Gas flow valve and method of operating same

Abstract

Certain embodiments of the present disclosure relate to a gas flow valve. The gas flow valve includes a housing configured to receive a flow of gas. The gas flow valve further includes a plunger configured to move between a closed position and one or more open positions within the housing. The gas flow valve further includes a position sensor configured to measure a distance associated with a difference in position of the plunger between the closed position and the one or more open positions. The gas flow valve further includes a force sensor coupled to the plunger and configured to measure a force exerted on a sealing surface by the plunger in the closed position.

Description

Technical Field

[0001] The embodiments of this disclosure generally relate to valves for controlling gas flow. Background Technology

[0002] Various manufacturing systems (e.g., for semiconductor applications) may include gas flow valves to control the amount of gas flowing into, for example, a process chamber. Gas flow valves may be actuated based on controller input. The controller may use sensor data, such as flow sensor data, to actuate the gas flow valve to meet a target flow rate. In some manufacturing systems, process gases (e.g., gases used during semiconductor manufacturing processes) and / or cleaning gases (e.g., gases used to clean manufactured components and / or chambers used to manufacture electronic components) may have precise delivery targets, including high-quality flow rates and the ability to precisely control low flow rates. Furthermore, gas flow valves are susceptible to wear and leakage, which can be caused by particles carried in the gas flow. These particles can damage the valve and other downstream components. Summary of the Invention

[0003] Some embodiments of this disclosure relate to a gas flow valve including a housing configured to receive a gas flow. The gas flow valve further includes a plunger configured to move within the housing between a closed position and one or more open positions. The gas flow valve further includes a position sensor configured to measure a distance associated with a positional difference of the plunger between the closed position and one or more open positions. The gas flow valve further includes a force sensor coupled to the plunger and configured to measure a force exerted by the plunger on a sealing surface when in the closed position.

[0004] In another aspect of this disclosure, the gas flow assembly includes a valve comprising a housing configured to receive a gas flow. The valve further includes a plunger configured to move within the housing between a closed position and one or more open positions. The valve further includes a position sensor configured to measure a distance associated with a positional difference of the plunger between the closed and one or more open positions. The valve further includes a force sensor coupled to the plunger and configured to measure a force exerted by the plunger on a sealing surface when in the closed position. The gas flow assembly further includes a particle trap forming a chamber configured to separate particles from the gas flow. The gas flow assembly further includes a processing device configured to actuate the valve to control the gas flow based on sensor data from one or more of the position and force sensors.

[0005] In another aspect of this disclosure, a method includes receiving position data from a position sensor configured to measure a distance associated with a positional difference of a gas valve plunger configured to move between a closed position and one or more open positions. The method further includes receiving force data from a force sensor coupled to the plunger and configured to measure a force exerted by the plunger on a sealing surface when in the closed position. The method further includes actuating the plunger between the closed position and one or more open positions based on one or more of the position data or force data. Attached Figure Description

[0006] In the figures of the accompanying drawings, the present disclosure is illustrated by way of example rather than limitation, wherein the same element symbols indicate similar elements. It should be noted that different references to “a” or “one” embodiments in this disclosure do not necessarily refer to the same embodiment, and such references mean at least one.

[0007] Figure 1 An exemplary system according to an embodiment of the present disclosure is shown, the system including a processing chamber, a gas source, and a flow control device.

[0008] Figure 2A This is a schematic diagram of a gas rod assembly according to an embodiment of the present disclosure.

[0009] Figure 2B This is a perspective view of a gas rod assembly according to an embodiment of the present disclosure.

[0010] Figures 3A to 3B This is a cross-sectional side view of a gas flow valve assembly according to an embodiment of the present disclosure.

[0011] Figures 4A to 4B A cross-sectional side view of a gas flow valve according to an embodiment of the present disclosure is shown.

[0012] Figures 5A to 5B This is a flowchart of a method for controlling a gas flow valve according to an embodiment of the present disclosure.

[0013] Figure 6 This is a block diagram illustrating a computer system used according to an embodiment of the present disclosure. Detailed Implementation

[0014] The embodiments described herein relate to a gas flow valve (also referred to as a gas flow control valve, proportional gas flow control valve, etc.), a gas flow system incorporating the gas flow valve, and a method for controlling the gas flow valve. Generally, it is advantageous to proportionally control the gas flow to a system such as a substrate manufacturing system. Conventional gas flow control valves are passive devices actuated based on control inputs (e.g., inputs from a controller). These control inputs are typically based on the target gas flow rate and flow rate sensor data. However, conventional gas flow control valves suffer from poor accuracy, repeatability, reliability, and cleanliness.

[0015] Typically, gas flow control valves wear down with continued use. For example, the sealing surfaces inside the valve deteriorate and / or corrode, causing mechanical or electrical hysteresis within the valve. This hysteresis leads to drift in valve performance, which may result in allowing incorrect or unexpected gas flow rates through the valve in response to controller-induced actuation. Deterioration of the valve sealing surfaces can also lead to gas leakage, which worsens over time, further damaging the valve and incorrectly introducing gas into the manufacturing process when the valve should be closed. Furthermore, the deterioration of conventional gas flow control valves can lead to particle generation. These particles are carried by the gas flow and can further damage the valve, causing reliability issues, or damaging downstream manufacturing processes and / or related components, and / or contaminating the substrate being processed. Because conventional gas flow control valves lack internal sensors capable of detecting valve wear and / or particles, the effects of wear and / or particles in the valve are not adequately compensated for in conventional control algorithms. Therefore, conventional gas flow control valves may lack accuracy, especially when the health of internal components deteriorates or wears down over time. Compensating for valve wear and performance degradation over time would be beneficial.

[0016] By providing a gas flow control valve having one or more sensors and / or actuators, aspects and implementations of this disclosure address the aforementioned and other disadvantages of conventional gas flow valves. In some embodiments, the gas flow control valve includes a housing. The housing may have one or more internal passages for receiving gas flow. The gas may be a process gas, such as nitrogen, argon, etc. The gas may be a corrosive gas, such as a gas used for substrate etching operations. In some embodiments, the flow control valve housing contains movable mechanical components, such as a plunger assembly and one or more sensors for measuring one or more valve-related metrics. In some embodiments, the housing includes one or more actuators that remove particles from the valve by vibrating one or more valve components to dislodge particles. In some embodiments, the housing includes a particle trap for capturing particles. In some embodiments, the housing additionally includes one or more sealing surfaces to impede gas flow (e.g., when the valve is closed). In some embodiments, the one or more sealing surfaces include elastomeric seals that are contacted by the plunger assembly when the valve is closed (e.g., when the plunger assembly is in the closed position).

