Vacuum adsorption device for PCB (Printed Circuit Board) and PCB production equipment

Abstract

The invention relates to the technical field of PCB manufacturing equipment, and discloses a vacuum adsorption device for a PCB and PCB production equipment. A plurality of vacuum suction cutters are arranged on a mounting main body of a vacuum adsorption mechanism; the negative pressure cavity in the mounting main body is sequentially communicated with the cavity on the vacuum suction knife, the suction channel and the plurality of suction holes; the first supporting shaft of the adjusting mechanism penetrates through the multiple vacuum suction knives, the distance between the suction holes and the upper surface of the PCB is adjusted through the supporting wheel according to the thickness of the PCB, and no matter how the thickness of the PCB changes, the vacuum suction knives can be kept in the optimal adsorption interval, so that the adsorption effect is guaranteed, and liquid medicine is prevented from being accumulated on the PCB. The floater freely ascends and descends between the ascending position and the descending position in the cavity, opening and closing of the vacuum suction knives are automatically adjusted by means of the gas-liquid proportion according to the size change of the PCB, the negative pressure cavity is prevented from sucking air, the adsorption effect of the vacuum suction knives is guaranteed, and the situation that liquid cannot be sucked due to vacuum failure caused by vacuum damage is avoided.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing equipment technology, specifically to a vacuum adsorption device for PCB boards and PCB board production equipment. Background Technology

[0002] In traditional vacuum suction knives, the height of the suction knife is fixed, and it cannot be adjusted in real time according to the product thickness. When the product thickness changes, the vacuum suction knife cannot maintain a certain distance from the product surface, causing the negative pressure suction effect of the suction knife to fail. This results in chemical residue on the product surface, affecting subsequent production processes and product quality. Furthermore, when the dimensions of the production board change, the vacuum suction knife draws in air in the board-free area, causing the negative pressure chamber to fail and unable to suction liquid, resulting in chemical residue on the product surface, affecting subsequent production processes and again impacting product quality. Summary of the Invention

[0003] In view of this, the present invention provides a vacuum adsorption device and PCB production equipment for PCB boards, so as to solve the problem that the vacuum suction knife cannot be adjusted according to the thickness and size of the PCB board.

[0004] In a first aspect, the present invention provides a vacuum adsorption device for PCB boards, comprising: The system includes a vacuum adsorption mechanism, a transmission mechanism, an adjustment mechanism, and an automatic float adjustment mechanism. The vacuum adsorption mechanism comprises a mounting body and a plurality of vacuum suction blades disposed within the mounting body. The mounting body has a plurality of first mounting holes, and the plurality of vacuum suction blades are fixedly installed in the first mounting holes one by one, with the vacuum suction blades extending to the bottom of the mounting body. The mounting body has a negative pressure chamber, and the vacuum suction blades have a chamber, a suction channel, and a plurality of suction holes, with the negative pressure chamber, the chamber, the suction channel, and the suction holes connected in sequence. The transmission mechanism includes multiple upper rollers disposed below the vacuum adsorption mechanism and multiple lower rollers disposed below the upper rollers; a PCB channel for conveying PCB boards is provided between the upper rollers and the lower rollers. The adjustment mechanism includes a first support shaft, which is simultaneously inserted through a plurality of vacuum suction knives. The first support shaft is provided with a support wheel, which adjusts the distance between the suction hole of the vacuum suction knife and the upper surface of the PCB board by adjusting the thickness of the PCB board. The automatic float adjustment mechanism includes a float that is movably disposed within the chamber and can freely rise and fall between the rising and falling positions within the chamber. When the suction medium of the vacuum suction knife is gas, the float is in the falling position and closes the suction channel.

[0005] Beneficial effects: Through the cooperation between the first support shaft, support wheel, PCB board, and vacuum suction knife, regardless of changes in PCB board thickness, the gap between the suction hole and the board surface can always be maintained within the optimal adsorption range, ensuring the adsorption effect of the vacuum suction knife and preventing the accumulation of medicine on the PCB board. Furthermore, through the cooperation between the float and the chamber, regardless of changes in PCB board size, the difference in gas-liquid specific gravity can be used to open and close the suction channel by raising and lowering the float, blocking air intake and ensuring the adsorption effect of the vacuum suction knife, preventing the accumulation of medicine on the PCB board. At the same time, this adjustment mechanism has no complex electronic control system or sensors, has a simple structure, low failure rate, reduces the manufacturing cost of the vacuum adsorption device, and is suitable for production line conditions.

