Probe
By designing a second, inclined, intersecting slit in the probe's connection area, stress is dispersed, solving the problem of probe breakage caused by stress concentration at the slit end and improving the probe's durability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2026-04-14
AI Technical Summary
In existing probes with multiple arms arranged in parallel, stress concentration at the slit ends can easily lead to probe breakage.
A probe was designed with a second slit, narrower than the first slit, forming a width direction in the connection region. The sides and end faces of the second slit are sloped and intersected to disperse stress concentration.
It effectively suppresses stress concentration at the slit end, reduces probe breakage, and ensures the reliability and durability of the probe.
Smart Images

Figure CN121866473A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a probe for inspecting the electrical properties of an object. Background Technology
[0002] To inspect the electrical properties of semiconductor integrated circuits and other objects without separating them from the wafer, a probe is used that contacts the object. In inspections using probes, a load can be applied to the probe to elastically deform it. This elastic deformation allows for reliable contact between the object and the probe using the probe's elastic force. To adjust the pressing force of the probe in contact with the object, a probe with a structure in which multiple columnar arms are arranged side-by-side was investigated (see Patent Document 1). In this probe with side-by-side arm arrangement, a slit is formed between the arms. The ends of this slit are the connecting portions between the arms.
[0003] Existing technical documents
[0004] Patent documents
[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-143976 Summary of the Invention
[0006] The problem the invention aims to solve
[0007] In a probe structure with multiple arms arranged side by side, stress concentrates at the ends of the slits formed between the arms due to the bending of the probe. This stress concentration can cause the probe to break.
[0008] The object of the present invention is to provide a probe that suppresses breakage caused by stress concentration at the end of the slit formed between the arms.
[0009] Solution for solving the problem
[0010] According to one aspect of the present invention, a probe is provided, comprising: a first end and a second end, which are axial ends respectively; and a first arm and a second arm in the shape of a cylinder, which are arranged side by side in a width direction perpendicular to the axial direction in such a way as to form a first slit between them. The first arm and the second arm extend from the first end to the second end respectively. The first arm and the second arm connect the first end and the second end to each other as a connecting region. At least one of the first end and the second end, a second slit is formed in the connecting region in such a way as to communicate with the first slit along the axial direction, the second slit having an opening width in the width direction that is narrower than the first slit. The side surface of the second slit in the cross section along the width direction is formed into a slope shape that intersects obliquely with respect to the width direction.
[0011] The effects of the invention
[0012] According to the present invention, it is possible to provide a probe that suppresses breakage caused by stress concentration at the end of the slit formed between the arms. Attached Figure Description
[0013] Figure 1 This is a schematic diagram illustrating the structure of the probe according to an embodiment of the present invention.
[0014] Figure 2 This is a schematic perspective view showing the structure of the end of the probe according to an embodiment of the present invention.
[0015] Figure 3 It is along Figure 1 A schematic cross-sectional view along direction III-III.
[0016] Figure 4 It is along Figure 1 A schematic cross-sectional view along the IV-IV direction.
[0017] Figure 5 It is along Figure 1 A schematic cross-sectional view in the VV direction.
[0018] Figure 6 This is a schematic diagram showing the structure of an electrical connection device that includes a probe according to an embodiment of the present invention.
[0019] Figure 7 This is a schematic diagram showing the state in which the first arm and the second arm are in contact at the second slit of the probe in an embodiment of the present invention. Detailed Implementation
[0020] Next, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description of the drawings, the same or similar reference numerals will be used to label the same or similar parts. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from reality. Furthermore, it is self-evident that the drawings also include parts with different dimensional relationships and ratios. The embodiments shown below illustrate apparatus and methods for embodying the technical concept of the present invention; the embodiments of the present invention do not specify the materials, shapes, structures, arrangements, and manufacturing methods of the constituent parts as described below.
[0021] Figure 1 The probe 10 of the illustrated embodiment is used to inspect the electrical properties of an object. The probe 10 includes a first end 101 and a second end 102, and columnar first arms 11 and 12. The first arm 11 and 12 extend from the first end 101 to the second end 102, respectively. The first arm 11 and 12 connect the first end 101 and the second end 102 as a connection region.
[0022] The following will Figure 1 The Y-direction in which the probe 10 extends is referred to as the "axial direction" of the probe 10. The first end 101 and the second end 102 are the ends on both sides of the axial direction of the probe 10, respectively. Furthermore, the X-direction in which the first arm 11 and the second arm 12 are arranged is referred to as the "width direction" of the probe 10. The width direction is perpendicular to the axial direction. And the Z-direction, which is perpendicular to both the Y and X directions, is referred to as the "thickness direction" of the probe 10.
