Electronic device, window module, and method for manufacturing electronic device

Abstract

Provided are an electronic device, a window module, and a method for manufacturing the electronic device, the electronic device including: a display panel including an active area in which a plurality of pixels are arranged and a peripheral area adjacent to the active area; a window on the display panel; a housing on a lower side of the display panel and accommodating the display panel; an optical layer on the window and including a plurality of layers; and an adhesive layer between the window and the optical layer and adhering the window and the optical layer. The plurality of layers includes a first layer, a second layer on the first layer, and a third layer on the second layer, and a side surface of the third layer includes a step portion overlapping the peripheral region.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2024-0138707, filed on October 11, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] One or more embodiments of this disclosure relate to electronic devices and methods for manufacturing electronic devices, for example, to electronic devices with improved reliability. Background Technology

[0003] Electronic devices (such as televisions, monitors, smartphones, and / or tablets) provide images to users. Electronic devices may include display devices comprising a display panel for displaying images. Various types of display panels (such as liquid crystal displays, organic light-emitting diode displays, electrowetting displays, and / or electrophoretic displays) have been developed and used. Additionally, display devices may include windows for protecting the display panel. The windows may be formed using a laser-cutting process and subsequently attached to the display panel. Summary of the Invention

[0004] One or more aspects of embodiments of this disclosure relate to an electronic device and a method for manufacturing the electronic device. Additional aspects will be set forth in part in the following description, and in part will be apparent from the description, or may be learned by practice of the proposed embodiments.

[0005] According to one or more embodiments of the present disclosure, an electronic device includes: a display panel including an effective area in which a plurality of pixels are disposed and a peripheral area adjacent to the effective area; a window on the display panel (e.g., disposed on the display panel); a housing on the underside of the display panel (e.g., disposed on the underside of the display panel) and housing the display panel; an optical layer on the window (e.g., disposed on the window) and including a plurality of layers; and an adhesive layer between the window and the optical layer (e.g., disposed between the window and the optical layer) and attaching the window and the optical layer, wherein the plurality of layers include a first layer, a second layer on the first layer (e.g., disposed on the first layer) and a third layer on the second layer (e.g., disposed on the second layer), and the side surface of the third layer includes a stepped portion overlapping the peripheral area.

[0006] The step portion may include a first surface and a second surface, the first surface being inclined at a first angle relative to the upper surface of the window, and the second surface being inclined at a second angle relative to the upper surface of the window, the second angle being different from the first angle.

[0007] In one or more embodiments, at least one of the first surface and the second surface may include a flat surface.

[0008] In one or more embodiments, at least one of the first surface and the second surface may include a curved surface.

[0009] The step portion may also include a third surface connected to the first or second surface and inclined at a third angle relative to the upper surface of the window, the third angle being different from the angle of the connected first or second surface relative to the upper surface of the window. For example, the third angle is different from the angle of the connected first or second surface relative to the upper surface of the window.

[0010] The third layer may consist of multiple layers, which may include a triacetylcellulose layer, a polyolefin film on the triacetylcellulose layer (e.g., disposed on the triacetylcellulose layer), and a protective film on the polyolefin film (e.g., disposed on the polyolefin film), and the step portion may be defined on the triacetylcellulose layer.

[0011] The side surfaces of the second layer can be separated from and / or separated (e.g., spaced apart or isolated) from the effective area more than the side surfaces of the third layer.

[0012] According to one or more embodiments of this disclosure, a window module includes: a window including a first region and a second region in a plane (e.g., in a plan view) surrounding the periphery of the first region (e.g., around the periphery of the first region); an optical layer including a first layer, a second layer disposed on the first layer (e.g., disposed on the first layer), and a third layer disposed on the second layer (e.g., disposed on the second layer); and an adhesive layer between the window and the optical layer (e.g., disposed between the window and the optical layer) and attaching the window and the optical layer, wherein the recess includes a first portion through the third layer and a second portion through the first and second layers, the second portion exposing at least a portion of the adhesive layer, and wherein the first portion includes at least one step portion. For example, the recess includes a first portion through the third layer and a second portion through the first and second layers, the second portion exposing at least a portion of the adhesive layer. The first portion includes at least one step portion.

[0013] In the cross-section, the width of the first part can be greater than the width of the second part.

[0014] The stepped portion may include a curved surface.

[0015] The surface of the defined groove in the third layer may include a protrusion, and the protrusion may protrude toward the upper surface of the third layer.

[0016] According to one or more embodiments of this disclosure, a method for manufacturing an electronic device includes the steps of: providing a display panel; providing a window, the window including a first region and a second region surrounding (e.g., around the periphery of the first region) in a plane (e.g., in a plan view); forming a preliminary window module by sequentially laminating an adhesive layer and an optical layer onto the window; forming a window module by cutting the preliminary window module; and combining the display panel and the window module, wherein the step of forming the window module by cutting the preliminary window module includes: a first irradiation operation of irradiating a first laser beam along a first irradiation line defined in the second region; a second irradiation operation of irradiating a second laser beam along a second irradiation line separated from and / or separated (e.g., spaced apart or separated) from the first irradiation line; and a third irradiation operation of irradiating a third laser beam along a third irradiation line defined between the first irradiation line and the second irradiation line, wherein the second irradiation line is separated from and / or separated (e.g., spaced apart or separated) from the first region more than the first irradiation line. For example, the second irradiation line is positioned further away from the first region than the first irradiation line. This refers to the distance from the first region to both the first and second irradiation lines. Compared to the first irradiation line, the second irradiation line will be at a greater distance from the first region.

[0017] The second irradiation operation can be performed after the first irradiation operation, and the third irradiation operation can be performed after the second irradiation operation.

[0018] The third depth reached by the third laser beam can be greater than the first depth reached by the first laser beam and the second depth reached by the second laser beam.

[0019] In the third irradiation operation, the depth reached by the third laser beam may be less than the depth of the lower surface of the adhesive layer (e.g., relative to the upper surface of the optical layer).

[0020] The optical layer may include a phase retardation layer, an adhesive member on the phase retardation layer (e.g., disposed on the phase retardation layer), and a polarizer on the adhesive member (e.g., disposed on the adhesive member), and the phase retardation layer and the adhesive member may not be cut during the first irradiation operation.

[0021] In the first irradiation operation, the depth reached by the first laser beam can be less than the thickness of the polarizer.

[0022] The polarizer may include multiple layers, which may include a triacetyl cellulose layer, a polyolefin film on the triacetyl cellulose layer (e.g., disposed on the triacetyl cellulose layer), and a protective film on the polyolefin film (e.g., disposed on the polyolefin film), and a first laser beam may pass through the polyolefin film and the protective film and may expose at least a portion of the triacetyl cellulose layer.

[0023] The distance between the first irradiation line and the second irradiation line can be less than half the diameter of each of the first, second, and third laser beams.

[0024] The power of the third laser beam can be lower than that of each of the first and second laser beams. Attached Figure Description

[0025] The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this disclosure. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure. The above and other objects and features of this disclosure will become apparent from the description of exemplary embodiments of the disclosure with reference to the accompanying drawings.

[0026] Figure 1A This is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0027] Figure 1B This is a block diagram of an electronic device according to one or more embodiments of the present disclosure.

[0028] Figure 2 This is an exploded perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0029] Figure 3 It is shown through examples Figure 1A A cross-sectional view of the electronic device shown.

[0030] Figure 4 It is shown through examples Figure 3 The view shown is a cross-sectional view of the display panel.

[0031] Figure 5 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure.

[0032] Figure 6 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure.

[0033] Figure 7 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure.

[0034] Figure 8 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure.

[0035] Figure 9 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure.

[0036] Figure 10 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure.

[0037] Figure 11A This is a plan view of a window module according to one or more embodiments of the present disclosure.

[0038] Figures 11B to 11I This is a cross-sectional view illustrating some of the operations of a method for manufacturing an electronic device according to one or more embodiments of the present disclosure.

[0039] Figures 12A to 12C This is a cross-sectional view illustrating some of the operations of a method for manufacturing an electronic device according to one or more embodiments of the present disclosure. Detailed Implementation

[0040] The embodiments of this disclosure can be modified and practiced in many alternative forms, and therefore exemplary embodiments will be illustrated and described in more detail in the accompanying drawings. However, it should be understood that the disclosure is not intended to be limited to the specific forms disclosed, but rather to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the disclosure.

[0041] In the disclosure, if a component (or region, layer and / or part, etc.) is mentioned as being "on" another component, "arranged on" another component, "connected to" or "integrated into" another component (for example, when a component (or region, layer and / or part, etc.) is mentioned as being "on" another component, "arranged on" another component, "connected to" or "integrated into" another component), it means that the preceding component can be directly arranged on, directly connected to or directly integrated into the following component, or that a third component can be arranged between the components.

[0042] In this disclosure, the same or similar reference numerals denote the same or similar components. Furthermore, in the drawings, for the effective description of the technical content, the thickness, scale, and dimensions of components may be exaggerated. The terms "and / or" or "or" may include one or more combinations that can be defined by the relevant components.

[0043] Furthermore, when describing one or more suitable components, terms such as “first” and “second” may be used, but embodiments of this disclosure are not limited by these terms. The terms are used only to distinguish components. For example, a first component may be named a second component without departing from the scope of this disclosure, and similarly, a second component may be named a first component. As used herein, singular expressions include plural expressions unless the context clearly indicates otherwise. For example, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. Furthermore, when describing embodiments of this disclosure, the use of “may” refers to “one or more embodiments of this disclosure.”

