Multi-perception sensing device and use method thereof

Abstract

The invention relates to a multi-perception sensing device which comprises a temperature and pressure assembly, a vibration assembly and an acoustic emission assembly. Outer threads are arranged on the lower portion of the vibration assembly and the lower portion of the acoustic emission assembly, inner threads are arranged on the upper portion of the warm pressing assembly and the upper portion of the vibration assembly, the upper portion of the warm pressing assembly is in threaded connection with the lower portion of the vibration assembly, and the lower portion of the acoustic emission assembly is in threaded connection with the upper portion of the vibration assembly. The method has the advantages that the three-section type layered design enables the product to be packaged in a modularized mode. In the aspect of structure, the integration level of the whole product is guaranteed, and production calibration and later analysis and maintenance of the product are facilitated. In terms of performance, the signal crosstalk is greatly reduced by the layered isolation design, and the accuracy of signal acquisition is improved; according to the device, temperature, pressure, vibration and acoustic emission signals are integrated, synchronous acquisition and output of multiple sensing signals are achieved, the real-time performance of data acquisition is improved, and later data accuracy analysis is facilitated.

Description

Technical Field

[0001] This invention belongs to the field of pipeline safety monitoring technology, specifically relating to a multi-sensor device and its usage method. Background Technology

[0002] With the expansion of urban underground pipe networks and their increasing service life, safety accidents such as pipe leaks and damage caused by third-party construction are frequent. As a core component of urban infrastructure, the safe operation of underground pipe networks is directly related to public safety. Taking gas pipe networks as an example, the main accidents fall into two categories: first, excessive service life leading to pipe corrosion and aging; and second, reckless construction by third parties, inadequate process management, and insufficient personnel supervision. Because the vibration frequencies caused by pipe aging differ significantly from those caused by construction, the core requirement for current pipe network safety monitoring is to simultaneously capture these two key frequency signals and combine them with temperature and pressure parameters to achieve multi-dimensional risk assessment.

[0003] Currently, mainstream pipeline monitoring solutions can be divided into three categories: The first category is independent sensor combinations, such as a combination of independent acoustic emission sensors and independent vibration sensors. Due to closed-loop judgment, multiple devices need to be deployed separately in practical applications, resulting in high costs per monitoring point, poor data synchronization, and difficulties in data correlation. The second category is fiber optic monitoring equipment, such as vibration-acoustic emission systems based on optical fibers. Although these systems have strong anti-interference capabilities, their deployment costs are too high, making them unsuitable for the economic needs of pipeline networks in small and medium-sized cities. The third category is simple integrated sensors. Because acoustic and vibration signals are packaged together, the signal crosstalk rate is high, which is not conducive to data analysis. In addition, from an engineering application perspective, existing equipment also faces three major problems: First, insufficient environmental adaptability. Underground pipeline networks generally face harsh environments with high humidity, corrosion, and large temperature differences. Using traditional protective measures, the annual replacement rate of equipment is high. Second, the integration level of multi-sensor devices is low, leading to cumbersome initial installation and significantly increased maintenance costs. Third, conventional vibration sensors use magnetic or adhesive methods, which are prone to aging of the bonding layer and loose adhesion, resulting in severe signal attenuation and hindering the acquisition of minute signals.

[0004] In summary, existing pipeline inspection devices suffer from problems such as low integration, poor environmental adaptability, and unscientific installation methods. These problems prevent existing solutions from simultaneously meeting the needs of refined urban pipeline network management in terms of "accuracy, economy, and ease of use," necessitating a new, highly integrated, and highly reliable manufacturing solution. Summary of the Invention

[0005] The present invention aims to solve the problem of low integration in existing pipeline inspection devices.

[0006] The present invention solves the above-mentioned technical problems through the following technical means: A multi-sensor device includes a temperature and pressure component, a vibration component, and an acoustic emission component; the lower parts of the temperature and pressure component, the vibration component, and the acoustic emission component are all provided with external threads, and the upper parts are all provided with internal threads; wherein the upper part of the temperature and pressure component is threadedly connected to the lower part of the vibration component, and the lower part of the acoustic emission component is threadedly connected to the upper part of the vibration component.

