Chip heat dissipation vapor chamber with novel efficient water return structure

Abstract

The invention discloses a chip heat dissipation vapor chamber with a novel efficient water return structure, and belongs to the technical field of heat dissipation equipment.The vapor chamber comprises a heated plate, a heat dissipation plate and a composite liquid absorption core, and a sunken groove used for making contact with a heat source is formed in the center of the heated plate; the heat dissipation plate is a flat-plate-shaped heat dissipation plate which is connected with the heated plate in a welding manner; the heated plate and the heat dissipation plate are oppositely arranged to jointly form a closed cavity, the cavity is filled with a phase change working medium, a first capillary structure layer is arranged on the heated plate, the first capillary structure is an in-plane gradient composite capillary structure, and the first capillary structure is composed of an elemental metal powder layer evenly sintered on the bottom face and the side wall of a center groove and a metal powder layer evenly sintered on the side wall of the center groove. According to the vapor chamber, the backflow speed of a heat dissipation liquid working medium can be increased, the long-distance water return capacity can be improved, the temperature uniformity of the vapor chamber can be improved, and a more reliable heat dissipation path and higher heat dissipation efficiency can be provided for an integrated chip with high heat productivity.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for microelectronic devices, and in particular to a chip heat dissipation vapor chamber with a novel high-efficiency water return structure. Background Technology

[0002] With the rapid development of electronic packaging technology, the integration and performance of electronic chips continue to improve, and their average surface heat flux density has exceeded 100 W / cm², showing a continuing upward trend. At the same time, chips generally suffer from the problem of "hot spots" where local heat is concentrated, which can easily lead to a sudden rise in local temperature and affect device stability.

[0003] A vapor chamber is a plate-shaped heat dissipation element designed based on the principle of heat pipes, utilizing a phase change process to achieve efficient heat conduction. It features a vacuum-sealed internal cavity filled with a liquid working medium such as water or ethylene glycol. The heat transfer process includes four stages: evaporation, vapor diffusion, condensation, and reflux. On the heat source side, the working medium absorbs heat and vaporizes. The vapor diffuses to the condensation end under pressure difference, releasing latent heat, thus achieving heat transfer from the evaporation zone 21 to the condensation zone 31. The condensed liquid working medium then flows back to the evaporation zone 21, completing the cycle. Unlike the one-dimensional heat transfer of a heat pipe, a vapor chamber can achieve heat diffusion on a two-dimensional surface, thus possessing superior temperature uniformity and heat transfer capabilities.

[0004] Existing vapor chambers generally incorporate capillary structures in the heat source region to promote condensation reflux. However, the reflux capacity of the working medium in areas far from the heat source remains insufficient, resulting in limited overall heat dissipation performance. Therefore, improving the working medium reflux capacity of vapor chambers in distant regions, accelerating the reflux rate, and optimizing their temperature uniformity and heat exchange efficiency are technical problems that urgently need to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a chip heat dissipation vapor chamber with a novel and efficient water return structure, which can improve the return speed of the heat dissipation liquid working medium, improve the long-distance water return capability, improve the temperature uniformity of the vapor chamber, and provide a more reliable heat dissipation path and higher heat dissipation efficiency for integrated chips with high heat generation.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A novel high-efficiency water return structure for chip heat dissipation includes a heat absorption part and a heat dissipation part. The heat absorption part is a heat-receiving plate with grooves on its inner surface, and the heat dissipation part is a flat heat dissipation plate welded to the heat-receiving plate. The heat dissipation plate and the heat-receiving plate are positioned opposite each other, forming a vacuum cavity filled with a working medium. The heat-receiving plate has a first capillary structure layer, which is an in-plane gradient composite capillary structure composed of a layer of elemental metal powder uniformly sintered on the bottom and sidewalls of the central groove, and a wire mesh layer laid on the heat-receiving plate outside the central groove.

