Electronic device

Abstract

The invention discloses an electronic device, the electronic device comprises a shell, a display screen and a circuit board structure, the shell and the display screen enclose to form an accommodating cavity, and the circuit board structure is arranged in the accommodating cavity. The circuit board structure comprises a first circuit board, a first frame plate and a second circuit board; the first frame plate is fixed between the first circuit board and the second circuit board, and the first frame plate, the first circuit board and the second circuit board define a first cavity. The first frame plate comprises a first notch, the first circuit board is provided with an electronic component, and the electronic component extends to the outer side of the first cavity from the first cavity through the first notch. In the electronic equipment, the first gap extends from the first circuit board to the direction far away from the first circuit board, and can accommodate the electronic component fixed in the area, directly facing the first gap, of the first circuit board, so that the layout density of the circuit board structure is improved.

Description

[0001] This application is a divisional of the Chinese Patent Application No. 202510593758.9, filed with the State Intellectual Property Office on May 8, 2025, and entitled “Circuit Board Structure and Electronic Device”, the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of circuit board stacking, and in particular to an electronic device. BACKGROUND

[0003] With the development of 5G technology, AI technology and other technologies, the performance requirements for electronic devices such as mobile phones are becoming higher and higher. The circuit board of the electronic device needs to be laid out with more and more components to meet the increasing performance requirements of the electronic device.

[0004] However, the internal space of the electronic device is relatively cramped, especially for portable terminal devices. Limited by the internal space of the electronic device, the layout area available for laying out components on the circuit board is limited, and therefore, it is necessary to develop more layout area from the circuit board to lay out more components. SUMMARY

[0005] The embodiments of the present application provide a circuit board structure and an electronic device, which can provide more layout area to lay out more components, thereby improving the layout density of the circuit board structure.

[0006] To achieve the above-mentioned purpose, the embodiments of the present application adopt the following technical solutions: In a first aspect, the embodiments of the present application provide a circuit board structure. The circuit board structure includes a first circuit board (such as an AP board) and a first frame board (such as an FB board). The first frame board is fixed to the first circuit board. The first frame board at least encloses the first circuit board to form a first cavity. The first frame board includes a first notch, the first notch extends from the first circuit board away from the first circuit board, and penetrates the first cavity and the outside of the first cavity, for accommodating a first component fixed to the first circuit board.

[0007] It should be noted that the first component can be a structure of the circuit board structure itself, such as a first shielding cover; or can not be a structure of the circuit board structure itself, such as an FPC connector.

[0008] In the circuit board structure provided by the embodiments, the first frame board includes a first notch penetrating the first cavity and the outside of the first cavity, the first notch extends from the first circuit board to a direction away from the first circuit board, and can accommodate a first component fixed to a region of the first circuit board opposite to the first notch. It can be seen that, by providing the above-mentioned first notch, the layout area is saved so that the region of the first circuit board opposite to the first notch can be laid out with the first component, thereby improving the layout density of the circuit board structure.

[0009] In addition, the first gap extends through the first chamber and the outside of the first chamber, so that the first chamber is an open space, which is more conducive to the heat dissipation performance of the circuit board structure.

[0010] In addition, in the case where components are arranged in the first chamber, the first gap extends through the first chamber and the outside of the first chamber, so that the components inside the first chamber are visible, which is more conducive to the maintenance and positioning of the components inside the first chamber.

[0011] In addition, the first frame plate requires less material and has lower material cost due to the first gap.

[0012] As a non-limiting embodiment, the first frame plate is a groove-shaped structure, which encloses the first circuit board to form the first chamber. It can be seen that this embodiment provides a specific formation scheme of the first chamber. In this scheme, the groove bottom plate of the first frame plate can be used to mount components, thereby improving the layout density of the circuit board structure.

[0013] As another non-limiting embodiment, the circuit board structure further comprises a second circuit board (such as an RF board). The second circuit board is fixed to one end of the first frame plate away from the first circuit board. The first frame plate encloses the first circuit board and the second circuit board to form the first chamber.

[0014] This embodiment provides another specific formation scheme of the first chamber. In this scheme, the second circuit board can also be used to mount components, thereby improving the layout density of the circuit board structure.

[0015] Optionally, the first frame plate further comprises a through hole. One end of the through hole extends to the first circuit board, and the other end of the through hole extends to the second circuit board, forming the first chamber extending from the first circuit board to the second circuit board.

[0016] In this case, the first frame plate is a non-closed ring structure, i.e., an open ring structure, which can further reduce the material cost on the one hand, and the first chamber does not have a blocking structure (such as a partition plate), so that the first chamber can accommodate components with a height of at most the length of the through hole.

[0017] Optionally, the first frame plate further comprises a partition plate, which divides the first chamber into an upper chamber and a lower chamber. The upper chamber is located on the side of the partition plate facing the second circuit board, and the lower chamber is located on the side of the partition plate facing the first circuit board.

[0018] In this embodiment, through the first gap, the upper chamber and the lower chamber are respectively extended through the outside of the first chamber from the first circuit board to the side of the partition plate facing the second circuit board, such as to the second circuit board. In this embodiment, the partition plate of the first frame plate can be used to layout more components, thereby improving the density of the circuit board structure.

[0019] As a non-limiting example, the first frame plate further comprises a plurality of frame bodies. The plurality of frame bodies are connected in sequence, and adjacent two frame bodies are arranged at an angle. The plurality of frame bodies comprise two end frame bodies, and the end frame bodies are frame bodies having free ends. The free ends of the two end frame bodies are arranged at intervals, and the first gap is located between the free ends of the two end frame bodies.

[0020] It should be noted that the free end of the end frame body refers to one end of the end frame body that is not connected to other frame bodies, and the opposite end is the non-free end of the end frame body, which is the end of the end frame body connected to other frame bodies. It can be understood that the first and last frame bodies of the plurality of frame bodies connected in sequence are end frame bodies on the connection path.

[0021] This embodiment provides a specific implementation scheme of the first frame plate and the first gap on the first frame plate. In this scheme, the strength of the first frame plate can be improved because the adjacent two frame bodies are arranged at an angle.

[0022] As a non-limiting example, the first frame plate comprises at least one first fixing hole. The second circuit board comprises a second fixing hole opposite the first fixing hole. The first circuit board comprises a third fixing hole opposite the first fixing hole. The first frame plate structure further comprises a first fixing member (such as a screw). The first fixing member extends into the first fixing hole, the second fixing hole and the third fixing hole to fix the first frame plate, the second circuit board and the first circuit board, respectively.

[0023] It should be noted that the position of the first frame plate where the first gap is provided is originally used to fix and connect the first circuit board and the second circuit board.

[0024] Due to the provision of the first gap, the fixing area of the first frame plate with the first circuit board and the second circuit board is reduced, thereby causing the connection reliability of the first frame plate with the first circuit board and the second circuit board to be poor.

[0025] In this embodiment, at least one first fixing hole is provided on the first frame plate, and a second fixing hole and a third fixing hole are respectively provided on the second circuit board and the first circuit board at corresponding positions, so that the first fixing member extends into the first fixing hole, the second fixing hole and the third fixing hole to fix the first frame plate, the second circuit board and the first circuit board, respectively, thereby compensating for the connection reliability of the first frame plate with the first circuit board and the second circuit board.

[0026] As a non-limiting example, the corner region of at least one set of adjacent two frame bodies is provided with a first fixing hole. The first fixing hole of the corner region is a fixing hole of the adjacent two frame bodies, respectively.

[0027] In this embodiment, the first fixing hole is arranged at the corner region of the two adjacent frame bodies, so that the two adjacent frame bodies share one first fixing hole and are connected with the first circuit board and the second circuit board respectively, thereby reducing the number of first fixing holes on the first frame plate, and facilitating the simplification of the circuit board structure and the processing steps.

[0028] In addition, since the first fixing hole needs to be fixed with the second fixing hole and the third fixing hole, as the number of first fixing holes decreases, the number of second fixing holes and third fixing holes also decreases, and the layout area of the second circuit board and the first circuit board occupied by the second fixing hole and the third fixing hole decreases, thereby saving more layout area on the first circuit board and the second circuit board for more components, thereby improving the layout density of the circuit board structure.

[0029] As a non-limiting embodiment, the first frame plate further comprises a reinforcing body. The reinforcing body fixes the first circuit board and the second circuit board respectively. The reinforcing body is arranged at the free end of the end frame body and extends from the free end of the end frame body to the circumferential side of the free end of the end frame body.

[0030] In this embodiment, the reinforcing body extends from the free end of the end frame body to the circumferential side of the free end of the end frame body, beyond the edge of the free end of the end frame body, which can disperse the stress of the free end of the end frame body and expand the fixing area of the free end of the end frame body, thereby improving the connection strength and connection reliability of the free end of the end frame body. In addition, by arranging the reinforcing body at the free end of the end frame body to fix the first circuit board and the second circuit board respectively, the connection reliability of the first frame plate with the first circuit board and the second circuit board can be compensated.

[0031] Optionally, the reinforcing body extends to the first circumferential side of the end frame body, and the first circumferential side is the side where the other end frame body is located; or the reinforcing body extends to the second circumferential side of the end frame body, and the second circumferential side is the opposite side of the side where the other end frame body is located.

[0032] Since the first gap is located between the free end of the end frame body and the free end of the other end frame body, the reinforcing body extends from the free end of the end frame body to the side where the free end of the other end frame body is located, which is equivalent to extending to the inside of the first gap, which occupies part of the area of the first gap. The reinforcing body extends from the free end of the end frame body to the opposite side of the side where the free end of the other end frame body is located, which is equivalent to extending to the outside of the first gap, which does not occupy the first gap. Therefore, in the specific implementation process, one of the above two schemes can be selected according to the required size of the first gap.

[0033] In this embodiment, the reinforcing body is bent relative to the end frame body regardless of whether the reinforcing body extends to the first or second circumferential side of the end frame body. In this way, when the corner position of the reinforcing body and the end frame body is subjected to an external force, stress is more evenly dispersed, thereby improving the connection strength and connection reliability of the end frame body.

[0034] Optionally, the reinforcing body is in a cylindrical structure, and the diameter of the cylindrical structure is greater than the width of the end frame body. The width of the end frame body is the dimension in the first direction of the end frame body, and the first direction is perpendicular to the arrangement direction of the free end and the non-free end of the end frame body.

[0035] In this embodiment, when the diameter of the cylindrical structure is greater than the width of the end frame body, the reinforcing body extends to the circumferential side around the free end of the end frame body, so that the stress of the free end of the end frame body can be better dispersed, thereby improving the connection strength and connection reliability of the free end of the end frame body.

[0036] As a non-limiting example, the reinforcing body is two, which are a first reinforcing body and a second reinforcing body. The two sections of the end frame body are the end frame body and another section of the end frame body. The first reinforcing body is arranged at the free end of the end frame body. The second reinforcing body is arranged at the free end of the other section of the end frame body.

[0037] It should be noted that the specific structure, positional relationship and connection relationship of the first reinforcing body and the second reinforcing body can be the same or different.

[0038] In this embodiment, one reinforcing body is fixed at the free end of each of the two sections of the end frame body, which can make the connection strength and connection reliability of the free end of the two sections of the end frame body better, and can improve the connection reliability of the first frame plate and the first circuit board and the second circuit board as a whole.

[0039] Of course, in other embodiments, the reinforcing body can also be one, which can be arranged at the free end of any one of the two sections of the end frame body.

[0040] As a non-limiting example, the first component includes a first shielding cover, and the first shielding cover also fixes the second circuit board.

[0041] In this embodiment, in the case where the first component includes the first shielding cover, the first shielding cover is fixed to the first circuit board, extends to the second circuit board through the first shielding cover through the first gap, and fixes the second circuit board, forming an additional connection link between the first circuit board and the second circuit board, which helps to compensate for the loss of connection reliability due to the arrangement of the first gap. In addition, the first shielding cover has a large area and high strength, which can increase the connection reliability.

[0042] In the related art, the first frame plate is not provided with the first gap, one end of the first frame plate at the position of the first gap is welded with the first circuit board, the other end is welded with the second circuit board respectively, and the two ends are connected through the tin filling of the metal via. There are at least four connection nodes, resulting in high impedance and insertion loss. In this embodiment, one end of the first shielding cover is fixed with the first circuit board, and the other end of the first shielding cover is fixed with the second circuit board. There are fewer connection nodes, smaller impedance and insertion loss, and better performance of the circuit board structure.

[0043] As a non-limiting example, the area of the second circuit board opposite the first gap is provided with a first jack. The first shielding cover includes a first cover body and a first protrusion fixing the first cover body. The first cover body is fixed on the side of the first circuit board facing the second circuit board, and the first protrusion extends into the first jack and fixes the hole wall of the first jack.

[0044] In this embodiment, the first shielding cover extends into the first jack of the second circuit board through the first protrusion and fixes the hole wall of the first jack, thereby achieving fixation with the second circuit board.

[0045] Of course, in other embodiments, the first shielding cover can also be fixed through the second circuit board. For example, the first shielding cover and the second circuit board are welded, bonded or elastically connected. Compared with the welding, bonding or elastic connection mode, the first protrusion extending into the first jack and fixing the hole wall of the first jack can form a larger connection area, so that the connection reliability is higher, which helps to compensate for the loss of connection reliability due to the setting of the first gap.

[0046] As a non-limiting example, the first protrusion is a cylindrical structure or a conical structure.

[0047] In this embodiment, the cylindrical structure is more easily fixed with the first jack when it extends into the first jack, but it is not easy to align and extend into the first jack; the conical structure is not easy to fix with the first jack when it extends into the first jack, but it is more aligned and extends into the first jack.

[0048] As a non-limiting example, the number of first jacks is multiple. At least two first jacks are long strip-shaped jacks, and are arranged in sequence along the second direction, which is the length direction of the long strip-shaped jack. Among them, in the second direction, the length of the long strip-shaped jack closest to the gap side edge of the second circuit board is the smallest, and the gap side edge of the second circuit board is the edge of the second circuit board on one side of the first gap in the second direction.

[0049] It should be noted that, in the case that the at least two first insertion holes are long strip-shaped insertion holes and are arranged in sequence along the second direction, the more central the position of the area of the second circuit board opposite the first notch is in the second direction, the thinner the position is and the more support is needed. In this embodiment, among the at least two long strip-shaped insertion holes in the second direction, the long strip-shaped insertion hole closest to the notch side edge of the second circuit board has the smallest length, and conversely, the long strip-shaped insertion hole more central in the second direction has a greater length, which can provide better support for the position of the area of the second circuit board opposite the first notch that is more central in the second direction, thereby obtaining better connection strength and connection reliability.

[0050] As a non-limiting example, the first shielding cover extends from the outside of the first chamber to the first chamber through the first notch.

[0051] Since the first notch penetrates the outside of the first chamber and the first chamber, the first shielding cover extends from the outside of the first chamber to the first chamber through the first notch.

[0052] In the case that the layout area of the area of the first circuit board opposite the first notch is relatively tight, this embodiment extends part of the first shielding cover to the outside of the first chamber for fixation, which can avoid the first shielding cover from occupying the already tight layout area of the first circuit board by being concentrated at the first notch.

[0053] As a non-limiting example, the first component includes a third circuit board and / or a second frame plate, which extends from the outside of the first chamber to the first chamber through the first notch. The second frame plate is fixed between the first circuit board and the third circuit board and encloses the second chamber with the first circuit board and the third circuit board.

[0054] In the case that the first frame plate does not have the first notch, the first frame plate has a closed ring structure, and the third circuit board and / or the second frame plate cannot extend into the first chamber through the first notch, but can only be arranged side by side on one side of the first frame plate. In this embodiment, since the first frame plate includes the first notch, the third circuit board can extend into the first chamber through the first notch, and the second circuit board and the first circuit board can be designed in a staggered manner, thereby saving more layout area of the first circuit board for more components, thereby improving the layout density of the circuit board structure.

[0055] As a non-limiting example, the second frame plate includes a second notch. The second notch penetrates the second chamber and the outside of the second chamber and extends from the first circuit board to the third circuit board, and is used for accommodating a second component fixed to the first circuit board and / or the third circuit board.

[0056] In this embodiment, the second frame plate is provided with a second notch, so that the first circuit board and / or the third circuit board can be arranged with the second components in the area corresponding to the second notch, thereby improving the layout density of the circuit board structure, and having the technical effects of better heat dissipation performance, more convenient maintenance and positioning, and lower material cost, and specific analysis can be adaptively referred to the foregoing description of the technical effects of providing the first notch.

[0057] As a non-limiting embodiment, the second notch is opposite to the first notch. The circuit board structure further comprises a second component, the second component extending from the second chamber to the first chamber through the second notch.