[0007] The present invention divides the main body of the device into three parts: a temperature and pressure component, a vibration component, and an acoustic emission component; each of the three is a unit and is connected by threads, which facilitates disassembly, installation, replacement, and maintenance; moreover, it can couple multiple sensing modules, thereby improving the overall performance of the sensing device.

[0008] Preferably, the temperature and pressure assembly includes a temperature and pressure PCBA, a threaded post, and a temperature and pressure assembly housing; the temperature and pressure assembly housing is a cylindrical component, the temperature and pressure PCBA is placed inside the temperature and pressure assembly housing, and the threaded post is located on the lower wall surface of the temperature and pressure assembly housing.

[0009] Preferably, the threaded column is integrally cast with the housing of the thermo-pressure component, the inside of the threaded column is vacuum-sealed, and the upper wall surface is in communication with the inside of the housing of the thermo-pressure component.

[0010] The threaded column design allows the device to be threadedly connected to the pipe, which can better detect vibrations compared to traditional adsorption or adhesive methods, while also improving the ease of installation.

[0011] Preferably, the temperature and pressure assembly further includes a temperature and pressure sensor and a buffer sheet. The buffer sheet is a circular porous sheet-like component located inside the threaded column. The temperature and pressure sensor is located inside the threaded column and is attached to the temperature and pressure PCBA.

[0012] Preferably, the vibration assembly includes a longitudinally vibrating piezoelectric ceramic sheet, a transversely vibrating piezoelectric ceramic sheet, a spring, a mass block, and a vibration assembly housing. The longitudinally vibrating piezoelectric ceramic sheet, the transversely vibrating piezoelectric ceramic sheet, the mass block, and the spring are all placed inside the vibration assembly housing. The longitudinally vibrating piezoelectric ceramic sheet and the transversely vibrating piezoelectric ceramic sheet are located inside the mass block. Multiple springs are located outside the mass block, with one end connected to the outer wall of the mass block and the other end connected to the inner wall of the vibration assembly housing.

[0013] Preferably, the acoustic emission assembly includes an acoustic emission piezoelectric ceramic sheet, a mass block, a waveguide rod, and an acoustic emission assembly housing, wherein the acoustic emission piezoelectric ceramic sheet, the mass block, and the waveguide rod are all placed inside the acoustic emission assembly housing; wherein the acoustic emission piezoelectric ceramic sheet is located inside the mass block, the waveguide rod is located outside the mass block, and the sidewall of the waveguide rod is tightly fitted with the outer wall of the mass block, and the lower wall of the waveguide rod is tightly fitted with the acoustic emission assembly housing.

[0014] Preferably, the acoustic emission assembly further includes a main control chamber and a main control PCBA. The main control chamber is a hollow structure integrally cast with the outer shell of the acoustic emission assembly, and the main control PCBA is located inside the main control chamber.

[0015] Preferably, a fluorine-containing O-ring is also provided at the threaded connection between the temperature and pressure component, the vibration component, and the acoustic emission component.

[0016] Fluorinated O-rings enable a tighter and more secure connection between components and provide waterproofing.

[0017] Preferably, the electrical connection between the temperature and pressure component, the vibration component, and the acoustic emission component is made using a pogopin connector.

[0018] The components are electrically connected using pogo pin connectors, which reduces the impact of rotation of threaded connections on electrical components during installation.

[0019] A method for using a multi-sensor device, characterized by the following steps: S1, external assembly of the device; S2, device debugging and threshold setting; S3, device installation and sleep mode; S4, determining whether temperature, pressure, and vibration have reached the threshold; if the threshold is reached, proceed to step S5; if the threshold is not reached, return to step S3 and remain in sleep mode; S5, waking up the device and acquiring signals; S6, signal output and analysis.

