Soldering tin polishing method and device, equipment, storage medium and program product

Abstract

The invention relates to the technical field of engineering control, and discloses a soldering tin polishing method and device, equipment, a storage medium and a program product. The method comprises the following steps: acquiring soldering tin allowance, a contact force error and an error change rate; the residual soldering tin is the residual soldering tin on the workpiece; determining PID update parameters by using the first interval, the second interval and the third interval according to a preset fuzzy rule database; determining operation parameters of the grinding head according to the PID updating parameters; and controlling the polishing head according to the operation parameters. Thus, in consideration of the fact that soldering tin polishing is a nonlinear change process, PID update parameters are matched through the fuzzy rule database according to the intervals where the soldering tin allowance, the contact force error and the error change rate are located, PID adjustment can be changed from linearity to nonlinearity, the method is more suitable for soldering tin polishing of a workpiece, and the over-grinding or under-grinding condition of the workpiece is reduced.

Description

Technical Field

[0001] This application relates to the field of engineering control technology, and in particular to a solder polishing method, apparatus, equipment, storage medium, and program product. Background Technology

[0002] In the precision grinding process of microelectronic components, it is necessary to ensure stable contact between the grinding head and the workpiece in order to grind off excess solder at the welded parts of the workpiece.

[0003] Related technologies use PID (Proportional-Integral-Derivative) algorithms to determine the operating parameters of the grinding head, thereby adjusting the grinding head. However, traditional PID algorithms rely on fixed parameters and are difficult to adapt to solder allowance variations of 0.1mm to 1mm, easily leading to overshoot or steady-state errors, causing over-grinding or under-grinding of the workpiece.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0006] This application provides a solder polishing method, apparatus, equipment, storage medium, and program product to reduce over-polishing or under-polishing of workpieces.

[0007] This application provides a solder polishing method applied to polishing equipment. The method includes: acquiring solder balance, contact force error, and error change rate; the solder balance is the remaining amount of solder on the workpiece; the contact force error is the error between the target contact force and the real-time contact force; the target contact force is the desired contact force between the polishing head and the workpiece; the real-time contact force is the contact force between the polishing head and the workpiece obtained by actual measurement; the error change rate is the trend of the contact force error; determining PID update parameters based on a preset fuzzy rule database using a first interval, a second interval, and a third interval; the first interval is the interval where the solder balance is located in a preset plurality of first alternative intervals; the second interval is the interval where the contact force error is located in a preset plurality of second alternative intervals; the third interval is the interval where the error change rate is located in a preset plurality of third alternative intervals; determining the operating parameters of the polishing head based on the PID update parameters; and controlling the polishing head based on the operating parameters.

[0008] In the above implementation, considering that solder polishing is a non-linear process, the PID update parameters are matched by using the intervals of solder allowance, contact force error, and error change rate through a fuzzy rule database. This can change the adjustment of the PID from linear to non-linear, making it more suitable for the solder polishing of the workpiece and reducing the over-polishing or under-polishing of the workpiece.

[0009] Furthermore, the PID update parameters include: proportional parameter correction, integral parameter correction, and derivative parameter correction. Determining the PID update parameters using a first interval, a second interval, and a third interval based on a preset fuzzy rule database includes: performing a lookup operation on the first interval, the second interval, and the third interval in the preset fuzzy rule database to obtain the proportional parameter range, integral parameter range, and derivative parameter range commonly corresponding to the first interval, the second interval, and the third interval; calculating the proportional parameter range using a preset centroid method algorithm to obtain the proportional parameter correction; calculating the integral parameter range using the centroid method algorithm to obtain the integral parameter correction; and calculating the derivative parameter range using the centroid method algorithm to obtain the derivative parameter correction. The fuzzy rule database stores the correspondence between the first interval, the second interval, the third interval, the proportional parameter range, the integral parameter range, and the derivative parameter range.

[0010] In the above implementation, by pre-storing the correspondences between various intervals of solder allowance, contact force error, error change rate, proportional parameter range, integral parameter range, and differential parameter range in a fuzzy rule database, the corresponding proportional parameter range, integral parameter range, and differential parameter range can be determined directly by searching the fuzzy rule database during use, eliminating the need to calculate the parameter range for each interval each time, thus saving time in determining various parameter ranges. Furthermore, compared to other algorithms that determine specific values ​​from intervals, the centroid method algorithm integrates all fuzzy information, resulting in high accuracy and smooth, abrupt output of the final parameter correction. Moreover, the centroid method algorithm is a linear operation, exhibiting strong real-time performance, good anti-interference effect, and good robustness.

[0011] Furthermore, the PID update parameters include: proportional parameter correction, integral parameter correction, and derivative parameter correction. Determining the grinding head's operating parameters based on the PID update parameters includes: acquiring the current proportional parameter value, current integral parameter value, and current derivative parameter value; determining a target proportional parameter value based on the current proportional parameter value and the proportional parameter correction; determining a target integral parameter value based on the current integral parameter value and the integral parameter correction; determining a target derivative parameter value based on the current derivative parameter value and the derivative parameter correction; determining a force control compensation amount using a preset positional discrete algorithm with the target proportional parameter value, the target integral parameter value, the target derivative parameter value, the contact force error, and the error change rate; and determining the grinding head's operating parameters based on the force control compensation amount.

[0012] In the above implementation, by using the positional discrete algorithm of PID control, combined with the contact force error and the error change rate, a reasonable force control compensation amount can be determined.

[0013] Furthermore, the operating parameters of the grinding head include: Z-axis feed correction amount; determining the operating parameters of the grinding head based on the force control compensation amount includes: calculating the Z-axis feed correction amount using the target contact force, the force control compensation amount, the preset preload, and the preset force displacement coupling coefficient according to a preset force displacement conversion algorithm.

[0014] In the above implementation, the force-displacement conversion algorithm can accurately convert force into corresponding displacement to determine a reasonable Z-axis feed correction amount.

[0015] Furthermore, the force-displacement coupling coefficient is determined by: performing a lookup operation on the first interval in a preset first parameter database to obtain the force-displacement coupling coefficient corresponding to the first interval; the first parameter database stores the correspondence between the first interval and the force-displacement coupling coefficient.