[0044] Furthermore, terms such as "below," "under," "above," and "over" are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative concepts and are described relative to the directions indicated in the drawings.

[0045] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having the same meaning as they have in the context of the specification and the relevant field, and shall not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0046] When terms such as “comprising” and / or “including” and / or “having” are used in the disclosure, it should be understood that they indicate the presence of the stated features, quantities, steps, operations, components, parts, and / or one or more (e.g., any suitable) combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, steps, operations, components, parts, and / or one or more (e.g., any suitable) combinations thereof. Furthermore, the terms “comprising,” “including,” “having,” or other similar terms include or support the terms “consisting of” and “substantially consisting of”, indicating the presence of the stated features, quantities, steps, operations, parts, and / or components, while other features, quantities, steps, operations, parts, components, and / or groups thereof are absent or substantially absent.

[0047] In the following description, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0048] Figure 1A This is a perspective view of an electronic device according to one or more embodiments of the present disclosure. Figure 1B This is a block diagram of an electronic device according to one or more embodiments of the present disclosure. Figure 2This is an exploded perspective view of an electronic device according to one or more embodiments of the present disclosure. Figure 1A and Figure 2 The electronic device shown in the illustration is a tablet device. The embodiments of this disclosure are not limited thereto.

[0049] Reference Figure 1A The electronic device ED may include a long side extending parallel to a first direction DR1 and a short side extending parallel to a second direction DR2 intersecting the first direction DR1. However, this is shown by way of example; for example, the electronic device ED may include sides having substantially the same length relative to each of the first direction DR1 and the second direction DR2, and embodiments of this disclosure are not limited thereto.

[0050] In the following text, a direction substantially orthogonal (e.g., perpendicular) to the plane defined by the first direction DR1 and the second direction DR2 is defined as the third direction DR3. Furthermore, in the disclosure, the meanings of "if viewed in a plane (e.g., when viewed in a plane)," "in a plane," or "in a plan view" are defined as the state of viewing from the third direction DR3.

[0051] The front surface of the electronic device ED can be defined as the display surface DS, and can have a plane defined by a first direction DR1 and a second direction DR2. The image IM generated by the electronic device ED can be provided to the user through the display surface DS.

[0052] Reference Figure 1A and Figure 2 The display surface DS may include an active area AA and a peripheral area NDA. The active area AA may be an area enabled according to an electrical signal. For example, the active area AA may be an area in which an image IM is displayed, and may also be an area in which an external input TC is sensed. The active area AA may be superimposed on at least a portion of the transmission area TA. Thus, a user can visually identify the image IM or provide the external input TC through the transmission area TA. However, this is merely an example, and in one or more embodiments, the area in which the image IM is displayed and the area in which the external input TC is sensed may be separated from each other in the active area AA, and the embodiments of this disclosure are not limited thereto.

[0053] Reference Figure 1A and Figure 2The peripheral region NDA may be adjacent to the active region AA. For example, in one or more embodiments, the peripheral region NDA may surround (e.g., encircle) the active region AA. Drive circuitry or drive wiring for driving the active region AA may be arranged in the peripheral region NDA. The peripheral region NDA may overlap with at least a portion of the border region BZA, and the border region BZA may prevent or reduce the visual identification of components arranged in the peripheral region NDA from the outside.

[0054] The electronic device ED can sense input applied from outside the electronic device ED. For example, the electronic device ED can sense a first input caused by an external input TC and / or a second input caused by a stylus PEN. The first input caused by the external input TC can include one or more suitable types (kinds) of external input (such as a part of the user's body, light, heat, and / or pressure). The stylus PEN can be an active pen or an electromagnetic pen, but embodiments of this disclosure are not limited thereto. The stylus PEN can be defined as an input device, and in addition to displaying the image IM, the effective area AA can also provide a sensing area capable of sensing the user's input.

[0055] In one or more embodiments, the electronic device ED can be a large electronic device (such as a television, monitor, and / or external billboard). In one or more embodiments, the electronic device ED can be a small to medium-sized electronic device (such as a personal computer, laptop computer, personal digital terminal, car navigation unit, game console, smartphone, tablet computer, and / or camera). However, this is merely an example, and the electronic device ED can be other display devices unless it deviates from the concept of this disclosure.

[0056] Reference Figure 1B The electronic device ED can output one or more suitable pieces of information through the display module DM in the operating system. When the processor 110 executes an application stored in the memory 120, the display module DM can provide application information to the user through the display panel DP.

[0057] Processor 110 can acquire external input via input module 130 or sensor module 161 and can execute applications corresponding to the external input. For example, if a user selects a camera icon displayed on display panel DP (e.g., when a user selects a camera icon displayed on display panel DP), processor 110 can acquire user input via input sensor 161-2 and can activate camera module 171. Processor 110 can transmit image data corresponding to the captured image acquired by camera module 171 to display module DM. Display module DM can display the image corresponding to the captured image via display panel DP.

[0058] The operation of the electronic device ED has been briefly described above. The construction of the electronic device ED will be described in more detail below. Some of the components of the electronic device ED, which will be described in more detail below, can be integrated to provide a single component, and a single component can be separated into two or more components.

[0059] Reference Figure 1B The electronic device ED can communicate with an external electronic device ED-A via a network (e.g., a short-range wireless communication network or a long-range wireless communication network). According to one or more embodiments, the electronic device ED may include a processor 110, a memory 120, an input module 130, a display module DM, a power module 150, an embedded module 160, and an external module 170. According to one or more embodiments, at least one of the above-described components may not be provided in the electronic device ED (e.g., at least one selected from the above-described components), or one or more other components may be added. According to one or more embodiments, some of the above-described components (e.g., sensor module 161, antenna module 162, or audio output module 163) may be integrated into another component (e.g., display module DM).

[0060] Processor 110 can execute software to control at least one other component (e.g., hardware or software component) connected to electronic device ED, and can perform one or more suitable data processing or operations. According to one or more embodiments, as at least part of the data processing or operation, processor 110 can store commands or data received from another component (e.g., input module 130, sensor module 161, or communication module 173) in volatile memory 121, process the commands or data stored in volatile memory 121, and the resulting data can be stored in non-volatile memory 122.

[0061] Processor 110 may include a main processor 111 and an auxiliary processor 112. Main processor 111 may include one or more central processing units (CPUs) 111-1 and application processors (APs). In one or more embodiments, main processor 111 may also include one or more graphics processing units (GPUs) 111-2, communication processors (CPs), and image signal processors (ISPs). In one or more embodiments, main processor 111 may also include neural network processing units (NPUs) 111-3. The neural network processing unit / neural network processing device is a processor dedicated to processing artificial intelligence models and can generate artificial intelligence models through machine learning. The artificial intelligence model may include multiple layers of artificial neural networks. Artificial neural networks can be one of deep neural networks (DNN), convolutional neural networks (CNN), recurrent neural networks (RNN), restricted Boltzmann machines (RBM), deep belief networks (DBN), bidirectional recurrent deep neural networks (BRDNN), and deep Q-networks (e.g., selected from one of deep neural networks (DNN), convolutional neural networks (CNN), recurrent neural networks (RNN), restricted Boltzmann machines (RBM), deep belief networks (DBN), bidirectional recurrent deep neural networks (BRDNN), and deep Q-networks) and / or two or more of them (e.g., any suitable combination), but embodiments of this disclosure are not limited thereto. In addition to hardware architecture, the artificial intelligence model may additionally or optionally include software architecture. At least two of the above-described processing units and processors (e.g., selected from at least two of the above-described processing units and processors) can be implemented as an integrated component (e.g., a single chip), or each of the above-described processing units and processors can be implemented as an independent component (e.g., multiple chips).

[0062] The auxiliary processor 112 may include a controller 112-1. The controller 112-1 may include an interface conversion circuit and a timing control circuit. The controller 112-1 receives image signals from the main processor 111, converts the data format of the image signals to meet the interface specifications with the display module DM, and outputs the image data. The controller 112-1 may output one or more suitable control signals required to drive the display module DM.

[0063] In one or more embodiments, the auxiliary processor 112 may further include a data conversion circuit 112-2, a gamma correction circuit 112-3, and a rendering circuit 112-4. The data conversion circuit 112-2 may receive image data from the controller 112-1 and compensate the image data according to the characteristics of the electronic device ED or user settings to display an image with desired or suitable brightness, or it may convert the image data to reduce power consumption or compensate for afterimages. The gamma correction circuit 112-3 may convert the image data or a gamma reference voltage so that the image displayed on the electronic device ED has desired or suitable gamma characteristics. The rendering circuit 112-4 may receive image data from the controller 112-1 and may render the image data taking into account the pixel settings applied to the display panel DP of the electronic device ED. In one or more embodiments, at least one of the data conversion circuit 112-2, the gamma correction circuit 112-3, and the rendering circuit 112-4 may be integrated into another component (e.g., the main processor 111 or the controller 112-1). In one or more embodiments, at least one of the data conversion circuit 112-2, the gamma correction circuit 112-3, and the rendering circuit 112-4 may be integrated into the data driver DDV, which will be described in more detail later.

[0064] Memory 120 may store one or more suitable data used by at least one component of the electronic device ED (e.g., processor 110 or sensor module 161), as well as input or output data for commands associated therewith. Memory 120 may include at least one of volatile memory 121 and non-volatile memory 122.

