Module testing machine for simulating heating and heat dissipation of new energy vehicle-mounted circuit board

Abstract

The invention discloses a module testing machine for simulating heating and heat dissipation of a new energy vehicle-mounted circuit board, and relates to the technical field of heat dissipation module testing, and the module testing machine comprises a machine body, the top of the machine body is fixedly connected with a stand column, the top of the stand column is provided with a pressure head assembly, and the top of the machine body is fixedly connected with a test bed. A positioning assembly is arranged outside the test bed, a mold assembly is placed at the top of the test bed, the mold assembly comprises a base plate, and the base plate is placed at the top of the test bed. According to the testing machine for simulating the heating and heat dissipation module of the new energy vehicle-mounted circuit board, a positioning structure can be quickly customized through 3D printing on the substrate according to a heat dissipation assembly structure, a light high-strength plastic material is adopted, a modular heat-resistant block is inserted into a substrate clamping groove, and the testing machine is made of high-temperature-resistant ceramic, can be repeatedly disassembled and assembled and can be reused across the substrate; the temperature sensor monitors the temperature of the simulated heat source in real time, low-cost customization, efficient resource utilization and accurate temperature monitoring are achieved, and stable operation of equipment is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation module testing technology, specifically a test machine for simulating the heat dissipation module of a circuit board in a new energy vehicle. Background Technology

[0002] With the rapid development of the new energy vehicle industry, the number of on-board electrical devices is continuously increasing, as are the types and power of heat sources. As a key component ensuring the safe operation of equipment, the verification of the heat dissipation performance of the heat dissipation module has become a core step in the production process. Testing the heat dissipation module of the circuit board in new energy vehicles is a crucial step in ensuring the safe operation of the equipment. With the increasing number and power of on-board electrical devices, the heat dissipation problem of circuit boards is becoming increasingly prominent, making the verification of the heat dissipation module's performance essential. In the test, thermocouples, infrared thermal imagers, and other equipment are used to measure the temperature of key points non-contactly or through contact, accurately locating hot spots. A programmable DC power supply and electronic load simulate actual working conditions, recording parameters such as temperature, current, and voltage in real time. Simultaneously, a constant temperature and humidity test chamber is used to simulate high and low temperature and humid environments to evaluate the module's environmental adaptability.

[0003] Existing heat dissipation module testing equipment adopts an integrated structure, with the simulated heat source and test board fixedly connected. The test board needs to be made of high-temperature resistant special alloys and other materials, which is costly, difficult to process, heavy, and inconvenient to transport. Different models of heat dissipation modules have different heat source positions and specifications. Testing different scenarios requires the production of multiple integrated test boards, which increases equipment investment costs. The operation of replacement is cumbersome and time-consuming, affecting testing efficiency. Moreover, the fixed positioning structure of the integrated test board makes it difficult to adapt to multiple models of heat dissipation modules, resulting in poor versatility and seriously restricting the flexibility and economy of testing work. Summary of the Invention

[0004] The purpose of this invention is to provide a test machine for simulating the heat dissipation module of a circuit board in a new energy vehicle, so as to solve the existing problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a test machine for simulating the heat dissipation module of a circuit board in a new energy vehicle, comprising a body, a column fixedly connected to the top of the body, a pressure head assembly disposed on the top of the column, a test platform fixedly connected to the top of the body, a positioning assembly disposed on the outside of the test platform, a mold assembly placed on the top of the test platform, the mold assembly comprising a base plate, the base plate being placed on the top of the test platform, an organic groove formed on the top of the base plate, a fan being engaged with the inside of the organic groove, a slot formed on the top of the base plate, a wire groove formed on the top of the base plate at a position communicating with the slot, a modular heat-resistant block being engaged with the inside of the slot, a simulated heat source fixedly connected to the top of the modular heat-resistant block, and a temperature sensor disposed on the top of the simulated heat source.

