Quartz cavity low-temperature bonding equipment and process
The quartz cavity low-temperature bonding equipment and process, which converts oxygen into ozone using an ultraviolet lamp and introduces nitrogen gas, solves the problems of thermal deformation and impurity diffusion caused by high-temperature bonding, and achieves low-cost and simplified operation of quartz cavity bonding.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-17
- Publication Date
- 2026-04-14
AI Technical Summary
Existing quartz cavity bonding technology suffers from problems such as thermal deformation, dimensional shrinkage, and impurity diffusion caused by high temperatures, while low-temperature bonding solutions have high equipment costs and complicated operation procedures.
Ultraviolet lamps are used to convert oxygen into ozone for cleaning, and nitrogen is introduced as a protective gas. A rectangular quartz bonding box is used for low-temperature bonding of the quartz cavity. A combination of a rotating mechanism and a clamping mechanism is used to achieve alignment and bonding of the quartz cavity.
It achieves high-reliability bonding of quartz cavities under low-temperature conditions, avoiding the problems of high equipment costs and complex operation procedures, and ensuring the purity and dimensional accuracy of the quartz cavity.
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Figure CN121865874A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of quartz bonding technology, specifically, it relates to a quartz cavity low-temperature bonding device and process. Background Technology
[0002] Currently, the mainstream technology in quartz cavity bonding processes is high-temperature bonding, which requires heating the quartz substrate to a near-molten temperature range to achieve interface fusion. This method has two drawbacks: First, high temperatures can easily cause thermal deformation and dimensional shrinkage of the quartz cavity, making it difficult to meet the dimensional accuracy requirements of precision quartz devices (such as quartz reaction chambers for semiconductors); second, the high-temperature environment accelerates the diffusion of impurity ions inside the quartz, damaging the purity of the quartz cavity and affecting its application in high-cleanliness fields.
[0003] To avoid the defects of high temperature, some low-temperature bonding solutions have emerged, but they still have shortcomings: one type of solution relies on coating the quartz bonding surface with a special adhesive layer (such as glass powder or polymer adhesive), which can reduce the temperature, but the adhesive layer is prone to introducing impurities, and may age and fall off during long-term use, resulting in a decrease in bonding sealing performance; another type of low-temperature solution without an adhesive layer requires a high vacuum environment or complex plasma surface treatment equipment, which is costly and has a complicated operation process.
[0004] Chinese Patent CN115376966B discloses a room-temperature bonding method for quartz, comprising: S100, cleaning the surface of a quartz sheet; S200, depositing silica on two quartz sheets to form a silica bonding film on the surface of the quartz sheets; S300, chemically and mechanically polishing the silica bonding film; S400, cleaning the quartz sheets with a hydrofluoric acid solution; and S500, bringing the silica bonding films of the two quartz sheets into contact and bonding the quartz sheets together using a bonding machine. This method can achieve highly reliable bonding of quartz to quartz at room temperature.
[0005] However, this technical solution still has at least the following drawbacks: it still requires complex plasma surface treatment equipment, and cannot solve the problems of high equipment cost and cumbersome operation procedures. Therefore, this invention is proposed. Summary of the Invention
[0006] To address the aforementioned technical problems, this invention provides a quartz cavity low-temperature bonding device and process. It utilizes an ultraviolet lamp to convert oxygen into ozone, thereby cleaning the surface of the quartz cavity. Nitrogen gas is introduced as a protective gas to safeguard the quartz cavity and prevent contamination. A rectangular quartz bonding box ensures ultraviolet light transmission while facilitating the insertion of the quartz cavity into the bonding box for bonding. Furthermore, the guide shields at both ends allow the filling gas to better fill the bonding box.
