Pyroelectric infrared multi-probe module and pyroelectric infrared detection device

Abstract

The invention provides a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device.The pyroelectric infrared multi-probe module comprises at least two PIR probes, a multi-layer FPC board, a PCB and a mounting bracket, the multi-layer FPC board comprises at least two conducting layers and at least one base material bearing the conducting layers, and the base material is arranged on the mounting bracket. Wherein each PIR probe is welded on the same surface of the multi-layer FPC board, the multi-layer FPC board and the PCB are respectively provided with a first connecting terminal and a second connecting terminal, and the mounting bracket is mounted on one surface of the PCB and is provided with at least two mounting surfaces. Wherein the multi-layer FPC board is connected to the PCB in a state that the first connecting terminal is inserted into or welded to the second connecting terminal, and the PIR probes are mounted on the mounting bracket in a state that the positions, where the PIR probes are welded, of the multi-layer FPC board are attached to different mounting surfaces.

Description

Technical Field

[0001] This invention relates to the field of infrared detection, and in particular to a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device. Background Technology

[0002] With the development of IoT technology and the popularization of low-carbon and environmentally friendly concepts, artificial intelligence, smart homes, and smart security technologies are increasingly demanding environmental detection, especially the detection of human movement characteristics. This allows for intelligent control of electrical equipment based on the detection results of human presence. Currently, there are three main technologies for human presence detection: 1. Image acquisition and corresponding algorithms to identify the human body and its behavior. However, this is unacceptable due to risks of privacy violations and leaks, and it is also costly due to complex algorithms and high hardware performance requirements; 2. Microwave detection technology based on the Doppler effect principle. This involves emitting a microwave beam and receiving the reflected echo formed by the beam being reflected by a corresponding object. A Doppler intermediate frequency signal corresponding to the frequency difference between the microwave beam and the reflected echo is generated through frequency mixing and detection. This Doppler intermediate frequency signal serves as feedback on the motion of the corresponding object; 3. Detection of human movement across detection zones using pyroelectric infrared (PIR) sensors based on Fresnel lenses. This is currently the most widely used and mature human presence detection technology. Among the three human presence detection technologies mentioned above, the third one, based on pyroelectric infrared sensors, is currently the most widely used. Consequently, the market demand for pyroelectric infrared detection devices is relatively high. However, there are currently many problems in the production of pyroelectric infrared detection devices, which affect production efficiency and the consistency of mass production. Furthermore, the structural design makes it easy for pyroelectric infrared detection devices to be subject to electromagnetic and thermal interference during use.

[0003] Specifically, existing pyroelectric infrared sensor probes are mainly divided into two types: through-hole and surface-mount, corresponding to reference... Figure 1As shown, an existing pyroelectric infrared sensor 10P is illustrated. The pyroelectric infrared sensor 10P includes a through-hole probe 11P, a PCB circuit board (printed circuit board) 12P, and circuit components 13P disposed on the PCB circuit board 12P. During the production process, the circuit components on the PCB circuit board 12P need to be soldered using a reflow soldering process. However, the temperature of the reflow soldering process is too high, which will damage the through-hole probe 11P. Therefore, in the actual production process, it is impossible to automatically produce the through-hole probe 11P at the same time. Instead, other circuit components must first be soldered onto the PCB circuit board 12P using a reflow soldering process, and then the through-hole probe 11P is soldered through manual insertion holes. This results in low production efficiency and does not conform to the current trend of automated production. Furthermore, because pyroelectric infrared sensor probes are sensitive to high temperatures, excessively high temperatures or prolonged soldering times can cause performance degradation or even functional failure of the probe. Therefore, strict requirements are placed on the temperature and duration of soldering during the production process. For example, when soldering the corresponding wires with a soldering iron, the soldering iron temperature must be below 350℃ and the soldering time must not exceed 3 seconds, which places strict requirements on the operators. For another example, when using wave soldering, the furnace temperature must not exceed 260℃ and the time must not exceed 3 seconds. Moreover, during wave soldering, the through-hole probe 11P needs to be raised to maintain a distance of at least 1mm from the PCB circuit board 12P to prevent short circuits. As a result, the overall process is complex, the production efficiency is low, and it is difficult to effectively ensure the consistency of mass production. Similarly, pyroelectric infrared sensors using patch probes also have many problems in the production process. Some patch probes use a mounting bracket that serves as a tube socket, substrate, and patch. When the mounting bracket is connected to the tube cap, it is difficult to ensure the seal. Furthermore, because the patch probe is mounted on the PCB circuit board, it is easy to conduct heat, which places higher demands on the soldering temperature and duration during the production process.

[0004] In other words, existing pyroelectric infrared (PIR) probes, whether through-hole or surface-mount, are in direct contact with the PCB circuit board and require manual soldering. This makes automated mass production impossible, and the inconsistent operation due to variations in human skill makes it difficult to guarantee production consistency. Especially when the corresponding pyroelectric infrared detection device is designed with multiple probes, each probe must be soldered to the PCB circuit board at a specific angle. During soldering, operators must not only strictly adhere to the aforementioned soldering requirements but also maintain the angle of the probes. However, in actual soldering operations, it is difficult to ensure that all probes are at the same tilt angle, affecting the performance of the pyroelectric infrared detection device. Furthermore, even within the same batch of products, differences in the tilt angles of the probes make it difficult to guarantee product consistency.

[0005] Furthermore, because the pyroelectric infrared (PIR) probe is directly mounted on the PCB circuit board, it is susceptible to the heat generated by the corresponding circuit components on the PCB during use. Thermal interference around the PIR probe can reduce its sensing energy for cross-regional movement based on Fresnel lenses, thus affecting detection accuracy and sensitivity. Additionally, the PIR probe is directly connected to other circuit components on the PCB circuit board via long and complex wiring, resulting in a long signal transmission path. During signal transmission, the lack of adequate protection makes it highly susceptible to interference from the PCB circuit board, such as interference from surrounding high-current traces, further impacting detection performance and accuracy. Summary of the Invention

[0006] One object of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the pyroelectric infrared multi-probe module is automatically mass-produced and the consistency of mass production is guaranteed.

[0007] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the pyroelectric infrared multi-probe module is based on a modular design concept, which departs from the traditional design of directly soldering the PIR probe onto the PCB circuit board, simplifies the production steps of installing the PIR probe on the PCB circuit board, and improves production efficiency while ensuring production consistency.

[0008] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the pyroelectric infrared multi-probe module can quickly set up the multi-angle orientation of each probe, while ensuring the accuracy of the orientation angle of each probe, thus ensuring the performance of the pyroelectric infrared multi-probe module and avoiding the influence of human operation on angle errors.

[0009] Another objective of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the pyroelectric infrared multi-probe module can form an orientation angle support for each probe based on an object at a fixed angle, thereby ensuring the accuracy of the orientation angle of each probe.

[0010] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared multi-probe module, wherein, based on the design of the pyroelectric infrared multi-probe module, it can protect sensitive components such as PIR probes during the welding process, reduce the impact of high temperature on sensitive components during welding, reduce welding requirements, and is suitable for fully automated welding production processes.

[0011] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the pyroelectric infrared multi-probe module is suitable for fully automated welding, thereby effectively eliminating the problem of inconsistent operation due to manual operation.

[0012] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the pyroelectric infrared multi-probe module can form a shielding layer, thereby effectively reducing or shielding electromagnetic interference from surrounding circuits, thus ensuring the operational stability of the pyroelectric infrared multi-probe module and the accuracy of the corresponding detection results.

[0013] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the pyroelectric infrared multi-probe module can form a thermal barrier between the PIR probe and the PCB circuit board, thereby effectively reducing or blocking the heat transfer from the PCB circuit board to the PIR probe during operation, and effectively ensuring the working stability of the pyroelectric infrared multi-probe module.

[0014] Another object of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the pyroelectric infrared multi-probe module can form an isolation layer between the PIR probe and the PCB circuit board to prevent the pins or surface mount pins of the PIR probe from being exposed to the PCB circuit board and coming into contact with the air, thereby further blocking thermal interference.

[0015] Another object of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the pyroelectric infrared multi-probe module includes at least two PIR probes, a multilayer FPC board, a PCB circuit board, and a mounting bracket, wherein the multilayer FPC board is designed with a multilayer structure including at least two conductive layers and at least one substrate supporting the conductive layers, wherein the PIR probes are soldered to one side of the FPC board, thereby enabling the FPC board to form thermal isolation between the PIR probes and the corresponding PCB circuit board and to form a shielding layer with at least one of the conductive layers to shield against corresponding electromagnetic interference when the pyroelectric infrared multi-probe module is installed and used, wherein the multilayer FPC board is provided with electrically connected The PIR probe has a first connection terminal, wherein the PCB circuit board has a second connection terminal that matches the first connection terminal, wherein the mounting bracket is mounted on one side of the PCB circuit board and has at least two mounting surfaces, wherein the multilayer FPC board is connected to the PCB circuit board with the first connection terminal plugged into or soldered to the second connection terminal, wherein each PIR probe is mounted on the mounting bracket with the position of the PIR probe soldered to the multilayer FPC board attached to different mounting surfaces, thereby setting the orientation angle of each PIR probe based on the angle and / or orientation design of each mounting surface to ensure the accuracy of the orientation angle of each PIR probe.

[0016] Another object of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein, when the multilayer FPC board is placed on the mounting bracket, it can be bent and placed on each of the mounting surfaces based on the flexibility of the multilayer FPC board. Based on the angle and / or orientation design of each of the mounting surfaces, the multilayer FPC board is set to have a specific orientation when placed on the mounting surface, thereby correspondingly forming the orientation angle setting of each of the PIR probes, so as to quickly realize the orientation angle setting of each of the PIR probes.

