A clamping platform for semiconductor chip stack packaging

Abstract

The application discloses a clamping platform for semiconductor chip stack packaging and particularly relates to the technical field of semiconductor chip processing. The clamping platform comprises a sleeve body, a mounting body, multiple sets of clamping mechanisms and a bidirectional imaging assembly. The mounting body is rotationally arranged on the sleeve body. The multiple sets of clamping mechanisms are distributed along the circumference of the mounting body. Each set of clamping mechanisms comprises clamping blocks that can synchronously move towards or away from each other and form a square mounting area. The bidirectional imaging assembly is arranged on the clamping blocks. The clamping blocks are integrated with active compensation clamping assemblies. The active compensation clamping assemblies comprise pressure control cavities formed in the clamping blocks, clamping pairs arranged on the clamping blocks and multiple compensation blocks slidingly connected to the clamping pairs. The active compensation clamping assemblies further comprise sensor modules. By integrating a set of multi-point and multi-degree-of-freedom active compensation clamping assemblies in the clamping blocks of the clamping mechanisms and combining with the omnidirectional visual feedback provided by the bidirectional imaging assembly, a high-precision vibration suppression and position compensation system is constructed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip processing technology, specifically to a clamping platform for semiconductor chip stacking and packaging. Background Technology

[0002] Gold wire bonding is a critical step in chip packaging, connecting pads on the chip body to external pins using extremely fine gold wires to achieve electrical interconnection. Current technology typically uses an ultrasonic wire bonder to perform gold wire bonding. During the bonding process, after the second solder joint is formed, the gold wire is clamped and broken. At the moment the gold wire breaks, a momentary, minute reaction force is generated on the chip. Although this reaction force is small, because the chip itself is extremely precise and thin, even a slight misalignment can affect subsequent gold wire bonding, ultimately leading to the failure of the entire chip bonding process.

[0003] Furthermore, existing wire bonding machines typically employ a sequential operation method when processing such multilayer chips. For example, all gold wires on one side of the chip are soldered first, then the chip is flipped 180 degrees by a flipping mechanism before soldering the other side. This method has significant drawbacks: firstly, it is inefficient, as flipping and repositioning require additional time; secondly, the solder joints and gold wires on the side that are soldered first may be affected by heat, mechanical vibration, or stress during the subsequent soldering of the other side, posing a reliability risk; and thirdly, the flipping process itself may introduce alignment errors.

[0004] To address the aforementioned issues, the existing Chinese invention patent document, with publication number "CN114566456A" and titled "A Packaging Device for Multilayer Stacked Memory Chips," proposes the use of two sets of soldering mechanisms symmetrically distributed about the chip. The two sets of soldering mechanisms operate synchronously, performing gold wire bonding on the upper and lower surfaces of the chip respectively. Furthermore, the soldering actions (especially the gold wire breaking action) of the two sets of mechanisms are in opposite directions. When the upper and lower sets of solder wires break the gold wires simultaneously, the resulting reaction forces are equal in magnitude and opposite in direction, symmetrical about the chip center, thus canceling each other out. Theoretically, the chip will not be affected by the net reaction force, improving the soldering stability and enabling simultaneous soldering on both sides.

[0005] However, this solution still has shortcomings: its core idea is to passively cancel out vibrations through the symmetry of forces, but it lacks the ability to actively respond to the complex and diverse vibration sources in the actual production environment (such as vibrations from the equipment's own motors, environmentally transmitted vibrations, welding impacts, etc.). Its clamping mechanism is a rigid clamp, which does not have the ability to sense vibrations or chip offsets in real time, and it cannot perform active and flexible compensation adjustments. Once there is a slight deviation in the initial clamping due to asymmetrical external forces, clamp wear, or workpiece tolerances, or if the cancellation is incomplete, the chip may still have a slight displacement that accumulates, affecting the yield of ultra-high precision packaging. To address these issues, we propose a clamping platform for semiconductor chip stacking packaging. Summary of the Invention

[0006] The purpose of this invention is to provide a clamping platform for semiconductor chip stacking and packaging, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a clamping platform for semiconductor chip stacking and packaging, including a frame body, a mounting body, multiple clamping mechanisms, and a bidirectional imaging component;

[0008] The mounting body is rotatably mounted on the frame body;

[0009] Multiple sets of clamping mechanisms are distributed at intervals along the circumference of the mounting body. Each set of clamping mechanisms includes clamping blocks that can move synchronously towards or away from each other and form a square mounting area for clamping semiconductor chips.

