Glass substrate micro-etching rate piece and preparation method and application thereof

Abstract

The invention discloses a glass substrate micro-etching rate sheet and a preparation method and application thereof. The preparation method comprises the following steps: pretreating a glass substrate, and depositing on the surface of the pretreated glass substrate to form a plurality of metal layer areas; and measuring the actual deposition thickness of the metal layer in each area, and comparing the actual deposition thickness with the corresponding preset deposition thickness for verification to obtain the glass substrate micro-etching rate sheet which is verified to be qualified. The test method using the glass substrate micro-etching rate piece comprises the following steps: placing the glass substrate micro-etching rate piece in the micro-etching line body for micro-etching; after micro-etching is completed, determining a completely etched metal layer area on the glass substrate micro-etching rate sheet, and determining the maximum value in preset deposition thicknesses corresponding to the completely etched metal layer area as the actual micro-etching amount of the micro-etching line body; and determining the micro-etching rate of the micro-etching line body based on the actual micro-etching amount. According to the method, the etching amount can be quickly and accurately judged, and efficient, economical and environment-friendly micro-etching rate testing is realized.

Description

Technical Field

[0001] This invention relates to the field of micro-etching rate testing technology, and in particular to a micro-etching rate sheet for a glass substrate, its preparation method, and its application. Background Technology

[0002] In the substrate industry, the mainstream solution for micro-etching rate testing is the gravimetric method. This method requires the use of a CCL (Clad Laminate) rate plate. The core logic is to measure the mass difference of the rate plate before and after micro-etching, and then use the rate plate area and metal density to infer the etched metal thickness. However, this traditional solution has many inherent and insurmountable flaws, and is seriously incompatible with the industry's core requirements for testing efficiency, cost control, accuracy, and production safety. Firstly, testing efficiency has reached a bottleneck and is completely unable to keep up with mass production pace. The commonly used method in the substrate industry for testing micro-etching rates is the gravimetric method. This involves measuring the mass difference of the rate sheet before and after micro-etching, and then using the rate sheet area and metal density to infer the thickness of the etched metal. The gravimetric method testing process is as follows: Figure 3 As shown, before and after the rate sample passes through the line test, additional auxiliary processes such as drying and weighing must be performed. These processes not only significantly increase the complexity of operation, but also directly lengthen the overall testing cycle. It takes a long time from sample preparation to result output. For batch testing scenarios on the production line, the efficiency bottleneck is particularly prominent, directly slowing down the production progress.

[0003] Secondly, the overall cost remains high, making it difficult to achieve refined management. CCL rate wafers are used only once and are scrapped after testing, making it impossible to reduce consumable consumption through recycling and reuse. In the long run, not only does the need to continuously invest in new rate wafers lead to a continuous increase in material costs, but additional waste disposal costs also need to be borne. This double consumption continuously increases the cost pressure on the testing process.

[0004] Third, the accuracy of the test is easily distorted, and the reliability of the data is not guaranteed. Ambient humidity is a key variable affecting the accuracy of this method. If the rate wafer is not thoroughly dried before and after passing through the line, the weight measurement value will directly deviate. Since the weight data is the core basis for calculating the etching thickness, once it is distorted, it will directly affect the final test result, resulting in a significant decrease in accuracy and failing to provide reliable support for process optimization and quality control.

[0005] Fourth, there are serious pollution risks, threatening the high-cleanliness production environment. Some CCL rate sheets contain halogen elements. During testing, these halogen elements may migrate to the surface or interior of the production line through volatilization or adhesion, compromising the cleanliness standards of the high-cleanliness production line and posing a potential threat to the stability of subsequent production processes and product quality. In addition, CCL rate sheets have inherent limitations: the standard size is fixed at 10×10cm, and due to manufacturing process limitations, the thickness of the surface metal coating is generally too thick, further exacerbating the testing difficulties of the gravimetric method. Summary of the Invention

[0006] The main objective of this invention is to provide a micro-etching rate sheet for a glass substrate, its preparation method, and its application, enabling rapid and accurate determination of etching amount, reducing waste pollution, and achieving efficient, economical, and environmentally friendly micro-etching rate testing.

