Embedded multi-element integrated semiconductor chip integrated packaging device based on PCB (Printed Circuit Board)

Abstract

The invention belongs to the technical field of semiconductor chip packaging, discloses an embedded multi-element integrated semiconductor chip integrated packaging device based on a PCB (printed circuit board), and aims to solve the problems of non-uniform filling of pouring sealant and easiness in leaving bubbles in existing packaging. The device comprises a workbench, a vertical guide rail, an upper template, a lower template, a vacuum piston tube and a packaging glue injection mold, two-dimensional precise positioning is achieved through longitudinal and transverse guide rails, sealing grooves of the upper mold plate and the lower mold plate form a closed cavity, and bubbles are removed through vacuum pumping of a vacuum piston pipe and a vent hole; the packaging glue injection mold is provided with a telescopic capsule, a silica gel contact mold with a micropore and a flexible fitting embedding groove, uniform filling of glue pouring and overflow prevention are achieved, the device is compatible with heating or ultraviolet activation type epoxy resin, multi-chip pouring and sealing can be completed synchronously, and the packaging yield and reliability are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip packaging technology, and in particular to a multi-component integrated semiconductor chip packaging device based on PCB embedded multi-component integrated packaging. Background Technology

[0002] As electronic products become smaller and more high-performance, the integration of semiconductor chips is increasing, and multi-component integration has become the mainstream trend. In multi-component integration, how to efficiently and reliably package multiple chips in a limited space, especially by using PCB embedded packaging technology to directly embed the chips into the printed circuit board, is a major challenge facing the semiconductor packaging field. Traditional semiconductor packaging methods, such as flip-chip bonding and wire bonding, usually connect the chip to the PCB surface, resulting in a relatively high packaging height and certain limitations in space utilization when integrating multiple chips.

[0003] In the existing technology, although there are relevant equipment and processes for PCB embedded packaging, there are still some common technical problems. For example, when multiple chips are encapsulated and potted at the same time, it is difficult to ensure that the potting glue is filled evenly and without air bubbles. Traditional potting equipment often cannot accurately control each embedding slot independently, which can easily lead to problems such as insufficient potting glue, air bubbles, or glue overflow, thereby reducing the packaging yield and reliability. Summary of the Invention

[0004] The technical problem to be solved by this invention is the common problem in existing PCB embedded multi-component integrated semiconductor chip packaging devices, such as uneven filling of potting compound and easy generation of air bubbles. To address this, we propose an integrated packaging device for multi-component integrated semiconductor chips based on PCB embedded components.

[0005] To achieve the above objectives, this application adopts the following technical solution: a multi-component integrated semiconductor chip packaging device based on PCB embedded, including a vertical guide rail fixedly installed on a worktable, a first slider slidably connected on the vertical guide rail, a fixing sleeve fixedly connected on the first slider, a vacuum piston tube coaxially fixedly connected inside the fixing sleeve, an upper template fixedly connected to the bottom of the vacuum piston tube through a flange structure, a fixing seat correspondingly provided directly below the upper template, the fixing seat being detachably fixed to the worktable by high-strength bolts, two sets of lifting guide rods vertically and symmetrically fixedly connected on the fixing seat, a lower template slidably sleeved on the lifting guide rods, a return spring provided between the lower template and the fixing seat corresponding to the position of the lifting guide rod, the return spring being coaxially sleeved on the outside of the lifting guide rod; The top of the lower template has a sealing groove, and a PCB positioning plate is fixedly connected to the sealing groove by internal hex bolts. An embedded PCB is positioned on the PCB positioning plate. The embedded PCB has an embedding groove corresponding to the position to be packaged. An embedded chip is pre-fixed in the embedding groove by thermally conductive adhesive, and the embedded chip is precisely aligned with the pads of the embedded PCB. An upper support plate is detachably and fixedly connected to the upper template by bolts, and a sealing and injection mold is fixedly connected to the lower part of the upper support plate by positioning bolts. A fixed piston is sealed and slidably fitted inside the vacuum piston tube. A piston rod is coaxially fixedly connected above the fixed piston. A fixed bracket is fixedly connected across the vertical guide rail. The fixed bracket is fixedly connected to the upper end of the piston rod through a threaded structure.