[0010] The bidirectional imaging component is mounted on the clamping block and is used to image the semiconductor chip, the semiconductor chip and the clamping block, as well as the mounting body and the clamping block located at the working station.

[0011] The clamping block is integrated with an active compensation clamping component;

[0012] The active compensation clamping assembly includes a pressure control cavity formed inside the clamping block, a clamping pair disposed on the clamping block and used to block the pressure control cavity, and a plurality of compensation blocks slidably connected to the clamping pair.

[0013] The pressure control chamber is provided with a pressure control hole, which is connected to an external pressure control system; the active compensation clamping assembly also includes a sensor module for monitoring the displacement of the compensation block and the pressure in the pressure control chamber.

[0014] Preferably, the clamping block has a clamping surface and a mating surface that are perpendicular to each other, as well as a toothed surface adjacent to the clamping surface and the mating surface;

[0015] A guide block is installed in the middle of the bonding surface. The guide block is slidably connected in the adjacent clamping pair, and the adjacent clamping surface is in surface contact with the bonding surface.

[0016] A sealing gasket is provided between the clamping surface and the clamping pair.

[0017] Preferably, the clamping mechanism further includes a linear guide rail mounted in the mounting body, a slider slidably connected to the linear guide rail, and a first drive unit disposed in the mounting body. The first drive unit is connected to the clamping blocks for driving a pair of clamping blocks to move synchronously. The slider is mounted on the bottom of the clamping blocks.

[0018] Preferably, the first drive unit includes a motor, a worm gear connected to the output shaft of the motor, a worm wheel meshing with the worm, a transmission shaft coaxially and fixedly connected to the worm wheel, a gear 2 meshing with a toothed surface, and an internal gear ring meshing with all gear 2.

[0019] One end of the drive shaft is fixedly connected to one of the gears.

[0020] The internal gear ring is rotatably connected to the mounting body, and the second gear is connected to the inside of the mounting body via a shaft pin.

[0021] Preferably, the clamping pair has a sliding cavity corresponding to the compensation block, the compensation block is slidably connected in the sliding cavity, and the contact surface between the compensation block and the sliding cavity is provided with a sealing plug.

[0022] Preferably, a second motor is mounted on the top of the mounting body, and a transmission assembly is provided inside the mounting body;

[0023] The transmission assembly includes an external gear ring fixed to the mounting body and a gear connected to the output shaft of the second motor, wherein the gear meshes with the external gear ring.

[0024] Preferably, the pressure control chamber is a closed space formed by the rear part of the compensation block in the sliding cavity and the end wall of the sliding cavity;

[0025] The pressure control hole penetrates the wall of the clamping block and communicates with the pressure control cavity; the sensor module includes a pressure sensor disposed in the pressure control cavity, and a displacement sensor disposed in the pressure control cavity for compensating for the displacement of the block.

[0026] Preferably, the bidirectional imaging assembly includes at least one internal imaging unit and at least one external imaging unit; the internal imaging unit is used to image the upper surface of the semiconductor chip held by the clamping mechanism and the space between the semiconductor chip and the clamping block; the external imaging unit is used to image the space between the clamping block and the mounting body.

[0027] Preferably, the platform further includes a control system, which is electrically connected to the sensor module, the bidirectional imaging component, the first drive unit, the second motor, and the pressure control system connected to the pressure control port.

[0028] The control system is configured to: receive monitoring data from the sensor module and image data from the bidirectional imaging component, analyze the positional deviation of the semiconductor chip and the vibration state of the clamping block positional deviation, and generate control commands to adjust the pressure in the pressure control chamber or control the first drive unit or motor two to make compensatory adjustments.

[0029] Preferably, the control system is further configured to dynamically track and compensate for the location of the solder joints during the chip wire bonding process, based on a preset wire bonding path and real-time images fed back by the bidirectional imaging component.

