Molding die, resin molding device, and method for manufacturing resin molded article

Abstract

The present invention suppresses deformation of a plate for a movable pin and stably operates the movable pin with high precision, and is provided with: an upper die 2 having a recess 21 that forms a cavity C; a lower mold (3) which is disposed facing the upper mold (2) and which is clamped together with the upper mold (2); a movable pin plate 62 which is provided on the opposite side from the lower mold 3 with respect to the upper mold 2 and to which a movable pin 61 that can move forward and backward in the recess 21 is fixed; a plurality of connecting rods 63 provided on the opposite side from the upper die 2 with respect to the movable pin plate 62, one end of each of the connecting rods 63 being fixed to the movable pin plate 62; a plate drive unit (64) that moves the movable pin plate (62) via a plurality of connecting rods (63) so as to move the movable pin (61) forward and backward within the recess (21); and a plurality of deformation suppressing members (9) that are provided so as to be interposed between the upper die (2) and the movable pin plate (62), and that suppress deformation of the movable pin plate (62) with respect to the upper die (2).

Description

Technical Field

[0001] This invention relates to a molding die, a resin molding apparatus, and a method for manufacturing resin molded articles. Background Technology

[0002] Previously, as shown in Patent Document 1, resin molding apparatuses included devices that used movable pins that operated separately from the mold to fix and position parts that were to be molded and were placed within the mold cavity.

[0003] In the resin molding apparatus, a plurality of movable pins are mounted on a mounting plate configured to receive power from a power transmission mechanism, allowing the movable pins to move simultaneously with the same stroke. Furthermore, each movable pin moves forward and backward within the mold cavity by sliding within a guide hole provided in the mold.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-084755 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, as the resin material enters the guide hole through resin molding, the sliding resistance between the movable pin and the guide hole increases. As a result, the mounting plate with the movable pin deflects and deforms, making it difficult to stably and accurately move the movable pin.

[0009] Therefore, the present invention was made to solve the aforementioned problems, and its main objective is to suppress the deformation of the movable pin plate while performing the movement of the movable pin with high precision and stability.

[0010] Technical means to solve the problem

[0011] That is, the molding die of the present invention is characterized by comprising: a first die having a recess forming a cavity for filling resin material; a second die disposed opposite to the first die and closed together with the first die; a movable pin plate disposed on the side opposite to the second die relative to the first die, and fixed with a movable pin capable of moving back and forth within the recess; a plurality of connecting rods disposed on the side opposite to the first die relative to the movable pin plate, and one end of which is fixed to the movable pin plate; a plate driving part that moves the movable pin plate via the plurality of connecting rods to cause the movable pin to move back and forth within the recess; and a plurality of deformation suppressing members disposed between the first die and the movable pin plate, and suppressing deformation of the movable pin plate relative to the first die.

[0012] The effects of the invention

[0013] With this invention, deformation of the movable pin plate can be suppressed, while the movable pin can be moved with high precision and stability. Attached Figure Description

[0014] [ Figure 1 [Illustration 1] is a schematic diagram showing the structure of a resin molding apparatus according to an embodiment of the present invention.

[0015] [ Figure 2 [Illustration 1] is a cross-sectional view schematically showing the specific structure of the forming module of the described embodiment.

[0016] [ Figure 3 [Illustration 1] is a cross-sectional view schematically showing the specific structure of the upper mold fixing mechanism in the described embodiment.

[0017] [ Figure 4 [Illustration 1] is a plan view showing the positional relationship of the connecting rod, etc., relative to the resin molding area in the embodiment described above.

[0018] [ Figure 5 [Illustrated] is a cross-sectional view schematically showing the behavior of the movable pin plate with or without the distance-defined component in the described embodiment.

[0019] [ Figure 6 [Illustrated] is a cross-sectional view schematically showing the behavior of the movable pin plate with and without the deformation-inhibiting member in the described embodiment.

[0020] [ Figure 7 [ ] is a schematic diagram showing the change in distance between the upper mold and the movable pin plate before and after the start of mold opening in the embodiment described.

[0021] [ Figure 8 [Illustration 1] is a flowchart illustrating a method for manufacturing a resin molded article according to the described embodiment.

[0022] [ Figure 9 [Illustration 1] is a cross-sectional view showing (a) the assembly of forming materials and (b) the mold closing in the described embodiment.

[0023] [ Figure 10 [ ] is a cross-sectional view showing (c) the movable pin protruding and (d) the resin material injection in the described embodiment.

[0024] [ Figure 11 [ ] is a cross-sectional view showing (e) the movable pin being pulled back and (f) the resin material being filled and hardened in the described embodiment.

[0025] [ Figure 12 [] is a cross-sectional view showing the protrusion of the movable pin and the start of mold opening in the described embodiment (g).

[0026] [ Figure 13 [Illustration 1] is a cross-sectional view schematically showing the structure of the deformation suppression member in the deformation embodiment. Detailed Implementation

[0027] Next, examples will be given to further illustrate the technology of the present invention in detail. However, the present invention is not limited to the following technologies.

[0028] The molding die of Technique 1 of the present invention is characterized by comprising: a first die having a recess forming a cavity for filling with resin material; a second die disposed opposite to the first die and closed together with the first die; a movable pin plate disposed on the side opposite to the second die relative to the first die, and fixed with a movable pin capable of moving back and forth within the recess; a plurality of connecting rods disposed on the side opposite to the first die relative to the movable pin plate, and one end of which is fixed to the movable pin plate; a plate driving part that moves the movable pin plate via the plurality of connecting rods to cause the movable pin to move back and forth within the recess; and a plurality of deformation suppressing members disposed between the first die and the movable pin plate, and suppressing deformation of the movable pin plate relative to the first die.

[0029] If it is the forming mold, multiple connecting rods are connected and fixed to the movable pin plate, and multiple deformation suppressing members are provided to suppress the deformation of the movable pin plate relative to the first mold. Therefore, even if the sliding resistance increases due to the movable pin sliding in the sliding hole formed in the first mold, the deformation of the movable pin plate can be suppressed, and the movement of the movable pin can be performed with high precision and stability.

