Embedded integrated distribution automation terminal

Abstract

The invention discloses an embedded integrated power distribution automation terminal, and belongs to the technical field of electric power automation equipment, the embedded integrated power distribution automation terminal comprises a case, a partition plate is fixed in the case, the interior of the case is divided into an integration area and a cooling area through the partition plate, and a plurality of supporting plates are fixed in the integration area of the case; switch integration assemblies are fixed to the top faces of the multiple supporting plates and comprise switch assemblies and heat dissipation assemblies, the switch assemblies are covered with the heat dissipation assemblies, and cooling assemblies matched with the heat dissipation assemblies to work are arranged in the cooling area of the case; the cooling assembly comprises a plurality of sets of heat conduction parts arranged in the partition plate in a penetrating mode and a circulation part arranged in the cooling area. The heat conduction part of the elastic cavity structure penetrates through the partition plate, expansion is achieved by filling the cooling medium through the circulation part, when the internal operation temperature of the partial area of the terminal exceeds a threshold value, the heat conduction part can be further filled with liquid in a targeted mode, the filling amount of the cooling medium is increased, and the heat dissipation efficiency and effect are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power automation equipment, and more particularly to an embedded integrated power distribution automation terminal. BACKGROUND

[0002] With the rapid development of power electronics technology, power electronic components are evolving towards integration, miniaturization and high power density, laying a solid foundation for the performance upgrade of power distribution automation terminals and supporting switching devices. As the core node equipment of the smart grid, the power distribution automation terminal integrates functions such as data acquisition, fault detection, remote control, and is deeply connected with the switching device. The switching device is the key execution unit for executing instructions from the terminal, directly receiving control signals such as fault isolation and load switching from the terminal, and together they form the core control system of the power distribution system. This system is mainly used for real-time monitoring of power distribution line operation state, and when a fault is detected, the terminal quickly locates the fault position and issues accurate instructions, and the switching device quickly executes fault isolation operation. The overall stability and reliability of the system directly determine the power supply quality and continuity of the power distribution system.

[0003] As known in the industry, in a high-current low-voltage power distribution automation terminal, due to the use of high-capacity frame circuit breakers for electrical components, the maximum size of the main busbar reaches eight copper bars (also known as busbars) per phase. Therefore, the heat generated by the switching device located inside the high-current low-voltage power distribution automation terminal is very serious.

[0004] In order to ensure the reliability of the system power supply and the ventilation and heat dissipation effect of the cabinet without reducing the protection level of the above-mentioned power distribution automation terminal, a large number of ventilation holes are punched on the top wall of the switching device, and the heat in the cabinet is dissipated to the outside in a convection manner through the ventilation holes. This measure has been proven to be effective, especially in small current (low current) systems, which is simple and practical. However, simple top opening cannot meet the requirements of the power distribution automation terminal for waterproof and dustproof of the switching device.

[0005] In view of this, we propose an embedded integrated power distribution automation terminal with a targeted and efficient heat dissipation structure. SUMMARY

[0006] The technical problem to be solved is to provide an embedded integrated power distribution automation terminal that solves the technical problems raised in the background.

[0007] Technical solution: The technical scheme of the application provides an embedded integrated power distribution automation terminal, which comprises a case, a partition plate is fixed in the case, an integrated area and a cooling area are arranged in the case by the partition plate, a plurality of support plates are fixed in the integrated area of the case, switch integrated assemblies are fixed on the top surfaces of the plurality of support plates, the switch integrated assemblies comprise switch assemblies and heat dissipation assemblies, the heat dissipation assemblies are arranged outside the switch assemblies, a cooling assembly that cooperates with the heat dissipation assemblies is arranged in the cooling area of the case, the cooling assembly comprises a plurality of heat conduction components that are arranged through the partition plate and a circulating component that is arranged in the cooling area, the circulating component is connected through the plurality of heat conduction components, the heat conduction components are used for heat transfer between the integrated area and the cooling area, the heat conduction components are elastic cavity structures, the elastic cavity structures of the heat conduction components are filled with cooling medium through the circulating component, and the heat dissipation assemblies are sleeved on the outer walls of the heat conduction components. The heat dissipation assembly comprises a blocking cover that is fixed on the top surface of the switch assembly, a clamping guide component is arranged through the blocking cover, the clamping guide component comprises a heat dissipation plate that is fixed on the top surface of the blocking cover, a plurality of heat dissipation fins are fixed on the bottom surface of the heat dissipation plate, a heat dissipation ring is connected to one side of the heat dissipation plate, the heat dissipation ring is connected to the outside of the blocking cover in a penetrating mode, the heat dissipation ring is made of a memory alloy material that can expand under the action of heat, the heat dissipation ring is sleeved on the outer wall of the heat conduction component, and is used for abutting against the heat conduction component and transferring heat in the blocking cover to the heat conduction component.

[0008] Further, the heat conduction component has three states by being filled with different amounts of cooling medium and the heat dissipation ring. In the first state, the heat conduction component is not filled with cooling medium, and the outer wall of the heat conduction component is arranged in a gap fit mode with the inner wall of the heat dissipation ring. In the second state, the heat conduction component is filled with cooling medium to preliminarily expand, so that the outer wall of the heat conduction component is tightly abutted against the inner wall of the heat dissipation ring in the unexpanded state. In the third state, the heat conduction component is filled with cooling medium to further expand, so that the outer wall of the heat conduction component is tightly abutted against the inner wall of the heat dissipation ring in the expanded state.

