EMI suppression for high speed cables

Abstract

The invention relates to EMI suppression for high speed cables. Disclosed are exemplary embodiments of an EMI absorber operable to suppress and / or absorb relatively high frequency EMI noise of a high speed cable for interconnection from chip to board, integrated circuit package to board, input / output panel to board, board to board, module to board, subsystem to board and supporting high speed interconnect technology standards (e.g., high speed interconnect technology standards, etc. The peripheral components are interconnected with high-speed 5 / 6 / 7 generations and computer high-speed links 3.1 and the like). In one embodiment, the EMI absorber includes a moldable thermoplastic EMI absorber configured to, when the EMI absorber is located on a portion or another component of the cable, e.g., when the EMI absorber completely and / or continuously surrounds a portion or another component of the cable (e.g., disposed 360 degrees, etc. The noise suppression device can be operated to suppress and / or absorb EMI noise from a cable or another component, wherein the EMI noise comprises frequencies of 5 gigahertz to 70 gigahertz.

Description

Technical Field

[0001] This disclosure relates to EMI (electromagnetic interference) suppression for high-speed cables. Background Technology

[0002] This section provides background information in connection with this disclosure, which is not necessarily prior art.

[0003] PCIe (Peripheral Component Interconnect) is a high-speed interface standard used to connect various hardware components to a computer motherboard. PCIe is commonly used to connect graphics cards, solid-state drives (SSDs), network cards, and other expansion cards.

[0004] PCIe uses channels to transmit data, where each channel consists of two pairs of wires: one pair for sending data and one pair for receiving data. PCIe has evolved over the years, with newer versions offering higher bandwidth. The most common PCIe versions include PCIe 3.0 (1 gigabyte per second per channel in each direction), PCIe 4.0 (2 GB / s per channel in each direction), PCIe 5.0 (4 GB / s per channel in each direction), and PCIe 6.0 (up to 8 GB / s per channel in each direction). PCIe continues to evolve, with newer versions and future generations (e.g., PCIe 7.0) supporting even faster data rates. Faster data rates will increase the EMI frequency range, for example, from 5 GHz to 50 GHz.

[0005] Ferrite beads or cores are a common type of EMI suppressor used in data cables. Typically, ferrite beads or cores are relatively small cylindrical components made of a magnetic material (ferrite) that are clipped onto or embedded in the data cable. Ferrite beads or cores are configured to operate against common-mode EMI noise while allowing desired data signals or power to pass through in differential mode. Ferrite beads or cores convert EMI noise into heat, thus effectively suppressing EMI noise. However, as recognized in this paper, ferrite-based EMI suppressors have a limitation: they can only effectively absorb lower frequencies, typically below 5 GHz. Summary of the Invention

[0006] This application relates to an electromagnetic interference (EMI) absorber, the EMI absorber comprising a moldable thermoplastic EMI absorber, and the EMI absorber being configured to operate for suppressing and / or absorbing EMI noise from the cable or the other component at frequencies ranging from 5 GHz to 70 GHz when the EMI absorber is located on a portion or another component of a cable such that the EMI absorber surrounds the portion or the other component of the cable.

[0007] The EMI absorber includes a one-piece molded thermoplastic EMI absorber that defines a path to allow the EMI absorber to be assembled onto a cable; and when the EMI absorber is assembled onto the cable, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass along the cable in differential mode.

[0008] The EMI absorber includes a one-piece molded thermoplastic cylindrical or ring-shaped EMI absorber that defines a circular path to allow the EMI absorber to be assembled onto a circular cable; and when the EMI absorber is assembled onto the circular cable, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass along the circular cable in differential mode.

[0009] The one-piece molded thermoplastic cylindrical or annular EMI absorber has an inner diameter ranging from 0.1 inches to 1 inch, an outer diameter ranging from 0.25 inches to 1.25 inches, and a wall thickness of 2 mm.

[0010] The EMI absorber includes a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber, which are respectively disposed within a first closable housing portion and a second closable housing portion of the housing, or respectively disposed along the first closable housing portion and the second closable housing portion of the housing. The first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber are configured such that when the first closable housing portion and the second closable housing portion are closed, the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber together define a path to allow the EMI absorber to be assembled onto a cable; and when the EMI absorber is assembled onto the cable, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise including frequencies from 5 GHz to 70 GHz, while allowing desired data signals or power to pass along the cable in differential mode.

[0011] The first and second molded thermoplastic EMI absorbers are configured such that when the first and second closable housing portions are closed, the first and second molded thermoplastic EMI absorbers together define a circular path to allow the EMI absorbers to be assembled onto a circular cable; and when the EMI absorbers are assembled onto the circular cable, the EMI absorbers are operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass along the circular cable in differential mode.

[0012] The first and second molded thermoplastic EMI absorbers are configured such that when the first and second closable housing portions are closed, the first and second molded thermoplastic EMI absorbers together define a rectangular path to allow the EMI absorbers to be assembled onto a stripline cable; and when the EMI absorbers are assembled onto the stripline cable, the EMI absorbers are operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass along the stripline cable in differential mode.

[0013] The housing is configured to have a width ranging from about 0.1 inches to about 1 inch, a length ranging from about 0.25 inches to about 1.25 inches, and a wall thickness of about 2 millimeters.

[0014] The first closable housing portion and the second closable housing portion are hinged together along a first side via a movable hinge; and the first closable housing portion and the second closable housing portion are configured to snap together along a second side opposite to the first side.

[0015] The EMI absorber includes a one-piece molded thermoplastic EMI absorber that defines multiple cavities or holes to allow the EMI absorber to be assembled onto a cable or other component; and when the EMI absorber is assembled onto the cable or other component, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through in differential mode. Attached Figure Description

[0016] The accompanying drawings described herein are for illustrative purposes only, representing selected embodiments and not all possible embodiments, and are not intended to limit the scope of this disclosure.

[0017] Figure 1An EMI suppression thermoplastic absorber according to an exemplary embodiment of the present disclosure is shown.

[0018] Figure 2 An EMI suppression thermoplastic absorber within a housing according to an exemplary embodiment of the present disclosure is shown.

[0019] Figure 3 An EMI suppression thermoplastic absorber according to an exemplary embodiment of the present disclosure is shown.

[0020] Figure 4 An EMI suppression thermoplastic absorber within a housing according to an exemplary embodiment of the present disclosure is shown.

[0021] Figure 5 An EMI suppression thermoplastic absorber according to an exemplary embodiment of the present disclosure is shown.

[0022] Figure 6 An EMI suppression thermoplastic absorber according to an exemplary embodiment of the present disclosure is shown.

[0023] Figure 7 It shows that it can be set with Figure 1 The example shown is a circular shielded high-density cable with an EMI suppression thermoplastic absorber.

[0024] Figure 8 It shows that it can be set with Figure 4 An exemplary ribbon cable for an EMI suppression thermoplastic absorber is shown.

[0025] Figure 9 It shows that it can be set with Figure 5 An example cable for an EMI suppression thermoplastic absorber is shown.

