Full-automatic silicon material constant-temperature cleaning system and constant-temperature cleaning device

Abstract

The invention provides a full-automatic silicon material constant-temperature cleaning system and a constant-temperature cleaning device. The system comprises a sorting subsystem, a pre-cleaning subsystem, an acid pickling subsystem, a final water washing subsystem, a drying subsystem and a constant-temperature control subsystem, wherein the sorting subsystem is used for sorting silicon materials; the sorted silicon materials are sequentially conveyed to the pre-washing subsystem, the acid pickling subsystem, the final water washing subsystem and the drying subsystem to be subjected to pre-washing, acid pickling, final water washing and drying respectively; and the constant-temperature control subsystem is used for carrying out constant-temperature control on the temperature and the drying temperature of cleaning liquid in the pre-washing subsystem, the acid washing subsystem, the final water washing subsystem and the drying subsystem. According to the full-automatic silicon material constant-temperature cleaning system and the constant-temperature cleaning device, automatic sorting of supplied materials is achieved, full-automatic constant-temperature cleaning is achieved by analyzing the sorted silicon materials and adjusting equipment parameters, and then the cleaning efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of silicon material cleaning technology before crystal pulling production, and particularly to a fully automatic silicon material constant temperature cleaning system and constant temperature cleaning device. Background Technology

[0002] Chip manufacturing begins with monocrystalline silicon. In the monocrystalline silicon pulling process (Czochralski or zone melting), silicon cleaning is a crucial and indispensable pre-process. Its core objective is to remove various contaminants from the silicon surface, ensuring that the final pulled monocrystalline silicon rod has extremely high purity, a perfect crystal structure, and excellent electrical properties. Incompletely cleaned or improperly cleaned silicon will directly lead to a decline in monocrystalline quality, a sharp drop in yield, and even the scrapping of the entire batch. After the silicon arrives at the factory, it needs to be manually sorted, and the parameters of the cleaning equipment are adjusted manually, resulting in low efficiency. Therefore, there is an urgent need for a highly efficient, fully automated, temperature-controlled silicon cleaning system. Summary of the Invention

[0003] One of the objectives of this invention is to provide a fully automatic silicon material constant temperature cleaning system and device, which realizes automatic sorting of incoming materials, and by analyzing the sorted silicon material and adjusting the equipment parameters, achieves fully automatic constant temperature cleaning, thereby improving cleaning efficiency.

[0004] The present invention provides a fully automatic silicon material constant temperature cleaning system, comprising: a sorting subsystem, a pre-washing subsystem, an acid washing subsystem, a final water washing subsystem, a drying subsystem, and a constant temperature control subsystem;

[0005] The sorting subsystem is used to sort silicon material. The sorted silicon material is then sequentially transported to the pre-washing subsystem, acid washing subsystem, final water washing subsystem, and drying subsystem for pre-washing, acid washing, final water washing, and drying, respectively. The constant temperature control subsystem controls the temperature of the cleaning solution and the drying temperature in the pre-washing subsystem, acid washing subsystem, final water washing subsystem, and drying subsystem.

[0006] Preferably, the sorting subsystem includes:

[0007] The image acquisition module is used to acquire the first image of the image acquisition device that takes pictures of the screening platform after the material is discharged from the storage silo to the screening platform.

[0008] The analysis module is used to analyze the first image to determine whether there is a region to be removed and to locate the region to be removed.

[0009] The rejection mechanism control module is used to control the rejection mechanism to remove the rejection area into the corresponding temporary storage box.

[0010] Preferably, the rejection mechanism includes: a positioning and moving structure disposed between the screening platform and the storage bin, a telescopic structure disposed on the moving platform of the positioning and moving structure, and a covering structure disposed at the end of the telescopic structure;

[0011] The positioning and moving structure includes: a first guide rail arranged in parallel, a second guide rail with both ends respectively set on the first guide rail, and a moving platform set on the second guide rail;

[0012] The covering structure includes: a mounting base, an annular covering body disposed on the outer periphery of the mounting base, and a flow guide head embedded on the outer periphery of the annular covering body; limiting bodies are respectively disposed on the outer periphery of the annular covering body and on both sides of the flow guide head; an arc-shaped guide rail is disposed on the outer side of the annular covering body, with both ends of the arc-shaped guide rail being fixedly connected to the side of the limiting body away from the flow guide head; a sliding body is disposed near both ends of the arc-shaped guide rail, and the sliding body is fixedly connected to the rotating end of a rotating structure disposed on the mounting base through a connecting body, wherein there are two rotating structures, each corresponding to one of the sliding bodies and stacked one on top of the other; an arc-shaped elastic body is fixedly disposed on the sliding body; the elastic body passes through the space between the limiting body and the annular covering body; the flow guide head has snap-fit ​​grooves on both sides for snapping with the ends of the elastic body; the flow guide head is configured to extend and retract outward from the annular covering body.

