Heat dissipation module of integrated washing machine control panel and heat dissipation method of heat dissipation module

Abstract

The invention relates to the technical field of washing machine accessories, in particular to a heat dissipation module of an integrated washing machine control panel and a heat dissipation method of the heat dissipation module. The heat dissipation module comprises a panel shell, a PCB, a heat dissipation substrate and an auxiliary heat dissipation mechanism, and the auxiliary heat dissipation mechanism comprises a sealing shell, a liquid storage tank, a circulating pump, a heat exchange pipeline, a semiconductor chilling plate and a heat dissipation fan; closed liquid cooling circulation is formed through the heat exchange pipeline embedded in the heat dissipation substrate, cooling liquid is driven by the circulating pump to continuously flow, and heat is directly and efficiently brought away from a heat source. Meanwhile, the semiconductor chilling plate integrated on the liquid storage tank can actively cool the cooling liquid, so that the cooling liquid always keeps high heat absorption capacity, and the liquid temperature can be effectively controlled even under high environment temperature or continuous high load. In addition, the heat dissipation fan and the heat dissipation groove work cooperatively, air convection on the surface of the heat dissipation substrate is enhanced, and the overall heat dissipation efficiency and stability of the integrated washing machine control panel are further improved.

Description

Technical Field

[0001] This invention relates to the field of washing machine accessories technology, and in particular to a heat dissipation module and heat dissipation method for an integrated washing machine control panel. Background Technology

[0002] With the development of smart and integrated home appliances, the control panels of modern washing machines have evolved from traditional mechanical knobs and scattered buttons to highly integrated intelligent control panels. These integrated control panels typically incorporate high-performance processors, large touchscreens, various sensors, and communication modules to achieve complex functions such as human-machine interaction, program control, and network connectivity. They have a high density of internal electronic components, resulting in concentrated heat generation during operation.

[0003] Currently, common integrated washing machine control panel heat dissipation modules typically consist of a metal heat sink, thermal grease, and ventilation holes on the housing. The basic structure involves attaching the main heat-generating components (such as the main control chip) to a metal heat sink using thermal grease. This heat sink is usually fixed to the back of the control panel's PCB (printed circuit board) and placed within a closed or semi-closed housing. Several ventilation holes are provided on the housing, allowing heat to be dissipated through natural air convection within the washing machine during operation.

[0004] However, the heat dissipation module of the existing integrated washing machine control panel relies solely on natural convection for heat dissipation, which has limited heat dissipation capacity. In hot summers or when running complex programs for a long time, the heat accumulated on the heat sink is difficult to dissipate quickly, causing heat to accumulate in the enclosed space, affecting the stability and lifespan of the control panel. Summary of the Invention

[0005] The purpose of this invention is to provide a heat dissipation module and a heat dissipation method for an integrated washing machine control panel, aiming to solve the technical problem that the heat dissipation module of the existing integrated washing machine control panel relies solely on natural convection for heat dissipation, which has limited heat dissipation capacity. In hot summers or when running complex programs for a long time, the heat accumulated on the heat sink is difficult to dissipate quickly, resulting in heat accumulation in the enclosed space, which affects the stability and lifespan of the control panel.

[0006] To achieve the above objectives, the present invention provides a heat dissipation module for an integrated washing machine control panel, comprising a panel housing, a PCB board, a heat dissipation substrate, and an auxiliary heat dissipation mechanism. The PCB board is installed inside the panel housing, the heat dissipation substrate is disposed on the back of the PCB board, and heat dissipation grooves are disposed on the outer side wall of the panel housing. The auxiliary heat dissipation mechanism includes a sealed housing, a liquid storage tank, a circulating pump, a heat exchange pipeline, a thermoelectric cooler, and a cooling fan. The sealed housing is installed inside the panel housing and forms an installation area with the inner wall of the panel housing. The liquid storage tank and the circulating pump are installed inside the installation area. The heat exchange pipeline is embedded inside the heat dissipation substrate. The input end of the circulating pump is connected to the outlet of the liquid storage tank, and the output end of the circulating pump is connected to the heat exchange pipeline through a connecting pipe. The end of the heat exchange pipeline away from the circulating pump is connected to the return port of the liquid storage tank through a return pipe. The thermoelectric cooler is disposed on the liquid storage tank. An installation window is provided on the side wall of the panel housing, located at the end of the panel housing closer to the sealed housing. The cooling fan is disposed at the installation window.

