Heat dissipation equipment and charging pile

Abstract

The invention relates to heat dissipation equipment and a charging pile, the heat dissipation equipment comprises a cold plate assembly, an immersion box body and a condenser, the cold plate assembly is provided with a first cavity, the cold plate assembly comprises a cold plate, the first cavity is used for accommodating the cold plate and a power module, the cold plate is attached to a core heating element of the power module, and the interior of the cold plate is used for allowing a first refrigerant to flow; the immersion box body is provided with a second cavity used for containing a second refrigerant, and the cold plate assembly is arranged in the second cavity. The condenser is arranged outside the second cavity, an inlet of the condenser communicates with an outlet of the cold plate, and an outlet of the condenser communicates with an inlet of the cold plate. The cold plate assembly is used for cooling the core heating element of the power module, and the second refrigerant filled in the second cavity of the immersion box body is used for cooling other heating elements of the power module, so that the core heating element and other heating elements of the power module are in different heat dissipation environments, the heat dissipation interference of the core heating element and other heating elements is reduced, and the service life of the power module is prolonged. And the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and in particular to a heat dissipation device and a charging pile. Background Technology

[0002] With the rapid development of electric vehicles and the increasing demand for fast charging, the power range of fast charging piles is also increasing. However, approximately 5% of the electrical energy in fast charging piles is converted into heat loss, resulting in enormous heat generation. Therefore, heat dissipation of the charging pile power module has become an increasingly urgent problem to solve. Currently, the market mainly uses immersion liquid cooling for power module heat dissipation, which involves placing the entire power module in an immersion liquid-cooled environment. However, this method results in the core heat-generating components of the power module and other heat-generating components sharing the same heat dissipation environment, leading to low heat dissipation efficiency. Summary of the Invention

[0003] Therefore, it is necessary to provide a heat dissipation device and a charging pile to address the heat dissipation problem of the charging pile power module.

[0004] A heat dissipation device, the heat dissipation device comprising:

[0005] A cold plate assembly has a first cavity, the cold plate assembly includes a cold plate, the first cavity is used to accommodate the cold plate and a power module, and the cold plate and the core heating element of the power module are in contact, and the cold plate is used to supply a first refrigerant for flow;

[0006] The immersion chamber has a second cavity for containing a second refrigerant, and the cold plate assembly is disposed within the second cavity;

[0007] A condenser is disposed outside the second cavity, and the inlet of the condenser is connected to the outlet of the cold plate, and the outlet of the condenser is connected to the inlet of the cold plate.

[0008] The aforementioned heat dissipation device, by setting up a cold plate assembly, attaches the power module and the cold plate together and places it within the first cavity of the housing. By bringing the core heat-generating component of the power module into contact with the cold plate, the cold plate cools the core heat-generating component of the power module. A second refrigerant is filled in the second cavity, which is submerged in the housing, and the cold plate assembly is placed within the second cavity to cool other heat-generating components of the power module. Furthermore, a condenser is located outside the second cavity, with its inlet connected to the outlet of the cold plate and its outlet connected to the inlet of the cold plate. After the first refrigerant in the cold plate cools the core heat-generating component of the power module, it vaporizes and flows through pipes sequentially through the outlet of the cold plate and the inlet of the condenser into the condenser, thereby liquefying the vaporized first refrigerant. The liquefied first refrigerant then flows through pipes sequentially through the outlet of the condenser and the inlet of the cold plate back into the cold plate, continuing to participate in the circulating cooling process. This application utilizes a cold plate assembly to cool the core heat-generating component of the power module, while a second refrigerant within the second cavity of the submerged housing cools other heat-generating components of the power module. This places the core heat-generating component and other heat-generating components in different heat dissipation environments, reducing heat dissipation interference between them and improving heat dissipation efficiency. Furthermore, since the heat generated by the other heat-generating components of the power module is relatively small, the second refrigerant within the submerged housing does not need to circulate to complete heat dissipation, saving refrigerant waste and reducing costs.