[0007] The technical solution adopted by this invention to solve its technical problem is:
[0008] A quartz cavity cryogenic bonding device includes a housing, wherein the housing is provided with:
[0009] Ultraviolet lamp, the ultraviolet lamp being used to convert oxygen into ozone;
[0010] A bonding box, which provides a sealed environment;
[0011] A support block is installed at the bottom of the bonding box, and a pushing mechanism and a clamping mechanism are also provided at the top of the support block. The pushing mechanism includes a liquid cavity, a piston is provided inside the liquid cavity, and a push rod is fixedly installed at one end of the piston. A rotating mechanism is provided between the pushing mechanism and the clamping mechanism. The rotating mechanism includes a fixed tube, a rotating column is movably installed inside the fixed tube, a first protrusion is installed on the inner wall of the fixed tube, and a second protrusion is installed on the outer side of the rotating column.
[0012] When the quartz cavity is irradiated by an ultraviolet lamp, the rotating mechanism drives the quartz cavity to rotate, so that the pushing mechanism applies pressure to the quartz cavity.
[0013] In a preferred embodiment of the present invention, a support plate is installed on the top of the support block, and a sliding mechanism is provided on the top of the support plate. The sliding mechanism includes a slide rod fixedly installed on the top of the support plate, and an installation block is slidably connected to the slide rod. The rotating mechanism is located on the top of the installation block, and a fixing block is installed at one end of the push rod of the pushing mechanism. The fixing block is fixedly connected to the installation block. When the pushing mechanism is working, it drives the installation block to slide on the slide rod.
[0014] In a preferred embodiment of the present invention, the rotating mechanism further includes sealing discs fixedly installed at both ends of the fixed tube, rotating shafts fixedly installed at both ends of the rotating column, and the rotating shafts movably pass through the sealing discs and extend to the outside, a fixing frame fixedly installed at the bottom of the fixed tube, the fixing frame fixedly installed at the top of the mounting block, and an air pipe installed on one side of the fixed tube, the air pipe being located between the first protrusion and the second protrusion.
[0015] In a preferred embodiment of the present invention, a support mechanism is provided on one side of the rotating mechanism. The support mechanism includes a mounting component, a clamping rod is provided on the mounting component, and an elastic reset component is provided on one side of the clamping rod. The elastic reset component includes a plug rod, a spring is movably sleeved on the plug rod, one end of the plug rod movably passes through the mounting component and is fixedly connected to the clamping rod, a mounting plate is fixedly mounted on one end of the mounting component, the mounting plate is fixedly connected to the rotating shaft, and a stop rod is fixedly mounted on one side of the mounting block, and the stop rod is aligned with the mounting plate.
[0016] In a preferred embodiment of the present invention, the bonding box has a rectangular cross-section, and both ends of the bonding box are equipped with flow guides. A first control valve and a second control valve are respectively installed at one end of the flow guides at both ends. A support frame is installed inside the bonding box, and a slot adapted to the support block is opened at the bottom of the bonding box. A sealing gasket is installed between the support block and the bottom of the bonding box.
[0017] In a preferred embodiment of the present invention, a slider is installed at the bottom of the support block, a slide rail is fixedly installed on one side of the inner wall of the box, the slider is slidably connected to the slide rail, and a lifting mechanism is provided at the bottom of the slider. The lifting mechanism includes a lead screw and a ball nut that cooperate with each other, and knobs are fixedly installed at both ends of the lead screw. Support rods are rotatably installed at both ends of the ball nut. The support rod at the top is rotatably connected to the slider, and the support rod at the bottom is rotatably installed with a base. The base is fixedly installed at the bottom of the box.
[0018] A quartz cavity low-temperature bonding process, implemented using a quartz cavity low-temperature bonding device, includes the following steps:
[0019] S1. Place the quartz cavity to be bonded at the clamping rod. The tension of the spring is transmitted to the clamping rod through the insert rod, so that the clamping rod holds the quartz cavity.
[0020] S2. Turning the knob drives the lead screw to rotate. When the lead screw rotates, it drives the ball nut to move, which in turn causes the support rod to lift the slider.