[0006] Furthermore, two sets of parallel longitudinal guide rails are provided on both sides below the vertical guide rail. The longitudinal guide rails are fixedly installed on the worktable by supports, and a second slider is slidably connected to them. A transverse guide rail is also provided on one side below the vertical guide rail. The transverse guide rail spans the two sets of longitudinal guide rails and is fixed to the second slider by bolts. A third slider is slidably connected to the transverse guide rail. The bottom of the vertical guide rail is fixedly connected to the third slider. The two-dimensional planar movement of the vertical guide rail is realized through the cooperation of the longitudinal guide rail and the transverse guide rail, so as to align the upper template with the sealing groove.

[0007] Furthermore, the first, second, and third sliders all adopt a drive method of servo motors combined with precision ball screws. The servo motors are connected to the ball screws through couplings, and the sliders are fixed to the ball screw nuts, realizing high-precision linear displacement adjustment of the sliders, with a positioning accuracy of ±0.01mm.

[0008] Furthermore, the bottom contour of the upper template matches the shape and size of the sealing groove of the lower template. When the first slider drives the upper template to descend, the bottom of the upper template is embedded in the sealing groove to form a closed cavity. An annular groove is provided on the edge of the sealing groove, and a sealing ring is embedded in the groove. The sealing ring is made of heat-resistant silicone material to ensure the sealing performance of the closed cavity.

[0009] Furthermore, the embedded PCB has positioning holes at its four corners, and positioning pins are fixedly installed on the PCB positioning plate at the corresponding positions of the positioning holes. The positioning pins are fitted with the positioning holes with a clearance, and after insertion, the embedded PCB is accurately positioned on the PCB positioning plate to prevent displacement during the packaging process.

[0010] Furthermore, multiple vent holes are evenly distributed on the upper support plate. One end of each vent hole connects to the gap between the upper template and the encapsulation injection mold, while the other end connects to a vacuum piston tube. This is used to extract air from the closed cavity during encapsulation, preventing air bubbles from forming in the potting compound.

[0011] Furthermore, the number, position, and size of the encapsulation molds correspond one-to-one with the embedding slots on the embedded PCB, ensuring that multiple embedded chips complete the potting and encapsulation process simultaneously.

[0012] Furthermore, the encapsulation and dispensing mold includes a dispensing base, which is fixedly connected to the bottom of the upper support plate by bolts. The dispensing base has a dispensing port on its top and a connection port on one side of the upper template. The dispensing port is connected to the connection port through a sealed pipe, and the connection port is connected to the dispensing system through a sealed pipe. The dispensing system is used to quantitatively supply the potting compound. A dispensing box is integrally formed below the dispensing base, and a telescopic capsule is sealed and connected below the dispensing box. A silicone contact mold is fixedly set at the bottom of the telescopic capsule. The silicone contact mold adapts to the edge contour of the embedding groove to achieve flexible fitting.

[0013] Furthermore, the potting compound uses one of the following: heat-activated single-component epoxy resin and ultraviolet-activated single-component epoxy resin, or a combination of the two mixed in a preset ratio. The curing temperature of the heat-activated epoxy resin is 80-120℃, and the curing wavelength of the ultraviolet-activated epoxy resin is 365-405nm.

[0014] Furthermore, the size of the silicone contact mold is larger than the size of the embedding groove. Micropores are densely arranged in the area corresponding to the embedding groove on the silicone contact mold. The micropore diameter is 0.1-0.3mm, which is used to allow the potting compound to penetrate evenly into every corner of the embedding groove, while avoiding air bubble residue.

[0015] The technical effects and advantages of this invention are as follows: 1. This invention, through the cooperation of the upper and lower templates, as well as the sealing groove and sealing ring, forms a sealed cavity, providing a foundation for achieving precise vacuum packaging. In particular, the vent holes on the upper support plate, combined with the vacuum piston tube, efficiently extract air from the closed cavity, effectively eliminating air bubbles in the potting compound, further improving packaging quality and product reliability, and avoiding the adverse effects of air bubbles on electrical and heat dissipation performance.

[0016] 2. The specially designed injection mold structure of this invention includes an injection base, an injection port, a connection port, an injection box, a telescopic capsule, and a silicone contact mold. This not only achieves precise delivery and uniform filling of the potting compound, but also the flexible fit design of the silicone contact mold can adapt to the contour of the embedded groove, effectively preventing the potting compound from overflowing and further ensuring the packaging quality. Attached Figure Description

[0017] The disclosure of this invention is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this invention. In the drawings, the same reference numerals are used to refer to the same parts: Figure 1 This is a schematic diagram of the external structure of the present invention; Figure 2 This is a schematic diagram of the upper template structure of the present invention; Figure 3 This is a schematic diagram of the lower template structure of the present invention; Figure 4 This is a schematic diagram of the vacuum piston tube structure of the present invention; Figure 5 This is a schematic diagram of the PCB positioning board structure of the present invention; Figure 6 This is a schematic diagram of the encapsulation injection mold structure of the present invention.