[0007] Preferably, the copper powder used in the elemental metal powder layer on the bottom surface and sidewalls of the groove has a mesh size of 0-00; the wire mesh layer laid in the area outside the groove of the heating plate is a 00-mesh copper wire mesh.

[0008] Preferably, the inner side of the flat heat sink is provided with a second capillary structure layer. The second capillary structure layer is a pure wire mesh capillary structure layer, specifically a double-layer composite structure composed of 0-mesh wire mesh and 00-mesh wire mesh, wherein the 0-mesh fine mesh layer is arranged in close contact with the inner surface of the flat heat sink.

[0009] Preferably, a strip-shaped capillary structure is further provided between the first capillary layer and the second capillary layer. A local area of ​​the strip-shaped capillary structure is compositely connected with the first capillary layer and the second capillary layer.

[0010] Preferably, the strip-shaped capillary structure is in at least partial contact with the capillary structures on the opposite inner surfaces of the cavity on both sides of the heat spreader along its thickness direction, and is integrally connected with the first and second capillary structure layers. During operation, the strip-shaped capillary structure, through direct contact with the condensation zone, can quickly absorb the condensed liquid working medium and rapidly guide it back to the surface of the evaporation zone using its own capillary force. Because the strip-shaped capillary structure extends from the heating source area to the edge of the cavity, it significantly enhances the water return capacity away from the heating source area, thereby improving the temperature uniformity and overall heat dissipation efficiency of the heat spreader.

[0011] Preferably, one end of the strip-shaped capillary structure is located on the bottom surface of the groove serving as the heating source area, and the other end extends along the groove wall in a direction away from the heating source area; Preferably, the strip-shaped capillary structure is a straight strip-shaped structure.

[0012] Preferably, a gap is reserved between the end of the strip-shaped capillary structure away from the heating source area and the side of the cavity.

[0013] Preferably, the copper powder used in the strip-shaped capillary structure has a mesh size of 0-00 mesh.

[0014] Preferably, a support column is provided between the heated plate and the heat dissipation plate, and the support column is covered with a copper powder capillary structure. This structure not only shortens the return path of the working medium and accelerates the return speed, thereby further improving the heat dissipation performance, but also enhances the mechanical strength of the heat spreader, effectively preventing indentation or cracking caused by excessive temperature or external pressure, ensuring the long-term stability and heat dissipation uniformity of the heat spreader, and reducing the overall thermal resistance.

[0015] Preferably, the layout of the support columns and their outer copper powder capillary structures is optimized by zoning design to synergistically improve the overall performance of the heat spreader. Specifically, in the grooved area of ​​the heat-receiving plate, i.e., the area corresponding to the heating source, the support columns are densely arranged, and each support column is wrapped with a copper powder capillary structure on its outer side to assist the rapid return of condensate, thereby enhancing the liquid replenishment capacity and preventing local drying. In the non-grooved area around the heat-receiving plate, the support columns are relatively sparsely distributed, and only some columns are equipped with copper powder capillary structures. This design ensures smooth diffusion of the gaseous working medium while maintaining the overall structural strength.

[0016] Preferably, both the heating plate and the heat dissipation plate are made of oxygen-free copper material.

[0017] Preferably, the working medium is deionized water.

[0018] Compared with the prior art, the heat spreader of the present invention adopts a composite liquid-absorbing core structure with a layer of single metal powder uniformly laid on the bottom surface and sidewalls of the groove on the inner surface of the heat-receiving plate, combined with a wire mesh layer laid on the heat-receiving plate and located in the bottom area outside the groove, multiple strip capillary structures, and pure wire mesh capillary structures on the flat heat dissipation plate. This allows the vapor of the working medium evaporated to the inner surface of the heat dissipation plate to be quickly adsorbed by the capillary structure after condensation, thereby achieving the effect of high-speed circulation and rapid heat conduction.