[0009] Further, the clamping guide component further comprises a heat dissipation plate that is fixed on the top surface of the blocking cover, a plurality of heat dissipation fins are fixed on the bottom surface of the heat dissipation plate, and a heat dissipation ring is connected to one side of the heat dissipation plate.

[0010] Further, the heat conduction component comprises a first fixed plate that is fixed through the partition plate, an expansion guide cylinder is connected to one side of the first fixed plate, the expansion guide cylinder is an elastic cavity structure, a liquid inlet pipe and a liquid outlet pipe are connected in a penetrating mode to one side of the expansion guide cylinder, the liquid inlet pipe and the liquid outlet pipe are connected through the first fixed plate, and the liquid inlet pipe and the liquid outlet pipe are connected in a penetrating mode to the inside of the circulating component.

[0011] Further, the heat-conducting component further comprises an inner cylinder fixed to the inside of the expansion cylinder, an annular inner cavity is formed between the outer wall of the inner cylinder and the inner wall of the expansion cylinder, one end of the liquid inlet pipe is connected to one side of the inner cylinder, one end of the liquid outlet pipe is connected to the annular inner cavity, and a through hole is formed in the outer wall of the inner cylinder away from the end of the liquid outlet pipe.

[0012] Further, the circulating component comprises a liquid storage tank fixed to the bottom of the cooling area of the cabinet, the top surface of the liquid storage tank is connected with a first electromagnetic pump and a second electromagnetic pump, the top end of the first electromagnetic pump is connected with a liquid outlet pipe, the top end of the second electromagnetic pump is connected with a liquid inlet pipe, the liquid outlet pipe is connected between the plurality of liquid inlet pipes on one side, and the liquid inlet pipe is connected between the plurality of liquid outlet pipes on one side.

[0013] Further, the switch assembly comprises a mounting box fixed to the top surface of the support plate, an installation plate is fixed to the inside of the mounting box, a plurality of high-voltage switches are arranged on the top surface of the installation plate, a third fixing plate is fixed to both sides of the installation plate, and the blocking cover is fixed to the top of the mounting box.

[0014] Further, the mounting box is a box body structure with the front and top being connected, the blocking cover is fixed to the front and top of the mounting box, the front wall of the blocking cover is connected with a fixing bolt, and one end of the fixing bolt is connected to the inside of the third fixing plate.

[0015] Further, the heat dissipation assembly further comprises a pressure guide component connected to the inside of the blocking cover, the pressure guide component is of a heat-conducting structure, the pressure guide component is elastically and slidingly connected to the inside of the blocking cover, one side of the pressure guide component is arranged in abutment with the heat dissipation ring, the pressure guide component is arranged on the top of the high-voltage switch, and the pressure guide component is expanded by heat dissipation ring to push down, so that the pressure guide component is abutted on the top surface of the high-voltage switch.

[0016] Further, the pressure guide component comprises a lifting plate slidingly connected to the inside of the blocking cover, the lifting plate is of a three-section bending structure, a pressing plate is fixed to the top surface of the lifting plate, the pressing plate is made of a same heat-expandable memory alloy material as the heat dissipation ring, the pressing plate is abutted on the bottom surface of the heat dissipation ring, an elastic plate is fixed to the bottom surface of the lifting plate, a pressure guide plate is fixed to the bottom surface of the elastic plate, the pressure guide plate is arranged on the top of the high-voltage switch, two sealing plates are sleeved on the outer wall of the lifting plate, the two sealing plates are slidingly connected to the inner wall and the outer wall of the blocking cover, respectively, two guide rods are connected to the bottom surface of one side of the lifting plate, a second fixing plate is sleeved between the outer walls of the two guide rods, the second fixing plate is fixed to the outer wall of the blocking cover, and springs are sleeved on the outer walls of the guide rods.

[0017] Further, the pressure guide component further comprises a temperature sensor arranged in the inside of the pressure guide plate, the bottom surface of the temperature sensor is a abutting detection surface, and the abutting detection surface of the temperature sensor is arranged flush with the bottom surface of the pressure guide plate.

[0018] Beneficial effects: one or more technical solutions provided in the technical scheme have at least the following technical effects or advantages: 1. The switch assembly is enclosed by a barrier cover, meeting the waterproof and dustproof requirements of the switch structure and ensuring the safety of the switch assembly.

[0019] 2. The barrier cover has a heat dissipation plate, heat dissipation fins, and a heat dissipation ring to dissipate heat from the top of the switch assembly, ensuring the heat dissipation effect of the switch assembly.

[0020] 3. The heat dissipation ring of the heat dissipation assembly is connected to the heat conduction component, allowing the heat inside the barrier cover to be quickly dissipated, improving the cooling effect inside the switch assembly.

[0021] 4. The internal space of the case is divided into an integrated area and a cooling area by a partition, avoiding heat diffusion and improving the targetedness of heat dissipation.

