Jet device for micro blind hole surface treatment

Abstract

The invention belongs to the technical field of micro etching, and particularly relates to a spraying device for micro blind hole surface treatment, which comprises a processing groove, a position change seat, a circuit board mounting frame, a circuit board main body, a leakage-proof cover plate and a solution box. According to the spraying device, after spraying treatment is completed, a second small electric push rod works and stretches to drive an X-axis second rack to move, under meshing transmission of an adjusting circular gear and the X-axis second rack, the adjusting circular gear drives a displacement rotating shaft to rotate, then a powerful supporting frame is driven to rotate, and a spraying plate moves accordingly; as shown in figure 2, enough space is formed above the circuit board mounting frame and the circuit board main body, preparation is made for follow-up swinging of the circuit board mounting frame, and before the circuit board mounting frame swings, the opening of the micro blind hole is covered, so that the circuit board mounting frame is prevented from swinging. Therefore, the micro-etching solution in the micro blind hole is prevented from splashing to other positions on the circuit board, and the processing quality is further improved.

Description

Technical Field

[0001] This invention relates to a spraying device, and more particularly to a spraying device for micro-blind hole surface treatment. Background Technology

[0002] Micro-etching technology for metal materials is an indispensable process in the semiconductor circuit board manufacturing industry. Before micro-etching, the semiconductor circuit board also needs to be treated for micro-blind holes. That is, through the treatment of micro-etching solution, the oxides and copper burrs on the surface of copper foil react with the micro-etching solution, and the oxides and copper burrs on the surface of copper foil can be cleaned, resulting in qualified semiconductor circuit boards for further surface treatment in subsequent processes.

[0003] However, existing micro-etching equipment processes semiconductor circuit boards vertically in the micro-etching tank or horizontally in the tank with the via openings facing upwards. Both methods have the problem that burrs cannot be completely removed, resulting in defective products and reduced production efficiency. Furthermore, the micro-etching solution can easily flow to other parts of the circuit board, further contributing to poor product quality.

[0004] In view of this, the present invention designs a spraying device for micro blind hole surface treatment. Summary of the Invention

[0005] The main objective of this disclosure is to provide a spraying device for surface treatment of micro-blind holes, so as to effectively solve the problems raised by the inventors in the above-mentioned background art.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A spraying device for surface treatment of micro blind holes includes a processing tank, a position changing seat, a circuit board mounting frame, a circuit board body, a leak-proof cover, and a solution tank. The front and rear side walls of the processing groove of the device are provided with sliding grooves, and a position changing seat is slidably installed in the sliding groove, that is, the sliding direction is left and right. A circuit board mounting frame is movably provided between the two position changing seats, and a mounting groove is provided at the top of the circuit board mounting frame. The circuit board body is fixed in the mounting groove, and the opening of the micro blind hole body at the top of the circuit board body faces upward. The side of the circuit board mounting frame is provided with two leak-proof covers, and the two leak-proof covers move in opposite directions. The sum of the dimensions of the two leak-proof covers is larger than the dimensions of the circuit board mounting frame. A solution tank is fixedly installed on the side of the processing tank of the device, and a displacement shaft is rotatably installed on the top of the solution tank. A strong support frame is fixedly installed on the displacement shaft, and a spray plate is fixedly installed on the other end of the strong support frame. The bottom of the spray plate is fixedly connected with evenly distributed alignment nozzles, and the spray plate is located directly above the main body of the circuit board, that is, the alignment nozzles correspond one-to-one with the micro blind hole body. The leak-proof cover is located below the strong support frame and diagonally above the circuit board mounting frame.

[0007] Preferably, a small-amplitude swing shaft is rotatably mounted between the two position-changing seats, and an outer sleeve is fixedly mounted on the small-amplitude swing shaft. The circuit board mounting frame is fixedly mounted on the small-amplitude swing shaft. A horizontal return torsion spring is fixedly connected between the side end of the outer sleeve and the position-changing seat, that is, the horizontal return torsion spring is sleeved on the surface of the small-amplitude swing shaft. Two parallel linear balance bars are fixedly mounted in the processing groove of the device, and two support plates are fixedly connected between the two linear balance bars. The circuit board mounting frame is located above the two support plates, and the distance between the two linear balance bars is greater than the width of the circuit board mounting frame. A friction liner is fixedly mounted on the left side of the top of the linear balance bar. A friction wheel is fixedly mounted on the outer sleeve, and the friction wheel is located directly above the linear balance bar. The friction wheel works in conjunction with the friction liner.