[0030] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0031] 1. This semiconductor chip stacking and packaging clamping platform integrates a multi-point, multi-degree-of-freedom active compensation clamping component within the clamping blocks of the clamping mechanism. Combined with omnidirectional visual feedback provided by a bidirectional imaging component, it constructs an intelligent, high-precision vibration suppression and position compensation system. The core of this active compensation system lies in decomposing the traditional rigid, monolithic clamping surface into multiple independently controllable compensation blocks. Each compensation block is connected to a high-precision pressure control system via an independent pressure-controlled chamber behind it and can be monitored in real time by displacement sensors. When the chip is subjected to vibration or external impact from any direction or form during the soldering process, the force is transmitted through the chip to the specific compensation block in contact with it. The minute displacement of the compensation block immediately changes the volume and pressure of the corresponding pressure-controlled chamber, and the sensor module quickly captures these nanometer-level changes. Based on this real-time sensor data, the control system dynamically and independently adjusts the air pressure within the pressure-controlled chamber, thereby generating a precise, reverse force applied to the corresponding compensation block to counteract external disturbances.

[0032] 2. This semiconductor chip stacking packaging clamping platform, through a rotatable multi-station mounting body, evenly distributes multiple independent clamping mechanisms along its circumference, constructing a highly efficient continuous operation platform. Each clamping mechanism constitutes an independent working unit, which can sequentially pass through different stations such as loading, alignment, welding, and inspection. This rotary indexing design replaces the traditional single-station sequential operation or processes that require complex flipping, realizing the assembly line production of semiconductor chip packaging, especially double-sided welding of multi-layer stacked chips. All stations can be precisely switched through a single drive motor, greatly reducing waiting time and auxiliary operation time between processes, and significantly improving the chip processing volume per unit time and overall production efficiency. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of the present invention;

[0035] Figure 2 This is a schematic diagram of the gear connection structure in this invention;

[0036] Figure 3 This is a schematic diagram of the structure of the mounting body connection in this invention;

[0037] Figure 4 This is a schematic diagram of the clamping mechanism in this invention;

[0038] Figure 5 This is a schematic diagram of the bottom structure of the clamping mechanism in this invention;

[0039] Figure 6 This is a schematic diagram of the clamping block in the present invention;

[0040] Figure 7 This is a schematic diagram of the clamping pair in this invention;

[0041] Figure 8 This is a schematic diagram illustrating the structure of the sliding cavity in this invention;

[0042] Figure 9 This is a cross-sectional schematic diagram showing the structure of the pressure control chamber in this invention.

[0043] In the diagram: 1. Frame body;

[0044] 2. Mounting body; 21. External gear ring 1; 22. Gear 1;

[0045] 3. Clamping mechanism; 31. Clamping block; 32. Linear guide rail; 33. Gear II; 34. Internal gear ring; 35. Drive shaft; 36. Worm gear; 37. Worm; 38. Motor I; 39. Slider;

[0046] 311 Clamping surface; 312 Toothed surface; 313 Mating surface; 321 Clamping pair; 322 Guide block; 323 Sealing gasket; 324 Compensation block; 331 Pressure control chamber; 332 Pressure control hole; 333 Sensor module; 3211 Sliding cavity;

[0047] 4. Motor 2;

[0048] 5. Connecting base;

[0049] 6. Two-way imaging component. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Example: Figure 1-9 As shown, the present invention provides a clamping platform for semiconductor chip stacking and packaging, including a frame body 1, a mounting body 2, multiple clamping mechanisms 3, and a bidirectional imaging component 6.

[0052] Mounting body 2 is rotatably mounted on frame body 1;

[0053] Multiple sets of clamping mechanisms 3 are distributed at intervals along the circumference of the mounting body 2. Each set of clamping mechanisms 3 includes clamping blocks 31 that can move synchronously towards or away from each other and form a square mounting area for clamping semiconductor chips.

[0054] The bidirectional imaging component 6 is disposed on the clamping block 31 and is used to image the semiconductor chip, the semiconductor chip and the clamping block 31 located at the working station, as well as the mounting body 2 and the clamping block 31.

[0055] The clamping block 31 integrates an active compensation clamping component;

[0056] The active compensation clamping assembly includes a pressure control cavity 331 formed inside the clamping block 31, a clamping pair 321 disposed on the clamping block 31 and used to block the pressure control cavity 331, and a plurality of compensation blocks 324 slidably connected to the clamping pair 321.

