Exposure device and substrate supporting member

Abstract

An exposure apparatus includes a static electricity eliminating unit that eliminates static electricity on a substrate supporting member that supports a substrate while the substrate supporting member moves, the substrate supporting member having a conductive main body portion and a conductive member. The conductive member faces the substrate supported by the substrate supporting member and conducts static electricity carried by the substrate to the main body portion, and the static electricity eliminating portion eliminates the static electricity conducted to the main body portion.

Description

Technical Field

[0001] This involves exposure equipment and substrate support components. Background Technology

[0002] In the photolithography process for manufacturing semiconductor components and liquid crystal display components, in order to transfer the pattern formed on the mask or reticle onto the glass substrate or wafer via a projection optical system, for example, step-repeat projection exposure equipment (so-called step lithography machine) or step-scan projection exposure equipment (so-called step-scan lithography machine (also known as scanner)) are mainly used.

[0003] In such exposure apparatus, various electrostatic countermeasures are employed to eliminate static electricity on the substrate and mask (e.g., Patent Document 1).

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 8-137112 Summary of the Invention

[0007] According to the disclosed aspect, the exposure apparatus has an antistatic unit that eliminates static electricity carried by a substrate support member during the movement of the substrate support member supporting the substrate. The substrate support member has a conductive main body and a conductive member. The conductive member is positioned opposite the substrate supported by the substrate support member and conducts static electricity carried by the substrate to the main body. The antistatic unit eliminates the static electricity conducted to the main body.

[0008] According to another disclosure, the substrate support member is a substrate support member that supports a movable substrate, and includes: a conductive main body; a conductive member opposite to the substrate and conducting static electricity carried by the substrate to the main body; and an electrostatic discharger electrically connected to the main body.

[0009] According to another disclosure, the substrate support member is a substrate support member that supports a movable substrate, comprising: a conductive main body; at least one of an antistatic brush and a conductive support member, the antistatic brush being electrically connected to the main body and having conductive bristles extending toward the substrate, the support member being electrically connected to the main body and contacting the substrate to support the substrate; and an electrostatic discharger being electrically connected to the main body.

[0010] According to another disclosure, the exposure apparatus has an antistatic unit that eliminates static electricity carried by a substrate support member during the movement of the substrate support member supporting the substrate. The substrate support member includes: a conductive main body; and at least one of an antistatic brush and a conductive support member. The antistatic brush is electrically connected to the main body and has conductive bristles extending toward the substrate. The support member is electrically connected to the main body and contacts the substrate to support it. The antistatic unit eliminates static electricity carried by the main body.

[0011] It should be noted that the structure of the embodiments described below can be appropriately modified, and at least a portion can be replaced with other structures. Furthermore, the constituent elements whose configuration is not particularly limited are not limited to the configuration disclosed in the embodiments, but can be configured in positions that enable their functions. Attached Figure Description

[0012] Figure 1 This is a schematic diagram showing the configuration of an exposure apparatus according to one embodiment.

[0013] Figure 2 (A) is a schematic diagram of the main body and substrate conveying device viewed from above. Figure 2 (B) is a schematic diagram of the main body and substrate conveying device viewed from the side.

[0014] Figure 3 (A) is a top view of the substrate tray. Figure 3 (B) is a side view of a substrate tray on which a substrate is placed on the upper surface.

[0015] Figure 4 This is a diagram showing the conveying mechanism as viewed from the +X side.

[0016] Figure 5 (A) is a diagram illustrating the relationship between the substrate holding section, the conveying mechanism, and the antistatic brush. Figure 5 (B) is a diagram used to illustrate the relationship between the antistatic brush and the substrate tray.

[0017] Figure 6 This is another example of a diagram used to illustrate the placement of an antistatic brush.

[0018] Figure 7 (A) ~ Figure 7 (C) is a diagram illustrating a modified example of the robot arm in this embodiment.

[0019] Figure 8 This is a diagram (one of) used to illustrate the structure of a mask loader.

[0020] Figure 9 This is a diagram (second one) used to illustrate the structure of a mask loader.

[0021] Figure 10 This is a flowchart showing a series of processes up to the point where the mask is mounted on the mask stage.

[0022] Figure 11 This is a flowchart illustrating a series of processes following the removal of the mask from the mask stage.

[0023] Figure 12 This is a cross-sectional view used to illustrate the structure of the mask box.

[0024] Figure 13 This is a cross-sectional view showing another example of the configuration of the mask box.

[0025] Figure 14 (A) is a diagram showing an outline of the transport vehicle. Figure 14 (B) is an enlarged view of the mechanical stop.

[0026] Figure 15 (A) and Figure 15 (B) is a diagram illustrating the structure of the static elimination mechanism of the transport vehicle.

[0027] Figure 16 (A) is a schematic diagram of the shelf section of the mask buffer as viewed from the +Z direction. Figure 16 (B) is Figure 16 AA-line section view of (A).

[0028] Figure 17 This is a schematic diagram showing the configuration of the buffer arm.

[0029] Figure 18 Figure (A) is a diagram showing the appearance of the mask conveying mechanism according to an embodiment. Figure 18 (B) is a schematic diagram showing the configuration of the mask conveying mechanism. Detailed Implementation

[0030] The following is for reference Figures 1 to 18 (B) describes an exposure apparatus EX according to one embodiment. Figure 1 This is a schematic diagram showing the configuration of an exposure apparatus EX according to one embodiment.

[0031] Exposure apparatus EX is used, for example, in the manufacture of organic EL displays to form TP (Touch Panel) circuits or CF (Color Filter) circuits on the upper surface of substrate P. Substrate P is obtained, for example, by forming TFTs (Thin Film Transistors) on a glass substrate through evaporation and then performing a sealing process, but is not limited to this.

[0032] like Figure 1 As shown, the exposure apparatus EX includes a main body 100, a substrate transport device 200, and a mask loader 300.

[0033] Hereinafter, the direction in which the mask M and the substrate P are scanned relative to the projection optical system 116 during exposure will be defined as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane will be defined as the Y-axis direction, and the direction orthogonal to both the X-axis and the Y-axis will be defined as the Z-axis direction. Furthermore, the directions of rotation (tilt) around the X-axis, Y-axis, and Z-axis will be defined as θx, θy, and θz directions, respectively.