[0007] The technical solution adopted in this invention is: a method for fabricating a glass substrate micro-etching rate sheet, comprising: The glass substrate is pretreated, and multiple metal layer regions are deposited on the surface of the pretreated glass substrate; wherein the preset deposition thickness of each metal layer region is different and is distributed in a gradient. The actual deposition thickness of the metal layer in each region is measured and compared with the corresponding preset deposition thickness for verification. If the difference between the actual deposition thickness of the metal layer in each region and the preset deposition thickness is lower than the preset value, the glass substrate micro-etching rate sheet is deemed qualified; otherwise, the glass substrate micro-etching rate sheet is remade until the thickness verification is qualified.

[0008] According to the above technical solution, the pretreatment includes: deionized water cleaning, ultrasonic cleaning, and hot air drying.

[0009] According to the above technical solution, an ion implantation vapor deposition technique is used to deposit a metal layer on the surface of a pretreated glass substrate.

[0010] According to the above technical solution, the glass substrate is divided into multiple independent regions by mask positioning.

[0011] According to the above technical solution, the number of metal layer regions is 30-50.

[0012] According to the above technical solution, the preset deposition thickness of the metal layer is 0.05μm-1.6μm, and the gradient interval is 0.02μm-0.05μm.

[0013] According to the above technical solution, the method for measuring the actual deposition thickness of the metal layer in each region includes: using a copper thickness gauge to perform multi-point thickness measurements on each metal layer region, with the measurement locations including the diagonal and center point of each metal layer region.

[0014] Another aspect of the present invention provides a glass substrate micro-etching rate sheet, which is manufactured by the above-described method for manufacturing a glass substrate micro-etching rate sheet.

[0015] Another aspect of the present invention provides a method for testing micro-etching rates, the method employing the aforementioned glass substrate micro-etching rate sheet, characterized in that it includes: The glass substrate micro-etching rate sheet is placed in the micro-etching line for micro-etching; After micro-etching is completed, the maximum value of the preset deposition thickness corresponding to the completely etched metal layer area on the glass substrate micro-etching rate sheet is determined as the actual micro-etching amount of the micro-etching line. The micro-etching rate of the micro-etched line is determined based on the actual micro-etching amount.

[0016] According to the above technical solution, after a micro-etching rate test is completed, all metal layers on the surface of the glass substrate micro-etching rate sheet used in the micro-etching rate test are removed to make the glass substrate micro-etching rate sheet used in the next micro-etching rate test.

[0017] The beneficial effects of this invention are as follows: By depositing a gradient-distributed metal layer on a glass substrate and obtaining a micro-etching rate sheet of the glass substrate through precise thickness verification, the micro-etching amount is obtained based on the maximum preset thickness corresponding to the fully etched area of ​​the glass substrate micro-etching rate sheet, thereby obtaining the micro-etching rate. This achieves a testing accuracy of 0.02μm, avoiding environmental, instrumental, and operational errors associated with traditional weighing methods. Compared to existing technologies, it eliminates cumbersome procedures such as drying and weighing, significantly improving testing efficiency, reducing consumable costs and solid waste generation, providing reliable support for production line process optimization, and achieving efficient, economical, environmentally friendly, and high-precision micro-etching rate detection.

[0018] Furthermore, this invention employs IVD technology to deposit a metal layer. This dry process does not rely on chemical plating solutions, is environmentally friendly, and can precisely control the amount of metal ions deposited. Compared with traditional wet metallization processes, it can more stably achieve precise deposition of gradient metal layers.

[0019] Furthermore, by using a mask to define independent regions, this invention enables precise isolation of each metal layer deposition area, avoiding mutual interference during the deposition process of different regions.

[0020] Furthermore, using a copper thickness gauge for multi-point measurement, with the measurement locations clearly defined as the diagonal and center points of the area, can comprehensively reflect the thickness distribution of each metal layer area and avoid the random errors of single-point measurement.

[0021] Furthermore, the testing method of the present invention can remove the residual metal layer and remake the rate sheet after testing, realizing the recycling of the glass substrate, completely changing the traditional single-use mode of CCL rate sheets, greatly reducing the cost of consumable procurement and solid waste treatment, and the reuse does not affect the testing accuracy, thus taking into account both economy and environmental protection. Attached Figure Description