[0017] In some embodiments, a plunger assembly (e.g., a plunger) is configured to move within a housing between a closed position (e.g., when the valve is closed) and one or more open positions (e.g., when the valve is open). When in the closed position, the bottom surface of the plunger contacts the sealing surface of the gas flow valve to prevent gas flow through the housing. The plunger can move to one or more open positions to allow gas flow. In some embodiments, the distance between the bottom surface of the plunger and the sealing surface increases, allowing an increase in the gas flow rate through the valve. In some embodiments, an actuator, such as an electric actuator or a pneumatic actuator, moves the plunger. In some embodiments, an electromagnetic coil coupled to the housing is energized to move the plunger. In some embodiments, the electromagnetic coil induces an electromagnetic force on the plunger to overcome the spring force that keeps the plunger normally closed or normally shut. In some embodiments, a controller opens and closes the plunger to proportionally control the gas flow through the valve.

[0018] In some embodiments, a position sensor is configured to measure the position of a plunger. In some embodiments, the position sensor measures the position of the plunger relative to itself. For example, the position sensor may measure the distance between itself and the plunger surface. In some embodiments, the position sensor is a capacitive displacement sensor located within a housing. The position sensor may be positioned above the plunger within the housing (e.g., opposite a sealing surface) and may measure the distance between itself and the top of the plunger. Sensor data from the position sensor may be sent to a controller. Because the distance between the top and bottom of the plunger (e.g., the length or height of the plunger) is known, the controller may determine the distance between the bottom surface of the plunger and the sealing surface of the gas flow control valve. Therefore, the controller may determine the degree of "opening" of the valve based on the position sensor data.

[0019] In some embodiments, a force sensor is coupled to the bottom surface of the plunger. In some embodiments, the force sensor measures the force exerted by the plunger on the sealing surface when it is in the closed position. In some embodiments, the force sensor is a piezoelectric module that outputs an electrical signal corresponding to the sensed force. In some embodiments, the force sensor is bonded to the bottom surface of the plunger. When the plunger is in the closed position, the force sensor can contact the sealing surface of the valve to stop the gas flow. In some embodiments, the force sensor can be vibrated by supplying an electric current to it. For example, the piezoelectric module can vibrate when an electric current is supplied. In some embodiments, the vibration of the force sensor may cause particles on the sealing surface to be displaced. The displaced particles may be carried away by the gas flow. In this case, the force sensor acts as an actuator that actively removes particles from the valve by vibrating the valve components.

[0020] In some embodiments, the health condition of a sealing surface can be determined based on force sensor data and position sensor data (e.g., via a controller). In some embodiments, the controller can use the force and position data to calculate a stress-strain profile of the sealing surface. The calculated stress-strain profile can be compared with the stress-strain profile of a well-conditioned sealing surface. In some embodiments, when the calculated stress-strain profile fails to meet a threshold criterion (e.g., the calculated stress-strain profile is significantly different from a known good stress-strain profile), the controller can determine that the sealing surface has deteriorated beyond the threshold condition. In some examples, when the stress-strain profile calculated using force and position data fails to meet the threshold condition, the controller can determine that the elastomeric sealing surface (e.g., an O-ring seal, etc.) has worn or deteriorated.

[0021] In some embodiments, the controller may determine that the valve is leaking based on force sensor data. In some examples, a leak between the sealing surface and the plunger will cause fluctuations in the applied force sensed by the force sensor. The controller may identify these fluctuations in force as a leak. In some embodiments, the controller may use a greater force to close the plunger (e.g., actuate it to the closed position) to stop the leak.

[0022] In some embodiments, the particulate trap is coupled to the outlet of a gas flow valve. The particulate trap may have a chamber to induce a swirling flow within the chamber. In some embodiments, centrifugal force may cause particles to move to the outer diameter of the chamber and contact the chamber wall. The chamber wall may be roughened so that particles adhere to the chamber wall. In some embodiments, particles are collected in a removable (e.g., detachable) container that can be periodically removed to dispose of the collected particles. Substantially particle-free gas can flow through a collection tube within the particulate trap chamber, thereby exiting the system.

[0023] Embodiments of this disclosure offer advantages over conventional systems described above. Specifically, some embodiments described herein provide a gas flow control valve that can be actuated based on sensor data collected from integrated sensors. For example, based on position data received from a position sensor, the plunger of the valve described herein can be actuated to open to a target position. In another example, based on force data received from a force sensor, the plunger can be closed more tightly. In some embodiments described herein, by comparing a calculated stress-strain curve with threshold criteria (e.g., known good values), the gas flow control valve can monitor the health of the sealing surface using one or more of a position sensor or a force sensor, which can help avoid unscheduled downtime for replacing valve components. In some embodiments described herein, the gas flow valve can detect leaks and perform appropriate actions to remedy them, such as applying greater force to close the valve. In some embodiments described herein, the gas flow valve includes an in-situ particle cleaning feature to remove particles, making the valve cleaner than conventional gas flow valves. In some embodiments, the gas flow valve includes a particle trap to collect particles in the gas flow, providing cleaner gas with fewer particles compared to conventional gas flow valves. In some embodiments, due to the advantages of the gas flow control valves described herein, the manufacturing system can process substrates more accurately with fewer errors and less waste, thereby increasing the overall system throughput. Compared to conventional gas flow control valves, the gas flow control valves described in at least some embodiments herein offer improved accuracy, improved repeatability, improved reliability, and / or improved cleanliness. For example, the gas flow control valves described in some embodiments herein can avoid mechanical and / or electrical hysteresis, reduce component wear, and / or reduce contaminant accumulation, thereby achieving one or more of the aforementioned improvements over conventional flow control valves.