[0030] Ideally, in the molding die of Technique 2 of the present invention, based on the structure of Technique 1, the plurality of deformation-inhibiting members are disposed on the outer and inner sides of the resin molding area formed by the first die and the second die when viewed from the die-closing direction.

[0031] If the structure is as described, since multiple deformation-inhibiting members are provided on the outer and inner sides of the resin molding area where the deformation of the movable pin plate increases due to deflection, the deformation of the movable pin plate can be suppressed in a balanced and even manner.

[0032] For example, when the movable pin is pulled back from the recess, the movable pin plate may bend convexly toward the first mold due to the sliding resistance between the movable pin and the sliding hole formed in the first mold. That is, the distance between the center and the end of the movable pin plate may change. As a result, if the movable pin plate has multiple movable pins, the amount of pull-back of each movable pin relative to the recess of the first mold will deviate. This will adversely affect the quality of the resin molded product.

[0033] To suitably solve the aforementioned problem, the forming mold of the present invention 3 ideally has the plurality of deformation suppression members fixed on the side opposite to the face of the first mold and the face of the second mold, based on the structure of the present invention 1 or 2, and in contact with the side of the movable pin plate opposite to the face of the first mold, thereby suppressing the deformation of the movable pin plate.

[0034] If the structure described above is used, even if the sliding resistance of the movable pin relative to the sliding hole increases, the deformation suppression member can still suppress the deformation of the movable pin plate. Furthermore, when the movable pin plate is provided with multiple movable pins, the pull-back amount of each movable pin relative to the recess of the first mold can be made consistent, thereby preventing deterioration of the quality of the resin molded article.

[0035] Ideally, the forming die of technique 4 of the present invention, based on any one of the structures of techniques 1 to 3, comprises: a fixing portion, inserted into a through hole formed in the movable pin plate, and fixed to a surface of the first die opposite to the surface facing the second die; and a contact portion, provided in the fixing portion, which contacts the surface of the movable pin plate opposite to the first die when the movable pin plate deforms in a direction away from the first die.

[0036] If the structure is as described, multiple deformation-inhibiting components can be easily constructed. Furthermore, deformation caused by the movable pin plate bending convexly toward the first mold can be effectively suppressed.

[0037] During the resin material hardening stage of resin molding, the movable pin is positioned in a state where it is withdrawn from the recess. Then, with the movable pin withdrawn from the recess, the resin material hardens. Therefore, as a specific embodiment for not adversely affecting the quality of the resin molded article, the molding die of technique 5 of the present invention ideally has the plurality of deformation-inhibiting members suppressing deformation of the movable pin plate relative to the first die when the movable pin is withdrawn from the recess, based on any of the structures of techniques 1 to 4.

[0038] Ideally, in the molding die of Technique 6 of the present invention, based on any of the structures of Techniques 1 to 5, the plurality of connecting rods are connected and fixed to the movable pin plate on the outside of the resin molding area formed by the first mold and the second mold when viewed from the mold closing direction.

[0039] If the structure is as described, since it is located on the outer side of the resin molding area, it is further outward than the recess of the first mold. Therefore, multiple connecting rods can be connected and fixed to the movable pin plate regardless of the position of the recess in the first mold. Furthermore, while the movable pin plate is prone to bending and deformation due to the connection and fixing of the connecting rods on the outer side of the resin molding area, the deformation of the movable pin plate can be suppressed because multiple deformation-inhibiting members are provided.

[0040] Ideally, in the forming mold of technique 7 of the present invention, based on any of the structures of techniques 1 to 6, the plate driving part includes a movable plate connected to the other end of the plurality of connecting rods, and the movable pin plate is moved via the plurality of connecting rods by moving the movable plate.

[0041] If the structure is as described, since no gap can be formed between the plate drive section and the movable pin plate, multiple connecting rods can move simultaneously with the same stroke.

[0042] In the structure of technology 7, for example, when the movable pin is inserted into the recess and protrudes, the movable pin plate may bend convexly to the side opposite to the first mold due to the sliding resistance between the movable pin and the sliding hole formed in the first mold. That is, the distance between the center and the end of the movable pin plate may change. As a result, when multiple movable pins are provided on the movable pin plate, the amount of protrusion of each movable pin relative to the recess of the first mold will deviate. Consequently, the position of the molded object in the mold cavity will deviate, which will adversely affect the quality of the resin molded article.

[0043] To suitably solve the aforementioned problem, the forming mold of the present invention 8 ideally includes, based on the structure of the present invention 7, a distance defining member disposed between the movable plate and the movable pin plate, and defining the distance between the movable plate and the movable pin plate.

[0044] If the structure described above is used, even if the sliding resistance of the movable pin relative to the sliding hole increases, the deformation of the movable pin plate can be suppressed by the distance specified member. In addition, when multiple movable pins are provided on the movable pin plate, the protrusion of each movable pin relative to the recess of the first mold can be made consistent, and the positioning of the molded object in the mold cavity can be accurately performed, thereby preventing the deterioration of the quality of the resin molded article.

[0045] Ideally, in the forming mold of technique 9 of the present invention, based on any one of the structures of techniques 1 to 8, at least one of the plurality of connecting rods is provided with a load sensor for measuring the load applied to the connecting rod.

[0046] If the structure is as described, by measuring the load applied to the connecting rod, adverse conditions (such as damage to the first mold, damage to the deformation-inhibiting member, etc.) caused by connecting a component whose size or position changes during mold opening (such as a support column or the first mold, etc.) with a component whose size or position does not change (such as a deformation-inhibiting member) can be eliminated.

[0047] Furthermore, the resin molding apparatus of technique 10 of the present invention is characterized by comprising: a molding die of any one of techniques 1 to 9; and a mold closing mechanism for closing the molding die.

[0048] If it is the resin molding device, deformation of the movable pin plate can be suppressed, while the movable pin can be moved stably with high precision, thus improving the quality of the resin molded product.

[0049] Furthermore, the resin molding apparatus of the present invention 11 is characterized by comprising: the molding die of the present invention 9; a mold closing mechanism for closing the molding die; and a control unit for controlling the plate drive unit to make the load obtained by the load sensor become a predetermined value when the molding die is opened by the mold closing mechanism.

