Heat extraction fan assembly, heat extraction unit and fan motor cooling subsystem

Abstract

The invention relates to a heat extraction fan assembly, a heat extraction unit and a fan motor cooling subsystem. The heat extraction fan assembly may include a set of fan blades. The heat rejection fan assembly may include a fan motor coupled to a set of fan blades via a motor shaft and configured to cause the set of fan blades to: move a first air volume through the heat exchanger; and moving the first air volume through the shroud opening. The heat rejection fan assembly may include a fan motor cooling subsystem configured to cool a fan motor.

Description

Cross-reference to related applications

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 708,037, filed October 16, 2024, pursuant to 35 USC § 119(e), which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to cooling systems, and more specifically to cooling fans for industrial cooling systems. Background Technology

[0003] Industrial cooling systems, such as those used in data centers, often utilize large outdoor heat dissipation units. These units consist of coils that circulate refrigerant and fans that push ambient air against the coils, transferring heat from the coils to the air, which is then propelled away from the heat dissipation unit by the fans. While data centers are typically designed with cooling systems to manage the heat expected to be generated, increases in ambient air temperature (due to local or global warming) and / or increased heat generated by servers, such as increased loads due to AI-based processing, can cause the air temperature inside the condenser (e.g., exhaust air) to rise above normal levels. Elevated air temperatures can reduce the expected lifespan of components in the heat dissipation unit, such as fan motors. One option to address this is to replace the original condenser with a larger capacity one. However, replacing the condenser is expensive and may not fit within the footprint of the original heat dissipation unit.

[0004] Therefore, there is a need to address one or more shortcomings of existing cooling systems and methods. Summary of the Invention

[0005] Therefore, this disclosure relates to a heat dissipation fan assembly, a system, and a method for cooling the heat dissipation fan assembly within a cooling system.

[0006] In some embodiments, the technology described herein relates to a heat dissipation fan assembly comprising: a set of fan blades; a fan motor connected via a motor shaft to the set of fan blades and configured to cause the set of fan blades to: move a first air volume through a heat exchanger; and move the first air volume through a shroud opening; and a fan motor cooling subsystem configured to cool the fan motor.

[0007] In some embodiments, the technology described herein relates to a heat dissipation unit comprising: a shroud including a shroud opening; a heat dissipation coil disposed within the shroud; and a heat dissipation fan assembly comprising: a set of fan blades; a fan motor connected via a motor shaft to the set of fan blades and configured to cause the set of fan blades to: move a first air volume through a heat exchanger; and move the first air volume through the shroud opening; and a fan motor cooling subsystem configured to cool the fan motor.

[0008] In some embodiments, the technology described herein relates to a fan motor cooling subsystem for a heat dissipation fan assembly configured to move a first air volume through a heat exchanger including a coolant inlet conduit comprising: a second air volume outlet disposed near the fan motor; and a second air volume inlet disposed at a second air volume, wherein the second air volume moves from the second air volume inlet to the second air volume outlet and cools the fan motor.

[0009] In some embodiments, the technology described herein relates to a method for controlling the operating temperature of a fan motor within a cooling system, the method comprising: receiving a temperature measurement from a sensor within the cooling system; determining whether the temperature measurement is above a threshold; and activating a coolant pump if the temperature measurement is above the threshold.

[0010] It should be understood that both the foregoing general description and the following detailed description are exemplary and illustrative only, and are not intended to limit this disclosure. The subject matter of this disclosure is illustrated in conjunction with the accompanying drawings, which are included and form part of this specification. Together, the specification and drawings serve to explain the principles of this disclosure. Attached Figure Description

[0011] Specific embodiments are described with reference to the accompanying drawings. The use of the same reference numerals in different instances in the specification and drawings may indicate similar or identical items. Various embodiments or examples (“Examples”) of this disclosure are disclosed in the specific embodiments and drawings. The drawings are not necessarily drawn to scale. Generally, unless otherwise provided in the claims, the operations of the disclosed processes can be performed in any order.

