High-integration integrated transmission structure

Abstract

The invention discloses a high-integration integrated transmission structure which comprises a lower carrier plate, an upper carrier plate, a box dam, metal columns and a ball array. The top surfaces and the bottom surfaces of the lower carrier plate and the upper carrier plate are coated with metal layers; the lower carrier plate comprises a first welding disc, a T-shaped matching branch knot, a first metal hole and a first copper avoiding area; the upper carrier plate comprises a second welding disc, a second copper avoiding area, a second metal hole and a third metal hole; the box dam is located between the lower carrier plate and the upper carrier plate and welded to the top face of the lower carrier plate and the bottom face of the upper carrier plate, the metal columns are welded to a first welding disc on the top face of the lower carrier plate and a second welding disc on the bottom face of the upper carrier plate, the box dam partially and half surrounds the metal columns, the box dam and the metal columns jointly form a half-surrounded quasi-coaxial structure, and the signal shielding and signal transmission effects are achieved. The ball array is welded on the top surface of the upper support plate, and a central ball of the ball array is aligned and welded with a second welding disc on the top surface of the upper support plate. According to the invention, three-dimensional integrated interconnection of broadband radio frequency transmission performance can be realized, and a good heat dissipation condition is ensured at the same time.

Description

Technical Field

[0001] This invention belongs to the field of SiP system-level packaging technology, specifically relating to a highly integrated integrated transmission structure. Background Technology

[0002] Miniaturization of electronic devices has always been a major direction of technological development. System-in-Package (SiP), as a technological route for miniaturization of electronic devices, has realized the transformation from monolithic integrated planar structures to multi-chip integrated three-dimensional structures, making highly integrated, miniaturized modules possible. With the development of miniaturization technology, the size of electronic devices has been further reduced, the integration level has been increased, and the functions have become more complex. Heat dissipation has become a limiting factor for the performance of modules. Summary of the Invention

[0003] The purpose of this invention is to provide a highly integrated transmission structure that can achieve three-dimensional integrated interconnection of wideband RF transmission performance while ensuring good heat dissipation, and can be widely used in system-level packaging design.

[0004] To achieve the above objectives, one aspect of the present invention provides a highly integrated transmission structure, including a download board, an upload board, a dam, metal pillars, and a sphere array; Both the top and bottom surfaces of the download board and the upload board are covered with metal layers. The download board includes a first solder pad, a T-shaped matching branch, a first metal hole, and a first copper avoidance area. The first copper avoidance area is located within the metal layer of the download board, and the T-shaped matching branch is located inside the first copper avoidance area. The T-shaped matching branch is used to connect to the chip via gold wire bonding to achieve RF signal transmission matching. The first metal hole is arranged along the edge of the first copper avoidance area, connecting the top and bottom metal layers of the download board to form a shielding and reflection effect on the signal. The upper board includes a second solder pad, a second copper avoidance area, a second metal hole and a third metal hole. The second copper avoidance area is disposed within the metal layer of the upper board. The second solder pad is disposed inside the second copper avoidance area. The second metal hole connects the second solder pad on the top surface and the bottom surface of the upper board. The third metal hole connects the metal layer on the top surface and the bottom surface of the upper board and is arranged around the second metal hole. The dam is located between the download plate and the upper plate, and is welded to the top surface of the download plate and the bottom surface of the upper plate. The metal column is welded to the first welding plate on the top surface of the download plate and the second welding plate on the bottom surface of the upper plate. The dam partially surrounds the metal column, and together with the metal column, they form a semi-enclosed coaxial structure, which serves to shield and transmit signals. The ball array is welded to the top surface of the upper plate, and the central ball of the ball array is aligned and welded to the second welding plate on the top surface of the upper plate.

[0005] The highly integrated transmission structure of the present invention, as described above, can be applied to system-level packaging design, exhibits excellent performance, has wide bandwidth transmission characteristics, and provides a good heat dissipation path. Attached Figure Description

[0006] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort: Figure 1 This is an overall schematic diagram of a highly integrated transmission structure according to an embodiment of the present invention; Figure 2 yes Figure 1 A partial structural schematic diagram of the upper plate and ball array is omitted. Figure 3 This is a schematic diagram of the structure of the upper plate and ball array according to an embodiment of the present invention; Figure 4 This is a schematic diagram illustrating the assembly and application of a highly integrated transmission structure according to an embodiment of the present invention; Figure 5 This is a standing wave curve diagram of an embodiment of the present invention; Figure 6 This is an insertion loss curve diagram of one embodiment of the present invention. Detailed Implementation

[0007] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0008] One embodiment of the present invention provides a highly integrated integrated transmission structure, such as... Figures 1-3 As shown, the highly integrated transmission structure of this invention includes a download board 1, an upload board 3, a dam 2, a metal pillar 4, and a spherical array 5.

[0009] The dam 2 is located between the download plate 1 and the upper plate 3, and is welded to the top surface of the download plate 1 and the bottom surface of the upper plate 3. The metal column 4 is welded to the first welding plate 6 on the top surface of the download plate 1 and the second welding plate 10 on the bottom surface of the upper plate 3. The ball array 5 is welded to the top surface of the upper plate 3, and the center ball of the ball array 5 is aligned and welded to the second welding plate 10 on the top surface of the upper plate 3.

[0010] The top and bottom surfaces of the download board 1 and the upload board 3 are covered with a metal layer. A copper avoidance area is set in the metal layer, and a metal pattern is set in the copper avoidance area. Metal holes are arranged in both the download board 1 and the upload board 3.