[0057] The pressure control chamber 331 is provided with a pressure control hole 332, which is connected to an external pressure control system; the active compensation clamping assembly also includes a sensor module 333 for monitoring the displacement of the compensation block 324 and the pressure in the pressure control chamber 331.

[0058] The clamping block 31 has a clamping surface 311 and a mating surface 313 that are perpendicular to each other, and a toothed surface 312 that is adjacent to the clamping surface 311 and the mating surface 313.

[0059] A guide block 322 is installed in the middle of the mating surface 313. The guide block 322 is slidably connected in the adjacent clamping pair 321, and the adjacent clamping surface 311 is in surface contact with the mating surface 313.

[0060] A sealing gasket 323 is provided between the clamping surface 311 and the clamping pair 321.

[0061] Specifically, the clamping block 31 is the core component of the clamping mechanism. Its geometry is carefully designed to integrate multiple functions. The clamping surface 311 is the surface that ultimately comes into direct or indirect contact with the side of the semiconductor chip, requiring extremely high flatness and smoothness. The toothed surface 312 is mainly used for meshing with the gears of the drive system. The contact surface 313 is the surface where the supporting or guiding structures between the clamping blocks 31 come into contact. The guide block 322 provides additional guidance and constraint for the precise sliding of the clamping block 31 within the clamping pair 321, ensuring that the movement trajectory of the clamping block is accurate when subjected to driving or compensating forces. The sealing gasket 323, as an elastic medium, is located between the clamping surface 311 and the rigid clamping pair 321. It not only plays a sealing role to prevent leakage of the pressure control chamber 331, but more importantly, it acts as a flexible interface to absorb some high-frequency vibrations and protect the chip edges.

[0062] The clamping mechanism 3 also includes a linear guide rail 32 installed in the mounting body 2, a slider 39 slidably connected to the linear guide rail 32, and a first drive unit located in the mounting body 2. The first drive unit is connected to the clamping block 31 for driving a pair of clamping blocks 31 to move synchronously. The slider 39 is installed at the bottom of the clamping block 31. The linear guide rail 32 and the slider 39 constitute a precision guide and bearing base for the clamping block 31 to perform large-scale opening and closing movements (i.e., adapting to chips of different sizes). The linear guide rail 32 ensures the straightness and stability of the clamping block 31 during movement.

[0063] The first drive unit includes a motor 38, a worm 37 connected to the output shaft of the motor 38, a worm wheel 36 meshing with the worm 37, a transmission shaft 35 coaxially and fixedly connected with the worm wheel 36, a gear 33 meshing with the toothed surface 312, and an internal gear ring 34 meshing with all gears 33.

[0064] One end of the drive shaft 35 is fixedly connected to one of the gears 33;

[0065] The internal gear ring 34 is rotatably connected inside the mounting body 2, and the gear 2 33 is connected inside the mounting body 2 by a shaft pin;

[0066] The first drive unit is a precision mechanical transmission system that performs coarse adjustment of the clamping block 31 (to adapt to the chip size). Motor 38 provides power, and the meshing of the worm gear 37 and worm wheel 36 transmits and reduces motion. More importantly, the worm gear pair has a self-locking characteristic, effectively preventing the clamping block 31 from accidentally loosening due to external disturbances (such as chip stress) when motor 38 stops, ensuring the stability of the initial clamping force. Drive shaft 35 transmits the rotational motion of the worm wheel 36. A gear 33 and the fixed worm wheel 36 are on the same drive shaft 35, achieving synchronous drive. The internal gear ring 34 is a key synchronous element. All gears 33 mesh with the inner gear ring of the same internal gear ring 34. When one of the gears 33 rotates synchronously, it drives the internal gear ring 34 to generate a slight "revolutionary" tendency. However, since the internal gear ring 34 is constrained within the mounting body 2 (it can float slightly or has specific constraints), the result is that while one of the gears 33 drives the internal gear ring 34, the internal gear ring 34 applies an equal force to the other gears 33, thereby pushing the clamping blocks 31 meshing with the gears 33 (through the rack structure on the toothed surface 312) to move strictly synchronously towards or away from each other. This design ensures the absolute synchronicity of the movement between the clamping blocks 31, which is the basis for forming a high-precision square mounting area.

