Glass substrate, window including same, and electronic device including window

Abstract

Disclosed are a glass substrate, a window including the glass substrate, and an electronic device including the window. The glass substrate may include a first portion in which a recess is formed or disposed and a second portion substantially continuous with the first portion. A difference CT between an internal tensile stress at a point of the first portion having the minimum thickness and an internal tensile stress at a point of the second portion having the maximum thickness may be no more than 100 MPa.

Description

Technical Field

[0001] One or more embodiments of this disclosure relate to a glass substrate, a window including the glass substrate, and an electronic device including the window. For example, embodiments relate to a glass substrate including portions of different thicknesses, a window including the glass substrate, and an electronic device including the window. Background Technology

[0002] Electronic devices can provide information to users by displaying images. In recent years, various types of electronic devices have been developed. For example, foldable electronic devices have been developed.

[0003] The electronic device includes a display device and a window. The window includes a glass substrate. A window is being developed to improve or enhance the impact resistance and strength of its outer surface and reduce stress generated during folding. Summary of the Invention

[0004] One or more embodiments of this disclosure relate to a chemically strengthened glass substrate with reduced deformation.

[0005] One or more embodiments of this disclosure relate to a window comprising a glass substrate.

[0006] One or more embodiments of this disclosure relate to an electronic device including a window.

[0007] Additional aspects of the embodiments will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practice of the disclosed embodiments.

[0008] According to one or more embodiments, a glass substrate includes: a first portion having a groove defined thereon; and a second portion extending from the first portion and being thicker than the first portion. Each of the first and second portions includes: a first compressive stress region having a first depth from a first surface; a second compressive stress region having a second depth from a second surface opposite to (e.g., facing the first surface) the second surface; and a tensile stress region between the first compressive stress region and the second compressive stress region. The difference between the internal tensile stress at the point of minimum thickness of the first portion and the internal tensile stress at the point of maximum thickness of the second portion is defined as follows. CT is no more than (e.g., equal to or less than) 100 MPa.

[0009] The first depth of the first compressive stress region in the first part can be substantially the same as the second depth of the first compressive stress region in the second part.

[0010] The difference between the internal tensile stress at the point with the minimum thickness in the first part and the internal tensile stress at the point with the maximum thickness in the second part. CT can satisfy Equation 1: Equation 1

[0011] Wherein, CS1 can be defined as the surface compressive stress of the first part, CS2 can be defined as the surface compressive stress of the second part, t1 can be defined as the thickness of the point with the minimum thickness of the first part, t2 can be defined as the thickness of the point with the maximum thickness of the second part, and Ratio can be defined as the value obtained by dividing the layer depth DOL of the first part or the second part by t1, where the layer depth DOL of the first part or the second part is the first depth or the second depth, and the first depth and the second depth are the same.

[0012] The surface compressive stress CS1 in the first part can be basically the same as the surface compressive stress CS2 in the second part.

[0013] The ratio can be in the range of 0.15 to 0.25.

[0014] The surface compressive stress CS1 in the first part and the surface compressive stress CS2 in the second part can both be in the range of 500MPa to 700MPa.

[0015] t1 can be in the range of 20 μm to 50 μm, and t2 can be in the range of 30 μm to 300 μm.

[0016] According to one or more embodiments, a window includes: a glass substrate and a resin layer disposed on one surface of the glass substrate. The glass substrate includes: a first portion defining a groove filled with the resin layer thereon; and a second portion extending from the first portion and being thicker than the first portion. Each of the first and second portions includes: a first compressive stress region having a first depth from the first surface; a second compressive stress region having a second depth from the second surface, the second surface being opposite to (e.g., facing the first surface) the first surface; and a tensile stress region between the first compressive stress region and the second compressive stress region. The difference between the internal tensile stress at the point of minimum thickness of the first portion and the internal tensile stress at the point of maximum thickness of the second portion is defined as follows. CT is no more than (e.g., equal to or less than) 100 MPa.

[0017] The resin layer can be stacked with the first part and the second part, and the thickness of the portion of the window corresponding to the first part can be substantially the same as the thickness of the portion of the window corresponding to the second part.

[0018] The first depth of the first compressive stress region in the first part can be substantially the same as the second depth of the first compressive stress region in the second part.

[0019] The difference between the internal tensile stress at the point with the minimum thickness in the first part and the internal tensile stress at the point with the maximum thickness in the second part. CT can satisfy Equation 1: Equation 1

[0020] Wherein, CS1 can be defined as the surface compressive stress of the first part, CS2 can be defined as the surface compressive stress of the second part, t1 can be defined as the thickness of the point with the minimum thickness of the first part, t2 can be defined as the thickness of the point with the maximum thickness of the second part, and Ratio can be defined as the value obtained by dividing the layer depth DOL of the first part or the second part by t1, where the layer depth DOL of the first part or the second part is the first depth or the second depth, and the first depth and the second depth are the same.

[0021] The surface compressive stress CS1 in the first part can be basically the same as the surface compressive stress CS2 in the second part.

[0022] The ratio can be in the range of 0.15 to 0.25.

[0023] The surface compressive stress CS1 in the first part and the surface compressive stress CS2 in the second part can both be in the range of 500MPa to 700MPa.

[0024] t1 can be in the range of 20 μm to 50 μm, and t2 can be in the range of 30 μm to 300 μm.

[0025] According to one or more embodiments, an electronic device includes a display panel and a window. The window is disposed on the display panel and includes a glass substrate and a resin layer disposed on one surface of the glass substrate. The glass substrate includes: a first portion defining a recess filled with the resin layer; and a second portion extending from the first portion and thicker than the first portion. Each of the first and second portions includes: a first compressive stress region having a first depth from the first surface; a second compressive stress region having a second depth from a second surface opposite to (e.g., facing the first surface) the second surface; and a tensile stress region between the first compressive stress region and the second compressive stress region.

[0026] The difference between the internal tensile stress at the point with the minimum thickness in the first part and the internal tensile stress at the point with the maximum thickness in the second part. CT is no more than (e.g., equal to or less than) 100 MPa.

[0027] The resin layer can be stacked with the first part and the second part. The thickness of the portion of the window corresponding to the first part can be substantially the same as the thickness of the portion of the window corresponding to the second part.

[0028] The electronic device may be foldable relative to the folding axis, and the folding axis may be defined to overlap with the groove and may extend in a direction substantially the same as the extension direction of the groove.

[0029] The difference between the internal tensile stress at the point with the minimum thickness in the first part and the internal tensile stress at the point with the maximum thickness in the second part. CT can satisfy Equation 1: Equation 1

[0030] Wherein, CS1 can be defined as the surface compressive stress of the first part, CS2 can be defined as the surface compressive stress of the second part, t1 can be defined as the thickness of the point with the minimum thickness of the first part, t2 can be defined as the thickness of the point with the maximum thickness of the second part, and Ratio can be defined as the value obtained by dividing the layer depth DOL of the first part or the second part by t1, where the layer depth DOL of the first part or the second part is the first depth or the second depth, and the first depth and the second depth are the same.

[0031] The surface compressive stress CS1 of the first part can be basically the same as the surface compressive stress CS2 of the second part, and the ratio can be in the range of 0.15 to 0.25.

[0032] One or more embodiments of this disclosure relate to a chemically strengthened glass substrate with reduced deformation, a window including the glass substrate, and an electronic device including the window. The glass substrate includes a first portion with grooves and a thicker second portion, each having a compressive stress region and a tensile stress region between the compressive stress regions. The difference in internal tensile stress between the thinnest and thickest points does not exceed 100 MPa, satisfying Equation 1: Equation 1

[0033] The window comprises a resin layer stacked with the two parts, maintaining consistent thickness and stress characteristics. Electronic devices (i.e., foldable electronic devices) incorporate this window into their display panels, thereby ensuring durability and reduced stress during folding. Attached Figure Description

[0034] The above and other aspects and features of certain embodiments of this disclosure will become more apparent from the description of one or more embodiments of the disclosure with reference to the accompanying drawings.

[0035] Figure 1A This is a block diagram of an electronic device according to one or more embodiments of the present disclosure.

[0036] Figures 1B to 1D This is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0037] Figures 2A to 2C This is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0038] Figure 3 This is an exploded perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0039] Figure 4A This is a cross-sectional view of a window according to one or more embodiments of the present disclosure.

[0040] Figure 4B yes Figure 4A An enlarged sectional view of a portion of the document.

