Substrate connecting device

Abstract

The invention provides a substrate connecting device, which comprises a lifting structure, a mounting structure, at least one separation structure and an anti-vibration structure, and is characterized in that the mounting structure comprises a base and a vertical plate; the vertical plate is connected with the base; each separation structure is connected with the base; distances are formed between the separation structures as well as between the separation structures and the vertical plates; the anti-vibration structure is arranged at the top of the vertical plate, and the anti-vibration structure extends to the vertical plate in the horizontal direction, so that the vertical plate and the separation structure can support the anti-vibration structure; the anti-vibration structure, the two adjacent separation structures and the base or the anti-vibration structure, the vertical plate, one separation structure and the base are mutually enclosed to form a moving space; a through hole is formed in the anti-vibration structure, the lifting structure movably penetrates through the through hole, and the lifting structure is movably arranged in the movable space. According to the present invention, the vibration and impact applied to the stage can be reduced, and the horizontal state of the provided process chamber can be maintained even in the vibration and impact applied from the lifting unit.

Description

Technical Field

[0001] This application belongs to the technical field of substrate connection device, and specifically relates to a substrate connection device. Background Technology

[0002] Currently, "display substrate" is a general term encompassing substrates for flat panel displays such as LCD, OLED, and PDP. From a manufacturing perspective, a pair of pre-fabricated substrates are bonded together to complete the display substrate. Existing technologies primarily involve supporting and arranging a pair of pre-fabricated substrates on opposing platforms, and then joining the substrates together using a lifting unit connected to the platforms. Simultaneously, the lifting unit connecting the platform is located in a drive cavity at the bottom of the process chamber, allowing for lifting operations during substrate alignment and joining.

[0003] However, the vibrations and impacts generated during the lifting operation of the lifting unit can be transmitted to the stage, the shaft of the lifting unit, and the drive cavity. This vibration and impact can then be transmitted to the substrate on the platform, causing the aligned substrate to shift, potentially leading to errors in the substrate bonding position. Furthermore, vibrations and impacts from lifting units at multiple different positions are transmitted to the drive cavity. Therefore, during substrate bonding, imbalances in the drive cavity, such as cavity deformation, may occur, causing the stage to become uneven in the horizontal direction, resulting in poor substrate bonding.

[0004] Therefore, how to provide a substrate connection device that can reduce the vibration and impact applied to the stage and maintain the horizontal state of the set process cavity even in the vibration and impact applied from the lifting unit has become an urgent problem for those skilled in the art. Summary of the Invention

[0005] Therefore, the technical problem to be solved by this application is to provide a substrate connection device that can reduce the vibration and impact applied to the stage, and maintain the horizontal state of the set process cavity even in the vibration and impact applied from the lifting unit.

[0006] To address the aforementioned problems, this application provides a substrate interconnection device, comprising: Lifting structure; The mounting structure includes a base and a vertical plate; the vertical plate is connected to the base. At least one partition structure; each partition structure is connected to the base; there are distances between each partition structure and between the partition structure and the vertical plate; The vibration damping structure is located at the top of the vertical plate and extends horizontally to the vertical plate so that the vertical plate and the partition structure can support the vibration damping structure. The vibration damping structure, together with two adjacent partition structures and the base, or the vibration damping structure, the vertical plate, one of the partition structures, and the base, enclose each other to form an active space. The vibration damping structure is provided with through holes, through which the lifting structure can be movably passed, and the lifting structure can be movably installed within the active space.

[0007] Furthermore, a buffer structure is installed within the activity space to buffer and reduce vibration of the lifting structure.

[0008] Furthermore, the buffer structure includes buffer protrusions, and the number of buffer protrusions is set to at least one; when the number of buffer protrusions is set to two or more, the two or more buffer protrusions form a continuous protrusion.

[0009] Furthermore, the buffer protrusion is a hemispherical protrusion; And / or, the cushioning protrusions protrude in a direction away from the base; And / or, buffer protrusions are evenly distributed on the outer periphery of the lifting structure.