[0007] The heat dissipation substrate includes a first substrate and a second substrate. The first substrate is disposed on the back side of the PCB board, and the second substrate is snapped onto the side of the first substrate away from the PCB board. The heat exchange pipeline is embedded between the first substrate and the second substrate.

[0008] The heat exchange pipeline is arranged in a serpentine coil structure, and both the first substrate and the second substrate are made of aluminum alloy.

[0009] The first substrate has fixing plates on both sides of the side facing the PCB board, and the fixing plates are fixed to the bottom of the PCB board by screws.

[0010] In this embodiment, a locking block is provided at each of the four corners of the side of the first substrate away from the PCB board, and a locking slot is provided at each of the four corners of the side of the second substrate facing the first substrate, wherein the locking block and the locking slot are adapted to each other.

[0011] The integrated washing machine control panel's heat dissipation module also includes an auxiliary fan. The side of the panel housing is also provided with a mounting slot, which is disposed through the side of the mounting area. The auxiliary fan is installed at the mounting slot, and the output end of the auxiliary fan corresponds to the hot end of the semiconductor cooling chip.

[0012] The panel housing is also provided with a dustproof frame on its side, which is located outside the mounting slot.

[0013] The present invention also provides a heat dissipation method for an integrated washing machine control panel, applied to the heat dissipation module of the integrated washing machine control panel as described above, comprising the following steps: Start-up signal triggering and system self-test: When the washing machine is powered on or the user starts any washing program, the main control module of the PCB board is powered on and generates a start signal to be sent to the control system of the auxiliary heat dissipation mechanism. The control system performs a self-test on the circuit connection and initial state of the circulation pump, the semiconductor cooling chip and the cooling fan. Basic liquid cooling cycle start-up: After the self-test is passed, the control system controls the circulation pump to start, driving the coolant in the storage tank to flow through the heat exchange pipeline and the return pipe to form a closed loop. When the coolant flows through the heat exchange pipeline embedded in the heat dissipation substrate, it absorbs the heat conducted from the heat-generating components on the PCB board to the heat dissipation substrate, completing the first heat exchange. Temperature monitoring and heat dissipation mode decision: Temperature sensors installed on the heat dissipation substrate or the key heat-generating area of ​​the PCB board monitor the temperature T in real time and feed the data back to the control system. Dynamic adjustment and operation maintenance: The control system continuously and dynamically adjusts the heat dissipation mode according to the real-time temperature T change, so as to keep the temperature stable within the target range; Program End and Heat Dissipation Delay: When the main washing program of the washing machine ends, the main control module of the PCB board generates a stop signal. After receiving the stop signal, the control system shuts down the semiconductor cooling chip and continues to run the circulation pump and the cooling fan for a preset delay period before shutting down the circulation pump and the cooling fan. The auxiliary heat dissipation mechanism then enters standby mode.

[0014] This invention discloses a heat dissipation module and method for an integrated washing machine control panel, comprising a panel housing, a PCB board, a heat dissipation substrate, and an auxiliary heat dissipation mechanism. The auxiliary heat dissipation mechanism includes a sealed housing, a liquid storage tank, a circulating pump, heat exchange pipes, a thermoelectric cooler, and a cooling fan. The heat exchange pipes embedded in the heat dissipation substrate form a closed liquid-cooled circulation. The circulating pump drives the continuous flow of coolant, directly and efficiently removing heat from the heat source, thus changing the passive heat conduction mode. Simultaneously, the thermoelectric cooler integrated in the liquid storage tank actively cools the coolant, maintaining its strong heat absorption capacity and effectively controlling the liquid temperature even under high ambient temperatures or continuous high loads. Furthermore, the specially configured cooling fan works in conjunction with the heat dissipation grooves to enhance air convection within the entire panel housing and on the surface of the heat dissipation substrate, further improving the overall heat dissipation efficiency and stability of the integrated washing machine control panel. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the heat dissipation module of the integrated washing machine control panel according to the first embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the external structure of the panel housing in the first embodiment of the present invention.

[0018] Figure 3 This is a partial structural schematic diagram of the auxiliary heat dissipation mechanism in the first embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the disassembled structure of the heat dissipation substrate in the first embodiment of the present invention.

[0020] Figure 5 This invention provides Figure 4 A magnified view of the local structure at point A.

