Cleaning device and method for parts of semiconductor equipment and semiconductor equipment

Abstract

The invention discloses a cleaning device for semiconductor equipment parts. The cleaning device comprises an installation support, an installation cover and an irradiation assembly. The mounting bracket is butted with semiconductor equipment; the mounting cover is arranged on the mounting bracket, and an outlet of the mounting cover faces a part to be cleaned; the irradiation assembly is arranged on the mounting cover and used for conducting ultraviolet irradiation on the to-be-cleaned part. By the adoption of the cleaning device, when the electrostatic chuck needs to be cleaned, the process cavity is opened, then the mounting support is placed in the process cavity, the opening of the mounting cover faces the electrostatic chuck, then the electrostatic chuck is subjected to ultraviolet irradiation through the irradiation assembly, and therefore organic matter pollution on the surface of the electrostatic chuck is decomposed and removed through ultraviolet light; the electrostatic chuck does not need to be detached for cleaning, so that the cleaning step is simplified, the cleaning efficiency is improved, and the downtime of the semiconductor equipment is shortened. The invention further discloses a cleaning method for the parts of the semiconductor equipment and the semiconductor equipment.

Description

Technical Field

[0001] This application belongs to the field of component cleaning technology, specifically relating to a cleaning apparatus and method for semiconductor equipment components, as well as semiconductor equipment. Background Technology

[0002] The semiconductor cleaning market offers services covering almost all equipment components across the entire process technology, primarily focusing on cleaning components for etching and thin-film growth equipment. Components from other processes (such as ion implantation, evaporation, furnace tubes, chemical mechanical polishing, and photolithography equipment) also require regular cleaning and maintenance. The main purpose of component cleaning is to remove contaminants from the surface of semiconductor equipment components, including particulate matter, metal ions, and organic impurities, to ensure the performance and reliability of these components during production. Existing cleaning solutions for semiconductor equipment components, such as electrostatic chucks, require disassembly for cleaning, which is a relatively cumbersome process. Summary of the Invention

[0003] The technical problem to be solved by this application is that the existing cleaning steps for electrostatic chucks are relatively cumbersome. In order to solve this technical problem, a cleaning device and method for semiconductor equipment components and a semiconductor equipment are provided. The use of this device and method simplifies the cleaning steps and allows cleaning of the electrostatic chuck without removing it.

[0004] The technical solution proposed in this application is as follows: A cleaning apparatus for semiconductor equipment components, comprising: Mounting brackets are used to interface with semiconductor equipment; A mounting cover is disposed on the mounting bracket, and the outlet of the mounting cover faces the part to be cleaned; An irradiation assembly, disposed on the mounting cover, is used to irradiate the parts to be cleaned with ultraviolet light.

[0005] Using the above-mentioned cleaning device, when it is necessary to clean the electrostatic chuck, the process chamber is opened, and then the mounting bracket is placed inside the process chamber with the opening of the mounting cover facing the electrostatic chuck. Then, the electrostatic chuck is irradiated with ultraviolet light by the irradiation component, thereby decomposing and removing organic contaminants on the surface of the electrostatic chuck through ultraviolet light. There is no need to remove the electrostatic chuck for cleaning, which simplifies the cleaning process, improves cleaning efficiency, and shortens the downtime of semiconductor equipment.

[0006] Furthermore, it also includes an exhaust assembly connected to the mounting cover for extracting and discharging gas from the mounting cover.

[0007] Furthermore, the exhaust assembly includes a connecting pipe and a fan, with one end of the connecting pipe connected to the mounting cover and the other end connected to the fan.

[0008] Furthermore, the illumination assembly includes a drive module and a lamp, the lamp being movably disposed within the mounting cover, and the drive module being used to drive the lamp to move within the mounting cover.

[0009] Furthermore, the lamp moves along a path surrounding the component to be cleaned.

