Semiconductor temperature control system

Abstract

The invention relates to the technical field of semiconductors, and provides a semiconductor temperature control system comprising a main pipeline comprising a circulating liquid tank, a pump body and a heater which are communicated in sequence; the inlet end of a heat release passage of the heat exchanger is communicated with the outlet end of the pump body, and the outlet end of the heat release passage of the heat exchanger is communicated with the inlet end of the heater; the circulating liquid tank is provided with a steam outlet and a reflux inlet, the inlet end of a heat release passage of the recoverer is communicated with the steam outlet, the outlet end of the heat release passage of the recoverer is communicated with the reflux inlet, and the inlet end of a heat absorption passage of the recoverer is communicated with the inlet end of a heat absorption passage of the heat exchanger; and the outlet end of the heat absorption passage of the recoverer is communicated with the outlet end of the heat absorption passage of the heat exchanger. Therefore, the recovery and reutilization of the fluorination liquid can be realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a semiconductor temperature control system. Background Technology

[0002] High-temperature operation is a common and critical working mode in semiconductor-specific temperature control equipment. When the equipment operates at high temperatures, its internal temperature control system follows a specific circulation path: the working medium in the circulating tank is pumped out by a water pump, passes through a three-way valve and a heater, and is then delivered from the supply port to the customer, before returning through the customer's return port, forming a complete circulation loop. During system loop operation, when the heater continuously heats the medium, causing its temperature to exceed its boiling point, vapor bubbles are generated. These bubbles eventually accumulate in the circulating tank within the loop.

[0003] In related technologies, an exhaust structure is designed at the circulating liquid tank. The exhaust pipeline mainly consists of a one-way valve and a tank with adsorption function. This tank can adsorb and treat the discharged medium vapor, thereby effectively preventing the discharged medium vapor from escaping into the environment and causing pollution. However, although this treatment method avoids environmental pollution problems, there is still a waste of resources and costs for the medium itself, which to some extent increases the operating cost of the equipment and causes resource depletion. Summary of the Invention

[0004] This invention provides a semiconductor temperature control system to solve the problem of fluorinated liquid waste in the prior art.

[0005] This invention provides a semiconductor temperature control system, comprising: The main pipeline includes a circulating liquid tank, a pump body, and a heater connected in sequence; A heat exchanger, wherein the inlet end of the heat exchanger's heat dissipation passage is connected to the outlet end of the pump body, and the outlet end of the heat exchanger's heat dissipation passage is connected to the inlet end of the heater. The heat recovery unit has a steam outlet and a reflux outlet in the circulating liquid tank. The inlet end of the heat release passage of the heat recovery unit is connected to the steam outlet, the outlet end of the heat release passage of the heat recovery unit is connected to the reflux outlet, the inlet end of the heat absorption passage of the heat recovery unit is connected to the inlet end of the heat absorption passage of the heat exchanger, and the outlet end of the heat absorption passage of the heat recovery unit is connected to the outlet end of the heat absorption passage of the heat exchanger.

[0006] According to a semiconductor temperature control system provided by the present invention, the main pipeline further includes an electric three-way valve; the inlet end of the electric three-way valve is connected to the outlet end of the pump body, the first outlet end of the electric three-way valve is connected to the inlet end of the heat dissipation passage of the heat exchanger, and the second outlet end of the electric three-way valve is connected to the inlet end of the heater.

[0007] According to a semiconductor temperature control system provided by the present invention, a first valve body is provided between the inlet end of the heat absorption passage of the heat recovery unit and the inlet end of the heat absorption passage of the heat exchanger.

[0008] According to a semiconductor temperature control system provided by the present invention, the circulating liquid tank is provided with a first temperature sensor, and the semiconductor temperature control system is configured to control the action of the first valve body according to the temperature of the first temperature sensor.

[0009] According to a semiconductor temperature control system provided by the present invention, the main pipeline further includes a second temperature sensor located between the pump body and the heater, the second temperature sensor being used to monitor the temperature of the fluorinated liquid at the inlet end of the heater.

[0010] According to a semiconductor temperature control system provided by the present invention, the main pipeline further includes a third temperature sensor located on the outlet side of the heater, and the third temperature sensor is used to monitor the temperature of the fluorinated liquid at the outlet of the main pipeline.

