Electronic device including structure for heat dissipation

Abstract

An electronic device according to an embodiment may include: a first housing including a first support portion; the second shell comprises a second supporting part opposite to the first supporting part; and at least one electronic component in the first housing. The electronic device may include a hinge structure rotatably coupling a first housing and a second housing to each other. The first support portion and the second support portion may be configured to be connected to each other in an expanded state of the electronic device to form a heat transfer path from the at least one electronic component to the second housing.

Description

Technical Field

[0001] The various embodiments described later relate to electronic devices that include structures for heat dissipation. Background Technology

[0002] Electronic devices incorporating large-screen displays can improve user utilization. With the increasing demand for highly portable electronic devices, these devices can include deformable displays. Deformable displays can be deformable in a sliding, rolling, or folding manner. By including deformable displays, electronic devices can be miniaturized for wearable or portable use. Electronic devices can include electronic components to perform various functions. As these electronic components perform operations in response to user requests, heat can be generated in the miniaturized device. To reduce damage to the device, structures may be needed to dissipate the heat generated from the electronic components.

[0003] The above information is provided as relevant technology for the purpose of aiding understanding of this disclosure. No argument or determination is made as to whether anything described above can be used as prior art in connection with this disclosure. Summary of the Invention

[0004] Technical solution

[0005] According to an embodiment, the electronic device may include a display, a first housing including a first support portion for supporting the display, and a second housing including a second support portion for supporting the display. The electronic device may include at least one electronic component disposed within the first housing. The electronic device may include a hinge structure configured to rotatably connect the first and second housings. The first and second support portions may be configured to form a heat transfer path from the at least one electronic component to the second housing by connecting them to each other in an deployed state of the electronic device.

[0006] According to an embodiment, the electronic device may include a first housing and a second housing, the first housing including a first support portion, and the second housing including a second support portion facing the first support portion. The electronic device may include a flexible display including a first display area coupled to the first housing, a second display area coupled to the second housing, and a deformable third display area extending from the first display area to the second display area. The electronic device may include at least one electronic component in the first housing. The electronic device may include a vapor chamber in the first housing, the vapor chamber contacting the at least one electronic component and the first support portion, and extending from the at least one electronic component to the first support portion. The electronic device may include a hinge structure configured to provide an unfolded state and multiple folded states of the second housing folded relative to the first housing about a folding axis by rotatably connecting the first and second support portions. The first support portion may be configured to form a heat transfer path from the at least one electronic component through the vapor chamber to the second housing by connecting to the second support portion in the unfolded state. Attached Figure Description

[0007] Figure 1 This is a block diagram of an electronic device in a network environment according to various embodiments.

[0008] Figure 2a An example of an exemplary electronic device in its unfolded state according to an embodiment is shown.

[0009] Figure 2b An example of a first folded state of an exemplary electronic device according to an embodiment is shown.

[0010] Figure 2c This is an exploded view of an exemplary electronic device according to an embodiment.

[0011] Figure 3 An exemplary electronic device along Figure 2a A partial cross-sectional view of the line A-A' cut.

[0012] Figure 4a and Figure 4b A portion of an exemplary electronic device is shown.

[0013] Figure 5a A portion of an exemplary electronic device in a first folded state is shown.

[0014] Figure 5b A portion of an exemplary electronic device in its second folded state is shown.

[0015] Figure 5c A portion of an exemplary electronic device in an unfolded state is shown.

[0016] Figure 6 A portion of an exemplary electronic device in an unfolded state is shown.

[0017] Figure 7a A portion of an exemplary electronic device in a first folded state is shown.

[0018] Figure 7b A portion of an exemplary electronic device in an unfolded state is shown.

[0019] Figure 7c This is a top plan view of the support structure of an exemplary electronic device.

[0020] Figure 8a A portion of an exemplary electronic device in a first folded state is shown.

[0021] Figure 8b A portion of an exemplary electronic device in an unfolded state is shown.

[0022] Figure 8c This is a partial exploded perspective view of an exemplary electronic device. Detailed Implementation

[0023] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0024] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of these components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (e.g., display module 160).

[0025] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to embodiments, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 can be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or as part of the main processor 121.

[0026] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) can be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) can include hardware architectures dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural networks can be deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), deep Q-networks, or combinations of two or more of these, but are not limited thereto. Additionally or optionally, the artificial intelligence model can include software structures in addition to hardware structures.

[0027] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0028] The program 140 can be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0029] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by another component of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0030] The audio output module 155 can output audio signals to the outside of the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver can be implemented separately from the speaker, or as part of the speaker.

[0031] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0032] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0033] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0034] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0035] Connection 178 may include a connector via which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0037] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0038] The power management module 188 can manage the power supplied to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0039] Battery 189 can power at least one component of electronic device 101. According to embodiments, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). A corresponding one of these communication modules can communicate via a first network 198 (e.g., a short-range communication network, such as Bluetooth). TM The wireless communication module 192 can communicate with external electronic devices via a Wi-Fi Direct or Infrared Data Association (IrDA) network or a second network 199 (e.g., a long-range communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and verify the electronic device 101 in the communication network (such as a first network 198 or a second network 199).

[0041] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0042] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element composed of conductive material or conductive patterns formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 197.

[0043] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, an RFIC, and multiple antennas (e.g., an array antenna). The RFIC is disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band). The multiple antennas are disposed on or adjacent to a second surface (e.g., the top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0044] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via inter-peripheral communication schemes (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0045] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic devices 102 or 104 can be the same as or a different type of device as electronic device 101. According to an embodiment, all or some operations that will be performed on electronic device 101 can be performed on one or more of external electronic devices 102, 104, or 108. For example, if electronic device 101 is required to automatically perform a function or service or to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform the requested at least portion of the function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing can be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0046] Figure 2a An example of the unfolded state of an electronic device according to an embodiment is shown. Figure 2b An example of a first folded state of an electronic device according to an embodiment is shown. Figure 2c This is an exploded view of an electronic device according to an embodiment.

[0047] Reference Figure 2a , Figure 2b and Figure 2c The electronic device 101 may include a first housing 210, a second housing 220, a display 230, and at least one camera 240 (e.g., Figure 1 The camera module 180, the hinge structure 250 and / or at least one electronic component 260.

[0048] The first housing 210 and the second housing 220 may form at least a portion of the outer surface of the electronic device 101 that can be held by a user. When the electronic device 101 is used by a user, the at least portion of the outer surface of the electronic device 101 defined by the first housing 210 and the second housing 220 may come into contact with a part of the user's body. According to an embodiment, the first housing 210 may include a first front surface 211, a first rear surface 212 facing and spaced apart from the first front surface 211, and a first side surface 213 covering at least a portion of the first front surface 211 and the first rear surface 212. The first side surface 213 may connect the periphery of the first front surface 211 to the periphery of the first rear surface 212. The first front surface 211, the first rear surface 212, and the first side surface 213 may define an internal space of the first housing 210. According to an embodiment, the first housing 210 may provide the space formed by the first front surface 211, the first rear surface 212, and the first side surface 213 as a space for mounting components of the electronic device 101.

[0049] According to an embodiment, the second housing 220 may include a second front surface 221, a second rear surface 222 facing and spaced apart from the second front surface 221, and a second side surface 223 covering at least a portion of the second front surface 221 and the second rear surface 222. The second side surface 223 may connect the periphery of the second front surface 221 to the periphery of the second rear surface 222. The second front surface 221, the second rear surface 222, and the second side surface 223 may define an internal space of the second housing 220. According to an embodiment, the second housing 220 may provide a space formed by the second front surface 221, the second rear surface 222, and the second side surface 223 covering at least a portion of the second front surface 221 and the second rear surface 222 as a space for mounting components of the electronic device 101. According to an embodiment, the second housing 220 may be coupled to the first housing 210 to be rotatable relative to the first housing 210.

[0050] According to an embodiment, each of the first housing 210 and the second housing 220 may respectively include a first protective member 214 and a second protective member 224. The first protective member 214 and the second protective member 224 may be disposed along the periphery of the display 230 on the first front surface 211 and the second front surface 221. According to an embodiment, the first protective member 214 and the second protective member 224 can prevent foreign matter (e.g., dust or moisture) from flowing in through the gap between the display 230 and the first housing 210 and the second housing 220. For example, the first protective member 214 may surround the periphery of the first display area 231 of the display 230, and the second protective member 224 may surround the periphery of the second display area 232 of the display 230. The first protective member 214 may be formed by attaching to or integrally forming with the first side surface 213 of the first housing 210. The second protective member 224 may be formed by attaching to or integrally forming with the second side surface 223 of the second housing 220.

[0051] According to an embodiment, the first side surface 213 and the second side surface 223 may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side surface 223 may include at least one conductive portion 225 and at least one non-conductive portion 226. The at least one conductive portion 225 may include a plurality of conductive portions spaced apart from each other. The at least one non-conductive portion 226 may be disposed between the plurality of conductive portions. The plurality of conductive portions may be disconnected from each other through the at least one non-conductive portion 226 disposed between the plurality of conductive portions. According to an embodiment, the plurality of conductive portions and the plurality of non-conductive portions may together form an antenna radiator. The electronic device 101 may communicate with an external electronic device through the antenna radiator formed by the plurality of conductive portions and the plurality of non-conductive portions.

[0052] Display 230 can be configured to display visual information. According to an embodiment, display 230 can be disposed across a hinge structure 250 on a first front surface 211 of a first housing 210 and a second front surface 221 of a second housing 220. For example, display 230 may include a first display area 231 disposed on the first front surface 211 of the first housing, a second display area 232 disposed on the second front surface 221 of the second housing, and a third display area 233 disposed between the first display area 231 and the second display area 232. The first display area 231, the second display area 232, and the third display area 233 may form the front surface of display 230. According to an embodiment, display 230 may further include a sub-display panel 235 disposed on a second rear surface 222 of the second housing 220. For example, display 230 may be referred to as a flexible display. According to an embodiment, display 230 may include a window exposed to the exterior of electronic device 101. The window may protect the surface of display 230 and transmit the visual information provided by display 230 to the exterior of electronic device 101 by including a substantially transparent material. For example, a window may include glass (e.g., ultra-thin glass (UTG)) and / or polymers (e.g., polyimide (PI)), but is not limited thereto.