[0022] 5. The heat conduction component of the elastic cavity structure penetrates the partition, and the cooling medium is filled through the circulating component to achieve expansion, forming three states with the heat dissipation ring made of memory alloy material: gap fit between the heat conduction component and the heat dissipation ring when not filled with liquid, facilitating installation; after initial liquid expansion, the heat dissipation ring is tightly attached to the expanded heat dissipation ring, achieving basic heat exchange and ensuring heat dissipation effect; when the internal temperature of the terminal part exceeds the threshold value, the heat conduction component can be further filled with liquid to increase the amount of cooling medium, increase the heat exchange area, and improve the heat dissipation efficiency and effect.

[0023] 6. The heat dissipation ring made of memory alloy material can automatically expand when reaching the phase change temperature, increasing the amount of cooling medium filled, causing the heat conduction component to expand and adaptively attach to the heat dissipation ring, ensuring the stability of heat exchange, improving the convenience of operation, and reducing energy consumption.

[0024] 7. The expansion cylinder serves as an elastic cavity, allowing the cooling medium to enter and exit through the liquid inlet pipe and the liquid outlet pipe. The liquid inlet pipe and the liquid outlet pipe penetrate the first fixed plate and are connected to the circulating component, forming a closed loop circulation path to avoid medium backflow and enhance heat exchange stability.

[0025] 8. The expansion degree of the expansion cylinder is precisely adjusted by controlling the liquid inlet amount to adapt to different states of the heat dissipation ring, allowing adjustment for switch assemblies with different heat power, improving the targeting and flexibility of operation.

[0026] 9. The inner cylinder is fixed inside the expansion cylinder, forming an annular inner cavity with the inner wall of the expansion cylinder. The liquid inlet pipe penetrates the inner cylinder, and the cooling medium enters the annular inner cavity through the through hole in the inner cylinder, prolonging the flow path and contact time. The annular inner cavity uniformly distributes the cooling medium to avoid dead zones, and the inner cylinder supports the inner wall of the expansion cylinder to evenly distribute the stress when it expands, preventing local damage.

[0027] 10. The pressure guide component is a heat-conducting structure, which is normally arranged at a distance from the high-voltage switch to avoid accidental triggering, and when the heat dissipation ring expands due to heat, it pushes the pressure guide component down to make it adhere to the top surface of the high-voltage switch, and the pressure guide component directly absorbs the heat of the high-voltage switch and transfers it to the heat dissipation ring, shortening the heat conduction path, improving the heat dissipation response speed of the high-voltage switch, and avoiding overheating damage.

[0028] 11. The temperature sensor is arranged inside the pressure guide plate, and the bottom surface is flush with the detection surface and the bottom surface of the pressure guide plate. When the pressure guide plate is attached to the high-voltage switch, the temperature sensor is attached synchronously, directly monitoring the actual temperature of the high-voltage switch, and accurately transmitting monitoring data to the main controller, providing a basis for flow regulation of the cooling medium. Normally, the temperature sensor is arranged at a distance from the high-voltage switch to avoid false monitoring in low-temperature conditions. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a schematic diagram of the embedded integrated power distribution automation terminal structure of the present application.

[0030] Figure 2 It is a schematic diagram of the cooling assembly structure of the present application.

[0031] Figure 3 It is a schematic diagram of the heat-conducting component structure of the present application.

[0032] Figure 4 It is a schematic diagram of the heat dissipation assembly structure of the present application.

[0033] Figure 5 It is a schematic diagram of the connection structure of the heat dissipation assembly and the switch assembly of the present application.

[0034] Figure 6 It is a schematic diagram of the switch assembly structure of the present application.

[0035] Figure 7 It is a schematic diagram of the barrier cover structure of the present application.

[0036] Figure 8 It is a cross-sectional view of the internal structure of the heat dissipation assembly of the present application.

[0037] Figure 9 It is a schematic diagram of the connection structure of the card guide component and the pressure guide component of the present application.

[0038] Figure 10 It is a cross-sectional view of the connection structure of the heat-conducting component and the heat dissipation assembly in the third state of the present application.

[0039] Label explanation: 100, case; 200, support plate; 300, partition; 400, cooling assembly; 410, liquid storage tank; 420, first electromagnetic pump; 430, liquid outlet pipe; 440, second electromagnetic pump; 450, liquid inlet pipe; 460, heat conduction component; 461, expansion duct; 462, first fixed plate; 463, liquid inlet pipe; 464, liquid outlet pipe; 465, inner cylinder; 4651, through hole; 500, heat dissipation assembly; 510, blocking cover; 511, fixed bolt; 520, clamping guide component; 521, heat dissipation plate; 522, heat dissipation fin; 523, heat dissipation ring; 530, pressure guide component; 531, pressing plate; 532, lifting plate; 5321, second fixed plate; 5322, guide rod; 5323, spring; 533, sealing plate; 534, elastic plate; 535, pressure guide plate; 536, temperature sensor; 600, switch assembly; 610, mounting box; 620, mounting plate; 630, high-voltage switch; 640, third fixed plate. DETAILED DESCRIPTION