[0065] Input module 130 can receive commands and / or data from outside the electronic device ED (e.g., from a user or external electronic device ED-A) that will be used in components of the electronic device ED (e.g., processor 110, sensor module 161, or sound output module 163).

[0066] Input module 130 may include a first input module 131 and a second input module 132. Commands or data from the user are input to the first input module 131, and commands or data from the external electronic device ED-A are input to the second input module 132. The first input module 131 may include a microphone, mouse, keyboard, keys (e.g., buttons), or pen (e.g., a passive or active pen). The second input module 132 may support specified protocols for wired or wireless connection to the external electronic device ED-A. According to one or more embodiments, the second input module 132 may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, and / or an audio interface. The second input module 132 may include connectors for physical connection to the external electronic device ED-A, such as an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0067] The display module (DM) visually provides information to the user. The display module (DM) may include a display panel (DP), a scan driver (SDC), and a data driver (DDV). The display module (DM) may also include a window, base, and bracket for protecting the display panel (DP).

[0068] The display panel DP can include a liquid crystal display panel, an organic light-emitting display panel, or an inorganic light-emitting display panel, and the type (variety) of the display panel DP is not particularly limited. The display panel DP can be a rigid type (variety) or a flexible type (variety) that can be rolled up or folded. The display module DM may also include a support, bracket, and / or heat dissipation component to support the display panel DP.

[0069] The scan driver SDC can be mounted as a driver chip on the display panel DP. In one or more embodiments, the scan driver SDC can be integrated into the display panel DP. For example, the scan driver SDC may include an amorphous silicon TFT gate driver circuit (ASG), a low-temperature polycrystalline silicon (LTPS) TFT gate driver circuit, and / or an oxide semiconductor TFT gate driver circuit (OSG) built into the display panel DP. The scan driver SDC receives control signals from the controller 112-1 and outputs scan signals to the display panel DP in response to the control signals.

[0070] In one or more embodiments, the display panel DP may further include a light-emitting driver. The light-emitting driver outputs a transmission control signal to the display panel DP in response to a control signal received from the controller 112-1. The light-emitting driver may be configured to be separate from the scan driver SDC, or it may be integrated into the scan driver SDC.

[0071] The data driver DDV receives a control signal from the controller 112-1, converts the image data into an analog voltage (e.g., a data voltage) in response to the control signal, and outputs the data voltage to the display panel DP.

[0072] In one or more embodiments, the data driver DDV may be integrated into another component (e.g., controller 112-1). The functions of the interface conversion circuitry and timing control circuitry of controller 112-1 may be integrated into the data driver DDV.

[0073] In one or more embodiments, the display module DM may further include a light-emitting driver and a voltage generating circuit. The voltage generating circuit can output one or more suitable voltages desired or required to drive the display panel DP.

[0074] Power module 150 supplies power to components of electronic device ED. In one or more embodiments, power module 150 may include a battery for charging with electrical voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell. Power module 150 may include a power management integrated circuit (PMIC). The PMIC supplies desired or optimized power to each of the modules described above and later in more detail. In one or more embodiments, power module 150 may include a wireless power transceiver component electrically connected to the battery. The wireless power transceiver component may include multiple antenna radiators in the form of coils.

[0075] In one or more embodiments, the electronic device ED may include an embedded module 160 and an external module 170. The embedded module 160 may include a sensor module 161, an antenna module 162, and a sound output module 163. The external module 170 may include a camera module 171, an optical module 172, and a communication module 173.

[0076] The sensor module 161 can sense input caused by the user's body or by a pen in the first input module 131, and can generate an electrical signal or data value corresponding to the input. The sensor module 161 may include at least one of a fingerprint sensor 161-1, an input sensor 161-2, and a digitizer 161-3.

[0077] The fingerprint sensor 161-1 can generate data values ​​corresponding to a user's fingerprint. The fingerprint sensor 161-1 can include any of the optical (type) fingerprint sensor and the capacitive (type) fingerprint sensor.

[0078] Input sensor 161-2 can generate data values ​​corresponding to coordinate information of input caused by the user's body or input caused by a pen. Input sensor 161-2 generates capacitance changes caused by the input as data values. In one or more embodiments, input sensor 161-2 can sense input caused by a passive pen, or send data to and receive data from an active pen.

[0079] In one or more embodiments, the input sensor 161-2 can measure biosignals such as blood pressure, humidity, or body fat. For example, if a part of a user's body touches the sensor layer or sensing panel of the input sensor 161-2 and remains stationary for a specific period of time (e.g., when a part of the user's body touches the sensor layer or sensing panel of the input sensor 161-2 and remains stationary for a specific period of time), the input sensor 161-2 can sense the biosignals based on changes in the electric field caused by the part of the body and output the information desired by the user to the display module DM.

[0080] The digitizer 161-3 can generate data values ​​corresponding to the coordinate information of the input caused by the pen. The digitizer 161-3 generates the change in the electromagnetic field caused by the input as a data value. The digitizer 161-3 can sense the input caused by a passive pen, or send data to and receive data from an active pen.

[0081] In one or more embodiments, at least one of the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 can be implemented as a sensor layer formed on the display panel DP by a continuous process. In one or more embodiments, the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 can be arranged on the display panel DP. In one or more embodiments, any one of the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 (e.g., the digitizer 161-3) can be arranged below the display panel DP.

[0082] In one or more embodiments, at least two of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 can be integrated into a single sensing panel using the same process. When integrated into a single sensing panel, the sensing panel can be positioned between the display panel DP and a window disposed on the display panel DP. According to one or more embodiments, the sensing panel can be disposed on the window, and the position of the sensing panel is not particularly limited.

[0083] In one or more embodiments, at least one of the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 may be embedded in the display panel DP. For example, at least one of the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 may be formed simultaneously (e.g., concurrently) by a process for forming elements (e.g., light-emitting elements and / or transistors, etc.) included in the display panel DP.

[0084] Furthermore, sensor module 161 can generate electrical signals or data values ​​corresponding to the internal or external states of electronic device ED. In one or more embodiments, sensor module 161 may also include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor.

[0085] Antenna module 162 may include one or more antennas for transmitting or receiving signals or power to or from an external source. According to one or more embodiments, communication module 173 may transmit signals to or receive signals from external electronic device ED-A via an antenna suitable for a communication method. The antenna pattern of antenna module 162 may be integrated into a component of display module DM (e.g., display panel DP) and / or input sensors 161-2, etc.

[0086] The sound output module 163 is a means for outputting sound signals to the outside of the electronic device ED, and may include, for example, a speaker for general purposes (such as multimedia playback or recording playback) and a receiver specifically for telephone reception. According to one or more embodiments, the receiver may be integrated with or separate from the speaker. The sound output pattern of the sound output module 163 may be integrated into the display module DM.

[0087] Camera module 171 can capture still images and moving images. According to one or more embodiments, camera module 171 may include one or more lenses, an image sensor, and / or an image signal processor. In one or more embodiments, camera module 171 may also include an infrared camera capable of measuring the presence or absence of a user, the user's position, and the user's gaze.

[0088] The light module 172 can provide light. The light module 172 may include a light-emitting diode or a lamp (e.g., a xenon lamp). The light module 172 can operate together with the camera module 171 or independently.

[0089] Communication module 173 can support the establishment of a wired or wireless communication channel between electronic device ED and external electronic device ED-A, and perform communication through the established communication channel. Communication module 173 may include one or both of a wireless communication module (such as a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) and a wired communication module (such as a local area network (LAN) communication module or a power line communication module). (For example, simultaneously including both a wireless communication module and a wired communication module). In one or more embodiments, communication module 173 can communicate with external electronic device ED-A via a short-range communication network (such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a long-range communication network (such as a cellular network, the Internet, or a computer network (e.g., a LAN or a WAN)). One or more suitable types of communication modules 173 described above can be implemented as a single chip or as separate (discrete) chips.

[0090] Input module 130, sensor module 161 and / or camera module 171, etc., can be used in conjunction with processor 110 to control the operation of display module DM.

[0091] The processor 110 outputs commands or data to the display module DM, the sound output module 163, the camera module 171, and / or the optical module 172 based on input data received from the input module 130. For example, the processor 110 may generate image data in response to input data applied via a mouse or active pen, and output the image data to the display module DM, or it may generate command data in response to input data, and output the command data to the camera module 171 or the optical module 172. When no input data is received from the input module 130 for a certain period of time, the processor 110 may switch the operating mode of the electronic device ED to a low-power mode or a sleep mode to reduce the power consumed by the electronic device ED.

[0092] Processor 110 outputs commands or data to display module DM, sound output module 163, camera module 171, and / or optical module 172 based on sensing data received from sensor module 161. For example, processor 110 can compare authentication data applied by fingerprint sensor 161-1 with authentication data stored in memory 120, and then execute the application based on the comparison result. Processor 110 can execute commands or output corresponding image data to display module DM based on sensing data sensed by input sensor 161-2 or digitizer 161-3. When sensor module 161 includes a temperature sensor, processor 110 can receive temperature data about the measured temperature from sensor module 161, and can also perform brightness correction on image data based on the temperature data.