[0008] Preferably, an L-shaped fixing block is fixedly installed on the right side of the circuit board mounting frame, and two opening and closing shafts are rotatably installed on the L-shaped fixing block. The two opening and closing shafts are staggered, and a leak-proof cover is fixedly installed on each of the two opening and closing shafts. The leak-proof cover is located above the processing groove of the device. A matching circular gear is fixedly installed at the upper end of each of the two opening and closing shafts, and the two matching circular gears mesh with each other. A first small electric push rod is fixedly installed on the vertical end of the L-shaped fixing block, and the output end of the first small electric push rod is fixedly connected to a Y-axis rack. The Y-axis rack meshes with one of the matching circular gears for transmission, that is, the Y-axis rack is located above the leak-proof cover.

[0009] Preferably, a telescopic conveying pipe is fixedly connected to the top of the solution tank, and another section of the telescopic conveying pipe is fixedly connected to the spray plate, that is, the telescopic conveying pipe is connected to each aligned nozzle. Part of the telescopic conveying pipe is bonded to a strong support frame. An adjusting circular gear is fixedly installed on the displacement shaft. A second small electric push rod is fixedly installed at the upper end of the solution tank, and the output end of the second small electric push rod is fixedly connected to the X-axis rack. The adjusting circular gear meshes with the X-axis rack.

[0010] Preferably, two mounting blocks are fixedly installed on both the front and rear sides of the processing groove of the device, and an X-axis linear screw is rotatably installed between the two mounting blocks on the same side. The position change seat is threaded onto the X-axis linear screw. A servo motor is fixedly installed on the rear side of the processing groove of the device, and the output end of the servo motor is fixedly connected to one of the X-axis linear screws.

[0011] Preferably, a transmission wheel is fixedly installed at one end of each of the two X-axis linear lead screws on the same side, and the two transmission wheels are connected by a synchronous belt drive.

[0012] In view of this, compared with the prior art, the beneficial effects of the present invention are: (i) In this application, when processing the micro-blind holes on the circuit board body, the spray plate is located directly above the circuit board mounting frame, that is, the alignment nozzles are aligned with the micro-blind hole body, such as... Figure 1 As shown, the two leak-proof covers are located diagonally above the main body of the circuit board, without covering the micro blind holes. This state is the position of each structure in the working posture, and will not cause motion interference.

[0013] (ii) In this application, the external pumping device operates to deliver the micro-etching solution in the solution tank to the spray plate through the telescopic delivery pipe. Finally, it is sprayed by the alignment nozzle and delivered to each micro-blind hole body. The micro-etching solution remains in the micro-blind hole for an appropriate time to react, so that burrs and other defects in the micro-blind hole body can be completely removed, thereby improving the quality of the micro-blind hole and ensuring the reliability of subsequent high-density interconnection.

[0014] (III) In this application, after the spraying treatment is completed, the second small electric push rod operates, which extends and drives the X-axis rack number two to move. Under the meshing transmission of the adjusting circular gear and the X-axis rack number two, the adjusting circular gear drives the displacement shaft to rotate, which in turn drives the strong support frame to rotate. The spray plate then moves, that is, it moves away from the top of the circuit board mounting frame, such as... Figure 2 As shown, this provides sufficient space above the circuit board mounting frame and the main body of the circuit board to prepare for the subsequent swinging of the circuit board mounting frame.

[0015] (iv) In this application, the first small electric actuator then operates, extending and driving the Y-axis rack to move, causing the Y-axis rack to drive one of the accompanying circular gears to rotate. Since the two accompanying circular gears mesh, the two opening and closing shafts rotate synchronously in opposite directions. The opening and closing shafts then drive the leak-proof cover to move, causing the two leak-proof covers to... Figure 1 The state changes in the middle are Figure 7 In this state, the two anti-leakage covers are closed and placed on top of the circuit board body, so that the opening of the micro blind hole is covered, thereby preventing the micro-etching solution inside the micro blind hole from splashing out to other parts of the circuit board, and further improving the processing quality.