[0041] Figure 4C This is a cross-sectional view of a window according to one or more embodiments of the present disclosure.

[0042] Figure 5A This is a cross-sectional view illustrating a method of manufacturing a window according to one or more embodiments of the present disclosure.

[0043] Figure 5B A method for chemical strengthening of a glass substrate according to one or more embodiments of the present disclosure is shown.

[0044] Figure 6 It is a graph depicting the stress variation of a glass substrate according to one or more embodiments of the present disclosure.

[0045] Figure 7 It describes the internal stress difference (e.g., internal tensile stress difference) between a first reference point and a second reference point of a glass substrate according to one or more embodiments of the present disclosure. A graph showing the ratio of the thickness of the CT relative to the thickness of the second reference point to the thickness of the first reference point.

[0046] Figures 8A to 8C This is a view showing a glass substrate according to an embodiment of the present disclosure. Detailed Implementation

[0047] The subject matter of this disclosure will be described more fully below with reference to the accompanying drawings, in which embodiments of the disclosure are illustrated. As those skilled in the art will recognize, the described embodiments may be modified in one or more suitable different ways without departing from the spirit or scope of this disclosure. The drawings and description are to be considered illustrative rather than restrictive in nature. Throughout the drawings and written description, the same reference numerals denote the same elements, and repeated descriptions of them may not be provided in the specification.

[0048] When describing embodiments of this disclosure, the word "may" is used to refer to "one or more embodiments of this disclosure" (e.g., when describing embodiments of this disclosure, the word "may" is used to refer to "one or more embodiments of this disclosure").

[0049] In the context of this application, unless otherwise defined, the term “use” and its variations may be considered synonymous with the term “utilize” and its variations, respectively.

[0050] Throughout this disclosure, the expression “selected from at least one of a, b and c” means only a, only b, only c, (e.g., simultaneously) both a and b, (e.g., simultaneously) both a and c, (e.g., simultaneously) both b and c, all of a, b and c, or variations thereof.

[0051] In this disclosure, if a component (e.g., a region, layer, and / or portion, etc.) is referred to as being "on" another component, "connected to," or "attached to" another component, this means that the component can be directly on, directly connected to, or directly attached to the other component, or a third component can exist between them (e.g., when a component (e.g., a region, layer, and / or portion, etc.) is referred to as being "on" another component, "connected to," or "attached to" another component, this means that the component can be directly on, directly connected to, or directly attached to the other component, or a third component can exist between them). Conversely, if a component is referred to as being "directly on" another component, "directly connected to," or "directly attached to" another component, then an intermediary component may not exist between them (e.g., when a component is referred to as being "directly on" another component, "directly connected to," or "directly attached to" another component, an intermediary component may not exist between them).

[0052] In the accompanying drawings, the thickness, proportions, and dimensions of the components may be exaggerated for the purpose of effective description.

[0053] As used herein, the term “and / or” includes all of one or more combinations defined by the relevant components.

[0054] Terms such as “first” and / or “second” may be used to describe one or more suitable components, but the components should not be limited by the terms. Terms may be used only to distinguish one component from others. For example, without departing from the scope of this disclosure, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component.

[0055] Unless otherwise stated, a singular term may include a plural term.

[0056] Terms such as “below,” “under,” “above,” and “over (through)” are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative concepts and are described based on the directions shown in the drawings.

[0057] It should be understood that if terms such as “comprising” and “having” are used herein, it indicates the presence of one or more (e.g., any suitable) combinations of the stated features, quantities, steps, operations, components, parts, and / or such features, quantities, steps, operations, components, parts, and / or such features, quantities, steps, operations, parts, and / or such features, quantities ... Furthermore, the terms “comprising,” “including,” “having,” and variations thereof or similar terms include or support the terms “composed of” and “substantially composed of,” which indicate the presence of the stated feature, whole, step, operation, element, and / or component, while other features, wholes, steps, operations, elements, components, and / or groups thereof are absent or substantially absent.

[0058] Unless otherwise defined, all terms used herein (including technical or scientific terms) shall have substantially the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Such terms (as defined in a general dictionary) shall be interpreted as having the same meaning as in the context of the relevant technical field and shall not be interpreted as having an idealized or overly (or fundamentally) formal meaning, unless expressly defined in this application as having such a meaning.

[0059] In the following description, one or more embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings.

[0060] Figure 1A This is a block diagram of an electronic device ED according to one or more embodiments of the present disclosure. Figures 1B to 1D This is a perspective view of an electronic device according to an embodiment of the present disclosure. Figures 2A to 2C This is a perspective view of an electronic device ED according to one or more embodiments of the present disclosure.

[0061] An electronic device ED according to one or more embodiments of the present disclosure may include a display device. An electronic device ED according to one or more embodiments of the present disclosure may be as follows: Figures 2A to 2C The mobile phone shown is not limited to the embodiments disclosed herein.

[0062] like Figure 1A As shown, the electronic device ED can be used to output one or more suitable pieces of information in the operating system via the display module 140. If the processor 110 executes an application stored in the memory 120, the display module 140 can provide the application information to the user via the display panel 141 (e.g., when the processor 110 executes an application stored in the memory 120, the display module 140 can provide the application information to the user via the display panel 141).

[0063] Processor 110 can be used to obtain external input through input module 130 and / or sensor module 161, and execute applications corresponding to the external input. For example, if a user selects a camera icon displayed on display panel 141, processor 110 can obtain user input through input sensor 161-2 and activate camera module 171 (e.g., when a user selects a camera icon displayed on display panel 141, processor 110 can obtain user input through input sensor 161-2 and activate camera module 171). Processor 110 can be used to transmit image data corresponding to the captured image obtained through camera module 171 to display module 140. Display module 140 can be used to display the image corresponding to the captured image through display panel 141.

[0064] In another example, if authentication of personal information is performed in display module 140, fingerprint sensor 161-1 can obtain the input fingerprint information as input data (e.g., when authentication of personal information is performed in display module 140, fingerprint sensor 161-1 can obtain the input fingerprint information as input data). Processor 110 can be used to compare the input data obtained by fingerprint sensor 161-1 with authentication data stored in memory 120, and execute the application based on the comparison result. Display module 140 can be used to display information that operates according to the logic of the application via display panel 141.

[0065] In another example, if the user selects a music stream icon displayed on display module 140, processor 110 can obtain user input via input sensor 161-2 and activate the music stream application stored in memory 120 (e.g., when the user selects a music stream icon displayed on display module 140, processor 110 can obtain user input via input sensor 161-2 and activate the music stream application stored in memory 120). If a music playback command is input to the music stream application, processor 110 can activate sound output module 163 and provide the user with sound information corresponding to the music playback command (e.g., when a music playback command is input to the music stream application, processor 110 can activate sound output module 163 and provide the user with sound information corresponding to the music playback command).

[0066] The operation of the electronic device ED is described in one or more embodiments. The construction or arrangement of the electronic device ED will be described in more detail below. One or more components of the electronic device ED, which will be described in more detail herein, may be implemented integrally with a single component, or a single component may be divided into two or more components.

[0067] Reference Figure 1A The electronic device ED can be used to communicate with an external electronic device 102 via a network (e.g., a short-range wireless communication network or a long-range wireless communication network). According to one or more embodiments, the electronic device ED may include a processor 110, a memory 120, an input module 130, a display module 140, a power module 150, an internal module 160, and an external module 170. According to one or more embodiments, the electronic device ED may not include at least one component selected from the components described in one or more embodiments, or may include one or more other components. According to one or more embodiments, one or more of the components described in one or more embodiments (e.g., sensor module 161, antenna module 162, or audio output module 163) may be integrated into any other component (e.g., display module 140).

[0068] Processor 110 may be used to execute software to control at least one other component (e.g., hardware and / or software components) of electronic device ED connected to processor 110, and may be used to perform one or more suitable data processing or operations. According to one or more embodiments, as at least part of the data processing or operation, processor 110 may be used to store instructions or data received from any other component (e.g., input module 130, sensor module 161, or communication module 173) in volatile memory 121, may be used to process instructions or data stored in volatile memory 121, and may be used to store processed data in non-volatile memory 122.