[0026] Figure 10 This is a line graph of the attenuation (in dB / cm) versus frequency (in GHz) of an injection-molded EMI suppression thermoplastic absorber comprising a liquid crystal polymer (LCP) resin system and magnetic particles within the LCP resin system, according to an exemplary embodiment of this disclosure.

[0027] Throughout the various views in the accompanying drawings, corresponding reference numerals may indicate corresponding (though not necessarily identical) parts. Detailed Implementation

[0028] The exemplary implementation will now be described more fully with reference to the accompanying drawings.

[0029] For example, the data rates of high-speed round or flat cables used in PCIe 5.0, 6.0, and future 7.0 generations continue to evolve, with newer versions and future generations supporting even faster data rates. Faster data rates will increase the EMI frequency range. For example, noise has been observed between 5 GHz and 50 GHz.

[0030] As recognized in this article, a better 360-degree electrical connection between cable shielding and connector shielding can help mitigate EMI issues, but fitting this into conventional EMI gaskets that are operable for suppressing and / or absorbing EMI above 20 GHz will be a challenging task. Furthermore, conventional ferrite-based EMI suppressors are limited to effectively absorbing only lower frequencies, typically below 5 GHz, and are therefore unsuitable for suppressing and / or absorbing common-mode EMI noise above 5 GHz.

[0031] In light of the above, this document develops and / or discloses exemplary embodiments of thermoplastic EMI absorbers that can be used to suppress and / or absorb relatively high-frequency (e.g., 5 GHz to 70 GHz, above 70 GHz, etc.) EMI noise from high-speed cables, such as those used for interconnections from chip to board, integrated circuit (IC) package to board, input / output (I / O) panel to board, board to board, module to board, subsystem to board, and supporting high-speed interconnection technology standards (e.g., PCIe 5 / 6 / 7 and Computer High Speed ​​Link (CXL) 3.1, etc.).

[0032] In an exemplary embodiment, the EMI absorber includes a molded (e.g., injection molding, hot molding, other molding processes, etc.) thermoplastic absorber that can operate with EMI suppression of more than 20 dB for frequencies, for example, between 5 GHz and 70 GHz, without requiring a good 360-degree electrical connection between the cable shield and the connector shield.

[0033] In an exemplary embodiment, the EMI absorber is injection molded from an injection moldable material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system. In other exemplary embodiments, the EMI absorber is thermomolded from a thermoplastic polymer material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system. The thermoplastic polymer resin system may include liquid crystal polymer (LCP), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomer (TPE), polyamide (PA), nylon, etc.

[0034] In an exemplary embodiment, the EMI absorber is injection molded from a high-temperature, magnetically loaded injection-moldable material. The injection-moldable material includes a liquid crystal polymer (LCP) resin system and magnetic particles within the LCP resin system. When used with round cables (e.g., Figure 7 When used together with other materials, injection-molded thermoplastic EMI absorbers can operate with excellent EMI suppression of over 20 dB for frequencies between 5 GHz and 70 GHz without requiring a good electrical connection between the 360-degree cable shield and connector shield. In exemplary embodiments, injection-molded materials comprising liquid crystal polymer (LCP) resin systems and magnetic particles may have the following characteristics and benefits: good high-temperature resistance, high dimensional stability, low coefficient of thermal expansion, RoHS compliance, halogen-free, ULVO flammability rating, and good attenuation (e.g., as...). Figure 10 The attenuation shown is approximately 40 dB / cm at a frequency of approximately 15 GHz, greater than 30 dB / cm at a frequency of approximately 12 GHz to approximately 40 GHz, and greater than 20 dB at a frequency of 5 GHz to 40 GHz, etc.), tensile strength of 40 MPa, elongation at 0.5%, cantilever beam notched impact strength of 22 joules / m, flexural strength of 60 MPa, and flexural modulus of 13 gigapascals (GPa).

[0035] In other exemplary embodiments, the EMI absorber is molded from an injection-moldable or thermo-moldable thermoplastic polymer material that is not based on an LCP resin system. For example, another exemplary embodiment includes an EMI absorber that is injection-molded from an injection-moldable absorber material comprising a polybutylene terephthalate (PBT) thermoplastic polymer resin system. Magnetic particles are located within the PBT resin system.

[0036] In another exemplary embodiment, the EMI absorber is injection molded from an injection-moldable absorbing material comprising a polypropylene (PP) thermoplastic polymer resin system. Magnetic particles are contained within the PP resin system.

[0037] In another exemplary embodiment, the EMI absorber is injection molded from a thermoplastic resin system comprising a polypropylene blend resin system. Magnetic particles are located within the polypropylene blend resin system.

[0038] In another exemplary embodiment, the EMI absorber is injection molded from an injection-moldable absorber material comprising a thermoplastic elastomer (TPE) resin system. Magnetic particles are contained within the TPE resin system.

[0039] In another exemplary embodiment, the EMI absorber is injection molded from an injection-moldable absorbing material comprising a polyamide (PA) resin system. Magnetic particles are contained within the PA resin system.

[0040] In another exemplary embodiment, the EMI absorber is injection molded from an injection-moldable absorber material comprising a nylon resin system. Magnetic particles are contained within the nylon resin system.

[0041] Refer to the attached diagram. Figure 1 A plurality of EMI-suppressing thermoplastic absorbers 100 according to exemplary embodiments of the present disclosure are shown. Figure 1 As shown, each absorber 100 comprises a single-piece, monolithically molded cylindrical or annular absorber without an external plastic housing. Each absorber 100 includes or defines an annular or circular passage therethrough to allow the absorber 100 to be assembled or positioned on a circular cable (e.g., Figure 8 The circular shielded high-density cable 101 shown in the figure is on the cable.

[0042] When the absorber 100 is assembled on a round cable, the absorber 100 is operable to suppress and / or absorb common-mode EMI noise at relatively high frequencies (e.g., 5 GHz to 70 GHz, above 70 GHz, etc.) while allowing the desired data signal or power to pass along the round cable in differential mode. For example, the absorber 100 can operate to provide excellent EMI suppression of more than 20 dB for frequencies between 5 GHz and 70 GHz.

[0043] In an exemplary embodiment, the absorber 100 is injection molded from an injection-moldable material comprising a thermoplastic polymer resin system. Magnetic particles are located within the thermoplastic polymer resin system. In other exemplary embodiments, the absorber 100 is thermomolded from a thermoplastic moldable material comprising a thermoplastic polymer resin system and magnetic particles within that system. The thermoplastic polymer resin system may include liquid crystal polymers (LCP), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomers (TPE), polyamides (PA), nylon, etc.

[0044] For example, the EMI suppression thermoplastic absorber 100 may have an inner diameter ranging from about 0.1 inches to about 1 inch, an outer diameter ranging from about 0.25 inches to about 1.25 inches, and a wall thickness of about 2 millimeters. In alternative embodiments, the EMI suppression thermoplastic absorber 100 may be configured differently, for example, with smaller or larger dimensions for the inner diameter, outer diameter, and / or wall thickness.