[0093] Processor 110 can receive measurement data from camera module 171 regarding the presence or absence of a user, the user's position, and / or the user's gaze. Processor 110 can also perform brightness correction on image data based on the measurement data. For example, processor 110, having determined the presence or absence of a user through input from camera module 171, can output brightness-corrected image data to display module DM via data conversion circuit 112-2 and / or gamma correction circuit 112-3.

[0094] Some of the components described above can be connected to each other via peripheral communication methods (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), mobile industrial processor interface (MIPI), or ultrapath interconnect (UPI) link) to exchange signals (e.g., commands or data). The processor 110 can communicate with the display module DM via a permitted interface, for example, any of the communication methods described above, and is not limited to them.

[0095] The electronic device ED according to one or more embodiments disclosed in this disclosure may be one or more suitable types (categories) of devices. The electronic device ED may include at least one of, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, and home appliances. The electronic device ED according to one or more embodiments of this disclosure is not limited to the devices described above.

[0096] Reference Figure 2 An electronic device (ED) may include a window module (WM), a display module (DM), and a housing (HAU). The window module (WM) and the housing (HAU) may be combined to form the appearance of the electronic device (ED) and protect the display module (DM).

[0097] The window module WM may include a transmissive region TA and a border region BZA. The transmissive region TA may be an optically transparent region. For example, the transmissive region TA may be a region with a visible light transmittance of approximately 90% or greater.

[0098] The border region BZA may be a region having a relatively lower light transmittance than the transmission region TA. The border region BZA may define the shape of the transmission region TA. The border region BZA may be adjacent to the transmission region TA and may be around the transmission region TA (e.g., surrounding the transmission region TA). However, this is shown by way of example, and the border region BZA of the window module WM may only be partially adjacent to one side of the transmission region TA, or the border region BZA may not be provided from the window module WM. In one or more embodiments, the window module WM may include at least one functional layer selected from an anti-fingerprint layer, a hard coating, and an anti-reflective layer, but embodiments of this disclosure are not limited thereto.

[0099] The display module DM can be located below the window module WM (e.g., arranged below the window module WM). The display module DM can be a structure used to substantially generate an image IM. The image IM can include images such as moving images and still images. The image IM generated by the display module DM can be displayed on the display surface DS of the display module DM and can be visually recognized by the user from the outside through the transmission area TA.

[0100] The housing HAU can be located below the display module DM (e.g., arranged below the display module DM). The housing HAU can be integrated with the window module WM. The housing HAU can be integrated with the window module WM to provide specific internal space. The display module DM can be housed within the internal space.

[0101] The housing HAU can comprise materials with relatively high rigidity. For example, the housing HAU can comprise multiple frames and / or plates comprising glass, plastic, or metal and / or combinations thereof (e.g., any suitable combination). The housing HAU can stably protect the components of the electronic device ED housed within the internal space from external impacts.

[0102] Figure 3 It is shown through examples Figure 1A A cross-sectional view of the electronic device shown. Figure 4 It is shown through examples Figure 3 The view shown is a cross-sectional view of the display panel.

[0103] Reference Figure 3 The electronic device ED may include a display panel DP, an input sensing unit ISP, an optical layer RPL, a window WIN, a panel protective film PPF, and a first adhesive layer AL1 and a second adhesive layer AL2. The display panel DP can be coupled to the aforementioned display panel DP (see...). Figure 1B The input sensing unit ISP can correspond to the aforementioned sensor module 161 (see...). Figure 1B )correspond.

[0104] The display panel DP according to one or more embodiments of this disclosure may be a light-emitting display panel. For example, the display panel DP may be an organic light-emitting display panel or an inorganic light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of an inorganic light-emitting display panel may include quantum dots and / or quantum rods. Hereinafter, the display panel DP will be described by way of example as an organic light-emitting display panel.

[0105] Reference Figure 4The display panel DP may include a substrate layer BS, a circuit element layer DP-CL, a display element layer DP-OLED, and a thin-film encapsulation layer TFE. The circuit element layer DP-CL, the display element layer DP-OLED, and the thin-film encapsulation layer TFE may be arranged on the substrate layer BS, for example, in the order stated.

[0106] The substrate layer BS may include glass or may include flexible plastic materials (such as polyimide (PI)).

[0107] Multiple pixels can be arranged on the circuit element layer DP-CL and the display element layer DP-OLED. Each pixel may include a transistor arranged on the circuit element layer DP-CL and a light-emitting element arranged on the display element layer DP-OLED and connected to the transistor.

[0108] A thin-film encapsulation layer (TFE) can be disposed on the circuit element layer (DP-CL) to cover the display element layer (DP-OLED). The TFE can protect the pixels from moisture, oxygen, and external foreign matter. In one or more embodiments, the TFE is shown to cover the entire area of ​​the substrate layer (BS), but in one or more embodiments of this disclosure, the substrate layer (BS) may include a portion exposed from the TFE. In one or more embodiments, the area exposed from the TFE may be formed along the periphery of the substrate layer (BS), and the embodiments of this disclosure are not limited thereto.

[0109] Reference Figure 3 The input sensing element (ISP) can be disposed on the display panel (DP). In one or more embodiments, the input sensing element (ISP) may include a plurality of sensing elements for capacitively sensing external input. The input sensing element (ISP) can be formed directly on the display panel (DP) during the manufacture of the electronic device (ED). More specifically, the conductive patterns and / or insulating layers constituting the input sensing element (ISP) can be directly deposited on the display panel (DP) or directly patterned on the display panel (DP). However, embodiments of this disclosure are not limited thereto; the input sensing element (ISP) can be manufactured as a panel separate from the display panel (DP) and attached to the display panel (DP) via an adhesive layer.

[0110] Reference Figure 3 The optical layer RPL can be disposed on the input sensing unit ISP. The optical layer RPL can reduce the external light reflectivity of the electronic device ED to improve the visibility of the image displayed on the electronic device ED. The optical layer RPL may include, but is not limited to, a phase retarder, a polarizer, a black matrix, and / or a color filter. The optical layer RPL can be formed directly on the input sensing unit ISP by coating or deposition processes, or it can be disposed in the form of a film and attached to the input sensing unit ISP by an adhesive layer, and the embodiments disclosed herein are not limited to these.

[0111] The window (WIN) can be disposed on the optical layer (RPL). The window protects the display panel (DP), input sensor (ISP), and optical layer (RPL) from external scratches and impacts. The window may include an optically transparent insulating material. For example, the window may include glass or plastic.

[0112] A panel protective film (PPF) can be disposed under the display panel (DP). The panel protective film (PPF) can support the display panel (DP) and protect the lower part of the display panel (DP). The panel protective film (PPF) can have insulating properties. For example, the panel protective film (PPF) can include resins (such as polyethylene terephthalate (PET), polyimide, and / or polypropylene (PP), etc.), but the embodiments of this disclosure are not limited thereto.

[0113] The first adhesive layer AL1 can be disposed between the display panel DP and the panel protective film PPF, and the display panel DP and the panel protective film PPF can be bonded to each other through the first adhesive layer AL1. The second adhesive layer AL2 can be disposed between the window WIN and the optical layer RPL, and the window WIN and the optical layer RPL can be bonded to each other through the second adhesive layer AL2.

[0114] Figure 5 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure. Figure 6 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure. Figure 7 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure. Figures 5 to 7 The window module WM shown can be rotated 180 degrees and can be connected to the display panel DP (see...). Figure 3 ( ) combined.

[0115] Reference Figure 5 The window module WM may include the window WIN, the adhesive layer PSA, and the optical layer RPL.

[0116] Window WIN can be placed on the display panel DP (see Figure 3 The window WIN may include a first region AR1 and a second region AR2 that surrounds the periphery of the first region AR1 on a plane (e.g., in a plan view). In this regard, after the window module WM is combined with the display panel DP, each of the first region AR1 and the second region AR2 can be respectively coupled with… Figure 2 Each of the effective area AA and peripheral area NDA shown corresponds to a specific region. For example, after the window module WM is combined with the display panel DP, the first area AR1 and the second area AR2 can be respectively associated with... Figure 2 The effective region AA and the peripheral region NDA shown correspond to each other.

[0117] The optical layer RPL can be disposed on the adhesive layer PSA. The optical layer RPL can be configured as multiple layers. The optical layer RPL may include a phase retardation layer RFL, a first adhesive member AD1, and a polarizer PP. The side surface of the optical layer RPL may be inclined relative to the upper surface WIN-US of the window WIN. However, embodiments of this disclosure are not limited thereto; for example, in one or more embodiments, the side surface of the optical layer RPL may be orthogonal (e.g., perpendicular) to the upper surface WIN-US of the window WIN.

[0118] The phase delay layer RFL can be arranged in the input sensing unit ISP (see Figure 3 The phase delay layer RFL can include a first phase delay layer RFL1 and a second phase delay layer RFL2. The second phase delay layer RFL2 can be disposed on the first phase delay layer RFL1.

[0119] The first phase retardation layer RFL1 can be an optical layer that delays the phase of the supplied light. For example, the first phase retardation layer RFL1 can delay the phase of the input light by λ / 4. The first phase retardation layer RFL1 has optical anisotropy and can change the polarization state of the light input to the first phase retardation layer RFL1. For example, light transmitted through the polarizer PP and supplied to the first phase retardation layer RFL1 can be changed from a linear polarization state to a circular polarization state. Furthermore, light supplied to the first phase retardation layer RFL1 in a circular polarization state can be changed to a linear polarization state.

