Boiling heat exchange device with manifold shunting channel and injection channel
By designing a boiling heat exchanger with a manifold distribution channel and an ejector channel, the problems of heat transfer efficiency and boiling stability of the cooling medium under high heat flux density were solved, achieving efficient cooling medium replenishment and steam removal, and improving heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-03
- Publication Date
- 2026-04-10
AI Technical Summary
Existing jet impact array two-phase cooling technology has insufficient heat transfer efficiency, large working fluid flow rate and uneven temperature distribution on the heat dissipation surface when high heat flux density heat dissipation requirements are met. In the microchannel boiling heat exchange process, there are problems such as uneven flow distribution, steam blockage and boiling flow instability.
Design a boiling heat exchanger with a manifold distribution channel and an ejector channel, including a multi-level biomimetic tree-shaped manifold distribution channel, an inlet nozzle, an ejector channel, and a return pipe structure. Through the connection between the multi-level manifold distribution channel structure and the return pipe structure, the multi-level distribution of the cooling medium and the bypass opening of the steam are realized, forming a self-oscillating ejector jet, thereby improving the cooling medium replenishment rate and steam removal capacity.
It significantly improves the boiling stability of the cooling medium, inhibits localized drying of the impact surface, enhances the fluid permeability and steam accumulation removal capacity of the cooling medium, reduces flow resistance, and strengthens the cooling effect.
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Figure CN121843092A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology for electronic devices, and in particular to a boiling heat exchange device having a manifold diversion channel and an ejector channel. Background Technology
[0002] High-performance integrated circuits are widely used in advanced engineering fields such as electrical control equipment for national defense, power systems for energy and transportation, and artificial intelligence cluster computing. Miniaturization and multi-chip integration are effective ways to improve integrated circuit performance. However, high-density transistors and large-scale chip integration bring about the problem of large-area, high-power dissipation. Therefore, future research will focus on heat source areas greater than 800 mm², average heat flux densities exceeding 100 W / cm², and local heat flux densities reaching as high as 1000 W / cm². 2 Cooling technology for highly efficient, low-power miniaturized electronic devices will be an important development direction.
[0003] Currently, jet impingement array two-phase cooling technology is considered one of the more ideal heat dissipation solutions for solving the problems of ultra-high heat flux density and spatiotemporally non-uniform heat generation in the next generation due to its extremely high heat transfer efficiency and excellent spatial thermal management capabilities. However, single-phase fluid cooling and other methods in jet impingement array two-phase cooling technology often exhibit problems such as insufficient heat transfer efficiency, large working fluid flow rate, and uneven temperature distribution on the heat dissipation surface when facing such high heat flux density heat dissipation requirements, due to their inherent heat transfer mechanism. Moreover, microchannel boiling heat transfer achieves efficient heat transfer through working fluid phase change, and has advantages such as high heat transfer coefficient, small working fluid quantity, and good surface temperature uniformity. It is regarded as a highly promising solution to solve the heat dissipation bottleneck of next-generation high-power electronic devices. However, the two-phase flow in the microchannel boiling heat transfer process suffers from boiling flow instability problems such as uneven flow distribution, vapor blockage, and localized drying, which has become an important research direction in the current heat dissipation field.
[0004] Therefore, there is an urgent need for a boiling heat exchanger that can efficiently remove steam generated under high heat flux density and high steam dryness conditions, while significantly enhancing the wettability of the impact surface, increasing the bubble escape rate and cooling medium replenishment rate in the impact gap, and improving the ability to remove steam accumulation under high bubble nucleation rate. Summary of the Invention
[0005] In view of the shortcomings of the prior art described above, this application provides a boiling heat exchange device with a manifold diversion channel and an ejector channel to solve the above-mentioned technical problems.
[0006] According to one aspect of the embodiments of this application, a boiling heat exchange device with a manifold diversion channel and an ejector channel is provided. The heat dissipation device includes: a device shell, a cooling medium inlet pipe and a cooling medium outlet pipe disposed on the device shell, a hierarchical manifold diversion channel structure, an ejector channel and a return pipe structure disposed inside the device shell, and an impact surface disposed at the bottom of the device shell. The tiered manifold diversion channel structure is connected to the cooling medium inlet pipe. This structure diverts the cooling medium, forming a two-phase fluid that is jetted onto the impact surface. One end of the ejector channel is connected to the tiered manifold diversion channel structure, and the other end is connected to the return pipe structure. This allows for bypass opening when steam is generated on the impact surface and the tiered manifold diversion channel structure is blocked by steam. This enables the tiered manifold diversion channel structure to connect with the return pipe structure, allowing additional cooling medium to flow into the tiered manifold diversion channel structure. The return pipe structure is connected to the cooling medium outlet pipe, supplying steam and cooling medium for return flow, and allowing the returned steam and cooling medium to flow out from the cooling medium outlet pipe.
[0007] In one embodiment of this application, the hierarchical manifold distribution channel structure includes: a multi-level biomimetic tree-shaped manifold distribution channel and an inlet nozzle; the multi-level biomimetic tree-shaped manifold distribution channel is connected to the cooling medium inlet pipe, and the multi-level biomimetic tree-shaped manifold distribution channel is used to perform multi-level distribution of the cooling medium to form a two-phase fluid; the inlet nozzle is disposed at the bottom of the multi-level biomimetic tree-shaped manifold distribution channel, and the inlet nozzle is connected to the bottom end of the ejector channel, and the inlet nozzle is used to allow the two-phase fluid to be sprayed onto the impact surface in a jet manner.