[0017] Another objective of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the orientation angle of each PIR probe of the pyroelectric infrared multi-probe module is determined by the mounting surface of the mounting bracket, thereby enabling rapid setting of the orientation angle of each PIR probe while ensuring the accuracy of the orientation angle of each probe.

[0018] Another object of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein, based on the number and distribution of the mounting surfaces, the orientation of the PIR probes can be adjusted accordingly based on the adjustment of the mounting surfaces on which the PIR probes are placed, so as to form a combination selection of orientations for each PIR probe of the pyroelectric infrared multi-probe module, thereby improving the design and usage flexibility of the pyroelectric infrared multi-probe module, that is, the placement area of ​​each PIR probe can be flexibly adjusted according to different product requirements and / or different detection areas, thereby forming an adjustment of the orientation of each PIR probe.

[0019] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device. Based on the design of this invention, the angles of multiple PIR probes can be quickly set, and subsequently, based on the partitioning and compartmentalization design of the corresponding lens unit of the pyroelectric infrared detection device, a multi-compartment structure and multi-partition detection of the pyroelectric infrared detection device can be further formed, thereby improving the design flexibility of the pyroelectric infrared detection device.

[0020] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the multilayer FPC board is placed in the mounting bracket, and the multilayer FPC board is located between the PIR probe and the PCB circuit board, thereby forming a thermal barrier between the PIR probe and the PCB circuit board. This prevents the heat from the PCB circuit board from being transferred to the PIR probe when the pyroelectric infrared multi-probe module is working, thus ensuring the working stability of the pyroelectric infrared multi-probe module.

[0021] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the multilayer FPC board is placed in the mounting bracket, the multilayer FPC board is located between the PIR probe and the PCB circuit board, and can also form a shield against interference from high current traces on the PCB circuit board, thereby ensuring the accuracy of the detection results of the pyroelectric infrared multi-probe module.

[0022] Another object of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the conductive layer located on at least one side of the multilayer FPC board is connected to the positive or negative terminal of the corresponding power supply to form the shielding layer, and at least one of the conductive layers of the multilayer FPC board, which is isolated from the substrate and the shielding layer, is a signal transmission layer, thereby reducing or shielding the electromagnetic interference of surrounding circuits on the signal transmission layer based on the shielding layer, thereby ensuring the working stability of the pyroelectric infrared multi-probe module and ensuring the accuracy of the detection results.

[0023] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein, in the state where the pyroelectric infrared multi-probe module is installed and used, the multilayer FPC board forms a thermal barrier with the substrate and a shielding layer with at least one conductive layer, and the PIR probe does not need to be directly soldered to the PCB circuit board. Therefore, the pyroelectric infrared multi-probe module does not need to raise the PIR probe on the PCB circuit board to avoid the PIR probe being affected by the temperature of the PCB circuit board. It can also form thermal barrier and electromagnetic interference shielding with the solid multilayer FPC board, effectively ensuring the working stability of the pyroelectric infrared multi-probe module.

[0024] Another objective of this invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the multilayer FPC board is preferably a four-layer board comprising three substrates and four conductive layers, wherein the three substrates are sequentially stacked, and two of the four conductive layers are respectively disposed between two pairs of adjacent substrates, and the other two conductive layers are disposed on two opposite sides of the multilayer FPC board. The two conductive layers located on both sides of the multilayer FPC board form the shielding layer, and the two conductive layers located between the substrates are the signal transmission layers. Thus, the shielding layer can shield the two signal transmission layers from interference on both sides of the multilayer FPC board, effectively reducing or shielding electromagnetic interference from surrounding circuits on signal transmission, thereby ensuring the operational stability of the pyroelectric infrared multi-probe module and the accuracy of the detection results.

[0025] Another objective of this invention is to provide a pyroelectric infrared (PIR) multi-probe module and a pyroelectric infrared multi-probe module, wherein during the process of soldering the PIR probe to the multilayer FPC board, a thermal barrier for the PIR probe can be formed based on the substrate. Furthermore, through openings on the multilayer FPC board corresponding to the corresponding pins of the PIR probe, and considering the thin and light structure of the multilayer FPC board, preheating of the side facing the PIR probe is not required during wave soldering; only preheating of the back side is needed to successfully solder the PIR probe to the multilayer FPC board. This ensures the soldering process while reducing the impact of high temperatures on the PIR probe, thus avoiding performance impacts on the pyroelectric infrared multi-probe module caused by high temperatures during the production soldering process, and ensuring performance consistency of the pyroelectric infrared multi-probe module during mass production.

[0026] Another object of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the mounting bracket extends protrudingly from both sides of the mounting surface and has two limiting walls, the two limiting walls defining a limiting groove on the mounting surface, wherein the multilayer FPC board is placed on the mounting surface along the limiting groove and is clamped by the two limiting walls, so that the two limiting walls limit the PIR probe on the mounting surface without the PIR probe being directly soldered to the PCB circuit board, thereby maintaining the orientation angle stability of each PIR probe.

[0027] Another object of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the mounting bracket further includes a pressure cap, wherein the pressure cap is matched with the mounting bracket to be detachably mounted on the mounting bracket, wherein, with the FPC board placed on the mounting bracket, the pressure cap can be used to limit the PIR probe in a direction away from the PCB board, thereby improving the firmness of the PIR probe being placed on the mounting bracket and maintaining the orientation angle stability of each PIR probe.

[0028] Another object of the present invention is to provide a pyroelectric infrared multi-probe module and a pyroelectric infrared detection device, wherein the pressure cap is provided with clearances corresponding to the number of PIR probes, so as to achieve edge fixing of the PIR probes when the pressure cap is installed on the mounting bracket, thereby further improving the installation stability of the PIR probes.

[0029] According to one aspect of this invention, a pyroelectric infrared multi-probe module is provided, wherein the pyroelectric infrared multi-probe module comprises: At least two PIR probes; A multilayer FPC board, wherein the multilayer FPC board includes at least two conductive layers and at least one substrate carrying the conductive layers, wherein each of the PIR probes is soldered to the same side of the multilayer FPC board, wherein the multilayer FPC board is provided with a first connection terminal electrically connected to the PIR probe. A PCB circuit board, wherein the PCB circuit board has a second connection terminal that mates with the first connection terminal; and A mounting bracket is mounted on one side of the PCB circuit board and has at least two mounting surfaces, wherein the multilayer FPC board is connected to the PCB circuit board with the first connection terminal plugged into or soldered to the second connection terminal, and each PIR probe is mounted on the mounting bracket with the position of the PIR probe soldered to the multilayer FPC board attached to a different mounting surface.

[0030] In one embodiment, the conductive layer located on at least one side of the multilayer FPC board is connected to the positive or negative terminal of a corresponding power supply to form the shielding layer, and at least one of the conductive layers of the multilayer FPC board, which is isolated from the shielding layer based on the substrate, is a signal transmission layer.

[0031] In one embodiment, the multilayer FPC board is a double-layer board comprising a substrate and two conductive layers supported on two opposite sides of the substrate.

[0032] In one embodiment, the multilayer FPC board is a three-layer board comprising two substrate layers and three conductive layers, wherein the three conductive layers are sequentially stacked and the two substrate layers are located between adjacent conductive layers, wherein the two conductive layers located on both sides of the multilayer FPC board form the shielding layer, and the conductive layer located between the two substrate layers is the signal transmission layer.

[0033] In one embodiment, the multilayer FPC board is a four-layer board comprising three substrate layers and four conductive layers, wherein the three substrate layers are stacked sequentially, and two of the four conductive layers are respectively disposed between two pairs of adjacent substrate layers, and the other two conductive layers are disposed on two opposite sides of the multilayer FPC board, wherein the two conductive layers located on both sides of the multilayer FPC board form the shielding layer, and the two conductive layers located between the substrate layers are the signal transmission layers.

[0034] In one embodiment, the first connection terminal is implemented as one of a gold finger structure, a terminal plug structure, and a pad-type terminal structure.

[0035] In one embodiment, the PIR probe is in an SMD package form, and the multilayer FPC board is provided with metallized through-holes corresponding to the pins of the PIR probe, so that when soldering is performed using a solder pot or wave soldering process, the solder can be applied to the PIR probe through the metallized through-holes due to the thin and light characteristics of the multilayer FPC board.

[0036] In one embodiment, the mounting bracket further includes a pressure cap that mates with the mounting bracket to be detachably mounted on the mounting bracket, wherein, with the FPC board placed on the mounting bracket, the pressure cap can limit the PIR probe in a direction away from the PCB board based on the mounting bracket being mounted on the mounting bracket.

[0037] In one embodiment, the pressure cap is provided with clearances corresponding to the number of PIR probes, so as to achieve edge clamping and fixing of the PIR probes when the pressure cap is mounted on the mounting bracket.

[0038] In one embodiment, the mounting bracket extends protrudingly from both sides of the mounting surface and has two limiting walls, the two limiting walls defining a limiting groove on the mounting surface, wherein the multilayer FPC board is placed on the mounting surface along the limiting groove and is clamped by the two limiting walls.

[0039] In one embodiment, the FPC board is adhered to the mounting surface.

[0040] In one embodiment, the mounting bracket includes a body and a cover, wherein the body extends downwardly with corresponding snaps or plugs adapted to be mounted on the PCB circuit board, wherein the mounting surface is located on the upper side of the body, and wherein the cover mates with the body and has a probe window, wherein when the cover is installed, each of the PIR probes protrudes from the probe window and is able to limit the PIR probe based on the cover.

[0041] In one embodiment, the mounting bracket has at least one mounting surface inclined to the PCB board, and the mounting surface inclined to the PCB board is named an inclined mounting surface, wherein the PIR probe is mounted on at least one of the inclined mounting surfaces.

[0042] In one embodiment, the multilayer FPC board is configured in a strip shape, and each of the PIR probes is arranged along the length direction of the multilayer FPC board.

[0043] In one embodiment, the first connection terminal is located at one end of the strip-shaped multilayer FPC board.