[0016] (V) In this application, when cleaning the micro-etching solution inside the micro-blind hole body, the servo motor works, causing it to drive the X-axis linear screw to rotate. Under the transmission action of two transmission wheels and a synchronous belt, the two X-axis linear screws rotate synchronously to ensure that the movement state of the two position change seats is consistent. Then, the two position change seats move to the left along the slide groove, causing the outer sleeve to move to the left along with the circuit board mounting frame and the circuit board body until the circuit board mounting frame is separated from the top of the support plate. At this time, the friction wheel will move to the position of the friction pad. Driven by the friction of the two, the small-amplitude swing shaft drives the circuit board mounting frame to rotate. The horizontal reset torsion spring is stressed and used to reset the circuit board mounting frame, causing the circuit board body to tend to flip over, that is, the micro-blind hole changes to face downward. Then, the leak-proof cover is unfolded and removed from the circuit board to drain the micro-etching solution inside the micro-blind hole, effectively preventing the micro-etching solution from flowing onto the circuit board body, which is safe and reliable. Attached Figure Description

[0017] Figure 1 The figure shown is a top view of the spraying device for micro-blind hole surface treatment provided by the present invention; Figure 2 As shown Figure 1 A schematic diagram of the structure after the central spray plate has been moved; Figure 3 As shown Figure 2 Enlarged structural diagram at point A; Figure 4 The image shown is a top view of the connection between the circuit board mounting frame and the leak-proof cover. Figure 5 As shown Figure 4 Enlarged structural diagram at point B; Figure 6 As shown Figure 4 A schematic diagram of a local structure in the image; Figure 7 As shown Figure 2 A schematic diagram of the structure after the two leak-proof covers have been moved; Figure 8 The image shown is a top view of the connection between the processing slot and the position changing seat of the device. Figure 9 The image shown is a top view of the spray plate structure.

[0018] icon: 1-Processing groove for the device; 101-Linear balance bar; 102-Friction liner; 103-Support plate; 2-Position change seat; 201-Mounting block; 202-X-axis linear lead screw; 203-Servo motor; 204-Synchronous belt; 205-Transmission pulley; 3-Circuit board mounting frame; 301-Small amplitude swing shaft; 302-Outer sleeve; 303-Horizontal return torsion spring; 304-Friction wheel; 4-Circuit board body; 401-Micro blind via body; 5-Leak-proof cover; 501-L-shaped fixing block; 502-Opening and closing pivot; 503-Accompanying circular gear; 504-First small electric push rod; 505-Y-axis rack No. 1; 6-Solution tank; 601-Shifting shaft; 602-Strong support frame; 603-Spray plate; 6031-Alignment nozzle; 604-Telescopic conveying pipe; 605-Adjusting circular gear; 606-Second small electric push rod; 607-X-axis rack No. 2. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1-9 The present invention provides the following embodiments: A spraying device for surface treatment of micro blind holes includes a processing tank 1, a position changing seat 2, a circuit board mounting frame 3, a circuit board body 4, a leak-proof cover 5, and a solution tank 6. The front and rear side walls of the processing groove 1 of the device are provided with sliding grooves, and the position changing seat 2 is slidably installed in the sliding groove, that is, the sliding direction is left and right. The circuit board mounting frame 3 is movably provided between the two position changing seats 2, and the top of the circuit board mounting frame 3 is provided with a mounting groove. The circuit board body 4 is fixed in the mounting groove, and the opening of the micro blind hole body 401 on the top of the circuit board body 4 faces upward. Two leak-proof covers 5 are movably provided on the side of the circuit board mounting frame 3, and the two leak-proof covers 5 move in opposite directions. The sum of the dimensions of the two leak-proof covers 5 is larger than the dimensions of the circuit board mounting frame 3. A solution tank 6 is fixedly installed on the side of the processing tank 1 of the device, and a displacement shaft 601 is rotatably installed on the top of the solution tank 6. A strong support frame 602 is fixedly installed on the displacement shaft 601, and a spray plate 603 is fixedly installed on the other end of the strong support frame 602. The bottom of the spray plate 603 is fixedly connected with evenly distributed alignment nozzles 6031, and the spray plate 603 is located directly above the circuit board body 4, that is, the alignment nozzles 6031 correspond one-to-one with the micro blind hole body 401. The leak-proof cover 5 is located below the strong support frame 602 and diagonally above the circuit board mounting frame 3.

