Sensor

Abstract

A sensor is provided with: a sensor main body (15); a diaphragm (21) that defines a housing space (R) together with the sensor body (15); and a transmission body (S) filled in the housing space (R), in which the measurement body (16) and the spacer (19) are disposed, a through-flow path (24) for injecting the transmission body (S) into the housing space (R) is formed across the sensor body (15) and the spacer (19), and the through-flow path (24) is formed by a through-hole penetrating the sensor body (15) in the axial direction and a through-hole penetrating the spacer (19) in the axial direction.

Description

[0001] This application is a divisional application of the invention patent application with application number 202180071221.6 (international application number PCT / JP2021 / 037442), application date October 8, 2021, and invention title "Pressure and Temperature Sensor". Technical Field

[0002] This invention relates to a pressure-temperature sensor capable of measuring the pressure and temperature of a fluid being measured. Background Technology

[0003] Pressure and temperature are used in various fields for equipment operation and maintenance, and both pressure and temperature are frequently used. To meet the requirement of obtaining both pressure and temperature simultaneously, pressure-temperature sensors are employed. A pressure-temperature sensor comprises: a pressure measuring element that outputs a pressure signal corresponding to the pressure of the fluid being measured; and a temperature measuring element that outputs a temperature signal corresponding to the temperature of the fluid being measured. This pressure-temperature sensor can transmit both pressure and temperature signals to external devices.

[0004] In such pressure-temperature sensors, the pressure and temperature sensors are sometimes positioned within the fluid being measured, and are thus susceptible to damage from the chemical and mechanical effects of the fluid. Therefore, pressure-temperature sensors with isolation mechanisms are widely used, where the pressure and temperature sensors are indirectly in contact with the fluid being measured.

[0005] An isolated pressure-temperature sensor, for example, has a pressure measuring element and a temperature measuring element disposed within a housing space divided by the sensor body and a diaphragm, and a transmission element filled within the housing space. The pressure measuring element outputs a pressure signal corresponding to the pressure of the transmission element received via the diaphragm from the pressure of the fluid being measured. The temperature measuring element outputs a temperature signal corresponding to the temperature of the transmission element received via the diaphragm from the temperature of the fluid being measured. The pressure and temperature signals are then converted into pressure and temperature measurement values ​​by an integrated circuit or similar device mounted on a substrate.

[0006] Patent Document 1, as an example of such an isolated pressure-temperature sensor, shows a sensor chip disposed within a housing filled with a transfer medium such as silicone oil. This sensor chip integrally comprises a pressure measuring element and a temperature measuring element. The sensor chip is a semiconductor diaphragm-type sensor chip with a bridge circuit. When pressure is applied to the sensor chip, the intermediate voltage of the bridge circuit, which functions as a pressure measuring element, changes, and the sensor chip outputs a pressure signal corresponding to this change. Furthermore, when the temperature of the sensor chip changes, the voltage across the bridge circuit, which functions as a temperature measuring element, changes, and the sensor chip outputs a temperature signal corresponding to this change.

[0007] Thus, in a pressure-temperature sensor like that in Patent Document 1, pressure and temperature can be measured by a sensor chip that integrates both a pressure measuring element and a temperature measuring element. Therefore, miniaturization is possible. However, since both measurements are taken using a single sensor chip, the construction of a pressure-temperature sensor like that in Patent Document 1 is limited. Furthermore, pressure changes in the transmission medium affect the temperature measuring element. Similarly, temperature changes in the transmission medium affect the pressure measuring element. Therefore, a pressure-temperature sensor like that in Patent Document 1 cannot measure accurate values ​​using individual measuring elements.

[0008] Therefore, pressure-temperature sensors like those in Patent Document 1 are difficult to correct for the influence of temperature on pressure measurements based on temperature signals. Consequently, the measured pressure and temperature values ​​lack accuracy. However, the relationship between pressure and temperature can be pre-calibrated to obtain accurate pressure and temperature values. However, sensor chips are manufactured using semiconductor processes, resulting in significant batch variations. Therefore, each solid needs to be calibrated for pressure and temperature, which is extremely time-consuming.