[0044] In one embodiment, the number of said PIR probes is two.

[0045] In one embodiment, the number of PIR probes is greater than or equal to three, and each PIR probe is arranged on the multilayer FPC board to form a PIR probe strip.

[0046] In one embodiment, the multilayer FPC board is configured in a cross shape with four protruding ends, and the PIR probe is provided at at least two ends of the multilayer FPC board.

[0047] In one embodiment, the number of PIR probes is three, and the three PIR probes are respectively disposed at three ends of the multilayer FPC board, and the first connection terminal is disposed at the other end of the multilayer FPC board.

[0048] In one embodiment, the multilayer FPC board with a cross-shaped form has three short ends and one long end, with the long end defined as the lower side. The number of PIR probes is four, with three PIR probes disposed at the three short ends and another PIR probe located between the upper short end and the long end. The distance between this other PIR probe and the upper PIR probe is equal to the distance between the two PIR probes located on the left and right sides. The first connection terminal is located at the long end.

[0049] In one embodiment, the multilayer FPC board is configured in a trident shape with three bearing segments intersecting at one end, and the included angle between two adjacent bearing segments along the circumferential direction is 120° within an error range of ±20%, wherein the PIR probe is disposed on at least two of the bearing segments of the multilayer FPC board.

[0050] In one embodiment, the number of PIR probes is three, and the three PIR probes are respectively disposed on three carrier segments of the multilayer FPC board such that adjacent PIR probes are at an angle of 120° within an error range of ±20%, wherein the first connection terminal is disposed on one of the carrier segments of the multilayer FPC board.

[0051] In one embodiment, the multilayer FPC board has six carrier segments intersecting at one end, and the included angle between two adjacent carrier segments along the circumferential direction is 60° within an error range of ±20%. The number of PIR probes is six, and the six PIR probes are respectively disposed on the six carrier segments of the multilayer FPC board such that the included angle between two adjacent PIR probes is 60° within an error range of ±20%. The first connection terminal is disposed on one of the carrier segments of the multilayer FPC board.

[0052] In one embodiment, the multilayer FPC board has at least two carrier segments that intersect at one end, wherein at least one of the carrier segments is equipped with the PIR probe, and wherein the first connection terminal is disposed at one of the carrier segments or at the intersection of the carrier segments of the multilayer FPC board.

[0053] In one embodiment, the PIR probe is installed at the intersection of each of the carrier segments.

[0054] According to another aspect of the present invention, the present invention provides a pyroelectric infrared detection device, wherein the pyroelectric infrared detection device comprises: The aforementioned pyroelectric infrared multi-probe module; and A lens unit, wherein the lens unit has a light-incoming surface, wherein the pyroelectric infrared multi-probe module wall is arranged such that the side of the multilayer FPC board carrying the PIR probe faces the side of the lens unit opposite to the light-incoming surface.

[0055] In one embodiment, the pyroelectric infrared detection device includes a housing, wherein the lens unit is disposed at one end of the housing, and the other end of the housing is adapted to be mounted on a corresponding lamp. The housing has a first sealed cavity and a second sealed cavity along the direction from the end where the lens unit is located to the other end. The PIR probe is housed in the first sealed cavity, and the multilayer FPC board extends from the first sealed cavity into the second sealed cavity to connect with the PCB circuit board housed in the second sealed cavity.

[0056] In one embodiment, the pyroelectric infrared detection device includes a housing with a lens window connecting the internal space and the external space of the housing. The lens unit is mounted on the lens window, the pyroelectric infrared multi-probe module is housed in the internal space of the housing, and each of the PIR probes is disposed facing away from and tilted in the internal space of the housing. The lens unit includes a lens distribution area corresponding to each of the PIR probes and an isolation area disposed between each of the lens distribution areas.

[0057] The further objects and advantages of the invention will become fully apparent from the following description and accompanying drawings. Attached Figure Description

[0058] Figure 1 This is a schematic diagram of the structure of an existing pyroelectric infrared sensor.

[0059] Figure 2 This is a schematic diagram of a dual-probe structure of a pyroelectric infrared multi-probe module according to an embodiment of the present invention.

[0060] Figure 3 This is a schematic diagram of the assembly of the dual-probe structure of the pyroelectric infrared multi-probe module according to the above embodiment of the present invention.

[0061] Figure 4 This is a side view schematic diagram of the dual-probe structure of the pyroelectric infrared multi-probe module according to the above embodiment of the present invention.

[0062] Figure 5 The above-described dual-probe structure of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0063] Figure 6This is a schematic diagram of the assembly of a three-probe structure of the pyroelectric infrared multi-probe module according to the above embodiment of the present invention.

[0064] Figure 7 This is a schematic diagram of the three-probe structure of the pyroelectric infrared multi-probe module according to the above embodiment of the present invention.

[0065] Figure 8 This is a schematic diagram of a modified structure of the three-probe structure of the pyroelectric infrared multi-probe module according to the above embodiment of the present invention.

[0066] Figure 9 This is a schematic diagram of a modified structure of the pyroelectric infrared multi-probe module according to the above embodiment of the present invention.

[0067] Figure 10 This is a schematic diagram of a modified structure of the pyroelectric infrared multi-probe module according to the above embodiment of the present invention.

[0068] Figure 11 This is a schematic diagram of a modified structure of the pyroelectric infrared multi-probe module according to the above embodiment of the present invention.

[0069] Figure 12 This is a schematic diagram of the structure of a PIR probe strip of the pyroelectric infrared multi-probe module according to the above embodiment of the present invention.

[0070] Figure 13 This is a schematic diagram of an embodiment of a multilayer FPC board for the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0071] Figure 14 This is a schematic diagram of another embodiment of the multilayer FPC board of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0072] Figure 15 This is a schematic diagram of another embodiment of the multilayer FPC board of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0073] Figure 16 This is a schematic diagram of a welding structure of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0074] Figure 17 This is a schematic diagram of another welding structure of the pyroelectric infrared multi-probe module according to the above embodiments of the invention.

[0075] Figure 18 This is a schematic diagram of the assembly and welding of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention during the production process.

[0076] Figure 19A This is a schematic diagram of an assembly structure of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0077] Figure 19B For the corresponding Figure 19A The diagram shows the assembled structure of the pyroelectric infrared multi-probe module.

[0078] Figure 19C For including Figure 19A The diagram shows a structural schematic of a pyroelectric infrared detection device of the pyroelectric infrared multi-probe module.

[0079] Figure 20A This is a schematic diagram of an assembly structure of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0080] Figure 20B For the corresponding Figure 20A The diagram shows the assembled structure of the pyroelectric infrared multi-probe module.

[0081] Figure 21A This is a schematic diagram of an assembly structure of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0082] Figure 21B For the corresponding Figure 21A The diagram shows the assembled structure of the pyroelectric infrared multi-probe module.

[0083] Figure 22 This is a partial structural deformation diagram of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0084] Figure 23A This is a partial structural deformation diagram of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0085] Figure 23B This is a partial structural deformation diagram of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0086] Figure 23C This is a partial structural deformation diagram of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention.

[0087] Figure 24 This is a schematic diagram of a pyroelectric infrared detection device according to the above embodiment of the present invention.

[0088] Figure 25A This is a schematic diagram of a pyroelectric infrared detection device according to the above embodiment of the present invention.

[0089] Figure 25BThis is a split structural diagram of the pyroelectric infrared detection device according to the above embodiments of the present invention.

[0090] Figure 25C This is a schematic diagram of the structure of a lens unit of the pyroelectric infrared detection device according to the above embodiments of the present invention.

[0091] Figure 26 This is a schematic diagram of a modified structure of the pyroelectric infrared multi-probe module according to the above embodiment of the present invention.

[0092] Figure 27 This is a schematic diagram of an installation configuration of the pyroelectric infrared multi-probe module according to the above embodiments of the present invention. Detailed Implementation

[0093] The following description is intended to disclose the present invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0094] Those skilled in the art should understand that, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting this invention.

[0095] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0096] Referring to the accompanying drawings of this invention Figures 2 to 11As shown, a pyroelectric infrared multi-probe module 100 according to an embodiment of the present invention is illustrated. The pyroelectric infrared multi-probe module 100 includes a multilayer FPC board 10 (multilayer flexible circuit board), at least two PIR probes 20, a PCB circuit board 30, and a mounting bracket 40. The PIR probes 20 are supported on one side of the multilayer FPC board 10, and the mounting bracket 40 is mounted on one side of the PCB circuit board 30 and has at least two mounting surfaces. Each PIR probe 20 is mounted on the mounting bracket 40 with its position on the multilayer FPC board 10 being attached to a different mounting surface. This allows for the setting of the orientation angle of each PIR probe 20 based on the angle and / or orientation design of each mounting surface, thereby ensuring the accuracy of the orientation angle of each PIR probe 20.

[0097] In other words, the corresponding reference Figure 3 and Figure 6 When the multilayer FPC board 10 is placed on the mounting bracket 40, it can be bent and placed on each mounting surface due to its flexibility. Based on the tilt angle design of each mounting surface, the multilayer FPC board 10 is set to a specific angular orientation when placed on the mounting surface, thereby correspondingly forming the orientation setting of each PIR probe 20. This allows for the rapid setting of the orientation angle of each PIR probe 20. Furthermore, the orientation angle of each PIR probe 20 of the pyroelectric infrared multi-probe module 100 is determined and maintained by the mounting surface of the mounting bracket 40. While achieving rapid setting of the orientation angle of each PIR probe 20, the accuracy of the orientation angle of each probe can also be guaranteed.