[0069] Processor 110 may include a main processor 111 and an auxiliary processor 112. The main processor 111 may include one or more central processing units (CPUs) 111-1 and application processors (APs). The main processor 111 may also include one or more graphics processing units (GPUs) 111-2, communication processors (CPs), and image signal processors (ISPs). The main processor 111 may also include neural processing units (NPUs) 111-3. The neural processing units 111-3 may be processors dedicated to processing artificial intelligence models, and these models may be created through machine learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural networks may include one selected from deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), and deep Q-networks, and / or two or more of them (e.g., any suitable combination), but embodiments of this disclosure are not limited thereto. Additionally or alternatively, in addition to hardware architecture, the artificial intelligence model may also include software architecture. At least two of the processing units and processors described in one or more embodiments may be implemented integrally with a single component (e.g., a single chip), or each of the processing units and processors described in one or more embodiments may be implemented with independent components (e.g., multiple chips).

[0070] The auxiliary processor 112 may include a controller 112-1. The controller 112-1 may include interface conversion circuitry and timing control circuitry. The controller 112-1 can be used to receive image signals from the main processor 111 and output image data obtained by converting the data format of the image signals to suit the interface specifications with the display module 140. The controller 112-1 can be used to output one or more suitable types or kinds of control signals desired or required by the display module 140.

[0071] The auxiliary processor 112 may also include a data conversion circuit 112-2, a gamma correction circuit 112-3, and / or a rendering circuit 112-4, etc. The data conversion circuit 112-2 can be used to receive image data from the controller 112-1 and can be used to compensate the image data according to the characteristics of the electronic device ED or user settings, so that the image is displayed with a desired or suitable brightness, or can be used to convert the image data to reduce power consumption or compensate for image retention. The gamma correction circuit 112-3 can be used to convert the image data or gamma reference voltage so that the image displayed on the electronic device ED has desired or suitable gamma characteristics. The rendering circuit 112-4 can be used to receive image data from the controller 112-1 and can be used to render the image data taking into account the pixel arrangement of the display panel 141 applied to the electronic device ED. At least one selected from the data conversion circuit 112-2, the gamma correction circuit 112-3, and the rendering circuit 112-4 can be integrated into any other component (e.g., the main processor 111 or the controller 112-1). At least one of the data conversion circuit 112-2, gamma correction circuit 112-3, and rendering circuit 112-4 may be integrated into the data driver 143, which will be described in more detail herein.

[0072] Memory 120 may be used to store one or more suitable data and input or output data of instructions associated therewith used by at least one component of the electronic device ED (e.g., processor 110 or sensor module 161). Memory 120 may include at least one selected from volatile memory 121 and non-volatile memory 122.

[0073] The input module 130 can be used to receive instructions or data from outside the electronic device ED (e.g., a user or external electronic device 102) that will be used by components of the electronic device ED (e.g., processor 110, sensor module 161, or sound output module 163).

[0074] Input module 130 may include a first input module 131 and a second input module 132, allowing a user to input instructions or data to the first input module 131 and an external electronic device 102 to input instructions or data to the second input module 132. The first input module 131 may include a microphone, mouse, keyboard, buttons (e.g., keypads), or pen (e.g., a passive or active pen). The second input module 132 may be used to support specified protocols that enable wired or wireless connection to the external electronic device 102. According to one or more embodiments, the second input module 132 may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, and / or an audio interface. The second input module 132 may include connectors capable of physical connection to the external electronic device 102 (e.g., an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector)).

[0075] Display module 140 can be used to visually provide information to a user. Display module 140 may include display panel 141, scan driver 142, and data driver 143. Display module 140 may also include a window, chassis, and bracket for protecting display panel 141.

[0076] The display panel 141 may include a liquid crystal display panel, an organic light-emitting display panel, and / or an inorganic light-emitting display panel, and there are no particular limitations on the type (variety) of the display panel 141. The display panel 141 may be a rigid type (variety) or a flexible type (variety) that can be rolled or folded. The display module 140 may also include a support, bracket, or heat dissipation component for supporting the display panel 141.

[0077] The scan driver 142 can be mounted as a driver chip on the display panel 141. In one or more embodiments, the scan driver 142 can be integrated into the display panel 141. For example, the scan driver 142 may include an amorphous (e.g., amorphous silicon TFT gate (ASG) driver circuit, a low-temperature polycrystalline silicon (LTPS) TFT gate driver circuit, or an oxide semiconductor TFT gate (OSG) driver circuit embedded in the display panel 141. The scan driver 142 can be used to receive control signals from the controller 112-1 and output scan signals to the display panel 141 in response to the control signals.

[0078] The display panel 141 may also include a transmitter driver. The transmitter driver can be used to output a transmitter control signal to the display panel 141 in response to a control signal received from the controller 112-1. The transmitter driver may be formed or arranged separately from the scan driver 142, or it may be integrated into the scan driver 142.

[0079] The data driver 143 can be used to receive control signals from the controller 112-1, convert image data into analog voltages (e.g., data voltages) in response to the control signals, and output the data voltages to the display panel 141.

[0080] Data driver 143 can be integrated into another component (e.g., controller 112-1). The functions of the interface conversion circuitry and timing control circuitry of controller 112-1 as described in one or more embodiments can be integrated into data driver 143.

[0081] The display module 140 may also include a transmitter driver and a voltage generation circuit. The voltage generation circuit can be used to output one or more suitable types of voltages desired or required for driving the display panel 141.

[0082] Power module 150 can be used to supply power to components of an electronic device ED. Power module 150 may include a battery that is charged to a power supply voltage. The battery may include a primary battery designed to be non-rechargeable, a secondary battery designed to be rechargeable, and / or a fuel cell. Power module 150 may include a power management integrated circuit (PMIC). The PMIC may be used to supply improved or optimized power to each of the modules described above and those described in more detail later. Power module 150 may include wireless power transmitting / receiving components electrically connected to the battery. The wireless power transmitting / receiving components may include multiple antenna radiators in the form of coils.

[0083] The electronic device ED may also include an internal module 160 and an external module 170. The internal module 160 may include a sensor module 161, an antenna module 162, and a sound output module 163. The external module 170 may include a camera module 171, an optical module 172, and a communication module 173.

[0084] Sensor module 161 can be used to sense input from the user's body and / or input from the pen in the first input module 131, and can be used to generate an electrical signal or data value corresponding to the input. Sensor module 161 may include at least one selected from fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3.

[0085] The fingerprint sensor 161-1 can be used to generate data values ​​corresponding to a user's fingerprint. The fingerprint sensor 161-1 may include one of an optical fingerprint sensor and a capacitive fingerprint sensor.

[0086] Input sensor 161-2 can be used to generate data values ​​corresponding to the coordinate information of user body input and / or pen input. Input sensor 161-2 can be used to generate capacitance changes caused by input as data values. Input sensor 161-2 can be used to sense input from a passive pen, or can exchange data with an active pen.

[0087] Input sensor 161-2 can be used to measure biometric signals such as blood pressure, humidity, and / or body fat. For example, if a user touches a part of his / her body to the sensor layer or sensing panel and does not move it during a given time period, input sensor 161-2 can detect biometric signals based on changes in the electric field caused by the body part and can output desired or appropriate information to display module 140 (e.g., when a user touches a part of his / her body to the sensor layer or sensing panel and does not move it during a given time period, input sensor 161-2 can detect biometric signals based on changes in the electric field caused by the body part and can output desired or appropriate information to display module 140).

[0088] The digitizer 161-3 can be used to generate data values ​​corresponding to the coordinate information input by the pen. The digitizer 161-3 can also be used to generate electromagnetic changes as data values ​​from input. The digitizer 161-3 can be used to sense input from a passive pen or can exchange data with an active pen.

[0089] At least one of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 can be implemented using a sensor layer on display panel 141 via a substantially continuous process. The fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 can be arranged above / on display panel 141, and one of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 (e.g., digitizer 161-3) can be arranged below / under display panel 141.

[0090] At least two of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 may be integrally formed or arranged with a sensing panel using substantially the same process. If they are integrally formed or arranged with a sensing panel, the sensing panel may be positioned between the display panel 141 and a window positioned above / on the display panel 141 (e.g., when integrally formed or arranged with a sensing panel, the sensing panel may be positioned between the display panel 141 and a window positioned above / on the display panel 141). According to one or more embodiments, the sensing panel may be positioned on the window, and the location of the sensing panel is not particularly limited.

[0091] At least one of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 may be embedded in the display panel 141. For example, at least one of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 may be formed or arranged concurrently (e.g., simultaneously) by a process of forming or arranging elements (e.g., light-emitting elements and transistors) included in the display panel 141.