[0009] In the pressure-temperature sensor shown in Patent Document 2, which is another example of a pressure-temperature sensor, the pressure measuring body and the temperature measuring body are separate components. Specifically, the pressure measuring body is disposed within a receiving space filled with a transmitter. The temperature measuring body protrudes from the center of the diaphragm toward the fluid being measured. A thermistor disposed within a cap-shaped receiving portion is fixed by filling it with a resin with high thermal conductivity, thereby constituting the temperature measuring body.

[0010] Existing technical documents

[0011] Patent documents

[0012] Patent Document 1: Japanese Patent Application Publication No. 2009-121871 (pp. 6-8) Figure 2 )

[0013] Patent Document 2: Japanese Patent Application Publication No. 2013-2885 (pp. 6-9) Figure 1 ) Summary of the Invention

[0014] The problem that the invention aims to solve

[0015] Thus, in a pressure-temperature sensor like that in Patent Document 2, the pressure measuring body and the temperature measuring body are separate, allowing for independent output of either pressure or temperature signals. Therefore, a pressure-temperature sensor like that in Patent Document 2 can correct for the effect of temperature on the pressure measuring body based on the temperature signal. However, a portion of the temperature measuring body is exposed to the fluid being measured, while the pressure measuring body is located within the transmission body. Therefore, when the temperature of the fluid being measured changes, the temperature change transmitted to the pressure measuring body is delayed compared to the temperature change transmitted to the temperature measuring body. Even with the aforementioned correction, the pressure measurement value may sometimes be inaccurate.

[0016] This invention was made in view of such a problem, and its purpose is to provide a pressure-temperature sensor that can accurately measure pressure.

[0017] Methods for solving problems

[0018] To address the aforementioned issues, the pressure and temperature sensor of the present invention comprises: a sensor body; a diaphragm that, together with the sensor body, divides a storage space; and a transmission body that fills the storage space, wherein a pressure measuring body and a temperature measuring body are disposed within the storage space.

[0019] Therefore, for example, even if the temperature of the sealed fluid changes, the pressure-temperature sensor can use the accurate temperature measured by the temperature measuring body to correct the pressure value measured by the pressure measuring body. Thus, the pressure-temperature sensor can accurately measure pressure.

[0020] Alternatively, the pressure measuring body and the temperature measuring body may be disposed on the sensor body side.

[0021] Therefore, the measuring object is positioned on the stationary side. Consequently, the physical changes to the measuring object are small.

[0022] Alternatively, the pressure and temperature sensor may have a bonding lead that is electrically connected to the pressure measuring body or the temperature measuring body, and a buffer component for buffering the transmission body may be disposed in the storage space between the diaphragm and the pressure measuring body, the temperature measuring body and the bonding lead.

[0023] Therefore, even if a high pressure is applied to the diaphragm by the fluid being measured for a short period of time, the diaphragm will not deform significantly. Consequently, no large forces are exerted from the transmission medium onto the pressure measuring body, temperature measuring body, and the bonding leads themselves. Thus, the pressure measuring body, temperature measuring body, the connections between each bonding lead, and the connection between the temperature measuring body and the bonding leads are protected.

[0024] Alternatively, the buffer component may be configured to be closer to the diaphragm than the pressure measuring body or the temperature measuring body.

[0025] As a result, the space between the diaphragm and the buffer component becomes narrower. Therefore, even if the fluid being measured experiences a high pressure for a short period of time, a large pressure will not be applied to the transmission medium that houses the pressure measuring body and the temperature measuring body.

[0026] Alternatively, a through hole may be formed on the buffer component.

[0027] Therefore, the through hole functions as a throttling orifice. Consequently, the structure of the buffer component is simple.

[0028] Alternatively, the buffer component may be formed such that the axis of the through hole is offset from the pressure measuring body and the temperature measuring body.

[0029] Therefore, the transmission medium moving through the through hole is less likely to directly act on the pressure and temperature measuring bodies. Thus, the pressure and temperature measuring bodies are protected.