[0010] Furthermore, the buffer protrusion includes at least one group; when the buffer protrusion includes two or more groups, the two or more groups of buffer protrusions are arranged sequentially in the direction away from the lifting structure, and each buffer protrusion in each group is arranged sequentially around the circumference of the lifting structure.

[0011] Furthermore, the vertical plate is provided with mounting holes that are adapted to the size and shape of the vibration damping structure. The vibration damping structure extends into the mounting holes so that the vertical plate can support the vibration damping structure.

[0012] Furthermore, the vertical plates are side plates, and the side plates surround and enclose the base to form a space; the vertical plates are set within the space; the vibration damping structure is simultaneously set on all the vertical plates and all the partition structures in the horizontal direction.

[0013] Furthermore, the substrate connection device also includes a first stage; a lifting structure is connected to the first stage, and the first stage is used to support the first substrate; the substrate connection device also includes a second stage, which is positioned corresponding to the first stage, and is used to support the second substrate.

[0014] Furthermore, the substrate connection device also includes a first substrate stage and a second substrate stage, wherein the first substrate stage is disposed on the first carrier stage; the first substrate stage is used to mount the first substrate, and the second substrate stage is used to mount the second substrate.

[0015] Furthermore, a first adhesive device is provided on the first substrate for attaching the first substrate; a second adhesive device is provided on the second substrate for attaching the second substrate.

[0016] The substrate connection device provided in this application can reduce the vibration and impact applied to the stage, and can maintain the horizontal state of the set process cavity even under vibration and impact applied from the lifting unit. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the substrate connection device of this application.

[0018] Figure 2 This is a schematic diagram of the lifting structure of this application.

[0019] Figure 3 This is a schematic diagram of the buffer structure of the lifting structure of this application.

[0020] Figure 4 This is a schematic diagram of the buffer structure of this application.

[0021] Figure 5 This is a sequence diagram of the substrate processing method of this application.

[0022] Figure 6 This is a flowchart of the substrate processing method of this application; Figure 7 This is a schematic diagram of the substrate connection device of this application; Figure 8 This is a schematic diagram of the substrate connection device of this application; Figure 9 This is a schematic diagram of the substrate connection device of this application. Implementation

[0023] See also Figure 1-9 As shown, a substrate connection device includes a lifting structure, a mounting structure, at least one partition structure, and a vibration damping structure. The mounting structure includes a base and a vertical plate; the vertical plate is connected to the base; each partition structure is connected to the base; there are distances between each partition structure and between the partition structure and the vertical plate; the vibration damping structure is disposed on the top of the vertical plate and extends horizontally to the vertical plate so that the vertical plate and the partition structure can support the vibration damping structure; the vibration damping structure and two adjacent partition structures and the base, or the vibration damping structure, the vertical plate, one of the partition structures, and the base, mutually enclose to form an active space; the vibration damping structure is provided with a through hole, through which the lifting structure can be movably passed, and the lifting structure can be movably disposed within the active space.

[0024] This application can reduce the vibration and impact applied to the stage, and provide the ability to maintain the level of the set process cavity even under the vibration and impact applied from the lifting unit; The system includes a substrate stage drive cavity and a substrate processing apparatus including the substrate stage. The substrate stage is housed within a process cavity body, and the main body is supported on its bottom surface. A plurality of lifting units, which raise and lower the substrate stage, are axially connected to the substrate stage and extend from the bottom surface of the main body along the length of each lifting unit. These lifting units are respectively housed at the upper ends of multiple lifting spaces. A vibration damping plate is supported on the sidewalls to prevent vibrations generated during the lifting operations of the lifting units from being applied to the process cavity. Therefore, vibrations and impacts applied to the stage can be reduced, and a set horizontal state can be maintained under vibration and impact, thereby improving the yield of display substrates and enabling the manufacture of high-quality display substrates. A partition structure forms a partition wall.

[0025] This application also discloses some embodiments in which a buffer structure is provided in the activity space, and the buffer structure is used to buffer and reduce vibration of the lifting structure.

[0026] This application also discloses some embodiments in which the buffer structure includes buffer protrusions, and the number of buffer protrusions is set to at least one; when the number of buffer protrusions is set to two or more, the two or more buffer protrusions form a continuous protrusion.