[0058] In this embodiment, the second notch is opposite to the first notch, and the second notch is communicated with the first notch. Since the first notch penetrates the first chamber and the outside of the first chamber, and the second notch penetrates the second chamber and the outside of the second chamber, when the second notch is communicated with the first notch, the second notch penetrates the first chamber and the second chamber, and the second component can extend from the second chamber to the first chamber through the second notch. It can be seen that this embodiment can support the layout of the second component occupying a larger layout area.

[0059] As a non-limiting embodiment, the circuit board structure further comprises a second shielding cover. The area of the second circuit board opposite to the first notch has a second jack. The second shielding cover comprises a second cover body and a second protrusion fixing the second cover body. The second cover body is fixed to the side of the second circuit board away from the first circuit board, and the second protrusion extends into the second jack and fixes the hole wall of the second jack.

[0060] In this embodiment, by providing the second protrusion on the second shielding cover, the connection reliability between the second shielding cover and the second circuit board can be better, which helps to compensate for the loss of connection reliability due to the provision of the first notch.

[0061] As a non-limiting embodiment, the number of the first chambers is multiple. The first frame plate comprises at least one first notch. Each first notch penetrates one of the multiple first chambers and the outside of the first chamber.

[0062] In this embodiment, when the first notch is one, the first notch can penetrate any one of the multiple first chambers and the outside of the first chamber. When the first notch is multiple, each first notch penetrates one of the multiple first chambers and the outside of the first chamber, so that a corresponding number of the multiple first chambers and the outside of the first chamber can be penetrated. When the first notch is multiple, each first notch comprises the technical effects of providing the first notch described above.

[0063] In a second aspect, an electronic device is provided. The electronic device comprises the circuit board structure provided in any of the embodiments of the first aspect. The electronic device comprises a receiving cavity, and the circuit board structure is located in the receiving cavity of the electronic device.

[0064] In addition to the separate description, the beneficial effects of the electronic device provided in the embodiments of the second aspect can be adaptively referred to the related description of the circuit board structure provided in the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0065] Figure 1 A structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0066] Figure 2 A structural schematic diagram of an electronic device provided in an embodiment of the present application. Figure 1 A structural exploded schematic diagram of the electronic device shown in FIG. 1.

[0067] Figure 3 A planar schematic diagram of the middle frame assembly in FIG. 2. Figure 2

[0068] A planar schematic diagram of the middle frame assembly of a double-fold mobile phone in an unfolded state provided in an embodiment of the present application. Figure 4

[0069] A planar schematic diagram of the middle frame assembly of a triple-fold mobile phone in an unfolded state provided in an embodiment of the present application. Figure 5

[0070] A planar schematic diagram of the middle frame assembly of another triple-fold mobile phone in an unfolded state provided in an embodiment of the present application. Figure 6

[0071] A planar schematic diagram of the middle frame assembly of a quadruple-fold mobile phone in an unfolded state provided in an embodiment of the present application. Figure 7

[0072] A planar schematic diagram of the middle frame assembly shown in FIG. 3 along the section line P1-P1. Figure 8 Figure 3 A planar schematic diagram of the main board provided in an embodiment of the present application.

[0073] Figure 9 A planar structural schematic diagram of the frame plate in FIG. 4.

[0074] Figure 10 Figure 8 A planar structural schematic diagram of the frame plate in FIG. 4.

[0075] Figure 11 A sectional schematic diagram of the main board of region four in FIG. 4. Figure 8

[0076] Figure 12 ​​​A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0077] Figure 13 A cross-sectional view of a circuit board structure according to an embodiment of the present application. Figure 12 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0078] Figure 14 A cross-sectional view of a circuit board structure according to an embodiment of the present application. Figure 12 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0079] Figure 15 A cross-sectional view of a circuit board structure according to an embodiment of the present application. Figure 12 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0080] Figure 16 A cross-sectional view of a circuit board structure according to an embodiment of the present application. Figure 15 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0081] Figure 17 A cross-sectional view of a circuit board structure according to an embodiment of the present application. Figure 15 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0082] Figure 18 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0083] Figure 19 A cross-sectional view of a circuit board structure according to an embodiment of the present application. Figure 15 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0084] Figure 20 A cross-sectional view of a circuit board structure according to an embodiment of the present application. Figure 15 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0085] Figure 21 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0086] Figure 22 A cross-sectional view of a circuit board structure according to an embodiment of the present application. Figure 21 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0087] Figure 23 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0088] Figure 24 A cross-sectional view of a circuit board structure according to an embodiment of the present application. Figure 23 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0089] Figure 25 A cross-sectional view of a circuit board structure according to an embodiment of the present application.

[0090] Figure 26 Fig. 1 is a top view of a circuit board structure according to an embodiment of the application. Figure 25 Fig. 2 is a cross-sectional view of the circuit board structure of Fig. 1.

[0091] Figure 27 Fig. 3 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0092] Figure 28 Fig. 4 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0093] Figure 29 Fig. 5 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0094] Figure 30 Fig. 6 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0095] Figure 31 Fig. 7 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0096] Figure 32 Fig. 8 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0097] Figure 33 Fig. 9 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0098] Figure 34 Fig. 10 is a plan view of a first frame plate according to an embodiment of the application.

[0099] Figure 35 Fig. 11 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0100] Figure 36 Fig. 12 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0101] Figure 37 Fig. 13 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0102] Figure 38 Fig. 14 is a plan view of another first frame plate according to an embodiment of the application.

[0103] Figure 39 Fig. 15 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0104] Figure 40 Fig. 16 is a cross-sectional view of another circuit board structure according to an embodiment of the application.

[0105] Figure 41 Fig. 17 is a cross-sectional view of another circuit board structure according to an embodiment of the application.Figure 40 a top view schematic diagram of the circuit board structure in the embodiment of the present application.

[0106] Figure 42 a cross-sectional schematic diagram of another circuit board structure provided for the embodiment of the present application.

[0107] Figure 43 a cross-sectional schematic diagram of another circuit board structure provided for the embodiment of the present application.

[0108] Reference signs: 000 - electronic device; 020 - middle frame assembly; 021 - first middle frame assembly; 022 - second middle frame assembly; 023 - third middle frame assembly; 024 - fourth middle frame assembly; 025 - first rotating shaft; 026 - second rotating shaft; 027 - third rotating shaft; 100 - display screen; 200 - shell; 210 - back cover; 220 - frame; 300 - middle plate; 600 - heat conduction plate; 700 - heat conduction gel; 800 - camera module; 900 - Deco piece; 400A - main board; 400B - sub board; 400C - first sub main board; 400D - second sub main board; 400E - third sub main board; 400A1 - annular area one; 400A2 - annular area two; 400A3 - annular area three; 401 - AP board; 402, 404 - frame board; 4021, 4022, 4023 - slot structure; 403, 405 - radio frequency board; 406 - SOC; 407 - copper skin; 400a - first chamber; 410 - first circuit board; 411 - third fixing hole; 420 - second circuit board; 421 - first jack; 4211 - long strip jack one; 4212 - long strip jack two; 4213 - long strip jack three; 4214 - long strip jack four; 4215 - long strip jack five; 4216 - long strip jack six; 4217 - round jack; S1, S2 - notch side edge; S3 - opposite edge position; 422 - second fixing hole; 423 - second jack; 430 - first frame board; 430a - first notch; 430b - through hole; 430c - corner area; 430d - first fixing hole; 430e - end frame body; 430f - metal via hole; 431 - first frame body; 432 - second frame body; 433 - third frame body; 434 - fourth frame body; 436 - reinforcing body; 4361 - first reinforcing body; 4362 - second reinforcing body; 440 - first component; 441 - first shield cover; 4411 - first cover body; 4412 - first protrusion; 442 - electronic component; 451 - long strip pad; 452 - triangular pad; 453 - board edge electroplating area; 460 - first fixing member; 470 - structural member; 471 - fixing hole; 472 - opening; 480 - second shield cover; 481 - second cover body; 482 - second protrusion; 483 - cover body pad; 491 - third circuit board; 492 - second frame board; 492a - second chamber; 492b - second notch; 493 - connecting layer; 494 - elastic member; 510 - first battery; 520 - second battery; 530 - third battery; 540 - fourth battery; 611 - first charging FPC; 621 - first battery FPC; 622 - second battery FPC; 623 - third battery FPC; 624 - fourth battery FPC; 631 - first through shaft FPC; 632 - second through shaft FPC; 633 - third through shaft FPC; 634 - fourth through shaft FPC. DETAILED DESCRIPTION

[0109] The embodiments of the present application are described below in detail with reference to the accompanying drawings. The same or similar components are denoted by the same or similar reference numerals throughout the drawings, and repeated description is omitted. The embodiments described below are examples for explaining the present application and are not intended to be limiting of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of the present application.

[0110] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "inner", "outer", "top", "bottom", "upper", "lower", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and are not intended to indicate or imply that the device or element referred to must include a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting the present application.

[0111] The terms "first", "second", and the like are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0112] In the present application, the two components connected by the term "connection" or the like can be directly connected or indirectly connected through an intermediate medium.

[0113] It should be noted that the words "in some embodiments", "exemplary", "for example", and the like in the present application are used to indicate an example, illustration, or description. Any embodiment or design scheme described as "in some embodiments", "exemplary", "for example" in the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the use of "in some embodiments", "exemplary", "for example" and the like is intended to present the relevant concept in a specific manner.

[0114] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in combination with the drawings and embodiments.

[0115] The electronic device provided by the embodiments of the present application is a terminal device including a circuit board structure. Exemplarily, the electronic device can be a display device such as a mobile phone, a tablet computer, a notebook computer, etc., and the embodiments of the present application do not specially limit the specific form of the above electronic device. The following embodiments take the mobile phone as an example for description.

[0116] Exemplarily, please refer to Figure 1 , Figure 1 A structural schematic diagram of an electronic device provided by the embodiments of the present application.

[0117] The electronic device 000 is a mobile phone, and Figure 1 is approximately rectangular and flat in the unfolded state. In order to facilitate the description of each of the embodiments below, an O-XYZ coordinate system is established on the basis of the electronic device 000 shown. Figure 1 The X-axis direction is the length direction of the electronic device 000. The Y-axis direction is the width direction of the electronic device 000. The Z-axis direction is the thickness direction of the electronic device 000. The X-axis direction and the Y-axis direction are perpendicular, the Y-axis direction and the Z-axis direction are perpendicular, and the Z-axis direction and the X-axis direction are perpendicular.

[0118] It can be understood that the coordinate system of the electronic device 000 can be flexibly set according to actual needs, which is not specifically limited here. Of course, in some other embodiments, the shape of the electronic device 000 can also be square flat, circular flat, etc.

[0119] The electronic device 000 includes a display screen 100, which is used to output image, text, video, etc. display content to the user.

[0120] Exemplarily, the display screen 100 can adopt a flexible display screen, or a rigid display screen. For example, the display screen 100 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, a liquid crystal display (LCD), etc.

[0121] The electronic device 000 further includes a housing 200.

[0122] The housing 200 and the display screen 100 form an accommodation cavity of the electronic device 000, so as to place the components of the electronic device 000 through the accommodation cavity, such as Figure 2The mainboard 400A, subboard 400B, and first battery 510 shown together provide a seal and protection for the components located within the housing cavity. It should be noted that the housing 200 and the display screen 100 can be joined at their edges using an intermediate medium (such as adhesive) to form the housing cavity of the electronic device 000. For example, please refer to Figure 2 , Figure 2 for Figure 1 The diagram shows an exploded view of the structure of electronic device 000. Figure 2 Is Figure 1 It is obtained by decomposing along the Z-axis based on the above.

[0123] Understandable Figure 2 The diagram only schematically shows some of the components included in the electronic device 000. In actual implementation, the electronic device 000 may include more or fewer components, and the actual shape, size, position and structure of each component are not limited by the structure shown in the diagram.

[0124] As a non-limiting embodiment, please refer to Figure 2 , Figure 2 for Figure 1 The diagram shows an exploded view of the electronic device 000. The housing 200 may include a back cover 210 and a frame 220.

[0125] The back cover 210, also known as the battery cover, is located on the back side of the display screen 100. It should be noted that the back side of the display screen 100 is the side of the display screen 100 that faces away from the display surface of the display screen 100.

[0126] The bezel 220 is disposed around the side of the back cover 210 and the side of the display screen 100. Exemplarily, the bezel 220 can be adhered to the side of the back cover 210 and the side of the display screen 100 using adhesive. It should be noted that the side of the back cover 210 refers to the surface of the back cover 210 including the edge along the thickness direction, which is the surface of the back cover 210 excluding the larger area. Figure 1 The surface of the middle back cover 210 outside the XOY plane.

[0127] The meaning of the side of the display screen 100 can be understood by referring to the side of the back cover 210. In some other embodiments, the frame 220 and the back cover 210 can be an integrally formed structure.

[0128] The frame 220, back cover 210 and display screen 100 enclose the aforementioned receiving cavity 010. The position between the display screen 100 and the back cover 210 is indicated by the arrowed marking line in the figure to roughly illustrate the position of the receiving cavity 010.

[0129] The electronic device 000 further includes a middle plate 300 located between the display screen 100 and the back cover 210, and the side edges of the middle plate 300 are fixed by the frame 220. Exemplarily, as shown in Figure 2 the middle plate 300 and the frame 220 can be an integrally formed structure, and the integrally formed structure is generally referred to as a middle frame.

[0130] Of course, in some other embodiments, the middle plate 300 and the frame 220 can also be fixed by means of adhesive bonding, and the embodiments of the present application do not limit this.

[0131] The middle plate 300 serves as the structural "skeleton" of the electronic device 000, and is used to mount and fix the components of the electronic device 000, such as the display screen 100, the main board 400A, the auxiliary board 400B, the first battery 510, and the like. For the convenience of subsequent description, the middle plate 300 in Figure 2 the middle frame formed by the integrally formed middle plate 300 and the frame 220 and the components arranged on the middle frame are collectively referred to as a middle frame assembly 020.

[0132] Specifically, the middle plate 300 includes a support plate surface and a mounting plate surface arranged oppositely. The support plate surface faces the display screen 100 and is used to mount and support the display screen 100. The mounting plate surface of the middle plate 300 faces the back cover 210 and is used to mount and fix the main board 400A, the auxiliary board 400B, the first battery 510, and the like. The support plate surface can also be paved with a heat spreading plate (not shown in the figure) to facilitate heat dissipation of the main board 400A. The middle plate 300, the heat spreading plate, the main board 400A, the auxiliary board 400B, and the first battery 510 are collectively located in the accommodation cavity 010.

[0133] The main board 400A can be a circuit board integrated with a system on a chip (SOC), a universal flash storage (UFS), a camera module (CAM), a power management chip (not shown in the figure), and the like, and the auxiliary board 400B can be a circuit board integrated with a charging interface (such as Type C), a loudspeaker, and the like. In some other embodiments, the power management chip can also be integrated on the auxiliary board 400B.

[0134] Please refer to Figure 3 , Figure 3 for Figure 2 the planar schematic view of the middle frame assembly 020. Figure 3 From Figure 2 the side of the middle frame assembly 020 facing the back cover 210. Since the SOC and the UFS are arranged on the side of the main board 400A facing away from the back cover 210, they are shown by dashed lines in the figure.

[0135] The main board 400A can be electrically connected with the first charging FPC 611 (not shown in the figure) and the auxiliary board 400B, and electrically connected with the first battery 510 through the first battery FPC 621.

[0136] In the implementation process, the first charging FPC 611 can be electrically connected with the main board 400A and the auxiliary board 400B through FOB welding, connector (such as BTB, ZIF) buckling and the like. In the case that the first charging FPC 611 is electrically connected with the main board 400A and the auxiliary board 400B, the first charging FPC 611 can transmit signals between the main board 400A and the auxiliary board 400B, for example, transmit the charging signal obtained by the auxiliary board 400B through the charging interface to the power management chip of the main board 400A, so as to process the charging signal into a signal suitable for charging by the power management chip. Wherein, the FOB welding is a welding process of combining the FPC with the rigid circuit board.

[0137] The first battery FPC 621 can also be electrically connected with the main board 400A through FOB welding, connector (such as BTB, ZIF) buckling and the like.

[0138] In the case that the first battery FPC 621 is electrically connected with the main board 400A and the first battery 510, the first battery FPC 621 can transmit the electric energy of the first battery 510 to the main board 400A to realize power supply, and can also transmit the voltage, current, temperature and the like of the first battery 510 to the main board 400A to realize the functions of charge and discharge control, overheat protection and the like, and can also transmit the charging signal processed by the power management chip of the main board 400A to the first battery 510 to charge the first battery 510.

