Circuit board and preparation method thereof

Abstract

The invention relates to the field of circuit boards, in particular to a circuit board and a preparation method thereof, and the method comprises the following steps: S1, taking a copper-clad substrate, and cutting the copper-clad substrate to obtain an initial board; s2, pasting transfer paper on one side of the initial plate; s3, transfer printing is conducted through a heat transfer printing machine; s4, enabling the transferred initial plates to sequentially and continuously enter corrosive liquid through a corrosion device to be subjected to corrosion processing; s5, the corroded initial plate is cleaned up; s6, the cleaned initial plate is drilled; s7, after drilling is completed, the initial plate is polished; and S8, cleaning and airing the initial board again, and coating the side with the circuit with rosin water to obtain the circuit board. By using the corrosion device, the initial plates can sequentially and continuously enter the corrosion liquid to be subjected to corrosion processing, and the corrosion processing efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board, in particular to a circuit board and a preparation method thereof. BACKGROUND

[0002] The name of the circuit board has: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high-frequency board, thick copper plate, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board miniaturizes the circuit, and plays an important role in the batch production of fixed circuit and the optimization of electric appliance layout.

[0003] When the circuit board is made, it needs to be corroded with etching liquid, but the existing etching method mostly adopts batch mode to send the circuit board into the etching liquid, and after etching, it is batch transferred out. In this process, the transfer operation is complex, which greatly affects the etching processing efficiency. SUMMARY

[0004] The purpose of the present application is to provide a circuit board and a preparation method thereof, which can make the initial plate continuously and uninterruptedly enter the etching liquid for etching processing by using the etching device, thereby improving the etching processing efficiency.

[0005] The purpose of the present application is achieved by the following technical solutions:

[0006] A preparation method of a circuit board, comprising the following steps:

[0007] S1, cutting a copper-clad substrate to obtain an initial plate;

[0008] S2, sticking a transfer paper on one side of the initial plate;

[0009] S3, transferring by a thermal transfer printer;

[0010] S4, making the transferred initial plate continuously and uninterruptedly enter the etching liquid for etching processing by an etching device;

[0011] S5, cleaning the etched initial plate;

[0012] S6, drilling the cleaned initial plate;

[0013] S7, polishing the initial plate after drilling;

[0014] S8, cleaning the initial plate again, and after drying, applying rosin water to one side with circuit to obtain a circuit board.

[0015] The transfer paper is printed with a circuit diagram.

[0016] The etching solution in step S4 includes concentrated hydrochloric acid, concentrated hydrogen peroxide and water.

[0017] The temperature of the heat transfer machine is 160-200℃ during the transfer.

[0018] The step S4 checks whether the initial plate is transferred well before etching.

[0019] The step S5 uses clean water for cleaning.

[0020] The step S7 uses fine sand paper for polishing.

[0021] The step S8 uses clean water for cleaning.

[0022] The step S8 uses a hot air machine to heat the initial plate so that the rosin solidifies quickly.

[0023] A circuit board prepared by the method. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a flowchart of the method for preparing a circuit board Figure 1 ;

[0025] Figure 2 is a flowchart of the method for preparing a circuit board Figure 2 ;

[0026] Figure 3 and Figure 4 is a structural diagram of an etching device;

[0027] Figure 5 is a partial structural diagram of the etching device Figure 1 ;

[0028] Figure 6 is a structural diagram of a semi-circular box;

[0029] Figure 7 is a partial structural diagram of the etching device Figure 2 ;

[0030] Figure 8 is Figure 7 a partial structural diagram of the etching device;

[0031] Figure 9 is a structural diagram of a horizontal plate seat;

[0032] Figure 10 is a structural diagram of an L-shaped plate;

[0033] Figure 11 is a structural diagram of a push block.

[0034] In the drawings:

[0035] Half-round box 101; door type plate 102; door type frame 103; threaded sleeve 104; bidirectional screw rod I 105; main shaft 106; transmission wheel 107;

[0036] Supporting plate 201; support arm plate 202; disc 203; round rubber ring 204;

[0037] Cross plate seat 301; middle hole 302; supporting plate 303; middle plate 304; long hole plate 305; extension plate 306; cross shaft 307; adjusting screw 308;

[0038] Side stop plate 401; L-shaped plate 402; bidirectional screw rod II 403;

[0039] Push block 501; linkage plate 502; round plate 503. DETAILED DESCRIPTION

[0040] As Figures 1-2 shown, the detailed description of the method for manufacturing a circuit board is as follows:

[0041] A method for manufacturing a circuit board, comprising the following steps:

[0042] S1, taking a copper-clad substrate to cut, obtaining an initial plate;

[0043] S2, sticking a transfer paper on one side of the initial plate;

[0044] S3, transferring by a heat transfer machine;

[0045] S4, making the transferred initial plate continuously and uninterruptedly enter an etching solution for etching processing by an etching device;

[0046] S5, cleaning the etched initial plate;

[0047] S6, drilling the cleaned initial plate;

[0048] S7, after drilling, polishing the initial plate;

[0049] S8, cleaning the initial plate again, and after drying, applying rosin water to one side with circuit to obtain a circuit board.