[0027] This application also discloses some embodiments in which the buffer protrusion is a hemispherical protrusion; And / or, the cushioning protrusions protrude in a direction away from the base; And / or, buffer protrusions are evenly distributed on the outer periphery of the lifting structure.

[0028] This application also discloses some embodiments, wherein the buffer protrusion includes at least one group; when the buffer protrusion includes two or more groups, the two or more groups of buffer protrusions are arranged sequentially in the direction away from the lifting structure, and each buffer protrusion in each group is arranged sequentially around the circumference of the lifting structure.

[0029] This application also discloses some embodiments in which mounting holes are provided on the vertical plate, the mounting holes being adapted to the size and shape of the vibration damping structure, and the vibration damping structure extending into the mounting holes so that the vertical plate can support the vibration damping structure.

[0030] This application also discloses some embodiments in which the vertical plate is a side plate, and the side plate surrounds and encloses the base to form a space; the vertical plate is disposed in the space; and the vibration damping structure is disposed on all the vertical plates and all the partition structures in the horizontal direction.

[0031] This application also discloses some embodiments, in which the substrate connection device further includes a first stage; a lifting structure is connected to the first stage, and the first stage is used to support the first substrate; the substrate connection device further includes a second stage, which is positioned corresponding to the first stage, and the second stage is used to support the second substrate.

[0032] This application also discloses some embodiments, in which the substrate connection device further includes a first substrate stage and a second substrate stage, the first substrate stage being disposed on a first carrier stage; the first substrate stage is used to mount the first substrate, and the second substrate stage is used to mount the second substrate.

[0033] This application also discloses some embodiments in which a first adhesive device is provided on a first substrate for attaching the first substrate; and a second adhesive device is provided on a second substrate for attaching the second substrate.

[0034] In this invention, the substrate stage driving cavity includes: a main body supporting a process cavity disposed inside the substrate stage; a bottom surface of the main body supported inside the main body; a plurality of lifting units axially connected to the substrate stage for raising and lowering the substrate stage; and a plurality of partition walls extending from the bottom of the main body along the length direction of the lifting units to form accommodating spaces for the plurality of lifting units respectively; and the upper edge regions of the plurality of partition walls being supported on the side walls of the main body, thereby generating vibration-resistant processes in the lifting units. The vibration damping plate may include an extension extending from the edge region of the vibration damping plate into the interior of the side wall of the main body. During the raising and lowering operation of the lifting units, the extension suppresses the main body from changing due to vibration, thereby maintaining the levelness of the process cavity. The extension passes through the side wall of the main body, causing the side wall of the main body to separate from the vibration damping plate. The lifting unit may include a support frame extending from the accommodating space and connected to the substrate stage, a drive frame that contacts the lower end of the support frame to lift the support frame, and a buffer portion that allows the contact surfaces of the support frame and the drive frame to make multi-faceted contact so as to alleviate vibrations applied to the substrate stage during the contact between the support frame and the drive frame.

[0035] The aforementioned buffer structure may include a plurality of buffer protrusions protruding from the upper end of the aforementioned drive frame, which is opposite to the lower end of the aforementioned support frame, toward the aforementioned support frame.

[0036] The aforementioned protrusion can be configured as a hemispherical shape protruding into the aforementioned support frame.

[0037] The aforementioned multiple buffer protrusions can be uniformly formed on the front surface of the upper end of the aforementioned drive frame.

[0038] The aforementioned multiple buffer protrusions can be evenly arranged in the upper edge region of the aforementioned drive frame.

[0039] The aforementioned lifting unit can guide the lifting of the support frame and drive frame from the outside of the support frame and drive frame, and further includes features for preventing the support frame and drive frame from lifting. The guide section of the drive frame is deviated.

[0040] The aforementioned buffer structure may include a plurality of buffer protrusions extending from the lower end of the aforementioned support frame toward the aforementioned drive frame.

