Chip cooling device

Abstract

The invention relates to the technical field of vehicle chip manufacturing, in particular to a chip cooling device which structurally comprises a box body. The multiple waved plates are arranged in the box body, the multiple waved plates are arranged in the vertical direction in a layered mode, a water inlet flow channel or a water outlet flow channel is formed between every two adjacent layers of waved plates in a clamped mode, the water inlet flow channels and the water outlet flow channels are located at different height layers, and the water inlet flow channels communicate with the water outlet flow channels; the water inlet pipe is arranged at the end part of the box body, and the water inlet pipe is communicated with the water inlet runner; the water outlet pipe is arranged at the end part of the box body, and the water outlet pipe is communicated with the water outlet runner; and the cooling base station is arranged at the top of the wave plate located on the uppermost layer and used for placing a part to be cooled. The chip cooling device can solve the problem that a thin-wall structure of an existing cooling device is difficult to machine.

Description

Technical Field

[0001] This application relates to the field of vehicle chip manufacturing technology, and in particular to a chip cooling device. Background Technology

[0002] The water-cooled plate of the cabin navigation control unit is a device for cooling electronic components. It has a complex internal flow channel. In mass production, it is made using die casting. In the trial production stage, it is often machined separately by CNC milling, and then the top cover and the body are friction-welded together. However, because its flow channel has a thin-walled structure (wall thickness of only 2 mm), the processing quality is difficult to guarantee. The cooling plate is large in size and has very high requirements for equipment. It usually takes more than 48 hours to process one piece. If structural changes are made during the trial production stage, the processing program needs to be rewritten, which is time-consuming and expensive. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a chip cooling device to solve the problem that the thin-walled structure of existing cooling devices is difficult to process.

[0004] According to the present invention, a chip cooling device is provided, wherein the chip cooling device is manufactured using an additive manufacturing process. The chip cooling device includes: a housing; a plurality of corrugated plates disposed within the housing, the plurality of corrugated plates being arranged in layers in a vertical direction, with an inlet channel or an outlet channel sandwiched between adjacent layers of corrugated plates, the inlet channel and the outlet channel being located at different height layers, the inlet channel being connected to the outlet channel; an inlet pipe disposed at the end of the housing, the inlet pipe being connected to the inlet channel; an outlet pipe disposed at the end of the housing, the outlet pipe being connected to the outlet channel; and a cooling base disposed on top of the uppermost corrugated plate, for placing the component to be cooled.

[0005] Preferably, the plurality of wave plates includes: a first wave plate, wherein an exhaust port is provided at the crest of the first wave plate; a second wave plate, disposed below the first wave plate, wherein the crest of the second wave plate is connected to the trough of the first wave plate in a one-to-one correspondence; and a third wave plate, disposed below the second wave plate, wherein the crest of the third wave plate is connected to the trough of the second wave plate in a one-to-one correspondence.

[0006] Preferably, a plurality of water inlet channels are formed between the first wave plate and the second wave plate, and the plurality of water inlet channels are separated laterally by the troughs of the first wave plate and the crests of the second wave plate; a plurality of water outlet channels are formed between the second wave plate and the third wave plate, and the plurality of water outlet channels are separated laterally by the troughs of the second wave plate and the crests of the third wave plate.

[0007] Preferably, the inlet channel and the outlet channel extend along the length of the housing, the inlet pipe and the outlet pipe are disposed at the first end of the housing, and the inlet channel and the outlet channel are connected at the second end of the housing.

[0008] Preferably, the second wave plate has a plurality of connecting holes at the end near the second end of the housing. The connecting holes are waist-shaped holes. Each water inlet channel has a plurality of connecting holes. The plurality of connecting holes are spaced apart along the length of the water inlet channel. Each water inlet channel is connected to an adjacent water outlet channel through the connecting holes.

[0009] Preferably, the third wave plate is inclined, with the end of the third wave plate near the second end of the box being higher than the end of the third wave plate near the first end of the box, and the inclination angle of the third wave plate is 2°.

[0010] Preferably, the first end of the housing is provided with a mounting platform protruding into the interior of the housing, and the mounting platform is provided with a first manifold and a second manifold. The water inlet pipe is connected to a plurality of water inlet channels through the first manifold, and the water outlet pipe is connected to a plurality of water outlet channels through the second manifold.