[0098] It is worth mentioning that the number of PIR probes 20 included in the pyroelectric infrared multi-probe module 100 can be set based on actual product requirements, for example, corresponding to Figures 2 to 5 As shown, the pyroelectric infrared multi-probe module 100 includes two PIR probes 20, corresponding to... Figures 6 to 8 As shown, the pyroelectric infrared multi-probe module 100 has three PIR probes 20, corresponding to... Figure 9 As shown, the pyroelectric infrared multi-probe module 100 has four PIR probes 20, corresponding to... Figure 10 As shown, the pyroelectric infrared multi-probe module 100 is configured with five PIR probes 20, corresponding to... Figure 11 As shown, the pyroelectric infrared multi-probe module 100 is configured with six of the PIR probes 20.

[0099] Furthermore, the multilayer FPC board 10 is provided with a first connection terminal 101 electrically connected to the PIR probe 20, and the PCB circuit board 30 has a second connection terminal that matches the first connection terminal 101. The multilayer FPC board 10 is connected to the PCB circuit board 30 with the first connection terminal 101 plugged into or soldered to the second connection terminal, and is placed on the mounting bracket 40 with each PIR probe 20 corresponding to a different mounting surface. That is, during production and installation, the probe module can be connected by simply plugging or soldering the first connection terminal 101 to the second connection terminal of the PCB circuit board 30, thereby realizing the electrical connection between the PIR probe 20 and the corresponding circuit component 31. Furthermore, the angle orientation of each PIR probe 20 can be set based on the mounting surface, eliminating the need to complete the electrical connection and angle setting by directly soldering the PIR probe 20 to the PCB circuit board 30. This simplifies the production steps of installing the PIR probe 20 on the PCB circuit board 30, ensuring production consistency while improving production efficiency.

[0100] It is worth mentioning that, to facilitate the connection between the first connecting terminal 101 and the second connecting terminal, the first connecting terminal 101 and the second connecting terminal can be configured as a mutually matching quick-connect structure, as shown in the reference. Figure 17 As shown, the first connection terminal 101 is implemented as a gold finger plug terminal.

[0101] It is understood that in some embodiments, the first connection terminal 101 may also be implemented in other forms, such as a terminal plug structure, a pad-type terminal structure, etc.

[0102] In particular, the present invention facilitates the electrical connection of the PIR probe 20 to the PCB circuit board 20 and the maintenance of a specific angle on the PCB circuit board 20, while also further improving the working performance of the pyroelectric infrared multi-probe module 100. Specifically, referring to the reference... Figures 13 to 15 The multilayer FPC board 10 is designed with a multilayer structure including at least two conductive layers 12 and at least one substrate 11 supporting the conductive layers 12. The PIR probe 20 is soldered to one side of the FPC board 10, thereby enabling the PIR probe 20 to be isolated from the PCB circuit board 30 based on the FPC board 10.

[0103] Specifically, the substrate 11 is made of materials such as polyimide (PI) or polyester (PET) and has an adhesive layer made of materials such as acrylic and epoxy resin to bond the conductive layer 12. Therefore, the substrate 11 maintains excellent flexibility, heat resistance and mechanical strength, so that when the pyroelectric infrared multi-probe module 100 is installed and used, the FPC board 10 can form a thermal barrier between the PIR probe 20 and the PCB circuit board 30, thereby effectively blocking or reducing the heat transfer from the PCB circuit board 30 to the PIR probe 20 when the pyroelectric infrared multi-probe module 100 is working, ensuring the working stability of the pyroelectric infrared multi-probe module 100 and improving the thermal interference resistance of the pyroelectric infrared multi-probe module 100.

[0104] Meanwhile, at least one conductive layer 12 in the multilayer FPC board 10 can also form a shielding layer, that is, the conductive layer 12 forms a reference ground or shielding layer, which can shield against interference from high current traces on the PCB board 30, thereby improving the anti-electromagnetic interference performance of the pyroelectric infrared multi-probe module 100 and ensuring the accuracy of the detection results of the pyroelectric infrared multi-probe module 100.

[0105] In other words, the multilayer FPC board 10 can form the shielding layer, thereby effectively reducing or shielding electromagnetic interference from surrounding circuits, thus ensuring the working stability of the pyroelectric infrared multi-probe module 100 and the accuracy of the detection results.

[0106] It is worth mentioning that, in the state where the pyroelectric infrared multi-probe module 100 is installed and used, the multilayer FPC board 10 forms a thermal barrier with the substrate 11 and a shielding layer with at least one conductive layer 12, and the PIR probe 20 does not need to be directly soldered to the PCB circuit board 30. Therefore, the pyroelectric infrared multi-probe module 100 does not need to raise the PIR probe 20 on the PCB circuit board 30 to avoid the PIR probe 20 being affected by the temperature on the PCB circuit board 30. It can also form thermal barrier and electromagnetic interference shielding with the solid multilayer FPC board 10, effectively ensuring the working stability of the pyroelectric infrared multi-probe module 100.

[0107] Furthermore, based on the design of this invention, the PIR probe 20 does not need to be directly soldered to the PCB circuit board 30, and the multilayer FPC board 10 forms an isolation layer between the PIR probe 20 and the PCB circuit board 30, which can prevent the pins or surface mount pins of the PIR probe 20 from being exposed to the PCB circuit board 30 and coming into contact with the air, thereby further blocking thermal interference.

[0108] In detail, corresponding to Figure 13 As shown, the multilayer FPC board 10 is a double-layer board comprising a substrate 11 and two conductive layers 12 supported on two opposite sides of the substrate 11. One conductive layer 12 forms the shielding layer 121, and the other conductive layer 12 is a signal transmission layer 122 that carries the relevant circuitry of the PIR probe 20. This allows the electromagnetic interference from surrounding circuits to the signal transmission layer 122 to be reduced or shielded based on the shielding layer 121, thereby ensuring the operational stability of the pyroelectric infrared multi-probe module 100 and the accuracy of the detection results.

[0109] Specifically, corresponding to Figure 14 As shown, the multilayer FPC board 10 is a three-layer board comprising two substrate layers 11 and three conductive layers 12. The three conductive layers 12 are stacked sequentially, with the two substrate layers 11 located between adjacent conductive layers 12. The two conductive layers 12 located on both sides of the multilayer FPC board 10 form the shielding layer 121, and the conductive layer 12 located between the two substrate layers 11 is the signal transmission layer 122. The shielding layer 121 can shield the two signal transmission layers 122 from interference on both sides of the multilayer FPC board 10. While ensuring the flexibility and thinness of the multilayer FPC board 10, it can also effectively shield and reduce interference on the top and bottom sides, thereby effectively reducing or shielding electromagnetic interference from surrounding circuits to signal transmission, thus ensuring the working stability of the pyroelectric infrared multi-probe module 100 and the accuracy of the detection results.

[0110] Specifically, corresponding to Figure 15As shown, the multilayer FPC board 10 is configured as a four-layer board comprising three substrates 11 and four conductive layers 12. The three substrates 11 are sequentially stacked. Two of the four conductive layers 12 are respectively disposed between two pairs of adjacent substrates 11, i.e., one conductive layer 12 is carried between two adjacent substrates 11. Correspondingly, in the three stacked substrates 11, there are two pairs of adjacent substrates 11, with conductive layers 12 on both sides carried between the substrates 11. The other two conductive layers 12 are disposed on two opposite sides of the multilayer FPC board 10, i.e., located at the back-to-back middle of the upper and lower substrates 11 of the stacked three substrates 11. On one side of the substrate 11, the two conductive layers 12 located on both sides of the multilayer FPC board 10 form the shielding layer 121, and the two conductive layers 12 located between the substrate 11 are the signal transmission layers 122. The shielding layer 121 can form interference shielding against the two signal transmission layers 122 on both sides of the multilayer FPC board 10. The design of the four-layer multilayer FPC board 10 ensures the flexibility and thinness of the multilayer FPC board 10, while also effectively shielding and reducing interference on the top and bottom sides. This effectively reduces or shields the electromagnetic interference of surrounding circuits on signal transmission, thereby ensuring the working stability of the pyroelectric infrared multi-probe module 100 and ensuring the accuracy of the detection results.

[0111] In other words, the conductive layer 12 located on at least one side of the multilayer FPC board 10 is connected to the positive or negative terminal of the corresponding power supply to form the shielding layer. At least one conductive layer 12 of the multilayer FPC board, isolated from the substrate by the shielding layer, serves as the signal transmission layer 122. This allows the shielding layer 121 to reduce or shield electromagnetic interference from surrounding circuits to the signal transmission layer 122, thereby ensuring the operational stability of the pyroelectric infrared multi-probe module 100 and the accuracy of the detection results. Furthermore, when multiple shielding layers 121 exist, at least one shielding layer 121 is connected to the positive or negative terminal of the corresponding power supply, while the other shielding layers 121 can be interconnected and indirectly connected to the positive or negative terminal of the corresponding power supply through metallized vias.

[0112] It is worth mentioning that, based on the design of the pyroelectric infrared multi-probe module 100, the FPC board 10 can also protect sensitive elements such as the PIR probe 20 during the welding process, reduce the impact of high temperature on sensitive elements during welding, reduce welding requirements, and is suitable for fully automated welding production processes.

[0113] Specifically, during the process of soldering the PIR probe 20 to the multilayer FPC board 10, a thermal barrier can be formed on the substrate 11 to protect the PIR probe 20. Furthermore, through openings on the multilayer FPC board 10 corresponding to the pins of the PIR probe 20, and considering the thin and light structure of the multilayer FPC board 10, preheating can be performed only on the lower side or even be eliminated during soldering in a hot-boiler or wave soldering process. That is, when the multilayer FPC board 10 is placed on the soldering line with the side facing away from the PIR probe 20 as its bottom, preheating on the side facing the PIR probe 20 is not required, allowing the PIR probe 20 to be soldered normally onto the multilayer FPC board 10. This ensures the soldering process while reducing the impact of high temperatures on the PIR probe 20, thus preventing high temperatures during the production soldering process from affecting the performance of the pyroelectric infrared multi-probe module 100 and ensuring the performance consistency of the pyroelectric infrared multi-probe module 100 during mass production.