[0053] At least one camera 240 may be configured to acquire an image based on receiving light from an external object of the electronic device 101. According to embodiments, at least one camera 240 may include a first camera 241, a second camera 242, and / or a third camera 243. The first camera 241 may be disposed within a first housing 210. For example, the first camera 241 may be disposed inside the first housing 210, and at least a portion of it may be visible through a first rear surface 212 of the first housing 210. The first camera 241 may be supported by a bracket (not shown) within the first housing 210. When viewed from above, the first rear surface 212 may include at least one opening 241a overlapping the first camera 241. The first camera 241 may acquire an image based on receiving light from the outside of the electronic device 101 through at least one opening 241a.

[0054] According to an embodiment, the second camera 242 may be disposed within the second housing 220. For example, the second camera 242 may be disposed inside the second housing 220 and visible through the sub-display panel 235. When viewed from above, the second housing 220 may include at least one opening 242a overlapping the second camera 242. The second camera 242 may acquire images based on receiving light from the outside of the electronic device 101 through at least one opening 242a.

[0055] According to an embodiment, a third camera 243 may be disposed within the first housing 210. For example, the third camera 243 may be disposed inside the first housing 210, and at least a portion of it may be visible through the first front surface 211 of the first housing 210. As another example, the third camera 243 may be disposed inside the first housing 210, and at least a portion of it may be visible through the first display area 231 of the display 230. When the display 230 is viewed from above, the first display area 231 of the display 230 may include at least one opening (not shown) overlapping with the third camera 243. The third camera 243 may acquire an image based on receiving light from the outside of the display 230 through at least one opening.

[0056] According to an embodiment, the second camera 242 and the third camera 243 may be disposed below the display 230 (e.g., facing the interior of the first housing 210 or the interior of the second housing 220). For example, the second camera 242 and the third camera 243 may be under-display cameras (UDC). When the second camera 242 and the third camera 243 are under-display cameras, the area of ​​the display 230 corresponding to the position of each of the second camera 242 and the third camera 243 may not be a non-active area. For example, when the second camera 242 and the third camera 243 are under-display cameras, the area of ​​the display 230 corresponding to the position of each of the second camera 242 and the third camera 243 may have a lower pixel density than other areas of the display 230. A non-active area of ​​the display 230 may mean an area of ​​the display 230 that does not contain pixels or does not emit light to the outside of the electronic device 101. As another example, the second camera 242 and the third camera 243 may be punch-hole cameras. When the second camera 242 and the third camera 243 are punch-hole cameras, the area of ​​the display 230 corresponding to the position of each of the second camera 242 and the third camera 243 can be a non-active area. For example, when the second camera 242 and the third camera 243 are punch-hole cameras, the area of ​​the display 230 corresponding to the position of each of the second camera 242 and the third camera 243 can include an opening without pixels.

[0057] According to an embodiment, hinge structure 250 can rotatably connect the first housing 210 and the second housing 220. Hinge structure 250 can be disposed between the first housing 210 and the second housing 220 of the electronic device 101, allowing the electronic device 101 to be bent, folded, or folded. For example, hinge structure 250 can be disposed between a portion of a first side surface 213 and a portion of a second side surface 223 facing each other. Hinge structure 250 can change the electronic device 101 to an unfolded (or unfolded) state with the first front surface 211 of the first housing 210 and the second front surface 221 of the second housing 220 substantially facing each other, or a folded (or folded) state with the first front surface 211 and the second front surface 221 facing each other. When the electronic device 101 is in the first folded state, the first housing 210 and the second housing 220 can be stacked or overlapped by facing each other.

[0058] According to an embodiment, when the electronic device 101 is in a first folded state, the directions facing the first front surface 211 and the second front surface 221 can be different from each other. For example, when the electronic device 101 is in the first folded state, the directions facing the first front surface 211 and the second front surface 221 can be opposite to each other. As another example, when the electronic device 101 is in the first folded state, the directions facing the first front surface 211 and the second front surface 221 can be tilted relative to each other. When the direction facing the first front surface 211 is tilted relative to the direction facing the second front surface 221, the first housing 210 can be tilted relative to the second housing 220. However, this is not a limitation. For example, in the first folded state of the electronic device 101, the first rear surface 212 of the first housing 210 can face the second rear surface 222 of the second housing 220. When the first rear surface 212 and the second rear surface 222 face each other in the first folded state of the electronic device 101, the directions facing the first front surface 211 and the second front surface 221 can be opposite to each other. With the first rear surface 212 and the second rear surface 222 facing each other in the first folded state of the electronic device 101, the display 230 can be directly exposed to the outside in the first folded state of the electronic device 101.

[0059] According to an embodiment, the electronic device 101 can be foldable relative to a folding axis f. The folding axis f can mean, but is not limited to, a virtual line extending through the hinge cover 251 in a direction substantially parallel to the longitudinal direction of the electronic device 101. For example, the folding axis f can be a virtual line extending in a direction substantially perpendicular to the longitudinal direction of the electronic device 101. When the folding axis f extends in a direction substantially perpendicular to the longitudinal direction of the electronic device 101, the hinge structure 250 can connect the first housing 210 and the second housing 220 by extending in a direction parallel to the folding axis f. The first housing 210 and the second housing 220 can be rotatable via the hinge structure 250 extending in a direction substantially perpendicular to the longitudinal direction of the electronic device 101.

[0060] According to an embodiment, the hinge structure 250 may include a hinge cover 251, a first hinge plate 252, a second hinge plate 253, and a hinge module 254. The hinge cover 251 may cover the internal components of the hinge structure 250 and form the outer surface of the hinge structure 250. According to an embodiment, when the electronic device 101 is in a first folded state, at least a portion of the hinge cover 251 covering the hinge structure 250 may be exposed to the outside of the electronic device 101 through the space between the first housing 210 and the second housing 220. According to an embodiment, when the electronic device 101 is in an unfolded state, the hinge cover 251 may be covered by the first housing 210 and the second housing 220 and may not be exposed to the outside of the electronic device 101.

[0061] According to an embodiment, the first hinge plate 252 and the second hinge plate 253 can be rotatably connected to the first housing 210 and the second housing 220 by being respectively connected to them. For example, the first hinge plate 252 can be connected to the first front bracket 215 of the first housing 210, and the second hinge plate 253 can be connected to the second front bracket 227 of the second housing 220. With the first hinge plate 252 and the second hinge plate 253 respectively connected to the first front bracket 215 and the second front bracket 227, the first housing 210 and the second housing 220 can be rotated according to the rotation of the first hinge plate 252 and the second hinge plate 253.

[0062] Hinge module 254 can rotate the first hinge plate 252 and the second hinge plate 253. For example, hinge module 254 can rotate the first hinge plate 252 and the second hinge plate 253 relative to the folding axis f by including gears that are rotatable via meshing with each other. According to an embodiment, there can be multiple hinge modules 254. For example, multiple hinge modules 254 can be configured to be spaced apart from each other at both ends of the first hinge plate 252 and the second hinge plate 253.

[0063] According to an embodiment, the first housing 210 may include a first front bracket 215 and a first rear bracket 216, and the second housing 220 may include a second front bracket 227 and a second rear bracket 228. The first front bracket 215 and the first rear bracket 216 may support components of the electronic device 101. The first front bracket 215 may define the first housing 210 by being coupled to the first rear bracket 216. The first rear bracket 216 may define a portion of the outer surface of the first housing 210. The second front bracket 227 and the second rear bracket 228 may support components of the electronic device 101. The second front bracket 227 may define the second housing 220 by being coupled to the second rear bracket 228. The second rear bracket 228 may define a portion of the outer surface of the second housing 220. For example, a display 230 may be disposed on the surface of the first front bracket 215 and the surface of the second front bracket 227. The first rear bracket 216 may be disposed on another surface of the first front bracket 215 opposite to the surface of the first front bracket 215. The second rear bracket 228 may be disposed on the opposite surface of the second front bracket 227. The sub-display panel 235 may be disposed between the second front bracket 227 and the second rear bracket 228.

[0064] According to an embodiment, a portion of the first front support 215 may be surrounded by a first side surface 213, and a portion of the second front support 227 may be surrounded by a second side surface 223. For example, the first front support 215 may be integrally formed with the first side surface 213, and the second front support 227 may be integrally formed with the second side surface 223. Alternatively, the first front support 215 may be formed separately from the first side surface 213, and the second front support 227 may be formed separately from the second side surface 223.

[0065] At least one electronic component 260 can perform various functions to be provided to the user. According to an embodiment, at least one electronic component 260 may include a first printed circuit board 261, a second printed circuit board 262, a flexible printed circuit board 263, and a battery 264 (e.g., Figure 1 Battery 189) and / or antenna 265 (e.g., Figure 1 Antenna module 197). The first printed circuit board 261 and the second printed circuit board 262 can each form an electrical connection between components in the electronic device 101. For example, components used to realize the overall function of the electronic device 101 (e.g., Figure 1 The processor 120 may be disposed in the first printed circuit board 261, and at least one electronic component for implementing some functions of the first printed circuit board 261 may be disposed in the second printed circuit board 262. For example, components for operating the sub-display panel 235 disposed on the second rear surface 222 may be disposed in the second printed circuit board 262.

[0066] According to an embodiment, a first printed circuit board 261 may be disposed in a first housing 210. For example, the first printed circuit board 261 may be disposed on the surface of a first front support 215. According to an embodiment, a second printed circuit board 262 may be disposed in a second housing 220. For example, the second printed circuit board 262 may be spaced apart from the first printed circuit board 261 and disposed on the surface of a second front support 227. A flexible printed circuit board 263 may connect the first printed circuit board 261 and the second printed circuit board 262. For example, the flexible printed circuit board 263 may extend from the first printed circuit board 261 to the second printed circuit board 262.

[0067] Battery 264 is a means for supplying power to at least one component of electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of battery 264 may be disposed on a plane substantially the same as the first printed circuit board 261 or the second printed circuit board 262.

[0068] Antenna 265 can be configured to receive power or signals from outside the electronic device 101. According to an embodiment, antenna 265 can be disposed between the first rear bracket 216 and the battery 264. Antenna 265 may include, for example, a near-field communication (NFC) antenna, an antenna module, and / or a magnetically secure transmission (MST) antenna. Antenna 265 can, for example, perform short-range communication with external devices or wirelessly send and receive power required for charging.

[0069] Figure 3 An exemplary electronic device along Figure 2a A partial cross-sectional view of the line A-A' cut.

[0070] Reference Figure 3 The electronic device 101 may include a first housing 210, a second housing 220, at least one electronic component 301, and a hinge structure 250.

[0071] According to an embodiment, the first housing 210 may include a first support portion 310. The second housing 220 may include a second support portion 320 facing the first support portion 310.