[0139] It should be noted that, in the implementation process, the electronic device 000 is not limited to Figure 1 and Figure 2 the forms shown. In some other embodiments, the electronic device 000 can also be a folding mobile phone, such as a double folding mobile phone, a triple folding mobile phone, a quadruple folding mobile phone and the like. In this case, the architecture of the middle frame assembly 020 is different, which will be illustrated below.

[0140] As Figure 4 shown, Figure 4 a planar schematic view of a middle frame assembly of a double folding mobile phone in an unfolded state is provided in the embodiments of the present application.

[0141] The middle frame assembly 020 includes a first middle frame assembly 021 and a second middle frame assembly 022, and the first rotating shaft 025 is rotatably connected between the first middle frame assembly 021 and the second middle frame assembly 022, so that the first middle frame assembly 021 and the second middle frame assembly 022 can rotate relatively close to each other or relatively far away from each other based on the first rotating shaft 025, so that the double folding mobile phone can be folded or unfolded.

[0142] Figure 4 the structure of the first middle frame assembly 021 in Figure 3 the structure of the middle frame assembly 020 is similar. In addition, Figure 4 The second middle frame assembly 022 is also included. The second middle frame assembly 022 includes a first auxiliary main board 400C and a second battery 520.

[0143] The first auxiliary main board 400C is a circuit board integrated with other components outside the SOC. The first auxiliary main board 400C and the main board 400A are electrically connected by the first through-axis FPC 631, and the first auxiliary main board 400C and the second battery 520 are electrically connected by the second battery FPC 622.

[0144] As shown in Figure 5 , Figure 5 A planar schematic view of the middle frame assembly of a three-fold mobile phone in a flat state is provided for the embodiments of the present application.

[0145] Figure 5 The third middle frame assembly 023 and the second rotating shaft 026 are also added on the basis of Figure 4 The first middle frame assembly 021 is located between the second middle frame assembly 022 and the third middle frame assembly 023.

[0146] The first rotating shaft 025 is rotationally connected between the first middle frame assembly 021 and the second middle frame assembly 022, so that the first middle frame assembly 021 and the second middle frame assembly 022 can be relatively rotated towards each other or away from each other based on the first rotating shaft 025, thereby enabling the three-fold mobile phone to be folded (fully folded or half-folded) or unfolded.

[0147] The second rotating shaft 026 is rotationally connected between the first middle frame assembly 021 and the third middle frame assembly 023, so that the first middle frame assembly 021 and the third middle frame assembly 023 can be relatively rotated towards each other or away from each other based on the second rotating shaft 026, thereby enabling the three-fold mobile phone to be folded (fully folded or half-folded) or unfolded.

[0148] The third middle frame assembly 023 includes a second auxiliary main board 400D and a third battery 530. The second auxiliary main board 400D is a circuit board integrated with other components outside the SOC. The second auxiliary main board 400D and the main board 400A are electrically connected by the second through-axis FPC 632, and the second auxiliary main board 400D and the third battery 530 are electrically connected by the third battery FPC 623.

[0149] In addition, Figure 5 The auxiliary board 400B is provided in the second middle frame assembly 022. The auxiliary board 400B is electrically connected to the first auxiliary main board 400C by the first charging FPC 611. As shown in Figure 6 , Figure 6Another three-fold mobile phone middle frame assembly provided by the embodiment of the present application is shown in the planar schematic view in the unfolded state.

[0150] Different from Figure 5 , Figure 6 In the middle frame assembly 020 shown in the figure, the second middle frame assembly 022 is located between the first middle frame assembly 021 and the third middle frame assembly 023, and in this case, the second rotating shaft 026 is rotationally connected between the second middle frame assembly 022 and the third middle frame assembly 023, so that the second middle frame assembly 022 and the third middle frame assembly 023 can rotate relatively close to each other or relatively far away from each other based on the second rotating shaft 026, thereby enabling the three-fold mobile phone to be folded (completely folded or half-folded) or unfolded.

[0151] In the figure, the main board 400A is electrically connected with the first auxiliary main board 400C and the second auxiliary main board 400D through the third through-axle FPC 633. In addition, the auxiliary board 400B is arranged in the first middle frame assembly 021. The auxiliary board 400B is electrically connected with the main board 400A through the first charging FPC 611.

[0152] As Figure 7 shown, Figure 7 A four-fold mobile phone middle frame assembly provided by the embodiment of the present application is shown in the planar schematic view in the unfolded state.

[0153] Figure 7 On the basis of Figure 6 , a fourth middle frame assembly 024 and a third rotating shaft 027 are added. In the figure, the third rotating shaft 027 is rotationally connected between the third middle frame assembly 023 and the fourth middle frame assembly 024, so that the third middle frame assembly 023 and the fourth middle frame assembly 024 can rotate relatively close to each other or relatively far away from each other based on the third rotating shaft 027, thereby enabling the three-fold mobile phone to be folded (completely folded or half-folded) or unfolded.

[0154] In the figure, the fourth middle frame assembly 024 includes a third auxiliary main board 400E and a fourth battery 540. The third auxiliary main board 400E is a circuit board integrated with other components outside the SOC. The second auxiliary main board 400D and the third auxiliary main board 400E are electrically connected through the fourth through-axle FPC 634, and the third auxiliary main board 400E and the fourth battery 540 are electrically connected through the fourth battery FPC 624.

[0155] Figure 4 to Figure 7 In the figure, the electrical connection mode of the FPC and the circuit board includes but is not limited to one of the following modes: FOB welding, connector (such as BTB, ZIF) buckling, etc.

[0156] It should be noted that, Figure 4 to Figure 7In the specific implementation process, the arrangement mode of each middle frame assembly and the components included in the middle frame assembly are not limited by the structure shown in the drawings.

[0157] With the development of 5G technology, AI technology and other technologies, the performance requirements for electronic devices such as mobile phones are getting higher and higher, and the circuit board of the electronic device needs to be laid out with more and more components to meet the increasing performance requirements of the electronic device. However, the internal space of the electronic device is relatively cramped, especially portable terminal devices. Limited by the internal space of the electronic device, the layout area available for laying out components on the circuit board is limited, and therefore, the structure of the circuit board needs to be optimized to obtain more layout area to facilitate the layout of more components in the limited internal space.

[0158] At present, a plurality of circuit boards are usually stacked to centrally arrange more electronic components to fully utilize the internal space of the electronic device. The following will be exemplarily described in combination with Figure 8 .

[0159] Exemplarily, please refer to Figure 8 , Figure 8 the cross-sectional view of the middle frame assembly 020 shown in FIG. 2B. Figure 3

[0160] In the middle frame assembly 020, the positions of the corresponding area one and area two of the upper surface of the application processor (AP) board 401 are stacked with the frame board (also referred to as FB board) 402, and the position of the corresponding area four of the upper surface of the AP board 401 is stacked with the frame board 404.

[0161] The position of the corresponding area one of the frame board 402 is configured as a slot-shaped structure 4021 with the notch facing the AP board 401.

[0162] The position of the corresponding area two of the frame board 402 is configured as a slot-shaped structure with two shared slot bottom plates, the notch of the lower slot-shaped structure 4022 faces the AP board 401, and the notch of the upper slot-shaped structure 4023 faces away from the AP board 401; the notch of the upper slot-shaped structure 4023 is stacked with the radio frequency (RF) board 403, and in this case, the notch of the upper slot-shaped structure 4023 faces the RF board 403. The RF board 405 is stacked above the frame board 404.

[0163] ​Thus, the upper and lower plate surfaces of the AP board 401, the upper and lower plate surfaces of the groove bottom plate of the groove-shaped structure 4021, the upper and lower plate surfaces of the groove bottom plate shared by the frame groove-shaped structure 4022 and the groove-shaped structure 4023, the upper and lower plate surfaces of the RF 403, and the upper and lower plate surfaces of the RF 405 can all be laid with components, which are schematically shown by black rectangular blocks in the figure. Obviously, compared with a single-layer circuit board, the structure of the circuit board can integrate more components.

[0164] It should be noted that the AP board is a circuit board for integrating an AP. In a specific implementation process, the AP can be a sub-module integrated in a SOC, in which case the AP board is a circuit board for integrating the SOC. The RF board is a circuit board integrating a radio frequency device. For example, the radio frequency device can be one or more of a PA, an LNA, a filter, a radio frequency switch, an antenna tuner, and the like.

[0165] Figure 8 In this case, the AP board 401, the frame board 402, the RF board 403, the frame board 404, the RF board 405, and the components mounted on these circuit boards by a non-detachable mounting manner (a manner that can be detached by non-violent means) can be regarded as a whole as the main board 400A in Figure 3 On the contrary, for the components mounted by a detachable mounting manner, they can not be regarded as part of the main board 400A in Figure 3 For example, the plug-in manner of the BTB connector is regarded as a detachable mounting manner, and welding is regarded as a non-detachable mounting manner.

[0166] Figure 8 The middle board 300 and the vapor chamber 600 are also shown in the view. The middle board 300 is located on the side facing the lower plate surface of the AP board 401, and the vapor chamber 600 is located on the side of the middle board 300 facing away from the AP board 401, i.e., the side of the middle board 300 facing the support plate surface.

[0167] In order to facilitate heat dissipation by the vapor chamber 600, Figure 8 In this case, the SOC 406 is laid on the lower plate surface of the AP board 401 and faces the opening of the middle board 300. The side of the SOC 406 facing away from the AP board 401 is also provided with a copper sheet 407, which is bonded to the vapor chamber 600 on the opposite side of the middle board 300 through the heat-conducting gel 700 located in the opening. In this way, the heat of the SOC 406 can be transmitted to the vapor chamber 600 through the copper sheet 407 and the heat-conducting gel 700, thereby achieving a heat dissipation effect.

[0168] Figure 8The shown view also shows the Deco part 900 and the CAM 800. The Deco part 900 is located above the frame board 402, the RF board 403, and the RF board 405. There can be multiple Deco protrusions on the Deco part 900, and the Deco protrusions protrude in the direction away from the AP board 401 to provide more installation space for the CAM 800. The CAM 800 is installed at the position corresponding to Region Three of the middle board 300 and extends through the AP board 401 towards the Deco protrusions of the Deco part 900.

[0169] It should be noted that currently, most FB boards are of a closed ring structure. Please refer to Figure 9 , Figure 9 which is a schematic plan view of the main board 400A provided by the embodiment of the present application.

[0170] Figure 9 In

[0171] , three circular regions are circled by thick black dotted lines, namely the circular region one 400A1, the circular region two 400A2, and the circular region three 400A3. These three circular regions are the closed circular areas enclosed by the FB board of the closed ring structure. Components can be laid on the inner sides of these closed circular areas, but other circuit boards need to be connected to the board body of the FB board.

[0171] Taking Figure 8 the partial structure of the main board involved in Region Four in Figure 10 and Figure 11 as an example, please combine Figure 10 and Figure 8 which is a schematic plan view of the frame board 404 in Figure 11 and Figure 8 which is a schematic cross-sectional view corresponding to the main board in Region Four in Figure 11 The cutting line corresponding to the cross-section of Figure 10 can pass through the position P3 - P3 shown in

[0172] The frame board 404 is of a closed ring structure in the shape of a "hui" character, which makes it impossible to lay local components at the connection positions between the frame board 404 and the upper and lower AP boards 401 and RF boards 405 respectively. <000048​​​​Any one of the circuit boards in the circuit board structure, such as a main board, a sub-board, and a sub-main board. The circuit board structure can provide more layout area to layout more components, thereby improving the layout density of the circuit board structure. The following takes the main board 400A shown in Figure 2 as an example, and in combination with Figure 8 to Figure 43 The circuit board structure provided by the embodiments of the present application is exemplarily described.

[0175] Exemplarily, please refer to Figure 12 , Figure 12 A cross-sectional schematic view of a circuit board structure provided by the embodiments of the present application.

[0176] Figure 12 The circuit board structure 400 shown in Figure 12 The stacking architecture of the main board involved in the fourth area in the circuit board structure is exemplarily described, including the first circuit board 410, the first frame board 430, and the second circuit board 420 stacked in the Z-axis direction.

[0177] It can be understood that, Figure 12 Some components included in the circuit board structure 400 are only exemplarily shown in the drawings, and in the specific implementation process, the circuit board structure can include more or fewer components, and the actual shape, actual size, actual position, and actual structure of each component are not limited by the structure shown in the drawings.

[0178] The first circuit board 410 and the second circuit board 420 refer to printed circuit boards (also known as PCBs) used to integrate and electrically connect one or more electronic components. The components integrated in the first circuit board 410 and the second circuit board 420 are shown by black filled graphics in the drawings. The first circuit board 410 and the second circuit board 420 can integrate electronic components on both sides or on one side, such as Figure 12 In the drawings, the upper board surface and the lower board surface of the first circuit board 410 both integrate electronic components, and the upper board surface of the second circuit board 420 integrates electronic components.

[0179] Exemplarily, in the case of the circuit board structure 400 being the main board 400A shown in Figure 2 , the first circuit board 410 can be an AP board, and the second circuit board 420 can be an RF board.

[0180] The second circuit board 420 is arranged in a board surface opposite manner with the first circuit board 410.

[0181] It should be noted that the board surface of the circuit board refers to the surface with a larger area on the circuit board, which includes the length side and the width side of the circuit board. The second circuit board 420 is arranged in a board surface opposite manner with the first circuit board 410, which means that the board surface of the second circuit board 420 and the board surface of the first circuit board 410 are opposite to each other.

[0182] Generally, the board surface of the circuit board is perpendicular to the thickness direction of the circuit board. In this case, the first circuit board 410 and the second circuit board 420 are stacked in the thickness direction, so that the board surface of the second circuit board 420 and the board surface of the first circuit board 410 are opposite to each other. The first circuit board 410 and the second circuit board 420 are stacked in the thickness direction, which means that the thickness direction of the second circuit board 420 and the thickness direction of the first circuit board 410 are in the same direction, such as both in the direction of the Z axis shown in the figure, and the orthographic projection of the second circuit board 420 along the thickness direction at least partially overlaps the first circuit board 410.

[0183] The first frame plate 430 serves as a rack body for the first circuit board 410 and the second circuit board 420 to be stacked, and is fixed between the first circuit board 410 and the second circuit board 420 to realize the stacking of the first circuit board 410 and the second circuit board 420.

[0184] The first frame plate 430 is fixed between the first circuit board 410 and the second circuit board 420, which means that the first frame plate 430 is located between the first circuit board 410 and the second circuit board 420, and is fixed to the first circuit board 410 and the second circuit board 420, such as by soldering through solder pads and solder balls.

[0185] In this case, the first circuit board 410, the first frame plate 430, and the second circuit board 420 are stacked in sequence, such as along the Z axis direction. This embodiment concentrates more electronic components in the form of stacked circuit boards to make full use of the internal space of the electronic device.

[0186] It should be noted that the first frame plate 430 can also serve to electrically connect the first circuit board 410 and the second circuit board 420. Specifically, the first frame plate 430 can be provided with some metal vias 430f to facilitate the filling of tin in the metal vias 430f, thereby respectively electrically connecting the first circuit board 410 and the second circuit board 420.

[0187] Among them, the first frame plate 430, the first circuit board 410 and the second circuit board 420 form a first cavity 400a. The first cavity 400a is used to accommodate components fixed to the lower board surface of the second circuit board 420 and / or the upper board surface of the first circuit board 410, Figure 12 The first cavity 400a is shown to accommodate components fixed to the upper board surface of the first circuit board 410.

[0188] Optionally, the first cavity 400a extending from the first circuit board 410 to the second circuit board 420 can be unobstructed without a blocking structure.

[0189] Please continue to refer to Figure 12The first frame plate 430 includes a through hole 430b. Exemplarily, the first frame plate 430 can be configured as a ring structure, and the through hole 430b is an inner region of the ring structure. It should be noted that the ring structure here does not specifically refer to a circular ring structure, but can be a rectangular ring structure. One end of the through hole 430b extends to the first circuit board 410, and the other end of the through hole 430b extends to the second circuit board 420, forming the first cavity 400a from the first circuit board 410 to the first circuit board 410.

[0190] In this embodiment, because the first frame plate 430 is provided with the through hole 430b, on the one hand, the material required by the first frame plate 430 is less, which can reduce the material cost; on the other hand, the first cavity 400a is unobstructed and does not have a blocking structure (such as a partition), and the first cavity 400a can accommodate components with a height of at most the length of the through hole 430b.