[0008] In one embodiment of this application, the multi-level biomimetic tree-shaped manifold distribution channel includes: a first-level biomimetic tree-shaped manifold distribution channel, a second-level biomimetic tree-shaped manifold distribution channel, and a third-level biomimetic tree-shaped manifold distribution channel; the top end of the first-level biomimetic tree-shaped manifold distribution channel is connected to the bottom end of the cooling medium inlet pipe, the bottom end of the first-level biomimetic tree-shaped manifold distribution channel is connected to the top end of the second-level biomimetic tree-shaped manifold distribution channel, and the bottom end of the second-level biomimetic tree-shaped manifold distribution channel is connected to the top end of the third-level biomimetic tree-shaped manifold distribution channel; the inlet nozzle is disposed in the... The bottom end of the third-level bionic tree-shaped manifold diversion channel; the number of the second-level bionic tree-shaped manifold diversion channels is a multiple of the number of the first-level bionic tree-shaped manifold diversion channels, and the number of the third-level bionic tree-shaped manifold diversion channels is a multiple of the number of the first-level bionic tree-shaped manifold diversion channels; the angle between the second-level bionic tree-shaped manifold diversion channels and the first-level bionic tree-shaped manifold diversion channels is in the range of [0℃, 180℃], and the angle between the third-level bionic tree-shaped manifold diversion channels and the second-level bionic tree-shaped manifold diversion channels is in the range of [0℃, 180℃].
[0009] In one embodiment of this application, the outlet return channel is connected to the cooling medium outlet pipe, the outlet return channel is connected to the outlet channel, the outlet nozzle is disposed at the bottom end of the outlet channel, and the outlet nozzle is connected to the top end of the ejector channel; the outlet nozzle is used for steam return, and the ejector channel is also used for cooling medium return when the bypass is open, and the returned steam and the returned cooling medium flow out sequentially from the outlet channel, the outlet return channel and the cooling medium outlet pipe.
[0010] In one embodiment of this application, the bottom diameter of the ejector channel is larger than the top diameter of the ejector channel; the ejector channel is used to bypass and open when steam is generated on the impact surface and the inlet nozzle is blocked by steam, so that the inlet nozzle is connected to the outlet nozzle and the newly added cooling medium flows into the multi-level biomimetic tree-shaped manifold distribution channel; the included angle between the ejector channel and the third-level biomimetic tree-shaped manifold distribution channel is (0°C, 90°C).
[0011] In one embodiment of this application, the inlet nozzles are arranged in an array, and the number of inlet nozzles is the same as the number of the third-level bionic tree-shaped manifold diversion channels; the outlet nozzles are arranged in an array, and the number of outlet nozzles is the same as the number of outlet channels; the outlet channels are arranged between the third-level bionic tree-shaped manifold diversion channels in adjacent rows, or the outlet channels are arranged between the third-level bionic tree-shaped manifold diversion channels in adjacent columns.
[0012] In one embodiment of this application, the diameter of the inlet nozzle ranges from [0.1, 10] mm, the lateral spacing between adjacent inlet nozzles ranges from [1, 30] mm, and the longitudinal spacing between adjacent inlet nozzles ranges from [1, 30] mm; the diameter of the outlet nozzle ranges from [0.1, 10] mm, the lateral spacing between adjacent outlet nozzles ranges from [1, 30] mm, and the longitudinal spacing between adjacent outlet nozzles ranges from [1, 30] mm; the spacing between the inlet nozzle and the outlet nozzle ranges from [0.5, 15] mm, and the spacing range between the inlet nozzle and the outlet nozzle is characterized by the spacing range between the third-level biomimetic tree-shaped manifold diversion channel and the outlet channel.
[0013] In one embodiment of this application, an impact gap layer is disposed above the impact surface. The impact gap layer is used to connect the inlet nozzle and the outlet nozzle. When the two-phase fluid is jetted onto the impact surface, the two-phase fluid passes through the impact gap layer, which is used to regulate the flow direction of the two-phase liquid. When the impact surface is impacted by the two-phase fluid and boils, the impact gap layer is used to adjust the bubble size. A substrate is disposed above the impact surface. The substrate is used to receive heat conducted by electronic devices and conduct it to the impact surface.
[0014] In one embodiment of this application, the impact surface is a smooth surface, a non-smooth hydrophilic-phobic microstructure surface, or a non-smooth metal mesh microstructure surface; the substrate is a ceramic substrate, a sapphire substrate, an indium tin oxide sapphire substrate, or an indium tin oxide sapphire substrate; and the material of the impact gap layer is a porous metal fiber material, a foamed metal material, or a porous granular layer material.
[0015] In one embodiment of this application, the material of the multi-level biomimetic tree-shaped manifold diversion channel is a metallic material, an inorganic non-metallic material, or an inorganic non-metallic composite material; the material of the outlet channel is a metallic material, an inorganic non-metallic material, or an inorganic non-metallic composite material.
[0016] The beneficial effects of this application are as follows: This application includes a device housing, a cooling medium inlet pipe and a cooling medium outlet pipe installed on the device housing, a tiered manifold distribution channel structure, an ejector channel and a return pipe structure installed inside the device housing, and an impact surface at the bottom of the device housing. The tiered manifold distribution channel structure is connected to the cooling medium inlet pipe and is used to distribute the cooling medium, forming a two-phase fluid. The two-phase fluid is jetted onto the impact surface. One end of the ejector channel is connected to the tiered manifold distribution channel structure, and the other end is connected to the return pipe structure. This allows for bypass opening when steam is generated on the impact surface and the tiered manifold distribution channel structure is blocked by steam, thus allowing the tiered manifold distribution channel structure to function properly. The structure is connected to the return pipe structure, allowing the newly added cooling medium to flow into the tiered manifold distribution channel structure. The return pipe structure is connected to the cooling medium outlet pipe and is used to supply steam and cooling medium for return flow. The returned steam and returned cooling medium flow out from the cooling medium outlet pipe. Through the above structural setup, a portion of the return steam and cooling medium can form a self-oscillating ejector jet, accelerating the replenishment of cooling medium and steam removal in the tiered manifold distribution channel structure. This increases the replenishment rate of cooling medium and the bubble escape rate in the tiered manifold distribution channel structure, thereby controlling the steam blockage behavior of the tiered manifold distribution channel structure, effectively suppressing local drying of the impact surface, significantly improving the instability of cooling medium boiling, and guiding the orderly conversion of flow patterns.