[0050] If it is the resin molding device, it can eliminate the adverse conditions (such as damage to the first mold, damage to the deformation-inhibiting component, etc.) caused by the connection between components whose size or position will change during mold opening (such as support columns or the first mold) and components whose size or position does not change (such as deformation-inhibiting components).

[0051] Furthermore, the resin molding article manufacturing method of technique 12 of the present invention is a method of manufacturing resin molding articles using a molding die of any one of techniques 1 to 9, characterized in that it includes: a mold closing step, in which the first mold and the second mold are closed; and a resin molding step, in which the movable pin is switched from a state protruding into the recess to a state pulled back to perform resin molding on the molded object.

[0052] If the method is the same as the method for manufacturing the resin molded article, deformation of the movable pin plate can be suppressed, while the movable pin can be moved stably with high precision, thus improving the quality of the resin molded article.

[0053] <An embodiment of the present invention>

[0054] Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the accompanying drawings.

[0055] Furthermore, generally speaking, the entire part that can be replaced relative to the resin molding apparatus depending on the type of object being molded is sometimes referred to as the molding mold. However, for ease of explanation, the part having the mold cavity or the part holding the object being molded will be referred to as the molding mold below. Also, for ease of understanding, any of the figures shown below may be omitted or depicted schematically with exaggerated references. Identical components will be labeled with the same reference numerals, and descriptions may be omitted.

[0056] <Overall Structure of the Resin Molding Device>

[0057] The resin molding apparatus 100 of this embodiment performs resin molding on a molding object W to which electronic components (not shown) are attached by means of transfer molding of resin material J.

[0058] Here, the object to be molded, W, can be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a wiring board, a lead frame, etc., and the presence or absence of wiring is arbitrary. Furthermore, the resin material J used for resin molding is, for example, a composite material containing a thermosetting resin, and the resin material J can be in granular, powdered, liquid, sheet, or tablet form. Moreover, the electronic component (not shown) connected to the upper surface of the object to be molded, W, can be, for example, a bare chip or a resin-sealed chip.

[0059] Specifically, such as Figure 1 As shown, the resin molding apparatus 100 includes a supply module 100A for supplying the molding object W and resin material J before molding, a molding module 100B for performing resin molding, and a storage module 100C for storing the molded object W (hereinafter referred to as the resin molded article P) after molding as constituent elements. Furthermore, the supply module 100A, molding module 100B, and storage module 100C are detachable and replaceable relative to the other constituent elements. Alternatively, two or three molding modules 100B can be provided to increase the number of constituent elements.

[0060] The supply module 100A is provided with a molding object supply unit 11 for supplying molding object W, a resin material supply unit 12 for supplying resin material J, and a conveying device 13 (hereinafter referred to as loader 13) for receiving molding object W from molding object supply unit 11 and conveying it to molding module 100B, and receiving resin material J from resin material supply unit 12 and conveying it to molding module 100B.

[0061] The loader 13 travels back and forth between the supply module 100A and the forming module 100B, and moves along a track (not shown) provided throughout the supply module 100A and the forming module 100B.

[0062] like Figure 1 and Figure 2As shown, the molding module 100B includes a molding mold that forms a cavity C for filling with resin material J, and has a first mold 2 (hereinafter referred to as upper mold 2) and a second mold 3 (hereinafter referred to as lower mold 3) arranged opposite to each other, and a mold closing mechanism 5 for closing the upper mold 2 and the lower mold 3.

[0063] In this embodiment, recesses 21 and 31 for forming the mold cavity C are formed on the upper mold 2 and lower mold 3, respectively. Here, the recesses 21 formed on the mold surface of the upper mold 2 (the surface facing the lower mold 3) and the recesses 31 formed on the mold surface of the lower mold 3 (the surface facing the upper mold 2) face each other, forming the mold cavity C. Furthermore, a resin injection section 4 for injecting resin material J into the mold cavity C is provided on the lower mold 3. The upper mold 2 is held in an upper mold support 101, which is fixed to an upper pressure plate 102. The lower mold 3 is held in a lower mold support 103, which is fixed to a movable pressure plate 104 that is raised and lowered by a mold closing mechanism 5.

[0064] The resin injection section 4 includes a container 41 formed in the lower mold 3 and containing resin material J, and a transfer mechanism 42 with a plunger 421 disposed at the lower part of the container 41. Furthermore, the container 41 is formed, for example, by a cylindrical member 43. The cylindrical member 43 is embedded in a through hole formed in the lower mold 3.

[0065] The transfer mechanism 42 moves the plunger 421 to inject resin material J from the tank 41 into the mold cavity C when the upper mold 2 and lower mold 3 are closed. The transfer mechanism 42, through the plunger 421, presses the resin material J, which has been heated and melted in the tank 41, into the mold cavity C. Furthermore, a resin passage (not shown) is formed in the upper mold 2 or lower mold 3 to connect the tank 41 and the mold cavity C. Additionally, an vent (not shown) is formed in the upper mold 2 on the side opposite to the tank 41.

[0066] Furthermore, when the plunger 421 is raised while the upper mold 2 and lower mold 3 are closed by the mold closing mechanism 5, the molten resin material J is injected into the mold cavity C through the resin passage. As a result, the electronic components (not shown) of the molded object W housed in the mold cavity C are sealed with resin.

[0067] like Figure 1 As shown, the storage module 100C is provided with a storage section 14 for storing resin molded articles P, and a conveying device 15 (hereinafter referred to as unloading machine 15) for receiving resin molded articles P from the molding module 100B and conveying them to the storage section 14.

[0068] The unloading machine 15 travels back and forth between the forming module 100B and the storage module 100C, and moves along a track (not shown) provided throughout the forming module 100B and the storage module 100C.

[0069] <Specific structure of forming module 100B>

[0070] Next, the specific structure of the forming module 100B in this embodiment will be described.