[0006] Preferably, the substrate is made by 3D printing and is made of lightweight, high-strength plastic material.

[0007] Preferably, the substrate forms an engaging structure with the modular heat-resistant block through a slot, and the modular heat-resistant block is installed inside the slot for positioning, and the modular heat-resistant block is made of high-temperature resistant ceramic.

[0008] Preferably, the simulated heat source is connected to an external power source via a cable in a cable tray, and the inner diameter of the cable tray matches the outer diameter of the cable. The cable is installed inside the cable tray and connects the simulated heat source to an adjustable power supply for external devices, adjusting the power parameters to the required heating power for testing.

[0009] Preferably, the pressure head assembly includes a first horizontal plate, which is fixed to the outer wall of the column. A first groove is formed inside the first horizontal plate. A second horizontal plate is placed on top of the first horizontal plate. A second groove is formed inside the second horizontal plate. A cylinder is fixedly connected to the top of the second horizontal plate. The output end of the cylinder is fixedly connected to the pressure head body.

[0010] Preferably, a positioning bolt is provided between the first horizontal plate and the second horizontal plate, and a knob nut is provided on the outer wall of the positioning bolt. One end of the positioning bolt passes through the first horizontal plate and the second horizontal plate and is fastened to the knob nut.

[0011] Preferably, the positioning component includes an electric push rod, which is fixed inside the test bench. The output end of the electric push rod is fixedly connected to a protruding plate. The top of the protruding plate is fixedly connected to a mounting shell. The bottom of the mounting shell is fixedly connected to a slide table. The bottom of the slide table is slidably connected to a slide rail, which is fixed to one side of the test bench.

[0012] Preferably, a double-ended screw is rotatably connected inside the mounting housing, and the two ends of the double-ended screw are connected to the two sides of the inside of the mounting housing through bearings. A movable sleeve is threadedly connected to the outer wall of the double-ended screw, and a guide rod is slidably connected inside the movable sleeve. The two ends of the guide rod are fixed to the inner wall of the mounting housing. The movable sleeve and the double-ended screw form a threaded structure. There are two movable sleeves, and the inner diameter of the movable sleeve matches the outer diameter of the double-ended screw. The threads inside the two movable sleeves are opposite, and the movable sleeve is fitted against the outer wall of the double-ended screw.

[0013] Preferably, a connecting rod is hinged to one side of the movable sleeve, and a limiting plate is hinged to the end of the connecting rod away from the movable sleeve. A sliding plate is fixedly connected inside the mounting shell. A sliding groove matching the sliding plate is opened at the bottom of the limiting plate, and the limiting plate is slidably connected to the sliding plate.

[0014] Preferably, a gear is fixedly connected to the outer wall of the double-ended screw and inside the mounting housing, and a rack is meshed with the outer wall of the gear, with one end of the rack fixed to one side of the test bench.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] In the scheme of this application:

[0017] 1. To address the problems of high customization costs, difficulty in adapting to diverse structural requirements, non-reusable heat-resistant components leading to resource waste, and lack of effective temperature monitoring methods in existing technologies, this application proposes a 3D-printed, rapidly customizable positioning structure for the substrate based on the heat dissipation component structure. This structure utilizes lightweight, high-strength plastic materials, modular heat-resistant blocks inserted into slots, and is made of high-temperature resistant ceramic. It is reusable and can be disassembled and reused across substrates. A temperature sensor monitors the simulated heat source temperature in real time, achieving low-cost customization, efficient resource utilization, and accurate temperature monitoring to ensure stable equipment operation.

[0018] 2. To address the problem in existing technologies where the pressure head is difficult to precisely match the heat dissipation components in different areas when pressing the heat dissipation module, resulting in poor pressing effect and inability to ensure close contact between the heat dissipation module and the simulated heat source, thus affecting the accuracy of heat dissipation testing, this application sets up a pressure head assembly. The cylinder is activated to push the pressure head body downward to contact the heat dissipation module and make it close to the simulated heat source. At the same time, the first horizontal plate and the second horizontal plate can be flexibly adjusted in terms of spacing and distance with the help of positioning bolts and knob nuts. This allows for flexible adjustment of the position of the pressure head body, enabling precise pressing of heat dissipation components in different areas and improving the accuracy of heat dissipation testing.