[0013] Preferably, a baffle is provided on the outer periphery of the screening platform; multiple temporary storage frames are configured and located on the outside of the baffle; a gate is provided on the baffle at the position corresponding to the temporary storage frame; a notch is formed at the joint position of the two gates of the gate and on the side closer to the screening platform to adapt to the tip of the guide head.

[0014] Preferably, an electrically controlled telescopic rod is hinged to the lower part of one side of the screening platform, and a fixed rod is hinged to the other side; a first discharge chute is provided on the baffle plate near the fixed rod.

[0015] Preferably, the image acquisition module is further configured to acquire a second image from the image acquisition device after the rejected area has been rejected;

[0016] The analysis module is also used to analyze the second image to determine the parameter information of the silicon material;

[0017] The sorting mechanism control module is used to control the actions of the sorting mechanism based on parameter information.

[0018] The communication module is used to send parameter information to the constant temperature control subsystem.

[0019] Preferably, the sorting mechanism includes: a main body and a telescopic column disposed at the lower end of the main body; multiple feed chutes and a second discharge chutes are disposed on both sides of the main body; the feed chutes and the second discharge chutes are arranged sequentially from top to bottom; a vertical guide rail is fixedly disposed on the inner side wall between adjacent feed chutes, and another vertical guide rail is disposed on the inner side wall of the corresponding side; an insertion groove is disposed on the sliding platform of the vertical guide rail; insertion bodies are hinged on both sides of the screen plate; the insertion bodies are inserted into the insertion grooves; the holes of the screen plate disposed from top to bottom in the main body decrease in size sequentially; the end of the feed chute is disposed in the middle of the screen plate; the starting end of the second discharge chute is disposed below the screen plate and close to the nearest hinge position.

[0020] Preferably, the temperature control subsystem includes:

[0021] Multiple sensing modules are used to sense the temperature of the pre-wash subsystem, pickling subsystem, final water washing subsystem, and drying subsystem, respectively;

[0022] The temperature control module is used to determine the temperature control parameters based on the sensed temperature and the set control temperature.

[0023] Multiple execution modules are used to control the actions of the actuators in the pre-washing subsystem, acid washing subsystem, final water washing subsystem, and drying subsystem based on temperature control parameters.

[0024] Preferably, the fully automatic silicon material constant temperature cleaning system further includes: a control temperature determination module, used to determine the control temperature of each of the pre-washing subsystem, acid washing subsystem, final water washing subsystem, and drying subsystem based on the parameter information sent by the communication module.

[0025] The present invention also provides a constant temperature cleaning device, comprising: a sorting device, a pre-washing device, an acid washing device, a final washing device, a drying device, multiple conveying devices, and a central control cabinet;

[0026] The controller in the central control cabinet is equipped with any of the above-mentioned fully automatic silicon material constant temperature cleaning systems.

[0027] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings.

[0028] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0029] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0030] Figure 1 This is a schematic diagram of a fully automatic silicon material constant temperature cleaning system according to an embodiment of the present invention;

[0031] Figure 2 This is a schematic diagram of a rejection mechanism according to an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of the covering structure of the rejection mechanism in an embodiment of the present invention;

[0033] Figure 4 This is a schematic diagram of the gate of the rejection mechanism in an embodiment of the present invention;

[0034] Figure 5 This is a schematic diagram of the material discharge from the screening platform of the rejection mechanism in an embodiment of the present invention;

[0035] Figure 6 This is a schematic diagram of a sorting mechanism according to an embodiment of the present invention;

[0036] Figure 7 This is a schematic diagram of the interior of the sorting mechanism in an embodiment of the present invention. Detailed Implementation