[0022] Figure 1 This is a flowchart of a method for fabricating a glass substrate micro-etching rate sheet according to an embodiment of the present invention; Figure 2 This is a flowchart of the micro-etching rate testing method according to an embodiment of the present invention; Figure 3 This is a flowchart illustrating the existing weighing method. Figure 4(a) is a schematic diagram of the structure of the existing CCL micro-etching rate sheet; Figure 4(b) is a schematic diagram of the structure of the glass substrate micro-etching rate sheet according to an embodiment of the present invention; Figure 5 This is a flowchart illustrating the glass substrate micro-etching rate sheet, its preparation method, and its application according to an embodiment of the present invention. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0024] Example 1 This embodiment provides a method for fabricating a micro-etching rate sheet on a glass substrate, aiming to achieve accurate and efficient micro-etching rate detection. The process is as follows: Figure 1 As shown, the steps include: S1. First, the glass substrate is pretreated. To ensure the uniformity and adhesion of the subsequent metal layer deposition, the pretreatment process must be carried out in sequence, including deionized water cleaning, ultrasonic cleaning and hot air drying, to thoroughly remove oil, dust and other impurities from the substrate surface.

[0025] After pretreatment, IVD ion implantation vapor deposition technology, combined with mask positioning process, is used to accurately divide the glass substrate into 30-50 independent regions. Multiple metal layer regions are deposited on the clean substrate surface. The preset deposition thickness of each metal layer region is different and has a gradient distribution. The preset deposition thickness range is set to 0.05μm-1.6μm, and the gradient interval is controlled at 0.02μm-0.05μm to adapt to the detection requirements of different micro-etched lines.

[0026] S2. To ensure the thickness of the rate sheet meets the accuracy requirements of micro-etching detection, the actual deposition thickness of the metal layer in each region needs to be measured. During measurement, a copper thickness gauge is used to perform multi-point sampling measurements on each metal layer region. Specific measurement locations include both ends of the diagonal and the center point of each region to completely avoid the random errors of single-point measurements. Subsequently, the actual deposition thickness is compared with the corresponding preset deposition thickness for verification: if the thickness difference in each region is lower than the preset standard, the micro-etching rate sheet of the glass substrate is deemed qualified; if there are areas with deviations exceeding the standard, it needs to be remade until the thickness verification is qualified.

[0027] This embodiment also provides a glass substrate micro-etching rate sheet, which is manufactured by the above-described method for manufacturing a glass substrate micro-etching rate sheet. The glass substrate surface has a precisely distributed metal layer structure with gradient distribution, and can be directly used for micro-etching rate detection.

[0028] This embodiment also provides a method for testing the micro-etching rate based on the micro-etching rate sheet of the glass substrate, the process of which is as follows: Figure 2 As shown, the steps include: T1. Place the qualified glass substrate micro-etching rate sheet steadily into the target micro-etching line and perform micro-etching treatment according to the preset process parameters of the line.

[0029] T2. After micro-etching is completed, the areas on the substrate where the metal layer has been completely etched are identified by visual observation. Combined with the preset thickness design of the rate wafer, the maximum value of the preset deposition thickness corresponding to all completely etched areas is determined as the actual micro-etching of the micro-etching line.

[0030] T3. The micro-etching rate of the line body is calculated based on the actual micro-etching amount.

[0031] To achieve resource recycling, after a micro-etching test is completed, the residual metal layer on the surface of the rate sheet can be removed by a complete etching process to restore the glass substrate to a clean state. Then, according to the new preset thickness requirements, the steps of the above-mentioned glass substrate micro-etching rate sheet fabrication method are repeated to obtain the rate sheet required for the next test.

[0032] Example 2 Based on Example 1, this example provides another method for fabricating a glass substrate micro-etching rate sheet, another glass substrate micro-etching rate sheet, and another micro-etching rate testing method, which can efficiently control the micro-etching rate for different etching lines.

[0033] The specific method for fabricating the micro-etching rate sheet on the glass substrate is as follows: First, based on the testing requirements and line compatibility, large-sized glass substrates are cut into transparent glass substrates of the required size (e.g., standard 100mm × 100mm) with no scratches or impurities on the surface. Then, the glass substrates are placed in a dedicated washing line, using a combination of deionized water cleaning, ultrasonic cleaning, and hot air drying to thoroughly remove oil, dust, and other contaminants from the substrate surface. After drying, the surface cleanliness of the substrate is confirmed visually or with a cleanliness tester to ensure there are no residual water stains or impurities.

