Silicon optical semiconductor packaging device

Abstract

The invention discloses a silicon optical semiconductor packaging device, and relates to the technical field of semiconductor packaging. Nitrogen flows out from a large conical surface of a conical ventilation groove to a small conical surface, so that the flow rate of the nitrogen is gradually increased, the nitrogen is ensured to gently diffuse at an outlet of a lower die cavity, high-speed airflow is prevented from directly impacting a sensitive structure, and stable cooling can be realized; the exhaust rate can be controlled through the small sectional area of the small conical surface outlet, dynamic balance is formed between the small conical surface outlet and air in the lower die cavity, insufficient resin filling caused by too fast exhaust or bubble residue caused by too slow exhaust is prevented, nitrogen sprayed out through rotation of the nozzle forms a spiral track, all corners in the upper die cavity and the lower die cavity can be covered, and therefore the air exhaust efficiency is improved. The surface tension of the bubbles is broken, the dissolution of the micro-bubbles is accelerated or the micro-bubbles float to an exhaust groove, the rotating airflow can more thoroughly remove the bubbles in the resin, the voidage is reduced, and the situation that the bubbles are compressed and difficult to discharge in a local high-pressure area or insufficient resin filling is caused in a local low-pressure area is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically to a silicon photonics semiconductor packaging device. Background Technology

[0002] In silicon photonics semiconductor packaging, the core of the epoxy resin device is an epoxy resin-based composite material system and supporting process equipment. Through the synergistic effect of material formulation design and molding process, it provides physical protection, electrical insulation, thermal management support, and optical performance assurance for the chip. As a matrix material, epoxy resin, with its excellent adhesion and flowability, can uniformly fill the tiny gaps between the chip and the substrate to form a dense encapsulation layer. The curing agent, through a cross-linking reaction with the epoxy resin, constructs a three-dimensional network structure, giving the material thermosetting properties, enabling it to maintain structural stability at high temperatures or during long-term use, and avoiding packaging failure due to softening. The addition of high-purity silica and aluminum nitride fillers significantly improves the material's mechanical strength and thermal conductivity. The former can resist mechanical stress impact, while the latter can quickly conduct the heat generated by the chip to the heat dissipation structure, preventing performance degradation caused by local overheating. The release agent ensures smooth separation of the device from the mold after packaging and reduces surface defects. In addition, to meet the stringent optical performance requirements of silicon photonics chips, the material formulation can be further optimized for refractive index matching to reduce optical signal transmission loss, while reducing energy attenuation during optical coupling through low light absorption design. Ultimately, the composite material is precisely wrapped around the chip surface through a molding process to form a robust shell that effectively blocks external factors such as dust, moisture, and chemical corrosion, creating a comprehensive protective barrier for the chip from its microstructure to its macro environment.

[0003] In existing epoxy resin encapsulation processes, introducing inert gas into the mold cavity to expel oxygen is a critical step. However, the design with a fixed injection angle and constant flow rate has significant limitations. A fixed injection angle allows the gas to flow along only a single path, easily creating blind spots that the gas cannot reach in complex structures such as the edge of the mold cavity, pin gaps, or the bottom of the chip. Oxygen residue causes the epoxy resin to undergo oxidation during curing, generating colored substances or damaging the cross-linked structure. At the same time, the air that is not expelled expands when heated, forming microbubbles. These defects significantly reduce the insulation performance of the package, increase the risk of leakage, and weaken the mechanical strength, making the package layer more prone to cracking under external force. Under constant flow rate, the gas flow in the mold cavity creates turbulence or stagnation zones due to differences in structural impedance. For example, a sudden drop in flow rate in narrow channels leads to oxygen accumulation, while excessively fast flow rates in open areas may entrain ambient air, further exacerbating the oxygen residue problem. In addition, oxygen residue can also hinder the full wetting of the epoxy resin at the interface between the chip and the substrate, leading to porosity or separation in the adhesive layer, reducing the overall reliability of the package structure, and ultimately affecting the optical coupling efficiency and long-term stability of the silicon photonics chip. Summary of the Invention

[0004] Technical problems to be solved

[0005] To address the shortcomings of existing silicon photonics semiconductor packaging technologies, such as slow heat dissipation and unstable packaging, this invention provides a silicon photonics semiconductor packaging device.