[0191] In order to improve the layout density of the circuit board structure 400, the first frame plate 430 in Figure 12 , Figure 12 may include a first notch 430a.

[0192] Exemplarily, the forming process of the first notch 430a on the first frame plate 430 in Figure 13 , Figure 13 is shown in the schematic view of Figure 12 .

[0193] Figure 13 The second frame plate on the right is the first frame plate 430 in Figure 12 , that is, the first frame plate 430 with the first notch 430a. The first frame plate 430 includes three frame bodies, namely a first frame body 431, a second frame body 432, and a third frame body 433. The first frame body 431, the third frame body 433, and the second frame body 432 are connected in sequence. Among them, the three frame bodies include two groups of adjacent frame bodies, one group of adjacent frame bodies composed of the first frame body 431 and the third frame body 433, and one group of adjacent frame bodies composed of the third frame body 433 and the second frame body 432. Adjacent frame bodies refer to two frame bodies that are adjacent in connection order.

[0194] Among them, the adjacent two frame bodies are arranged at an angle, Figure 13 which shows the case that the adjacent two frame bodies are arranged at an angle of 90°. Of course, in some other embodiments, the first frame body 431 and the second frame body 432 can also be arranged at other angles, such as 108°, 120°, etc., which are not limited in the embodiments of the present application. In addition, the angles between each group of adjacent two frame bodies can be the same or different, Figure 13 which shows the same case.

[0195] It should be noted that the two adjacent frame bodies are arranged at an angle, which makes the two adjacent frame bodies have a corner area 430c. The corner area 430c can be regarded as a region of one of the two adjacent frame bodies that connects the other frame body. It should be noted that the corner area 430c can be regarded as a region of any one of the two adjacent frame bodies.

[0196] The three frame bodies are connected in sequence, and the first and last frame bodies in the connection sequence are end frame bodies with free ends. The first and last frame bodies are the first frame body 431 and the second frame body 432, respectively. That is, the first frame body 431 and the second frame body 432 are both end frame bodies with free ends.

[0197] By adjusting the angle between the two adjacent frame bodies, the free end of the first frame body 431 and the free end of the second frame body 432 can be arranged at intervals to form a first gap 430a between the free end of the first frame body 431 and the free end of the second frame body 432.

[0198] Figure 13 The first frame plate 430 shown as a whole is a non-closed ring structure with a gap. It should be noted that the ring structure does not specifically refer to a circular ring structure, such as Figure 13 In this embodiment, the first frame plate 430 is a rectangular ring structure.

[0199] It should be noted that Figure 13 The frame plate on the left is the first frame plate 430 before the first gap 430a is set, which is a closed ring structure, specifically a closed rectangular ring structure. In the specific implementation process, the frame plate on the left can be cut off at one side to obtain Figure 13 The frame plate on the left is a closed rectangular ring structure. In the specific implementation process, the frame plate on the left can be cut off at one side to obtain Figure 33 The first frame plate 430 on the right has a first gap 430a, and in this case, the shape of the first frame plate 430 is roughly a "concave" shape.

[0200] In the specific implementation process, the first gap 430a can be provided at a position where there is a redundant solder pad or a position where a higher connection strength is required, because there are more solder pads at this position, which occupies a larger layout area. By providing the first gap 430a, more layout area can be obtained. In order to provide the required connection strength, a compensation scheme provided later can be used for compensation.

[0201] It can be seen that the embodiment provides a specific implementation scheme of the first frame plate 430 and the first gap 430a of the first frame plate 430. In this implementation scheme, because the two adjacent frame bodies are arranged at an angle, the strength of the first frame plate 430 can be improved.

[0202] It should be noted that in some other embodiments, the first frame plate 430 can further include more or less segments of frame bodies, and the non-enclosed ring structure formed by sequentially connecting these frame bodies can have different shapes. Details will be described later. Figure 34 and Figure 12 are described by way of example.

[0203] Please continue to refer to Figure 12 , the first gap 430a extends from the back of the first circuit board 410 to the first circuit board 410 (such as along the Z-axis direction), such as extending to the second circuit board 420, and penetrating the first cavity 400a and the outside of the first cavity 400a, for accommodating the first component 440 fixed to the first circuit board 410 (such as along the Z-axis direction).

[0204] Figure 12 In the case of , the first gap 430a of the first frame plate 430 is distributed on the right side in the Y-axis direction. Because the first component 440 can pass through the first gap 430a, it can block part of the right side area of the first frame plate 430. In the figure, the first gap 430a of the first frame plate 430 is shown by showing that the first component 440 blocks part of the right side area of the first component 440. In addition, Figure 12 In the case of , the first component 440 accommodated by the first gap 430a extends from the first circuit board 410 to the second circuit board 420, indicating that the first gap 430a extends from the first circuit board 410 to the second circuit board 420.

[0205] It can be understood that when the first gap 430a extends to the second circuit board 420, the first gap 430a can also be used to accommodate components fixed to the second circuit board 420. Of course, in some other embodiments, the first gap 430a can not extend to the second circuit board 420.

[0206] Figure 14 It is shown that the first component 440 includes the first shielding cover 441 and the electronic component (such as a radio frequency device) inside the first shielding cover 441. Among them, the first shielding cover 441 is fixed to the first circuit board 410, and the first shielding cover 441 and the first circuit board 410 form a first shielding cavity. The electronic component is fixed to the board area of the first circuit board 410 inside the first shielding cavity.

[0207] Optionally, please refer to Figure 14 , Figure 12 for Figure 12 the first gap 430a of the first frame plate 430 in and the position relationship of the first shielding cover 441 and the electronic component 442 inside it. Due to the shielding reason, the electronic component 442 inside the first shielding cover 441 cannot be shown, so its position is roughly shown by a dashed line.

[0208] Since the first gap 430a penetrates the outer side of the first chamber 400a and the first chamber 400a, the first shield 441 and the electronic components 442 inside the first shield 441 can extend from the first chamber 400a to the outer side of the first chamber 400a through the first gap 430a.

[0209] In the case that the layout area of the region of the first circuit board 410 opposite to the first gap 430a is relatively tight, the embodiment extends the first shield 441 and the electronic components 442 inside the first shield 441 to the outer side of the first chamber 400a to fix the first shield 441 and the electronic components 442, which can avoid the first shield 441 and the electronic components 442 from occupying the layout area of the region of the first circuit board 410 opposite to the first gap 430a, which is already tight.

[0210] Of course, in other embodiments, the first shield 441 and the electronic components 442 inside the first shield 441 can extend from the first chamber 400a to the first gap 430a, but not to the outer side of the first chamber 400a, or the first shield 441 and the electronic components 442 inside the first shield 441 can only be located in the first gap 430a, without occupying the space of the first chamber 400a and the outer side thereof.

[0211] It should be noted that, Figure 35 The first component 440 is taken as an example to be described. In other embodiments, the first component 440 can also include other electronic components 442 without shielding requirements, such as resistors and the like, in which case the first component 440 can not include the first shield 441; or in other embodiments, in the case that the electronic components 442 inside the first shield 441 are located in the first chamber 400a and do not occupy the first gap 430a, the first component 440 can include the first shield 441 but not the electronic components 442.

[0212] In addition, in other embodiments, the first component 440 can also be other types of structures, such as a circuit board and the like, which will be described later in detail through the embodiments shown. Figure 12 The embodiments shown are taken as an example to be described.

[0213] Figure 2 In the circuit board structure 400 shown, the first gap 430a extends from the first circuit board 410 to a direction away from the first circuit board 410, which can accommodate the first component 440 fixed in the region of the first circuit board 410 opposite to the first gap 430a.

[0214] It can be seen that, by opening the first gap 430a, the area of the first circuit board 410 opposite the first gap 430a is saved, and the first component 440 can be arranged, thereby improving the layout density of the circuit board structure 400. For example, the layout density is improved by 30%.

[0215] In addition, since the first gap 430a penetrates the first chamber 400a and the outside of the first chamber 400a, the first chamber 400a is an open space, which is more conducive to the heat dissipation performance of the circuit board structure 400. It should be noted that, in the case of the mainboard 400A shown in Figure 15 , the heat dissipation object is usually the SOC on the mainboard 400A. With the improvement of the heat dissipation performance, the heat of the SOC can be quickly dissipated, thereby improving the operation performance of the electronic device, such as the AI performance.

[0216] In addition, in the case where a component is arranged in the first chamber 400a, since the first gap 430a penetrates the first chamber 400a and the outside of the first chamber 400a, the component inside the first chamber 400a is visible, which is more conducive to the maintenance and positioning of the component inside the first chamber 400a.

[0217] In addition, since the first frame plate 430 is provided with the first gap 430a, less material is required, and the material cost is lower.

[0218] It should be noted that, since the first frame is provided with the first gap 430a, the fixing area of the first frame plate 430 with the first circuit board 410 and the second circuit board 420 is smaller, which makes the connection reliability between the first frame plate 430 and the first circuit board 410 and the second circuit board 420 worse. Based on this, it is necessary to compensate for the deteriorated connection reliability. Next, the compensation scheme adopted by the circuit board structure 400 in Figure 12 will be exemplarily described. Figure 15

[0219] Exemplarily, please refer to Figure 15 , Figure 12 for another cross-sectional view and component schematic diagram of the circuit board structure 400 shown in Figure 15 .

[0220] Among them, Figure 12 (a) in Figure 15 corresponds to the cross-sectional position of the cross-sectional line P2-P2 in Figure 15 , which shows the cross section of the circuit board structure 400; Figure 15 (b) in Figure 15 corresponds to the perspective view of the lower plate surface of the second circuit board 420 in(a) in Figure 15The upper plate surface perspective view of the first frame plate 430 in (a) in FIG. 4 shows the first frame plate 430; Figure 15 The perspective view from below of the first frame plate 430 in (d) in FIG. 4 shows the first frame plate 430; Figure 15 The upper plate surface perspective view of the first circuit board 410 in (a) in FIG. 5 shows the first circuit board 410; Figure 15 The perspective view from below of the first circuit board 410 in (e) in FIG. 5 shows the first circuit board 410; Figure 15 The upper plate surface perspective view of the first shielding cover 441 in (a) in FIG. 6 shows the first shielding cover 441; Figure 15 The perspective view from below of the first shielding cover 441 in (f) in FIG. 6 shows the first shielding cover 441. Figure 15 The perspective view from below of the first shielding cover 441 in (e) in FIG. 6 shows the first shielding cover 441.

[0221] The first compensation scheme, as shown in (b) to (d) in FIG. 4, each frame body of the first frame plate 430 is provided with multiple rows of pads arranged along the width direction, so as to be respectively welded and fixed with the first circuit board 410 and the second circuit board 420 through the pads. The number of rows of pads is one or more, such as two rows or three rows, and the maximum value is fifty rows. Each row of pads has multiple pads, for example, five or more. In this way, the multiple rows of pads can make the welding more stable, thereby compensating the connection reliability. Figure 15 The second compensation scheme, as shown in (b) to (d) in FIG. 4, the pads of the second circuit board 420, the first frame plate 430 and the first circuit board 410 can be multiple small-area pads connected into a larger-area pad, for example, three circular pads in the same column are connected into an elongated pad 451, and for example, three circular pads not in the same straight line are connected into a triangular pad 452.

[0222] Figure 15 The larger-area pad can provide a larger fixing area, thereby compensating the connection reliability. Especially, the elongated pad and the triangular pad can better resist external forces such as vibration and impact compared with the circular pad, thereby ensuring the connection reliability of the welding point.

[0223] The third compensation scheme, as shown in (a) to (d) in FIG. 5, the entire side of the second circuit board 420, the first frame plate 430 and the first circuit board 410 has a plate edge electroplating area 453.

[0224] The fourth compensation scheme, as shown in (a) to (d) in FIG. 5, the plate edge electroplating area 453 of the second circuit board 420, the first frame plate 430 and the first circuit board 410 is connected through welding or bonding, etc. Figure 15 The length of the plate edge electroplating area is relatively long, and the connection reliability can be compensated by connecting the plate edge electroplating area of the first frame plate 430 with the plate edge electroplating area of the second circuit board 420 and the plate edge electroplating area of the first circuit board 410 through welding or bonding, etc.

[0225] The fourth compensation scheme, as shown in (a) to (d) in FIG. 5, the plate edge electroplating area 453 of the second circuit board 420, the first frame plate 430 and the first circuit board 410 is connected through welding or bonding, etc.

[0226] Figure 15 ​​As shown in (a), the first shield 441 fixes the first circuit board 410, extends through the first notch 430a to the second circuit board 420 and fixes the second circuit board 420.

[0227] Thus, the first shield 441 forms an additional connection link between the first circuit board 410 and the second circuit board 420, which helps to compensate for the loss of connection reliability due to the first notch 430a. In addition, the first shield 441 has a large fixed area and high strength, which can increase connection reliability.

[0228] It should be noted that in the relevant technology, the first frame plate 430 does not have a first notch 430a. One end of the first frame plate 430 at the location of the first notch 430a is soldered to the first circuit board 410, and the other end is soldered to the second circuit board 420, with the two ends connected by solder filling through metal vias. This connection path has four connection nodes, resulting in high impedance and insertion loss of the circuit board structure 400. It should be noted that connection nodes refer to the connection points of structures made of different materials.

[0229] and Figure 16 In the embodiment shown in (a), one end of the first shield 441 is fixed to the first circuit board 410, and the other end of the first shield 441 is fixed to the second circuit board 420. There are fewer connection nodes, lower impedance and insertion loss, and better performance of the circuit board structure 400, such as AI performance.

[0230] To enable the first shielding cover 441 to fix the second circuit board 420, optionally, please refer to... Figure 16 In section (d), a first insertion hole 421 is provided in the area of ​​the second circuit board 420 opposite to the first notch 430a. The first shielding cover 441 includes a first cover body 4411 and a first protrusion 4412. The first cover body 4411 and the first protrusion 4412 are integrally formed. The first protrusion 4412 extends into the first insertion hole 421 and fixes the hole wall of the first insertion hole 421, thereby realizing the first shielding cover 441 fixing the second circuit board 420.

[0231] Optionally, please refer to the following: Figure 15 , Figure 15 for Figure 15 The diagram shows a partial cross-sectional view of the second circuit board obtained by cutting along the section line P6-P6. The first socket 421 is a metallized hole, meaning that the wall of the first socket 421 is a metal layer. Thus, after the first protrusion 4412 extends into the first socket 421, it can be fixed by reflow soldering and also serve as a conductor.

[0232] It should be noted that the integral molding of the first cover 4411 and the first protrusion 4412 means that the first protrusion 4412 and the first cover 4411 are formed in one piece using the same material through injection molding or other integral molding processes, without secondary processing. It can be understood that because the first protrusion 4412 needs to extend into the first insertion hole 421 for fixation, the first protrusion 4412 and the first insertion hole 421 are opposite each other in the Z-axis direction.

[0233] It should be noted that before the first notch 430a is set, the first frame board 430 is connected to the first circuit board 410 and the second circuit board 420 respectively through multiple rows of pads at the location of the first notch 430a. Due to process and other factors, there are limitations on the minimum size and spacing of the pads, making it impossible to achieve extremely narrow connections, and the multiple rows of pads occupy a large layout area of ​​the second circuit board 420.

[0234] Compared to the first frame plate 430 without the first notch 430a, in this embodiment, the first protrusion 4412 of the first shield 441 extends into the first socket 421, resulting in higher connection reliability. The number of first sockets 421 can be reduced, eliminating the need for multiple rows. The layout area of ​​the second circuit board 420 occupied is smaller, and extremely narrow connections can be achieved.

[0235] Optionally, the number of first sockets 421 and the number of first protrusions 4412 are greater than or equal to two, so that the first shield 441 and the second circuit board 420 can be more securely connected. For example, Figure 17 In (a) shown, the number of first sockets 421 and the number of first protrusions 4412 are both four. In some other embodiments, the number of first sockets 421 and the number of first protrusions 4412 may be more or less, for example, one, two, three, five, etc.

[0236] Figure 17 In the embodiment shown in (a), since the first protrusion 4412 and the first cover 4411 are integrally formed, they can be regarded as a single structure. Therefore, the connection path does not introduce more connection nodes due to the setting of the first protrusion 4412; the number of connection nodes remains fewer, resulting in lower impedance and insertion loss of the circuit board structure 400 and better performance. Furthermore, the fixing method of the first protrusion 4412 extending into the first socket 421 and fixing the wall of the first socket 421 can form a larger connection area, making the connection more reliable and helping to compensate for the connection reliability loss caused by the setting of the first notch 430a.