[0011] Specifically, the download board 1 includes a first solder pad 6, a T-shaped matching stub 7, a first metal via 8, and a first copper avoidance region 9. The T-shaped matching stub 7 is located inside the first copper avoidance region 9. The T-shaped matching stub 7 can be used for RF signal transmission matching from the chip bonding wire to the first solder pad 6. This is achieved by adjusting the length and width dimensions of the T-shaped matching stub 7 to achieve signal matching transmission. The first metal via 8 is arranged along the edge of the first copper avoidance region 9, connecting the top and bottom metal layers of the download board 1, forming a certain degree of shielding and reflection effect on the signal.

[0012] The upper plate 3 includes a second solder pad 10, a second copper avoidance area 11, a second metal hole 12, and a third metal hole 13. The second solder pad 10 and the second copper avoidance area 11 are both provided on the top and bottom surfaces of the upper plate 3. The second solder pad 10 is located inside the second copper avoidance area 11. The second metal hole 12 connects the second solder pad 10 on the top and bottom surfaces of the upper plate 3. The third metal hole 13 connects the top and bottom metal layers of the upper plate 3 and is arranged around the second metal hole 12 at a certain distance.

[0013] The dam 2 is made of metal. The dam 2 is welded to the download plate 1 and the upper plate 3, forming a support for the upper plate 3. The dam 2 partially surrounds the metal column 4, together with the metal column 4 forming a semi-enclosed coaxial structure, providing signal shielding and signal transmission.

[0014] The ball array 5 is formed by arranging solder balls in a nine-square grid and welding them to the top surface of the upper plate 3 to form a signal transmission interface.

[0015] Figure 4 This illustrates an example of the assembly and application of a highly integrated transmission structure according to an embodiment of the present invention. Chip 14 is mounted on the top surface of download board 1. Chip 14 is connected to T-type matching stub 7 via gold wire bonding. The signal is matched and transmitted through T-type matching stub 7 to a semi-enclosed coaxial structure composed of metal pillars 4 and dams 2, and then transmitted to ball array 5 via upload board 3, realizing the external interconnection and transmission of the signal.

[0016] In this embodiment, the download board 1 and the load board 3 are made of aluminum nitride, a material with high thermal conductivity. The chip is mounted on the top surface of the download board 1, and the bottom surface of the entire structure, which is also the bottom surface of the download board 1, can be tightly attached to an external heat dissipation device. In the conventional method, the chip 14 is mounted on the bottom surface of the load board 3, and the top surface of the entire structure, which is also the top surface of the ball array 5, is tightly attached to an external heat dissipation device. Compared to the conventional method, the highly integrated transmission structure of this invention has a shorter heat dissipation transmission path and better heat dissipation effect.

[0017] Figure 5 and Figure 6 The figures respectively reflect the standing wave ratio (SWR) and insertion loss of the highly integrated transmission structure in the embodiment of the present invention. The SWR is no higher than 1.2 in the DC-38GHz range, and the insertion loss is better than -0.5dB, which shows that it has good radio frequency transmission performance.

[0018] In summary, the highly integrated transmission structure of this invention achieves three-dimensional integrated interconnection of wideband RF transmission performance while ensuring good heat dissipation, and can be widely used in system-level packaging design.

[0019] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A highly integrated, single-unit transmission structure, characterized in that, Includes download board, upload board, dam, metal pillars and spherical array; Both the top and bottom surfaces of the download board and the upload board are covered with metal layers. The download board includes a first solder pad, a T-shaped matching branch, a first metal hole, and a first copper avoidance area. The first copper avoidance area is located within the metal layer of the download board, and the T-shaped matching branch is located inside the first copper avoidance area. The T-shaped matching branch is used to connect to the chip via gold wire bonding to achieve RF signal transmission matching. The first metal hole is arranged along the edge of the first copper avoidance area, connecting the top and bottom metal layers of the download board to form a shielding and reflection effect on the signal. The upper board includes a second solder pad, a second copper avoidance area, a second metal hole and a third metal hole. The second copper avoidance area is disposed within the metal layer of the upper board. The second solder pad is disposed inside the second copper avoidance area. The second metal hole connects the second solder pad on the top surface and the bottom surface of the upper board. The third metal hole connects the metal layer on the top surface and the bottom surface of the upper board and is arranged around the second metal hole. The dam is located between the download plate and the upper plate, and is welded to the top surface of the download plate and the bottom surface of the upper plate. The metal column is welded to the first welding plate on the top surface of the download plate and the second welding plate on the bottom surface of the upper plate. The dam partially surrounds the metal column, and together with the metal column, they form a semi-enclosed coaxial structure, which serves to shield and transmit signals. The ball array is welded to the top surface of the upper plate, and the central ball of the ball array is aligned and welded to the second welding plate on the top surface of the upper plate.

2. The highly integrated transmission structure according to claim 1, characterized in that, The chip is mounted on the top surface of the download board and connected to the T-type matching stub via gold wire bonding. The signal is transmitted through the T-type matching stub to the semi-enclosed coaxial structure composed of metal pillars and dams, and then transmitted to the ball array via the uploading board to realize the external interconnection and transmission of the signal.

3. The highly integrated transmission structure according to claim 1 or 2, characterized in that, The ball array is formed by arranging solder balls in a nine-square grid and welding them to the top surface of the upper plate to form a signal transmission interface.

4. The highly integrated transmission structure according to claim 1 or 2, characterized in that, The download board and the load board are made of aluminum nitride, which has a high thermal conductivity. The bottom surface of the download board is in close contact with the external heat dissipation device.

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