devices.

[0047] The internal space of the substrate layer can be fully utilized to design the specific structure of the flow channel 13, which makes it easier to increase the total length of the flow channel 13, thereby increasing the heat exchange path and improving the heat exchange effect of the heat exchange module.

[0048] Furthermore, sealing the micropump 2 to the substrate layer of the circuit board 1 simplifies the assembly of the micropump 2. Two through holes 15 can be formed on the substrate layer, both of which communicate with the flow channel 13. Connecting the working fluid inlet and outlet of the micropump 2 to the two through holes 15 one by one enables communication between the micropump 2 and the flow channel 13, allowing the micropump 2 to drive the working fluid to circulate within the flow channel 13, thereby ensuring the heat exchange effect of the heat exchange module.

[0049] The number of micropumps 2 can be increased to adjust their driving capability. Pads can be provided on the micropumps 2 to electrically connect them to the functional layers of the circuit board 1. The micropumps 2 include, but are not limited to, piezoelectric pumps and electromagnetic pumps. The thickness of the micropumps 2 can be between 0.3mm and 3mm to facilitate the thinner and lighter development of the heat exchange module.

[0050] Optionally, the circuit board 1 includes a first circuit board 11 and a second circuit board 12. The first circuit board 11 includes a first substrate layer 111, and the second circuit board 12 includes a second substrate layer 121. The first substrate layer 111 and the second substrate layer 121 are stacked together.

[0051] The first substrate layer 111 and the second substrate layer 121 form the flow channel 13, and one of the micropumps 2 is hermetically connected to one of the first substrate layer 111 and the second substrate layer 121.

[0052] like Figure 1As shown, in this embodiment, the heat exchange module includes two circuit boards 1, which are stacked. Specifically, the first substrate layer 111 and the second substrate layer 121 can be connected, and the first functional layer 112 and the second functional layer 122 can be exposed, such that the first substrate layer 111 and the second substrate layer 121 are located on the inner side, and the first functional layer 112 and the second functional layer 122 are located on the outer side. The outer first functional layer 112 and the second functional layer 122 can be used to form electrical connections with electronic devices, thereby expanding the functionality of the circuit board 1.

[0053] Furthermore, stacking the two circuit boards 1 can reduce the horizontal size of the heat exchange module, thereby reducing the internal horizontal space occupied by the electronic device using the heat exchange module and facilitating the miniaturization of the electronic device.

[0054] In this design, flow channel grooves can be etched on at least one of the first substrate layer 111 and the second substrate layer 121, and a sealed flow channel 13 can be formed at the flow channel grooves by connecting the first substrate layer 111 and the second substrate layer 121. This simplifies the process of creating the flow channel grooves, thereby reducing the processing difficulty of the heat exchange module. The sealed connection between the first substrate layer 111 and the second substrate layer 121 can be achieved through processes such as bonding, hot pressing, and ultrasonic welding.

[0055] Depending on the actual arrangement, the micropump 2 can be sealed to the first substrate layer 111; or the micropump 2 can be sealed to the second substrate layer 121; or multiple micropumps 2 can be set, with some micropumps 2 sealed to the first substrate layer 111 and others sealed to the second substrate layer 121, all of which can enable the micropump 2 to drive the working fluid in the flow channel 13.

[0056] Optionally, the first circuit board 11 further includes a first functional layer 112, and the second circuit board 12 further includes a second functional layer 122. One side of the first substrate layer 111 is connected to the first functional layer 112, one side of the second substrate layer 121 is connected to the second functional layer 122, and the other side of the first substrate layer 111 is connected to the other side of the second substrate layer 121. A gap exists between the first functional layer 112 or the second functional layer 122 and the micropump 2.

[0057] That is, on the first substrate layer 111, the first functional layer 112 is staggered from the micropump 2; on the second substrate layer 121, the second functional layer 122 is staggered from the micropump 2, which can avoid interference between the first functional layer 112 and the second functional layer 122 and the micropump 2, thereby ensuring the working reliability of the heat exchange module.