[0072] For example, the first support portion 310 may be a portion of the first housing 210 that is connected to the hinge structure 250. For example, the first support portion 310 may be configured to allow the first housing 210 to rotate relative to the hinge structure 250 via rotatable connection to the hinge structure 250. For example, the first support portion 310 may be a bracket within the first housing 210 (e.g., Figure 2cThe first front bracket 215 is used to connect to the hinge structure 250, but is not limited thereto. For example, the first support portion 310 may be configured to allow the display (e.g., Figure 2a At least a portion of the display 230 on the first housing 210 (e.g., Figure 2a The third display area 233) is deformed. For example, the first support portion 310 may receive at least a portion of the heat emitted from at least one electronic component 301 in the first housing 210.

[0073] For example, the second support portion 320 may be a portion of the second housing 220 that connects to the hinge structure 250. For example, the second support portion 320 may be configured to allow the second housing 220 to rotate relative to the hinge structure 250 via rotatable connection to it. For example, the second support portion 320 may be a bracket within the second housing 220 (e.g., Figure 2c The second front bracket 227 is used to connect to the hinge structure 250, but is not limited thereto. For example, the second support portion 320 may be configured to allow at least a portion of the display 230 on the second housing 220 (e.g., by rotatably connecting the second housing 220 to the hinge structure 250) to be mounted on the second housing 220. Figure 2a The third display area 233) is deformed.

[0074] According to an embodiment, the electronic device 101 may include a display 230, the display 230 including a first display area coupled to the first housing 210 (e.g., Figure 2a The first display area 231), and the second display area connected to the second housing 220 (e.g., Figure 2a The display 230 includes a second display area 232 and a deformable third display area 233 extending from the first display area 231 to the second display area 232. For example, the first display area 231 may be attached to the first housing 210. The second display area 232 may be attached to the second housing 220 and spaced apart from the first display area 231. For example, the third display area 233 may connect the first display area 231 and the second display area 232. The third display area 233 may be disposed on a hinge structure 250. For example, the third display area 233 may be at least partially deformable by rotating the first housing 210 and / or the second housing 220 via the hinge structure 250. For example, the third display area 233 may be disposed on a first support portion 310 of the first housing 210 and a second support portion 320 of the second housing 220. The third display area 233 may be at least partially deformable by the first support portion 310 and / or the second support portion 320. The display 230 can provide various user experiences to the user by including the deformable third display area 233.

[0075] According to an embodiment, at least one electronic component 301 may be disposed in the first housing 210. For example, at least one electronic component 301 may be disposed on a printed circuit board (e.g., in the first housing 210) within the first housing 210. Figure 2c The first printed circuit board 261). For example, at least one electronic component 301 may be disposed between the first housing 210 and the display 230 on the first housing 210. For example, as the electronic device 101 operates, at least one electronic component 301 may generate heat. At least a portion of the heat dissipated from the electronic device 101 may be transferred to the first support portion 310 of the first housing 210. For example, at least one electronic component 301 may be referred to as the processor of the electronic device 101 (e.g., Figure 1 The processor 120) and / or battery (e.g., Figure 1 Battery 189 and / or Figure 2c (Battery 264), but not limited to this.

[0076] According to an embodiment, the hinge structure 250 can be configured to provide an unfolded state and multiple folded states of the second housing 220 folded relative to the first housing 210 about the folding axis f by rotatably connecting the first support portion 310 and the second support portion 320.

[0077] Multiple folded states of the electronic device 101 can mean a state in which the second housing 220 is folded relative to the first housing 210 via the hinge structure 250. For example, multiple folded states can mean a state in which the second housing 220 is tilted relative to the first housing 210. For example, multiple folded states can mean a state in which the second front surface of the second housing 220 (e.g., Figure 2a The second front surface 221) is relative to the first front surface of the first housing 210 (e.g., Figure 2a The first front surface 211 is tilted. Multiple folding states can be states where the first front surface 211 and the second front surface 221 face each other. Multiple folding states can be states where the first front surface 211 and the second front surface 221 face substantially different directions. For example, multiple folding states can be states where the first display area 231 on the first housing 210 and the second display area 232 on the second housing 220 face different directions. For example, multiple folding states can be states where at least a portion of the third display area 233 between the first display area 231 and the second display area is bent. For example, multiple folding states can include states where the angle between the first housing 210 and the second housing 220 is in the range greater than 0 degrees and less than 180 degrees.

[0078] The unfolded state of the electronic device 101 can be referred to as the unfolded state of the first housing 210 and the second housing 220. For example, the unfolded state can be a state that can be changed into multiple folded states. For example, the unfolded state can be a state in which the first housing 210 and the second housing 220 form substantially flat surfaces as the first housing 210 and the second housing 220 are unfolded. For example, the unfolded state can be a state in which the first display area 231 and the second display area 232 of the display 230 face substantially the same direction. For example, the unfolded state can be a state in which the angle between the first housing 210 and the second housing 220 is 180 degrees. For example, the unfolded state can be a state in which the deformable third display area 233 of the display 230 is unfolded.

[0079] For example, hinge structure 250 can provide a folding axis f. A first support portion 310 can be coupled to hinge structure 250 to be rotatable relative to a second support portion 320 about the folding axis f. A second support portion 320 can be coupled to hinge structure 250 to be rotatable relative to the first support portion 310 about the folding axis f. For example, a first housing 210 can be coupled to hinge structure 250 to be rotatable relative to a second housing 220 via the first support portion 310. A second housing 220 can be coupled to hinge structure 250 to be rotatable relative to the first housing 210 via the second support portion 320. For example, the first support portion 310 and the second support portion 320 can face each other about the folding axis f.

[0080] According to an embodiment, the hinge structure 250 may include a first hinge plate 331 connected to a first housing 210 and a second hinge plate 332 connected to a second housing 220 and spaced apart from the first hinge plate 331. The hinge structure 250 may include a hinge cover 340 that rotatably connects the first hinge plate 331 and the second hinge plate 332. For example, the hinge cover 340 may include a first link 250a for connecting the first hinge plate 331 to the hinge cover 340 and a second link 250b for connecting the second hinge plate 332 to the hinge cover 340. The first link 250a may provide an axis of rotation such that the first hinge plate 331 is rotatable relative to the hinge cover 340. The second link 250b may provide an axis of rotation such that the second hinge plate 332 is rotatable relative to the hinge cover 340. The hinge cover 340 may rotatably connect the first hinge plate 331 and the second hinge plate 332 by providing the first link 250a and the second link 250b. For example, a first hinge plate 331 may be coupled to a first support portion 310 of a first housing 210. A second hinge plate 332 may be coupled to a second support portion 320 of a second housing 220. For example, the first hinge plate 331 and the second hinge plate 332 may face each other about a folding axis f. For example, a hinge cover 340 may be a portion of the hinge structure 250 that provides the folding axis f. For example, the hinge cover 340 may be at least partially disposed between the first housing 210 and the second housing 220. For example, the hinge cover 340 may be at least partially exposed to the outside in multiple folded states of the electronic device 101. For example, the hinge cover 340 may be made by including a hinge module (e.g., a gear) in the hinge structure 250. Figure 2c The hinge module 254 rotatably connects the first hinge plate 331 and the second hinge plate 332. The hinge cover 340 rotatably connects the first housing 210 and the second housing 220 by rotatably connecting the first hinge plate 331 and the second hinge plate 332.

[0081] According to an embodiment, the first support portion 310 is slidably connected to the first hinge plate 331. The second support portion 320 is slidably connected to the second hinge plate 332. For example, the first support portion 310 can slide relative to the first hinge plate 331 toward the folding axis f while changing from multiple folded states to an unfolded state. The second support portion 320 can slide relative to the first hinge plate 331 toward the folding axis f while changing from multiple folded states to an unfolded state. For example, in order to change from an unfolded state to multiple folded states, the first support portion 310 can slide relative to the first hinge plate 331 in a direction opposite to the direction toward the folding axis f in the unfolded state. The second support portion 320 can slide relative to the second hinge plate 332 in a direction opposite to the direction toward the folding axis f in the unfolded state. However, this is not a limitation.

[0082] According to an embodiment, heat dissipated from at least one electronic component 301 in the first housing 210 can be dissipated into the interior of the first housing 210. Due to the heat, the performance of at least one electronic component in the first housing 210 and / or the electronic device 101 may degrade. At least a portion of the heat may be transferred to the first support portion 310 of the first housing 210. The electronic device 101 may require a structure for heat dissipation using the first support portion 310 and a second support portion 320 facing the first support portion 310. The structure for heat dissipation will be described below. Figure 4a As described in the text.

[0083] According to the above embodiments, the electronic device 101 can provide various user experiences to a user through a first housing 210 having a first support portion 310 connected to the hinge structure 250 and a second housing 220 having a second support portion 320 connected to the hinge structure 250. The electronic device 101 can also provide various user experiences to a user through a display 230 including a deformable third region 233.

[0084] Figure 4a and Figure 4b A portion of an exemplary electronic device is shown.

[0085] Reference Figure 4a and Figure 4b The electronic device 101 may include a first housing 210 and a second housing 220. The first housing 210 includes a first support portion 310, and the second housing 220 includes a second support portion 320 facing the first support portion 310. The electronic device 101 may include at least one electronic component 301 in the first housing 210. The electronic device 101 may include a hinge structure 250 configured to provide an unfolded state and multiple folded states of the second housing 220 folded relative to the first housing 210 about a folding axis f by rotatably connecting the first support portion 310 and the second support portion 320. According to an embodiment, the hinge structure 250 may include a first hinge plate 331 coupled to the first housing 210, a second hinge plate 332 coupled to the second housing 220 and spaced apart from the first hinge plate 331, and a hinge cover 340 rotatably connecting the first hinge plate 331 and the second hinge plate 332.

[0086] According to an embodiment, a first hinge plate 331 may be connected to a first support portion 310. A second hinge plate 332 may be connected to a second support portion 320. The hinge cover 340 may include a first protruding structure 341 on a folding axis f that separates the first hinge plate 331 and the second hinge plate 332. For example, the first protruding structure 341 may overlap with the folding axis f. The first hinge plate 331 and the second hinge plate 332 may contact the first protruding structure 341 in the unfolded state. For example, the first hinge plate 331 may include a first connecting portion 331a connected to the hinge cover 340 and a second connecting portion 331b extending from the first connecting portion 331a toward the first housing 210 and connected to the first support portion 310. The second hinge plate 332 may include a third connecting portion 332a connected to the hinge cover 340 and a fourth connecting portion 332b extending from the third connecting portion 332a toward the second housing 220 and connected to the second support portion 320. The first connecting portion 331a and the third connecting portion 332a are each rotatably connected to the hinge cover 340. The first connecting portion 331a and the third connecting portion 332a can contact the first protruding structure 341 in the unfolded state. The second connecting portion 331b is slidably connected to the first support portion 310. The fourth connecting portion 332b is slidably connected to the second support portion 320.

