Aggregate sheet

Abstract

The invention provides an aggregate sheet (1). The aggregate sheet (1) is provided with a printed circuit board (2) and an alignment mark (4). The alignment mark (4) has: a metal layer (40); a first mark (41) that is disposed on one surface (S11) of the metal layer (40) and contains the same material as a base insulating layer (23) of the wired circuit board (2); and a second mark (42) that is disposed on one surface (S11) of the metal layer (40) and contains the same material as the first conductor pattern (24) of the wired circuit board (2).

Description

Technical Field

[0001] This invention relates to composite sheet materials. Background Technology

[0002] Previously, it was known to provide alignment marks on an assembly sheet having multiple wiring circuit boards during the manufacturing of wiring circuit boards (for example, see Patent Document 1 below). The alignment marks are formed by an opening in the substrate insulating layer or by the substrate insulating layer itself, and are used for the alignment of the photomask relative to the assembly sheet.

[0003] Prior art literature Patent documents Patent Document 1: Japanese Patent Application Publication No. 2011-227363 Summary of the Invention

[0004] The problem that the invention aims to solve In the manufacturing method of a wiring circuit board as described in Patent Document 1, it is sometimes desirable to use multiple alignment marks. For example, it is sometimes desirable to use alignment marks used for aligning a photomask with a substrate insulating layer and alignment marks used for aligning a photomask with a conductor layer.

[0005] In this case, it may be difficult to detect multiple alignment marks through image recognition.

[0006] The present invention provides an aggregate sheet capable of easily detecting multiple marks through image recognition.

[0007] Technical solutions for solving the problem The present invention [1] includes an assembly sheet having a wiring circuit board and alignment marks, the wiring circuit board having: a metal support layer; a base insulating layer disposed on one side of the metal support layer in the thickness direction; and a first conductor pattern disposed on one side of the base insulating layer in the thickness direction; the alignment marks having: a metal layer; a first mark disposed on one side surface of the metal layer in the thickness direction, comprising the same material as the base insulating layer of the wiring circuit board; and a second mark disposed on the one side surface of the metal layer in the thickness direction, comprising the same material as the first conductor pattern of the wiring circuit board.

[0008] According to this structure, a first mark containing the same material as the substrate insulating layer and a second mark containing the same material as the first conductor pattern are both disposed on one side surface of the metal layer, forming an alignment mark.

[0009] Therefore, if an alignment mark is image-recognized from one side of the metal layer, it is possible to detect both a first mark containing the same material as the substrate insulating layer and a second mark containing the same material as the first conductor pattern.

[0010] As a result, multiple markers (first marker and second marker) can be easily detected through image recognition.

[0011] The present invention [2] includes the assembly sheet of the above [1], wherein the first mark has a circular plate shape or a polygonal plate shape, and the second mark has a circular ring shape or a polygonal ring shape and surrounds the first mark.

[0012] Based on this structure, a simple structure such as the second mark surrounding the first mark can be formed to create an alignment mark having the first mark and the second mark.

[0013] In addition, the center of the first mark can be calculated based on the periphery of the first mark, and the center of the second mark can be calculated based on the periphery of the second mark.

[0014] Therefore, by measuring the distance between the center of the first mark and the center of the second mark, it is possible to check the positional offset of the first conductor pattern relative to the substrate insulating layer.

[0015] The present invention [3] includes the assembly sheet of [1] above, wherein the first mark and the second mark each have a circular or polygonal ring shape, and the first mark surrounds the second mark.

[0016] Based on this structure, a simple structure in which the first mark surrounds the second mark can be formed to create an alignment mark having the first mark and the second mark.

[0017] In addition, the center of the first mark can be calculated based on the periphery of the first mark, and the center of the second mark can be calculated based on the periphery of the second mark.

[0018] Therefore, by measuring the distance between the center of the first mark and the center of the second mark, it is possible to check the positional offset of the first conductor pattern relative to the substrate insulating layer.

[0019] The present invention [4] includes an assembly sheet of any one of [1] to [3] above, wherein the wiring circuit board further comprises: a protective metal layer disposed in the thickness direction between the metal support layer and the substrate insulating layer, the metal layer of the alignment mark comprising: a first metal layer comprising the same material as the metal support layer of the wiring circuit board; and a second metal layer disposed in the thickness direction on one side surface of the first metal layer, comprising the same material as the protective metal layer.

[0020] Based on this structure, the reflectivity of one side surface of the metal layer that becomes the background in image recognition can be adjusted by using a second metal layer.

[0021] Therefore, it is possible to improve the detection accuracy of alignment marks.

[0022] The present invention [5] includes an assembly sheet of any one of [1] to [4] above, wherein the wiring circuit board further comprises: a second conductor pattern disposed on one side of the substrate insulating layer in the thickness direction and being thicker than the first conductor pattern, and the alignment mark further comprises: a third mark disposed on the surface of one side of the metal layer in the thickness direction, comprising the same material as the second conductor pattern and having a circular or polygonal ring shape, and surrounding the second mark.

[0023] Based on this structure, a simple structure such as the third mark surrounding the second mark can be formed to create an alignment mark having a first mark, a second mark, and a third mark.

[0024] In addition, by measuring the distance between the center of the third mark and the center of the second mark, it is possible to check the positional offset of the second conductor pattern relative to the first conductor pattern.

[0025] In addition, by measuring the distance between the center of the third mark and the center of the first mark, it is possible to check the positional offset of the second conductor pattern relative to the substrate insulation layer.

[0026] The present invention [6] includes an assembly sheet of any one of [1] to [5] above, wherein the wiring circuit board further comprises: a first covering insulating layer disposed on one side of the base insulating layer in the thickness direction and covering the first conductor pattern, and the alignment mark further comprises: a cover layer disposed on the surface of the metal layer in the thickness direction, comprising the same material as the first covering insulating layer of the wiring circuit board and covering the first mark and the second mark.

[0027] With this structure, the alignment marks can be protected by the covering layer.

[0028] In addition, by confirming the coverage state of the cover layer over the first mark and the second mark, it is possible to check the coverage state of the first cover insulation layer over the first conductor pattern.

[0029] The present invention [7] includes the assembly sheet of [6] above, wherein the cover layer of the alignment mark has a fourth mark having a circular or polygonal ring shape and surrounds the second mark.

[0030] Based on this structure, a simple structure such as the fourth mark surrounding the second mark can be formed to create an alignment mark having the first mark, the second mark, and the fourth mark.

[0031] In addition, by measuring the distance between the center of the fourth mark and the center of the second mark, it is possible to check the positional offset of the first covering insulation layer relative to the first conductor pattern.

[0032] The present invention [8] includes an assembly sheet of any one of [1] to [4] above, wherein the wiring circuit board further comprises: a first covering insulating layer disposed on one side of the base insulating layer in the thickness direction and covering the first conductor pattern; a second conductor pattern disposed on one side of the first covering insulating layer in the thickness direction and being thicker than the first conductor pattern; and a second covering insulating layer disposed on one side of the first covering insulating layer in the thickness direction and covering the second conductor pattern, wherein the alignment mark further comprises: a first covering layer disposed on one side surface of the metal layer in the thickness direction, comprising the same material as the first covering insulating layer of the wiring circuit board and covering the first mark and the second mark; and a third mark disposed on one side surface of the first covering layer in the thickness direction, comprising the same material as the second conductor pattern and having a circular or polygonal ring shape and surrounding the second mark.

[0033] According to this structure, even a structure in which the second conductor pattern is arranged on one side of the first covering insulation layer can form an alignment mark with the first mark, the second mark, and the third mark by surrounding the second mark with the third mark.

[0034] In addition, by measuring the distance between the center of the third mark and the center of the second mark, it is possible to check the positional offset of the second conductor pattern relative to the first conductor pattern.

[0035] In addition, by measuring the distance between the center of the third mark and the center of the first mark, it is possible to check the positional offset of the second conductor pattern relative to the substrate insulation layer.

[0036] The present invention [9] includes the assembly sheet of [8] above, wherein the alignment mark further comprises: a second cover layer disposed on one side surface of the first cover layer in the thickness direction, comprising the same material as the second cover insulating layer of the wiring circuit board, and covering the third mark; the first cover layer of the alignment mark has a fourth mark having a circular or polygonal ring shape and surrounding the second mark; the second cover layer of the alignment mark has a fifth mark having a circular or polygonal ring shape and surrounding the third mark.