[0024] Figure 1 A system 100 according to an embodiment of this disclosure is depicted, comprising a processing chamber 101, a gas source 160, and a flow control device (e.g., a gas rod assembly 200). The processing chamber 101 can be used in processes that provide a corrosive plasma environment. For example, the processing chamber 101 may be a chamber for a plasma etcher or plasma etching reactor, a plasma cleaner, etc. In alternative embodiments, other processing chambers may or may not be exposed to a corrosive plasma environment. Some examples of chamber components include chemical vapor deposition (CVD) chambers, physical vapor deposition (PVD) chambers, ALD chambers, IAD chambers, etching chambers, and other types of processing chambers. In some embodiments, the processing chamber 101 may be any chamber used in an electronic component manufacturing system.

[0025] In one embodiment, the processing chamber 101 includes a chamber body 102 and a spray head 130 enclosing an internal volume 106. The spray head 130 may include a spray head base and a gas distribution plate (GDP) having multiple gas delivery orifices 132 (also referred to herein as channels) throughout the GDP. Alternatively, in some embodiments, the spray head 130 may be replaced by a cap and nozzles, or in other embodiments by multiple pie-shaped spray head compartments and plasma generation units. The chamber body 102 may be made of aluminum, stainless steel, or other suitable materials such as titanium. The chamber body 102 generally includes sidewalls 108 and a bottom 110.

[0026] An outer gasket 116 may be disposed adjacent to a sidewall 108 to protect the chamber body 102. The outer gasket 116 may be manufactured to include one or more holes. In one embodiment, the outer gasket 116 is made of alumina.

[0027] An exhaust port 126 may be defined within the chamber body 102 and may couple the internal volume 106 to a pump system 128. The pump system 128 may include one or more pumps and throttle valves for evacuating the internal volume 106 of the processing chamber 101 and regulating the pressure of the internal volume 106.

[0028] A gas source 160 may be coupled to a processing chamber 101 to supply processing gas and / or cleaning gas to the internal volume 106 via a supply line 112 through a spray head 130. A flow control device may be coupled to the gas source 160 and the processing chamber 101. The flow control device can be used to measure and control the gas flow rate from the gas source 160 to the internal volume 106. See below for further details. Figures 2A to 2B An exemplary flow control device is described in more detail below. In some embodiments, the flow control device includes a gas flow valve as described herein. In some embodiments, one or more gas panels 160 may be coupled to a processing chamber 101 to supply gas to an internal volume 106. In this embodiment, one or more flow control systems may be coupled to each gas source 160 and the processing chamber 101. In other embodiments, a single flow control device may be coupled to one or more gas panels 160. In some embodiments, the flow control device may include a flow ratio controller to control the flow of gas to the processing chamber 101 (e.g., through one or more supply lines 112) or other processing chambers.

[0029] In some embodiments, a separate flow control device is used to supply each gas to the processing chamber. In embodiments, each flow control device is or includes a gas rod assembly, as described below. Figures 2A to 2B As described and shown.

[0030] The spray head 130 may be supported on the side wall 108 of the chamber body 102. The spray head 130 (or cover) may be opened to allow access to the internal volume 106 of the processing chamber 101 and may provide a seal for the processing chamber 101 when closed. A gas source 160 may be coupled to the processing chamber 101 to supply processing gas and / or cleaning gas to the internal volume 106 through the spray head 130 or the cover and nozzle (e.g., through the orifice of the spray head or cover and nozzle).

[0031] In some embodiments, one or more sensor assemblies 170 may be housed within the internal volume 106. For example, one or more sensor assemblies 170 may be located near the spray head 130 (e.g., within 10 cm). As another example, one or more sensor devices may be located near the substrate 144 (e.g., within 10 cm), which can be used to monitor conditions near the reaction site.

[0032] In one embodiment, the substrate support assembly 148 includes a base 152 supporting an electrostatic chuck 150. The electrostatic chuck 150 further includes a thermally conductive substrate and an electrostatic chuck bonded to the thermally conductive substrate by an adhesive, in one embodiment, which may be a silicone adhesive. The thermally conductive base and / or electrostatic chuck of the electrostatic chuck 150 may include one or more optional embedded heating elements, embedded thermal insulators, and / or conduits to control the lateral temperature distribution of the substrate support assembly 148. The electrostatic chuck may further include multiple gas passages, such as recesses, platforms, and other surface features that may be formed in the upper surface of the electrostatic chuck. The gas passages may be fluidly connected to a source of heat transfer (or back) gas (such as helium) through holes drilled in the electrostatic chuck. In operation, back gas may be supplied to the gas passages under controlled pressure to enhance heat transfer between the electrostatic chuck and the supported substrate 144. The electrostatic chuck 150 may include at least one clamping electrode controlled by a chuck power supply.

[0033] Figure 2AA schematic diagram of a gas rod assembly according to an embodiment of the present disclosure is shown. Multiple gas rod assemblies may receive gas from multiple gas sources. For example, the processing apparatus may include different gas rod assemblies for each type of gas delivered to the processing chamber. As shown, gas flows through the gas rod assembly from left to right. In some embodiments, the gas rod assembly 200 includes a mixing valve 201, which may be a first component of the gas rod assembly 200. The mixing valve may include a manual valve and an automatically actuated valve (e.g., a pneumatic valve, an electric valve, etc.). The mixing valve 201 may receive gas from a gas source (not shown). The mixing valve 201 may direct gas to a purging valve 202 via one or more passages. The purging valve 202 may be configured to purify the gas rod assembly 200. In some embodiments, the gas rod assembly 200 includes a regulator 203. The regulator 203 may receive gas from the purging valve 202. The regulator 203 may regulate the gas flow rate through the gas rod assembly 200. In some embodiments, a filter 204 is coupled downstream of the regulator 203 and receives the gas flow rate from the regulator 203. In some embodiments, upstream valve 205 may receive gas from regulator 203 and direct the gas flow to mass flow controller 206. Mass flow controller 206 may control the gas flow through gas rod assembly 200. In some embodiments, downstream valve 207 receives gas from mass flow controller or other upstream components. Downstream valve 207 may direct gas to a gas destination (e.g., a processing chamber; not shown). In some embodiments, one or more of mixing valve 201, upstream valve 205, or downstream valve 207 includes one or more integrated sensors, such as force sensors and / or position sensors described herein. In some embodiments, one or more of mixing valve 201, upstream valve 205, or downstream valve 207 is actuated based on force sensor data and / or position sensor data as described herein. In some embodiments, one or more of mixing valve 201, upstream valve 205, or downstream valve 207 includes a particle trap configured to capture particles in the gas flow.