[0071] like Figure 2 As shown, the upper mold 2 and lower mold 3 of the molding module 100B have fixing mechanisms 6. These fixing mechanisms 6 fix the molded object W by moving a movable pin 61 back and forth within the mold cavity C during resin molding. Furthermore, fixing mechanisms 6 are respectively provided in the upper mold 2 and the lower mold 3. Since the fixing mechanisms 6 of the upper mold 2 and the lower mold 3 have the same structure, the following description focuses on the fixing mechanism 6 of the upper mold 2, omitting the description of the fixing mechanism 6 of the lower mold 3.

[0072] Specifically, such as Figure 3 As shown, the fixing mechanism 6 includes a movable pin plate 62 with a movable pin 61 that can move in and out of the recess 21, a plurality of connecting rods 63 with one end fixed to the movable pin plate 62, and a plate driving part 64 that moves the movable pin plate 62.

[0073] The movable pin plate 62 is disposed on the side opposite to the lower mold 3, relative to the upper mold 2. Specifically, the movable pin plate 62 is disposed between the upper mold 2 and the upper pressure plate 102. A plurality of movable pins 61 are provided on the movable pin plate 62. The plurality of movable pins 61 slide within sliding holes 2h1 formed along the thickness direction of the upper mold 2. Furthermore, each sliding hole 2h1 communicates with a recess 21 formed in the upper mold 2. Moreover, when the plurality of movable pins 61 are moved forward and backward relative to a recess 21, the structure becomes such that the plurality of sliding holes 2h1 communicate with a recess 21. Additionally, the movable pin plate 62 corresponds to the shape of the upper mold 2 when viewed from above (from the mold closing direction), as in this embodiment... Figure 4 As shown, for example, it is rectangular in shape.

[0074] Multiple connecting rods 63 are disposed on the side opposite to the upper mold 2, relative to the movable pin plate 62. Specifically, the multiple connecting rods 63 are disposed through the upper pressure plate 102. Furthermore, through holes are formed in the upper pressure plate 102 corresponding to each connecting rod 63.

[0075] In addition, such as Figure 4As shown, multiple connecting rods 63, when viewed from above (from the mold closing direction), are connected and fixed to the movable pin plate 62 on the outside of the resin molding area R formed by the upper mold 2 and the lower mold 3. The resin molding area R includes at least the area where the mold cavity C of the upper mold 2 and the lower mold 3 is formed, and the outside of the resin molding area R is the outside of the mold cavity C. In this embodiment, the resin molding area R is an area that is approximately the same as the molding object W disposed in the molding mold when viewed from above, and the outside of the resin molding area R is the outside of the molding object W to be resin molded. The multiple connecting rods 63 are arranged at points symmetrically on the movable pin plate 62. Furthermore, the multiple connecting rods 63 are connected and fixed to the corresponding two sides of the movable pin plate 62. In this embodiment, two connecting rods 63 are respectively connected and fixed to the opposing short sides of the movable pin plate 62. Furthermore, the connecting rod 63 is preferably located near the position (plate moving part 642) that transmits the driving force from the plate driving part 64 described later when viewed from the mold closing direction, so that the movable pin plate 62 can move up and down in parallel.

[0076] Here, the connection structure between one end of the connecting rod 63 and the movable pin plate 62 will be described.

[0077] In this embodiment, such as Figure 3 As shown, one end of the connecting rod 63 is connected and fixed to the movable pin plate 62 from the mold surface side of the upper mold 2, i.e., the parting line side. Specifically, a through hole 2h2 is formed on the outer side of the resin molding area R in the upper mold 2. The through hole 2h2 is formed at a position corresponding to the connecting rod 63.

[0078] Furthermore, one end of the connecting rod 63 is connected by a connecting member 7 inserted into the through hole 2h2 of the upper mold 2. The connecting member 7 includes a bolt 71 and a collar 72 that limits the tightening amount of the bolt 71, such as... Figure 3 As shown in the partially enlarged cross-sectional view, the connecting member 7 is screwed into an internally threaded hole 631 formed at one end of the connecting rod 63 through a through hole 62h1 formed in the movable pin plate 62, thereby connecting one end of the connecting rod 63 to the movable pin plate 62. Furthermore, the symbol 73 indicates a washer. Additionally, the collar 72 of the connecting member 7 has a fastening surface 7a that contacts the lower surface (facing the upper mold 2) of the movable pin plate 62. By screwing the bolt 71 of the connecting member 7 into the internally threaded hole 631, the fastening surface 7a contacts the lower surface of the movable pin plate 62, so that the upper surface of the movable pin plate 62 (the surface opposite to the upper mold 2) is in close contact with the lower end face of one end of the connecting rod 63.

[0079] The plate drive unit 64 moves the movable pin plate 62 via a plurality of connecting rods 63, so that the movable pin 61 moves back and forth within the recess 21.

[0080] Specifically, such as Figure 3As shown, the plate driving unit 64 includes a movable plate 641 connected to the other end of a plurality of connecting rods 63, and a plate moving unit 642 for moving the movable plate 641.

[0081] The movable plate 641 is positioned on the side opposite to the movable pin plate 62 (above the upper pressure plate 102) relative to the upper pressure plate 102. A plurality of connecting rods 63 are fixedly connected to the other end of the movable plate 641.

[0082] The plate moving part 642 moves the movable plate 641 in the vertical direction (mold closing direction). In this embodiment, it is located above the movable plate 641 (on the side opposite to the connecting rod 63 relative to the movable plate 641). The plate moving part 642 can be configured, for example, using a ball screw mechanism 642a. In this embodiment, it is a structure that transmits the driving force from the drive motor 642b to the ball screw mechanism 642a connected to the movable plate 641 via a transmission mechanism 642c such as a conveyor belt. Alternatively, the plate moving part 642 can also use other actuators such as cylinders or linear motors.

[0083] By using the plate moving part 642 to move the movable plate 641 in the vertical direction, the movable pin plate 62 moves in the vertical direction via a plurality of connecting rods 63 connected to the movable plate 641. As a result, the plurality of movable pins 61 move back and forth within the recess 21, switching between a state protruding into the recess 21 (entering state) and a state being pulled back from the recess 21 (exiting state).

[0084] <Distance Specified Component 8>

[0085] like Figure 3 , Figure 4 and Figure 5 As shown in (a), the forming module 100B of this embodiment includes one or more distance defining members 8 that define the distance between the movable plate 641 and the movable pin plate 62. In this embodiment, multiple distance defining members 8 are provided.