[0019] 3. To address the problems of insufficient precision, complex operation, and difficulty in achieving stable and reliable positioning of mold components in existing technologies, which lead to mold misalignment during processing and affect product quality and production efficiency, this application proposes a positioning component. An electric push rod pushes a convex plate, causing the mounting shell to move on a slide rail. The gear and rack mechanism drives a double-ended screw to rotate, which in turn, guided by a guide rod, drives a connecting rod to push the limiting plate. This achieves precise and stable positioning of the substrate from both sides, effectively improving the precision of mold processing and product quality. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the main structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the second horizontal plate and the main structure of the pressure head of the present invention;

[0022] Figure 3 This is a schematic diagram of the pressure head assembly structure of the present invention;

[0023] Figure 4 This is a schematic diagram of the mold assembly structure of the present invention;

[0024] Figure 5 This is a schematic diagram of the positioning component structure of the present invention;

[0025] Figure 6 This is a schematic diagram of the mounting shell and limiting plate structure of the present invention.

[0026] In the diagram: 1. Machine body; 2. Column; 3. Pressure head assembly; 301. First horizontal plate; 302. First slide groove; 303. Positioning bolt; 304. Knob nut; 305. Second horizontal plate; 306. Second slide groove; 307. Cylinder; 308. Pressure head body; 4. Test bench; 5. Positioning assembly; 501. Electric push rod; 502. Protruding plate; 503. Mounting shell; 504. Double-ended screw. 505. Moving sleeve; 506. Guide rod; 507. Connecting rod; 508. Limiting plate; 509. Slide plate; 510. Slide table; 511. Slide rail; 512. Gear; 513. Rack; 6. Mold assembly; 601. Base plate; 602. Machine slot; 603. Fan; 604. Card slot; 605. Wire groove; 606. Modular heat-resistant block; 607. Simulated heat source; 608. Temperature sensor. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] This invention provides a test machine for simulating the heat dissipation module of a circuit board in a new energy vehicle, such as... Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, the device includes a body 1, a column 2 fixedly connected to the top of the body 1, a pressure head assembly 3 mounted on the top of the column 2, a test bench 4 fixedly connected to the top of the body 1, a positioning assembly 5 mounted on the outside of the test bench 4, a mold assembly 6 placed on the top of the test bench 4, the mold assembly 6 including a base plate 601, the base plate 601 being placed on the top of the test bench 4, a groove 602 formed on the top of the base plate 601, a fan 603 being engaged with the inside of the groove 602, a slot 604 formed on the top of the base plate 601, and a wire groove 6 formed on the top of the base plate 601 at a position communicating with the slot 604. 05. A modular heat-resistant block 606 is internally engaged with the slot 604. A simulated heat source 607 is fixedly connected to the top of the modular heat-resistant block 606, and a temperature sensor 608 is installed on the top of the simulated heat source 607. The substrate 601 is made of 3D printed lightweight high-strength plastic material, and the modular heat-resistant block is made of high-temperature resistant ceramic, which can effectively resist high temperature and prevent excessive heat conduction to the substrate 601, protect the stable operation of the equipment, and can be repeatedly disassembled and reused across substrates 601 to avoid waste. The temperature sensor 608 monitors the temperature of the simulated heat source 607 in real time to provide data support for testing.

[0029] Further such as Figure 1 and Figure 4 As shown, the substrate 601 is made by 3D printing and uses lightweight, high-strength plastic materials. 3D printing can achieve precise molding of complex structures, meet diverse design needs, and improve product adaptability. Its lightweight nature can effectively reduce the overall weight, reduce energy consumption and transportation costs, while its high strength ensures that the substrate 601 can withstand greater external forces during use, is not easily deformed or damaged, ensures stable product operation, and extends service life.

