Configuration method and device of automatic carrying system, storage medium and electronic equipment
By assessing congestion in automated material handling systems and optimizing track configuration using a minimum-cost maximum flow algorithm, the problem of balancing transmission efficiency and cost in existing technologies is solved, achieving efficient and economical wafer transfer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 中芯京城集成电路制造(北京)有限公司
- Filing Date
- 2024-10-12
- Publication Date
- 2026-04-17
AI Technical Summary
Existing automated handling systems struggle to balance transmission efficiency and cost, especially during wafer transfer where congestion is common and construction costs are high.
By obtaining the relationship between the current actual capacity value and the target capacity value of the automated material handling system, it is determined whether congestion has occurred. When congestion occurs, the second layer of material handling tracks is precisely configured, and the track configuration is optimized using the minimum cost maximum flow algorithm to reduce construction costs.
It achieves a balance between transmission efficiency and economic benefits, reduces track construction costs, and improves system stability and operation and maintenance efficiency.
Smart Images
Figure CN121888904A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a configuration method, apparatus, storage medium, and electronic device for an automated handling system. Background Technology
[0002] In semiconductor manufacturing companies, wafers are usually handled in batches. However, manual handling is not only inefficient but also prone to danger. Furthermore, the handling process carries uncertainties such as chip contamination and chip breakage due to collisions.
[0003] To address the risks and uncertainties associated with manual handling, Automated Material Handling Systems (AMHS) have emerged and are widely used in the semiconductor manufacturing industry. As the primary method of wafer transfer, the transfer efficiency of automated handling systems directly determines the time required for wafer transfer, thus impacting wafer fab capacity.
[0004] However, existing automated handling systems struggle to balance transmission efficiency and cost. Summary of the Invention
[0005] The technical problem solved by this invention is: how to make an automated material handling system balance transmission efficiency and cost.
[0006] To address the aforementioned technical problems, this invention provides a configuration method for an automated material handling system. The automated material handling system includes a first layer of material handling tracks, comprising: acquiring the current actual capacity value and target capacity value of the automated material handling system; preferentially configuring the automated material handling system to consist of the first layer of material handling tracks; when the current actual capacity value is greater than or equal to the target capacity value, determining whether the first layer of material handling tracks is congested, and when the first layer of material handling tracks is congested, configuring a second layer of material handling tracks for the automated material handling system based on the congestion location of the first layer of material handling tracks.
[0007] Optionally, determining whether the first layer of the transport track is congested includes: obtaining the average transport time of the automated transport system and the production cycle of the wafer to be transported; and determining whether the automated transport system is congested based on the average transport time of the automated transport system and the production cycle of the wafer to be transported.
[0008] Optionally, determining whether the automated handling system is congested based on the average handling time of the automated handling system and the production cycle of the wafer to be handled includes: determining that the automated handling system is not congested when the average handling time of the automated handling system is less than or equal to a preset average handling time and the production cycle of the wafer to be handled is less than or equal to a preset production cycle; and determining that the automated handling system is congested when the average handling time of the automated handling system is greater than the preset average handling time and the production cycle of the wafer to be handled is greater than the preset production cycle.
[0009] Optionally, configuring a second layer of transport tracks for the automated transport system based on the congestion location of the first layer of transport tracks includes: determining congestion location information on the first layer of transport tracks; configuring a second layer of transport tracks for the automated transport system based on the congestion location information; the second layer of transport tracks being located above the first layer of transport tracks.
[0010] Optionally, the first layer of transport track includes at least two single tracks and at least one composite track, wherein the composite track is composed of two or more consecutive single tracks connected together.
[0011] Optionally, determining the congestion location information on the first layer transport track includes: determining whether the single track is congested based on the track transport volume of the single track, and obtaining the congestion location information of the single track when congestion occurs; when two or more consecutive single tracks are congested, determining whether the composite track where the two or more consecutive single tracks are located is congested based on the track transport volume and wafer storage volume of the composite track where the two or more consecutive single tracks are located, and obtaining the congestion location information of the composite track where the two or more consecutive single tracks are located based on the congestion location information of the two or more consecutive single tracks when congestion occurs.
[0012] Optionally, determining whether a single track is congested based on its track transmission volume includes: determining that the single track is congested when its track transmission volume is greater than a first preset track transmission volume; otherwise, determining that the single track is not congested.
[0013] Optionally, determining whether the composite track is congested based on the track transmission volume and wafer storage volume of the composite track includes: determining that the composite track is congested when the track transmission volume of the composite track is greater than a second preset track transmission volume and the wafer storage volume of the composite track is greater than a preset wafer storage volume; otherwise, determining that the composite track is not congested.
[0014] Optionally, configuring a second-layer transport track for the automated transport based on the congestion location information includes: obtaining a plurality of first configuration schemes corresponding to the second-layer transport track based on the first congestion location information of the first-layer transport track, wherein the first congestion location information is any congestion location information of the first-layer transport track; selecting the optimal configuration scheme from the plurality of first configuration schemes, and configuring the second-layer transport track.