[0034] Figure 2B A perspective view of a gas rod assembly 200 according to an embodiment of the present disclosure is shown. Multiple gas rod assemblies can receive gas from multiple gas sources. For example, the processing apparatus may include different gas rod assemblies for each type of gas delivered to the processing chamber. As shown, gas flows through the gas rod assembly from left to right.

[0035] In some embodiments, the gas rod assembly 200 includes a substrate 209. The gas rod assembly 200 can receive gas (e.g., from a gas source) via a gas coupling member 208. In some embodiments, the gas rod assembly 200 includes a mixing valve 201, a purging valve 202, a regulator 203, a filter 204, an upstream valve 205, a mass flow controller 206, and / or a downstream valve 207. In some embodiments, each of the mixing valve 201, the purging valve 202, the regulator 203, the filter 204, the upstream valve 205, the mass flow controller 206, and / or the downstream valve 207 is coupled to the gas rod assembly substrate 209.

[0036] Figure 3A A cross-sectional side view of a gas flow valve assembly 300A according to an embodiment of the present disclosure is shown. In some embodiments, the gas flow valve assembly includes a housing 302 that houses various mechanical components and / or sensor components. In some embodiments, a plunger 304 is disposed within the housing 302. The plunger 304 may be ferrous. In some embodiments, the plunger 304 is a magnetized iron or steel rod. The housing 302 may include a base 312 having one or more internal passages through which gas can flow. In some embodiments, the base 312 is made of stainless steel. In some embodiments, the base 312 is welded to the housing 302. In some embodiments, gas enters through a gas inlet 362 and exits through a gas outlet 364. When the plunger 304 is in one or more open positions (e.g., as shown), gas is allowed to flow through a sealing surface 314. In some embodiments, the sealing surface 314 is made of an elastomeric seal, such as an O-ring seal. In some embodiments, the elastomeric seal is bonded within a groove formed in the base 312.

[0037] In some embodiments, the electromagnetic coil 308 may sense an electromagnetic force to move the plunger 304 against a spring force. In some embodiments, the electromagnetic coil 308 may be energized by current and / or voltage. In some embodiments, the spring 306 holds the plunger 304 in a normally closed position. In some embodiments, the spring 306 holds the plunger 304 in a normally open position. The spring 306 may include one or more springs. In some embodiments, the spring 306 is a helical spring that actuates the top surface of the plunger 304. In some embodiments, the spring 306 is made of a generally corrosion-resistant metal such as stainless steel.

[0038] In some embodiments, bellows 310A is configured to isolate a first internal portion of housing 302 from a second internal portion of housing 302. In some embodiments, bellows 310A separates a gas flow portion of valve assembly 300A from a sealing portion of valve assembly 300A. In some embodiments, bellows 310A flexes as plunger 304 moves between a closed position and one or more open positions. For example, the flexing of bellows 310A occurs in… Figure 4A and Figure 4B As shown in the image. Figure 4A A cross-sectional side view of a gas flow valve 400A according to an embodiment of the present disclosure is shown. Figure 4B A cross-sectional side view of a gas flow valve 400B according to an embodiment of the present disclosure is shown. Figure 4A The example shows plunger 304 in the open position, while Figure 4B A plunger 304 is shown in the closed position. In some embodiments, when the plunger 304 is in such a position... Figure 4A When the bellows 310A is in the open position as shown, it is in a compressed state. In some embodiments, when the plunger 304 is in the open position as shown... Figure 4B In the closed position shown, bellows 310A is in the extended state. When plunger 304 is in the closed position, gas flow through the valve can be stopped. In the closed position, plunger 304 and / or force sensor 332 form a seal with sealing surface 314 to prevent gas flow. In some embodiments, bellows 310A is a metal bellows. Bellows 310A may be substantially corrosion-resistant. In some embodiments, bellows 310A may be made of stainless steel. In some embodiments, bellows 310A is coupled to a portion of housing 302. In some embodiments, bellows 310A is welded to housing 302.

[0039] See Figure 3B This figure illustrates a cross-sectional side view of a gas flow valve assembly 300B according to an embodiment of the present disclosure. In some embodiments, a diaphragm 310B separates the gas flow portion of the valve assembly 300B from the sealing portion of the valve assembly 300B. In some embodiments, the diaphragm 310B flexes as the plunger 304 moves between a closed position and one or more open positions. In some embodiments, the diaphragm 310B is a metallic diaphragm. The diaphragm 310B may be substantially corrosion-resistant. In some embodiments, the diaphragm 310B may be made of stainless steel. In some embodiments, the diaphragm 310B is coupled to a substrate 312. In some embodiments, the diaphragm 310B is coupled between the substrate 312 and a housing 302. In some embodiments, the diaphragm 310B is welded to the housing 302 and / or the substrate 312.

[0040] See again Figure 3AIn some embodiments, position sensor 334 is coupled to the bottom of cover 303 on top of housing 302. In some embodiments, position sensor 334 is coupled by one or more mechanical fasteners and / or adhesives or bonding agents. In some embodiments, position sensor 334 is screwed into cover 303. In some embodiments, position sensor 334 measures the position of plunger 304. In some embodiments, position sensor 334 is a capacitive displacement sensor. In some embodiments, capacitive displacement sensor is a non-contact measuring device capable of measuring the position and / or position change of a conductive target. In some embodiments, position data collected by position sensor 334 is transmitted (e.g., via wired, via wireless communication, etc.) to controller 340. In some embodiments, controller 340 determines the position of plunger 304 based on the position data. In some embodiments, controller 340 moves the plunger based on the position data. In some examples, controller 340 provides an output signal to solenoid coil 308 to move plunger 304. Controller may receive position data (e.g., from position sensor 334) indicating that plunger 304 is in a non-target position. The controller can determine a new output signal (e.g., based on received position data) to the electromagnetic coil to move the plunger 304 to a target position. In some embodiments, the controller 340 can determine the distance between the sealing surface 314 and the bottom surface of the plunger 304 (e.g., the bottom surface of the force sensor 332 coupled to the bottom surface of the plunger 304). For example, the controller 340 can infer the gap between the bottom surface of the plunger 304 and the sealing surface 314 using the position data of the plunger 304 and a known height (e.g., length, etc.). The controller 340 can move the plunger 304 (e.g., by providing an output signal to the electromagnetic coil 308) to increase or decrease the size of the gap.