[0237] Please refer to the reference. Figure 15 , Figure 17 for Figure 17 A schematic diagram of the structure in which the first protrusion 4412 of the first shielding cover 441 extends into the first socket 421 and is fixed.

[0238] First, as shown in (a) of FIG. 4A, the first protrusions 4412 of the first shielding cover 441 are inserted into the first insertion holes 421. In this case, part of the first protrusions 4412 extends out of the upper board surface of the second circuit board 420 through the first insertion holes 421, and part of the first protrusions 4412 does not extend out of the upper board surface of the second circuit board 420. Figure 18

[0239] Generally, the extension length of the first protrusions 4412 extending out of the upper board surface of the second circuit board 420 does not exceed the component height of the upper board surface of the second circuit board 420.

[0240] Of course, in other embodiments, all the first protrusions 4412 can not extend out of the upper board surface of the second circuit board 420, so as to obtain more layout area on the upper board surface of the second circuit board 420 to layout more components, thereby improving the layout density of the circuit board structure 400.

[0241] Second, as shown in (b) of FIG. 4A, tin paste 454 is injected into the position of the first insertion holes 421 for welding, so as to fix the first protrusions 4412 to the hole wall of the first insertion holes 421, thereby realizing the fixation of the first shielding cover 441 to the second circuit board 420. Figure 18

[0242] Of course, in other embodiments, the fixation can also be realized through other ways. For example, please refer to Figure 15 Figure 33 The structure schematic diagram of the first protrusions 4412 of the first shielding cover 441 extending into and being fixed to the first insertion holes 421 is provided for other embodiments of the present application.

[0243] The first protrusions 4412 and the hole wall of the first insertion holes 421 can be fixed through the underfill (UF) glue injected into the first insertion holes 421. It should be noted that in the case of using the adhesion method for fixation, the reflow welding times can be reduced, thereby improving the connection reliability of the circuit board structure 400. In addition, the UF glue has greater flowability, and is more likely to flow into the first insertion holes 421, so that the connection reliability of the first protrusions 4412 and the hole wall of the first insertion holes 421 is stronger.

[0244] Optionally, please continue to refer to Figure 27 to Figure 30 The first protrusions 4412 are in a cylindrical structure, and the first insertion holes 421 are circular. It should be noted that in the case that the first protrusions 4412 in the cylindrical structure extend into the first insertion holes 421, the first protrusions 4412 are more likely to be fixed to the first insertion holes 421, but it is not easy to align and extend into the first insertion holes 421.

[0245] In addition, the first protrusions 4412 in the cylindrical structure and the first shielding cover 441 need to be processed through an integral molding process such as injection molding, and the processing process is more complex. ​​​

[0246] Of course, in other embodiments, the first protrusion 4412 can also have other structures, and the first insertion hole 421 can also have other shapes. For example, the first protrusion 4412 can also be a conical structure, and the first insertion hole 421 can also be an elongated hole. Further details will follow. Figure 31 The embodiments shown are illustrated by way of example.

[0247] Furthermore, in some other embodiments, the method by which the first shielding cover 441 fixes the second circuit board 420 can also be in other ways, such as... Figure 32 An example of welding or bonding, for instance, Figure 15 or Figure 15 The diagram illustrates the spring-loaded connection. It should be noted that using a non-soldering method for fixation reduces the number of reflow soldering cycles, thereby improving the connection reliability of the circuit board structure 400.

[0248] The fourth compensation option, such as Figure 15 As shown in (c), the first frame plate 430 includes at least one first fixing hole 430d, and two first fixing holes 430d are shown in the figure. Figure 19 As shown in (b) of the diagram, the second circuit board 420 includes a second mounting hole 422 opposite to the first mounting hole 430d. Figure 19 As shown in (d), the first circuit board 410 includes a third fixing hole 411 opposite to the first fixing hole 430d.

[0249] Please refer to the reference. Figure 15 , Figure 15 for Figure 15 A cross-sectional view of another section of the circuit board structure 400. This section passes through the first fixing hole 430d (specifically through...). Figure 15 The indicated locations are P4-P4), the second fixing hole 422, and the third fixing hole 411.

[0250] The circuit board structure 400 also includes a first fixing member 460, such as a screw. In this case, the aforementioned fixing holes can be screw holes. The first fixing member 460 extends into the first fixing hole 430d, the second fixing hole 422, and the third fixing hole 411 to fix the first frame plate 430, the second circuit board 420, and the first circuit board 410, respectively.

[0251] In this embodiment, at least one first fixing hole 430d is arranged on the first frame plate 430, and a second fixing hole 422 and a third fixing hole 411 are arranged on the second circuit board 420 and the first circuit board 410 respectively at corresponding positions, so that the first frame plate 430, the second circuit board 420 and the first circuit board 410 are fixed respectively by the first fixing member 460 inserted into the first fixing hole 430d, the second fixing hole 422 and the third fixing hole 411, thereby compensating the connection reliability of the first frame plate 430 with the first circuit board 410 and the second circuit board 420 respectively.

[0252] Please continue to refer to Figure 15 (c), the first frame plate 430 is provided with two first fixing holes 430d. The two first fixing holes 430d are respectively located at the corner areas 430c of the first frame body 431 and the third frame body 433, and the corner areas 430c of the third frame body 433 and the first frame body 431.

[0253] In this embodiment, the first fixing hole 430d is arranged at the corner area 430c of the adjacent two frame bodies, so that the adjacent two frame bodies share one first fixing hole 430d and are connected with the first circuit board 410 and the second circuit board 420 respectively, thereby reducing the number of first fixing holes 430d on the first frame plate 430, and facilitating the simplification of the circuit board structure 400 and the processing steps.

[0254] In addition, since the first fixing hole 430d needs to be fixed with the second fixing hole 422 and the third fixing hole 411, with the reduction of the number of first fixing holes 430d, the number of second fixing holes 422 and third fixing holes 411 is also reduced, and the layout area of the second circuit board 420 and the third circuit board occupied by the second fixing hole 422 and the third fixing hole 411 is reduced, thereby saving more layout area for more components, thereby improving the layout density of the circuit board structure 400.

[0255] It should be noted that the number and distribution position of the first fixing hole 430d are not limited to Figure 15 (c) shown in (c). In the specific implementation process, the number and distribution position of the first fixing hole 430d can be set for the purpose of each frame body having at least one first fixing hole 430d.

[0256] In this case, each frame body can be fixed with the first circuit board 410 and the second circuit board 420 respectively by using at least one first fixing hole 430d, thereby improving the connection reliability of the first frame plate 430 with the first circuit board 410 and the second circuit board 420 respectively.

[0257] It is to be noted that the first fixing hole 430d of the corner area 430c of the two adjacent frame bodies is regarded as a first fixing hole 430d of each of the two adjacent frame bodies.

[0258] For example, Figure 15 In (c) of FIG. 4, the left first fixing hole 430d is located at the corner area 430c of the first frame body 431 and the third frame body 433, and is simultaneously the first fixing hole 430d of the first frame body 431 and the first fixing hole 430d of the third frame body 433.

[0259] The right first fixing hole 430d is located at the corner area 430c of the third frame body 433 and the second frame body 432, and is simultaneously the first fixing hole 430d of the third frame body 433 and the first fixing hole 430d of the second frame body 432.

[0260] In this case, the first frame body 431 has one first fixing hole 430d, the second frame body 432 has one first fixing hole 430d, and the third frame body 433 has one first fixing hole 430d.

[0261] Optionally, Figure 20 In the circuit board structure 400 shown in FIG. 4, the following size requirements can be met: Table 1

[0262] It is to be noted that the opposite edge position S3 of the second circuit board 420 refers to the position of the edge of the first peripheral side of the end frame body opposite to the second circuit board 420.

[0263] At present, the circuit board structure 400 can meet the size requirements shown in Table 1 above and meet the connection reliability requirements through a lower-cost process.

[0264] Figure 20 The circuit board structure 400 shown in (a) of FIG. 4 can be processed based on the processing process shown in FIG. 5. Figure 20

[0265] Exemplarily, please refer to Figure 15 , Figure 23 to Figure 28 is Figure 21 The processing process of the circuit board structure 400 in FIG. 4.

[0266] First, the device is welded on the lower plate surface of the first circuit board 410.

[0267] Second, the device (such as PMU) is welded on the upper plate surface of the first circuit board 410.

[0268] ​Then, the first shield 441 and the first frame plate 430 are welded on the upper plate surface of the first circuit board 410.

[0269] Then, the first receptacle 421 of the second circuit board 420 is inserted into the first protrusion 4412 of the first shield 441, and the first frame plate 430 and the lower plate surface of the second circuit board 420 are fixed. In the implementation, the devices on the upper plate surface of the second circuit board 420 can be welded before the first frame plate 430 on the lower plate surface, so as to reduce the reflow times.

[0270] Finally, the first receptacle 421 is sprayed with tin by a tin spraying device, so that the first protrusion 4412 fixes the hole wall of the first receptacle 421.

[0271] It should be noted that in other embodiments, other compensation schemes can also be used, which will be described below in conjunction with Figure 21 for exemplary description.

[0272] The fifth compensation scheme can fix the area of the second circuit board 420 opposite to the first gap 430a by other shields, so as to compensate for the lost connection reliability.

[0273] For example, please refer to Figure 21 , Figure 15 for another cross-sectional view of the circuit board structure 400 provided by the embodiments of the present application. Figure 21 The cross-sectional view angle shown can refer to the cross-sectional view angle shown in (a) of FIG. 4. Figure 15

[0274] In this embodiment, the circuit board structure 400 further includes a second shield 480, which includes a second shield body 481, a second protrusion 482, and a shield pad 483. The shield pad 483 and the second protrusion 482 both fix the bottom end of the second shield body 481, and the second shield body 481 is fixed to the upper plate surface of the second circuit board 420 through the shield pad 483, so as to be fixed to the side of the second circuit board 420 opposite to the first circuit board 410. The second protrusion 482 at the bottom end of the second shield body 481 extends into the second receptacle 423 of the area of the second circuit board 420 opposite to the first gap 430a and fixes the hole wall of the second receptacle 423.

[0275] The specific implementation of the second protrusion 482 and the second receptacle 423 can refer to the related description of the first protrusion 4412 and the first receptacle 421.

[0276] It should be noted that the second receptacle 423 can be the first receptacle 421, Figure 21 which is shown in this case; or can be a receptacle independent of the first receptacle 421.

[0277] ​In the case that the second jack 423 is not the first jack 421, Figure 15 the scheme in which the first protrusion 4412 of the first shield 441 extends into the first jack 421 to be fixed can be replaced by the scheme in which the second protrusion 482 of the second shield 480 extends into the first jack 421 and fixes the hole wall of the first jack 421, Figure 21 which is shown in the following figure. In other embodiments, the first protrusion 4412 of the first shield 441 and the second protrusion 482 of the second shield 480 can respectively extend into the first jack 421 from both ends of the first jack 421 and fix the hole wall of the first jack 421.

[0278] In the case that the second jack 423 is not the first jack 421, Figure 22 the scheme in which the first protrusion 4412 of the first shield 441 extends into the first jack 421 to be fixed and Figure 22 the scheme in which the second protrusion 482 of the second shield 480 extends into the second jack 423 and fixes the hole wall of the second jack 423 can be implemented simultaneously or separately.

[0279] In this embodiment, by setting the second protrusion 482 on the second shield, the connection reliability between the second shield 480 and the second circuit board 420 can be better, which helps to compensate for the loss of connection reliability due to the setting of the first gap 430a, especially in the case that the second circuit board 420 is also fixed with the first shield 441.

[0280] Please refer to Figure 21 , Figure 22 for the top view of the circuit board structure 400 in Figure 23 . In this embodiment, the second shield 480 can replace the originally set part of the shield pad 483 with the second protrusion 482, so as to improve the connection reliability between the second shield 480 and the second circuit board 420 without occupying the layout area of the upper surface of the second circuit board 420.

[0281] It should be noted that the position of the second protrusion 482 is not limited to the position shown in Figure 24 . In other embodiments, the position of the second protrusion 482 can be adjusted according to the position of the second jack 423 and the first gap, so as to set the second protrusion 482 at other positions of the bottom end of the second shield 480.

[0282] Exemplarily, please refer to Figure 23 and Figure 23 , Figure 15 for another cross-sectional view of the circuit board structure 400 provided by the embodiments of the present application, Figure 24 the cross-sectional view angle shown in Figure 23the cross-sectional view shown in (a) of FIG. 4A; Figure 23 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 24 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A.

[0283] Figure 25 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 26 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A.

[0284] The sixth compensation scheme can be combined with reference to the fifth compensation scheme. Figure 25 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 25 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 15 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 26 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 25 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 15 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 15 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A.

[0285] As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 27 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 27 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A.

[0286] As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A.

[0287] As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A.

[0288] The seventh compensation scheme can be combined with reference to the sixth compensation scheme.

[0289] As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 27 As shown in FIG. 4A, the cross-sectional view of the circuit board structure 400 is shown in (a) of FIG. 4A. Figure 15Another cross section and component schematic diagram of the circuit board structure 400 provided by the embodiment of the present application is shown in FIG. 4B. Figure 27 The cross section perspective shown in (a) of FIG. 4A can refer to the cross section perspective shown in (a) of FIG. 3A. Figure 15 The cross section perspective shown in (a) of FIG. 4A can refer to the cross section perspective shown in (a) of FIG. 3A. Figure 27 The perspective shown in (b) of FIG. 4A can refer to the perspective shown in (b) of FIG. 3A. Figure 15 The perspective shown in (b) of FIG. 4A can refer to the perspective shown in (b) of FIG. 3A. Figure 27 The perspective shown in (c) of FIG. 4A can refer to the perspective shown in (c) of FIG. 3A. Figure 15 The perspective shown in (c) of FIG. 4A can refer to the perspective shown in (c) of FIG. 3A. Figure 28 The perspective shown in (d) of FIG. 4A can refer to the perspective shown in (d) of FIG. 3A. Figure 28 The perspective shown in (d) of FIG. 4A can refer to the perspective shown in (d) of FIG. 3A.

[0290] The first frame plate 430 further comprises two reinforcing bodies 436, which respectively fix the first circuit board 410 and the second circuit board 420. Moreover, the reinforcing bodies 436 are arranged at the free end of the end frame body 430e and extend from the free end of the end frame body 430e to the periphery of the free end of the end frame body 430e.

[0291] In this embodiment, the reinforcing bodies 436 extend from the free end of the end frame body 430e to the periphery of the free end of the end frame body 430e, beyond the edge of the free end of the end frame body 430e, so as to disperse the stress of the free end of the end frame body 430e and expand the fixing area of the free end of the end frame body 430e, thereby improving the connection strength and reliability of the free end of the end frame body 430e. Moreover, by arranging the reinforcing bodies 436 at the free end of the end frame body 430e to respectively fix the first circuit board 410 and the second circuit board 420, the connection reliability of the first frame plate 430 with the first circuit board 410 and the second circuit board 420 can be compensated.

[0292] For the convenience of understanding and description, the two reinforcing bodies 436 are respectively referred to as a first reinforcing body 4361 and a second reinforcing body 4362 in the embodiment of the present application. The first reinforcing body 4361 is arranged at the free end of the first frame body 431 and extends from the free end of the first frame body 431 to the periphery of the free end of the first frame body 431; the second reinforcing body 4362 is arranged at the free end of the second frame body 432 and extends from the free end of the second frame body 432 to the periphery of the free end of the second frame body 432.

[0293] The first reinforcing body 4361 extends towards the first circumferential side of the first frame 431, which is the side where the free end of the second frame 432 is located, as shown in the positive X-axis direction of the figure. Similarly, the second reinforcing body 4362 extends towards the first circumferential side of the second frame 432, which is the side where the free end of the first frame 431 is located, as shown in the negative X-axis direction of the figure. Thus, the first reinforcing body 4361 and the second reinforcing body 4362 extend in opposite directions and are close to each other.

[0294] In this embodiment, since the first notch 430a is located between the free end of the first frame body 431 and the free end of the second frame body 432, the extension of the first reinforcing body 4361 from the free end of the first frame body 431 to the side where the free end of the second frame body 432 is located, and the extension of the second reinforcing body 4362 from the free end of the second frame body 432 to the side where the free end of the first frame body 431 is located, are both equivalent to extending into the inside of the first notch 430a. This will occupy part of the area of ​​the first notch 430a, making the first notch 430a smaller, which is suitable for accommodating the first component 440, which occupies a smaller size in the X-axis direction.