[0015] Optionally, the optimal configuration scheme can be selected from the plurality of first configuration schemes to configure the second layer transport track.
[0016] Optionally, selecting the optimal configuration scheme from the plurality of first configuration schemes includes: using a preset minimum cost maximum flow model to select the optimal configuration scheme from the plurality of first configuration schemes.
[0017] Optionally, obtaining several first configuration schemes corresponding to the second-layer transport track based on the first congestion location information of the automated transport system includes: determining whether the relevant location of the second-layer transport track is suitable for track configuration based on the first congestion location information; and generating the first configuration scheme based on the determination result.
[0018] Optionally, determining whether the location of the second-layer transport track is suitable for configuration based on the first congestion location information includes: determining the longitudinal spatial information of the location of the second-layer transport track; and determining whether the location of the second-layer transport track is suitable for configuration based on the longitudinal spatial information of the location of the second-layer transport track.
[0019] Optionally, the preferred configuration of the automated handling system consisting of the first layer of handling tracks includes: configuring the automated handling system to consist of the first layer of handling tracks when the current actual capacity value is less than the target capacity value; and configuring the automated handling system to consist of the first layer of handling tracks when the current actual capacity value is greater than or equal to the target capacity value and the automated handling system is not congested.
[0020] This invention also provides a configuration device for an automated handling system. The device includes: an acquisition unit, adapted to acquire the current actual capacity value and target capacity value of the automated handling system; a first configuration unit, adapted to preferentially configure the automated handling system to consist of a first layer of handling tracks; a congestion determination unit, adapted to determine whether the first layer of handling tracks is congested when the current actual capacity value is greater than or equal to the target capacity value; and a second configuration unit, adapted to configure a second layer of handling tracks for the automated handling system based on the congestion location of the first layer of handling tracks when congestion occurs.
[0021] This invention also provides a computer-readable storage medium having a computer program stored thereon, the computer program being executed by a processor to implement the steps of any of the methods described above.
[0022] This invention also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program that can run on the processor, and the processor executes the steps of any of the methods described above when running the computer program.
[0023] Compared with the prior art, the technical solution of the embodiments of the present invention has the following beneficial effects:
[0024] The configuration method in this embodiment of the invention involves acquiring and comparing the current actual capacity value and the target capacity value of the automated handling system. If the current actual capacity value is greater than or equal to the target capacity value, it is determined whether the first-layer handling track is congested. If congestion occurs on the first-layer handling track, a second-layer handling track is configured for the automated handling system based on the location of the congestion. Compared to laying the second-layer handling track entirely above the first-layer handling track, or only laying the second-layer handling track above the main track of the first-layer handling track, the second-layer handling track can be precisely positioned and configured, thus balancing the transmission efficiency and cost of the automated handling system.
[0025] Furthermore, this invention is based on the minimum cost maximum flow algorithm in network flow algorithms. It addresses the configuration constraints of the second-layer transport track to achieve maximum wafer transport in an automated transport system with the minimum length, thereby achieving a balance between transmission efficiency and economic benefits. Attached Figure Description
[0026] Figure 1 This is a structural schematic diagram of the automated handling system described above.
[0027] Figure 2 This is a schematic diagram of another type of automated handling system.
[0028] Figure 3 This is a structural schematic diagram of yet another type of automated handling system;
[0029] Figure 4 This is a flowchart illustrating a configuration method for an automated handling system according to an embodiment of the present invention;
[0030] Figure 5 This is a flowchart illustrating another configuration method for the automated handling system in an embodiment of the present invention;
[0031] Figure 6This is a schematic diagram of the structure of an automated handling system according to an embodiment of the present invention;
[0032] Figure 7 This is a schematic diagram of the structure of an automated handling system transformed into a directed model in an embodiment of the present invention. Figure 1 ;
[0033] Figure 8 This is a schematic diagram of the structure of an automated handling system transformed into a directed model in an embodiment of the present invention. Figure 2 ;
[0034] Figure 9 This is a schematic diagram of the configuration device of an automated handling system according to an embodiment of the present invention. Detailed Implementation
[0035] Currently, in semiconductor factories, when throughput increases, automated material handling systems are typically configured with double-layer transport tracks. Existing configuration methods include two approaches: one is to lay the second layer of transport tracks entirely above the first layer, and the other is to lay the second layer only above the main tracks of the first layer. The following example illustrates this. Figure 1 Taking this as an example, we will describe the existing configuration method.
[0036] Figure 1 This is a schematic diagram of the structure of the first-layer transport track 101 in an automated transport system. The first-layer transport track 101 includes multiple tracks, such as the first track 1011 and the second track 1012.
[0037] A second layer of transport tracks is laid entirely above the first layer of transport tracks 101, meaning that a second layer of tracks is installed above each track of the first layer of transport tracks 101, forming a structure like... Figure 2 The second-layer transport track 1021 is shown. However, this method is limited by the area of the cleanroom, and the construction cost of the AMHS double-layer track system is high. The whole plant installation often does not consider the economic benefits of transportation while meeting efficiency requirements. Moreover, the high degree of automation will increase the difficulty of later operation and maintenance management and system stability maintenance.