[0009] In one embodiment, the condenser is positioned above the cold plate.

[0010] In one embodiment, the cold plate assembly further includes a copper substrate disposed in the first cavity, and the core heating element is attached to the cold plate through the copper substrate.

[0011] In one embodiment, the cold plate assembly further includes a thermal pad, through which the copper substrate abuts against the cold plate.

[0012] In one embodiment, the cold plate assembly includes a first connector and a second connector connected together, the first connector and the second connector surrounding to form the first cavity, and the power module and the cold plate sandwiched between the first connector and the second connector.

[0013] In one embodiment, the cold plate is disposed within the first cavity to divide the first cavity into a first space and a second space, both of which are used to accommodate portions of the power module.

[0014] In one embodiment, a liquid return assembly is further included, the liquid return assembly including a liquid return pipe and a first quick-connect pipe connected together, the liquid return pipe being disposed outside the second cavity, the first quick-connect pipe being disposed inside the second cavity, one end of the liquid return pipe opposite to the first quick-connect pipe being connected to the outlet of the condenser, and one end of the first quick-connect pipe opposite to the liquid return pipe being connected to the inlet of the cold plate.

[0015] In one embodiment, a drain assembly is further included, comprising a drain pipe and a second quick-connect pipe connected together. The drain pipe is disposed outside the second cavity, and the second quick-connect pipe is disposed inside the second cavity. One end of the drain pipe opposite to the second quick-connect pipe is connected to the inlet of the condenser, and the other end of the second quick-connect pipe opposite to the drain pipe is connected to the outlet of the cold plate.

[0016] In one embodiment, multiple cold plate assemblies are provided, and the multiple cold plate assemblies are arranged at intervals and disposed in the second cavity.

[0017] This application also provides a charging pile, including a power module and the heat dissipation device described in any of the above claims, wherein the power module is disposed in the first cavity and is attached to the cold plate.

[0018] The aforementioned charging pile places the power module within the first cavity of the cold plate assembly of the heat dissipation device. By bringing the core heat-generating component of the power module into contact with the cold plate, the cold plate cools the core heat-generating component of the power module. A second refrigerant is filled in the second cavity of the immersion housing, and the cold plate assembly is placed within the second cavity, where the second refrigerant cools the other heat-generating components of the power module. This application utilizes the cold plate assembly to cool the core heat-generating component of the power module, and the second refrigerant in the second cavity of the immersion housing to cool the other heat-generating components. This places the core heat-generating component and other heat-generating components in different heat dissipation environments, reducing heat dissipation interference between them and improving heat dissipation efficiency. Furthermore, since the heat generated by the other heat-generating components of the power module is relatively small, the second refrigerant in the immersion housing does not need to circulate to complete heat dissipation, saving refrigerant waste and reducing costs. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the heat dissipation device provided in an embodiment of this application.

[0020] Figure 2 This is a schematic diagram of the structure of the cold plate assembly provided in an embodiment of this application.

[0021] Figure 3 An exploded view of the cold plate assembly provided in an embodiment of this application.

[0022] Figure 4 This is a schematic diagram of the structure of the cold plate provided in an embodiment of this application.

[0023] In the picture:

[0024] 100. Cold plate assembly; 110. Cold plate; 111. Cold plate cover; 112. Cold plate body; 1121. Outlet; 1122. Inlet; 120. Copper substrate; 130. Thermal pad; 140. First connector; 150. Second connector;

[0025] 200. Immersion chamber; 210. Second chamber; 220. Insulated through-wall electrode terminal; 230. Through-wall communication terminal; 240. Handle; 250. Drainage quick connector; 260. Cover;

[0026] 300. Condenser;

[0027] 400. Return liquid assembly; 410. Return liquid pipe; 420. First quick-connect pipe;

[0028] 500. Drainage assembly; 510. Drainage pipe; 520. Second quick-connect fitting;

[0029] 600. Sealing gasket;

[0030] 700. Printed circuit board. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0037] The power module includes a core heat-generating component and other heat-generating components. In this field, the power module is usually cooled by immersion in liquid cooling. However, this heat dissipation method causes the core heat-generating component and other heat-generating components of the power module to be in the same heat dissipation environment, which interferes with each other and results in low heat dissipation efficiency.