[0006] In an alternative embodiment, a seal is further included, disposed on the vacuum suction knife and sleeved on the first support shaft.

[0007] In one optional embodiment, the vacuum suction knife is provided with a chamber and a suction channel, and the negative pressure chamber, the chamber, the suction channel and the suction hole are connected in sequence; The float is movably disposed within the cavity.

[0008] In one alternative embodiment, the upper roller includes a first conveying roller and a second conveying roller, the diameter of the first conveying roller being smaller than the diameter of the second conveying roller; along the Y direction, the first conveying roller is located on at least one side of the vacuum suction knife and at least partially located below the mounting body along the Z direction.

[0009] In one alternative embodiment, a water-blocking roller is further included, the diameter of which is smaller than that of the second conveying roller. Along the Y direction, the water-blocking roller is located on the other side of the vacuum suction knife and at least partially below the mounting body along the Z direction.

[0010] In one optional embodiment, the mounting body is provided with a connecting plate, and the connecting plate is provided with a plurality of second mounting holes; The vacuum suction knife includes a first vacuum suction knife and a second vacuum suction knife. The first vacuum suction knife is installed in the first mounting hole and the second mounting hole, and its upper end extends above the connecting plate along the Z direction. The second vacuum suction knife is installed in the first mounting hole, and its upper end is located below the connecting plate along the Z direction.

[0011] In one alternative implementation, along the X direction, the first vacuum suction knife is located at both ends of the mounting body, and the support wheel is located between two adjacent first vacuum suction knives.

[0012] In one optional embodiment, a connecting mechanism is further included, the connecting mechanism comprising a first drive shaft passing through the center of the upper roller and a second drive shaft passing through the center of the lower roller, the first drive shaft being located above the second drive shaft.

[0013] In one optional embodiment, a gear assembly is further included for transmission connection with the connecting mechanism; the gear assembly includes a transmission gear and a drive gear, the transmission gear and the drive gear being coaxially mounted on the first transmission shaft and the second transmission shaft, respectively.

[0014] In one alternative embodiment, a drive mechanism is further included, which is connected to the drive gear in a transmission manner.

[0015] Secondly, the present invention also provides a PCB board manufacturing equipment, comprising: At least one vacuum adsorption device for PCB boards as described above.

[0016] Beneficial effects: Since the PCB board production equipment includes a vacuum adsorption device for PCB boards, it has the same effect as the vacuum adsorption device for PCB boards, so it will not be elaborated here. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a vacuum adsorption device for PCB boards according to an embodiment of the present invention; Figure 2 for Figure 1 Enlarged diagram of A in the middle; Figure 3 This is another structural schematic diagram of a vacuum adsorption device for PCB boards according to an embodiment of the present invention.

[0019] Explanation of reference numerals in the attached figures: 100. Mounting body; 110. Connecting plate; 120. Negative pressure chamber; 121. First negative pressure chamber; 122. Second negative pressure chamber; 200. Vacuum suction knife; 210. Chamber; 220. Suction channel; 230. Float; 240. Suction hole; 250. Sealing element; 260. First vacuum suction knife; 270. Second vacuum suction knife; 300. First support shaft; 310. Support wheel; 400. Upper roller; 410. First roller; 420. Second roller; 500. Lower roller; 600. Water-blocking roller. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] According to embodiments of the present invention, in one aspect, such as Figures 1 to 3As shown, a vacuum adsorption device for PCB boards is provided, including: a vacuum adsorption mechanism, a transmission mechanism, an adjustment mechanism, and a float automatic adjustment mechanism. The vacuum adsorption mechanism includes a mounting body 100 and a plurality of vacuum suction blades 200 disposed within the mounting body 100. The mounting body 100 has a plurality of first mounting holes, and the plurality of vacuum suction blades 200 are fixedly installed in the first mounting holes one by one, with the vacuum suction blades 200 extending below the mounting body 100. The mounting body 100 has a negative pressure chamber 120, and the vacuum suction blades 200 have a chamber 210, a suction channel 220, and a plurality of suction holes 240, which are sequentially connected. The transmission mechanism includes a plurality of upward rollers disposed below the vacuum adsorption mechanism. The upper roller 400 and multiple lower rollers 500 are arranged below the upper roller 400; a PCB channel for conveying PCB boards is provided between the upper roller 400 and the lower rollers 500; the adjustment mechanism includes a first support shaft 300, which is simultaneously inserted through a plurality of vacuum suction knives 200, and a support wheel 310 is provided on the first support shaft 300. The support wheel 310 adjusts the distance between the suction hole 240 of the vacuum suction knife 200 and the upper surface of the PCB board according to the thickness of the PCB board; the float automatic adjustment mechanism includes a float 230, which is movably arranged in the chamber 210 and freely rises and falls between the rising position and the falling position in the chamber 210. When the suction medium of the vacuum suction knife 200 is gas, the float 230 is in the falling position and the suction channel 220 is closed.