[0120] A second phase retardation layer RFL2 can be disposed between the first phase retardation layer RFL1 and the polarizer PP. The second phase retardation layer RFL2 can be an optical layer that delays the phase of the supplied light. For example, the second phase retardation layer RFL2 can delay the phase of the input light by λ / 2. The second phase retardation layer RFL2 can change the polarization state of the input light. The polarization direction of linearly polarized light input from the polarizer PP to the second phase retardation layer RFL2 can be changed.

[0121] Polarizing filters (PP) can prevent or reduce the reflection of external light. PP polarizing filters can block a portion of external light. PP polarizing filters can minimize or reduce the reflection of external light in electronic devices (ED).

[0122] The side surface of the polarizer PP may include a stepped portion SP. The stepped portion SP may be superimposed on the peripheral region NDA. The stepped portion SP may include a first surface IS1, a second surface IS2, and a third surface IS3.

[0123] In one or more embodiments, a first surface IS1 may be inclined at a first angle a1 relative to the upper surface WIN-US of the window WIN. A second surface IS2 may be inclined at a second angle a2 relative to the upper surface WIN-US of the window WIN. The second surface IS2 may be connected to the first surface IS1. In this respect, the second angle a2 may be different from the first angle a1. A third surface IS3 may be inclined at a third angle a3 relative to the upper surface WIN-US of the window WIN. The third surface IS3 may be connected to the second surface IS2. The third angle a3 may be different from the second angle a2. The first to third surfaces IS1, IS2 and IS3 may each independently comprise a flat surface. However, embodiments of this disclosure are not limited thereto.

[0124] The side surface of the polarizer PP can be separated from and / or separated from the side surface of the first adhesive member AD1 by the step portion SP (e.g., spaced apart or separated). In this respect, the side surface of the first adhesive member AD1 can be separated from and / or separated from the first region AR1 by a greater distance than the side surface of the polarizer PP. For example, this means that the side surface of the first adhesive member AD1 is located at a greater distance from the first region AR1 due to the presence of the step portion SP compared to the side surface of the polarizer PP.

[0125] The first adhesive member AD1 can be disposed between the second phase retardation layer RFL2 and the polarizer PP. The second phase retardation layer RFL2 and the polarizer PP can be bonded to each other through the first adhesive member AD1.

[0126] The adhesive layer PSA can be disposed between the window WIN and the optical layer RPL. In this respect, the adhesive layer PSA can be... Figure 3 The second adhesive layer AL2 shown corresponds to this. The window WIN and the optical layer RPL can be bonded to each other via the adhesive layer PSA. In one or more embodiments, the side surface of the adhesive layer PSA can be stepped relative to the side surface of the window WIN. However, the embodiments of this disclosure are not limited thereto.

[0127] In the window module cutting process, which will be described in more detail later, the stepped portion SP can be formed by moving in a direction further away from the first region AR1 after the first laser irradiation and performing additional laser irradiation. After the first laser irradiation, compared to performing additional laser irradiation at the same location, when performing additional laser irradiation by moving in a direction further away from the first region AR1, the dummy portion DPA to be removed (see...) is reduced. Figure 9The dummy part DPA can be arranged further away from and / or separated from the first region AR1 (e.g., spaced apart or separated). Therefore, if the dummy part DPA is removed (e.g., when the dummy part DPA is removed), damage to the window WIN can be reduced or prevented by reducing the impact applied to the portion of the window WIN that is arranged under the adhesive layer PSA and overlaps with the first region AR1.

[0128] In one or more embodiments, the optical layer RPL may further include a polarizer layer. The polarizer layer may be an optical layer that linearly polarizes the provided light in one direction, and may be a linear polarizer. The polarizer layer may be a film-type (or near-)linear polarizer comprising a stretched polymer film. For example, the stretched polymer film may be a stretched polyvinyl alcohol (PVA) film.

[0129] Reference Figure 6 In one or more embodiments, the side surface of the polarizer PP and the side surface of the adhesive layer PSA may each independently include a curved surface CS. However, Figure 5 and Figure 6 The illustration is merely an example, and the shape of the side surface of the optical layer RPL can vary depending on the shape of the cross-section cut during the window module cutting process.

[0130] Reference Figure 7 ,and Figure 5 and Figure 6 In one or more embodiments, the side surface PSA-SS of the adhesive layer PSA and the side surface WIN-SS of the window WIN can be aligned with each other. However, the embodiments of this disclosure are not limited thereto, and the shape of the side surface of the window module WM can vary.

[0131] Figure 8 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure. In the following, with reference to... Figure 8 In the description, the same / similar reference numerals are used respectively with Figures 5 to 7 The same or similar constructs are described in the previous section, and for the sake of brevity, their repeated descriptions will not be provided.

[0132] Reference Figure 8 In one or more embodiments, the polarizer PP can be configured as multiple layers. The polarizer PP may include a triacetyl cellulose layer (TAC), a second adhesive member (AD2), a polyolefin film (COP), and a protective film (BF).

[0133] The triacetyl cellulose (TAC) layer can be disposed on the first adhesive member AD1. The TAC layer can protect the polarizer layer disposed beneath the TAC layer from external impacts.

[0134] Polyolefin film COP can be arranged on a triacetyl cellulose (TAC) layer. Polyolefin film COP may include optically transparent insulating materials.

[0135] The second adhesive member AD2 can be disposed between the triacetyl cellulose layer TAC and the polyolefin film COP. The triacetyl cellulose layer TAC and the polyolefin film COP can be bonded to each other through the second adhesive member AD2.

[0136] A protective film (BF) can be applied to a polyolefin film (COP). The BF protects the COP from external impacts or scratches. Furthermore, the BF prevents or reduces the reflection of external light.

[0137] The triacetyl cellulose layer (TAC) may include a stepped portion (SP) superimposed on the second region (AR2). The stepped portion (SP) may be superimposed on the peripheral region (NDA). The side surface of the polarizer (PP) may be separated from and / or separated from the side surface of the first adhesive member (AD1) via the stepped portion (SP). In this respect, the side surface of the first adhesive member (AD1) may be separated from and / or separated from the first region (AR1) by a greater distance than the side surface of the polarizer (PP). Although Figure 8 The step portion SP is shown to include a flat surface, but this is only shown by way of example; the step portion SP may include a curved surface.

[0138] Figure 9 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure. In the following, with reference to... Figure 9 In the description, the same / similar reference numerals are used respectively with Figures 5 to 8 The same or similar constructs are described in the previous section, and for the sake of brevity, their repeated descriptions will not be provided.

[0139] Reference Figure 9 In one or more embodiments of this disclosure, the window module WM-1 may include a window WIN, an adhesive layer PSA, and an optical layer RPL. Figure 9 The window module WM-1 shown can be used with the window module in the form of Figure 8 The window module WM shown corresponds to the previous window module in operation. In one or more embodiments, the optical layer RPL can be configured as multiple layers. The optical layer RPL may include a phase retardation layer RFL, a first adhesive member AD1, and a polarizer PP. The phase retardation layer RFL, the first adhesive member AD1, and the polarizer PP can be respectively bonded to... Figure 8 The components shown correspond to each other, so for the sake of brevity, their descriptions will not be repeated.

[0140] In one or more embodiments, the groove GRV may be defined within the window module WM-1. The groove GRV may be stacked with the second region AR2. The groove GRV may have a shape that is recessed from the upper surface WM-US of the window module WM-1 along the thickness direction of the window module WM-1. The groove GRV may be divided in cross-section into a first portion PT1 and a second portion PT2. The first portion PT1 may be a space formed from the upper surface WM-US of the window module WM-1 to the upper surface AD-US of the first adhesive member AD1, and the second portion PT2 may be a space formed from the upper surface AD-US of the first adhesive member AD1 to the bottom surface GRV-GS of the groove GRV. More specifically, the first portion PT1 may be formed by a construction that stacks on the first adhesive member AD1, i.e., in one or more embodiments, it may be formed through the polarizer PP. For example, the first portion PT1 may be formed by removing portions of the protective film BF, the polyolefin film COP, the second adhesive member AD2, and the triacetyl cellulose layer TAC. Therefore, the new surfaces of the protective film BF, the polyolefin film COP, the second adhesive component AD2, and the triacetyl cellulose layer TAC can be exposed through the first part PT1.

[0141] The second portion PT2 can be formed to pass through the first adhesive member AD1 and the phase retardation layer RFL, and to cause a portion of the adhesive layer PSA to be recessed. For example, a new surface of the first adhesive member AD1 and the phase retardation layer RFL can be exposed through the second portion PT2, but at least a portion of the adhesive layer PSA can still be retained to define the bottom surface GRV-GS of the groove GRV. Therefore, at least a portion of the adhesive layer PSA covers the window WIN, so the upper surface WIN-US of the window WIN can be left unexposed through the groove GRV.

[0142] The width of the first portion PT1 in the cross-section can be greater than the width of the second portion PT2. For example, the maximum width of the first portion PT1 in the cross-section can be greater than the maximum width of the second portion PT2. In one or more embodiments, in Figure 9 The diagram shows that the shape of the grooved GRV has a symmetrical structure in cross-section, but the embodiments of this disclosure are not limited thereto.