[0092] In one or more embodiments, sensor module 161 may be used to generate electrical signals or data values ​​corresponding to the internal or external states of electronic device ED. Sensor module 161 may also include, for example, gesture sensors, gyroscope sensors, barometric pressure sensors, magnetic sensors, accelerometers, grip sensors, proximity sensors, color sensors, infrared (IR) sensors, biometric sensors, temperature sensors, humidity sensors, and / or illuminance sensors.

[0093] Antenna module 162 may include one or more antennas for transmitting or receiving signals or power from an external source. According to one or more embodiments, communication module 173 may be used to transmit signals to or receive signals from external electronic device 102 via antennas suitable for communication methods. The antenna pattern of antenna module 162 may be integrated with a component of display module 140 (e.g., display panel 141) or input sensor 161-2.

[0094] The sound output module 163, which serves as a means of outputting sound signals to the outside of the electronic device ED, may include, for example, a speaker for general purposes such as multimedia playback or transcription playback, and a receiver specifically for receiving calls. According to one or more embodiments, the receiver and speaker may be implemented integrally or separately. The sound output mode of the sound output module 163 may be integrated with the display module 140.

[0095] Camera module 171 can be used to image still images and / or moving images. According to one or more embodiments, camera module 171 may include one or more lenses, image sensors, or image signal processors. Camera module 171 may also include an infrared camera capable of measuring the presence or absence of a user, the user's position, and the user's line of sight.

[0096] The light module 172 can be used to provide light. The light module 172 may include a light-emitting diode and / or a xenon lamp. The light module 172 can be used to operate in conjunction with the camera module 171, or it can be used to operate independently.

[0097] Communication module 173 can be used to establish a wired or wireless communication channel between electronic device ED and external electronic device 102, and can be used to support communication execution through the established communication channel. Communication module 173 may include one or all of the following: a wireless communication module (such as a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) and a wired communication module (such as a local area network (LAN) communication module or a power line communication module). Communication module 173 can be used to communicate with external electronic device 102 via a short-range communication network (such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a long-range communication network (such as a cellular network, the Internet, or a computer network (e.g., a LAN or a WAN)). One or more suitable types or kinds of communication modules as described herein may be implemented using a single chip or separate chips.

[0098] Input module 130, sensor module 161 and / or camera module 171, etc., can be used in conjunction with processor 110 to control the operation of display module 140.

[0099] Processor 110 can be used to output instructions or data to display module 140, sound output module 163, camera module 171, or optical module 172 based on input data received from input module 130. For example, processor 110 can be used to generate image data corresponding to input data applied by a mouse or active pen, and can be used to output the image data to display module 140. In one or more embodiments, processor 110 can be used to generate instruction data corresponding to input data, and can be used to output the instruction data to camera module 171 or optical module 172. If no input data is received from input module 130 during a given time period, processor 110 can switch the operating mode of electronic device ED to a low-power mode or sleep mode, thereby reducing the power consumption of electronic device ED (e.g., when no input data is received from input module 130 during a given time period, processor 110 can switch the operating mode of electronic device ED to a low-power mode or sleep mode, thereby reducing the power consumption of electronic device ED).

[0100] Processor 110 can be used to output instructions or data to display module 140, sound output module 163, camera module 171, or optical module 172 based on sensing data received from sensor module 161. For example, processor 110 can be used to compare authentication data obtained by fingerprint sensor 161-1 with authentication data stored in memory 120, and then can be used to execute an application based on the comparison result. Processor 110 can be used to execute instructions based on sensing data sensed by input sensor 161-2 or digitizer 161-3, or can be used to output image data corresponding to the sensing data to display module 140. If sensor module 161 includes a temperature sensor, processor 110 can receive temperature data associated with the measured temperature from sensor module 161, and can also perform brightness correction on image data based on the temperature data (e.g., when sensor module 161 includes a temperature sensor, processor 110 can receive temperature data associated with the measured temperature from sensor module 161, and can also perform brightness correction on image data based on the temperature data).

[0101] Processor 110 can be used to receive measurement data from camera module 171 regarding the presence or absence of a user, the user's position, and the user's gaze. Processor 110 can also be used to perform brightness correction on image data based on the measurement data. For example, processor 110, which determines the presence or absence of a user based on input from camera module 171, can be used to output image data whose brightness has been corrected by data conversion circuit 112-2 or gamma correction circuit 112-3 to display module 140.

[0102] One or more components, as described in one or more embodiments, can be connected to each other via communication schemes between peripheral devices (e.g., buses, general purpose input / output (GPIO), serial peripheral interfaces (SPI), mobile industrial processor interfaces (MIPI), or hyperpath interconnect (UPI) links) and can be used to exchange signals (e.g., instructions or data). Processor 110 can be used to communicate with display module 140 via a given interface. For example, one of the communication methods described in one or more embodiments can be used, and embodiments of this disclosure are not limited thereto.

[0103] The electronic device ED according to one or more embodiments of this disclosure can be implemented as one or more suitable types (classes) of devices. The electronic device ED may include at least one selected from, for example, portable communication devices (e.g., smartphones), tablet devices, portable multimedia devices, wearable devices, and home appliances. The electronic device ED according to one or more embodiments of this disclosure is not limited to the devices described in one or more embodiments. Figure 1B The AR glasses shown, such as Figure 1CThe vehicle display device of one or more suitable types (categories) shown, and such as Figure 1D The smartwatch shown can be implemented as the electronic device ED disclosed herein.

[0104] Reference Figures 2A to 2C The electronic device ED may include a display surface FS defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The electronic device ED can be used to provide an image IM to a user through the display surface FS. The image IM can also be provided on a third-party direction DR3.

[0105] The display surface FS of an electronic device ED according to one or more embodiments may include a display area F-AA and a peripheral area F-NAA. The electronic device ED can be used to display an image IM through the display area F-AA. The peripheral area F-NAA may be adjacent to the display area F-AA. The peripheral area F-NAA may not be used to display the image IM and may have a specific (e.g., set or predetermined) color. The peripheral area F-NAA may surround the display area F-AA (e.g., around the display area F-AA). However, it is not limited thereto; the peripheral area F-NAA may be arranged to be adjacent only to one side of the display area F-AA, or the peripheral area F-NAA may not be provided. The electronic device ED according to one or more embodiments of this disclosure may include an effective area having one or more suitable shapes, and is not limited to any one or more embodiments.

[0106] The display surface FS may also include a sensing area EMA. One or more suitable electronic modules may be arranged in the sensing area EMA. For example, the electronic modules may include at least one selected from a camera module, a light detection sensor, and a thermal detection sensor. The sensing area EMA may be surrounded by the display area F-AA. Although a sensing area EMA is shown as an example, the number of sensing areas EMA is not limited to this.

[0107] The sensing area EMA can be part of the display area F-AA. Therefore, the sensing area EMA can also be used to display the image IM. For example, if the electronic module arranged in the sensing area EMA is deactivated, the sensing area EMA can display the image IM as part of the display area F-AA (e.g., when the electronic module arranged in the sensing area EMA is deactivated, the sensing area EMA can display the image IM as part of the display area F-AA).

[0108] The electronic device ED and / or display surface FS may include a folded region FA and non-folded regions NFA1 and NFA2. The electronic device ED may include multiple non-folded regions NFA1 and NFA2. In one or more embodiments, the electronic device ED may include a first non-folded region NFA1 and a second non-folded region NFA2, with the folded region FA disposed between the first non-folded region NFA1 and the second non-folded region NFA2. In one or more embodiments, although... Figures 2A to 2C One or more embodiments of an electronic device ED including a folded region FA are shown, but the embodiments disclosed herein are not limited thereto, and the electronic device ED may include multiple folded regions.

[0109] Reference Figure 2B and Figure 2C The electronic device ED can be folded relative to a folding axis FX extending in one direction. For example... Figure 2B and Figure 2C The folding axis FX shown can be a virtual axis extending in the second direction DR2. The folding axis FX can be defined to overlap with the folding region FA and can be parallel (e.g., substantially parallel) to the direction of the long side of the electronic device ED.

[0110] Reference Figure 2B The electronic device ED can be folded such that the first non-folded region NFA1 and the second non-folded region NFA2 are opposite each other (e.g., facing each other). For example, the electronic device ED can be folded inwards so that the display surface FS is not exposed to the outside. (See reference...) Figure 2C The electronic device ED according to one or more embodiments of the present disclosure can be folded outward so that the display surface FS is exposed to the outside.

[0111] Figure 3 This is an exploded perspective view of an electronic device ED according to one or more embodiments of the present disclosure.