[0041] In some embodiments, force sensor 332 is coupled to the bottom of plunger 304. In some embodiments, force sensor 332 is coupled to a second end of the plunger opposite to the first end, wherein spring 306 applies force to the first end of plunger 304. In some embodiments, force sensor 332 is bonded to the bottom of plunger 304 by an epoxy resin layer 352. The epoxy resin layer 352 may be an adhesive layer to bond force sensor 332 to plunger 304. In some embodiments, force sensor 332 is coupled to plunger 304 by one or more mechanical fasteners. In some embodiments, force sensor 332 is a piezoelectric module. In some embodiments, the piezoelectric module includes one or more crystals configured to convert mechanical energy into electrical energy. In some embodiments, the piezoelectric module is configured to sense applied force.

[0042] In some embodiments, the force sensor 332 is configured to measure the force applied by the plunger 304. In some embodiments, when the plunger 304 is in the closed position, the force sensor 332 senses the amount of force applied by the plunger 304 to the sealing surface 314, such as... Figure 4B As shown. In some embodiments, when the plunger 304 is in the closed position to prevent gas from flowing through the valve, the force sensor 332 contacts the sealing surface 314. In some embodiments, an electrical signal indicating the magnitude of the force applied to the sealing surface 314 is sent to the controller 340. In some embodiments, the force sensor 332 is electrically connected to the controller 340 via one or more wires routed through the plunger 304 via a through-hole 305.

[0043] In some embodiments, when the plunger 304 is in the closed position, the controller 340 may determine whether a leak exists at the sealing surface 314. Leaking gas (e.g., leakage through the sealing surface 314 when the plunger 304 is in the closed position) may cause vibrations sensed by the force sensor 332. These vibrations may be evidenced by small fluctuations in the applied force sensed by the force sensor 332. In some embodiments, when the controller 340 determines that gas is leaking, the controller 340 may cause the plunger 304 to increase the force applied to the sealing surface. The controller 340 may cause the plunger (e.g., via the force sensor 332) to apply an increased force to the sealing surface 314 by increasing the current and / or voltage applied to the solenoid coil 308 or by decreasing the current and / or voltage applied to the solenoid coil 308, thereby sending a signal to the solenoid coil 308 to cause the plunger to apply a greater force to the sealing surface 314.

[0044] In some embodiments, controller 340 can determine the health condition of sealing surface 314 using force data from force sensor 332 and position data from position sensor 334. In some embodiments, controller 340 calculates a stress-strain profile of sealing surface 314. In some examples, as plunger 304 moves to the closed position, the applied force (e.g., stress) on sealing surface 314 increases, and controller 340 can sense the displacement (e.g., strain) of sealing surface 314. Controller 340 can correlate the strain indicated by position data (e.g., from position sensor 334) with the stress indicated by force data (e.g., from force sensor 332) to calculate the stress-strain profile. In some embodiments, controller 340 compares the calculated stress-strain profile with a known healthy stress-strain profile of sealing surface 314. The known healthy stress-strain profile may correspond to the stress-strain profile of sealing surface 314 in good condition, such as when it is brand new or unused. The known healthy stress-strain profile may be associated with a threshold criterion used for comparing the calculated stress-strain profile. As the sealing surface 314 deteriorates over time and / or with use, the stress-strain profile may drift and / or change. In some embodiments, the controller 340 may determine the health condition of the sealing surface 314 based on the drift and / or change in the stress-strain profile. In some embodiments, the controller may determine that the sealing surface 314 is in an unhealthy condition in response to determining that the calculated stress-strain profile has exceeded a threshold condition. The controller 340 may output a notification (e.g., to a technician, etc.) that the sealing surface 314 should be repaired or replaced when it is in an unhealthy condition.

[0045] In some embodiments, the controller 340 may use force data from the force sensor 332 to determine the health condition of the spring 306. In some embodiments, the spring 306 provides a force to move the plunger 304 to a closed position. The spring force (e.g., from the spring 306) keeps the plunger 304 closed to prevent gas flow. The force sensor 332 can sense the spring force exerted by the spring 306 to keep the plunger 304 in the closed position. As the spring 306 wears out with use, the spring force exerted by the spring 306 decreases over time. The force data can indicate the decrease in spring force. In some embodiments, the controller 340 may determine the condition of the spring 306 based on the force data indicating the spring force. When the force data (e.g., from the force sensor 332) indicates a force below a threshold, the controller 340 may determine that the spring 306 is in an unhealthy condition. In some embodiments, when the spring is in an unhealthy condition, the controller 340 may output a notification that the spring 306 should be repaired or replaced.

[0046] In some embodiments, the controller 340 may initiate a self-cleaning procedure to dislodge particles from the sealing surface 314. In some embodiments, the controller may send a command (e.g., an electronic signal) to induce vibration in the force sensor 332, thereby dislodging particles from the sealing surface 314. For example, if the force sensor 332 is a piezoelectric module, the controller may send an electrical signal to the piezoelectric module to excite the piezoelectric transistor and induce vibration. Vibration may cause particles accumulated on the sealing surface 314 to displace. The gas flow through the valve may carry away the displaced particles from the sealing surface 314. In some embodiments, to dislodge particles, the plunger 304 is opened so that the force sensor 332 contacts the sealing surface 314, but no seal is created to stop the gas flow. The vibration induced in the force sensor 332 may dislodge particles, and the flowing gas may carry away the displaced particles.