[0021] Specifically, a small-amplitude swing shaft 301 is rotatably mounted between the two position-changing seats 2, and an outer sleeve 302 is fixedly mounted on the small-amplitude swing shaft 301. The circuit board mounting frame 3 is fixedly mounted on the small-amplitude swing shaft 301. A horizontal reset torsion spring 303 is fixedly connected between the side end of the outer sleeve 302 and the position-changing seat 2, that is, the horizontal reset torsion spring 303 is sleeved on the surface of the small-amplitude swing shaft 301. Two parallel linear balance bars 101 are fixedly mounted in the device processing groove 1, and two support plates 103 are fixedly connected between the two linear balance bars 101. The circuit board mounting frame 3 is located above the two support plates 103, and the distance between the two linear balance bars 101 is greater than the width of the circuit board mounting frame 3. A friction pad 102 is fixedly mounted on the left side of the top of the linear balance bar 101. A friction wheel 304 is fixedly mounted on the outer sleeve 302, and the friction wheel 304 is located directly above the linear balance bar 101. The friction wheel 304 works in conjunction with the friction pad 102.

[0022] Specifically, an L-shaped fixing block 501 is fixedly installed on the right side of the circuit board mounting frame 3, and two opening and closing shafts 502 are rotatably installed on the L-shaped fixing block 501. The two opening and closing shafts 502 are staggered, and a leak-proof cover plate 5 is fixedly installed on each of the two opening and closing shafts 502. The leak-proof cover plate 5 is located above the processing groove 1 of the device. A matching circular gear 503 is fixedly installed at the upper end of each of the two opening and closing shafts 502, and the two matching circular gears 503 mesh with each other. A first small electric push rod 504 is fixedly installed on the vertical end of the L-shaped fixing block 501, and the output end of the first small electric push rod 504 is fixedly connected to a Y-axis rack 505. The Y-axis rack 505 meshes with one of the matching circular gears 503 for transmission, that is, the Y-axis rack 505 is located above the leak-proof cover plate 5.

[0023] Specifically, a telescopic conveying pipe 604 is fixedly connected to the top of the solution tank 6, and another section of the telescopic conveying pipe 604 is fixedly connected to the spray plate 603. That is, the telescopic conveying pipe 604 is connected to each aligned nozzle 6031. Part of the telescopic conveying pipe 604 is bonded to the strong support frame 602. An adjusting circular gear 605 is fixedly installed on the displacement shaft 601. A second small electric push rod 606 is fixedly installed at the upper end of the solution tank 6, and the output end of the second small electric push rod 606 is fixedly connected to the X-axis rack 607. The adjusting circular gear 605 meshes with the X-axis rack 607 for transmission. An external pumping device can be installed inside the solution tank 6 to transport the micro-etching solution inside the solution tank 6 via the telescopic delivery pipe 604.

[0024] Specifically, two mounting blocks 201 are fixedly installed on the front and rear sides of the processing tank 1 of the device, and an X-axis linear screw 202 is rotatably installed between the two mounting blocks 201 on the same side. The position change seat 2 is threaded onto the X-axis linear screw 202. A servo motor 203 is fixedly installed on the rear side of the processing tank 1 of the device, and the output end of the servo motor 203 is fixedly connected to one of the X-axis linear screws 202. A transmission wheel 205 is fixedly installed on one end of the two X-axis linear screws 202 on the same side, and the two transmission wheels 205 are connected by a synchronous belt 204.