[0143] In one or more embodiments, the surface exposed through the first portion PT1 may include a stepped portion SP. The stepped portion SP may be superimposed on the second region AR2. The stepped portion SP may be superimposed on the peripheral region NDA. The side surface of the polarizer PP may be separated from and / or separated (e.g., spaced apart or separated) from the side surface of the first adhesive member AD1 via the stepped portion SP. In this respect, the side surface of the first adhesive member AD1 may be separated from and / or separated (e.g., spaced apart or separated) from the first region AR1 further than the side surface of the polarizer PP. Although Figure 9The step portion SP is shown to include a flat surface, but this is shown by way of example, and in one or more embodiments, the step portion SP may include a curved surface. For example, the groove GRV includes a first portion PT1 passing through the polarizer PP and a second portion PT2 passing through the first adhesive member AD1 and the phase retardation layer RFL, the second portion PT2 exposing at least a portion of the adhesive layer PSA. The first portion PT1 includes at least one step portion SP.

[0144] Figure 8 The window module WM shown can be accessed from... Figure 9 The window module WM-1 shown is formed by removing the dummy part DPA. The dummy part DPA is superimposed on the second region AR2 in the plane, and at least a portion of the dummy part DPA can extend further outward from the side surface of the window WIN. Because the dummy part DPA is partially superimposed on the second region AR2, a portion of the upper surface WIN-US of the window WIN can be exposed when the dummy part DPA is removed.

[0145] In the window module cutting process, which will be described in more detail later, the stepped portion SP can be formed by moving in a direction further away from the first region AR1 and performing additional laser irradiation after the first laser irradiation. After the first laser irradiation, compared to performing additional laser irradiation at the same location, when performing additional laser irradiation by moving in a direction further away from the first region AR1, the dummy portion DPA can be arranged further away from the first region AR1. Therefore, if the dummy portion DPA is removed (e.g., when the dummy portion DPA is removed), damage to the window WIN can be reduced or prevented by reducing the impact applied to the portion of the window WIN that is arranged under the adhesive layer PSA and overlaps with the first region AR1.

[0146] Figure 10 This is an enlarged cross-sectional view showing a portion of a window module according to one or more embodiments of the present disclosure. In the following, with reference to... Figure 10 In the description, the same / similar reference numerals are used with respect to... Figures 5 to 9 The same or similar constructs are described in the previous section, and for the sake of brevity, their repeated descriptions will not be provided.

[0147] Reference Figure 10 The polarizer PP can be composed of multiple layers. The polarizer PP may include a triacetyl cellulose layer (TAC), a second adhesive component (AD2), a polyolefin film (COP), and a protective film (BF).

[0148] The surface of the defined groove GRV1 of the polyolefin film COP may include a protruding portion PPA. The protruding portion PPA may protrude toward the upper surface of the polarizer PP. The protruding portion PPA may include a bent portion CP. One end of the protruding portion PPA may be bent. Therefore, if an external force or external impact is applied during the laser cutting process (e.g., when an external force or external impact is applied during the laser cutting process), damage to the window module WM-2 can be reduced or prevented by preventing or reducing stress concentration at a single point during the window module cutting process. However, embodiments of this disclosure are not limited thereto, and the shape of the protruding portion PPA may be one or more suitable shapes.

[0149] Figure 11A This is a plan view of a window module according to one or more embodiments of the present disclosure. Figures 11B to 11I This is a cross-sectional view illustrating some of the operations of a method for manufacturing an electronic device according to one or more embodiments of the present disclosure. In the following, with reference to... Figures 11A to 11I In the description, the same / similar reference numerals are used with respect to... Figures 5 to 10 The same or similar constructs are described in the previous section, and for the sake of brevity, their repeated descriptions will not be provided.

[0150] Reference Figures 11A to 11I A window module WM can be formed by cutting a preliminary window module. The preliminary window module can be formed by sequentially laminating a window WIN, an adhesive layer PSA, and an optical layer RPL. The window WIN may include a first region AR1 and a second region AR2 surrounding the periphery of the first region AR1 in a plane. In one or more embodiments, for ease of description, the periphery of each of the first region AR1 and the second region AR2 is shown by solid lines. In these embodiments, the preliminary window module can be cut by a laser beam. The operation of cutting the preliminary window module may include a first irradiation operation, a second irradiation operation, and a third irradiation operation. In one or more embodiments, for ease of description, imaginary irradiation lines CL1, CL2, and CL3 are shown by dashed lines.

[0151] Figure 11B The first illumination operation, in which the first laser beam LB1 is irradiated onto the preliminary window module, is shown.

[0152] Reference Figure 11A and Figure 11B The first laser beam LB1 can be irradiated from the laser irradiation section LS along the first irradiation line CL1. The first irradiation line CL1 can be defined in the second region AR2, and the first laser beam LB1 can irradiate along the second region AR2 while being separated from and / or separated from the first region AR1 (e.g., spaced apart or separated).

[0153] In this regard, the first laser beam LB1 may not reach the phase retardation layer RFL and the first adhesive member AD1. For example, the phase retardation layer RFL and the first adhesive member AD1 may remain uncut. The depth RD1 reached by the first laser beam LB1 (hereinafter referred to as the first depth) may be less than the thickness of the polarizer PP. In this regard, the first depth RD1 may refer to the length from the upper surface of the polarizer PP to the end LE1 of the first irradiation line CL1. The first depth RD1 may be less than the thickness of the polarizer PP.

[0154] If the first laser beam LB1 reaches the phase retardation layer RFL and a portion of the phase retardation layer RFL is cut (e.g., when the first laser beam LB1 reaches the phase retardation layer RFL and a portion of the phase retardation layer RFL is cut), cracks may occur in the polarizer PP disposed on the phase retardation layer RFL. Since the first laser beam LB1 does not reach the phase retardation layer RFL in one or more embodiments of this disclosure, the phase retardation layer RFL is not cut, thereby preventing cracks from occurring in the polarizer PP.

[0155] When the first laser beam LB1 irradiates the preliminary window module, deformation occurs in the region DFA1 (hereinafter referred to as the first deformation region) of the preliminary window module where the first laser beam LB1 is absorbed. Figure 11B In this illustration, for ease of description, the first deformation region DFA1 is shaded and shown. The deformation produced by the first laser beam LB1 can include state deformation (such as melting). In this regard, the first deformation region DFA1 may have a width in the cross-section that decreases with increasing distance from the first laser beam LB1 in the thickness direction. In the initial window module, deformation is most extensively generated in the portion where the first laser beam LB1 is first input and exposed to the first laser beam LB1 for a long time (e.g., a relatively long period of time), and the deformation may be minimal in the portion where the first laser beam LB1 is last arrived and exposed to the first laser beam LB1 for a relatively short time / period of time. Therefore, the first deformation region DFA1 may have an inverted conical shape in the cross-section. The width of the first deformation region DFA1 in the cross-section may vary along the thickness direction. However, embodiments of this disclosure are not limited thereto.

[0156] Reference Figure 11B and Figure 11C The first deformed region DFA1 can be removed by a first irradiation operation for the preliminary window module. As described above, the first deformed region DFA1 can be a part of the polarizer PP and can have a thickness smaller than that of the polarizer PP. Therefore, a first recessed portion RP1 recessed in the thickness direction can be formed on the polarizer PP.

[0157] Figure 11DThe second illumination operation, in which the second laser beam LB2 is irradiated onto the preliminary window module, is shown.

[0158] Reference Figure 11A and Figure 11D The second laser beam LB2 can be irradiated from the laser irradiation section LS along the second irradiation line CL2. The second irradiation line CL2 can be spaced apart from and / or separated from the first region AR1 in a direction that becomes further away from the first region AR1 (e.g., spaced apart or separated).

[0159] In this regard, the second laser beam LB2 may not reach the phase retardation layer RFL and the first adhesive member AD1. For example, the phase retardation layer RFL and the first adhesive member AD1 may remain uncut. The depth RD2 reached by the second laser beam LB2 (hereinafter referred to as the second depth) may be smaller than the thickness of the polarizer PP. In this regard, the second depth RD2 may refer to the length from the upper surface of the polarizer PP to the end LE2 of the second irradiation line CL2. The second depth RD2 may be smaller than the thickness of the polarizer PP. Although Figure 11D The first depth RD1 and the second depth RD2 are shown to be substantially the same by way of example, but the embodiments of this disclosure are not limited thereto, and the first depth RD1 and the second depth RD2 may be different from each other. For example, in one or more embodiments, the second depth RD2 may be greater than the first depth RD1.

[0160] When the second laser beam LB2 is irradiated onto the preliminary window module, deformation occurs in the region DFA2 (or the second deformation region) where the second laser beam LB2 is absorbed. Figure 11D In this illustration, for ease of description, the second deformable region DFA2 is shaded and shown. In one or more embodiments, the second deformable region DFA2 may be formed to be separated from and / or separated (e.g., spaced apart or separated) from the first recessed portion RP1 on a plane (non-overlapping). However, this is shown by way of example; for example, in one or more embodiments, the second deformable region DFA2 may be formed to partially overlap with the region in which the first recessed portion RP1 is present, and embodiments of this disclosure are not limited thereto.

[0161] The deformation produced by the second laser beam LB2 may include state deformation (such as melting). In this regard, the second deformation region DFA2 may have a width in the cross-section that decreases with increasing distance from the second laser beam LB2 in the thickness direction. The second deformation region DFA2 may have an inverted conical shape in the cross-section. The width of the second deformation region DFA2 in the cross-section may vary along the thickness direction. However, embodiments of this disclosure are not limited thereto.