[0023] like Figure 1 As shown, the first arm 11 and the second arm 12 are arranged side by side in the width direction, forming a first slit 13 between them. Additionally, at the first end 101 and the second end 102, a second slit 14 is formed axially in the connecting area, with a width distance (hereinafter also referred to as the "opening width") narrower than the first slit 13. The first slit 13 and the second slit 14 communicate with each other. The first slit 13 and the second slit 14 penetrate the probe 10 in the thickness direction. The second slit 14 is formed at both the first end 101 and the second end 102 of the probe 10.
[0024] Figure 2 Indicates will Figure 1 A magnified 3D view of the connected region shown in area A. (See image below.) Figure 2 As shown, the opening width of the first slit 13 (hereinafter also referred to as "first opening width W1") is wider than the opening width of the second slit (hereinafter also referred to as "second opening width W2"). When viewed in the thickness direction, the second slit 14 is disposed in the middle region between the first arm 11 and the second arm 12. In other words, the second slit 14 communicates with the first slit 13 at the regions where it is separated from the first arm 11 in the same connecting region and from the second arm 12 in the connecting region.
[0025] like Figure 3 As shown, the side surface of the second slit 14 in the cross section along the width direction (referred to as "second side surface D2") is formed into a slope shape that intersects with an inclination relative to the width direction and the thickness direction. The angle between the second side surface D2 of the second slit 14 and the width direction is defined as "second side surface angle α2".
[0026] Moreover, such as Figure 4 As shown, the side surface of the end of the second slit 14 in the cross section along the axial direction (referred to as "second end face T2") is formed into a slope shape that intersects with respect to the axial and thickness directions. The angle between the second end face T2 of the second slit 14 and the axial direction is defined as "second end face angle β2".
[0027] In addition, such as Figure 3As shown, the angle between the side surface of the first slit 13 (referred to as "first side surface D1") in the cross-section along the width direction and the width direction is defined as "first side surface angle α1". Figure 3 As shown, the angle α1 of the first side surface is greater than the angle α2 of the second side surface. In other words, the first side surface D1 is formed to be closer to being perpendicular to the width direction than the second side surface D2. For example, the first side surface D1 can also be perpendicular to the width direction. In other words, the first side surface D1 can also be parallel to the thickness direction.
[0028] In addition, such as Figure 5 As shown, the angle between the side surface of the end of the first slit 13 in the cross-section along the axial direction (labeled "first end face T1") and the axial direction is defined as "first end face angle β1". Figure 4 and Figure 5 As shown, the angle β1 of the first end face is larger than the angle β2 of the second end face. In other words, the first end face T1 is formed to be more perpendicular to the axial direction than the second end face T2. For example, the first end face T1 can also be perpendicular to the axial direction. In other words, the first end face T1 can also be parallel to the thickness direction.
[0029] The probe 10 can also be formed by patterning the substrate, which is the material of the probe 10, into a predetermined shape through an etching process. For example, a probe 10 integrating the first arm 11, the second arm 12, and the connection area can be manufactured by a wet etching method using an etching mask. By using a wet etching method to etch the substrate with an etching solution, multiple probes 10 can be cut from one substrate simultaneously. In addition, the first slit 13 can be formed by this wet etching method. That is, the first slit 13 can also be formed simultaneously when the probe 10 is cut from the substrate.
[0030] However, when the first slit 13 is formed by etching with an etchant, the amount of etchant sometimes differs between the upper and lower surfaces of the substrate. Therefore, the etching rate differs between the upper and lower surfaces of the substrate, and the sides of the first slit 13 (first side surface D1 and first end surface T1) are sometimes formed as sloping shapes that are not perpendicular to the width direction and axial direction. However, when the first slit 13 is formed using a wet etching method, the first side surface D1 and the first end surface T1 of the first slit 13 are formed approximately perpendicular to the width direction and axial direction.
[0031] The width of the first opening, W1, can be, for example, about 10 μm to tens of μm. On the other hand, the width of the second opening, W2, can be about several μm. Thus, since the width of the second opening, W2, is relatively narrow, it is difficult to form the second slit 14 by wet etching. Therefore, the second slit 14 is formed, for example, by irradiating the connection area of the probe 10 with a laser (hereinafter also referred to as "laser processing"). The axial length of the second slit 14 is, for example, about tens to hundreds of μm.
[0032] The second slit 14 is formed using laser processing. The second side surface D2 of the second slit 14 is formed into a slope shape that intersects with an inclination relative to the width direction, and the second end face T2 is formed into a slope shape that intersects with an inclination relative to the axial direction. The angle α2 of the second side surface and the angle β2 of the second end face can also be approximately the same. The second side surface D2 and the second end face T2 of the second slit 14 can also be formed continuously by laser processing in the same step.