[0050] The transfer paper is printed with a circuit diagram.

[0051] The etching solution in step S4 comprises concentrated hydrochloric acid, concentrated hydrogen peroxide and water.

[0052] During transferring, the temperature of the heat transfer machine is 160-200℃.

[0053] Before etching in step S4, it is checked whether the initial plate is well transferred.

[0054] The step S5 uses clean water to clean.

[0055] The step S7 uses fine sandpaper to polish.

[0056] The step S8 uses clean water to clean.

[0057] The step S8 uses a hot air blower to heat the initial plate to make the rosin solidify quickly.

[0058] As shown in the figure, the detailed description of the corrosion device is as follows: Figures 3-11

[0059] The corrosion device comprises a semicircular box 101, a door-shaped plate 102, a door-shaped frame 103, a threaded sleeve 104, a bidirectional screw rod I 105, a main shaft 106, a transmission wheel 107, a support plate 201, a disc 203 and a round rubber ring 204, the middle part of the upper end of the semicircular box 101 is fixed with the door-shaped plate 102, the door-shaped frame 103 is lifted and slid through in the door-shaped plate 102, the threaded sleeve 104 is rotated on the door-shaped plate 102 and is in threaded connection with the screw rod on the door-shaped frame 103, the bidirectional screw rod I 105 and the main shaft 106 are transversely rotated at the lower end of the door-shaped frame 103, the two support plates 201 are symmetrically threaded on the bidirectional screw rod I 105, the two transmission wheels 107 are respectively rotated on the two support plates 201 and are both in sliding connection with the main shaft 106 through keys, the two discs 203 are respectively rotated at the lower end of the two support plates 201 and are respectively in transmission connection with the two transmission wheels 107, and the two round rubber rings 204 are fixed at the outer edges of the two discs 203 and the inner sides of the two round rubber rings 204 are symmetrically provided with a plurality of grooves.

[0060] In use, the corrosion liquid is added into the semicircular box 101, at this time, the lower parts of the two round rubber rings 204 are immersed in the corrosion liquid, a first motor installed on one of the support plates 201 is started to drive the main shaft 106, so that the two discs 203 carrying the two round rubber rings 204 are driven to rotate through the transmission wheels 107, at this time, the initial plate to be corroded is inserted between the two round rubber rings 204, the initial plate is fixed and tightened by the elasticity of the two round rubber rings 204 and is rotated into the corrosion liquid to be corroded, so that a plurality of initial plates of the same size specification can be inserted between the two round rubber rings 204 in turn, a plurality of initial plates are corroded in the corrosion liquid in turn, are rotated out of the corrosion liquid at the other end of the semicircular box 101 to complete the corrosion processing, and are taken down in turn, so that the continuous and uninterrupted corrosion processing of the initial plate is formed, and the corrosion processing efficiency is improved; and in this process, the distance between the adjacent two initial plates is ensured to ensure the corrosion effect.

[0061] ​The first motor can control the rotating speed of the disc 203, control the time of the initial plate in the etching liquid, ensure the etching processing effect, and control the lifting of the disc 203 by rotating the screw rod on the door-shaped frame 103 through the threaded transmission of the threaded sleeve 104, control the depth of the disc 203 immersed in the etching liquid, and further control the etching time.

[0062] Moreover, the two-way screw rod 105 can be rotated to synchronously approach or move away from the two supporting plates 201 through threaded transmission, adjust the distance between the two discs 203, and make the device adapt to the etching processing of initial plates with different widths.

[0063] Moreover, when the initial plate is inserted between the two rubber rings 204, the initial plate can correspond to the grooves on the two rubber rings 204, further ensure the stability of the clamped and fixed initial plate, and stir the etching liquid when the initial plate fixed between the two rubber rings 204 rotates in the etching liquid, ensure the uniformity of the etching liquid, and ensure the etching effect.

[0064] Further:

[0065] The etching device further comprises a supporting arm plate 202, a horizontal plate base 301, a middle hole 302, a supporting plate 303, a middle plate 304, a long hole plate 305, an extension plate 306, a horizontal shaft 307, and an adjusting screw 308, the two supporting arm plates 202 are both fixed with the supporting arm plate 202 in an inclined manner, the horizontal plate base 301 penetrates the two supporting arm plates 202 in a horizontal manner, the middle hole 302 is arranged at the center of the horizontal plate base 301, the middle plate 304 is vertically fixed to the upper side of the horizontal plate base 301, the supporting plate 303 is fixed to the lower side of the horizontal plate base 301 in an extending manner, the extension plate 306 is fixed to the middle part of the supporting plate 303 in an extending manner, the long hole plate 305 is fixed to the two sides of the horizontal plate base 301, the horizontal shaft 307 is connected to the upper ends of the two supporting arm plates 202 in a penetrating manner, the adjusting screw 308 is rotatably arranged at the center of the horizontal shaft 307, and the adjusting screw 308 is threadedly connected with the extension plate 306.