[0087] According to an embodiment, the first support portion 310 may be configured to form a heat transfer path p from at least one electronic component 301 to the second housing 220 by connecting it to the second support portion 320 in the unfolded state.

[0088] For example, the first support portion 310 may contact the second support portion 320 in the unfolded state. For example, the first support portion 310 may be configured to be closer to the second support portion 320 in the unfolded state than in multiple folded states. For example, the first support portion 310 may receive heat from at least one electronic component 301 in the first housing 210. The first support portion 310 may transfer at least a portion of the heat received from the at least one electronic component 301 to the second support portion 320 through conductive heat transfer to the second support portion 320 in the unfolded state. For example, in the unfolded state, at least a portion of the first support portion 310 may contact at least a portion of the second support portion 320 on the hinged cover 340. For example, in the unfolded state, the first support portion 310 may form a heat transfer path p with the second support portion 320 through at least one thermally conductive material disposed between the first support portion 310 and the second support portion 320. Because at least a portion of the heat is transferred to the second support portion 320, the heat dissipated from at least one electronic component 301 into the interior of the first housing 210 can be dissipated into the interior of the second housing 220 through the heat transfer path p formed by the first support portion 310 and the second support portion 320. By forming the heat transfer path p together with the second support portion 320 in the deployed state, the first support portion 310 can reduce the damage to the electronic device 101 caused by the heat dissipated from at least one electronic component 301.

[0089] According to an embodiment, a first support portion 310 may be slidably connected to a first hinge plate 331. The first support portion 310 may include a first portion 311 supporting the first hinge plate 331 and a second portion 312 extending from the first portion 311 along the folding axis f. A second support portion 320 may be slidably connected to a second hinge plate 332. The second support portion 320 may include a third portion 321 supporting the second hinge plate 332 and a fourth portion 322 extending from the third portion 321 along the folding axis f. The second portion 312 may be configured to form a heat transfer path p by contacting the fourth portion 322 in the unfolded state.

[0090] For example, the first portion 311 may be the part of the first support portion 310 that connects to the first hinge plate 331. The first portion 311 may be slidably connected to the first hinge plate 331. For example, the first portion 311 may be the part of the first support portion 310 that contacts the first hinge plate 331. The first portion 311 may cover at least a portion of the first hinge plate 331. The first portion 311 may be connected to the first hinge plate 331 and spaced apart from the second support portion 320 by the hinge cover 340 (or the first protruding structure 341). For example, the second portion 312 may be connected to the first portion 311. The second portion 312 may extend from the first housing 210 toward the folding axis f in the unfolded state.

[0091] For example, the third portion 321 may be the part of the second support portion 320 that connects to the second hinge plate 332. The third portion 321 may be slidably connected to the second hinge plate 332. For example, the third portion 321 may be the part of the second support portion 320 that contacts the second hinge plate 332. The third portion 321 may cover at least a portion of the second hinge plate 332. The third portion 321 may be spaced apart from the first support portion 310 by the hinge cover 340 (or the first protruding structure 341) by connecting to the second hinge plate 332. For example, a fourth portion 322 may be connected to the third portion 321. The fourth portion 322 may extend from the second housing 220 toward the folding axis f in the unfolded state.

[0092] For example, the second part 312 can contact the fourth part 322 on the folding axis f in the unfolded state. The second part 312 can be disconnected from the fourth part 322 by being spaced apart from it in multiple folded states. For example, the electronic device 101 can be configured to hold the display (e.g., ...) in multiple folded states. Figure 2a The display 230) is in a low-power mode. The electronic device 101 can be configured to dissipate relatively more heat from at least one electronic component 301 in the unfolded state than in multiple folded states in order to display visual information via the display 230. The second part 312 can form a heat transfer path p for heat dissipated from at least one electronic component 301 by contacting the fourth part 322 in the unfolded state.

[0093] For example, the second portion 312 may include a first region 312a disposed on the hinge cover 340 in the unfolded state. The fourth portion 322 may include a second region 322a disposed on the hinge cover 340 and contacting the first region 312a in the unfolded state. For example, while changing from multiple folded states to the unfolded state, the first region 312a may be located on the hinge cover 340 by moving along a first support portion 310 that slides relative to the first hinge plate 331. While changing from multiple folded states to the unfolded state, the second region 322a may be located on the hinge cover 340 by moving along a second support portion 320 that slides relative to the second hinge plate 332. The first region 312a and the second region 322a may contact each other on the hinge cover 340 in the unfolded state. For example, the second portion 312 may include a third region 312b extending from the first portion 311. The first region 312a may protrude from the third region 312b toward the folding axis f in the unfolded state. For example, the fourth portion 322 may include a fourth region 322b extending from the third portion 321. The second region 322a can protrude from the fourth region 322b toward the folding axis f in the unfolded state. In the unfolded state, the first region 312a can contact the second region 322a with respect to the folding axis f. Since the first region 312a is configured to contact the second region 322a in the unfolded state, the electronic device 101 can dissipate heat from at least one electronic component 301 to the second housing 220 through the heat transfer path p formed by the first region 312a and the second region 322a.

[0094] According to an embodiment, the first region 312a and the second region 322a may each include a deformable first thermally conductive member 410. For example, the first thermally conductive member 410 may be disposed in the portion of the second region 322a that contacts the first region 312a and the portion of the first region 312a that contacts the second region 322a in the unfolded state. For example, the first thermally conductive member 410 may be disposed along the folding axis f in the unfolded state. For example, the first thermally conductive member 410 may form the surface of the second region 322a configured to contact the first region 312a. The first thermally conductive member 410 may form the surface of the first region 312a configured to contact the second region 322a. For example, the first thermally conductive member 410 may improve the thermal conductivity of the heat transfer path p by having a relatively high thermal conductivity. For example, since the first thermally conductive member 410 is deformable, it may reduce damage to the second portion 312 and the fourth portion 322 by bringing the second portion 312 and the fourth portion 322 into contact when changing from multiple folded states to an unfolded state.

[0095] According to an embodiment, the first heat-conducting member 410 may include a first heat-conducting portion 411 disposed in a first region 312a and a second heat-conducting portion 412 disposed in a second region 322a. The first heat-conducting portion 411 may contact the second heat-conducting portion 412 in an unfolded state. For example, the first heat-conducting portion 411 may be disposed in the unfolded state at the end of the first region 312a facing the second region 322a. The second heat-conducting portion 412 may be disposed in the unfolded state at the end of the second region 322a facing the first region 312a. For example, the first heat-conducting portion 411 may receive heat from at least one electronic component 301. Because the first heat-conducting portion 411 contacts the second heat-conducting portion 412 in the unfolded state, heat transferred from at least one electronic component 301 to the first heat-conducting portion 411 may be transferred to the second housing 220 through the second heat-conducting portion 412.

[0096] According to an embodiment, the first support portion 310 and the second support portion 320 may each include at least one of aluminum, thermal grease, and SMT gaskets. For example, the first thermally conductive member 410, included in the first support portion 310 and the second support portion 320 and forming the heat transfer path p, can reduce the thermal resistance between the first support portion 310 and the second support portion 320 by including at least one of thermal grease and SMT gaskets. For example, the first support portion 310 and the second support portion 320 can improve the thermal conductivity of the heat transfer path p from at least one electronic component 301 to the second housing 220 by each including aluminum. However, this is not the only possibility.

[0097] According to an embodiment, the thermal conductivity c1 of the first support portion 310 and the thermal conductivity c2 of the second support portion 320 can be greater than the thermal conductivity c3 of the hinge structure 250. Because the thermal conductivity c1 of the first support portion 310 and the thermal conductivity c2 of the second support portion 320 are higher than the thermal conductivity c3 of the hinge structure 250, the electronic device 101 can improve the thermal conductivity of the heat transfer path p formed by the first support portion 310 and the second support portion 320 in the deployed state. For example, the first support portion 310 and the second support portion 320 can form a heat transfer path p from at least one electronic component 301 to the second housing 220 by contacting each other above the hinge structure 250. The first support portion 310 and the second support portion 320 can improve the thermal conductivity of the heat transfer path p by directly contacting each other without passing through the hinge structure 250.

[0098] According to an embodiment, the electronic device 101 may include a vapor chamber 420 in a first housing 210, the vapor chamber 420 contacting at least one electronic component 301 and a first support portion 310, and forming a heat transfer path p by extending from at least one electronic component 301 to the first support portion 310. For example, the vapor chamber 420 may be at least partially located on at least one electronic component 301. For example, the vapor chamber 420 may be attached to at least one electronic component 301. For example, the vapor chamber 420 may provide a heat transfer path in the first housing 210 for heat transfer from at least one electronic component 301 to the first support portion 310. For example, the vapor chamber 420 may extend to a portion of the first support portion 310 that contacts a second support portion 320 in the unfolded state (e.g., a first region 312a). For example, the vapor chamber 420 may extend from at least one electronic component 301 to a folding axis f in the unfolded state. The electronic device 101 can be configured to form a heat transfer path for heat transfer from at least one electronic component 301 in the first housing 210 to said portion (e.g., first region 312a) of the first support portion 310 via a vapor chamber 420 included in the first housing 210.

[0099] According to an embodiment, the second housing 220 may include a heat dissipation member 430, which is attached to the second support portion 320 and configured to contact the vapor chamber 420 in the unfolded state. For example, the heat dissipation member 430 may cover at least a portion of the second support portion 320. For example, the heat dissipation member 430 may extend from the second support portion 320 into the interior of the second housing 220. For example, the heat dissipation member 430 may extend to the folding axis f in the unfolded state. For example, the heat dissipation member 430 may contact the vapor chamber 420 on the folding axis f in the unfolded state. The heat dissipation member 430 may dissipate heat received from the vapor chamber 420, the first support portion 310, the second support portion 320, and / or the first thermally conductive member 410 in the unfolded state into the interior of the second housing 220. The electronic device 101 may form a heat transfer path p from at least one electronic component 301 of the first housing 210 to the second housing 220 by including the heat dissipation member 430 disposed in the second housing 220.