[0112] An electronic device ED according to one or more embodiments of the present disclosure may include a display panel DP and a window WM arranged on the display panel DP.

[0113] The display panel DP can be an emissive display panel. For example, the display panel DP can be an organic light-emitting display panel, an inorganic light-emitting display panel, a micro LED display panel, a micro OLED display panel, and / or a nano LED display panel.

[0114] The display panel (DP) can include a display area (DP-DA) and a non-display area (DP-NDA). The display area (DP-DA) can be an area with pixels arranged in it. The display area (DP-DA) can be used to generate references, etc. Figures 2A to 2CThe image IM is described. The display area of ​​the display panel DP-DA can be compared with that shown in the reference. Figures 2A to 2C The description corresponds to the display area F-AA. The non-display area DP-NDA can be compared with the referenced area. Figures 2A to 2C The description of the peripheral regions corresponds to F-NAA. In this disclosure, if the regions overlap, it is sufficient or appropriate to say "one region (e.g., part) corresponds to another region (e.g., part)" (e.g., when the regions overlap, it is sufficient or appropriate to say "one region (e.g., part) corresponds to another region (e.g., part)"), and is not limited to substantially the same shape and substantially the same area.

[0115] The display panel DP may include folded areas FA-D, first non-folded areas NFA1-D, and second non-folded areas NFA2-D, which correspond to the folded areas FA, first non-folded areas NFA1, and second non-folded areas NFA2 of the electronic device ED, respectively.

[0116] Windows WM can provide references as follows Figures 2A to 2C The described display surface FS. For example, a window WM can provide the front surface of an electronic device ED. The window WM may include a folded area FA-W, a first non-folded area NFA1-W, and a second non-folded area NFA2-W, respectively corresponding to the folded area FA, the first non-folded area NFA1, and the second non-folded area NFA2 of the electronic device ED.

[0117] A window WM may include a substrate and a border pattern disposed on one surface of the substrate. The area with the border pattern may be defined as shown in the reference. Figures 2A to 2C The outer region F-NAA is described. In one or more embodiments of this disclosure, a border pattern may not be provided.

[0118] exist Figure 3 The diagram illustrates one or more components of an electronic device ED (such as a display panel DP and a window WM). For example, the electronic device ED may also include a protective layer disposed on the window WM, an input sensor disposed between the window WM and the display panel DP, and a support plate, a buffer layer, an electronic module, and a housing disposed beneath the display panel DP. The electronic module disposed beneath the display panel DP may include, as shown in the reference diagram... Figure 1A The processor 110, memory 120, and power module 150 are described. In one or more embodiments, the electronic device ED may further include, as referenced... Figures 2A to 2C Other components described.

[0119] Figure 4A This is a cross-sectional view of a window WM according to one or more embodiments of the present disclosure. Figure 4B yes Figure 4A An enlarged sectional view of a portion of the document. Figure 4C This is a cross-sectional view of a window WM according to one or more embodiments of the present disclosure.

[0120] Reference Figure 4A and Figure 4B A window WM may include a glass substrate GS and a resin layer RL disposed on one surface of the glass substrate GS. The glass substrate GS may be a chemically strengthened glass substrate. The resin layer RL may include acrylic resin, epoxy resin, silicone resin, urethane resin, urethane acrylic resin, mixed sol-gel resin, and / or siloxane resin. A window WM having the structure described in one or more embodiments may have improved or enhanced impact resistance through the resin layer RL while maintaining the optical and design properties of the glass substrate GS.

[0121] The glass substrate GS may include a first surface S1 and a second surface S2 that are opposite to each other (e.g., facing each other) on a third-direction DR3, and the resin layer RL may include a first surface S10 and a second surface S20 that are opposite to each other (e.g., facing each other) on a third-direction DR3. Figure 4A and Figure 4B In the diagram, the first surface S1 of the glass substrate GS is shown as the upper surface of the glass substrate GS, and the first surface S10 of the resin layer RL is shown as the upper surface of the resin layer RL. The first surface S10 of the resin layer RL can be the upper surface of the window WM. The first surface S1 of the glass substrate GS and the second surface S20 of the resin layer RL can be in contact with each other.

[0122] The glass substrate GS and the resin layer RL can have different thicknesses depending on the region. The first portion GS1 of the glass substrate GS corresponding to the folded region FA-W can have a thickness smaller than the thickness of the second portion GS2 of the glass substrate GS corresponding to the first unfolded region NFA1-W and the thickness of the third portion GS3 of the glass substrate GS corresponding to the second unfolded region NFA2-W. The first portion RL1 of the resin layer RL corresponding to the folded region FA-W can have a thickness larger than the thickness of the second portion RL2 of the resin layer RL corresponding to the first unfolded region NFA1-W and the thickness of the third portion RL3 of the resin layer RL corresponding to the second unfolded region NFA2-W.

[0123] The first part GS1 of the glass substrate GS may be formed or arranged with [something] in [something]. Figure 2B and Figure 2C The region of the groove GV extends in a direction parallel (e.g., substantially parallel) to the folding axis FX. The groove GV may have a substantially constant width in the first direction DR1 and may extend in the second direction DR2.

[0124] The first portion RL1 of the resin layer RL can fill the groove GV. The second surface S2 of the glass substrate GS can provide a flat surface (e.g., a substantially flat surface), and the first surface S10 of the resin layer RL can provide a flat surface (e.g., a substantially flat surface). Therefore, the window WM can have a substantially uniform thickness.

[0125] There are no particular restrictions on the shape of the groove GV in the cross section. Figure 4B A groove GV is shown, defined by a flat bottom surface BS and two symmetrically inclined surfaces IS. The bottom surface BS and the two inclined surfaces IS can be different portions of the first surface S1 of the glass substrate GS.

[0126] According to this disclosure, the locations of the glass substrate GS and the resin layer RL are not limited to, as shown in the figure. Figure 4A and Figure 4B One or more embodiments of the window WM shown. Figure 4C It shows if with such Figure 4A and Figure 4B Compared to the glass substrate GS and resin layer RL of the window WM shown, the window WM in which the glass substrate GS and resin layer RL are reversed (e.g., Figure 4C It shows when with, as Figure 4A and Figure 4B The window WM shown is a window where the glass substrate GS and resin layer RL are inverted (as shown in the window WM).

[0127] In one or more embodiments of this disclosure, the stacking structure of the window WM can be modified. In one or more embodiments of this disclosure, the resin layer RL may be omitted. In one or more embodiments of this disclosure, the resin layer RL can be replaced by an adhesive layer such as a pressure-sensitive adhesive sheet. A protective film may be additionally disposed on the adhesive layer.

[0128] Figure 5A This is a cross-sectional view illustrating a method for manufacturing a window WM according to one or more embodiments of the present disclosure. Figure 5B A chemical strengthening method for GS glass substrates is shown.

[0129] exist Figure 5A and Figure 5B In China, based on Figure 4B The glass substrate GS is shown. It may not be provided as referenced. Figures 4A to 4C A more detailed description of the component that is essentially the same as the one described, and will refer to Figures 4A to 4C Describe it.

[0130] like Figure 5AAs shown, grooves GV can be formed or arranged on a glass substrate GS. Grooves GV can be formed or arranged on a surface of a glass substrate GS having a substantially constant thickness using chemical etching and / or mechanical processing methods.

[0131] Next, chemical strengthening can be performed on the glass substrate GS having grooves GV formed or arranged thereon. Chemical strengthening can include ion exchange. The first portion GS1, the second portion GS2, and the third portion GS3 can be subjected to substantially the same chemical strengthening. Tensile stress regions TP and compressive stress regions SP1 and SP2 can be formed or arranged in the glass substrate GS. The first compressive stress region SP1 and the second compressive stress region SP2 can be formed or arranged on opposite sides of the tensile stress region TP in the third direction DR3. The first compressive stress region SP1 can have a first depth from the first surface S1, and the second compressive stress region SP2 can have a second depth from the second surface S2. Because substantially the same chemical strengthening is performed on the first surface S1 and the second surface S2, the first compressive stress region SP1 and the second compressive stress region SP2 on opposite sides can have substantially the same thickness and / or substantially the same depth. For example, the first depth and the second depth can be substantially the same.

[0132] Figure 5B The ion exchange method is illustrated schematically. A glass substrate GS having grooves GV formed or arranged thereon can be chemically strengthened using a salt containing a specific or suitable ionic salt (e.g., a liquid ionic salt). Multiple potassium ions (K ions) can be supplied to the glass substrate GS. + Therefore, the glass substrate GS can include a medium and sodium ions (Na+) dispersed in the medium. + ) and potassium ions (K + Potassium ions (K) + ) can replace sodium ions (Na) dispersed in the medium + And it can be absorbed from ionic salts into the glass substrate GS.