[0034] Figure 2 (A) is a schematic view of the main body 100 and the substrate conveying device 200 from above. Figure 2 (B) is a schematic view of the main body 100 and the substrate conveying device 200 viewed from the side. Figure 1 , Figure 2 (A) and Figure 2 As shown in (B), the substrate transport device 200 is disposed on the +X side of the main body 100. It should be noted that the substrate transport device 200 may also be disposed on the -X side of the main body 100.

[0035] <Substrate transfer device 200>

[0036] The substrate conveying device 200 performs the work on an external device 1000 such as a coating machine / developer (see reference). Figure 2 The junction of the substrate P between the (A) and the main body 100. The external device 1000 has, for example, a forked robot RH, which can transport the substrate P placed on the robot RH from the external device 1000 to the substrate transfer device 200.

[0037] The substrate conveying device 200 includes a substrate tray (substrate support component) 201, a conveying mechanism 202, an alignment mechanism 203, and a support component 204.

[0038] The support section 204 has a substrate tray 201. The substrate P, which is placed on the robot arm RH, is transported from the external device 1000 to the substrate transfer device 200 and placed on the substrate tray 201 on the support section 204.

[0039] The substrate tray 201 is a transport device used for transporting the substrate P into the main body 100 and for setting the substrate P, and the substrate P is placed on its upper surface. Figure 3 (A) is a top view of the substrate tray 201. Figure 3 (B) is a side view of a substrate tray 201 on which a substrate P is placed on the upper surface.

[0040] like Figure 3As shown in (A), the substrate tray 201 is, for example, a lattice-shaped component. The substrate tray 201 includes a base component 201a and a support component 201b that supports the substrate P, the support component 201b being disposed on the base component 201a. In this embodiment, the base component 201a and the support component 201b are conductive and are electrically connected together. It should be noted that in this specification, "conductive" or "electrically conductive" refers to electrostatic conductivity or electrostatic diffusion. An electrostatically conductive material has a surface resistivity of 1 × 10⁻⁶. 2 ≤Rs<1×10 4 Ω-sized materials, electrostatically diffusing materials, have a surface resistivity of 1×10⁻⁶. 4 ≤Rs<1×10 11 Ω material.

[0041] In this embodiment, an antistatic mechanism 210 for eliminating static electricity carried by the substrate P is provided on the substrate tray 201.

[0042] The static eliminator 210 includes a static eliminator brush 210a and a static discharger 210b. The static eliminator brush 210a has conductive bristles (conductive fibers). The static eliminator brush 210a is electrically connected to the base member 201a and conducts the static electricity carried by the substrate P supported by the support member 201b to the base member 201a. It should be noted that in this embodiment, the support member 201b is also conductive and electrically connected to the base member 201a. Therefore, the support member 201b also conducts the static electricity carried by the substrate P to the base member 201a. However, the support member 201b can also be non-conductive.

[0043] The electrostatic discharger 210b is electrically connected to the base component 201a. Also known as an electrostatic discharger, the electrostatic discharger 210b discharges the static charge conducted to the base component 201a into the air. This eliminates static electricity on the substrate P placed on the substrate tray 201, thus preventing damage to devices such as TFTs formed on the substrate P due to electrostatic discharge.

[0044] The substrate tray 201 has a size such that, for example, a substrate P of size G6 (1850 × 1500 mm) can be placed without protruding from the substrate tray 201. That is, the substrate tray 201 has a size capable of holding two half-sized substrates P, each half the size of a G6 (1850 × 1500 mm) substrate P. It should be noted that the size of the substrate P placed on the substrate tray 201 is not limited to the G6 size; it can be a size larger than or smaller than the G6 size. It should be noted that this size of the substrate tray 201 is designed to allow the substrate P to be placed without protruding from the substrate tray 201 when the size of the substrate P placed on the substrate tray 201 is larger than the G6 size. Furthermore, the number of substrates P placed on the substrate tray 201 is not limited to one or two; it can be three or more.

[0045] The alignment mechanism 203 positions the substrate P relative to the substrate tray 201 based on the position of the substrate P detected by a position detection sensor (not shown). The substrate P is then transported into the interior of the main body 100 while positioned on the substrate tray 201. The alignment mechanism 203 can be, for example, the configuration described in Japanese Patent Application 2022-058723, but other configurations may also be used.

[0046] The transfer mechanism 202 transfers the substrate tray 201 holding the positioned substrate P to the main body 100. In addition, the transfer mechanism 202 removes the substrate tray 201 disposed inside the main body 100 from the main body 100.

[0047] Figure 4 This is a view of the conveying mechanism 202 from the +X side. The conveying mechanism 202 has conveying arms 202a. The conveying arms 202a hold the substrate tray 201 from both sides, for example, in the Y-axis direction. In this state, the conveying mechanism 202 moves along the X-axis direction by a moving mechanism (not shown). Thus, the substrate tray 201 is conveyed by the conveying mechanism 202.

[0048] A conductive component 202b is installed on the conveying arm 202a, and the conductive component 202b is grounded via wiring. For example... Figure 4 As shown, with the transfer arm 202a holding the substrate tray 201, the conductive component 202b contacts the base component 201a of the substrate tray 201. Therefore, since the conductive component 202b and the substrate tray 201 are electrically connected, static electricity conducted to the base component 201a is eliminated. Thus, it is possible to suppress the situation where the substrate P becomes statically charged during the transfer of the substrate P by the transfer mechanism 202, thereby preventing damage to devices such as TFTs formed on the substrate P due to electrostatic discharge.

[0049] <Main Body 100>

[0050] Next, the structure of the main body 100 will be explained. For example... Figure 2 As shown in (B), the main body 100 includes an illumination system 112, a mask stage 114 for holding a mask M on which circuit patterns are formed, a projection optical system 116, an optical platform 118, and a substrate stage device 120 for holding a substrate P.

[0051] The lighting system 112 is configured, for example, to be the same as the lighting system disclosed in U.S. Patent No. 5,729,331. The lighting system 112 illuminates the mask M with light emitted from a light source (e.g., a mercury lamp) that is not shown, through a reflector (not shown), a dichroic mirror, a shutter, a wavelength selective filter, various lenses, etc., as exposure illumination light (illumination light) IL.