[0037] Based on this structure, a simple structure can be formed by surrounding the second mark with the fourth mark of the first covering layer and surrounding the third mark with the fifth mark of the second covering layer, thus creating an alignment mark having the first mark, the second mark, the third mark, the fourth mark, and the fifth mark.

[0038] In addition, by measuring the distance between the center of the fourth mark and the center of the second mark, it is possible to check the positional offset of the first covering insulation layer relative to the first conductor pattern.

[0039] In addition, by measuring the distance between the center of the fifth mark and the center of the third mark, it is possible to check the positional offset of the second covering insulation layer relative to the second conductor pattern.

[0040] The present invention

[10] includes an assembly sheet of any one of [1] to [9] above, wherein the assembly sheet has: a frame supporting the wiring circuit board, and the alignment mark is disposed on the frame.

[0041] The present invention

[11] includes an assembly sheet of any one of [1] to

[10] above, wherein the assembly sheet has a plurality of said wiring circuit boards, and the alignment mark is disposed between the plurality of said wiring circuit boards.

[0042] The present invention

[12] includes an assembly sheet of any one of [1] to

[11] above, wherein the assembly sheet has a plurality of the alignment marks.

[0043] The present invention

[13] includes the aggregate sheet of

[12] described above, wherein the aggregate sheet extends along a width direction orthogonal to the thickness direction and a flow direction orthogonal to the thickness direction and the width direction, and the plurality of alignment marks include: a first alignment mark; a second alignment mark disposed away from the first alignment mark in the width direction; and a third alignment mark disposed away from the second alignment mark in the flow direction.

[0044] Based on this structure, it is possible to improve the positional accuracy of the photomask relative to the assembly sheet in both the width and flow directions.

[0045] The present invention

[14] includes the assembly sheet of

[13] above, wherein the second alignment mark is smaller than the first alignment mark and the third alignment mark.

[0046] Based on this structure, by confirming the position of the second alignment mark, the width direction and flow direction of the assembly sheet can be easily identified.

[0047] The present invention

[15] includes the assembly sheet of

[13] or

[14] above, wherein the distance between the first alignment mark and the second alignment mark in the width direction is different from the distance between the second alignment mark and the third alignment mark in the flow direction.

[0048] Based on this structure, by confirming the distance between the first alignment mark and the second alignment mark in the width direction and the distance between the second alignment mark and the third alignment mark in the flow direction, the width direction and flow direction of the assembly sheet can be easily identified.

[0049] The present invention

[16] includes a method for manufacturing an assembly sheet, which is a method for manufacturing an assembly sheet according to any one of [1] to

[15] above, wherein the wiring circuit board further comprises: a first cover insulating layer disposed on one side of the base insulating layer in the thickness direction and covering the first conductor pattern, the method for manufacturing the assembly sheet comprising: a base insulating layer forming step, forming the base insulating layer and forming the first mark; a first conductor pattern forming step, forming the first conductor pattern and forming the second mark; and a first cover insulating layer forming step, forming the first cover insulating layer, wherein in the first cover insulating layer forming step, the first mark is used to align the photomask for forming the first cover insulating layer relative to the base insulating layer, or the second mark is used to align the photomask for forming the first cover insulating layer relative to the first conductor pattern.

[0050] According to this method, in the substrate insulating layer forming process, a substrate insulating layer is formed and a first mark is formed, and the positional relationship between the substrate insulating layer and the first mark is determined.

[0051] In addition, in the first conductor pattern forming process, a first conductor pattern is formed and a second mark is formed, and the positional relationship between the first conductor pattern and the second mark is determined.

[0052] Furthermore, in the first cover insulating layer forming process, if the photomask used to form the first cover insulating layer is aligned with the substrate insulating layer using the first mark, the positional accuracy of the first cover insulating layer relative to the substrate insulating layer can be improved.

[0053] Furthermore, if the photomask used to form the first covering insulating layer is aligned with the first conductor pattern using the second mark, the positional accuracy of the first covering insulating layer relative to the first conductor pattern can be improved.

[0054] The present invention

[17] includes a method for manufacturing an assembly sheet as described in

[16] above, wherein the wiring circuit board further comprises: a second conductor pattern that is thicker than the first conductor pattern, and the method for manufacturing the assembly sheet further comprises: a second conductor pattern forming step for forming the second conductor pattern, wherein in the second conductor pattern forming step, the first mark is used to align the photomask used to form the second conductor pattern relative to the substrate insulating layer, or the second mark is used to align the photomask used to form the second conductor pattern relative to the first conductor pattern.

[0055] According to this method, in the second conductor pattern forming process, if the photomask used to form the second conductor pattern is aligned with the substrate insulating layer using the first mark, the positional accuracy of the second conductor pattern relative to the substrate insulating layer can be improved.

[0056] Furthermore, if the photomask used to form the second conductor pattern is aligned with the first conductor pattern using the second mark, the positional accuracy of the second conductor pattern relative to the first conductor pattern can be improved.

[0057] The present invention

[18] includes a method for manufacturing the aggregate sheet described in

[17] above, wherein the second conductor pattern is disposed on one side of the substrate insulating layer in the thickness direction, and the first covering insulating layer forming step is performed after the second conductor pattern forming step.

[0058] The present invention

[19] includes a method for manufacturing the composite sheet of the above

[17] , wherein the second conductor pattern is disposed on one side of the first covering insulating layer in the thickness direction, and the second conductor pattern forming step is performed after the first covering insulating layer forming step.

[0059] Invention Effects According to the composite sheet of the present invention, multiple marks can be easily detected through image recognition. Attached Figure Description

[0060] Figure 1 This is a top view of an assembly sheet as an embodiment of the present invention. Furthermore, in... Figure 1The insulating layer covering it is omitted.

[0061] Figure 2A yes Figure 1 The diagram shows a cross-sectional view (AA) of the wiring circuit board. Figure 2B yes Figure 1 The BB cross-sectional view with the alignment marks shown.

[0062] Figure 3 yes Figure 1 An enlarged view of the alignment marks shown.

[0063] Figure 4A and Figure 4B This indicates the process of forming the substrate insulating layer. Figure 4A It means equivalent to Figure 1 A cross-sectional view of line AA. Figure 4B It means equivalent to Figure 1 A cross-sectional view of the BB line.

[0064] Figure 5A and Figure 5B This indicates the process of aligning the photomask used to form the first conductor pattern relative to the substrate insulating layer in the first conductor pattern forming process. Figure 5A It means equivalent to Figure 1 A cross-sectional view of line AA. Figure 5B It means equivalent to Figure 1 A cross-sectional view of the BB line.

[0065] Figure 6A and Figure 6B This indicates the process of forming the first conductor pattern and forming the second mark in the first conductor pattern forming process. Figure 6A It means equivalent to Figure 1 A cross-sectional view of line AA. Figure 6B It means equivalent to Figure 1 A cross-sectional view of the BB line.

[0066] Figure 7A and Figure 7B This indicates the process of aligning the photomask used to form the second conductor pattern relative to the substrate insulating layer during the second conductor pattern formation process. Figure 7A It means equivalent to Figure 1 A cross-sectional view of line AA. Figure 7B It means equivalent to Figure 1 A cross-sectional view of the BB line.

[0067] Figure 8A and Figure 8B This indicates the process of forming the second conductor pattern and the third mark in the second conductor pattern forming process. Figure 8A It means equivalent to Figure 1 A cross-sectional view of line AA. Figure 8BIt means equivalent to Figure 1 A cross-sectional view of the BB line.

[0068] Figure 9A and Figure 9B This indicates the process of aligning the photomask used to form the cover insulating layer relative to the substrate insulating layer during the cover insulating layer formation process. Figure 9A It means equivalent to Figure 1 A cross-sectional view of line AA. Figure 9B It means equivalent to Figure 1 A cross-sectional view of the BB line.

[0069] Figure 10A This is a top view showing the alignment marks of variant example (2). Figure 10B This is a top view showing the alignment marks of variant example (3).

[0070] Figure 11A This is a cross-sectional view of the wiring circuit board of variant example (4), which is equivalent to Figure 1 A cross-sectional view of line AA. Figure 11B This is a cross-sectional view of the alignment mark of variant example (4), which is equivalent to Figure 1 A cross-sectional view of the BB line.

[0071] Figure 12 yes Figure 11B A top view of the alignment marks shown.

[0072] Figure 13 This is a top view of the composite sheet material representing the modified example (5).

[0073] Figure 14 This is a top view of the composite sheet material representing the modified example (6).

[0074] Figure 15 This is a top view of the composite sheet material representing the modified example (7).