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will be combined with the drawings in the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0041] In the description of the present application, it should be understood that the terms “center”, “longitudinal”, “transverse”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, and the like indicate the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0042] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms “mounting”, “connection”, and “connection” should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0043] Reference Figures 1-10This application provides an embedded integrated power distribution automation terminal, including a chassis 100. A partition 300 is fixed inside the chassis 100, separating an integration area and a cooling area. Multiple support plates 200 are fixed inside the integration area of ​​the chassis 100, and a switch integration assembly is fixed to the top surface of each support plate 200. The switch integration assembly includes a switch assembly 600 and a heat dissipation assembly 500, with the heat dissipation assembly 500 covering the switch assembly 600. The cooling area of ​​the chassis 100 is provided with… A cooling component 400 is provided to work in conjunction with the heat dissipation component 500. The cooling component 400 includes multiple sets of heat-conducting components 460 that are disposed through the partition 300 and a circulation component disposed inside the cooling zone. The circulation component and the multiple sets of heat-conducting components 460 are connected in a through manner. The heat-conducting components 460 are used for heat transfer between the integration zone and the cooling zone. The heat-conducting components 460 have an elastic cavity structure. The elastic cavity structure of the heat-conducting components 460 is filled with a cooling medium through the circulation component. One side of the heat dissipation component 500 is sleeved on the outer wall of the heat-conducting components 460. The heat dissipation assembly 500 includes a barrier cover 510 fixed to the top surface of the switch assembly 600. A guide component 520 is disposed inside the barrier cover 510. The guide component 520 includes a heat dissipation ring 523 that is connected to the outside of the barrier cover 510. The heat dissipation ring 523 is made of a heat-expandable shape memory alloy material. The heat dissipation ring 523 is sleeved on the outer wall of the heat-conducting component 460 to fit the heat-conducting component 460 and transfer the heat inside the barrier cover 510 to the heat-conducting component 460. The heat-conducting component 460 is configured in three states by filling different amounts of cooling medium with the heat dissipation ring 523. In the first state, the heat-conducting component 460 is not filled with cooling medium, and the outer wall of the heat-conducting component 460 and the inner wall of the heat dissipation ring 523 are configured with a clearance fit. In the second state, the heat-conducting component 460 is filled with cooling medium and initially expands so that the outer wall of the heat-conducting component 460 expands and fits tightly against the inner wall of the heat dissipation ring 523 in the unexpanded state. In the third state, the heat-conducting component 460 is filled with cooling medium and expands further, so that the outer wall of the heat-conducting component 460 expands and fits tightly with the inner wall of the heat dissipation ring 523 in the expanded state. By enclosing the switch assembly with a barrier cover, the waterproof and dustproof requirements of the switch structure are met, ensuring the safety of the switch assembly. The shielding cover contains a heat sink, heat fins, and heat dissipation rings to conduct heat away from the top of the switching assembly, ensuring effective heat dissipation for the switching assembly. By connecting the heat dissipation ring of the heat dissipation component to the heat conduction component, the heat inside the barrier cover can be quickly dissipated, thereby improving the cooling effect inside the switching component. The internal space of the chassis 100 is divided into an integration area and a cooling area by the partition 300, which avoids heat dissipation and improves the effectiveness of heat dissipation. The heat-conducting component 460 of the elastic cavity structure penetrates the partition 300 and expands by being filled with cooling medium through the circulation component. It forms three mating states with the heat dissipation ring 523 made of shape memory alloy: when not filled with liquid, the heat-conducting component 460 and the heat dissipation ring 523 are in a gap fit for easy installation; after initial filling and expansion, it fits tightly with the unexpanded heat dissipation ring 523 to achieve basic heat exchange and ensure heat dissipation effect; when the internal operating temperature of the terminal area exceeds the threshold, the heat-conducting component 460 can be further filled with liquid to increase the amount of cooling medium, increase the heat exchange area, and improve heat dissipation efficiency and effect. By using a heat dissipation ring 523 made of shape memory alloy, it can automatically expand when the phase change temperature is reached and increase the amount of cooling medium charged, so that the heat-conducting component 460 expands and adaptively fits the heat dissipation ring 523, ensuring the stability of heat exchange, improving the convenience of operation, and reducing energy consumption. The heat dissipation component 500 is sealed and fixed to the top of the switch assembly 600 to reduce heat loss and facilitate heat dissipation by concentrating it into the heat dissipation ring 523.

[0044] In this embodiment, the card guide component 520 further includes a heat dissipation plate 521 fixed to the top surface inside the barrier cover 510. Multiple heat dissipation fins 522 are fixed to the bottom surface of the heat dissipation plate 521, and a heat dissipation ring 523 is connected to one side of the heat dissipation plate 521. The heat dissipation plate 521 is fixed to the top surface inside the barrier cover 510 to increase the heat collection area and quickly absorb the heat emitted by the switch assembly 600. Multiple heat dissipation fins 522 are vertically fixed to the bottom surface of the heat dissipation plate 521 to make the temperature distribution inside the barrier cover 510 more uniform and further expand the contact area with air to enhance heat conduction.