[0041] The substrate processing apparatus according to the present invention includes a process cavity disposed inside a substrate stage and a lower part of the process cavity, a drive cavity supporting the process cavity, and The aforementioned drive cavity is internally supported on its bottom surface and is axially connected to the aforementioned substrate stage, enabling multiple lifting units to raise and lower the aforementioned substrate stage, and the drive cavity is also supported by these units. The bottom surface of the cavity extends along the length of the aforementioned lifting unit, forming multiple partitions that respectively accommodate the receiving spaces of the multiple lifting units and the upper surface of the aforementioned partitions. The end, on the side wall supporting the aforementioned drive cavity in the edge region, provides a vibration damping process to prevent vibration during the operation of the aforementioned lifting unit. The aforementioned vibration damping plate may include an extension that extends from the edge region of the vibration damping plate into the interior of the side wall of the drive cavity.

[0042] During the lifting operation of the lifting unit, the extension suppresses the deformation of the drive cavity due to the vibration, thereby maintaining the levelness of the process cavity.

[0043] The aforementioned extension passes through the side wall of the main body, thereby separating the side wall of the main body from the aforementioned vibration damping plate.

[0044] The lifting unit may include a support frame extending from the accommodating space and connected to the substrate stage, a drive frame that contacts the lower end of the support frame to lift the support frame, and a buffer portion that allows the contact surfaces of the support frame and the drive frame to make multi-faceted contact so as to alleviate the vibration applied to the substrate stage during the contact between the support frame and the drive frame.

[0045] The aforementioned buffer structure may include a plurality of buffer protrusions protruding from the upper end of the aforementioned drive frame, which is opposite to the lower end of the aforementioned support frame, toward the aforementioned support frame.

[0046] The aforementioned protrusion can be configured as a hemispherical shape protruding into the aforementioned support frame.

[0047] The aforementioned multiple buffer protrusions can be uniformly formed on the front surface of the upper end of the aforementioned drive frame.

[0048] The aforementioned multiple buffer protrusions can be evenly arranged in the upper edge region of the aforementioned drive frame.

[0049] The aforementioned lifting unit can guide the lifting and lowering of the support frame and drive frame from the outside of the support frame and drive frame, and further includes a guide portion for preventing the support frame and drive frame from deviating. The aforementioned buffer structure may include multiple buffer protrusions protruding from the lower end of the support frame and drive frame. Figure 1 This is a simplified diagram illustrating a substrate processing apparatus according to this embodiment. Figure 2 This is a simplified illustration of the substrate stage lifting unit of the substrate processing apparatus according to this embodiment. Figure 2 This is a simplified diagram showing the substrate stage lifting unit of the substrate processing apparatus according to this embodiment. Additionally, Figure 3 This is a plan view showing the buffer structure of the substrate stage lifting unit according to this embodiment.

[0050] like Figures 1 to 3 As shown, the substrate processing apparatus according to this embodiment can be configured as a substrate bonding apparatus 100 for substrate bonding. However, this is just one embodiment for illustrating this embodiment, and the substrate processing apparatus can be configured with various apparatuses such as a substrate deposition apparatus and a substrate etching apparatus.

[0051] On the other hand, the substrate bonding apparatus 100 may include a process cavity 200 and a drive cavity 300.

[0052] First, a process area for substrate bonding is formed inside the process cavity 200. Here, the process cavity 200 may include an upper cavity 210 and a lower cavity 230. The upper cavity 210 forms the upper region of the process cavity 200 and may be provided with an upper platform 211 for supporting the first substrate S1 introduced into the process cavity 200. A first substrate support portion 211a for supporting the upper surface of the first substrate S1 is mounted on the upper platform 211.

[0053] The first substrate support 211a may be provided with a variety of adhesion devices for adhering the first substrate S1, or adsorption devices for adsorbing the first substrate S1, and the shape of the first substrate support 211a is not limited.

[0054] The lower cavity 230 forms the lower region of the process cavity 200. Here, the lower cavity 230 is connected to the cavity lifting unit 220, and the spacing distance between it and the upper cavity 210 can be adjusted. Therefore, the lower cavity 230 is separated from the upper cavity 210 from the substrate entry and exit, forming the substrate entry and exit path, and is in close contact with the upper cavity 210 during substrate bonding, forming a process environment inside the process cavity 200.