[0023] In this embodiment, the X direction is the length direction of the vacuum adsorption device, the Y direction is the width direction of the vacuum adsorption device, and the Z direction is the height direction of the vacuum adsorption device. The mounting body 100 of the vacuum adsorption mechanism is formed by combining a top plate, a bottom plate, and a pair of oppositely arranged side plates, and a negative pressure cavity 120 is formed inside the mounting body 100. A plurality of first mounting holes penetrating the bottom plate are provided on the bottom plate of the mounting body 100, and the plurality of first mounting holes are spaced apart along the X direction. A plurality of vacuum suction blades 200 correspond one-to-one with the first mounting holes and are all fixedly installed in the first mounting holes, reserving movement space for the subsequent adjustment mechanism to drive the suction blades up and down to adapt to the thickness of the PCB board. Part of the vacuum suction blade 200 is located inside the mounting body 100, and another part extends from the first mounting hole to the bottom of the bottom plate, so that the vacuum suction blade 200 can be aligned with the upper surface of the PCB board.

[0024] The vacuum suction knife 200 has a hollow chamber 210 inside, which is connected to the negative pressure chamber 120. The vacuum suction knife 200 also has a suction channel 220 located at its lower end. Several suction holes 240 are provided on the lower surface of the vacuum suction knife 200, allowing the suction channel 220 to connect with both the chamber 210 and the suction holes 240. This sequentially connects the negative pressure chamber 120, the chamber 210, the suction channel 220, and the suction holes 240. When an external negative pressure device is connected to the negative pressure chamber 120, all the suction holes 240 of the vacuum suction knife 200 simultaneously generate negative pressure suction, thereby absorbing the chemicals on the surface of the PCB board. This solves the problem of chemical accumulation on the PCB board surface and overcomes the problem of chemical residue caused by incomplete adsorption in existing suction knives. The transmission mechanism enables continuous and stable transport of PCB boards. This mechanism includes multiple upper rollers 400 and multiple lower rollers 500. The upper rollers 400 are fixed below the vacuum adsorption mechanism, and the lower rollers 500 are fixed below the upper rollers 400. The gap between the upper rollers 400 and lower rollers 500 forms a PCB channel, allowing the PCB board to move within this channel. When the upper rollers 400 and lower rollers 500 rotate synchronously, the PCB board, after being placed in the PCB channel, is propelled forward at a uniform speed by the friction of the rollers. Simultaneously, the vacuum adsorption mechanism continuously adsorbs the upper surface of the PCB board to remove any residual chemicals, preventing chemical accumulation on the PCB board.

[0025] The adjustment mechanism is used to adjust the distance between the vacuum suction knife 200 and the PCB board. The adjustment mechanism includes a first support shaft 300 and a support wheel 310. All vacuum suction knives 200 pass through the first support shaft 300 to enable all vacuum suction knives 200 to move up and down synchronously and ensure the consistency of the suction gap. The support wheel 310 is mounted on the first support shaft 300 and directly contacts the upper surface of the PCB board. When PCBs of different thicknesses enter the PCB channel, the upper surface of the PCB directly contacts the support roller 310. If the PCB is thicker, the PCB surface lifts the support roller 310, which in turn drives the first support shaft 300 to move upward. The first support shaft 300 simultaneously pulls all the vacuum suction knives 200 upward, causing the vacuum suction device to move upward. This maintains a suitable distance between the suction hole 240 and the upper surface of the PCB, preventing the suction knives from scratching the PCB surface and ensuring the suction force of the vacuum suction knives 200 is effective. If the PCB is thinner, the support roller 310 loses the support force of the thicker board, and the vacuum suction knives 200 fall downward under gravity. The first support shaft 300 drives all the vacuum suction knives 200 downward, adjusting the gap between the suction hole 240 and the PCB surface to ensure that the negative pressure suction force of the vacuum suction knives 200 can effectively act on the PCB surface, preventing suction failure. Therefore, regardless of the thickness of the PCB board, the cooperation between the first support shaft 300, the support wheel 310, the PCB board, and the vacuum suction knife 200 ensures that the gap between the suction hole 240 and the board surface remains within the optimal adsorption range, guaranteeing the adsorption effect of the vacuum suction knife 200 and preventing the accumulation of chemicals on the PCB board. Furthermore, this adjustment mechanism has no complex electronic control system or sensors, resulting in a simple structure, low failure rate, reduced manufacturing costs of the vacuum adsorption device, and compatibility with production line conditions.