[0012] Figure 1A A perspective view of a cooling system according to one or more embodiments of the present disclosure is shown.

[0013] Figure 1B A simplified schematic cross-sectional view of a cooling system according to one or more embodiments of the present disclosure is shown.

[0014] Figure 2A The illustration shows a cross-sectional view of a heat dissipation fan assembly within a cooling system according to one or more embodiments of the present disclosure.

[0015] Figure 2B The illustration shows a cross-sectional view of a heat dissipation fan assembly within a cooling system according to one or more embodiments of the present disclosure.

[0016] Figure 2C The illustration shows a cross-sectional view of a heat dissipation fan assembly within a cooling system according to one or more embodiments of the present disclosure.

[0017] Figure 2D The illustration shows a cross-sectional view of a heat dissipation fan assembly within a cooling system according to one or more embodiments of the present disclosure.

[0018] Figure 2E The illustration shows a cross-sectional view of a heat dissipation fan assembly within a cooling system according to one or more embodiments of the present disclosure.

[0019] Figure 3A A simplified cross-sectional view of a cooling system including a coolant inlet pipe according to one or more embodiments of the present disclosure is shown.

[0020] Figure 3B The illustration shows a front view of a set of fan blades for a heat dissipation fan assembly according to one or more embodiments of the present disclosure.

[0021] Figure 4 The illustration shows a block diagram depicting a cooling system according to one or more embodiments of the present disclosure.

[0022] Figure 5 The illustration shows a process flow diagram depicting a method for controlling the operating temperature of a fan motor in a cooling system according to one or more embodiments of the present disclosure. Detailed Implementation

[0023] Before explaining one or more embodiments of this disclosure in detail, it should be understood that the embodiments, in their application, are not limited to the details of the construction and arrangement of the components, steps, or methods set forth in the following description or illustrated in the accompanying drawings. In the following detailed description of the embodiments, many specific details may be set forth to provide a more thorough understanding of this disclosure. However, it will be readily understood by those skilled in the art who will benefit from this disclosure that the embodiments disclosed herein can be practiced without some of these specific details. In other instances, well-known features may not be described in detail to avoid unnecessarily complicating this disclosure.

[0024] As used herein, the letters following the reference numerals are intended to indicate embodiments of features or elements that may be similar to, but not necessarily identical to, previously described elements or features having the same reference numerals (e.g., 1, 1a, 1b). Such shorthand symbols are used for convenience only and should not be construed as limiting this disclosure in any way unless expressly stated otherwise.

[0025] Furthermore, unless explicitly stated otherwise, "or" refers to an inclusive "or," not an exclusive "or." For example, conditions A or B are satisfied by either of the following: A is true (or exists) and B is false (or does not exist); A is false (or does not exist) and B is true (or exists); and both A and B are true (or exist).

[0026] Additionally, the terms "a" or "an" may be used to describe elements and components of the embodiments disclosed herein. This is done for convenience only, and "a" and "an" are intended to include "one" or "at least one," and the singular forms also include the plural, unless it is obvious otherwise.

[0027] Finally, as used herein, any reference to “one embodiment” or “implementation” means that a particular element, feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment disclosed herein. The phrase “in an embodiment” appearing in various places throughout this specification does not necessarily refer to the same embodiment, and an embodiment may include one or more features explicitly described or inherent in this document, or any combination or sub-combination of two or more such features, as well as any other features that may not necessarily be explicitly described or inherent in this disclosure.

[0028] The subject matter disclosed will now be described in detail with reference to the figures shown in the accompanying drawings.