[0006] Technical solution

[0007] The present invention is achieved through the following technical solution: a silicon photonics semiconductor packaging device, including a packaging machine, wherein a resin filling head is provided inside the packaging machine, an upper mold is installed on the outer surface of the resin filling head, an upper mold cavity is opened inside the upper mold, and a lower mold is provided inside the packaging machine, wherein a lower mold cavity is opened inside the lower mold.

[0008] The lower mold has several pin slots inside, and several conical venting grooves are evenly distributed inside the lower mold. One end of the conical venting groove has a large conical surface, and the other end of the conical venting groove has a small conical surface.

[0009] Furthermore, a motor is mounted on the top surface of the upper mold, and a rotating shaft is mounted on the outer surface of the motor output end.

[0010] Furthermore, a main bevel gear is mounted on one end surface of the rotating shaft, and a retaining ring is movably mounted on the outer surface of the resin filling head.

[0011] Furthermore, the retaining ring has a second air chamber inside, and the resin filling head has a first air chamber inside.

[0012] Furthermore, two air pipe connectors are installed on the outer surface of the resin filling head, and several nozzles are evenly distributed inside the retaining ring.

[0013] Furthermore, the lower mold has a positioning hole inside, and the bottom surface of the upper mold is evenly distributed with positioning pins, the outer surface of the positioning pins being in contact with the inner surface of the positioning hole.

[0014] Beneficial effects

[0015] The present invention has the following beneficial effects:

[0016] (1) In the silicon photonics semiconductor packaging device, nitrogen flows out through the large cone surface of the cone venting groove to the small cone surface, so that the nitrogen flow rate gradually increases, ensuring that the nitrogen diffuses gently at the outlet of the lower mold cavity, avoiding the direct impact of high-speed airflow on the sensitive structure, and can stably cool down. The small cross-sectional area of ​​the outlet of the small cone surface can control the exhaust rate and form a dynamic balance with the air in the lower mold cavity, preventing insufficient resin filling due to excessive exhaust or residual bubbles due to excessively slow exhaust.

[0017] (2) The device for silicon photonic semiconductor packaging uses a rotating nozzle to spray nitrogen gas in a spiral trajectory, which can cover all corners of the upper and lower mold cavities. This avoids the local nitrogen concentration deficiency caused by the fixed nozzle spray direction, and forms a uniform inert atmosphere. It is suitable for packaging silicon photonic chips that are sensitive to oxygen. The rotating nitrogen gas flow creates a continuous disturbance on the epoxy resin surface, breaks the surface tension of the bubbles, and accelerates the dissolution or floating of microbubbles to the exhaust groove. The rotating gas flow can more thoroughly remove bubbles in the resin and reduce the void ratio. The rotating nozzle minimizes the pressure gradient in the mold cavity, avoiding local high pressure areas that cause bubbles to be compressed and difficult to discharge, or local low pressure areas that cause insufficient resin filling.

[0018] (3) The silicon photonics semiconductor packaging device fixes the silicon photonics semiconductor pins by inserting them into the pin slots. The upper mold moves synchronously through the resin filling head, so that the positioning post of the upper mold is inserted into the positioning hole of the lower mold. The upper mold cavity and the lower mold cavity are molded together. Epoxy resin is filled into the upper mold cavity and the lower mold cavity through the resin filling head. The rigid fit between the positioning post and the positioning hole ensures that the pin slot is strictly aligned with the chip pins, avoiding the deterioration of electrical performance caused by packaging offset. The rigid frame formed after mold closing can effectively disperse external impact force, combined with the curing shrinkage rate of epoxy resin.

[0019] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the packaging machine of the present invention;

[0021] Figure 2 This is a schematic diagram of the external structure of the resin filling head of the present invention;

[0022] Figure 3 This is a schematic diagram of the internal structure of the mold of the present invention;

[0023] Figure 4 This is a schematic diagram of the internal structure of the resin filling head of the present invention;

[0024] Figure 5 This is a schematic diagram of the internal structure of the mold of the present invention.