[0038] To address the aforementioned technical problems, this application provides a heat dissipation device, such as... Figures 1 to 4As shown, the heat dissipation device includes a cold plate assembly 100, an immersion chamber 200, and a condenser 300. The cold plate assembly 100 has a first cavity, which includes a cold plate 110. The first cavity is used to accommodate the cold plate 110 and the power module, and the core heat-generating components of the power module are attached to the cold plate 110. The cold plate 110 is used to supply the flow of a first refrigerant. The immersion chamber 200 has a second cavity 210 for accommodating a second refrigerant, and the cold plate assembly 100 is disposed in the second cavity 210. The condenser 300 is disposed outside the second cavity 210, and the inlet of the condenser 300 is connected to the outlet 1121 of the cold plate 110, and the outlet of the condenser 300 is connected to the inlet 1122 of the cold plate 110.

[0039] The aforementioned heat dissipation device, by setting up a cold plate assembly 100, attaches the power module and the cold plate 110 together and places them within the first cavity of the housing. By attaching the core heat-generating component of the power module to the cold plate 110, the cold plate 110 cools the core heat-generating component of the power module. Meanwhile, the second cavity 210, which is submerged in the housing 200, is filled with a second refrigerant, and the cold plate assembly 100 is placed within the second cavity 210, where the second refrigerant cools the other heat-generating components of the power module. Furthermore, the condenser 300 is positioned outside the second cavity 210, with its inlet connected to the outlet 1121 of the cold plate 110 and its outlet connected to the inlet 1122 of the cold plate 110. After the first refrigerant in the cold plate 110 cools the core heating element of the power module, it vaporizes and flows through the outlet 1121 of the cold plate 110 and the inlet 1122 of the condenser 300 into the condenser 300 via pipelines, thereby liquefying the vaporized first refrigerant. The liquefied first refrigerant then flows through the outlet 1121 of the condenser 300 and the inlet 1122 of the cold plate 110 into the cold plate 110, continuing to participate in the circulating cooling. This application utilizes the cold plate assembly 100 to cool the core heating element of the power module, while the second refrigerant in the second cavity 210 of the immersion housing 200 cools other heating elements of the power module. This places the core heating element and other heating elements in different heat dissipation environments, reducing heat dissipation interference between the core heating element and other heating elements and improving heat dissipation efficiency. Furthermore, since the other heat-generating components of the power module do not generate much heat, the second refrigerant immersed in the enclosure 200 does not need to be circulated to complete heat dissipation, saving refrigerant waste and reducing costs.

[0040] It should be noted that the cold plate 110 contains a first refrigerant, and the second cavity 210 contains a second refrigerant. In some embodiments, the first and second refrigerants are the same, while in others, they are different. The selection of the first and second refrigerants is determined based on actual operational needs.

[0041] In some embodiments, the condenser 300 is flush with the cold plate 110 submerged in the housing 200; in other embodiments, the condenser 300 is positioned below the cold plate 110. It is understood that when the condenser 300 is flush with the cold plate 110 or positioned below the cold plate 110, a water pump is required to deliver the liquefied first refrigerant from the condenser 300 into the cold plate 110.

[0042] In this embodiment, as Figure 1 As shown, the condenser 300 is positioned above the cold plate 110. With the condenser 300 positioned above the cold plate 110, the vaporized first refrigerant automatically flows upward through the pipes into the condenser 300, while the liquefied first refrigerant, under the influence of gravity, automatically flows downward through the pipes into the cold plate 110. This application, by positioning the condenser 300 above the cold plate 110, eliminates the need for a water pump and its associated circulation pipes, enabling the liquefied first refrigerant to be delivered into the cold plate 110. This achieves unpowered cooling via the cold plate 110's loop heat pipes, simplifying the footprint of the cooling equipment and saving production costs.