[0045] Figure 2An EMI-suppressing thermoplastic absorber 200 within a housing 204 according to an exemplary embodiment of this disclosure is shown. For example... Figure 2 As shown, the housing 204 (e.g., nylon, other plastics, etc.) includes a first closable housing portion 208 and a second closable housing portion 212 connected along a first side (e.g., connected via a hinged joint, having a clamshell configuration, etc.). The first closable housing portion 208 and the second closable housing portion 212 are configured to attach to each other along opposite second sides (e.g., snap together, etc.).

[0046] A first molded thermoplastic EMI absorber 216 and a second molded thermoplastic EMI absorber 220 are respectively disposed within or along the first closable housing portion 208 and the second closable housing portion 212. When the first closable housing portion 208 and the second closable housing portion 212 are attached to each other (e.g., snapped together, etc.), the first molded thermoplastic EMI absorber 216 and the second molded thermoplastic EMI absorber 220 together define an annular or circular passage therethrough, allowing the absorber 200 (e.g., two absorber halves, etc.) to be assembled or positioned on a circular cable (such as... Figure 8 The circular shielded high-density cable 101 shown is on the cable.

[0047] When assembled on a round cable, the first molded thermoplastic EMI absorber 216 and the second molded thermoplastic EMI absorber 220 are operable to suppress and / or absorb common-mode EMI noise at relatively high frequencies (e.g., 5 GHz to 70 GHz, above 70 GHz, etc.) while allowing the desired data signal or power to pass along the round cable in differential mode. For example, the first molded thermoplastic EMI absorber 216 and the second molded thermoplastic EMI absorber 220 can operate to provide excellent EMI suppression of more than 20 dB for frequencies between 5 GHz and 70 GHz.

[0048] In an exemplary embodiment, the first molded thermoplastic EMI absorber 216 and the second molded thermoplastic EMI absorber 220 are injection molded from an injection-moldable material comprising a thermoplastic polymer resin system. Magnetic particles are located within the thermoplastic polymer resin system. In other exemplary embodiments, the first molded thermoplastic EMI absorber 216 and the second molded thermoplastic EMI absorber 220 are thermomolded from a thermoplastic polymer resin system comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system. The thermoplastic polymer resin system may include liquid crystal polymer (LCP), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomer (TPE), polyamide (PA), nylon, etc.

[0049] Figure 3 An EMI suppression thermoplastic absorber 300 according to an exemplary embodiment of the present disclosure is shown. Figure 3 As shown, absorber 300 comprises a single-piece, monolithic molded EMI absorber without an external plastic housing. Absorber 300 includes or defines a passage 302 (e.g., having a generally rectangular shape with rounded corners, etc.) through it to allow the thermoplastic absorber to be assembled or positioned on a ribbon cable (e.g., Figure 9 The high-speed ribbon cable 401 shown is on the cable.

[0050] When the absorber 300 is assembled on a ribbon cable, it is operable to suppress and / or absorb common-mode EMI noise at relatively high frequencies (e.g., 5 GHz to 70 GHz, above 70 GHz, etc.) while allowing the desired data signal or power to pass along the ribbon cable in differential mode. For example, the absorber 300 may operate to provide excellent EMI suppression of more than 20 dB for frequencies between 5 GHz and 70 GHz.

[0051] In an exemplary embodiment, the absorber 300 is injection molded from an injection-moldable material comprising a thermoplastic polymer resin system. Magnetic particles are located within the thermoplastic polymer resin system. In other exemplary embodiments, the absorber 300 is thermomolded from a thermoplastic polymer resin system comprising a thermoplastic polymer resin system and magnetic particles within that system. The thermoplastic polymer resin system may include liquid crystal polymers (LCPs), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomers (TPEs), polyamides (PAs), nylon, etc.

[0052] For example, the height of the EMI suppression thermoplastic absorber 300 can range from about 0.1 inches to about 1 inch, the width can range from about 0.25 inches to about 1.25 inches, and the wall thickness can be about 2 millimeters. In alternative embodiments, the EMI suppression thermoplastic absorber can be configured differently, for example, having smaller or larger dimensions for height, width, and / or wall thickness.

[0053] Figure 4 An EMI-suppressing thermoplastic absorber 400 within a housing 404 according to an exemplary embodiment of this disclosure is shown. For example... Figure 4 As shown, housing 404 (e.g., nylon, other plastics, etc.) includes a first closable housing portion 408 and a second closable housing portion 412 connected along a first side (e.g., connected via a hinged joint, having a clamshell configuration, etc.). The first closable housing portion 408 and the second closable housing portion 412 are configured to attach to each other along opposite second sides (e.g., snap together, etc.).

[0054] A first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber are respectively disposed within or along the first closable housing portion 408 and the second closable housing portion 412. When the first closable housing portion 408 and the second closable housing portion 412 are attached to each other (e.g., snapped together, etc.), the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber together define a passage 402 (e.g., having a generally rectangular shape with rounded corners, etc.) therethrough to allow the absorber 400 to be assembled or positioned on a ribbon cable (such as...). Figure 9 The high-speed ribbon cable 401 shown is on the cable.

[0055] When assembled on a ribbon cable, the first and second molded thermoplastic EMI absorbers within housing 404 are operable to suppress and / or absorb common-mode EMI noise at relatively high frequencies (e.g., 5 GHz to 70 GHz, above 70 GHz, etc.) while allowing the desired data signal or power to pass along the ribbon cable in differential mode. For example, the first and second molded thermoplastic EMI absorbers within housing 404 can operate to provide excellent EMI suppression of more than 20 dB for frequencies between 5 GHz and 70 GHz.

[0056] In an exemplary embodiment, the first and second molded thermoplastic EMI absorbers of absorber 400 are injection molded from an injection-moldable material comprising a thermoplastic polymer resin system. Magnetic particles are located within the thermoplastic polymer resin system. In other exemplary embodiments, the first and second molded thermoplastic EMI absorbers of absorber 400 are thermomolded from a thermoplastic polymer resin system comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system. The thermoplastic polymer resin system may include liquid crystal polymer (LCP), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomer (TPE), polyamide (PA), nylon, etc.

[0057] Figure 5 An EMI suppression thermoplastic absorber 500 according to an exemplary embodiment of the present disclosure is shown. Figure 5As shown, the absorber 500 includes a first molded thermoplastic EMI absorber 516 and a second molded thermoplastic EMI absorber 520. When the first molded thermoplastic EMI absorber 516 and the second molded thermoplastic EMI absorber 520 are positioned adjacent to and / or in abutment contact with each other, the first molded thermoplastic EMI absorber 516 and the second molded thermoplastic EMI absorber 520 together define a plurality of cavities or openings 502 (e.g., having a generally rectangular shape, etc.). The plurality of cavities or openings 502 are configured to allow the absorber 500 to be assembled or positioned on a cable (e.g., Figure 8 The absorber 500 can also be assembled or applied to 3X connectors, components, input / output (I / O) ports, metal shields, integrated circuit (IC) chips, etc. In an alternative embodiment, the absorber 500 may include a monolithic injection-molded EMI absorber defining a plurality of cavities or openings 502.