[0037] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0038] This invention provides a fully automated silicon material constant temperature cleaning system, such as... Figure 1 As shown, it includes: sorting subsystem 1, pre-washing subsystem 2, acid washing subsystem 3, final water washing subsystem 4, drying subsystem 5, and constant temperature control subsystem 6;

[0039] The sorting subsystem 1 is used to sort silicon material; the sorted silicon material is sequentially conveyed to the pre-washing subsystem 2, acid washing subsystem 3, final water washing subsystem 4, and drying subsystem 5 for pre-washing, acid washing, final water washing, and drying respectively; the constant temperature control subsystem 6 controls the temperature of the cleaning solution and the drying temperature in the pre-washing subsystem 2, acid washing subsystem 3, final water washing subsystem 4, and drying subsystem 5.

[0040] This embodiment of the fully automated silicon material constant temperature cleaning system comprises a sorting subsystem 1, a pre-washing subsystem 2, an acid washing subsystem 3, a final water washing subsystem 4, and a drying subsystem 5. These subsystems perform sorting, pre-washing, acid washing, final water washing, and drying of the silicon material to obtain raw materials that meet the requirements of the crystal pulling process, ensuring the quality of the monocrystalline silicon rods produced by the crystal pulling process. Specifically, the sorting subsystem 1 sorts the silicon material to ensure its uniformity (particle size, degree of contamination, etc.). The pre-washing subsystem 2 aims to remove large dust particles, loosely attached dirt, and some oil stains; this can be achieved by soaking or spraying with an alkaline solution (such as diluted KOH or a special alkaline cleaning agent) to remove organic grease and some particles. At this point, the water temperature may be slightly higher (e.g., 50-70°C) to enhance the effect; the goal of the acid pickling subsystem is to deeply remove metallic impurities, oxides, and partially embedded particles, which is the most critical and effective decontamination step; RCA SC-1 Standard Cleaning (APM): Ammonia, hydrogen peroxide, ultrapure water (typical ratio NH4OH:H2O2:H2O = 1:1:5 ~ 1:2:7). Performed at 70-80°C. Function: Micro-etches the silicon surface, removing particulate matter (through oxidation / complexation), some metal ions (such as Cu, Ag, Au, Ni), and forming a hydrophilic surface. H2O2 oxidizes metals, and NH4OH dissolves oxides and complexed metal ions. HF Rinse (DHF): Diluted hydrofluoric acid (HF:H2O = 1:10 ~ 1:100). Function: Quickly and thoroughly removes the silicon dioxide layer from the silicon surface. HF hardly corrodes elemental silicon. It can also dissolve some metallic impurities attached to SiO2. After this step, the silicon surface becomes hydrophobic. RCA SC-2 Standard Cleaning (HPM): Hydrochloric acid, hydrogen peroxide, ultrapure water (typical ratio HCl:H2O2:H2O = 1:1:6 ~ 1:2:8). Performed at 70-80°C. Purpose: Effectively removes alkali metal ions (Na⁺, K⁺, etc.) and heavy metal ions (Fe³⁺, Zn²⁺, Al³⁺, etc.). HCl provides Cl⁻ ions to complex metal cations, and H2O2 maintains an oxidizing environment to prevent metal redeposition. After each acid pickling step, a thorough rinse with a large, continuous supply of ultrapure water (UPW) is necessary to completely remove the acid and dissolved contaminants, preventing cross-contamination and subsequent reactions. Rinsing is typically performed using overflow, spraying, or megasonic-assisted methods. The resistivity of the ultrapure water needs to reach 18.2 MΩ·cm (25°C); the final water washing subsystem 4 aims to ensure the complete removal of all cleaning chemical residues by using a large volume of high-speed flowing ultrapure water for prolonged, multi-stage (e.g., 3-5 stages) countercurrent or overflow rinsing. This is often combined with megasonic technology, utilizing the cavitation effect (the bursting of tiny bubbles generated by high-frequency sound waves) to powerfully strip away particles and residues. The water temperature may be controlled within a certain range to optimize the effect.The purpose of drying subsystem 5 is to thoroughly remove moisture from the silicon surface, preventing watermarks (which may contain impurity ions) and new oxidation. Drying can be achieved by blowing with hot nitrogen / clean air: using a highly efficient filtered, dry, clean, inert gas (such as nitrogen) or compressed air to purge the surface. Gas purity and temperature must be controlled. During pre-cleaning, acid washing, final water washing, and drying processes, the temperature of the cleaning solution and air must be controlled to ensure consistent contaminant removal efficiency, controllable reaction endpoints, and the activity of the cleaning solution. Temperature control subsystem 6 maintains a constant temperature for the cleaning solution and drying temperature in pre-cleaning subsystem 2, acid washing subsystem 3, final water washing subsystem 4, and drying subsystem 5.