[0086] Furthermore, in the absence of a distance-specifying component 8, such as Figure 5 As shown in (b), due to the sliding resistance when the movable pin 61 enters the recess 21, the movable pin plate 62 may bend convexly to the side opposite to the upper mold 2. That is, the distance between the center and the end of the movable pin plate 62 changes, and the amount of protrusion of each movable pin 61 relative to the recess 21 deviates.

[0087] The distance-preserving member 8 suppresses the deflection of the movable pin plate 62 when the movable pin 61 enters the recess 21. Specifically, the distance-preserving member 8 suppresses the situation where the movable pin plate 62 bends upward (in the opposite direction to the upper mold 2) due to the sliding resistance between the movable pin 61 and the sliding hole 2h1 formed in the upper mold 2 when the movable pin 61 enters the recess 21, thereby ensuring that the multiple movable pins 61 are in the same position within the recess 21. Through the distance-preserving member 8, the protrusion amount of the multiple movable pins 61 within the recess 21 is the same.

[0088] The distance regulating member 8 is disposed between the movable plate 641 and the movable pin plate 62. To suppress deflection, the distance regulating member 8 is preferably disposed further inward than the plurality of connecting rods 63 when viewed from the mold closing direction (see reference). Figure 4 The distance defining member 8 is more preferably provided in the portion near the recess 21 (mold cavity C) when viewed from the mold closing direction. Each distance defining member 8 has a certain length, and the distance between the movable plate 641 and the movable pin plate 62 is defined as a certain distance by using one end face and the other end face in the axial direction.

[0089] The distance measuring member 8, like the connecting rod 63, is provided to pass through the upper pressure plate 102. Furthermore, through holes are formed in the upper pressure plate 102 corresponding to each distance measuring member 8. In this embodiment, the distance measuring member 8 is connected and fixed to the movable plate 641, but not connected and fixed to the movable pin plate 62, functioning as a so-called support rod between the movable plate 641 and the movable pin plate 62. Alternatively, the distance measuring member 8 may not be connected and fixed to the movable plate 641. Additionally, the distance measuring member 8 may be connected and fixed to the movable pin plate 62 instead of the movable plate 641.

[0090] <Deformation suppression component 9>

[0091] Furthermore, such as Figure 3 , Figure 4 and Figure 6 As shown in (a), the forming module 100B of this embodiment also includes a plurality of deformation suppression members 9 for suppressing the deformation of the movable pin plate 62 relative to the upper mold 2.

[0092] Furthermore, in the absence of deformation suppression component 9, such as Figure 6 As shown in (b), when the movable pin 61 is withdrawn from the recess 21 and pulled back, due to the sliding resistance between the movable pin 61 and the sliding hole 2h1 formed in the upper mold 2, the movable pin plate 62 may bend convexly toward the upper mold 2. That is, the distance between the center and the end of the movable pin plate 62 changes, and the amount of pull-back of each movable pin 61 relative to the recess 21 deviates.

[0093] The deformation suppression member 9 suppresses the deflection of the movable pin plate 62 when the movable pin 61 is withdrawn from the recess 21. Multiple deformation suppression members 9 are provided and spaced between the upper mold 2 and the movable pin plate 62.

[0094] like Figure 4 As shown, multiple deformation-inhibiting members 9 are balanced and well-arranged on the outer and inner sides of the resin molding area R formed by the upper mold 2 and the lower mold 3 when viewed from the mold-closing direction, in order to appropriately suppress the deflection of the movable pin plate 62. The multiple deformation-inhibiting members 9 are fixed to the surface of the upper mold 2 opposite to the mold surface and contact the surface of the movable pin plate 62 opposite to the upper mold 2 to suppress deformation of the movable pin plate 62. In this embodiment, the multiple deformation-inhibiting members 9 suppress the deformation of the movable pin plate 62 relative to the upper mold 2 when the movable pin 61 is withdrawn from the recess 21. Therefore, the withdrawal position (pull-back position) of each of the multiple movable pins 61 relative to the recess 21 is the same. That is, the pull-back amount of the multiple movable pins 61 relative to the recess 21 is the same due to the deformation-inhibiting members 9.

[0095] Specifically, such as Figure 3 and Figure 6 As shown in the enlarged cross-sectional view of (a), the plurality of deformation suppression members 9 have: a fixing portion 91, fixed to the surface of the upper mold 2 opposite to the mold surface; and a contact portion 92, provided in the fixing portion 91, which contacts the surface of the movable pin plate 62 opposite to the upper mold 2 when the movable pin plate 62 moves away from the upper mold 2. In this embodiment, a through hole 62h2 for inserting the fixing portion 91 is formed in the movable pin plate 62, and the fixing portion 91 is fixed to the upper mold 2 when inserted into the through hole 62h2 of the movable pin plate 62. In addition, a receiving recess 621 for receiving the contact portion 92 is formed in the upper part of the through hole 62h2.

[0096] Here, the contact portion 92 forms a flange at the upper end of the fixing portion 91 (the end opposite to the upper mold 2). In this embodiment, as shown... Figure 6 As shown in the enlarged cross-sectional view of (a), an annular member 921, such as a washer, is fixed to the upper end of the fixing part 91. The lower surface of the annular member 921 contacts the bottom surface of the receiving recess 621, suppressing deformation of the movable pin plate 62. Here, an upper fixing part 91a for fixing the annular member 921 is provided at the upper end of the fixing part 91. The movement of the movable pin plate 62 is restricted by the contact between the annular member 921 and the upper fixing part 91a. In this embodiment, the fixing part 91 has a bolt 911 and a collar 912 disposed around it, and the upper fixing part 91a includes the head of the bolt 911. In this structure, the annular member 921 is fixed by being clamped between the collar 912 and the head of the bolt 911. Furthermore, the fixing part 91 and the contact part 92 may also be an integral component.