[0043] Specifically, such as Figure 1 and Figure 2 As shown, the heat dissipation device also includes a liquid return assembly 400. The liquid return assembly 400 includes a liquid return pipe 410 and a first quick-connect pipe 420 connected together. The liquid return pipe 410 is disposed outside the second cavity 210, and the first quick-connect pipe 420 is disposed inside the second cavity 210. The end of the liquid return pipe 410 away from the first quick-connect pipe 420 is connected to the outlet of the condenser 300, and the end of the first quick-connect pipe 420 away from the liquid return pipe 410 is connected to the inlet 1122 of the cold plate 110. By setting up the liquid return assembly 400, the liquid return pipe 410 is connected to the outlet of the condenser 300, and the first quick-connect pipe 420 is connected to the inlet 1122 of the cold plate 110. The first refrigerant liquefied by the condenser 300 flows into the cold plate 110 sequentially through the outlet of the condenser 300, the liquid return pipe 410, the first quick-connect pipe 420, and the inlet 1122 of the cold plate 110, thereby delivering the first refrigerant liquefied by the condenser 300 into the cold plate 110.

[0044] Specifically, such as Figure 1 and Figure 2As shown, the heat dissipation device also includes a drain assembly 500, which includes a drain pipe 510 and a second quick-connect pipe 520 connected together. The drain pipe 510 is disposed outside the second cavity 210, and the second quick-connect pipe 520 is disposed inside the second cavity 210. One end of the drain pipe 510 away from the second quick-connect pipe 520 is connected to the inlet of the condenser 300, and the other end of the second quick-connect pipe 520 away from the drain pipe 510 is connected to the outlet 1121 of the cold plate 110. By setting up the drain assembly 500, the drain pipe 510 is connected to the inlet of the condenser 300, and the second quick-connect pipe 520 is connected to the outlet 1121 of the cold plate 110. The first refrigerant, after being heated and vaporized in the cold plate 110, flows into the condenser 300 through the outlet 1121 of the cold plate 110, the second quick-connect pipe 520, the drain pipe 510, and the inlet of the condenser 300 in sequence, thereby delivering the vaporized first refrigerant into the condenser 300.

[0045] More specifically, such as Figure 1 and Figure 2 As shown, the heat dissipation device also includes a sealing gasket 600. Sealing gaskets 600 are provided at the connection points of the drain pipe 510 and the second quick-connect pipe 520, and at the connection points of the return pipe 410 and the first quick-connect pipe 420, thereby improving the sealing performance at the connections of the drain pipe 510 and the second quick-connect pipe 520, the connection points of the return pipe 410 and the first quick-connect pipe 420, between the return assembly 400 and the immersion tank 200200, and between the drain assembly 500 and the immersion tank 200200. Further, as... Figure 1 and Figure 2 As shown, multiple cold plate assemblies 100 are provided, and the multiple cold plate assemblies 100 are arranged at intervals and disposed in the second cavity 210. Multiple cold plate assemblies 100 are disposed in the second cavity 210, and the multiple cold plate assemblies 100 are arranged at intervals. The first cavity of each cold plate assembly 100 is used to accommodate the core heat sink of the power module, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0046] In some embodiments, the cold plates 110 of a plurality of cold plate assemblies 100 share a single condenser 300.

[0047] In this embodiment, as Figure 1 and Figure 2 As shown, each cold plate assembly 100 has a corresponding condenser 300, liquid return assembly 400 and liquid drain assembly 500 on its cold plate 110.

[0048] Specifically, such as Figure 1 As shown, a quick-drain connector 250 is provided on the immersion chamber 200, which facilitates the discharge of the second refrigerant in the second chamber 210.

[0049] Specifically, the immersion chamber 200 is equipped with a quick-connect liquid inlet. By providing the quick-connect liquid inlet, it is easy to deliver the second refrigerant into the second chamber 210.