[0058] When assembled onto cables or other components, absorber 500 is operable to suppress and / or absorb common-mode EMI noise at relatively high frequencies (e.g., 5 GHz to 70 GHz, above 70 GHz, etc.) while allowing desired data signals or power to pass through in differential mode. For example, absorber 500 can operate to provide excellent EMI suppression of more than 20 dB for frequencies between 5 GHz and 70 GHz.

[0059] In an exemplary embodiment, the absorber 500 is injection molded from an injection-moldable material comprising a thermoplastic polymer resin system. Magnetic particles are located within the thermoplastic polymer resin system. In other exemplary embodiments, the absorber 500 is thermomolded from a thermoplastic material comprising a thermoplastic polymer resin system and magnetic particles within that system. The thermoplastic polymer resin system may comprise liquid crystal polymer (LCP), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomers (TPE), polyamide (PA), nylon, etc.

[0060] Figure 6 An EMI suppression thermoplastic absorber 600 according to an exemplary embodiment of the present disclosure is shown. Figure 6As shown, absorber 600 includes a one-piece, monolithic molded EMI absorber that includes or defines an opening 602 (e.g., having a generally rectangular shape, etc.). Absorber 600 is configured to be mounted on, positioned around, or surround connector brackets or metal shields 603 for suppressing and / or absorbing EMI noise at relatively high frequencies (e.g., 5 GHz to 70 GHz, above 70 GHz, etc.). For example, thermoplastic absorber 600 can operate to provide excellent EMI suppression of more than 20 dB for frequencies between 5 GHz and 70 GHz.

[0061] In an exemplary embodiment, the absorber 600 is injection molded from an injection-moldable material comprising a thermoplastic polymer resin system. Magnetic particles are located within the thermoplastic polymer resin system. In other exemplary embodiments, the absorber 600 is thermomolded from a thermoplastic material comprising a thermoplastic polymer resin system and magnetic particles within that system. The thermoplastic polymer resin system may include liquid crystal polymers (LCP), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomers (TPE), polyamides (PA), nylon, etc.

[0062] This document discloses exemplary embodiments of EMI absorbers that can be used to suppress and / or absorb relatively high-frequency (e.g., 5 GHz to 70 GHz, above 70 GHz, etc.) EMI noise from high-speed cables, such as those used for interconnects from chip to board, integrated circuit (IC) package to board, input / output (I / O) panel to board, board to board, module to board, subsystem to board, and supporting high-speed interconnect technology standards (e.g., Peripheral Component Interconnect High Speed ​​(PCIe) 5 / 6 / 7, etc. and Computer High Speed ​​Link (CXL) 3.1, etc.). In an exemplary embodiment, the EMI absorber includes a moldable thermoplastic EMI absorber configured to suppress and / or absorb EMI noise from the cable or another component at frequencies ranging from 5 GHz to 70 GHz when the EMI absorber is located on a portion or another component of the cable, for example, when the EMI absorber completely and / or continuously surrounds (e.g., in a 360-degree configuration, etc.) a portion or another component of the cable.

[0063] In an exemplary embodiment, the EMI absorber includes a one-piece molded (e.g., injection molding, hot molding, other molding processes, etc.) thermoplastic EMI absorber that defines a path to allow the EMI absorber to be assembled onto a cable. When the EMI absorber is assembled onto the cable, it can be used to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass along the cable in differential mode.

[0064] In an exemplary embodiment, the EMI absorber includes a one-piece molded (e.g., injection molded, thermoformed, other molding processes, etc.) cylindrical or ring-shaped EMI absorber that defines a circular path to allow the EMI absorber to be assembled onto a circular cable. When the EMI absorber is assembled onto a circular cable, it can be used to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass along the circular cable in differential mode. The one-piece molded cylindrical or ring-shaped EMI absorber may have an inner diameter ranging from about 0.1 inches to about 1 inch, an outer diameter ranging from about 0.25 inches to about 1.25 inches, and a wall thickness of about 2 millimeters.

[0065] In an exemplary embodiment, the EMI absorber includes a first molded (e.g., injection molding, hot molding, other molding processes, etc.) thermoplastic EMI absorber disposed within or along a first and second closable housing portion of the housing. Furthermore, the first and second molded thermoplastic EMI absorbers are configured such that when the first and second closable housing portions are closed, they collectively define a path to allow the EMI absorber to be mounted onto a cable. When mounted onto a cable, the EMI absorber can suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass along the cable in differential mode.

[0066] In an exemplary embodiment, a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber are configured such that when the first and second closable housing portions are closed, the first and second molded thermoplastic EMI absorbers together define a circular path to allow the EMI absorber to be assembled onto a circular cable. When the EMI absorber is assembled onto the circular cable, it can be used to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through the circular cable in differential mode.

[0067] In an exemplary embodiment, a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber are configured such that when the first and second closable housing portions are closed, the first and second molded EMI absorbers together define a rectangular path to allow the EMI absorber to be assembled onto a stripline cable. When the EMI absorber is assembled onto the stripline cable, it can be used to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass along the stripline cable in differential mode. The housing may be configured to have a width ranging from about 0.1 inches to about 1 inch, a length ranging from about 0.25 inches to about 1.25 inches, and a wall thickness of about 2 millimeters.

[0068] In an exemplary embodiment, a first closable housing portion and a second closable housing portion are hinged together along a first side via a movable hinge. Furthermore, the first and second closable housing portions are configured to snap shut along a second side opposite the first side. In such an exemplary embodiment, the EMI absorber may have a clamshell configuration.

[0069] In an exemplary embodiment, the EMI absorber includes a one-piece molded (e.g., injection molded, hot molded, other molding processes, etc.) EMI absorber that defines multiple cavities or holes to allow the EMI absorber to be assembled onto a cable or another component. When the EMI absorber is assembled onto a cable or another component, it can be used to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through in differential mode.

[0070] In an exemplary embodiment, the EMI absorber includes a first molded (e.g., injection molded, hot molded, other molding processes, etc.) thermoplastic EMI absorber and a second molded thermoplastic EMI absorber. The first and second molded thermoplastic EMI absorbers are configured to collectively define a plurality of cavities or openings therebetween when positioned adjacent to and / or in contact with each other. The plurality of cavities or openings are configured to allow the EMI absorber to be mounted onto a cable or another component. When mounted onto a cable or other component, the EMI absorber can be used to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through in differential mode.

[0071] In an exemplary embodiment, the EMI absorber includes a one-piece molded (e.g., injection molding, hot molding, other molding processes, etc.) thermoplastic EMI absorber that defines an opening to allow the EMI absorber to be assembled onto a connector bracket or shield. When the EMI absorber is assembled onto the connector bracket or shield, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz.

[0072] In an exemplary embodiment, the EMI absorber defines a circular opening therethrough, which is configured to allow the EMI absorber to be assembled onto a circular cable.

[0073] In an exemplary embodiment, the EMI absorber defines a rectangular opening through the EMI absorber, which is configured to allow the EMI absorber to be assembled onto a ribbon cable.

[0074] In an exemplary embodiment, the EMI absorber defines a rectangular opening through the EMI absorber, which is configured to allow the EMI absorber to be assembled onto a connector bracket or a metal shield.