[0021] Figure 6 This is a schematic diagram of the external structure of the panel housing in the second embodiment of the present invention.

[0022] Figure 7 This is a flowchart illustrating the steps of the heat dissipation method for the integrated washing machine control panel provided by the present invention.

[0023] 101-Panel housing, 102-PCB board, 103-Sealed housing, 104-Liquid storage tank, 105-Circulating pump, 106-Heat exchange pipeline, 107-Semiconductor cooling chip, 108-Cooling fan, 109-First substrate, 110-Second substrate, 111-Cooling slot, 112-Installation area, 113-Connecting pipe, 114-Return pipe, 115-Installation window, 116-Fixing plate, 117-Card block, 118-Card slot, 119-Cooling fins, 201-Auxiliary fan, 202-Installation slot, 203-Dustproof frame. Detailed Implementation

[0024] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0025] First embodiment: Please see Figures 1 to 5 ,in Figure 1 This is a schematic diagram of the heat dissipation module of the integrated washing machine control panel in the first embodiment. Figure 2 This is a schematic diagram of the external structure of the panel housing in the first embodiment. Figure 3 This is a partial structural diagram of the auxiliary heat dissipation mechanism in the first embodiment. Figure 4 This is a schematic diagram of the disassembled structure of the heat dissipation substrate in the first embodiment. Figure 5 yes Figure 4 A magnified view of the local structure at point A.

[0026] This invention provides a heat dissipation module for an integrated washing machine control panel: comprising a panel housing 101, a PCB board 102, a heat dissipation substrate, and an auxiliary heat dissipation mechanism. The auxiliary heat dissipation mechanism includes a sealed housing 103, a liquid storage tank 104, a circulation pump 105, a heat exchange pipeline 106, a semiconductor cooling chip 107, and a cooling fan 108. The heat dissipation substrate includes a first substrate 109 and a second substrate 110. This solution solves the problem that existing integrated washing machine control panel heat dissipation modules rely solely on natural convection for cooling, which has limited heat dissipation capacity. In hot summers or during prolonged operation of complex programs, the heat accumulated on the heat sink is difficult to dissipate quickly, leading to heat accumulation in the enclosed space, affecting the stability and lifespan of the control panel. Therefore, the aforementioned solution can be used in the structure of an integrated washing machine control panel heat dissipation module.

[0027] In this specific embodiment, the PCB board 102 is installed inside the panel housing 101, and the heat dissipation substrate is provided on the back of the PCB board 102. The heat dissipation groove 111 is provided on the outer side wall of the panel housing 101. By conducting the heat of the PCB board 102 to the heat dissipation substrate on the back, and using the heat dissipation groove 111 on the panel housing 101 to form a preliminary air convection path, the basic physical heat dissipation of the heat-generating components inside the integrated control panel is realized.

[0028] The sealing housing 103 is installed inside the panel housing 101, forming an installation area 112 with the inner wall of the panel housing 101. The liquid storage tank 104 and the circulating pump 105 are installed inside the installation area 112. The heat exchange pipeline 106 is embedded inside the heat dissipation substrate. The input end of the circulating pump 105 is connected to the outlet of the liquid storage tank 104, and the output end of the circulating pump 105 is connected to the heat exchange pipeline 106 via a connecting pipe 113. The end of the heat exchange pipeline 106 away from the circulating pump 105 is connected to the return pipe 114. The return port of the liquid storage tank 104 is connected, and the semiconductor cooling chip 107 is installed on the liquid storage tank 104. An installation window 115 is provided on the side wall of the panel housing 101, located at the end of the panel housing 101 near the sealing housing 103. A cooling fan 108 is installed at the installation window 115. A closed liquid cooling cycle is formed through the heat exchange pipes 106 embedded in the heat dissipation substrate. The circulating pump 105 drives the coolant to flow continuously, directly and efficiently removing heat from the heat source, thus changing the passive heat conduction mode. Simultaneously, the semiconductor cooling chip 107 integrated on the liquid storage tank 104 can actively cool the coolant, maintaining its strong heat absorption capacity and effectively controlling the liquid temperature even under high ambient temperature or continuous high load. In addition, the specially configured cooling fan 108 works in conjunction with the cooling slot 111 to enhance air convection inside the entire panel housing 101 and on the surface of the cooling substrate, further improving the overall heat dissipation efficiency and stability of the integrated washing machine control panel.