[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings: Figure 1 This is a schematic diagram of the structure of a boiling heat exchanger having a manifold diversion channel and an ejector channel, as shown in an exemplary embodiment of this application. Figure 2 This is a schematic diagram of the internal structure of a boiling heat exchanger having a manifold diversion channel and an ejector channel, as shown in an exemplary embodiment of this application. Figure 3 This is a schematic diagram of a biomimetic structure of a hierarchical manifold diversion channel structure, as shown in an exemplary embodiment of this application. Figure 4 This is a schematic diagram of the center section of a hierarchical manifold distribution channel structure, as shown in an exemplary embodiment of this application. Figure 5 This is a schematic diagram illustrating an inlet nozzle array and an outlet nozzle array, as shown in an exemplary embodiment of this application.
[0019] Figure label: 1-Cooling medium inlet pipe; 2-First-level biomimetic tree-shaped manifold diversion channel; 3-Second-level biomimetic tree-shaped manifold diversion channel; 4-Third-level biomimetic tree-shaped manifold diversion channel; 5-Inlet nozzle; 6-Ejector channel; 7-Outlet nozzle; 8-Outlet channel; 9-Outlet return channel; 10-Cooling medium outlet pipe; 11-Impact gap layer; 12-Impact surface; 13-Base plate; 14-Equipment housing. Detailed Implementation
[0020] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0021] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.
[0022] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the present application. However, it will be apparent to those skilled in the art that embodiments of the present application may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the present application.
[0023] The implementation details of the technical solutions in the embodiments of this application are described in detail below: Reference Figures 1-3 As shown, the heat dissipation device includes: a device housing 14, a cooling medium inlet pipe 1 and a cooling medium outlet pipe 10 disposed on the device housing 14, a hierarchical manifold distribution channel structure, an ejector channel 6 and a return pipe structure disposed inside the device housing 14, and an impact surface 12 disposed at the bottom of the device housing 14. The hierarchical manifold distribution channel structure is connected to the cooling medium inlet pipe 1. The hierarchical manifold distribution channel structure is used to split the cooling medium and form a two-phase fluid. The two-phase fluid is sprayed onto the impact surface 12 in a jet manner. One end of the ejector channel 6 is connected to the hierarchical manifold distribution channel structure, and the other end of the ejector channel 6 is connected to the return pipe structure. It is used to open the bypass when steam is generated on the impact surface 12 and the hierarchical manifold distribution channel structure is blocked by steam, so that the hierarchical manifold distribution channel structure is connected to the return pipe structure and the newly added cooling medium flows into the hierarchical manifold distribution channel structure. The return pipe structure is connected to the cooling medium outlet pipe 10. The return pipe structure is used to supply steam and cooling medium for return, and to allow the returned steam and returned cooling medium to flow out from the cooling medium outlet pipe 10.
[0024] In one embodiment of this application, during the operation of the heat dissipation device, the cooling medium enters the hierarchical manifold distribution channel structure through the cooling medium inlet pipe 1, forming a two-phase fluid. After the two-phase liquid flows out of the hierarchical manifold distribution channel structure, it is sprayed onto the impact surface 12 in a jet manner. Because the impact surface 12 receives the heat generated by the electronic devices under high heat flux density conditions, it has a high temperature. When the two-phase liquid is sprayed onto the impact surface 12, the impact surface 12 begins to boil, generating steam bubbles that flow back to the hierarchical manifold distribution channel structure and cause blockage. The bypass of jet channel 6 opens, connecting the tiered manifold distribution channel structure with the return pipe structure, and allowing the newly added cooling medium to flow into the tiered manifold distribution channel structure. It can utilize some of the return steam and cooling medium to form a self-oscillating ejector jet, accelerating the replenishment of cooling medium and the removal of steam in the tiered manifold distribution channel structure. This increases the replenishment rate of cooling medium and the escape rate of bubbles in the tiered manifold distribution channel structure, thereby controlling the steam blockage behavior of the tiered manifold distribution channel structure, effectively suppressing the local drying of the impact surface 12, significantly improving the instability of cooling medium boiling, and guiding the orderly conversion of flow patterns.
[0025] In one embodiment of this application, the return pipe structure is used for the return of steam and cooling medium, and the returned steam and cooling medium flow out from the cooling medium outlet pipe 10. Whether the steam bubbles generated after the two-phase liquid is sprayed onto the impact surface 12 in a jet manner cause steam blockage in the hierarchical manifold distribution channel structure is determined by data collected by pressure sensors, temperature sensors, flow sensors, etc. installed in the hierarchical manifold distribution channel structure, which will not be elaborated here.
[0026] In one embodiment of this application, the hierarchical manifold diversion channel structure includes: a multi-level biomimetic tree-shaped manifold diversion channel and an inlet nozzle 5; The multi-level biomimetic tree-shaped manifold distribution channel is connected to the cooling medium inlet pipe 1. The multi-level biomimetic tree-shaped manifold distribution channel is used to perform multi-level distribution of the cooling medium to form a two-phase fluid. The inlet nozzle 5 is located at the bottom of the multi-level biomimetic tree-shaped manifold distribution channel. The inlet nozzle 5 is connected to the bottom end of the ejector channel 6. The inlet nozzle 5 is used to allow two-phase fluid to be sprayed onto the impact surface 12 in a jet manner.