[0011] According to a semiconductor temperature control system provided by the present invention, the main pipeline further includes a fourth temperature sensor located at the inlet end of the pump body, and the fourth temperature sensor is used to monitor the temperature of the fluorinated liquid at the inlet end of the main pipeline.

[0012] According to a semiconductor temperature control system provided by the present invention, the main pipeline further includes a flow meter located at the outlet end of the heater, and the flow meter is used to monitor the flow rate of the fluorinated liquid at the outlet end of the heater.

[0013] According to a semiconductor temperature control system provided by the present invention, a bypass channel is further included, wherein the inlet end of the bypass channel is disposed between the heater and the flow meter, and the outlet end of the bypass channel is disposed on the side where the inlet end of the pump body is located.

[0014] According to a semiconductor temperature control system provided by the present invention, a second valve body is provided on the bypass channel.

[0015] The semiconductor temperature control system provided by this invention connects the inlet end of the heat release path of the recoverer to the steam outlet of the circulating liquid tank, the outlet end of the heat release path of the recoverer to the return port of the circulating liquid tank, the inlet end of the heat absorption path of the recoverer to the inlet end of the heat absorption path of the heat exchanger, and the outlet end of the heat absorption path of the recoverer to the outlet end of the heat absorption path of the heat exchanger. In this way, the recovery and reuse of fluorinated liquid can be realized. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the semiconductor temperature control system provided by the present invention.

[0018] Figure 2 This is a schematic diagram of the recycler provided by the present invention.

[0019] Figure label: 1. Circulating liquid tank; 2. Pump body; 3. Heater; 4. Heat exchanger; 5. Heat recovery unit; 51. Heat release passage of the heat recovery unit; 52. Heat absorption passage of the heat recovery unit; 6. Electric three-way valve; 7. Second temperature sensor; 8. Third temperature sensor; 9. Fourth temperature sensor; 10. Flow meter; 11. Bypass passage; 111. Second valve body. Detailed Implementation

[0020] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on or indirectly set on another component; when a component is referred to as "connected to" another component, it can be directly connected to or indirectly connected to another component.

[0022] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" or "several" means two or more, unless otherwise explicitly specified.

[0024] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0025] like Figure 1 and Figure 2 As shown, the semiconductor temperature control system of this embodiment includes a main pipeline, a heat exchanger 4, and a heat recovery unit 5. The main pipeline includes a circulating liquid tank 1, a pump body 2, and a heater 3 connected in sequence. The inlet end of the heat release passage of the heat exchanger 4 is connected to the outlet end of the pump body 2, and the outlet end of the heat release passage of the heat exchanger 4 is connected to the inlet end of the heater 3. The circulating liquid tank 1 has a steam outlet and a reflux outlet. The inlet end of the heat release passage 51 of the heat recovery unit is connected to the steam outlet, the outlet end of the heat release passage 51 of the heat recovery unit is connected to the reflux outlet, the inlet end of the heat absorption passage 52 of the heat recovery unit is connected to the inlet end of the heat absorption passage of the heat exchanger 4, and the outlet end of the heat absorption passage 52 of the heat recovery unit is connected to the outlet end of the heat absorption passage of the heat exchanger 4.

[0026] It should be noted that the circulating liquid tank 1 is used to store the refrigerant, which can be a fluorinated liquid. The pump body 2 is used to control the flow direction of the refrigerant in the main pipeline. In other words, the pump body 2 provides power for the movement of the refrigerant in the main pipeline. By controlling the direction of the motor in the pump body 2, the flow direction of the refrigerant in the main pipeline can be controlled. The pump body 2 can be a centrifugal pump, a reciprocating pump, a mixed flow pump, or an axial flow pump, etc. Specifically, the embodiments of the present invention are not specifically limited here.

[0027] It is understood that heater 3 is used to regulate the temperature of the refrigerant. When it is necessary to increase the temperature of the refrigerant in the main pipeline, the power of heater 3 can be changed to achieve precise heating of the refrigerant. Heater 3 can be an electromagnetic heater 3, an infrared heater 3, or a resistance heater 3, etc. Specifically, this embodiment of the invention is not limited here.

[0028] Among them, the heat exchanger 4 is partially connected in parallel with the main pipeline. Specifically, the inlet end of the heat release passage of the heat exchanger 4 is connected to the outlet end of the pump body 2, and the outlet end of the heat release passage of the heat exchanger 4 is connected to the inlet end of the heater 3. The heat exchanger 4 is used to regulate the temperature of the refrigerant.