[0029] Secondly, the first substrate 109 is disposed on the back side of the PCB board 102, and the second substrate 110 is snapped onto the side of the first substrate 109 away from the PCB board 102. The heat exchange pipe 106 is embedded between the first substrate 109 and the second substrate 110. By adopting the combined design of the first substrate 109 and the second substrate 110, the heat exchange pipe 106 is sealed and clamped between the two, thereby completing the installation of the heat exchange pipe 106.

[0030] Meanwhile, the heat exchange pipeline 106 is arranged in a serpentine coil structure. The first substrate 109 and the second substrate 110 are both made of aluminum alloy. The serpentine coil structure design combined with the aluminum alloy substrate significantly increases the contact area between the coolant and the substrate and the heat exchange efficiency, while achieving the comprehensive technical effect of lightweight, corrosion resistance and high cost performance of the heat dissipation module.

[0031] In addition, fixing plates 116 are provided on both sides of the side of the first substrate 109 facing the PCB board 102. The fixing plates 116 are fixed to the bottom of the PCB board 102 by screws. The fixing plates 116 are used to fix the first substrate 109. The four corners of the side of the first substrate 109 away from the PCB board 102 are provided with locking blocks 117. The four corners of the side of the second substrate 110 facing the first substrate 109 are provided with locking slots 118. The locking blocks 117 and the locking slots 118 are adapted to each other. The locking blocks 117 and the locking slots 118 make it easier to assemble and disassemble the first substrate 109 and the second substrate 110.

[0032] Furthermore, the second substrate 110 has heat dissipation fins 119 on the side away from the first substrate 109. The heat dissipation fins 119 further allow the rapidly flowing air to carry away the heat absorbed by the heat dissipation substrate.

[0033] When using the heat dissipation module of the integrated washing machine control panel of this embodiment, the heat from the PCB board 102 is conducted to the heat dissipation substrate on the back, and the heat dissipation grooves 111 on the panel housing 101 form a preliminary air convection path, achieving basic physical heat dissipation for the heat-generating components inside the integrated control panel. Furthermore, a closed liquid cooling cycle is formed by the heat exchange pipes 106 embedded in the heat dissipation substrate, with the circulating pump 105 driving the coolant to flow continuously, directly and efficiently removing heat from the heat source, thus changing the passive heat conduction mode. Simultaneously, the semiconductor cooling chip 107 integrated on the liquid storage tank 104 can actively cool the coolant, maintaining its strong heat absorption capacity and effectively controlling the liquid temperature even under high ambient temperatures or continuous high loads. In addition, the specially configured cooling fan 108 works in conjunction with the heat dissipation grooves 111, enhancing air convection inside the entire panel housing 101 and on the surface of the heat dissipation substrate, further improving the overall heat dissipation efficiency and stability of the integrated washing machine control panel.

[0034] Second embodiment: Based on the first embodiment, please refer to Figure 6 , Figure 6 This is a schematic diagram of the external structure of the panel housing in the second embodiment.

[0035] The present invention provides a heat dissipation module for an integrated washing machine control panel, which also includes an auxiliary fan 201.

[0036] In this specific embodiment, a mounting slot 202 is also provided on the side of the panel housing 101. The mounting slot 202 is disposed through the side of the mounting area 112. An auxiliary fan 201 is installed at the mounting slot 202. The output end of the auxiliary fan 201 corresponds to the hot end of the thermoelectric cooler 107. By setting the auxiliary fan 201, the air circulation speed in the mounting area 112 is accelerated, thereby speeding up the removal of the heat accumulated at the hot end of the thermoelectric cooler 107, so that the cooling effect of the thermoelectric cooler 107 is better.

[0037] The panel housing 101 is also provided with a dustproof frame 203 on its side. The dustproof frame 203 is located outside the mounting slot 202. The dustproof frame 203 is provided to prevent excessive dust in the air from entering the interior of the mounting area 112, thereby preventing excessive dust from adhering to the exterior of the hot end of the thermoelectric cooler 107 and affecting the cooling effect of the thermoelectric cooler 107.