[0011] Preferably, the water inlet pipe is located in the middle of the width direction of the first end of the tank, and the first manifold is provided with a plurality of pipe openings for communicating with the water inlet channel, the cross-sectional area of ​​the plurality of pipe openings gradually increasing in the direction away from the water inlet pipe; the water outlet pipe is located on both sides of the width direction of the first end of the tank, the height of the water outlet pipe is lower than the height of the water outlet channel, and the connection end of the second manifold and the water outlet pipe is lower than the connection end of the second manifold and the water outlet channel.

[0012] Preferably, the cooling base is a columnar or conical structure, the first wave plate penetrates the lower part of the cooling base, the bottom surface of the cooling base is connected to the top surface of the first wave plate, the contact area between the cooling base and the first wave plate is greater than or equal to the contact area between the cooling base and the part to be cooled, and multiple cooling bases are spaced apart on the first wave plate.

[0013] Preferably, the outer sides of the upper and lower covers of the box are provided with cross-shaped reinforcing ribs.

[0014] The chip cooling device of this invention comprises multiple corrugated plates arranged within a housing. These corrugated plates are arranged in vertical layers, with an inlet or outlet water channel formed between adjacent layers. The inlet and outlet water channels are located at different heights and are connected to the outlet water channel. An inlet pipe is located at the end of the housing and is connected to the inlet water channel. An outlet pipe is also located at the end of the housing and is connected to the outlet water channel. A cooling base is positioned on top of the uppermost corrugated plate and is used to place the component to be cooled. This arrangement facilitates the fabrication of the chip cooling device using additive manufacturing processes, eliminating the difficulties in milling thin-walled parts and removing the need for friction welding. Furthermore, the corrugated plate structure increases the contact area with the cooling base, thereby increasing cooling efficiency. This effectively solves the problem of the difficulty in processing thin-walled structures in existing cooling devices.

[0015] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a chip cooling device according to the present invention.

[0018] Figure 2 This is a cross-sectional view of the chip cooling device according to the present invention.

[0019] Figure 3 This is a schematic diagram of a portion of the chip cooling device according to the present invention.

[0020] Figure 4 This is a schematic diagram of another part of the chip cooling device according to the present invention.

[0021] Figure 5 This is a schematic diagram of another part of the chip cooling device according to the present invention.

[0022] Reference numerals in the attached drawings: 1-box body; 10-mounting platform; 101-first manifold section; 102-second manifold section; 2-corrugated plate; 21-first corrugated plate; 22-second corrugated plate; 23-third corrugated plate; 3-inlet pipe; 4-outlet pipe; 5-cooling base; 6-inlet channel; 7-outlet channel; 8-connecting hole. Detailed Implementation

[0023] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0024] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.

[0025] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.

[0026] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0027] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0028] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.

[0029] The terminology used herein is for the purpose of describing various examples only and is not intended to limit the examples. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0030] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0031] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.

[0032] This invention provides a chip cooling device, such as... Figures 1 to 5 As shown, the chip cooling device includes a housing 1, a corrugated plate 2, a water inlet pipe 3, a water outlet pipe 4, and a cooling base 5.

[0033] In the following description, reference will be made to Figures 1 to 5 The specific structure of the aforementioned components of the chip cooling device and their connection relationships are described in detail.

[0034] like Figures 1 to 5As shown, in this embodiment, the chip cooling device can be manufactured using additive manufacturing. Specifically, it can be made of aluminum alloy using SLM additive manufacturing. Multiple corrugated plates 2 can be arranged inside the housing 1, and these corrugated plates 2 are easily manufactured using additive manufacturing. The multiple corrugated plates 2 are arranged in layers vertically, with an inlet channel 6 or an outlet channel 7 sandwiched between adjacent layers. The inlet channel 6 and the outlet channel 7 are located at different heights. The staggered arrangement of the inlet channel 6 and the outlet channel 7 improves heat exchange efficiency and balances the cooling effect at different heights. The inlet channel 6 connects to the outlet channel 7, allowing coolant to flow between them. A water inlet pipe 3 can be located at the end of the housing 1, and it connects to the inlet channel 6. A water outlet pipe 4 can be located at the end of the housing 1, and it connects to the outlet channel 7. The cooling base 5 is positioned on top of the uppermost corrugated plate 2, allowing it to exchange heat with the coolant in the inlet channel 6. The cooling base 5 is used to hold the component to be cooled, which can be an electronic component (e.g., a chip). This arrangement makes the chip cooling device easier to manufacture using additive manufacturing processes, eliminating the difficulties of milling thin-walled parts and removing the need for friction welding. Furthermore, the structural design of the corrugated plate 2 increases the contact area with the cooling base 5, thereby increasing cooling efficiency.

