Wafer cassette with anti-collision baffle

Abstract

A wafer box with anti-collision baffle comprises a box body, a wafer storage box and a limiting baffle. The wafer storage box is provided with a storage groove. The limiting baffle comprises a baffle and an anti-collision structure. The baffle comprises a baffle body, a side baffle and a connecting structure. Each of the two anti-collision structures comprises an anti-collision part and a guide part. Each of the anti-collision parts comprises an anti-collision surface, a contact groove, a first contact point and a second contact point. The guide part comprises a connecting end, an insertion end and a guide inclined surface. Compared with the prior art, the anti-collision part is arranged to avoid direct contact between the baffle body and the wafer, so that the wafer is not damaged due to collision, and the wafer can be stopped to avoid wafer deviation, thereby playing a protection role. The guide part is arranged to guide and correct the wafer sliding out of the wafer storage box when the box cover is buckled, so as to ensure that the wafers are arranged in order and the protection role of the anti-collision part is ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor storage technology, and in particular to a wafer cassette with a shock-absorbing baffle. Background Technology

[0002] A wafer carrier, also known as a wafer cassette, is a type of semiconductor carrier. It is a precision-designed device specifically for holding semiconductor wafers and plays a crucial role in semiconductor production. It is primarily used to place and transport wafers, simplifying the wafer transport process, reducing the risk of wafer contamination, and ensuring the smooth flow of wafers between different production stages.

[0003] In existing technologies, wafers are transported by inserting them into placement slots in wafer cassettes. During transport, the wafers may vibrate and shift, necessitating a limiting baffle inside the wafer cassette to protect them. For example, Chinese invention CN119673833B, concerning a wafer cassette with a protective limiting device, mentions a limiting frame within the wafer cassette, comprising a base plate, a wafer storage box, a cover, and a limiting assembly. The limiting assembly includes a limiting seat, a support assembly, a rotating plate, a limiting frame, and a rotating wheel. The limiting seat includes a connecting crossbar, a connecting arm, and a support baffle. The support assembly includes a connecting part, a support protrusion, a connecting rod, a tension plate, and reinforcing ribs. This technical solution uses the wafer storage box to insert the wafers and the limiting assembly to support them, effectively preventing wafer damage. Simultaneously, the support assembly provides a protective limit to the supporting action, preventing rigid support from damaging the wafers.

[0004] However, in actual use of the wafer cassette, it was found that if the limiting baffle directly abuts against the side of the wafer, the rigid contact between the wafer and the baffle, made of hard plastic, poses a risk of chipping due to edge impact. While setting the limiting baffle and wafer at a distance can control the distance to an extremely small extent, providing space for wafer movement, and ensuring that the impact force generated by the wafer's movement and collision with the limiting baffle does not damage the wafer itself, this arrangement causes the wafers inserted in the wafer storage cassette to move along inconsistent paths, resulting in different orientations for multiple layers of stacked wafers. This makes it impossible to accurately identify and align the crystallographic orientation of the wafer. As is well known, crystallographic orientation, often referred to as crystal orientation, refers to the specific orientation of the crystal structure on the wafer surface, such as… <100> or <110> If the crystallographic orientation cannot be accurately identified and aligned, it will affect subsequent steps such as photolithography, etching, and ion implantation, because the performance of semiconductor devices is highly dependent on their fabrication in a specific orientation on the crystal surface. Summary of the Invention

[0005] In view of this, the present invention provides a wafer cassette with a collision-resistant baffle to solve the above-mentioned technical problems.