[0020] The advantages of this invention are: (1) The device is a miniaturized device that integrates temperature, pressure, vibration and acoustic emission signals into one output signal. It realizes the synchronous acquisition and output of multi-sensor signals, which not only improves the real-time performance of the acquired data, but also facilitates the accurate analysis of the data in the later stage.

[0021] (2) The three-stage layered design allows the product to be modularly packaged; in terms of structure, it not only ensures the overall integration of the product, but also facilitates product production calibration and subsequent analysis and maintenance; in terms of performance, the layered isolation design greatly reduces signal crosstalk and improves the accuracy of signal acquisition.

[0022] (3) The vibration sensing component uses two sets of piezoelectric ceramic sheets, which are placed in the horizontal and vertical directions to facilitate the collection of stress waves in different directions and avoid the loss of vibration signals due to differences in installation direction.

[0023] (4) Connecting pipes with threaded interfaces makes it easier to adapt to different pipe diameters and avoids signal loss caused by traditional magnetic or adhesive structures, thus improving the capture rate of weak vibration or acoustic emission signals.

[0024] (5) Through the triple sealing design of threaded shell, epoxy resin potting and fluororubber seal, the IP68 protection level is achieved, which greatly increases the service life and significantly reduces the operation and maintenance cost. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the external structure of the first embodiment of the present invention; Figure 2 This is a cross-sectional schematic diagram of the first embodiment of the present invention; Figure 3 This is a flowchart illustrating the usage method of the second embodiment of the present invention.

[0026] Numbering on the map: 1. Temperature and pressure assembly; 11. Temperature and pressure assembly housing; 12. Temperature and pressure PCBA; 13. Threaded post; 14. Buffer plate; 15. Temperature and pressure sensor; 2. Vibration assembly; 21. Vibration assembly housing; 22. First mass block; 23. Lateral vibration piezoelectric ceramic sheet; 24. Longitudinal vibration piezoelectric ceramic sheet; 25. Spring; 3. Acoustic emission assembly; 31. Acoustic emission assembly housing; 32. Second mass block; 33. Acoustic emission piezoelectric ceramic sheet; 34. Waveguide rod; 35. Main control compartment; 36. Main control PCBA. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Example 1: Combination Figure 1 As shown, this embodiment provides a multi-sensor device, including a temperature and pressure component 1, a vibration component 2, and an acoustic emission component 3. See Figure 2The temperature and pressure assembly 1 includes a temperature and pressure assembly housing 11, a temperature and pressure PCBA 12, a threaded post 13, a buffer plate 14, and a temperature and pressure sensor 15. The temperature and pressure assembly housing 11 is a cylindrical shell component, with its upper wall extending upwards in a ring shape and having internal threads tapped on its inner wall. The temperature and pressure PCBA 12 is a PCBA board capable of controlling the temperature and pressure sensor 15; its dimensions match the inner diameter of the temperature and pressure assembly housing 11, and it is located inside the temperature and pressure assembly housing 11. The threaded post 13 is an integrally cast cylindrical component with the temperature and pressure assembly housing 11, located on the lower wall of the temperature and pressure assembly housing 11. Its outer wall surface is tapped with external threads, and its interior is hollow, communicating with the interior of the temperature and pressure assembly housing 11. The buffer plate 14 is a metal disc with multiple evenly spaced fine holes, located inside the threaded post 13. Due to foreign objects in the pipe or water hammer effect, the pipe will emit shock waves caused by pressure fluctuations. The function of the buffer plate 14 is to protect the sensor from the impact of pressure fluctuations. The temperature and pressure sensor 15 is located inside the threaded post 13 and is attached to the temperature and pressure PCBA 12. Some temperature and pressure sensors 15 use high-precision piezoresistive MEMS temperature and pressure sensors (other temperature and pressure sensors can also be used). After the internal components of the temperature and pressure assembly 1 are assembled, epoxy resin needs to be injected into the temperature and pressure assembly 1. The epoxy resin can effectively protect the internal electrical components of the temperature and pressure assembly 1 and can operate normally in a humid environment.