[0097] Here, as Figure 3 As shown, multiple support columns 10 are provided between the upper pressure plate 102 and the upper mold 2 to ensure the flatness of the upper mold 2. For example... Figure 7 As shown in (a), the support column 10 contracts by closing the upper mold 2 and the lower mold 3 (the size of the support column 10 is L1). Furthermore, the deformation suppression member 9 functions when the movable pin 61 is pulled out of the mold cavity C (removed from the recess 21) while the upper mold 2 and the lower mold 3 are closed. That is, when the movable pin 61 is pulled back from the mold cavity C to complete the filling of the resin material J, the movable pin plate 62 comes into contact with the deformation suppression member 9. Then, when the mold is opened after the resin material J has hardened, as... Figure 7 As shown in (b), the contraction of the support column 10 is released, and it extends to its original size L2 (>L1). As a result, the upper mold 2 descends relative to the upper pressure plate 102 (movable pin plate 62). In this way, with the extension of the support column 10, a large load is applied to the contact portion 92 of the deformation suppression member 9, and there is a possibility of damage to the upper mold 2, the fixing portion 91, or the contact portion 92.

[0098] To address the aforementioned problems, in this embodiment, as follows: Figure 3 , Figure 5 as well as Figure 6 As shown, at least one of the plurality of connecting rods 63 is provided with a load sensor LS for measuring the load applied to the connecting rod 63. Furthermore, a control unit CTL (see reference) is provided to control the plate drive unit 64 so that the load obtained by the load sensor LS becomes a predetermined value (zero in this embodiment). Figure 1 Furthermore, the specified value can be set to a value suitable for resin molding based on the type of the object being molded, W, or the type of resin material, J. For example, it can be set to a value that ensures the upper mold 2, the fixing part 91, or the contact part 92 will not be damaged.

[0099] Specifically, the force applied to the connecting rod 63 during the opening of the upper mold 2 and lower mold 3 (the tensile force accompanying the extension of the support column 10) is measured by the load sensor LS. The movable pin plate 62 is moved up and down during a predetermined period from the start of mold opening to make the load measured by the load sensor LS zero. That is, the movable pin plate 62 is moved towards the mold cavity C by a corresponding amount of stretching towards the mold cavity C, thereby achieving no load or low load. Here, the predetermined period from the start of mold opening is, for example, at least from the start of mold opening until the support column 10 extends and returns to its original size, and at least from the start of mold opening until the mold surfaces of the upper mold 2 and lower mold 3 become non-contact. Alternatively, the movable pin plate 62 can be moved up and down from the start of mold opening until the mold opening is completed, so that the load measured by the load sensor LS becomes a predetermined value (zero in this embodiment).

[0100] Furthermore, the upper mold 2 is provided with a plurality of ejector pins (not shown) for demolding the resin molded article P from the upper mold 2 after resin molding. These ejector pins are configured to pass through the desired parts of the upper mold 2 and can be raised and lowered relative to the upper mold 2, and are fixed to an ejector pin plate (not shown) provided on the upper side of the upper mold 2. In addition, the ejector pin plate may be provided between the upper mold 2 and the movable pin plate 62. In this case, the ejector pin plate has through holes for the movable pin 61, connecting rod 63, connecting structural member 7, distance regulating member 8, deformation inhibiting member 9, and support column 10 to be inserted.

[0101] The ejector pin plate also has a return pin. During mold closing, the return pin contacts the resin molding area R of the molded object W in the lower mold 3, thereby causing the ejector pin plate to rise relative to the upper mold 2. Thus, during mold closing, the ejector pin is in a state of retraction into the mold surface of the upper mold 2. On the other hand, during mold opening, as the lower mold 3 descends, the ejector pin plate descends relative to the upper mold 2, and the resin molded part P is demolded from the upper mold 2 by the ejector pin.

[0102] <Method for manufacturing resin molded article P>

[0103] Next, the operation of the resin molding apparatus 100 of this embodiment and the method for manufacturing the resin molded article P will be described together. Furthermore, the following operations are performed, for example, by controlling each part through a control unit CTL provided in the supply module 100A.

[0104] First, the loader 13 transports the molding object W and the molding material J of the resin material to the lower mold 3 and assembles them (step S1; molding material assembly, refer to...). Figure 9 (a) Specifically, the object to be molded, W, is aligned and placed on the lower mold 3, and resin material J is supplied to the tank 41. In this embodiment, before placing the object to be molded, W, on the lower mold 3, the movable pin 61 of the lower mold 3 protrudes into the recess 31, and the lower surface of the fixed part of the object to be molded, W, is supported by the movable pin 61 of the lower mold 3. The movable pin 61 of the lower mold 3 protrudes into the recess 31 by the same amount as the distance specified by the member 8. Then, the upper mold 2 and the lower mold 3 are closed (step S2; closing the mold, see...). Figure 9 (b)

[0105] Then, with the mold closed, the movable pin 61 of the upper mold 2 is protruded into the recess 21, so that the movable pin 61 contacts the upper surface of the fixed part of the molded object W (step S3; upper movable pin protrusion, refer to...). Figure 10 (c) The movable pin 61 of the upper mold 2 protrudes the same amount as the distance specified by the member 8 within the recess 21. Thus, within the mold cavity C, the object W to be formed is positioned and fixed by being clamped by the movable pin 61 of the lower mold 3 and the movable pin 61 of the upper mold 2.

[0106] After the molded object W is positioned and fixed (with the movable pin 61 inserted into the recess 21 and recess 31), the transfer mechanism 42 is controlled and the molten resin material J in the tank 41 is injected into the mold cavity C through the plunger 421 (step S4; resin material injection, refer to...). Figure 10 (d) After the resin material J is injected, at a suitable time for molding, the movable pin plate 62 is moved out of the mold cavity C by the plate drive 64. Then, the movable pin plate 62 comes into contact with the contact portion 92 of the deformation inhibiting member 9 and stops. As a result, the movable pin 61 is pulled back from the mold cavity C and stops at a predetermined position, so that the movable pin 61 is withdrawn from the recess 21 and the recess 31 (step S5; movable pin pull-back, see...). Figure 11 (e)). Here, in the case of the movable pin plate 62 deflection, the deformation is corrected by the deformation suppression member 9, and the pull-back position of the movable pin 61 of the upper mold 2 is the same, and the pull-back position of the movable pin 61 of the lower mold 3 is the same.