[0016] In the above embodiments, by employing different force-displacement coupling coefficients for different solder allowances, solder can be removed more quickly even when the solder allowance is thick. Solder can also be removed precisely when the solder allowance is thick.

[0017] Furthermore, the operating parameters of the grinding head also include: grinding head speed correction amount; determining the operating parameters of the grinding head based on the force control compensation amount further includes: obtaining a first correction amount of displacement to speed and a second correction amount of force error to speed; the first correction amount is the product of the Z-axis feed correction amount and a preset first correction coefficient; the second correction amount is the product of the contact force error, the target proportional parameter value and a preset second correction coefficient; calculating the sum of the first correction amount and the second correction amount to obtain the grinding head speed correction amount.

[0018] In the above implementation, by combining the Z-axis feed rate to determine the grinding head speed, the grinding trajectory error of the grinding head can be reduced.

[0019] Furthermore, the first correction coefficient is determined by performing a lookup operation on the first interval in a preset second parameter database to obtain the first correction coefficient corresponding to the first interval; the second parameter database stores the correspondence between the first interval and the first correction coefficient.

[0020] In the above embodiments, by using different first correction coefficients for different solder allowances, solder can be removed more quickly when the solder allowance is thick. Solder can also be removed precisely when the solder allowance is thick.

[0021] Furthermore, the grinding equipment includes: a Z-axis servo driver, a grinding head motor driver, and a grinding head; the Z-axis servo driver is used to control the Z-axis displacement of the grinding head, and the grinding head motor driver is used to control the grinding head speed; the operating parameters of the grinding head include: Z-axis feed correction amount and grinding head speed correction amount; controlling the grinding head according to the operating parameters includes: acquiring the current Z-axis feed amount and the current grinding head speed; triggering the Z-axis servo driver to run according to the target feed amount; the target feed amount is the sum of the current Z-axis feed amount and the Z-axis feed correction amount; triggering the grinding head motor driver to run the grinding head according to the target grinding head speed; the target grinding head speed is the sum of the current grinding head speed and the grinding head speed correction amount.

[0022] In the above embodiments, by making the Z-axis servo driver run according to the determined Z-axis displacement and the grinding head motor driver run according to the determined grinding head speed, the grinding head can reduce the over-grinding or under-grinding of the workpiece when grinding.

[0023] Furthermore, before determining the PID update parameters based on the first interval, second interval, and third interval, the method further includes: preprocessing the solder balance, the contact force error, and the error change rate. Correspondingly, the first interval is the interval where the preprocessed solder balance falls within a set of preset first candidate intervals; the second interval is the interval where the preprocessed contact force error falls within a set of preset second candidate intervals; and the third interval is the interval where the preprocessed error change rate falls within a set of preset third candidate intervals.

[0024] In the above embodiments, by preprocessing the solder allowance, the contact force error, and the error change rate, the first interval, the second interval, and the third interval that are subsequently matched can be more accurate, thereby improving the accuracy of the operating parameters of the grinding head that are subsequently determined.

[0025] This application provides a solder polishing device, comprising: an acquisition module for acquiring solder balance, contact force error, and error change rate; wherein the solder balance is the remaining amount of solder on the workpiece; the contact force error is the error between the target contact force and the real-time contact force; the target contact force is the desired contact force between the polishing head and the workpiece; the real-time contact force is the contact force between the polishing head and the workpiece obtained by actual measurement; and the error change rate is the trend of the contact force error; a parameter determination module for determining PID update parameters based on a first interval, a second interval, and a third interval; wherein the first interval is the interval in which the solder balance falls within a preset plurality of first alternative intervals; the second interval is the interval in which the contact force error falls within a preset plurality of second alternative intervals; and the third interval is the interval in which the error change rate falls within a preset plurality of third alternative intervals; a parameter adjustment module for determining the operating parameters of the polishing head based on the PID update parameters; and an operation module for controlling the polishing head based on the operating parameters.

[0026] This application provides an electronic device, including a processor and a memory. The memory stores computer-executable instructions that can be executed by the processor, and the processor executes the computer-executable instructions to implement the above-described solder polishing method.

[0027] This application provides a storage medium storing computer-executable instructions. When the computer-executable instructions are called and executed by a processor, the computer-executable instructions cause the processor to implement the above-described solder polishing method.

[0028] This application provides a computer program product, which includes a computer program that, when executed by a processor, implements the above-described solder polishing method.

[0029] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0030] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are considered similar elements. The drawings do not constitute a limitation of scale, and wherein: Figure 1 This is a schematic flowchart of a solder polishing method provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a grinding device provided in an embodiment of this application; Figure 3This is a schematic diagram of the structure of a solder polishing device provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0031] Figure label: 20: Sensing module; 21: Control module; 22: Execution module; 31: Acquisition module; 32: Parameter determination module; 33: Parameter adjustment module; 34: Running module; 41: Processor; 42: Memory; 43: Communication interface; 44: Bus. Detailed Implementation

[0032] To provide a more detailed understanding of the features and technical content of the embodiments of this application, the implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this application. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0033] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0034] Unless otherwise stated, the term "multiple" means two or more.

[0035] The term "correspondence" can refer to an association or binding relationship. The correspondence between A and B means that there is an association or binding relationship between A and B.

[0036] Engineers typically use grinding equipment to remove solder from welded areas of workpieces. Grinding equipment includes a processor, a Z-axis servo driver, a grinding head motor driver, and a grinding head. The processor, Z-axis servo driver, and grinding head motor driver are interconnected. The Z-axis servo driver controls the Z-axis displacement of the grinding head. The grinding head motor driver controls the grinding head's rotational speed.

[0037] During the grinding process, it is necessary to ensure stable contact between the grinding head and the workpiece, and at the same time, it is also necessary to adjust the operating parameters of the grinding head. Existing technology has the following drawbacks: 1. Traditional PID control relies on fixed parameters, which makes it difficult to adapt to the 0.1 mm to 1 mm margin variation of solder. This results in nonlinear characteristics of the system, which is prone to overshoot or steady-state error, causing the workpiece to be over- or under-grinded. 2. The Z-axis feed rate and the grinding head speed are mostly adjusted independently, lacking a coordination mechanism, which leads to a contradiction between grinding efficiency and accuracy, and causes workpiece surface damage due to the lag in feed rate matching at high speeds; 3. The response to real-time disturbances such as workpiece size deviation and grinding head wear is delayed, resulting in the grinding head grinding trajectory error often exceeding ±10μm (micrometers), which cannot meet the high precision requirements.