[0114] In other words, under suitable temperature control, the PIR probe 20 can be directly soldered onto the multilayer FPC board 10 using wave soldering, without the need for manual soldering. (See reference...) Figure 16 As shown, when the PIR probe 20 is in an SMD (Surface Mount Device) package, the multilayer FPC board 10 has metallized vias 102 at the pins 21 of the PIR probe 20. This facilitates soldering of the PIR probe 20 through the metallized vias 102 during soldering using a hot-sink or wave soldering process, taking advantage of the thinness of the multilayer FPC board 10. (See reference...) Figure 17 As shown, when the PIR probe 20 is in the form of a pin, the pin 22 of the PIR probe 20 can be directly inserted into the socket 103 on the multilayer FPC board 10, and can be directly wave soldered. This conforms to the development trend of automated production and can also effectively reduce the problem of unreliable operation due to manual operation, improve production efficiency and improve the yield rate.

[0115] It is also worth mentioning that, for reference Figure 18 As shown, the PIR probe 20 can be soldered onto the multilayer FPC board 10 using a fully automated wave soldering process, thus enabling wave soldering via panel welding. Figure 18 As shown, a panel 1000 is formed by assembling multiple pyroelectric infrared multi-probe modules 100 to be welded. The panel welding method significantly improves welding efficiency and also increases the yield rate of production.

[0116] In particular, the shape of the multilayer FPC board 10 can be flexibly designed according to the different numbers of the PIR probes 20 and design requirements.

[0117] For example, corresponding to Figures 2 to 5 In the structure shown, there are two PIR probes 20. The multilayer FPC board 10 is schematically shown in a strip shape. The PIR probes 20 are arranged along the length of the strip-shaped multilayer FPC board 10. The first connection terminal 101 is located at one end of the strip-shaped multilayer FPC board 10. In this structure, the mounting bracket 40 has two mounting surfaces, and the two mounting surfaces are inclined to the PCB circuit board 30. The mounting surface inclined to the PCB circuit board 30 is named the inclined mounting surface 41. The two PIR probes 20 are respectively set at different angles corresponding to the two inclined mounting surfaces 41.

[0118] It is understood that when the number of PIR probes 20 is greater than two, the multilayer FPC board 10 can also be designed in a strip shape, for example, as shown in the reference. Figure 12 As shown, the number of PIR probes 20 is greater than or equal to three, and each PIR probe 20 is arranged at equal intervals along the length direction of the multilayer FPC board 10 to form a PIR probe strip. The PIR probe strip can be mounted around a corresponding mounting bracket. For example, each mounting surface is set to be perpendicular to the PCB board 30. The PIR probe strip is mounted around the mounting bracket so that each PIR probe 20 corresponds to a different mounting surface, thereby enabling 360° circumferential detection of the corresponding pyroelectric infrared detection device. Thus, the functions of the pyroelectric infrared detection device are enriched based on the orientation of each PIR probe 20.

[0119] It is worth mentioning that the mounting method of the mounting bracket 40 on the PCB circuit board 30 does not constitute a limitation on the present invention. For example, corresponding to Figure 5 As shown, the mounting bracket 40 has a snap 43 and is mounted to the PCB circuit board 30 by the snap 43. In some embodiments, the mounting bracket 40 may also be mounted to the PCB circuit board 30 in other ways, such as by adhesive, snap-fit ​​connection, etc.

[0120] For example, corresponding to Figure 6 and Figure 7As shown, the number of PIR probes 20 is three, and the multilayer FPC board 10 is designed in a cross shape with four protruding ends. The three PIR probes 20 are respectively disposed at three ends of the multilayer FPC board, and the first connection terminal 101 is disposed at the other end of the multilayer FPC board 10. Correspondingly, in this structure, the mounting bracket 40 includes not only the inclined mounting surface 41 inclined to the PCB circuit board 30, but also a mounting surface parallel to the PCB circuit board 30. Each PIR probe 20 is disposed in a state corresponding to a different mounting surface. Specifically, in this structure, at least two of the PIR probes 20 are mounted on the inclined mounting surface 41.

[0121] It is understood that in some implementations, the mounting bracket 40 may be configured with only one inclined mounting surface 41, or only one of the multiple inclined mounting surfaces 41 may have the PIR probe 20 mounted on it. In this case, the PIR probe 20 may be mounted on the mounting surface parallel to the PCB circuit board 30. When the corresponding pyroelectric infrared detection device is wall-mounted, the PIR probe 20 mounted on the inclined mounting surface 41 will face downwards to detect the near area, while the PIR probe 20 mounted on the mounting surface parallel to the PCB circuit board 30 will detect the far area.

[0122] It is understood that when the multilayer FPC board 10 is designed in a cross-shaped configuration, the number of PIR probes 20 can also be two, for example, two PIR probes 20 can be disposed at one or both ends of the multilayer FPC board. Furthermore, the number of PIR probes 20 can also exceed three; for example, refer to... Figure 9 The multilayer FPC board 10, which is cross-shaped, has three short ends and one long end, with the long end defined as the lower side. The number of PIR probes 20 is four, with three PIR probes 20 located at the three short ends and another PIR probe 20 located between the upper short end and the long end. The distance between this other PIR probe 20 and the upper PIR probe 20 is equal to the distance between the two PIR probes 20 located on the left and right sides. The first connection terminal 101 is located at the long end.

[0123] For further examples, see reference Figure 10 As shown, the mounting bracket 40 mounts the PIR probe 20 on both the inclined mounting surface 41 and the mounting surface parallel to the PCB circuit board 30. Specifically, with Figure 9 The structure shown is the same as that shown in Figure 10In this structure of the pyroelectric infrared multi-probe module 100 shown, there are four PIR probes 20. Three of the PIR probes 20 are located at the three short ends, and the other PIR probe 20 is located between the upper short end and the long end. The distance between this other PIR probe 20 and the upper PIR probe 20 is equal to the distance between the two PIR probes 20 located on the left and right sides. The mounting bracket 40 has four inclined mounting surfaces 41, with each of the four PIR probes 20 corresponding to one of the four inclined mounting surfaces 41. Figure 9 The structure shown is different in that, Figure 10 The pyroelectric infrared multi-probe module 100 shown further includes a PIR probe 20, which is positioned at the intersection of the cross-shaped multilayer FPC board 10 and corresponds to the state in which the multilayer FPC board 10 is placed on the mounting bracket 40. The PIR probe 20 is located on the mounting surface of the mounting bracket 40 parallel to the PCB circuit board 30.

[0124] It is worth mentioning that, based on the angle between each of the PIR probes 20, different partitions can be formed. For example, refer to... Figure 8 The multilayer FPC board 10 is configured in a triangular shape with three intersecting support segments at one end, and the included angle between two adjacent support segments along the circumferential direction is 120° within a ±20% error range. The number of PIR probes 20 is three, and each of the three PIR probes 20 is respectively disposed on one of the three support segments of the multilayer FPC board 10 such that the included angle between two adjacent PIR probes 20 is 120° within a ±20% error range. The first connecting terminal 101 is disposed on one of the support segments of the multilayer FPC board 10. (Comparative Reference) Figure 8 and Figure 7 As shown, it can be clearly seen that when there are three PIR probes 20, the different orientations of the PIR probes 20 can be achieved by setting the included angle between each PIR probe 20.

[0125] It is understandable that, in the corresponding Figure 8 When the multilayer FPC board 10 shown is configured in a trident shape, the number of PIR probes 20 is not limited to three. For example, only two PIR probes 20 can be set in two of the carrier sections of the multilayer FPC board 10.

[0126] For further examples, see reference Figure 11As shown, the multilayer FPC board 10 has six protruding carrier segments, and the included angle between two adjacent carrier segments along the circumferential direction is 60° within an error range of ±20%. The number of PIR probes 20 is six, and the six PIR probes 20 are respectively disposed on the six carrier segments of the multilayer FPC board 10 so that the included angle between two adjacent PIR probes 20 is 60° within an error range of ±20%. The first connection terminal 101 is disposed on one of the carrier segments of the multilayer FPC board 10, thereby forming different partitions based on different shapes and the number of PIR probes 20.

[0127] Understandably, with Figure 10 The structure shown is similar, in Figure 8 and Figure 11 In the structures shown, the PIR probe 20 can also be installed at the intersection of each of the carrier segments. Then, corresponding to the state in which the multilayer FPC board 10 is placed on the mounting bracket 40, the PIR probe 20 installed at the intersection of each of the carrier segments is located on the mounting surface of the mounting bracket 40 parallel to the PCB circuit board 30.

[0128] It is also understood that, in specific implementation, the specific position of the first connecting terminal 101 on the FPC board 10 can be designed according to actual needs. For example, but not limited to, it can be located at one end of the FPC board 10 as shown in these structures of the present invention, at the intersection of each of the bearing segments, or in the middle of the strip-shaped multilayer FPC board 10.

[0129] It is worth mentioning that, to ensure the stability of the multilayer FPC board 10 placed on the mounting bracket 40, the present invention further fixes the multilayer FPC board 10, wherein... Figure 9 The structure shown is schematic, wherein the mounting bracket 40 further includes a pressure cap 42, wherein the pressure cap 42 matches the mounting bracket 40 to be detachably mounted on the mounting bracket 40, for example, but not limited to, fixing by snap-fit ​​or plug-in fixing, wherein when the FPC board 10 is placed on the mounting bracket 40, the pressure cap 42 can limit the PIR probe 20 in a direction away from the PCB circuit board 30 based on the mounting bracket, thereby improving the firmness of the PIR probe 20 being placed on the mounting bracket 40 and maintaining the orientation angle stability of each PIR probe 20.