[0021] As a preferred embodiment of the present invention, it further includes:
[0022] S3. During the upward movement of the slider, the support block is moved upward simultaneously until the support block and the bonding box form a sealed state.
[0023] S4. Nitrogen gas is introduced into the fixed tube through the air pipe. Under the pressure of the nitrogen gas, the second protrusion is pushed to rotate, which drives the rotating column and rotating shaft to rotate, thereby causing the mounting plate to rotate.
[0024] As a preferred embodiment of the present invention, it further includes:
[0025] S5. When the mounting plate rotates, it drives the clamping mechanism to adjust its posture so that the bonding surface of the quartz cavity is aligned with the ultraviolet lamp.
[0026] S6. Open the first control valve and the second control valve to introduce oxygen into the bonding chamber. After the chamber is filled with oxygen, close the first control valve and the second control valve and turn on the ultraviolet lamp. The oxygen is converted into ozone by irradiation to clean the surface of the quartz cavity to be bonded.
[0027] As a preferred embodiment of the present invention, it further includes:
[0028] S7. After cleaning, open the first control valve and the second control valve again to introduce nitrogen into the bonding box and purge the residual oxygen and ozone inside; then extract the nitrogen from the fixed tube through the air tube, reset the clamping mechanism, and drive the two quartz cavities to align with each other.
[0029] S8. Liquid is delivered into the liquid chamber, and the hydraulic pressure drives the piston to move. The piston moves via the push rod, and the mounting block moves. The two quartz chambers are bonded under external pressure. After bonding, the slider moves via the lead screw and ball nut, so that the support block is removed and the mounting block is reset so that the quartz chamber can be removed.
[0030] Compared with the prior art, the present invention has the following advantages:
[0031] This invention uses an ultraviolet lamp to convert oxygen into ozone to clean the surface of the quartz cavity, and introduces nitrogen as a protective gas to protect the quartz cavity. The entire operation effectively prevents air from entering and prevents the quartz cavity from being contaminated.
[0032] This invention uses a rectangular quartz bonding box to ensure that ultraviolet light can pass through while facilitating the insertion of the quartz cavity into the bonding box for bonding. Furthermore, the guide shields at both ends allow the filling gas to better fill the bonding box, reducing equipment costs and simplifying the operation process. Attached Figure Description
[0033] Figure 1 This is a schematic diagram of the overall structure of the quartz cavity low-temperature bonding device of the present invention;
[0034] Figure 2 This is a schematic diagram of the internal structure of the bonding box of the present invention;
[0035] Figure 3 This is a schematic diagram of the top structure of the support block of the present invention;
[0036] Figure 4 This is a schematic diagram of the clamping mechanism of the present invention;
[0037] Figure 5 This is a schematic diagram of the structure of the stop bar of the present invention;
[0038] Figure 6 This is a schematic diagram of the structure of the fixed tube and the rotating column in the separated state of the present invention;
[0039] Figure 7 This is a schematic diagram of the internal structure of the fixed tube of the present invention;
[0040] Figure 8 This is a schematic diagram of the structure of the liquid cavity in this invention.
[0041] Figure label:
[0042] 100. Housing; 101. Base; 102. Support rod; 103. Ball bearing nut; 104. Lead screw; 105. Knob; 106. Slider; 107. Slide rail;
[0043] 200. Ultraviolet lamp; 201. Bonding box; 202. Shielding; 203. First control valve; 204. Second control valve; 205. Support frame;
[0044] 300. Support block; 301. Support plate; 302. Slide rod; 303. Mounting block; 304. Mounting plate; 305. Mounting component; 306. Insert rod; 307. Spring; 308. Clamping rod; 309. Stop rod;
[0045] 400. Fixed tube; 401. First protrusion; 402. Rotating column; 403. Second protrusion; 404. Sealing plate; 405. Fixing bracket; 406. Air tube;
[0046] 500, Liquid chamber; 501, Piston; 502, Push rod; 503, Fixing block; 504, Liquid pipe. Detailed Implementation
[0047] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate the present invention.