[0100] An electronic device 101 is described and illustrated, including a vapor chamber 420 in a first housing 210 and a heat dissipation member 430 in a second housing 220, but is not limited thereto. The electronic device 101 may include at least one of a plurality of vapor chambers, a plurality of heat dissipation members, and combinations thereof, to form a heat transfer path p of heat dissipated from at least one electronic component 301 in the first housing 210. For example, unlike the illustration, the second housing 220 may include another vapor chamber distinct from the vapor chamber 420 located in the first housing 210, instead of including the heat dissipation member 430. In the deployed state, this other vapor chamber may, together with the vapor chamber 420, form the heat transfer path p from at least one electronic component 301 to the second housing 220. For example, unlike the illustration, the first housing 220 may include another heat dissipation member distinct from the heat dissipation member 430 disposed in the second housing 220, instead of including the vapor chamber 420. In the deployed state, this other heat dissipation member may, together with the heat dissipation member 430, form the heat transfer path p from at least one electronic component 301 to the second housing 220.

[0101] According to the above embodiment, since the first support portion 310 of the first housing 210 and the second support portion 320 of the second housing 220 are configured to form a heat transfer path p in the unfolded state, the electronic device 101 can be configured to dissipate at least a portion of the heat emitted from at least one electronic component 301 in the first housing 210 to the second housing 220 in the unfolded state. The electronic device 101 can reduce damage to the electronic device 101 caused by heat emitted from at least one electronic component 301 by being configured to form a heat transfer path p in the unfolded state.

[0102] Figure 5a A portion of an exemplary electronic device in a first folded state is shown. Figure 5b A portion of an exemplary electronic device in its second folded state is shown. Figure 5c A portion of an exemplary electronic device in an unfolded state is shown.

[0103] Reference Figure 5a , Figure 5b and Figure 5c The electronic device 101 may include a first housing (e.g., Figure 2a The first housing 210) and the second housing (e.g., Figure 2aThe first housing includes a first support portion 310, and the second housing includes a second support portion 320 facing the first support portion 310. Electronic device 101 may include at least one electronic component 301 within the first housing 210. Electronic device 101 may include a hinge structure 250 configured to provide an unfolded state and multiple folded states of the second housing 220 folded relative to the first housing 210 about a folding axis f by rotatably connecting the first support portion 310 and the second support portion 320. The first support portion 310 may be configured to form a heat transfer path p from at least one electronic component 301 to the second housing 220 by connecting to the second support portion 320 in the unfolded state. According to an embodiment, hinge structure 250 may include a first hinge plate 331 coupled to the first housing 210, a second hinge plate 332 coupled to the second housing 220 and spaced apart from the first hinge plate 331, and a hinge cover 340 rotatably connecting the first hinge plate 331 and the second hinge plate 332.

[0104] In the following text, the pair having the same characteristics will be omitted. Figure 4a and Figure 4b Redundant description of the configuration of the same reference numerals described in the figures.

[0105] According to an embodiment, the second part 312 can contact the fourth part 322 on the folding axis f in the unfolded state. The second part 312 can be disconnected from the fourth part 322 by being spaced apart from it in multiple folded states.

[0106] Reference Figure 5a and Figure 5b The first support portion 310 can be disconnected from the second support portion 320 in multiple folded states, including a first folded state and a second folded state. While changing from the first folded state to the second folded state, the first hinge plate 331 can rotate relative to the hinge cover 340. The first support portion 310 can slide relative to the first hinge plate 331 toward the folding axis f by moving along the first hinge plate 331, which rotates relative to the hinge cover 340. At least one electronic component 301 in the first housing 210 can rotate along the first support portion 310, which moves relative to the hinge structure 250. While changing from the first folded state to the second folded state, the second hinge plate 332 can rotate relative to the hinge cover 340. The second support portion 320 can slide relative to the second hinge plate 332, which rotates relative to the hinge cover 340, toward the folding axis f by moving along the second hinge plate 332, which rotates relative to the hinge cover 340.

[0107] Reference Figure 5b and Figure 5cAs the device changes from a second folded state to an unfolded state, the first support portion 310 can move toward the second support portion 320 by sliding relative to the first hinge plate 331 toward the folding axis f. The second support portion 320 can move toward the first support portion 310 by sliding relative to the second hinge plate 332 toward the folding axis f. In the unfolded state, the first support portion 310 and the second support portion 320 can form a heat transfer path p from at least one electronic component 301 to the second housing 220 by contacting each other on the folding axis f. The first hinge plate 331 and the second hinge plate 332 can be spaced apart by a first protruding structure 341 of the hinge cover 340.

[0108] According to an embodiment, the first support portion 310 and the second support portion 320 may each include a first heat-conducting member 410. The first heat-conducting member 410 may be disposed at the portion of the first support portion 310 that contacts the second support portion 320 and at the portion of the second support portion 320 that contacts the first support portion 310. Since the first heat-conducting member 410 is deformable, it can prevent damage to the first support portion 310 and the second support portion 320 when they collide with each other during the transition from a second folded state to an unfolded state.

[0109] According to the above embodiments, by including a first support portion 310 and a second support portion 320 configured to form a heat transfer path p from at least one electronic component 301 to the second housing 220 in the unfolded state, the electronic device 101 can reduce damage to the electronic device 101 caused by heat dissipated from at least one electronic component 301. The first support portion 310 and the second support portion 320 can each reduce damage to the first support portion 310 and the second support portion 320 and improve the thermal conductivity of the heat transfer path p by each including a first thermally conductive member 410 disposed at a position where the first support portion 310 and the second support portion 320 contact each other.

[0110] Figure 6 A portion of an exemplary electronic device in an unfolded state is shown.

[0111] Reference Figure 6 The electronic device 101 may include a first housing (e.g., Figure 2a The first housing 210) and the second housing (e.g., Figure 2aThe first housing includes a first support portion 310, and the second housing includes a second support portion 320 facing the first support portion 310. Electronic device 101 may include at least one electronic component 301 within the first housing 210. Electronic device 101 may include a hinge structure 250 configured to provide an unfolded state and multiple folded states of the second housing 220 folded relative to the first housing 210 about a folding axis f by rotatably connecting the first support portion 310 and the second support portion 320. The first support portion 310 may be configured to form a heat transfer path p from at least one electronic component 301 to the second housing 220 by connecting to the second support portion 320 in the unfolded state. According to an embodiment, hinge structure 250 may include a first hinge plate 331 coupled to the first housing 210, a second hinge plate 332 coupled to the second housing 220 and spaced apart from the first hinge plate 331, and a hinge cover 340 rotatably connecting the first hinge plate 331 and the second hinge plate 332.

[0112] According to an embodiment, the hinge cover 340 may include a second protruding structure 610 separating a first support portion 310 and a second support portion 320. The first support portion 310 and the second support portion 320 may be configured to form a heat transfer path p through the second protruding structure 610 by contacting it in the unfolded state. For example, the second protruding structure 610 may extend from a first protruding structure 341 separating a first hinge plate 331 and a second hinge plate 332. The second protruding structure 610 may extend along a folding axis f. The second protruding structure 610 may provide the folding axis f together with the first protruding structure 341.

[0113] For example, the first support portion 310 may include a first portion 311 connected to the first hinge plate 331 and a second portion 312 extending from the first portion 311. The second portion 312 may include a first region 312a that contacts the second protruding structure 610 in the deployed state. The second support portion 320 may include a third portion 321 connected to the second hinge plate 332 and a fourth portion 322 extending from the third portion 321. The fourth portion 322 may include a second region 322a that contacts the second protruding structure 610 in the deployed state. The second protruding structure 610 may separate the first region 312a and the second region 322a from each other in the deployed state. The protruding structure 610 may be a structure required to improve the thermal conductivity of the heat transfer path p formed by the first region 312a and the second region 322a in the deployed state.

[0114] According to an embodiment, the second protruding structure 610 may include a deformable second heat-conducting member 612 that contacts the first support portion 310 and the second support portion 320 in an unfolded state. For example, the second protruding structure 610 may include a partition wall 611 and a second heat-conducting member 612 attached to the partition wall 611. The second heat-conducting member 612 may contact the first support portion 310 and the second support portion 320 in an unfolded state. For example, the second heat-conducting member 612 may be positioned toward the first support portion 310 and the second support portion 320 in both an unfolded state and multiple folded states. For example, the hinge cover 340 may include a first mounting groove 621 and a second mounting groove 622 extending from the partition wall 611. A first region 312a of the first support portion 310 may rotate within the first mounting groove 621. A second region 322a of the second support portion 320 may rotate within the second mounting groove 622. The second heat-conducting member 612 may contact the first region 312a and the second region 322a in an unfolded state by being located in at least a portion of the inner surface of the first mounting groove 621 and the inner surface of the second mounting groove 622. The second protruding structure 610 can improve the thermal conductivity of the heat transfer path p formed by the first support portion 310, the second support portion 320, and the second protruding structure 610 by including a second thermally conductive member 612. According to an embodiment, the second thermally conductive member 612 is deformable, and when the first support portion 310 and / or the second support portion 320 collides with the partition wall 611 during a change from a folded state to an unfolded state, the second thermally conductive member 612 can reduce damage to the first support portion 310 and / or the second support portion 320.

[0115] According to an embodiment, the second heat-conducting member 612 may include a third heat-conducting portion 612a that contacts the first region 312a in the unfolded state and a fourth heat-conducting portion 612b that contacts the second region 322a in the unfolded state. For example, the third heat-conducting portion 612a and the fourth heat-conducting portion 612b may be attached to a partition wall 611. The third heat-conducting portion 612a and the fourth heat-conducting portion 612b may be separated from each other with respect to the partition wall 611. For example, the third heat-conducting portion 612a may extend from a first mounting groove 621 for the first region 312a. The fourth heat-conducting portion 612b may extend from a second mounting groove 622 for the second region 322a. For example, the first region 312a may receive heat from at least one electronic component 301 in the unfolded state. In the unfolded state, heat transferred from at least one electronic component 301 to the first region 312a can be transferred to the second housing 220 through the third heat-conducting part 612a in contact with the first region 312a, the hinge cover 340 (or partition wall 611), the fourth heat-conducting part 612b, and the second region 322a in contact with the fourth heat-conducting part 612b. The first region 312a, the third heat-conducting part 612a, the partition wall 611, the fourth heat-conducting part 612b, and the second region 322a can form a heat transfer path p for heat.

[0116] The second thermally conductive member 612 is described and illustrated, including, but not limited to, a third thermally conductive portion 612a and a fourth thermally conductive portion 612b separated from each other with respect to the partition wall 611. Unlike the illustration, the second thermally conductive member 612 may cover the partition wall 611. For example, the second thermally conductive member 612 may include a third thermally conductive portion 612a in the deployed state that contacts a first region 312a, a fourth thermally conductive portion 612b in the deployed state that contacts a second region 322a, and another thermally conductive portion extending from the third thermally conductive portion 612a to the fourth thermally conductive portion 612b and attached to the partition wall 611. The second thermally conductive member 612 can improve the thermal conductivity of the heat transfer path p from at least one electronic component 301 to the second housing 220 by covering the partition wall 611.