[0038] To address at least some of the aforementioned problems, embodiments of this application provide a solder polishing method applied to polishing equipment. See also... Figure 1 As shown, Figure 1 This is a flowchart illustrating the solder polishing method provided in the embodiments of this application. The method includes: Step S101: Obtain solder balance, contact force error, and error change rate.

[0039] In this embodiment, the solder allowance is the amount of solder remaining on the workpiece.

[0040] In some embodiments, the solder balance can be acquired using a laser displacement sensor.

[0041] For example, the grinding equipment also includes a feeding robotic arm. The feeding robotic arm is used to move the workpiece to be ground to a set position. A laser displacement sensor is mounted on the feeding robotic arm to collect the solder residue before grinding the workpiece with the grinding head.

[0042] Optionally, the laser displacement sensor can be placed at the end of the feeding robot arm, which is the end of the robot arm that grips the workpiece.

[0043] Optionally, after the laser displacement sensor collects the solder balance, the solder balance can be transmitted to the processor of the polishing equipment via Ethernet.

[0044] In this embodiment of the application, the contact force error is the error between the target contact force and the real-time contact force.

[0045] The target contact force is the desired contact force between the grinding head and the workpiece. The real-time contact force is the actual measured contact force between the grinding head and the workpiece.

[0046] For example, this can be achieved by calculating e=F ref -F act The contact force error is obtained. Here, e is the contact force error, and F... ref For the target contact force, F act For real-time contact force.

[0047] In some embodiments, real-time contact force can be acquired using a force sensor.

[0048] For example, a force sensor can be placed at the end of the grinding head to collect the real-time contact force between the grinding head and the workpiece. The end of the grinding head is the end that contacts the workpiece.

[0049] Optionally, after the force sensor collects the real-time contact force, the real-time contact force can be transmitted to the processor of the grinding equipment via Ethernet.

[0050] Optionally, a moving average filter is applied to the acquired real-time contact force to eliminate high-frequency noise. The filtered real-time contact force is then used in the calculation of the contact force error.

[0051] In this embodiment, the error change rate is the trend of the contact force error.

[0052] In some embodiments, ec = can be calculated = The error change rate is obtained. Here, ec is the error change rate. Let the contact force error be at time k. The contact force error at time k-1 is... For contact force sampling period, Let e ​​be the derivative of e with respect to time t.

[0053] Step S102: Determine the PID update parameters using the first interval, the second interval, and the third interval based on the preset fuzzy rule database.

[0054] In some embodiments, the obtained solder balance, contact force error, and error change rate are not preprocessed. The first interval is the interval where the solder balance falls within a set of preset first alternative intervals. The second interval is the interval where the contact force error falls within a set of preset second alternative intervals. The third interval is the interval where the error change rate falls within a set of preset third alternative intervals.

[0055] Optionally, the preset first candidate intervals are intervals related to solder margin stored in the fuzzy rule database. The preset second candidate intervals are intervals related to contact force error stored in the fuzzy rule database. The preset third candidate intervals are intervals related to error change rate stored in the fuzzy rule database.

[0056] In some embodiments, before determining the PID update parameters based on the first interval, the second interval, and the third interval, the solder polishing method further includes: preprocessing the solder balance, contact force error, and error change rate.

[0057] Correspondingly, the first interval is the interval of the pre-treated solder balance among a number of preset first alternative intervals; the second interval is the interval of the pre-treated contact force error among a number of preset second alternative intervals; and the third interval is the interval of the pre-treated error change rate among a number of preset third alternative intervals.

[0058] In the above embodiments, preprocessing the solder allowance can be achieved by calculating x1. 量化 =ROUND((x1 实际 -x1 min ) / (x1 max - x1 min )×6-3)) to obtain the pre-treated solder balance.

[0059] Where x1 量化 x1 represents the solder allowance after pretreatment. 实际 This represents the solder allowance before preprocessing; ROUND() is the rounding algorithm. x1 min x1 represents the minimum value of the universe of discourse for solder allowance. max This represents the maximum value of the domain of the solder allowance.

[0060] The minimum value of the universe of discourse for solder allowance is the minimum value of solder allowance recorded in the fuzzy rule database. The maximum value of the universe of discourse for solder allowance is the maximum value of solder allowance recorded in the fuzzy rule database. For example, if there are three first-option intervals in the fuzzy rule database, their corresponding solder allowance ranges are [0.1, 0.3], (0.3, 0.6], and (0.6, 1). In this case, the minimum value recorded in the fuzzy rule database is 0.1, so the minimum value of the universe of discourse for solder allowance is 0.1. The maximum value recorded in the fuzzy rule database is 1, so the maximum value of the universe of discourse for solder allowance is 1. That is, the universe of discourse for solder allowance is [0.1mm, 1mm].

[0061] In the above embodiments, preprocessing the contact force error can be achieved by calculating x2. 量化 =ROUND((x2 实际 -x2 min ) / (x2 max - x2 min )×6-3)), to obtain the contact force error after pretreatment.

[0062] Where x2 量化 x2 represents the contact force error after pretreatment. 实际 This represents the contact force error before pretreatment. X2 min X2 represents the minimum value of the universe of discourse for the contact force error. max This represents the maximum value of the domain of the contact force error.

[0063] The minimum value of the universe of discourse for contact force error is the minimum value of the contact force error recorded in the fuzzy rule database. The maximum value of the universe of discourse for contact force error is the maximum value of the contact force error recorded in the fuzzy rule database. For example, the universe of discourse for contact force error is [-1N, 1N], where N is Newtons.

[0064] In the above embodiments, preprocessing the error change rate can be achieved by calculating x3. 量化 =ROUND((x3 实际 -x3 min ) / (x3 max - x3 min )×6-3)) to obtain the error change rate after preprocessing.