[0133] Based on potassium ions (K + ) and sodium ions (Na) + The degree of substitution determines the magnitude of surface stress (e.g., surface compressive stress), the magnitude of internal stress (e.g., internal tensile stress), and the depth of compressive stress regions SP1 and SP2 (e.g., layer depth DOL). Figure 6In one or more embodiments, the magnitude of the surface stress (e.g., surface compressive stress), the magnitude of the internal stress (e.g., internal tensile stress), and the depth of the compressive stress regions SP1 and SP2 (e.g., layer depth DOL) can be determined according to one or more suitable chemical strengthening methods for the glass substrate GS. The magnitude of the surface stress (e.g., surface compressive stress) and the layer depth DOL can be determined by the ion exchange time and ion exchange temperature.

[0134] Then, as Figure 5A As shown, a resin layer RL can be formed or disposed on the first surface S1 of the glass substrate GS. In one or more embodiments of this disclosure, the resin layer RL can be formed or disposed by coating the first surface S1 of the glass substrate GS with liquid resin and then drying the liquid resin.

[0135] Figure 6 It is a graph depicting the stress variation of a glass substrate GS according to one or more embodiments of the present disclosure. Figure 7 It describes the internal stress difference between a first reference point and a second reference point of a glass substrate GS according to one or more embodiments of the present disclosure. A graph showing the ratio of CT (e.g., internal tensile stress difference) to the thickness t2 of the second reference point and the thickness t1 of the first reference point.

[0136] For reference Figure 5A and Figure 5B As described, the chemically strengthened glass substrate GS may include a first compressive stress region SP1, a second compressive stress region SP2, and a tensile stress region TP defined in the thickness direction between the first compressive stress region SP1 and the second compressive stress region SP2. In one or more embodiments, the second portion GS2 and the third portion GS3 may include substantially the same first compressive stress region SP1, substantially the same second compressive stress region SP2, and substantially the same tensile stress region TP, and therefore the following description will focus on the second portion GS2.

[0137] Figure 6 The first curve G1 represents the first part GS1 (refer to...) Figure 5A The stress change is represented by the second curve G2, which represents the second part GS2 (refer to...). Figure 5A Stress changes.

[0138] Reference Figure 5A and Figure 6 The first curve G1, the compressive stress CS, can appear on the first surface S1 and the second surface S2 of the first part GS1. This compressive stress can be defined as surface compressive stress. The magnitude of the compressive stress can decrease from the first surface S1 and the second surface S2 toward the interior of the first part GS1. For example, the compressive stress can decrease linearly.

[0139] Compressive stress may be substantially ineffective at a specific (e.g., set or predetermined) depth, and this depth may be defined as the layer depth DOL. Tensile stress may occur inside the first portion GS1 at a depth greater than the layer depth DOL. Tensile stress may increase with increasing distance from the first surface S1 or the second surface S2. For example, tensile stress may increase linearly. Tensile stress may have a maximum value at a specific (e.g., set or predetermined) depth. Tensile stress may cease to increase and may remain substantially balanced at a specific (e.g., set or predetermined) depth. The expression "tensile stress remains substantially balanced" used herein is not necessarily limited to substantially the same value. Tensile stress may be considered to be in a substantially balanced state within a depth range in which the change in tensile stress is significantly smaller compared to the tensile stress in a section where tensile stress increases (e.g., tensile stress may be considered to be in a substantially balanced state within a depth range in which the change in tensile stress is significantly smaller compared to the tensile stress in a section where tensile stress increases).

[0140] Tensile stress in a state of basic equilibrium can be defined as internal tensile stress CT. The region where compressive stress acts in the first part GS1 can be as shown in the reference... Figure 5A The first compressive stress region SP1 and the second compressive stress region SP2 are described, and the region where tensile stress acts in the first part GS1 can be as shown in the reference. Figure 5A The tensile stress region TP is described.

[0141] Referring to the second curve G2, even in the case of the second part GS2, compressive stress can act on the first surface S1 and the second surface S2, and tensile stress can also act on the region with a depth greater than the layer depth DOL.

[0142] Because of the reference Figure 5A and Figure 5B The first portion GS1 and the second portion GS2 described perform substantially the same chemical strengthening, so the first portion GS1 and the second portion GS2 can have substantially the same surface compressive stress CS. In one or more embodiments, the first portion GS1 and the second portion GS2 can have substantially the same layer depth DOL.

[0143] Because the second part GS2 is thicker than the first part GS1, the second part GS2 can have a tensile stress region TP that is thicker than that of the first part GS1. Because the second part GS2 has a thicker tensile stress region TP than the first part GS1, the second part GS2 can have a relatively small internal tensile stress CT. Because the tensile stress occurring at a point in the first part GS1 and the tensile stress occurring at a point in the second part GS2 are substantially the same, if the thickness of the tensile stress region TP is large, the internal tensile stress CT can be small (e.g., when the thickness of the tensile stress region TP is large, the internal tensile stress CT can be small). If the tensile stress occurring at a point in the first part GS1 and the tensile stress occurring at a point in the second part GS2 are substantially the same, this can refer to the area below the layer depth DOL of the first curve G1 and the area below the layer depth DOL of the second curve G2 being substantially the same (e.g., when the tensile stress occurring at a point in the first part GS1 and the tensile stress occurring at a point in the second part GS2 are substantially the same, this can refer to the area below the layer depth DOL of the first curve G1 and the area below the layer depth DOL of the second curve G2 being substantially the same).

[0144] For example, the first portion GS1 may have a first internal tensile stress CT1, and the second portion GS2 may have a second internal tensile stress CT2 that does not exceed (e.g., is equal to or less than) the first internal tensile stress CT1. The first internal tensile stress CT1 may have a maximum value at the point of minimum thickness of the first portion GS1 (hereinafter referred to as the first reference point). (Refer to...) Figure 5A A point on the bottom surface BS can have a larger first internal tensile stress CT1 than a point on the inclined surface IS.

[0145] The second internal tensile stress CT2 can have a minimum value at the point of maximum thickness of the second part GS2 (hereinafter referred to as the second reference point). Because the second part GS2 has substantially the same thickness, the second part GS2 can have substantially the same second internal tensile stress CT2, regardless of the measurement point.

[0146] As a result, a difference in internal tensile stress CT may occur between the first part GS1 and the second part GS2. CT. Difference in internal tensile stress CT The maximum value of CT may occur between the first reference point and the second reference point.

[0147] If the first part GS1 has a larger internal tensile stress CT than the second part GS2, this means that the expansion property of the tensile stress region TP of the first part GS1 (with an area smaller than the area of ​​the tensile stress region TP of the second part GS2) can be greater than the expansion property of the tensile stress region TP of the second part GS2 (for example, when the first part GS1 has a larger internal tensile stress CT than the second part GS2, this means that the expansion property of the tensile stress region TP of the first part GS1 (with an area smaller than the area of ​​the tensile stress region TP of the second part GS2) can be greater than the expansion property of the tensile stress region TP of the second part GS2). This means that as the difference in internal tensile stress CT... As CT increases, the expansion properties of the tensile stress region TP in the first part GS1 can be greater than those in the second part GS2.

[0148] Table 1 shows the distortions of the first part GS1 depending on whether the example shows them.

[0149] Table 1

[0150] According to Table 1, in Experimental Examples 1 to 6, the surface compressive stress CS1 (hereinafter referred to as the first surface compressive stress) was measured at a first reference point where the minimum thickness of the first portion GS1 was 30 μm, and the surface compressive stress CS2 (hereinafter referred to as the second surface compressive stress) was measured at a second reference point where the maximum thickness of the second portion GS2 was 50 μm. The internal tensile stress CT1 (hereinafter referred to as the first internal tensile stress) was calculated at the first reference point, and the internal tensile stress CT2 (hereinafter referred to as the second internal tensile stress) was calculated at the second reference point. In one or more embodiments, the layer depth DOL of the first portion GS1 and the layer depth DOL of the second portion GS2 were measured.

[0151] In Experimental Examples 1 through 6, chemical strengthening was performed so that the first part GS1 and the second part GS2 had substantially the same layer depth DOL.