[0006] A wafer cassette with anti-collision baffles includes a cassette body, a wafer storage cassette disposed within the cassette body, and a limiting baffle disposed within the cassette body. The cassette body includes a base plate and a cover that snaps onto the base plate. The wafer storage cassette has multiple storage slots. The limiting baffle includes a baffle plate and two anti-collision structures disposed on the baffle plate. The baffle plate includes a baffle body, two side baffles on both sides of the baffle body, and multiple connecting structures disposed on the baffle body. The baffle body is disposed parallel to the baffle base, and the two side baffles are disposed on both sides of the baffle body. The two anti-collision structures are respectively disposed on the two side baffles and each includes an anti-collision portion fixed to the side baffle plate and a guiding portion located on one side of the anti-collision portion. The length of the anti-collision portion extends in the same direction as the arrangement direction of the wafers within the wafer storage cassette. The anti-collision portion has an internally hollow, arched shape in a cross-section perpendicular to its extension direction. Each of the aforementioned anti-collision portions includes an arc-shaped anti-collision surface, a contact groove disposed on the anti-collision surface, a first contact point located on one side of the contact groove, and a second contact point located on the other side of the contact groove. On the same cross-section perpendicular to the extension direction of the anti-collision portion, the line connecting the center of the contact groove and the center of the anti-collision surface is spaced apart from the geometric center of the storage tank, and the line connecting the centers of the contact grooves and the centers of the anti-collision surfaces of the two anti-collision portions is located on opposite sides of the geometric center of the storage tank, so that wafers deviating from the geometric center of the storage tank can impact the first contact point or the second contact point. A guiding portion is disposed at the end of the anti-collision portion, located at the end of the anti-collision portion facing the base plate. The guiding portion includes a connecting end connected to the anti-collision portion, an insertion end located away from the end of the anti-collision portion, and a guiding ramp located between the connecting end and the insertion end. The distance from the connecting end to the side baffle surface is greater than the distance from the insertion end to the side baffle surface. The connecting end and the side baffle are connected by the guide slope to form a cone-shaped structure.

[0007] Furthermore, the base plate is a rectangular plate structure, the cover is a rectangular box with an opening on one side, the inside of the cover is a receiving cavity for placing the wafer storage box, and the opening of the cover is fastened to the base plate.

[0008] Furthermore, the baffle seat is integrally injection molded and fixed to the top of the inner side of the box cover cavity by screws. It forms a rectangular frame structure with two horizontal bars and two vertical bars. This structure is spaced apart from and parallel to the side wall of the box cover.

[0009] Furthermore, the limiting baffle also includes a baffle seat fixed on the box cover, and two connectors disposed on the baffle seat. The two connectors are spaced apart from each other and arranged in parallel. Each connector includes a rotating shaft connected to the baffle seat, two fins disposed on the rotating shaft, and a connecting rod disposed between the two fins.

[0010] Furthermore, the two ends of the rotating shaft are provided with insertion ends, the two vertical rods of the baffle seat are respectively provided with insertion holes for the rotating shaft to be inserted, and the baffle seat is also provided with a stop block.

[0011] Furthermore, both fins are integrally formed with the rotating shaft, located on opposite sides of the rotating shaft in the radial direction, spaced apart from each other and arranged symmetrically with the connecting rod as the axis of symmetry, and the extension direction of each fin is radial to the rotating shaft.

[0012] Furthermore, the two ends of the connecting rod are respectively connected to two fins, and are spaced apart from and parallel to the rotating shaft.

[0013] Furthermore, each of the aforementioned anti-collision structures is made of soft rubber.

[0014] Furthermore, the limiting baffle also includes a rotating wheel disposed on the baffle, the rotating wheel being disposed at the bottom of the baffle near the base plate, and the axis of the rotating wheel being consistent with the axis of the rotating shaft.

[0015] Furthermore, the contact groove is an arc-shaped groove formed on the anti-collision surface. The groove extends in the same direction as the anti-collision part, and the groove opening faces the wafer placed in the wafer storage box. The groove body is an arc with the curvature opposite to that of the anti-collision surface in a cross section perpendicular to its extension direction.

[0016] Compared with existing technologies, the wafer cassette with anti-collision baffle provided by this invention avoids direct contact between the baffle body and the wafer, thus preventing wafer damage due to collisions. Simultaneously, it supports the wafer, preventing misalignment due to inconsistent wafer movement paths that could lead to inaccurate crystallographic orientation identification and alignment, thereby providing excellent protection. Furthermore, the guide portion guides and corrects the wafers sliding out of the wafer storage cassette when the cassette cover is closed, ensuring neat wafer arrangement and guaranteeing the protective function of the anti-collision baffle. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a wafer cassette with a collision protection baffle provided by the present invention.

[0018] Figure 2 for Figure 1 A cross-sectional structural diagram of a wafer cassette with anti-collision baffles.

[0019] Figure 3 for Figure 1 A schematic diagram of the limiting baffle in a wafer cassette with anti-collision baffles.

[0020] Figure 4 for Figure 1 A schematic diagram of the limiting baffle of a wafer cassette with anti-collision baffle from another perspective.

[0021] Figure 5 for Figure 1 An exploded view of the limiting baffle in a wafer cassette with anti-collision baffles.