[0026] The float automatic adjustment mechanism includes a float 230, which is installed inside the chamber 210 and can float within the chamber 210. Along the Z-direction, the lower end face of the float 230 has a protrusion that extends downwards along its lower end face, which can block the suction channel 220. When the medium adsorbed by the vacuum suction knife 200 is liquid, the float 230 is in the raised position within the chamber 210. The negative pressure chamber 120, the chamber 210, the suction channel 220, and the suction hole 240 are sequentially connected to absorb the liquid from the upper surface of the PCB board. When the medium adsorbed by the vacuum suction knife 200 is gas, if there is no liquid medicine on the PCB board corresponding to the current vacuum suction knife 200, the density of the gas adsorbed by the vacuum suction knife 200 is less than the density of the liquid. Due to the specific gravity, the float 230 sinks to the descending position in the chamber 210 to block the suction channel 220 of the current vacuum suction knife 200. This can prevent the gas from being sucked into the vacuum suction knife 200, thereby preventing the negative pressure of the vacuum adsorption device from failing.

[0027] By utilizing the interaction between the float and the chamber, regardless of changes in the PCB board size, the difference in specific gravity between gas and liquid can be used to open and close the suction channel through the rising and falling position of the float, blocking air intake and ensuring the adsorption effect of the vacuum suction knife. This ensures that when other vacuum suction knives 200 are used on the PCB board containing liquid, the liquid can be successfully adsorbed, preventing accumulation on the PCB board surface. The weight and density of the float 230 can be set according to actual usage requirements. For example, when the density of the liquid is low, the float 230 can be made of a low-density and low-weight material.

[0028] Since the vacuum suction knife 200 is fixedly installed and the first support shaft 300 passes through all the vacuum suction knives 200, a through hole is provided on the vacuum suction knife 200 for the first support shaft 300 to pass through. There will be assembly gap and movement gap between the through hole and the outer ring of the first support shaft 300. The negative pressure chamber 120 in the mounting body 100 is a vacuum environment with a high pressure difference. The negative pressure will leak outward along the gap, resulting in insufficient vacuum in the negative pressure chamber 120, thus affecting the adsorption effect.

[0029] In one embodiment, a seal 250 is also included, disposed on the vacuum suction knife 200 and sleeved on the first support shaft 300.

[0030] In this embodiment, the first support shaft 300 is the linkage shaft through which all vacuum suction blades 200 pass. Therefore, each vacuum suction blade 200 is equipped with a corresponding seal 250, and all seals 250 are fitted onto the same first support shaft 300. By fitting the seal 250 onto the outer ring of the first support shaft 300 and fixing it to the vacuum suction blade 200, all gaps between the vacuum suction blade 200 and the first support shaft 300 are filled, blocking the channel for negative pressure leakage and ensuring the stability of the vacuum degree in the negative pressure chamber 120, thereby ensuring the adsorption effect of the vacuum suction blade 200. Moreover, the seal 250 can also prevent direct contact between the vacuum suction blade 200 and the first support shaft 300, thereby reducing the wear of the vacuum suction blade 200 and the first support shaft 300 and extending their service life.

[0031] In one embodiment, the upper roller 400 includes a first conveying roller and a second conveying roller, the diameter of the first conveying roller being smaller than the diameter of the second conveying roller; along the Y direction, the first conveying roller is located on at least one side of the vacuum suction knife 200 and at least partially located below the mounting body 100 along the Z direction.