[0075] Figure 16 This is a top view of the composite sheet material representing the modified example (8). Detailed Implementation

[0076] 1. Composite sheet like Figure 1 As shown, the assembly sheet 1 extends along both the width and flow directions. The assembly sheet 1 has a sheet shape. The flow direction is orthogonal to the width direction. The assembly sheet 1 includes multiple wiring circuit boards 2, frames 3, and multiple alignment marks 4.

[0077] (1) Wiring circuit board Multiple wiring circuit boards 2 are arranged at intervals in the width direction and at intervals in the flow direction. Each of the multiple wiring circuit boards 2 has the same structure. Therefore, only one wiring circuit board 2 will be described, and the description of the other wiring circuit boards 2 will be omitted.

[0078] The wiring circuit board 2 extends along both the width and flow directions. In this embodiment, the wiring circuit board 2 has a generally rectangular shape. However, the shape of the wiring circuit board 2 is not limited.

[0079] like Figure 2A As shown, the wiring circuit board 2 has: a metal support layer 21, a protective metal layer 22, a base insulating layer 23, a seed layer 20, a first conductor pattern 24, a second conductor pattern 25, and a covering insulating layer 26 (the first covering insulating layer).

[0080] (1-1) Metal support layer The metal support layer 21 supports the substrate insulating layer 23, the first conductor pattern 24, the second conductor pattern 25, and the covering insulating layer 26. Materials for the metal support layer 21 include, for example, stainless steel and copper alloys.

[0081] (1-2) Protective metal layer A protective metal layer 22 is disposed on one side surface S1 of the metal support layer 21 in the thickness direction. The thickness direction is orthogonal to the width direction and the flow direction. The protective metal layer 22 is disposed between the metal support layer 21 and the substrate insulating layer 23 in the thickness direction. The protective metal layer 22 protects the metal support layer 21 from the influence of the substrate insulating layer 23. Examples of materials for the protective metal layer 22 include chromium, nickel, titanium, and their alloys. The protective metal layer 22 preferably contains chromium.

[0082] (1-3) Substrate insulation layer A substrate insulating layer 23 is disposed on one side of the metal support layer 21 in the thickness direction. The substrate insulating layer 23 is disposed on the protective metal layer 22. In other words, the substrate insulating layer 23 is disposed on one side surface S1 of the metal support layer 21, separated by the protective metal layer 22. The substrate insulating layer 23 is disposed in the thickness direction between the metal support layer 21 and the first conductor pattern 24, and between the metal support layer 21 and the second conductor pattern 25. The substrate insulating layer 23 insulates the metal support layer 21 from the first conductor pattern 24 and from the second conductor pattern 25. The substrate insulating layer 23 comprises a transparent resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the substrate insulating layer 23 comprises polyimide.

[0083] (1-4) Seed layer A seed layer 20 is disposed on one side surface S2 of the substrate insulating layer 23 in the thickness direction. The seed layer 20 is disposed between the substrate insulating layer 23 and the first conductor pattern 24, and between the substrate insulating layer 23 and the second conductor pattern 25 in the thickness direction. The seed layer 20 protects the first conductor pattern 24 and the second conductor pattern 25 from the influence of the substrate insulating layer 23. Examples of materials for the seed layer 20 include chromium, nickel, titanium, and alloys thereof. The seed layer 20 preferably contains chromium.

[0084] (1-5) First conductor pattern The first conductor pattern 24 is disposed on one side of the substrate insulating layer 23 in the thickness direction. The first conductor pattern 24 is disposed on the seed layer 20. The first conductor pattern 24 is disposed on one side surface S2 of the substrate insulating layer 23, separated from the seed layer 20, in the thickness direction. The first conductor pattern 24 is disposed on the opposite side of the metal support layer 21 relative to the substrate insulating layer 23 in the thickness direction. Examples of materials for the first conductor pattern 24 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. The first conductor pattern 24 preferably contains copper.

[0085] The shape of the first conductor pattern 24 is not limited. In this embodiment, as... Figure 1 As shown, the first conductor pattern 24 has multiple terminals 241A, 241B, multiple terminals 242A, 242B, and multiple wirings 243A, 243B. Furthermore, the number of terminals and the number of wirings are not limited.

[0086] Terminals 241A and 241B are disposed at one end of the wiring circuit board 2 in the width direction. In this embodiment, terminals 241A and 241B are arranged at intervals along the flow direction. Each of terminals 241A and 241B has, for example, a square pad shape.

[0087] Terminals 242A and 242B are disposed at the other end of the wiring circuit board 2 in the width direction. In this embodiment, terminals 242A and 242B are arranged at intervals along the flow direction. Each of terminals 242A and 242B has, for example, a square pad shape.

[0088] Wiring 243A and 243B are, for example, signal wiring used for transmitting electrical signals. Wiring 243A and 243B can also form a differential pair. One end of wiring 243A is connected to terminal 241A. The other end of wiring 243A is connected to terminal 242A. Wiring 243A electrically connects terminal 241A and terminal 242A. One end of wiring 243B is connected to terminal 241B. The other end of wiring 243B is connected to terminal 242B. Wiring 243B electrically connects terminal 241B and terminal 242B.

[0089] (1-6) Second conductor pattern like Figure 2A As shown, the second conductor pattern 25 is disposed on one side of the substrate insulating layer 23 in the thickness direction. The second conductor pattern 25 is disposed on the seed layer 20. The second conductor pattern 25 is disposed on one side surface S2 of the substrate insulating layer 23 in the thickness direction, separated by the seed layer 20. The second conductor pattern 25 is disposed on the opposite side of the metal support layer 21 in the thickness direction relative to the substrate insulating layer 23. The thickness T2 of the second conductor pattern 25 is thicker than the thickness T1 of the first conductor pattern 24. As the material of the second conductor pattern 25, the same material as the first conductor pattern 24 can be used. Preferably, the material of the second conductor pattern 25 is the same as the material of the first conductor pattern 24.

[0090] The shape of the second conductor pattern 25 is not limited. In this embodiment, as... Figure 1 As shown, the second conductor pattern 25 has multiple terminals 251A, 251B, multiple terminals 252A, 252B, and multiple wirings 253A, 253B. Furthermore, the number of terminals and the number of wirings are not limited.

[0091] Terminals 251A and 251B are disposed at one end of the wiring circuit board 2 in the width direction. In this embodiment, terminals 251A and 251B are arranged at intervals along the flow direction. Each of terminals 251A and 251B has, for example, a square pad shape.

[0092] Terminals 252A and 252B are disposed at the other end of the wiring circuit board 2 in the width direction. In this embodiment, terminals 252A and 252B are arranged at intervals along the flow direction. Each of terminals 252A and 252B has, for example, a square pad shape.

[0093] Wiring 253A and 253B are, for example, power supply wiring for the flow of current from a power source. One end of wiring 253A is connected to terminal 251A. The other end of wiring 253A is connected to terminal 252A. Wiring 253A electrically connects terminal 251A and terminal 252A. One end of wiring 253B is connected to terminal 251B. The other end of wiring 253B is connected to terminal 252B. Wiring 253B electrically connects terminal 251B and terminal 252B.

[0094] (1-7) Cover with insulation layer like Figure 2AAs shown, the cover insulating layer 26 is disposed on one side of the base insulating layer 23 in the thickness direction. The cover insulating layer 26 covers the first conductor pattern 24 and the second conductor pattern 25. Specifically, the cover insulating layer 26 covers wirings 243A, 243B, 253A, and 253B. The cover insulating layer 26 does not cover terminals 241A, 241B, 251A, 251B, 242A, 242B, 252A, and 252B. The cover insulating layer 26 comprises a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the cover insulating layer 26 comprises polyimide.

[0095] (2) Framework like Figure 1 As shown, the frame 3 is disposed on the outer periphery of the assembly sheet 1. The frame 3 surrounds a plurality of wiring circuit boards 2. In this embodiment, the frame 3 has a frame shape. As a material for the frame 3, for example, a metal of the same material as the metal support layer 21 can be used.

[0096] In this embodiment, the assembly sheet 1 has notches 5 between the frame 3 and the wiring circuit board 2, and between the two wiring circuit boards 2. Furthermore, the assembly sheet 1 has a connecting portion 6A that connects the frame 3 and the wiring circuit board 2, and a connecting portion 6B that connects the two wiring circuit boards 2 to each other. The multiple wiring circuit boards 2 are connected to the frame 3 via the connecting portion 6A while being interconnected via the connecting portion 6B. Thus, the frame 3 supports the multiple wiring circuit boards 2.