[0045] In this embodiment, the heat-conducting component 460 includes a first fixing plate 462 that penetrates and is fixed inside the partition 300. A guide tube 461 is connected to one side of the first fixing plate 462. The guide tube 461 has an elastic cavity structure. An inlet pipe 463 and a drain pipe 464 are connected through one side of the guide tube 461. Both the inlet pipe 463 and the drain pipe 464 penetrate and are connected inside the first fixing plate 462. The ends of the inlet pipe 463 and the drain pipe 464 away from the guide tube 461 are connected through to the inside of the circulation component. The expansion tube 461, as an elastic cavity, allows the cooling medium to enter and exit through the liquid inlet pipe 463 and the liquid outlet pipe 464. The liquid inlet pipe 463 and the liquid outlet pipe 464 pass through the first fixed plate 462 and are connected to the circulation component to form a closed-loop circulation path, which avoids medium backflow and enhances heat exchange stability. By controlling the liquid inlet volume, the expansion degree of the expansion tube 461 can be precisely adjusted to adapt to different states of the heat dissipation ring 523, and can be adjusted for the switching component 600 with different heat generation power.

[0046] In this embodiment, the heat-conducting component 460 further includes an inner cylinder 465 fixed inside the expansion cylinder 461. An annular inner cavity is formed between the outer wall of the inner cylinder 465 and the inner wall of the expansion cylinder 461. One side of the inner cylinder 465 is connected to one end of the liquid inlet pipe 463, and one end of the liquid outlet pipe 464 is connected to the annular inner cavity. A through hole 4651 is provided on the outer wall of the end of the inner cylinder 465 away from the liquid outlet pipe 464. The inner cylinder 465 is fixed inside the expansion cylinder 461, forming an annular inner cavity with the inner wall of the expansion cylinder 461. The liquid inlet pipe 463 is connected to the inner cylinder 465. The cooling medium enters the annular inner cavity through the through hole 4651 on the inner cylinder 465, extending the flow path and contact time. The annular inner cavity makes the cooling medium evenly distributed and avoids dead zones. The inner cylinder 465 supports the inner wall of the expansion cylinder 461, so that it is subjected to uniform force when it expands, preventing local damage.

[0047] In this embodiment, the circulation component includes a liquid storage tank 410 fixed to the bottom of the cooling area of ​​the chassis 100. A first electromagnetic pump 420 and a second electromagnetic pump 440 are connected to the top surface of the liquid storage tank 410. The top of the first electromagnetic pump 420 is connected to an outlet pipe 430, and the top of the second electromagnetic pump 440 is connected to an inlet pipe 450. One side of the outlet pipe 430 is connected to a plurality of inlet pipes 463, and one side of the inlet pipe 450 is connected to a plurality of drain pipes 464. The liquid storage tank 410 stores the cooling medium for easy centralized replenishment and management. The first electromagnetic pump 420 and the second electromagnetic pump 440 are responsible for the delivery and return of the medium, respectively. The flow rate of the medium is precisely controlled by adjusting the pump power. The liquid outlet pipe 430 is connected to multiple liquid inlet pipes 463, and the liquid inlet pipe 450 is connected to multiple liquid outlet pipes 464, so as to achieve uniform liquid supply to multiple sets of heat-conducting components 460. The closed-loop circulation design allows the cooling medium to be reused and reduces losses.

[0048] In this embodiment, the switch assembly 600 includes a mounting box 610 fixed to the top surface of the support plate 200, a mounting plate 620 fixed to the bottom surface inside the mounting box 610, a plurality of high-voltage switches 630 provided on the top surface of the mounting plate 620, a third fixing plate 640 fixed to both sides of the mounting plate 620, and a barrier cover 510 closed and fixed to the top of the mounting box 610. The third fixing plate 640 provides a connection point for the barrier cover 510. The barrier cover 510 is fixedly closed on the top of the mounting box 610 to form a sealed space, which isolates the high-voltage switch 630 and the mounting plate 620 from the outside world and protects them from interference from the external environment (such as humid air and dust). The barrier cover 510 serves as a carrier for the heat dissipation component 500 and fits tightly against the switch component 600 to enhance heat transfer.

[0049] In this embodiment, the mounting box 610 is a box structure with the front and top connected. The barrier cover 510 is fixedly closed to the front and top of the mounting box 610. The front wall of the barrier cover 510 is connected to a fixing bolt 511, one end of which is connected to the inside of the third fixing plate 640. The front and top of the mounting box 610 are connected, which facilitates the installation and debugging of the mounting plate 620 and the high-voltage switch 630. The barrier cover 510 simultaneously closes the front and top of the mounting box 610, forming a fully enclosed space. The fixing bolt 511 passes through the front wall of the barrier cover 510 and is connected to the inside of the third fixing plate 640, so as to achieve a firm fixation of the barrier cover 510. The bolt connection method is convenient for disassembly and assembly, and facilitates later maintenance.