[0041] Upon arrival at the factory, silicon material may be contaminated to varying degrees due to factors such as transportation and production, resulting in inconsistent silicon material. Therefore, sorting is necessary. In one embodiment, the sorting subsystem includes:

[0042] The image acquisition module is used to acquire a first image of the screening platform after the storage silo discharges material to the screening platform. The storage silo stores silicon material, which is added to the silo by a silicon material adding device after entering the site. The silicon material is sorted in batches by controlling the discharge of the discharge silo. The image acquisition module captures a first image of the screening platform after each discharge from the storage silo to the screening platform using the configured image acquisition device.

[0043] The analysis module is used to analyze the first image to determine whether there are any rejection regions and to locate the rejection regions. Specifically, the analysis and determination of rejection regions involves dividing the first image into a pre-configured grid, comparing the wind-cut region image with images in a pre-configured standard library, and determining whether a region is identified as a rejection region based on the analysis results associated with the standard images that match the comparison in the standard library. The location of rejection regions involves determining the position of the region image identified as a rejection region in the first image, and thus determining the position of the region image corresponding to the screening platform.

[0044] The rejection mechanism control module controls the rejection mechanism to remove silicon material from the rejection area and place it into the corresponding temporary storage box. The rejection mechanism removes the silicon material from the rejection area from the screening platform and places it into the corresponding temporary storage box to ensure the consistency of silicon material on the screening platform and in the temporary storage box.

[0045] Among them, such as Figure 2As shown, the rejection mechanism includes: a positioning and moving structure 12 disposed between the screening platform 11 and the storage bin 10, a telescopic structure 13 disposed on the moving platform 121 of the positioning and moving structure 12, and a covering structure 14 disposed at the end of the telescopic structure 13; wherein, the positioning and moving structure 12 includes: a first guide rail 123 disposed in parallel, a second guide rail 122 disposed at both ends on the first guide rail 123, and a moving platform 121 disposed on the second guide rail 122;

[0046] like Figure 3As shown, the covering structure 14 includes: a mounting base 141, an annular cover 142 disposed on the outer periphery of the mounting base 141, and a guide head 143 embedded on the outer periphery of the annular cover 142; limiting bodies 144 are respectively provided on the outer periphery of the annular cover 142 and on both sides of the guide head 143; an arc-shaped guide rail 145 is provided on the outer side of the annular cover 142, and the two ends of the arc-shaped guide rail 145 are respectively fixedly connected to the side of the limiting body 144 away from the guide head 143; a sliding body 146 is respectively provided near both ends of the arc-shaped guide rail 145. 146 is fixedly connected to the rotating end of the rotating structure 148 disposed on the mounting base 141 via the connecting body 147. There are two rotating structures 148, which correspond one-to-one with the sliding body 146 and are stacked one on top of the other. An arc-shaped elastic body 149 is fixedly disposed on the sliding body 146. The elastic body 149 passes through the space between the limiting body 144 and the annular cover 142. The guide head 143 has snap-fit ​​grooves 1431 on both sides, which are used to snap-fit ​​with the ends of the elastic body 149. The guide head 143 is configured to extend and retract outward from the annular cover. The extension and retraction of the guide head 143 are achieved by setting a telescopic rod in the mounting cavity of the annular cover 142 for embedding the guide head 143. The extension of the telescopic rod pushes the guide head 143 to extend; the retraction of the telescopic rod makes the guide head 143 retract into the mounting cavity. In addition, to ensure structural stability, multiple reinforcing ribs are provided between the base 141 and the annular cover 142. To facilitate the outward drainage of silicon material when the cover mechanism 14 moves on the screening platform, the guide head is equipped with a pointed tip. The specific working steps are as follows: after the elastomer engages with the guide head's engagement groove, the telescopic rod extends, pushing the guide head 143 to extend. Simultaneously, the rotating mechanism continues to rotate, pushing the elastomer further towards the guide head. This creates a distinct pointed tip on one side of the annular cover 142, enabling the outward drainage of silicon material when the cover mechanism 14 moves on the screening platform. Furthermore, the lowest point of the embedding cavity is a certain distance from the lowest point of the annular cover 142, which can be any value between 1cm and 5cm. This ensures that the contact between the annular cover 142 and the screening platform 11 is circular, facilitating close contact. Additionally, when the two are close, the first and second guide rails can be moved slightly left and right to ensure the final close contact effect. The elastomer 149 can be made of a metal material with shape memory. Of course, the lower end of the elastomer 149 must be flush with the lower end of the annular cover 142.