[0034] Next, the pre-treated glass substrate is fixed onto the fixture of the IVD equipment, ensuring the substrate is flat and without displacement. According to the preset testing plan, the glass substrate is divided into 30 independent testing areas using the equipment's mask positioning system. Figure 5As shown, precise regional isolation is achieved, and then IVD ion implantation parameters are set. According to the design requirements of a copper thickness range of 0.05-1.5 μm and a gradient interval of 0.05 μm, differentiated copper ion implantation is performed on different regions to ensure that the copper layer thickness in each region precisely matches the design value, forming a gradient copper layer structure. IVD (Ion Implant Vapor Deposition) technology is a newly developed substrate metallization technology. Its core principle is to precisely implant and deposit metal ions onto the substrate surface through the synergistic effect of high-energy ion implantation and vapor deposition to form a uniform and dense metal layer. It is a dry process that does not rely on chemical plating solutions, making it more environmentally friendly than traditional wet copper plating processes. Furthermore, by adjusting ion implantation time parameters and limiting the area using a mask, dual precision control is achieved, ensuring the uniformity and consistency of the copper layer thickness.

[0035] Following the principle of first dividing the area and then fixing the points, the copper thickness of the 30 areas was measured sequentially. Three test points were selected for each area (the two ends of the diagonal of the area + the center point of the area). The copper thickness data of each test point was recorded and compared with the design specifications. If the copper thickness deviation of all areas was within ±5% (or within the preset acceptable range), the rate chip was deemed qualified and could be transferred to the production line. If there were areas with deviations exceeding the standard, IVD injection had to be performed again or the product was deemed unqualified.

[0036] The glass substrate micro-etching rate sheet provided in this embodiment is manufactured by the above-described method. Its substrate surface has a precisely distributed copper layer structure with gradient distribution. The distribution area and thickness specifications of each copper layer region are shown in Figure 4(b), with the unit being μm. Compared with the traditional CCL micro-etching rate sheet in Figure 4(a), it breaks through the limitations of fixed size and thick copper layer in conventional methods. The copper layer thickness accuracy can be stably controlled at the 0.02μm level. The size is not fixed and can be flexibly adjusted according to the line inspection requirements. Moreover, the thickness range and gradient interval can be customized. Multi-specification production can be achieved without changing the core equipment. It has high mass production efficiency, controllable cost, and can adapt to the feeding specifications of different production lines.

[0037] As shown in the application examples in Table 1, for the conventional etching amount range of 0.5-1.4μm for the Tenting pretreatment line, a rate wafer with 45 gradient copper thickness regions corresponding to the 0.5-1.4μm copper thickness range can be customized. For the conventional etching amount range of 0.6-1.6μm for the solder mask pretreatment line, a rate wafer with 50 gradient copper thickness regions corresponding to the 0.6-1.6μm copper thickness range can be customized. Each gradient corresponds to a fine interval of 0.02μm, which can completely cover the etching amount range of the line and accurately capture the micro-etching rate changes of different process nodes.

[0038]

[0039] Table 1 - Application Cases of Micro-etching Rate Sheets on Glass Substrates The specific method for testing the micro-etching rate of the glass substrate micro-etching rate sheet is as follows: a qualified glass substrate micro-etching rate sheet is smoothly placed into the feed port of the pretreatment line to ensure that the rate sheet moves at a uniform speed with the conveyor belt, avoiding uneven etching due to jamming or deviation. The equipment operation status is monitored throughout the process, and the real-time fluctuation of process parameters is recorded to ensure that the testing process meets the preset conditions.

[0040] After the wafer completes the pre-processing line and is discharged, it is placed on a white backlit inspection stage to enhance the contrast between the copper layer residue and the etched area. The state of the copper layer residue in each area is visually observed to identify and mark the completely etched areas—areas where the copper layer has been completely removed, exposing only the transparent glass substrate. The design value of the thickest copper layer in the completely etched area is found by referring to the copper thickness design table. This design value represents the actual micro-etching amount under the current process parameters. Based on this actual micro-etching amount, the micro-etching rate of the line is then determined. The entire manufacturing and testing process is as follows: Figure 5 As shown.

[0041] Furthermore, after a micro-etching rate test is completed, the residual copper layer on the substrate surface can be completely removed through a full etching process, restoring the glass substrate to its initial clean state. Without replacing the substrate, a copper layer of a preset thickness can be directly re-deposited using ion plating implantation technology to regenerate a brand-new rate sheet, achieving 100% recycling of the testing material and forming a complete resource closed loop of use-regeneration-reuse.

