Cover window etching apparatus and cover window etching method for manufacturing electronic device

Abstract

Disclosed are a cover window etching apparatus and a cover window etching method for manufacturing an electronic device. The cover window etching device comprises an objective table used for supporting an initial cover window; a plurality of plates disposed above the stage; and a nozzle disposed above the plurality of plates, where the nozzle sprays an etchant toward the initial cover window. The plurality of plates reciprocates in a first direction.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2024-0137065, filed on October 8, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to a cover window etching apparatus for manufacturing electronic devices, and a cover window etching method for manufacturing electronic devices using the cover window etching apparatus. Background Technology

[0004] Electronic devices can provide information to users by displaying various images on a screen. Typically, electronic devices display information within a designated screen. Recently, flexible display devices, including foldable flexible display panels, have been developed. Unlike rigid electronic devices, flexible electronic devices can be foldable, rollable, or bendable. Regardless of existing screen sizes, flexible electronic devices that can deform into various shapes can be portable, thus improving user convenience.

[0005] Such electronic devices may include a display panel and a cover window disposed on the display panel to protect the display panel. Summary of the Invention

[0006] This disclosure provides a cover window etching apparatus for manufacturing electronic devices, which can easily etch cover windows for electronic devices.

[0007] This disclosure also provides a cover window etching apparatus for manufacturing electronic devices, which effectively prevents the boundary between the folded and unfolded portions of the cover window for electronic devices from being observed.

[0008] An embodiment of the present invention provides a cover window etching apparatus for manufacturing an electronic device. The cover window etching apparatus for manufacturing an electronic device includes: a stage for supporting an initial cover window; a plurality of plates disposed above the stage; and a nozzle disposed above the plurality of plates, wherein the nozzle sprays etchant toward the initial cover window, and the plurality of plates reciprocate in a first direction.

[0009] In an embodiment of the present invention, a cover window etching method for manufacturing an electronic device includes: setting an initial cover window on a stage; moving the stage to position the stage under a plurality of plates spaced apart from each other in a first direction inside a receiving recess defined by a housing; and etching the initial cover window by spraying etchant toward the initial cover window using nozzles disposed above the plurality of plates, wherein the plurality of plates move in the first direction when the nozzles spray the etchant.

[0010] In an embodiment of the present invention, a cover window etching apparatus for manufacturing an electronic device includes: a plurality of holding members spaced apart from each other in a first direction, wherein the plurality of holding members support an initial cover window; a source member disposed below the plurality of holding members and providing an etchant; and a housing housing the plurality of holding members and the source member, wherein the plurality of holding members reciprocate in the first direction. Attached Figure Description

[0011] The above and other features of the embodiments of the present invention will become more apparent from the following detailed description of the embodiments of the present invention with reference to the accompanying drawings, wherein:

[0012] Figure 1 This is a cross-sectional view of a cover window etching apparatus for manufacturing an electronic device according to an embodiment of the present invention;

[0013] Figure 2A This includes using Figure 1 The diagram shows a perspective view of the electronic device used to manufacture the cover window using a cover window etching apparatus.

[0014] Figure 2B It is shown Figure 2A The electronic device shown in the figure is in a folded state.

[0015] Figure 3 yes Figure 2A An exploded perspective view of the electronic device illustrated in the figure;

[0016] Figure 4 yes Figure 3 The cross-sectional view of the cover window shown in the figure;

[0017] Figures 5A to 5C It is used to describe the etching process. Figure 4 The cross-sectional view of the window covering method shown in the figure;

[0018] Figure 6 This is a cross-sectional view of a cover window etching apparatus for manufacturing an electronic device according to an embodiment of the present invention;

[0019] Figure 7 This is a cross-sectional view of a cover window etching apparatus for manufacturing an electronic device according to an embodiment of the present invention;

[0020] Figures 8A to 8C It is a description of the use of Figure 6 The diagram shows a method for etching a cover window using an etching apparatus for manufacturing electronic devices; and

[0021] Figure 9 It is a description of the use of Figure 7 The diagram shows a method for etching a cover window using a cover window etching apparatus for manufacturing electronic devices. Detailed Implementation

[0022] The invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0023] It will be understood that when an element is referred to as being "on" another element, the element may be directly on the other element, or there may be intervening elements between them. Conversely, when an element is referred to as being "directly on" another element, there are no intervening elements. In this specification, it will be understood that when an element (or region, layer, or portion, etc.) is referred to as being "connected to" or "bonded to" another element, the element may be directly connected to or directly bonded to the other element, or other elements may be disposed between them.

[0024] The same reference numerals or symbols always refer to the same elements. Furthermore, in the accompanying drawings, the thickness, proportions, and dimensions of elements are exaggerated for the purpose of effectively describing the technical content.

[0025] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Therefore, without departing from the teachings herein, “first element,” “first component,” “first region,” “first layer,” or “first section” discussed below may be referred to as “second element,” “second component,” “second region,” “second layer,” or “second section.”

[0026] Furthermore, relative terms such as “below” or “bottom” and “above” or “top” may be used herein to describe the relationship between one element and another as illustrated in the accompanying drawings. It will be understood that, in addition to the orientation depicted in the drawings, the relative terms are intended to cover different orientations of the device. For example, if the device is flipped in a drawing, an element described as being “below” the other elements will subsequently be positioned “above” the other elements. Thus, depending on the specific orientation of the drawing, the term “below” can cover both “below” and “above” orientations. Similarly, if the device is flipped in a drawing, an element described as being “below” or “under” the other elements will subsequently be positioned “above” the other elements. Thus, the term “below” or “under” can cover both “above” and “below” orientations.