[0065] Among them, x3 量化 x3 represents the rate of change of error after preprocessing. 实际 X3 represents the rate of change of error before preprocessing. min X3 represents the minimum value of the universe of discourse for the rate of change of error. max This represents the maximum value of the universe of discourse for the rate of change of error.

[0066] The minimum value of the universe of discourse for the rate of change of error is the minimum value of the rate of change of error recorded in the fuzzy rule database. The maximum value of the universe of discourse for the rate of change of error is the maximum value of the rate of change of error recorded in the fuzzy rule database. For example, the universe of discourse for the rate of change of error is [-0.5N / ms, 0.5N / ms], where N / ms is Newtons per millisecond.

[0067] In some embodiments, the PID update parameters include: proportional parameter correction, integral parameter correction, and derivative parameter correction. Step S102 may include: performing a lookup operation on the first interval, the second interval, and the third interval in a preset fuzzy rule database to obtain the proportional parameter range, integral parameter range, and derivative parameter range commonly corresponding to the first interval, the second interval, and the third interval; calculating the proportional parameter range using a preset centroid method algorithm to obtain the proportional parameter correction; calculating the integral parameter range using the centroid method algorithm to obtain the integral parameter correction; and calculating the derivative parameter range using the centroid method algorithm to obtain the derivative parameter correction.

[0068] Optionally, the fuzzy rule database stores the correspondence between the first interval, the second interval, the third interval, the range of proportional parameters, the range of integral parameters, and the range of differential parameters.

[0069] As shown in Table 1, Table 1 presents some correspondences between the solder allowance h, contact force error e, error change rate ec, proportional parameter range, integral parameter range, and differential parameter range recorded in the fuzzy rule database.

[0070] To simplify the expression of the corresponding range, different labels can be set for different ranges. For example, when the solder allowance is [0.6, 1], the label thickness (L) can be set.

[0071] For example: if h is thickness (L), e is positive (PB), and ec is positive fast (PB), then the range of the proportional parameter is positive (PB) [2, 2.8], the range of the integral parameter is negative (NB) [-0.5, -0.3], and the range of the differential parameter is negative (NB) [-1, -0.6].

[0072] Table 1

[0073] For example, in the fuzzy rule database, three fuzzy sets can be set for the solder allowance h, i.e., three first candidate intervals, with a universe of discourse range of [0.1mm, 0.3mm]. Seven fuzzy sets can be set for the contact force error e, i.e., seven second candidate intervals, with a universe of discourse range of [-1N, 1N]. Seven fuzzy sets can be set for the error change rate ec, i.e., seven third candidate intervals, with a universe of discourse range of [-0.5N / ms, 0.5N / ms]. Seven fuzzy sets can be set for the proportional parameter range, i.e., seven proportional parameter intervals, with a universe of discourse range of [-2, 2.8]. Seven fuzzy sets can be set for the integral parameter range, i.e., seven integral parameter intervals, with a universe of discourse range of [-0.5, 0.7]. Seven fuzzy sets can be set for the differential parameter range, i.e., seven differential parameter intervals, with a universe of discourse range of [-1, 1.4].

[0074] Engineers can construct fuzzy rule databases according to the following principles: If the solder margin is L, prioritize efficiency, tending to increase ΔKp (proportional parameter correction) to speed up response and decrease ΔKi (integral parameter correction) to avoid integral saturation. If the solder margin is S, prioritize accuracy, tending to decrease ΔKp to avoid overshoot and increase ΔKi to suppress fluctuations. When the contact force error e is greater than 0, it indicates insufficient contact force; ΔKp and ΔKi can be positive to enhance the adjustment effect. When the contact force error e is less than 0, it indicates excessive contact force; ΔKp and ΔKi can be negative to weaken the adjustment effect. When the error change rate indicates an increase in error, ΔKd (differential parameter correction) needs to be strengthened for differential suppression. When the error change rate indicates a decrease in error, the adjustment amplitude needs to be weakened.

[0075] In the above embodiments, the centroid method algorithm can use the following formula: .

[0076] When calculating the proportional parameter range using the preset centroid method algorithm to obtain the proportional parameter correction amount, the value of V represents the proportional parameter correction amount, Zi represents the value of the discrete point selected from the proportional parameter range, m is the number of discrete points selected from the proportional parameter range, and μi is the membership degree of the proportional parameter range at the discrete point Zi.

[0077] When calculating the integral parameter range using the preset centroid method algorithm to obtain the integral parameter correction, the value of V represents the integral parameter correction, Zi represents the quantization value of the discrete point selected from the integral parameter range, m is the number of discrete points selected from the integral parameter range, and μi is the membership degree of the integral parameter range at the discrete point Zi.

[0078] When using the centroid method to calculate the range of differential parameters and obtain the differential parameter correction, the value of V represents the differential parameter correction, Zi represents the value of the discrete point selected from the range of differential parameters, m is the number of discrete points selected from the range of differential parameters, and μi is the membership degree of the differential parameter range at the discrete point Zi.

[0079] Optionally, the number of discrete points and the quantization value of the discrete points can be set by the engineer based on experience.

[0080] Alternatively, the membership degree of the parameter range at the discrete point Zi can be calculated using the triangular membership function based on the discrete point Zi and the parameter range.

[0081] For example, the following formula is used to calculate the membership degree of the parameter range at the discrete point Zi.

[0082]

[0083] Among them, a, b, and c can be set by engineers based on experience. For example, a can be the left endpoint of the parameter range, c can be the right endpoint of the parameter range, and b is the middle value between a and c.

[0084] For example, when calculating the membership degree of the proportional parameter range at the discrete point Zi, 'a' can be the left endpoint of the proportional parameter range, 'c' can be the right endpoint of the proportional parameter range, and 'b' is the intermediate value between 'a' and 'c'. Similarly, when calculating the membership degree of the integral parameter range at the discrete point Zi, 'a' can be the left endpoint of the integral parameter range, 'c' can be the right endpoint of the integral parameter range, and 'b' is the intermediate value between 'a' and 'c'. Likewise, when calculating the membership degree of the differential parameter range at the discrete point Zi, 'a' can be the left endpoint of the differential parameter range, 'c' can be the right endpoint of the differential parameter range, and 'b' is the intermediate value between 'a' and 'c'.