[0018] Legend: 1. Vertical guide rail; 2. First slider; 3. Fixing sleeve; 4. Vacuum piston tube; 401. Fixed piston; 402. Piston rod; 403. Fixing frame; 5. Upper template; 6. Fixing seat; 7. Lifting guide rod; 8. Lower template; 9. Return spring; 10. Sealing groove; 11. PCB positioning plate; 1101. Positioning pin; 12. Embedded PCB; 1201. Positioning hole; 13. Embedded groove; 14. Embedded chip; 15. Upper support plate; 1501. Vent hole; 16. Encapsulation injection mold; 1601. Injection base; 1602. Injection port; 1603. Connection port; 1604. Injection box; 1605. Telescopic capsule; 1606. Silicone contact mold; 17. Longitudinal guide rail; 18. Second slider; 19. Transverse guide rail; 20. Third slider. Detailed Implementation

[0019] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of this application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0020] Example 1 Please see Figure 1 - Figure 6The present invention provides a PCB-embedded multi-component integrated semiconductor chip packaging device, which aims to achieve efficient and high-precision PCB-embedded chip packaging.

[0021] The packaging device includes a vertical guide rail 1 fixedly mounted on the worktable. The vertical guide rail 1 provides a vertical movement path, and a first slider 2 is slidably connected to it. The first slider 2 can move smoothly up and down along the vertical guide rail 1 to drive the upper packaging component to rise and fall. A fixing sleeve 3 is fixedly connected to the first slider 2. The fixing sleeve 3 serves as a connection and support. A vacuum piston tube 4 is coaxially fixedly connected inside the fixing sleeve 3. The vacuum piston tube 4 is a hollow cylindrical structure. Its interior is used to create a vacuum environment and cooperate with the piston mechanism. The bottom of the vacuum piston tube 4 is firmly fixedly connected to the upper template 5 through a flange structure. The upper template 5 is one of the core components of the packaging device. It is used to support the packaging injection mold 16 and to form a closed cavity together with the lower template 8 when the upper template 5 descends.

[0022] Directly below the upper template 5, a fixed seat 6 is correspondingly provided on the worktable. The fixed seat 6 is detachably fixed to the worktable by high-strength bolts for easy maintenance and replacement. Two sets of lifting guide rods 7 are vertically and symmetrically fixedly connected to the fixed seat 6. These two sets of lifting guide rods 7 provide guidance for the vertical movement of the lower template 8. The lower template 8 is slidably sleeved on the lifting guide rods 7, which means that the lower template 8 can move up and down smoothly on the lifting guide rods 7. In order to realize the reset function of the lower template 8, a reset spring 9 is provided between the lower template 8 and the fixed seat 6 at the position corresponding to the lifting guide rod 7. The reset spring 9 is coaxially sleeved on the outside of the lifting guide rod 7. When the upper template 5 descends and applies pressure to the lower template 8, the reset spring 9 is compressed to accumulate elastic potential energy. After the upper template 5 is raised, this elastic potential energy can push the lower template 8 to reset upward.

[0023] Please also refer to Figure 2 - Figure 5The top of the lower template 8 has a sealing groove 10, the shape and size of which match the bottom contour of the upper template 5. This groove is used to form a closed cavity with the upper template 5 during encapsulation. Inside the sealing groove 10, a PCB positioning plate 11 is fixedly connected by hexagonal screws. The PCB positioning plate 11 is a key component for accurately placing the embedded PCB 12. The embedded PCB 12 is positioned on the PCB positioning plate 11. The embedded PCB 12 is the circuit board to be encapsulated. An embedding groove 13 is provided on the PCB 12 corresponding to the encapsulation position. An embedded chip 14 is pre-fixed in these embedding grooves 13 with thermally conductive adhesive. Pre-fixing helps to stabilize the chip position before encapsulation. It is worth noting that the embedded chip 14 and the pads of the embedded PCB 12 are precisely aligned. This is a key step to ensure the reliability of electrical connection. In order to achieve accurate positioning of the embedded PCB 12 on the PCB positioning plate 11, positioning holes 1201 are provided at the four corners of the embedded PCB 12. Positioning pins 1101 are fixedly provided on the PCB positioning plate 11 at the positions corresponding to the positioning holes 1201. The positioning pin 1101 and the positioning hole 1201 are fitted with a clearance, which enables the embedded PCB 12 to be accurately positioned on the PCB positioning board 11 after the positioning pin 1101 is inserted into the positioning hole 1201, effectively preventing displacement during the packaging process and thus ensuring packaging accuracy.