[0067] The clamping pair 321 has a sliding cavity 3211 that corresponds to the compensation block 324. The compensation block 324 is slidably connected in the sliding cavity 3211, and the contact surface between the compensation block 324 and the sliding cavity 3211 is provided with a sealing rubber plug.

[0068] The clamping pair 321 is a key structural component inside the clamping block 31 used to support the active compensation function. Multiple (e.g., 5-10 distributed along the length of the clamping surface) independent sliding cavities 3211 are machined on it. Each sliding cavity 3211 is fitted with a compensation block 324. The compensation block 324 is the actuator that directly applies compensation force to the chip. A precision sliding fit is used between the compensation block 324 and the sliding cavity 3211 to ensure smooth movement without radial wobble. Sealing plugs (typically O-rings or rectangular seals) on the contact surface achieve a sliding dynamic seal, allowing the space behind each compensation block 324 to form an independent sealed pressure-controlled cavity 331, while simultaneously allowing the compensation block 324 to perform small-stroke reciprocating motion under pneumatic drive.

[0069] Motor 2 4 is mounted on the top of the mounting body 2, and a transmission assembly is provided inside the mounting body 2;

[0070] The transmission assembly includes an external gear ring 21 fixed on the mounting body 2 and a gear 22 connected to the output shaft of the motor 4. The gear 22 meshes with the external gear ring 21.

[0071] Motor 2, part 4, is the drive source for the entire rotary table (mounting body 2). The output shaft of motor 2, part 4, is connected to gear 1, part 22 via a coupling. Gear 1, part 22 meshes with an external gear ring 1, part 21, which is much larger in diameter and is fixedly mounted on mounting body 2. Figure 2 , Figure 3 (As shown). This "small gear driving a large gear ring" structure is a classic rotary drive scheme. When the output shaft of motor 24 rotates, gear 22 rotates, thereby driving the external gear ring 21, which is fixed to the mounting body 2, to rotate relative to the sleeve body 1. This structure is compact and can provide stable rotary drive torque and precise angular indexing (usually achieved with an encoder).

[0072] The pressure control chamber 331 is a closed space formed by the rear part of the compensation block 324 in the sliding cavity 3211 and the end wall of the sliding cavity 3211;

[0073] The pressure control hole 332 penetrates the wall of the clamping block 31 and communicates with the pressure control cavity 331; the sensor module 333 includes a pressure sensor disposed in the pressure control cavity 331, and a displacement sensor disposed in the pressure control cavity 331 for compensating the displacement of the block 324.

[0074] The pressure control chamber 331 is the power source chamber for each independent compensation unit. Its volume varies with the position of the compensation block 324. The pressure control port 332 is a channel connecting the external high-precision pneumatic control system to each independent pressure control chamber 331, typically consisting of micro-tubes and micro-flow channels integrated within the clamping block 31. The sensor module 333 is the "sensory nerve" of the system. Pressure sensors (such as micro-differential pressure film sensors) monitor the absolute pressure or the difference relative to a reference pressure within the pressure control chamber 331 in real time. Displacement sensors (such as non-contact capacitive or eddy current micro-sensors, or micro-LVDTs integrated within the chamber) are used to directly measure the precise displacement of the compensation block 324 relative to the end wall of the sliding cavity 3211. The data from these two types of sensors are the direct basis for the control system to perform real-time closed-loop compensation control.

[0075] The bidirectional imaging assembly 6 includes at least one internal imaging unit and at least one external imaging unit; the internal imaging unit is used to image the upper surface of the semiconductor chip held by the clamping mechanism 3 and the space between the semiconductor chip and the clamping block 31; the external imaging unit is used to image the space between the clamping block 31 and the mounting body 2.

[0076] The bidirectional imaging component 6 is the system's "visual eye," providing both macroscopic and microscopic positional information. The internal imaging unit typically refers to an imaging system whose optical path can penetrate deep into the clamping area. For example, a camera can be directly mounted at a specific position on the clamping block 31, enabling high-precision positioning of the pads on the chip's upper surface (providing coordinates for the upper / lower wire bonding machine). It can also observe the contact gap and state between the chip's side and the clamping surface 311 (or sealing gasket 323), determining if there is tilting, foreign objects, or uneven contact. The external imaging unit is used to observe the relative positional relationship between the clamping mechanism 3 as a whole and the mounting body 2 from the outside. For example, it can detect the offset between specific reference features on the clamping block 31 and the corresponding reference on the mounting body 2, thereby determining the overall pose deviation of the clamping mechanism caused by long-term use, thermal deformation, etc.