[0117] According to the above embodiments, by including a second protruding structure 610 that forms a heat transfer path p from at least one electronic component 301 to the second housing 220 together with the first support portion 310 and the second support portion 320, the hinge structure 250 can reduce the damage to the electronic device 101 caused by heat dissipated from at least one electronic component 301. The second protruding structure 610 can improve the thermal conductivity of the heat transfer path p by including a second thermally conductive member 612 that contacts the first support portion 310 and the second support portion 320 in the deployed state.

[0118] Figure 7a A portion of an exemplary electronic device in a first folded state is shown. Figure 7b A portion of an exemplary electronic device in an unfolded state is shown. Figure 7c This is a top plan view of the support structure of an exemplary electronic device.

[0119] Reference Figure 7a and Figure 7b The electronic device 101 may include a first housing (e.g., Figure 2a The first housing 210) and the second housing (e.g., Figure 2aThe first housing includes a first support portion 310, and the second housing includes a second support portion 320 facing the first support portion 310. Electronic device 101 may include at least one electronic component 301 within the first housing 210. Electronic device 101 may include a hinge structure 250 configured to provide an unfolded state and multiple folded states of the second housing 220 folded relative to the first housing 210 about a folding axis f by rotatably connecting the first support portion 310 and the second support portion 320. The first support portion 310 may be configured to form a heat transfer path p from at least one electronic component 301 to the second housing 220 by connecting to the second support portion 320 in the unfolded state. According to an embodiment, hinge structure 250 may include a first hinge plate 331 coupled to the first housing 210, a second hinge plate 332 coupled to the second housing 220 and spaced apart from the first hinge plate 331, and a hinge cover 340 rotatably connecting the first hinge plate 331 and the second hinge plate 332.

[0120] According to an embodiment, the electronic device 101 may include a support structure 710 that contacts a first support portion 310 and a second support portion 320 and includes a protrusion 710a that separates the first support portion 310 and the second support portion 320 in an unfolded state. The protrusion 710a may be configured to be pressed by the first support portion 310 in a first direction 701 perpendicular to the folding axis f and by the second support portion 320 in a second direction 702 perpendicular to the folding axis f and opposite to the first direction 701 in the unfolded state.

[0121] For example, the support structure 710 may be disposed on the hinge cover 340. For example, the thermal conductivity of the support structure 710 may be greater than the thermal conductivity of the first support portion 310 and the second support portion 320. For example, the support structure 710 may be deformable. For example, the support structure 710 may contact the first support portion 310 and the second support portion 320 in an unfolded state and in multiple folded states. For example, the support structure 710 may be located on a folding axis f. For example, the support structure 710 may be configured to form a heat transfer path p from at least one electronic component 301 to the second housing 220 by contacting the first support portion 310 and the second support portion 320 in the unfolded state.

[0122] For example, a protrusion 710a may be disposed between the first support portion 310 and the second support portion 320. For example, when changing from a folded state to an unfolded state, the protrusion 710a may be pressed by the first support portion 310, which moves along the first hinge plate 331, in a first direction 701. When changing from a folded state to an unfolded state, the protrusion 710a may be pressed by the second support portion 320, which moves along the second hinge plate 332, in a second direction 702 opposite to the first direction 701. For example, the protrusion 710a may be pressed by the first region 312a of the first support portion 310 contacting the support structure 710 in the first direction 701. The protrusion 710a may be pressed by the second region 322a of the second support portion 320 contacting the support structure 710 in the second direction 702 opposite to the first direction 701. As the protrusion 710a is pressed, a gap may be formed between the support structure 710 and the first support portion 310, or a gap may be formed between the support structure 710 and the second support portion 320. As gaps are formed between support portions 310 and 320, the thermal conductivity of the heat transfer path p decreases. Support structure 710 may be required to reduce these gaps in order to improve the thermal conductivity of the heat transfer path p.

[0123] According to an embodiment, the support structure 710 may include a first support member 711, a second support member 712, and an elastic structure 713. The first support member 711 may include a first fastening portion 711a having a serrated shape. The second fastening portion 712a may include a second fastening portion 712a having a serrated shape corresponding to the shape of the first fastening portion 711a to fasten to the first fastening portion 711a. The elastic structure 713 may include a first elastic member 713a and a second elastic member 713b, the first elastic member 713a pressing the first support member 711 in a third direction 703 parallel to the folding axis f, and the second elastic member 713b pressing the second support member 712 in a fourth direction 704 parallel to the folding axis f and opposite to the third direction 703. The protrusion 710a can be configured to press the first support portion 310 and the second support portion 320 in the unfolded state by means of the elastic structure 713 in a direction inclined relative to the first direction 701 and the third direction 703 and / or in a direction inclined relative to the second direction 702 and the fourth direction 704.

[0124] For example, the first support member 711 may be at least partially disposed between the hinged cover 340 and the first support portion 310. For example, the first support member 711 may contact a first region 312a of the first support portion 310. For example, the thermal conductivity of the first support member 711 may be higher than that of the first support portion 310. For example, the first support member 711 may be deformable and elastic. For example, the first fastening portion 711a may form at least a portion of the protrusion 710a. For example, the first fastening portion 711a may be the portion of the first support member 711 that contacts the second support member 712.

[0125] For example, the second support member 712 may be at least partially disposed between the hinge cover 340 and the second support portion 320. For example, the second support member 712 may contact a second region 322a of the second support portion 320. For example, the thermal conductivity of the second support member 712 may be higher than that of the second support portion 320. For example, the second support member 712 may be deformable and elastic. For example, the second fastening portion 712a may form a protrusion 710a together with the first fastening portion 711a. For example, the second fastening portion 712a may fasten the second support member 712 to the first support member 711 by fastening it to the first fastening portion 712a.

[0126] For example, the elastic structure 713 can press the first support member 711 and the second support member 712 in a direction parallel to the folding axis f to maintain the fastening between the first support member 711 and the second support member 712. For example, the first elastic member 713a can be provided on a side surface of the support structure 710. The first elastic member 713a can press the protrusion 710a in a third direction 703 parallel to the folding axis f. The second elastic member 713b can be provided on a side surface opposite to the side surface of the support structure 710. The second elastic member 713b can press the protrusion 710a in a fourth direction 704 parallel to the folding axis f and opposite to the third direction 703.

[0127] For example, when changing from multiple folded states to an unfolded state, the first support member 711 can be pressed by the first support portion 310 in a first direction 701. The second support member 712 can be pressed by the second support portion 320 in a second direction 702 opposite to the first direction 701. The elastic structure 713 can press the first support member 711 and the second support member 712 in directions perpendicular to the first direction 701 and the second direction 702 (e.g., a third direction 703 and a fourth direction 704). Through the serrated shape of the first fastening portion 711a and the second fastening portion 712a, the protrusion 710a pressed by the elastic structure 713 can press the support portions 310 and 320 in a direction inclined relative to the first direction 701 and the third direction 703. For example, the first support member 711 and the second support member 712 of the support structure 710 can each be elastic. The support structure 710 can be displaced toward the first support portion 310 by the first support member 711 pressed by the elastic structure 713. The support structure 710 can be displaced toward the second support portion 320 by the second support member 712 pressed by the elastic structure 713. The support structure 710 can reduce the formation of gaps between itself and the support portions 310 and 320 by generating displacements toward the support portions 310 and 320 respectively in directions inclined relative to the first direction 701 and the third direction 703. By reducing the formation of gaps, the support structure 710 can improve the thermal conductivity of the heat transfer path p formed by the support structure 710 and the support portions 310 and 320.

[0128] According to the above embodiments, by including a support structure 710 that forms a heat transfer path p from at least one electronic component 301 to the second housing 220 together with support portions 310 and 320, the electronic device 101 can reduce damage to the electronic device 101 caused by heat generated from at least one electronic component 301. The support structure 710 can improve the thermal conductivity of the heat transfer path p by being configured to press the support portions 310 and 320 in a direction inclined relative to a first direction 701 perpendicular to the folding axis f and a third direction 703 parallel to the folding axis f in the unfolded state.

[0129] Figure 8a A portion of an exemplary electronic device in a first folded state is shown. Figure 8b A portion of an exemplary electronic device in an unfolded state is shown. Figure 8c This is a partial exploded perspective view of an exemplary electronic device.

[0130] Reference Figure 8a and Figure 8b The electronic device 101 may include a first housing (e.g., Figure 2a The first housing 210) and the second housing (e.g., Figure 2aThe first housing includes a first support portion 310, and the second housing includes a second support portion 320 facing the first support portion 310. Electronic device 101 may include at least one electronic component 301 within the first housing 210. Electronic device 101 may include a hinge structure 250 configured to provide an unfolded state and multiple folded states of the second housing 220 folded relative to the first housing 210 about a folding axis f by rotatably connecting the first support portion 310 and the second support portion 320. The first support portion 310 may be configured to form a heat transfer path p from at least one electronic component 301 to the second housing 220 by connecting to the second support portion 320 in the unfolded state. According to an embodiment, hinge structure 250 may include a first hinge plate 331 coupled to the first housing 210, a second hinge plate 332 coupled to the second housing 220 and spaced apart from the first hinge plate 331, and a hinge cover 340 rotatably connecting the first hinge plate 331 and the second hinge plate 332.

[0131] According to an embodiment, a first hinge plate 331 may be coupled to a first support portion 310. A second hinge plate 332 may be coupled to a second support portion 320. A hinge cover 340 may include a first protruding structure 341 on a folding axis f that separates the first hinge plate 331 and the second hinge plate 332. The electronic device 101 may include a third thermally conductive member 810 attached to the first hinge plate 331 and the second hinge plate 332 and in contact with the first protruding structure 341. For example, the third thermally conductive member 810 may cover at least a portion of the first hinge plate 331 and at least a portion of the second hinge plate 332. For example, the thermal conductivity of the third thermally conductive member 810 may be greater than the thermal conductivity of the first hinge plate 331 and the second hinge plate 332. For example, the third thermally conductive member 810 may be attached to the first hinge plate 331 facing the display (e.g., Figure 2a The third heat-conducting member 810 is located on the surface 330a of the display 230 and the surface 330b of the second hinge plate 332 facing the display 230. For example, the third heat-conducting member 810 may form a heat transfer path p from at least one electronic component 301 in the first housing 210 to the second housing 220 together with the first protruding structure 341 of the first hinge plate 331, the second hinge plate 332, and the hinge cover 340. For example, at least a portion of the heat dissipated from at least one electronic component 301 may be transferred to the third heat-conducting member 810 through the first support portion 310 and the first hinge plate 331 connected to the first support portion 310. The heat transferred to the third heat-conducting member 810 may be transferred to the interior of the second housing 220 through the hinge cover 340 and the second hinge plate 332.