[0024] Please see Figure 2 Within the upper template 5, an upper support plate 15 is detachably and fixedly connected by bolts, providing an installation base for the encapsulation mold 16. Below the upper support plate 15, the encapsulation mold 16 is fixedly connected by positioning bolts. The encapsulation mold 16 is the core component for completing the potting and encapsulation operation, and its number, position, and size correspond one-to-one with the embedding slots 13 on the embedded PCB 12. This means that multiple sets of embedded chips 14 can be potted and encapsulated simultaneously.

[0025] To achieve the filling operation under vacuum conditions, a fixed piston 401 is sealed and slidably fitted inside the vacuum piston tube 4. A piston rod 402 is coaxially fixedly connected above the fixed piston 401, and a fixed frame 403 is horizontally fixedly connected above the vertical guide rail 1. The fixed frame 403 is fixedly connected to the upper end of the piston rod 402 through a threaded structure. When the first slider 2 drives the vacuum piston tube 4 to descend, the fixed piston 401 will generate relative movement inside the vacuum piston tube 4 because it is relatively fixed by the piston rod 402 and the fixed frame 403, thereby creating a negative pressure and achieving the vacuuming function.

[0026] Example 2 Based on Example 1, combined with Figure 1 The mobile positioning structure of the present invention will be further explained.

[0027] To achieve precise alignment of the sealing groove 10 on the upper template 5 and the lower template 8, this device also incorporates a two-dimensional planar moving structure. Two sets of parallel longitudinal guide rails 17 are provided on both sides below the vertical guide rail 1. The longitudinal guide rails 17 are fixedly mounted on the worktable via supports, and a second slider 18 is slidably connected to them. A transverse guide rail 19 is also provided on one side below the vertical guide rail 1. The transverse guide rail 19 spans the two sets of longitudinal guide rails 17 and is fixed to the second slider 18 with bolts. This allows the transverse guide rail 19 to move longitudinally along with the second slider 18. A third slider 20 is slidably connected to the transverse guide rail 19, and the bottom of the vertical guide rail 1 is fixedly connected to the third slider 20. Through the cooperation of the longitudinal guide rails 17 and the transverse guide rails 19, the vertical guide rail 1 can move in the XY plane, thereby enabling the upper template 5 to precisely align with the sealing groove 10 on the lower template 8, ensuring alignment accuracy before sealing.

[0028] To further improve the accuracy and automation of the mobile positioning, the first slider 2, the second slider 18, and the third slider 20 are all driven by servo motors in conjunction with precision ball screws. The servo motors are connected to the ball screws via couplings, and the sliders are fixed to the ball screw nuts. This driving method can achieve high-precision linear displacement adjustment of the sliders, with a positioning accuracy of ±0.01mm, which greatly ensures the alignment accuracy and repeatability of the packaging device.

[0029] During the encapsulation process, the bottom contour of the upper template 5 is matched with the shape and size of the sealing groove 10 of the lower template 8. When the first slider 2 drives the upper template 5 to descend, the bottom of the upper template 5 will be precisely embedded in the sealing groove 10, thereby forming a sealed cavity. In order to ensure the sealing performance of the closed cavity, an annular groove is provided on the edge of the sealing groove 10, and a sealing ring is embedded in the groove. The sealing ring is preferably made of heat-resistant silicone material. Its high temperature resistance and chemical corrosion resistance can ensure good sealing in the closed cavity during the encapsulation operation, especially during the subsequent curing and heating process, effectively preventing the leakage of potting compound and the entry of outside air.

[0030] Please see Figure 2 To achieve a vacuum environment within the cavity, multiple vent holes 1501 are evenly provided on the upper support plate 15. One end of each vent hole 1501 connects to the gap between the upper template 5 and the encapsulation injection mold 16, while the other end connects to the vacuum piston tube 4. During encapsulation, a negative pressure is generated through the vacuum piston tube 4, which allows air to be drawn out of the closed cavity through these vent holes 1501, thereby preventing air bubbles from forming in the potting compound during the potting process and significantly improving the encapsulation quality and reliability.