[0027] In one embodiment of this application, during the operation of the heat dissipation device, the cooling medium enters the multi-level biomimetic tree-shaped manifold distribution channel through the cooling medium inlet pipe 1, forming a two-phase fluid. After the two-phase liquid flows out of the inlet nozzle 5, it is sprayed onto the impact surface 12 in a jet manner. The multi-level biomimetic tree-shaped manifold distribution channel performs multi-level distribution of the cooling medium, so that after the two-phase liquid flows out of the inlet nozzle 5, it can be evenly sprayed onto the impact surface 12, reducing the local temperature difference for heat dissipation of electronic devices.
[0028] In one embodiment of this application, the multi-level biomimetic tree-like manifold diversion channel includes: First-level biomimetic tree-shaped manifold diversion channel 2, second-level biomimetic tree-shaped manifold diversion channel 3, third-level biomimetic tree-shaped manifold diversion channel 4; The top end of the first-level bionic tree-shaped manifold distribution channel 2 is connected to the bottom end of the cooling medium inlet pipe 1. The bottom end of the first-level bionic tree-shaped manifold distribution channel 2 is connected to the top end of the second-level bionic tree-shaped manifold distribution channel 3. The bottom end of the second-level bionic tree-shaped manifold distribution channel 3 is connected to the top end of the third-level bionic tree-shaped manifold distribution channel 4. The inlet nozzle 5 is located at the bottom end of the third-level bionic tree-shaped manifold distribution channel 4. The number of second-level bionic tree-shaped manifold diversion channels 3 is a multiple of the number of first-level bionic tree-shaped manifold diversion channels 2, and the number of third-level bionic tree-shaped manifold diversion channels 4 is a multiple of the number of first-level bionic tree-shaped manifold diversion channels 2. The angle between the second-level bionic tree-shaped manifold diversion channel 3 and the first-level bionic tree-shaped manifold diversion channel 2 is in the range of [0℃, 180℃], and the angle between the third-level bionic tree-shaped manifold diversion channel 4 and the second-level bionic tree-shaped manifold diversion channel 3 is in the range of [0℃, 180℃].
[0029] In one embodiment of this application, a first-level biomimetic tree-shaped manifold diversion channel 2, a second-level biomimetic tree-shaped manifold diversion channel 3, and a third-level biomimetic tree-shaped manifold diversion channel 4 are provided. The number of second-level biomimetic tree-shaped manifold diversion channels 3 is a multiple of the number of first-level biomimetic tree-shaped manifold diversion channels 2, and the number of third-level biomimetic tree-shaped manifold diversion channels 4 is a multiple of the number of first-level biomimetic tree-shaped manifold diversion channels 2. The second-level biomimetic tree-shaped manifold diversion channels 3 and the first-level biomimetic tree-shaped manifold diversion channels are diverted. The included angle between channels 2 is in the range of [0℃, 180℃], and the included angle between the third-level bionic tree-shaped manifold distribution channel 4 and the second-level bionic tree-shaped manifold distribution channel 3 is in the range of [0℃, 180℃]. This can reduce the flow resistance of the cooling medium in the first-level bionic tree-shaped manifold distribution channel 2, the second-level bionic tree-shaped manifold distribution channel 3, and the third-level bionic tree-shaped manifold distribution channel 4, enhance the transport of the cooling medium, improve the fluid permeability of the cooling medium to a certain extent, and improve the flow non-uniformity of the cooling medium.
[0030] In one embodiment of this application, the first-level biomimetic tree-shaped manifold branching channel 2, the second-level biomimetic tree-shaped manifold branching channel 3, and the third-level biomimetic tree-shaped manifold branching channel 4 adopt a biomimetic design method, conforming to Murry's law. The diameters of adjacent-level biomimetic tree-shaped manifold branching channels follow Murry's law, meaning their function is to characterize the optimized relationship between the dimensions of the main pipe and the daughter pipes in the branching system, in order to minimize flow resistance or maximize transmission efficiency. Furthermore, the multi-level biomimetic tree-shaped manifold branching channel has several layers, and the parting angle between each two layers ranges from 0° to θ. n ≤180°, for example, θ1, and the parting angle between the biomimetic tree-shaped manifold distribution channels in the same layer can be set to the same value or different values. The parting angle range between the biomimetic tree-shaped manifold distribution channels in the same layer is 0°≤θ. n ≤180°, for example, θ2, θ3.
[0031] In one embodiment of this application, the return pipe structure includes: an outlet nozzle 7, an outlet channel 8, and an outlet return channel 9; The outlet return channel 9 is connected to the cooling medium outlet pipe 10, and the outlet return channel 9 is connected to the outlet channel 8. The outlet nozzle 7 is located at the bottom end of the outlet channel 8 and is connected to the top end of the ejector channel 6. The outlet nozzle 7 is used for steam recirculation. When the bypass is open, the ejector channel 6 is also used for cooling medium recirculation. The recirculated steam and the recirculated cooling medium flow out sequentially from the outlet channel 8, the outlet recirculation channel 9, and the cooling medium outlet pipe 10.
[0032] In one embodiment of this application, steam enters the outlet channel 8 through the outlet nozzle 7 and is collected in the outlet return channel 9. When the ejector channel 6 is open in bypass mode, the cooling medium flows back to the outlet channel 8 through the ejector channel 6 and is collected in the outlet return channel 9. The collected steam and the collected cooling medium flow out from the cooling medium outlet pipe 10.