[0107] Resin material J is also filled into the space formed after the movable pin 61 is pulled back, completing the filling of resin material J into the mold cavity C (step S6; resin material filling completed). Then, after a specified curing time, the resin material J hardens and resin molding is performed on the molded object W (step S7; resin material curing completed, refer to...). Figure 11 (f)

[0108] After the specified hardening time has elapsed, the process transitions to mold opening. Before mold opening begins, the movable pin plate 62 is controlled to cause the movable pin 61 to protrude into the mold cavity C (causing the movable pin 61 to enter the mold cavity C) (step S8; movable pin protrusion, see...). Figure 12 (g)). Here, it is determined whether the load measured by the load sensor LS is above a predetermined value (zero in this embodiment) (step S9; the load of the movable pin is above the predetermined value). Furthermore, before the mold opening begins, the movable pin plate 62 is pulled back, so the load measured by the load sensor LS is negative. When the load measured by the load sensor LS is zero, it is assumed that no load is generated on the movable pin plate 62 and the deformation suppression member 9. Then, if the load measured by the load sensor LS is not above the predetermined value (NO in step S9), the movable pin 61 is protruded by the plate drive unit 64 to set the load measured by the load sensor LS to above the predetermined value (see reference). Figure 12 (g)). If the load measured by the load sensor LS becomes above the specified value (YES in step S9), the mold opening operation begins (step S10; mold opening begins). Specifically, the lower mold 3 is lowered by the mold closing mechanism 5.

[0109] During the mold opening operation, within a specified time period, the movable pin plate 62 is moved up and down by the plate drive unit 64 to make the load measured by the load sensor LS reach a specified value (zero in this embodiment) (step S11; the movable pin moves up and down to make the load of the movable pin reach a specified value). In this way, the mold opening is performed simultaneously by controlling the plate drive unit 64 to make the load measured by the load sensor LS reach the specified value. The mold opening is completed by the lower mold 3 descending to the mold opening completion position (step S12; mold opening completed). Then, the unloading machine 15 receives the resin molded article P from the lower mold 3 and transfers it to the storage unit 14 (step S13; resin molded article removed), and the manufacturing of the resin molded article P is completed.

[0110] <Effects of this implementation method>

[0111] According to the resin molding apparatus 100 of this embodiment, a plurality of connecting rods 63 are connected and fixed to the movable pin plate 62, and a plurality of deformation suppression members 9 are provided to suppress the deformation of the movable pin plate 62 relative to the upper mold 2 and the lower mold 3. Therefore, even if the sliding resistance between the movable pin 61 and the sliding hole 2h1 formed in the upper mold 2 and the lower mold 3 increases, the deformation of the movable pin plate 62 can be suppressed, and the movement of the movable pin 61 can be performed with high precision and stability.

[0112] Furthermore, in this embodiment, multiple deformation suppression members 9 are provided on the outer and inner sides of the resin molding region R, where the deformation of the movable pin plate 62 increases due to deflection. This allows for balanced and even suppression of the deformation of the movable pin plate 62. Additionally, since this is on the outer side of the resin molding region R, and is located further outward than the recess 21 of the upper mold 2 and the recess 31 of the lower mold 3, multiple deformation suppression members 9 can be provided regardless of their positions.

[0113] Furthermore, the deformation suppression member 9 of this embodiment suppresses the deformation of the movable pin plate 62 relative to the upper mold 2 when the movable pin 61 is withdrawn from the recess 21, thus preventing the deterioration of the quality of the resin molded article P. Here, the multiple deformation suppression members 9 contact the surfaces of the movable pin plate 62 that are opposite to the molds 2 and 3 to suppress the deformation of the movable pin plate 62, thus appropriately suppressing the deformation of the movable pin plate 62 that bends convexly toward each mold 2 and 3.

[0114] Furthermore, in this embodiment, when the upper mold 2 and lower mold 3 are opened by the mold closing mechanism 5, the plate drive unit 64 is controlled to make the load obtained by the load sensor LS become zero. Therefore, the adverse conditions caused by the connection between components whose size or position changes during mold opening (such as support column 10 or upper mold 2) and components whose size or position does not change (such as deformation suppression member 9) can be eliminated (e.g., damage to upper mold 2, damage to deformation suppression member 9, etc.).

[0115] Furthermore, since the connecting rod 63 is fixed to the movable pin plate 62 from the mold surface side (parting line side) of both the upper mold 2 and the lower mold 3, the connection between the connecting rod 63 and the movable pin plate 62 can be released from the mold surface side of both the upper mold 2 and the lower mold 3. As a result, the upper mold 2 and the movable pin plate 62 provided on the upper mold 2, or the lower mold 3 and the movable pin plate 62 provided on the lower mold 3, can be easily installed and removed. Consequently, the replacement of each mold 2, 3, and the movable pin plate 62 for changing the type of resin molded product P can be easily performed.

[0116] <Other variations and implementations>

[0117] Furthermore, the present invention is not limited to the embodiments described herein.

[0118] For example, the described embodiment has a structure in which the movable pin 61 is provided in both the upper mold 2 and the lower mold 3, but it can also be configured to be provided in only one of the upper mold 2 or the lower mold 3.

[0119] In addition, in the above embodiment, the recess forming the mold cavity C is provided in both the upper mold 2 and the lower mold 3, but it can also be provided in one of the upper mold 2 or the lower mold 3.

[0120] Furthermore, in controlling the movable pin plate 62 during mold opening, if the load measured by the load sensor LS is less than zero, the descent of the lower mold 3, which is the mold opening action, can be stopped. Then, while the descent of the lower mold 3 is stopped, the movable pin 61 can be protruded by the plate drive unit 64, and the descent of the lower mold 3 can be restarted when the load measured by the load sensor LS becomes zero or higher.