[0047] A baffle plate 15 is provided around the outer perimeter of the screening platform 11; multiple temporary storage frames 16 are configured and located outside the baffle plate 15; a gate 17 is provided on the baffle plate 15 at the position corresponding to the temporary storage frame 16; such as Figure 4As shown, a notch is formed at the joint position of the two gate bodies of gate 17 on the side near the screening platform 11, which is adapted to the tip of the guide head. When the covering structure 14 moves on the screening platform, the guide head 143 first engages with the notch of gate 17, which is equivalent to cutting into the gate. Then, when the covering structure 14 moves outward from the gate, the elastic guide head, the elastic body, and the annular covering body 142 continuously push the gate body to contract to both sides. When the covering structure 14 moves outward, the gate is reset and closed under the operation of the internal reset structure; the reset structure can be realized by a spring.

[0048] To achieve automatic feeding of silicon material to the next sorting process after rejection on the screening platform, such as... Figure 5 As shown, an electrically controlled telescopic rod 18 is hinged to the lower part of one side of the screening platform 11, and a fixed rod 19 is hinged to the other side; a first discharge chute 20 is provided on the baffle plate 15 near the fixed rod 19. After rejection, the electrically controlled telescopic rod 18 extends a certain length, causing the screening platform to tilt; then the electrically controlled telescopic rod 18 is controlled to extend and retract up and down by a certain range, causing the silicon material on the screening platform to slide out from the first discharge chute 20 into the sorting mechanism.

[0049] The above-described rejection operation removes silicon material that is heavily contaminated or contains obvious foreign objects. Furthermore, the configuration of the storage silo 10 is also crucial. The storage silo 10 has multiple discharge ports at its lower part. After quantitative discharge control of these ports, a corresponding dropping area can be formed on the screening platform, and these dropping areas do not overlap. The annular cover 142 is configured to fit the size of the dropping area. This configuration simplifies the analysis of the rejection area, and the quantitative dropping can be controlled to the maximum thickness of the silicon material after dropping, ensuring the accuracy of the first image analysis without the need for silicon material spreading. The quantitative control parameters are determined by the staff through multiple tests on each machine. Additionally, to facilitate staff adjustments, the height of the storage silo 10 and the screening platform can be configured to be adjustable; for example, the storage silo 10 can be raised and lowered using a lifting mechanism.

[0050] In order to control the sorting mechanism and the temperature control subsystem, the image acquisition module is also used to acquire a second image from the image acquisition device after the rejection area is rejected.

[0051] The analysis module is also used to analyze the second image to determine the parameter information of the silicon material; the parameter information includes: silicon material type, particle size, etc.

[0052] The sorting mechanism control module is used to control the actions of the sorting mechanism based on parameter information.

[0053] The communication module is used to send parameter information to the constant temperature control subsystem.