[0050] In this embodiment, the heat dissipation assembly 500 further includes a pressure-conducting component 530 that penetrates and connects inside the barrier cover 510. The pressure-conducting component 530 is a heat-conducting structure. The pressure-conducting component 530 is elastically slidably connected inside the barrier cover 510. One side of the pressure-conducting component 530 is fitted with the heat dissipation ring 523. The pressure-conducting component 530 is disposed on the top of the high-voltage switch 630. The pressure-conducting component 530 is pushed down by the heat dissipation ring 523 expanding due to heat, so that the pressure-conducting component 530 fits against the top surface of the high-voltage switch 630. The pressure-conducting component 530 is a heat-conducting structure that is elastically slidably connected inside the barrier cover 510. Under normal conditions, it is spaced apart from the high-voltage switch 630 to avoid accidental triggering. When the heat dissipation ring 523 expands due to heat, it pushes the pressure-conducting component 530 down, so that it fits against the top surface of the high-voltage switch 630. The pressure-conducting component 530 directly absorbs the heat of the high-voltage switch 630 and transfers it to the heat dissipation ring 523, shortening the heat conduction path and improving the heat dissipation response speed of the high-voltage switch 630, thus avoiding overheating damage. The elastic structure adapts to the height error of the high-voltage switch 630 to ensure a tight fit.

[0051] In this embodiment, the pressure guiding component 530 includes a lifting plate 532 slidably connected inside the barrier cover 510. The lifting plate 532 has a three-section bending structure. A pressure plate 531 is fixed to the top surface of the lifting plate 532. The pressure plate 531 is made of the same heat-expandable shape memory alloy material as the heat dissipation ring 523. The pressure plate 531 is fitted to the bottom surface of the heat dissipation ring 523. An elastic plate 534 is fixed to the bottom surface of the lifting plate 532, and a pressure guiding plate 534 is fixed to the bottom surface of the elastic plate 534. 35. A pressure guide plate 535 is set on the top of the high-voltage switch 630. Two sealing plates 533 are sleeved on the outer wall of the lifting plate 532. The two sealing plates 533 are slidably connected to the inner wall and outer wall of the barrier cover 510 respectively. Two guide rods 5322 are connected to one bottom surface of the lifting plate 532. A second fixing plate 5321 is sleeved between the outer walls of the two guide rods 5322. The second fixing plate 5321 is fixed to the outer wall of the barrier cover 510. A spring 5323 is sleeved on the outer wall of the guide rods 5322. The lifting plate 532 has a three-section bending structure, which fits the internal space of the barrier cover 510 and slides smoothly without jamming, so that the pressure guide component 530 can be raised and lowered smoothly without jamming, thus improving the reliability of the operation. The pressure plate 531 uses the same shape memory alloy material as the heat dissipation ring 523, which expands synchronously when heated to ensure a tight fit with the heat dissipation ring 523. The elastic plate 534 buffers the contact pressure between the pressure guide component 530 and the high-voltage switch 630 to avoid damage to the device. The pressure guide plate 535 increases the contact area with the high-voltage switch 630 and enhances heat conduction. The sealing plate 533 is slidably connected to the inner and outer walls of the barrier cover 510 to prevent dust from entering. The spring 5323 drives the lifting plate 532 to return to its original position, maintaining the distance between the pressure guide component 530 and the high-voltage switch 630 under normal conditions.

[0052] In this embodiment, the pressure guiding component 530 further includes a temperature sensor 536 that penetrates inside the pressure guiding plate 535. The bottom surface of the temperature sensor 536 is a contact detection surface, and the contact detection surface of the temperature sensor 536 is flush with the bottom surface of the pressure guiding plate 535. The temperature sensor 536 penetrates inside the pressure guiding plate 535, and the bottom contact detection surface is flush with the bottom surface of the pressure guiding plate 535. When the pressure guiding plate 535 is in contact with the high-voltage switch 630, the temperature sensor 536 is in contact simultaneously, directly monitoring the actual temperature of the high-voltage switch 630. The monitoring data is accurately transmitted to the main controller, providing a basis for the flow regulation of the cooling medium. Under normal conditions, the temperature sensor 536 and the high-voltage switch 630 are spaced apart to avoid false monitoring under low-temperature conditions.