[0038] Laying a second layer of transport tracks above the first layer of transport tracks 101 (main track) can form a structure like... Figure 3 The second-layer transport track 1022 is shown. This method is prone to uneven track transmission efficiency, and the double-layer track fails to play its maximum transmission role. Moreover, if the track needs to be modified later, it will not only affect the factory production operation, but also generate high modification costs.
[0039] To address the aforementioned technical problems, this invention provides a configuration method for an automated material handling system. By acquiring and comparing the current actual capacity value and the target capacity value of the automated material handling system, it determines whether the system is congested. Based on whether congestion has occurred or not, different material handling tracks are configured for the automated material handling system. Furthermore, when congestion occurs, a second layer of material handling tracks is configured based on the congestion location of the first layer, achieving precise configuration of the second layer, reducing track construction costs, and thus achieving a balance between transmission efficiency and economic benefits.
[0040] To make the above-mentioned objectives, features and beneficial effects of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0041] Figure 4 This is a flowchart illustrating a configuration method for an automated handling system according to an embodiment of the present invention.
[0042] Please refer to Figure 4 This invention provides a configuration method for an automated handling system, the automated handling system comprising: a first-layer handling track, including:
[0043] S11: Obtain the current actual capacity value and target capacity value of the automated handling system.
[0044] Specifically, obtaining the current actual production capacity of the automated handling system may include: obtaining the actual parameters on the first layer of the automated handling system, the actual parameters including: the wafer transfer amount and the number of transfers on each track of the first layer of the handling system.
[0045] Specifically, the current actual production capacity is obtained based on the wafer transfer volume and the number of transfers.
[0046] S12: Determine whether the current actual capacity value of the automated handling system is greater than or equal to the target capacity value.
[0047] After step S12, the following steps are performed: the automated handling system is configured to consist of the first layer of handling tracks.
[0048] The step of prioritizing the configuration of the automated handling system consisting of the first layer of handling tracks includes: when the current actual capacity value is less than the target capacity value, executing step S13.
[0049] When the current actual production capacity value is greater than or equal to the target production capacity value, step S14 is executed.
[0050] S13: Configure the automated handling system to consist of the first layer of handling tracks.
[0051] In one embodiment, when the current actual production capacity is less than the target production capacity, that is, based on the current actual production capacity, there is no congestion on the automated handling system, the first layer of handling track can meet the current production needs.
[0052] S14: Determine whether the automated handling system is experiencing congestion.
[0053] In specific implementation, determining whether the automated handling system is congested may include: obtaining the average handling time of the automated handling system and the production cycle of the wafer to be handled; and determining whether the automated handling system is congested based on the average handling time of the automated handling system and the production cycle of the wafer to be handled.
[0054] Specifically, determining whether the automated handling system is congested based on the average handling time of the automated handling system and the production cycle of the wafer to be handled includes: when the average handling time of the automated handling system is less than or equal to a preset average handling time and the production cycle of the wafer to be handled is less than or equal to a preset production cycle, it is determined that the automated handling system is not congested; when the average handling time of the automated handling system is greater than the preset average handling time and the production cycle of the wafer to be handled is greater than the preset production cycle, it is determined that the automated handling system is congested.
[0055] In specific implementation, the methods for obtaining the average handling time of the automated handling system and the production cycle of the wafer to be handled include:
[0056] In practice, the actual wafer processing cycle is obtained based on the sum of the processing times of all processes at each loading point, the transport time of the transport trolley from the loading point to the unloading point, the waiting time of the transport trolley from the loading point to the unloading point, and the number of processing layers of the wafer.
[0057] In practice, the average transport time is obtained based on the transport time of the transport trolley from the loading point to the unloading point, the waiting time of the transport trolley from the loading point to the unloading point, and the number of processing layers of the wafer.
[0058] The step of prioritizing the configuration of the automated handling system consisting of the first layer of handling tracks further includes: executing step S15 when the automated handling system is not congested.
[0059] When congestion occurs in the automated handling system, step S16 is executed.
[0060] S15: Configure the automated handling system to consist of the first layer of handling tracks.
[0061] S16: Based on the congestion location of the first layer of transport track, configure a second layer of transport track for the automated transport system.
[0062] The second layer of transport track is located above the first layer of transport track.
[0063] The first layer of transport tracks includes at least two single tracks and at least one composite track, wherein the composite track is composed of two or more single tracks connected together. A single track refers to a track that includes one loading point and one unloading point, and a composite track refers to a track that includes at least two loading points and at least two unloading points.
[0064] In one embodiment, configuring a second layer of transport tracks for the automated transport system may include: determining congestion location information of the automated transport system on the first layer of transport tracks; and configuring a second layer of transport tracks for the automated transport system based on the congestion location information.
[0065] In one embodiment, determining the congestion location information of the automated handling system on the first-layer handling track includes: determining whether a single track is congested based on the track transport volume of the single track, and obtaining the congestion location information of the single track when congestion occurs; when two or more consecutive single tracks are congested, determining whether the composite track containing the two or more consecutive single tracks is congested based on the track transport volume and wafer storage volume of the composite track containing the two or more consecutive single tracks, and obtaining the congestion location information of the composite track containing the two or more consecutive single tracks based on the congestion location information of the two or more consecutive single tracks when congestion occurs.