[0035] Preferred, such as Figures 1 to 4 As shown, in this embodiment, the plurality of wave plates 2 may include a first wave plate 21, a second wave plate 22, and a third wave plate 23. A vent may be provided at the crest of the first wave plate 21. Multiple vents may be provided to discharge gas from the water inlet channel 6. The second wave plate 22 may be located below the first wave plate 21, with the crests of the second wave plate 22 corresponding to the troughs of the first wave plate 21, thus forming a water inlet channel 6 between the crests of the second wave plate 22 and the troughs of the first wave plate 21. The third wave plate 23 is located below the second wave plate 22, with the crests of the third wave plate 23 corresponding to the troughs of the second wave plate 22, thus forming a water outlet channel 7 between the crests of the third wave plate 23 and the troughs of the second wave plate 22.

[0036] Furthermore, preferably, such as Figures 1 to 4As shown, in this embodiment, the cross-sectional shapes of the inlet channel 6 and the outlet channel 7 can be approximately rhomboid. This arrangement ensures that the interior angles of the inlet channel 6 and the outlet channel 7 meet the requirement that no additional support structure is needed during additive manufacturing (i.e., the angle between any cross-section of the corrugated plate 2 and the horizontal plane is ≥45°). Preferably, the distance between adjacent crests of the first corrugated plate 21 can be 9 mm, and the height difference between the crests and troughs can be 10 mm. The waveforms of the second corrugated plate 22 and the third corrugated plate 23 can be the same as those of the first corrugated plate 21.

[0037] Preferred, such as Figures 1 to 4 As shown in the embodiment, since there are multiple crests and troughs on the corrugated plate 2, there are also multiple inlet channels 6 and outlet channels 7. Specifically, multiple inlet channels 6 can be sandwiched between the first corrugated plate 21 and the second corrugated plate 22, and the multiple inlet channels 6 are separated laterally (i.e., in the width direction of the shell) by the troughs of the first corrugated plate 21 and the crests of the second corrugated plate 22. Multiple outlet channels 7 can be sandwiched between the second corrugated plate 22 and the third corrugated plate 23, and the multiple outlet channels 7 are separated laterally by the troughs of the second corrugated plate 22 and the crests of the third corrugated plate 23.

[0038] Preferred, such as Figures 1 to 4 As shown, in this embodiment, the shape of the housing 1 can be approximately cuboid. The top and bottom of the housing 1 are respectively provided with an upper cover and a lower cover (not shown). The outer sides of the upper and lower covers of the housing 1 may also be provided with cross-shaped reinforcing ribs (not shown) to prevent printing deformation. The cross-shaped reinforcing ribs can be removed (e.g., sawed off) after the chip cooling device has cooled and annealed.

[0039] Further optimized, such as Figures 1 to 5 As shown, in this embodiment, the inlet channel 6 and the outlet channel 7 can extend along the length of the housing 1. The corrugated plate 2 is connected to both ends of the housing 1 along its length, so that the inlet channel 6 and the outlet channel 7 also extend to both ends of the housing 1 along its length. The inlet pipe 3 and the outlet pipe 4 can be located at the first end (e.g., Figure 2 (As shown on the right end), the inlet channel 6 and the outlet channel 7 can be located at the second end of the housing 1 (e.g., the right end). Figure 2 The left end (as shown) is connected.