[0075] In an exemplary embodiment, the EMI absorber defines multiple cavities or openings through the EMI absorber to allow the EMI absorber to be assembled onto another component.

[0076] In an exemplary embodiment, the EMI absorber is configured to operate by providing EMI suppression of more than 20 dB for frequencies from 5 GHz to 70 GHz. In such an exemplary embodiment, the EMI absorber may have a wall thickness ranging from about 2 mm to about 20 mm, an inner diameter ranging from about 2 mm to about 20 mm, an outer diameter ranging from about 4 mm to about 40 mm, and a length ranging from about 2 mm to about 40 mm.

[0077] In an exemplary embodiment, the EMI absorber is configured to provide EMI suppression of more than 20 dB for frequencies from 5 GHz to 70 GHz when used with a high-speed cable that can support high-speed interconnect technologies, including Peripheral Component Interconnect High Speed ​​(PCIe) 5.0, 6.0, or 7.0, or Computer High Speed ​​Link (CXL) 3.1. In such an exemplary embodiment, the EMI absorber may have a wall thickness ranging from about 2 mm to about 20 mm, an inner diameter ranging from about 2 mm to about 20 mm, an outer diameter ranging from about 4 mm to about 40 mm, and a length ranging from about 2 mm to about 40 mm.

[0078] In an exemplary embodiment, the EMI absorber includes a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber having a clamshell configuration. The first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber define an opening or passage therebetween to allow the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber to be positioned on a portion of a cable or another component.

[0079] In an exemplary embodiment, the EMI absorber is thermomolded from a thermomoldable material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system.

[0080] In an exemplary embodiment, the EMI absorber is injection molded from an injection moldable material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system. The thermoplastic polymer resin system includes liquid crystal polymer (LCP), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomer (TPE), polyamide (PA), or nylon.

[0081] In an exemplary embodiment, the EMI absorber is injection molded from an injection-moldable material comprising a liquid crystal polymer (LCP) resin system and magnetic particles within the liquid crystal polymer (LCP) resin system.

[0082] Exemplary components are also disclosed, including the EMI absorber disclosed herein and a high-speed cable that can be used to support high-speed interconnect technologies, such as Peripheral Component Interconnect High Speed ​​(PCIe) 5.0, 6.0, or 7.0, or Computer High Speed ​​Link (CXL) 3.1, etc. The EMI absorber is configured to provide EMI suppression of frequencies above 20 dB for the high-speed cable at frequencies from 5 GHz to 70 GHz. In such an exemplary embodiment, the EMI absorber may have a wall thickness ranging from about 2 mm to about 20 mm, an inner diameter ranging from about 2 mm to about 20 mm, an outer diameter ranging from about 4 mm to about 40 mm, and a length ranging from about 2 mm to about 40 mm. Furthermore, the EMI absorber may be injection molded from an injection-moldable material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system. Furthermore, the thermoplastic polymer resin system may include liquid crystal polymer (LCP), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomer (TPE), polyamide (PA), or nylon.

[0083] In an exemplary embodiment, the method includes positioning an EMI absorber disclosed herein on a portion or another component of a cable such that the EMI absorber completely and / or continuously surrounds the portion or another component of the cable, wherein the EMI absorber can be used to suppress and / or absorb EMI noise from the cable or another component, including frequencies from 5 GHz to 70 GHz.

[0084] An exemplary method for providing an electromagnetic interference (EMI) absorber is disclosed for suppressing and / or absorbing EMI noise from a cable or another component at frequencies ranging from 5 GHz to 70 GHz. The method includes molding a thermoplastic EMI absorber such that the molded thermoplastic EMI absorber can be positioned on a portion of the cable or another component to surround that portion or other component, wherein the molded thermoplastic EMI absorber is operable for suppressing and / or absorbing EMI noise from the cable or another component at frequencies ranging from 5 GHz to 70 GHz.

[0085] In an exemplary method, molding a thermoplastic EMI absorber includes injection molding a moldable material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system.

[0086] In an exemplary method, molding a thermoplastic EMI absorber includes thermally molding a thermomoldable material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system.

[0087] In an exemplary method, the molded thermoplastic EMI absorber includes a molded one-piece molded thermoplastic EMI absorber that defines an opening or passage to allow the one-piece molded thermoplastic EMI absorber to be positioned on a portion of a cable or another component.

[0088] In an exemplary method, molding a thermoplastic EMI absorber includes molding a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber (e.g., having a clamshell configuration, etc.). The first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber define an opening or passage therebetween to allow the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber to be positioned on a portion of a cable or another component.

[0089] In an exemplary method, a molded thermoplastic EMI absorber includes a molded thermoplastic EMI absorber such that the molded thermoplastic EMI absorber can be positioned on a portion of a high-speed cable to completely and / or continuously surround that portion of the high-speed cable, wherein the molded thermoplastic EMI absorber is operable to suppress and / or absorb EMI noise from the high-speed cable, which is operable to support high-speed interconnect technologies (including Peripheral Component Interconnect High Speed ​​(PCIe) 5.0, 6.0, or 7.0 or Computer High Speed ​​Link (CXL) 3.1).

[0090] An exemplary method for suppressing and / or absorbing EMI noise from a cable or another component at frequencies ranging from 5 GHz to 70 GHz is also disclosed. The method includes positioning a molded thermoplastic EMI absorber on a portion of the cable or another component such that the molded thermoplastic EMI absorber surrounds that portion of the cable or other component, wherein the molded thermoplastic EMI absorber is operable to suppress and / or absorb EMI noise from the cable or another component at frequencies ranging from 5 GHz to 70 GHz.

[0091] In an exemplary method, positioning a molded thermoplastic EMI absorber on a portion or another part of a cable includes: positioning the molded thermoplastic EMI absorber on a portion of a high-speed cable such that the molded thermoplastic EMI absorber completely and / or entirely surrounds that portion of the high-speed cable, the portion of the high-speed cable being operable to support high-speed interconnect technologies, including Peripheral Component Interconnect High Speed ​​(PCIe) 5.0, 6.0, or 7.0 or Computer High Speed ​​Link (CXL) 3.1.

[0092] In an exemplary method, the molded thermoplastic EMI absorber includes a plurality of molded thermoplastic EMI absorbers, including a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber (e.g., having a clamshell configuration, etc.). The first and second molded thermoplastic EMI absorbers define an opening or passage therebetween to allow the first and second molded thermoplastic EMI absorbers to be positioned on a portion of a cable or another component.

[0093] In an exemplary method, the molded thermoplastic EMI absorber includes a one-piece molded thermoplastic EMI absorber that defines an opening or passage to allow the one-piece molded thermoplastic EMI absorber to be positioned on a portion of a cable or another component.

[0094] This application involves the following provisions:

[0095] 1. An electromagnetic interference (EMI) absorber, the EMI absorber comprising a moldable thermoplastic EMI absorber, and the EMI absorber being configured to operate for suppressing and / or absorbing EMI noise from the cable or the other component at frequencies ranging from 5 GHz to 70 GHz when the EMI absorber is located on a portion or another component of a cable such that the EMI absorber surrounds said portion or the other component.