[0029] A fan motor cooling subsystem and a method for using the fan motor cooling subsystem are disclosed. The fan motor cooling subsystem can be integrated within a fan, such as within a heat dissipation fan assembly. It can also be integrated into a cooling system, such as a heat dissipation unit. The fan motor cooling subsystem may include components that separate exhaust air (e.g., a first air volume) that has been warmed by exposure to a heat exchanger from "fresh" air (e.g., a second air volume) that has not yet been exposed to the heat exchanger. For example, the second air volume may include air that has not yet moved through the heat exchanger. The fan motor cooling subsystem may also include active cooling components for cooling the fan motor, such as a circulating coolant.

[0030] The embodiments disclosed herein are particularly advantageous because the fan motor cooling subsystem cools the fan motor, thereby reducing motor temperature and increasing expected motor life. Embodiments can also be implemented without requiring changes to fan size or output. The fan motor cooling subsystem is novel because it provides a separate cooling airflow to the fan motor, rather than relying on the main airflow, as current cooling systems use the main airflow to cool the fan motor.

[0031] As used herein, the term "heat removal unit" refers to any type of device, system, or system component that removes heat from a refrigerant, fluid, or space and transfers that heat to the surrounding environment (e.g., air or water). For example, a heat removal unit may include, but is not limited to, air-cooled condensers, water-cooled condensers, cooling towers, dry coolers, and evaporative condensers. For instance, while embodiments herein may illustrate a heat removal fan assembly within an air-cooled condenser with cooling coils, a heat removal fan assembly can be incorporated into any type of heat removal unit as described above.

[0032] The heat dissipation unit may also include one or more heat exchangers. Heat exchangers may include, but are not limited to, finned tube coil heat exchangers, plate condenser heat exchangers, shell-and-tube heat exchangers, and plate heat exchangers (e.g., brazed plate heat exchangers). For example, while embodiments herein may illustrate a heat exchanger as a set of cooling coils for an air-cooled condenser, the heat exchanger may include any type of cooling technology.

[0033] Figure 1A The illustration shows a perspective view of a cooling system 100 according to one or more embodiments of the present disclosure. The cooling system 100 can be used for any purpose, including but not limited to cooling data centers or telecommunications centers. The cooling system 100 may include a heat dissipation unit.

[0034] In one embodiment, the cooling system 100 includes one or more exhaust fan assemblies 102a, 102b and one or more heat exchangers integrated into the housing 103. For example, one or more heat exchangers 104a, 104b (e.g., coils) may be integrated into one or more sides of the housing 103. In another example, one or more exhaust fan assemblies 102a, 102b may be integrated into one or more shrouds 106a, 106b of the housing. For example, one or more exhaust fan assemblies 102a, 102b may be integrated into or disposed within one or more shroud openings 108a, 108b of one or more shrouds 106a, 106b.

[0035] Figure 1BThe illustration shows a simplified schematic side view of a cooling system 100 according to one or more embodiments of the present disclosure. In one embodiment, a heat dissipation fan assembly 102 includes a group of one or more fan blades 110 connected to each other at a hub 112. The heat dissipation fan assembly 102 also includes a fan motor 114 coupled to the hub 112 (e.g., via a motor shaft 116). As the group of fan blades 110 rotates, air, such as fresh air and / or ambient air, is drawn through heat exchangers 104a, 104b (e.g., as indicated by airflows 118a, 118b) and discharged through a shroud opening 108. As the air travels through the heat exchangers 104a, 104b, heat from the heat exchangers 104a, 104b is transferred to the air, resulting in the generation of exhaust air, wherein the air that has flowed through the heat exchangers is referred to as a first air volume 122 (e.g., as indicated by the dashed triangle). The fan motor 114 may include any type of electric motor, including but not limited to electronically commutated (EC) electric motors and electric motors standardized by the National Electrical Manufacturers Association (NEMA).