[0130] Specifically, the pressure cap 42 is provided with clearance positions 421 corresponding to the number of PIR probes 20, so as to achieve edge fixing of the PIR probes 20 when the pressure cap 42 is installed on the mounting bracket 40, thereby further improving the installation stability of the PIR probes 20.

[0131] It is worth mentioning that, in this structure, the mounting bracket 40 extends protrudingly from both sides of the mounting surface and has two limiting walls. The two limiting walls define a limiting groove on the mounting surface. The multilayer FPC board 10 is placed on the mounting surface along the limiting groove and is held by the two limiting walls. In this way, the two limiting walls limit the PIR probe 20 on the mounting surface without the PIR probe being directly soldered to the PCB board 30, thus maintaining the orientation angle stability of each PIR probe 20.

[0132] Specifically, the mounting surface is provided with a slot 411, and the cover 42 is provided with a tooth 422 that matches the slot 411, wherein the cover 42 is detachably mounted to the mounting bracket 40 with the tooth 422 inserted into the slot 411.

[0133] It is worth mentioning that, when the pressure cap 42 is installed on the mounting bracket 40, a barrier cavity can be defined by the limiting wall, in which the PIR probe 20 is housed. This allows the pressure cap 42, the mounting bracket 40, and the limiting wall to form a thermal barrier against the PIR probe 20, further reducing the impact of heat generated by electronic components and air heat on the PIR probe 20, and improving the thermal interference resistance of the pyroelectric infrared multi-probe module 100.

[0134] In particular, in addition to using a mechanical structure to limit the multilayer FPC board 10 to attach the multilayer FPC board 10 to the mounting surface, the multilayer FPC board 10 can also be attached to the mounting surface by means of adhesive or other methods, and a mechanical structure can be further provided to limit the multilayer FPC board 10 when it is attached to the mounting surface.

[0135] Furthermore, refer to the accompanying drawings of the specification of this invention. Figures 19A to 19CAs shown, the production and assembly process of the pyroelectric infrared multi-probe module 100 is illustrated. The mounting bracket 40 includes a base and a cover 42. The base extends downward and has corresponding snap-fit ​​or plug-in pins to be mounted on the PCB circuit board 30 by snap-fit ​​or plug-in. The mounting surface 41 is located on the upper side of the base and has several through holes 411. The cover 42 matches the base and has a probe window 423 and extends downward with a snap-fit ​​422. The cover 422 is snapped onto the PCB circuit board 30 based on the snap-fit ​​422. When the cover 422 is installed, each PIR probe 20 protrudes from the probe window 423 and can be limited by the cover 42.

[0136] Specifically, during assembly, mechanical installation can be quickly completed simply by mounting the base onto the PCB circuit board 30 and installing the pressure cap 42. The multilayer FPC board 10 and the PIR probe 20 can be installed on the base before or after the base is mounted onto the PCB circuit board 30. Correspondingly, after the multilayer FPC board 10 and the PIR probe 20 are mounted on the base, and the base is mounted onto the PCB circuit board 30, the installation is completed simply by inserting the pressure cap 42 onto the PCB circuit board 30 from top to bottom. This allows the PIR probe 20 to be quickly and securely fixed to the PCB circuit board 40 without needing to be directly soldered to it. The pressure cap 42's mounting on the PCB circuit board 30 also helps to create an upward upper limit on the base, improving the installation firmness of the mounting bracket 40. It is understood that in some embodiments, the pressure cap 42 can also be designed to be mounted on the base.

[0137] It is worth mentioning that, in the mounting of the mounting bracket 40 on the PCB circuit board 40 and the soldering or plugging of the first connecting terminal 101 and the second connecting terminal, the pyroelectric infrared multi-probe module 100 is assembled and can be easily installed into the corresponding pyroelectric infrared detection device. See [reference needed] for details. Figure 19CAs shown, a pyroelectric infrared detection device 200 including the pyroelectric infrared multi-probe module 100 is schematically illustrated. The pyroelectric infrared detection device 200 includes the pyroelectric infrared multi-probe module 100 and a lens unit 210. The lens unit 210 has a light-incoming surface. The pyroelectric infrared multi-probe module 100 is positioned such that the side of the multilayer FPC board 10 carrying the PIR probe 20 faces the side of the lens unit 210 opposite to the light-incoming surface. It is understood that the lens unit 210 is a lens with light-gathering characteristics. For example, the lens unit 210 can be a convex lens, a Fresnel lens, or a lens with light-gathering characteristics formed by further designing corresponding textures based on the structure of a convex lens and a Fresnel lens. Furthermore, the focal length and structure of each lens unit 210 are not limited to the same value.

[0138] In other words, based on the design of this invention, the pyroelectric infrared multi-probe module 100 can be automatically mass-produced and the product quality can be guaranteed, thereby helping to ensure the production efficiency and product performance quality of the pyroelectric infrared detection device 200, so as to meet the market demand and quality requirements for the pyroelectric infrared detection device 200. The pyroelectric infrared multi-probe module 100 can be quickly assembled to form the pyroelectric infrared detection device 200.

[0139] It is understood that in the actual production process, the PCB circuit board 30 may be assembled with the PIR probe 20 later when the PIR probe 20 is installed into the pyroelectric infrared detection device 200. For example, the soldering of the PIR probe 20 and the multilayer FPC board 10 may be completed by a production line or a manufacturer, and the subsequent production line or manufacturer may be specifically responsible for the assembly of the pyroelectric infrared detection device 200. This invention does not limit this.

[0140] Specifically, the limiting method for the multilayer FPC board 20 to the mounting bracket 40 can also be other methods, such as, but not limited to, snap-fit ​​fixing, insertion fixing, etc. For specific examples, refer to Figure 20A and Figure 20B As shown, the mounting bracket 40 includes a snap-fit ​​43, which engages and limits the position of the multilayer FPC board 20 when it is mounted on the mounting bracket 40, thereby maintaining the orientation and angular stability of each PIR probe 20. For example, refer to... Figure 21A and Figure 21BAs shown, the mounting bracket 40 extends upward with a positioning post 44, and the multilayer FPC board 10 has a positioning hole 1023 that matches the positioning post 44. The PIR probe 20 is fixedly mounted on the mounting bracket 40 with the positioning hole 1023 inserted by the positioning post 44, so as to maintain the orientation and angular stability of each PIR probe 20.

[0141] It is worth mentioning that, for reference Figure 22 As shown, the corresponding circuit components 31 can also be carried on the multilayer FPC board 10, which helps to simplify the circuit design of the PCB board 30. The circuit components 31 can be a photosensitive sensor 311, a remote control receiver 312, etc., and the present invention does not limit this.

[0142] It is understood that the specific form of the PIR probe 20 described herein does not constitute a limitation of the present invention, as can be seen from the references. Figure 23A , Figure 23B as well as Figure 23C Different embodiments of the PIR probe 20 are illustrated, and the specific form of the PIR probe 20 is, for example, but not limited to, the corresponding Figure 23A The combination of circles and squares shown corresponds to Figure 23B The square shape shown corresponds to Figure 23C The circular shape shown.

[0143] It is worth mentioning that, with reference to the accompanying drawings of this invention... Figure 24As shown, a pyroelectric infrared detection device 200 according to the above embodiment of the present invention is illustrated. The pyroelectric infrared detection device 200 is installed in a lamp and includes the pyroelectric infrared multi-probe module 100, the lens unit 210, and a housing 220. The lens unit 210 is disposed at one end of the housing 220, and the other end of the housing 220 is installed in the corresponding lamp. The housing 220 has a first sealed cavity 2201 and a second sealed cavity 2202 along the direction from the end where the lens unit 210 is located to the other end. The R probe 20 is housed in the first sealed cavity 2201. The multilayer FPC board 10 extends from the first sealed cavity 2201 into the second sealed cavity 2202 to connect with the PCB circuit board 30 housed in the second sealed cavity 2202. This ensures that when the corresponding lamp is a high-power lamp or a high-temperature resistant LED, even if the end of the housing 220 near the lamp reaches 100°C to 120°C due to the lamp's operating heat, the housing 220 remains relatively cool. The lack of air circulation inside the pyroelectric infrared multi-probe module 100 creates an air gap, thus providing thermal insulation. Simultaneously, the multilayer FPC board 10 further provides thermal insulation for the PIR probe 20. Since the PIR probe 20 is suspended and mounted in the first sealed cavity 2201, for example, by a mounting component disposed in the first sealed cavity 2201, the PIR probe 20 is mounted and positioned. Connected to the PCB circuit board 30 via the multilayer FPC board 10, this effectively creates high-temperature thermal insulation at the end where the lens unit 210 is located. The end of the lens unit 210 faces outward. When heat from one end of the lamp is transferred to the end where the lens unit 210 is located, the housing 220 and / or cavity wall can transfer the heat to the outside to achieve heat dissipation. Based on this design of the present invention, the temperature at the end where the lens unit 210 is located can be at least 30°C lower than the temperature at the other end. That is to say, even if the end of the housing 220 near the lamp reaches a high temperature of 110°C due to the lamp's operation, the temperature at the location of the PIR probe 20 can still be maintained below 80°C, thus enabling the PIR probe 20 to operate normally. Furthermore, based on the design of the present invention, the pyroelectric infrared detection device 200 is easy to assemble during the production process, effectively improving the production efficiency of the pyroelectric infrared detection device 200.

[0144] It is understandable that, based on the consideration of product miniaturization, in some designs of the present invention, holes can be drilled in the PCB circuit board 30 at the position corresponding to the PIR probe 20. The PIR probe 20 can be recessed based on the hole in the PCB circuit board 30, which helps to reduce the height of the pyroelectric infrared detection device 200 and facilitates the miniaturization design of the pyroelectric infrared detection device 200. At the same time, based on the air gap formed by the first sealed cavity 2201, which has a thermal barrier effect, the thermal barrier effect formed by the multilayer FPC board 10 on the PIR probe 20, and the heat dissipation conduction formed by the housing 200 and the cavity wall, the pyroelectric infrared detection device 200 can still produce a good heat insulation effect on the PIR probe 20.