[0031] Example 3 Based on Embodiment 1 and Embodiment 2, combined with Figure 2 and Figure 6The specific structure of the encapsulation mold 16 and the characteristics of the potting compound are further described in detail.

[0032] The encapsulation and dispensing mold 16 includes a dispensing base 1601, which is fixedly connected to the bottom of the upper support plate 15 by bolts, serving as the main body of the entire dispensing module. The top of the dispensing base 1601 has a dispensing port 1602 for receiving potting compound. A connection port 1603 is provided on one side of the upper mold plate 5. The dispensing port 1602 is connected to the connection port 1603 via a sealed pipe to ensure the sealing of the potting compound during transport. The connection port 1603 is connected to an external dispensing system via a sealed pipe. This dispensing system is used to quantitatively supply the potting compound, achieving precise control of the dispensing volume.

[0033] Below the dispensing base 1601, there is an integrally formed dispensing box 1604 for temporary storage and dispensing of potting compound. Below the dispensing box 1604, there is a telescopic capsule 1605 sealed and connected. A silicone contact mold 1606 is fixedly installed at the bottom of the telescopic capsule 1605. The silicone contact mold 1606 is a component that directly contacts the embedding groove 13 on the embedded PCB 12. Its design is intended to adapt to the edge contour of the embedding groove 13 to achieve flexible fit, thereby avoiding potting compound overflow.

[0034] Specifically, the size of the silicone contact mold 1606 is slightly larger than that of the embedding groove 13 to ensure that it can completely cover the edge of the embedding groove 13 during pressing. Micropores are densely arranged in the area corresponding to the embedding groove 13 on the silicone contact mold 1606. The pore diameter of these micropores is 0.1-0.3mm. These micropores are designed to allow the potting compound to penetrate evenly and slowly into all corners of the embedding groove 13 during potting, fully filling the tiny gaps around the embedded chip 14, and assisting in venting through capillary action, while avoiding the rapid influx of potting compound that would cause air bubbles to remain.

[0035] The potting compound used in this invention can be adapted to different process requirements and chip characteristics by employing either a heat-activated single-component epoxy resin or a UV-activated single-component epoxy resin, or a combination of both mixed in a preset ratio. The recommended curing temperature for the heat-activated epoxy resin is 80-120℃, and curing can be achieved by controlling the temperature of the lower template 8 or the entire cavity using an external heating device. The recommended curing wavelength for the UV-activated epoxy resin is 365-405nm, and it can be activated and cured by irradiation with an external UV light source. This flexibility allows the encapsulation device to be compatible with a variety of different potting compound materials to meet the encapsulation requirements of different application scenarios.

[0036] The working process of this invention is as follows: Before the encapsulation process begins, preliminary positioning and preparation are completed. The embedded PCB 12 is precisely placed on the PCB positioning plate 11. The positioning holes 1201 at the four corners of the embedded PCB 12 are fitted with the positioning pins 1101 on the PCB positioning plate 11 to ensure stable positioning of the embedded PCB 12. This effectively prevents displacement due to force or adhesive flow during the encapsulation process, thus ensuring encapsulation accuracy. Prior to this, the embedded chip 14 has been pre-fixed in the embedding slot 13 of the embedded PCB 12 using thermally conductive adhesive, ensuring precise alignment between the embedded chip 14 and the pads of the embedded PCB 12. This lays the foundation for reliable electrical connections in subsequent encapsulation. Simultaneously, the adhesive supply system prepares the potting compound, selecting heat-activated, UV-activated single-component epoxy resin or a mixture of both according to the encapsulation requirements, and adjusting it to the appropriate supply state.

[0037] After the preparation work is completed, the second slider 18 and the third slider 20 are moved precisely by the coordinated action of the longitudinal guide rail 17 and the transverse guide rail 19, thereby realizing the position adjustment of the vertical guide rail 1 in the two-dimensional plane, and finally aligning the upper template 5 precisely with the sealing groove 10 on the lower template 8 to complete the alignment calibration before packaging.