[0029] In this embodiment of the invention, the heat exchanger 4 can be a partition wall type heat exchanger 4, that is, the refrigerant in the main pipeline is introduced into the heat exchanger 4, and the liquid that exchanges heat with it is also introduced into the heat exchanger 4, so that the refrigerant and the heat exchange liquid are separated by the wall of the heat exchanger 4 and flow in different spaces of the heat exchanger 4. Through the heat conduction of the wall of the heat exchanger 4 and the convection of the liquid on the wall surface, the heat exchange process between the refrigerant in the main pipeline and the heat exchange liquid can be realized, thereby controlling the temperature of the refrigerant in the main pipeline. It should be noted that the heat exchanger 4 can cool down or heat up the refrigerant in the main pipeline. Specifically, this can be achieved by changing the temperature of the heat exchange liquid, which will not be elaborated here.

[0030] In practical applications, the high-temperature fluorinated liquid vapor in the main pipeline enters the circulating liquid tank 1, first passing through the steam outlet of the circulating liquid tank 1, and then through the inlet of the heat release passage 51 of the recovery unit. During this process, the vapor can exchange heat with the coolant in the heat absorption passage 52 of the recovery unit, thereby achieving rapid cooling. The cooled vapor quickly condenses into liquid in the heat release passage 51 of the recovery unit, and then returns to the circulating liquid tank 1 sequentially through the return port of the circulating liquid tank 1 and the outlet of the heat release passage 51 of the recovery unit.

[0031] It is understood that in the semiconductor temperature control system provided in this embodiment of the invention, by connecting the inlet end of the heat release passage 51 of the recoverer to the steam outlet of the circulating liquid tank 1, the outlet end of the heat release passage 51 of the recoverer to the reflux outlet of the circulating liquid tank 1, the inlet end of the heat absorption passage 52 of the recoverer to the inlet end of the heat absorption passage of the heat exchanger 4, and the outlet end of the heat absorption passage 52 of the recoverer to the outlet end of the heat absorption passage of the heat exchanger 4, the fluorinated liquid can be recovered and reused.

[0032] It is particularly important to point out here that, as Figure 2 As shown, the heat recovery unit 5 includes a housing and a tube disposed within the housing, wherein the tube is arranged in a spiral shape and both ends of the tube extend outside the housing. One end of the tube is defined as the inlet end of the heat release passage 51 of the heat recovery unit, and the other end is defined as the outlet end of the heat release passage 51 of the heat recovery unit. In the height direction of the housing, the inlet end of the heat release passage 51 of the heat recovery unit is located above the outlet end of the heat release passage 51 of the heat recovery unit. Correspondingly, the outlet end of the heat absorption passage 52 of the heat recovery unit is located at the top of the housing, and the inlet end of the heat absorption passage 52 of the heat recovery unit is located at the bottom of the housing.

[0033] In optional embodiments, such as Figure 1 As shown, the main pipeline also includes an electric three-way valve 6; the inlet end of the electric three-way valve 6 is connected to the outlet end of the pump body 2, the first outlet end of the electric three-way valve 6 is connected to the inlet end of the heat dissipation passage of the heat exchanger 4, and the second outlet end of the electric three-way valve 6 is connected to the inlet end of the heater 3.

[0034] It should be noted that the electric three-way valve 6 can be used to regulate the flow rate of the refrigerant entering the heat exchanger 4 and heater 3 from the outlet end of the pump body 2. In other words, the refrigerant entering the heat exchanger 4 and heater 3 needs to pass through the electric three-way valve 6 first. By adjusting the opening of the electric three-way valve 6, the flow rate of the refrigerant into the heat exchanger 4 or heater 3 can be controlled.

[0035] In an optional embodiment of the present invention, the electric three-way valve 6 can also be replaced by two electric two-way valves, that is, the outlet end of the pump body 2 is connected to the inlet end of two electric two-way valves, and the outlet end of the two electric two-way valves is connected to the inlet end of the heat release passage of the heat exchanger 4 and the inlet end of the heater 3, respectively. The flow rate of the refrigerant entering the heater 3 and the heat exchanger 4 is controlled by the two electric two-way valves, respectively, so as to achieve the same technical effect as the electric three-way valve 6.