[0052] The mask stage 114 holds the transparent mask M. The mask stage 114 drives the mask M with a predetermined stroke in the X-axis direction (scanning direction) relative to the illumination system 112 (illumination light IL), for example, via a drive system (not shown) including a linear motor, and performs minute drives on the mask M in the Y-axis and θz directions. The position information of the mask M in the horizontal plane is obtained, for example, by a mask stage position measurement system (not shown) including a laser interferometer or an encoder.

[0053] The projection optical system 116 is disposed below the mask stage 114. The projection optical system 116 is, for example, a so-called multi-lens projection optical system with the same structure as the projection optical system disclosed in U.S. Patent No. 6,552,775, etc., and includes multiple optical systems that form an upright image using a dual-telecentric equal magnification system.

[0054] In the main body 100, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system 112, a projected image (partially upright image) of the circuit pattern of the mask M within the illumination area is formed on the substrate P on the illumination area (exposure area) of the illumination light conjugate to the illumination area by the illumination light passing through the mask M via the projection optics system 116. Then, the mask M is moved relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P is moved relative to the exposure area (illumination light IL) in the scanning direction, thereby performing scanning exposure on an exposure area on the substrate P, and transferring the pattern formed on the mask M to the exposure area.

[0055] The optical platform 118 supports the aforementioned mask stage 114 and projection optical system 116.

[0056] The substrate stage device 120 is used to position the substrate P with high precision relative to the projection optical system 116 (illumination light IL), and includes a substrate holding part 121 for holding the substrate P and a substrate stage 122.

[0057] like Figure 2 As shown in (A), the substrate holding portion 121 has a receiving portion 121a. The receiving portion 121a is a groove provided in the substrate holding portion 121 to receive the substrate tray 201. Thus, the substrate tray 201 holding the substrate P is received in the receiving portion 121a, thereby placing the substrate P on the upper surface of the substrate holding portion 121.

[0058] The substrate stage 122 is driven by a drive device (not shown) along a horizontal plane (X-axis and Y-axis directions) for a predetermined stroke, and performs minute actuation in six degrees of freedom directions. The structure of the substrate stage device 120 is not particularly limited. For example, it is preferable to use a stage device with a so-called coarse-fine motion structure disclosed in Japanese Patent Application Publication No. 2004-14915 or U.S. Patent Application Publication No. 2012 / 0057140, which includes a gantry-type two-dimensional coarse motion stage and a minute motion stage that is minutely driven relative to the two-dimensional coarse motion stage.

[0059] like Figure 2 As shown in (A), an X-moving mirror (bar mirror) 124X with a reflective surface orthogonal to the X-axis is fixed on the -X side of the substrate stage 122, and a Y-moving mirror 124Y with a reflective surface orthogonal to the Y-axis is fixed on the +Y side.

[0060] A first and a second laser interferometer (not shown) are mounted on an optical platform 118. The first and second laser interferometers measure the position of the substrate holding portion 121 of the substrate P in the X-axis direction and the position in the Y-axis direction, respectively.

[0061] The first laser interferometer illuminates a measurement beam onto the X-axis moving mirror 124X and an X-axis fixed mirror (not shown) fixed near the projection optical system 116. The first laser interferometer measures the position information of the substrate holding part 121 in the X-axis direction with the position of the X-axis fixed mirror as a reference.

[0062] Additionally, the second laser interferometer illuminates a measurement beam onto the Y-moving mirror 124Y and a Y-fixed mirror (not shown) fixed near the projection optical system 116. The second laser interferometer measures the position information of the substrate holding section 121 in the Y-axis direction based on the position of the Y-fixed mirror.

[0063] The control device (not shown) drives the substrate stage 122 based on the position information (including rotation information (deflection (rotation θz in the θz direction), pitch (rotation θy in the θy direction), and roll (rotation θx in the θx direction)) of the substrate stage 122 in the XY plane measured by the first laser interferometer and the second laser interferometer.

[0064] In the main body 100, alignment measurements (e.g., EGA) are performed before exposure, and the substrate P is exposed according to the following steps based on the results. First, the mask stage 114 and the substrate stage 122 are driven synchronously in the X-axis direction according to the instructions of a control device (not shown). This results in scanning exposure of the first exposure area on the substrate P. When the scanning exposure of the first exposure area is completed, the control device (not shown) moves the substrate stage 122 to a position corresponding to the second exposure area (stepping). Then, the second exposure area is scanned and exposed. The control device (not shown) similarly repeats the stepping of the substrate P between exposure areas and the scanning exposure of the exposure areas, thereby transferring the pattern of the mask M to all exposure areas on the substrate P.

[0065] In the exposure apparatus EX of this embodiment, an X-ray ion generator is provided in the main body 100 to eliminate static electricity on the substrate P placed on the substrate holding section 121. Similarly, in the substrate transport apparatus 200, an X-ray ion generator is provided to eliminate static electricity on the substrate P placed on the substrate tray 201 held by the support section 204. It should be noted that the X-ray ion generator may be provided in either the main body 100 or the substrate transport apparatus 200.

[0066] However, during the period when the conveying mechanism 202 conveys the substrate P between the support portion 204 and the substrate holding portion 121, the substrate P becomes electrostatically charged. If this electrostatic discharge occurs, there is a concern that the devices such as TFTs formed on the substrate P may be damaged due to the discharge phenomenon. Therefore, in this embodiment, as... Figure 2 As shown in (B), an antistatic brush 500 is provided so that static electricity carried by the substrate P can be eliminated during the movement between the substrate holder C121 (first region) and the support portion 204 (second region). More specifically, static electricity conducted from the substrate P and accumulated on the substrate tray 201 can be eliminated.

[0067] Figure 5 (A) is a diagram illustrating the relationship between the substrate holding section 121, the conveying mechanism 202, and the antistatic brush 500. Figure 5 (B) is a diagram used to illustrate the relationship between the antistatic brush 500 and the substrate tray 201.