[0053] Specifically, according to Figures 1-10 As shown, mounting plate 620 is installed inside mounting box 610, and high-voltage switch 630 is installed and electrically connected to mounting plate 620, completing the assembly of switch assembly 600. Then, barrier cover 510 is installed and sealed on mounting box 610. At this time, pressure guide plate 535 is spaced apart from high-voltage switch 630 to prevent the temperature on high-voltage switch 630 from being directly transferred to heat sink 523 through pressure guide component 530, thus preventing excessive sensitivity and triggering heat sink 523 expansion. This triggering temperature does not represent the internal temperature of barrier cover 510, and also prevents temperature sensor 536 from directly contacting and monitoring high-voltage switch. To prevent premature triggering of the main controller to increase the cooling medium, the surface temperature of the switch 630 is controlled. The expansion tube 461 is not filled with cooling medium at first. The expansion tube 461 is made of thermally conductive elastic rubber material. At this time, the gap between the outer wall of the expansion tube 461 and the inner wall of the heat dissipation ring 523 is 5mm. This makes it easy for the heat dissipation ring 523 to be fitted onto the outer wall of the expansion tube 461 when the barrier cover 510 is installed. Then, the fixing bolt 511 is rotated and connected to the third fixing plate 640 to complete the assembly of the heat dissipation component 500 on the switch assembly 600. The same process is used to complete the assembly of the other heat dissipation components 500 on the switch assembly 600. After assembly, the first electromagnetic pump 420 is started by the main controller. The first electromagnetic pump 420 introduces the cooling medium inside the liquid storage box into the liquid outlet pipe 430. The cooling medium is insulating heat-conducting oil. The liquid outlet pipe 430 introduces the cooling medium into each inner cylinder 465 through each liquid inlet pipe 463. The cooling medium passes through the through hole 4651 into the expansion cylinder 461. Then, the cooling medium is discharged into the liquid inlet pipe 450 through the drain pipe 464. As the amount of cooling medium inside each expansion cylinder 461 increases, the expansion cylinder 461 expands and tightly adheres to the liquid. The cooling medium, which is circulated into the inlet pipe 450, is guided back to the storage tank 410. This ensures that the pressure inside the expansion tube 461 is tightly pressed against the inner wall of the cooling ring 523, and the circulating cooling medium absorbs the heat transferred to the expansion tube 461. The temperature is monitored inside the barrier cover 510 by the temperature sensor 536 on the pressure guide plate 535. The temperature sensor 536 transmits the monitoring data to the main controller. Finally, the chassis 100 is embedded and fixed in the cabinet. During terminal use, the mounting plate 620 and the high-voltage switch 630 generate heat during operation. The heat is transferred to the heat dissipation ring 523 through the heat sink 522 and the heat dissipation plate 521 inside the barrier cover 510. The pressure guide assembly as a whole transfers heat to the heat dissipation ring 523. The phase change temperature of the heat dissipation ring 523 and the pressure plate 531 is 50°C. When the temperature transferred to the heat dissipation ring 523 is below 50°C, the heat dissipation ring 523 transfers heat to the expansion cylinder 461 and uses the circulating cooling medium for cooling. When the temperature inside one or more of the barrier covers 510 rises, and the temperature transferred from the heat sink 521 to the heat sink ring 523 reaches or exceeds 50°C, the heat sink ring 523 deforms and expands. At this time, the main controller uses the temperature sensor 536 to monitor the temperature data to determine whether the temperature reaches the trigger temperature set by the main controller (set to 50°C). The main controller then controls the first magnetic pump and the second electromagnetic pump 440 to increase the circulating cooling medium and replenish the cooling medium into the expansion cylinder 461 connected to the expanded heat sink ring 523. This causes the expansion cylinder 461 to expand and remain in close contact with the expanded heat sink ring 523, improving the heat exchange efficiency and effect. Furthermore, the increased internal space of the expansion cylinder 461 and the increase in cooling medium make it easier for the cooling medium to form turbulence inside the expansion cylinder 461, allowing more cooling medium to fully exchange heat, thereby further improving the heat exchange efficiency and effect. This also enables targeted heat exchange and cooling treatment of the inside of the barrier cover 510 where the temperature rises, improving the fullness and targeting of the utilization of the cooling medium. As the heat dissipation ring 523 expands, the pressure plate 531 expands synchronously. The heat dissipation ring 523 pushes the pressure plate 531 downward, causing the lifting plate 532 to descend and attach the pressure guide plate 535 to the high-voltage switch 630. The pressure guide plate 535 directly and quickly transfers the heat from the high-voltage switch 630 to the heat dissipation ring 523 through the elastic plate 534, the lifting plate 532, and the pressure plate 531, further promoting the expansion of the heat dissipation ring 523. The heat is then quickly transferred to the expanding guide cylinder 461 through the heat dissipation ring 523, further improving the heat exchange efficiency and effect. Furthermore, the temperature sensor 536, which previously monitored the temperature intermittently, is now directly attached to the high-voltage switch 630 to monitor the temperature. This allows the temperature sensor 536 to be directly attached to monitor the temperature in the event of high temperatures, avoiding heat disturbance interference and ensuring the accuracy of temperature monitoring. This enables timely protection of the high-voltage switch 630 and improves the safety of the power distribution equipment.

[0054] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. All electrical components mentioned herein are electrically connected to the main controller and 220V AC mains power, and the main controller is a common existing technology such as a computer that performs control functions. Content not described in detail in this specification is prior art known to those skilled in the art.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An embedded integrated power distribution automation terminal, characterized in that: The device includes a chassis with a partition fixed inside. The chassis is divided into an integration area and a cooling area by the partition. Multiple support plates are fixed inside the integration area of ​​the chassis. Switch integration components are fixed on the top surface of the multiple support plates. The switch integration components include a switch component and a heat dissipation component, and the heat dissipation component is covered outside the switch component. The cooling area of ​​the chassis is equipped with a cooling component that works in conjunction with the heat dissipation component. The cooling component includes multiple sets of heat-conducting components that penetrate through the partition and a circulation component that is located inside the cooling area. The circulation component and the multiple sets of heat-conducting components are internally connected. The heat-conducting components are used for heat transfer between the integration area and the cooling area. The heat-conducting components have an elastic cavity structure. The elastic cavity structure of the heat-conducting components is filled with a cooling medium through the circulation component. One side of the heat dissipation component is sleeved on the outer wall of the heat-conducting component. The heat dissipation assembly includes a barrier cover fixed to the top surface of the switch assembly. A guide component is installed inside the barrier cover. The guide component includes a heat dissipation plate fixed to the top surface inside the barrier cover. Multiple heat dissipation fins are fixed to the bottom surface of the heat dissipation plate. A heat dissipation ring is connected to one side of the heat dissipation plate. The heat dissipation ring is connected to the outside of the barrier cover. The heat dissipation ring is made of a heat-expandable shape memory alloy material. The heat dissipation ring is sleeved on the outer wall of the heat-conducting component to fit the heat-conducting component and transfer the heat inside the barrier cover to the heat-conducting component.