[0025] The specific implementation method of this embodiment is as follows: When processing the micro blind holes on the circuit board body 4, the spray plate 603 is located directly above the circuit board mounting frame 3, that is, the alignment nozzle 6031 is aligned with the micro blind hole body 401, such as... Figure 1 As shown, the two leak-proof covers 5 are located diagonally above the main body of the circuit board 4, without covering the micro blind holes. This state is the position of each structure in the working posture, and will not cause motion interference. The external pumping device operates to deliver the micro-etching solution in the solution tank 6 to the spray plate 603 through the telescopic delivery pipe 604. Finally, it is sprayed by the alignment nozzle 6031 and delivered to each micro-blind hole body 401. The micro-etching solution remains in the micro-blind hole for an appropriate time to react, so that burrs and other defects in the micro-blind hole body 401 can be completely removed, thereby improving the quality of the micro-blind hole and ensuring the reliability of subsequent high-density interconnection. After the spraying process is completed, the second small electric push rod 606 operates, extending and driving the X-axis rack 607 to move. Under the meshing transmission of the adjusting circular gear 605 and the X-axis rack 607, the adjusting circular gear 605 drives the displacement shaft 601 to rotate, which in turn drives the strong support frame 602 to rotate. The spray plate 603 then moves, i.e., moves away from above the circuit board mounting frame 3. Figure 2 As shown, this provides sufficient space above the circuit board mounting frame 3 and the circuit board body 4 to prepare for the subsequent swinging of the circuit board mounting frame 3. Subsequently, the first small electric push rod 504 operates, extending and driving the first rack 505 on the Y-axis to move. This causes the first rack 505 to drive one of the accompanying circular gears 503 to rotate. Since the two accompanying circular gears 503 mesh, the two opening and closing shafts 502 rotate synchronously in opposite directions. The opening and closing shafts 502 then drive the leak-proof cover 5 to move, causing the two leak-proof cover 5 to... Figure 1 The state changes in the middle are Figure 7 In the state where the two leak-proof cover plates 5 are closed and cover the top of the circuit board body 4, the opening of the micro blind hole is covered, thereby preventing the micro etching solution in the micro blind hole from splashing out to other parts of the circuit board and further improving the processing quality. When cleaning the micro-etching solution inside the micro-blind hole body 401, the servo motor 203 operates, causing it to drive the X-axis linear screw 202 to rotate. Under the transmission action of the two transmission wheels 205 and a synchronous belt 204, the two X-axis linear screws 202 rotate synchronously to ensure that the movement state of the two position change seats is consistent. Then, the two position change seats 2 move to the left along the slide groove, causing the outer sleeve 302 to move to the left along with the circuit board mounting frame 3 and the circuit board body 4 until the circuit board mounting frame 3 is removed from the top of the support plate 103. At this time, the friction wheel 304 will move to the position of the friction pad 102. Driven by the friction between the two, the small-amplitude swing shaft 301 drives the circuit board mounting frame 3 to rotate. The horizontal reset torsion spring 303 is stressed and used to reset the circuit board mounting frame 3, causing the circuit board body 4 to tend to flip over, that is, the micro-blind hole changes to face downward. Then, the leak-proof cover 5 is unfolded and removed from the circuit board to drain the micro-etching solution inside the micro-blind hole, effectively preventing the micro-etching solution from flowing onto the circuit board body 4, which is safe and reliable.

[0026] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A spraying device for surface treatment of micro blind holes, characterized in that: It includes a processing tank (1), a position changing seat (2), a circuit board mounting frame (3), a circuit board body (4), a leak-proof cover (5), and a solution tank (6); The processing groove (1) of the device is provided with sliding grooves on the front and rear side walls, and a position change seat (2) is slidably installed in the sliding groove, that is, the sliding direction is left and right. A circuit board mounting frame (3) is movably provided between the two position change seats (2), and a mounting groove is provided on the top of the circuit board mounting frame (3). The circuit board body (4) is fixed in the mounting groove, and the opening of the micro blind hole body (401) on the top of the circuit board body (4) is upward. The side of the circuit board mounting frame (3) is provided with two leak-proof covers (5), and the two leak-proof covers (5) move in opposite directions. The sum of the dimensions of the two leak-proof covers (5) is larger than the dimensions of the circuit board mounting frame (3). A solution tank (6) is fixedly installed on the side of the processing tank (1) of the device, and a displacement shaft (601) is rotatably installed on the top of the solution tank (6). A strong support frame (602) is fixedly installed on the displacement shaft (601), and a spray plate (603) is fixedly installed on the other end of the strong support frame (602). A uniformly distributed alignment nozzle (6031) is fixedly connected to the bottom of the spray plate (603), and the spray plate (603) is located directly above the circuit board body (4), that is, the alignment nozzle (6031) corresponds one-to-one with the micro blind hole body (401). The leak-proof cover (5) is located below the strong support frame (602) and diagonally above the circuit board mounting frame (3).