[0097] (3) Alignment marks Multiple alignment marks 4 are configured, for example, in frame 3. The multiple alignment marks 4 include a first alignment mark 4A, a second alignment mark 4B, a third alignment mark 4C, and a fourth alignment mark 4D.

[0098] The first alignment mark 4A is disposed at one end of the frame 3 in the flow direction. The first alignment mark 4A is disposed at one end of the frame 3 in the width direction. The first alignment mark 4A is, for example, a polygonal shape (e.g., an octagon).

[0099] The second alignment mark 4B is disposed at one end of the frame 3 in the flow direction. The second alignment mark 4B is disposed away from the first alignment mark 4A in the width direction. The second alignment mark 4B is disposed at the other end of the frame 3 in the width direction. A plurality of wiring circuit boards 2 are disposed between the first alignment mark 4A and the second alignment mark 4B in the width direction. The second alignment mark 4B is, for example, polygonal in shape (e.g., octagonal).

[0100] The second alignment mark 4B is smaller than the first alignment mark 4A and the third alignment mark 4C. Specifically, in the width direction, the external dimensions of the second alignment mark 4B are smaller than the external dimensions of the first alignment mark 4A and the third alignment mark 4C. In the flow direction, the external dimensions of the second alignment mark 4B are smaller than the external dimensions of the first alignment mark 4A and the third alignment mark 4C. Because the second alignment mark 4B is smaller than the first alignment mark 4A and the third alignment mark 4C, the width direction and flow direction of the assembly sheet 1 can be easily identified by confirming the position of the second alignment mark 4B.

[0101] Furthermore, the distance D1 between the first alignment mark 4A and the second alignment mark 4B in the width direction and the distance D2 between the second alignment mark 4B and the third alignment mark 4C in the flow direction are different. Therefore, by confirming the distance D1 between the first alignment mark 4A and the second alignment mark 4B in the width direction and the distance D2 between the second alignment mark 4B and the third alignment mark 4C in the flow direction, the width direction and the flow direction of the assembly sheet 1 can be easily identified.

[0102] The third alignment mark 4C is disposed away from the second alignment mark 4B in the flow direction. The third alignment mark 4C is disposed at the other end of the frame 3 in the flow direction. The third alignment mark 4C is disposed at the other end of the frame 3 in the width direction. A plurality of wiring circuit boards 2 are disposed between the second alignment mark 4B and the third alignment mark 4C in the flow direction. The external dimensions of the third alignment mark 4C are the same as the external dimensions of the first alignment mark 4A. The third alignment mark 4C is, for example, a polygonal shape (e.g., an octagon).

[0103] The fourth alignment mark 4D is disposed away from the third alignment mark 4C in the width direction. The fourth alignment mark 4D is disposed at one end of the frame 3 in the width direction. The fourth alignment mark 4D is disposed away from the first alignment mark 4A in the flow direction. The fourth alignment mark 4D is disposed at the other end of the frame 3 in the flow direction. The external dimensions of the fourth alignment mark 4D are the same as the external dimensions of the first alignment mark 4A. The fourth alignment mark 4D is, for example, a polygonal shape (e.g., an octagon).

[0104] The construction of alignment mark 4 is described below. Figure 3 As shown, alignment mark 4 has a metal layer 40 (see reference). Figure 2B ), first mark 41, second mark 42, third mark 43 and overlay layer 44 (see reference) Figure 2B Furthermore, alignment mark 4 may not have a cover layer 44.

[0105] (3-1) Metal layer When the alignment mark 4 is configured on the frame 3, the metal layer 40 can also be part of the frame 3. For example... Figure 2B As shown, the metal layer 40 may have a first metal layer 401, a second metal layer 402, and a third metal layer 403.

[0106] The first metal layer 401 includes, for example, the metal support layer 21 of the wiring circuit board 2 (see reference). Figure 2A (The same material.)

[0107] The second metal layer 402 is disposed in the thickness direction between the first metal layer 401 and the first mark 41, and between the first metal layer 401 and the third metal layer 403. The second metal layer 402 is disposed in the thickness direction on one side surface 401A of the first metal layer 401. Therefore, the reflectivity of one side surface S11 (one side surface in the thickness direction) of the metal layer 40, which becomes the background in image recognition, can be adjusted by the second metal layer 402. Therefore, the detection accuracy of the alignment mark 4 can be improved. The material of the second metal layer 402 is different from the material of the first metal layer 401. The second metal layer 402 includes, for example, a protective metal layer 22 (see reference 2) of the wiring circuit board 2. Figure 2A (The same material.)

[0108] The third metal layer 403 is disposed in the thickness direction between the second metal layer 402 and the second mark 42, between the second metal layer 402 and the third mark 43, and between the second metal layer 402 and the cover layer 44. The third metal layer 403 is not disposed between the second metal layer 402 and the first mark 41. The third metal layer 403 is disposed on one side surface of the second metal layer 402 in the thickness direction. Therefore, the reflectivity of one side surface S11 (one side surface in the thickness direction) of the metal layer 40, which becomes the background in image recognition, can be adjusted by the third metal layer 403. The material of the third metal layer 403 is different from the material of the first metal layer 401. The third metal layer 403, for example, contains the same material as the seed layer 20 of the wiring circuit board 2.

[0109] (3-2) First mark like Figure 3 As shown, the first mark 41 is disposed radially at the center of the alignment mark 4. The first mark 41 is disposed radially inside the second mark 42. The first mark 41 has a polygonal (e.g., octagonal) plate shape.

[0110] like Figure 2BAs shown, the first mark 41 is disposed on one side surface S11 of the metal layer 40 in the thickness direction. When the metal layer 40 has a first metal layer 401, a second metal layer 402, and a third metal layer 403, the first mark 41 is disposed on one side surface of the second metal layer 402 in the thickness direction. The first mark 41 includes an insulating layer 23 (see reference 23) on the substrate of the wiring circuit board 2. Figure 2A (The same material.)

[0111] (3-3) Second mark like Figure 3 As shown, the second mark 42 is arranged radially outside the first mark 41 of the alignment mark 4. The second mark 42 surrounds the first mark 41. The second mark 42 is arranged radially spaced from the first mark 41 of the alignment mark 4. The second mark 42 is arranged radially between the first mark 41 and the third mark 43 of the alignment mark 4. The second mark 42 has a polygonal (e.g., octagonal) ring shape.

[0112] like Figure 2B As shown, the second mark 42 is disposed on one side surface S11 of the metal layer 40 in the thickness direction. When the metal layer 40 has a first metal layer 401, a second metal layer 402, and a third metal layer 403, the second mark 42 is disposed on one side surface of the third metal layer 403 in the thickness direction. The second mark 42 includes the first conductor pattern 24 of the wiring circuit board 2 (see reference). Figure 2A (The same material.)

[0113] (3-4) Third mark like Figure 3 As shown, the third mark 43 is arranged radially outside the second mark 42 of the alignment mark 4. The third mark 43 surrounds the second mark 42. The third mark 43 is arranged radially spaced from the second mark 42 of the alignment mark 4. The third mark 43 has a polygonal (e.g., octagonal) ring shape.

[0114] like Figure 2B As shown, the third mark 43 is disposed on one side surface S11 of the metal layer 40 in the thickness direction. When the metal layer 40 has a first metal layer 401, a second metal layer 402, and a third metal layer 403, the third mark 43 is disposed on one side surface of the third metal layer 403 in the thickness direction. The third mark 43 includes the second conductor pattern 25 of the wiring circuit board 2 (see reference 2). Figure 2A The same material. The thickness T12 of the third mark 43 is thicker than the thickness T11 of the second mark 42.

[0115] (3-5) Covering layer A cover layer 44 is disposed on one side surface S11 of the metal layer 40 in the thickness direction. When the metal layer 40 has a first metal layer 401, a second metal layer 402, and a third metal layer 403, the cover layer 44 is disposed on one side surface of the third metal layer 403 in the thickness direction. The cover layer 44 comprises a transparent resin. The cover layer 44 may also include a cover insulating layer 26 (see reference 26) that covers the wiring circuit board 2. Figure 2A The same material is used. Preferably, the cover layer 44 comprises polyimide. The cover layer 44 covers the first mark 41, the second mark 42, and the third mark 43. The cover layer 44 has a fourth mark 44A.