[0030] Alternatively, the temperature measuring element may be a thermoelectric resistive element.

[0031] As a result, the influence of pressure acting on the temperature measuring body is reduced. Therefore, pressure-temperature sensors can measure temperature and pressure more simply and accurately.

[0032] Alternatively, the pressure measuring body and the temperature measuring body can be separate components.

[0033] Therefore, the separate pressure and temperature measuring elements are housed in a shared storage space. This allows the pressure and temperature sensor to employ measuring elements suitable for each measurement, resulting in a structure less affected by the other's measurement.

[0034] Alternatively, the pressure and temperature sensors can mutually correct the measured values ​​of the pressure measuring body and the temperature measuring body.

[0035] Therefore, pressure and temperature sensors can accurately measure pressure and temperature. Attached Figure Description

[0036] Figure 1 This is a perspective view of a pressure and temperature sensor according to an embodiment of the present invention.

[0037] Figure 2 This is a cross-sectional view of the main part of the pressure and temperature sensor according to an embodiment of the present invention.

[0038] Figure 3 This is a top view of the spacer.

[0039] Figure 4 This is a top view of the interior enclosure. Detailed Implementation

[0040] Hereinafter, the method of using a pressure and temperature sensor for implementing the present invention will be described based on embodiments.

[0041] Example

[0042] Reference Figures 1-4 The pressure and temperature sensor of the embodiment will be described below. Figure 2 The top, bottom, left, and right sides when viewed from the front are described as the top and bottom sides of the pressure and temperature sensor. Specifically, the upper side of the paper surface where the connector 11 is located is described as the upper side of the pressure and temperature sensor, and the lower side of the paper surface where the diaphragm cover 22 is located is described as the lower side of the pressure and temperature sensor.

[0043] like Figure 1 As shown, the pressure-temperature sensor 1 of the present invention is configured to detect the pressure of the object to be measured, and uses a battery (not shown) as a power source. Furthermore, the pressure-temperature sensor 1 is fixed to a mounting part such as a pipe, pipeline, or tank (not shown), and detects the pressure and temperature of the object to be measured inside the mounting part. The object to be measured is a fluid such as a liquid or gas.

[0044] like Figure 1 As shown, the pressure-temperature sensor 1 mainly includes a power supply unit 2 and a sensor unit 10. For example, the pressure-temperature sensor 1 is used by screwing the threaded portion 2a formed at the lower end of the power supply unit 2 into the mounting port of a pipe (not shown).

[0045] like Figure 2 As shown, the sensor unit 10, from the top side, mainly includes a connector 11, a substrate 12, a signal processing circuit 13, multiple electrode pins 14, a sensor body 15, a pressure measuring body 16, a temperature measuring body 17, multiple bonding leads 18, a spacer 19, an inner cover 20 as a buffer component, a diaphragm 21, and a diaphragm cover 22.

[0046] Connector 11 is electrically connected to power supply unit 2. Connector 11, signal processing circuit 13, and multiple electrode pins 14 are electrically connected to substrate 12. Sensor body 15 is formed of metal or resin material.

[0047] Pressure sensor 16 and temperature sensor 17 are disposed within a recess 150 of sensor body 15. Multiple bonding leads 18 are electrically connected to electrode pins 14 and pressure sensor 16, or to electrode pins 14 and temperature sensor 17.

[0048] Spacer 19 is disposed within recess 150. Diaphragm 21 is formed of metal or resin. Diaphragm cover 22 is formed of metal or resin. Furthermore, silicone oil S, serving as a transfer medium, is filled in the storage space R divided by sensor body 15 and diaphragm 21.

[0049] The sensor body 15 is formed in the shape of a bottomed cylinder. A recess 150, multiple connecting holes 151, and a connecting path 152 are formed within the sensor body 15. The recess 150 is recessed axially upward from the lower end of the sensor body 15. The connecting hole 151 extends axially from the outer diameter side of the bottom surface 150a of the recess 150. The connecting path 152 extends axially from the outer diameter side of one of the connecting holes 151 on the bottom surface 150a.