[0047] In some embodiments, the particulate trap 320 is coupled to the substrate 312. In some embodiments, a gas loaded with particles flows into the particulate trap 320 through an inlet and into the separator module 322. Particles can be separated from the flowing gas and collected in a removable container 324. Gas that is substantially free of particles can flow upward through a collection tube 326 and out through a gas outlet 364. In some embodiments, a cyclone or eddy current is induced in the gas flow within the separator module 322. In some embodiments, a cyclone flow is induced in the separator module 322 by tangentially introducing the gas flow into the separator module 322. Due to centrifugal force, the cyclone flow in the gas flow can cause particles to be pushed against the wall of the separator module 322. In some embodiments, the wall of the separator module 322 is rough, causing particles to adhere to the wall. In some embodiments, particles move downward along the wall of the separator module 322 and fall into the removable container 324. The removable container 324 can be configured to be periodically removed for cleaning. In some embodiments, the removable container 324 is detachable from the separator module 322, allowing the collected particles to be emptied. In some embodiments, the removable container 324 is coupled to the separator module 322 by one or more mechanical fasteners. In some embodiments, a seal, such as an O-ring seal, seals the interface between the separator module 322 and the removable container 324. In some embodiments, the separator module 322 is coupled to the upper portion of the particle trap 320 by one or more mechanical fasteners. In some embodiments, a seal (e.g., an O-ring seal, an elastomeric seal, etc.) seals the interface between the separator module 322 and the upper portion of the particle trap 320. In some embodiments, the upper portion of the particle trap 320 couples the particle trap 320 to the substrate 312. In some embodiments, the separator module 322, the removable container 324, the upper portion of the particle trap 320, and / or the collection tube 326 are made of a substantially non-corrosive metal, such as stainless steel.

[0048] Figures 5A to 5B This is a flowchart of a method for controlling a gas flow valve according to an embodiment of the present disclosure. Figure 5A This is a flowchart of a method 500A for controlling a gas flow valve, such as a gas flow valve assembly 300A, 300B, or a flow valve 400A or 400B, according to an embodiment of this disclosure. In some embodiments, method 500A is executed and / or prompted to be executed by processing logic including hardware (e.g., circuitry, dedicated logic, programmable logic, microcode, processing device, etc.), software (e.g., instructions running on a processing device, general-purpose computer system, or special-purpose machine), firmware, microcode, or a combination of the foregoing. In some embodiments, method 500A is executed at least in part by a controller (e.g., controller 340) of the gas flow valve assembly.

[0049] For simplicity, method 500A is depicted and described as a series of operations. However, operations according to this disclosure may occur in various sequences and / or concurrently with other operations not presented and described herein. Furthermore, in some embodiments, implementing method 500A according to the disclosed objectives does not necessarily perform all the operations shown. Moreover, those skilled in the art will understand and appreciate that method 500A may alternatively be represented as a series of interrelated states via a state diagram or events.

[0050] In some embodiments, at block 502, processing logic receives position data from a position sensor. The position sensor may be configured to measure a distance associated with a positional difference of a gas flow valve plunger configured to move between a closed position and one or more open positions. In some embodiments, the position sensor is a capacitive displacement sensor. In some embodiments, the position data indicates the plunger's position relative to the sensor.

[0051] In some embodiments, at block 504, processing logic receives force data from a force sensor. In some embodiments, the force sensor is coupled to a plunger. The force sensor measures the force exerted by the plunger on a sealing surface when it is in the closed position. In some embodiments, the force sensor is a piezoelectric module that outputs an electrical signal in response to sensing the applied force.

[0052] In some embodiments, at block 506, processing logic actuates the plunger between a closed position and one or more open positions based on one or more of position data or force data. In some embodiments, processing logic opens the plunger to a larger or smaller open position based on position data. In some embodiments, processing logic closes the plunger based on position data indicating that the plunger is in an open position. In some embodiments, in response to force data indicating a gas leak or insufficient sealing force, processing logic causes the plunger to apply a greater force on the sealing surface.

[0053] Figure 5B This is a flowchart of a method 500B for controlling a gas flow valve, such as a gas flow valve assembly 300A, 300B, or a flow valve 400A or 400B, according to an embodiment of this disclosure. In some embodiments, method 500B is executed and / or causes to be executed by processing logic including hardware (e.g., circuitry, dedicated logic, programmable logic, microcode, processing device, etc.), software (e.g., instructions running on a processing device, general-purpose computer system, or special-purpose machine), firmware, microcode, or a combination of the foregoing. In some embodiments, method 500B is executed at least in part by a controller (e.g., controller 340) of the gas flow valve assembly.

[0054] For simplicity, method 500B is depicted and described as a series of operations. However, operations according to this disclosure may occur in various sequences and / or concurrently with other operations not presented and described herein. Furthermore, in some embodiments, implementing method 500B according to the disclosed objectives does not necessarily perform all the operations shown. Moreover, those skilled in the art will understand and appreciate that method 500B may alternatively be represented by a state diagram or events as a series of interrelated states.

[0055] In some embodiments, at block 512, the processing logic substantially actuates the gas valve plunger to the target position in response to receiving position data indicating that the plunger is positioned at a non-target position. In some embodiments, the processing logic (e.g., based on the position data received at block 502) determines that the plunger position does not match the target plunger position. The processing logic may actuate the plunger such that the plunger position substantially matches the target plunger position.

[0056] In some embodiments, at block 514, processing logic, in response to receiving force data indicating a gas leak, causes the plunger to increase the force applied to the sealing surface. In some embodiments, the processing logic (e.g., based on force data received at block 504) determines that gas is leaking through the sealing surface. The processing logic may determine the presence of a leak based on force data reflecting fluctuations in the force applied by the plunger to the sealing surface. The processing logic may cause the plunger to apply a greater force to the sealing surface to stop the leak.

[0057] In some embodiments, at block 516, the processing logic determines the condition of the elastomeric seal on the sealing surface based on a stress-strain curve calculated using position and force data. In some embodiments, when the plunger is actuated to the closed position, the processing logic calculates the stress-strain curve using position and / or force data received from a position sensor and / or force sensor. In some embodiments, the processing logic compares the calculated stress-strain curve with a baseline stress-strain curve (e.g., a known healthy stress-strain curve, a threshold criterion, etc.) to determine the condition of the elastomeric seal. In some embodiments, the processing logic outputs a notification (e.g., to a technician) indicating the condition of the elastomeric seal. The notification may be output in response to the calculated stress-strain curve failing to meet a threshold criterion.

[0058] In some embodiments, at block 518, the processing logic causes the piezoelectric module to vibrate to dislodge particles from the sealing surface. In some embodiments, the piezoelectric module is a force sensor. In some embodiments, the vibration of the piezoelectric module causes particles to displace from the sealing surface. The displaced particles may be carried away by the gas flow. Vibration of the piezoelectric module may be caused when force data and / or position data indicate to the processing logic that there are excessive particles on the sealing surface. The displaced particles may be collected in a particle trap.