[0019] Furthermore, when a support column and its peripheral capillary structure are integrally connected to the capillary layer and connected to the heat sink in a vacuum cavity, the reflux effect of the vaporized working medium after condensation is more significant. Moreover, after the working medium stored in the capillary structure of the heated plate evaporates, the liquid working medium stored in the peripheral capillary structure of the support column can be promptly replenished to the capillary layer of the heated plate. Additionally, due to the role of the support column, the heat spreader of this invention will not experience indentation or cracking deformation due to temperature variations or applied pressure. Furthermore, regardless of whether the heat spreader of this invention is horizontally upright, horizontally inverted, or vertically positioned, it has little impact on the reflux direction and speed of the condensed working medium, thereby effectively improving its operational stability and reliability. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0021] Figure 1 This is a schematic diagram illustrating the working principle of the heat spreader of the present invention.

[0022] Figure 2 This is an exploded view of the heat spreader structure of the present invention.

[0023] Figure 3 for Figure 2 A schematic diagram showing the specific distribution of the support column 5 and the outer copper powder capillary structure 51; The attached figures are labeled as follows: 1-Heating source area, 2-Heating plate, 21-Evaporation zone, 22-First capillary layer, 3-Heat dissipation plate, 31-Condensation zone, 32-Second capillary layer, 4-Strip-shaped capillary structure, 5-Support column, 51-Capillary structure around the support column, 6-Groove, 7-Vacuum cavity, 8-Working medium, 81-Vapor working medium, 82-Droplet-shaped working medium, 9-Chip, 91-Heat source, 92-Liquid cooling plate, 10-Injection tube Detailed Implementation To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to its embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the scope of protection of the invention.

[0024] In this invention, the terms "first" and "second" do not represent a specific quantity or order, but are merely used to distinguish names.

[0025] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram illustrating the working principle of the heat spreader of the present invention; Figure 2 This is an exploded view of the heat spreader structure of the present invention.

[0026] This invention provides a chip heat dissipation vapor chamber with a novel high-efficiency water return structure. The vapor chamber includes a heating plate 2, a heat dissipation plate 3, and a composite liquid-absorbing core. The heating plate 2 has a recessed groove 6 in its central region specifically for direct contact with the chip 9 inside the module. The heat dissipation plate 3 is a flat plate that is sealed and welded to the heating plate 2. The heating plate 2 and the heat dissipation plate 3 are arranged opposite each other, together forming a sealed vacuum cavity 7, which is filled with an appropriate amount of phase change working medium 8.

[0027] In use, the bottom outer surface of the recessed groove 6 on the outer side of the heated plate 2 is directly attached to the chip 9 inside the module of the electronic component, while the outer surface of the heat sink 3 is in contact with external heat dissipation devices such as the liquid cooling plate 92.

[0028] The heating plate 2 and the heat dissipation plate 3 are made of a thermally conductive metal material, such as copper or aluminum. The heating plate 2 and the heat dissipation plate 3 can be made of the same metal or a combination of different metals. Preferably, the heating plate 2 and the heat dissipation plate 3 are made of a thin plate of oxygen-free copper, with a thickness ranging from 0.2mm to 1.6mm, preferably 0.5mm. The heating plate 2 and the heat dissipation plate 3 are square, but can also be other shapes. Their materials and shapes are not limited to those listed above. The heating plate 2 and the heat dissipation plate 3 can be designed as circular, square, or rectangular, etc., according to specific processing technology and packaging requirements, to stably maintain the thermodynamic cycle of the phase change working medium.

[0029] The inner surface of the heat sink 3, i.e., the condensation zone 31, is a smooth flat plate. Its outer edge is welded to the edge of the heat receiving plate 2 to form an internal cavity. This cavity is evacuated and sealed to form a high-vacuum inner cavity 7, into which deionized water is injected as the working medium 8. The working medium 8 absorbs heat and undergoes a phase change at the recessed groove 6, evaporating into a vapor-like working medium 81. After flowing into the low-pressure area and contacting the heat sink 3, it releases heat and condenses into droplet-like working medium 81. Through the capillary force of the wick, it flows back to the heat receiving plate 2, thus forming a complete gas-liquid two-phase heat transfer cycle. The working medium 8 of this invention is not limited to deionized water; other phase change working media 8 that can meet the heat dissipation requirements of high heat flux density electronic chips can also be used.