[0010] Furthermore, it also includes a detection module and a control module. The detection module is disposed on the mounting cover and is used to detect the position of the parts to be cleaned. The control module is connected to the detection module and the drive module.

[0011] Furthermore, the illumination assembly includes at least two lamps, which are spaced apart from each other on the mounting cover.

[0012] A cleaning method for semiconductor device components, based on the aforementioned cleaning apparatus for semiconductor device components, the cleaning method comprising the steps of: S110, Open the semiconductor equipment process chamber; S120, place the mounting bracket into the process chamber, with the mounting cover positioned above the part to be cleaned and the outlet of the mounting cover facing the part to be cleaned; S130 uses an irradiation unit to irradiate the parts to be cleaned with ultraviolet light.

[0013] Furthermore, in step S130, the component to be cleaned is first irradiated with ultraviolet light with a wavelength of less than 200nm, and then the component to be cleaned is irradiated with ultraviolet light with a wavelength of 200~350nm.

[0014] A semiconductor device includes a process chamber, a transport device, and a cleaning device for semiconductor device components, wherein the transport device is capable of moving the cleaning device into or out of the process chamber.

[0015] In summary, the cleaning apparatus and method for semiconductor equipment components, as well as the semiconductor equipment provided in this application, have at least the following advantages: 1. The mounting bracket is installed in the process chamber, and the electrostatic chuck is irradiated with ultraviolet light by the irradiation component to clean the electrostatic chuck. There is no need to remove the electrostatic chuck, which simplifies the cleaning process, improves the cleaning efficiency, and shortens the downtime of semiconductor equipment. 2. The volatile gases generated during the cleaning process can be extracted and discharged through the exhaust system, preventing the volatile gases from remaining in the process chamber and affecting the process effect; 3. The lamps are installed inside the mounting cover, which allows for all-around illumination of the electrostatic suction cups, improving the cleaning effect; 4. The mounting cover allows for the installation of movable brackets, ensuring that ultraviolet light irradiates the parts to be cleaned, making the cleaning device suitable for cleaning different parts; 5. First use ultraviolet light with a wavelength of less than 200nm for irradiation, and then use ultraviolet light with a wavelength of 200~350nm for irradiation. This can ensure that organic pollutants are decomposed into volatile gases and improve the cleaning effect. Attached Figure Description

[0016] The accompanying drawings are provided to further understand this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof.

[0017] Figure 1 This is a schematic diagram of a cleaning device for semiconductor equipment components provided in an embodiment of this application.

[0018] Label Explanation: 10. Cleaning device; 20. Process chamber; 30. Electrostatic chuck; 110. Mounting bracket; 120. Mounting cover; 130. Exhaust assembly; 131. Connecting pipe; 132. Fan. Detailed Implementation

[0019] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] To address the problem that existing electrostatic chucks in semiconductor equipment require disassembly for cleaning, resulting in a cumbersome and inefficient cleaning process, this application provides a cleaning device for semiconductor equipment. This device can clean electrostatic chucks or other components that would otherwise require disassembly without removing them, simplifying the cleaning process and improving efficiency. The following explanation uses cleaning an electrostatic chuck as an example.

[0026] like Figure 1As shown, in one embodiment, the cleaning device 10 includes a mounting bracket 110, a mounting cover 120, and an irradiation assembly. The mounting bracket 110 is used to interface with a semiconductor device, such as a process chamber 20. The process chamber 20 can be opened, and the mounting bracket 110 can be placed inside the process chamber 20 to interface with the semiconductor device. The mounting cover 120 is disposed on the mounting bracket 110, and its outlet faces the electrostatic chuck 30. The irradiation assembly is disposed on the mounting cover 120 and is used to irradiate the electrostatic chuck 30 with ultraviolet light, thereby cleaning the electrostatic chuck 30 using ultraviolet light.