[0059] Figure 6 A graphical representation of a machine having an exemplary form of computer system 600 is illustrated, in which a set of instructions (e.g., for causing the machine to perform any one or more methods discussed herein) can be executed. In alternative implementations, the machine may be connected (e.g., networked) to other machines in a LAN, WAN, internal network, external network, or the Internet. The machine may operate as a server or client machine in a client-server network environment, or as a peer-to-peer machine in a peer (or distributed) network environment. The machine may be a personal computer (PC), tablet PC, PDA, cellular phone, network device, server, network router, switch, or bridge, or any machine capable of executing a set of instructions (sequentially or otherwise) specifying the actions the machine will take. Furthermore, although only a single machine is shown, the term "machine" should also be understood to include any collection of machines that individually or jointly execute one or more sets of instructions to perform any one or more of the methods discussed herein. Some or all components of computer system 600 may be used or described by any electronic components described herein.

[0060] An exemplary computer system 600 includes a processing device (processor) 602, a main memory 604 (e.g., ROM, flash memory, dynamic random access memory (DRAM), such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM), etc.), a static memory 606 (e.g., flash memory, static random access memory (SRAM), etc.), and a data storage device 620, all of which communicate with each other via a bus 610.

[0061] Processor 602 represents one or more general-purpose processing devices, such as microprocessors, central processing units, etc. More specifically, processor 602 may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets, or a processor implementing combinations of instruction sets. Processor 602 may also be one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, etc. Processor 602 is configured to execute instructions 640 for performing the operations discussed herein.

[0062] The computer system 600 may further include a network interface device 608. The computer system 600 may further include a video display unit 612 (e.g., a liquid crystal display (LCD), a cathode ray tube (CRT), or a touch screen), an alphanumeric input device 614 (e.g., a keyboard), a cursor control device 616 (e.g., a mouse), and a signal generation device 622 (e.g., a speaker).

[0063] Power device 618 can monitor the power level of the battery used to power computer system 600 or one or more components thereof. Power device 618 can provide one or more interfaces to provide indications of power levels, the remaining time window before shutting down computer system 600 or one or more components thereof, power consumption rate, indicators of whether the computer system is using external power or battery power, and other power-related information. In some implementations, the indications associated with power device 618 are remotely accessible (e.g., accessible via a network connection to a remote backup management module). In some implementations, the battery used by power device 618 can be a local or remote uninterruptible power supply (UPS) for computer system 600. In this implementation, power device 618 can provide information about the power level of the UPS.

[0064] Data storage device 620 may include computer-readable storage medium 624 (e.g., a non-transitory computer-readable storage medium) storing one or more instruction sets 640 (e.g., software) embodying any or more of the methods or functions described herein. These instructions 640 may also reside wholly or at least partially within main memory 604 and / or processor 602, which also constitute the computer-readable storage medium, during execution by computer system 600. The instructions 640 may further be transmitted or received via network 630 through network interface device 608. Although computer-readable storage medium 624 is shown as a single medium in the exemplary implementation, it should be understood that computer-readable storage medium 624 may include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) storing one or more instruction sets 640.

[0065] Many details have been set forth in the foregoing description. However, it will be apparent to those skilled in the art that this disclosure may be practiced without these specific details. Although specific embodiments have been described herein, it should be understood that these embodiments are given by way of example only and not as limitations. The breadth and scope of this application should not be limited to any of the embodiments described herein, but should be defined solely by the claims and their equivalents filed below and thereafter. In fact, various other implementations and modifications of this disclosure will be apparent to those skilled in the art, in addition to those described herein, based on the foregoing description and the accompanying drawings. Therefore, such other implementations and modifications are intended to fall within the scope of this disclosure.

[0066] Referring to the accompanying drawings, which form part of this specification, specific embodiments are illustrated by way of illustration. While these disclosed embodiments have been described in sufficient detail to enable those skilled in the art to implement them, it should be understood that these examples are not limiting, and other embodiments may be used, and modifications may be made to the disclosed embodiments without departing from their spirit and scope. For example, the blocks of the methods shown and described herein are not necessarily performed in the order indicated in some other embodiments. Furthermore, in some other embodiments, the disclosed methods may include more or fewer blocks than those described. As another example, some blocks described herein as independent blocks may be combined in some other embodiments. Conversely, in some other embodiments, the content described herein as a single block may be implemented in multiple blocks. Furthermore, unless otherwise stated, the conjunction “or” herein is used in an inclusive sense where appropriate; that is, the phrase “A, B, or C” is intended to include the possibilities of “A,” “B,” “C,” “A and B,” “B and C,” “A and C,” and “A, B, and C.”

[0067] The terms “example” or “exemplary” as used herein mean as an example, illustration, or description. Any aspect or design described herein as an “example” or “exemplary” is not necessarily to be construed as better or superior to other aspects or designs. Rather, the use of the terms “example” or “exemplary” is intended to present concepts in a specific manner. When the terms “about” or “approximate” are used herein, it means that the nominal values ​​presented are accurate to within ±10%.

[0068] Furthermore, the articles “a” and “an” used herein and in the appended claims should be generally understood as “one or more”, unless otherwise stated or clearly indicated from the context. References throughout this specification to “an embodiment,” “one embodiment,” “some embodiments,” or “certain embodiments” indicate that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment. Therefore, the phrases “an embodiment,” “one embodiment,” “some embodiments,” or “certain embodiments” appearing in different places throughout the specification do not necessarily refer to the same embodiment.

[0069] Certain parts of the detailed description can be presented as algorithms and symbolic representations of operations on data bits within computer memory. These algorithmic descriptions and representations are the most effective way for those skilled in the art of data processing to communicate the essence of their work to others of similar skill. Algorithms are generally considered here as self-consistent sequences of operations that produce desired results. These operations require physical manipulation of physical quantities. Typically, though not always necessary, these quantities take the form of electrical or magnetic signals that can be stored, transmitted, combined, compared, or otherwise manipulated. Primarily for common use, these signals are referred to as bits, values, elements, symbols, characters, items, quantities, etc., which sometimes proves convenient.