[0030] Preferably, the injection amount of the working medium 8 is 70%-100% of the total volume of the capillary structure of the heat spreader. This preferred filling rate range ensures that the working medium 8 in the chamber is in the optimal evaporation-condensation-reflux working state, effectively avoiding the boiling space limitation and reduced evaporation efficiency caused by excessive filling amount, or the local drying and intermittent heat absorption phenomenon caused by insufficient filling amount.

[0031] The vacuum level in the vacuum cavity 7 is 10. -2 Pascal-10 -5 Pascal, preferably with a vacuum degree of 10. -3 Pascal, thus satisfying the vacuum conditions required for the heating and evaporation of the working medium 8, while saving the time, financial resources and electricity spent on pumping the vacuum to a high vacuum state.

[0032] A plurality of cylindrical support columns 5 are provided between the heating plate 2 and the heat dissipation plate 3, and the outer peripheral surface of the support columns 5 is covered with copper powder capillary structures 51. Preferably, the capillary structures 51 on the outer peripheral surface of the support columns 5 are copper powder with a mesh size of 60-100 mesh. The top of the support column 5 is in contact with the inner surface of the heat dissipation plate 3. The copper powder capillary structures 51 on the outer surface of the support column 5 can not only quickly adsorb the droplet-shaped working medium 81 after condensation in the condensation zone 31, but also shorten the return path of the working medium 8 and accelerate the return speed, thereby further improving the heat dissipation performance. Moreover, after the working medium 8 stored in the first capillary structure 21 of the heating plate 2 evaporates, the liquid working medium 8 stored in the support column 5 can be replenished to the heating plate 2 in a timely manner. In addition, the support column 5 significantly enhances the overall compressive and bending mechanical strength of the heat spreader, effectively preventing the cavity from deforming, sinking or cracking under high temperature and high pressure or external stress. This ensures low contact thermal resistance between the heat-receiving plate 2 and the chip inside the module, and between the heat sink and the external liquid cooling plate 92, avoiding increased thermal resistance due to poor contact and ensuring the structural stability and temperature uniformity of long-term operation.

[0033] Preferably, the layout of the support columns 5 and the copper powder capillary structure 51 on their outer sides is optimized by a zoned design to synergistically improve the overall performance of the heat spreader. Specifically, in the groove 6 area of ​​the heat-receiving plate 2, i.e., the heating source area 1, the support columns 5 are densely arranged, and each support column 5 is wrapped with a copper powder capillary structure 51 on its outer side to assist the rapid return of condensate, thereby enhancing the liquid replenishment capacity and preventing local drying. In the non-groove 6 area around the heat-receiving plate 2, the support columns 5 are relatively sparsely distributed, and only some columns are equipped with copper powder capillary structures 51. This design effectively reduces the steam flow resistance while maintaining the overall structural strength, ensuring the smooth diffusion of the vapor working medium 81.

[0034] Specifically, the groove 6 area of ​​the heating plate 2 is equipped with 13 solid support columns 5, each 4.6 mm high, all covered with copper powder capillary structures 51 with a mesh size of 60-100 and a thickness of 1.25 mm. The surrounding area is equipped with 78 solid support columns 5, each 1.5 mm high, some of which are covered with the same copper powder capillary structures 51. This arrangement, through differentiated layout in different zones, not only enhances the liquid replenishment capability, ensuring the rapid liquid replenishment needs of the heating source area 51, but also optimizes the steam flow path, thereby significantly improving the overall heat dissipation efficiency and temperature uniformity of the heat spreader.