[0068] like Figure 5As shown in (A), the antistatic brush 500 is disposed in the region between the main body 100 and the support portion 204 in the X-axis direction. Figure 5 As shown in (B), the antistatic brush 500 extends in a direction orthogonal to the moving direction (X-axis direction) of the substrate tray 201 (Y-axis direction). Furthermore, the antistatic brush 500 is positioned opposite to the side of the substrate tray 201 that holds the substrate P during its movement between the support portion 204 and the substrate holding portion 121. Additionally, the antistatic brush 500 is grounded.

[0069] The antistatic brush 500 has conductive bristles 502 extending toward the substrate tray 201 (in the +Z direction) when the substrate tray 201 is above the antistatic brush 500, which eliminates static electricity conducted from the substrate P to the base member 201a of the substrate tray 201. Therefore, during the period when the conveying mechanism 202 conveys the substrate P between the support portion 204 and the substrate holding portion 121, it is possible to suppress the discharge phenomenon of static electricity carried by the substrate P, which could damage devices such as TFTs formed on the substrate P.

[0070] like Figure 5 As shown in (B), the conductive bristles 502 of the antistatic brush 500 do not contact the lower surface of the base member 201a of the substrate tray 201 (the surface opposite to the surface of the substrate P supporting the substrate tray 201). The substrate tray 201 and substrate P, transported by the conveying mechanism 202, flex due to their own weight. Therefore, in the Y-axis direction, the central portion of the substrate tray 201 and substrate P is located lower than the two ends. Consequently, the length of the conductive bristles 502 of the antistatic brush 500 is short in the central portion in the Y-axis direction and becomes longer as it approaches the two ends. Thus, the conductive bristles 502 of the antistatic brush 500 do not contact the substrate tray 201. If the bristles 502 come into contact with the substrate tray 201 and wear, dust will be generated in the exposure apparatus EX due to the wear, and there is a concern that this dust may cause poor exposure. By configuring the length of the conductive bristles 502 of the antistatic brush 500 in the above manner, the generation of poor exposure can be suppressed.

[0071] It should be noted that, based on or replacing the antistatic brush 500, such as... Figure 6 As shown, a grounded antistatic brush 500A can also be provided on the substrate stage 122. In this case, the antistatic brush 500A extends in a direction orthogonal to the moving direction (X-axis direction) of the substrate tray 201 (Y-axis direction), and is positioned opposite to the side of the substrate tray 201 that holds the substrate P during the movement between the support portion 204 and the substrate holding portion 121. Furthermore, the conductive bristles of the antistatic brush 500A only need to be configured such that they do not contact the substrate tray 201, with a short length at the center in the Y-axis direction and becoming longer towards both ends.

[0072] It should be noted that this is not the substrate tray 201; for example, it can be obtained through... Figure 2 (A) shows a robot arm RH on a fork that transports substrate P to substrate holding section 121. When substrate P is transported to substrate holding section 121 by robot arm RH, substrate transport device 200 is omitted.

[0073] Figure 7 (A) ~ Figure 7 (C) is a diagram illustrating a modified example of this embodiment of the robotic arm RH-A. Figure 7 (A) is a diagram of the robot arm RH-A viewed from the +Z direction. Figure 7 (B) is a diagram of the robot arm RH-A with substrate P mounted on it, viewed from the +Z direction. Figure 7 (C) is a diagram of the robot arm RH-A with substrate P placed on it, viewed from the +Z direction.

[0074] like Figure 7 (A) and Figure 7 As shown in (C), the robot arm RH-A includes a conductive base component 801, a conductive support component 802 provided on the base component 801, and an antistatic brush 803. The support component 802 is electrically connected to the base component 801. Furthermore, the antistatic brush 803 has conductive bristles, which are electrically connected to the base component 801. Thus, static electricity carried by the substrate P is conducted to the base component 801 via the support component 802 and the antistatic brush 803.

[0075] De-static brushes 500 are disposed along the path of the robotic arm RH-A until it transports the substrate P to the main body 100, and along the path from the main body 100 until it transports the substrate P to a predetermined position. This allows static electricity conducted to the base member 801 to be released to the ground via the de-static brushes 500. Therefore, it is possible to suppress the damage to devices such as TFTs formed on the substrate P caused by the discharge of static electricity carried on the substrate P.

[0076] It should be noted that the support component 802 can be non-conductive. Alternatively, an electrostatic discharger that is electrically connected to the base component 801 of the robot arm RH-A can also be provided.

[0077] <Mask Loader 300>

[0078] Figure 8 as well as Figure 9 This diagram illustrates the configuration of the mask loader 300. It should be noted that... Figure 8 In the diagram, a portion of the structure is shown in a sectional view.

[0079] like Figure 8 as well as Figure 9As shown, the mask loader 300 includes a mask buffer 310, a mask foreign object inspection unit (hereinafter referred to as PPD) 390, a buffer arm 330, a relay station 350, and a mask conveying mechanism 370.

[0080] The mask buffer 310 temporarily stores the mask box 600 containing the mask M. The mask buffer 310 has multiple slots SLT for storing the mask box 600.

[0081] PPD390 is positioned on top of mask buffer 310. PPD390 checks for the presence of PLCL (refer to...) adhering to the surface film of mask M. Figure 12 The PPD390 has a PPD arm 391. This includes foreign matter, and whether or not foreign matter is attached to the side opposite to the surface of the mask M where the PLCL is located.

[0082] The relay station 350 temporarily holds the mask M during transport when the mask M is being replaced. The relay station 350 has a platform (not shown) for placing the mask M loaded onto the mask platform 114 of the main body 100, and a platform (not shown) for placing the mask M unloaded from the mask platform 114 of the main body 100.

[0083] The buffer arm 330 performs the loading, unloading, and transporting of the mask box 600 relative to the mask buffer 310. The mask transport mechanism 370 transports the mask M from the relay station 350 to the main body 100, or vice versa. Additionally, the mask transport mechanism 370 transports the mask M to or receives the mask M from the PPD arm 391. Furthermore, the mask transport mechanism 370 also performs the handover of the mask M relative to the buffer arm 330.

[0084] Reference Figure 10 as well as Figure 11 This describes the processing performed by the mask loader 300. Figure 10 This is a flowchart illustrating a series of processes up to the point where the mask M is mounted on the mask stage 114. Figure 11 This is a flowchart illustrating a series of processes following the removal of the mask M from the mask stage 114.