[0096] 2. The EMI absorber according to Clause 1, wherein:

[0097] The EMI absorber includes a one-piece molded thermoplastic EMI absorber that defines a path to allow the EMI absorber to be assembled onto a cable; and

[0098] When the EMI absorber is assembled onto the cable, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through the cable in differential mode.

[0099] 3. The EMI absorber according to Clause 1, wherein:

[0100] The EMI absorber includes a one-piece molded thermoplastic cylindrical or annular EMI absorber that defines a circular path to allow the EMI absorber to be assembled onto a circular cable; and

[0101] When the EMI absorber is assembled onto the circular cable, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through the circular cable in differential mode.

[0102] 4. The EMI absorber according to Clause 3, wherein the one-piece molded thermoplastic cylindrical or annular EMI absorber has an inner diameter ranging from 0.1 inches to 1 inch, an outer diameter ranging from 0.25 inches to 1.25 inches, and a wall thickness of 2 mm.

[0103] 5. The EMI absorber according to Clause 1, wherein:

[0104] The EMI absorber includes a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber. The first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber are respectively disposed within the first closable housing portion and the second closable housing portion of the housing, or respectively disposed along the first closable housing portion and the second closable housing portion of the housing.

[0105] The first and second molded thermoplastic EMI absorbers are configured such that when the first and second closable housing portions are closed, the first and second molded thermoplastic EMI absorbers together define a path to allow the EMI absorbers to be assembled onto a cable; and

[0106] When the EMI absorber is assembled onto the cable, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through the cable in differential mode.

[0107] 6. The EMI absorber as described in Clause 5, wherein:

[0108] The first and second molded thermoplastic EMI absorbers are configured such that when the first and second closable housing portions are closed, the first and second molded thermoplastic EMI absorbers together define a circular path to allow the EMI absorbers to be assembled onto a circular cable; and

[0109] When the EMI absorber is assembled onto the circular cable, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through the circular cable in differential mode.

[0110] 7. The EMI absorber as described in Clause 5, wherein:

[0111] The first and second molded thermoplastic EMI absorbers are configured such that when the first and second closable housing portions are closed, the first and second molded thermoplastic EMI absorbers together define a rectangular path to allow the EMI absorbers to be assembled onto a ribbon cable; and

[0112] When the EMI absorber is assembled onto the ribbon cable, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through the ribbon cable in differential mode.

[0113] 8. The EMI absorber according to Clause 7, wherein the housing is configured to have a width ranging from 0.1 inches to 1 inch, a length ranging from 0.25 inches to 1.25 inches, and a wall thickness of 2 millimeters.

[0114] 9. The EMI absorber as described in Clause 5, wherein:

[0115] The first closable housing portion and the second closable housing portion are hinged together along the first side via a movable hinge; and

[0116] The first closable housing portion and the second closable housing portion are configured to snap shut along a second side opposite to the first side.

[0117] 10. The EMI absorber according to Clause 1, wherein:

[0118] The EMI absorber includes a one-piece molded thermoplastic EMI absorber that defines multiple cavities or holes to allow the EMI absorber to be assembled onto a cable or another component; and

[0119] When the EMI absorber is assembled onto the cable or another component, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through in differential mode.

[0120] 11. The EMI absorber according to Clause 1, wherein:

[0121] The EMI absorber includes a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber, wherein the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber are configured to, when positioned adjacent to and / or in abutment contact with each other, jointly define a plurality of cavities or openings between the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber, the plurality of cavities or openings being configured to allow the EMI absorber to be assembled onto a cable or another component; and

[0122] When the EMI absorber is assembled onto the cable or another component, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz, while allowing desired data signals or power to pass through in differential mode.

[0123] 12. The EMI absorber according to Clause 1, wherein:

[0124] The EMI absorber includes a one-piece molded thermoplastic EMI absorber that defines an opening to allow the EMI absorber to be assembled onto a connector bracket or shield; and

[0125] When the EMI absorber is assembled onto the connector bracket or shield, the EMI absorber is operable to suppress and / or absorb common-mode EMI noise at frequencies ranging from 5 GHz to 70 GHz.

[0126] 13. The EMI absorber according to Clause 1, wherein the EMI absorber defines a circular opening through the EMI absorber, the circular opening being configured to allow the EMI absorber to be mounted on a circular cable.

[0127] 14. The EMI absorber according to Clause 1, wherein the EMI absorber defines a rectangular opening through the EMI absorber, the rectangular opening being configured to allow the EMI absorber to be mounted on a ribbon cable.

[0128] 15. The EMI absorber according to Clause 1, wherein the EMI absorber defines a rectangular opening through the EMI absorber, the rectangular opening being configured to allow the EMI absorber to be assembled onto a connector bracket or a metal shield.

[0129] 16. The EMI absorber according to Clause 1, wherein the EMI absorber defines a plurality of cavities or openings through the EMI absorber to allow the EMI absorber to be assembled onto a cable or other component.

[0130] 17. The EMI absorber according to Clause 1, wherein the EMI absorber is configured to operate to provide EMI suppression of more than 20 dB for frequencies from 5 GHz to 70 GHz.

[0131] 18. The EMI absorber according to Clause 17, wherein the EMI absorber has a wall thickness in the range of 2 mm to 20 mm, an inner diameter in the range of 2 mm to 20 mm, an outer diameter in the range of 4 mm to 40 mm, and a length in the range of 2 mm to 40 mm.

[0132] 19. The EMI absorber according to Clause 1, wherein the EMI absorber is configured to operate with EMI suppression of more than 20 dB for frequencies from 5 GHz to 70 GHz when used with a high-speed cable, the high-speed cable being operable to support high-speed interconnect technologies, including peripheral component interconnect high-speed PCIe 5.0, 6.0 or 7.0 or computer high-speed link CXL 3.1.

[0133] 20. The EMI absorber according to Clause 19, wherein the EMI absorber has a wall thickness in the range of 2 mm to 20 mm, an inner diameter in the range of 2 mm to 20 mm, an outer diameter in the range of 4 mm to 40 mm, and a length in the range of 2 mm to 40 mm.

[0134] 21. The EMI absorber according to Clause 1, wherein the EMI absorber includes a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber having a clamshell configuration, the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber defining an opening or passage between the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber to allow the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber to be positioned on said portion or said other component of the cable.

[0135] 22. The EMI absorber according to any one of clauses 1 and 21, wherein the EMI absorber is thermomolded from a thermomoldable material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system.

[0136] 23. The EMI absorber according to any one of clauses 1 to 21, wherein the EMI absorber is injection molded from an injection moldable material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system.

[0137] 24. The EMI absorber according to Clause 23, wherein the thermoplastic polymer resin system comprises liquid crystal polymer (LCP), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomer (TPE), polyamide (PA), or nylon.

[0138] 25. The EMI absorber according to any one of clauses 1 to 21, wherein the EMI absorber is injection molded from an injection moldable material comprising a liquid crystal polymer (LCP) resin system and magnetic particles within the LCP resin system.