[0027] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, “a,” “an,” “the,” and “at least one” do not indicate a limitation on quantity and are intended to include both the singular and plural forms. Therefore, reference to “an” in the following claims to the “the” element includes one element and multiple elements. For example, unless the context clearly indicates otherwise, “an element” has the same meaning as “at least one element.” “At least one” should not be construed as limited to “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items. It will also be understood that, when used in this specification, the terms “comprising” and / or “including” or “having” and / or “containing” indicate the presence of the stated features, areas, integrals, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components and / or groups thereof.

[0028] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), the terms "about" or "approximately" as used herein include the stated value and mean within an acceptable range of deviation from the stated value as determined by one of ordinary skill in the art. For example, "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0029] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Unless expressly defined herein, it will also be understood that terms such as those defined in general dictionaries shall be interpreted as having meanings consistent with their meanings in the context of the relevant field, and shall not be interpreted in an idealized or overly formalized sense.

[0030] The embodiments are described herein with reference to cross-sectional views as idealized examples. Thus, variations in the shape of the figures are anticipated due to factors such as manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions illustrated herein, but will include deviations in shape, for example, due to manufacturing processes. For instance, regions illustrated or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners in the figures may be rounded. Therefore, the regions illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions, nor are they intended to limit the scope of the claims.

[0031] In the following description, embodiments of the invention are illustrated with reference to the accompanying drawings.

[0032] Figure 1 This is a cross-sectional view of a cover window etching apparatus for manufacturing electronic devices according to an embodiment of the present invention.

[0033] An embodiment of a cover window etching apparatus (WEA) for manufacturing electronic devices may include a housing HS, a stage STG, multiple transport components WH, multiple plate PLTs, multiple drive components DU, and a nozzle NZ.

[0034] In this embodiment, the housing HS is illustrated to have a shape defined as part of a quadrilateral, but the shape of the housing HS is not limited thereto and can be varied depending on the embodiment. The housing HS may define receiving recesses AGR for accommodating the stage STG, the conveying component WH, and a plurality of plates PLT.

[0035] The housing HS may include a base plate (or base) BP, a plurality of sidewall portions SW, and a door GAT. The base plate BP (e.g., the upper surface of the base plate BP) may define a base plate surface that receives a recess AGR. The sidewall portions SW may extend upward from two opposing sides of the base plate BP in a first direction DR1. The sidewall portions SW may be spaced apart from each other in the first direction DR1.

[0036] In the following text, the direction intersecting the first direction DR1 is defined as the second direction DR2. The direction substantially perpendicular to the plane defined by the first direction DR1 and the second direction DR2 is defined as the third direction DR3. In this specification, the phrase "when viewed in a plan view" can represent the state when viewed from the third direction DR3.

[0037] For example, Figure 1 The figure shows a cross-sectional view of the cover window etching apparatus WEA when viewed in the second direction DR2.

[0038] The sidewall portion SW may include a first sidewall portion SW1 and a second sidewall portion SW2. The first sidewall portion SW1 may be defined as a sidewall portion SW extending from one of two opposing sides of the base plate portion BP in a first direction DR1 into a third direction DR3. The second sidewall portion SW2 may be defined as a sidewall portion SW extending from the other of two opposing sides of the base plate portion BP in the first direction DR1 into a third direction DR3. The first sidewall portion SW1 and the second sidewall portion SW2 may be spaced apart from each other in the first direction DR1.

[0039] Although not shown in the figure, multiple sidewall portions SW can also be provided on other opposing sides of the base plate portion BP in the second direction DR2.

[0040] Multiple openings OP can be defined in the inner surface of the defined receiving groove AGR of the housing HS. Specifically, multiple openings OP can be defined in the first sidewall portion SW1 and the second sidewall portion SW2. The openings OP can extend from one side (i.e., the inner side) of each of the first sidewall portion SW1 and the second sidewall portion SW2 toward the other side (i.e., the outer side) in a first direction DR1.

[0041] The door GAT can cover the receiving groove AGR and is set on the outer wall (or outer surface) of the first side wall portion SW1. By controlling the opening and closing operation of the door GAT, the stage STG can be transported into or out of the receiving groove AGR.

[0042] The stage STG can be set in the receiving recess AGR. The initial cover window IWM, described later (see...). Figure 5A The stage (STG) can be mounted on and supported by the STG. Although not shown, the upper surface of the STG can be parallel to the plane defined by the first direction DR1 and the second direction DR2. Furthermore, when the initial cover window IWM (see...) Figure 5A When the sample is placed on the upper surface of the stage STG, the multiple adsorption holes defined in the upper surface of the stage STG can be converted to a vacuum state and the initial cover window IWM (see Figure 5AIt is fixed on the upper surface of the stage STG.

[0043] The conveying component WH can be disposed on the lower surface of the stage STG. In an embodiment, as shown... Figure 1 As illustrated, the conveying component WH can be defined as multiple wheels, but embodiments of the present invention are not limited thereto. The conveying component WH may include a circular track, a guide rail, a linear motion guide, etc.

[0044] When the door GAT performs the open operation, the stage STG and the initial cover window IWM (see...) Figure 5A It can be conveyed to the receiving groove AGR via the conveying component WH.

[0045] Multiple drive components DU can be disposed on the inner side of each of the first sidewall portion SW1 and the second sidewall portion SW2, which face each other. A portion of each of the multiple drive components DU can be disposed in the opening OP.