[0116] like Figure 3 As shown, the fourth mark 44A is arranged radially outside the third mark 43 of the alignment mark 4. The fourth mark 44A surrounds the third mark 43. The fourth mark 44A is arranged radially spaced from the third mark 43 of the alignment mark 4. The fourth mark 44A has a polygonal annular shape. The fourth mark 44A is a slit. One side surface S11 of the metal layer 40 can also be exposed to one side in the thickness direction through the fourth mark 44A.

[0117] When performing image recognition on the alignment mark 4 from one side of the thickness direction, the centers of the first mark 41, the second mark 42, the third mark 43, and the fourth mark 44A are preferably aligned. However, the centers of the first mark 41, the second mark 42, the third mark 43, and the fourth mark 44A may not be aligned.

[0118] 2. Manufacturing method of composite sheet material Next, the manufacturing method of the composite sheet 1 will be described.

[0119] The manufacturing method of the composite sheet 1 includes a substrate insulating layer forming process (see reference). Figure 4A and Figure 4B ), the first conductor pattern formation process (refer to) Figures 5A to 6B ), the second conductor pattern formation process (refer to) Figures 7A to 8B ) and the process of forming a covering insulation layer (the first process of forming a covering insulation layer, see below) Figure 9A and Figure 9B ).

[0120] (1) Substrate insulation layer formation process like Figure 4A and Figure 4B As shown, in the substrate insulating layer forming process, a substrate insulating layer 23 is formed, and a first mark 41 is formed.

[0121] In detail, during the substrate insulating layer formation process, firstly, a metal thin film M2 is formed on one side surface of a metal substrate M1 in the thickness direction. Furthermore, a portion of the substrate M1 becomes the metal support layer 21 of the wiring circuit board 2 (see reference). Figure 2A ) and the first metal layer 401 of alignment mark 4 (refer to Figure 2B A portion of the metal thin film M2 becomes the protective metal layer 22 of the wiring circuit substrate 2 (see reference). Figure 2A ) and the second metal layer 402 of alignment mark 4 (refer to Figure 2B The metal thin film M2 is formed, for example, by sputtering.

[0122] Next, in the substrate insulating layer formation process, a solution of photosensitive resin (varnish) is coated onto the metal thin film M2 and dried to form a photosensitive resin coating.

[0123] Next, the photosensitive resin coating is exposed and developed. As a result, a substrate insulating layer 23 and a first mark 41 are formed on the metal thin film M2.

[0124] (2) First conductor pattern formation process Next, in the first conductor pattern forming process, the first conductor pattern 24 is formed (see reference). Figure 6A ), and form the second mark 42 (see reference) Figure 6B ).

[0125] In detail, in the first conductor patterning process, a seed layer 20 is first formed on the surface of the substrate insulating layer 23 in the thickness direction. Furthermore, the seed layer 20 is also formed on the surface of the metal thin film M2 and the surface of the first mark 41 in the thickness direction. The seed layer 20 is formed, for example, by sputtering.

[0126] Next, as Figure 5A and Figure 5B As shown, an anti-plating agent R1 is adhered to one side surface of the substrate M1 in the thickness direction. The anti-plating agent R1 covers the metal film M2, the substrate insulating layer 23, and the first mark 41.

[0127] Next, the photomask PM1 used to form the first conductor pattern 24 is aligned with the substrate insulating layer 23 using the first mark 41.

[0128] Photomask PM1 has mask pattern 101 (reference) Figure 5A ) and multiple alignment patterns 102 (refer to) Figure 5B ).

[0129] Mask pattern 101 has the same shape as the first conductor pattern 24 (see reference). Figure 1 (Same shape. Mask pattern 101 blocks light.)

[0130] Alignment pattern 102 has the same as the second mark 42 (refer to) Figure 3 (Same shape. Align pattern 102 to block the light.)

[0131] Light passes through the portion of photomask PM1 except for mask pattern 101 and alignment pattern 102.

[0132] like Figure 5B As shown, the photomask PM1 is aligned with the substrate M1 such that the center 102A of the alignment pattern 102 coincides with the center 41A of the first mark 41 when viewed from one side in the thickness direction. With the center 102A of the alignment pattern 102 and the center 41A of the first mark 41 aligned, as... Figure 5A As shown, the mask pattern 101 overlaps with the substrate insulating layer 23.

[0133] Furthermore, the center 41A of the first mark 41 is calculated, for example, based on the peripheral edge E11 of the first mark 41. The peripheral edge E11 is read, for example, by image recognition. Similarly, the center 102A of the alignment pattern 102 is calculated, for example, based on the peripheral edge E12 of the alignment pattern 102. The peripheral edge E12 is read, for example, by image recognition. The same applies to the photomasks PM2 and PM3 used in subsequent processes.

[0134] Next, in the first conductor patterning process, the resist plating agent R1 is exposed and developed through the photomask PM1.

[0135] Therefore, the portion of the resist R1 that is blocked by the mask pattern 101 and the alignment pattern 102 is removed, and the seed layer 20 is exposed in the portion where the first conductor pattern 24 and the second mark 42 are formed. On the other hand, the exposed portion of the resist R1, that is, the portion where the first conductor pattern 24 is not formed, remains.

[0136] Next, as Figure 6A and Figure 6B As shown, a first conductor pattern 24 is formed on the exposed seed layer 20 by electroplating (see reference). Figure 6A ) and the second mark 42 (see reference) Figure 6B Thus, a first conductor pattern 24 is formed on the substrate insulating layer 23, and a second mark 42 is formed on the metal thin film M2.

[0137] After electroplating is completed, the anti-plating agent R1 is stripped off.

[0138] (3) Second conductor pattern formation process Next, in the second conductor pattern forming process, the second conductor pattern 25 is formed (see reference). Figure 8A ), and form the third mark 43 (see reference) Figure 8B ).

[0139] In detail, such as Figure 7A and Figure 7B As shown, an anti-plating agent R2 is adhered to one side surface of the substrate M1 in the thickness direction. The anti-plating agent R2 covers the metal film M2, the substrate insulating layer 23, the first conductor pattern 24, the first mark 41, and the second mark 42.

[0140] Next, the photomask PM2 used to form the second conductor pattern 25 is aligned relative to the substrate insulating layer 23 using the first mark 41. Alternatively, if positional accuracy of the second conductor pattern 25 relative to the first conductor pattern 24 is required, the photomask PM2 can also be aligned relative to the first conductor pattern 24 using the second mark 42.

[0141] Photomask PM2 has mask pattern 201 (refer to) Figure 7A ) and multiple alignment patterns 202 (refer to) Figure 7B ).

[0142] Mask pattern 201 has the same characteristics as second conductor pattern 25 (see reference). Figure 1 (Same shape. Mask pattern 201 blocks light.)

[0143] Alignment pattern 202 has the same as third mark 43 (refer to) Figure 3 (Same shape. Align pattern 202 to block the light.)

[0144] Light passes through the portion of photomask PM2 except for mask pattern 201 and alignment pattern 202.

[0145] like Figure 7B As shown, the photomask PM2 is aligned with the substrate M1 such that the center 202A of the alignment pattern 202 coincides with the center 41A of the first mark 41 when viewed from one side in the thickness direction. With the center 202A of the alignment pattern 202 and the center 41A of the first mark 41 aligned, as... Figure 7A As shown, the mask pattern 201 overlaps with the substrate insulating layer 23.

[0146] Next, in the second conductor patterning process, the resist plating agent R2 is exposed and developed through the photomask PM2.

[0147] Therefore, the portion of the resist R2 that is blocked by the mask pattern 201 and the alignment pattern 202 is removed, and the seed layer 20 is exposed in the portion where the second conductor pattern 25 and the third mark 43 are formed. On the other hand, the exposed portion of the resist R2, that is, the portion where the second conductor pattern 25 and the third mark 43 are not formed, remains.

[0148] Next, as Figure 8A as well as Figure 8BAs shown, a second conductor pattern 25 is formed on the exposed seed layer 20 by electroplating (see reference). Figure 8A ) and third mark 43 (see reference) Figure 8B Thus, a second conductor pattern 25 is formed on the substrate insulating layer 23, and a third mark 43 is formed on the metal thin film M2.

[0149] Subsequently, the anti-plating agent R2 is stripped off, and the seed layer 20 exposed due to the stripping of the anti-plating agent R2 is removed by etching.

[0150] (4) Cover insulation layer formation process Next, in the process of forming the covering insulation layer, the covering insulation layer 26 (see reference) is formed. Figure 2A ), and form a covering layer 44 (refer to) Figure 2B The process of forming the insulating layer is performed after the process of forming the second conductor pattern.