[0048] Example 1:
[0049] like Figures 1 to 8 As shown, a quartz cavity cryogenic bonding device includes a housing 100, and the housing 100 contains:
[0050] UV lamp 200, UV lamp 200 is used to convert oxygen into ozone;
[0051] Bonding box 201 is used to provide a sealed environment. Bonding box 201 is made of quartz material to reduce the obstruction of the light from ultraviolet lamp 200.
[0052] A support block 300 is installed at the bottom of the bonding box 201. A pushing mechanism and a clamping mechanism are also provided at the top of the support block 300. The pushing mechanism includes a liquid chamber 500. A piston 501 is provided inside the liquid chamber 500. A push rod 502 is fixedly installed at one end of the piston 501. A rotating mechanism is provided between the pushing mechanism and the clamping mechanism. The rotating mechanism includes a fixed tube 400. A rotating column 402 is movably installed inside the fixed tube 400. A first protrusion 401 is installed on the inner wall of the fixed tube 400. A second protrusion 403 is installed on the outer side of the rotating column 402. A liquid pipe 504 is installed at one end of the liquid chamber 500. The liquid pipe 504 passes through the support block 300 and extends to the outside.
[0053] After the quartz cavity is irradiated by the ultraviolet lamp 200, the rotating mechanism drives the quartz cavity to rotate, so that the pushing mechanism applies pressure to the quartz cavity.
[0054] like Figures 2 to 3 As shown, in a specific embodiment, a support plate 301 is installed on the top of the support block 300. A sliding mechanism is provided on the top of the support plate 301. The sliding mechanism includes a slide rod 302 fixedly installed on the top of the support plate 301. An installation block 303 is slidably connected to the slide rod 302. A rotating mechanism is located on the top of the installation block 303. A fixed block 503 is installed at one end of the push rod 502 of the pushing mechanism. The fixed block 503 is fixedly connected to the installation block 303. When the pushing mechanism works, it drives the installation block 303 to slide on the slide rod 302. In this configuration, there are two installation blocks 303 and two structural components on them, which are symmetrically distributed to clamp and install two quartz cavities. When liquid is introduced into the liquid cavity 500, the piston 501 moves and the push rod 502 and the fixed block 503 drive the installation block 303 to move, so that the two quartz cavities fit together.
[0055] like Figures 5 to 7 As shown, the rotating mechanism further includes sealing discs 404 fixedly installed at both ends of the fixed tube 400, rotating shafts fixedly installed at both ends of the rotating column 402, and the rotating shafts movably pass through the sealing discs 404 and extend to the outside. A fixing bracket 405 is fixedly installed at the bottom of the fixed tube 400, and the fixing bracket 405 is fixedly installed at the top of the mounting block 303. An air pipe 406 is installed on one side of the fixed tube 400, and the air pipe 406 is located between the first protrusion 401 and the second protrusion 403. In this configuration, both the first protrusion 401 and the second protrusion 403 are arc-shaped, and their corresponding central angles are both 90 degrees. There are two spaces between the first protrusion 401 and the second protrusion 403. One space is connected to the air pipe 406, and the other space is connected to the outside through an air hole opened on the side wall of the fixed pipe 400. When the air pipe 406 delivers nitrogen into the fixed pipe 400, the pressure squeezes the second protrusion 403 to drive the rotating column 402 to rotate. At this time, the gas in the space corresponding to the air hole is squeezed and discharged through the air hole. The gas in the fixed pipe 400 is nitrogen, so even if leakage occurs, it will not contaminate the cleaned quartz cavity.