[0035] The inner surface of the heating plate 2 is provided with a first capillary layer 22, and the inner surface of the heat dissipation plate 3 is provided with a second capillary layer 32. Eight strip-shaped capillary structures 4 are sandwiched between the first capillary layer 22 and the second capillary layer 32. One end of each strip-shaped capillary structure 4 starts from the groove 6, i.e., the heating source region 1, and the other end extends away from the heating source 1. In the thickness direction of the heat spreader, its upper and lower sides are at least partially in contact with the first capillary layer 22 and the second capillary layer 32 on the two inner surfaces of the cavity, respectively.

[0036] The aforementioned first capillary layer 22, together with the strip-shaped capillary structure 4, the copper powder capillary structure 51 covering the outer periphery of the support column 5, and the second capillary structure 32, constitute a composite liquid-absorbing core. This composite design provides a rapid recovery channel for the droplet-shaped working medium 82 on the surface of the heat sink 3, allowing it to quickly flow back to the heating source region 1 along the strip-shaped capillary structure 4 and the copper powder capillary structure 51 around the support column 5 with extremely low flow resistance. During operation, after the vaporized working medium 81 condenses and releases heat on the heat sink 3, the strip-shaped capillary structure 4 and the copper powder capillary structure 51 around the support column 5 utilize their contact surface with the surface of the condensation zone 31 and their own capillary force to rapidly guide the liquid working medium 8 back. Since the strip-shaped capillary structure 4 also extends from 1 towards the edge of the cavity, it greatly enhances the water return capacity of the far-end region, thereby improving the temperature uniformity and overall heat dissipation efficiency of the heat spreader.

[0037] It should be noted that the aforementioned composite absorbent core refers to a capillary structure formed by stacking four capillary structures together. Specifically, it can be that separate capillary structures are processed together by overlapping and sintering, or that the four capillary structures are processed into an integrated structure.

[0038] It should be noted that the first capillary structure 22 and the second capillary structure 32 mentioned above can be designed as grooves, meshes, or metal powder sintering, etc.; the capillary structure 51 on the outer periphery of the strip capillary structure 4 and the support column 5 can be designed as a mesh capillary structure or a metal powder sintering structure with a higher mesh count, etc.

[0039] Preferably, the first capillary layer 22 is an in-plane gradient composite capillary structure, which is composed of a layer of elemental metal powder uniformly sintered on the bottom surface and sidewalls of the recessed groove 6 at the center, and a wire mesh layer laid on the heating plate 2 outside the groove 6. Specifically, the elemental metal powder layer on the bottom surface and sidewalls of the groove 6 is made of 180-200 mesh fine copper powder sintered, with a thickness of 0.4 mm; the wire mesh layer laid in the remaining area of ​​the heating plate 2 is four layers of 100 mesh coarse-pore copper wire mesh.

[0040] This composite structure combines the high capillary force of copper powder with the high permeability of wire mesh: the central sunken groove 6 region uses fine copper powder sintered together, resulting in a small effective capillary radius that provides extremely high capillary force, effectively overcoming flow resistance and suppressing gas-liquid backflow under high heat flux; simultaneously, the dense sintered layer provides abundant vaporization nuclei and solid-liquid contact area, enhancing boiling heat transfer performance. Meanwhile, the area surrounding the groove 6 uses coarse wire mesh with high porosity and permeability, reducing the flow resistance of the working medium 8 during reflux. The synergistic effect of these two components significantly improves the overall capillary performance of the wicking core.

[0041] Preferably, the second capillary layer 32 is a pure wire mesh capillary layer, specifically a double-layer composite structure composed of a single layer of 180-mesh wire mesh and a single layer of 100-mesh copper wire mesh, wherein the 180-mesh fine mesh layer is arranged in close contact with the inner surface of the flat heat sink 3 to optimize the adsorption and reflux of the droplet-shaped working medium 82.

[0042] The heating source region 1 is located at the center of the heating plate 2, and eight strip-shaped capillary structures 4 are arranged side by side along the circumference of the central heating source region 1. A gap is reserved between the end of each strip-shaped capillary structure 4 away from the heating source region 1 and the side wall of the cavity. This arrangement avoids a large area of ​​the cavity 7 being occupied by the strip-shaped capillary structures 4, thus connecting the various cavities separated by the strip-shaped capillary structures 4 into a unified whole through the gaps, ensuring an effective gas flow channel, and further facilitating the flow of the vapor-like working medium 81 within the inner cavity 7, thereby maximizing the performance of the heat spreader.