[0070] However, it should be remembered that all these and similar terms are associated with appropriate physical quantities and are merely convenient labels applied to these quantities. Unless otherwise specified, it will be apparent from the following discussion that throughout this specification, the use of terms such as “receive,” “extract,” “transmit,” “calculate,” “generate,” “process,” “reprocess,” “add,” “subtract,” “multiply,” “divide,” “optimize,” “calibrate,” “detect,” “execute,” “analyze,” “determine,” “enable,” “identify,” “modify,” “convert,” “apply,” “result,” “store,” “compare,” etc., refers to the actions and processes of a computer system or similar electronic computing device that manipulate data represented as physical (e.g., electronic) quantities within the computer system's caches and memories, and convert the data into other data similarly represented as physical quantities within the computer system's caches and memories or other such information storage, transmission, or display devices.

[0071] Furthermore, although this disclosure has been described in the context of a particular implementation in a particular setting for a particular purpose, those skilled in the art will recognize that the purpose of this disclosure is not limited thereto, and that it can be advantageously implemented in any setting for any purpose. Therefore, the claims set forth below should be interpreted in light of the full scope and spirit of this disclosure as described herein and the full scope of its equivalents.

Claims

1. A gas flow valve, comprising: The housing is configured to receive gas flow; The plunger is configured to move between a closed position and one or more open positions within the housing; A position sensor is configured to measure a distance associated with the positional difference of the plunger between the closed position and the one or more open positions; as well as A force sensor is coupled to the plunger and configured to measure the force applied to the sealing surface by the plunger in the closed position.

2. The gas flow valve as claimed in claim 1, further comprising: A particulate trap forms a chamber configured to separate particles from the gas flow, wherein at least a portion of the particulate trap is configured to be removed for cleaning.

3. The gas flow valve of claim 2, wherein the particle trap is configured to induce a cyclone in the gas flow within the chamber to separate the particles from the gas flow due to centrifugal force.

4. The gas flow valve of claim 1, wherein the force sensor is coupled to a first end of the plunger and configured to contact an elastomeric seal of the sealing surface when the plunger is in the closed position, and wherein the distance includes the distance between the position sensor and a second end of the plunger opposite to the first end.

5. The gas flow valve as claimed in claim 1, further comprising: A spring, within the housing, is configured to hold the plunger in the closed position or in one or more open positions; as well as An electromagnetic coil is configured to actuate the plunger between the closed position and the one or more open positions in response to being energized with current.

6. The gas flow valve as claimed in claim 1, further comprising: One or more of a metal bellows or a metal diaphragm are configured to isolate a first portion of the housing from a second portion of the housing, wherein a plunger is disposed in the first portion of the housing and gas will flow through the second portion of the housing.

7. The gas flow valve of claim 1, wherein the force sensor is a piezoelectric module, and the piezoelectric module is configured to: When the plunger is in the closed position, it contacts the sealing surface, and the force exerted by the plunger on the sealing surface is measured; and In response to being energized, vibration is induced on the sealing surface to cause particles to detach from the sealing surface.

8. The gas flow valve as claimed in claim 1, wherein the position sensor is a capacitive displacement sensor disposed within the housing.

9. A gas flow component, comprising: Valves, including: The housing is configured to receive gas flow; The plunger is configured to move between a closed position and one or more open positions within the housing; A position sensor is configured to measure a distance associated with the positional difference of the plunger between the closed position and the one or more open positions; and A force sensor, coupled to the plunger and configured to measure the force applied to the sealing surface by the plunger in the closed position; A particulate trap, forming a chamber configured to separate particles from the gas flow; and The processing device is configured to actuate the valve to control the gas flow rate based on sensor data from one or more of the position sensor or the force sensor.

10. The gas flow assembly of claim 9, wherein the particle trap is configured to induce a cyclone in the gas flow within the chamber to separate the particles from the gas flow due to centrifugal force.

11. The gas flow assembly of claim 9, wherein the force sensor is coupled to a first end of the plunger and configured to contact an elastomeric seal of the sealing surface when the plunger is in the closed position, and wherein the distance includes the distance between the position sensor and a second end of the plunger opposite to the first end.

12. The gas flow assembly of claim 9, wherein the valve further comprises: One or more of a metal bellows or a metal diaphragm are configured to isolate a first portion of the housing from a second portion of the housing, wherein a plunger is disposed in the first portion of the housing and gas will flow through the second portion of the housing.

13. The gas flow assembly of claim 9, wherein the force sensor is a piezoelectric module, the piezoelectric module being configured to: When the plunger is in the closed position, it contacts the sealing surface, and the force exerted by the plunger on the sealing surface is measured; and In response to a command from the processing device, vibration is induced on the sealing surface to energize the piezoelectric module, causing particles to detach from the sealing surface.

14. The gas flow assembly of claim 9, wherein the position sensor is a capacitive displacement sensor disposed within the housing.

15. The gas flow assembly of claim 9, wherein the processing device is further configured to substantially actuate the plunger to the target position in response to receiving position data from the position sensor indicating that the plunger is positioned at a non-target position.

16. The gas flow assembly of claim 9, wherein the processing device is further configured to increase the force applied to the sealing surface by the plunger in response to receiving force data indicating gas leakage from the force sensor.

17. The gas flow assembly of claim 9, wherein the processing device is further configured to determine the condition of the elastomeric seal on the sealing surface based on a stress-strain curve calculated using sensor data received from the position sensor and the force sensor.

18. The gas flow assembly of claim 9, wherein the processing device is further configured to prepare a notification based on sensor data received from one or more of the position sensor or the force sensor for one or more of a gas leak or a condition deterioration of the elastomeric seal on the sealing surface exceeding a threshold condition.

19. A method comprising: Position data is received from a position sensor configured to measure a distance associated with a positional difference of a gas valve plunger configured to move between a closed position and one or more open positions; Force data is received from a force sensor coupled to the plunger and configured to measure the force applied to the sealing surface by the plunger in the closed position; as well as The plunger is actuated between the closed position and the one or more open positions based on one or more of the position data or the force data.

20. The method of claim 19, further comprising: In response to receiving position data indicating that the plunger is positioned at a non-target position, the plunger is substantially actuated to the target position; In response to receiving force data indicating a gas leak, the plunger increases the force applied to the sealing surface; The condition of the elastomeric seal on the sealing surface is determined based on the stress-strain curve calculated using the position data and the force data. as well as Vibrate the piezoelectric module, which includes the force sensor, to cause the particles to fall off the sealed surface.

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