[0152] Chemical strengthening of the glass substrate under different chemical strengthening conditions results in variations in the first surface compressive stress CS1 and the second surface compressive stress CS2, depending on the embodiment. For example, if chemical strengthening is performed at a relatively low temperature, a relatively long chemical strengthening time is desired or required to achieve the desired or suitable layer depth DOL (e.g., when chemical strengthening is performed at a relatively low temperature, a relatively long chemical strengthening time is desired or required to achieve the desired or suitable layer depth DOL). If chemical strengthening is performed under such conditions, a chemically strengthened glass substrate with relatively high first surface compressive stress CS1 and relatively high second surface compressive stress CS2 can be manufactured (e.g., when chemical strengthening is performed under such conditions, a chemically strengthened glass substrate with relatively high first surface compressive stress CS1 and relatively high second surface compressive stress CS2 can be manufactured). Conversely, if chemical strengthening is performed at a relatively high temperature, a relatively short chemical strengthening time is desired or required to achieve the desired or suitable layer depth DOL (e.g., when chemical strengthening is performed at a relatively high temperature, a relatively short chemical strengthening time is desired or required to achieve the desired or suitable layer depth DOL). As a result, the first surface compressive stress CS1 and the second surface compressive stress CS2 can be reduced. If the chemical strengthening temperature is changed to achieve the desired or suitable layer depth DOL as described in one or more embodiments, the chemical strengthening time can be varied (e.g., the chemical strengthening time can be varied when the chemical strengthening temperature is changed to achieve the desired or suitable layer depth DOL as described in one or more embodiments). The first surface compressive stress CS1 and the second surface compressive stress CS2 can be varied under different chemical strengthening conditions.

[0153] In each of Experimental Examples 1 to 6, the first surface compressive stress CS1 and the second surface compressive stress CS2 can be substantially the same as each other. This is because, in one experimental example, the first part CS1 and the second part CS2 are chemically strengthened in substantially the same way. As can be seen in Table 1, there are slight errors in the first surface compressive stress CS1 and the second surface compressive stress CS2 due to the influence of the experimental environment.

[0154] Referring to Table 1, it can be seen that if the difference between the internal tensile stress CT in Experimental Examples 1 to 5 is... Compared to CT, the difference in internal tensile stress CT in Experimental Example 6 is... The CT is relatively small (e.g., when compared with the internal tensile stress CT in Experimental Examples 1 to 5). When compared to CT, the difference in internal tensile stress CT in Experimental Example 6 (CT is relatively small), and no deformation of the first part GS1 was observed in Experimental Example 6. If the difference in internal tensile stress CT... If the CT is small, the tensile stress region TP of the first part GS1 can expand relatively little (e.g., when the difference in internal tensile stress CT is small). When the CT is small, the tensile stress region TP of the first part GS1 can expand relatively little, thus preventing deformation of the first part GS1. Experimental Example 6 shows that if the difference in internal tensile stress CT... If the CT is 103 MPa, then the deformation of the first part GS1 will not occur (for example, when the difference in internal tensile stress CT). When the CT is 103 MPa, deformation of the first part GS1 may not occur. Based on this, it can be more reliably ensured that if the difference in internal tensile stress CT... If the CT is 100 MPa or less, deformation of the first part of GS1 may not occur (e.g., when the difference in internal tensile stress CT is...). When the CT is 100 MPa or less, deformation of the first part GS1 may not occur.

[0155] This is obtained by measuring the stress change at a point in the first part GS1. Figure 6 The first curve G1 is obtained by measuring the stress change at a point in the second part GS2. Figure 6 The second curve G2. A point in the first portion GS1 may be a first reference point as described in one or more embodiments. A point in the second portion GS2 may be a second reference point as described in one or more embodiments.

[0156] The difference in internal tensile stress between the first reference point and the second reference point CT can be calculated using Equations 1A and 1.

[0157] In Experimental Example 6, an internal tensile stress difference of 100 MPa or less has been described. A glass substrate for CT. However, according to this disclosure, the glass substrate is not limited to this.

[0158] Even if the internal tensile stress difference calculated by Equation 1A or Equation 1 is satisfied... Glass substrates with a CT of 100 MPa or less have different specifications than the glass substrate of Experimental Example 6, and can also suppress or reduce deformation defects as described in one or more embodiments.

[0159] Equation 1A

[0160] In Equation 1A, t1 can be the thickness of the first reference point. t2 can be the thickness of the second reference point. It can be assumed that the first part GS1 and the second part GS2 have substantially the same layer depth DOL.

[0161] The layer depth DOL can be controlled or selected through chemical strengthening conditions, and the Ratio can be expressed as the ratio of the layer depth DOL to the thickness t1 at the first reference point. Recombination of Equation 1A can produce Equation 1.

[0162] Equation 1

[0163] Therefore, the internal tensile stress difference can be determined by the ratio between the thickness t2 of the second reference point and the thickness t1 of the first reference point, the first surface compressive stress CS1, the second surface compressive stress CS2, and the ratio of the layer depth DOL to the thickness t1 of the first reference point. CT scan.

[0164] In one or more embodiments, the surface compressive stress CS can be in the range of 500 MPa to 700 MPa, and the ratio of the layer depth DOL to the thickness t1 of the first reference point Ratio can be in the range of 0.15 to 0.25. For example, the layer depth DOL can be in the range of 15% to 25% of the thickness t1 of the first reference point. t1 can be in the range of 20 μm to 50 μm, and t2 can be in the range of 30 μm to 300 μm.

[0165] Within the aforementioned numerical range, the internal tensile stress difference CT can be determined by the ratio between the thickness t2 of the second reference point and the thickness t1 of the first reference point. Figure 7 Nine curves are shown. Figure 7 In the curves, the first surface compressive stress CS1 and the second surface compressive stress CS2 are represented as surface compressive stress CS, and it is assumed that the first surface compressive stress CS1 and the second surface compressive stress CS2 are equal to each other. The unit of surface compressive stress CS is not provided, and the layer depth DOL is expressed as a percentage (%) of the thickness t1 relative to the first reference point.

[0166] Reference Figure 7 The curve shows that as the surface compressive stress CS increases, the internal tensile stress difference... CT can be increased, and as the ratio of layer depth DOL to the thickness t1 of the first reference point increases, the internal tensile stress difference increases. CT scans can increase the size of the image.

[0167] It can be seen that as the surface compressive stress CS increases or the ratio of the layer depth DOL to the thickness t1 of the first reference point increases, the ratio of the thickness t2 of the second reference point to the thickness t1 of the first reference point (without deformation) is limited. If the surface compressive stress CS is large or the ratio of the layer depth DOL to the thickness t1 of the first reference point is large, then the ratio of the thickness t2 of the second reference point to the thickness t1 of the first reference point must be small so that no deformation occurs in the first part GS1 (for example, when the surface compressive stress CS is large or the ratio of the layer depth DOL to the thickness t1 of the first reference point is large, the ratio of the thickness t2 of the second reference point to the thickness t1 of the first reference point must be small so that no deformation occurs in the first part GS1). Conversely, if the surface compressive stress CS is small or the ratio of the layer depth DOL to the thickness t1 of the first reference point is small, then even if the ratio of the thickness t2 of the second reference point to the thickness t1 of the first reference point is large, no deformation may occur in the first part GS1 (for example, when the surface compressive stress CS is small or the ratio of the layer depth DOL to the thickness t1 of the first reference point is small, even if the ratio of the thickness t2 of the second reference point to the thickness t1 of the first reference point is large, no deformation may occur in the first part GS1). This can be seen from the fact that in the curve where the surface compressive stress CS is 500 MPa and the layer depth DOL is 15% of the thickness t1 of the first reference point, the internal tensile stress difference... CT is less than or equal to (e.g., not exceeding) 100 MPa, and is independent of the ratio between the thickness t2 of the second reference point and the thickness t1 of the first reference point.

[0168] Figures 8A to 8C This is a view showing glass substrates (GS) with various shapes. For example... Figures 8A to 8C The glass substrate GS shown may include a first portion GS1 having a cross-sectional shape different from the cross-sectional shape of the glass substrate GS as described in one or more embodiments.

[0169] like Figure 8A As shown, the first part GS1 may include multiple parts with different thicknesses. Figure 8B As shown, the first portion GS1 may include two inclined surfaces defining a groove. Figure 8C As shown, the first portion GS1 may include a concave curved surface defining a groove. Figures 8A to 8C The image shows the thickness t1 of the first reference point and the thickness t2 of the second reference point. (Refer to...) Figures 5A to 7 , Figures 8A to 8C The glass substrate GS shown in the figure has one or more suitable shapes that can meet the deformation-free condition and, in the specification that satisfies Equation 1A or Equation 1, may not exhibit deformation in the first part GS1.