[0032] In this embodiment, the vacuum suction blades 200 are arranged in an array along the X direction. Along the Y direction, the first conveying roller is positioned to the left or right of the vacuum suction blades 200, ensuring that the first conveying roller avoids the area directly below the vacuum suction blades 200. This prevents obstruction of the suction holes 240 of the vacuum suction blades 200, ensuring a completely unobstructed negative pressure path from the suction holes 240 to the PCB board surface, and guaranteeing that the suction function is not affected by obstruction by the first conveying roller. Furthermore, the diameter of the first conveying roller is smaller than that of the second conveying roller, allowing the first conveying roller to extend into the space below the mounting body 100 to facilitate the conveying of the PCB board, while ensuring that the first conveying roller does not collide with the mounting body 100.

[0033] In one embodiment, a water-blocking roller 600 is also included. The diameter of the water-blocking roller 600 is smaller than that of the second conveying roller. Along the Y direction, the water-blocking roller 600 is located on the other side of the vacuum suction knife 200 and at least partially located below the mounting body 100 along the Z direction.

[0034] In this embodiment, a water-blocking roller 600 is provided on the other side of the vacuum suction knife 200 along the Y direction, such as the first conveying roller being located on the left side of the vacuum suction knife 200, and the water-blocking roller 600 being located on the right side of the vacuum suction knife 200. By arranging the water-blocking roller 600 on the other side of the vacuum suction knife 200, the water-blocking roller 600 will neither obstruct the adsorption area of ​​the vacuum suction knife 200 nor collide with the vertically moving vacuum suction knife 200. Moreover, the diameter of the water-blocking roller 600 is smaller than the diameter of the second conveying roller and is also located below the mounting body 100. The radial height of the water-blocking roller 600 is small. When the water-blocking roller 600 extends into the space below the mounting body 100, the top of the water-blocking roller 600 will not touch the lower surface of the mounting body 100, thus preventing volume collision in the vertical direction. By positioning the water-blocking roller 600 at least partially below the mounting body 100, the water-blocking roller 600 does not need to be entirely inserted into the confined space. Water blocking is achieved simply by the edge of the water-blocking roller 600 adhering to the surface of the PCB board, minimizing spatial overlap with the mounting body 100 and further reducing the risk of interference. By placing the water-blocking roller 600 on one side of the vacuum suction knife 200, the water-blocking roller 600 can block residual chemicals on the PCB board surface, allowing the vacuum suction knife 200 to fully absorb any remaining chemicals, thus preventing chemical accumulation on the PCB board surface.

[0035] In one embodiment, the mounting body 100 is provided with a connecting plate 110, and the connecting plate 110 is provided with a plurality of second mounting holes; the vacuum suction knife 200 includes a first vacuum suction knife 260 and a second vacuum suction knife 270, the first vacuum suction knife 260 is installed in the first mounting hole and the second mounting hole, and along the Z direction, the upper end of the first vacuum suction knife 260 extends above the connecting plate 110; the second vacuum suction knife 270 is installed in the first mounting hole, and along the Z direction, the upper end of the second vacuum suction knife 270 is located below the connecting plate 110.

[0036] In this embodiment, a connecting plate 110 is provided inside the mounting body 100, thereby dividing the negative pressure chamber 120 into a first negative pressure chamber 121 and a second negative pressure chamber 122 that are interconnected. The first negative pressure chamber 121 is located between the top plate and the connecting plate 110, and the second negative pressure chamber 122 is located between the bottom plate and the connecting plate 110. A gap exists between the connecting plate 110 and the side plate, allowing the first negative pressure chamber 121 and the second negative pressure chamber 122 to communicate. A plurality of second mounting holes are provided on the connecting plate 110, and a first vacuum suction knife 260 is simultaneously disposed within both the first and second mounting holes. The lower end of the first vacuum suction knife 260 extends out of the first mounting hole and down to the bottom plate, while the upper end extends out of the second mounting hole and up to the top of the connecting plate 110, extending into the body of the first negative pressure chamber 121. The second vacuum suction knife 270 is installed only in the first mounting hole. The lower end of the second vacuum suction knife 270 extends out of the first mounting hole and extends to the bottom of the base plate. The upper end of the second vacuum suction knife 270 is located in the second negative pressure chamber 122.

[0037] In one embodiment, along the X direction, the first vacuum suction knife 260 is located at both ends of the mounting body 100, and the support wheel 310 is located between two adjacent first vacuum suction knives 260.