[0050] The connecting holes 151 are arranged approximately evenly in the circumferential direction. Each connecting hole 151 is sealed by an airtight seal 23 with one electrode pin 14 inserted through it.

[0051] The upper end face of the pressure measuring body 16 and the upper end face of the temperature measuring body 17 are attached to the center of the bottom surface 150a of the recess 150 by an adhesive.

[0052] The pressure measuring element 16 is a MEMS (Micro Electro Mechanical Systems) device. The lower surface of the pressure measuring element 16, i.e., the sensing surface 16a, is positioned opposite the diaphragm 21. When the pressure acting on the sensing surface 16a changes, the resistance value of a strain gauge (not shown) changes. Utilizing this, the pressure measuring element 16 outputs a voltage corresponding to the pressure as a pressure signal, i.e., a measured value.

[0053] The lower surface of the temperature measuring element 17, i.e., the sensing surface 17a, is positioned opposite the diaphragm 21. When the temperature of the sensing surface 17a changes, the resistance value changes. Utilizing this, the temperature measuring element 17 outputs a voltage corresponding to the temperature as a temperature signal, i.e., a measured value. Furthermore, the temperature measuring element 17 is preferably a platinum thermoelectric resistor, but it can also be a copper thermoelectric resistor, a nickel thermoelectric resistor, or other thermoelectric resistors besides platinum.

[0054] Furthermore, a cylindrical spacer 19 is fitted into the recess 150 along the circumferential surface 150b, which is substantially perpendicular to the bottom surface 150a. The upper end face of the spacer 19 is adhered to the outer diameter side end of the bottom surface 150a by an adhesive.

[0055] Reference Figure 2 , Figure 3The spacer 19 is made of aluminum. Furthermore, the axial dimensions of the spacer 19 are formed to be approximately uniform. Regarding the radial dimensions of the spacer 19, except for a portion having a thick portion 190 that bulges inwards towards the inner diameter, the rest are formed to be approximately uniform. An axially extending connecting passage 191 is formed in the thick portion 190. This connecting passage 191 is aligned with the connecting passage 152 of the sensor body 15. The connecting passages 152 and 191 form a through flow path 24 communicating with the storage space R.

[0056] Reference Figure 2 The through-flow path 24 is used when filling the receiving space R with silicone oil S. After the silicone oil S is filled, the through-flow path 24 is sealed by fitting the oil plug 25 into the upper end of the through-flow path 24.

[0057] Additionally, an interior cover 20, shaped as a disc, is fitted into the recess 150 along the circumferential surface 150b. The upper end face of the interior cover 20 is adhered to the lower end face of the spacer 19 by an adhesive.

[0058] Reference Figure 2 , Figure 4 The interior cover 20 is made of aluminum. The interior cover 20 has a base 200 and a peripheral wall 201. The base 200 is in the shape of a circular plate. The peripheral wall 201 is annular, extending from the outer peripheral end of the base 200 toward the axially upward side. A through hole 202 is formed in the center of the base 200, extending axially through the center.

[0059] Furthermore, the axial dimensions of the peripheral wall 201 of the inner cover 20 are formed to be approximately the same. Regarding the radial dimensions of the peripheral wall 201, except for a thin portion 201a formed where a portion of the inner diameter side is recessed towards the outer diameter side, the rest are formed to be approximately the same. This thin portion 201a is formed in alignment with the thick portion 190 of the spacer 19.

[0060] Additionally, a diaphragm 21 is fixed to the lower end of the sensor body 15 by welding or adhesive. The storage space R formed between the recess 150 of the sensor body 15 and the diaphragm 21 is isolated from the fluid being measured.

[0061] More specifically, the storage space R is divided into space R1 and space R3. Space R1 is defined by the bottom surface 150a of the recess 150, the spacer 19, and the inner cover 20. Space R3 is defined by the inner cover 20, the peripheral surface 150b of the recess 150, and the diaphragm 21. Spaces R1 and R3 are connected by a through hole 202 in the inner cover 20.

[0062] In addition, the space in space R1 divided by the lower end face of the thick portion 190 of the spacer 19, the inner peripheral surface of the thin portion 201a of the inner cover 20, and the upper end face of the base 200 is called space R2.