[0056] like Figures 4 to 5As shown, a support mechanism is further provided on one side of the rotating mechanism. The support mechanism includes a mounting component 305, a clamping rod 308 on the mounting component 305, and an elastic reset component on one side of the clamping rod 308. The elastic reset component includes an insert rod 306, on which a spring 307 is movably sleeved. One end of the insert rod 306 movably passes through the mounting component 305 and is fixedly connected to the clamping rod 308. A mounting plate 304 is fixedly mounted on one end of the mounting component 305 and is fixedly connected to the rotating shaft. A stop rod 309 is fixedly mounted on one side of the mounting block 303, and the stop rod 309 is aligned with the mounting plate 304. In this configuration, the middle part of the clamping rod 308 is zigzag-shaped, used to hold the quartz cavity against the quartz cavity when pressure is applied. One end of the clamping rod 308 includes a silicone sleeve to prevent wear on the side wall of the quartz cavity. The elastic force of the spring 307 is sufficient to overcome the gravity of the quartz cavity so that the quartz cavity is in the middle position of the support mechanism.
[0057] like Figures 1 to 2 As shown, the bonding box 201 has a rectangular cross-section, and both ends of the bonding box 201 are equipped with flow guides 202. A first control valve 203 and a second control valve 204 are respectively installed at one end of each flow guide 202. A support frame 205 is installed inside the bonding box 201. A slot adapted to the support block 300 is opened at the bottom of the bonding box 201, and a sealing gasket is installed between the support block 300 and the bottom of the bonding box 201. In this configuration, the flow guides 202 can smoothly connect the bonding box 201 with the first control valve 203 and the second control valve 204. When gas is introduced into the bonding box 201, the original gas inside the bonding box 201 can be squeezed out, ensuring the purity of the gas inside the bonding box 201.
[0058] like Figure 1 As shown, furthermore, a slider 106 is installed at the bottom of the support block 300, and a slide rail 107 is fixedly installed on one side of the inner wall of the housing 100. The slider 106 is slidably connected to the slide rail 107. A lifting mechanism is provided at the bottom of the slider 106. The lifting mechanism includes a lead screw 104 and a ball nut 103 that cooperate with each other. Knobs 105 are fixedly installed at both ends of the lead screw 104. Support rods 102 are rotatably installed at both ends of the ball nut 103. The support rod 102 at the top is rotatably connected to the slider 106, and the support rod 102 at the bottom is rotatably installed with a base 101. The base 101 is fixedly installed at the bottom of the housing 100. In this configuration, the threads at both ends of the lead screw 104 are symmetrically arranged. When the lead screw 104 rotates, it drives the ball nuts 103 on both sides to move in the opposite direction, so that the support rods 102 move, thereby realizing the lifting and lowering of the slider 106.
[0059] In this application, a heating coil can be installed at the support plate 301, and a built-in circulating fan can realize temperature circulation, so as to keep the temperature uniform during bonding.
[0060] The implementation principle of the quartz cavity low-temperature bonding equipment and process in this embodiment is as follows: In use, the quartz cavity to be bonded is placed at the clamping rod 308. At this time, the tension of the spring 307 is transmitted to the clamping rod 308 through the insertion rod 306 so that the clamping rod 308 clamps the quartz cavity. At this time, the screw 104 is rotated by the knob 105. When the screw 104 rotates, it drives the ball nut 103 to move, so that the support rod 102 drives the slider 106 to rise. During the rising process, the support block 300 is moved up until it is sealed with the bonding box 201.
[0061] Nitrogen gas is introduced into the fixed tube 400 through the air tube 406. After the nitrogen gas enters, it pushes the second protrusion 403 to rotate under the action of a large pressure, so that the rotating column 402 rotates. The rotating column 402 drives the mounting plate 304 to rotate through the rotating shaft, so that the clamping mechanism rotates the quartz cavity and keeps the bonding surface aligned with the ultraviolet lamp 200.
[0062] At this time, open the first control valve 203 and the second control valve 204, and introduce oxygen through one of them. When the bonding chamber 201 is full of oxygen, stop introducing oxygen and close the first control valve 203 and the second control valve 204. At this time, turn on the ultraviolet lamp 200. The oxygen is converted into ozone under the irradiation of the ultraviolet lamp 200 and cleans the surface of the quartz cavity to be bonded.