[0151] In detail, such as Figure 9A and Figure 9B As shown, in the process of forming the insulating layer, a solution of photosensitive resin (varnish) is applied to the metal film M2, the substrate insulating layer 23, the first conductor pattern 24, the second conductor pattern 25, the first mark 41, the second mark 42 and the third mark 43 and then dried to form a photosensitive resin coating F.

[0152] Next, the photomask PM3 used to form the covering insulating layer 26 is aligned relative to the substrate insulating layer 23 using the first mark 41. Alternatively, during the covering insulating layer formation process, the photomask PM3 used to form the covering insulating layer 26 can also be aligned relative to the first conductor pattern 24 using the second mark 42.

[0153] Photomask PM3 has mask pattern 301 (refer to) Figure 9A ) and multiple alignment patterns 302 (refer to) Figure 9B ).

[0154] The mask pattern 301 has a light-blocking portion 301A and a light-transmitting portion 301B. The light-blocking portion 301A blocks light. The light-transmitting portion 301B transmits light.

[0155] Alignment pattern 302 has the same as fourth mark 44A (refer to) Figure 3 (Same shape. Align pattern 302 to block light.)

[0156] like Figure 9B As shown, the photomask PM3 is aligned with the substrate M1 such that the center 302A of the alignment pattern 302 coincides with the center 41A of the first mark 41 when viewed from one side in the thickness direction. With the center 302A of the alignment pattern 302 and the center 41A of the first mark 41 aligned, as... Figure 9A As shown, the light-shielding portion 301A overlaps with the portion of the coating F that does not form the covering insulating layer 26, and the light-transmitting portion 301B overlaps with the portion of the coating F that forms the covering insulating layer 26.

[0157] Next, the photosensitive resin coating F is exposed and developed. Thus, as... Figure 2A and Figure 2B As shown, an insulating layer 26 and a cover layer 44 are formed.

[0158] Subsequently, the aforementioned notch 5 is formed by etching the substrate M1 and the metal thin film M2.

[0159] Thus, the composite sheet 1 is completed.

[0160] In addition, the manufacturing method of the composite sheet 1 may also include an inspection process.

[0161] During the inspection process, alignment marks 4 can also be used to check the positional offset of each layer (base insulating layer 23, first conductor pattern 24, second conductor pattern 25, and cover insulating layer 26) of the wiring circuit board 2.

[0162] For example, by measuring the distance between the center of the first mark 41 and the center of the second mark 42, the positional offset of the first conductor pattern 24 relative to the substrate insulating layer 23 can be detected. Furthermore, by measuring the distance between the center of the third mark 43 and the center of the second mark 42, the positional offset of the second conductor pattern 25 relative to the first conductor pattern 24 can be detected. Similarly, by measuring the distance between the center of the third mark 43 and the center of the first mark 41, the positional offset of the second conductor pattern 25 relative to the substrate insulating layer 23 can be detected. Furthermore, by measuring the distance between the center of the fourth mark 44A and the center of the first mark 41, the positional offset of the covering insulating layer 26 relative to the substrate insulating layer 23 can be detected. Additionally, by measuring the distance between the center of the fourth mark 44A and the center of the second mark 42, the positional offset of the covering insulating layer 26 relative to the first conductor pattern 24 can be detected. Finally, by measuring the distance between the center of the fourth mark 44A and the center of the third mark 43, the positional offset of the second covering insulating layer 27 relative to the second conductor pattern 25 can be detected.

[0163] 3. Effects (1) According to the aggregate sheet 1, such as Figure 2B and Figure 3 As shown, it includes an insulating layer 23 with the substrate (refer to...) Figure 2A The first mark 41 is made of the same material as the first conductor pattern 24 (see reference). Figure 2A The second marks 42 of the same material are disposed on one side surface S11 of the metal layer 40, forming an alignment mark 4.

[0164] Therefore, if an alignment mark 4 is image-recognized from one side of the metal layer 40, it is possible to detect both the first mark 41, which contains the same material as the substrate insulating layer 23, and the second mark 42, which contains the same material as the first conductor pattern 24.

[0165] As a result, multiple markers (first marker 41 and second marker 42) can be easily detected through image recognition.

[0166] (2) According to the aggregate sheet 1, such as Figure 3 As shown, the first mark 41 has a polygonal plate shape, and the second mark 42 has a polygonal ring shape. The second mark 42 surrounds the first mark 41.

[0167] Therefore, a simple structure in which the first mark 41 is surrounded by the second mark 42 can be used to form an alignment mark 4 having the first mark 41 and the second mark 42.

[0168] In addition, the center of the first mark 41 can be calculated based on the peripheral edge of the first mark 41, and the center of the second mark 42 can be calculated based on the peripheral edge of the second mark 42.

[0169] Therefore, by measuring the distance between the center of the first mark 41 and the center of the second mark 42, it is possible to check the positional offset of the first conductor pattern 24 relative to the substrate insulating layer 23.

[0170] (3) According to the aggregate sheet 1, such as Figure 2B As shown, the metal layer 40 of alignment mark 4 has a metal support layer 21 (see reference 4). Figure 2A The first metal layer 401 and the protective metal layer 22 (see reference) are made of the same material. Figure 2A A second metal layer 402 of the same material is disposed on one side surface 401A of the first metal layer 401 in the thickness direction.

[0171] Therefore, the reflectivity of one side surface S11 of the metal layer 40, which becomes the background in image recognition, can be adjusted by the second metal layer 402.

[0172] As a result, the detection accuracy of alignment mark 4 can be improved.

[0173] (4) According to the aggregate sheet 1, such as Figure 2B and Figure 3 As shown, the alignment mark 4 also has a third mark 43 comprising the same material as the second conductor pattern 25. The third mark 43 is disposed together with the first mark 41 and the second mark 42 on one side surface S11 of the metal layer 40. The third mark 43 has a polygonal ring shape and surrounds the second mark 42.

[0174] Thus, a simple structure in which the second mark 42 is surrounded by the third mark 43 can be formed to create an alignment mark 4 having the first mark 41, the second mark 42, and the third mark 43.

[0175] In addition, by measuring the distance between the center of the third mark 43 and the center of the second mark 42, it is possible to check the positional offset of the second conductor pattern 25 relative to the first conductor pattern 24.

[0176] In addition, by measuring the distance between the center of the third mark 43 and the center of the first mark 41, the positional offset of the second conductor pattern 25 relative to the substrate insulating layer 23 can be checked.

[0177] (5) According to the aggregate sheet 1, such as Figure 2B As shown, the alignment mark 4 also has a cover layer 44 comprising the same material as the covering insulating layer 26. The cover layer 44 is disposed on one side surface S11 of the metal layer 40, covering the first mark 41, the second mark 42 and the third mark 43.

[0178] Therefore, the alignment mark 4 can be protected by the covering layer 44.

[0179] In addition, by confirming the coverage state of the cover layer 44 on the first mark 41, the second mark 42 and the third mark 43, the coverage state of the cover insulation layer 26 on the first conductor pattern 24 and the second conductor pattern 25 can be checked.

[0180] (6) According to the composite sheet 1, such as Figure 2B and Figure 3 As shown, the cover layer 44 has a fourth mark 44A. The fourth mark 44A has a polygonal ring shape, surrounding the first mark 41, the second mark 42, and the third mark 43.

[0181] Thus, a simple structure can be formed by surrounding the first mark 41, the second mark 42, and the third mark 43 with the fourth mark 44A, thereby creating an alignment mark 4 having the first mark 41, the second mark 42, the third mark 43, and the fourth mark 44A.

[0182] In addition, by measuring the distance between the center of the fourth mark 44A and the center of the second mark 42, it is possible to check the positional offset of the covering insulation layer 26 relative to the first conductor pattern 24.

[0183] In addition, by measuring the distance between the center of the fourth mark 44A and the center of the third mark 43, it is possible to check the positional offset of the covering insulation layer 26 relative to the second conductor pattern 25.

[0184] In addition, by measuring the distance between the center of the fourth mark 44A and the center of the first mark 41, the positional offset of the covering insulation layer 26 relative to the base insulation layer 23 can be checked.

[0185] (7) For example Figure 1 As shown, the assembly sheet 1 has a first alignment mark 4A, a second alignment mark 4B disposed away from the first alignment mark 4A in the width direction, and a third alignment mark 4C disposed away from the second alignment mark 4B in the flow direction.