[0139] 26. A component comprising an EMI absorber according to any one of claims 1 to 21 and a high-speed cable, the high-speed cable being operable to support high-speed interconnect technologies, the high-speed interconnect technologies including peripheral component interconnect high-speed PCIe 5.0, 6.0 or 7.0 or computer high-speed link CXL 3.1, wherein the EMI absorber is configured to operate to provide EMI suppression of more than 20 dB for frequencies from 5 GHz to 70 GHz of the high-speed cable.

[0140] 27. The component according to Clause 26, wherein the EMI absorber has a wall thickness in the range of 2 mm to 20 mm, an inner diameter in the range of 2 mm to 20 mm, an outer diameter in the range of 4 mm to 40 mm, and a length in the range of 2 mm to 40 mm.

[0141] 28. The component according to Clause 26, wherein the EMI absorber is injection molded from an injection moldable material comprising a thermoplastic polymer resin system and magnetic particles located within the thermoplastic polymer resin system.

[0142] 29. The component according to Clause 28, wherein the thermoplastic polymer resin system comprises liquid crystal polymer (LCP), polybutylene terephthalate (PBT), polypropylene (PP), polypropylene blends, thermoplastic elastomer (TPE), polyamide (PA), or nylon.

[0143] 30. A method of using an EMI absorber according to any one of claims 1 to 21, the method comprising the steps of: positioning the EMI absorber on a portion or another component of a cable such that the EMI absorber completely and / or continuously surrounds the portion or other component of the cable, wherein the EMI absorber is operable to suppress and / or absorb EMI noise from the cable or the other component, including frequencies from 5 GHz to 70 GHz.

[0144] 31. A method of providing an electromagnetic interference (EMI) absorber for suppressing and / or absorbing EMI noise from a cable or another component at frequencies ranging from 5 GHz to 70 GHz, the method comprising molding a thermoplastic EMI absorber such that the molded thermoplastic EMI absorber can be positioned on a portion of the cable or the other component to surround the portion of the cable or the other component, wherein the molded thermoplastic EMI absorber is operable for suppressing and / or absorbing EMI noise from the cable or the other component at frequencies ranging from 5 GHz to 70 GHz.

[0145] 32. The method according to Clause 31, wherein molding the thermoplastic EMI absorber comprises: injection molding an injection-moldable material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system.

[0146] 33. The method according to Clause 31, wherein molding the thermoplastic EMI absorber comprises: thermomolding a thermomoldable material, the thermomoldable material comprising a thermoplastic polymer resin system and magnetic particles within the thermoplastic polymer resin system.

[0147] 34. The method according to any one of clauses 31 to 33, wherein molding the thermoplastic EMI absorber comprises: molding a one-piece molded thermoplastic EMI absorber, the one-piece molded thermoplastic EMI absorber defining an opening or passage to allow the one-piece molded thermoplastic EMI absorber to be positioned on the portion of the cable or the other component.

[0148] 35. The method according to any one of clauses 31 to 33, wherein molding the thermoplastic EMI absorber comprises: molding a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber, the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber defining an opening or passage between the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber to allow the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber to be positioned on said portion or said other component of the cable.

[0149] 36. The method according to any one of clauses 31 to 33, wherein molding the thermoplastic EMI absorber comprises: molding the thermoplastic EMI absorber such that the molded thermoplastic EMI absorber can be positioned on a portion of a high-speed cable to completely and / or continuously surround said portion of the high-speed cable, wherein the molded thermoplastic EMI absorber is operable to suppress and / or absorb EMI noise from said high-speed cable, said high-speed cable being operable to support high-speed interconnect technologies including peripheral component interconnect high-speed PCIe 5.0, 6.0 or 7.0 or computer high-speed link CXL3.1.

[0150] 37. A method for suppressing and / or absorbing EMI noise from a cable or another component at frequencies ranging from 5 GHz to 70 GHz, the method comprising: positioning a molded thermoplastic EMI absorber on a portion of the cable or the other component such that the molded thermoplastic EMI absorber surrounds said portion of the cable or said other component, wherein the molded thermoplastic EMI absorber is operable for suppressing and / or absorbing EMI noise from said cable or said other component at frequencies ranging from 5 GHz to 70 GHz.

[0151] 38. The method according to Clause 37, wherein positioning the molded thermoplastic EMI absorber on the portion or another part of the cable comprises: positioning the molded thermoplastic EMI absorber on a portion of a high-speed cable such that the molded thermoplastic EMI absorber completely and / or entirely surrounds the portion of the high-speed cable, the portion of the high-speed cable being operable to support high-speed interconnect technologies, the high-speed interconnect technologies including peripheral component interconnect high-speed PCIe 5.0, 6.0 or 7.0 or computer high-speed link CXL3.1.

[0152] 39. The method according to clause 37 or 38, wherein the molded thermoplastic EMI absorber comprises a plurality of molded thermoplastic EMI absorbers, the plurality of molded thermoplastic EMI absorbers including a first molded thermoplastic EMI absorber and a second molded thermoplastic EMI absorber, the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber defining an opening or passage between the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber to allow the first molded thermoplastic EMI absorber and the second molded thermoplastic EMI absorber to be positioned on said portion or another part of the cable.

[0153] 40. The method according to clause 37 or 38, wherein the molded thermoplastic EMI absorber includes a one-piece molded thermoplastic EMI absorber defining an opening or passage to allow the one-piece molded thermoplastic EMI absorber to be positioned on said portion or another part of the cable.

[0154] Exemplary implementations are provided to make this disclosure thorough and to fully convey the scope to those skilled in the art. Numerous specific details, such as examples of specific components, apparatus, and methods, are set forth to provide a thorough understanding of embodiments of this disclosure. It will be apparent to those skilled in the art that specific details are not required, that exemplary implementations may be embodied in many different forms, and neither should be construed as limiting the scope of this disclosure. In some exemplary implementations, well-known processes, well-known device structures, and well-known techniques are not described in detail. Furthermore, advantages and improvements that may be achieved using one or more exemplary embodiments of this disclosure are provided for illustrative purposes only and do not limit the scope of this disclosure, as the exemplary embodiments disclosed herein may or may not provide all of the foregoing advantages and improvements and still fall within the scope of this disclosure.

[0155] The specific numerical dimensions and values, specific materials and / or specific shapes disclosed herein are exemplary in nature and do not limit the scope of this disclosure. The specific values ​​and specific ranges of values ​​for a given parameter disclosed herein do not exclude other values ​​and ranges of values ​​that may be used in one or more examples disclosed herein. Furthermore, it is contemplated that any two specific values ​​of a particular parameter described herein may define endpoints that may fit within a range of values ​​for the given parameter (the disclosure of a first and second value of a given parameter can be interpreted as any value between the first and second values ​​also being applicable to the given parameter). For example, if parameter X is exemplified herein as having a value A and also exemplified as having a value Z, then parameter X is contemplated to have a range of values ​​from about A to about Z. Similarly, it is contemplated that the disclosure of two or more ranges of values ​​for a parameter (whether these ranges are nested, overlapping, or distinct) encompasses all possible combinations of ranges of values ​​that may be claimed using endpoints of the disclosed ranges. For example, if parameter X is exemplified herein as having a value in the range of 1 to 10, or 2 to 9, or 3 to 8, it is also conceivable that parameter X could have other value ranges including 1 to 9, 1 to 8, 1 to 3, 1 to 2, 2 to 10, 2 to 8, 2 to 3, 3 to 10, and 3 to 9.