[0033] In one embodiment of this application, a power pump or the like is provided on the cooling medium inlet pipe 1 to accelerate the inflow of cooling medium, and a power pump or the like is provided on the cooling medium outlet pipe 10 to accelerate the outflow of cooling medium.
[0034] In one embodiment of this application, the bottom diameter of the ejector channel 6 is larger than the top diameter of the ejector channel 6; The ejector channel 6 is used to bypass and open when steam is generated on the impact surface 12 and the inlet nozzle 5 is blocked by steam, so that the inlet nozzle 5 is connected to the outlet nozzle 7 and the newly added cooling medium flows into the multi-level biomimetic tree-shaped manifold distribution channel. The angle between ejector channel 6 and the third-level biomimetic tree-shaped manifold diversion channel 4 is (0°C, 90°C).
[0035] In one embodiment of this application, the bottom diameter of the ejector channel 6 is d2, the top diameter of the ejector channel 6 is d1, the bottom diameter d2 of the ejector channel 6 is larger than the top diameter d1 of the ejector channel 6, and the ejector channel 6 is inclined. When steam is generated on the impact surface 12 and the inlet nozzle 5 is blocked by steam, the bypass of the ejector channel 6 is opened, which has the function of regulating the steam blockage behavior of the hierarchical manifold distribution channel structure, accelerating the replenishment of cooling medium in the hierarchical manifold distribution channel structure, thereby accelerating the removal of steam from the hierarchical manifold distribution channel structure and guiding the orderly conversion of the flow pattern.
[0036] In one embodiment of this application, the inlet nozzles 5 are arranged in an array, and the number of inlet nozzles 5 is the same as the number of the third-level biomimetic tree-shaped manifold diversion channels 4. The outlet nozzles 7 are arranged in an array, and the number of outlet nozzles 7 is the same as the number of outlet channels 8; The outlet channel 8 is located between the third-level bionic tree-shaped manifold diversion channels 4 in adjacent rows, or the outlet channel 8 is located between the third-level bionic tree-shaped manifold diversion channels 4 in adjacent columns.
[0037] In one embodiment of this application, an outlet channel 8 rows are provided between the third-level bionic tree-shaped manifold diversion channels 4 in adjacent rows. The number of outlet channels 8 in each row is the same as the number of third-level bionic tree-shaped manifold diversion channels 4 in each row. Each outlet nozzle 7 can be connected to the adjacent inlet nozzle 5 on one side through the ejector channel 6 to form an asymmetrical arrangement structure, or it can be connected to the adjacent inlet nozzles 5 on both sides through the ejector channel 6 to form a symmetrical arrangement structure.
[0038] In one embodiment of this application, an outlet channel 8 columns are provided between the third-level bionic tree-shaped manifold diversion channels 4 in adjacent columns, and the number of outlet channels 8 in each column is the same as the number of third-level bionic tree-shaped manifold diversion channels 4 in each column.
[0039] In one embodiment of this application, the diameter of the inlet nozzle ranges from [0.1, 10] mm, the lateral spacing between adjacent inlet nozzles ranges from [1, 30] mm, and the longitudinal spacing between adjacent inlet nozzles ranges from [1, 30] mm; the diameter of the outlet nozzle ranges from [0.1, 10] mm, the lateral spacing between adjacent outlet nozzles ranges from [1, 30] mm, and the longitudinal spacing between adjacent outlet nozzles ranges from [1, 30] mm; the spacing between the inlet nozzle and the outlet nozzle ranges from [0.5, 15] mm, and the spacing range between the inlet nozzle and the outlet nozzle is characterized by the spacing range between the third-level biomimetic tree-like manifold diversion channel and the outlet channel.
[0040] In one embodiment of this application, the spacing range between the inlet nozzle 5 and the outlet nozzle 7 is characterized by the spacing range between the third-level bionic tree-shaped manifold diversion channel 4 and the outlet channel 8. The spacing range between the third-level bionic tree-shaped manifold diversion channel 4 and the outlet channel 8 is either the spacing range between the third-level bionic tree-shaped manifold diversion channel 4 and the outlet channel 8 located in the same row, or the spacing range between the third-level bionic tree-shaped manifold diversion channel 4 and the outlet channel 8 located in the same column.
[0041] In one embodiment of this application, by setting the diameter range of the inlet nozzle 5, the lateral spacing range between adjacent inlet nozzles 5, the longitudinal spacing range between adjacent inlet nozzles 5, the diameter range of the outlet nozzle 7, the lateral spacing range between adjacent outlet nozzles 7, the longitudinal spacing range between adjacent outlet nozzles 7, and the spacing range between the inlet nozzle 5 and the outlet nozzle 7, the uniformity of the two-phase fluid falling on the impact surface 12 after the diversion effect of the multi-level biomimetic tree-shaped manifold diversion channel is ensured, while ensuring that steam and cooling medium flow out of the heat dissipation device through the return pipe structure and the cooling medium outlet pipe 10.
[0042] In one embodiment of this application, an impact gap layer 11 is provided above the impact surface 12. The impact gap layer 11 is used to connect the inlet nozzle 5 and the outlet nozzle 7. When the two-phase fluid is sprayed onto the impact surface 12 in a jet manner, the two-phase fluid passes through the impact gap layer 11. The impact gap layer 11 is used to regulate the flow direction of the two-phase liquid. When the impact surface 12 is impacted by the two-phase fluid and boils, the impact gap layer 11 is used to adjust the bubble size. A substrate 13 is disposed above the impact surface 12. The substrate 13 is used to receive the heat conducted by the electronic device and conduct it to the impact surface 12.