[0162] The second irradiation operation can be performed after the first irradiation operation. The first laser beam LB1 and the second laser beam LB2 can be laser beams irradiated from the same laser irradiation unit LS. After cutting a portion of the preliminary window module by irradiating the first laser beam LB1, another portion of the preliminary window module can be cut by moving the laser irradiation unit LS in a direction that is further away from the first region AR1 and irradiating the second laser beam LB2.

[0163] Reference Figure 11D and Figure 11E The second deformed region DFA2 can be removed by a second irradiation operation on the initial window module. As described above, the second deformed region DFA2 can be a part of the polarizer PP and can have a thickness smaller than that of the polarizer PP. Therefore, a second recessed portion RP2 recessed in the thickness direction can be formed on the polarizer PP.

[0164] The distance between the first irradiation line CL1 and the second irradiation line CL2 can be less than half the diameter of each of the first to third laser beams LB1, LB2, and LB3. If the distance between the first irradiation line CL1 and the second irradiation line CL2 is greater than half the diameter of each of the first to third laser beams LB1, LB2, and LB3 (e.g., when the distance between the first irradiation line CL1 and the second irradiation line CL2 is greater than half the diameter of each of the first to third laser beams LB1, LB2, and LB3), the area of ​​the polarizer PP remaining between the first recessed portion RP1 and the second recessed portion RP2 after the first and second irradiation operations may be relatively large. Therefore, it may be difficult to cut the adhesive layer PSA so that the residual thickness SD of the adhesive layer PSA can be minimized or reduced by the third irradiation operation (see...). Figure 11F ).

[0165] Reference Figure 11A and Figure 11F A third laser beam LB3 can be irradiated from the laser irradiation unit LS along the third irradiation line CL3. The third irradiation line CL3 can be defined within the second region AR2, and the third laser beam LB3 can irradiate along the second region AR2 while being separated from and / or separated from the first region AR1 (e.g., spaced apart or separated). The third irradiation line CL3 can be defined between the first irradiation line CL1 and the second irradiation line CL2.

[0166] In this regard, the third laser beam LB3 may not reach the bottom surface PSA-BS of the adhesive layer PSA. The depth RD3 reached by the third laser beam LB3 (hereinafter referred to as the third depth) may be greater than the first depth RD1 and the second depth RD2. In this regard, the third depth RD3 may refer to the length from the upper surface of the polarizer PP to the end LE3 of the third irradiation line CL3. The third depth RD3 may be less than the depth of the bottom surface PSA-BS of the adhesive layer PSA. In this regard, the depth of the bottom surface PSA-BS of the adhesive layer PSA may refer to the length from the upper surface of the polarizer PP to the bottom surface PSA-BS of the adhesive layer PSA. For example, the third laser beam LB3 may not reach the bottom surface PSA-BS of the adhesive layer PSA.

[0167] The power of the third laser beam LB3 can be lower than the power of each of the first laser beam LB1 and the second laser beam LB2. During the third irradiation operation, the power of the third laser beam LB3 can be set lower than the power of each of the first laser beam LB1 and the second laser beam LB2, so that the residual thickness SD of the adhesive layer PSA overlapping with the third irradiation line CL3 can be carefully adjusted to be minimized or reduced. Therefore, when the dummy part DPA is removed, the impact applied to the window WIN can be reduced.

[0168] Reference Figure 11F When the third laser beam LB3 is irradiated onto the preliminary window module, deformation occurs in a portion of the preliminary window module, specifically in area DFA3 (or the third deformation region). Figure 11F In this illustration, for ease of description, the third deformation region DFA3 is shaded and shown. The deformation produced by the third laser beam LB3 can include state deformation (such as melting). In this regard, the third deformation region DFA3 may have a width in the cross-section that decreases with increasing distance from the third laser beam LB3 in the thickness direction. The third deformation region DFA3 may have an inverted conical shape in the cross-section. The width of the third deformation region DFA3 in the cross-section may vary along the thickness direction. However, the embodiments of this disclosure are not limited thereto.

[0169] A third irradiation operation can be performed after the second irradiation operation. The first laser beam to the third laser beam LB1, LB2 and LB3 can be laser beams irradiated from the same laser irradiation section LS. After cutting a portion of the preliminary window module by irradiating the second laser beam LB2, the preliminary window module can be irradiated by moving the third laser beam LB3 closer to the first region AR1 and irradiating it with the third laser beam LB3, and another portion of the preliminary window module arranged between the first irradiation line CL1 and the second irradiation line CL2 can be cut.

[0170] Reference Figure 11F and Figure 11GWhen the third irradiation operation on the initial window module is completed, the third deformed region DFA3 can be removed. With the removal of the third deformed region DFA3 between the first recessed portion RP1 and the second recessed portion RP2, a grooved GRV can be formed in the polarizer PP. The grooved GRV can be superimposed on the second region AR2. Figure 9 The groove GRV shown corresponds to this. The groove GRV may include a step portion SP. The step portion SP may be superimposed on the peripheral region NDA. The side surface of the polarizer PP may be separated from and / or separated from the side surface of the first adhesive member AD1 by the step portion SP (e.g., spaced apart or separated). In this respect, the side surface of the first adhesive member AD1 may be separated from and / or separated from the first region AR1 by a greater distance than the side surface of the polarizer PP.

[0171] It can be obtained from Figure 11G The window module WM-1 shown is formed by removing the dummy component DPA. Figure 11H The window module WM is shown in the figure. In this regard, the dummy part DPA can be the part separated from and / or separated (e.g., spaced apart or separated) from the first region AR1 at the point PT where the residual thickness SD of the adhesive layer PSA is smallest relative to the point where it is located. Figure 11H The window module shown can be used with Figure 8 The window module shown corresponds to this.

[0172] After the first laser irradiation, compared to performing additional laser irradiation at the same location, when additional laser irradiation is performed by irradiating the second laser beam LB2 via moving it away from the first laser beam LB1 from the first region AR1, the dummy part DPA can be formed at a position further away from and / or separated (e.g., spaced apart or separated) from the first region AR1. Therefore, when the dummy part DPA is removed, damage to the window WIN can be reduced or prevented by reducing the impact applied to the portion of the window WIN arranged under the adhesive layer PSA and overlapping with the first region AR1.

[0173] Furthermore, after the first laser irradiation, compared to performing additional laser irradiation at the same location, when the second irradiation line CL2 and the third irradiation line CL3 are set to move away from the first irradiation line CL1 away from the first region AR1, the stress between the adhesive layer PSA adjacent to the first region AR1 and the window WIN can be minimized or reduced. This reduces or prevents stress on the effective area AA (see [link to product description]) when the adhesive layer PSA is bonded to the display panel of the window WIN. Figure 2 Damage to adjacent areas.

[0174] although Figures 11A to 11HThe example illustrates that the laser beam irradiation is performed three times, but the embodiments of this disclosure are not limited to this, and the number of laser beam irradiations can vary. Furthermore, the power, speed, focus, and diameter of the first to third laser beams LB1, LB2, and LB3 can be set differently depending on the material of the layers constituting the window module WM and the cutting shape of the window module WM. The interval between the first to third irradiation lines CL1, CL2, and CL3 can also be set differently depending on the material of the polarizer PP.

[0175] Reference Figure 11I , Figure 11H The window module WM shown can be combined with the display panel DP. After the display panel DP is arranged on the polarizer PP, the window module WM and the display panel DP can be combined with each other. The window module WM and the display panel DP can be pressed together to combine them. The first region AR1 and the second region AR2 can be respectively combined with the effective region AA (see...). Figure 2 ) and peripheral NDA (see Figure 2 )correspond.

[0176] Figures 12A to 12C This is a cross-sectional view illustrating some of the operations of a method for manufacturing an electronic device according to one or more embodiments of the present disclosure. In the following, with reference to... Figure 12A and Figure 12B In the description, the same / similar reference numerals are used with respect to... Figures 5 to 11I The same or similar constructs are described in the previous section, and for the sake of brevity, their repeated descriptions will not be provided.

[0177] Reference Figures 12A to 12C The polarizer PP can be composed of multiple layers. The polarizer PP may include a triacetyl cellulose layer (TAC), a second adhesive component (AD2), a polyolefin film (COP), and a protective film (BF).

[0178] Reference Figure 12A The first laser beam LB1 can penetrate the polyolefin film COP, the protective film BF, and the second adhesive member AD2, exposing at least a portion of the triacetyl cellulose layer TAC. The first depth RD1 can be less than the thickness of the polarizer PP.

[0179] Reference Figures 12A to 12CIn one or more embodiments, the first depth RD1 may correspond to a length extending from the upper surface of the protective film BF to a portion of the triacetyl cellulose layer TAC. For example, the first laser beam LB1 may be provided until the first deformation region DFA1 does not reach the first adhesive member AD1 and the phase retardation layer RFL. The end LE1 of the first irradiation line CL1 may be disposed on the triacetyl cellulose layer TAC. If the first laser beam LB1 reaches the phase retardation layer RFL and a portion of the phase retardation layer RFL is cut (e.g., when the first laser beam LB1 reaches the phase retardation layer RFL and a portion of the phase retardation layer RFL is cut), cracks may occur in the polarizer PP disposed on the phase retardation layer RFL. Since the first laser beam LB1 does not reach the phase retardation layer RFL, the phase retardation layer RFL is not cut, thereby preventing cracks from occurring in the polarizer PP.