[0085] Alternatively, other membership functions can be used to calculate membership, such as Gaussian membership functions, trapezoidal membership functions, etc. Table 2 records the differences between different membership functions across different dimensions.

[0086] Table 2

[0087] For example, the complete calculation process is illustrated by determining ΔKp using the centroid method. Assume that a lookup operation is performed in a pre-defined fuzzy rule database for the first interval (solder allowance), the second interval (contact force error), and the third interval (error change rate), obtaining a proportional parameter range of positive (PB) (2, 2.8). In this case, the specific value of ΔKp obtained by the centroid method must be a number between (2, 2.8). To balance calculation accuracy and efficiency, 11 discrete points Zi are selected within (2, 2.8), as shown in Table 3.

[0088] Table 3

[0089] The trigonometric membership function is used to calculate μi corresponding to each Zi. In this case, a is 2.0, b is 2.4, and c is 2.8.

[0090]

[0091] The values ​​of μi obtained after calculation are shown in Table 4 below.

[0092] Table 4

[0093] use Perform the calculation: The sum of the numerators is calculated as follows: (0.0000×2.00)+(0.2000×2.08)+(0.4000×2.16)+(0.6000×2.24)+(0.8000×2.32)+(1.0000×2.40)+(0.8000×2.48)+(0.6000×2.56)+(0.4000×2.64)+(0.2000×2.72)+(0.0000×2.80)=12.00.

[0094] Sum of denominators = 0 + 0.2 + 0.4 + 0.6 + 0.8 + 1 + 0.8 + 0.6 + 0.4 + 0.2 + 0 = 5.0.

[0095] ΔKp=12 / 5=2.40.

[0096] Alternatively, in addition to the centroid method, the maximum membership method, weighted average method, etc., can also be used. Table 5 records the advantages and disadvantages of different defuzzification algorithms.

[0097] Table 5

[0098] In other embodiments, the PID update parameters include: proportional parameter correction, integral parameter correction, and derivative parameter correction. If the proportional parameter correction, integral parameter correction, and derivative parameter correction are calculated in advance using the centroid method based on the proportional parameter range, integral parameter range, and derivative parameter range in Table 1 above, they can also be directly recorded in the fuzzy rule database. In this case, step S102 may include: performing a table lookup operation on the first interval, second interval, and third interval in the preset fuzzy rule database to obtain the proportional parameter correction, integral parameter correction, and derivative parameter correction commonly corresponding to the first interval, second interval, and third interval.

[0099] As shown in Table 6, Table 6 presents a partial correspondence between the solder allowance h, contact force error e, error change rate ec, proportional parameter correction, integral parameter correction, and differential parameter correction recorded in the fuzzy rule database.

[0100] Table 6

[0101] Step S103: Determine the operating parameters of the grinding head based on the PID update parameters.

[0102] In some embodiments, the PID update parameters include: proportional parameter correction, integral parameter correction, and derivative parameter correction. Step S103 may include: obtaining the current proportional parameter value, the current integral parameter value, and the current derivative parameter value; determining the target proportional parameter value based on the current proportional parameter value and the proportional parameter correction; determining the target integral parameter value based on the current integral parameter value and the integral parameter correction; determining the target derivative parameter value based on the current derivative parameter correction and the derivative parameter correction; determining the force control compensation amount using the target proportional parameter value, the target integral parameter value, the target derivative parameter value, the contact force error, and the error change rate according to a preset positional discrete algorithm; and determining the operating parameters of the grinding head based on the force control compensation amount.

[0103] In one optional approach, determining the target scale parameter value based on the current scale parameter value and the scale parameter correction amount can be achieved by: calculating K. p =K p0 +ΔK p To obtain the target ratio parameter value.

[0104] Among them, K p K is the target scaling parameter value. p0 ΔK is the current scaling parameter value. p This is the adjustment amount for the proportional parameter.

[0105] In another alternative approach, the target scale parameter value is determined based on the current scale parameter value and the scale parameter correction amount. This can be achieved by searching for the target scale parameter value that corresponds to both the current scale parameter value and the scale parameter correction amount in a preset first numerical database.

[0106] The first numerical database stores the correspondence between the current scale parameter value, the scale parameter correction amount, and the target scale parameter value.

[0107] In one optional approach, the target integral parameter value is determined based on the current integral parameter value and the integral parameter correction amount. This can be achieved by calculating K. i =K i0 +ΔK i , thus obtaining the target integral parameter value.

[0108] Among them, K i K is the target integration parameter value. i0 ΔK is the current integration parameter value. i This is the correction amount for the integral parameter.

[0109] In another alternative approach, the target integral parameter value is determined based on the current integral parameter value and the integral parameter correction amount. This can be achieved by searching for the target integral parameter value that corresponds to both the current integral parameter value and the integral parameter correction amount in a preset second numerical database.

[0110] The second numerical database stores the correspondence between the current integral parameter value, the integral parameter correction amount, and the target integral parameter value.

[0111] In one alternative approach, determining the target differential parameter value based on the current differential parameter value and the differential parameter correction amount can be achieved by: calculating K. d =K d0 +ΔK d The target differential parameter value is obtained.

[0112] Among them, K d Let K be the target differential parameter value. d0 Let ΔK be the current differential parameter value. d This is the correction amount for the differential parameter.

[0113] In another alternative approach, the target differential parameter value is determined based on the current differential parameter value and the differential parameter correction amount. This can be achieved by searching for the target differential parameter value that corresponds to both the current differential parameter value and the differential parameter correction amount in a preset third numerical database.

[0114] The third numerical database stores the correspondence between the current differential parameter value, the differential parameter correction amount, and the target differential parameter value.

[0115] For example, when the grinding equipment is first started, the engineer can set the current proportional parameter value, the current integral parameter value, and the current derivative parameter value. For example: K p0 =8、K i0 =0.3, K d0 =1.5. This value can be tuned using the Ziegler method.

[0116] In one optional approach, the force control compensation amount is determined using a preset positional discretization algorithm based on the target proportional parameter value, target integral parameter value, target differential parameter value, contact force error, and error change rate. This can be achieved by: Calculate u F = K p ·e + K i · ·Δt + K d · .