[0145] Further, refer to Figures 25A to 25C As shown, a product form of a pyroelectric infrared detection device 200 according to the above embodiment of the present invention is illustrated. The pyroelectric infrared detection device 200 includes the pyroelectric infrared multi-probe module 100, the lens unit 210, and the housing 220. The housing 220 has a lens window 301 communicating between the internal space and the external space of the housing 220. The lens unit 210 is installed in the lens window 301. The pyroelectric infrared multi-probe module 100 is housed in the internal space of the housing 220, and each of the PIR probes 20 is arranged facing away from and tilted in the internal space of the housing 220.

[0146] Specifically, the multilayer FPC board 10 carrying each PIR probe 20 is placed on the mounting bracket 40 disposed on the PCB circuit board 30. Based on the flexibility of the multilayer FPC board 10, it can be bent and placed on each mounting surface of the mounting bracket 40. Based on the tilt angle design of each mounting surface, the multilayer FPC board 10 is set with a specific angular orientation when placed on the mounting surface, thereby correspondingly forming the orientation setting of each PIR probe 20. In this way, each PIR probe 20 is quickly set to face away and tilted in the internal space of the housing 220. Furthermore, the orientation angle of each PIR probe 20 of the pyroelectric infrared multi-probe module 100 is determined and maintained by the mounting surface of the mounting bracket 40. While realizing the rapid setting of the orientation angle of each PIR probe 20, the accuracy of the orientation angle of each probe can also be guaranteed.

[0147] Furthermore, the lens unit 210 includes a lens distribution area 211 corresponding to each of the PIR probes 20 and an isolation area 212 disposed between each of the lens distribution areas 211. Each of the lens distribution areas 211 is circumferentially distributed and is responsible for the circumferential horizontal field of view, thereby achieving 360° horizontal field of view coverage. Furthermore, the spacing of each of the lens distribution areas 211 enables the partitioning and isolation of each of the PIR probes 20, which helps to avoid mutual interference between the PIR probes 20 and simplifies the production process of the pyroelectric infrared detection device 200.

[0148] In particular, the isolation area 212, as a separating component of each of the lens distribution areas 211, can provide strength support for the lens unit 210, which is beneficial for the thinning design of the lens unit 210 at the position of each of the lens distribution areas 211, thereby improving the corresponding detection sensitivity and resolution.

[0149] In particular, in this product form illustrated in the present invention, the isolation area 212 is provided with reinforcing ribs 2121, which can strengthen the strength support for each of the lens distribution areas 211, so that the lens unit 210 is thinned at the position of each of the lens distribution areas 211, which is beneficial to improving the sensitivity of the pyroelectric infrared detection device 200.

[0150] It is worth mentioning that the isolation area 212 refers to the area where infrared rays cannot be focused on the corresponding PIR probe 20 based on the isolation area 212. The isolation area 212 can be an area on the lens unit 210 where no lens is provided, or it can be an area that cannot focus infrared rays based on the corresponding lens through frosting and / or light-blocking treatment. The present invention does not limit this.

[0151] Specifically, the isolation area 212 serves as a separator for each of the lens distribution areas 211. Supporting components such as support columns can be directly installed on the isolation area 212 without obstructing the corresponding PIR probe. This improves the structural strength of the lens unit 210 without affecting the performance of the pyroelectric infrared detection device 200, i.e., it does not obstruct the PIR probe 20. Furthermore, the structural reinforcement effectively prevents the lens unit 210 from being deformed by compression, collision, etc., ensuring the structural stability of the lens unit 210. It also facilitates the thinning of the position of the lens unit 210 in each of the lens distribution areas 211.

[0152] Specifically, the isolation area 210, serving as a separator between the lens distribution areas 211, is a free area that does not require infrared transmission / focusing functions. Therefore, it can be used to embed various control components of the pyroelectric infrared detection device 200, such as, but not limited to, potentiometers, switches, buttons, light sensors, infrared receivers, and temperature sensors. Thus, the isolation area 212 can serve as a control adjustment area for the control components. There is no need to set up a mounting area for the corresponding control components on the housing 220 of the pyroelectric infrared detection device 200, which facilitates the miniaturization of the pyroelectric infrared detection device 200. Furthermore, since each PIR probe 20 is tilted within the internal space of the housing 220, with its sensing surface facing the lens distribution area 211, a 360° horizontal field of view can be achieved. Moreover, with the isolation area 212 serving as the control adjustment area for the control components, the placement of the control components will not obstruct the infrared radiation emitted by the human body from reaching the corresponding PIR probe 20 through each lens area.

[0153] Specifically, in this product form of the present invention, the circuit components 31 of the pyroelectric infrared detection device 200 are carried on the PCB circuit board 30. The PIR probe 20 is connected to the second connection terminal on the PCB circuit board 30 through the first connection terminal 101, that is, it can be electrically connected to the circuit components 31. Correspondingly, during production and installation, it is only necessary to connect the first connection terminal 101 to the second connection terminal on the PCB circuit board 30 to complete the connection of the probe module. There is no need to directly solder the PIR probe 20 to the PCB circuit board 30, which simplifies the production steps of installing the PIR probe 20 on the PCB circuit board 30, and can improve production efficiency while ensuring production consistency. Furthermore, during the production process, the PCB circuit board 30 can be manufactured separately and assembled with the PIR probe 20 only when it is installed into the pyroelectric infrared detection device 200. For example, the soldering of the PIR probe 20 and the multilayer FPC board 10 is completed by one production line or one manufacturer, the PCB circuit board 30 is manufactured by another production line or another manufacturer, the housing 220 and the lens unit 210 are manufactured by other production lines or other manufacturers, and the subsequent production line or manufacturer is specifically responsible for the assembly of the pyroelectric infrared detection device 200. In this way, production efficiency is improved through modular production.

[0154] Furthermore, a potentiometer 32 is also provided on the PCB circuit board 30. The adjustment knob 321 of the potentiometer 32 is located in the isolation area 212 of the lens unit 210. When the lens unit 210 is installed in the housing 220, the adjustment knob 321 is matched and installed on the potentiometer 32 to operate the potentiometer 32. This eliminates the need for an additional installation area for the potentiometer adjustment knob in the pyroelectric infrared detection device 200. Moreover, the adjustment knob 321 of the potentiometer 32 is located on the front of the pyroelectric infrared detection device 200 and will not cause any obstruction, making it convenient for the user to set parameters.

[0155] It is worth mentioning that the pyroelectric infrared detection device 200 includes a support column 230, one end of which abuts against the isolation area 212 of the lens unit 210, and the other end is mounted on the PCB circuit board 30, the housing 220, or the mounting bracket 40 to form a support for the lens unit 210. This makes the isolation area 212 both a separation area for each PIR probe 20 and a support area for the lens unit 210. Furthermore, the arrangement of the support column 230 will not obstruct the infrared radiation emitted by the human body from reaching the corresponding PIR probe 20 through each lens area. Preferably, in this product form illustrated in the present invention, the support column 230 is supported at the physical center point of the isolation area 212, which can effectively prevent the lens unit 210 from being dented or deformed by compression, collision, etc., and ensure the structural stability of the lens unit 210. Each of the PIR probes 20 is arranged around the support column 230 with its back to the support column 230, thereby forming a structural form in which each of the PIR probes 20 is arranged with its back to the support column 230.

[0156] Specifically, the pyroelectric infrared detection device 200 further includes a temperature sensor 33, which is disposed at one end of the support column 230 so that the temperature sensor 33 contacts the lens unit 210 based on the support of the support column 230. The contact between the temperature sensor 33 and the lens unit 210 improves the accuracy of temperature detection, which is beneficial to improving the accuracy of temperature compensation of the pyroelectric infrared detection device 200. Therefore, based on accurate temperature compensation settings, the pyroelectric infrared detection device 200 can be applied to ultra-low temperature environments such as cold storage.

[0157] Preferably, the support column 230 is configured as a hollow column, and the temperature sensor 33 is connected to the circuit components 31 of the PCB circuit board 30 through the internal wiring of the support column 230. This simplifies the wiring complexity and avoids obstructing the PIR probe 20. It is understood that in some embodiments, the temperature sensor 33 may also be located in other areas, such as the area where the potentiometer 32 is located; this invention does not limit this.

[0158] Specifically, based on the design of this invention, when the multilayer FPC board 10 is placed on the mounting surface, each PIR probe 20 automatically forms a specific angular orientation, thereby correspondingly setting the orientation of each PIR probe 20. This allows each PIR probe 20 to be positioned backwards and tilted within the internal space of the housing 220. Furthermore, the isolation area 212 forms a separation between each lens distribution area 211, thus achieving a partitioned setting for each PIR probe 20. Each PIR probe 20 corresponds to one lens distribution area 211. Therefore, the housing 220 does not require compartmentalization design for each PIR probe 20 with a specific angular orientation, which simplifies the structure of the pyroelectric infrared detection device 200 and facilitates its production and debugging.

[0159] It is worth mentioning that, in addition to being set according to the natural color of the lens main material, in some embodiments of the present invention, the lens unit 210 may also be set to the same color as the housing 220. For example, if the housing 220 is white, the lens unit 210 is white by incorporating relevant color powder / pigment into the lens main material. In this way, the aesthetics and concealment of the pyroelectric infrared detection device 200 are improved by the feature that the lens unit 210 and the housing 220 are the same color.