[0043] The strip-shaped capillary structure 4 in this invention can be designed as a wire mesh capillary structure or a metal powder sintering structure, or it can be designed as a combination of various different capillary structures. Preferably, the strip-shaped capillary structure 4 is a copper powder sintering structure, and the copper powder used has a mesh size of 60-100 mesh, with a single strip dimension of 2mm width, 0.75mm height, and 24mm length.

[0044] Preferably, the strip-shaped capillary structure 4 extends in a straight line from the heating source region 1 towards the edge (e.g., Figure 3 (As shown). The strip-shaped capillary structure 4 can be designed in various shapes. Specifically, the strip-shaped capillary structure 4 can extend along a straight line, a broken line, or a curve, that is, it can be a straight strip structure or a curved strip structure. Preferably, the straight strip structure creates the shortest fluid path for the return flow of the condensed droplet-shaped working medium 82 to the evaporation zone 21. Combined with the high permeability characteristics of 60-100 mesh coarse copper powder, the straight channel can minimize the frictional resistance and pressure drop of the working medium 8 along the path, minimizing kinetic energy loss. Compared with the curved channel, the straight strip structure can increase the return flow rate of the condensed working medium 8.

[0045] Preferably, at each end of the heating source region 1, the strip-shaped capillary structure 4 has two identical structures arranged side by side. This arrangement allows for the arrangement of more capillary return channels, thereby further improving the water return capacity of each region within the cavity 7, especially at the far end, and improving the overall temperature uniformity of the heat spreader.

[0046] It should be noted that the heating source region 1 of the heat spreader provided by the present invention can be located at the center of the heat receiving plate 2 or at a certain distance offset from the center. The number of strip-shaped capillary structures 4 can be one or more. When multiple strip-shaped capillary structures 4 are provided, they can be arranged side by side or radially. Preferably, the heating source region 1 is located at the center of the heat receiving plate 2, and eight strip-shaped capillary structures 4 are arranged side by side along the circumference of the heating source region 1.

[0047] In practical applications of products, the placement and orientation of the heat spreader must be compatible with the setting of electronic components. That is, the heat spreader may be horizontally upside down, horizontally upright, or vertically set. Therefore, the heat conduction and heat dissipation efficiency of the heat spreader cannot change with its placement orientation, that is, the difference in total thermal resistance cannot be too large.

[0048] The heat spreader of the present invention employs a first capillary structure 22, which consists of a layer of single metal powder uniformly laid on the bottom and sidewalls of the groove 6 and a wire mesh layer laid in the bottom area outside the groove 6, combined with multiple strip capillary structures 4 and copper powder capillary structures 51 on the outer periphery of the support column 5, and a second capillary structure 32 of the heat dissipation plate 3, to form a composite capillary liquid absorption core.

[0049] Regardless of the placement of the heat spreader, the condensed droplet-shaped working medium 82 is instantly adsorbed by the second capillary structure 32. Under the strong capillary force of the first capillary structure 22, it flows at high speed towards the evaporation zone 21 along the shortest path, i.e., the outer periphery capillary structure 51 of the support column 5 or the strip capillary structure 4. This shortens the return path of the working medium 8, accelerates its return speed, and improves heat dissipation efficiency. At the same time, the liquid working medium 8 stored inside the outer periphery capillary structure 51 or the strip capillary structure 4 of the support column 5 can be used as a reserve to replenish the central heating source area 1 of the heat-receiving plate 2 at any time.