[0033] As described above, the first slit 13 is formed by wet etching, and the second slit 14 is formed by laser processing. As a result, in the cross-section along the width direction of the probe 10, the second side angle α2 is smaller than the first side angle α1. Similarly, in the cross-section along the axial direction of the probe 10, the second end face angle β2 is smaller than the first end face angle β1.
[0034] exist Figure 1 In the probe 10 shown, tip members 15 are disposed at the first end 101 and the second end 102. The tip members 15 extend from the connection region in a direction opposite to the direction in which the first arm 11 and the second arm 12 extend. In other words, the tip members 15 protrude from the tips of the first end 101 and the second end 102. The tip members 15 are made of a material with a higher hardness than the first end 101 and the second end 102.
[0035] As described below, during the inspection of an object using probe 10, the tip member 15 of the first end 101 contacts the object. By positioning the tip member 15, which has a higher hardness than the first end 101, at the tip of the first end 101, wear on the first end 101 can be suppressed. The materials for the first end 101, the second end 102, the first arm 11, and the second arm 12 can be, for example, nickel (Ni), nickel alloys, etc. The material for the tip member 15 can be, for example, rhodium (Rh), rhodium alloys, etc.
[0036] The following is for reference Figure 6 The description includes an electrical connection device 1 containing probe 10. The electrical connection device 1 is used to inspect the characteristics of an object 2. The object 2 is, for example, a semiconductor integrated circuit formed on a semiconductor substrate.
[0037] The electrical connection device 1 includes a probe head 200 that holds probes 10 with the first end 101 facing the object to be inspected 2 and a wiring board 300. The number of probes 10 held by the probe head 200 can be arbitrarily set according to the number of terminals of the object to be inspected 2, the number of objects to be inspected simultaneously, etc.
[0038] The tip member 15 disposed at the second end 102 of the probe 10 is electrically connected to the pad 310 disposed on the wiring substrate 300. The pad 310 is made of a conductive material such as metal, and the inspection device (not shown) such as the tester is electrically connected to the pad 310. The electrical signal is transmitted between the inspection device and the object to be inspected 2 via the electrical connection device 1. The wiring substrate 300 is, for example, a printed circuit board (PCB) or an interposer (IP) substrate.
[0039] The probe head 200 has multiple guide plates, each having a through hole (hereinafter also referred to as a "guide hole") through which the probe 10 passes. Figure 6 The probe head 200 shown has a bottom guide plate 210, a top guide plate 220, and an intermediate guide plate 230 disposed between the bottom guide plate 210 and the top guide plate 220. The bottom guide plate 210 faces the object 2 being inspected. The top guide plate 220 faces the wiring substrate 300. The intermediate guide plate 230 is disposed near the bottom guide plate 210. By distributing a spacer 240 between the outer edge regions of the bottom guide plate 210 and the top guide plate 220, a hollow region 250 is formed inside the probe head 200 between the top guide plate 220 and the intermediate guide plate 230. The probe head 200 is made of materials such as ceramic.
[0040] When viewed from the surface normal of the main surface of the guide plate, the position of the guide hole in the top guide plate 220 through which the same probe 10 passes is offset from the positions of the guide holes in the bottom guide plate 210 and the middle guide plate 230 in a direction parallel to the main surface. This configuration of guide holes is also called an "offset configuration". With the offset configuration, the probe 10 bends through elastic deformation in the hollow region 250. Therefore, when in contact with the object to be inspected 2, the probe 10 is bent, and the probe 10 contacts the object to be inspected 2 with a specified pressing force.
[0041] Figure 6 The electrical connection device 1 shown is a vertically moving probe card. The electrical connection device 1 and the object to be inspected 2 move relative to each other, and the top member 15 disposed at the first end 101 of the probe 10 contacts the object to be inspected 2. Figure 6 This indicates that probe 10 is not in contact with the object 2 being inspected.
[0042] By bringing the probe 10 into contact with the object to be inspected 2 and applying a load to the probe 10, the probe 10 contacts the object to be inspected 2 in a bent state. Based on the probe 10, whose first arm 11 and second arm 12 are arranged side-by-side in the width direction, the pressing force of the probe 10 in contact with the object to be inspected 2 can be adjusted to a predetermined value. For example, the pressing force of the probe 10 in contact with the object to be inspected 2 can also be adjusted by setting the spacing between the first arm 11 and the second arm 12 along the width direction, and the axial length of the first slit 13.