[0022] Figure 6 for Figure 1 A partial structural diagram of the limiting baffle in a wafer cassette with anti-collision baffles.

[0023] Figure 7 for Figure 1 A cross-sectional schematic diagram of the limiting baffle in a wafer cassette with anti-collision baffles.

[0024] Explanation of reference numerals in the attached drawings: Box body 10, base plate 11, box cover 12, wafer storage box 20, limiting baffle 30, baffle seat 31, connector 32, rotating shaft 321, fin 322, connecting rod 323, baffle 33, baffle body 331, side baffle 332, connecting structure 333, anti-collision structure 34, anti-collision part 341, anti-collision surface 3411, contact groove 3412, first contact point 3413, second contact point 3414, guiding part 342, connecting end 3421, insertion end 3422, guiding slope 3423, rotating wheel 35. Detailed Implementation

[0025] The following provides a more detailed description of specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the scope of protection of the present invention.

[0026] like Figures 1 to 7 The diagram shows a structural schematic of a wafer cassette with a shock-absorbing baffle provided by the present invention. The wafer cassette with a shock-absorbing baffle includes a housing 10, a wafer storage cassette 20 disposed within the housing 10, and a limiting baffle 30 disposed within the housing 10. It is conceivable that the wafer cassette with a shock-absorbing baffle also includes other functional modules such as locking components, lifting handles, etc., which are technologies well known to those skilled in the art and will not be described in detail here.

[0027] The housing 10 includes a base plate 11 and a cover 12 that fastens to the base plate 11. The base plate 11 can be a rectangular plate structure, and multiple other components are provided on the base plate 11, including but not limited to locking components, check valves, and guide components. These are all common technologies used in the field of mechanical equipment and are not the main content of this application, so they will not be described in detail here. The cover 12 is a rectangular box with an opening on one side, and the interior is a receiving cavity for placing the wafer storage box 20. The opening of the cover 12 fastens to the base plate 11 to form a closed rectangular box, thereby ensuring that the wafers stored in the wafer storage box 20 are not contaminated by dust or other substances during the process of placing the wafer storage box 20 inside and transporting it.

[0028] The wafer storage container 20 can be a holding device for placing multiple wafers. It has an opening on one side and is provided with multiple storage slots. The storage slots are disposed on the inner wall of the wafer storage container 20, and the opening direction of the slots is horizontal to allow wafers to be inserted. The container body 10 and the wafer storage container 20 themselves are existing technologies and will not be described in detail here.

[0029] The limiting baffle 30 is fixedly disposed inside the box cover 12, and includes a baffle seat 31 fixed on the box cover 12, two connectors 32 disposed on the baffle seat 31, a baffle 33 connected to the connector 32, two anti-collision structures 34 disposed on the baffle 33, and a rotating wheel 35 disposed on the baffle 33.

[0030] The baffle seat 31 can be an integrally injection molded structure, which is fixed to the top of the inner side of the cavity of the box cover 12 by fasteners such as screws. It forms a rectangular frame structure with two horizontal bars and two vertical bars. This structure is spaced apart from and parallel to the side wall of the box cover 12, so as to set the connector 32 and the baffle 33.

[0031] The two connectors 32 are spaced apart and arranged in parallel. Each connector 32 includes a rotating shaft 321 connected to the baffle seat 31, two fins 322 disposed on the rotating shaft 321, and a connecting rod 323 disposed between the two fins 322.

[0032] The rotating shaft 321 has insertion ends at both ends, and the two vertical rods of the baffle seat 31 are respectively provided with insertion holes for the rotating shaft 321 to be inserted, so that the two ends of the rotating shaft 321 can be inserted into the baffle seat 31 and rotate. In addition, the baffle seat 31 is also provided with a stop to limit the rotation angle of the rotating shaft 321, and so that when the stop abuts against the rotating shaft 321, the baffle 33 is positioned against the wafer in the wafer cassette. This is a common technology applied in related fields and is not the main content of this application, so it is only briefly described here.

[0033] Both fins 322 are integrally formed with the rotating shaft 321, located on opposite radial sides of the rotating shaft 321, spaced apart from each other and arranged symmetrically about the connecting rod 323. The extension direction of each fin 322 is radial to the rotating shaft 321, thereby cooperating with the stop block on the baffle seat 31 to limit the rotation angle of the rotating shaft 321.

[0034] The two ends of the connecting rod 323 are respectively connected to the two fins 322, and are spaced apart from and parallel to the rotating shaft 321, so as to connect the baffle 33.