[0055] In this lower cavity 230, a lower stage 231 for supporting the second substrate S2 introduced into the process cavity 200 can be installed. A second substrate support portion 231a for supporting the lower surface of the second substrate S2 can be provided on the lower stage 231.

[0056] Here, the second substrate support portion 231a may be provided with various adhesion devices for adhering the second substrate S2, or adsorption devices for adsorbing the second substrate S2, and the shape of the second substrate support portion 231a is not limited.

[0057] Additionally, the lower stage 231 may be equipped with a lifting pin 231c for placing the second substrate S2 on the lower stage 231 during substrate input, or for separating the second substrate S2 from the lower stage 231. Here, the lifting pin 231c may be configured as a lifting module 231cc for lifting multiple support pins 231ca that penetrate the lower stage 231 and the support pins 231ca. Furthermore, the process cavity 200 may be equipped with a camera 250 and a light source 270. The camera 250 may be arranged on the upper part of the upper cavity 210.

[0058] Here, the camera 250 can observe the interior of the process cavity 200 through the imaging hole formed in the upper cavity 210. The camera 250 can capture alignment marks that can be formed on the first and second substrates S1 and S2 respectively, to observe whether the first and second substrates S1 and S2 are located at the correct bonding points.

[0059] In addition, the light source 270 is located on the upper part of the upper cavity 210, and illuminates the interior of the process cavity 200 through an illumination hole formed on the upper cavity 210. Therefore, when the camera 250 photographs the sorting marks, it can accurately observe the alignment marks based on the light illuminating the interior of the process cavity 200.

[0060] On the other hand, the lower stage 231 can align the first and second substrates S1 and S2 with each other based on the signal provided from the camera 250. For example, the lower stage 231 is configured to move the second substrate S2 supported on the upper part to a UVW stage along the x-axis, y-axis and z-axis, and the position of the second substrate S2 can be aligned to correspond to the first substrate S1 based on the alignment signal provided from the camera 250.

[0061] On the other hand, the drive cavity 300 is arranged on the lower side of the process cavity 200. The drive cavity 300 supports multiple lifting units 400 in the arrangement of the second substrate S2 and the combination of the first and second substrates S1 and S2.

[0062] This drive cavity 300 includes a main body 300a. The main body 300a may consist of a lower plate 310 and a side wall 330. On the lower surface of the lower plate 310, a plurality of horizontal displacements 311 supported on the base 10 can maintain the parallel state of the process cavity 200 arranged above the drive cavity 300. And the side wall 330 is arranged between the process cavity 200 and the lower plate 310 to form a space for arranging the lifting unit 400 inside the drive cavity 300.

[0063] Additionally, a support 350 is provided inside the drive cavity 300 to support multiple lifting units 400. The support 350 fixes the position of the lifting units 400 inside the drive cavity 300 and can suppress the transmission of vibrations and impacts generated during the lifting operation of the lifting units 400 to the process cavity 200. This support 350 includes a partition wall 351 and a vibration damping plate 353.

[0064] Multiple partition walls 351 are provided and extend from the bottom surface of the drive cavity 300 along the length direction of the lifting unit 400. Therefore, the partition walls 351 form a receiving space for the lifting unit 400 between the side wall 330 and the partition wall 351 or between the partition walls 351.

[0065] Additionally, the vibration damping plate 353 is mounted on and supported at the upper ends of multiple partition walls 351. Here, the frame area of ​​the vibration damping plate 353 includes an extension 353a extending into the interior of the side wall 330, such that the side wall 330 is vertically separated with respect to the vibration damping plate 353.

[0066] This vibration damping plate 353 prevents vibrations generated from the lifting operation of the lifting unit 400 from being applied to the process cavity 200. For example, during the lifting operation of multiple lifting units 400, vibrations generated by the lifting units 400 can be transmitted to the bottom surface of the main body 300a, and the vibrations transmitted to the bottom surface can be applied to the process cavity 200 supported on the upper part of the main body 300a through the side wall of the main body 300a. However, the side wall of the vibration damping plate 353 can be separated vertically based on the vibration damping plate 353, thereby reducing the vibrations applied upward from the bottom surface of the main body 300a through the side wall 330.