[0058] Optionally, a flow channel groove is formed on the first substrate layer 111 or the second substrate layer 121, and the first substrate layer 111 and the second substrate layer 121 are sealed together and form the flow channel 13 at the flow channel groove.

[0059] like Figure 3 As shown, in this embodiment, flow channel grooves can be etched on the first substrate layer 111, and a sealed flow channel 13 can be formed at the flow channel grooves using the second substrate layer 121; as Figure 2 As shown, flow channel grooves can also be etched on the second substrate layer 121, and a sealed flow channel 13 can be formed at the flow channel groove using the first substrate layer 111. This simplifies the flow channel groove opening process and also enables the utilization of the internal space of the circuit board 1, facilitating the miniaturization of electronic devices using this heat exchange module.

[0060] Furthermore, by creating a flow channel groove on one substrate layer and then covering it with another substrate layer for sealing, the formation and sealing of the flow channel can be simplified, and the sealing performance of the formed flow channel 13 can be guaranteed, avoiding abnormalities such as working fluid leakage.

[0061] Optionally, a first flow channel groove is formed on the side of the first substrate layer 111 near the second substrate layer 121, and a second flow channel groove is formed on the side of the second substrate layer 121 near the first substrate layer 111. The second substrate layer 121 is sealed to the first substrate layer 111 and forms the flow channel 13 at the first flow channel groove and the second flow channel groove.

[0062] like Figure 4 and Figure 5 As shown, in this embodiment, a flow channel groove can be etched on both sides where the first substrate layer 111 and the second substrate layer 121 are connected, and a flow channel 13 is formed at the two flow channel grooves through the sealing connection of the first substrate layer 111 and the second substrate layer 121. This can also realize the utilization of the internal space of the circuit board 1, which is conducive to the miniaturization of electronic devices using the heat exchange module.

[0063] Depending on the specific locations of the first and second flow channels, one or two flow channels 13 can be formed within the circuit board 1, thereby adapting to different heat exchange requirements.

[0064] Optionally, the first flow channel and the second flow channel are positioned opposite each other along the thickness direction of the heat exchange module.

[0065] like Figure 4As shown, in this embodiment, flow channel grooves can be etched on opposite sides where the first substrate layer 111 and the second substrate layer 121 are connected. The first flow channel groove and the second flow channel groove are positioned opposite each other, and a flow channel 13 can be formed at the two flow channel grooves by utilizing the sealing connection of the first substrate layer 111 and the second substrate layer 121. By designing the structure of at least one flow channel groove in the first substrate layer 111 and the second substrate layer 121, the structure of the flow channel 13 can be adjusted accordingly, thereby adjusting the heat exchange effect of the heat exchange module.

[0066] Optionally, the first flow channel and the second flow channel are at least partially offset along the thickness direction of the heat exchange module.

[0067] In this embodiment, flow channel grooves can be etched on both sides where the first substrate layer 111 and the second substrate layer 121 are connected. The first flow channel groove and the second flow channel groove are partially offset or completely offset. The sealing connection of the first substrate layer 111 and the second substrate layer 121 can form two flow channels 13 at the two flow channel grooves, thereby increasing the total length of the flow channels 13 formed by the circuit board 1, which can increase the heat exchange path of the working fluid and facilitate the improvement of the heat exchange effect of the heat exchange module.

[0068] The two flow channels 13 can be connected so that the working fluid can flow between the two flow channels 13; or the two flow channels 13 can be disconnected so that the working fluid can flow independently in the two flow channels 13, which can adapt to different heat exchange requirements.

[0069] Optionally, the first flow channel has a first opening at the end near the second flow channel, and the second flow channel has a second opening at the end near the first flow channel, with the second opening communicating with the first opening.

[0070] like Figure 5 As shown, in this embodiment, when the first flow channel and the second flow channel are partially misaligned, openings can be made at opposite ends of the first flow channel and the second flow channel. The first opening connects to the first flow channel 1111, and the second opening connects to the second flow channel 1211. This allows the two flow channels 13 to be connected by the first and second openings that are in opposite positions, so that the working medium can flow between the two flow channels 13.