[0038] After alignment, the first slider 2 is driven to move downward along the vertical guide rail 1, which drives the vacuum piston tube 4 and the upper template 5 at the bottom to descend synchronously. The bottom of the upper template 5 is first embedded in the sealing groove 10 of the lower template 8. With the help of the heat-resistant silicone sealing ring in the annular groove at the edge of the sealing groove 10, a closed cavity with good sealing performance is formed, which provides a sealing guarantee for the subsequent construction of vacuum environment and encapsulation of adhesive liquid.

[0039] The upper template 5 continues to move downwards, causing the encapsulation mold 16 to gradually approach the embedded PCB 12. Since the number, position, and size of the encapsulation mold 16 correspond one-to-one with the embedded grooves 13, the silicone contact mold 1606 can accurately cover each area of ​​the embedded grooves 13. As pressure is applied, the silicone contact mold 1606 adapts to the edge contour of the embedded grooves 13 to achieve flexible fit, while compressing the telescopic capsule 1605, so that the encapsulation mold 16 and the surface of the embedded PCB 12 form a tight seal, preventing the potting compound from overflowing. At this time, the upper template 5 continues to move downwards and exerts pressure on the lower template 8. The lower template 8 slides downwards along the lifting guide rod 7, and simultaneously compresses the reset spring 9. The reset spring 9 accumulates elastic potential energy to provide power for the template reset after the encapsulation is completed.

[0040] While the template is closed and pressure is applied, vacuum extraction and glue injection are carried out simultaneously. Since the fixed piston 401 and the vertical guide rail 1 are kept relatively fixed through the fixed frame 403 and the piston rod 402, when the vacuum piston tube 4 continues to descend with the upper template 5, the fixed piston 401 slides relatively inside the vacuum piston tube 4. The air in the closed cavity is extracted through the vent hole 1501 on the upper support plate 15, so that a negative pressure environment is formed in the cavity. On the one hand, this significantly improves the fluidity of the potting glue, and on the other hand, it can effectively remove the glue and residual air bubbles embedded in the gaps of the chip 14.

[0041] Meanwhile, the glue supply system delivers a quantitative amount of potting glue through a sealed pipe to the glue injection port 1602 of the glue injection base 1601 via the connection port 1603 of the upper template 5. After the potting glue enters the glue injection box 1604, it penetrates evenly into all corners of the embedding groove 13 through the dense micropores with a diameter of 0.1-0.3mm on the silicone contact mold 1606, fully filling the gaps around the embedded chip 14, and achieving a tight wrapping of the embedded chip 14 and the embedded PCB 12.

[0042] The negative pressure environment continues until the potting compound is fully filled, ensuring complete coverage and eliminating air bubbles. Once the compound is fully filled, the curing process begins depending on the type of potting compound used. For heat-activated epoxy resin, the curing temperature is controlled between 80-120℃; for UV-activated epoxy resin, UV light with a wavelength of 365-405nm is used for activation and curing. After the potting compound is fully cured, the negative pressure extraction stops, and the first slider 2 moves the upper template 5 upwards to reset. The lower template 8 rises along the lifting guide rod 7 under the elastic force of the reset spring 9, separating the silicone contact mold 1606 from the encapsulated embedded PCB 12. Finally, the encapsulated product is removed, completing the entire integrated encapsulation process.

[0043] The above are merely embodiments of this application and are not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A PCB-embedded multi-component integrated semiconductor chip integrated packaging device, characterized in that, The device includes a vertical guide rail fixedly mounted on a workbench. A first slider is slidably connected to the vertical guide rail. A fixing sleeve is fixedly connected to the first slider. A vacuum piston tube is coaxially fixedly connected inside the fixing sleeve. An upper template is fixedly connected to the bottom of the vacuum piston tube through a flange structure. A fixing seat is correspondingly provided directly below the upper template. The fixing seat is detachably fixed to the workbench by high-strength bolts. Two sets of lifting guide rods are vertically and symmetrically fixedly connected to the fixing seat. A lower template is slidably sleeved on the lifting guide rod. A return spring is provided between the lower template and the fixing seat at the position corresponding to the lifting guide rod. The return spring is coaxially sleeved on the outside of the lifting guide rod. The lower template has a sealing groove at the top. A PCB positioning plate is fixedly connected to the sealing groove by an internal hex bolt. An embedded PCB is positioned on the PCB positioning plate. An embedding groove is opened on the embedded PCB corresponding to the position to be packaged. An embedded chip is pre-fixed in the embedding groove by thermally conductive adhesive. The embedded chip and the pads of the embedded PCB are precisely aligned. An upper support plate is detachably and fixedly connected to the upper template by bolts, and a sealing and injection mold is fixedly connected to the lower part of the upper support plate by positioning bolts; A fixed piston is sealed and slidably fitted inside the vacuum piston tube. A piston rod is coaxially fixedly connected above the fixed piston. A fixed frame is horizontally fixedly connected above the vertical guide rail. The fixed frame is fixedly connected to the upper end of the piston rod through a threaded structure.