[0117] Among them, u F To control the compensation amount. Integral term. • Δt must be limited to [-200, 200] to avoid saturation.

[0118] In the above embodiment, the operating parameters of the grinding head include: Z-axis feed correction. The operating parameters of the grinding head can be determined based on the force control compensation amount, which may be as follows: Calculate ΔZ= .

[0119] Where ΔZ is the Z-axis feed correction amount. For preload, This is the force-displacement coupling coefficient.

[0120] Optionally, the force-displacement coupling coefficient can be determined by performing a table lookup operation on the first interval in a preset first parameter database to obtain the force-displacement coupling coefficient corresponding to the first interval.

[0121] The first parameter database stores the correspondence between the first interval and the force-displacement coupling coefficient.

[0122] Optionally, the preload can be set by the engineer based on experience. For example, a preload of 2 N.

[0123] In the above embodiments, the operating parameters of the grinding head further include: grinding head speed correction amount; determining the operating parameters of the grinding head based on the force control compensation amount further includes: obtaining a first correction amount of displacement to speed and a second correction amount of force error to speed; the first correction amount is the product of Z-axis feed correction amount and a preset first correction coefficient; the second correction amount is the product of contact force error, target proportional parameter value and a preset second correction coefficient; calculating the sum of the first correction amount and the second correction amount to obtain the grinding head speed correction amount.

[0124] For example, calculate Δn = r·ΔZ + γ·K p ·e, to obtain the grinding head speed correction amount. Where Δn is the grinding head speed correction amount, r is the first correction coefficient, and γ is the second correction coefficient.

[0125] Optionally, the first correction factor is the correction factor for the Z-axis feed rate to the rotational speed. The first correction factor can be determined by performing a lookup operation on the first interval in a preset second parameter database to obtain the first correction factor corresponding to the first interval.

[0126] The second parameter database stores the correspondence between the first interval and the first correction coefficient.

[0127] Optionally, the second correction factor is a correction factor for the contact force error and proportional coefficient on the rotational speed. This second correction factor can be set by the engineer based on experience. For example, the second correction factor could be 50 rpm / N (the change in rotational speed caused by a unit change in load torque).

[0128] Step S104: Control the grinding head according to the operating parameters.

[0129] In some embodiments, the operating parameters of the grinding head include: Z-axis feed correction and grinding head speed correction. Step S104 may include: obtaining the current Z-axis feed and the current grinding head speed; triggering the Z-axis servo driver to run according to the target feed; the target feed is the sum of the current Z-axis feed and the Z-axis feed correction; triggering the grinding head motor driver to run the grinding head according to the target grinding head speed; the target grinding head speed is the sum of the current grinding head speed and the grinding head speed correction.

[0130] Optionally, the current Z-axis feed can be acquired using a grating ruler.

[0131] For example, the processor of the grinding equipment is an Inovance H5U series PLC. The grating ruler can be connected to the high-speed counting channel of the H5U to transmit the current Z-axis feed. The Z-axis servo driver can communicate with the PLC through the EtherCAT slave interface, and the grinding head motor driver can adjust the grinding head speed in real time by receiving the PWM (pulse width modulation) modulation signal sent by the PLC.

[0132] For example, in combination Figure 2As shown, the grinding equipment is built based on the Huichuan H5U series PLC. The grinding equipment may include a sensing module 20, a control module 21, and an execution module 22. The sensing module 20 is used to acquire real-time status parameters of the grinding process, such as solder residue, real-time contact force, current Z-axis feed, and current grinding head speed. The control module 21 is used to determine PID update parameters based on a preset fuzzy rule database using the first, second, and third intervals, and to determine the grinding head's operating parameters based on the PID update parameters. Specifically, the control module determines the Z-axis feed correction and the grinding head speed correction. The execution module 22 receives the Z-axis feed correction and grinding head speed correction sent by the control module and adjusts the Z-axis servo driver and grinding head motor driver accordingly.

[0133] The data interaction between the sensing module, control module, and execution module can be achieved through the EtherCAT (a high-speed, high-performance, deterministic industrial fieldbus system based on the standard Ethernet physical layer) master station function natively supported by the H5U PLC, with a cycle of ≤1ms. The H5U PLC acts as the EtherCAT master station, establishing master-slave communication with the Z-axis servo drive and the grinding head motor drive. The PDO (Process Data Object) mapping includes: control word, target feed amount or target grinding head speed, current Z-axis feed amount or current grinding head speed, and status word. The communication cycle is 500μs, and the synchronization mode uses DC phase-locked loop, with a synchronization error ≤50ns. The control word describes the control quantity, and the status word provides feedback on the drive's status, such as whether the target grinding head speed has been reached.

[0134] Thus, the solution proposed in this application employs a fuzzy PID algorithm, dynamically correcting PID parameters through dual feedback of solder margin and contact force, keeping contact force fluctuations within ±0.5N and adapting to the nonlinear characteristics of the system. By dynamically adjusting PID parameters through a fuzzy rule base, it can adapt to solder thickness variations within the range of 0.1mm to 1mm without manual intervention, demonstrating strong adaptability. Controlling contact force fluctuations within ±0.5N significantly reduces the probability of over-grinding and under-grinding, resulting in high control accuracy. Based on the dual-CPU (processor) architecture of the Huichuan H5UPLC (a PLC model), the fuzzy PID algorithm and motion control are processed in parallel, shortening the control cycle to 500μs (microseconds), with a disturbance response lag of ≤5ms, which is twice that of traditional PLCs. It also improves the system's anti-interference capability and can extend the grinding head life by more than 30%. Combined with EtherCAT synchronous control, the Z-axis feed and grinding head speed are adjusted collaboratively, reducing grinding head trajectory errors and resolving the accuracy contradictions caused by independent adjustments.

[0135] Based on the same inventive concept, embodiments of this application provide a solder polishing device, such as... Figure 3As shown, the solder polishing device includes: an acquisition module 31, a parameter determination module 32, a parameter adjustment module 33, and an operation module 34. The acquisition module 31 is used to acquire solder balance, contact force error, and error change rate; the parameter determination module 32 is used to determine PID update parameters based on a first interval, a second interval, and a third interval; the parameter adjustment module 33 is used to determine the operating parameters of the polishing head based on the PID update parameters; and the operation module 34 is used to control the polishing head according to the operating parameters.