[0046] When an external signal is received, multiple drive components DU can reciprocate in the first direction DR1. As the multiple drive components DU reciprocate in the first direction DR1, the multiple drive components DU can move into or out of the opening OP. The portion of the multiple drive components DU disposed inside the opening OP can have a variable length.

[0047] Multiple plate PLTs can be mounted on the stage STG. Two corresponding plate PLTs among the multiple plate PLTs can be spaced apart from each other above the stage STG in the first direction DR1. The multiple plate PLTs can overlap with two opposite sides of the stage STG in the first direction DR1.

[0048] Multiple board PLTs can be connected to multiple drive components DUs on their outer sides, opposite to the inner sides of the multiple board PLTs, in the first direction DR1. Therefore, when the multiple drive components DUs reciprocate in the first direction DR1, the multiple board PLTs can also reciprocate in the first direction DR1.

[0049] Nozzle NZ can be positioned above the stage STG and multiple plate PLTs. Nozzle NZ can spray the etchant EL, described later (see [link to etchant description]). Figure 5B ).

[0050] Figure 2A This includes using Figure 1 The diagram shows a perspective view of the electronic device of the cover window manufactured by the cover window etching apparatus. Figure 2B It is shown Figure 2A The diagram shows a view of the electronic device in its folded state.

[0051] Reference Figure 2AIn a plan view (or when viewed in a third direction DR3), an embodiment of the electronic device ED may have a rectangular shape having a long side extending in a first direction DR1 and a short side extending in a second direction DR2. However, embodiments of the invention are not limited thereto, and the electronic device ED may have various shapes in a plan view, such as a circular shape or other polygonal shapes. The electronic device ED may be a flexible electronic device.

[0052] The electronic device ED may include a folded region FA and multiple non-folded regions NFA1 and NFA2. The non-folded regions NFA1 and NFA2 may include a first non-folded region NFA1 and a second non-folded region NFA2. The folded region FA may be disposed between the first non-folded region NFA1 and the second non-folded region NFA2. The first non-folded region NFA1, the folded region FA, and the second non-folded region NFA2 may be arranged in a first direction DR1.

[0053] exist Figure 2A The illustration shows an embodiment that defines a single folded region FA and two non-folded regions NFA1 and NFA2, but the number of folded regions FA and the number of non-folded regions NFA1 and NFA2 are not limited thereto. In an embodiment, for example, the electronic device ED may include more than two non-folded regions and multiple folded regions, with the non-folded regions disposed between the multiple folded regions.

[0054] The upper surface of the electronic device ED can be defined as a display surface DS and has a flat surface defined by a first direction DR1 and a second direction DR2. The image IM generated from the electronic device ED can be provided to the user through the display surface DS.

[0055] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image, and the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA and define a boundary of the electronic device ED printed in a predetermined color.

[0056] Although not illustrated, the electronic device ED may include multiple sensors and at least one camera.

[0057] Reference Figure 2B The electronic device ED can be a foldable electronic device ED that can be folded or unfolded. In an embodiment, for example, the electronic device ED can be folded such that the folding region FA is bent relative to a folding axis FX parallel to the second direction DR2. The folding axis FX can be defined as an axis parallel to the short side of the electronic device ED.

[0058] When the electronic device ED is folded, it can be folded inwards such that the first non-folded region NFA1 and the second non-folded region NFA2 face each other and the display surface DS is not exposed to the outside. However, embodiments of the present invention are not limited thereto. In embodiments, for example, the electronic device ED can also be folded outwards relative to the folding axis FX, such that the display surface DS is exposed to the outside.

[0059] Figure 3 yes Figure 2A The diagram shows an exploded perspective view of the electronic device.

[0060] Reference Figure 3 Embodiments of the electronic device ED include a display device DD and a housing HU. Although not illustrated, the electronic device ED may also include a mechanical structure for controlling the folding operation of the display device DD.

[0061] A display device DD according to an embodiment of the present invention may include a display module DM for displaying an image, an upper module UM disposed on the display module DM, and a lower module LM disposed below the display module DM. The display module DM may constitute part of the display device DD, and specifically, the image may be generated from the display module DM. The display module DM may display an image in response to an electrical signal and send / receive information about external input. The display module DM may be defined as an active region AA and a peripheral region NAA. The active region AA may be defined as the area in which the image provided by the display module DM is displayed.

[0062] The peripheral region NAA is adjacent to the active region AA. In an embodiment, for example, such as... Figure 3 As shown, the peripheral region NAA may surround the active region AA. However, this is illustrated as an example. The peripheral region NAA may be defined to have various shapes and is not limited to any one embodiment. According to an embodiment, the active region AA of the display module DM may at least be adjacent to... Figure 2A The display area DA overlaps with a portion of it.

[0063] The display module DM may include a display panel DP and an input sensing unit ISP. According to embodiments of the present invention, the display panel DP may be a light-emitting display panel, but is not specifically limited thereto. In embodiments, for example, the display panel DP may be an organic light-emitting display panel, an inorganic light-emitting display panel, or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials, while the light-emitting layer of an inorganic light-emitting display panel may include inorganic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots, quantum rods, etc. Hereinafter, for ease of description, embodiments in which the display panel DP is an organic light-emitting display panel will be primarily described.

[0064] The display panel DP can be a flexible display panel. Therefore, the display panel DP can be fully rolled up, fully folded, or fully unfolded relative to the folding axis FX.