[0085] exist Figure 10 In the illustrated process, firstly, the patterned mask M is housed in the mask box 600 (described later) (step S11). Next, the mask box 600 containing the mask M is mounted on the transport vehicle 700 (described later) (step S13). The transport vehicle 700 carrying the mask box 600 is then inserted into the mask buffer 310 (step S15). Thus, the mask box 600 is inserted into the mask buffer 310.

[0086] The mask box 600 inserted into the mask buffer 310 is housed in each slot SLT of the mask buffer 310 (step S17).

[0087] When using a mask M housed in a mask box 600 housed in a mask buffer 310, the mask M is transported for each mask box 600 using a buffer arm 330 (step S19).

[0088] The mask transport mechanism 370 takes out the mask M from the mask box 600 transported by the buffer arm 330 and transports it (step S20). The mask M is handed over to the PPD arm 391 of the PPD 390. In the PPD 390, it is checked for foreign matter attached to the surface film PLCL of the mask M and for foreign matter attached to the side of the mask M opposite to the surface film PLCL (step S21).

[0089] When the inspection using PPD390 is completed, the mask M is transported to the mask stage 114 via the relay station 350 through the mask transport mechanism 370 (step S23). Afterwards, the mask M is mounted on the mask stage 114 (step S25). Figure 10 The processing is now complete.

[0090] on the other hand, Figure 11 The process begins when the exposure to substrate P ends. First, the mask M is removed from the mask stage 114 (step S31).

[0091] Next, the removed mask M is transported by the mask transport mechanism 370 (step S33). The mask M transported by the mask transport mechanism 370 is stored in the mask box 600 (step S35).

[0092] The mask box 600 is transported by the buffer arm 330 and stored in the mask buffer 310 (step S37).

[0093] The mask box 600, stored in the mask buffer 310, is loaded onto the transport vehicle 700 when it is removed from the mask buffer 310 (step S39). The mask box 600 is transported by the transport vehicle 700 to a designated location and unloaded from the transport vehicle 700 (step S41). The mask M is removed from the mask box 600 unloaded from the transport vehicle 700 (step S43). Figure 11 The processing is now complete.

[0094] exist Figure 10 as well as Figure 11 In the series of processes shown for mask M, when mask M is moved into PPD390 ( Figure 10 Step S21): When mounting the mask M on the mask stage 114 ( Figure 10Step S25), when unloading the mask M from the mask stage 114 ( Figure 11 Step S31), and when removing the mask M from the mask box 600 ( Figure 11 (Step S43) Conventionally, static electricity on the mask M is eliminated using an X-ray ion generator or the like. In this embodiment, static electricity on the mask M is also eliminated in steps other than this, thereby further suppressing the possibility of the pattern formed on the mask M being destroyed by electrostatic discharge.

[0095] <Mask Box 600>

[0096] Next, the mask box 600 of this embodiment will be described. Figure 12 This is a sectional view used to illustrate the construction of the mask box 600. It should be noted that... Figure 12 In the text, the shadow lines of some elements are omitted.

[0097] like Figure 12 As shown, the mask box 600 includes a box body 601 for accommodating the mask and an electrostatic discharger 602.

[0098] The box body 601 includes a first shell portion 601a having a bottom surface BS and a second shell portion 601b having a top surface CS disposed opposite to the bottom surface BS. The second shell portion 601b is configured to be detachable from the first shell portion 601a. ​​The first shell portion 601a and the second shell portion 601b are conductive.

[0099] The first housing portion 601a has a foot portion 610, on which a mask box support portion 611 is mounted. The mask box support portion 611 is conductive and is electrically connected to the first housing portion 601a (foot portion 610).

[0100] A mask support member 603 for supporting the mask M is provided on the bottom surface BS of the first housing portion 601a. ​​The mask support member 603 supports the mask M in such a way that the surface film PLCL protecting the patterned area formed in the mask M does not contact the bottom surface BS. The mask support member 603 is conductive and is electrically connected to the first housing portion 601a. ​​Therefore, the mask support member 603 and the mask box support portion 611 are electrically connected together.

[0101] The electrostatic discharger 602 is electrically connected to the first housing portion 601a. ​​Therefore, the mask support member 603 and the electrostatic discharger 602 are electrically connected together. Consequently, static electricity carried by the mask M is conducted through the mask support member 603 to the conductive first housing portion 601a, and the static electricity carried by the first housing portion 601a is discharged through the electrostatic discharger 602. This prevents the pattern formed on the mask M from being destroyed due to the discharge of static electricity carried by the mask M.

[0102] An antistatic brush 604 with conductive bristles is provided on the top surface CS of the second housing 601b. The antistatic brush 604 is electrically connected to the second housing 601b. The antistatic brush 604 is positioned opposite to the mask M supported by the mask support member 603, and conducts the static electricity carried by the mask M to the second housing 601b.

[0103] With the second shell 601b assembled to the first shell 601a, the first shell 601a and the second shell 601b are electrically connected together. Consequently, static electricity conducted from the mask M to the second shell 601b is conducted through the first shell 601a to the electrostatic discharger 602 and discharged from the electrostatic discharger 602. This prevents the pattern formed on the mask M from being destroyed due to the discharge of static electricity carried on the mask M.

[0104] The first shell portion 601a and the second shell portion 601b are, for example, made of aluminum, and a non-conductive film (coating) (such as a rust-proof film) is formed on their surfaces. Therefore, in this embodiment, with the second shell portion 601b assembled to the first shell portion 601a, the film at the contact point between the first shell portion 601a and the second shell portion 601b is removed. Additionally, in the first shell portion 601a, the film at the portion where the mask support member 603 is mounted is removed. Furthermore, in the first shell portion 601a, the film at the portion where the mask box support member 611 is mounted is removed. Additionally, in the second shell portion 601b, the film at the portion where the anti-static brush 604 is disposed is removed. This ensures electrical connection. It should be noted that in... Figure 12 In the diagram, the portion in the first shell 601a where the film is removed is shown as the film removal region 615a, and the portion in the second shell 601b where the film is removed is shown as the film removal region 615b.