[0063] Additionally, refer to Figure 2 The height dimension of the peripheral wall 201 of the inner enclosure 20, more specifically, the dimension from the upper end face of the base 200 to the upper end face of the peripheral wall 201, is shorter than the thickness dimension of the base 200. Consequently, the height dimension of space R2 is also shorter than the thickness dimension of the base 200. Thus, space R2 is a very narrow space within space R1.

[0064] Furthermore, a disc-shaped diaphragm cover 22 is fixed to the lower end of the diaphragm 21 by welding or adhesive. Additionally, a plurality of axially extending connecting passages 22a are formed at the bottom of the diaphragm cover 22.

[0065] Next, the method for outputting the measured pressure and temperature values ​​of the pressure-temperature sensor 1 will be described. In the pressure-temperature sensor 1, which is fixed at the mounting port of the piping, the fluid to be measured flows into the space between the diaphragm 21 and the diaphragm cover 22 through the connecting passage 22a. Pressure and temperature are transmitted from the fluid to be measured to the silicone oil S via the diaphragm 21. Therefore, a voltage corresponding to the pressure of the silicone oil S is obtained from the pressure measuring body 16. And a voltage corresponding to the temperature of the silicone oil S is obtained from the temperature measuring body 17.

[0066] The voltages obtained from the pressure measuring body 16 or the temperature measuring body 17 are analog signals. Each analog signal is amplified by an amplifier circuit (not shown) provided on the substrate 12, then input to the signal processing circuit 13, where it is converted into a digital signal by an A / D converter, and then corrected by a correction unit. Alternatively, the amplifier circuit may be provided on the pressure measuring body 16 or the temperature measuring body 17, or it may not be provided.

[0067] Digital signals are less susceptible to external factors such as noise compared to analog signals. Therefore, compared to structures that perform A / D conversion in the power supply unit 2, external devices, etc., the pressure and temperature sensor 1 of this embodiment can output accurate pressure and temperature measurements to external devices.

[0068] The correction of the signal processing circuit 13 described above will be explained. In the correction unit, the digitally converted temperature data is compared with reference data, and the digitally converted pressure data is corrected based on the difference. As a result, the pressure-temperature sensor 1 can accurately measure pressure and temperature.

[0069] Furthermore, the calibration unit can compare the digitally converted pressure data with reference data, and correct the digitally converted temperature data based on the difference. Additionally, the calibration unit can also perform mutual correction between the pressure data and the temperature data.

[0070] Furthermore, an example of using digitally converted data for correction was described, but it is also possible to correct analog data and then convert it through the A / D converter unit.

[0071] As explained above, even if, for example, the temperature of the sealed fluid changes, the pressure-temperature sensor 1 of this embodiment can correct the pressure value measured by the pressure measuring body 16 using the accurate temperature measured by the temperature measuring body 17. Thus, the pressure-temperature sensor 1 can accurately measure the pressure.

[0072] Furthermore, pressure and temperature are applied to the pressure measuring body 16 and the temperature measuring body 17 via a shared silicone oil S. Therefore, even if the temperature of the sealed fluid changes, the signal processing circuit 13 can correct for the effect of temperature on the pressure measuring body 16 without time delay. Thus, the pressure-temperature sensor 1 can accurately measure the pressure.

[0073] Furthermore, the pressure measuring element 16 and the temperature measuring element 17 are disposed on the sensor body 15, which is not affected by changes in pressure or temperature. Therefore, the physical changes to the pressure measuring element 16 and the temperature measuring element 17 are small.

[0074] Furthermore, the sensing surfaces 16a and 17a of both the pressure measuring body 16 and the temperature measuring body 17 are arranged opposite to the diaphragm 21. In other words, the sensing surfaces 16a and 17a are arranged facing the same direction. Therefore, the time difference between the temperature acting on the temperature measuring body 17 and the temperature acting on the pressure measuring body 16 is smaller.