[0054] Among them, such as Figure 6 and Figure 7 As shown, the sorting mechanism includes: a main body 21 and a telescopic column 22 disposed at the lower end of the main body 21; multiple feed chutes 23 and a second discharge chutes 24 are disposed on both sides of the main body 21; the feed chutes 23 and the discharge chutes 24 are arranged sequentially from top to bottom; a vertical guide rail 25 is fixedly disposed on the inner side wall between adjacent feed chutes 23, and another vertical guide rail 25 is disposed on the inner side wall of the corresponding side; an insertion groove is disposed on the sliding platform of the vertical guide rail; insertion bodies are hinged on both sides of the screen plate 26; the insertion bodies are inserted into the insertion grooves; the holes of the screen plates disposed from top to bottom in the main body 21 decrease in size sequentially; the end of the feed chutes 23 is disposed in the middle of the screen plate 26; the starting end of the second discharge chutes 24 is disposed below the screen plate and close to the nearest hinge position. The sorting mechanism control module controls the actions of the sorting mechanism based on parameter information. Primarily, it selects the feed chute 23 according to particle size to guide the particle into the sieve plate corresponding to the maximum particle size. It controls the extension and retraction of the telescopic column 22 to achieve the lifting and lowering of the main body and docking with the first discharge chute of the rejection mechanism. The sorting mechanism performs hierarchical sieve screening to separate different particle sizes; then, different particles are output via the second discharge chute. The sieve plate adopts a plug-in design, which facilitates the sieve plate tilting and the sliding platform slightly moving up and down when the sliding platform is not aligned with the vertical guide rail. The silicon material moves from the sieve plate to the second discharge chute. Furthermore, the vertical guide rail furthest from the second discharge chute moves more vertically than the other vertical guide rail. Depending on the subsequent process configuration, materials of different particle sizes and types are output to their corresponding positions. In multi-cleaning equipment production lines, when multiple pre-cleaning devices exist in the pre-cleaning subsystem, each device processes one type and one particle size of silicon material. Through sorting and adaptive processing, optimal processing efficiency and reagent usage can be ensured, effectively reducing reagent consumption. Multiple material conveyor belts are installed on one side of the second discharge chute to receive the material discharged from it. In a single-cleaning equipment production line, equipment parameters need to be adjusted according to the silicon material parameters, including a combination of parameters such as temperature, reagent concentration, spray speed, and conveyor belt speed.

[0055] To achieve constant temperature control, the constant temperature control subsystem includes:

[0056] Multiple sensing modules are used to sense the temperature of the pre-wash subsystem, pickling subsystem, final water washing subsystem, and drying subsystem, respectively; the sensing modules can be configured as temperature sensors to detect the temperature through detection.

[0057] The temperature control module is used to determine the temperature control parameters based on the sensed temperature and the set control temperature.

[0058] Multiple execution modules are used to control the actions of the actuators in the pre-wash subsystem, acid wash subsystem, final water wash subsystem, and drying subsystem based on temperature control parameters. These execution modules can be configured as electrically heated components to heat water or gas for output.

[0059] To ensure the control temperature is determined, the fully automatic silicon material constant temperature cleaning system also includes a control temperature determination module, which is used to determine the control temperature of each of the pre-washing subsystem, acid washing subsystem, final water washing subsystem, and drying subsystem based on the parameter information sent by the communication module.

[0060] The present invention also provides a constant temperature cleaning device, comprising: a sorting device, a pre-washing device, an acid washing device, a final washing device, a drying device, multiple conveying devices, and a central control cabinet;

[0061] The central control cabinet is equipped with any of the aforementioned fully automated silicon material constant temperature cleaning systems. The conveying equipment can be a material conveyor belt, which is a key piece of equipment connecting each stage. It transports the material output from the sorting mechanism to the conveyor belt of the pre-washing equipment, and then, after pre-washing, it is conveyed to the conveyor belt of the acid washing equipment, until it is moved from the drying equipment to the storage workshop for container storage.

[0062] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A fully automatic silicon material constant temperature cleaning system, characterized in that, include: The system comprises a sorting subsystem, a pre-washing subsystem, an acid washing subsystem, a final water washing subsystem, a drying subsystem, and a constant temperature control subsystem. The sorting subsystem is used to sort silicon material. The sorted silicon material is then sequentially transported to the pre-washing subsystem, acid washing subsystem, final water washing subsystem, and drying subsystem for pre-washing, acid washing, final water washing, and drying, respectively. The constant temperature control subsystem controls the temperature of the cleaning solution and the drying temperature in the pre-washing subsystem, acid washing subsystem, final water washing subsystem, and drying subsystem.

2. The fully automated silicon material constant temperature cleaning system as described in claim 1, characterized in that, The sorting subsystem includes: The image acquisition module is used to acquire the first image of the image acquisition device that takes pictures of the screening platform after the material is discharged from the storage silo to the screening platform. The analysis module is used to analyze the first image to determine whether there is a region to be removed and to locate the region to be removed. The rejection mechanism control module is used to control the rejection mechanism to remove the rejection area into the corresponding temporary storage box.