2. The spraying device for micro-blind hole surface treatment according to claim 1, characterized in that: A small-amplitude swing shaft (301) is rotatably mounted between the two position change seats (2), and an outer sleeve (302) is fixedly mounted on the small-amplitude swing shaft (301). The circuit board mounting frame (3) is fixedly mounted on the small-amplitude swing shaft (301). A horizontal reset torsion spring (303) is fixedly connected between the side end of the outer sleeve (302) and the position change seat (2). That is, the horizontal reset torsion spring (303) is sleeved on the surface of the small-amplitude swing shaft (301). Two parallel linear balance bars (101) are fixedly installed in the processing groove (1) of the device, and two support plates (103) are fixedly connected between the two linear balance bars (101). The circuit board mounting frame (3) is located above the two support plates (103), and the distance between the two linear balance bars (101) is greater than the width of the circuit board mounting frame (3).

3. The spraying device for micro-blind hole surface treatment according to claim 2, characterized in that: A friction pad (102) is fixedly installed on the left side of the top of the linear balance bar (101), and a friction wheel (304) is fixedly installed on the outer sleeve (302). The friction wheel (304) is located directly above the linear balance bar (101), and the friction wheel (304) is used in conjunction with the friction pad (102).

4. The spraying device for micro-blind hole surface treatment according to claim 3, characterized in that: An L-shaped fixing block (501) is fixedly installed on the right side of the circuit board mounting frame (3), and two opening and closing shafts (502) are rotatably installed on the L-shaped fixing block (501). The two opening and closing shafts (502) are staggered, and a leak-proof cover plate (5) is fixedly installed on each of the two opening and closing shafts (502). The leak-proof cover plate (5) is located above the processing groove (1) of the device, and the upper ends of the two opening and closing shafts (502) are fixedly installed with accompanying circular teeth. The wheel (503) and two accompanying circular gears (503) mesh with each other. A first small electric push rod (504) is fixedly installed on the vertical end of the L-shaped fixing block (501), and the output end of the first small electric push rod (504) is fixedly connected to the first Y-axis rack (505). The first Y-axis rack (505) meshes with one of the accompanying circular gears (503) for transmission, that is, the first Y-axis rack (505) is located above the leak-proof cover plate (5).

5. The spraying device for micro-blind hole surface treatment according to claim 4, characterized in that: The top of the solution tank (6) is fixedly connected to a telescopic conveying pipe (604), and another section of the telescopic conveying pipe (604) is fixedly connected to the spray plate (603). That is, the telescopic conveying pipe (604) is connected to each aligned nozzle (6031), and part of the telescopic conveying pipe (604) is bonded to the strong support frame (602).

6. The spraying device for micro-blind hole surface treatment according to claim 5, characterized in that: An adjusting circular gear (605) is fixedly installed on the displacement shaft (601), and a second small electric push rod (606) is fixedly installed on the upper end of the solution tank (6). The output end of the second small electric push rod (606) is fixedly connected to the X-axis rack (607), and the adjusting circular gear (605) meshes with the X-axis rack (607) for transmission.

7. The spraying device for micro-blind hole surface treatment according to claim 6, characterized in that: Two mounting blocks (201) are fixedly installed on the front and rear sides of the processing groove (1) of the device, and an X-axis linear screw (202) is rotatably installed between the two mounting blocks (201) on the same side. The position change seat (2) is threaded on the X-axis linear screw (202). A servo motor (203) is fixedly installed on the rear side of the processing groove (1), and the output end of the servo motor (203) is fixedly connected to one of the X-axis linear screws (202).

8. The spraying device for micro-blind hole surface treatment according to claim 7, characterized in that: Both X-axis linear lead screws (202) have a transmission wheel (205) fixedly installed on one end of the same side, and the two transmission wheels (205) are connected by a synchronous belt (204).

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