[0040] Furthermore, preferably, such as Figure 2 and Figure 4As shown, in this embodiment, the end of the second wave plate 22 near the second end of the housing 1 may be provided with multiple connecting holes 8, allowing the inlet channel 6 and the outlet channel 7 to communicate through the connecting holes 8. The connecting holes 8 may be oblong holes (i.e., elongated holes). Preferably, the major axis of the oblong hole may be 6mm and the minor axis may be 4mm. Multiple connecting holes 8 may be provided within each inlet channel 6, and these holes may be spaced apart along the length of the inlet channel 6. Each inlet channel 6 is connected to an adjacent outlet channel 7 through the connecting holes 8, which are located on both sides of the bottom of each inlet channel 6. Specifically, three connecting holes 8 may be provided on each side of the bottom of each inlet channel 6.

[0041] Preferred, such as Figure 2 As shown, in this embodiment, the third wave plate 23 can also be arranged at an angle. Specifically, the end of the third wave plate 23 near the second end of the housing 1 (e.g., Figure 2 The left end shown can be higher than the end of the third wave plate 23 near the first end of the box 1 (as shown). Figure 2 (as shown at the right end), so that the coolant in the outlet channel 7 tends to flow towards the first end of the housing 1, so as to facilitate the drainage of the coolant. Further, preferably, the inclination angle of the third wave plate 23 can be 2°, that is, the angle between the extension of the third wave plate 23 and the length direction of the housing 1 is 2°.

[0042] In addition, preferred, such as Figure 1 , Figure 2 and Figure 5 As shown in the embodiment, the first end of the housing 1 may be provided with a mounting platform 10 protruding into the interior of the housing 1. The mounting platform 10 may be approximately cuboid in shape. A first manifold 101 and a second manifold 102 may be provided inside the mounting platform 10. The first manifold 101 is located above the second manifold 102, and the first manifold 101 and the second manifold 102 are not connected. The water inlet pipe 3 is connected to multiple water inlet channels 6 through the first manifold 101, and the water outlet pipe 4 is connected to multiple water outlet channels 7 through the second manifold 102.

[0043] Furthermore, preferably, such as Figure 1 , Figure 2 and Figure 5As shown, in this embodiment, there can be one water inlet pipe 3, which can be located in the middle of the width direction of the first end of the body. There can be nine water inlet channels 6, and the first manifold 101 is a nine-way manifold. The first manifold 101 is provided with multiple ports (in this embodiment, there can be nine) for communicating with the water inlet channels 6. The cross-sectional area of ​​the multiple ports gradually increases in the direction away from the water inlet pipe 3, that is, the cross-sectional area of ​​the nine ports of the first manifold 101 gradually increases from the center to both sides, to balance the flow resistance of each part of the cooling plate. Specifically, the cross-sectional shape of the ports of the water inlet channels 6 can be rhomboid. The major axis of the port located in the center can be 11 mm, and the minor axis can be 4 mm. The major axis of the ports located at both ends can be 17.5 mm, and the minor axis can be 7 mm.

[0044] Preferred, such as Figure 1 , Figure 2 and Figure 5 As shown, in this embodiment, there can be two water outlet pipes 4, which can be respectively arranged on both sides of the width direction of the first end of the housing 1. There can be ten water outlet channels 7, and the second manifold 102 can be a manifold divided into two sections. More preferably, the height of the water outlet pipes 4 can be lower than the height of the water outlet channels 7. Correspondingly, the connection end between the second manifold 102 and the water outlet pipes 4 can be lower than the connection end between the second manifold 102 and the water outlet channels 7, making it easier for the coolant in the second manifold 102 to be drained.

[0045] Preferred, such as Figures 1 to 4 As shown, in this embodiment, the cooling base 5 can be a cylindrical or conical structure, and its upper surface can be horizontal. The first corrugated plate 21 extends through the lower part of the cooling base 5, meaning the bottom surface of the cooling base 5 is attached to the upper surface of the first corrugated plate 21. This arrangement increases the heat exchange area, thereby further improving heat dissipation efficiency. The bottom surface of the cooling base 5 is connected to the top surface of the first corrugated plate 21, and the contact area between the cooling base 5 and the first corrugated plate 21 is greater than or equal to the contact area between the cooling base 5 and the part to be cooled. This ensures the cooling effect of the cooling base 5 on the part to be cooled. Multiple cooling bases 5 can be spaced apart on the first corrugated plate 21 to fully utilize each flow channel for heat exchange.