3. The fully automated silicon material constant temperature cleaning system as described in claim 2, characterized in that, The rejection mechanism includes: a positioning and moving structure set between the screening platform and the storage bin, a telescopic structure set on the moving platform of the positioning and moving structure, and a covering structure set at the end of the telescopic structure; The positioning and moving structure includes: a first guide rail arranged in parallel, a second guide rail with both ends respectively set on the first guide rail, and a moving platform set on the second guide rail; The covering structure includes: a mounting base, an annular covering body disposed on the outer periphery of the mounting base, and a flow guide head embedded on the outer periphery of the annular covering body; limiting bodies are respectively disposed on the outer periphery of the annular covering body and on both sides of the flow guide head; an arc-shaped guide rail is disposed on the outer side of the annular covering body, with both ends of the arc-shaped guide rail being fixedly connected to the side of the limiting body away from the flow guide head; a sliding body is disposed near both ends of the arc-shaped guide rail, and the sliding body is fixedly connected to the rotating end of a rotating structure disposed on the mounting base through a connecting body, wherein there are two rotating structures, each corresponding to one of the sliding bodies and stacked one on top of the other; an arc-shaped elastic body is fixedly disposed on the sliding body; the elastic body passes through the space between the limiting body and the annular covering body; the flow guide head has snap-fit ​​grooves on both sides for snapping with the ends of the elastic body; the flow guide head is configured to extend and retract outward from the annular covering body.

4. The fully automatic silicon material constant temperature cleaning system as described in claim 3, characterized in that, A baffle plate is provided on the outer periphery of the screening platform; multiple temporary storage frames are configured and located on the outside of the baffle plate; a gate is provided on the baffle plate at the position corresponding to the temporary storage frame; a notch is formed at the joint position of the two gates of the gate and on the side closer to the screening platform to adapt to the tip of the guide head.

5. The fully automated silicon material constant temperature cleaning system as described in claim 3, characterized in that, An electrically controlled telescopic rod is hinged to the lower part of one side of the screening platform, and a fixed rod is hinged to the other side; a first discharge chute is provided on the baffle plate near the fixed rod.

6. The fully automated silicon material constant temperature cleaning system as described in claim 2, characterized in that, The image acquisition module is also used to acquire a second image from the image acquisition device after the rejected area has been rejected; The analysis module is also used to analyze the second image to determine the parameter information of the silicon material; The sorting mechanism control module is used to control the actions of the sorting mechanism based on parameter information. The communication module is used to send parameter information to the constant temperature control subsystem.

7. The fully automated silicon material constant temperature cleaning system as described in claim 2, characterized in that, The sorting mechanism includes: a main body and a telescopic column located at the lower end of the main body; multiple feed chutes and a second discharge chutes are provided on both sides of the main body; the feed chutes and the second discharge chutes are arranged sequentially from top to bottom; a vertical guide rail is fixedly installed on the inner side wall between adjacent feed chutes, and another vertical guide rail is installed on the inner side wall of the corresponding side; an insertion slot is provided on the sliding platform of the vertical guide rail; insertion bodies are hinged on both sides of the screen plate; the insertion bodies are inserted into the insertion slots; the holes of the screen plate arranged from top to bottom in the main body decrease in size sequentially; the end of the feed chute is located in the middle of the screen plate; the starting end of the second discharge chute is located below the screen plate and close to the nearest hinge position.

8. The fully automated silicon material constant temperature cleaning system as described in claim 1, characterized in that, The temperature control subsystem includes: Multiple sensing modules are used to sense the temperature of the pre-wash subsystem, pickling subsystem, final water washing subsystem, and drying subsystem, respectively; The temperature control module is used to determine the temperature control parameters based on the sensed temperature and the set control temperature. Multiple execution modules are used to control the actions of the actuators in the pre-washing subsystem, acid washing subsystem, final water washing subsystem, and drying subsystem based on temperature control parameters.

9. The fully automated silicon material constant temperature cleaning system as described in claim 8, characterized in that, Also includes: The temperature control module is used to determine the control temperature of each of the pre-wash subsystem, pickling subsystem, final water washing subsystem, and drying subsystem based on the parameter information sent by the communication module.

10. A constant temperature cleaning device, characterized in that, include: Sorting equipment, pre-washing equipment, pickling equipment, final washing equipment, drying equipment, multiple conveying equipment and central control cabinet; The controller in the central control cabinet is equipped with a fully automatic silicon material constant temperature cleaning system as described in any one of claims 1 to 9.

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