[0025] In the diagram: 1. Packaging machine; 2. Resin filling head; 3. Air pipe connector; 4. Air chamber one; 5. Snap ring; 6. Air chamber two; 7. Sealing strip; 8. Nozzle; 9. Motor; 10. Rotating shaft; 11. Main bevel gear; 12. Driven bevel gear; 13. Positioning pin; 14. Upper mold; 15. Lower mold; 16. Upper mold cavity; 17. Lower mold cavity; 18. Conical vent groove; 19. Pin slot; 20. Large conical surface; 21. Small conical surface; 22. Positioning hole. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.

[0028] Please see Figures 1-5 The present invention provides a technical solution: a silicon photonics semiconductor packaging device, including a packaging machine 1, a resin filling head 2 inside the packaging machine 1, an upper mold 14 installed on the outer surface of the resin filling head 2, an upper mold cavity 16 opened inside the upper mold 14, a lower mold 15 inside the packaging machine 1, and a lower mold cavity 17 opened inside the lower mold 15.

[0029] The lower mold 15 has several pin slots 19 inside, and several conical venting grooves 18 are evenly distributed inside the lower mold 15. One end of the conical venting groove 18 has a large conical surface 20, and the other end of the conical venting groove 18 has a small conical surface 21. Nitrogen flows out from the large conical surface 20 to the small conical surface 21 of the conical venting groove 18, so that the nitrogen flow rate gradually increases, ensuring that the nitrogen diffuses gently at the outlet of the lower mold cavity 17, avoiding the direct impact of high-speed airflow on sensitive structures, and can stably cool down. The small cross-sectional area of ​​the outlet of the small conical surface 21 can control the venting rate and form a dynamic balance with the air in the lower mold cavity 17, preventing insufficient resin filling due to excessive venting or residual air bubbles due to excessively slow venting.

[0030] A motor 9 is mounted on the top surface of the upper mold 14. A rotating shaft 10 is mounted on the outer surface of the output end of the motor 9. A main bevel gear 11 is mounted on one end surface of the rotating shaft 10. A retaining ring 5 is movably mounted on the outer surface of the resin filling head 2. An air chamber 6 is opened inside the retaining ring 5. An air chamber 4 is opened inside the resin filling head 2. Two air pipe connectors 3 are mounted on the outer surface of the resin filling head 2. Several nozzles 8 are evenly distributed inside the retaining ring 5. A positioning hole 22 is opened inside the lower mold 15. Positioning pins 13 are evenly distributed on the bottom surface of the upper mold 14. The outer surface of the positioning pins 13 is movably mounted with the inner surface of the positioning hole 22. The nitrogen gas ejected from the rotating nozzle 8 forms a spiral trajectory, which can cover all corners of the upper mold cavity 16 and the lower mold cavity 17. This avoids the local nitrogen concentration deficiency caused by the fixed direction of the fixed nozzle 8, and forms a uniform inert atmosphere, which is suitable for oxygen-sensitive silicon photonic chip packaging. The rotating nitrogen gas flow continuously disturbs the epoxy resin surface, breaks the surface tension of bubbles, and accelerates the dissolution or floating of microbubbles to the venting groove. The rotating gas flow can more thoroughly remove bubbles from the resin and reduce the void ratio. The rotating nozzle 8 minimizes the pressure gradient in the mold cavity, avoiding local high pressure areas that cause bubbles to be compressed and difficult to expel, or local low pressure areas that cause insufficient resin filling.

[0031] The specific workflow of this invention is as follows: When epoxy resin encapsulation of silicon photonic semiconductors is required, the leads of the silicon photonic semiconductors are inserted into the lead slots 19 for fixation. The upper mold 14 moves synchronously through the resin filling head 2, thereby inserting the positioning post 13 of the upper mold 14 into the positioning hole 22 of the lower mold 15. The upper mold cavity 16 and the lower mold cavity 17 are closed. Epoxy resin is filled into the upper mold cavity 16 and the lower mold cavity 17 through the resin filling head 2. The rigid fit between the positioning post 13 and the positioning hole 22 ensures that the lead slots 19 are strictly aligned with the chip leads, avoiding electrical performance degradation caused by encapsulation misalignment. The rigid frame formed after mold closing can effectively disperse external impact forces, combined with the curing shrinkage rate of epoxy resin.