[0030] Further such as Figure 1 and Figure 4 As shown, the substrate 601 forms a locking structure with the modular heat-resistant block 606 through the slot 604. The inner diameter of the slot 604 matches the outer diameter of the modular heat-resistant block 606, and the inner wall of the slot 604 fits snugly against the outer wall of the modular heat-resistant block 606. The modular heat-resistant block 606 is positioned inside the slot 604. The modular heat-resistant block 606 is made of high-temperature resistant ceramic, which facilitates quick assembly and disassembly, improving assembly efficiency and maintenance convenience. The modular heat-resistant block 606, made of high-temperature resistant ceramic, can effectively resist high-temperature environments, prevent excessive heat conduction to the substrate 601, protect the substrate 601 and other components, and ensure stable operation of the equipment at high temperatures. Only the heat source contact parts use heat-resistant materials, and it can be repeatedly disassembled and reused across substrates 601, avoiding the waste of replacing the entire test board.

[0031] Further such as Figure 1 and Figure 4As shown, the simulated heat source 607 is connected to an external power source via cables within a cable tray 605. The inner diameter of the cable tray 605 matches the outer diameter of the cables, and the cables are installed within the cable tray 605. The cables connect the simulated heat source 607 to an adjustable power supply. The power parameters are adjusted to the required heating power for testing. The simulated heat source 607 is connected to the external power source via cables within the cable tray 605. The cable tray 605 can neatly store the cables, preventing them from tangling or being damaged, ensuring a safe connection. After connecting the simulated heat source 607 to the adjustable power supply, the power parameters can be flexibly adjusted to precisely control the heating power of the simulated heat source 607 to meet the testing requirements. This simulates different thermal conditions, providing reliable thermal environment conditions for performance testing and optimized design of related products or systems.

[0032] In a further preferred embodiment of the present invention, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the pressure head assembly 3 includes a first horizontal plate 301, which is fixed to the outer wall of the column 2. A first groove 302 is formed inside the first horizontal plate 301. A second horizontal plate 305 is placed on top of the first horizontal plate 301. A second groove 306 is formed inside the second horizontal plate 305. A cylinder 307 is fixedly connected to the top of the second horizontal plate 305. The output end of the cylinder 307 is fixedly connected to the pressure head body 308. The heat dissipation assembly is placed on top of the base plate 601, and the heat dissipation module on the heat dissipation assembly is brought into contact with the simulated heat source 607, thus ensuring that the heat dissipation module on the heat dissipation assembly... The fan 603 can be installed in the slot 602 inside the base plate 601. At this time, the cylinder 307 of the pressure head assembly 3 can be activated, so that the cylinder 307 pushes the pressure head body 308 downward to contact the heat dissipation module, and makes the heat dissipation module tightly fit the simulated heat source 607 on the top of the modular heat-resistant block 606. In addition, the first horizontal plate 301 and the second horizontal plate 305 are fixed in relative position by positioning bolts 303 and knob nuts 304, and the distance between the two horizontal plates and the front and rear distance can be flexibly adjusted to meet the adjustment requirements of different positions of the pressure head body 308, and the heat dissipation components in different areas can be pressed.

[0033] Further such as Figure 1 , Figure 2 and Figure 3As shown, a positioning bolt 303 is provided between the first horizontal plate 301 and the second horizontal plate 305, and a knob nut 304 is provided on the outer wall of the positioning bolt 303. One end of the positioning bolt 303 passes through the first horizontal plate 301 and the second horizontal plate 305 and is fastened to the knob nut 304. The cooperation between the positioning bolt 303 and the knob nut 304 can accurately fix the relative position of the two horizontal plates, ensure structural stability, facilitate flexible adjustment of the distance between the two horizontal plates, and meet the adjustment of the pressure head body 308 at different positions to press the heat dissipation components in different areas.