[0105] It should be noted that conductive electrode components such as busbars can be installed without removing the coating. Figure 13 This is a cross-sectional view showing another configuration example of the mask box 600.

[0106] exist Figure 13 In the mask box 600 shown, an electrode component 605a, such as a busbar, is provided on a portion of the bottom surface BS of the first housing portion 601a, and the mask support component 603 is electrically connected to the electrode component 605a. Additionally, an electrode component 605b is provided, such as a busbar, to electrically connect the electrode component 605a provided in the first housing portion 601a and the electrostatic discharger 602.

[0107] Furthermore, an electrode component 605c, such as a busbar, is provided on the top surface CS of the second housing 601b, and an anti-static brush 604 is electrically connected to the electrode component 605c. When the second housing 601b is mounted on the first housing 601a, an electrode component 605d, such as a busbar, is provided to electrically connect the electrode components 605c and 605a. The electrode component 605d is elastic, thereby reliably achieving the electrical connection between the electrode components 605c and 605a.

[0108] Furthermore, an electrode component 605e, such as a busbar, is provided on the foot portion 610 of the first housing portion 601a, and the mask box support portion 611 is electrically connected to the electrode component 605e. In this way, electrical connections between the components can be achieved through the electrode component, and the electrostatic discharger 602 can discharge the electrostatic charge on the mask M.

[0109] The mask box 600 that holds the mask M is transported to the mask buffer 310 by the transport vehicle 700 and stored in the mask buffer 310.

[0110] <Transport Vehicle 700>

[0111] Figure 14 (A) is a diagram showing an outline of the transport vehicle (transport flatbed truck) 700. (See diagram for reference.) Figure 14 As shown in (A), the transport vehicle 700 includes a mounting section 701 for placing the mask box 600, wheels 702 mounted on the mounting section 701, a handle 703 for the operator to hold when moving the transport vehicle 700, and a mechanical stop 704 disposed on the front side of the mounting section 701. The transport vehicle 700 also has an antistatic mechanism 710 for further eliminating static electricity carried by the mask box 600 placed on the mounting section 701.

[0112] The static eliminator 710 includes a first electrode part 711, an electrostatic discharger 712, and an electrode component 713.

[0113] Figure 15 (A) and Figure 15 (B) is a diagram illustrating the construction of the static eliminator 710.

[0114] The first electrode component 711 is, for example, a contact probe, such as... Figure 15 As shown in (A), a force is applied upward by a force-applying member 715 such as a compression spring. As a result, the front end of the first electrode part 711 protrudes beyond the contact surface 701a in the mounting part 701 that contacts the mask box support part 611 of the mask box 600.

[0115] like Figure 15 As shown in (B), when the mask box 600 is placed on the mounting part 701, the first electrode part 711 and the mask box support part 611 come into contact and are electrically connected together.

[0116] The first electrode component 711 is electrically connected to the electrostatic discharger 712. This allows static electricity carried by the mask cassette 600 to be conducted to the electrostatic discharger 712 via the first electrode component 711, and then discharged from the electrostatic discharger 712. Therefore, during the transport of the mask cassette 600 containing the mask M by the transport vehicle 700, it is possible to prevent the pattern formed on the mask M from being damaged due to the discharge of static electricity carried by the mask M.

[0117] Furthermore, the first electrode component 711 is electrically connected to the electrode member 713 located on the front side of the mechanical stop 704. The electrode member 713 is a conductive component, such as a busbar.

[0118] like Figure 9 As shown, when the mask box 600 is housed within the mask buffer 310, the transport vehicle 700 is positioned by the positioning frame 311 located on the mask buffer 310. Figure 14 As shown in (A), a mechanical stop 315 is provided on the positioning frame 311. The mechanical stop 704 of the transport vehicle 700 contacts the mechanical stop 315 of the positioning frame 311, thereby positioning the transport vehicle 700 on the positioning frame 311.

[0119] Figure 14 (B) is an enlarged view of the mechanical stop 315. The mechanical stop 315 is provided with a second electrode part 312, a shock absorbing part 313 such as a shock absorber.

[0120] Impact absorbing component 313 absorbs the impact when mechanical stop 704 and mechanical stop 315 of transport vehicle 700 come into contact.

[0121] The second electrode component 312, for example, is a contact probe. When the transport vehicle 700 is positioned on the positioning frame 311, the second electrode component 312 is electrically connected to the electrode component 713 of the transport vehicle 700. In this embodiment, the second electrode component 312 is forced by a force-applying component 316 such as a compression spring, so that the front end of the second electrode component 312 protrudes beyond the mechanical stop surface 315a. Thus, when the mechanical stop 315 and the mechanical stop 704 contact to stop the transport vehicle 700, even if the transport vehicle 700 is pushed backward by the reaction force of the impact absorption component 313, the contact (electrical connection) between the second electrode component 312 and the electrode component 713 can be ensured.

[0122] The second electrode component 312 is grounded. Therefore, when the transport vehicle 700 is positioned on the positioning frame 311, the static electricity carried by the mask box 600 can be released to the ground via the first electrode component 711, the electrode component 713, and the second electrode component 312. This can suppress the destruction of the pattern formed on the mask M due to static discharge.

[0123] When the transport vehicle 700 is positioned on the positioning frame 311, the mask box 600 placed on the mounting part 701 is moved into the mask buffer 310.

[0124] <Mask Buffer 310>

[0125] like Figure 8 As shown, the mask buffer 310 has multiple slots SLT for storing the mask box 600, and each slot SLT has a shelf portion 320 for mounting the mask box 600.

[0126] Figure 16 (A) and Figure 16 (B) is a diagram illustrating the configuration of each shelf section 320. Figure 16 (A) is a schematic diagram of the shelf portion 320 of the mask buffer 310 as viewed from the +Z direction. Figure 16 (B) is Figure 16 AA-line section view of (A).

[0127] like Figure 16 (A) and Figure 16 As shown in (B), the shelf portion 320 has a pair of support portions 320a supporting the mask box 600, and a frame portion 320b to which the support portions 320a are fixed.