[0036] In an optional embodiment, a first valve body is provided between the inlet end of the heat absorption passage 52 of the heat recovery unit and the inlet end of the heat absorption passage of the heat exchanger 4. The first valve body can be a solenoid valve. Specifically, opening the first valve body allows fluid to flow from the inlet end of the heat absorption passage of the heat exchanger 4 through the first valve body into the inlet end of the heat absorption passage 52 of the heat recovery unit, and then enter the heat absorption passage 52 of the heat recovery unit to participate in heat exchange.

[0037] In order to achieve energy saving, in practical applications, the circulating liquid tank 1 is equipped with a first temperature sensor, and the semiconductor temperature control system is configured to control the action of the first valve body according to the temperature of the first temperature sensor.

[0038] For example, when the temperature of the first temperature sensor is greater than or equal to the target temperature, the first valve body is controlled to open; when the temperature of the first temperature sensor is less than the target temperature, the first valve body is controlled to close.

[0039] It is particularly important to note that the semiconductor temperature control system involved in this embodiment of the invention has the function of separating multiple immiscible fluorinated liquids. When these fluorinated liquids have different boiling points, the system can introduce coolant at different temperatures into the heat absorption passage 52 of the recovery unit at different time periods, thereby performing cooling, recovery, and separation operations on fluorinated liquids with different boiling points respectively, ultimately achieving the purpose of separating multiple fluorinated liquids.

[0040] In optional embodiments, such as Figure 1As shown, the main pipeline also includes a second temperature sensor 7, which is located between the pump body 2 and the heater 3. The second temperature sensor 7 is used to monitor the temperature of the fluorinated liquid at the inlet end of the heater 3.

[0041] It should be noted that the second temperature sensor 7 is used to monitor the temperature of the refrigerant at the inlet of the heater 3. In other words, the refrigerant entering the heater 3 must first pass through the second temperature sensor 7. In this way, the second temperature sensor 7 can detect the temperature of the refrigerant at the inlet of the heater 3 in real time. The second temperature sensor 7 can be selected as a resistance temperature sensor or a thermocouple temperature sensor, and can be selected according to the needs.

[0042] In optional embodiments, such as Figure 1 As shown, the main pipeline also includes a third temperature sensor 8, which is located on the side where the heater 3 is located. The third temperature sensor 8 is used to monitor the temperature of the fluorinated liquid at the outlet of the main pipeline.

[0043] It should be noted that the third temperature sensor 8 is used to monitor the temperature of the refrigerant at the outlet of the main pipeline. In other words, the refrigerant flowing out of the main pipeline needs to pass through the third temperature sensor 8 first, so that the third temperature sensor 8 can monitor the temperature of the refrigerant at the outlet of the main pipeline in real time. The third temperature sensor 8 is similar to the second temperature sensor 7, and can also be selected as a resistance temperature sensor or a thermocouple temperature sensor, which can be selected according to the needs.

[0044] In optional embodiments, such as Figure 1 As shown, the main pipeline also includes a fourth temperature sensor 9, which is located on the inlet side of the pump body 2. The fourth temperature sensor 9 is used to monitor the temperature of the fluorinated liquid at the inlet of the main pipeline. Specifically, on the inlet side of the pump body 2, a third valve body and the fourth temperature sensor 9 are arranged sequentially, and the circulating liquid tank 1 is located between the fourth temperature sensor 9 and the pump body 2. The third valve body can be a solenoid valve.

[0045] It should be noted that the fourth temperature sensor 9 is used to monitor the temperature of the refrigerant at the inlet of the main pipeline. In other words, the refrigerant returning from the client to the main pipeline needs to pass through the fourth temperature sensor 9 first, so the fourth temperature sensor 9 can monitor the temperature of the refrigerant at the inlet of the main pipeline in real time. The fourth temperature sensor 9 is similar to the third temperature sensor 8, and can also be selected as a resistance temperature sensor or a thermocouple temperature sensor, which can be selected according to the needs.

[0046] In optional embodiments, such as Figure 1As shown, the main pipeline also includes a flow meter 10, which is located on the outlet side of the heater 3. The flow meter 10 is used to monitor the flow rate of the fluorinated liquid at the outlet of the heater 3. Specifically, on the outlet side of the heater 3, a pressure sensor, a third temperature sensor 8, a flow meter 10, and a fourth valve body are arranged in sequence. The fourth valve body can be a solenoid valve.