[0077] The platform also includes a control system, which is electrically connected to the pressure control system connected to the sensor module 333, the bidirectional imaging component 6, the first drive unit, the second motor 4, and the pressure control port 332.

[0078] The control system is configured to receive monitoring data from sensor module 333 and image data from bidirectional imaging component 6, analyze the positional deviation of semiconductor chip and vibration state of clamp block 31, and generate control commands to adjust the pressure in pressure control chamber 331 or control the first drive unit or motor 4 to make compensatory adjustments.

[0079] The control system is also configured to dynamically track and compensate for the location of the solder joints during the chip wire bonding process, based on the preset wire bonding path and the real-time images fed back by the bidirectional imaging component 6.

[0080] In summary, the semiconductor chip stacking and packaging clamping platform allows for the packaging of semiconductor chips. During use, the output shaft of motor 4 drives gear 22 to rotate, which in turn rotates the external gear ring 21, causing the mounting body 2 to rotate. Through the rotation of the mounting body 2, the clamping mechanism 3 on the mounting body 2, which is in multiple positions, can switch positions, laying the foundation for continuous processing of semiconductor chip packaging.

[0081] Driven by the output shaft of motor 38, worm 37 rotates, which in turn drives worm wheel 36 to drive gear 33 to rotate via transmission shaft 35. Through the transmission of internal gear ring 34, internal gear ring 34 drives clamping block 31, enabling clamping blocks 31 to move synchronously and change the size of the square mounting area between clamping blocks 31 to accommodate semiconductor chips of different sizes.

[0082] When vibration occurs during semiconductor chip packaging, the bidirectional imaging component 6 can directly image the semiconductor chip. Firstly, it provides precise positioning for gold wire bonding; secondly, by imaging the clamping block 31 and the semiconductor chip, it analyzes and determines the positional deviation between the clamping block 31 and the semiconductor chip and performs compensation operations; thirdly, by imaging the clamping block 31 and the mounting body 2, it analyzes and determines the positional deviation of the clamping block 31 and performs compensation operations.

[0083] The distance sensor and air pressure sensor composed of sensor module 333 can determine the travel distance of sealing gasket 323 and the pressure change in pressure control chamber 331, and understand the slight positional deviation of semiconductor chip. The pressure in pressure control chamber 331 is controlled by pressure control hole 332, so that sealing gasket 323 is finely aligned with semiconductor chip. At the same time, the clamping method of pressure control chamber 331 forms flexible clamping of semiconductor chip, reducing the damage to semiconductor chip caused by vibration. In addition, part of sealing gasket 323 abuts against guide block 322 to suppress the offset of clamping block 31.

[0084] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A clamping platform for semiconductor chip stacking and packaging, comprising a frame (1), characterized in that: It also includes a mounting body (2), multiple clamping mechanisms (3) and a bidirectional imaging assembly (6); The mounting body (2) is rotatably mounted on the frame body (1); Multiple sets of clamping mechanisms (3) are distributed circumferentially along the mounting body (2). Each set of clamping mechanisms (3) includes clamping blocks (31) that can move synchronously towards or away from each other and form a square mounting area for clamping semiconductor chips. The bidirectional imaging component (6) is disposed on the clamp (31) and is used to image the semiconductor chip, the semiconductor chip and the clamp (31) located at the working station, as well as the mounting body (2) and the clamp (31); The clamping block (31) is equipped with an active compensation clamping component; The active compensation clamping assembly includes a pressure control cavity (331) formed inside the clamping block (31), a clamping pair (321) disposed on the clamping block (31) and used to block the pressure control cavity (331), and a plurality of compensation blocks (324) slidably connected to the clamping pair (321). The pressure control chamber (331) is provided with a pressure control hole (332), which is connected to an external pressure control system; the active compensation clamping assembly also includes a sensor module (333) for monitoring the displacement of the compensation block (324) and the pressure in the pressure control chamber (331).