[0065] The input sensing unit (ISP) can be directly disposed on the display panel (DP). According to embodiments of the present invention, the input sensing unit (ISP) can be formed on the display panel (DP) using a continuous process. In such embodiments, when the input sensing unit (ISP) is directly disposed on the display panel (DP), no adhesive film is disposed between the input sensing unit (ISP) and the display panel (DP). However, embodiments of the present invention are not limited thereto. In another embodiment, an adhesive film can be disposed between the input sensing unit (ISP) and the display panel (DP). In such embodiments, the input sensing unit (ISP) and the display panel (DP) can be manufactured without a continuous process, but the input sensing unit (ISP) can be manufactured using a process separate from the process of manufacturing the display panel (DP) and subsequently fixed to the upper surface of the display panel (DP) by an adhesive film.

[0066] The display panel (DP) generates an image, and the input sensing unit (ISP) acquires coordinate information about the user's input (e.g., touch events).

[0067] The upper module UM may include a cover window WM disposed on the display module DM. The cover window WM may include an optically transparent insulating material. Therefore, the image generated from the display module DM penetrates the cover window WM and can thus be easily recognized by the user. (See reference...) Figures 5A to 5C Detailed description of the manufacturing process of the WM cover window.

[0068] The upper module UM may also include one or more functional layers disposed between the display module DM and the cover window WM. In embodiments of the present invention, for example, the functional layer may be an anti-reflective layer RPL that blocks the reflection of external light.

[0069] The anti-reflective layer RPL effectively prevents the components constituting the display module DM from being observed from the outside due to external light incident through the front surface of the display device DD. The anti-reflective layer RPL may include a phase retarder and a polarizer. The phase retarder may be a film-type or a liquid crystal coated type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film-type or a liquid crystal coated type. The film-type may include a stretched synthetic resin film, and the liquid crystal coated type may include liquid crystal arranged in a predetermined manner. The phase retarder and polarizer may form a polarizing film. The functional layer may also include a protective film disposed above or below the anti-reflective layer RPL.

[0070] The lower module LM may include a support plate SP disposed on the back surface of the display module DM and supporting the display module DM, and a protective film PF disposed between the display module DM and the support plate SP. The support plate SP may include a number corresponding to the non-folded areas NFA1 and NFA2 (see...). Figure 2A The number of support plates is ( ). In embodiments of the present invention, for example, the support plate SP may include a first support plate SP1 and a second support plate SP2 positioned spaced apart from the first support plate SP1.

[0071] The first support plate SP1 and the second support plate SP2 can be configured to correspond to the first non-folded region NFA1 and the second non-folded region NFA2, respectively (see...). Figure 2A The first support plate SP1 is configured to be aligned with the first non-folding area NFA1 of the electronic device ED (see...). Figure 2A The second support plate SP2 is overlapped with the second non-folded area NFA2 of the electronic device ED (see...). Figure 2A The first support plate SP1 and the second support plate SP2 may each consist of metal or plastic materials.

[0072] In such Figure 2A In the illustrated case, with the electronic device ED deployed, the first support plate SP1 and the second support plate SP2 are spaced apart from each other in the first direction DR1. Figure 2B In the figure, with the electronic device ED folded relative to the folding axis FX, the first support plate SP1 and the second support plate SP2 can be positioned spaced apart from each other on the third direction DR3.

[0073] The first support plate SP1 and the second support plate SP2 can be spaced apart from each other to partially correspond to the folded area FA (see [link]). Figure 2A The first support plate SP1 and the second support plate SP2 can be connected to the folding area FA (see...). Figure 2A The two support plates (SP1 and SP2) partially overlap. That is, the distance between the first support plate SP1 and the second support plate SP2 in the first direction DR1 can be greater than the distance between the folded area FA (see...). Figure 2A The width of ) in the first direction DR1 is small.

[0074] Although not illustrated, the support plate SP may also include a connecting module for connecting the first support plate SP1 and the second support plate SP2. The connecting module may include a hinge module or a hinge joint module.

[0075] In an embodiment, such as Figure 3As shown, the support plate SP may include two support plates SP1 and SP2, but embodiments of the invention are not limited thereto. In embodiments providing multiple folding axes FX, the support plate SP may include multiple support plates separated from the multiple folding axes FX. Alternatively, the support plate SP may not be separated into a first support plate SP1 and a second support plate SP2, but may be provided as a single piece. In such embodiments, the support plate may be provided with a bend to correspond to the folding area FA (see...). Figure 2A The bent portion may have an opening formed by penetrating the support plate SP (or removing a portion of the support plate SP) or may have a groove recessed from a surface of the support plate SP.

[0076] A protective film PF can be disposed between the display module DM and the support plate SP. The protective film PF can be disposed below the display module DM and can protect the back surface of the display module DM. The protective film PF may include a synthetic resin film, such as a polyimide film or a polyethylene terephthalate film. However, this is presented as an example, and the protective film PF is not limited thereto.

[0077] The housing HU can be integrated with the display device DD, for example, with the cover window WM, and accommodate the display module DM and the lower module LM. In an embodiment, as... Figure 3 As shown, the housing HU may include a first housing HU1 and a second housing HU2 that are separate from each other, but embodiments of the invention are not limited thereto. Although not shown, the electronic device ED may also include a hinge structure for connecting the first housing HU1 and the second housing HU2.

[0078] Figure 4 yes Figure 3 The diagram shows a cross-sectional view of the cover window.

[0079] Specifically, Figure 4 It is along the window cover WM Figure 3 The cross-sectional view taken by line I-I' in the figure.

[0080] Reference Figure 4 An embodiment of the cover window WM may include a first non-folding portion NFP1, a second non-folding portion NFP2, and a folding portion FP. The folding portion FP may be disposed between the first non-folding portion NFP1 and the second non-folding portion NFP2. The first non-folding portion NFP1, the folding portion FP, and the second non-folding portion NFP2 may be arranged in a first direction DR1.