[0043] In one embodiment of this application, a predetermined distance H is maintained between the impact gap layer 11 and the impact surface 12, wherein the predetermined distance H ranges from [0.1, 10] mm. When the two-phase fluid is jetted onto the impact surface 12, the two-phase fluid passes through the impact gap layer 11, which is used to regulate the flow direction of the two-phase liquid, further ensuring that the two-phase liquid is uniformly sprayed onto the impact surface 12. When the impact surface 12 is impacted and boils due to the steam backflow, bubbles are generated in the impact gap layer 11. As the boiling process of the impact surface 12 continues, the impact surface 12 partially dries up, and the bubbles converge into "long gas". When the steam bubbles return to the hierarchical manifold distribution channel structure, they cause steam blockage at the inlet nozzle 5. At this time, the bypass of the ejector channel 6 is opened, connecting the inlet nozzle 5 and the outlet nozzle 7, and allowing the newly added cooling medium to flow into the impact gap layer 11. A self-oscillating ejector jet is generated in the impact gap layer 11 and acts on the "long bubble" blocking the inlet nozzle 5. The "long bubble" is cooled and broken by the upstream cooling medium, and the impact surface 12 in the area below the "long bubble" is re-wetted, thereby regulating the steam blockage behavior of the impact gap layer 11, accelerating the replenishment of cooling medium and steam removal at the inlet nozzle 5, suppressing the instability of two-phase fluid boiling, and guiding the orderly conversion of the flow pattern.
[0044] In one embodiment of this application, the impact surface 12 is a smooth surface, a non-smooth hydrophilic-hydrophobic microstructure surface, or a non-smooth metal mesh microstructure surface; The substrate 13 is a ceramic substrate 13, a sapphire substrate 13, an indium tin oxide sapphire substrate 13, or an indium tin oxide sapphire substrate 13. The material of the impact gap layer 11 is a porous metal fiber material, a foam metal material, or a porous granular layer material.
[0045] In one embodiment of this application, the impact surface 12 is made of a smooth surface by means of a metallic material (e.g., copper and copper alloys, stainless steel, aluminum and aluminum alloys, etc.), the impact surface 12 is made of a non-smooth hydrophilic and hydrophobic microstructure surface by means of a metallic material (e.g., copper and copper alloys, stainless steel, etc.) or a ceramic material (e.g., alumina, silicon carbide), and the impact surface 12 is made of a non-smooth metallic mesh microstructure surface by means of a metallic material (e.g., copper and copper alloys, stainless steel, titanium alloys, etc.).
[0046] In one embodiment of this application, the porous metal fiber material can be selected from metals with good thermal conductivity, such as stainless steel, copper, titanium, and aluminum.
[0047] In one embodiment of this application, the material of the multi-level biomimetic tree-shaped manifold diversion channel is a metallic material, an inorganic non-metallic material, or an inorganic non-metallic composite material; the material of the outlet channel 8 is a metallic material, an inorganic non-metallic material, or an inorganic non-metallic composite material.
[0048] In one embodiment of this application, the multi-level biomimetic tree-shaped manifold distribution channel is made of metallic materials, inorganic non-metallic materials, or inorganic non-metallic composite materials. This improves the durability and heat transfer efficiency of the entire boiling heat exchanger, ensuring stable operation of the multi-level biomimetic tree-shaped manifold distribution channel under high temperature and high pressure conditions. The outlet channel 8 is made of metallic materials, inorganic non-metallic materials, or inorganic non-metallic composite materials, ensuring structural integrity and fluid transport efficiency under high temperature, high pressure, and complex fluid environments. This avoids leakage or deformation problems caused by insufficient material properties. Through the coordinated matching of the material properties of the multi-level biomimetic tree-shaped manifold distribution channel, the material properties of the outlet channel 8, the structural design of the multi-level biomimetic tree-shaped manifold distribution channel, and the material properties of the outlet channel 8, the reliability and heat transfer efficiency of the boiling heat exchanger under extreme conditions can be further improved, while reducing long-term maintenance costs.
[0049] In one embodiment of this application, the cooling medium may be selected from water, dielectric cooling medium (e.g., HFE7100 (methoxy-nonafluorobutane, C4F9OCH3) or HFE7000 (C4H3F7O)), R134a (tetrafluoroethane), etc.
[0050] In one embodiment of this application, both the cooling medium inlet pipe 1 and the cooling medium outlet pipe 10 are pagoda-shaped.
[0051] Figure 4 This is a schematic diagram of the center section of a hierarchical manifold distribution channel structure, as shown in an exemplary embodiment of this application. Figure 4As shown, during the operation of the heat dissipation device, the cooling medium enters sequentially through the cooling medium inlet pipe 1 into the first-level bionic tree-shaped manifold distribution channel 2, the second-level bionic tree-shaped manifold distribution channel 3, and the third-level bionic tree-shaped manifold distribution channel 4, forming a two-phase fluid. After the two-phase liquid flows out of the inlet nozzle 5, it is sprayed onto the impact surface 12 in a jet manner. After the impact surface 12 boils, the steam enters the outlet channel 8 through the outlet nozzle 7, and the cooling medium enters the outlet channel 8 through the ejector channel 6. The steam and cooling medium are collected in the outlet return channel 9, and the collected steam and collected cooling medium flow out from the cooling medium outlet pipe 10. The diameter of the outlet channel 8 is larger than the diameter of the first-level bionic tree-shaped manifold distribution channel 2, the diameter of the outlet channel 8 is larger than the diameter of the second-level bionic tree-shaped manifold distribution channel 3, and the diameter of the third-level bionic tree-shaped manifold distribution channel 4 is larger than the diameter of the second-level bionic tree-shaped manifold distribution channel 3.