[0038] In this embodiment, multiple first vacuum suction blades 260 may be provided, and the multiple first vacuum suction blades 260 are all located at both ends of the mounting body 100 along the X direction, while multiple second vacuum suction blades 270 are disposed between the first vacuum suction blades 260. By placing the first vacuum suction blades 260 at both ends of the mounting body 100, the movement stability of the first vacuum suction blades 260 and the second vacuum suction blades 270 can be improved during movement. The support wheel 310 is mounted on the first support shaft 300. The first support shaft 300 still passes through all the first vacuum suction knives 260 and the second vacuum suction knives 270. By setting the support wheel 310 between two adjacent first vacuum suction knives 260, when the support wheel 310 adjusts the distance between the suction hole 240 on the lower surface of the vacuum suction knife 200 and the surface of the PCB board according to the thickness of the PCB board, the force is preferentially applied to the first support shaft 300 near the first vacuum suction knife 260. This facilitates the transmission of force to the second vacuum suction knife 270 and thus adjusts the height of all vacuum suction knives 200, thereby realizing the adjustment of the distance between the suction hole 240 on the lower surface of the vacuum suction knife 200 and the surface of the PCB board.

[0039] In one embodiment, a connecting mechanism is also included, which includes a first drive shaft passing through the center of the upper roller 400 and a second drive shaft passing through the center of the lower roller 500, with the first drive shaft located above the second drive shaft.

[0040] In this embodiment, a first drive shaft passes through the center holes of all upper rollers 400, serving as the common axis of rotation for all upper rollers 400. A second drive shaft passes through the center holes of all lower rollers 500, also serving as the common axis of rotation for all lower rollers 500. Furthermore, the first drive shaft is positioned above the second drive shaft along the Z-direction. When the first drive shaft rotates, all upper rollers 400 mounted on it rotate synchronously and at the same speed around the axis of the first drive shaft, preventing any inconsistency in the rotational speed of individual upper rollers 400. Similarly, when the second drive shaft rotates, all lower rollers 500 mounted on it rotate synchronously and at the same speed around the axis of the second drive shaft, preventing any inconsistency in the rotational speed of individual lower rollers 500.

[0041] It is understandable that there are multiple first and second drive shafts, and the multiple first drive shafts and multiple second drive shafts are arranged at intervals along the Y direction, so that the PCB board can move along the PCB channel under the drive of the upper roller 400 and the lower roller 500.

[0042] In one embodiment, a gear assembly is further included for transmission connection with the connecting mechanism; the gear assembly includes a transmission gear and a drive gear, which are coaxially mounted on a first transmission shaft and a second transmission shaft, respectively. Further, a drive mechanism is included, which is transmissionally connected to the drive gear.

[0043] In this embodiment, the transmission gear can be coaxially fixed on the first transmission shaft, and the drive gear can be coaxially fixed on the second transmission shaft, with the transmission gear and drive gear meshing together. Simultaneously, the drive gear is connected to the drive mechanism, such as by coaxially connecting the drive gear to the output shaft of the drive motor. When the drive motor starts, the output shaft of the drive motor drives the drive gear to rotate, transmitting the driving force to the second transmission shaft, which in turn drives the lower roller 500 to rotate. The drive gear simultaneously transmits the driving force to the transmission gear meshing with it, which then transmits the driving force to the first transmission shaft, which in turn transmits the driving force to the upper roller 400, causing the upper roller 400 to rotate. Because the transmission gear and drive gear are meshed, they rotate relative to each other, causing the upper roller 400 and lower roller 500 to rotate relative to each other. This creates a counter-rotating clamping force between the upper roller 400 and lower roller 500, driving the PCB board along the PCB channel and preventing slippage during transport, thus ensuring the stability of the PCB board transport.

[0044] Secondly, embodiments of the present invention also provide a PCB board manufacturing equipment, including a vacuum adsorption device for PCB boards. Since the PCB board manufacturing equipment includes a vacuum adsorption device for PCB boards, it has the same effect as the vacuum adsorption device for PCB boards, and will not be described in detail here.

[0045] In the specific implementation of the above embodiments, the technical features can be combined in any non-contradictory way. For the sake of brevity, not all possible combinations of the above technical features are described. However, as long as the combination of these technical features is not contradictory, it should be considered to be within the scope of this specification.