[0295] In some other embodiments, such as Figure 28 As shown, Figure 15 This is a cross-sectional view and component schematic diagram of another circuit board structure 400 provided in an embodiment of this application. Figure 28 The cross-sectional view shown in (a) can be roughly referenced. Figure 15 The cross-sectional view shown in (a) is as follows. Figure 28 The perspective in (b) can be referenced. Figure 15 From the perspective of (b) in the text, Figure 28 The perspective in (c) can be referenced. Figure 15 From the perspective of (c) in the middle, Figure 28 The perspective of (d) in the text can be referenced. Figure 27 The perspective of (d) in the text.

[0296] Figure 29 In the circuit board structure 400 shown, the first reinforcing body 4361 extends towards the second periphery of the first frame 431, which is opposite to the side where the free end of the second frame 432 is located, as shown in the negative X-axis direction; and the second reinforcing body 4362 extends towards the second periphery of the second frame 432, which is opposite to the side where the free end of the first frame 431 is located, as shown in the positive X-axis direction. It can be seen that the first reinforcing body 4361 and the second reinforcing body 4362 extend in opposite directions and are far apart from each other.

[0297] It can be seen that, unlike Figure 29In the illustrated embodiment, the first reinforcing body 4361 extends from the free end of the first frame body 431 to the side opposite to the side where the free end of the second frame body 432 is located, and the second reinforcing body 4362 extends from the free end of the second frame body 432 to the side opposite to the side where the free end of the first frame body 431 is located, both of which correspond to extending to the outside of the first gap 430a, which does not occupy the first gap 430a, so that the first gap 430a can be suitable for accommodating the first component 440 which occupies a larger size in the X-axis direction.

[0298] In other embodiments, as shown in Figure 29 Figure 15 Another cross-sectional view and component schematic diagram of a circuit board structure 400 provided by embodiments of the present application. Figure 29 The perspective of the cross-sectional view shown in (a) of FIG. 4 can refer to the perspective of the cross-sectional view shown in (a) of FIG. 1, Figure 15 The perspective of (b) of FIG. 4 can refer to the perspective of (b) of FIG. 1, Figure 29 The perspective of (c) of FIG. 4 can refer to the perspective of (c) of FIG. 1, Figure 15 The perspective of (d) of FIG. 4 can refer to the perspective of (d) of FIG. 1. Figure 29 The perspective of (d) of FIG. 4 can refer to the perspective of (d) of FIG. 1. Figure 15 The perspective of (d) of FIG. 4 can refer to the perspective of (d) of FIG. 1. Figure 27 The perspective of (d) of FIG. 4 can refer to the perspective of (d) of FIG. 1. Figure 30 The perspective of (d) of FIG. 4 can refer to the perspective of (d) of FIG. 1.

[0299] The first reinforcing body 4361 extends to the first peripheral side of the first frame body 431, which is the side where the free end of the second frame body 432 is located, as shown in the positive direction of the X-axis; and the second reinforcing body 4362 extends to the second peripheral side of the second frame body 432, which is the side opposite to the side where the free end of the first frame body 431 is located, as shown in the positive direction of the X-axis. It can be seen that the first reinforcing body 4361 and the second reinforcing body 4362 extend in the same direction.

[0300] It can be seen that, unlike the embodiment shown in Figure 30 In the illustrated embodiment, the first reinforcing body 4361 extends from the free end of the first frame body 431 to the side where the free end of the second frame body 432 is located, which corresponds to extending to the inside of the first gap 430a, which occupies part of the area of the first gap 430a; the second reinforcing body 4362 extends from the free end of the second frame body 432 to the side opposite to the side where the free end of the first frame body 431 is located, which corresponds to extending to the outside of the first gap 430a, which does not occupy the first gap 430a. The first gap 430a of this embodiment is suitable for accommodating the first component 440 whose fixed position is offset to the second reinforcing body 4362.

[0301] In other embodiments, as shown in Figure 30 Figure 15 ​​Another cross section and component schematic diagram of the circuit board structure 400 provided by an embodiment of the present application is shown in FIG. 4B. Figure 27 The cross section view shown in FIG. 4B can be substantially the same as the cross section view shown in (a) of FIG. 4A. Figure 27 to Figure 30 The cross section view shown in FIG. 4B can be substantially the same as the cross section view shown in (a) of FIG. 4A.

[0302] The first reinforcing body 4361 extends to the second peripheral side of the first frame body 431, which is the opposite side of the side where the free end of the second frame body 432 is located, such as the negative direction of the X axis shown in the figure; and the second reinforcing body 4362 extends to the first peripheral side of the second frame body 432, which is the side where the free end of the first frame body 431 is located, such as the negative direction of the X axis shown in the figure. It can be seen that the first reinforcing body 4361 and the second reinforcing body 4362 extend in the same direction.

[0303] It can be seen that the first reinforcing body 4361 and the second reinforcing body 4362 of the embodiment shown in FIG. 4B extend in the same direction, which is different from the embodiments shown in FIGS. 4A and 4C. Figure 15 In the embodiment shown in FIG. 4B, the first reinforcing body 4361 extends from the free end of the first frame body 431 to the opposite side of the side where the free end of the second frame body 432 is located, which is equivalent to extending to the outside of the first gap 430a, which does not occupy the first gap 430a; the second reinforcing body 4362 extends from the free end of the second frame body 432 to the side where the free end of the first frame body 431 is located, which is equivalent to extending to the inside of the first gap 430a, which occupies part of the area of the first gap 430a. The first gap 430a of this embodiment is suitable for accommodating the first component 440 whose fixed position is offset towards the first reinforcing body 4361.

[0304] Figure 27 In the embodiment shown in FIG. 4B, the first protrusion 4412 of the first shielding cover 441 in FIG. 4A is replaced by the first shielding cover 441 and the lower board surface of the second circuit board 420 being fixed by the connecting layer 493, such as being bonded by the bonding layer or being soldered by the soldering layer. Figure 31 The connecting positions where the top of the first shielding cover 441 and the lower board surface of the second circuit board 420 are respectively fixed by the connecting layer 493 are shown in FIG. 4B. In this embodiment, the number of connecting nodes is still less, the impedance and insertion loss of the circuit board structure 400 are still smaller, and the performance of the circuit board structure 400 is better. Figure 31

[0305] This kind of connection mode does not occupy the upper board surface of the second circuit board 420, so more layout area can be obtained on the upper board surface of the second circuit board 420 to layout more components, thereby improving the layout density of the circuit board structure 400.

[0306] In some other embodiments, as shown in FIG. 4C, Figure 31 Figure 15 Another cross section and component schematic diagram of the circuit board structure 400 provided by an embodiment of the present application is shown in FIG. 4B.​​Figure 32 The cross-sectional view can be substantially the same as the cross-sectional view shown in (a) of FIG. 13. Figure 32 The first reinforcing body 4361 is a cylindrical structure, and the diameter of the cylindrical structure is greater than the width of the first frame body 431 so that the first reinforcing body 4361 extends to the periphery of the free end of the first frame body 431. The width of the first frame body 431 is the dimension of the first frame body 431 in the first direction (e.g., the X-axis direction), which is perpendicular to the arrangement direction of the free end and the non-free end of the first frame body 431 (e.g., the Y-axis direction). In addition, the second reinforcing body 4362 extends to the first periphery of the second frame body 432, which is the side where the free end of the first frame body 431 is located, such as the negative direction of the X-axis.

[0307] In this embodiment, the diameter of the cylindrical structure is greater than the width of the first frame body 431, and the first reinforcing body 4361 extends to the periphery of the free end of the first frame body 431, so that the stress of the free end of the first frame body 431 can be better dispersed, and the connection strength and connection reliability of the free end of the first frame body 431 can be improved.

[0308] In addition, the second reinforcing body 4362 extends from the free end of the second frame body 432 to the side where the free end of the first frame body 431 is located, which is equivalent to extending to the inner side of the first gap 430a, which occupies part of the area of the first gap 430a. The first gap 430a of this embodiment is suitable for accommodating the first component 440 whose fixed position is offset towards the first reinforcing body 4361.

[0309] In other embodiments, as shown in Figure 32 , Figure 15 is another cross-sectional view and component schematic diagram of a circuit board structure 400 provided by an embodiment of the present application. Figure 31 The cross-sectional view can be substantially the same as the cross-sectional view shown in (a) of FIG. 13. Figure 32 The cross-sectional view can be substantially the same as the cross-sectional view shown in (a) of FIG. 13.

[0310] Unlike Figure 31 , Figure 32 , the second reinforcing body 4362 extends to the second periphery of the second frame body 432, which is the opposite side of the side where the free end of the first frame body 431 is located, such as the positive direction of the X-axis.

[0311] It should be noted that in other embodiments, the first reinforcing body 4361 and the second reinforcing body 4362 in Figure 31 and Figure 32 may be reversed, and the first gap 430a of this embodiment is suitable for accommodating the first component 440 whose fixed position is offset towards the second reinforcing body 4362.

[0312] Figure 15 and Figure 27 to Figure 32 The embodiment shown in Figure 27 to Figure 32 The first protrusion 4412 of the first shielding cover 441 in the first gap 430a is fixed by the elastic member 494 (such as a spring sheet) to replace the scheme. The elastic member 494 can provide upward elastic force to the area of the second circuit board 420 opposite the first gap 430a to support and improve the strength of the area of the second circuit board 420 opposite the first gap 430a, which helps to compensate for the loss of connection reliability due to the setting of the first gap 430a.

[0313] This connection method does not occupy the upper surface of the second circuit board 420, so more layout area can be obtained on the upper surface of the second circuit board 420 to layout more components, thereby improving the layout density of the circuit board structure 400.

[0314] In the implementation process, according to the actual situation of the first component 440 contained, one of the reinforcement body schemes shown in Figure 31 can be selected for implementation.

[0315] It should be noted that, Figure 32 In the embodiment shown in Figure 27 to Figure 32 and Figure 27 to Figure 32 The cylindrical structure.

[0316] In addition, Figure 27 to Figure 32 The embodiment shown in

[0317] It should be noted that, Figure 15In the illustrated embodiment, in addition to the first fixing hole being provided on the frame body, the first fixing hole can also be provided on the reinforcing body 436. In this case, the second circuit board 420 and the first circuit board 410 are respectively provided with the second fixing hole and the third fixing hole. It should be noted that when there is a corner area between the reinforcing body 436 and the frame body, the first fixing hole can be provided at the corner area, so that both the reinforcing body 436 and the frame body corresponding to the corner area have the first fixing hole.

[0318] Furthermore, it should be noted that in some other embodiments, the first frame body 431 may also include one of the first solidification body 4361 and the second solidification body 4362, and this application embodiment does not limit this.

[0319] It should be noted that, Figure 15 to Figure 32 The descriptions of the perspectives of the various sub-graphs in the schematic diagram can be used as a reference. Figure 12 to Figure 32 The introduction in the text.

[0320] In the specific implementation process, it is possible to Figure 33 Choose one or more of the seven compensation schemes shown for implementation. It should be noted that there is currently a problem of insufficient connection strength between the first circuit board 410, the second circuit board 420, and the first frame board 430. The above compensation schemes can improve the connection strength between the first frame board 430 and the first circuit board 410 and the second circuit board 420, respectively.

[0321] It should be noted that, Figure 34 The following description uses the example of a first frame plate 430 comprising three frame segments. In other embodiments, the first frame plate 430 may also include more or fewer frame segments. The following will illustrate this with examples of... Figure 33 The two frame sections shown are Figure 33 The following explanation uses the four-segment frame shown as an example.

[0322] For example, please refer to Figure 33 , Figure 33 This is a cross-sectional view and component schematic diagram of another circuit board structure 400 provided in an embodiment of this application.

[0323] in, Figure 33 (a) in the diagram is a cross-sectional view of the circuit board structure 400. Figure 33 The location of section (a) in the diagram can be roughly referenced. Figure 33 The sectioning position corresponding to sectioning line P5-P5 shown in (b) is shown in the figure; Figure 33 (b) from Figure 33 The second circuit board 420 is shown from the bottom of (a) in the image. Figure 33 (c) from Figure 33The upper plate surface perspective of the first frame plate 430 in (a) in FIG. 4A shows the first frame plate 430. Figure 33 The upper plate surface perspective of the first circuit board 410 in (a) in FIG. 4A shows the first circuit board 410. Figure 33 The upper plate surface perspective of the first frame plate 430 in (a) in FIG. 4A shows the first frame plate 430. Figure 33 The upper plate surface perspective of the first circuit board 410 in (a) in FIG. 4A shows the first circuit board 410. Figure 33 The upper plate surface perspective of the first frame plate 430 in (a) in FIG. 4A shows the first frame plate 430.

[0324] As shown in (a) in FIG. 4A, the first frame plate 430 includes two frame bodies, i.e., a first frame body 431 and a second frame body 432. The first frame body 431 and the second frame body 432 are connected in sequence, and the first frame body 431 and the second frame body 432, which are adjacent to each other, are arranged at an angle. Figure 33 The upper plate surface perspective of the first frame plate 430 in (a) in FIG. 4A shows the first frame plate 430. Figure 15 The upper plate surface perspective of the first frame plate 430 in (a) in FIG. 4A shows the first frame plate 430.

[0325] In this case, the first frame body 431 and the second frame body 432 are end frame bodies 430e with free ends. By adjusting the angle between the first frame body 431 and the second frame body 432, the free end of the first frame body 431 and the free end of the second frame body 432 can be arranged at intervals, so as to form a first gap 430a between the free end of the first frame body 431 and the free end of the second frame body 432.

[0326] Figure 33 In (a) in FIG. 4A, the first frame plate 430 is approximately a rectangular ring structure with two sides cut off to form the first gap 430a. The shape of the first frame plate 430 is approximately an "L" shape. Of course, in some other embodiments, the first frame body 431 and the second frame body 432 can also be arranged at other angles.

[0327] It can be seen that this embodiment provides another specific implementation scheme of the first frame plate 430 and the first gap 430a of the first frame plate 430. Because the adjacent two frame bodies are arranged at an angle, this implementation scheme can also improve the strength of the first frame plate 430.

[0328] In addition, compared with the first frame plate 430 shown in (a) in FIG. 4A, Figure 33 In (a) in FIG. 4A, because the first gap 430a is larger, more components can be arranged in the area of the first circuit board 410 opposite the first gap 430a, so as to obtain a higher layout density. Figure 33 Optionally,

[0329] Figure 33 ​In the embodiment, the second circuit board 420 is provided with seven first insertion holes 421, including two groups of long strip-shaped insertion holes and a circular insertion hole 4217 arranged at the corner of the two groups of long strip-shaped insertion holes. The two groups of long strip-shaped insertion holes are long strip-shaped insertion hole one 4211, long strip-shaped insertion hole two 4212 and long strip-shaped insertion hole three 4213 arranged in sequence along the X-axis direction, and long strip-shaped insertion hole four 4214, long strip-shaped insertion hole five 4215 and long strip-shaped insertion hole six 4216 arranged in sequence along the Y-axis direction.

[0330] The length direction of the long strip-shaped insertion hole one 4211, the long strip-shaped insertion hole two 4212 and the long strip-shaped insertion hole three 4213 arranged in sequence along the X-axis direction is also the X-axis direction; the length direction of the long strip-shaped insertion hole four 4214, the long strip-shaped insertion hole five 4215 and the long strip-shaped insertion hole six 4216 arranged in sequence along the Y-axis direction is also the Y-axis direction.

[0331] Among the long strip-shaped insertion hole one 4211, the long strip-shaped insertion hole two 4212 and the long strip-shaped insertion hole three 4213 arranged in sequence along the X-axis direction, the long strip-shaped insertion hole one 4211 is the long strip-shaped insertion hole closest to the notch side edge S1 of the second circuit board 420 in the X-axis direction, and the length of the long strip-shaped insertion hole one 4211 is smaller than that of the long strip-shaped insertion hole two 4212 and the long strip-shaped insertion hole three 4213. The notch side edge S1 of the second circuit board 420 is the edge of the second circuit board 420 on one side of the first notch 430a in the X-axis direction. The lengths of the long strip-shaped insertion hole two 4212 and the long strip-shaped insertion hole three 4213 can be the same or different.

[0332] Among the long strip-shaped insertion hole four 4214, the long strip-shaped insertion hole five 4215 and the long strip-shaped insertion hole six 4216 arranged in sequence along the Y-axis direction, the long strip-shaped insertion hole six 4216 is the long strip-shaped insertion hole closest to the notch side edge S2 of the second circuit board 420 in the Y-axis direction, and the length of the long strip-shaped insertion hole six 4216 is smaller than that of the long strip-shaped insertion hole four 4214 and the long strip-shaped insertion hole five 4215. In the Y-axis direction, the notch side edge S2 of the second circuit board 420 is the edge of the second circuit board 420 on one side of the first notch 430a in the Y-axis direction. The lengths of the long strip-shaped insertion hole four 4214 and the long strip-shaped insertion hole five 4215 can be the same or different.