[0170] As described in one or more embodiments, deformation of the glass substrate (e.g., the degree or occurrence of deformation) can be reduced. Furthermore, the strength of the glass substrate can be improved or enhanced, and stress generated during folding (e.g., the degree or occurrence of stress) can be reduced.

[0171] Any numerical range described herein is intended to include all subranges with the same numerical precision contained within the range. For example, the range “1.0 to 10.0” is intended to include all subranges between (and including) a minimum value of 1.0 and a maximum value of 10.0, such as having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, for example, 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit described herein is intended to include all higher numerical limits contained therein. Therefore, the applicant reserves the right to amend this specification (including the claims) to expressly describe any subranges contained within the range expressly described herein.

[0172] In one or more embodiments, the impact resistance of the window can be increased or enhanced.

[0173] The display device, electronic device, electronic device, device for manufacturing substantially the same, and / or any other related device or component according to one or more embodiments of this disclosure can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuit), software, or a combination of software, firmware, and hardware (e.g., any suitable). For example, one or more components of the device may be provided on an integrated circuit (IC) chip or a separate IC chip. Furthermore, one or more components of the device may be implemented on a flexible printed circuit film, tape-on-a-carrier package (TCP), and / or printed circuit board (PCB), or disposed on a substrate. Additionally, one or more components of the device may be a process or thread running on one or more processors in one or more computing devices, executing computer program instructions and interacting with other system components to perform one or more functions described herein. The computer program instructions may be stored in a memory, which may be implemented in a computing device utilizing standard memory devices, such as random access memory (RAM). The computer program instructions may also be stored in other non-transitory computer-readable media, such as CD-ROMs and / or flash drives. Furthermore, those skilled in the art will recognize that, without departing from the scope of this disclosure, the functions of one or more computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed across one or more other computing devices.

[0174] While the subject matter of this disclosure has been described in conjunction with exemplary embodiments that are now considered practical, it will be apparent to those skilled in the art that one or more suitable changes and modifications may be made thereto without departing from the spirit and scope of this disclosure as set forth in the appended claims and their equivalents.

Claims

1. A glass substrate, the glass substrate comprising: The first part has a groove defined on the first part; as well as The second part is arranged to extend from the first part and be thicker than the first part. Each of the first part and the second part includes: The first compressive stress region has a first depth from the first surface; A second compressive stress region has a second depth from a second surface, the second surface being arranged opposite to the first surface; and The tensile stress region is located between the first compressive stress region and the second compressive stress region, and The difference between the internal tensile stress at the point with the minimum thickness in the first part and the internal tensile stress at the point with the maximum thickness in the second part. The CT pressure should not exceed 100 MPa.

2. The glass substrate according to claim 1, wherein, The first depth of the first compressive stress region of the first part is the same as the second depth of the first compressive stress region of the second part.

3. The glass substrate according to claim 1, wherein, The difference between the internal tensile stress at the point of the first portion having the minimum thickness and the internal tensile stress at the point of the second portion having the maximum thickness. CT satisfies Equation 1: Equation 1 and Wherein, CS1 is defined as the surface compressive stress of the first part, CS2 is defined as the surface compressive stress of the second part, t1 is defined as the thickness of the point in the first part having the minimum thickness, t2 is defined as the thickness of the point in the second part having the maximum thickness, and Ratio is defined as the value obtained by dividing the layer depth of the first part or the second part by t1, wherein the layer depth of the first part or the second part is the first depth or the second depth, and the first depth and the second depth are the same.

4. The glass substrate according to claim 3, wherein, The surface compressive stress in the first part is the same as the surface compressive stress in the second part.

5. The glass substrate according to claim 3, wherein, The ratio is in the range of 0.15 to 0.

25.

6. The glass substrate according to claim 3, wherein, The surface compressive stress of the first part and the surface compressive stress of the second part are both in the range of 500 MPa to 700 MPa.

7. The glass substrate according to claim 3, wherein, The thickness of the point having the minimum thickness in the first portion is in the range of 20 μm to 50 μm, and the thickness of the point having the maximum thickness in the second portion is in the range of 30 μm to 300 μm.

8. A window, the window comprising: Glass substrate; as well as A resin layer is placed on one surface of the glass substrate. The glass substrate includes: The first part defines a groove filled with the resin layer on the first part; and The second part is arranged to extend from the first part and be thicker than the first part. Each of the first part and the second part includes: The first compressive stress region has a first depth from the first surface; A second compressive stress region has a second depth from a second surface, the second surface being arranged opposite to the first surface; and The tensile stress region is located between the first compressive stress region and the second compressive stress region, and The difference between the internal tensile stress at the point with the minimum thickness in the first part and the internal tensile stress at the point with the maximum thickness in the second part. The CT pressure should not exceed 100 MPa.

9. The window according to claim 8, wherein, The resin layer is stacked with the first portion and the second portion, and The thickness of the portion of the window corresponding to the first part and the thickness of the portion of the window corresponding to the second part are the same.

10. The window according to claim 8, wherein, The first depth of the first compressive stress region of the first part is the same as the second depth of the first compressive stress region of the second part.

11. The window according to claim 8, wherein, The difference between the internal tensile stress at the point of the first portion having the minimum thickness and the internal tensile stress at the point of the second portion having the maximum thickness. CT satisfies Equation 1: Equation 1 and Wherein, CS1 is defined as the surface compressive stress of the first part, CS2 is defined as the surface compressive stress of the second part, t1 is defined as the thickness of the point in the first part having the minimum thickness, t2 is defined as the thickness of the point in the second part having the maximum thickness, and Ratio is defined as the value obtained by dividing the layer depth of the first part or the second part by t1, wherein the layer depth of the first part or the second part is the first depth or the second depth, and the first depth and the second depth are the same.

12. The window according to claim 11, wherein, The surface compressive stress in the first part is the same as the surface compressive stress in the second part.

13. The window according to claim 11, wherein, The ratio is in the range of 0.15 to 0.

25.

14. The window according to claim 11, wherein, The surface compressive stress of the first part and the surface compressive stress of the second part are both in the range of 500 MPa to 700 MPa.

15. The window according to claim 11, wherein, The thickness of the point having the minimum thickness in the first portion is in the range of 20 μm to 50 μm, and the thickness of the point having the maximum thickness in the second portion is in the range of 30 μm to 300 μm.

16. An electronic device, the electronic device comprising: Display panel; as well as A window, arranged on the display panel, includes a glass substrate and a resin layer on one surface of the glass substrate. The glass substrate includes: The first part defines a groove filled with the resin layer on the first part; and The second part is arranged to extend from the first part and be thicker than the first part. Each of the first part and the second part includes: The first compressive stress region has a first depth from the first surface; A second compressive stress region has a second depth from a second surface, the second surface being arranged opposite to the first surface; and The tensile stress region is located between the first compressive stress region and the second compressive stress region, and The difference between the internal tensile stress at the point with the minimum thickness in the first part and the internal tensile stress at the point with the maximum thickness in the second part. The CT pressure should not exceed 100 MPa.

17. The electronic device according to claim 16, wherein, The resin layer is stacked with the first portion and the second portion, and The thickness of the portion of the window corresponding to the first part and the thickness of the portion of the window corresponding to the second part are the same.

18. The electronic device according to claim 16, wherein, The electronic device is foldable relative to the folding axis, and the folding axis is defined to overlap with the groove and extend in the same direction as the extension direction of the groove.

19. The electronic device according to claim 16, wherein, The difference between the internal tensile stress at the point of the first portion having the minimum thickness and the internal tensile stress at the point of the second portion having the maximum thickness. CT satisfies Equation 1: Equation 1 and Wherein, CS1 is defined as the surface compressive stress of the first part, CS2 is defined as the surface compressive stress of the second part, t1 is defined as the thickness of the point in the first part having the minimum thickness, t2 is defined as the thickness of the point in the second part having the maximum thickness, and Ratio is defined as the value obtained by dividing the layer depth of the first part or the second part by t1, wherein the layer depth of the first part or the second part is the first depth or the second depth, and the first depth and the second depth are the same.

20. The electronic device according to claim 19, wherein, The surface compressive stress of the first part is the same as that of the second part, and the ratio is in the range of 0.15 to 0.25.

Images