[0067] Furthermore, the vibration damping plate 353 can suppress deformation of the main body 300a due to vibration during the lifting operation of the lifting unit 400. For example, vibrations generated during the lifting operation of multiple lifting units 400 are applied to the sidewalls of the main body 300a adjacent to each lifting unit 400, which can cause flow within the main body 300a itself, resulting in deformation of the main body 300a such as twisting. In particular, the lifting operation of the lifting unit 400 is performed during substrate alignment and substrate bonding processes. Deformation of the main body 300a, i.e., changes in the levelness of the process cavity 200 arranged above the main body 300a, is a fatal drawback due to process errors in the substrate alignment and bonding processes.

[0068] However, the vibration damping plate 353 can not only reduce the vibration applied to the process cavity 200, but also suppress the deformation of the drive cavity 300, thereby enabling the substrate alignment and bonding processes to be performed smoothly.

[0069] On the other hand, multiple lifting units 400 are supported on the support portion 350 respectively, and perform lifting operations together or individually. Such lifting units 400 may include a power unit 410, a drive frame 430, a support frame 450, a guide unit 470, and a buffer unit 490.

[0070] A power unit 410 is disposed at the lower part of the lifting unit 400, generating power for lifting the lower platform 231. Here, the power unit 410 may be configured as a power device such as an electric motor, but this is one embodiment for illustrating this embodiment, and the type of power unit 410 is not limited thereto.

[0071] The drive frame 430 is raised and lowered by power supplied from the power unit 410. Here, the drive frame 430 can be provided in the form of a ball screw, and when the power unit 410 is provided as an electric motor, the drive frame 430 can be raised and lowered based on the rotational force provided from the power unit 410.

[0072] A support frame 450 is disposed on the upper part of the drive frame 430, and the lower platform 231 rises as the drive frame 430 rises. For example, the upper end of the support frame 450 is connected to the lower surface of the lower platform 231, and the lower end is in contact with the upper end of the drive frame 430. At this time, the support frame 450, with one end exposed above the support portion 350, is arranged to penetrate the vibration damping plate 353 and the lower cavity 230, thereby raising the lower cavity 231 as the drive frame 430 rises.

[0073] Furthermore, the guide portion 470 guides the lifting and lowering movements of the drive frame 430 and the support frame 450, preventing them from deviating from each other. For example, the guide portion 470 can be provided in the form of a bushing surrounding the drive frame 430 and the support frame 450, thus guiding their lifting and lowering movements.

[0074] In addition, during the lifting and lowering of the lower platform 231, the buffer section 490 causes the upper end of the drive frame 430 and the lower end of the support frame 450 to come into multi-faceted contact with each other.

[0075] However, the following description states that the buffer portion 490 is formed on the upper end of the drive frame 430, but this is an embodiment for illustrating this embodiment. The buffer portion 490 can be formed on... The lower end of the support frame 450.

[0076] This buffer structure 490 may include a plurality of buffer protrusions protruding from the upper end of the drive frame 430 toward the lower end of the support frame 450. The plurality of buffer protrusions 491 may be formed on the front of the upper end of the drive frame 430, and the upper region in contact with the lower end of the support frame 450 may be arranged in a circular form, such as a hemispherical form.

[0077] This buffer 490 allows the drive frame 430 and the support frame 450 to make multi-faceted contact with each other, thereby reducing the vibration and impact that may occur at the upper end of the drive frame 430 and the lower end of the support frame 450 during the lifting and lowering of the lower platform 231.

[0078] For example, when the drive frame 430 and the support frame 450 come into contact with each other, not only are the vibrations and impacts generated during the contact between the drive frame 430 and the support frame 450 large, but the vibrations and impacts can also be directly applied to the lower stage 231 through the support frame 450. Therefore, an error occurs in the position of the second substrate S2 supported on the lower stage 231, which may result in process errors during the bonding of the first and second substrates S1 and S2.

[0079] However, the buffer structure 490 makes multifaceted contact between the upper end of the drive frame 430 and the lower end of the support frame 450, thereby fundamentally reducing the amount of vibration and impact generated during the contact between the drive frame 430 and the support frame 450. Therefore, the vibration and impact applied to the lower stage 231 can be minimized by the support frame 450, thereby preventing errors in the position of the second substrate S2 supported on the lower stage 231.