[0034] In a further preferred embodiment of the present invention, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the positioning assembly 5 includes an electric push rod 501, which is fixed inside the test bench 4. A protruding plate 502 is fixedly connected to the output end of the electric push rod 501. A mounting shell 503 is fixedly connected to the top of the protruding plate 502, and a slide table 510 is fixedly connected to the bottom of the mounting shell 503. A slide rail 511 is slidably connected to the bottom of the slide table 510, and the slide rail 511 is fixed to one side of the test bench 4. The electric push rod 501, fixed inside the test bench 4, pushes the protruding plate 502 with its output end. The protruding plate 502 drives the mounting shell 503, which moves along the slide rail 511 fixed to one side of the test bench 4 via the slide table 510. When the mounting shell 503 moves... The gear 512, which is fixed to the outer wall of the double-ended screw 504, rolls along the rack 513 fixed to one side of the test bench 4, thereby driving the double-ended screw 504 to rotate. The rotation of the double-ended screw 504 causes the movable sleeve 505, which is threaded to the outer wall, to move precisely and linearly along the axial direction of the double-ended screw 504 under the guidance and limitation of the guide rod 506 fixed to the inner wall of the mounting shell 503. When the movable sleeve 505 moves, the connecting rod 507 hinged on one side pushes the limiting plate 508. The limiting plate 508 slides along the sliding plate 509 inside the mounting shell 503 by relying on the bottom sliding groove, and finally achieves precise limitation and fixation of the substrate 601 from both sides, ensuring the stability of the mold assembly 6 during the test.

[0035] Further such as Figure 2 , Figure 5 and Figure 6As shown, a double-ended screw 504 is rotatably connected inside the mounting housing 503, and both ends of the double-ended screw 504 are connected to the inner sides of the mounting housing 503 via bearings. A movable sleeve 505 is threadedly connected to the outer wall of the double-ended screw 504, and a guide rod 506 is slidably connected inside the movable sleeve 505. Both ends of the guide rod 506 are fixed to the inner wall of the mounting housing 503. The movable sleeve 505 and the double-ended screw 504 form a threaded structure. There are two movable sleeves 505. The inner diameter of the sliding sleeve 505 matches the outer diameter of the double-ended screw 504, and the threads inside the two sliding sleeves 505 are opposite. The sliding sleeve 505 is fitted to the outer wall of the double-ended screw 504. The sliding sleeve 505, which is threaded to the outer wall of the double-ended screw 504, can move along its axial direction as the screw rotates. The guide rod 506 is fixed inside the mounting shell 503, and the sliding sleeve 505 slides on it, playing a guiding and limiting role, preventing the sliding sleeve 505 from rotating, ensuring the precise linear movement of the sliding sleeve 505, and realizing position adjustment.

[0036] Further such as Figure 2 , Figure 5 and Figure 6 As shown, a connecting rod 507 is hinged to one side of the movable sleeve 505, and a limiting plate 508 is hinged to the end of the connecting rod 507 away from the movable sleeve 505. A sliding plate 509 is fixedly connected inside the mounting shell 503. A groove matching the sliding plate 509 is provided at the bottom of the limiting plate 508. The limiting plate 508 and the sliding plate 509 are slidably connected. Through the setting of the limiting plate 508, when the movable sleeve 505 moves, it can drive the connecting rod 507 to push the limiting plate 508 to move, and the limiting plate 508 can slide along the outer wall of the sliding plate 509 by relying on the groove at the bottom.

[0037] Further such as Figure 2 , Figure 5 and Figure 6 As shown, a gear 512 is fixedly connected to the outer wall of the double-ended screw 504 and inside the mounting housing 503. A rack 513 is meshed with the outer wall of the gear 512, and one end of the rack 513 is fixed to one side of the test bench 4, which enhances the connection between the double-ended screw 504 and the gear 512. This allows the gear 512 to roll along the rack 513 when the mounting housing 503 moves, thereby driving the double-ended screw 504 to rotate.