[0050] Specifically, such as Figure 1 As shown, the heat dissipation device also includes a cover 260 connected to the immersion chamber 200. Connecting the cover 260 to the immersion chamber 200 seals the second cavity 210 and prevents the second refrigerant in the second cavity 210 from flowing out of the immersion chamber 200.

[0051] More specifically, the cover 260 is made of a transparent material to facilitate observation of the working status of the cold plate assembly 100 inside the second cavity 210.

[0052] Specifically, such as Figure 1 As shown, the immersion tank 200 is provided with a through-wall communication terminal 230, which is electrically connected to the cold plate assembly 100, thereby realizing the communication connection between the cold plate assembly 100 and the control module of the heat dissipation equipment.

[0053] Specifically, such as Figure 1 As shown, the immersion tank 200 is provided with an insulating through-wall electrode terminal 220 and a through-wall communication terminal 230. Both the insulating through-wall electrode terminal 220 and the through-wall communication terminal 230 are used for external connection of the power module electrode, which ensures sealing and insulation performance while realizing the transmission of power module information.

[0054] Specifically, such as Figure 1 As shown, the immersion tank 200 is equipped with a handle 240 for easy movement of the immersion tank 200200.

[0055] Furthermore, such as Figures 2 to 4 As shown, a cold plate 110 is disposed within the first cavity to divide the first cavity into a first space and a second space, both of which are used to accommodate portions of the power module. With portions of the power module disposed in both the first and second spaces, and both sides of the cold plate 110 able to adhere to the portions of the power module, this not only improves the space utilization of the cold plate assembly 100 but also enhances the heat dissipation efficiency of the power module.

[0056] Specifically, such as Figures 2 to 4 As shown, the power module includes multiple printed circuit boards 700, multiple core heating elements, and multiple other heating elements. Each printed circuit board 700 is equipped with a core heating element and other heating elements. The multiple printed circuit boards 700 of the power module are respectively disposed in a first space and a second space.

[0057] More specifically, in this embodiment, the cold plate 110 divides the first cavity into a first space and a second space. A printed circuit board 700 is provided in both the first space and the second space, and the core heating element provided on each printed circuit board 700 is attached to the cold plate 110.

[0058] This application provides multiple cold plate assemblies 100, and each cold plate assembly 100 has two printed circuit boards 700 disposed in the first cavity of its housing, and the two printed circuit boards 700 are respectively distributed in the first space and the second space.

[0059] Specifically, such as Figures 2 to 4 As shown, the cold plate assembly 100 also includes a copper substrate 120 disposed in the first cavity, and the core heat-generating component is attached to the cold plate 110 through the copper substrate 120. Because the copper substrate 120 has good thermal conductivity, by providing the copper substrate 120, the core heat-generating component on the printed circuit board 700 is attached to the cold plate 110 through the copper substrate 120, thereby improving the heat dissipation efficiency of the core heat-generating component.

[0060] More specifically, such as Figures 2 to 4 As shown, there are multiple core heating elements and multiple copper substrates 120, with each core heating element and each copper substrate 120 connected in a corresponding manner.

[0061] Specifically, such as Figures 2 to 4 As shown, the cold plate assembly 100 also includes a thermal pad 130, through which the copper substrate 120 abuts against the cold plate 110. By providing the thermal pad 130, the copper substrate 120 abuts against the cold plate 110, thereby improving the thermal conductivity of the copper substrate 120 and further improving the heat dissipation efficiency of the core heat-generating component.

[0062] More specifically, there are multiple thermal pads 130 and multiple copper substrates 120, with each thermal pad 130 and each copper substrate 120 corresponding to the other.