[0186] Therefore, the positional accuracy of photomasks PM1, PM2, and PM3 relative to the assembly sheet 1 can be improved in both the width and flow directions.

[0187] (8) According to the aggregate sheet 1, such as Figure 1 As shown, the second alignment mark 4B is smaller than the first alignment mark 4A and the third alignment mark 4C.

[0188] Therefore, by confirming the position of the second alignment mark 4B, the width direction and flow direction of the assembly sheet 1 can be easily identified.

[0189] (9) According to the composite sheet 1, such as Figure 1 As shown, the distance D1 between the first alignment mark 4A and the second alignment mark 4B in the width direction is different from the distance D2 between the second alignment mark 4B and the third alignment mark 4C in the flow direction.

[0190] Therefore, by confirming the distance D1 between the first alignment mark 4A and the second alignment mark 4B in the width direction and the distance D2 between the second alignment mark 4B and the third alignment mark 4C in the flow direction, the width direction and the flow direction of the assembly sheet 1 can be easily identified.

[0191] (10) According to the manufacturing method of the composite sheet 1, such as Figure 4A and Figure 4B As shown, in the substrate insulating layer forming process, a substrate insulating layer 23 is formed and a first mark 41 is formed, and the positional relationship between the substrate insulating layer 23 and the first mark 41 is determined.

[0192] Then, as Figure 5A and Figure 5B As shown, in the first conductor pattern forming process, the photomask PM1 used to form the first conductor pattern 24 is aligned with the substrate insulating layer 23 using the first mark 41.

[0193] This enables an improvement in the positional accuracy of the first conductor pattern 24 relative to the substrate insulating layer 23.

[0194] In addition, such as Figure 6A and Figure 6B As shown, in the first conductor pattern forming process, a first conductor pattern 24 is formed and a second mark 42 is formed, and the positional relationship between the first conductor pattern 24 and the second mark 42 is determined.

[0195] Then, as Figure 9A and Figure 9B As shown, in the process of forming the cover insulating layer, the photomask PM3 used to form the cover insulating layer 26 is aligned with the substrate insulating layer 23 using the first mark 41.

[0196] This enables an improvement in the positional accuracy of the covering insulating layer 26 relative to the base insulating layer 23.

[0197] (11) According to the manufacturing method of the composite sheet 1, such as Figure 7A and Figure 7B As shown, in the second conductor pattern forming process, the photomask PM2 used to form the second conductor pattern 25 is aligned with the substrate insulating layer 23 using the first mark 41.

[0198] This enables an improvement in the positional accuracy of the second conductor pattern 25 relative to the substrate insulating layer 23.

[0199] 4. Variations Next, modified examples will be described. In the modified examples, the same symbols are used to mark the same components as in the embodiments described above, and the descriptions are omitted.

[0200] (1) In the second conductor pattern forming process described above (refer to) Figure 7A and Figure 7B In this case, the second mark 42 can also be used to align the photomask PM2 with respect to the first conductor pattern 24. In this case, the positional accuracy of the second conductor pattern 25 relative to the first conductor pattern 24 can be improved.

[0201] In addition, in the above-mentioned process of forming the covering insulation layer (refer to...) Figure 9A and Figure 9B In this case, the second mark 42 can also be used to align the photomask PM3 with the first conductor pattern 24. In this case, the positional accuracy of the covering insulating layer 26 relative to the first conductor pattern 24 can be improved.

[0202] Alternatively, the third mark 43 can be used to align the photomask PM3 with the second conductor pattern 25. In this case, the positional accuracy of the covering insulating layer 26 relative to the second conductor pattern 25 can be improved.

[0203] (2) For example Figure 10AAs shown, the alignment mark 4 can also be circular. More specifically, the first mark 41 can be in the shape of a disc, and the second mark 42, the third mark 43, and the fourth mark 44A can be in the shape of annulus. The second mark 42 surrounds the first mark 41, the third mark 43 surrounds the second mark 42, and the fourth mark 44A surrounds the third mark 43.

[0204] (3) The order of the first mark 41, the second mark 42, the third mark 43 and the fourth mark 44A in the radial direction of the alignment mark 4 is not limited.

[0205] For example, such as Figure 10B As shown, the first mark 41 can also be positioned further outward than the second mark 42, the third mark 43, and the fourth mark 44A. That is, the first mark 41 can also surround the second mark 42, the third mark 43, and the fourth mark 44A. In this case, the first mark 41 can also have a circular or polygonal ring shape.

[0206] In this variation, a simple structure can be formed by surrounding the second mark 42, the third mark 43, and the fourth mark 44A with the first mark 41, thus creating an alignment mark 4 having the first mark 41, the second mark 42, the third mark 43, and the fourth mark 44A.

[0207] (4) such as Figure 11A As shown, the second conductor pattern 25 can also be disposed on one side of the covering insulating layer 26 (the first covering insulating layer) in the thickness direction. In this variation, the covering insulating layer 26 does not cover the second conductor pattern 25. In this case, the wiring circuit board 2 can also have a second covering insulating layer 27.

[0208] The second cover insulating layer 27 is disposed on one side of the cover insulating layer 26 in the thickness direction. The second cover insulating layer 27 covers the second conductor pattern 25. Specifically, the second cover insulating layer 27 covers wirings 253A and 253B. The second cover insulating layer 27 does not cover terminals 241A, 241B, 251A, 251B, 242A, 242B, 252A, and 252B. The second cover insulating layer 27 may contain, for example, the same resin as the cover insulating layer 26. Preferably, the second cover insulating layer 27 contains polyimide.

[0209] In addition, in this variant example, such as Figure 11B As shown, alignment mark 4 may also have a cover layer 44 (first cover layer) and a second cover layer 45.

[0210] In this variation, similar to the embodiment described above, the covering layer 44 covers the first mark 41 and the second mark 42. However, unlike the embodiment described above, in this variation, the covering layer 44 does not cover the third mark 43.

[0211] In this modified example, the third mark 43 is disposed on one side surface S21 of the cover layer 44 in the thickness direction. Figure 12 As shown, the fourth mark 44A of the cover layer 44 is disposed radially between the second mark 42 and the third mark 43 of the alignment mark 4. The fourth mark 44A surrounds the second mark 42.

[0212] like Figure 11B As shown, the second cover layer 45 is disposed on one side surface S21 of the cover layer 44 in the thickness direction. The second cover layer 45 comprises a transparent resin. The second cover layer 45 may also include a second cover insulating layer 27 (see reference 27) that is connected to the wiring circuit board 2. Figure 11A The same material. Preferably, the second cover layer 45 comprises polyimide. The second cover layer 45 covers the third mark 43. The second cover layer 45 has a fifth mark 45A.

[0213] like Figure 12 As shown, the fifth mark 45A is arranged radially outside the third mark 43 of the alignment mark 4. The fifth mark 45A surrounds the third mark 43. The fifth mark 45A is arranged radially spaced from the third mark 43 of the alignment mark 4. The fifth mark 45A is a slit. The fifth mark 45A has a circular or polygonal ring shape.

[0214] In this variation, the second conductor pattern forming step is performed after the first cover insulating layer forming step. Specifically, unlike the implementation described above, in this variation, the substrate insulating layer forming step, the first conductor pattern forming step, the cover insulating layer forming step (first cover insulating layer forming step), and the second conductor pattern forming step are performed sequentially.

[0215] According to this variation, even in a structure where the second conductor pattern 25 is disposed on one side of the covering insulation layer 26, a simple structure such as the third mark 43 surrounding the second mark 42 can be formed to create an alignment mark 4 having the first mark 41, the second mark 42, and the third mark 43.

[0216] Furthermore, according to this modified example, a simple structure can be formed by surrounding the second mark 42 with the fourth mark 44A of the covering layer 44 and surrounding the third mark 43 with the fifth mark 45A of the second covering layer 45, thus forming an alignment mark 4 having a first mark 41, a second mark 42, a third mark 43, a fourth mark 44A, and a fifth mark 45A.

[0217] In addition, by measuring the distance between the center of the fourth mark 44A and the center of the second mark 42, it is possible to check the positional offset of the covering insulation layer 26 relative to the first conductor pattern 24.

[0218] In addition, by measuring the distance between the center of the fifth mark 45A and the center of the third mark 43, the positional offset of the second covering insulation layer 27 relative to the second conductor pattern 25 can be checked.

[0219] (5) The configuration of alignment mark 4 is not limited. For example, as Figure 13 As shown, alignment mark 4 may not be configured on frame 3. Alignment mark 4 may also be configured between multiple wiring circuit boards 2.