[0036] Figure 2AA cross-sectional view of a heat dissipation fan assembly 102 within a cooling system 100 according to one or more embodiments of the present disclosure is illustrated. In an embodiment, the heat dissipation fan assembly 102 includes a fan motor cooling subsystem configured to cool a fan motor 114. For example, the fan motor cooling subsystem may include a coolant inlet conduit 202 fluidly connected to the fan motor 114 and configured to selectively induce or propel a second air volume 204 (e.g., fresh air, ambient air, or non-exhaust air) to contact the fan motor 114 through an opening in the cooling system 100, such as an opening in the housing 103, in which the second air volume 204 cools the fan motor 114 directly or by minimizing the amount of hot air impacting the motor. When the heat dissipation fan assembly 102 is used, the second air volume 204 may be at least partially biased or moved due to the reduced air pressure generated on the opposite side of the fan blades 110. The coolant inlet conduit 202 may also include a second air volume inlet 206 (e.g., opposite to a second air volume outlet 207) that draws fresh air (e.g., a second air volume 204) into the housing 103 or heat dissipation space of the cooling system 100 while preventing the first air volume 122 from mixing with the second air volume 204. The second air volume 204 is colder than the first air volume 122, and therefore provides more efficient cooling for the fan motor 114 than the first air volume 122. The fan motor cooling subsystem may also include a coolant outlet conduit 208 configured to direct the second air volume 204 away from the fan motor 114. Conduits 202 and 208 may also provide an insulating boundary layer between the first air volume 122 and the second air volume 204. The coolant inlet conduit 202 and the coolant outlet conduit 208 may be directly attached to the fan motor 114 or may be positioned adjacent to the fan motor 114 (e.g., one or more duct frame elements).

[0037] Because the diameter of the coolant inlet pipe 202 is relatively narrow compared to the volume of the heat dissipation unit chamber, the coolant inlet pipe 202 only slightly reduces the flow rate of the first air volume 122 through the heat dissipation fan assembly 102. For example, compared to a cooling system without the coolant inlet pipe 202, the coolant inlet pipe 202 can reduce the flow rate of the first air volume by less than 2%.

[0038] The coolant inlet pipe 202 and / or coolant outlet pipe 208 provide an easily implemented solution to the fan motor thermal problem because pipes 202, 208 provide a second air volume 204 that is 10°F to 20°F cooler than the first air volume 122. This airflow cools the fan motor 114 and insulates it from the warmer first air volume 122. The pressure drop generated at the underside of the fan blades 110 draws air in through pipes 202, 208. The second air volume 204, located at the center of the exhaust fan assembly 102, experiences less turbulence and may generate a boundary layer, further improving motor fan cooling. Pipes 202, 208 can be added to existing exhaust fan assemblies 102, such as those operating within the maximum permissible temperature range of pipes 202, 208, to reduce motor temperature and increase expected lifespan.

[0039] Figure 2B The illustration shows a cross-sectional side view of a heat dissipation fan assembly 102 within a cooling system 100 according to one or more embodiments of the present disclosure. In the embodiments, the fan motor cooling subsystem includes one or more cooling duct fans 210 or other cooling devices disposed within a coolant inlet duct 202 and / or a coolant outlet duct 208. One or more cooling duct fans 210 bias, push, or otherwise move a second air volume 204 through the coolant inlet duct 202 and / or the coolant outlet duct 208. A portion of the second air volume 204 can then contact the fan motor 114. The cooling duct fan 210 may include any type of air movement device and / or heat exchanger having an external cooling medium, and the cooling duct fan 210 is disposed within or at the inlet and / or outlet of the ducts 202, 208. Other cooling devices that may be included within the fan motor cooling subsystem may include heat exchangers utilizing cooling fluids and / or fans coupled to the heat exchangers.

[0040] Figure 2CThe illustration shows a cross-sectional side view of a heat dissipation fan assembly 102 within a cooling system 100 according to one or more embodiments of the present disclosure. In one embodiment, the fan motor cooling subsystem includes a set of air-moving fins 212 (e.g., a set of cooling fins) configured to guide a second air volume 204 through a shroud opening 108. The set of air-moving fins 212 can be configured as static or moving fins. For example, the set of air-moving fins 212 can be incorporated into a hub 112 or shroud of the heat dissipation fan assembly 102. Thus, when the hub 112 rotates, the set of air-moving fins 212 also rotates, causing the second air volume 204 to flow through the shroud opening 108. In another embodiment, the surface of the fan motor 114 may include a set of air-moving fins 212 that guide a cooler second air volume 204 along a path along the fan motor 114, thereby increasing the efficiency with which the second air volume 204 can cool the fan motor 114. In some embodiments, both hub 112 and fan motor 114 include moving and static groups of corresponding air-moving fins 212.