[0066] The step of determining whether a single track is congested based on its track transmission volume includes: determining that the single track is congested when its track transmission volume is greater than a first preset track transmission volume; otherwise, determining that the single track is not congested.
[0067] Specifically, determining whether the composite track is congested based on the track transmission volume and wafer storage volume of the composite track may include: determining that the composite track is congested when the track transmission volume of the composite track is greater than a second preset track transmission volume and the wafer storage volume of the composite track is greater than a preset wafer storage volume; otherwise, determining that the composite track is not congested.
[0068] When congestion occurs in the automated handling system, configuring a second layer of handling tracks for the automated handling system includes: determining the congestion location information of the automated handling system; and configuring a second layer of handling tracks for the automated handling system based on the congestion location information of the automated handling system.
[0069] The step of configuring a second-layer transport track for the automated transport system based on the congestion location information of the automated transport system includes: obtaining several first configuration schemes corresponding to the second-layer transport track based on the first congestion location information of the automated transport system, wherein the first congestion location information is any congestion location information of the first-layer transport track of the automated transport system; selecting the optimal configuration scheme from the several first configuration schemes, and configuring the second-layer transport track.
[0070] The optimal configuration scheme is the configuration scheme with the lowest cost among the plurality of first configuration schemes.
[0071] In one embodiment, selecting the optimal configuration scheme from the plurality of first configuration schemes includes: selecting the optimal configuration scheme from the plurality of first configuration schemes using a preset minimum cost maximum flow model.
[0072] In this embodiment, the cost corresponding to different configuration schemes is obtained by substituting the first configuration scheme into the preset minimum cost maximum flow model.
[0073] Substitute the congestion location information from different first configuration schemes into the preset minimum cost maximum flow model.
[0074] The step of obtaining several first configuration schemes corresponding to the second-layer transport track based on the first congestion location information of the automated transport system may include: determining whether the relevant location of the second-layer transport track is suitable for track configuration based on the first congestion location information; and generating the first configuration scheme based on the determination result.
[0075] The step of determining whether the location of the second-layer transport track is suitable for configuration based on the first congestion location information may include: determining the longitudinal spatial information of the location of the second-layer transport track; and determining whether the location of the second-layer transport track is suitable for configuration based on the longitudinal spatial information of the location of the second-layer transport track.
[0076] In this embodiment, when the longitudinal spatial information at the relevant position of the second-layer transport track meets the preset longitudinal spatial information, it is determined that the relevant position of the second-layer transport track is suitable for configuring a track; when the longitudinal spatial information at the relevant position of the second-layer transport track does not meet the preset longitudinal spatial information, it is determined that the relevant position of the second-layer transport track is not suitable for configuring a track, and the congestion information at the relevant position of the unsuitable track is removed. In the automated transport system after removing the congestion information at the relevant position of the unsuitable track, the first congestion information is re-acquired.
[0077] The longitudinal spatial information is characterized as the longitudinal space of the cleanroom in the automated handling system.
[0078] Figure 5 A flowchart illustrating a second-layer transport track configuration method provided in an embodiment of the present invention.
[0079] Please refer to Figure 5 The configuration method of the automated handling system includes the following steps:
[0080] S21: Obtain the current actual production capacity of the automated handling system.
[0081] In practical implementation, the current actual capacity of the automated handling system can be obtained by summing the track transport volumes of each track in the first-layer transport track. Here, the i-th loading point S... i Up to the j-th unloading point S j between orbits D ij For example, in calculating orbit D ij When calculating the actual production capacity, it can be based on track D. ij wafer transfer volume S ij and the number of transmissions a ij To obtain orbital D ij The current actual production capacity value. Specifically, orbit D ij Track transfer volume = S ij *a ij The current state of the automated handling system. Where i and j are both positive integers, I is the total number of loading points and J is the total number of unloading points.
[0082] Among them, the i-th load point S can be set. i Up to the j-th unloading point S j between orbits D ij wafer transfer volume S ij ≤25pcs, the track D between the i-th loading point and the j-th unloading point ij Number of transmissions a ij >0.
[0083] In specific implementation, when obtaining the wafer transfer amount S ij and the number of transmissions a ij Previously, it also included: dividing the automated handling system into several equipment intervals, each of the equipment intervals including at least one loading point and / or at least one unloading point, and then based on the loading point and the unloading point of each equipment interval, converting the first layer of handling track of the automated handling system into a directed graph model, with each loading point and unloading point as a node in the directed graph model.
[0084] For example, refer to Figure 6 The automated material handling system is divided into seven equipment zones, namely, Zone 1 to Zone 7. Figure 6 Discretizing the equipment areas of an automated material handling system can yield the following results: Figure 7 The directed graph model shown in the figure.