[0063] Specifically, such as Figures 2 to 4 As shown, the cold plate assembly 100 includes a first connector 140 and a second connector 150 connected to each other. The first connector 140 and the second connector 150 form a first cavity, and the power module and the cold plate 110 are sandwiched between the first connector 140 and the second connector 150. By setting the first connector 140 and the second connector 150, the first connector 140 and the second connector 150 form the first cavity, thereby accommodating the cold plate 110, the copper substrate 120, the thermal pad 130, and the printed circuit board 700 of the power module.

[0064] Furthermore, such as Figure 4 As shown, the cold plate 110 includes a cold plate cover 111 and a cold plate body 112 connected to each other, and the cold plate body 112 has a cavity for containing a first refrigerant.

[0065] Specifically, such as Figures 2 to 4 As shown, the cold plate cover 111 and the cold plate body 112 are brazed together.

[0066] More specifically, a protrusion is provided on the side of the cold plate body 112 near the cold plate cover 111, and the protrusion is welded to the cold plate cover 111 to ensure that the cold plate 110 can withstand sufficient pressure.

[0067] Specifically, such as Figures 2 to 4 As shown, the cold plate body 112 is provided with an outlet 1121 and an inlet 1122, with the outlet 1121 located at the top of the cold plate body 112 and the inlet 1122 located below the outlet 1121. The condensed liquid first refrigerant enters the cold plate 110 from the inlet 1122, thereby ensuring that the refrigerant can circulate through evaporation without power.

[0068] This application also provides a charging pile, including a power module and a heat dissipation device as described above, wherein the power module is disposed in the first cavity and is attached to the cold plate 110.

[0069] In the aforementioned charging pile, the power module is placed within the first cavity of the cold plate assembly 100 of the heat dissipation device. The core heat-generating component of the power module is brought into contact with the cold plate 110, thereby utilizing the cold plate 110 to cool the core heat-generating component. Meanwhile, a second refrigerant is filled in the second cavity 210 of the immersion housing 200, and the cold plate assembly 100 is placed within the second cavity 210, using the second refrigerant to cool other heat-generating components of the power module. This application utilizes the cold plate assembly 100 to cool the core heat-generating component of the power module, and the second refrigerant filled in the second cavity 210 of the immersion housing 200 to cool other heat-generating components of the power module. This places the core heat-generating component and other heat-generating components in different heat dissipation environments, reducing heat dissipation interference between the core heat-generating component and other heat-generating components, and improving heat dissipation efficiency. Furthermore, since the heat generated by the other heat-generating components of the power module is relatively small, the second refrigerant in the immersion housing 200 does not need to circulate to complete heat dissipation, saving refrigerant waste and reducing costs.

[0070] It should be noted that the core heat-generating components of the power module are critical heat sources (IGBTs, etc.).

[0071] The heat dissipation cycle of the charging pile is explained below:

[0072] Because of the use of mixed liquid cooling, the immersion chamber 200 is a closed cavity. The first refrigerant in the cold plate 110 of the cold plate assembly 100 is heated and evaporates. The gaseous first refrigerant is transported to the condenser 300 for liquefaction through the second quick-connect pipe 520 and the drain pipe 510 of the drain assembly 500. The condensed first refrigerant flows back to the cold plate 110 through the return pipe 410 and the first quick-connect pipe 420, completing the heat dissipation cycle of the core heat-generating component of the power module. Moreover, by placing the condenser 300 above the cold plate 110, the heat dissipation of the cold plate 110 adopts the form of a loop heat pipe, eliminating the need for an additional pump for circulation.

[0073] Multiple cold plate assemblies 100 (three in this example) are centrally installed in the immersion chamber 200. Then, a second refrigerant is added to the immersion chamber 200 to dissipate heat from the remaining heat-generating components of the power module in the first cavity of the cold plate assembly 100 (excluding the heat dissipation of the cold plate 110).

[0074] This creates two independent heat dissipation cycles: one is the non-powered cold plate 110 loop heat pipe cooling, used to dissipate heat from the core heat-generating components of the power module; the other utilizes the second refrigerant immersed in the enclosure 200 for cooling the remaining heat-generating components of the power module. Furthermore, since the heat generated by the other heat-generating components of the power module is relatively small, the second refrigerant immersed in the enclosure 200 does not need to circulate to complete its cooling function.