[0047] In practical applications, such as Figure 1 As shown, it also includes a bypass channel 11, with the inlet end of the bypass channel 11 located between the heater 3 and the flow meter 10, and the outlet end of the bypass channel 11 located on the side where the inlet end of the pump body 2 is located. Specifically, the inlet end of the bypass channel 11 is located between the heater 3 and the pressure sensor, and the outlet end of the bypass channel 11 is located between the circulating liquid tank 1 and the fourth temperature sensor 9.

[0048] It is understandable that, such as Figure 1 As shown, a second valve body 111 is provided on the bypass channel 11, and the second valve body 111 can be a solenoid valve. In this way, the flow rate of fluorinated liquid in the bypass channel 11 can be easily adjusted.

[0049] Finally, it should be noted that the terms "parallel" and "perpendicular" in the embodiments of this invention should not be strictly limited to a geometric sense. At least manufacturing and installation errors should be considered. For example, an error of ±10° should be within the protection range of the embodiments of this invention. The above embodiments are only used to illustrate the technical solutions of this invention, and not to limit it. Although the invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this invention.

Claims

1. A semiconductor temperature control system, characterized in that, include: The main pipeline includes a circulating liquid tank (1), a pump body (2), and a heater (3) connected in sequence. The heat exchanger (4) has its inlet end connected to the outlet end of the pump body (2) and its outlet end connected to the inlet end of the heater (3). The recovery unit (5) has a steam outlet and a return outlet in the circulating liquid tank (1). The inlet end of the heat release passage (51) of the recovery unit is connected to the steam outlet, the outlet end of the heat release passage (51) of the recovery unit is connected to the return outlet, the inlet end of the heat absorption passage (52) of the recovery unit is connected to the inlet end of the heat absorption passage of the heat exchanger (4), and the outlet end of the heat absorption passage (52) of the recovery unit is connected to the outlet end of the heat absorption passage of the heat exchanger (4).

2. The semiconductor temperature control system according to claim 1, characterized in that, The main pipeline also includes an electric three-way valve (6); the inlet end of the electric three-way valve (6) is connected to the outlet end of the pump body (2), the first outlet end of the electric three-way valve (6) is connected to the inlet end of the heat dissipation passage of the heat exchanger (4), and the second outlet end of the electric three-way valve (6) is connected to the inlet end of the heater (3).

3. The semiconductor temperature control system according to claim 1, characterized in that, A first valve body is provided between the inlet end of the heat absorption passage (52) of the heat recovery unit and the inlet end of the heat absorption passage of the heat exchanger (4).

4. The semiconductor temperature control system according to claim 3, characterized in that, The circulating liquid tank (1) is equipped with a first temperature sensor, and the semiconductor temperature control system is configured to control the action of the first valve body according to the temperature of the first temperature sensor.

5. The semiconductor temperature control system according to claim 1, characterized in that, The main pipeline also includes a second temperature sensor (7), which is located between the pump body (2) and the heater (3). The second temperature sensor (7) is used to monitor the temperature of the fluorinated liquid at the inlet of the heater (3).

6. The semiconductor temperature control system according to claim 1, characterized in that, The main pipeline also includes a third temperature sensor (8), which is located on the side where the outlet end of the heater (3) is located. The third temperature sensor (8) is used to monitor the temperature of the fluorinated liquid at the outlet end of the main pipeline.

7. The semiconductor temperature control system according to claim 1, characterized in that, The main pipeline also includes a fourth temperature sensor (9), which is located on the side of the inlet end of the pump body (2) and is used to monitor the temperature of the fluorinated liquid at the inlet end of the main pipeline.

8. The semiconductor temperature control system according to claim 1, characterized in that, The main pipeline also includes a flow meter (10), which is located on the side where the outlet end of the heater (3) is located. The flow meter (10) is used to monitor the flow rate of the fluorinated liquid at the outlet end of the heater (3).

9. The semiconductor temperature control system according to claim 8, characterized in that, It also includes a bypass channel (11), the inlet end of which is located between the heater (3) and the flow meter (10), and the outlet end of which is located on the side where the inlet end of the pump body (2) is located.

10. The semiconductor temperature control system according to claim 9, characterized in that, A second valve body (111) is provided on the bypass channel (11).

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