[0156] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not restrictive. As used herein, the singular forms “a,” “an,” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprising,” “including,” “containing,” “encompassing,” “having,” “having,” and “covering” are inclusive and thus specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. It should also be understood that additional or alternative steps may be employed.

[0157] When an element or layer is referred to as being “on,” “joined to,” “connected to,” or “attached to” another element or layer, it may be directly on, joined to, connected to, or attached to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as being “directly on,” “directly joined to,” “directly connected to,” or “directly attached to,” there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” vs. “directly between,” “adjacent” vs. “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0158] When applied to numerical values, the term "about" indicates that the calculation or measurement allows for some slight inaccuracy (somewhat close to the accuracy of the value; approximately or reasonably close to the value; almost). If, for some reason, the inaccuracy provided by "about" is not understood in this common sense in the art, then "about" as used herein at least indicates a variation that may be caused by common methods of measuring or using such parameters. For example, the terms "approximately," "about," and "substantially" may be used herein to indicate within manufacturing tolerances. Or, for example, when modifying the amount of an ingredient or reactant used in the invention, the term "about" as used herein refers to a variation in the numerical amount that may occur through the typical measurement and processing procedures used, for example, when preparing a concentrate or solution in the real world through unintentional errors in these procedures; through differences in the manufacture, source, or purity of the ingredients used to prepare the composition or carry out the method; and so on. The term "about" also covers amounts that differ due to different equilibrium conditions of the composition produced from a particular initial mixture. Whether or not modified by the term "about," the claims include equivalents of the stated amounts.

[0159] Although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or portion from another. Unless the context clearly indicates otherwise, terms such as “first,” “second,” and other numerical terms used herein do not imply order or sequence. Therefore, a first element, component, region, layer, or portion may be referred to as a second element, component, region, layer, or portion without departing from the teachings of the exemplary embodiments.

[0160] Spatial relative terms, such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., may be used herein to describe the relationship between one element or feature and another element or feature as shown in the figures. Spatial relative terms may be intended to cover different orientations of the device in use or operation other than those depicted in the figures. For example, if the device in the figures is flipped, an element described as “below” or “below” other elements or features will be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein shall be interpreted accordingly.

[0161] The foregoing description of embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or limiting of this disclosure. Various elements, intended or stated uses or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable where applicable and can be used in selected embodiments, even if not specifically shown or described. It can also be varied in many ways. Such variations should not be considered as departing from this disclosure, and all such modifications are intended to be included within the scope of this disclosure.

Claims

1. An electromagnetic interference (EMI) absorber, the EMI absorber comprising a moldable thermoplastic EMI absorber, and the EMI absorber being configured so that, when the EMI absorber is positioned on a portion of a cable or another component so that the EMI absorber encloses the portion of the cable or the other component, the EMI absorber is operable to suppress and / or absorb EMI noise from the cable or the other component including frequencies of 5 gigahertz to 70 gigahertz.

2. The EMI absorber of claim 1, wherein: the EMI absorber comprises a single-piece molded thermoplastic EMI absorber, the single-piece molded thermoplastic EMI absorber defining a passageway to allow the EMI absorber to be assembled onto a cable; and when the EMI absorber is assembled onto the cable, the EMI absorber is operable to suppress and / or absorb common mode EMI noise including frequencies of 5 gigahertz to 70 gigahertz while allowing desired data signals or power to pass along the cable in differential mode.

3. The EMI absorber of claim 1, wherein: the EMI absorber comprises a single-piece molded thermoplastic cylindrical or annular EMI absorber, the single-piece molded thermoplastic cylindrical or annular EMI absorber defining a circular passageway to allow the EMI absorber to be assembled onto a circular cable; and when the EMI absorber is assembled onto the circular cable, the EMI absorber is operable to suppress and / or absorb common mode EMI noise including frequencies of 5 gigahertz to 70 gigahertz while allowing desired data signals or power to pass along the circular cable in differential mode.

4. The EMI absorber of claim 3, wherein, the single-piece molded thermoplastic cylindrical or annular EMI absorber has an inner diameter in a range from 0.1 inch to 1 inch, an outer diameter in a range from 0.25 inch to 1.25 inch, and a wall thickness of 2 millimeters.

5. The EMI absorber of claim 1, wherein: the EMI absorber comprises first and second molded thermoplastic EMI absorbers, the first and second molded thermoplastic EMI absorbers being disposed within, or along, first and second closable housing portions, respectively, of a housing, the first and second molded thermoplastic EMI absorbers are configured so that, when the first and second closable housing portions are closed, the first and second molded thermoplastic EMI absorbers collectively define a passageway to allow the EMI absorber to be assembled onto a cable; and when the EMI absorber is assembled onto the cable, the EMI absorber is operable to suppress and / or absorb common mode EMI noise including frequencies of 5 gigahertz to 70 gigahertz while allowing desired data signals or power to pass along the cable in differential mode.

6. The EMI absorber of claim 5, wherein: The first and second molded thermoplastic EMI absorbers are configured such that, when the first and second closable housing portions are closed, the first and second molded thermoplastic EMI absorbers collectively define a circular passageway to allow the EMI absorber to be assembled onto a circular cable; and When the EMI absorber is assembled onto the circular cable, the EMI absorber is operable to suppress and / or absorb common mode EMI noise including frequencies from 5 gigahertz to 70 gigahertz, while allowing desired data signals or power to pass in differential mode along the circular cable.

7. The EMI absorber of claim 5, wherein: The first and second molded thermoplastic EMI absorbers are configured such that, when the first and second closable housing portions are closed, the first and second molded thermoplastic EMI absorbers collectively define a rectangular passageway to allow the EMI absorber to be assembled onto a ribbon cable; and When the EMI absorber is assembled onto the ribbon cable, the EMI absorber is operable to suppress and / or absorb common mode EMI noise including frequencies from 5 gigahertz to 70 gigahertz, while allowing desired data signals or power to pass in differential mode along the ribbon cable.

8. The EMI absorber of claim 7, wherein, The housing is configured to have a width in a range from 0.1 inches to 1 inch, a length in a range from 0.25 inches to 1.25 inches, and a wall thickness of 2 millimeters.

9. The EMI absorber of claim 5, wherein: The first and second closable housing portions are hingedly connected along a first side via a living hinge; and The first and second closable housing portions are configured to snap closed along a second side opposite the first side.

10. The EMI absorber of claim 1, wherein: The EMI absorber comprises a single-piece molded thermoplastic EMI absorber defining a plurality of cavities or holes to allow the EMI absorber to be assembled onto a cable or another component; and, when the EMI absorber is assembled onto the cable or another component, the EMI absorber is operable to suppress and / or absorb common mode EMI noise including frequencies from 5 gigahertz to 70 gigahertz, while allowing desired data signals or power to pass in differential mode.

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