[0046] During use, the operator can place the component to be cooled on the upper surface of the cooling base 5 and introduce coolant into the inlet pipe 3 for heat exchange. The staggered arrangement of the inlet channel 6 and the outlet channel 7 improves heat exchange efficiency and balances the cooling effect at different heights. The corrugated structure of the corrugated plate 2 is easy to manufacture using additive manufacturing, thus avoiding the need for milling thin-walled components and eliminating the friction welding process. In addition, the structural design of the corrugated plate 2 increases the contact area with the cooling base 5, thereby effectively improving cooling efficiency and meeting the production and usage requirements of the chip cooling device.

[0047] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The scope of protection of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip cooling device, characterized in that, The chip cooling device is manufactured using an additive manufacturing process, and the chip cooling device includes: Box; Multiple corrugated plates are disposed within the housing, arranged in vertical layers. An inlet channel or outlet channel is formed between adjacent layers of corrugated plates. The inlet channel and outlet channel are located at different height levels, and the inlet channel is connected to the outlet channel. A water inlet pipe is provided at the end of the housing, and the water inlet pipe is connected to the water inlet channel; A water outlet pipe is disposed at the end of the housing, and the water outlet pipe is connected to the water outlet channel; and A cooling platform, located on top of the uppermost wave plate, is used to place the parts to be cooled.

2. The chip cooling device according to claim 1, characterized in that, The plurality of wave plates include: The first wave plate has an exhaust port at its crest. A second wave plate is positioned below the first wave plate, with the crests of the second wave plate corresponding one-to-one with the troughs of the first wave plate; and The third wave plate is positioned below the second wave plate, with the crests of the third wave plate corresponding to the troughs of the second wave plate.

3. The chip cooling device according to claim 2, characterized in that, A plurality of water inlet channels are formed between the first wave plate and the second wave plate, and the plurality of water inlet channels are separated laterally by the troughs of the first wave plate and the crests of the second wave plate. A plurality of water outlet channels are formed between the second wave plate and the third wave plate, and the plurality of water outlet channels are separated laterally by the troughs of the second wave plate and the crests of the third wave plate.

4. The chip cooling device according to claim 3, characterized in that, The inlet channel and the outlet channel extend along the length of the housing. The inlet pipe and the outlet pipe are located at the first end of the housing, and the inlet channel and the outlet channel are connected at the second end of the housing.

5. The chip cooling device according to claim 4, characterized in that, The second wave plate has multiple connecting holes at its end near the second end of the housing. The connecting holes are waist-shaped holes. Each water inlet channel has multiple connecting holes. The multiple connecting holes are spaced apart along the length of the water inlet channel. Each water inlet channel is connected to an adjacent water outlet channel through the connecting holes.

6. The chip cooling device according to claim 4, characterized in that, The third wave plate is inclined, with the end of the third wave plate near the second end of the box being higher than the end of the third wave plate near the first end of the box, and the inclination angle of the third wave plate is 2°.

7. The chip cooling device according to claim 4, characterized in that, The first end of the housing is provided with a mounting platform protruding into the interior of the housing. The mounting platform is provided with a first manifold and a second manifold. The water inlet pipe is connected to a plurality of water inlet channels through the first manifold, and the water outlet pipe is connected to a plurality of water outlet channels through the second manifold.

8. The chip cooling device according to claim 7, characterized in that, The water inlet pipe is located in the middle of the width direction of the first end of the box body. The first manifold is provided with a plurality of pipe openings for communicating with the water inlet channel. The cross-sectional area of ​​the plurality of pipe openings gradually increases in the direction away from the water inlet pipe. The water outlet pipes are located on both sides of the width direction of the first end of the tank. The height of the water outlet pipes is lower than the height of the water outlet channel. The connection end between the second manifold and the water outlet pipe is lower than the connection end between the second manifold and the water outlet channel.

9. The chip cooling device according to claim 2, characterized in that, The cooling base is a columnar or conical structure. The first wave plate penetrates the lower part of the cooling base. The bottom surface of the cooling base is connected to the top surface of the first wave plate. The contact area between the cooling base and the first wave plate is greater than or equal to the contact area between the cooling base and the part to be cooled. Multiple cooling bases are spaced apart on the first wave plate.

10. The chip cooling device according to claim 1, characterized in that, The outer sides of the upper and lower covers of the box are provided with cross-shaped reinforcing ribs.

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