[0052] Figure 5 This is a schematic diagram illustrating an inlet nozzle 5 array and an outlet nozzle 7 array, as shown in an exemplary embodiment of this application. Figure 5 In the diagram, the large circle represents the outlet nozzle 7, and the small circle represents the inlet nozzle 5. The diameter of the inlet nozzle 5 is d. in The lateral spacing between adjacent inlet nozzles 5 is W1, the longitudinal spacing between adjacent inlet nozzles 5 is P1, the number of inlet nozzles 5 in the array is 16, and the diameter of the outlet nozzle 7 is d. out The lateral spacing between adjacent outlet nozzles 7 is W2, the longitudinal spacing between adjacent outlet nozzles 7 is P2, the number of outlet nozzles 7 arrays is 12, and the spacing range between inlet nozzles 5 and outlet nozzles 7 is D.
[0053] In one embodiment of this application, the diameter d of the inlet nozzle 5 is... in The range is [0.1, 10] mm, the lateral spacing W1 between adjacent inlet nozzles 5 is [1, 30] mm, the longitudinal spacing P1 between adjacent inlet nozzles 5 is [1, 30] mm, the number of inlet nozzle arrays 5 is [1, 30], and the diameter d of the outlet nozzle 7 is [0.1, 10] mm. out The range is [0.1, 10] mm, the range of the lateral spacing W2 between adjacent outlet nozzles 7 is [1, 30] mm, the range of the longitudinal spacing P2 between adjacent outlet nozzles 7 is [1, 30] mm, the range of the number of outlet nozzles 7 arrays is [1, 30], and the range of the spacing D between inlet nozzle 5 and outlet nozzle 7 is [0.5, 15] mm.
[0054] In one embodiment of this application, by setting the diameter range of the inlet nozzle 5, the lateral spacing range between adjacent inlet nozzles 5, the longitudinal spacing range between adjacent inlet nozzles 5, the diameter range of the outlet nozzle 7, the lateral spacing range between adjacent outlet nozzles 7, the longitudinal spacing range between adjacent outlet nozzles 7, and the spacing range between the inlet nozzle 5 and the outlet nozzle 7, the uniformity of the two-phase fluid falling on the impact surface 12 after the diversion effect of the multi-level biomimetic tree-shaped manifold diversion channel is ensured, while ensuring that steam and cooling medium flow out of the heat dissipation device through the return pipe structure and the cooling medium outlet pipe 10.
[0055] This application effectively enhances the transport process of the two-phase fluid by coupling a three-dimensional biomimetic flow path (i.e., a multi-level biomimetic tree-shaped manifold distribution channel) with a steam outlet layer (i.e., a return pipe structure) and constructing an ejector channel 6 between the three-dimensional biomimetic flow path and the return pipe structure. The aforementioned structure significantly enhances the organization and controllability of the flow field within the impact gap layer 11. By optimizing the vortex structure characteristics of the steam and cooling medium, it improves the flow uniformity under wall constraints, thereby suppressing the unstable bubble nucleation phenomenon caused by localized uneven heat transfer. Compared with the multi-level manifold array jet impact microchannel in related technologies, the three-dimensional biomimetic flow path-steam outlet layer design... This invention further enhances the uniformity of cooling medium flow, reduces cooling medium flow resistance, optimizes cooling medium transmission efficiency, suppresses steam backflow, shortens the discharge path, and significantly strengthens two-phase transport. The application also features a multi-level biomimetic tree-shaped manifold distribution channel, which improves the uniformity of cooling medium distribution within the channel and the steam discharge capacity. This allows for sustained and efficient two-phase heat exchange under high heat flux conditions, effectively delaying the occurrence of critical heat flux, significantly improving the performance and reliability of the heat dissipation device, and achieving coordinated control of the flow field structure and heat transfer characteristics during the boiling process of the impact surface 12.
[0056] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.
Claims
1. A boiling heat exchanger having a manifold diversion channel and an ejector channel, characterized in that, The heat dissipation device includes: The device housing, the cooling medium inlet pipe and the cooling medium outlet pipe disposed on the device housing, the hierarchical manifold distribution channel structure, the ejector channel and the return pipe structure disposed inside the device housing, and the impact surface disposed at the bottom of the device housing; The hierarchical manifold distribution channel structure is connected to the cooling medium inlet pipe. The hierarchical manifold distribution channel structure is used to split the cooling medium and form a two-phase fluid. The two-phase fluid is sprayed onto the impact surface in a jet manner. One end of the ejector channel is connected to the hierarchical manifold distribution channel structure, and the other end of the ejector channel is connected to the return pipe structure. This is used to bypass the flow when steam is generated on the impact surface and the hierarchical manifold distribution channel structure is blocked by steam, so that the hierarchical manifold distribution channel structure is connected to the return pipe structure and the newly added cooling medium flows into the hierarchical manifold distribution channel structure. The return pipe structure is connected to the cooling medium outlet pipe. The return pipe structure is used to supply steam and cooling medium for return, and to allow the returned steam and returned cooling medium to flow out from the cooling medium outlet pipe.
2. The boiling heat exchanger with a manifold diversion channel and an ejector channel according to claim 1, characterized in that, The hierarchical manifold diversion channel structure includes: a multi-level biomimetic tree-shaped manifold diversion channel and an inlet nozzle; The multi-level biomimetic tree-shaped manifold distribution channel is connected to the cooling medium inlet pipe. The multi-level biomimetic tree-shaped manifold distribution channel is used to perform multi-level distribution of the cooling medium to form a two-phase fluid. The inlet nozzle is located at the bottom of the multi-level biomimetic tree-shaped manifold distribution channel. The inlet nozzle is connected to the bottom end of the ejector channel. The inlet nozzle is used to allow two-phase fluid to be sprayed onto the impact surface in a jet manner.