[0038] Working principle: During the test, the substrate 601 can be quickly customized and positioned by 3D printing according to the structure of the heat dissipation component. At this time, the modular heat-resistant block 606 can be inserted into the slot 604 first. Then, the mold assembly 6 is placed on the top of the test bench 4. The mold assembly 6 is accurately positioned by the positioning component 5. The electric push rod 501 pushes the convex plate 502, which drives the mounting shell 503 to move on the slide rail 511. When the mounting shell 503 moves, the gear 512 rolls along the rack 513, which drives the double-headed screw 504 to rotate. The movable sleeve 505 moves axially along the double-headed screw 504. Under the guidance and limitation of the guide rod 506, the movable sleeve 505 drives the connecting rod 507 to push the limiting plate 508. The limiting plate 508 slides along the sliding plate 509, limiting and fixing the substrate 601 from both sides. The simulated heat source 607 is connected to an external adjustable power supply through the cable in the wire groove 605. The power supply parameters are adjusted to the required heat dissipation power for testing to simulate different thermal conditions. At this time, the heat dissipation component can be placed on top of the substrate 601, and the heat dissipation component on the substrate 601 can be placed on top of the substrate 601. The heat dissipation module comes into contact with the simulated heat source 607, allowing the fan 603 on the heat dissipation component to be installed in the slot 602 within the substrate 601. At this time, the cylinder 307 of the pressure head assembly 3 can be activated, causing the cylinder 307 to push the pressure head body 308 downward to contact the heat dissipation module, ensuring that the heat dissipation module is tightly fitted to the simulated heat source 607 on top of the modular heat-resistant block 606. Furthermore, the first horizontal plate 301 and the second horizontal plate 305 are fixed in relative position by positioning bolts 303 and knob nuts 304, allowing for flexible adjustment of the distance between the two horizontal plates and the front-to-back distance to meet the adjustment needs of different positions of the pressure head body 308. This allows for pressing of the heat dissipation component in different areas. The substrate 601 is made of 3D-printed lightweight, high-strength plastic material, and the modular heat-resistant block is made of high-temperature resistant ceramic, which can effectively resist high temperatures, prevent excessive heat, protect the stable operation of the equipment, and can be repeatedly disassembled and reused across substrates 601, avoiding waste. The temperature sensor 608 monitors the temperature of the simulated heat source 607 in real time, providing data support for testing.

[0039] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A test machine for simulating the heat dissipation module of a circuit board in a new energy vehicle, comprising a body (1), characterized in that: A column (2) is fixedly connected to the top of the machine body (1), and a pressure head assembly (3) is provided on the top of the column (2). A test bench (4) is fixedly connected to the top of the machine body (1), and a positioning assembly (5) is provided on the outside of the test bench (4). A mold assembly (6) is placed on the top of the test bench (4). The mold assembly (6) includes a base plate (601), and the base plate (601) is placed on the top of the test bench (4). An organic groove (602) is formed on the top of the base plate (601). A fan (603) is engaged with the inside of the slot (602). A slot (604) is provided on the top of the substrate (601). A wire groove (605) is provided on the top of the substrate (601) and at the position communicating with the slot (604). A modular heat-resistant block (606) is engaged with the inside of the slot (604). A simulated heat source (607) is fixedly connected to the top of the modular heat-resistant block (606), and a temperature sensor (608) is provided on the top of the simulated heat source (607).

2. The test machine for simulating the heat dissipation module of a circuit board in a new energy vehicle according to claim 1, characterized in that: The substrate (601) is made by 3D printing and is made of lightweight, high-strength plastic material.

3. The test machine for simulating the heat dissipation module of a new energy vehicle circuit board according to claim 1, characterized in that: The substrate (601) forms a locking structure with the modular heat-resistant block (606) through the slot (604), and the inner diameter of the slot (604) matches the outer diameter of the modular heat-resistant block (606). The inner wall of the slot (604) fits against the outer wall of the modular heat-resistant block (606). The modular heat-resistant block (606) is installed inside the slot (604) for positioning. The modular heat-resistant block (606) is made of high-temperature resistant ceramic.