[0071] The first opening and the second opening can be respectively located at the ends of the flow channel groove, that is, at the ends of each flow channel 13, which can increase the total length of the two flow channels 13 formed, thereby increasing the heat exchange path of the working fluid and improving the heat exchange effect of the heat exchange module.

[0072] In another embodiment, when the first flow channel and the second flow channel are completely misaligned, corresponding connecting holes can be formed in the first substrate layer 111 and the second substrate layer 121. One end of the connecting hole is connected to the first flow channel, and the other end of the connecting hole is connected to the second flow channel, so that the two flow channels 13 can be connected by the connecting hole, and the working fluid can flow between the two flow channels 13.

[0073] Optionally, a groove is formed on the side of the first substrate layer 111 near the second substrate layer 121, and a support portion is formed on the side of the second substrate layer 121 near the first substrate layer 111. The second substrate layer 121 is sealed to the first substrate layer 111, and the support portion forms the flow channel 13 in the groove.

[0074] In this embodiment, a large groove can be first formed on the first substrate layer 111, and a support portion including support protrusions, support ribs, etc. can be etched on the second substrate layer 121. Then, the second substrate layer 121 and the first substrate layer 111 are sealed together, so that the support portion in the second substrate layer 121 can form a flow channel 13 for the working fluid to flow in the groove in the first substrate layer 111.

[0075] The method of machining grooves and support portions on the two substrate layers simplifies the machining of a single substrate layer and facilitates mass production of the substrate layers. Furthermore, since the structures on the first substrate layer 111 and the second substrate layer 121 are relatively simple, the sealing process between the two is also facilitated, thereby improving the reliability of the sealed connection between the first substrate layer 111 and the second substrate layer 121.

[0076] Optionally, a flow channel groove is formed in the substrate layer, and the substrate layer forms a closed flow channel 13 at the flow channel groove, and there are gaps between the flow channel groove and the top wall of the substrate layer, and between the flow channel groove and the bottom wall of the substrate layer.

[0077] In this embodiment, the flow channel is built into the substrate layer, so that the flow channel 13 is also located inside the substrate layer. This allows the inner wall of the substrate layer to be used directly to seal the flow channel 13 without the need for additional sealing components. This enables the utilization of the internal space of the circuit board 1 while reducing production costs and also reduces the thickness of the heat exchange module, facilitating the miniaturization of electronic devices using the heat exchange module.

[0078] Optionally, the first circuit board 11 is located above the second circuit board 12, and the micropump 2 is sealed to the first substrate layer 111.

[0079] like Figure 1As shown, in this embodiment, the micropump 2 is sealed to the substrate layer of the circuit board 1 located on the upper side. On the one hand, this can reduce the impact of gravity on the micropump 2 while connecting the micropump 2 and the flow channel 13, thereby ensuring the normal operation of the micropump 2. On the other hand, it can also simplify the installation process of the micropump 2, thereby reducing the assembly difficulty of the heat exchange module.

[0080] Optionally, the circuit board 1 has a connection hole 14 that passes through the first circuit board 11 and the second circuit board 12, and forms an electrical connection between the first functional layer 112 and the second functional layer 122. In this embodiment, the connection hole 14 is also a through hole, which can electrically connect the first functional layer 112 and the second functional layer 122, facilitating the electrical connection between the first functional layer 112 and the second functional layer 122 and electronic devices, thereby expanding the functionality of the circuit board 1.

[0081] Optionally, two through holes 15 are formed on the substrate layer. One end of the through hole 15 is connected to the flow channel 13, and the working fluid inlet and the working fluid outlet are respectively connected to the other ends of the two through holes 15.

[0082] like Figure 2 As shown, in this embodiment, two through holes 15 can be opened at corresponding positions on the substrate layer of the circuit board 1, and both through holes 15 are connected to the flow channel 13. The working fluid inlet and outlet of the micro pump 2 are connected to the two through holes 15 one by one, thereby realizing the connection between the micro pump 2 and the flow channel 13, so that the micro pump 2 can drive the working fluid to circulate in the flow channel 13, thereby ensuring the heat exchange effect of the heat exchange module.