[0085] exist Figure 6 Based on reference Figure 7 Node S1 is a node in the first device area (Area 1), node S2 is a node in the second device area (Area 2), node S3 is a node in the third device area (Area 2), node S4 is a node in the fourth device area (Area 4), node S5 is a node in the fifth device area (Area 5), node S6 is a node in the sixth device area (Area 6), and node S7 is a node in the seventh device area (Area 7). Each node may act as either a load point or an unload point, depending on the transmission volume when the node acts as a load point or an unload point. Further development can be based on... Figure 7 The directed graph model shown in the figure is used to configure the second layer of transport tracks.
[0086] In some embodiments, the division of equipment zones is based on the comprehensive zone layout rules and the characteristics of the equipment zones.
[0087] In this embodiment, there are two Area 7, the seventh device interval.
[0088] In practical implementation, assuming the wafer transfer amount at the i-th loading point is si and the wafer transfer amount at the j-th unloading point is sj, in the directed graph model, the transfer amount at the i-th loading point should be greater than or equal to the transfer amount at the j-th unloading point, i.e., si / PT. i ≥sj / PT j , among which PT i This indicates that the current wafer manufacturing process is at the i-th loading point S. i Required processing time, PT j This indicates that the current wafer manufacturing process is at the j-th unloading point S. j The required processing time. Among them, PT i and PTj It can be obtained through actual measurement.
[0089] S22: Determine whether the current actual capacity of the automated handling system is greater than the target capacity. If the current actual capacity is less than the target capacity, proceed to step S23. If the current actual capacity is greater than or equal to the target capacity, proceed to step S24.
[0090] S23: Configure the automated handling system to consist of the first layer of handling tracks.
[0091] S24: Obtain the average handling time of the automated handling system and the production cycle of the wafer to be handled.
[0092] In specific implementation, the methods for obtaining the average handling time of the automated handling system and the production cycle of the wafer to be handled include:
[0093] In specific implementation, the actual wafer processing cycle CT is as shown in formula (1):
[0094]
[0095] Among them, AT i Td can be expressed as the sum of the processing times of all operations at each loading point of the wafer. ij This can be represented as starting from the i-th loading point S i Up to the j-th unloading point S j Transmission time, WT ij This can be represented as the transport trolley at the i-th loading point S i Up to the j-th unloading point S j The waiting time on the track between them, layer can be represented as the number of processing layers of the wafer.
[0096] In specific implementation, the average handling time Ts is as shown in formula (2):
[0097]
[0098] Among them, Td ij This can be represented as the transport trolley starting from the i-th loading point S. i Up to the j-th unloading point S j Transmission time, WT ij For the transport trolley at the i-th loading point S i Up to the j-th unloading point S j The waiting time on the track between them, layer can be represented as the number of processing layers of the wafer.
[0099] In practical implementation, the transmission time Td ij =DISij / Vd, where DIS ij S represents the i-th loading point. i Up to the j-th unloading point S j Between orbits D ij The track length is Vd, and Vd represents the speed of the transport trolley on the first layer of the transport track. The speed of the transport trolley is Vd≤Vds, where Vds is the maximum speed of the transport trolley on the first layer of the transport track.
[0100] S25: Determine whether the average handling time is greater than the production cycle of the wafer to be handled, and whether the production cycle of the wafer to be handled is greater than the preset production cycle.
[0101] If the average handling time is greater than the production cycle of the wafer to be handled, and the production cycle of the wafer to be handled is greater than the preset production cycle, then step S27 is executed; otherwise, step S26 is executed.
[0102] S26: Determine that the automated handling system is not congested, and configure the automated handling system to consist of the first layer of handling tracks.
[0103] S27: Determine that the first layer transport track is congested, and obtain the congestion location information of the first layer transport track.
[0104] In one embodiment, the first layer of transport track includes at least two single tracks and at least one composite track, wherein the composite track is composed of two or more single tracks connected together. A single track refers to a track that includes one loading point and one unloading point, i.e., a track without any intermediate nodes. The composite track is composed of two or more consecutive single tracks connected together, so that within a composite track, there is at least one intermediate node, which can be either a loading point or an unloading point.
[0105] For example, please refer to Figure 7 Track D between the 8th loading point S8 and the 7th unloading point S7 87 Track D between the 7th loading point S7 and the 6th unloading point S6 76 Track D between the 6th loading point S6 and the 4th unloading point S4 64 Track D between the 4th loading point S4 and the 5th unloading point S5 45 It is a single track. The track D between the 8th loading point S8 and the 6th unloading point S6. 86 The composite track D 86 This includes a single track D between the 8th loading point S8 and the 7th unloading point S7. 87 and the single track D between the 7th loading point S7 and the 6th unloading point S6 76It belongs to a composite orbital.
[0106] In one embodiment, obtaining congestion location information on the first layer transport track includes: determining whether a single track is congested based on its track transport volume, and obtaining congestion location information of the single track when congestion occurs; when two or more consecutive single tracks are congested, determining whether the composite track containing the two or more consecutive single tracks is congested based on the track transport volume and wafer storage volume of the composite track containing the two or more consecutive single tracks, and obtaining congestion location information of the composite track containing the two or more consecutive single tracks based on the congestion location information of the two or more consecutive single tracks when congestion occurs.