[0041] Figure 2D The illustration shows a cross-sectional view of a heat dissipation fan assembly 102 within a cooling system 100 according to one or more embodiments of the present disclosure. In one embodiment, the coolant inlet conduit 202 includes one or more second air volume inlets 206a, 206b away from the heat exchangers 104a, 104b. For example, and as... Figure 2DAs shown, the coolant inlet conduit 202 may include one or more second air volume inlets 206a, 206b, positioned such that a second air volume 204 is received from the side of the cooling system 100 where heat exchangers 104a, 104b are not positioned. The second air volume 204 may originate from outside the cooling system 100, wherein the second air volume 204 enters as fresh air through an opening in the housing 103 or other opening within the cooling system 100, and then passes through the coolant inlet conduit. In an alternative embodiment, the second air volume 204 originates from a portion of the first air volume 122 having a lower temperature than other portions of the first air volume 122. For example, it can be determined that a portion of the first air volume 122, such as the portion of the first air volume 122 furthest from the heat exchangers 104a, 104b, may have a lower temperature than the portion of the first air volume 122 adjacent to the heat exchangers 104. These cooler portions of the first air volume 122 (e.g., designated as the second air volume 204) can then be moved into the coolant inlet duct 202 to cool the fan motor 114. In an embodiment, the second air volume inlets 206a, 206b are positioned orthogonal to the rotor shaft 116 and away from the heat exchangers 104a, 104b.

[0042] Figure 2E The illustration shows a cross-sectional view of a heat dissipation fan assembly 102 within a cooling system 100 according to one or more embodiments of the present disclosure. In one embodiment, a fan motor cooling subsystem includes a radiator 220 or cold plate thermally coupled to a fan motor 114, which is cooled by a circulating coolant 222. For example, the fan motor cooling subsystem may include coolant 222 circulated via pump 224 through coolant lines 223a, 223b (e.g., coolant lines 223a, 223b may be thermally coupled to the radiator 220). In this way, heat from the fan motor 114 is absorbed by the radiator 220, which is then displaced by the circulating coolant 222. The fan motor cooling subsystem may also use or include pump 224, coolers, refrigeration subsystems, or other devices to reduce the temperature of the coolant 222. The circulating coolant 222 may include any type of liquid or vapor, including but not limited to water. For example, coolant 222 may include any compatible refrigerant. Because of the cooling provided by coolant 222, the cooling system 100 may not need to move the second air volume 204 (e.g., the cooling system 100 may be configured to move only the first air volume 122). The fan motor cooling subsystem may include one or more sensors 226 configured to measure the temperature of the radiator 220 and / or other components of the cooling system 100.

[0043] Figure 3A A simplified cross-sectional view of a cooling system 100 including a coolant inlet conduit 202 according to one or more embodiments of the present disclosure is illustrated. An end surface 300 of the cooling system 100 is also illustrated, comprising an end opening 302 coupled to a second air volume inlet 206, which allows fresh air (e.g., a second air volume 204) to flow into the coolant inlet conduit 202 to cool a fan motor 114 (hidden and not visible by a shroud 304). The end opening 302 and / or the second air volume inlet 206 may have a diameter ranging from 1 cm to 30 cm or from 3 cm to 10 cm. For example, the end opening 302 and / or the second air volume inlet 206 may have a diameter of approximately 7.6 cm (3 inches). In another example, the end opening 302 and / or the second air volume inlet 206 may have a diameter greater than 30 cm. The fairing 304 may include a conical shape, a shield shape, or other shapes that prevent the second air volume 204 from suddenly contacting the fan motor 114 and / or interfering with the flow of the second air volume 204.