[0063] After cleaning, the first control valve 203 and the second control valve 204 are opened, and nitrogen is introduced into the bonding box 201 to purge the oxygen and ozone inside the bonding box 201. At this time, the nitrogen inside the fixed tube 400 is extracted through the gas pipe 406, the clamping mechanism is reset, and the two quartz cavities are aligned with each other. At this time, liquid is delivered into the liquid cavity 500 through the liquid pipe 504. Under the action of hydraulic pressure, the liquid pushes the piston 501 to move, and then drives the mounting block 303 to move through the push rod 502. At this time, the two quartz cavities are bonded under the action of external pressure.
[0064] After bonding is completed, the slider 106 is moved by the lead screw 104 and ball nut 103 so that the support block 300 is moved out. At this time, the mounting block 303 is reset to facilitate the removal of the quartz cavity.
[0065] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.
Claims
1. A quartz cavity low-temperature bonding device, comprising a housing (100), characterized in that, The box (100) is equipped with: Ultraviolet lamp (200), the ultraviolet lamp (200) is used to convert oxygen into ozone; Bonding box (201), the bonding box (201) is used to provide a sealed environment; The bonding box (201) is equipped with a support block (300) at the bottom. The support block (300) is also equipped with a pushing mechanism and a clamping mechanism at the top. The pushing mechanism includes a liquid cavity (500). A piston (501) is provided inside the liquid cavity (500). A push rod (502) is fixedly installed at one end of the piston (501). A rotating mechanism is provided between the pushing mechanism and the clamping mechanism. The rotating mechanism includes a fixed tube (400). A rotating column (402) is movably installed inside the fixed tube (400). A first protrusion (401) is installed on the inner wall of the fixed tube (400). A second protrusion (403) is installed on the outer side of the rotating column (402). When the quartz cavity is irradiated by the ultraviolet lamp (200), the rotating mechanism drives the quartz cavity to rotate so that the pushing mechanism applies pressure to the quartz cavity.
2. The quartz cavity low-temperature bonding device according to claim 1, characterized in that, The support block (300) is equipped with a support plate (301) on top. The support plate (301) is provided with a sliding mechanism on top. The sliding mechanism includes a slide rod (302) fixedly installed on the top of the support plate (301). An installation block (303) is slidably connected to the slide rod (302). The rotating mechanism is located on top of the installation block (303). A fixed block (503) is installed at one end of the push rod (502) of the pushing mechanism. The fixed block (503) is fixedly connected to the installation block (303). When the pushing mechanism is working, it drives the installation block (303) to slide on the slide rod (302).
3. The quartz cavity low-temperature bonding device according to claim 2, characterized in that, The rotating mechanism also includes sealing discs (404) fixedly installed at both ends of the fixed tube (400), rotating shafts fixedly installed at both ends of the rotating column (402), and the rotating shafts movably pass through the sealing discs (404) and extend to the outside. A fixing bracket (405) is fixedly installed at the bottom of the fixed tube (400), and the fixing bracket (405) is fixedly installed at the top of the mounting block (303). An air pipe (406) is installed on one side of the fixed tube (400), and the air pipe (406) is located between the first protrusion (401) and the second protrusion (403).
4. The quartz cavity low-temperature bonding device according to claim 3, characterized in that, A support mechanism is provided on one side of the rotating mechanism. The support mechanism includes a mounting component (305). A clamping rod (308) is provided on the mounting component (305). An elastic reset component is provided on one side of the clamping rod (308). The elastic reset component includes a plug rod (306). A spring (307) is movably sleeved on the plug rod (306). One end of the plug rod (306) movably passes through the mounting component (305) and is fixedly connected to the clamping rod (308). A mounting plate (304) is fixedly installed on one end of the mounting component (305). The mounting plate (304) is fixedly connected to the rotating shaft. A stop rod (309) is fixedly installed on one side of the mounting block (303), and the stop rod (309) is aligned with the mounting plate (304).