2. The integrated semiconductor chip packaging device based on PCB embedded multi-component packaging according to claim 1, characterized in that, Two sets of parallel longitudinal guide rails are also provided on both sides below the vertical guide rail. The longitudinal guide rails are fixedly installed on the worktable by supports, and a second slider is slidably connected to them. A transverse guide rail is also provided on one side below the vertical guide rail. The transverse guide rail spans the two sets of longitudinal guide rails and is fixed to the second slider by bolts. A third slider is slidably connected to the transverse guide rail. The bottom of the vertical guide rail is fixedly connected to the third slider. The two-dimensional planar movement of the vertical guide rail is realized through the cooperation of the longitudinal and transverse guide rails, so as to align the upper template with the sealing groove.

3. The integrated semiconductor chip packaging device based on PCB embedded multi-component packaging according to claim 1, characterized in that, The first slider, the second slider, and the third slider are all driven by servo motors in conjunction with precision ball screws.

4. The integrated semiconductor chip packaging device based on PCB embedded multi-component packaging according to claim 1, characterized in that, The bottom contour of the upper template is adapted to the shape and size of the sealing groove of the lower template. When the first slider drives the upper template to descend, the bottom of the upper template is embedded in the sealing groove to form a closed cavity. The edge of the sealing groove is provided with an annular groove, and a sealing ring is embedded in the groove. The sealing ring is made of heat-resistant silicone material to ensure the sealing performance of the closed cavity.

5. The integrated semiconductor chip packaging device based on PCB embedded multi-component packaging according to claim 1, characterized in that, The embedded PCB has positioning holes at its four corners. Positioning pins are fixedly installed on the PCB positioning plate at the corresponding positions of the positioning holes. The positioning pins are fitted with the positioning holes with a clearance. After insertion, the embedded PCB is accurately positioned on the PCB positioning plate to prevent displacement during the packaging process.

6. The integrated semiconductor chip packaging device based on PCB embedded multi-component packaging according to claim 1, characterized in that, The upper support plate is provided with a plurality of ventilation holes evenly distributed. One end of each ventilation hole is connected to the gap between the upper template and the encapsulation injection mold, and the other end is connected to the vacuum piston tube.

7. The integrated semiconductor chip packaging device based on PCB embedded multi-component packaging according to claim 1, characterized in that, The number, position, and size of the encapsulation molds correspond one-to-one with the embedding slots on the embedded PCB, ensuring that multiple sets of embedded chips complete the potting and encapsulation operation simultaneously.

8. The integrated semiconductor chip packaging device based on PCB embedded multi-component packaging according to claim 1, characterized in that, The encapsulation and dispensing mold includes a dispensing base, which is fixedly connected to the bottom of an upper support plate by bolts. The dispensing base has a dispensing port on its top and a connection port on one side of the upper mold plate. The dispensing port is connected to the connection port through a sealed pipe, and the connection port is connected to a dispensing system through a sealed pipe. The dispensing system is used to quantitatively supply potting compound. A dispensing box is integrally formed below the dispensing base. A telescopic capsule is sealed and connected below the dispensing box. A silicone contact mold is fixedly set at the bottom of the telescopic capsule. The silicone contact mold adapts to the edge contour of the embedding groove to achieve flexible fit.

9. The integrated semiconductor chip packaging device based on PCB embedded multi-component packaging according to claim 8, characterized in that, The potting compound is made of one of the following: heat-activated single-component epoxy resin, ultraviolet-activated single-component epoxy resin, or a combination of the two mixed in a preset ratio.

10. The integrated semiconductor chip packaging device based on PCB embedded multi-component packaging according to claim 8, characterized in that, The size of the silicone contact mold is larger than the size of the embedding groove. Micropores are densely arranged in the area corresponding to the embedding groove on the silicone contact mold. The micropore diameter is 0.1-0.3mm, which is used to allow the potting compound to penetrate evenly into every corner of the embedding groove, while avoiding air bubbles.

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