[0160] Specifically, based on the design of this invention, multiple PIR probes 20 are supported by the flexible multilayer FPC board 10, allowing for flexible angle settings of each PIR probe 20 during installation, for example, by referring to... Figure 26 As shown, each of the PIR probes 20 is tilted and facing each other, with reference to... Figure 27As shown, when the multilayer FPC board 10 is placed on the mounting bracket 40 on the PCB circuit board 30, the mounting surface of the multilayer FPC board 10 can be bent and placed on the mounting bracket 40 based on its flexible characteristics. Based on the tilt angle design of each mounting surface, the multilayer FPC board 10 is set to a specific angular orientation when placed on the mounting surface, which quickly realizes the state in which each PIR probe 20 is tilted and facing each other, while also ensuring the accuracy of the orientation angle of each probe. The lens unit 210 can be set as a multi-segment folding lens. Based on the overlapping detection range of at least two tilted and facing PIR probes 20, it is beneficial to improve detection accuracy.

[0161] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0162] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and any variations or modifications may be made to the implementation of the present invention without departing from the stated principles.

Claims

1. A pyroelectric infrared multi-probe module, characterized in that, include: At least two PIR probes; A multilayer FPC board, wherein the multilayer FPC board includes at least two conductive layers and at least one substrate carrying the conductive layers, wherein each of the PIR probes is soldered to the same side of the multilayer FPC board, wherein the multilayer FPC board is provided with a first connection terminal electrically connected to the PIR probe. A PCB circuit board, wherein the PCB circuit board has a second connection terminal that mates with the first connection terminal; and A mounting bracket is mounted on one side of the PCB circuit board and has at least two mounting surfaces, wherein the multilayer FPC board is plugged into or soldered to the PCB circuit board with the first connection terminal connected to the second connection terminal, and each PIR probe is mounted on the mounting bracket with the PIR probe attached to a different mounting surface at the position where the PIR probe is soldered to the multilayer FPC board.

2. The pyroelectric infrared multi-probe module according to claim 1, wherein at least one side of the multilayer FPC board is connected to the positive or negative terminal of a corresponding power supply to form the shielding layer, and at least one of the conductive layers of the multilayer FPC board, which is isolated from the shielding layer based on the substrate, is a signal transmission layer.

3. The pyroelectric infrared multi-probe module according to claim 2, wherein the multilayer FPC board is a double-layer board comprising one substrate and two conductive layers supported on two opposite sides of the substrate.

4. The pyroelectric infrared multi-probe module according to claim 2, wherein the multilayer FPC board is a three-layer board comprising two substrate layers and three conductive layers, wherein the three conductive layers are sequentially stacked and the two substrate layers are located between adjacent conductive layers, wherein the two conductive layers located on both sides of the multilayer FPC board form the shielding layer, and the conductive layer located between the two substrate layers is the signal transmission layer.

5. The pyroelectric infrared multi-probe module according to claim 2, wherein the multilayer FPC board is a four-layer board comprising three substrate layers and four conductive layers, wherein the three substrate layers are stacked sequentially, wherein two of the four conductive layers are respectively disposed between two pairs of adjacent substrate layers, and the other two conductive layers are disposed on two opposite sides of the multilayer FPC board, wherein the two conductive layers located on both sides of the multilayer FPC board form the conductive shielding layer, and the two conductive layers located between the substrate layers are the signal transmission layers.

6. The pyroelectric infrared multi-probe module according to claim 1, wherein the first connection terminal is implemented as one of a gold finger structure, a terminal plug-in structure, and a pad-type terminal structure.

7. The pyroelectric infrared multi-probe module according to claim 1, wherein the PIR probe is in SMD package form, and wherein the multilayer FPC board is provided with metallized through holes at the pins of the PIR probe, so that when soldering is performed using a solder pot or wave soldering process, the solder can be soldered to the PIR probe through the metallized through holes based on the thin and light characteristics of the multilayer FPC board.

8. The pyroelectric infrared multi-probe module according to claim 1, wherein the mounting bracket further includes a pressure cap, wherein the pressure cap is matched with the mounting bracket to be detachably mounted on the mounting bracket, wherein in the state where the PIR probe is mounted on the mounting bracket, the pressure cap can be used to limit the PIR probe in a direction away from the PCB circuit board.

9. The pyroelectric infrared multi-probe module according to claim 8, wherein the pressure cap is provided with clearances corresponding to the number of PIR probes, so as to achieve edge fixing of the PIR probes when the pressure cap is installed on the mounting bracket.

10. The pyroelectric infrared multi-probe module according to claim 1, wherein the mounting bracket extends protrudingly from both sides of the mounting surface and has two limiting walls, the two limiting walls defining a limiting groove on the mounting surface, wherein the multilayer FPC board is placed on the mounting surface along the limiting groove and is clamped by the two limiting walls, so as to be limited and attached to the mounting surface.

11. The pyroelectric infrared multi-probe module according to claim 1, wherein the FPC board is adhered to the mounting surface.

12. The pyroelectric infrared multi-probe module according to claim 1, wherein the mounting bracket comprises a body and a cover, wherein the body extends downwardly with corresponding snaps or plugs for mounting on the PCB circuit board, wherein the mounting surface is located on the upper side of the body, wherein the cover matches the body and has a probe window, wherein when the cover is installed, each of the PIR probes protrudes from the probe window and can be limited based on the cover.

13. The pyroelectric infrared multi-probe module according to any one of claims 1 to 12, wherein the mounting bracket has at least one mounting surface inclined to the PCB board, and the mounting surface inclined to the PCB board is correspondingly named as an inclined mounting surface, wherein at least one of the inclined mounting surfaces is on which the PIR probe is mounted.

14. The pyroelectric infrared multi-probe module according to claim 13, wherein the multilayer FPC board is configured in a strip shape, and each of the PIR probes is arranged along the length direction of the multilayer FPC board.

15. The pyroelectric infrared multi-probe module according to claim 14, wherein the first connection terminal is located at one end of the strip-shaped multilayer FPC board.

16. The pyroelectric infrared multi-probe module according to claim 15, wherein the number of PIR probes is two.

17. The pyroelectric infrared multi-probe module according to claim 15, wherein the number of PIR probes is greater than or equal to three, and each of the PIR probes is arranged on the multilayer FPC board to form a PIR probe strip.

18. The pyroelectric infrared multi-probe module according to claim 13, wherein the multilayer FPC board is configured in a cross shape with four protruding ends, and the PIR probe is provided at at least two ends of the multilayer FPC board.

19. The pyroelectric infrared multi-probe module according to claim 18, wherein the number of PIR probes is three, the three PIR probes are respectively disposed at three ends of the multilayer FPC board, and the first connection terminal is disposed at the other end of the multilayer FPC board.

20. The pyroelectric infrared multi-probe module according to claim 18, wherein the cross-shaped multilayer FPC board has three short ends and one long end corresponding to its shape, wherein the long end is defined as the lower side, wherein the number of PIR probes is four, wherein three of the PIR probes are disposed at the three short ends, and another PIR probe is located between the upper short end and the long end, and the distance between the other PIR probe and the PIR probe located on the upper side is equal to the distance between the two PIR probes located on the left and right sides, wherein the first connecting terminal is located at the long end.

21. The pyroelectric infrared multi-probe module according to claim 13, wherein the multilayer FPC board is configured in a trident shape with three bearing segments intersecting at one end, and the included angle between two adjacent bearing segments along the circumferential direction is 120° within an error range of ±20%, wherein the PIR probe is disposed on at least two of the bearing segments of the multilayer FPC board.

22. The pyroelectric infrared multi-probe module according to claim 21, wherein the number of PIR probes is three, and the three PIR probes are respectively disposed on three of the carrier segments of the multilayer FPC board such that two adjacent PIR probes are at an angle of 120° within an error range of ±20%, wherein the first connection terminal is disposed on one of the carrier segments of the multilayer FPC board.

23. The pyroelectric infrared multi-probe module according to claim 13, wherein the multilayer FPC board has six carrier segments intersecting at one end, and the included angle between two adjacent carrier segments along the circumferential direction is 60° within an error range of ±20%, wherein the number of PIR probes is six, and the six PIR probes are respectively disposed on the six carrier segments of the multilayer FPC board such that the included angle between two adjacent PIR probes is 60° within an error range of ±20%, wherein the first connecting terminal is disposed on one of the carrier segments of the multilayer FPC board.

24. The pyroelectric infrared multi-probe module according to claim 13, wherein the multilayer FPC board has at least two carrier segments intersecting at one end, wherein at least one of the carrier segments is equipped with the PIR probe, wherein the first connection terminal is disposed at one of the carrier segments of the multilayer FPC board or at the intersection of the carrier segments.

25. The pyroelectric infrared multi-probe module according to claim 24, wherein the PIR probe is installed at the intersection of each of the carrier segments.

26. A pyroelectric infrared detection device, characterized in that, include: The pyroelectric infrared multi-probe module according to any one of claims 1 to 25; and A lens unit, wherein the lens unit has a light-incoming surface, wherein the pyroelectric infrared multi-probe module wall is arranged such that the side of the multilayer FPC board carrying the PIR probe faces the side of the lens unit opposite to the light-incoming surface.

27. The pyroelectric infrared detection device according to claim 26, wherein the pyroelectric infrared detection device includes a housing, wherein the lens unit is disposed at one end of the housing, the other end of the housing is adapted to be mounted on a corresponding lamp, wherein the housing has a first sealed cavity and a second sealed cavity along the direction from the end where the lens unit is located to the other end, wherein the PIR probe is housed in the first sealed cavity, and the multilayer FPC board extends from the first sealed cavity into the second sealed cavity to connect with the PCB circuit board housed in the second sealed cavity.

28. The pyroelectric infrared detection device according to claim 26, wherein the pyroelectric infrared detection device includes a housing, the housing having a lens window communicating with an internal space and an external space of the housing, the lens unit being mounted on the lens window, the pyroelectric infrared multi-probe module being housed in the internal space of the housing, and each of the PIR probes being disposed facing away from and tilted in the internal space of the housing, wherein the lens unit includes a lens distribution area corresponding to each of the PIR probes and an isolation area disposed between each of the lens distribution areas.

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