[0081] The first non-folding portion NFP1 can be with Figure 2A The first non-folded region NFA1 overlaps (or corresponds to) the second non-folded region NFP2. Figure 2AThe second non-folded region NFA2 overlaps (or corresponds to). The folded portion FP can be with Figure 2A The folded regions FA overlap (or correspond).

[0082] The folding groove FGR may be defined on the upper surface of the folded portion FP. The folding groove FGR may extend from the upper surface of the folded portion FP toward the lower surface of the folded portion FP. In embodiments, for example, the folding groove FGR may have a shape that partially corresponds to a trapezoid. However, the shape of the folding groove FGR is not limited to this.

[0083] The thickness of the folded portion FP can be smaller than the thickness of the first non-folded portion NFP1 and the second non-folded portion NFP2. The height of the upper surface of the folded portion FP relative to its lower surface can be lower than the height of the upper surface of the first non-folded portion NFP1 relative to its lower surface and the height of the upper surface of the second non-folded portion NFP2 relative to its lower surface.

[0084] Because the thickness of the folded portion FP is smaller than the thickness of the first non-folded portion NFP1 and the second non-folded portion NFP2, when the folded display device DD (see...) Figure 3 When ), the folding part FP of the cover window WM can be easily folded.

[0085] Since the thickness of the first non-folded portion NFP1 and the thickness of the second non-folded portion NFP2 are greater than the thickness of the folded portion FP, the first non-folded portion NFP1 and the second non-folded portion NFP2 can have higher rigidity than the folded portion FP.

[0086] The inner surface of the folding groove FGR defining the folded portion FP may include a flat portion PLA and a plurality of inclined portions SL. Although not shown, the flat portion PLA may be parallel to the plane defined by the first direction DR1 and the second direction DR2.

[0087] An inclined portion SL can be disposed between the flat portion PLA and the first non-folding portion NFP1, and between the flat portion PLA and the second non-folding portion NFP2. The inclined portion SL can extend from two opposing sides of the flat portion PLA in a first direction DR1, and extend upwards to the first non-folding portion NFP1 and the second non-folding portion NFP2, respectively. One upper surface of the inclined portion SL can connect the upper surface of the first non-folding portion NFP1 and the upper surface of the flat portion PLA. The other upper surface of the inclined portion SL can connect the upper surface of the second non-folding portion NFP2 and the upper surface of the flat portion PLA.

[0088] The angle formed between the upper surface of the inclined portion SL and the upper surface of the flat portion PLA can be defined as a first angle θ. When viewed from the second direction DR2, the first angle θ can be an obtuse angle. The magnitude of the first angle θ can be inversely proportional to the inclination of the upper surface of the inclined portion SL.

[0089] The boundary between the folded portion FP and the first non-folded portions NFP1 and NFP2 can be determined based on the magnitude of the first angle θ. As the magnitude of the first angle θ increases, the boundary between the folded portion FP and the first non-folded portions NFP1 and NFP2 may become invisible. As the inclination of the inclined portion SL decreases, the boundary between the folded portion FP and the first non-folded portions NFP1 and NFP2 may also become invisible. In an embodiment, for example, the first angle θ may be in the range of approximately 170° to approximately 179.5°.

[0090] However, embodiments of the present invention are not limited thereto, and the size of the first angle θ can be changed according to the thickness of the first non-folded portion NFP1, the second non-folded portion NFP2 and the folded portion FP, or according to the width of the folded portion FP in the first direction DR1.

[0091] Cover window WM can be used Figure 1 The cover window is manufactured using the WEA etching apparatus illustrated in the figure. An embodiment of the method for manufacturing the cover window WM will be described in detail later.

[0092] Figures 5A to 5C It is used to describe the etching process. Figure 4 The diagram shows a cross-sectional view of the method of covering a window.

[0093] Specifically, Figures 5A to 5C This is a cross-sectional view when viewed from the second direction DR2.

[0094] exist Figures 5A to 5C In the components illustrated herein, descriptions of components that are the same as or similar to those described in the above figures will be omitted or simplified.

[0095] Reference Figure 5A , used for etching for electronic devices ED (see Figure 2A WM (see) cover window Figure 4 Embodiments of the method may include a process of setting an initial cover window (IWM) on a stage (STG). The initial cover window (IWM) may be fixed to the upper surface of the stage (STG) outside the housing (HS) and then conveyed to the receiving groove (AGR) via a conveying member (WH).

[0096] The initial cover window IWM may include a first non-folding portion NFP1, a second non-folding portion NFP2, and an initial folding portion IFP. The first non-folding portion NFP1 and the second non-folding portion NFP2 of the initial cover window IWM can be integrated with the cover window WM (see [link to WM]). Figure 4 The first non-folded portion NFP1 (see) Figure 4 ) and the second non-folded part NFP2 (see Figure 4 The initial folded portion IFP can be the same as the folded portion FP before it is etched (see...). Figure 4 )correspond.

[0097] The initial folded portion IFP may include an initial flattened portion IPL and multiple initial tilted portions ISL. The initial flattened portion IPL may be combined with the flattened portion PLA before etching (see [link to documentation]). Figure 4 ) corresponds to, and the initial tilt portion ISL can be matched with the tilt portion SL before etching (see Figure 4 )correspond.

[0098] The initial cover window (IWM) can be positioned between the stage (STG) and multiple plate PLTs inside the receiving recess (AGR). Alternatively, the initial cover window (IWM) can be positioned below the multiple plate PLTs.