[0132] According to an embodiment, the third heat-conducting member 810 may include a fifth heat-conducting portion 811 attached to the first hinge plate 331 and a sixth heat-conducting portion 812 attached to the second hinge plate 332. The fifth heat-conducting portion 811 and the sixth heat-conducting portion 812 may contact the first protruding structure 341 of the hinge cover 340 in the unfolded state. For example, the fifth heat-conducting portion 811 and the sixth heat-conducting portion 812 may be separated from each other with respect to the first protruding structure 341. For example, the fifth heat-conducting portion 811 may receive heat from at least one electronic component 301. In the unfolded state, heat transferred from at least one electronic component 301 to the fifth heat-conducting portion 811 may be transferred to the second housing 220 through the hinge cover 340 (or the first protruding structure 341) contacting the fifth heat-conducting portion 811 and the sixth heat-conducting portion 812 contacting the hinge cover 340. The fifth heat-conducting portion 811, the hinge cover 340, and the sixth heat-conducting portion 812 may form a heat transfer path p for heat.

[0133] According to an embodiment, the electronic device 101 may include a fourth thermally conductive member 820, which is spaced apart from the first hinge plate 331 and the second hinge plate 332 and attached to the hinge cover 340 along the folding axis f. For example, the hinge cover 340 may include a groove 340a for receiving the fourth thermally conductive member 820. The groove 340a may be formed in a direction opposite to the direction toward the display 230. The fourth thermally conductive member 820 may be attached in the groove 340a. For example, the thermal conductivity of the fourth thermally conductive member 820 may be greater than that of the hinge cover 340. The electronic device 101 can improve the thermal conductivity of the heat transfer path p formed by the first hinge plate 331, the second hinge plate 332, and the hinge cover 340 by including the fourth thermally conductive member 820.

[0134] According to the above embodiments, by including a third heat-conducting member 810 and a fourth heat-conducting member 820 attached to the hinge structure 250, the electronic device 101 can improve the thermal conductivity of the heat transfer path p formed by the hinge structure 250 from at least one electronic component 301 to the second housing 220.

[0135] According to the above embodiments, electronic devices (e.g., Figure 1 The electronic device 101 may include: a display (e.g., Figure 2a The display 230); the first housing (e.g., Figure 2a The first housing 210 includes a first support portion for supporting the display (e.g., Figure 3 The first support portion 310); and the second housing (e.g., Figure 2a The second housing 220 includes a second support portion for supporting the display (e.g., Figure 3 The second support portion 320). The electronic device may include at least one electronic component disposed in the first housing (e.g., Figure 3 At least one electronic component 301). The electronic device may include a hinge structure configured to rotatably connect the first housing and the second housing (e.g., Figure 2b The hinge structure 250). The first support portion and the second support portion can be configured to form a heat transfer path from the at least one electronic component to the second housing by connecting them to each other in the deployed state of the electronic device (e.g., the hinge structure 250). Figure 4a The heat transfer path p). According to the above embodiment, by including a first support portion that forms a heat transfer path together with the second support portion in the unfolded state, the electronic device can reduce damage to the electronic device caused by the at least one electronic component. The above embodiment can have various effects including the effects described above.

[0136] According to an embodiment, the hinge structure may include a first hinge plate (e.g., connected to the first housing) Figure 3 The first hinge plate 331) and the second hinge plate (e.g., connected to the second housing and spaced apart from the first hinge plate) Figure 3 The second hinge plate 332). The first support portion can be in the first part of the first support portion (e.g., Figure 4b The first portion 311 is slidably connected to the first hinge plate and may include a second portion extending from the first portion along the folding axis (e.g., Figure 4b The second support portion can be in the third part of the second support portion (e.g., Figure 4b The third part 321 is slidably connected to the second hinge plate and may include a fourth part (e.g., extending from the third part along the folding axis) Figure 4b (Part 322). A heat transfer path can be formed by bringing the second and fourth parts into contact in the unfolded state. According to the above embodiment, by including the fourth part that contacts the second part in the unfolded state, the electronic device can reduce damage to the electronic device from the at least one electronic component. The above embodiment can have various effects including the effects described above.

[0137] According to an embodiment, the hinge structure may further include a hinge cover (e.g., Figure 4a The hinge cover 340). The second part may include a first area (e.g., in the unfolded state, disposed between the hinge cover and the display). Figure 4b The first region 312a). The fourth part may include the second region (e.g., Figure 4b The second region 322a), in the unfolded state, is disposed between the hinge cover and the display and is connected via at least one deformable heat-conducting member (e.g., Figure 4a The first thermally conductive component 410 and / or Figure 6The second heat-conducting member 612 contacts the first region. For example, the first region and the second region may each include a deformable first heat-conducting member (e.g., Figure 4a (First heat-conducting member 410). According to the above embodiment, by including the first heat-conducting member, the electronic device can improve the heat conduction efficiency of the heat transfer path and reduce damage to the first and second support portions in the deployed state. The above embodiment can have various effects including the above-described effects.

[0138] According to an embodiment, the second part can contact at least a portion of the hinge cover in the unfolded state. The second part can be disconnected from the fourth part by being spaced apart from it in multiple folded states. According to the above embodiment, by including the fourth part that contacts the second part in the unfolded state, the electronic device can reduce damage to the electronic device caused by the at least one electronic component. The above embodiments can have various effects including those described above.

[0139] According to an embodiment, the at least one heat-conducting member may be disposed at the end of at least one of the first region or the second region.

[0140] According to an embodiment, the at least one heat-conducting member may be disposed on a portion of the hinge cover.

[0141] According to an embodiment, the hinge structure may include a hinge cover, the hinge cover including a protruding structure separating a first support portion and a second support portion (e.g., Figure 6 The second protruding structure 610). The first support portion and the second support portion can be configured to form a heat transfer path through the protruding structure by contacting it in the deployed state. According to the above embodiment, the first support portion and the second support portion can reduce damage to the electronic device by the at least one electronic component by contacting the protruding structure in the deployed state. The above embodiment can have various effects including the effects described above.

[0142] According to an embodiment, the protruding structure may further include a deformable second thermally conductive member (e.g., in the unfolded state, contacting the first and second support portions) Figure 6 (Second heat-conducting component 612). According to the above embodiment, by including the second heat-conducting component, the electronic device can improve the heat conduction efficiency of the heat transfer path. The above embodiment can have various effects including the effects described above.

[0143] According to embodiments, the electronic device may further include a support structure (e.g., Figure 7a The support structure 710), the support structure contacts the first support portion and the second support portion and includes a protrusion (e.g., in the deployed state) that separates the first support portion and the second support portion. Figure 7aThe protrusion 710a). The protrusion can be configured such that, in the unfolded state, it is supported by a first support portion in a first direction perpendicular to the folding axis (e.g., Figure 7b Pressed on the first direction 701) and supported by the second support portion in a second direction perpendicular to the folding axis and opposite to the first direction (e.g., Figure 7b Pressing on the second direction 702). According to the above embodiment, by including a support structure, the electronic device can improve the thermal conductivity of the heat transfer path. The above embodiment can have various effects including the effects described above.

[0144] According to an embodiment, the support structure may include a first support member (e.g., Figure 7b The first support member 711), the first support member includes a first fastening portion having a serrated shape (e.g., Figure 7b The first fastening portion 711a). The support structure may include a second support member (e.g., Figure 7b The second support member 712 includes a second fastening portion having a serrated shape corresponding to the shape of the first fastening portion for fastening to the first fastening portion (e.g., a second fastening portion). Figure 7b The second fastening portion 712a). The support structure may include an elastic structure (e.g., Figure 7b The elastic structure 713 includes a third direction parallel to the folding axis (e.g., Figure 7b A third party presses the first elastic member (e.g., on the first support member) onto the first support member (703). Figure 7b The first elastic member 713a) and in a fourth direction parallel to the folding axis and opposite to the third direction (e.g., Figure 7b The second elastic member (e.g., pressing the second support member on the fourth direction 704) Figure 7b The second elastic member 713b). The protrusion can be configured such that, in the deployed state, the elastic structure presses against the first and second support portions in a direction inclined relative to the first and third directions. According to the above embodiment, by including the support structure, the electronic device can improve the thermal conductivity of the heat transfer path. The above embodiment can have various effects including the effects described above.

[0145] According to an embodiment, the hinge structure may include a first hinge plate coupled to a first support portion and a second hinge plate coupled to a second support portion. The hinge structure may include a hinge cover that rotatably connects the first and second hinge plates and includes a protruding structure on the folding axis separating the first and second hinge plates (e.g., Figure 4b The first protruding structure 341). The electronic device may further include a third thermally conductive member (e.g., attached to the first hinge plate and the second hinge plate and in contact with the protruding structure) Figure 8a(The third heat-conducting component 810). According to the above embodiment, by including the third heat-conducting component, the electronic device can improve the heat conduction efficiency of the heat transfer path. The above embodiment can have various effects including the effects described above.

[0146] According to an embodiment, the electronic device may further include a fourth heat-conducting member (e.g., spaced apart from the first hinge plate and the second hinge plate and attached to the hinge cover along the folding axis). Figure 8a (The fourth heat-conducting component 820). According to the above embodiment, by including the fourth heat-conducting component, the electronic device can improve the heat conduction efficiency of the heat transfer path. The above embodiment can have various effects including the effects described above.

[0147] According to an embodiment, the display may include a first display area coupled to a first housing (e.g., Figure 2a The first display area 231), and the second display area connected to the second housing (e.g., Figure 2a The second display area 232) and a deformable third display area extending from the first display area to the second display area (e.g., Figure 2a (The third display area 233). According to the above embodiments, by including a display containing a deformable third area, the electronic device can provide a variety of user experiences to the user. The above embodiments can have various effects including the effects described above.

[0148] According to an embodiment, the electronic device may further include a vapor chamber (e.g., in the first housing) Figure 4a The vapor chamber 420 contacts the at least one electronic component and the first support portion, and forms a heat transfer path by extending from the at least one electronic component to the first support portion. According to the above embodiment, by including the vapor chamber, the electronic device can form a heat transfer path within the first housing. The above embodiment can have various effects including those described above.