[0038] When using the heat dissipation module of the integrated washing machine control panel of this embodiment, the auxiliary fan 201 accelerates the airflow speed in the installation area 112, thereby speeding up the removal of heat accumulated at the hot end of the thermoelectric cooler 107, resulting in better cooling effect of the thermoelectric cooler 107. Furthermore, the dustproof frame 203 prevents excessive dust from entering the interior of the installation area 112, thus preventing excessive dust from adhering to the exterior of the hot end of the thermoelectric cooler 107 and affecting its cooling effect.

[0039] Please see Figure 7 The present invention also provides a heat dissipation method for an integrated washing machine control panel, applied to the heat dissipation module of the integrated washing machine control panel as described above, comprising the following steps: S1. Start signal trigger and system self-test: When the washing machine is powered on or the user starts any washing program, the main control module of the PCB board 102 is powered on and generates a start signal to be sent to the control system of the auxiliary heat dissipation mechanism. The control system performs a self-test on the circuit connection and initial state of the circulation pump 105, the semiconductor cooling chip 107 and the heat dissipation fan 108. S2. Basic liquid cooling cycle start-up: After the self-test is passed, the control system controls the circulation pump 105 to start, driving the coolant in the storage tank 104 to flow through the heat exchange pipe 106 and the return pipe 114 to form a closed loop. When the coolant flows through the heat exchange pipe 106 embedded in the heat dissipation substrate, it absorbs the heat conducted from the heat-generating components on the PCB board 102 to the heat dissipation substrate, completing the first heat exchange. S3. Temperature monitoring and heat dissipation mode decision: A temperature sensor installed on the heat dissipation substrate or the key heat-generating area of ​​the PCB board 102 monitors the temperature T in real time and feeds the data back to the control system. S4. Dynamic Adjustment and Operation Maintenance: The control system continuously adjusts the heat dissipation mode dynamically according to the real-time temperature T change, so as to keep the temperature stable within the target range; S5. Program End and Heat Dissipation Delay: When the main washing program of the washing machine ends, the main control module of the PCB board 102 generates a stop signal. After receiving the stop signal, the control system shuts down the semiconductor cooling chip 107 and maintains the circulation pump 105 and the cooling fan 108 to continue running for a preset delay period before shutting down the circulation pump 105 and the cooling fan 108. The auxiliary heat dissipation mechanism then enters standby mode.

[0040] In the dynamic adjustment and operation maintenance step, the control system continuously adjusts the heat dissipation mode dynamically according to the real-time temperature T to keep the temperature stable within the target range. The specific adjustment logic is as follows: Preset a first threshold temperature T1 and a second threshold temperature T2, where T1 <T2; If the real-time temperature T ≤ T1, the control system maintains the basic liquid cooling circulation mode in which only the circulating pump 105 operates; If the real-time temperature T satisfies T1 < T ≤ T2, the control system starts the cooling fan 108 and adjusts its speed to the first preset level, entering a hybrid cooling mode that combines basic liquid cooling and forced air cooling; if the real-time temperature T > T2, the control system, while maintaining the hybrid cooling mode, starts the semiconductor cooling chip 107 and adjusts its cooling power to the corresponding level according to the over-temperature range, entering an enhanced cooling mode that includes active cooling. Meanwhile, the control system adjusts the speed of the cooling fan 108 and / or the power of the semiconductor cooling chip 107 in real time according to the dynamic changes of temperature T in the range of T1 and T2, forming a seamless adaptive adjustment closed loop from low-power silent operation to efficient active heat dissipation.

[0041] In this embodiment, through continuous temperature monitoring and a preset threshold decision mechanism, the control system can automatically and adaptively switch between three modes: basic liquid cooling, combined air cooling, and enhanced semiconductor cooling, based on the heat load level. Simultaneously, the dynamic PID control system achieves precise matching and smooth transition of heat dissipation power. This not only ensures that the core temperature of the control panel is consistently controlled within a safe threshold during high-performance operation, effectively preventing overheating and frequency throttling or component damage, but also fully dissipates residual system heat through a delayed heat dissipation design after program completion.

[0042] The above description discloses only one preferred embodiment of the present invention, and should not be construed as limiting the scope of the present invention. Those skilled in the art will understand that all or part of the processes of the above embodiments can be implemented, and equivalent changes made in accordance with the claims of the present invention are still within the scope of the invention.