2. The embedded integrated power distribution automation terminal according to claim 1, characterized in that: The heat-conducting component is configured in three states by filling it with different amounts of cooling medium and heat dissipation ring. In the first state, the heat-conducting component is not filled with cooling medium, and the outer wall of the heat-conducting component and the inner wall of the heat dissipation ring are set with a clearance fit. In the second state, the heat-conducting component is filled with cooling medium and initially expands so that the outer wall of the heat-conducting component expands and fits tightly against the inner wall of the heat dissipation ring in the unexpanded state. In the third state, the heat-conducting component is filled with cooling medium and expands further, so that the outer wall of the heat-conducting component expands and fits tightly against the inner wall of the heat dissipation ring in the expanded state.

3. The embedded integrated power distribution automation terminal according to claim 2, characterized in that: The heat-conducting component includes a first fixed plate that penetrates and is fixed inside the partition. A guide tube is connected to one side of the first fixed plate. The guide tube has an elastic cavity structure. An inlet pipe and a drain pipe are connected through one side of the guide tube. Both the inlet pipe and the drain pipe penetrate and are connected inside the first fixed plate. The ends of the inlet pipe and the drain pipe away from the guide tube are connected through and connected to the inside of the circulation component.

4. The embedded integrated power distribution automation terminal according to claim 3, characterized in that: The heat-conducting component also includes an inner cylinder fixed inside the expansion cylinder. An annular inner cavity is formed between the outer wall of the inner cylinder and the inner wall of the expansion cylinder. One side of the inner cylinder is connected to one end of the liquid inlet pipe, and one end of the liquid outlet pipe is connected to the annular inner cavity. A through hole is opened on the outer wall of the end of the inner cylinder away from the liquid outlet pipe.

5. An embedded integrated power distribution automation terminal according to claim 4, characterized in that: The circulation component includes a liquid storage tank fixed to the bottom of the cooling area of ​​the chassis. A first electromagnetic pump and a second electromagnetic pump are connected to the top surface of the liquid storage tank. The top of the first electromagnetic pump is connected to an outlet pipe, and the top of the second electromagnetic pump is connected to an inlet pipe. One side of the outlet pipe is connected to multiple inlet pipes, and one side of the inlet pipe is connected to multiple outlet pipes.

6. An embedded integrated power distribution automation terminal according to claim 1, characterized in that: The switch assembly includes a mounting box fixed to the top surface of a support plate, a mounting plate fixed to the bottom surface inside the mounting box, multiple high-voltage switches on the top surface of the mounting plate, third fixing plates fixed to both sides of the mounting plate, and a barrier cover fixedly enclosed to the top of the mounting box.

7. An embedded integrated power distribution automation terminal according to claim 6, characterized in that: The mounting box is a box structure that runs through the front and top. The barrier cover is closed and fixed to the front and top of the mounting box. The front wall of the barrier cover is connected to a fixing bolt, one end of which is connected to the inside of the third fixing plate.

8. An embedded integrated power distribution automation terminal according to claim 6, characterized in that: The heat dissipation assembly also includes a pressure-conducting component that runs through the inside of the barrier cover. The pressure-conducting component is a heat-conducting structure and is elastically slidably connected inside the barrier cover. One side of the pressure-conducting component is fitted with the heat dissipation ring. The pressure-conducting component is located on the top of the high-voltage switch. The pressure-conducting component is pushed down by the expansion of the heat dissipation ring due to heat, so that the pressure-conducting component fits against the top surface of the high-voltage switch.

9. An embedded integrated power distribution automation terminal according to claim 8, characterized in that: The pressure guiding component includes a lifting plate slidably connected inside the barrier cover. The lifting plate has a three-section bending structure. A pressure plate is fixed on the top surface of the lifting plate. The pressure plate is made of the same heat-expandable shape memory alloy material as the heat dissipation ring. The pressure plate fits into the bottom surface of the heat dissipation ring. An elastic plate is fixed on the bottom surface of the lifting plate. A pressure guiding plate is fixed on the bottom surface of the elastic plate. The pressure guiding plate is set on the top of the high-voltage switch. Two sealing plates are sleeved on the outer wall of the lifting plate. The two sealing plates are slidably connected to the inner wall and outer wall of the barrier cover, respectively. Two guide rods are connected to one bottom surface of the lifting plate. A second fixing plate is sleeved between the outer walls of the two guide rods. The second fixing plate is fixed to the outer wall of the barrier cover. A spring is sleeved on the outer wall of the guide rods.

10. An embedded integrated power distribution automation terminal according to claim 9, characterized in that: The pressure guiding component also includes a temperature sensor that penetrates through the inside of the pressure guiding plate. The bottom surface of the temperature sensor is a contact detection surface, and the contact detection surface of the temperature sensor is flush with the bottom surface of the pressure guiding plate.

Images