[0027] It should be explained that in this embodiment, the semiconductor device is an ion implantation device, and the contamination on the electrostatic chuck 30 to be cleaned is typically organic contamination. Ultraviolet irradiation can begin by irradiating the electrostatic chuck 30 with ultraviolet light of wavelength less than 200 nm (preferably 185 nm) to decompose the organic matter into ions, free atoms, and excited molecules, while simultaneously converting oxygen in the air into ozone. Next, ultraviolet light of wavelength 200-350 nm (preferably 254 nm) is used to further decompose the ozone into oxygen and active oxygen atoms. These active oxygen atoms can react with carbon and hydrocarbons on the surface of the electrostatic chuck 30 to generate volatile gases such as carbon dioxide and water vapor, thereby thoroughly removing the organic contamination adhering to the surface of the electrostatic chuck 30.

[0028] Using the cleaning device 10 described above, when the electrostatic chuck 30 needs to be cleaned, the process chamber 20 is opened, and then the mounting bracket 110 is placed inside the process chamber 20 with the opening of the mounting cover 120 facing the electrostatic chuck 30. Then, the electrostatic chuck 30 is irradiated with ultraviolet light by the irradiation component, thereby decomposing and removing organic contaminants on the surface of the electrostatic chuck 30 through ultraviolet light. There is no need to remove the electrostatic chuck 30 for cleaning, which simplifies the cleaning process, improves cleaning efficiency, and shortens the downtime of semiconductor equipment.

[0029] In one embodiment, the mounting cover 120 is detachably connected to the mounting bracket 110, and the mounting cover 120 can rotate relative to the mounting bracket 110, thereby adjusting the irradiation angle of the irradiation component on the mounting cover 120 and improving the cleaning effect on the electrostatic chuck 30. Furthermore, the adjustment of the irradiation angle also allows the cleaning device 10 to be suitable for cleaning different components. In practical applications, the cleaning device 10 also includes a connecting seat, which is detachably connected to the mounting bracket 110. The mounting cover 120 is connected to the connecting seat via a damped spherical joint, thereby enabling the mounting cover 120 to be separated from the mounting bracket 110, and allowing the mounting cover 120 to rotate relative to the mounting bracket 110 under external force. Optionally, the connecting seat and the mounting bracket 110 are connected by magnetic attraction, for example, by providing magnets on the connecting seat and / or the mounting bracket 110. Of course, they can also be connected via a quick-release structure, which is not limited here.

[0030] In one embodiment, the illumination assembly includes a drive module and a luminaire. The luminaire is movably mounted on the mounting cover 120, and the drive module is used to drive the luminaire to move within the mounting cover 120, thereby further adjusting the illumination angle of the luminaire to ensure omnidirectional illumination of the electrostatic chuck 30. It is certain that the luminaire needs to generate ultraviolet light, and can be a UV lamp.

[0031] Furthermore, the inner wall of the mounting cover 120 is provided with a movable track, on which the lamp is movably mounted. Optionally, the drive module may include a slide, a pulley, and a motor. The lamp, pulley, and motor are all mounted on the slide, which is movably mounted on the movable track via the pulley. The motor is connected to the pulley, thereby driving the slide to move on the movable track. The motor may be a stepper motor, and this is not limited to this.

[0032] In one embodiment, the luminaire moves along a path surrounding the part to be cleaned. Thus, after adjusting the position of the mounting cover 120 to ensure that the ultraviolet light generated by the luminaire is directed towards the electrostatic chuck 30, the ultraviolet light generated by the luminaire will continue to irradiate the electrostatic chuck 30 as the luminaire moves along this path, thereby achieving illumination of the electrostatic chuck 30 from different angles. Preferably, the movable track within the mounting cover 120 is an arc-shaped track, and after the mounting bracket 110 is placed into the process cavity and the position of the mounting cover 120 is adjusted, the center of the circle containing the movable track coincides with the electrostatic chuck 30, thereby ensuring that the luminaire always emits ultraviolet light towards the electrostatic chuck 30 during its movement.