[0029] See Figure 2The vibration assembly 2 includes a vibration assembly housing 21, a first mass block 22, a transverse vibrating piezoelectric ceramic plate 23, a longitudinal vibrating piezoelectric ceramic plate 24, and a spring 25. The vibration assembly housing 21 is a cylindrical shell component, with its upper and lower outer rings extending upwards and downwards respectively. The inner wall of the extended portion on the upper wall is threaded internally, and the outer wall of the lower extended portion on the lower wall is threaded externally. The thread of the extended portion on the lower wall matches the thread of the extended portion on the upper wall of the thermo-pressure assembly housing 11, allowing the vibration assembly housing 21 to be threadedly connected to the thermo-pressure assembly housing 11. A fluorinated O-ring is also provided at the connection point to further ensure internal waterproofing. The first mass block 22 is a hollow, disc-shaped component located inside the vibration assembly housing 21, and bolts are pre-installed on the inner wall of the first mass block 22. The transverse vibrating piezoelectric ceramic plate 23 and the longitudinal vibrating piezoelectric ceramic plate 24 are PZT-4 piezoelectric ceramic plates (other types of piezoelectric ceramic plates can also be used), and both ceramic plates include bolt holes, located inside the first mass block 22. The transversely vibrating piezoelectric ceramic plate 23 is arranged transversely on one side of the first mass block 22 and fixed with a pre-reserved bolt within the first mass block 22; the longitudinally vibrating piezoelectric ceramic plate 24 is arranged longitudinally on the other side of the first mass block 22 and fixed with a pre-reserved bolt within the first mass block 22. This design avoids attenuation of the vibration signal due to inconsistent fixing directions of the device. Multiple springs 25 are located between the first mass block 22 and the vibration assembly housing 21, with one end fixed to the outer wall of the first mass block 22 and the other end fixed to the inner wall of the vibration assembly housing 21. Electrical components between the temperature and pressure assembly 1 and the vibration assembly 2 are connected via pogo pin connectors. Multiple pogo pin connectors are located at the connection between the temperature and pressure assembly housing 11 and the vibration assembly housing 21. Pogo pin connectors prevent wire entanglement caused by rotation of the upper housing.

[0030] See Figure 2The acoustic emission assembly 3 includes an acoustic emission assembly housing 31, a second mass block 32, an acoustic emission piezoelectric ceramic sheet 33, a waveguide rod 34, a main control compartment 35, and a main control PCBA 36. The acoustic emission assembly housing 31 is a cylindrical shell component with its lower outer wall extending downwards. The outer wall of the extended portion is threaded externally, matching the internal thread of the extended portion of the upper wall of the vibration assembly housing 21, allowing the acoustic emission assembly housing 31 to be threadedly connected to the vibration assembly housing 21. A fluorinated O-ring is also provided at the connection point to further ensure internal waterproofing. The second mass block 32 is a hollow, disc-shaped component located inside the acoustic emission assembly housing 31, and bolts are pre-drilled on its inner wall. The acoustic emission piezoelectric ceramic sheet 33 uses a set of PLiS-5 piezoelectric ceramic sheets (or other piezoelectric ceramic sheets). The ceramic sheet has bolt holes that match the pre-drilled bolts inside the second mass block 32, allowing the acoustic emission piezoelectric ceramic sheet 33 to be fixed inside the second mass block 32. The waveguide rod 34, located between the second mass block 32 and the acoustic emission component housing 31, is a rod-shaped component. Its sidewalls are tightly fitted to the outer wall of the second mass block 32, and its lower wall is fixed to the interior of the acoustic emission component housing 31. The main control chamber 35 is located on top of the acoustic emission component housing 31 and is integrally cast with it. The main control chamber 35 is a hollow cylindrical shell component with a wire lead-out hole pre-drilled at the center of its upper wall. The main control PCBA 36 is located inside the main control chamber 35 and can be connected to external control equipment via data wires. After the main control PCBA 36 is installed, epoxy resin is injected and filled into the main control chamber 35 to protect it and ensure its normal operation in humid environments. The electrical components between the acoustic emission component 3 and the vibration component 2 are connected via pogo pin connectors. Multiple pogo pin connectors are located at the connection between the acoustic emission component housing 31 and the vibration component housing 21. The pogo pin connector can avoid the problem of wire harness tangling caused by the rotation of the upper housing.