2. The clamping platform for semiconductor chip stacking and packaging according to claim 1, characterized in that: The clamping block (31) has a clamping surface (311) and a mating surface (313) that are perpendicular to each other, and a toothed surface (312) adjacent to the clamping surface (311) and the mating surface (313). A guide block (322) is installed in the middle of the bonding surface (313). The guide block (322) is slidably connected in the adjacent clamping pair (321), and the adjacent clamping surface (311) is in surface contact with the bonding surface (313). A sealing gasket (323) is provided between the clamping surface (311) and the clamping pair (321).

3. The clamping platform for semiconductor chip stacking and packaging according to claim 2, characterized in that: The clamping mechanism (3) further includes a linear guide rail (32) installed in the mounting body (2), a slider (39) slidably connected to the linear guide rail (32), and a first drive unit provided in the mounting body (2). The first drive unit is connected to the clamping block (31) for driving a pair of clamping blocks (31) to move synchronously. The slider (39) is installed at the bottom of the clamping block (31).

4. The clamping platform for semiconductor chip stacking and packaging according to claim 3, characterized in that: The first drive unit includes a motor (38), a worm (37) connected to the output shaft of the motor (38), a worm wheel (36) meshing with the worm (37), a transmission shaft (35) coaxially and fixedly connected with the worm wheel (36), a gear (33) meshing with the toothed surface (312), and an internal gear ring (34) meshing with all gears (33). One end of the drive shaft (35) is fixedly connected to one of the gears (33); The internal gear ring (34) is rotatably connected inside the mounting body (2), and the second gear (33) is connected inside the mounting body (2) by a shaft pin.

5. The clamping platform for semiconductor chip stacking and packaging according to claim 4, characterized in that: The clamping pair (321) has a sliding cavity (3211) corresponding to the compensation block (324) one by one. The compensation block (324) is slidably connected in the sliding cavity (3211). The contact surface between the compensation block (324) and the sliding cavity (3211) is provided with a sealing rubber plug.

6. The clamping platform for semiconductor chip stacking and packaging according to claim 5, characterized in that: The top of the mounting body (2) is equipped with a motor (4), and the mounting body (2) is provided with a transmission assembly; The transmission assembly includes an external gear ring (21) fixed on the mounting body (2) and a gear (22) connected to the output shaft of the motor (4), wherein the gear (22) meshes with the external gear ring (21).

7. The clamping platform for semiconductor chip stacking and packaging according to claim 6, characterized in that: The pressure control chamber (331) is a closed space formed by the rear part of the compensation block (324) in the sliding cavity (3211) and the end wall of the sliding cavity (3211); The pressure control hole (332) penetrates the wall of the clamping block (31) and communicates with the pressure control cavity (331); the sensor module (333) includes a pressure sensor installed in the pressure control cavity (331) and a displacement sensor installed in the pressure control cavity (331) for compensating the displacement of the block (324).

8. The clamping platform for semiconductor chip stacking and packaging according to claim 7, characterized in that: The bidirectional imaging assembly (6) includes at least one internal imaging unit and at least one external imaging unit; the internal imaging unit is used to image the upper surface of the semiconductor chip held by the clamping mechanism (3) and the space between the semiconductor chip and the clamping block (31); the external imaging unit is used to image the space between the clamping block (31) and the mounting body (2).

9. The clamping platform for semiconductor chip stacking and packaging according to claim 8, characterized in that: The platform also includes a control system, which is electrically connected to the pressure control system connected to the sensor module (333), the bidirectional imaging component (6), the first drive unit, the second motor (4), and the pressure control port (332); The control system is configured to: receive monitoring data from the sensor module (333) and image data from the bidirectional imaging component (6), analyze the positional deviation of the semiconductor chip and the vibration state of the positional deviation of the clamp (31), and generate control commands to adjust the pressure in the pressure control chamber (331) or control the first drive unit or motor (4) to make compensatory adjustments.

10. The clamping platform for semiconductor chip stacking and packaging according to claim 9, characterized in that: The control system is also configured to dynamically track and compensate for the location of the solder joint during the chip wire bonding process, based on the preset wire bonding path and the real-time image fed back by the bidirectional imaging component (6).

Images