[0032] Nitrogen gas is introduced into air chamber 4 through air connector 3. The nitrogen gas is then ejected from several nozzles 8 through air chamber 2. The controller operates motor 9, which drives rotating shaft 10 to rotate. Rotating shaft 10 drives main bevel gear 11 to rotate. The outer surface of main bevel gear 11 meshes with the outer surface of driven bevel gear 12, causing driven bevel gear 12 to rotate. Driven bevel gear 12 drives retaining ring 5 and two sealing strips 7 to rotate, thus maintaining the airtightness of air chamber 4 and air chamber 2. The nitrogen gas ejected from several nozzles 8 rotates, thus uniformly filling the upper mold cavity 16 and lower mold cavity 17. Nitrogen gas is ejected from nozzle 8 in a spiral trajectory, covering all corners of the upper mold cavity 16 and lower mold cavity 17. This avoids the local nitrogen concentration deficiency caused by the fixed spray direction of the fixed nozzle 8, forming a uniform inert atmosphere, which is suitable for oxygen-sensitive silicon photonic chip packaging. The rotating nitrogen gas flow continuously disturbs the epoxy resin surface, breaking the surface tension of bubbles and accelerating the dissolution or floating of microbubbles to the venting groove. The rotating gas flow can more thoroughly remove bubbles from the resin and reduce the void ratio. The rotating nozzle 8 minimizes the pressure gradient in the mold cavity, avoiding local high pressure areas that cause bubbles to be compressed and difficult to expel, or local low pressure areas that cause insufficient resin filling.

[0033] Furthermore, nitrogen flows out through the large conical surface 20 of the conical venting groove 18 to the small conical surface 21, gradually increasing the nitrogen flow rate. This ensures that the nitrogen diffuses gently at the outlet of the lower mold cavity 17, preventing high-speed airflow from directly impacting the sensitive structure and allowing for stable cooling. The smaller cross-sectional area of ​​the outlet of the small conical surface 21 controls the venting rate, forming a dynamic balance with the air in the lower mold cavity 17. This prevents insufficient resin filling due to excessively rapid venting or residual air bubbles due to excessively slow venting.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0035] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A silicon photonics semiconductor packaging apparatus, comprising a packaging machine (1), characterized in that: The packaging machine (1) is provided with a resin filling head (2), and an upper mold (14) is installed on the outer surface of the resin filling head (2). An upper mold cavity (16) is opened inside the upper mold (14). The packaging machine (1) is provided with a lower mold (15), and a lower mold cavity (17) is opened inside the lower mold (15). The lower mold (15) has several pin slots (19) inside, and several conical ventilation grooves (18) are evenly distributed inside the lower mold (15). One end of the conical ventilation groove (18) has a large conical surface (20), and the other end of the conical ventilation groove (18) has a small conical surface (21).

2. The silicon photonics semiconductor packaging device according to claim 1, characterized in that: A motor (9) is mounted on the top surface of the upper mold (14), and a rotating shaft (10) is mounted on the outer surface of the output end of the motor (9).

3. The silicon photonics semiconductor packaging device according to claim 2, characterized in that: A main bevel gear (11) is mounted on one end surface of the rotating shaft (10), and a retaining ring (5) is movably mounted on the outer surface of the resin filling head (2).

4. The silicon photonics semiconductor packaging device according to claim 3, characterized in that: The retaining ring (5) has an air chamber two (6) inside, and the resin filling head (2) has an air chamber one (4) inside.

5. A silicon photonics semiconductor packaging device according to claim 4, characterized in that: Two air pipe connectors (3) are installed on the outer surface of the resin filling head (2), and several nozzles (8) are evenly distributed inside the retaining ring (5).

6. The silicon photonics semiconductor packaging device according to claim 1, characterized in that: The lower mold (15) has a positioning hole (22) inside, and the bottom surface of the upper mold (14) is evenly equipped with positioning posts (13), and the outer surface of the positioning post (13) is in contact with the inner surface of the positioning hole (22).

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