[0107] The step of determining whether a single track is congested based on its track transmission volume includes: determining that the single track is congested when its track transmission volume is greater than a first preset track transmission volume; otherwise, determining that the single track is not congested.
[0108] Specifically, the method for obtaining the track transport volume of a single track includes: based on the i-th loading point S i Up to the j-th unloading point S j The wafer transfer amount between single tracks and the i-th loading point S i Up to the j-th unloading point S j The number of transmissions per track between tracks is used to obtain the track transmission volume per track.
[0109] refer to Figure 8 Assuming the i-th loading point S i Up to the j-th unloading point S j between orbits D ij If it is a single track, then it can be determined according to track D. ij wafer transfer volume S ij and the track D between the i-th loading point and the j-th unloading point ij Number of transmissions a ij Obtain orbital D ij The orbital transport volume is S ij *a ij .
[0110] Assume the i-th loading point S i Up to the j-th unloading point S j between orbits D ij Since it is a composite orbit, it can be determined based on orbit D. ij The orbital transfer volume and wafer storage volume are used to determine orbital D. ij Is there congestion? Specifically, when track D... ijThe track transmission volume is greater than the second preset track transmission volume, and track D ij If the wafer storage capacity exceeds a preset wafer storage capacity, the composite track is determined to be congested; otherwise, the composite track is determined not to be congested. Track D... ij The orbital transport volume is equal to the volume of the orbital components D. ij The sum of the track transport volume of each individual track.
[0111] In one embodiment, the track D between the 7th loading point S7 and the 2nd unloading point S2 72 The composite orbit is D. 72 This includes a single track D between the 7th loading point S7 and the 1st unloading point S1. 71 The single track D between the first loading point S1 and the second unloading point S2 12 and the single track D between the second loading point S2 and the second unloading point S2 22 The single track D 71 Single-track D 12 and single-track D 22 It is a continuous single track.
[0112] In one embodiment, orbit D is determined. ij Methods for determining wafer storage capacity include: determining orbital D ij and the constituent orbital D ij The track transport volume of each individual track; track D ij The difference between the track transport amounts of two consecutive single-track segments in the data is used as track D. ij The wafer storage capacity. Among them, orbital D ij The orbital transport volume, i.e., S ij *a ij Assuming orbit D ij There is only one intermediate node S. k Then obtain the i-th loading point S in the composite orbit. i Up to the j-th unloading point S j The intermediate node S between k The wafer storage capacity is (S ik *a ik )-(S kj *a kj ).
[0113] When the intermediate node S k When the wafer storage capacity is greater than the preset wafer storage capacity, it indicates that the i-th loading point S i The transfer wafer at point S cannot be transferred to the intermediate node S. k This leads to traffic congestion.
[0114] Please refer to Figure 7In one embodiment, when the composite orbital is D 86 When the composite orbit is D 86 Including single-track D 87 and D 76 The i-th loading point is S8, and the j-th unloading point is S... j S6 is the intermediate node S. k It is S7.
[0115] In another embodiment, when the composite orbital is D 74 At that time, the D 74 Including single-track D 76 and D 64 The i-th loading point is S7, and the j-th unloading point is S... j S4, intermediate node S k It is S6.
[0116] In other embodiments, when the composite orbital is D 65 At that time, the D 65 Including single-track D 64 and D 45 The i-th loading point is S6, and the j-th unloading point is S... j S5 is the intermediate node S. k It is S4.
[0117] In other embodiments, the hypothetical orbit D ij There are two intermediate nodes S k S L When the time is right, the i-th loading point S in the composite orbit is obtained. i Up to the j-th unloading point S j The intermediate node S between k The wafer storage capacity is (S ik *a ik )-(S kL *a kL ), the i-th loading point S i Up to the j-th unloading point S j The intermediate node S between L The wafer storage capacity is (S kL *a kL )-(S Lj *a Lj ).
[0118] S28: Based on the first congestion location information, determine whether the location of the second layer transport track is suitable for configuring the track. If yes, proceed to step S29; otherwise, return to step S27.
[0119] The step of determining whether the location of the second-layer transport track is suitable for configuration based on the first congestion location information includes: determining the longitudinal spatial information of the location of the second-layer transport track; and determining whether the location of the second-layer transport track is suitable for configuration based on the longitudinal spatial information of the location of the second-layer transport track.
[0120] In this embodiment, when the longitudinal spatial information at the relevant position of the second-layer transport track meets the preset longitudinal spatial information, it is determined that the relevant position of the second-layer transport track is suitable for configuring a track; when the longitudinal spatial information at the relevant position of the second-layer transport track does not meet the preset longitudinal spatial information, it is determined that the relevant position of the second-layer transport track is not suitable for configuring a track, and the congestion information at the relevant position of the unsuitable track is removed. In the automated transport system after removing the congestion information at the relevant position of the unsuitable track, the first congestion information is re-acquired.
[0121] The longitudinal spatial information is characterized as the longitudinal space of the cleanroom in the automated handling system.