[0121] Furthermore, the height position of the contact portion 92 can also be adjusted within the deformation suppression member. Specifically, for example... Figure 13 As shown, by providing other spacers 922, such as washers, between the annular member 921 and the collar 912 in the fixing part 91, the height position of the annular member 921 (contact part 92) can also be adjusted. By adjusting the height position of the annular member 921 (contact part 92) in this way, the amount of deflection suppression of the movable pin plate 62 can be adjusted, or the amount by which the movable pin 61 is withdrawn from the mold cavity C (in the recess 21) can be adjusted. Furthermore, as... Figure 13 As shown, an oil-free bushing or similar bushing 923 can also be provided between the collar 912 of the fixing part 91 and the through hole 62h2 of the movable pin plate 62 to allow the movable pin plate 62 to move smoothly up and down. In addition, the fixing part 91 can also be fixed to the upper mold 2 by an embedded structure.

[0122] Furthermore, in the described embodiment, a connecting member 7 is used to connect and fix the connecting rod 63 and the movable pin plate 62 from the mold surface side of the upper mold 2 and the mold surface side of the lower mold 3. However, other methods can also be used for connection and fixation. For example, a structure can be provided that connects and fixes the upper mold 2 from the side opposite to the mold surface and the lower mold 3 from the side opposite to the mold surface. Alternatively, a structure can be provided that connects and fixes the upper mold 2 from the side and the lower mold 3 from the side.

[0123] In the described embodiment, the movable pin plate 62 is rectangular in shape, but its shape is not limited as long as it can hold the movable pin 61 and allow it to move forward and backward within the mold cavity C. For example, it can also be polygonal or circular. In addition, the movable pin plate 62 may also include multiple plates.

[0124] In the described embodiment, a plurality of connecting rods 63 are arranged at points symmetrically in the movable pin plate 62, but such arrangement is not particularly limited as long as the movable pin plate 62 can move up and down in parallel.

[0125] In addition, in the above embodiment, before placing the object to be molded W on the lower mold 3, the movable pin 61 of the lower mold 3 protrudes into the recess 31, and in the mold-closed state, the movable pin 61 of the upper mold 2 protrudes into the recess 21, thereby fixing the fixed part of the object to be molded W. However, the timing of the fixing is not particularly limited, as long as it is before resin injection.

[0126] Furthermore, the present invention is not limited to the described embodiments, and various modifications can be made without departing from its spirit.

[0127] Industrial availability

[0128] This invention can suppress the deformation of the movable pin plate while ensuring the stable movement of the movable pin with high precision.

[0129] Explanation of icon numbers

[0130] 100: Resin molding apparatus

[0131] W: Shaped object

[0132] P: Resin molded products

[0133] J: Resin materials

[0134] C: Mold cavity

[0135] 2: First mold (upper mold)

[0136] 21: Concave

[0137] 3: Second mold (lower mold)

[0138] 31: concave part

[0139] 5: Mold closing mechanism

[0140] 61: Movable pins

[0141] 62: Movable pin plate

[0142] 63: Connecting rod

[0143] 64: Board drive section

[0144] LS: Load sensor

[0145] R: Resin molding area

[0146] 641: Movable plate

[0147] 8: Distance specified components

[0148] 9: Deformation suppression components

Claims

1. A forming die comprising: The first mold has a recess that forms a cavity for filling with resin material; The second mold is configured to face the first mold and is molded together with the first mold; A movable pin plate is disposed on the side opposite to the second mold relative to the first mold, and is fixed with a movable pin that can move in and out of the recess; Multiple connecting rods are arranged on the side opposite to the first mold relative to the movable pin plate, and one end is fixed to the movable pin plate; The plate drive unit moves the movable pin plate via the plurality of connecting rods to allow the movable pin to move back and forth within the recess; as well as Multiple deformation-inhibiting components are disposed between the first mold and the movable pin plate, and inhibit the deformation of the movable pin plate relative to the first mold.

2. The forming mold according to claim 1, wherein, The plurality of deformation suppression components are disposed on the outer and inner sides of the resin molding area formed by the first mold and the second mold when viewed from the mold closing direction.

3. The forming die of claim 1 or 2, wherein, The plurality of deformation suppression components are fixed on the side of the first mold opposite to the side facing the second mold, and are in contact with the side of the movable pin plate opposite to the first mold, and suppress the deformation of the movable pin plate.

4. The forming mold according to any one of claims 1 to 3, wherein, The plurality of deformation suppression components have: The fixing part is inserted into the through hole formed in the movable pin plate and fixed to the side of the first mold that is opposite to the side facing the second mold; as well as The contact portion, provided in the fixing portion, contacts the surface of the movable pin plate opposite to the first mold when the movable pin plate deforms in a direction away from the first mold.

5. The forming mold according to any one of claims 1 to 4, wherein, The plurality of deformation suppression members suppress the deformation of the movable pin plate relative to the first mold when the movable pin is withdrawn from the recess.

6. The forming mold according to any one of claims 1 to 5, wherein When viewed from the mold closing direction, the plurality of connecting rods are connected and fixed to the movable pin plate on the outside of the resin molding area formed by the first mold and the second mold.

7. The forming mold according to any one of claims 1 to 6, wherein The plate drive unit includes a movable plate connected to the other end of the plurality of connecting rods. By moving the movable plate, the movable pin plate is moved via the plurality of connecting rods.

8. The forming mold according to claim 7 further includes a distance defining member, the distance defining member being disposed between the movable plate and the movable pin plate, and defining the distance between the movable plate and the movable pin plate.

9. The forming mold according to any one of claims 1 to 8, wherein At least one of the plurality of connecting rods is provided with a load sensor for measuring the load applied to the connecting rod.

10. A resin molding apparatus comprising: The forming die according to any one of claims 1 to 9; as well as The mold closing mechanism closes the forming mold.

11. A resin forming apparatus comprising: The forming mold according to claim 9; The mold closing mechanism closes the forming mold; as well as The control unit controls the plate drive unit to make the load obtained by the load sensor become a predetermined value when the forming mold is opened by the mold closing mechanism.

12. A method for manufacturing a resin molded article, comprising using a molding die according to any one of claims 1 to 9 to manufacture the resin molded article, the method comprising: The mold closing process involves closing the first mold and the second mold together; and A resin molding step in which the movable pin is switched from the state of protruding into the recess to the state of being pulled out to resin-mold the molding object.

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