Claims

1. A heat dissipation module for an integrated washing machine control panel, comprising a panel housing, a PCB board, and a heat dissipation substrate, wherein the PCB board is installed inside the panel housing, the heat dissipation substrate is disposed on the back of the PCB board, and heat dissipation grooves are disposed on the outer side wall of the panel housing, characterized in that, It also includes auxiliary heat dissipation mechanisms; The auxiliary heat dissipation mechanism includes a sealed housing, a liquid storage tank, a circulating pump, a heat exchange pipeline, a thermoelectric cooler, and a cooling fan. The sealed housing is installed inside the panel housing and forms an installation area with the inner wall of the panel housing. The liquid storage tank and the circulating pump are installed inside the installation area. The heat exchange pipeline is embedded inside the heat dissipation substrate. The input end of the circulating pump is connected to the outlet of the liquid storage tank, and the output end of the circulating pump is connected to the heat exchange pipeline through a connecting pipe. The end of the heat exchange pipeline away from the circulating pump is connected to the return port of the liquid storage tank through a return pipe. The thermoelectric cooler is disposed on the liquid storage tank. An installation window is provided on the side wall of the panel housing, located at the end of the panel housing closer to the sealed housing. The cooling fan is disposed at the installation window.

2. The heat dissipation module of the integrated washing machine control panel as described in claim 1, characterized in that, The heat dissipation substrate includes a first substrate and a second substrate. The first substrate is disposed on the back side of the PCB board, and the second substrate is snapped onto the side of the first substrate away from the PCB board. The heat exchange pipeline is embedded between the first substrate and the second substrate.

3. The heat dissipation module of the integrated washing machine control panel as described in claim 2, characterized in that, The heat exchange pipeline is arranged in a serpentine coil structure, and both the first substrate and the second substrate are made of aluminum alloy.

4. The heat dissipation module of the integrated washing machine control panel as described in claim 3, characterized in that, The first substrate has fixing plates on both sides of the side facing the PCB board, and the fixing plates are fixed to the bottom of the PCB board by screws.

5. The heat dissipation module of the integrated washing machine control panel as described in claim 4, characterized in that, The first substrate has a locking block at each of its four corners on the side away from the PCB board, and the second substrate has a locking slot at each of its four corners on the side facing the first substrate, with the locking block and the locking slot being compatible.

6. The heat dissipation module of the integrated washing machine control panel as described in claim 1, characterized in that, The heat dissipation module of the integrated washing machine control panel also includes an auxiliary fan. The side of the panel housing is also provided with a mounting slot, which is disposed through the side of the mounting area. The auxiliary fan is installed at the mounting slot, and the output end of the auxiliary fan corresponds to the hot end of the semiconductor cooling chip.

7. The heat dissipation module of the integrated washing machine control panel as described in claim 6, characterized in that, A dustproof frame is also provided on the side of the panel housing, and the dustproof frame is located outside the mounting slot.

8. A heat dissipation method for an integrated washing machine control panel, applied to the heat dissipation module of the integrated washing machine control panel as described in claim 1, characterized in that, Includes the following steps: Start-up signal triggering and system self-test: When the washing machine is powered on or the user starts any washing program, the main control module of the PCB board is powered on and generates a start signal to be sent to the control system of the auxiliary heat dissipation mechanism. The control system performs a self-test on the circuit connection and initial state of the circulation pump, the semiconductor cooling chip and the cooling fan. Basic liquid cooling cycle start-up: After the self-test is passed, the control system controls the circulation pump to start, driving the coolant in the storage tank to flow through the heat exchange pipeline and the return pipe to form a closed loop. When the coolant flows through the heat exchange pipeline embedded in the heat dissipation substrate, it absorbs the heat conducted from the heat-generating components on the PCB board to the heat dissipation substrate, completing the first heat exchange. Temperature monitoring and heat dissipation mode decision: Temperature sensors installed on the heat dissipation substrate or the key heat-generating area of ​​the PCB board monitor the temperature T in real time and feed the data back to the control system. Dynamic adjustment and operation maintenance: The control system continuously and dynamically adjusts the heat dissipation mode according to the real-time temperature T change, so as to keep the temperature stable within the target range; Program End and Heat Dissipation Delay: When the main washing program of the washing machine ends, the main control module of the PCB board generates a stop signal. After receiving the stop signal, the control system shuts down the semiconductor cooling chip and continues to run the circulation pump and the cooling fan for a preset delay period before shutting down the circulation pump and the cooling fan. The auxiliary heat dissipation mechanism then enters standby mode.

Images