[0136] In some embodiments, the parameter determination module 32 is used to determine the PID update parameters based on a preset fuzzy rule database using a first interval, a second interval, and a third interval in the following manner: performing a lookup operation on the first interval, the second interval, and the third interval in the preset fuzzy rule database to obtain the proportional parameter range, integral parameter range, and derivative parameter range that are commonly corresponding to the first interval, the second interval, and the third interval; calculating the proportional parameter range using a preset centroid method algorithm to obtain the proportional parameter correction amount; calculating the integral parameter range using the centroid method algorithm to obtain the integral parameter correction amount; and calculating the derivative parameter range using the centroid method algorithm to obtain the derivative parameter correction amount.

[0137] In some embodiments, the parameter adjustment module 33 is used to determine the operating parameters of the grinding head based on the PID update parameters in the following ways: obtaining the current proportional parameter value, the current integral parameter value, and the current derivative parameter value; determining the target proportional parameter value based on the current proportional parameter value and the proportional parameter correction amount; determining the target integral parameter value based on the current integral parameter value and the integral parameter correction amount; determining the target derivative parameter value based on the current derivative parameter value and the derivative parameter correction amount; determining the force control compensation amount based on the target proportional parameter value, the target integral parameter value, the target derivative parameter value, the contact force error, and the error change rate using a preset positional discrete algorithm; and determining the operating parameters of the grinding head based on the force control compensation amount.

[0138] In some embodiments, the parameter adjustment module 33 is used to determine the operating parameters of the grinding head based on the force control compensation amount in the following manner: by calculating the Z-axis feed correction amount using the target contact force, the force control compensation amount, the preset preload force, and the preset force displacement coupling coefficient according to the preset force displacement conversion algorithm.

[0139] In some embodiments, the parameter adjustment module 33 is used to determine the force-displacement coupling coefficient by performing a lookup operation on the first interval in a preset first parameter database to obtain the force-displacement coupling coefficient corresponding to the first interval; the first parameter database stores the correspondence between the first interval and the force-displacement coupling coefficient.

[0140] In some embodiments, the parameter adjustment module 33 is further configured to determine the operating parameters of the grinding head based on the force control compensation amount in the following manner: obtaining a first correction amount of displacement to rotational speed and a second correction amount of force error to rotational speed; the first correction amount is the product of the Z-axis feed correction amount and a preset first correction coefficient; the second correction amount is the product of the contact force error, the target proportional parameter value and a preset second correction coefficient; and calculating the sum of the first correction amount and the second correction amount to obtain the grinding head rotational speed correction amount.

[0141] In some embodiments, the parameter adjustment module 33 is further configured to determine the first correction coefficient by performing a lookup operation on the first interval in a preset second parameter database to obtain the first correction coefficient corresponding to the first interval; the second parameter database stores the correspondence between the first interval and the first correction coefficient.

[0142] In some embodiments, the operation module 34 is used to control the grinding head according to the operating parameters in the following manner: obtaining the current Z-axis feed and the current grinding head speed; triggering the Z-axis servo driver to run according to the target feed; the target feed is the sum of the current Z-axis feed and the Z-axis feed correction; triggering the grinding head motor driver to run the grinding head according to the target grinding head speed; the target grinding head speed is the sum of the current grinding head speed and the grinding head speed correction.

[0143] In some embodiments, the solder polishing device further includes: a pre-processing module for pre-processing solder balance, contact force error, and error change rate; correspondingly, the first interval is the interval in which the pre-processed solder balance is located among a plurality of preset first alternative intervals; the second interval is the interval in which the pre-processed contact force error is located among a plurality of preset second alternative intervals; and the third interval is the interval in which the pre-processed error change rate is located among a plurality of preset third alternative intervals.

[0144] Combination Figure 4 As shown, this application embodiment provides an electronic device, including a processor 41 and a memory 42. Optionally, the device may further include a communication interface 43 and a bus 44. The processor 41, communication interface 43, and memory 42 can communicate with each other via the bus 44. The communication interface 43 can be used for information transmission. The processor 41 can call logical instructions in the memory 42 to execute the solder polishing method of the above embodiment.

[0145] Furthermore, the logical instructions in the aforementioned memory 42 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium.

[0146] The memory 42, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions / modules corresponding to the methods in the embodiments of this application. The processor 41 executes functional applications and data processing by running the program instructions / modules stored in the memory 42, that is, it implements the solder polishing method in the above embodiments.

[0147] The memory 42 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the terminal device. Furthermore, the memory 42 may include high-speed random access memory and may also include non-volatile memory.

[0148] Among them, electronic devices can be computers or servers, etc.

[0149] This application provides a storage medium storing computer-executable instructions configured to perform the above-described solder polishing method.

[0150] This application provides a computer program product, which includes a computer program stored on a storage medium. The computer program includes program instructions, which, when executed by a computer, cause the computer to perform the above-described solder polishing method.

[0151] The aforementioned computer-readable storage medium may be a transient computer-readable storage medium or a non-transitory computer-readable storage medium.

[0152] The technical solutions of this application embodiment can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes one or more instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in this application embodiment. The aforementioned storage medium can be a non-transitory storage medium, including various media capable of storing program code such as USB flash drives, portable hard drives, read-only memory, random access memory, magnetic disks, or optical disks, or it can be a transient storage medium.

[0153] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0154] The above descriptions are merely embodiments of this application and are not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application. Furthermore, the above embodiments can be combined with each other to form new embodiments without conflict.

Claims

1. A method for polishing solder, characterized in that, Applied to grinding equipment, the method includes: The following parameters are used to obtain solder balance, contact force error, and error change rate: solder balance refers to the amount of solder remaining on the workpiece; contact force error refers to the error between the target contact force and the real-time contact force; the target contact force is the expected contact force between the grinding head and the workpiece; the real-time contact force is the contact force between the grinding head and the workpiece obtained from actual measurement; and the error change rate is the trend of the contact force error. The PID update parameters are determined using a first interval, a second interval, and a third interval based on a preset fuzzy rule database; the first interval is the interval in which the solder balance falls within a preset plurality of first alternative intervals; the second interval is the interval in which the contact force error falls within a preset plurality of second alternative intervals; and the third interval is the interval in which the error change rate falls within a preset plurality of third alternative intervals. The operating parameters of the grinding head are determined based on the PID update parameters. The grinding head is controlled according to the operating parameters.