5. The quartz cavity low-temperature bonding device according to claim 4, characterized in that, The bonding box (201) has a rectangular cross-section, and both ends of the bonding box (201) are equipped with flow guides (202). One end of the flow guides (202) at both ends is equipped with a first control valve (203) and a second control valve (204). A support frame (205) is installed inside the bonding box (201). The bottom of the bonding box (201) is provided with a slot that matches the support block (300). A sealing gasket is installed between the support block (300) and the bottom of the bonding box (201).
6. The quartz cavity low-temperature bonding device according to claim 5, characterized in that, The bottom of the support block (300) is equipped with a slider (106), and a slide rail (107) is fixedly installed on one side of the inner wall of the box (100). The slider (106) is slidably connected to the slide rail (107). The bottom of the slider (106) is provided with a lifting mechanism. The lifting mechanism includes a lead screw (104) and a ball nut (103) that cooperate with each other. A knob (105) is fixedly installed at both ends of the lead screw (104). A support rod (102) is rotatably installed at both ends of the ball nut (103). The support rod (102) at the top is rotatably connected to the slider (106). The support rod (102) at the bottom is rotatably installed with a base (101). The base (101) is fixedly installed at the bottom of the box (100).
7. A quartz cavity low-temperature bonding process, implemented based on the quartz cavity low-temperature bonding equipment according to any one of claims 1-6, characterized in that, Includes the following steps: S1. Place the quartz cavity to be bonded at the clamping rod (308). The tension of the spring (307) is transmitted to the clamping rod (308) through the insert rod (306), so that the clamping rod (308) clamps the quartz cavity. S2. Rotate the knob (105) to drive the lead screw (104) to rotate. When the lead screw (104) rotates, it drives the ball nut (103) to move, which in turn causes the support rod (102) to drive the slider (106) to rise.
8. The quartz cavity low-temperature bonding process according to claim 7, characterized in that, Also includes: S3. During the upward movement of the slider (106), the support block (300) is moved upward in sync until the support block (300) and the bonding box (201) form a sealed state. S4. Nitrogen gas is introduced into the fixed tube (400) through the air pipe (406). Under pressure, the nitrogen gas pushes the second protrusion (403) to rotate, which drives the rotating column (402) and the rotating shaft to rotate, thereby causing the mounting plate (304) to rotate.
9. The quartz cavity low-temperature bonding process according to claim 8, characterized in that, Also includes: S5. When the mounting plate (304) rotates, it drives the clamping mechanism to adjust its posture so that the bonding surface of the quartz cavity is aligned with the ultraviolet lamp (200). S6. Open the first control valve (203) and the second control valve (204) to introduce oxygen into the bonding box (201). After the oxygen is full, close the first control valve (203) and the second control valve (204) and turn on the ultraviolet lamp (200). The oxygen is converted into ozone by irradiation to clean the surface of the quartz cavity to be bonded.
10. The quartz cavity low-temperature bonding process according to claim 9, characterized in that, Also includes: S7. After cleaning, open the first control valve (203) and the second control valve (204) again to introduce nitrogen into the bonding box (201) and purge the residual oxygen and ozone inside; then extract the nitrogen in the fixed tube (400) through the air pipe (406), reset the clamping mechanism, and drive the two quartz cavities to align with each other. S8. Liquid is delivered into the liquid chamber (500), and the piston (501) is moved by hydraulic pressure. The piston (501) is moved by the push rod (502), and the mounting block (303) is moved. The two quartz chambers are bonded under external pressure. After bonding, the slider (106) is moved by the lead screw (104) and ball nut (103), so that the support block (300) is moved out and the mounting block (303) is reset so that the quartz chamber can be removed.
Citation Information
Patent Citations
A quartz room temperature bonding method
CN115376966B