[0033] It should be noted that in actual use, the lamps can be switched between two positions to achieve omnidirectional illumination of the electrostatic chuck 30. Therefore, in other embodiments, two or more lamps can be set. In this case, the lamps can remain fixed, and omnidirectional ultraviolet light illumination of the electrostatic chuck 30 can be achieved through two or more lamps.

[0034] In one embodiment, the cleaning device 10 further includes a detection module and a control module. The detection module is disposed on the mounting cover 120 and is used to detect the position of the electrostatic chuck 30. The control module is connected to the detection module, the drive module, and the lamp. After obtaining the position information detected by the detection module, the control module controls the drive module to adjust the position of the lamp, and then controls the lamp to turn on after the position is adjusted. It should be noted that in this embodiment, the mounting cover 120 can also be driven by a drive mechanism. For example, a drive mechanism can be disposed on the aforementioned connecting seat. The drive mechanism can be a small robotic arm. The drive mechanism is connected to the mounting cover 120, and the control module is connected to the drive mechanism to control the drive mechanism to adjust the position of the mounting cover 120 after obtaining the position information detected by the detection module, ensuring that the opening of the mounting cover 120 faces the electrostatic chuck 30. Optionally, the detection module can be a conventional visual inspection structure, such as a camera, and the control module can be a conventional controller, which is not limited here.

[0035] In one embodiment, the cleaning device 10 further includes an exhaust assembly 130. The exhaust assembly 130 is connected to the mounting cover 120 and is used to extract and discharge gas from within the mounting cover 120. It should be noted that the exhaust assembly 130, by extracting gas from the mounting cover 120, can create a negative pressure within the mounting cover 120, thereby extracting and discharging the volatile gases generated by the ultraviolet light irradiation of the electrostatic chuck 30. Furthermore, it is understood that the outlet end of the exhaust assembly 130 can be connected to a tail gas treatment device to treat the volatile gases before venting them.

[0036] Furthermore, the exhaust assembly 130 includes a connecting pipe 131 and a fan 132. One end of the connecting pipe 131 is connected to and communicates with the interior of the mounting cover 120, and the other end is connected to the fan 132, so as to extract and exhaust the gas inside the mounting cover 120 through the fan 132 and the connecting pipe 131. In practical applications, the connecting pipe 131 is a flexible hose to suit different application scenarios, and can be made of chemically resistant materials, such as polytetrafluoroethylene. It should be explained that during use, the mounting cover 120 is placed inside the process chamber 20, and the fan 132 is usually placed outside the process chamber 20, with the two connected by a flexible hose.

[0037] Based on the cleaning apparatus 10 described above, this application also provides a cleaning method for semiconductor equipment components, the cleaning method comprising the steps of: S110, open the semiconductor equipment process chamber 20; S120, place the mounting bracket 110 into the process chamber 20, with the mounting cover 120 positioned above the electrostatic chuck 30 and the outlet of the mounting cover 120 facing the electrostatic chuck 30; S130, irradiate the electrostatic chuck 30 with ultraviolet light through the irradiation assembly.

[0038] Specifically, in S120, the mounting bracket 110 is first placed into the process chamber 20, and then the connecting seat is connected to the mounting bracket 110, thereby connecting the mounting cover 120 to the mounting bracket 110. Next, the position of the mounting cover 120 is adjusted so that its outlet faces the electrostatic chuck 30. In S130, the lamp needs to be switched between two positions, and in either position, the lamp first uses ultraviolet light with a wavelength less than 200nm to irradiate the electrostatic chuck 30, and then uses ultraviolet light with a wavelength of 200~350nm to irradiate the electrostatic chuck 30. Preferably, ultraviolet light with a wavelength of 185nm is used first, followed by ultraviolet light with a wavelength of 254nm.

[0039] Based on the above embodiments, it can be determined that the cleaning device 10 and some of its operations are performed manually. On the other hand, this application also provides a semiconductor device, including a process chamber 20, a transport device, and the aforementioned cleaning device 10. The transport device can move the cleaning device 10 into or out of the process chamber 20. This enables automatic cleaning of semiconductor device components without disassembling them, simplifying the cleaning process, improving cleaning efficiency, and shortening downtime for the semiconductor device.