4. The test machine for simulating the heat dissipation module of a new energy vehicle circuit board according to claim 1, characterized in that: The simulated heat source (607) is connected to an external power source through a cable in a cable tray (605). The inner diameter of the cable tray (605) matches the outer diameter of the cable. The cable is installed in the cable tray (605). The cable connects the simulated heat source (607) to an adjustable power supply for external devices. The power supply parameters are adjusted to the required heating power for testing.

5. The test machine for simulating the heat dissipation module of a new energy vehicle circuit board according to claim 1, characterized in that: The pressure head assembly (3) includes a first horizontal plate (301) and the first horizontal plate (301) is fixed to the outer wall of the column (2). The first horizontal plate (301) has a first sliding groove (302) inside. A second horizontal plate (305) is placed on the top of the first horizontal plate (301). The second horizontal plate (305) has a second sliding groove (306) inside. A cylinder (307) is fixedly connected to the top of the second horizontal plate (305). The output end of the cylinder (307) is fixedly connected to the pressure head body (308).

6. The test machine for simulating the heat dissipation module of a new energy vehicle circuit board according to claim 5, characterized in that: A positioning bolt (303) is provided between the first horizontal plate (301) and the second horizontal plate (305), and a knob nut (304) is provided on the outer wall of the positioning bolt (303). One end of the positioning bolt (303) passes through the first horizontal plate (301) and the second horizontal plate (305) and is fastened to the knob nut (304).

7. The test machine for simulating the heat dissipation module of a new energy vehicle circuit board according to claim 1, characterized in that: The positioning component (5) includes an electric push rod (501), which is fixed inside the test bench (4). The output end of the electric push rod (501) is fixedly connected to a convex plate (502). The top of the convex plate (502) is fixedly connected to a mounting shell (503). The bottom of the mounting shell (503) is fixedly connected to a slide table (510). The bottom of the slide table (510) is slidably connected to a slide rail (511), which is fixed to one side of the test bench (4).

8. The test machine for simulating the heat dissipation module of a new energy vehicle circuit board according to claim 7, characterized in that: The mounting housing (503) is rotatably connected to a double-ended screw (504), and the two ends of the double-ended screw (504) are connected to the two sides of the inside of the mounting housing (503) through bearings. The outer wall of the double-ended screw (504) is threadedly connected to a movable sleeve (505). The movable sleeve (505) is slidably connected to a guide rod (506), and the two ends of the guide rod (506) are fixed to the inner wall of the mounting housing (503). The movable sleeve (505) and the double-ended screw (504) form a threaded structure. There are two movable sleeves (505), and the inner diameter of the movable sleeve (505) matches the outer diameter of the double-ended screw (504). The threads inside the two movable sleeves (505) are opposite, and the movable sleeve (505) is fitted to the outer wall of the double-ended screw (504).

9. The test machine for simulating the heat dissipation module of a new energy vehicle circuit board according to claim 8, characterized in that: A connecting rod (507) is hinged to one side of the movable sleeve (505), and a limiting plate (508) is hinged to the end of the connecting rod (507) away from the movable sleeve (505). A sliding plate (509) is fixedly connected inside the mounting shell (503). A sliding groove matching the sliding plate (509) is opened at the bottom of the limiting plate (508), and the limiting plate (508) and the sliding plate (509) are slidably connected.

10. A test machine for simulating the heat dissipation module of a circuit board in a new energy vehicle according to claim 8, characterized in that: The outer wall of the double-ended screw (504) and the inside of the mounting shell (503) are fixedly connected to a gear (512), the outer wall of the gear (512) is meshed with a rack (513), and one end of the rack (513) is fixed to one side of the test bench (4).

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