[0044] Figure 3B The illustration shows a front view of a set of fan blades 110a to 110e for a heat dissipation fan assembly 102 according to one or more embodiments of the present disclosure. In one embodiment, the heat dissipation fan assembly 102 includes one or more microblades 306a, 306b coupled to a hub 112 and / or a shroud 304. The one or more microblades 306 are configured to generate airflow to the core volume of the cooling system 100 (e.g., the area occupied by the second air volume 204).

[0045] Figure 4 The illustration shows a block diagram depicting a cooling system 100 according to one or more embodiments of the present disclosure. In one embodiment, the cooling system includes components communicatively connected to a fan motor 114 and a fan motor cooling subsystem 402, such as... Figure 2E The fan motor cooling subsystem 402 may include one or more controllers 400. For example, the fan motor cooling subsystem 402 may include one or more pumps 224 and / or one or more coolers. The one or more controllers 400 are configured to provide and / or control the functions of the fan motor 114 and / or the fan motor cooling subsystem 402. The one or more controllers 400 include one or more processors 404, which are configured to execute program instructions held in memory 406.

[0046] It should be understood that the cooling system 100 may not include the controller 400. For example, the fan motor 114 may be controlled by a switch. Therefore, the above description should not be construed as a limitation on the embodiments of this disclosure, but is merely illustrative.

[0047] It should be understood that any of the fan motor cooling subsystems 402 described herein may include one or more components of other fan motor cooling subsystems 402 as described herein. For example, a fan motor cooling system may include both a cooling inlet conduit 202 and coolant lines 223a, 223b for circulating coolant 222. Therefore, the above description should not be construed as limiting the embodiments of this disclosure, but is merely illustrative.

[0048] One or more processors 404 of controller 400 may include any processor or processing element known in the art. For the purposes of this disclosure, the terms "processor" or "processing element" may be broadly defined to encompass any device having one or more processing elements or logic elements (e.g., one or more microprocessor devices, one or more application-specific integrated circuit (ASIC) devices, one or more field-programmable gate arrays (FPGAs), or one or more digital signal processors (DSPs)). In this sense, one or more processors 404 may include any device configured to execute algorithms and / or instructions (e.g., program instructions stored in memory). In some embodiments, one or more processors 404 may be embodied as a desktop computer, mainframe computer system, workstation, graphics computer, parallel processor, network computer, or any other computer system configured to execute program instructions. Furthermore, the steps described throughout this disclosure may be performed by a single controller or alternatively by multiple controllers. Additionally, controller 400 may include one or more controllers housed in a common housing or multiple housings.

[0049] Memory 406 may include any storage medium known in the art suitable for storing program instructions executable by one or more associated processors 404. For example, memory 406 may include a non-transitory storage medium. By another example, memory 406 may include, but is not limited to, read-only memory (ROM), random access memory (RAM), magnetic or optical storage devices (e.g., magnetic disks), magnetic tape, solid-state drives, etc. It should also be noted that memory 406 may be housed together with one or more processors 404 in a shared controller housing. In some embodiments, memory 406 may be remotely located relative to the physical location of one or more processors 404 and controller 400. For example, one or more processors 404 of controller 400 may access remote memory (e.g., a server) accessible via a network (e.g., the Internet or an intranet).

[0050] Figure 5 The illustration depicts a process flow diagram illustrating a method 500 for controlling the operating temperature of a fan motor 114 within a cooling system 100 according to one or more embodiments of the present disclosure. For example, the cooling system 100 can use method 500 to prevent the fan motor 114 from overheating. Method 500 can be used in systems including a controllable fan motor cooling subsystem 402, such as... Figure 2E The cooling system 100 of the fan motor cooling subsystem 402 described herein.