[0046] The specific embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A vacuum adsorption device for PCB boards, characterized in that, include: The system includes a vacuum adsorption mechanism, a transmission mechanism, an adjustment mechanism, and a float automatic adjustment mechanism. The vacuum adsorption mechanism comprises a mounting body (100) and a plurality of vacuum suction blades (200) disposed within the mounting body (100). The mounting body (100) has a plurality of first mounting holes, and the plurality of vacuum suction blades (200) are fixedly installed in the first mounting holes one by one, with the vacuum suction blades (200) extending below the mounting body (100). The mounting body (100) has a negative pressure chamber (120), and the vacuum suction blades (200) have a chamber (210), a suction channel (220), and a plurality of suction holes (240). The negative pressure chamber (120), the chamber (210), the suction channel (220), and the suction holes (240) are sequentially connected. The transmission mechanism includes multiple upper rollers (400) disposed below the vacuum adsorption mechanism and multiple lower rollers (500) disposed below the upper rollers (400); a PCB channel for conveying PCB boards is provided between the upper rollers (400) and the lower rollers (500); The adjustment mechanism includes a first support shaft (300), which is simultaneously inserted through a plurality of vacuum suction knives (200). The first support shaft (300) is provided with a support wheel (310), which adjusts the distance between the suction hole (240) of the vacuum suction knife (200) and the upper surface of the PCB board by adjusting the thickness of the PCB board. The automatic adjustment mechanism of the float includes a float (230), which is movably disposed in the chamber (210) and freely rises and falls between the rising position and the falling position in the chamber (210). When the suction medium of the vacuum suction knife (200) is gas, the float (230) is in the falling position and closes the suction channel (220).

2. The vacuum adsorption device for PCB boards according to claim 1, characterized in that, It also includes a seal (250) disposed on the vacuum suction knife (200) and sleeved on the first support shaft (300).

3. The vacuum adsorption device for PCB boards according to claim 1, characterized in that, The upper roller (400) includes a first conveying roller and a second conveying roller, the diameter of the first conveying roller being smaller than the diameter of the second conveying roller; along the Y direction, the first conveying roller is located on at least one side of the vacuum suction knife (200) and at least partially located below the mounting body (100) along the Z direction.

4. The vacuum adsorption device for PCB boards according to claim 3, characterized in that, It also includes a water-blocking roller (600), the diameter of which is smaller than that of the second conveying roller. Along the Y direction, the water-blocking roller (600) is located on the other side of the vacuum suction knife (200) and at least partially below the mounting body (100) along the Z direction.

5. The vacuum adsorption device for PCB boards according to claim 1, characterized in that, The mounting body (100) is provided with a connecting plate (110), and the connecting plate (110) is provided with a plurality of second mounting holes; The vacuum suction knife (200) includes a first vacuum suction knife (260) and a second vacuum suction knife (270). The first vacuum suction knife (260) is installed in the first mounting hole and the second mounting hole. Along the Z direction, the upper end of the first vacuum suction knife (260) extends above the connecting plate (110). The second vacuum suction knife (270) is installed in the first mounting hole. Along the Z direction, the upper end of the second vacuum suction knife (270) is located below the connecting plate (110).

6. The vacuum adsorption device for PCB boards according to claim 5, characterized in that, Along the X direction, the first vacuum suction knife (260) is located at both ends of the mounting body (100), and the support wheel (310) is located between two adjacent first vacuum suction knives (260).

7. The vacuum adsorption device for PCB boards according to claim 1, characterized in that, It also includes a connecting mechanism, which includes a first drive shaft passing through the center of the upper roller (400) and a second drive shaft passing through the center of the lower roller (500), with the first drive shaft located above the second drive shaft.

8. The vacuum adsorption device for PCB boards according to claim 7, characterized in that, It also includes a gear assembly for transmission connection with the connecting mechanism; the gear assembly includes a transmission gear and a drive gear, the transmission gear and the drive gear being coaxially mounted on the first transmission shaft and the second transmission shaft, respectively.

9. The vacuum adsorption device for PCB boards according to claim 8, characterized in that, It also includes a drive mechanism, which is connected to the drive gear in a transmission manner.

10. A PCB board manufacturing equipment, characterized in that, include: At least one vacuum adsorption device for PCB boards as described in any one of claims 1 to 9.

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