[0042] This testing method relies on the differentiated design of ion implantation coating layers of varying thicknesses, breaking away from the dependence on complex instruments and cumbersome procedures in traditional weighing methods. Operators can directly identify and obtain test results simply by visual inspection, improving detection efficiency by over 90% and significantly reducing human error. Furthermore, the glass substrate has a robust physical structure, stable chemical properties, and extremely strong elemental inertness. When in contact with chemical reagents such as micro-etching solutions and cleaning solutions, it hardly dissolves, reacts, or precipitates impurities, thus preventing contamination of the production line. It can protect the stability of the production line's chemical composition and avoid the degradation or failure of chemical performance due to impurities. At the same time, it does not contain harmful components such as heavy metals, which can reduce the amount of solid waste generated during the testing process, forming an environmentally friendly testing mode of use and recycling. It successfully breaks through the technical bottlenecks of existing copper clad laminate (CCL) micro-etching rate measurement methods in terms of efficiency, cost, accuracy, and environmental protection.

[0043] In summary, this invention provides a glass substrate micro-etching rate sheet, its preparation method, and its application, which can quickly and accurately determine the etching amount and achieve efficient, economical, and environmentally friendly micro-etching rate testing.

[0044] It should be noted that, depending on the implementation needs, the various steps / components described in this application can be broken down into more steps / components, or two or more steps / components or parts of the operation of steps / components can be combined into new steps / components to achieve the purpose of this invention.

[0045] The order of the steps in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0046] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A method for fabricating a glass substrate micro-etching rate sheet, characterized in that, include: The glass substrate is pretreated, and multiple metal layer regions are deposited on the surface of the pretreated glass substrate to serve as a glass substrate micro-etching rate sheet; wherein the preset deposition thickness of each metal layer region is different and has a gradient distribution. The actual deposition thickness of the metal layer in each region is measured and compared with the corresponding preset deposition thickness for verification. If the difference between the actual deposition thickness of the metal layer in each region and the preset deposition thickness is lower than the preset value, the glass substrate micro-etching rate sheet is deemed qualified; otherwise, the glass substrate micro-etching rate sheet is remade until the thickness verification is qualified.

2. The method for fabricating a glass substrate micro-etching rate sheet according to claim 1, characterized in that, The pretreatment includes: deionized water cleaning, ultrasonic cleaning, and hot air drying.

3. The method for fabricating a glass substrate micro-etching rate sheet according to claim 1, characterized in that, A metal layer was deposited on the surface of a pretreated glass substrate using ion implantation vapor deposition technology.

4. The method for fabricating a glass substrate micro-etching rate sheet according to claim 1, characterized in that, The glass substrate is divided into multiple independent regions by mask positioning.

5. The method for fabricating a glass substrate micro-etching rate sheet according to claim 1, characterized in that, The number of metal layer regions is 30-50.

6. The method for fabricating a glass substrate micro-etching rate sheet according to claim 1, characterized in that, The preset deposition thickness of the metal layer is 0.05μm-1.6μm, and the gradient interval is 0.02μm-0.05μm.

7. The method for fabricating a glass substrate micro-etching rate sheet according to claim 1, characterized in that, Methods for measuring the actual deposition thickness of the metal layer in each region include: using a copper thickness gauge to perform multi-point thickness measurements on each metal layer region, with measurement locations including the diagonal and center points of each metal layer region.

8. A glass substrate micro-etching rate sheet, characterized in that, It is manufactured by the method for fabricating a glass substrate micro-etching rate sheet according to any one of claims 1 to 7.

9. A method for testing micro-etching rate, characterized in that, The method employs the glass substrate micro-etching rate sheet described in claim 8, and includes: The glass substrate micro-etching rate sheet is placed in the micro-etching line for micro-etching; After micro-etching is completed, the maximum value of the preset deposition thickness corresponding to the completely etched metal layer area on the glass substrate micro-etching rate sheet is determined as the actual micro-etching amount of the micro-etching line. The micro-etching rate of the micro-etched line is determined based on the actual micro-etching amount.

10. The micro-etching rate testing method according to claim 9, characterized in that, After a micro-etching rate test is completed, all metal layers on the surface of the glass substrate micro-etching rate sheet used in that micro-etching rate test are removed to prepare the glass substrate micro-etching rate sheet for the next micro-etching rate test.

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