[0031] The bottom of the temperature and pressure component 1 uses a standard threaded interface. When applied to pipes of different diameters, only the temperature and pressure component 1 with a different threaded post 13 needs to be replaced. Furthermore, compared to traditional adsorption or adhesive connections, threaded connections more easily ensure efficient stress wave transmission and stable signal acquisition. The temperature and pressure sensor 15, the transverse vibration piezoelectric ceramic plate 23, and the longitudinal vibration piezoelectric ceramic plate 24 employ a low-power method for continuous active data acquisition. The entire multi-sensor device is connected to an external processing device via wires, which can set signal trigger thresholds for the multi-sensor device.

[0032] Example 2: To better demonstrate the usage of the multi-sensor device of this application, combined with Figure 3 Narrate: S1. External assembly of the device; S2. Device debugging and threshold setting; S3. Device installation and sleep mode; S4. Determine whether the temperature, pressure, and vibration have reached the threshold. If the threshold is reached, proceed to step S5. If the threshold is not reached, return to step S3 and remain in sleep mode; S5. Wake up the device and collect signals; S6. Output and analyze the signals.

[0033] Specifically, in step S1, the multi-sensor device is assembled externally. During assembly, attention must be paid to ensuring the waterproofing at the joints of each component is adequate. In step S2, after assembly, the device undergoes preliminary debugging. During debugging, the device is connected to an external data processing device. Temperature, pressure, and vibration trigger thresholds are set for the device in the external data processing device. Different levels of external temperature, pressure, and vibration are applied to the multi-sensor device using external tools to ensure it can trigger normally within the set trigger threshold range. Since the acoustic emission signal emitted during pipe leakage ranges from 20kHz to 1MHz, accompanied by instantaneous or gradual fluctuations in pipe pressure, and the vibrations generated by construction equipment such as excavators and drilling rigs are low-frequency vibration signals ranging from 0.1Hz to 2kHz, the vibration trigger threshold is set in two segments. In step S3, the multi-sensor device is installed at the pipe joint, and the sensor is connected to the external data processing device via a lead wire for signal processing. The installed device remains in a dormant state until triggered. In step S4, when the temperature, pressure, and vibration sensed by the device reach a preset threshold, the signal is transmitted to an external data processing device, which immediately wakes up the sensor. If the device does not sense temperature, pressure, and vibration within the threshold range, it remains in sleep mode. In step S5, once the device is woken up, it immediately collects vibration, temperature, pressure, and acoustic emission signals at a high frequency and issues an alarm to alert personnel. In step S6, the external data processing device performs a preliminary analysis of the collected signals to determine the cause of the pipeline accident and identifies the location of the fault.

[0034] This multi-sensor device is a miniaturized unit that integrates temperature, pressure, vibration, and acoustic emission signals into a single output signal. It achieves synchronous acquisition and output of multiple sensing signals, improving the real-time performance of the acquired data and facilitating subsequent data accuracy analysis. The three-tiered design allows for modular packaging. Structurally, this ensures overall product integration and facilitates production calibration and subsequent analysis and maintenance. In terms of performance, the tiered isolation design significantly reduces signal crosstalk and improves the accuracy of signal acquisition. The vibration component 2 uses two sets of piezoelectric ceramic plates placed horizontally and vertically, facilitating the acquisition of stress waves from different directions and preventing signal loss due to variations in installation orientation. The temperature and pressure component 1 connects to the pipe via a threaded interface, making it easier to adapt to different pipe diameters and avoiding signal loss caused by traditional magnetic or adhesive structures, thus improving the capture rate of weak vibration or acoustic emission signals. Through a triple-seal design of a threaded outer shell, epoxy resin potting, and fluororubber seal, an IP68 protection rating is achieved, significantly increasing service life and reducing maintenance costs.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Terms such as "upper," "lower," "left," "right," "front," and "rear" used in the invention are merely for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0036] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-sensor device, characterized in that, It includes a temperature and pressure component, a vibration component, and an acoustic emission component; the lower part of the vibration component and the acoustic emission component are provided with external threads, and the upper part of the temperature and pressure component and the vibration component are provided with internal threads, wherein the upper part of the temperature and pressure component is threadedly connected to the lower part of the vibration component, and the lower part of the acoustic emission component is threadedly connected to the upper part of the vibration component.