[0083] This invention also provides an electronic device, including the aforementioned heat exchange module. This electronic device can be a small electronic device, such as a tablet computer, laptop computer, smart glasses, smartwatch, or smart headband.

[0084] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0085] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A heat exchange module, characterized in that, include: Circuit board (1), the circuit board (1) includes a substrate layer having a flow channel (13) therein; Micropump (2) is sealed to the substrate layer. The micropump (2) has a working fluid inlet and a working fluid outlet, which are respectively connected to the flow channel (13).

2. The heat exchange module according to claim 1, characterized in that, The circuit board (1) includes a first circuit board (11) and a second circuit board (12). The first circuit board (11) includes a first substrate layer (111), and the second circuit board (12) includes a second substrate layer (121). The first substrate layer (111) and the second substrate layer (121) are stacked together. The first substrate layer (111) and the second substrate layer (121) form the flow channel (13), and one of the micropumps (2) is hermetically connected to one of the first substrate layer (111) and the second substrate layer (121).

3. The heat exchange module according to claim 2, characterized in that, The first circuit board (11) further includes a first functional layer (112), and the second circuit board (12) further includes a second functional layer (122). One side of the first substrate layer (111) is connected to the first functional layer (112), one side of the second substrate layer (121) is connected to the second functional layer (122), and the other side of the first substrate layer (111) is connected to the other side of the second substrate layer (121). There is a gap between the first functional layer (112) or the second functional layer (122) and the micropump (2).

4. The heat exchange module according to claim 2, characterized in that, A flow channel groove is formed on the first substrate layer (111) or the second substrate layer (121), and the first substrate layer (111) and the second substrate layer (121) are sealed together and form the flow channel (13) at the flow channel groove.

5. The heat exchange module according to claim 2, characterized in that, A first flow channel groove is formed on the side of the first substrate layer (111) near the second substrate layer (121), and a second flow channel groove is formed on the side of the second substrate layer (121) near the first substrate layer (111). The second substrate layer (121) is sealed to the first substrate layer (111) and forms the flow channel (13) at the first flow channel groove and the second flow channel groove.

6. The heat exchange module according to claim 5, characterized in that, Along the thickness direction of the heat exchange module, the first flow channel groove and the second flow channel groove are positioned opposite each other.

7. The heat exchange module according to claim 5, characterized in that, Along the thickness direction of the heat exchange module, the first flow channel and the second flow channel are at least partially offset.

8. The heat exchange module according to claim 7, characterized in that, The first flow channel has a first opening at the end near the second flow channel, and the second flow channel has a second opening at the end near the first flow channel, with the second opening communicating with the first opening.

9. The heat exchange module according to claim 2, characterized in that, A groove is formed on the side of the first substrate layer (111) near the second substrate layer (121), and a support portion is formed on the side of the second substrate layer (121) near the first substrate layer (111). The second substrate layer (121) is sealed to the first substrate layer (111), and the support portion forms the flow channel (13) in the groove.

10. The heat exchange module according to claim 1, characterized in that, The substrate layer has a flow channel groove, and the substrate layer forms a closed flow channel (13) at the flow channel groove. There are gaps between the flow channel groove and the top wall of the substrate layer, and between the flow channel groove and the bottom wall of the substrate layer.

11. The heat exchange module according to claim 2, characterized in that, The first circuit board (11) is located above the second circuit board (12), and the micropump (2) is sealed to the first substrate layer (111).

12. The heat exchange module according to claim 3, characterized in that, The circuit board (1) has a connection hole (14) that passes through the first circuit board (11) and the second circuit board (12), and makes the first functional layer (112) and the second functional layer (122) electrically connected.

13. The heat exchange module according to claim 1, characterized in that, Two through holes (15) are formed on the substrate layer. One end of the through hole (15) is connected to the flow channel (13), and the working fluid inlet and the working fluid outlet are respectively connected to the other end of the two through holes (15).

14. An electronic device, characterized in that, Includes the heat exchange module as described in any one of claims 1 to 13.

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