[0220] (6) For example Figure 14 As shown, the assembly sheet 1 may also have two alignment marks 4. In this case, one alignment mark 4 may be disposed at one end of the frame 3 in the width direction and at the center of the frame 3 in the flow direction. The other alignment mark 4 may be disposed at the other end of the frame 3 in the width direction and at the center of the frame 3 in the flow direction.

[0221] (7) In addition, such as Figure 15 As shown, an alignment mark 4 can also be disposed at one end of the frame 3 in the flow direction and at the center of the frame 3 in the width direction. Other alignment marks 4 can also be disposed at the other end of the frame 3 in the flow direction and at the center of the frame 3 in the width direction.

[0222] (8) In addition, such as Figure 16 As shown, it can also have Figure 14 The two alignment marks 4 and Figure 15 The two alignment marks 4 are shown.

[0223] (9) In the above-described variations (1) to (8), the same effect as the above-described implementation can also be obtained. In addition, the above-described implementation and the above-described variations (1) to (8) can be combined with each other.

[0224] Furthermore, the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and should not be interpreted as limiting. Modifications of the invention that will be apparent to those skilled in the art are included within the scope of the foregoing patent claims.

[0225] Industrial availability The composite sheet and the method for manufacturing the composite sheet of the present invention can be used in the manufacture of wiring circuit boards.

[0226] Symbol Explanation 1. Composite sheet 2 Wiring circuit board 3 Framework 4 Alignment Marks 4A First Alignment Mark 4B Second Alignment Mark 4C Third Alignment Mark 21 Metal support layer 22 Protective metal layer 23. Substrate insulation layer 24 First conductor pattern 25 Second conductor pattern 26. Covering insulation layer (first covering insulation layer) 27 Second Cover Insulation Layer 40 metal layers 401 First Metal Layer 401A One side surface of the first metal layer 402 Second Metal Layer 41 First Mark 42 Second mark 43 Third mark 44 Covering layer (first covering layer) 44A Fourth Mark 45 Second Covering Layer 45A Fifth Mark D1 Distance between the first alignment mark and the second alignment mark D2 Distance between the second and third alignment marks PM2 is used as a photomask to form the second conductor pattern. PM3 is used to form a photomask covering an insulating layer. One side surface of the S11 metal layer S21 The side surface covered by the insulating layer.

Claims

1. An assembly sheet comprising a wiring circuit board and alignment marks, the wiring circuit board comprising: a metal support layer; a substrate insulating layer disposed on one side of the metal support layer in the thickness direction; and a first conductor pattern disposed on one side of the substrate insulating layer in the thickness direction. The alignment mark has: Metal layer; A first mark, disposed on one side surface of the metal layer in the thickness direction, comprises the same material as the substrate insulating layer of the wiring circuit board; as well as The second mark, which is disposed on one side surface of the metal layer in the thickness direction, comprises the same material as the first conductor pattern of the wiring circuit substrate.

2. The composite sheet according to claim 1, wherein, The first mark has a circular or polygonal plate shape. The second mark has a circular or polygonal ring shape and surrounds the first mark.

3. The composite sheet according to claim 1, wherein, The first mark and the second mark each have a circular or polygonal ring shape. The first mark surrounds the second mark.

4. The composite sheet according to claim 1, wherein, The wiring circuit board also has: A protective metal layer is disposed between the metal support layer and the substrate insulating layer in the thickness direction. The metal layer of the alignment mark has: The first metal layer comprises the same material as the metal support layer of the wiring circuit board; as well as A second metal layer is disposed on one side surface of the first metal layer in the thickness direction and contains the same material as the protective metal layer.

5. The composite sheet according to claim 1, wherein, The wiring circuit board also has: A second conductor pattern is disposed on one side of the substrate insulating layer in the thickness direction and is thicker than the first conductor pattern. The alignment mark also has: A third mark, disposed on one side surface of the metal layer in the thickness direction, comprises the same material as the second conductor pattern and has a circular or polygonal ring shape, and surrounds the second mark.

6. The composite sheet according to claim 1, wherein, The wiring circuit board also has: A first covering insulating layer is disposed on one side of the base insulating layer in the thickness direction and covers the first conductor pattern. The alignment mark also has: A cover layer, disposed on one side surface of the metal layer in the thickness direction, comprises the same material as the first cover insulating layer of the wiring circuit substrate, and covers the first mark and the second mark.

7. The composite sheet according to claim 6, wherein, The overlay of the alignment mark has a fourth mark, which has a circular or polygonal ring shape and surrounds the second mark.

8. The composite sheet according to claim 1, wherein, The wiring circuit board also has: A first covering insulating layer is disposed on one side of the base insulating layer in the thickness direction and covers the first conductor pattern; The second conductor pattern is disposed on one side of the first covering insulating layer in the thickness direction and is thicker than the first conductor pattern; as well as A second covering insulating layer is disposed on one side of the first covering insulating layer in the thickness direction and covers the second conductor pattern. The alignment mark also has: A first cover layer, disposed on one side surface of the metal layer in the thickness direction, comprises the same material as the first cover insulating layer of the wiring circuit board, and covers the first mark and the second mark; as well as A third mark is disposed on one side surface of the first cover layer in the thickness direction, contains the same material as the second conductor pattern, and has a circular or polygonal ring shape, and surrounds the second mark.

9. The composite sheet according to claim 8, wherein, The alignment mark also has: A second cover layer, disposed on one side surface of the first cover layer in the thickness direction, comprises the same material as the second cover insulating layer of the wiring circuit board, and covers the third mark. The first overlay of the alignment mark has a fourth mark, which has a circular or polygonal ring shape and surrounds the second mark. The second overlay of the alignment mark has a fifth mark, which has a circular or polygonal ring shape and surrounds the third mark.

10. The composite sheet according to claim 1, wherein, The composite sheet has: A frame that supports the wiring circuit board. The alignment mark is configured on the frame.

11. The composite sheet according to claim 1, wherein, The assembly sheet has multiple wiring circuit boards. The alignment marks are disposed between the plurality of the wiring circuit boards.

12. The composite sheet according to claim 1, wherein, The assembly sheet has a plurality of the alignment marks.

13. The composite sheet according to claim 12, wherein, The composite sheet extends along a width direction orthogonal to the thickness direction and a flow direction orthogonal to both the thickness direction and the width direction. The plurality of alignment marks include: First alignment mark; A second alignment mark is disposed away from the first alignment mark in the width direction; and A third alignment mark is configured away from the second alignment mark in the flow direction.

14. The composite sheet according to claim 13, wherein, The second alignment mark is smaller than the first alignment mark and the third alignment mark.

15. The composite sheet according to claim 13, wherein, The distance between the first alignment mark and the second alignment mark in the width direction is different from the distance between the second alignment mark and the third alignment mark in the flow direction.

16. A method for manufacturing an aggregate sheet, wherein the method is the same as that for manufacturing the aggregate sheet according to any one of claims 1 to 15. The wiring circuit board also has: A first covering insulating layer is disposed on one side of the base insulating layer in the thickness direction and covers the first conductor pattern. The method for manufacturing the composite sheet includes: The substrate insulating layer forming process forms the substrate insulating layer and forms the first mark; The first conductor pattern forming process forms the first conductor pattern and forms the second mark; as well as The first covering insulation layer forming process forms the first covering insulation layer. In the first cover insulating layer forming process, the first mark is used to align the photomask used to form the first cover insulating layer relative to the substrate insulating layer, or the second mark is used to align the photomask used to form the first cover insulating layer relative to the first conductor pattern.

17. The method for manufacturing an aggregate sheet according to claim 16, wherein, The wiring circuit board also has: The second conductor pattern is thicker than the first conductor pattern. The method for manufacturing the composite sheet further includes: The second conductor pattern forming process for forming the second conductor pattern, In the second conductor patterning process, the first mark is used to align the photomask used to form the second conductor pattern relative to the substrate insulating layer, or the second mark is used to align the photomask used to form the second conductor pattern relative to the first conductor pattern.

18. The method for manufacturing an aggregate sheet according to claim 17, wherein, The second conductor pattern is disposed on one side of the substrate insulating layer in the thickness direction. The first covering insulation layer formation process is performed after the second conductor pattern formation process.

19. The method for manufacturing an aggregate sheet according to claim 17, wherein, The second conductor pattern is disposed on one side of the first covering insulating layer in the thickness direction. The second conductor patterning process is performed after the first covering insulation layer forming process.

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