[0035] The baffle 33 is rotatably connected to the two connectors 32. When the wafer storage cassette 20 is placed inside the cassette body 10, the baffle 33 prevents the wafers inserted in the wafer storage cassette 20 from sliding out of the cassette 20. The baffle 33 includes a baffle body 331, two side baffles 332 on both sides of the baffle body 331, and a plurality of connecting structures 333 disposed on the baffle body 331.

[0036] The baffle body 331 and the side baffle 332 can be integrally injection molded. The baffle body 331 is arranged parallel to the baffle seat 31. The two side baffles 332 are arranged on both sides of the baffle body 331 and are arranged symmetrically with the baffle body 331 as the axis of symmetry. The side of the baffle body 331 and the side baffle 332 away from the baffle seat 31 is arc-shaped to fit the curvature of the wafer inserted in the wafer storage box 20.

[0037] Each of the connecting structures 333 includes a connecting seat disposed on the baffle 33 and a fastener fastened to the connecting seat. The connecting seat and the fastener hold the connecting rod 323 for connecting the baffle body 331 and the connecting member 32.

[0038] The two anti-collision structures 34 are respectively disposed on the two side baffles 332. Each anti-collision structure 34 may be made of soft rubber and includes an anti-collision part 341 and a guide part 342 located on one side of the anti-collision part 341. Soft rubber is a flexible plastic material made by injection molding. It is soft at room temperature and does not require vulcanization treatment. Common materials include low-density plastics such as PP and PE.

[0039] The anti-collision part 341 can be a strip-shaped structure fixed to the side baffle 332 facing the wafer by adhesive or secondary injection molding. The extension direction of its length is consistent with the arrangement direction of the wafer in the wafer storage box 20, so as to abut against the edge of the wafer placed in the wafer storage box 20 and play a protective role. The anti-collision part 341 adopts an internally hollow arch shape in the cross section perpendicular to its extension direction, which can not only withstand higher impact force, but also make the structure itself elastic, further improving the buffering effect of the anti-collision part 341.

[0040] Each of the aforementioned anti-collision parts 341 includes an arc-shaped anti-collision surface 3411, a contact groove 3412 disposed on the anti-collision surface 3411, a first contact point 3413 located on the contact groove 3412, and a second contact point 3414 located on the contact groove 3412.

[0041] The anti-collision surface 3411 is the surface of the anti-collision part 341 away from the side baffle 332, and is an arc surface so as to abut against the edge of the wafer placed in the wafer storage box 20.

[0042] The contact groove 3412 is an arc-shaped groove formed on the anti-collision surface 3411. The groove body extends in the same direction as the anti-collision part 341. The groove opening faces the wafer placed in the wafer storage box 20. The groove body is an arc shape with the curvature opposite to that of the anti-collision surface 3411 in the cross section perpendicular to its extension direction.

[0043] Both the first contact point 3413 and the second contact point 3414 are located at the opening of the contact groove 3412. On a cross-section perpendicular to the extending direction of the contact groove 3412, the first contact point 3413 and the second contact point 3414 are the two points on the anti-collision part 341 furthest from the surface of the side baffle 332. The first contact point 3413 is located on the side of the contact groove 3412 closer to the baffle body 331, and the second contact point 3414 is located on the other side of the contact groove 3412 away from the baffle body 331, so that the wafer can be abutted when in contact with it. It is conceivable that numerous first contact points 3413 and second contact points 3414 extend along the extending direction of the contact groove 3412 to form the opening of the contact groove 3412, creating a convex ridge-like structure. Here, "contact point" refers only to the point of contact when abutting against the wafer.