[0128] A pair of support portions 320a are separately arranged in the Y-axis direction, and each support portion 320a extends in the X-axis direction. A plurality of box support members 320c are arranged in each support portion 320a, and the box support members 320c contact the mask box support portion 611 of the first shell portion 601a of the mask box 600, and support the mask box 600 from below.

[0129] The support portion 320a, frame portion 320b, and box support member 320c are conductive. The support portion 320a and frame portion 320b are electrically connected together, and the box support member 320c is electrically connected to the support portion 320a. Thus, the box support member 320c and frame portion 320b are electrically connected together. It should be noted that in this embodiment, a non-conductive film (e.g., a rust-preventive film) is formed on the surface of the support portion 320a and the surface of the frame portion 320b. Therefore, the film at the portion where the electrical connection occurs in the support portion 320a and the frame portion 320b is removed. Figure 16In (B), the portion of the support portion 320a where the film is removed is shown as the film removal area 321a, and the portion of the frame portion 320b where the film is removed is shown as the film removal area 321b.

[0130] The frame portion 320b is grounded. Therefore, when the mask box 600 is placed on the shelf portion 320, the static electricity carried by the mask box 600 is conducted to the frame portion 320b via the box support member 320c and the support portion 320a, and is released to the ground. This prevents the pattern formed on the mask M from being destroyed due to the discharge of static electricity from the mask M housed within the mask box 600 and the mask box 600. In other words, in the mask buffer 310, the box support member 320c which contacts the mask box 600, the support portion 320a which is electrically connected to the box support member 320c, and the frame portion 320b which is electrically connected to the support portion 320a and grounded, function as an antistatic mechanism to eliminate static electricity carried by the mask box 600.

[0131] It should be noted that, for example, an antistatic brush with conductive bristles extending toward the mask box 600 can also be provided on the surface of the support portion 320a opposite to the mask box 600 (the surface on the +Z side). In this case, the conductive bristles are electrically connected to the support portion 320a. Thus, static electricity carried by the mask box 600 can be conducted to the frame portion 320b via the antistatic brush. When an antistatic brush is provided, the box support member 320c can be non-conductive.

[0132] <Buffer Arm 330>

[0133] The mask box 600 stored in the mask buffer 310 is moved in and out via the buffer arm 330. Figure 17 This is a schematic diagram showing the configuration of the buffer arm 330. The buffer arm 330 includes: an arm portion 331 that is driven in the X-axis direction to remove the mask box 600 from the mask buffer 310 (more specifically, the shelf portion 320) or insert the mask box 600 into the mask buffer 310; and an antistatic mechanism 340 for eliminating static electricity carried on the arm portion 331.

[0134] The arm portion 331 includes a conductive main body portion 331a, a positioning mechanism 331b, and a pedestal portion 331c. The pedestal portion 331c supports the mask box support portion 611 of the mask box 600. The positioning mechanism 331b engages with a recess 612a in the positioning portion 612 of the mask box 600, thereby determining the position of the mask box 600 relative to the buffer arm 330 by means that the mask box support portion 611 is supported by the pedestal portion 331c. It should be noted that the positioning portion 612 is conductive and electrically connected to the first shell portion 601a of the mask box 600.

[0135] The arm 331 is driven in the X-axis direction by a first drive mechanism 333, such as a linear guide held by a conductive first frame 332, as shown by arrow AR31. This allows the arm 331 to enter the slot SLT. The first frame 332 is driven in the Z-axis direction by a second drive mechanism 335, such as a linear guide held by a conductive second frame 334, as shown by arrow AR32. This allows the mask box 600 to be removed from each slot SLT located at different positions in the Z-axis direction. It should be noted that when the mask M is removed from the slot SLT, the second shell 601b remains inside the slot SLT, and only the first shell 601a containing the mask M is removed by the arm 331.

[0136] The static eliminator 340 has a third electrode part 341, a first static eliminator brush 342, and a second static eliminator brush 343.

[0137] The third electrode component 341, for example, is a contact probe, which contacts the mask box 600 (positioning part 612) when the mask box 600 is placed on the arm 331. Thus, the mask box 600 and the third electrode component 341 are electrically connected together. The third electrode component 341 is subjected to force by a force-applying member 345 such as a compression spring, so that the front end of the third electrode component 341 is positioned above the position of the positioning part 612 of the mask box 600 when the mask box 600 is placed on the arm 331. This allows for more reliable electrical connection between the mask box 600 and the third electrode component 341. The third electrode component 341 is electrically connected to the main body 331a. This allows static electricity carried by the mask box 600 to be conducted to the main body 331a.

[0138] The first antistatic brush 342 has conductive bristles extending toward the main body 331a. The first antistatic brush 342 is electrically connected to the first frame 332. In this embodiment, a non-conductive film is formed on the surface of the main body 331a of the arm portion 331, but... Figure 17 In the portion indicated by the dashed line, the film is removed. Specifically, the film is removed from the lower surface of the -X side end and the lower surface near the center of the main body 331a, exposing the material of the main body 331a. If the area where the film is removed in the lower surface of the -X side end is designated as film removal area 336a, and the area where the film is removed in the lower surface near the center is designated as film removal area 336b, then the first antistatic brush 342 can conduct the static electricity carried by the main body 331a to the first frame 332 when it is positioned opposite to the film removal areas 336a and 336b. In other words, the first antistatic brush 342 conducts the static electricity carried by the main body 331a (arm 331) to the first frame 332 when the arm 331 is located closest to the mask buffer 310 in the X-axis direction and when it is located closest to the second frame 334 in the X-axis direction.

[0139] The second antistatic brush 343 has conductive bristles extending toward the first frame 332. The second antistatic brush 343 is electrically connected to the second frame 334. In this embodiment, a non-conductive film is formed on the surface of the first frame 332, but... Figure 17 The portion of the film indicated by the dashed line is removed. Specifically, the film is removed from the -Z side end of the first frame 332, exposing the material of the first frame 332. If the area in the first frame 332 where the film is removed is designated as the film removal area 332a, then the second antistatic brush 343, when positioned opposite the film removal area 332a, can conduct the static electricity carried by the first frame 332 to the second frame 334. It should be noted that in Figure 17 The figure shows a second antistatic brush 343, but in this embodiment, the second antistatic brush 343 is provided at least at two locations, opposite to the film removal area 332a of the first frame 332 when the first frame 332 is at its highest position in the Z-axis direction and when it is at its lowest position.