[0333] Optionally, ​ In the circuit board structure 400 shown, the following size requirements in Table 2 can be met: Table 2 (* represents multiplication)

[0334] In this case, the first protrusion 4412 extending into the circular insertion hole 4217 can be a cylindrical structure; the first protrusion 4412 extending into the long strip-shaped insertion hole can be a long strip-shaped protrusion, such as, ​The long strip-shaped conical structure shown in (a) in FIG. 4A is a long strip-shaped triangular pyramid structure with a triangular cross section.

[0335] Compared with Figure 15 Compared with the scheme in which the first protrusion 4412 of the cylindrical structure extends into the first insertion hole 421, in the case where the first protrusion 4412 of the conical structure extends into the first insertion hole 421, it is not easy to be fixed with the first insertion hole 421, but it is more aligned and extends into the first insertion hole 421, and, Figure 33 The conical structure in FIG. 4A is a hollow structure, and the first shielding cover 441 can be stamped to form, and the processing process is simpler.

[0336] In addition, in the case where the first protrusion 4412 is formed by stamping the first cover body 4411, the first protrusion 4412 and the first cover body 4411 can be regarded as one structure, so that the connection path does not introduce more connection nodes due to the arrangement of the first protrusion 4412, and the connection nodes are still less, the impedance and insertion loss of the circuit board structure 400 are smaller, and the performance is better.

[0337] In addition, in the case where the at least two first insertion holes 421 are long strip-shaped insertion holes and are arranged in sequence along the second direction, the area of the second circuit board 420 opposite the first notch 430a is thinner at the more central position in the second direction, and needs more support. In this embodiment, among the at least two long strip-shaped insertion holes in the second direction, the length of the long strip-shaped insertion hole closest to the notch side edge of the second circuit board 420 is the smallest, and vice versa. The length of the long strip-shaped insertion hole in the second direction is larger, and better support can be provided to the area of the second circuit board 420 opposite the first notch 430a in the second direction by the long strip-shaped protrusion, so as to obtain better connection strength.

[0338] It should be noted that in other embodiments, the first insertion holes 421 of the first frame plate 430 can also be all long strip-shaped insertion holes or all circular insertion holes 4217. In addition, in other embodiments, the number of long strip-shaped insertion holes included in each group can be more or less.

[0339] Exemplarily, please refer to Figure 34 , Figure 34 The first frame plate provided in another embodiment of the present application is a plan view.

[0340] The first frame plate 430 includes four frame bodies, namely a first frame body 431, a third frame body 433, a fourth frame body 434, and a second frame body 432. The four frame bodies are connected in sequence, and adjacent two frame bodies are arranged at an angle, Figure 32The two adjacent frame bodies are arranged at an angle of 108°. In this case, the first frame body 431 and the second frame body 432 are end frame bodies 430e with free ends. By adjusting the angle between the first frame body 431 and the second frame body 432, the free end of the first frame body 431 and the free end of the second frame body 432 can be arranged at intervals, so as to form the first gap 430a between the free end of the first frame body 431 and the free end of the second frame body 432.

[0341] Figure 34 In this case, the first frame plate 430 is substantially a regular pentagonal ring structure with one side cut to form the first gap 430a. It can be seen that this embodiment provides another specific implementation of the first frame plate 430 and the first gap 430a of the first frame plate 430. Since the two adjacent frame bodies are arranged at an angle, this implementation can also improve the strength of the first frame plate 430.

[0342] Figures 12 to 34 The first component 440 is taken as an example of the first shielding cover 441 and the electronic component 442 inside the first shielding cover 441. In some other embodiments, the first component 440 can also include a third circuit board and / or a second frame plate. In this case, the third circuit board and / or the second frame plate extend from the outside of the first cavity 400a to the first cavity 400a through the first gap 430a, realizing a staggered design. The following will be described in combination with Figure 35 .

[0343] Exemplarily, please refer to Figure 35 , Figure 35 Another cross-sectional schematic view of the circuit board structure 400 provided by the embodiments of the present application is shown. Figure 35 The cross section shown can be substantially the cross section shown by the cutting position corresponding to the cutting line P1-P1 shown in Figure 3 .

[0344] Figure 35 The circuit board structure 400 shown also includes a third circuit board 491 and a second frame plate 492. The second frame plate is fixed between the first circuit board 410 and the third circuit board 491, and the first circuit board 410, the second frame plate 492 form a second cavity 492a. The meaning and specific fixing manner of the second frame plate 492 being fixed between the first circuit board 410 and the third circuit board 491 can be referred to the related description of the first frame plate 430 being fixed between the first circuit board 410 and the second circuit board 420.

[0345] Figure 35 In this case, the first component 440 can include the third circuit board 491 and the second frame plate 492, and extend from the outside of the first cavity 400a to the first cavity 400a through the first gap 430a.

[0346] It should be noted that in the related art, the first frame plate 430 is Figure 13 a closed ring structure as shown on the left side, the third circuit board 491 and the second frame plate 492 cannot extend into the first cavity 400a through the first gap 430a, and can only be arranged side by side on one side of the first frame plate 430 and the first circuit board 410.

[0347] However Figure 35 In the embodiment shown, because the first frame plate 430 includes the first gap 430a, the third circuit board 491 and the second frame plate 492 can extend into the first cavity 400a through the first gap 430a, and implement a staggered design with the first circuit board 410, thereby saving more layout area of the first circuit board 410 to layout more components, thereby improving the layout density of the circuit board structure 400.

[0348] In some other embodiments, in the case where the circuit board structure 400 further includes the third circuit board 491 and the second frame plate 492, the first component 440 can also include the third circuit board 491 without including the second frame plate 492, in which case the third circuit board 491 can extend into the first cavity 400a through the first gap 430a, and the second frame plate 492 does not extend into the first cavity 400a. Alternatively, the first component 440 can also include the second frame plate 492 without including the third circuit board 491, in which case the second frame plate 492 extends into the first cavity 400a through the first gap 430a, and the third circuit board 491 does not extend into the first cavity 400a.

[0349] In some other embodiments, the circuit board structure 400 can also not include the third circuit board 491, for example, in the case where the second frame plate 492 itself can integrate components, the circuit board component can not be provided with the third circuit board 491. In this case, the first component 440 does not include the third circuit board 491.

[0350] Optionally, please continue to refer to Figure 35 The second frame plate 492 can include a second gap 492b. The second gap 492b extends through the second cavity 492a and the outside of the second cavity 492a, and extends from the first circuit board 410 to the third circuit board 491, for accommodating a second component fixed to the first circuit board 410 and / or the third circuit board 491.

[0351] In the implementation process, the second frame plate 492 and the second gap 492b of the second frame plate 492 can be implemented with reference to the specific implementation schemes of the foregoing first frame body 431 and the first gap 430a of the first frame plate 430, which will not be described here.

[0352] In this embodiment, the second frame plate 492 is provided with a second notch 492b, so that the area of the first circuit board 410 and / or the third circuit board 491 corresponding to the second notch 492b can be arranged with the second component, thereby improving the layout density of the circuit board structure 400, and including the technical effects of better heat dissipation performance, more convenient maintenance and positioning, and lower material cost, and specific analysis can be adaptively referred to the foregoing description of the technical effects of the first notch 430a.

[0353] Optionally, please continue to refer to Figure 35 , the second notch 492b and the first notch 430a are opposite. The circuit board structure 400 further includes a second component, the second component extending from the second cavity 492a to the first cavity 400a through the second notch 492b.

[0354] In this embodiment, in the case that the second notch 492b and the first notch 430a are opposite, the second notch 492b and the first notch 430a are communicated. Since the first notch 430a penetrates the first cavity 400a and the outside of the first cavity 400a, and the second notch 492b penetrates the second cavity 492a and the outside of the second cavity 492a, in the case that the second notch 492b and the first notch 430a are communicated, the second notch 492b penetrates the first cavity 400a and the second cavity 492a, and the second component can extend from the second cavity 492a to the first cavity 400a through the second notch 492b. It can be seen that this embodiment can support the layout of the second component occupying a larger layout area.

[0355] In other embodiments, the first component 440 can also be Figure 15 The first shielding cover 441 and the electronic component 442 are stacked in Figure 35 The upper surface of the third circuit board 491 forms a stack. It should be noted that when the first component 440 is a stack formed by a plurality of components stacked in sequence, the bottom end of the stack is fixed to the first circuit board 410.

[0356] Figures 12 to 35 Taking the case that the first component 440 is the structure of the circuit board structure 400 itself as an example for description. In other embodiments, the first component 440 accommodated by the first notch 430a can also not be the structure of the circuit board structure 400 itself.

[0357] For example, the first component 440 can be an FPC or an FPC connector fixed and electrically connected to the first circuit board 410.

[0358] For example, in the case that the FPC is electrically connected to the first circuit board 410 in the FOB mode, the FPC can extend into the first cavity 400a or to the first notch 430a through the first notch 430a.

[0359] For example, when the FPC is electrically connected to the first circuit board 410 via a connector, the FPC's BTB connector can extend into the first chamber 400a and / or reach the first notch 430a through the first notch 430a. Figure 36 This demonstrates the FPC connector extending into the first chamber 400a through the first notch 430a. Figure 37 This demonstrates the FPC connector extending to the first notch 430a.

[0360] Among them, FPC can be Figures 2 to 7 The FPCs used in this project include rechargeable FPCs, battery FPCs, or through-shaft FPCs. Correspondingly, the FPC connectors can be BTB connectors, ZIP connectors, etc.

[0361] Furthermore, in some other embodiments, the first component 440 may also include the structure of the circuit board structure 400 itself as well as other structures besides the structure of the circuit board structure 400 itself. For example, the first component 440 may include a third circuit board 491 and an FPC connector fixed to the third circuit board 491.

[0362] The following is combined with Figure 38 and Figure 39 The circuit board structure 400 shown has more circuit board layers. Figures 12 to 37 The first circuit board 410, the second circuit board 420, the first frame board 430, and the first chamber 400a involved are described by way of example.

[0363] For example, please refer to Figure 38 , Figure 38 This is a cross-sectional schematic diagram of another circuit board structure 400 provided in an embodiment of this application. Figure 38 The cross-section shown can be roughly referenced Figure 3 The section corresponding to the cutting position shown by the cutting line P1-P1.

[0364] The circuit board structure 400 includes three circuit boards stacked sequentially along the Z-axis: circuit board M1 (e.g., AP board), circuit board M2 (e.g., RF board), and circuit board M3 (e.g., RF board). A frame plate N1 is fixed between circuit board M1 and circuit board M2, and the frame plate N1, circuit board M1, and circuit board M2 enclose a cavity O1. A frame plate N2 is fixed between circuit board M2 and circuit board M3, and the frame plate N2, circuit board M1, and circuit board M2 enclose a cavity O2.

[0365] for Figure 38In the circuit board structure 400 shown, the first circuit board 410 and the second circuit board 420 can be any two adjacent circuit boards in a three-layer circuit board, the first frame board 430 can be a frame board between the two adjacent circuit boards, and the first cavity 400a can be a cavity enclosed by the two adjacent circuit boards and the frame board therebetween, and the first notch 430a can be disposed on the frame board between the two adjacent circuit boards.

[0366] In a first example, the first circuit board 410 can be a circuit board M1, the second circuit board 420 can be a circuit board M2, the first frame board 430 can be a frame board N1, the first cavity 400a can be a cavity O1, and the first notch 430a can be disposed on the frame board N1. Figure 38 In the circuit board structure 400 shown, the first circuit board 410 and the second circuit board 420 can be any two adjacent circuit boards in a three-layer circuit board, the first frame board 430 can be a frame board between the two adjacent circuit boards, and the first cavity 400a can be a cavity enclosed by the two adjacent circuit boards and the frame board therebetween, and the first notch 430a can be disposed on the frame board between the two adjacent circuit boards. Figure 38 In the circuit board structure 400 shown, the first circuit board 410 and the second circuit board 420 can be any two adjacent circuit boards in a three-layer circuit board, the first frame board 430 can be a frame board between the two adjacent circuit boards, and the first cavity 400a can be a cavity enclosed by the two adjacent circuit boards and the frame board therebetween, and the first notch 430a can be disposed on the frame board between the two adjacent circuit boards. Figure 38 In the circuit board structure 400 shown, the first circuit board 410 and the second circuit board 420 can be any two adjacent circuit boards in a three-layer circuit board, the first frame board 430 can be a frame board between the two adjacent circuit boards, and the first cavity 400a can be a cavity enclosed by the two adjacent circuit boards and the frame board therebetween, and the first notch 430a can be disposed on the frame board between the two adjacent circuit boards.

[0367] In a second example, the first circuit board 410 can be a circuit board M2, the second circuit board 420 can be a circuit board M3, the first frame board 430 can be a frame board N2, the first cavity 400a can be a cavity O2, and the first notch 430a can be disposed on the frame board N2. Figure 38 In the circuit board structure 400 shown, the first circuit board 410 and the second circuit board 420 can be any two adjacent circuit boards in a three-layer circuit board, the first frame board 430 can be a frame board between the two adjacent circuit boards, and the first cavity 400a can be a cavity enclosed by the two adjacent circuit boards and the frame board therebetween, and the first notch 430a can be disposed on the frame board between the two adjacent circuit boards. Figure 38 In the circuit board structure 400 shown, the first circuit board 410 and the second circuit board 420 can be any two adjacent circuit boards in a three-layer circuit board, the first frame board 430 can be a frame board between the two adjacent circuit boards, and the first cavity 400a can be a cavity enclosed by the two adjacent circuit boards and the frame board therebetween, and the first notch 430a can be disposed on the frame board between the two adjacent circuit boards. Figure 38 In the circuit board structure 400 shown, the first circuit board 410 and the second circuit board 420 can be any two adjacent circuit boards in a three-layer circuit board, the first frame board 430 can be a frame board between the two adjacent circuit boards, and the first cavity 400a can be a cavity enclosed by the two adjacent circuit boards and the frame board therebetween, and the first notch 430a can be disposed on the frame board between the two adjacent circuit boards.

[0368] In a third example, the first circuit board 410 can be a circuit board M3, the second circuit board 420 can be a circuit board M1, the first frame board 430 can be a frame board N1, the first cavity 400a can be a cavity O1, and the first notch 430a can be disposed on the frame board N1. Figure 38 In the circuit board structure 400 shown, the first circuit board 410 and the second circuit board 420 can be any two adjacent circuit boards in a three-layer circuit board, the first frame board 430 can be a frame board between the two adjacent circuit boards, and the first cavity 400a can be a cavity enclosed by the two adjacent circuit boards and the frame board therebetween, and the first notch 430a can be disposed on the frame board between the two adjacent circuit boards.

[0369] For example, please refer to Figure 39 , Figure 39 Another cross-sectional view of a circuit board structure 400 provided by an embodiment of the present application. Figure 39 The cross-section shown can be substantially the same as the cross-section shown in Figure 3 the cross-section corresponding to the cross-section position shown by the cross-section line P1-P1.

[0370] Figure 39The circuit board structure 400 shown includes four circuit boards stacked in the Z-axis direction, namely, circuit board M1, circuit board M2, circuit board M3, and circuit board M4. The frame plate N1 is fixed between the circuit board M1 and the circuit board M2, the frame plate N2 is fixed between the circuit board M2 and the circuit board M3, and the frame plate N3 is fixed between the circuit board M1 and the circuit board M4. The frame plate N1, the circuit board M1, and the circuit board M2 enclose the cavity O1; the frame plate N2, the circuit board M1, and the circuit board M2 enclose the cavity O2; and the frame plate N3, the circuit board M1, and the circuit board M4 enclose the cavity O3.

[0371] It should be noted that, Figure 39 In the circuit board structure 400 shown, the first circuit board 410 and the second circuit board 420 can be any two adjacent circuit boards in the four circuit boards, the first frame plate 430 can be the frame plate between the two adjacent circuit boards, the first cavity 400a can be the cavity formed by the two adjacent circuit boards and the frame plate between the two adjacent circuit boards, and the first notch 430a can be arranged on the frame plate between the two adjacent circuit boards.

[0372] The first example can be implemented with reference to the first example in Figure 39 .

[0373] The second example can be implemented with reference to the first example in Figure 39 .

[0374] The third example, the first circuit board 410 can be the circuit board M1 shown in Figure 39 , the second circuit board 420 can be the circuit board M4 shown in Figure 39 , the first frame plate 430 can be the frame plate N3 shown in Figure 39 , the first cavity 400a can be the cavity O3 shown in , and the first notch 430a can be arranged on the frame plate N3.