[0099] Two corresponding plate PLTs among the multiple plate PLTs may be spaced apart from each other on the initial cover window IWM in the first direction DR1. The multiple plate PLTs may overlap with the initial inclined section ISL. The multiple plate PLTs may not overlap with the initial flat section IPL. The initial flat section IPL may be exposed to the outside from the multiple plate PLTs.

[0100] Reference Figure 5B When the initial cover window (IWM) is positioned inside the receiving recess (AGR), an etchant EL spraying process can be performed using a nozzle (NZ). The nozzle (NZ), positioned above the board PLT, can spray the etchant EL towards the initial cover window (IWM). In an embodiment, the etchant may be, for example, hydrogen fluoride (HF).

[0101] The initial flat portion IPL exposed to the outside from the multiple plate PLTs can be etched by etchant EL. The initial sloping portion ISL, the first non-folded portion NFP1, and the second non-folded portion NFP2 covered by the multiple plate PLTs can be left unetched by etchant EL.

[0102] Reference Figure 4 , Figure 5B and Figure 5CWhen the nozzle NZ sprays the etchant EL, multiple drive components DU can move toward the inside of the opening OP in the first direction DR1. As the multiple drive components DU move in the first direction DR1, multiple plate PLTs can also move in the first direction DR1. In an embodiment, for example, the multiple plate PLTs can move at a constant speed. However, embodiments of the invention are not limited to this, and the moving speed of the multiple plate PLTs can be controlled based on the amount of etching of the initial folded portion IFP.

[0103] The distance between two corresponding plate PLTs spaced apart in the first direction DR1 can be increased. The area of ​​the initial folded portion IFP exposed to the outside from the plate PLT can be increased accordingly. The initial tilted portion ISL can be exposed to the outside from the plate PLT. Accordingly, the initial tilted portion ISL can be etched using etchant EL.

[0104] The time for spraying etchant EL toward the initial flat portion IPL can be longer than the time for spraying etchant EL toward the initial inclined portion ISL. Therefore, the etching amount of the initial flat portion IPL can be greater than the etching amount of the initial inclined portion ISL.

[0105] The time for spraying etchant EL toward the portion of the initial inclined portion ISL adjacent to the initial flat portion IPL can be longer than the time for spraying etchant EL toward the portions of the initial inclined portion ISL adjacent to the first non-folded portion NFP1 and the second non-folded portion NFP2. Therefore, the initial inclined portion ISL is configured such that the upper surface of the inclined portion SL can have... Figure 4 The tilt pattern shown in the diagram is etched.

[0106] Multiple board PLTs can cover the first non-folded portion NFP1 and the second non-folded portion NFP2 to effectively prevent the first non-folded portion NFP1 and the second non-folded portion NFP2 from being etched. The etchant EL etches the initial cover window IWM, and subsequent fabrication can then proceed. Figure 4 WM with a covered window.

[0107] Conventionally, a mask comprising titanium (Ti) can be disposed on the first non-folded portion NFP1 and the second non-folded portion NFP2 to prevent the first non-folded portion NFP1 and the second non-folded portion NFP2 from being etched. Therefore, conventional methods for etching the cover window WM may include processes of disposing the mask on the first non-folded portion NFP1 and the second non-folded portion NFP2 and removing the mask from the first non-folded portion NFP1 and the second non-folded portion NFP2. This may increase the number of process steps.

[0108] In this situation, during the process of removing the mask from the first non-folded portion NFP1 and the second non-folded portion NFP2, the first non-folded portion NFP1 and the second non-folded portion NFP2 may be damaged. Therefore, defects may occur in the cover window WM.

[0109] Furthermore, as the mask thickness increases, the size of the first angle θ may decrease. The upper surface of the inclined portion SL may have an increased inclination. Therefore, the boundary between the folded portion FP and the first non-folded portion NFP1 and the second non-folded portion NFP2 may be visible from the outside.

[0110] In the cover window etching apparatus WEA for manufacturing electronic devices according to an embodiment of the present invention, multiple plate PLTs can effectively prevent the first non-folded portion NFP1 and the second non-folded portion NFP2 from being etched. Therefore, the processes of setting the mask on the first non-folded portion NFP1 and the second non-folded portion NFP2 and removing the mask from the first non-folded portion NFP1 and the second non-folded portion NFP2 can be omitted, making it easy or efficient to etch the cover window WM, that is, the process of etching the cover window WM can be simplified.

[0111] In such an embodiment, damage to the first non-folded portion NFP1 and the second non-folded portion NFP2 that may occur during the process of removing the mask from the first non-folded portion NFP1 and the second non-folded portion NFP2 can be effectively prevented. Therefore, defects in the cover window WM can be prevented or reduced.

[0112] In this embodiment, since the masking process is omitted, the size of the first angle θ and the inclination of the upper surface of the inclined portion SL can be easily adjusted. Therefore, the boundary between the folded portion FP and the first non-folded portion NFP1 and the second non-folded portion NFP2 can be effectively prevented from being observed.

[0113] Figure 6 This is a cross-sectional view of a cover window etching apparatus for manufacturing electronic devices according to an embodiment of the present invention.

[0114] Figure 7 This is a cross-sectional view of a cover window etching apparatus for manufacturing electronic devices according to an embodiment of the present invention.

[0115] Specifically, Figure 6 and Figure 7 This is a cross-sectional view of the cover window etching apparatus WEAa and WEAb used in manufacturing electronic devices, as viewed from the second direction DR2.

[0116] Reference Figure 6An embodiment of the cover window etching apparatus WEAa for manufacturing electronic devices may include a housing HSa, a plurality of retaining members HP, and a source member EXP. The housing HSa may define a receiving recess AGR for accommodating the plurality of retaining members HP and the source member EXP.