[0040] In summary, the cleaning apparatus 10 and method for semiconductor device components and the semiconductor device provided in this application have at least the following advantages: 1. The mounting bracket 110 is installed into the process chamber 20. The electrostatic chuck 30 is irradiated with ultraviolet light by the irradiation component to clean the electrostatic chuck 30 without removing it. This simplifies the cleaning process, improves cleaning efficiency, and shortens the downtime of semiconductor equipment. 2. The volatile gases generated during the cleaning process can be extracted and discharged through the exhaust assembly 130 to prevent the volatile gases from remaining in the process chamber 20 and affecting the process effect; 3. The lamp is installed inside the mounting cover 120, which can illuminate the electrostatic suction cup 30 from all directions, improving the cleaning effect; 4. The mounting cover 120 can be mounted on the bracket 110, which ensures that the ultraviolet light is irradiated on the parts to be cleaned, so that the cleaning device 10 can be used to clean different parts. 5. First use ultraviolet light with a wavelength of less than 200nm for irradiation, and then use ultraviolet light with a wavelength of 200~350nm for irradiation. This can ensure that organic pollutants are decomposed into volatile gases and improve the cleaning effect.

[0041] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cleaning device for semiconductor equipment components, characterized in that, include: Mounting brackets are used to interface with semiconductor equipment; A mounting cover is disposed on the mounting bracket, and the outlet of the mounting cover faces the part to be cleaned; An irradiation assembly, disposed on the mounting cover, is used to irradiate the parts to be cleaned with ultraviolet light.

2. The cleaning apparatus for semiconductor equipment components according to claim 1, characterized in that, It also includes an exhaust assembly, which is connected to the mounting cover and is used to extract and discharge gas from the mounting cover.

3. The cleaning apparatus for semiconductor equipment components according to claim 2, characterized in that, The exhaust assembly includes a connecting pipe and a fan. One end of the connecting pipe is connected to the mounting cover, and the other end is connected to the fan.

4. The cleaning apparatus for semiconductor equipment components according to claim 1, characterized in that, The illumination assembly includes a drive module and a lamp, the lamp being movably disposed within the mounting cover, and the drive module being used to drive the lamp to move within the mounting cover.

5. The cleaning apparatus for semiconductor equipment components according to claim 4, characterized in that, The light fixture moves along a path surrounding the component to be cleaned.

6. The cleaning apparatus for semiconductor equipment components according to claim 4, characterized in that, It also includes a detection module and a control module. The detection module is disposed on the mounting cover and is used to detect the position of the parts to be cleaned. The control module is connected to the detection module and the drive module.

7. The cleaning apparatus for semiconductor equipment components according to claim 1, characterized in that, The illumination assembly includes at least two lamps, which are spaced apart on the mounting cover.

8. A cleaning method for semiconductor device components, characterized in that, Based on the cleaning apparatus for semiconductor device components according to any one of claims 1-7, the cleaning method includes the steps of: S110, Open the semiconductor equipment process chamber; S120, place the mounting bracket into the process chamber, with the mounting cover positioned above the part to be cleaned and the outlet of the mounting cover facing the part to be cleaned; S130 uses an irradiation unit to irradiate the parts to be cleaned with ultraviolet light.

9. The cleaning method for semiconductor device components according to claim 8, characterized in that, In step S130, the component to be cleaned is first irradiated with ultraviolet light with a wavelength of less than 200nm, and then the component to be cleaned is irradiated with ultraviolet light with a wavelength of 200~350nm.

10. A semiconductor device, characterized in that, The device includes a process chamber, a transport device, and a cleaning device for semiconductor equipment components as described in any one of claims 1-7, wherein the transport device is capable of moving the cleaning device into or out of the process chamber.

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