[0044] On the same cross-section perpendicular to the extending direction of the anti-collision part 341, the line connecting the center of the arc surface of the contact groove 3412 and the center of the arc surface of the anti-collision surface 3411 is spaced apart from the geometric center of the storage tank. Simultaneously, the line connecting the center of the contact groove 3412 and the center of the anti-collision surface 3411 of the two anti-collision parts 341 should be located on either side of the geometric center of the storage tank. This ensures that when a wafer not located at the geometric center of the storage tank contacts and abuts against the two anti-collision parts 341, it will first contact the first contact point 3413 or the second contact point 3414. Specifically, if a wafer is biased towards... Figure 7 The right-side anti-collision section 341 shown will contact the first contact point 3413 of the left-side anti-collision section 341 and the second contact point 3414 of the right-side anti-collision section 341; if a wafer deviates... Figure 7 The left-side anti-collision section 341 shown will contact the second contact point 3414 of the left-side anti-collision section 341 and the first contact point 3413 of the right-side anti-collision section 341. If a wafer is located exactly at the geometric center of the storage tank, it may simultaneously contact the first contact point 3413 and the second contact point 3414 of both anti-collision sections 341. Thus, when the wafer moves, the paths traveled by the multiple layers of stacked wafers are essentially the same, allowing the crystallographic orientation of the wafer to be accurately identified and aligned. It is well known that when a wafer is placed in the storage tank during fabrication, its crystallographic orientation is already determined and identifiable, which facilitates the smooth progress of the entire process.

[0045] In addition, when the wafer is displaced, if the displacement direction is towards the baffle body 331, the wafer remains against the first contact point 3413 and is compressed to deform towards the side baffle 332. If the impact force is large, after the anti-collision part 341 continues to deform, the wafer contacts and impacts the second contact point 3414 for secondary force relief, preventing the anti-collision part 341 from being squeezed to complete deformation due to excessive impact force and thus failing to effectively relieve force. When the wafer is displaced, if the displacement direction is parallel to the baffle body 331, after the wafer moves, it directly contacts and impacts the second contact point 3414 in the displacement direction for force relief, while buffering and shock absorption are provided by the elastic reaction force generated by the deformation of the first contact point 3413.

[0046] The guide portion 342 is disposed at the end of the anti-collision portion 341 and located at the end of the anti-collision portion 341 facing the base plate 11, and may be integrally injection molded with the anti-collision portion 341. The guide portion 342 includes a connecting end 3421 connected to the anti-collision portion 341, an insertion end 3422 located at the end away from the anti-collision portion 341, and a guide slope 3423 located between the connecting end 3421 and the insertion end 3422.

[0047] The distance from the connecting end 3421 to the surface of the side baffle 332 is greater than the distance from the insertion end 3422 to the surface of the side baffle 332. The connecting end 3421 and the side baffle 332 are connected by the guide slope 3423, thereby forming a conical structure, which serves as a guide during the process of the cover 12 closing on the base plate 11. The end of the insertion end 3422 away from the anti-collision part 341 is rounded to prevent sharp edges from hitting the wafer edge.

[0048] When wafers are inserted into the wafer storage cassette 20, some wafers may slip out of the cassette 20, causing the wafers to be misaligned in the arrangement direction. As the cassette cover 12 closes onto the base plate 11, the anti-collision structure 34 contacts the edge of the wafer sequentially from the insertion end 3422 to the connection end 3421, thereby pushing the protruding wafers back into the wafer storage cassette 20 through the guide ramp 3423, thus achieving the guiding and correction function.

[0049] The rotating wheel 35 is located at the bottom of the baffle 33 near the bottom plate 11. The axis of the rotating wheel 35 is aligned with the axis of the rotating shaft 321. When the cover 12 is placed on the bottom plate 11, the rotating wheel 35 will contact the bottom plate 11, causing the baffle 33 to move upward. The baffle 33 drives the connector 32 to rotate, thereby moving the baffle 33 closer to the wafer storage box 20 and protecting the wafers inserted in the wafer storage box 20. When the wafers are displaced due to movement and transportation, they will be limited and blocked by the baffle 33, preventing them from detaching from the wafer storage box 20.

[0050] Compared with existing technologies, the wafer cassette with anti-collision baffle provided by the present invention, by setting the anti-collision part 341, avoids direct contact between the baffle body 331 and the wafer, thus preventing wafer damage due to collision. Simultaneously, it can support the wafer, preventing misalignment due to inconsistent wafer movement paths that could lead to inaccurate crystallographic orientation identification and alignment, thereby providing excellent protection. By setting the guide part 342, the wafers sliding out of the wafer storage cassette 20 are guided and corrected when the cassette cover 12 is closed, ensuring neat wafer arrangement and guaranteeing the protective function of the anti-collision part 341.

[0051] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions or improvements within the spirit of the present invention are covered within the scope of the claims of the present invention.