[0117] The housing HSa may include a base plate portion BP and a side wall portion SWa. Because the base plate portion BP and... Figure 1 The base plate portion BP is substantially the same, therefore any repetitive detailed description of the base plate portion BP will be omitted. The side wall portion SWa extends from two opposing sides of the base plate portion BP in the first direction DR1 into the third direction DR3. The side wall portions SWa may be spaced apart from each other in the first direction DR1.

[0118] The sidewall portion SWa may include a first sidewall portion SW1a and a second sidewall portion SW2a. When viewed from the second direction DR2, the first sidewall portion SW1a may be adjacent to the right side of the base plate portion BP. The second sidewall portion SW2a may be adjacent to the left side of the base plate portion BP. (Except for the door GAT, see...) Figure 1 )outside, Figure 6 The housing HSa can be with Figure 1 The casing HS is substantially the same or similar to that of the casing HSa, and any repeated detailed description of the casing HSa will be omitted below.

[0119] Multiple retaining members HP can be disposed on the inner surfaces of the first sidewall SW1a and the second sidewall SW2a, and the inner surfaces of the first sidewall SW1a and the second sidewall SW2a face each other in the first direction DR1. Two corresponding retaining members HP among the multiple retaining members HP can be spaced apart from each other in the first direction DR1. Two corresponding retaining members HP can face each other in the first direction DR1.

[0120] Multiple retaining components HP can reciprocate along the first direction DR1. The distance between two corresponding retaining components HP along the first direction DR1 can vary. The reciprocating movement of the multiple retaining components HP along the first direction DR1 will be described in detail below.

[0121] The retaining groove HGR can be defined on the facing sides of the retaining member HP in the first direction DR1. The retaining groove HGR can extend from the facing side of the retaining member HP toward the outside of the retaining member HP in the first direction DR1.

[0122] The source component EXP can be positioned inside the receiving groove AGR. The source component EXP can be positioned below multiple retaining components HP. The source component EXP may include a nozzle NZ. The nozzle NZ can be positioned above the upper surface of the base plate BP. The nozzle NZ can spray etchant EL upwards (see...). Figure 8C However, this is presented as an example, and in another embodiment, the source component EXP may include, for example... Figure 7 The etchant EL is contained inside the receiving groove AGR as shown in the figure.

[0123] Figures 8A to 8C It is a description of the use of Figure 6 The diagram shows a method for etching a cover window using a cover window etching apparatus for manufacturing electronic devices. Figure 9 It is a description of the use of Figure 7 The diagram shows a method for etching a cover window using a cover window etching apparatus for manufacturing electronic devices.

[0124] Specifically, Figures 8A to 9 This is a cross-sectional view of the cover window etching apparatus WEAa and WEAb used in manufacturing electronic devices, as viewed from the second direction DR2.

[0125] exist Figures 8A to 9 In the components illustrated herein, descriptions of components that are the same as or similar to those described with reference to the above figures will be omitted or simplified.

[0126] Reference Figure 8A , used for etching for electronic devices ED (see Figure 2A WM (see) cover window Figure 4 An embodiment of the method may include a process of placing an initial cover window (IWM) inside a receiving groove (AGR). The initial cover window (IWM) may be placed between two corresponding retaining members (HP). The initial cover window (IWM) may be placed inside a retaining groove (HGR). Two opposing sides of the initial cover window (IWM) in a first direction (DR1) may each be placed inside the retaining groove (HGR).

[0127] Reference Figure 8B When the initial cover window IWM is positioned inside the retaining groove HGR, the retaining member HP can move in the first direction DR1. As the multiple retaining members HP move, the distance between two corresponding retaining members HP in the first direction DR1 can be shortened.

[0128] As the distance between the two corresponding retaining members HP decreases, the initial cover window IWM disposed between the two corresponding retaining members HP can be bent. The upper surface of the initial cover window IWM can have a downwardly concave curved surface. The lower surface of the initial cover window IWM can have a downwardly convex curved surface. The height of the lower surface (or lowest point) of the initial folded portion IFP relative to the base plate portion BP can be lower than the height of the lower surface (or lowest point) of the first non-folded portion NFP1 relative to the base plate portion BP and the height of the lower surface (or lowest point) of the second non-folded portion NFP2 relative to the base plate portion BP.

[0129] Reference Figure 8C The nozzle NZ can spray etchant EL towards the initial cover window IWM. It can also spray etchant EL towards the portion of the lower surface of the initial cover window IWM whose height is lower than the outer perimeter of the initial cover window IWM. Furthermore, it can spray etchant EL towards the initial folded portion IFP.

[0130] When using the cover window etching apparatus WEAa according to an embodiment of the present invention for electronic devices ED (see Figure 2A WM (see) cover window Figure 4 During the etching process, the initial cover window IWM can be bent. Therefore, the initial folded portion IFP is closer to the nozzle NZ than the first non-folded portion NFP1 and the second non-folded portion NFP2, and thus it is easy to spray the etchant EL toward the initial folded portion IFP. In such an embodiment, since the lower surface of the initial cover window IWM deforms into a downward convex shape, the etchant EL can flow toward the initial folded portion IFP even when it is provided on the lower surfaces of the first non-folded portion NFP1 and the second non-folded portion NFP2. Therefore, it is convenient to use this for manufacturing cover window WMs (see...). Figure 4 Etching process.

[0131] In such an embodiment, the process of separately providing and removing masks to prevent the first non-folded portion NFP1 and the second non-folded portion NFP2 from being etched can be omitted, and thus the process for manufacturing the cover window WM can be simplified (see Figure 4 Etching process.