[0051] In one implementation, method 500 includes step 510 of receiving temperature measurements from a sensor within the cooling system 100. For example, controller 400 may receive temperature measurements from sensor 236 located on or near radiator 220, indicating the operating temperature of cooling system 100 and / or fan motor 114.

[0052] In one implementation, method 500 includes a step 520 of determining whether a temperature measurement value is higher than a threshold. For example, the controller may include a threshold or operating value for the fan motor 11 in memory 406 and compare the threshold or operating value with the temperature measurement value.

[0053] In one implementation, method 500 includes step 530 of activating coolant pump 224 if the measured temperature is above a threshold temperature. For example, if one or more processors 404 determine that the measured temperature is above a threshold temperature, one or more processors 404 may activate pump 224 to circulate coolant 222, thereby cooling fan motor 114.

[0054] As described herein, the use of cooler air, such as air from the second air volume 204, creates an air layer surrounding the fan motor 114. This air layer protects the fan motor from the higher-temperature exhaust air (e.g., the first air volume) from the heat exchanger 104. This cooler air bypasses the hot air, and the low pressure inside the heat exchanger 104 generated by the fan blades 110 forces the air to move through the coolant inlet duct 202. The second air volume inlet 206 prevents mixing with the mainstream flow and forms a cooler air layer above the fan motor 114.

[0055] The subjects described herein are sometimes illustrated with different components included within or connected to different other components. It should be understood that the architectures depicted are merely exemplary, and many other architectures can actually be implemented to achieve the same functionality. Conceptually, any arrangement of components that achieve the same functionality is effectively “associated” to achieve the desired functionality. Therefore, any two components combined herein to achieve a particular function can be considered “associated” with each other to achieve the desired functionality, regardless of the architecture or intermediate components. Similarly, any two components so associated can also be considered “operably connected” or “operably linked” to each other to achieve the desired functionality, and any two components that can be so associated can also be considered “operably linked” to each other to achieve the desired functionality. Specific examples of components that can be operatedly linked include, but are not limited to, components that can be physically matched and / or physically interact, and / or components that can wirelessly interact and / or wirelessly interact, and / or components that can logically interact and / or logically interact.

[0056] Those skilled in the art will recognize that it is common in the art to describe devices and / or processes in the manner set forth herein, and that such described devices and / or processes are subsequently integrated into power and / or data processing systems through engineering practice. That is, at least a portion of the devices and / or processes described herein can be integrated into a data processing system through a reasonable amount of experimentation. Those skilled in the art will recognize that a typical power and / or data processing system generally includes one or more of the following: a system unit housing, a video display device, memory such as volatile and non-volatile memory, a processor such as a microprocessor and a digital signal processor, computing entities such as operating systems, drivers, graphical user interfaces, and applications, one or more interactive devices such as a touchpad or screen, and / or a control system including feedback loops and control motors (e.g., feedback for sensing position and / or speed; control motors for moving and / or adjusting the number and quantity of components). A typical power and / or data processing system can be implemented using any suitable commercially available components, such as those commonly found in power and / or data computing / communication and / or network computing / communication systems.

[0057] It is also contemplated that each implementation of the methods described above may include any other step of any other method described herein. Furthermore, each implementation of the methods described above may be performed by any system described herein.

[0058] Those skilled in the art will understand that, generally, the terms used herein and especially in the appended claims (e.g., the body of the appended claims) are generally intended to be “open-ended” terms (e.g., the term “comprising” should be interpreted as “including but not limited to”, the term “having” should be interpreted as “at least having”, the term “comprising” should be interpreted as “including but not limited to”, etc.).

[0059] While specific aspects of the subject matter described herein have been shown and described, it will be readily understood by those skilled in the art that changes and modifications can be made based on the teachings herein without departing from the subject matter and its broader aspects, and therefore, the appended claims cover all such changes and modifications within their scope, as well as the true spirit and scope of the subject matter described herein. Furthermore, it should be understood that the invention is defined by the appended claims.