3. The boiling heat exchanger with a manifold diversion channel and an ejector channel according to claim 2, characterized in that, The multi-level biomimetic tree-shaped manifold diversion channel includes: First-level biomimetic tree-shaped manifold diversion channel, second-level biomimetic tree-shaped manifold diversion channel, third-level biomimetic tree-shaped manifold diversion channel; The top end of the first-level bionic tree-shaped manifold distribution channel is connected to the bottom end of the cooling medium inlet pipe, the bottom end of the first-level bionic tree-shaped manifold distribution channel is connected to the top end of the second-level bionic tree-shaped manifold distribution channel, the bottom end of the second-level bionic tree-shaped manifold distribution channel is connected to the top end of the third-level bionic tree-shaped manifold distribution channel, and the inlet nozzle is located at the bottom end of the third-level bionic tree-shaped manifold distribution channel. The number of the second-level bionic tree-shaped manifold diversion channels is a multiple of the number of the first-level bionic tree-shaped manifold diversion channels, and the number of the third-level bionic tree-shaped manifold diversion channels is a multiple of the number of the first-level bionic tree-shaped manifold diversion channels. The angle between the second-level bionic tree-shaped manifold diversion channel and the first-level bionic tree-shaped manifold diversion channel is in the range of [0°C, 180°C], and the angle between the third-level bionic tree-shaped manifold diversion channel and the second-level bionic tree-shaped manifold diversion channel is in the range of [0°C, 180°C].
4. The boiling heat exchanger with a manifold diversion channel and an ejector channel according to claim 3, characterized in that, The reflux pipe structure includes: an outlet nozzle, an outlet channel, and an outlet reflux channel; The outlet return channel is connected to the cooling medium outlet pipe, the outlet return channel is connected to the outlet channel, the outlet nozzle is located at the bottom end of the outlet channel, and the outlet nozzle is connected to the top end of the ejector channel. The outlet nozzle is used for steam recirculation, and the ejector channel is also used for cooling medium recirculation when the bypass is open. The recirculated steam and the recirculated cooling medium flow out sequentially from the outlet channel, the outlet recirculation channel and the cooling medium outlet pipe.
5. The boiling heat exchanger with a manifold diversion channel and an ejector channel according to claim 4, characterized in that, The bottom diameter of the ejector channel is larger than the top diameter of the ejector channel; The ejector channel is used to bypass and open when steam is generated on the impact surface and the inlet nozzle is blocked by steam, so that the inlet nozzle is connected to the outlet nozzle and the newly added cooling medium flows into the multi-level biomimetic tree-shaped manifold distribution channel. The angle between the ejector channel and the third-level biomimetic tree-shaped manifold diversion channel is (0°C, 90°C).
6. The boiling heat exchanger with a manifold diversion channel and an ejector channel according to claim 4, characterized in that, The inlet nozzles are arranged in an array, and the number of inlet nozzles is the same as the number of the third-level biomimetic tree-shaped manifold diversion channels; The outlet nozzles are arranged in an array, and the number of outlet nozzles is the same as the number of outlet channels; The outlet channel is located between the third-level bionic tree-shaped manifold distribution channels of adjacent rows, or the outlet channel is located between the third-level bionic tree-shaped manifold distribution channels of adjacent columns.
7. The boiling heat exchanger with a manifold diversion channel and an ejector channel according to claim 6, characterized in that, The diameter of the inlet nozzle ranges from [0.1, 10] mm, the lateral spacing between adjacent inlet nozzles ranges from [1, 30] mm, and the longitudinal spacing between adjacent inlet nozzles ranges from [1, 30] mm; the diameter of the outlet nozzle ranges from [0.1, 10] mm, the lateral spacing between adjacent outlet nozzles ranges from [1, 30] mm, and the longitudinal spacing between adjacent outlet nozzles ranges from [1, 30] mm; the spacing between the inlet nozzle and the outlet nozzle ranges from [0.5, 15] mm, and the spacing between the inlet nozzle and the outlet nozzle is characterized by the spacing between the third-level biomimetic tree-shaped manifold diversion channel and the outlet channel.
8. The boiling heat exchanger having a manifold diversion channel and an ejector channel according to any one of claims 4-7, characterized in that, An impact gap layer is provided above the impact surface. The impact gap layer is used to connect the inlet nozzle and the outlet nozzle. When the two-phase fluid is sprayed onto the impact surface in a jet manner, the two-phase fluid passes through the impact gap layer. The impact gap layer is used to regulate the flow direction of the two-phase liquid. When the impact surface is impacted by the two-phase fluid and boils, the impact gap layer is used to adjust the bubble size. A substrate is disposed above the impact surface, the substrate being used to receive heat conducted by the electronic device and conduct it to the impact surface.
9. The boiling heat exchanger with a manifold diversion channel and an ejector channel according to claim 8, characterized in that, The impact surface is a smooth surface, a non-smooth hydrophilic / hydrophobic microstructure surface, or a non-smooth metal mesh microstructure surface. The substrate is a ceramic substrate, a sapphire substrate, an indium tin oxide sapphire substrate, or an indium tin oxide glass substrate. The material of the impact gap layer is a porous metal fiber material, a foamed metal material, or a porous granular layer material.
10. The boiling heat exchanger having a manifold diversion channel and an ejector channel according to any one of claims 4-7, characterized in that, The material of the multi-level biomimetic tree-shaped manifold diversion channel is a metallic material, an inorganic non-metallic material, or an inorganic non-metallic composite material; The material of the outlet channel is a metallic material, an inorganic non-metallic material, or an inorganic non-metallic composite material.