[0075] Furthermore, when a shock wave or similar high pressure is generated in the fluid being measured and applied to the diaphragm 21 for a short period of time, the diaphragm 21 indents towards the space R3 side. At this time, the through hole 202 of the inner cover 20 functions as a throttling orifice, which restricts the flow rate of silicone oil S from space R3 to space R1. As a result, the diaphragm 21 does not deform significantly. Consequently, the silicone oil S does not exert a large force on the pressure measuring body 16, the temperature measuring body 17, and each bonding lead 18.

[0076] In particular, the pressure measuring element 16 is a MEMS with an external dimension of about a few millimeters and a thin-walled portion of less than 1 millimeter, thus exhibiting poor durability against external forces. Furthermore, the connection points of the bonding leads 18 connected to it are tiny and may be peeled off due to external forces. Therefore, in the pressure-temperature sensor 1 of this embodiment, as described above, the connection between the pressure measuring element 16 and the bonding leads 18, as well as the connection between the temperature measuring element 17 and the bonding leads 18, are protected by the inner cover 20. Additionally, the bonding leads 18 are formed of metals such as gold or aluminum, but any material that can transmit measurement signals is acceptable.

[0077] Furthermore, the inner shroud 20 is positioned closer to the diaphragm 21 than the pressure measuring body 16 and the temperature measuring body 17. Even considering the difference in diameter between space R1 and space R3, space R3 is narrower than space R1. Therefore, even if a high pressure, such as a shock wave, is applied to the diaphragm 21 in the fluid being measured for a short period, less silicone oil S moves from space R3 to space R1. In other words, less pressure is applied to the silicone oil S in space R1, which houses the pressure measuring body 16 and the temperature measuring body 17.

[0078] Furthermore, as mentioned above, the through hole 202 functions as a throttling orifice. Therefore, the structure of the inner cover 20, which can buffer the silicone oil S, is simple.

[0079] Furthermore, the through hole 202 of the inner cover 20 is configured such that the axis P, as shown by the dashed line, passes between the pressure measuring body 16 and the temperature measuring body 17 disposed in the recess 150. Therefore, the silicone oil S moving through the through hole 202 is less likely to directly act on the pressure measuring body 16 and the temperature measuring body 17. As a result, the pressure measuring body 16 and the temperature measuring body 17 are protected.

[0080] Furthermore, each electrode pin 14 is positioned closer to the outer diameter side than the pressure measuring body 16 and the temperature measuring body 17. Therefore, the connections between each electrode pin 14 and each bonding lead 18, the connection between the pressure measuring body 16 and the bonding lead 18, and the connection between the temperature measuring body 17 and the bonding lead 18 are appropriately protected.

[0081] Furthermore, multiple electrode pins 14 are disposed on the outer diameter side of the pressure measuring body 16 and the temperature measuring body 17. Therefore, compared to a structure where the electrode pins 14 are disposed between the pressure measuring body 16 and the temperature measuring body 17, the pressure measuring body 16 and the temperature measuring body 17 can be disposed close together. As a result, the time difference before temperature and pressure act on the pressure measuring body 16 or the temperature measuring body 17 is further reduced.

[0082] Furthermore, space R2 is a very narrow space within space R1. Additionally, space R2 is relatively far from the through-hole 202 of the inner casing 20. Therefore, the influence of the pressure and temperature of the fluid being measured is less likely to affect the through-flow path 24 from space R2.

[0083] Furthermore, the through-flow path 24 is connected to the space R2 at the outer diameter end of the space R1. For example, compared to a structure where the axis of the through-flow path 24 is located between the pressure measuring body 16 and the temperature measuring body 17, the pressure and temperature of the fluid being measured are more easily transmitted to the space outside the space R2 within the space R1. As a result, the pressure and temperature sensor 1 can accurately measure the pressure and temperature of the fluid being measured in a short time.

[0084] Furthermore, the temperature measuring element 17 is a resistive temperature sensor. This reduces the influence of pressure acting on the temperature measuring element 17. Therefore, the pressure-temperature sensor 1 can measure temperature and pressure more simply and accurately.