[0132] Reference Figure 9 In the etching used for electronic devices ED (see Figure 2A WM (see) cover window Figure 4 In an embodiment of the method, the initially folded portion IFP in a bent state can be immersed in etchant EL contained within the receiving groove AGR. The first non-folded portion NFP1 and the second non-folded portion NFP2 may not be immersed in etchant EL. Therefore, it is convenient for use in manufacturing cover window WM (see Figure 4Etching process.

[0133] According to an embodiment of the invention, when the etchant is sprayed from the nozzle toward the initial cover window, the two corresponding plates can move away from each other. Therefore, the initial folded portion of the initial cover window exposed to the outside from the plates can be etched by the etchant, while the non-folded portion can be covered by the plates and not etched. Thus, the cover window can be easily etched.

[0134] According to an embodiment of the present invention, the distance between two corresponding plates can gradually increase. Therefore, the initial inclined portion of the initial folded portion can have a shorter etchant contact time than the initial flat portion of the initial folded portion, and the etching amount of the initial inclined portion can be smaller than the etching amount of the initial flat portion. Therefore, it is possible to effectively prevent the boundary between the folded portion and the flat portion from being observed.

[0135] This invention should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept to those skilled in the art.

[0136] Although the invention has been specifically shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit or scope of the invention as defined by the appended claims.

Claims

1. A cover window etching apparatus for manufacturing electronic devices, wherein, The cover window etching apparatus includes: The stage is used to support the initial cover window; Multiple plates are positioned above the stage; and Nozzles are positioned above the plurality of plates, wherein the nozzles spray etchant toward the initial cover window. The plurality of plates reciprocate in a first direction.

2. The cover window etching apparatus according to claim 1, wherein, Two corresponding plates among the plurality of plates are spaced apart from each other in the first direction.

3. The cover window etching apparatus according to claim 2, wherein, When the nozzle sprays the etchant, the two corresponding plates move.

4. The cover window etching apparatus according to claim 3, wherein, When the nozzle sprays the etchant, the distance between the two corresponding plates in the first direction increases.

5. The cover window etching apparatus according to claim 4, wherein, As the distance between the two corresponding plates in the first direction increases, the area of ​​the initial cover window exposed to the outside from the two corresponding plates increases.

6. The cover window etching apparatus according to claim 4, wherein, The moving speed of each of the two corresponding plates is constant.

7. The cover window etching apparatus according to claim 1, wherein, The cover window etching apparatus also includes a housing defining a receiving groove in which the stage and the plurality of plates are received.

8. The cover window etching apparatus according to claim 7, wherein, The cover window etching apparatus further includes a plurality of driving components disposed in openings defined on the inner surface of the housing defining the receiving groove and connected to the outer sides of the plurality of plates. Wherein, the outer side of the plurality of plates is defined as the side of the plurality of plates opposite to the inner side of the plurality of plates in the first direction.

9. The cover window etching apparatus according to claim 8, wherein, When the plurality of driving components reciprocate into or out of the opening in the first direction, the plurality of plates reciprocate in the first direction.

10. A method for etching a cover window in the manufacture of an electronic device, wherein, The cover window etching method includes: Set the initial cover window on the loading platform; The stage is moved to position it beneath a plurality of plates spaced apart from each other in a first direction within a receiving recess defined by the housing; and The initial cover window is etched by spraying etchant towards it using nozzles positioned above the plurality of plates. When the nozzle sprays the etchant, the plurality of plates move in the first direction.

11. The cover window etching method according to claim 10, wherein, When the nozzle sprays the etchant, the distance between two corresponding plates among the plurality of plates in the first direction increases.

12. The cover window etching method according to claim 11, wherein, As the distance between the two corresponding plates in the first direction increases, the area of ​​the initial cover window exposed to the outside from the two corresponding plates increases.

13. The cover window etching method according to claim 10, wherein, The moving speed of each of the plurality of plates is constant.

14. The cover window etching method according to claim 13, wherein, Multiple drive components are disposed in openings defined on the inner surface of the housing defining the receiving groove and connected to the outer sides of the multiple plates. Wherein, the outer side of the plurality of plates is defined as the side of the plurality of plates opposite to the inner side of the plurality of plates in the first direction.

15. A cover window etching apparatus for manufacturing electronic devices, wherein, The cover window etching apparatus includes: Multiple retaining members are spaced apart from each other in a first direction, wherein the multiple retaining members support the initial cover window; The source component is disposed below the plurality of retaining components and provides the etchant; and Housing that houses the plurality of retaining components and the source component. The plurality of retaining components reciprocate in the first direction.

16. The cover window etching apparatus according to claim 15, wherein, The initial cover window is disposed in a retaining groove defined on the facing sides of two corresponding retaining members among the plurality of retaining members in the first direction.

17. The cover window etching apparatus according to claim 16, wherein, When the two corresponding retaining components move in the first direction, the distance between the two corresponding retaining components in the first direction is shortened.

18. The cover window etching apparatus according to claim 17, wherein, When the distance between the two corresponding retaining components in the first direction is shortened, the lower surface of the initial cover window deforms into a downwardly convex curved surface.

19. The cover window etching apparatus according to claim 18, wherein, The source component includes a nozzle that sprays the etchant toward the initial cover window.

20. The cover window etching apparatus according to claim 18, wherein, The etchant provided by the source component is contained within a receiving recess defined by the housing, and The portion of the initial cover window that is lower in height than the outer portion of the initial cover window is immersed in the etchant.

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