[0122] S29: Based on the congestion location information of the first layer transport track, obtain several first configuration schemes corresponding to the second layer transport track.
[0123] In one embodiment, the first congestion location information is track D. 86 The first configuration scheme for the corresponding second-layer transport track can include: Configuration Scheme 1, on track D 86 The second layer of transport track is configured on top; configuration option two, on track D 86 and orbit D 23 The second layer of transport track is configured on top; configuration option three, on track D 87 Orbit D 47 and orbit D 15 A second layer of transport rails is configured on top.
[0124] S210: Using the preset minimum cost maximum flow model MinZ, select the optimal configuration scheme from the several first configuration schemes, and configure the second layer of transport track for the automated transport system.
[0125] The optimal configuration scheme is the configuration scheme with the lowest cost among the plurality of first configuration schemes.
[0126] The preset minimum cost maximum flow model MinZ is specifically shown in formula (3):
[0127]
[0128] Among them, C ij For construction costs, d ijThe length of the single track or the composite track.
[0129] Using the first congestion location information as track D 86 For example, formula (3) can be used to calculate the construction cost and track length of each configuration scheme in configuration scheme 1, configuration scheme 2 and configuration scheme 3, and then the cost of the three configuration schemes can be obtained. Thus, the configuration scheme with the lowest cost can be selected as the optimal configuration scheme from the three configuration schemes.
[0130] In summary, the technical solution of this invention obtains and compares the current actual capacity value and the target capacity value of the automated handling system to determine whether the automated handling system is congested. When congestion occurs on the automated handling system, a second layer of handling track is configured for the automated handling system, achieving precise positioning and configuration of the second layer of handling track, reducing track construction costs, and achieving a balance between transmission efficiency and economic benefits.
[0131] Furthermore, this invention, based on the minimum-cost maximum-flow algorithm in network flow algorithms, addresses the configuration constraints of the second-layer transport tracks to achieve maximum wafer transport within a minimum-length automated transport system, thereby achieving a balance between transmission efficiency and economic benefits.
[0132] Accordingly, embodiments of the present invention also provide a configuration device 30 for an automated handling system, including: an acquisition unit 31, a first configuration unit 32, a congestion determination unit 33, and a second configuration unit 34.
[0133] The acquisition unit 31 is adapted to acquire the current actual capacity value and the target capacity value of the automated handling system.
[0134] The first configuration unit 32 is adapted to preferentially configure the automated handling system to consist of a first layer of handling tracks.
[0135] The congestion determination unit 33 is adapted to determine whether the first layer of transport track is congested when the current actual production capacity value is greater than or equal to the target production capacity value.
[0136] The second configuration unit 34 is adapted to configure a second layer of transport track for the automated transport system based on the location of the congestion in the first layer of transport track when congestion occurs in the first layer of transport track.
[0137] This invention also provides a computer-readable storage medium having a computer program stored thereon, the computer program being executed by a processor to implement the steps of any of the above methods.
[0138] In specific implementations, the computer-readable storage medium may include ROM, RAM, disk, or optical disk, etc.
[0139] This invention also provides an electronic device, which includes a memory and a processor. The memory stores a computer program that can run on the processor, and the processor executes the steps of any of the methods described above when running the computer program.
[0140] Regarding the modules / units included in the various devices and products described in the above embodiments, they can be software modules / units, hardware modules / units, or a combination of both. For example, for various devices and products applied to or integrated into a chip, all of their modules / units can be implemented using hardware methods such as circuits, or at least some modules / units can be implemented using software programs that run on a processor integrated within the chip, while the remaining (if any) modules / units can be implemented using hardware methods such as circuits; for various devices and products applied to or integrated into a chip module, all of their modules / units can be implemented using hardware methods such as circuits, and different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components of the chip module, or at least some modules / units can be implemented using hardware methods such as circuits. The components can be implemented using software programs that run on the processor integrated within the chip module. The remaining (if any) modules / units can be implemented using hardware methods such as circuits. For various devices and products applied to or integrated into the terminal, each of its components / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or in different components within the terminal. Alternatively, at least some modules / units can be implemented using software programs that run on the processor integrated within the terminal, while the remaining (if any) modules / units can be implemented using hardware methods such as circuits.
[0141] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. A configuration method for an automated handling system, the automated handling system comprising: The first layer of transport track is characterized by comprising: Obtain the current actual capacity and target capacity of the automated material handling system; The automated handling system is configured to consist of the first layer of handling tracks. When the current actual production capacity is greater than or equal to the target production capacity, it is determined whether the first layer of transport track is congested, and when the first layer of transport track is congested, a second layer of transport track is configured for the automated transport system based on the congestion location of the first layer of transport track.
2. The configuration method of the automated handling system as described in claim 1, characterized in that, Determining whether the first layer of transport track is congested includes: Obtain the average handling time of the automated handling system and the production cycle of the wafer to be handled; Based on the average handling time of the automated handling system and the production cycle of the wafers to be handled, it is determined whether the automated handling system is experiencing congestion.