[0066] In use, the two supporting arm plates 202 are in an inclined state, so that the horizontal plate base 301 and the supporting plate 303 penetrating the two supporting arm plates 202 are also in an inclined state, so that multiple initial plates can be screwed on the supporting plate 303, the multiple initial plates screwed on the supporting plate 303 are also in an inclined state and lean against the middle plate 304 due to the influence of the inclined supporting plate 303, at this time, the initial plate at the lowermost end corresponds to the middle hole 302, so that the initial plate at the lowermost end can be pushed into the middle hole 302, thereby being inserted between the two rubber rings 204, and the initial plate can be installed in sequence by sequentially pushing the initial plate at the lowermost end into the middle hole 302 with the rotation of the two rubber rings 204.

[0067] And by rotating the adjusting screw 308, the extension plate 306 can be screwed to drive the horizontal plate base 301 to slide on the support arm plate 202, thus adjusting the distance between the horizontal plate base 301 and the rubber ring 204, so as to adapt to the insertion of initial plates of different sizes.

[0068] Further:

[0069] The corrosion device further comprises a push block 501, a linkage plate 502 and a circular plate 503, the circular plate 503 rotates on the extension plate 306, the push block 501 slides in the center of the middle hole 302 and the supporting plate 303, one end of the linkage plate 502 is rotationally connected with the push block 501, and the other end of the linkage plate 502 is rotationally connected with the eccentric part of the circular plate 503.

[0070] The second motor installed on the extension plate 306 drives the circular plate 503 to rotate, and the rotating circular plate 503 can drive the push block 501 to reciprocate in the center of the middle hole 302 and the supporting plate 303 through the linkage plate 502, thus forming reciprocating pushing of the initial plate at the lower end.

[0071] Further:

[0072] The corrosion device further comprises side baffles 401, L-shaped plates 402 and a bidirectional screw II 403, the two side baffles 401 slide in the middle hole 302, the lower ends of the two L-shaped plates 402 are fixedly connected with the two side baffles 401 respectively, the bidirectional screw II 403 rotates on the middle plate 304, and the upper ends of the two L-shaped plates 402 are screw-connected with the two ends of the bidirectional screw II 403 respectively.

[0073] The two side baffles 401 and the two L-shaped plates 402 are arranged to block the two sides of the screwing initial plate, so as to ensure that the screwing initial plate is located in the middle and corresponds to the two rubber rings 204, and the two L-shaped plates 402 are synchronously moved close to or away from each other by rotating the bidirectional screw II 403, thus adjusting the distance between the two side baffles 401 and making the device adapt to the limiting of initial plates of different widths.

Claims

1. A method for manufacturing a circuit board, characterized in that: Includes the following steps: S1. Cut the copper-clad substrate to obtain the initial board; S2. Apply the transfer paper to one side of the initial plate; S3. Transfer printing using a heat transfer machine; S4. The initial plate after transfer is continuously and uninterruptedly immersed in the etching solution for etching processing through the etching device. S5. Clean the corroded initial board thoroughly; S6. Drill holes in the cleaned initial board; S7. After drilling, polish the initial board. S8. Clean the initial board again, let it dry, and then apply rosin to the side with the circuit to obtain the circuit board.

2. The method for manufacturing a circuit board according to claim 1, characterized in that: The transfer paper has a circuit diagram printed on it.

3. The method for manufacturing a circuit board according to claim 1, characterized in that: The corrosive solution in step S4 includes concentrated hydrochloric acid, concentrated hydrogen peroxide, and water.

4. The method for manufacturing a circuit board according to claim 1, characterized in that: During the transfer process, the temperature of the heat transfer machine is 160-200℃.

5. The method for manufacturing a circuit board according to claim 1, characterized in that: Before etching in step S4, check whether the initial plate has been properly transferred.

6. The method for manufacturing a circuit board according to claim 1, characterized in that: In step S5, clean water is used for rinsing.

7. The method for manufacturing a circuit board according to claim 1, characterized in that: In step S7, the surface is polished using fine sandpaper.

8. The method for manufacturing a circuit board according to claim 1, characterized in that: In step S8, the water is used for cleaning.

9. A method for manufacturing a circuit board according to claim 1, characterized in that: In step S8, the initial plate is heated by a hot air blower to rapidly solidify the rosin.

10. A circuit board, characterized in that, The circuit board is prepared using the circuit board preparation method described in any one of claims 1-9.

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