[0050] This composite capillary structure endows the liquid working medium 8 with extremely strong directional guidance, completely eliminating the stagnation of the liquid working medium 8 in the non-evaporation zone, and comprehensively improving the working reliability and heat transfer efficiency of the heat spreader under complex working conditions. Therefore, regardless of whether the heat spreader of the present invention is set horizontally upright, horizontally inverted, or vertically, it has little impact on the return velocity of the working medium 8. The condensed droplet-shaped working medium 82 can be returned to the evaporation zone 21 in a timely manner, effectively improving the working stability and reliability of the heat spreader.

[0051] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A chip heat dissipation vapor chamber with a novel high-efficiency water return structure, comprising a heat absorption portion and a heat dissipation portion, characterized in that, The heat-absorbing part is a heat-receiving plate (2) with a groove (6) on its inner surface, and the heat-dissipating part is a flat heat-dissipating plate (3) welded to the heat-receiving plate (2); the heat-dissipating plate (3) and the heat-receiving plate (2) are arranged opposite each other to form a vacuum cavity (7), and the working medium (8) is injected into the vacuum cavity (7). The heating plate (2) is provided with a first capillary structure layer (22), which specifically includes: a single metal powder layer uniformly laid on the bottom surface and side wall of the groove (6), and a wire mesh layer laid on the heating plate (2) and located outside the groove (6).

2. The chip heat dissipation vapor chamber with a novel high-efficiency water return structure according to claim 1, characterized in that, The copper powder used in the single metal powder layer on the bottom surface of the groove (6) has a mesh size of 180-200; the wire mesh layer laid in the area outside the groove (6) of the heating plate (2) is a 100-mesh copper wire mesh.

3. The chip heat dissipation vapor chamber with a novel high-efficiency water return structure according to claim 2, characterized in that, The heat sink (3) has a second capillary structure layer (32) on its inner side. The second capillary structure layer (32) is a pure wire mesh capillary structure layer, specifically a double-layer composite structure composed of 180 mesh wire mesh and 100 mesh wire mesh, wherein the 180 mesh wire mesh is arranged close to the inner surface of the heat sink (3).

4. The chip heat dissipation vapor chamber with a novel high-efficiency water return structure according to claim 3, characterized in that, A strip-shaped capillary structure (4) is further provided between the first capillary layer (22) and the second capillary layer (32), and a local area of ​​the strip-shaped capillary structure (4) is compositely connected with the first capillary layer (22) and the second capillary layer (32).

5. The chip heat dissipation vapor chamber with a novel high-efficiency water return structure according to claim 4, characterized in that, The strip-shaped capillary structure (4) is in at least partial contact with the first capillary structure layer (22) and the second capillary structure layer (32) on the opposite inner surfaces of the vacuum cavity (7) on both sides of the heat spreader thickness direction, and is integrated with the first capillary structure layer (22) and the second capillary structure layer (32).

6. The chip heat dissipation vapor chamber with a novel high-efficiency water return structure according to claim 4, characterized in that, One end of the strip-shaped capillary structure (4) is located on the bottom surface of the groove (6) which serves as the heating source region (1), and the other end extends along the wall of the groove (6) in a direction away from the heating source region (1).

7. The chip heat dissipation vapor chamber with a novel high-efficiency water return structure according to claim 6, characterized in that, The strip-shaped capillary structure (4) is a straight strip structure, and a gap is reserved between the end of the strip-shaped capillary structure (4) away from the heating source region (1) and the side of the vacuum cavity (7).

8. The chip heat dissipation vapor chamber with a novel high-efficiency water return structure according to claim 4, characterized in that, The copper powder used in the strip-shaped capillary structure (4) has a mesh size of 60-100.

9. The chip heat dissipation vapor chamber with a novel high-efficiency water return structure according to claim 1, characterized in that, A support column (5) is provided between the heat receiving plate (2) and the heat dissipation plate (3), and the support column (5) is covered with a copper powder capillary structure (51).

10. The chip heat dissipation vapor chamber with a novel high-efficiency water return structure according to claim 1, characterized in that, Both the heating plate (2) and the heat dissipation plate (3) are made of oxygen-free copper material, and the working medium (8) is deionized water.

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