2. The multi-sensor device according to claim 1, characterized in that, The temperature and pressure assembly includes a temperature and pressure PCBA, a threaded post, and a temperature and pressure assembly housing; the temperature and pressure assembly housing is a cylindrical component, the temperature and pressure PCBA is placed inside the temperature and pressure assembly housing, and the threaded post is located on the lower wall surface of the temperature and pressure assembly housing.

3. The multi-sensor device according to claim 2, characterized in that, The threaded column is integrally cast with the outer shell of the thermo-pressure component. The inside of the threaded column is vacuum-sealed, and its upper wall is connected to the inside of the outer shell of the thermo-pressure component.

4. The multi-sensor device according to claim 1, characterized in that, The temperature and pressure assembly also includes a temperature and pressure sensor and a buffer sheet. The buffer sheet is a circular porous sheet-like component located inside the threaded column. The temperature and pressure sensor is located inside the threaded column and is attached to the temperature and pressure PCBA.

5. A multi-sensor device according to claim 1, characterized in that, The vibration assembly includes a longitudinally vibrating piezoelectric ceramic plate, a transversely vibrating piezoelectric ceramic plate, a spring, a mass block, and a vibration assembly housing. The longitudinally vibrating piezoelectric ceramic plate, the transversely vibrating piezoelectric ceramic plate, the mass block, and the spring are all placed inside the vibration assembly housing. The longitudinally vibrating piezoelectric ceramic plate and the transversely vibrating piezoelectric ceramic plate are located inside the mass block. Multiple springs are located outside the mass block, with one end connected to the outer wall of the mass block and the other end connected to the inner wall of the vibration assembly housing.

6. A multi-sensor device according to claim 1, characterized in that, The acoustic emission assembly includes an acoustic emission piezoelectric ceramic sheet, a mass block, a waveguide rod, and an acoustic emission assembly housing. The acoustic emission piezoelectric ceramic sheet, the mass block, and the waveguide rod are all placed inside the acoustic emission assembly housing. The acoustic emission piezoelectric ceramic sheet is located inside the mass block, the waveguide rod is located outside the mass block, and the sidewall of the waveguide rod is tightly fitted with the outer wall of the mass block, while the lower wall of the waveguide rod is tightly fitted with the acoustic emission assembly housing.

7. A multi-sensor device according to claim 6, characterized in that, The acoustic emission assembly also includes a main control chamber and a main control PCBA. The main control chamber is a hollow structure integrally cast with the outer shell of the acoustic emission assembly, and the main control PCBA is located inside the main control chamber.

8. A multi-sensor device according to claim 1, characterized in that, Fluorine-containing O-rings are also provided at the threaded connections between the temperature and pressure component, the vibration component, and the acoustic emission component.

9. A multi-sensor device according to claim 8, characterized in that, The electrical connection between the temperature and pressure component, the vibration component, and the acoustic emission component is achieved using a pogo pin connector.

10. A method of using a multi-sensor device according to any one of claims 1 to 9, characterized in that, Includes the following steps: S1. External assembly of the device; S2. Device debugging and threshold setting; S3. Device installation and maintenance of sleep mode; S4. Determine whether the temperature, pressure, and vibration have reached the threshold. If they have, proceed to step S5. If they have not reached the threshold, return to step S3 and remain in sleep mode. S5. Wake up the device and collect the signal. S6. Output and analyze the signal.

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