2. The method according to claim 1, characterized in that, The PID update parameters include: proportional parameter correction, integral parameter correction, and derivative parameter correction; the PID update parameters are determined using a first interval, a second interval, and a third interval based on a preset fuzzy rule database, including: A lookup operation is performed on the first interval, the second interval, and the third interval in a preset fuzzy rule database to obtain the proportional parameter range, integral parameter range, and differential parameter range that are commonly corresponding to the first interval, the second interval, and the third interval. The range of proportional parameters is calculated using a preset centroid method algorithm to obtain the proportional parameter correction amount; The range of integral parameters is calculated using the centroid method to obtain the correction amount for the integral parameters; The range of the differential parameters is calculated using the centroid method algorithm to obtain the differential parameter correction amount; The fuzzy rule database stores the correspondence between the first interval, the second interval, the third interval, the range of proportional parameters, the range of integral parameters, and the range of differential parameters.

3. The method according to claim 1, characterized in that, The PID update parameters include: proportional parameter correction, integral parameter correction, and derivative parameter correction; the operating parameters of the grinding head are determined based on the PID update parameters, including: Get the current proportional parameter value, current integral parameter value, and current derivative parameter value; Determine the target scale parameter value based on the current scale parameter value and the scale parameter correction amount; The target integral parameter value is determined based on the current integral parameter value and the integral parameter correction amount; The target differential parameter value is determined based on the current differential parameter value and the differential parameter correction amount; The force control compensation amount is determined based on the target proportional parameter value, the target integral parameter value, the target differential parameter value, the contact force error, and the error change rate using a preset positional discretization algorithm. The operating parameters of the grinding head are determined based on the force control compensation amount.

4. The method according to claim 3, characterized in that, The operating parameters of the grinding head include: Z-axis feed correction; the operating parameters of the grinding head are determined based on the force control compensation, including: The Z-axis feed correction is obtained by calculating the target contact force, the force control compensation amount, the preset preload, and the preset force-displacement coupling coefficient according to the preset force-displacement conversion algorithm.

5. The method according to claim 4, characterized in that, The force-displacement coupling coefficient is determined in the following way: A table lookup operation is performed on the first interval in the preset first parameter database to obtain the force-displacement coupling coefficient corresponding to the first interval. The first parameter database stores the correspondence between the first interval and the force-displacement coupling coefficient.

6. The method according to claim 4, characterized in that, The operating parameters of the grinding head also include: grinding head speed correction amount; determining the operating parameters of the grinding head based on the force control compensation amount also includes: Obtain a first correction amount for displacement relative to rotational speed and a second correction amount for force error relative to rotational speed; the first correction amount is the product of the Z-axis feed correction amount and a preset first correction coefficient; the second correction amount is the product of the contact force error, the target proportional parameter value, and a preset second correction coefficient; The sum of the first correction amount and the second correction amount is calculated to obtain the grinding head speed correction amount.

7. The method according to claim 6, characterized in that, The first correction factor is determined in the following manner: A lookup operation is performed on the first interval in the preset second parameter database to obtain the first correction coefficient corresponding to the first interval; The second parameter database stores the correspondence between the first interval and the first correction coefficient.

8. The method according to any one of claims 1 to 7, characterized in that, The grinding equipment includes: a Z-axis servo driver, a grinding head motor driver, and a grinding head; the Z-axis servo driver is used to control the Z-axis displacement of the grinding head, and the grinding head motor driver is used to control the grinding head speed; the operating parameters of the grinding head include: Z-axis feed correction amount and grinding head speed correction amount; controlling the grinding head according to the operating parameters includes: Get the current Z-axis feed rate and the current grinding head speed; The Z-axis servo driver is triggered to run according to the target feed rate; the target feed rate is the sum of the current Z-axis feed rate and the Z-axis feed correction rate. The grinding head motor driver is triggered to run the grinding head at the target grinding head speed; the target grinding head speed is the sum of the current grinding head speed and the grinding head speed correction amount.

9. The method according to any one of claims 1 to 7, characterized in that, Before determining the PID update parameters based on the first interval, the second interval, and the third interval, the method further includes: Preprocessing is performed on the solder allowance, the contact force error, and the error change rate; Correspondingly, the first interval is the interval in which the pre-processed solder balance falls within a plurality of preset first alternative intervals; the second interval is the interval in which the pre-processed contact force error falls within a plurality of preset second alternative intervals; and the third interval is the interval in which the pre-processed error change rate falls within a plurality of preset third alternative intervals.

10. A solder polishing device, characterized in that, include: The acquisition module is used to acquire solder balance, contact force error, and error change rate; the solder balance is the amount of solder remaining on the workpiece. The contact force error is the error between the target contact force and the real-time contact force; the target contact force is the expected contact force between the grinding head and the workpiece; the real-time contact force is the contact force between the grinding head and the workpiece obtained by actual measurement; the error change rate is the trend of the contact force error. The parameter determination module is used to determine the PID update parameters based on a first interval, a second interval, and a third interval; the first interval is the interval in which the solder balance falls among a plurality of preset first alternative intervals; the second interval is the interval in which the contact force error falls among a plurality of preset second alternative intervals; The third interval is the interval in which the error change rate falls among a plurality of preset third alternative intervals; The parameter adjustment module is used to determine the operating parameters of the grinding head based on the PID update parameters; The operation module is used to control the grinding head according to the operation parameters.

11. An electronic device, characterized in that, It includes a processor and a memory, the memory storing computer-executable instructions that can be executed by the processor, the processor executing the computer-executable instructions to implement the solder polishing method according to any one of claims 1 to 9.

12. A storage medium, characterized in that, The storage medium stores computer-executable instructions, which, when invoked and executed by a processor, cause the processor to implement the solder polishing method according to any one of claims 1 to 9.

13. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements the solder polishing method according to any one of claims 1 to 9.

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