[0085] Furthermore, separate pressure measuring element 16 and temperature measuring element 17 are arranged within a shared storage space R filled with silicone oil S. Thus, the pressure and temperature sensor 1 can employ measuring elements 16 and 17 adapted to each measured value, enabling a structure that reduces the influence of the other's measured value.

[0086] Furthermore, impurities and other contaminants are less likely to enter the space between the diaphragm cover 22 and the diaphragm 21 through the communication path 22a of the diaphragm cover 22. Therefore, the diaphragm cover 22 can protect the diaphragm 21.

[0087] Furthermore, the space R2 is composed of a thick portion 190 of the spacer 19 and a thin portion 201a of the inner cover 20, which are separate from each other. A connecting path 191 communicating with the space R2 is formed in the spacer 19. Thus, compared with a configuration in which the space R2 and the connecting path 191 are integrally formed, the space R2 and the connecting path 191 in this embodiment can be configured more simply.

[0088] Furthermore, the inner cover 20 is formed of aluminum, which has high thermal conductivity. This facilitates heat transfer to the silicone oil S within the space R1. Consequently, the pressure-temperature sensor 1 exhibits good responsiveness in measuring pressure and temperature. Alternatively, the inner cover 20 can also be formed of other metals or resins with high thermal conductivity, and is not limited to aluminum.

[0089] Furthermore, both the spacer 19 and the inner cover 20 are made of aluminum. Therefore, the thermal expansion caused by the temperature of the silicone oil S has approximately the same effect. Consequently, the spacer 19 and the inner cover 20 are less prone to breakage. Additionally, the spacer 19 and the inner cover 20 are preferably made of raw materials with the same coefficient of thermal expansion, but they can also be made of raw materials with different coefficients of thermal expansion.

[0090] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the specific structure is not limited to these embodiments. Even if there are changes or additions that do not depart from the spirit of the present invention, they are also included in the present invention.

[0091] For example, in the above embodiments, a structure for measuring absolute pressure without atmospheric pressure acting on the pressure measuring body was described, but it is not limited to this. A structure for measuring gauge pressure by acting atmospheric pressure on the pressure measuring body can also be used.

[0092] In addition, the structure of the temperature measuring body is described as a temperature measuring resistor, but it is not limited to this. It can also be a thermocouple, thermistor, resistive element, etc., and can be changed appropriately.

[0093] In addition, the structure in which the pressure measuring body and the temperature measuring body are arranged on the bottom surface of the same recess has been described, but it is not limited to this and they can also be arranged on the circumferential surface of the recess.

[0094] In addition, the structure of silicone oil as the carrier is described, but it is not limited to this. It can also be water, air, oil, etc., and can be changed appropriately.

[0095] Furthermore, while a structure with a thick portion for the spacer has been described, it is not limited to this. The radial dimension, i.e., the thickness dimension, of the peripheral wall can also be relatively longer than the thickness dimension of the peripheral wall of the inner cover and approximately the same throughout the entire circumferential range. With such a structure, it becomes easier to form a through flow path after the spacer is fixed to the sensor body, thereby facilitating the formation of the through flow path and the space connected by the through flow path.

[0096] Label Explanation

[0097] 1: Pressure and temperature sensor; 10: Sensor unit; 15: Sensor body; 16: Pressure measuring body; 16a: Sensing surface; 17: Temperature measuring body; 17a: Sensing surface; 18: Bonding lead; 20: Inner cover; 21: Diaphragm; 202: Through hole; P: Shaft; R: Storage space; S: Silicone oil (transmitter).

Claims

1. A sensor having: Sensor body; A diaphragm, together with the sensor body, defines a storage space; and The delivery body fills the storage space. A measuring element and a spacer are arranged within the storage space. A through flow path for injecting the transfer medium into the receiving space is formed throughout the sensor body and the spacer. The through-flow route is formed by a through-hole that penetrates the sensor body axially and a through-hole that penetrates the spacer axially.

2. The sensor according to claim 1, wherein, The through hole of the spacer is formed in a thick portion that bulges out toward the inner diameter side of the spacer.

3. The sensor according to claim 1, wherein, The spacer is cylindrical.

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