[0043] When the probe 10 is bent, stress is concentrated at the end of the first slit 13 formed between the first arm 11 and the second arm 12. In other words, stress is concentrated in the connection area where the first arm 11 and the second arm 12 are connected.
[0044] However, with the probe 10 having the second slit 14 formed in the connection region, the stress in the connection region is dispersed. Therefore, the stress concentration at the end of the first slit 13 can be mitigated in the probe 10.
[0045] Furthermore, when the probe 10 bends, the first arm 11 and the second arm may come into contact at the second slit 14. However, the sides of the first arm 11 and the second arm 12 opposite each other at the second slit 14 are sloped. Therefore, when viewed axially, the side of the first arm 11 and the side of the second arm 12 are in point contact. Moreover, in the case where the first arm 11 and the second arm 12 come into contact at the second slit 14, as... Figure 7 As shown, the portion of the side of the first arm 11 closest to the second arm 12 is offset in the thickness direction from the portion of the side of the second arm 12 closest to the first arm 11. Therefore, according to the probe 10, compared to the case where the sides of the first arm 11 and the second arm 12 are in surface contact, the pressure applied to the first arm 11 and the second arm 12 can be reduced. As a result, breakage of the probe 10 can be suppressed.
[0046] As explained above, in the probe 10 of this embodiment, a second slit 14 is formed at the end of the first slit 13, i.e., the connection region. By forming a second slit 14 that communicates with the first slit 13 in the connection region, stress concentration at the connection region when the probe 10 is bent can be mitigated. Therefore, damage to the probe 10 caused by stress concentration at the end of the first slit 13 can be suppressed.
[0047] (Other implementation methods)
[0048] As described above, the present invention has been described through embodiments, but it should not be construed as limiting the invention to the extent that the discussion and drawings constitute a part of this disclosure. Various alternative embodiments, examples, and techniques will become apparent to those skilled in the art based on this disclosure.
[0049] For example, the above example shows an instance where the second slit 14 is formed at both the first end 101 and the second end 102. However, when the probe 10 bends, the first end 101, which is in contact with the object under inspection 2, experiences greater stress compared to the second end 102 connected to the pad 310. Therefore, the second slit 14 may be formed only at the first end 101. Furthermore, the case where the tip member 15 is provided at both the first end 101 and the second end 102 has been described, but the tip member 15 may also be provided at only one end. For example, the tip member 15 may be provided only at the first end 101, so that the connection area of the second end 102 contacts the pad 310. Alternatively, the tip member 15 may not be provided at either the first end 101 or the second end 102.
[0050] Thus, the present invention naturally includes various embodiments not described above.
[0051] Explanation of reference numerals in the attached figures
[0052] 10. Probe; 11. First arm; 12. Second arm; 13. First slit; 14. Second slit; 15. Top member; 101. First end; 102. Second end.
Claims
1. A probe used for inspecting the electrical properties of an object, wherein, The probe includes: The first end and the second end are axial ends, respectively; and The first and second arms, which are columnar in shape, are arranged side by side in a width direction perpendicular to the axial direction, forming a first slit between them, and extend from the first end to the second end, respectively. The first arm and the second arm connect the first end and the second end to each other as a connecting area. At least one of the first end and the second end has a second slit formed in the connecting region along the axial direction in a manner communicating with the first slit. The second slit has an opening width in the width direction that is narrower than that of the first slit. The side of the second slit in the cross section along the width direction is formed into a slope shape that intersects obliquely with respect to the width direction.
2. The probe according to claim 1, wherein, The side surface of the second slit in the cross section along the axial direction is formed into a slope shape that intersects obliquely with respect to the axial direction.
3. The probe according to claim 1 or 2, wherein, In the cross-section of the first slit along the width direction, the angle between the side of the first slit and the width direction is greater than the angle between the side of the second slit and the width direction.
4. The probe according to claim 1 or 2, wherein, In the cross-section along the axial direction of the first slit, the angle between the side of the first slit and the axial direction is greater than the angle between the side of the second slit and the axial direction.
5. The probe according to claim 1 or 2, wherein, The second slit is formed at both the first end and the second end.
6. The probe according to claim 1 or 2, wherein, The second slit communicates with the first slit at the regions where it is separated from the connection position of the first arm and the connection position of the second arm of the connecting region, respectively.
7. The probe according to claim 1 or 2, wherein, A top end member is provided at the first end, the top end member being made of a material with a higher hardness than the first end and extending from the connection region in a direction opposite to the direction in which the first arm and the second arm extend. The second slit is formed at the first end.
Citation Information
Patent Citations
Electrical connection device
JP2020143976A