Claims

1. A heat dissipation fan assembly, comprising: A set of fan blades; A fan motor, connected to the set of fan blades via a motor shaft and configured such that the set of fan blades: The first air volume moves through the heat exchanger, and The first air volume is moved through the opening in the protective cover; as well as A fan motor cooling subsystem configured to cool the fan motor.

2. The exhaust fan assembly of claim 1, wherein, The fan motor cooling subsystem includes a coolant inlet pipe configured to selectively contact a second volume of air with the fan motor.

3. The exhaust fan assembly of claim 2, wherein, The second air volume does not move through the heat exchanger.

4. The exhaust fan assembly of claim 2, wherein, The fan motor cooling subsystem also includes a coolant outlet pipe configured to direct the second air volume away from the fan motor.

5. The heat dissipation fan assembly according to claim 2 further includes a cooling pipe fan disposed within the coolant inlet pipe.

6. The exhaust fan assembly of claim 2, wherein, The set of fan blades includes a hub, wherein the hub includes a set of cooling fins configured to guide the second air volume through the shroud opening.

7. The exhaust fan assembly of claim 2, wherein, The coolant inlet pipe includes one or more inlets, wherein the one or more inlets include one or more inlets away from the heat exchanger.

8. The exhaust fan assembly of claim 7, wherein, One or more inlets are positioned orthogonal to the motor shaft.

9. The exhaust fan assembly of claim 1, wherein, The fan motor cooling subsystem includes: heat sink; Coolant lines, the coolant lines being thermally connected to the radiator; and A pump configured to circulate coolant through the coolant line.

10. A heat dissipation unit, comprising: A protective cover, the protective cover including a protective cover opening; A heat dissipation coil is disposed inside the protective cover; as well as The heat dissipation fan assembly includes: A set of fan blades; A fan motor, connected to the set of fan blades via a motor shaft and configured such that the set of fan blades: The first air volume moves through the heat dissipation coil, and The first air volume moves through the opening in the shield; and A fan motor cooling subsystem configured to cool the fan motor.

11. The heat rejection unit of claim 10, wherein, The fan motor cooling subsystem includes a coolant inlet pipe configured to selectively contact a second volume of air with the fan motor.

12. The heat rejection unit of claim 11, wherein, The fan motor cooling subsystem also includes a coolant outlet pipe configured to direct the second air volume away from the fan motor.

13. The heat dissipation unit according to claim 11 further includes a cooling pipe fan disposed in the coolant inlet pipe.

14. The heat rejection unit of claim 11, wherein, The set of fan blades includes a hub, wherein the hub includes a set of cooling fins configured to guide the second air volume through the shroud opening.

15. The heat rejection unit of claim 11, wherein, The second air volume does not move through the heat dissipation coil.

16. The heat rejection unit of claim 11, wherein, The coolant inlet pipe includes one or more inlets, wherein the one or more inlets include one or more inlets opposite to the heat dissipation coil.

17. The heat dissipation unit according to claim 16, wherein, One or more inlets are positioned orthogonal to the motor shaft.

18. The heat rejection unit of claim 10, wherein, The fan motor cooling subsystem includes: heat sink; Coolant lines, the coolant lines being thermally connected to the radiator; and A pump configured to circulate coolant through the coolant line.

19. A fan motor cooling subsystem for use in a heat rejection fan assembly, wherein, The exhaust fan assembly is configured to move a first air volume through a heat exchanger, and the fan motor cooling subsystem includes: A coolant inlet pipe, which is fluidly connected to a fan motor, includes: A second air volume outlet, the second air volume outlet being located near the fan motor; and A second air volume inlet is provided at a second air volume, wherein the second air volume moves from the second air volume inlet to the second air volume outlet and cools the fan motor.

20. The heat dissipation fan assembly of claim 19, further comprising a cooling duct fan disposed within the coolant inlet duct and configured to push the second air volume against the fan motor.

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