[0080] This buffer structure 490 can be made of the same material as the drive frame 430, and when the drive frame 430 and support frame 450 are made of stainless steel respectively, they can be made of the same stainless steel material as described above. In particular, when the buffer portion 490 is a rigid body such as stainless steel, the buffer portion 490 deforms very little in the contact between the drive frame 430 and the support frame 450, thereby suppressing vibration of the frame itself. On the other hand, as... Figure 4 As shown, this buffer portion 490 can only form multiple protrusions 491 in the upper edge region of the drive frame 430. Therefore, the buffer portion 490 can only make the edge regions of the drive frame 430 and the support frame 450 in multi-faceted contact with each other. At this time, the buffer portion 490 formed only in the edge region of the drive frame 430 can not only reduce vibration and impact in the contact between the drive frame 430 and the support frame 450, but also has the advantages of reducing the manufacturing difficulty of the buffer structure 490 and improving manufacturing efficiency during the manufacturing process of the buffer structure 490.

[0081] Additionally, a lifting guide 370 is provided between the vibration damping plate 353 and the process cavity 200. The lifting guide 370 is provided in the form of a bushing that surrounds the upper part of the support frame 450. Therefore, the lifting guide 370 allows the support frame 450 to move smoothly up and down inside, and minimizes the flow of the support frame 450 when it moves up and down.

[0082] Additionally, an exhaust pump 290 can be connected to the process chamber 200, which is used to bond the substrate to the interior of the process chamber 200. The exhaust pump 290 empties the process area, creating a vacuum environment inside the process chamber 200.

[0083] On the other hand, the substrate processing method according to this embodiment will be described in detail below with reference to the accompanying drawings. However, detailed descriptions of the above-described components will be omitted, and they will be described using the same reference numerals.

[0084] Figure 5 This is a flowchart illustrating a substrate processing method according to this embodiment. Figures 6 to 9 This is a process diagram illustrating the substrate processing method according to this embodiment.

[0085] like Figures 5 to 9 As shown, according to the substrate processing method of this embodiment, a substrate bonding process for bonding a pair of pre-manufactured substrates together is described as an example.

[0086] First, in the substrate bonding process, with the upper cavity 210 and the lower cavity 230 spaced apart, the first and second substrates S1 and S2 are introduced into the process cavity 200. At this time, the first substrate S1 is supported on the upper stage 211, and the second substrate S2 is placed on the lower stage 231 S100. See below. Figure 6.

[0087] Subsequently, the exhaust pump 290 can discharge into the process chamber 200, creating a vacuum environment inside the process chamber 200, and the camera 250 can capture images of the sorting marks formed on the first and second substrates S1 and S2, respectively. Here, the lower stage 231 controls the position of the second substrate S2 so that the sorting marks of the first and second substrates S1 and S2 correspond to each other, so that the first and second substrates S1 and S2 are located at the joint point where they are to be joined together.

[0088] Subsequently, the lifting unit 400 raises the lower platform 231, causing the first and second substrates S1 and S2 to engage with each other. Here, from the lifting action of the lifting unit 400, the support frame 450 supporting the lower platform 231 may be in a state where the support claw 451 protruding from the outer diameter of the support frame 450 is supported on the stop 480 on the upper part of the guide portion 470, and is spaced apart from the drive frame 430.

[0089] Subsequently, when the power unit 410 generates power to engage the first and second substrates S1, S2, the drive frame 430 rises toward the support frame 450. Here, the buffer portion 490 reduces vibrations and impacts S200 that may occur during the contact between the drive frame 430 and the support frame 450. (See also...) Figure 7 That is, the buffer portion 490 can fundamentally reduce the vibration and impact applied to the lower stage 231, thereby preventing the position of the second substrate S2 supported on the lower stage 231 from changing due to vibration and impact.