Claims

1. A wafer cassette with a shock-absorbing baffle, characterized in that: The wafer cassette with anti-collision baffle includes a cassette body, a wafer storage cassette disposed within the cassette body, and a limiting baffle disposed within the cassette body. The cassette body includes a base plate and a cassette cover fastened to the base plate. The wafer storage cassette is provided with multiple storage slots. The limiting baffle includes a baffle plate and two anti-collision structures disposed on the baffle plate. The baffle plate includes a baffle plate main body, two side baffle plates on both sides of the baffle plate main body, and multiple connecting structures disposed on the baffle plate main body. The baffle body is arranged parallel to the baffle seat. Two side baffles are arranged on both sides of the baffle body. Two anti-collision structures are respectively arranged on the two side baffles, each including an anti-collision part fixed to the side baffle and a guiding part located on one side of the anti-collision part. The length extension direction of the anti-collision part is consistent with the arrangement direction of the wafers within the wafer storage cassette. The anti-collision part, in a cross-section perpendicular to its extension direction, adopts an internally hollow arch shape. Each anti-collision part includes an arc-shaped anti-collision surface. A contact groove is provided on the anti-collision surface, a first contact point is located on one side of the contact groove, and a second contact point is located on the other side of the contact groove. On the same cross section perpendicular to the extension direction of the anti-collision part, the line connecting the center of the contact groove and the center of the anti-collision surface is spaced apart from the geometric center of the storage tank, and the line connecting the center of the contact groove and the center of the anti-collision surface of the two anti-collision parts is located on both sides of the geometric center of the storage tank, so that the wafer deviating from the geometric center of the storage tank can impact the first contact point or the second contact point. The guide part is provided at the end of the anti-collision part and is located at the end of the anti-collision part facing the base plate. The guide part includes a connecting end connected to the anti-collision part, an insertion end located away from the end of the anti-collision part, and a guide slope located between the connecting end and the insertion end. The distance from the connecting end to the surface of the side baffle is greater than the distance from the insertion end to the surface of the side baffle. The connecting end and the side baffle are connected by the guide slope to form a cone-shaped structure.

2. The wafer cassette with anti-collision baffle as described in claim 1, characterized in that: The base plate is a rectangular plate structure, the cover is a rectangular box with an opening on one side, the inside of the cover is a receiving cavity for placing the wafer storage box, and the opening of the cover is fastened to the base plate.

3. The wafer cassette with anti-collision baffle as described in claim 1, characterized in that: The baffle seat is integrally injection molded and fixed to the top of the inner side of the box cover cavity by screws. It forms a rectangular frame structure with two horizontal bars and two vertical bars. This structure is spaced apart from and parallel to the side wall of the box cover.

4. The wafer cassette with anti-collision baffle as described in claim 1, characterized in that: The limiting baffle also includes a baffle seat fixed on the box cover, and two connectors disposed on the baffle seat. The two connectors are spaced apart from each other and arranged in parallel. Each connector includes a rotating shaft connected to the baffle seat, two fins disposed on the rotating shaft, and a connecting rod disposed between the two fins.

5. The wafer cassette with anti-collision baffle as described in claim 4, characterized in that: The rotating shaft has insertion ends at both ends, and the two vertical rods of the baffle seat are respectively provided with insertion holes for the rotating shaft to be inserted. The baffle seat is also provided with a stop block.

6. The wafer cassette with anti-collision baffle as described in claim 4, characterized in that: Both fins are integrally formed with the rotating shaft and are located on both sides of the rotating shaft in the radial direction. They are spaced apart from each other and arranged symmetrically with the connecting rod as the axis of symmetry. The extension direction of each fin is radial to the rotating shaft.

7. The wafer cassette with anti-collision baffle as described in claim 4, characterized in that: The two ends of the connecting rod are respectively connected to the two fins and are spaced apart from and parallel to the rotating shaft.

8. The wafer cassette with anti-collision baffle as described in claim 1, characterized in that: Each of the aforementioned anti-collision structures is made of soft rubber.

9. The wafer cassette with anti-collision baffle as described in claim 4, characterized in that: The limiting baffle also includes a rotating wheel disposed on the baffle, the rotating wheel being disposed at the bottom of the baffle near the base plate, and the axis of the rotating wheel being consistent with the axis of the rotating shaft.

10. The wafer cassette with anti-collision baffle as described in claim 1, characterized in that: The contact groove is an arc-shaped groove formed on the anti-collision surface. The groove extends in the same direction as the anti-collision part, and the groove opening faces the wafer placed in the wafer storage box. The groove body is an arc with the curvature opposite to that of the anti-collision surface in a cross section perpendicular to its extension direction.

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