[0375] Figure 39 The fourth example, The circuit board structure 400 shown can include at least two of the first three examples at the same time. In this case, the circuit board structure 400 includes two first circuit boards 410, two second circuit boards 420, two first cavities 400a, two first frame plates 430, and two first notches 430a.

[0376] Figure 39 The fifth example, The circuit board structure 400 shown can include the first three examples at the same time. In this case, the circuit board structure 400 includes three first circuit boards 410, three second circuit boards 420, three first cavities 400a, three first frame plates 430, and three first notches 430a.

[0377] It should be noted that,Figures 12 to 39 The following example illustrates a single first frame plate 430 including a first notch 430a that encloses and forms a first chamber 400a. In other embodiments, the number of first notches 430a included in a single first frame plate 430 and the number of first chambers 400a that can be enclosed and formed may be greater.

[0378] For example, please refer to Figure 40 , Figure 40 This is a cross-sectional schematic diagram of another circuit board structure 300 provided in an embodiment of this application. Since the through holes of the first frame plate 430 are used to form the first chamber 400a, the first chamber 400a is characterized in the figure by indicating the through holes of the first frame plate 430. The number of first chambers 400a is six. Of course, in some other embodiments, the number of first chambers 400a can be other numbers, such as two, three, or four.

[0379] The first frame plate 430 includes two first notches 430a. Of course, in some other embodiments, the number of first notches 430a can be other, such as one, three, four, etc.

[0380] Each first notch 430a penetrates one of the multiple first chambers 400a and its outer side. For example, Figure 40 In the middle, one of the two first gaps 430a penetrates one first chamber 400a and its outer side, while the other first gap 430a penetrates the other first chamber 400a and its outer side.

[0381] When there is only one first notch 430a, the first notch 430a can penetrate any one of the multiple first chambers 400a and its outer side; when there are multiple first notches 430a, each first notch 430a penetrates one of the multiple first chambers 400a and its outer side, thus penetrating a corresponding number of the multiple first chambers 400a and their outer sides. When there are multiple first notches 430a, each first notch 430a includes the aforementioned technical effects of setting the first notch 430a.

[0382] Please refer to Figure 41 , Figure 41 for Figure 40 A top view of the circuit board structure 400. (Compared to...) Figure 9 In terms of the circuit board structure 400, Figure 9 The two annular regions, 400A2 and 400A3, are integrated into a single structure to achieve bilateral integration, thereby overcoming... Figure 9 The large area occupied by the U-shaped FB board in the middle makes it impossible to use two or three sides for support to improve the area utilization rate.

[0383] It should be noted that, Figures 12 to 41 For example, the first chamber 400a is open and does not have a blocking structure. In other embodiments, the first chamber 400a extending from the first circuit board 410 to the second circuit board 420 can be closed and have a blocking structure.

[0384] For example, please refer to Figure 42 , Figure 42 Another cross-sectional view of the circuit board structure 400 provided by the embodiments of the present application.

[0385] Figure 42 The circuit board structure 400 shown in Figure 12 The mainboard stacking architecture involved in the second area of the mainboard is schematically illustrated, still including the first circuit board 410, the first frame board 430 and the second circuit board 420 stacked in the Z-axis direction. Figure 42 The cross-sectional view can be approximately referred to the cross-sectional view of Figure 8 .

[0386] Figure 42 In the circuit board structure 400 shown, the first frame board 430 further includes a partition plate 437, which divides the first chamber 400a into an upper chamber 400a1 and a lower chamber 400a2. The upper chamber 400a1 is located on the side of the partition plate 437 facing the second circuit board 420, and the lower chamber 400a2 is located on the side of the partition plate 437 facing the first circuit board 410.

[0387] For example, the first frame board 430 can be two back-to-back groove structures, and the two groove structures share the partition plate 437 as a groove bottom plate. The slot of one of the groove structures faces the first circuit board 410, so as to form the lower chamber 400a2 with the first circuit board 410; the slot of the other groove structure faces the second circuit board 420, so as to form the upper chamber 400a1 with the second circuit board 420.

[0388] Figure 42 In the circuit board structure 400 shown, because the partition plate 437 is arranged in the first chamber 400a, compared with Figure 12 The first chamber 400a shown can accommodate components with a lower height. Figure 42

[0389] At the same time, the partition plate 437 arranged in the first chamber 400a can be used as a circuit board for integrating and electrically connecting one or more components.

[0390] ​In this case, the upper chamber 400a1 can be used to accommodate components fixed to the lower surface of the second circuit board 420 and / or the upper surface of the partition 437, Figure 42 The upper chamber 400a1 is shown to accommodate components fixed to both the lower surface of the second circuit board 420 and the upper surface of the partition 437.

[0391] The lower chamber 400a2 can be used to accommodate components fixed to the upper surface of the first circuit board 410 and / or the lower surface of the partition 437, Figure 42 The lower chamber 400a2 is shown to accommodate components fixed to both the upper surface of the first circuit board 410 and the lower surface of the partition 437.

[0392] As can be seen, the partition 437 provides more layout area. Based on this, compared to the circuit board structure 400 shown in FIG. 1, Figure 12 The first chamber 400a shown can accommodate more components, Figure 42 The first chamber 400a shown can accommodate more components, which is conducive to improving the layout density of the circuit board structure 400.

[0393] It should be noted that, Figure 42 The first frame body 431 in the circuit board structure 400 shown can also be provided with a first notch 430a, to obtain similar technical effects to Figure 42 The first notch 430a in the circuit board structure 400 shown can also be provided with a first notch 430a, to obtain similar technical effects to

[0394] For the circuit board structure 400 shown, Figure 42 The first notch 430a can extend from the first circuit board 410 to the side of the partition 437 facing the second circuit board 420, such as to the second circuit board 420, and pass through the first chamber 400a and the outside of the first chamber 400a, for accommodating the first components 440 fixed to the first circuit board 410.

[0395] Since the first chamber 400a is divided into the upper chamber 400a1 and the lower chamber 400a2 by the partition 437, the first notch 430a extending from the first circuit board 410 to the side of the partition 437 facing the second circuit board 420 can realize that the upper chamber 400a1 and the lower chamber 400a2 of the first chamber 400a pass through the outside thereof through the one notch 430a. In addition, in the case where the first notch 430a extends to the second circuit board 420, the first notch 430a can also accommodate components fixed to the region of the second circuit board 420 opposite the first notch 430a.

[0396] It should be noted that,Figure 42 In the circuit board structure 400 shown, the type of the first component 440 accommodated by the first gap 430a of the first frame body 431 can refer to the description of the first component 440 in the above three embodiments.

[0397] The first component 440 can extend into the upper chamber 400a1 and / or the lower chamber 400a2 of the first chamber 400a through the first gap 430a, or can extend to the first gap 430a without extending into the upper chamber 400a1 and / or the lower chamber 400a2 of the first chamber 400a. The components extending into the upper chamber 400a1 and the lower chamber 400a2 of the first chamber 400a through the first gap 430a are sub-components of the first component 440, and these sub-components are collectively regarded as the first component 440.

[0398] It is worth noting that the first component 440 extending from the side of the partition 437 towards the first circuit board 410 to the side towards the second circuit board 420 is blocked by the partition 437, and is not suitable for extending into the first chamber 400a through the first gap 430a, but can extend to the first gap 430a.

[0399] It should be noted that, Figures 12 to 42 The first chamber 400a is formed by the first circuit board 410, the second circuit board 420, and the first frame plate 430 as an example. In other embodiments, the first chamber 400a can be formed by more or fewer components including the first circuit board 410 and the first frame plate 430, that is, the first frame plate 430 at least surrounds the first circuit board 410 to form the above-mentioned first chamber 400a.

[0400] Exemplarily, please refer to Figure 43 , Figure 43 Another cross-sectional view of the circuit board structure 400 provided by the embodiments of the present application is shown.

[0401] Figure 43 The circuit board structure 400 shown is schematically illustrated by taking the stacking architecture of the mainboard involved in the area one in Figure 12 , which includes the first circuit board 410, the first frame plate 430 stacked in sequence along the Z-axis direction. Figure 43 The cross-sectional view shown can refer to the cross-sectional view of Figure 8 .

[0402] Figure 12 In the circuit board structure 400 shown, the first chamber 400a is formed by the first circuit board 410 and the first frame plate 430. Specifically, the circuit board structure 400 includes the first circuit board 410 and the first frame plate 430, and does not include Figure 8 the second circuit board 420 shown.

[0403] The first frame plate 430 is fixed to the first circuit board 410, for example, by welding. In this case, the first circuit board 410 and the first frame plate 430 are stacked in sequence, for example, along the Z-axis direction. This embodiment concentrates more components in the stacked circuit board manner to make full use of the internal space of the electronic device.

[0404] The first frame plate 430 and the first circuit board 410 form the first cavity 400a.

[0405] For example, the first frame plate 430 can be a groove-shaped structure, and the groove opening faces the first circuit board to form the first cavity 400a with the first circuit board 410. In this case, the groove bottom plate of the first frame plate 430 can be used as a circuit board to integrate and electrically connect one or more components to make full use of the internal space of the electronic device to arrange more components.

[0406] In the case where the first frame plate 430 is a groove-shaped structure, the first notch 430a described above can be provided on the side wall of the first frame plate 430, extend from the back of the first circuit board 410 to the first circuit board 410 (for example, along the Z-axis direction), and can or can not extend to the groove bottom plate of the first circuit board 410, and extend through the first cavity 400a and the outside of the first cavity 400a to accommodate the first component 440 fixed to the first circuit board 410.

[0407] In this embodiment, the first notch 430a can improve the layout density and heat dissipation performance of the circuit board structure 400, and can also facilitate maintenance and positioning of components inside the first cavity 400a and reduce material costs. For specific analysis, please refer to the description of the foregoing related embodiments.

[0408] In addition, in this embodiment, the connection reliability lost due to the provision of the first notch 430a can be compensated for by any one or more of the six compensation schemes, which will not be described here.

[0409] It should be noted that in the specific implementation process, the same circuit board structure 400 can be similar to the structure shown in Figures 12 to 40 , and at the same time has at least two of Figure 42 the first cavity 400a without a partition plate, Figure 43 the first cavity 400a with a partition plate, and Figures 12 to 43 the first cavity 400a formed by the first circuit board 410 and the first frame plate 430.

[0410] It should also be noted that in the specific implementation process, any frame plate configured as a closed ring structure on the circuit board structure 400 can use the above​ The provided scheme opens the first gap to obtain the technical effect brought by the first gap.

[0411] In the above embodiments, the description of each embodiment has its own focus, and the parts not described or recorded in a certain embodiment can be referred to the related description of other embodiments. In addition, the above content is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. An electronic device, comprising: The application relates to a housing, a display screen and a circuit board structure, wherein the housing and the display screen enclose a containing cavity, and the circuit board structure is arranged in the containing cavity. The circuit board structure comprises a first circuit board, a first frame plate and a second circuit board; the first frame plate is fixed between the first circuit board and the second circuit board, and the first frame plate, the first circuit board and the second circuit board enclose a first cavity. The first frame plate comprises a first frame body, a second frame body and a third frame body, the first frame body, the third frame body and the second frame body are sequentially connected, and adjacent two frame bodies are arranged at an angle. The first frame body and the second frame body respectively have free ends, the free ends of the first frame body and the second frame body are arranged at intervals, and the first gap is located between the free ends of the first frame body and the second frame body.

2. The electronic device of claim 1, wherein, The circuit board structure further comprises a first shielding cover, one end of the first shielding cover is fixed with the first circuit board, and the other end of the first shielding cover is fixed with the second circuit board. The first shielding cover and the first circuit board enclose a first shielding cavity, and the electronic component is arranged in the first shielding cavity.

3. The electronic device of claim 1 or 2, wherein, The second circuit board is provided with a first jack hole corresponding to the region of the first gap.

4. The electronic device of claim 3, wherein, The other end of the first shielding cover is provided with a first protrusion, and the first protrusion extends into the first jack hole.

5. The electronic device of claim 3 or 4, wherein, The first shielding cover is fixed to one side of the first circuit board facing the second circuit board, the first shielding cover comprises a first cover body, and the first protrusion is arranged on the first cover body. The first protrusion and the first jack hole are welded and fixed.

6. The electronic device of claim 5, wherein, The hole wall of the first jack hole is metal.

7. The electronic device of claim 5 or 6, wherein, The first cover body and the first protrusion are integrally formed.

8. The electronic device of any of claims 5-7, wherein, The number of the first jack holes is multiple, the first jack holes are long strip-shaped jack holes, and the long strip-shaped jack holes are arranged along the length direction.

9. The electronic device of claim 6, wherein, The length of the long strip-shaped jack hole corresponding to the side edge of the first gap of the second circuit board is a first value, the length of the long strip-shaped jack hole corresponding to the region in the middle of the first gap of the second circuit board is a second value, and the first value is smaller than the second value.

10. The electronic device of any of claims 5-9, wherein, Each frame body of the first frame plate is provided with multiple rows of pads arranged along the width direction of each frame body, and the pads are respectively welded and fixed with the first circuit board and the second circuit board.

11. The electronic device of claim 10, wherein, Each row of pads has multiple pads, and part of the pads in the multiple pads are connected with each other.

12. The electronic device of any of claims 1-11, wherein, The first frame plate further comprises at least one first fixing hole; the second circuit board comprises a second fixing hole opposite to the first fixing hole; and the first circuit board comprises a third fixing hole opposite to the first fixing hole.

13. The electronic device of claim 12, wherein, The first circuit board structure further comprises a first fixing piece; the first fixing piece extends into the first fixing hole, the second fixing hole and the third fixing hole, and respectively fixes the first frame plate, the second circuit board and the first circuit board.

14. The electronic device of any of claims 1-13, wherein, ​ ​ 15. The electronic device of any of claims 1-14, wherein, The first frame plate comprises a through hole, one end of the through hole extends to the first circuit board, and the other end of the through hole extends to the second circuit board to form the first cavity.

16. The electronic device of any of claims 1-15, wherein, The first frame plate is a non-closed ring structure with a notch.

17. The electronic device of any of claims 1-16, wherein, The electronic component is an SOC.

18. The electronic device of any of claims 1-17, wherein, The first frame plate further comprises a partition plate, the partition plate divides the first cavity into an upper cavity and a lower cavity; the upper cavity is located on one side of the partition plate facing the second circuit board, and the lower cavity is located on one side of the partition plate facing the first circuit board. The first notch extends to one side of the partition plate facing the second circuit board.

19. The electronic device of claim 2, wherein, The frame body with a free end among the first frame body, the second frame body and the third frame body is an end frame body; the first frame plate further comprises a reinforcing body; the reinforcing body is fixed to the first circuit board and the second circuit board respectively; wherein the reinforcing body is arranged at the free end of the end frame body and extends from the free end of the end frame body to the circumferential side of the free end of the end frame body.

20. The electronic device of claim 19, wherein, The reinforcing body extends to a first circumferential side of the end frame body, and the first circumferential side is a side where another section of the end frame body is located; or The reinforcing body extends to a second circumferential side of the end frame body, and the second circumferential side is a side opposite to the side where another section of the end frame body is located.

21. The electronic device of claim 19 or 20, wherein, The reinforcing body is in a cylindrical structure, and a diameter of the cylindrical structure is greater than a width of the end frame body. The width of the end frame body is a size in a first direction of the end frame body, and the first direction is perpendicular to an arrangement direction of the free end and the non-free end of the end frame body.

22. The electronic device of any of claims 19-21, wherein, The reinforcing body is two, which are a first reinforcing body and a second reinforcing body. The first reinforcing body is arranged at the free end of the first frame body, and the second reinforcing body is arranged at the free end of the second frame body.

23. The electronic device of claim 2, wherein, The circuit board structure further comprises a third circuit board and a second frame plate. The second frame plate is fixed between the first circuit board and the third circuit board, and forms a second cavity together with the first circuit board and the third circuit board.

24. The electronic device of claim 23, wherein, The second frame plate comprises a second notch, the second notch extends through the second cavity and an outer side of the second cavity, and extends from the first circuit board to the third circuit board.

25. The electronic device of claim 23 or 24, wherein, The circuit board structure further comprises a second shielding cover; an area of the second circuit board opposite to the first notch has a second jack; The second shielding cover comprises a second cover body and a second protrusion fixing the second cover body; The second cover body is fixed on a side of the second circuit board facing away from the first circuit board, and the second protrusion extends into the second jack and fixes a hole wall of the second jack.

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