[0090] Furthermore, the vibration damping plate 353 reduces the vibrations generated during the lifting and lowering of the multiple lifting units 400 and applied to the process cavity 200 by the drive cavity 300, and suppresses deformation S300 of the main body 300a, such as twisting, that may occur in the drive cavity 300 according to the lifting and lowering operation of the lifting units 400. Therefore, the first and second substrates S1 and S2 can be bonded together with the vibration damping plate 353 while maintaining the levelness of the process cavity 200. See [link to relevant documentation] Figure 8 After final bonding, the lifting unit 400 lowers the lower platform 231. The transfer robot then removes the first and second substrates S1 and S2 from the process chamber 200 after bonding, ensuring the completion of the bonding process S500. (Refer to...) Figure 9 .

[0091] However, this embodiment describes the lifting unit 400 lifting the lower stage 231 in the combination of the first and second substrates S1 and S2, but the lifting unit 400 can lift the lower stage 231 in the arrangement of the first and second substrates S1 and S2. As described above, the drive cavity and the substrate processing apparatus including the drive cavity can reduce the vibration and impact applied to the stage, and can maintain the set horizontal state under vibration and impact, thereby improving the yield of display substrates and manufacturing high-quality display substrates.

[0092] It will be readily understood by those skilled in the art that the aforementioned advantageous methods can be freely combined and superimposed without conflict.

[0093] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application. The above are merely preferred embodiments of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this application, and these improvements and modifications should also be considered within the protection scope of this application.

Claims

1. A substrate connecting device, characterized by, include: Lifting structure; The mounting structure includes a base and a vertical plate; the vertical plate is connected to the base. At least one partition structure; each of the partition structures is connected to the base; there are distances between each of the partition structures and between each partition structure and the vertical plate; A vibration damping structure is provided at the top of the vertical plate and extends horizontally to the vertical plate, so that the vertical plate and the partition structure can support the vibration damping structure. The vibration damping structure, together with the two adjacent partition structures and the base, or the vibration damping structure, together with the vertical plate, one of the partition structures and the base, forms an active space; the vibration damping structure is provided with a through hole, the lifting structure can move through the through hole, and the lifting structure can be movably disposed within the active space.

2. The substrate connection device according to claim 1, characterized in that, A buffer structure is provided within the activity space to buffer and reduce vibration of the lifting structure.

3. The substrate connection device according to claim 2, characterized in that, The buffer structure includes buffer protrusions, and the number of buffer protrusions is set to at least one; when the number of buffer protrusions is set to two or more, the two or more buffer protrusions form a continuous protrusion.

4. The substrate connection device according to claim 3, characterized in that, The buffer protrusion is a hemispherical protrusion; And / or, the buffer protrusion protrudes in a direction away from the base; And / or, the buffer protrusions are uniformly disposed on the outer periphery of the lifting structure.

5. The substrate connection device according to claim 3, characterized in that, The buffer protrusions include at least one group; when the buffer protrusions include two or more groups, the two or more groups of buffer protrusions are arranged sequentially in the direction away from the lifting structure, and each buffer protrusion in each group is arranged sequentially around the circumference of the lifting structure.

6. The substrate connection device according to claim 1, characterized in that, The vertical plate is provided with mounting holes, which are adapted to the size and shape of the vibration damping structure. The vibration damping structure extends into the mounting holes so that the vertical plate can support the vibration damping structure.

7. The substrate connection device according to claim 1, characterized in that, The vertical plate is a side plate, and the side plate surrounds and encloses the base to form a space; the vertical plate is set in the space; the vibration damping structure is set on all the vertical plates and all the partition structures in the horizontal direction.

8. The substrate connection device according to claim 1, characterized in that, The substrate connection device further includes a first platform; the lifting structure is connected to the first platform, and the first platform is used to support the first substrate; the substrate connection device further includes a second platform, the second platform is positioned corresponding to the first platform, and the second platform is used to support the second substrate.

9. The substrate connection device according to claim 8, characterized in that, The substrate connection device further includes a first substrate stage and a second substrate stage, wherein the first substrate stage is disposed on the first carrier stage; the first substrate stage is used to mount the first substrate, and the second substrate stage is used to mount the second substrate.

10. The substrate connection device according to claim 9, characterized in that, The first substrate is provided with a first adhesive device for attaching the first substrate; the second substrate is provided with a second adhesive device for attaching the second substrate.

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