[0149] According to an embodiment, the second housing may further include a heat dissipation component (e.g., Figure 4a The heat dissipation component 430 is attached to the second support portion and configured to contact the vapor chamber in the deployed state. According to the above embodiment, by including the heat dissipation component, the electronic device can form a heat transfer path within the second housing. The above embodiment can have various effects including those described above.

[0150] According to embodiments, the first support portion and the second support portion may each include at least one of aluminum, thermal grease, and SMT gaskets. According to the above embodiments, the first support portion and the second support portion can improve the thermal conductivity of the heat transfer path by including components with relatively high thermal conductivity. The above embodiments can have various effects including those described above.

[0151] According to an embodiment, the thermal conductivity of the first support portion (e.g., Figure 4b The thermal conductivity of the second support portion (e.g., c1) and the thermal conductivity of the second support portion (e.g., Figure 4b The thermal conductivity (c2) can be greater than that of the hinge structure (e.g., Figure 4b (c3). According to the above embodiment, since the thermal conductivity of the first support portion and the thermal conductivity of the second support portion are greater than the thermal conductivity of the hinge structure, the thermal conductivity efficiency of the heat transfer path is improved. The above embodiment can have various effects including the above-described effects.

[0152] According to embodiments, the electronic device may include a first housing and a second housing, the first housing including a first support portion, and the second housing including a second support portion facing the first support portion. The electronic device may include a flexible display, including a first display area coupled to the first housing, a second display area coupled to the second housing, and a deformable third display area extending from the first display area to the second display area. The electronic device may include at least one electronic component in the first housing. The electronic device may include a vapor chamber in the first housing, the vapor chamber contacting the at least one electronic component and the first support portion and extending from the at least one electronic component to the first support portion. The electronic device may include a hinge structure configured to provide an unfolded state and multiple folded states of the second housing folded relative to the first housing about a folding axis by rotatably connecting the first and second support portions. The first support portion may be configured to form a heat transfer path from the at least one electronic component through the vapor chamber to the second housing by connecting with the second support portion in the unfolded state. According to the above embodiments, by including a first support portion that forms a heat transfer path together with the second support portion in the unfolded state, the electronic device can reduce damage to the electronic device from the at least one electronic component. By including a display containing a deformable third area, the electronic device can provide a variety of user experiences. The above embodiments can have various effects, including the effects described above.

[0153] According to an embodiment, the hinge structure may include a first hinge plate coupled to a first housing and a second hinge plate coupled to a second housing and spaced apart from the first hinge plate. A first support portion may be slidably coupled to the first hinge plate and may include a first portion supporting the first hinge plate and a second portion extending from the first portion along a folding axis. A second support portion may be slidably coupled to the second hinge plate and may include a third portion supporting the second hinge plate and a fourth portion extending from the third portion along a folding axis. The second portion may be configured to form a heat transfer path by contacting the fourth portion in the unfolded state. According to the above embodiment, by including a fourth portion that contacts the second portion in the unfolded state, the electronic device can reduce damage to the electronic device from the at least one electronic component. The above embodiments may have various effects including the effects described above.

[0154] According to an embodiment, the hinge structure may include a hinge cover, which includes a protruding structure separating a first support portion and a second support portion. The first and second support portions may be configured to form a heat transfer path through the protruding structure by contacting it in the deployed state. According to the above embodiment, the first and second support portions can reduce damage to the electronic device from the at least one electronic component by contacting the protruding structure in the deployed state. The above embodiments may have various effects including those described above.

[0155] According to an embodiment, the electronic device may further include a support structure that contacts a first support portion and a second support portion and includes a protrusion that separates the first and second support portions in the unfolded state. The protrusion may be configured to be pressed by the first support portion in a first direction perpendicular to the folding axis and by the second support portion in a second direction perpendicular to the folding axis and opposite to the first direction in the unfolded state. According to the above embodiment, by including the support structure, the electronic device can improve the thermal conductivity of the heat transfer path. The above embodiment can have various effects including the aforementioned benefits.

[0156] According to an embodiment, the support structure may include a first support member, which includes a first fastening portion having a serrated shape. The support structure may also include a second support member, which includes a second fastening portion having a serrated shape corresponding to the shape of the first fastening portion for fastening to the first fastening portion. The support structure may include an elastic structure comprising a first elastic member pressing the first support member in a third direction parallel to the folding axis and a second elastic member pressing the second support member in a fourth direction parallel to the folding axis and opposite to the third direction. The protrusion may be configured to press the first and second support portions in a direction inclined relative to the first and third directions by the elastic structure in the unfolded state. According to the above embodiments, by including the support structure, the electronic device can improve the thermal conductivity of the heat transfer path. The above embodiments can have various effects including the effects described above.

[0157] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0158] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase in the phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether or not the terms “operational ground” or “communication ground” are used, if an element (e.g., a first element) is referred to as being “less” or “connected” to another element (e.g., a second element) than to another element (e.g., a second element), it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0159] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0160] The various embodiments set forth herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without one or more other components. This allows the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between cases where data is stored semi-permanently in the storage medium and cases where data is temporarily stored in the storage medium.

[0161] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0162] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device (101), comprising: Display (230); The first housing (210) includes a first support portion (310) for supporting the display (230). The second housing (220) includes a second support portion (320) for supporting the display (230); At least one electronic component (301) is disposed in the first housing (210); as well as A hinge structure (250) is configured to rotatably connect the first housing (210) and the second housing (220). The first support portion (310) and the second support portion (320) are configured to provide a heat transfer path (p) from the at least one electronic component (301) to the second housing (220) by connecting to each other in the deployed state of the electronic device (101).

2. The electronic device (101) according to claim 1. in, The hinge structure (250) includes: The first hinge plate (252, 331) is connected to the first housing (210); and The second hinge plate (253, 332) is connected to the second housing (220) and spaced apart from the first hinge plate (252, 331); The first support portion (310) is slidably connected to the first hinge plate (252, 331) at a first portion (311) of the first support portion (310), and includes a second portion (312) extending from the first portion (311) along the folding axis (f). The second support portion (320) is slidably connected to the second hinge plate (253, 332) at the third portion (321) of the second support portion (320), and includes a fourth portion (322) extending from the third portion (321) along the folding axis (f), and The heat transfer path (p) is formed by bringing the second part (312) and the fourth part (322) into contact in the unfolded state.

3. The electronic device (101) according to claim 1 or claim 2. in, The hinge structure (250) further includes hinge covers (251, 340). The second part (312) includes a first region (312a) disposed between the hinge cover (251, 340) and the display (230) in the unfolded state, and The fourth part (322) includes a second region (322a) which is disposed between the hinge cover (251, 340) and the display (230) in the unfolded state, and contacts the first region (312a) via at least one deformable heat-conducting member (410).

4. The electronic device (101) according to any one of claims 1 to 3. in, The second part (312) contacts the fourth part (322) along at least a portion of the hinge cover (251, 340) in the unfolded state and is disconnected from the fourth part (322) in multiple folded states.

5. The electronic device (101) according to any one of claims 1 to 4. in, The at least one heat-conducting member (410) is disposed at the end of at least one of the first region (312a) or the second region (322a).

6. The electronic device (101) according to any one of claims 1 to 5. in, The at least one heat-conducting member (410) is disposed on a portion of the hinge cover (251, 340).

7. The electronic device (101) according to any one of claims 1 to 6, further comprising: The support structure (710) contacts the first support portion (310) and the second support portion (320), and includes a protrusion (710a) that separates the first support portion (310) and the second support portion (320) in the unfolded state. The protrusion (710a) is configured to be pressed by the first support portion (310) in a first direction (701) perpendicular to the folding axis (f) in the unfolded state and by the second support portion (320) in a second direction (702) perpendicular to the folding axis (f) and opposite to the first direction (701).

8. The electronic device (101) according to any one of claims 1 to 7. in, The support structure (710) includes: The first support member (711) includes a first fastening portion (711a) having a serrated shape. The second support member (712) includes a second fastening portion (712a) having a serrated shape corresponding to the shape of the first fastening portion (711a) for fastening to the first fastening portion (711a); and The elastic structure (713) includes a first elastic member (713a) and a second elastic member (713b), the first elastic member (713a) pressing the first support member (711) in a third direction (703) parallel to the folding axis (f), and the second elastic member (713b) pressing the second support member (712) in a fourth direction (704) parallel to the folding axis (f) and opposite to the third direction (703); and The protrusion (710a) is configured to press the first support portion (310) and the second support portion (320) in the unfolded state by means of the elastic structure (713) in a direction inclined relative to the first direction (701) and the third direction (703).

9. The electronic device (101) according to any one of claims 1 to 8. in, The hinge structure (250) includes: The first hinge plate (252, 331) is connected to the first support portion (310); The second hinge plate (253, 332) is connected to the second support portion (320); and The hinge cover (251, 340) rotatably connects the first hinge plate (252, 331) and the second hinge plate (253, 332), and includes a protruding structure (341) on the folding axis (f) separating the first hinge plate (252, 331) and the second hinge plate (253, 332), and The electronic device (101) further includes a third thermally conductive member (810) which is attached to the first hinge plate (252, 331) and the second hinge plate (253, 332) and contacts the protruding structure (341).

10. The electronic device (101) according to any one of claims 1 to 9, further comprising: A fourth heat-conducting member (410) is spaced apart from the first hinge plate (252, 331) and the second hinge plate (253, 332) and is attached to the hinge cover (251, 340) along the folding axis (f).

11. The electronic device (101) according to any one of claims 1 to 10. in, The display (230) includes: The first display area (231) is connected to the first housing (210); The second display area (232) is connected to the second housing (220); and The third display area (233) is deformable and extends from the first display area (231) to the second display area (232).

12. The electronic device (101) according to any one of claims 1 to 11, further comprising: A vapor chamber (420) is located in the first housing (210), in contact with at least one electronic component (301) and the first support portion (310), and forms the heat transfer path (p) by extending from the at least one electronic component (301) to the first support portion (310).

13. The electronic device (101) according to any one of claims 1 to 12. in, The second housing (220) further includes a heat dissipation member (430) attached to the second support portion (320) and configured to contact the vapor chamber (420) in the deployed state.

14. The electronic device (101) according to any one of claims 1 to 13. in, The first support portion (310) and the second support portion (320) each include at least one of aluminum, thermal grease and SMT gasket.

15. The electronic device (101) according to any one of claims 1 to 14. in, The thermal conductivity (c1) of the first support portion (310) and the thermal conductivity (c2) of the second support portion (320) are greater than the thermal conductivity (c3) of the hinge structure (250).

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