[0075] In summary, the charging pile of this application has the following beneficial effects:

[0076] 1. This invention can provide different heat dissipation for the core heat-generating components of the power module and other heat-generating components, which better meets the heat dissipation requirements, saves energy and reduces consumption, and ensures the reliable operation of the system.

[0077] 2. Since the second refrigerant does not flow within the 200-degree immersion chamber, it only requires a normal pressure seal to meet the requirements, making it easier to achieve and less prone to leakage.

[0078] 3. A non-powered loop heat pipe is used to dissipate heat from the charging pile power module, eliminating the need for additional liquid cooling components such as pumps and storage tanks.

[0079] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A heat dissipation device, characterized in that, The heat dissipation device includes: A cold plate assembly (100) has a first cavity, the cold plate assembly (100) includes a cold plate (110), the first cavity is used to accommodate the cold plate (110) and the power module, and the cold plate (110) and the core heating element of the power module are attached together, and the cold plate (110) is used to supply a first refrigerant for flow; The immersion chamber (200) has a second cavity (210) for containing a second refrigerant, and the cold plate assembly (100) is disposed in the second cavity (210); A condenser (300) is disposed outside the second cavity (210), and the inlet of the condenser (300) is connected to the outlet (1121) of the cold plate (110), and the outlet of the condenser (300) is connected to the inlet (1122) of the cold plate (110).

2. The heat dissipation device according to claim 1, characterized in that, The condenser (300) is positioned above the cold plate (110).

3. The heat dissipation device according to claim 1, characterized in that, The cold plate assembly (100) further includes a copper substrate (120) disposed in the first cavity, and the core heating element is attached to the cold plate (110) through the copper substrate (120).

4. The heat dissipation device according to claim 3, characterized in that, The cold plate assembly (100) further includes a thermal pad (130), through which the copper substrate (120) abuts against the cold plate (110).

5. The heat dissipation device according to claim 1, characterized in that, The cold plate assembly (100) includes a first connector (140) and a second connector (150) connected to each other. The first connector (140) and the second connector (150) surround and form the first cavity. The power module and the cold plate (110) are sandwiched between the first connector (140) and the second connector (150).

6. The heat dissipation device according to claim 1, characterized in that, The cold plate (110) is disposed in the first cavity to divide the first cavity into a first space and a second space, both of which are used to accommodate portions of the power module.

7. The heat dissipation device according to claim 1, characterized in that, It also includes a liquid return assembly (400), which includes a liquid return pipe (410) and a first quick-connect pipe (420) connected to each other. The liquid return pipe (410) is disposed outside the second cavity (210), and the first quick-connect pipe (420) is disposed inside the second cavity (210). One end of the liquid return pipe (410) away from the first quick-connect pipe (420) is connected to the outlet of the condenser (300), and the other end of the first quick-connect pipe (420) away from the liquid return pipe (410) is connected to the inlet (1122) of the cold plate (110).

8. The heat dissipation device according to claim 1, characterized in that, It also includes a drain assembly (500), which includes a drain pipe (510) and a second quick-connect pipe (520) connected to each other. The drain pipe (510) is disposed outside the second cavity (210), and the second quick-connect pipe (520) is disposed inside the second cavity (210). One end of the drain pipe (510) away from the second quick-connect pipe (520) is connected to the inlet of the condenser (300), and the other end of the second quick-connect pipe (520) away from the drain pipe (510) is connected to the outlet (1121) of the cold plate (110).

9. The heat dissipation device according to claim 1, characterized in that, Multiple cold plate assemblies (100) are provided, and the multiple cold plate assemblies (100) are arranged at intervals and disposed in the second cavity (210).

10. A charging pile, characterized in that, It includes a power module and a heat dissipation device as described in any one of claims 1-9, wherein the power module is disposed in the first cavity and is attached to the cold plate (110).

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