3. The configuration method of the automated handling system as described in claim 2, characterized in that, The determination of whether the automated handling system is congested, based on the average handling time of the automated handling system and the production cycle of the wafers to be handled, includes: When the average handling time of the automated handling system is less than or equal to the preset average handling time, and the production cycle of the wafer to be handled is less than or equal to the preset production cycle, it is determined that the automated handling system is not congested. When the average handling time of the automated handling system is greater than the preset average handling time, and the production cycle of the wafer to be handled is greater than the preset production cycle, it is determined that the automated handling system is congested.
4. The configuration method of the automated handling system as described in claim 2, characterized in that, The configuration of a second layer of transport tracks for the automated transport system based on the congestion locations of the first layer of transport tracks includes: Determine the location information of congestion on the first-layer transport track; Based on the congestion location information, a second layer of transport track is configured for the automated transport; the second layer of transport track is located above the first layer of transport track.
5. The configuration method of the automated handling system as described in claim 4, characterized in that, The first layer of transport track includes at least two single tracks and at least one composite track, wherein the composite track is composed of two or more consecutive single tracks connected together.
6. The configuration method of the automated handling system as described in claim 5, characterized in that, Determining the congestion location information on the first layer of transport track includes: Based on the track transmission volume of the single track, determine whether the single track is congested, and when the single track is congested, obtain the congestion location information of the single track; When two or more consecutive single tracks become congested, the congestion status of the composite track containing the two or more consecutive single tracks is determined based on the track transmission volume and wafer storage volume of the composite track containing the two or more consecutive single tracks. When the composite track containing the two or more consecutive single tracks becomes congested, the congestion location information of the composite track containing the two or more consecutive single tracks is obtained based on the congestion location information of the two or more consecutive single tracks.
7. The configuration method of the automated handling system as described in claim 6, characterized in that, The determination of whether a single track is congested based on its track transport volume includes: If the track transmission volume of a single track is greater than a first preset track transmission volume, it is determined that the single track is congested; otherwise, it is determined that the single track is not congested.
8. The configuration method of the automated handling system as described in claim 6, characterized in that, The determination of whether the composite track is congested based on the track transfer volume and wafer storage volume includes: If the track transmission volume of the composite track is greater than the second preset track transmission volume, and the wafer storage volume of the composite track is greater than the preset wafer storage volume, it is determined that the composite track is congested; otherwise, it is determined that the composite track is not congested.
9. The configuration method of the automated handling system as described in claim 4, characterized in that, The step of configuring a second-layer transport track for the automated transport based on the congestion location information includes: Based on the first congestion location information of the first layer transport track, several first configuration schemes corresponding to the second layer transport track are obtained, wherein the first congestion location information is any congestion location information of the first layer transport track; Select the optimal configuration scheme from the several first configuration schemes and configure the second layer transport track.
10. The configuration method of the automated handling system as described in claim 9, characterized in that, The optimal configuration scheme is the configuration scheme with the lowest cost among the several first configuration schemes.
11. The configuration method of the automated handling system as described in claim 9, characterized in that, Selecting the optimal configuration scheme from the plurality of first configuration schemes includes: using a preset minimum cost maximum flow model to select the optimal configuration scheme from the plurality of first configuration schemes.
12. The configuration method of the automated handling system as described in claim 10, characterized in that, Based on the first congestion location information of the automated handling system, several first configuration schemes corresponding to the second-layer handling track are obtained, including: Based on the first congestion location information, determine whether the location of the second layer transport track is suitable for configuring the track; Based on the determined results, the first configuration scheme is generated.
13. The configuration method of the automated handling system as described in claim 12, characterized in that, The step of determining whether the location of the second-layer transport track is suitable for configuration based on the first congestion location information includes: Determine the longitudinal spatial information at the relevant locations of the second-layer transport track; Based on the longitudinal spatial information of the relevant locations of the second-layer transport track, it is determined whether the relevant locations of the second-layer transport track are suitable for track configuration.
14. The configuration method of the automated handling system as described in claim 1, characterized in that, The priority configuration of the automated handling system, which consists of the first layer of handling tracks, includes: configuring the automated handling system to consist of the first layer of handling tracks when the current actual capacity value is less than the target capacity value; and configuring the automated handling system to consist of the first layer of handling tracks when the current actual capacity value is greater than or equal to the target capacity value and the automated handling system is not congested.
15. A configuration device for an automated handling system, characterized in that, include: The acquisition unit is adapted to acquire the current actual capacity value and the target capacity value of the automated handling system. The first configuration unit is suitable for preferentially configuring an automated handling system consisting of a first layer of handling tracks; The congestion determination unit is adapted to determine whether congestion occurs in the first layer of transport track when the current actual capacity value is greater than or equal to the target capacity value; The second configuration unit is adapted to configure a second layer of transport track for the automated transport system based on the location of the congestion on the first layer of transport track when congestion occurs on the first layer of transport track.
16. A storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed, they perform the steps of the method according to any one of claims 1 to 14.
17. An electronic device comprising a memory and a processor, wherein the memory stores computer instructions capable of running on the processor, characterized in that, When the processor executes the computer instructions, it performs the steps of the method according to any one of claims 1 to 14.