[0180] Similarly, in one or more embodiments, the second depth RD2 may correspond to a length extending from the upper surface of the protective film BF to a portion of the triacetylcellulose layer TAC. For example, the second laser beam LB2 may be provided until the second deformation region DFA2 does not reach the first adhesive member AD1 and the phase retardation layer RFL. The end LE2 of the second irradiation line CL2 may be disposed on the triacetylcellulose layer TAC.

[0181] The third depth RD3 can correspond to a length extending from the upper surface of the protective film BF to a portion of the adhesive layer PSA. For example, the third laser beam LB3 can be provided until the third deformation region DFA3 does not reach the bottom surface PSA-BS of the adhesive layer PSA. The third depth RD3 can be greater than the first depth RD1 and the second depth RD2. The end LE3 of the third irradiation line CL3 can be disposed on the adhesive layer PSA. The third laser beam LB3 may not reach the bottom surface PSA-BS of the adhesive layer PSA. Therefore, the remaining uncut portion of the adhesive layer PSA can be disposed on the window WIN to protect the window WIN from damage caused by the third laser beam LB3.

[0182] After the first irradiation operation, compared to performing the second and third irradiation operations at the same location, when the second and third irradiation operations are performed by moving the first laser beam LB1 in a direction away from the first region AR1, the dummy unit DPA (see...) Figure 9 The dummy portion (DPA) can be formed at a location further away from and / or separated from the first region AR1 (e.g., spaced apart or separated). Therefore, when the dummy portion DPA is removed, damage to the window WIN can be reduced or prevented by reducing the impact applied to the portion of the window WIN arranged under the adhesive layer PSA and overlapping with the first region AR1.

[0183] According to this disclosure, by reducing or preventing the degree of damage to the window when cutting the window module and the cracking problem that occurs in the polarizer when removing the dummy part in the laser cutting process of the window module, an electronic device with improved reliability can be provided.

[0184] In this disclosure, phrases such as “at least one of…”, “one of…”, and “selected from…” modify the entire list of elements before / after a list of elements, without modifying any individual elements in the list. For example, “at least one of a, b, and c”, “selected from at least one of a, b, and c”, “selected from at least one of a to c”, etc., can mean only a, only b, only c, (e.g., both a and b), (e.g., both a and c), (e.g., both b and c), all of a, b, and c, or variations thereof.

[0185] In the context of this application, unless otherwise defined, the term “use” and its variations may be considered synonymous with the term “utilize” and its variations, respectively.

[0186] As used herein, the terms “substantially,” “approximately,” “around,” or similar terms are used as approximate terms rather than terms of degree and are intended to account for inherent biases in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. As used herein, “approximately” or “around” includes the stated value and means: within an acceptable deviation of the stated value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, “approximately” or “around” could mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0187] Any numerical range listed herein is intended to include all subranges containing the same numerical precision within the listed range. For example, the range “1.0 to 10.0” is intended to include all subranges between the listed minimum value 1.0 and the listed maximum value 10.0 (and including both the listed minimum value 1.0 and the listed maximum value 10.0), i.e., having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as 2.4 to 7.6. Any maximum numerical limit listed herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit listed in this specification is intended to include all higher numerical limits contained therein. Therefore, the applicant reserves the right to amend this disclosure (including the claims) to expressly list any subranges included within the range expressly listed herein.

[0188] It will be understood by those skilled in the art that, in view of the entirety of this disclosure, each suitable feature of the various embodiments of this disclosure may be combined in part or in whole, or combined with one another, and may be technically interlocked and operated in a variety of suitable ways, and unless otherwise stated or implied, each embodiment may be implemented independently of one another or in any suitable combination with one another.

[0189] The window manufacturing apparatus, light-emitting element, display module, display device, electronic device / equipment, or any other related device / equipment or component according to embodiments of the present disclosure described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuit), software, or a combination of software, firmware, and hardware. For example, various components of the device can be formed on an integrated circuit (IC) chip or a separate IC chip. Furthermore, various components of the device can be implemented on a flexible printed circuit film, a tape-on-a-carrier package (TCP), a printed circuit board (PCB), or formed on a substrate. Additionally, various components of the device can be processes or threads that run on one or more processors, execute computer program instructions in one or more computing devices, and interact with other system components to perform the various functions described herein. The computer program instructions are stored in a memory, which can be implemented in a computing device using a standard memory device, such as random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer-readable media, such as CD-ROMs, flash drives, etc. Furthermore, those skilled in the art will recognize that, without departing from the scope of the embodiments of this disclosure, the functions of various computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed across one or more other computing devices.

[0190] Although this disclosure has been described with reference to one or more embodiments, those skilled in the art to which this disclosure pertains will understand that modifications and alterations can be made to this disclosure within the scope of the appended claims without departing from the spirit and technical field of this disclosure. Therefore, the technical scope of this disclosure should not be limited to the detailed description disclosed, but should be determined by the claims and their equivalents.

Claims

1. An electronic device, the electronic device comprising: The display panel includes an effective area in which a plurality of pixels are arranged and a peripheral area adjacent to the effective area; Window, on the display panel; A housing is located below the display panel and houses the display panel. An optical layer, on the window and comprising multiple layers; and An adhesive layer is placed between the window and the optical layer, and attaches the window and the optical layer. The plurality of layers includes a first layer, a second layer on the first layer, and a third layer on the second layer. The side surface of the third layer includes a stepped portion that overlaps with the peripheral region.

2. The electronic device according to claim 1, wherein, The stepped portion includes a first surface and a second surface. The first surface is inclined at a first angle relative to the upper surface of the window, and the second surface is inclined at a second angle relative to the upper surface of the window, the second angle being different from the first angle.

3. The electronic device according to claim 2, wherein, At least one of the first surface and the second surface includes a flat surface.

4. The electronic device according to claim 2, wherein, At least one of the first surface and the second surface includes a curved surface.

5. The electronic device according to claim 2, wherein, The stepped portion further includes a third surface connected to the first surface or the second surface and inclined at a third angle relative to the upper surface of the window, the third angle being different from the angle of the connected surface of the first surface and the second surface relative to the upper surface of the window.

6. The electronic device according to claim 1, wherein, The third layer comprises multiple layers. The third layer comprises a triacetylcellulose layer, a polyolefin film on the triacetylcellulose layer, and a protective film on the polyolefin film. The stepped portion is defined on the triacetylcellulose layer.

7. The electronic device according to claim 1, wherein, The side surface of the second layer is further away from the effective area than the side surface of the third layer.

8. A window module, the window module comprising: The window includes a first region and a second region surrounding the periphery of the first region in the plan view; The optical layer includes a first layer, a second layer on the first layer, and a third layer on the second layer; as well as An adhesive layer is placed between the window and the optical layer, and attaches the window and the optical layer. The groove includes a first portion extending through the third layer and a second portion extending through the first and second layers, the second portion exposing at least a portion of the adhesive layer. The first part includes at least one step portion.

9. The window module according to claim 8, wherein, In cross-section, the width of the first part is greater than the width of the second part.

10. The window module according to claim 8, wherein, The stepped portion includes a curved surface.

11. The window module according to claim 8, wherein, The surface defining the groove in the third layer includes a protruding portion, and The protruding portion protrudes toward the upper surface of the third layer.

12. A method for manufacturing an electronic device, the method comprising the following steps: Provide a display panel; A window is provided, the window comprising a first region and a second region on a plane surrounding the periphery of the first region; A preliminary window module is formed by sequentially laminating an adhesive layer and an optical layer onto the window. The window module is formed by cutting the initial window module; as well as Combine the display panel and the window module. The step of forming the window module by cutting the initial window module includes: A first irradiation operation is performed to irradiate a first laser beam along a first irradiation line defined in the second region; A second irradiation operation involving irradiating a second laser beam along a second irradiation line spaced apart from the first irradiation line; and A third irradiation operation involves irradiating a third laser beam along a third irradiation line defined between the first irradiation line and the second irradiation line. The second irradiation line is farther away from the first region than the first irradiation line.

13. The method according to claim 12, wherein, The second irradiation operation is performed after the first irradiation operation, and The third irradiation operation is performed after the second irradiation operation.

14. The method according to claim 12, wherein, The third laser beam reaches a third depth greater than the first laser beam reaches a first depth and the second laser beam reaches a second depth.

15. The method according to claim 14, wherein, In the third irradiation operation, The third depth reached by the third laser beam is less than the depth of the lower surface of the adhesive layer relative to the upper surface of the optical layer.

16. The method according to claim 12, wherein, The optical layer includes a phase retardation layer, an adhesive member on the phase retardation layer, and a polarizer on the adhesive member. In the first irradiation operation, the phase delay layer and the adhesive member are not cut.

17. The method according to claim 16, wherein, In the first irradiation operation, the depth reached by the first laser beam is less than the thickness of the polarizer.

18. The method according to claim 16, wherein, The polarizer comprises multiple layers. The plurality of layers include a triacetyl cellulose layer, a polyolefin film on the triacetyl cellulose layer, and a protective film on the polyolefin film. The first laser beam passes through the polyolefin film and the protective film, exposing at least a portion of the triacetylcellulose layer.

19. The method according to claim 12, wherein, The distance between the first irradiation line and the second irradiation line is less than half the diameter of each of the first laser beam, the second laser beam, and the third laser beam.

20. The method according to claim 12, wherein, The power of the third laser beam is lower than that of each of the first and second laser beams.

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