[0140] It should be noted that the second antistatic brush 343 may also be positioned opposite the film removal area 332a of the first frame 332 at at least one of its highest and lowest Z-axis positions. Alternatively, the second antistatic brush 343 may be provided at multiple locations in the Z-axis direction, corresponding to the stop position of the arm 331 (the position corresponding to each slot SLT).

[0141] The second frame 334 is grounded. This allows the static electricity carried by the mask box 600 to be released to the ground via the third electrode part 341, the main body 331a, the first antistatic brush 342, the first frame 332, the second antistatic brush 343, and the second frame 334. As described above, when the arm 331 is located closest to the mask buffer 310 in the X-axis direction and closest to the second frame 334 in the X-axis direction, the first antistatic brush 342 conducts the static electricity carried by the main body 331a (arm 331) to the first frame 332. Therefore, when the mask box 600 is removed from the shelf 320 and when the mask box 600 is returned to the shelf 320, the static electricity carried by the mask box 600 can be eliminated.

[0142] The mask M, housed in the first housing 601a and moved to a predetermined position in the Z-axis direction by the buffer arm 330, is removed from the mask box 600 (first housing 601a) by the mask transport mechanism 370. The PPD arm 391 moves below the mask transport mechanism 370 and transfers the mask M from the mask transport mechanism 370 to the PPD arm 391. The PPD arm 391, carrying the mask M, moves into the PPD 390. Inside the PPD 390, it is checked for foreign matter adhering to the PLCL (plastic composite film) of the mask M, and for foreign matter adhering to the side of the mask M opposite to the side with the PLCL. After the foreign matter inspection of the mask M is completed, the PPD arm 391, carrying the mask M, moves below the mask transport mechanism 370, and the mask M is transferred from the PPD arm 391 to the mask transport mechanism 370.

[0143] The mask transport mechanism 370, which holds the mask M, moves the mask M to the mask stage 114 of the main body 100.

[0144] <Mask Conveying Mechanism 370>

[0145] Figure 18 (A) is a diagram showing the appearance of the mask conveying mechanism 370 according to this embodiment. Figure 18 (B) is a schematic diagram showing the configuration of the mask conveying mechanism 370. Figure 18 (A) and Figure 18 As shown in (B), the mask conveying mechanism 370 has a pair of holding portions 371 for holding the mask M, and an antistatic mechanism 380 for eliminating static electricity carried by the holding portions 371. It should be noted that in Figure 18 In (B), one of the pair of retaining parts 371 is shown.

[0146] The holding part 371 includes: a conductive support part 371a that contacts the mask M and supports the mask M; and an arm part 371b connected to the support part 371a and capable of being driven in the Y-axis direction. A portion of the arm part 371b is housed within a frame 372. The arm part 371b is driven in the Y-axis direction, for example, via an actuator 373 that transmits power to a cylinder or the like. The actuator 373 is also housed within the frame 372.

[0147] The support portion 371a and the arm portion 371b are conductive. The static elimination mechanism 380 includes: a connecting portion 381 that electrically connects the support portion 371a and the arm portion 371b and conducts static electricity carried by the support portion 371a to the arm portion 371b; and a static elimination brush 382 that conducts static electricity carried by the arm portion 371b to the frame 372.

[0148] In this embodiment, the support portion 371a is rotatable about the axis 371c, as indicated by arrow AR41. For this purpose, the connecting portion 381 is elastic to reliably achieve electrical connection between the support portion 371a and the arm portion 371b. For example, a metal leaf spring can be used as the connecting portion 381. A non-conductive film is formed on the surface of the conductive component of the arm portion 371b, but the film is removed from the portion 371e to which the connecting portion 381 connects. Thus, the connecting portion 381 can conduct static electricity carried by the support portion 371a to the arm portion 371b.

[0149] Additionally, for example, when the mask M is held in the support portion 371a, the film on the portion 371f of the arm portion 371b, which is opposite to the antistatic brush 382, ​​is removed. As a result, when the mask M is held in the support portion 371a, the static electricity carried by the arm portion 371b can be conducted to the frame 372.

[0150] The frame 372 is conductive and grounded. Therefore, during the mask transport mechanism 370's transport of the mask M, static electricity carried by the mask M can be conducted to the frame 372 via the support portion 371a, the arm portion 371b, and the antistatic brush 382, ​​and released to the ground from the frame 372. This prevents the pattern formed on the mask M from being destroyed due to the discharge of static electricity carried by the mask M. It should be noted that when the arm portion 371b is composed of multiple components, electrical connection is achieved by removing the film at the connection points of the multiple components.

[0151] As described in the detailed explanation above, according to this embodiment, the exposure apparatus EX includes an antistatic brush 500 that eliminates static electricity carried on the substrate tray 201 during the movement of the substrate tray 201 supporting the substrate P. The substrate tray 201 includes a conductive base member 201a, an antistatic brush 210a that conducts static electricity carried on the substrate P to the base member 201a opposite to the substrate P supported by the substrate tray 201, and a conductive support member 201b. The antistatic brush 500 eliminates the static electricity conducted to the base member 201a. Therefore, it is possible to suppress the damage to devices such as TFTs formed on the substrate P caused by the discharge of static electricity carried on the substrate P during the transport of the substrate P using the substrate tray 201.

[0152] Furthermore, in this embodiment, the antistatic brush 500 is provided in the region between the main body 100 and the support 204, which perform antistatic removal relative to the substrate P, and eliminates the static electricity carried by the substrate tray 201 during the period when the substrate tray 201 moves in this region. In this embodiment, the substrate P placed on the substrate holding part 121 is destaticated by the X-ray ion generator provided in the main body 100. However, without the antistatic brush 500, there is no mechanism to release the static electricity carried by the substrate P (the static electricity carried by the substrate tray 201) during the period when the substrate P is transported between the main body 100 and the support 204. There is a concern that the discharge phenomenon of the static electricity carried by the substrate P may damage devices such as TFTs formed on the substrate P. By providing an antistatic brush 500 in the area between the main body 100 and the support 204, static electricity conducted from the substrate P to the substrate tray 201 during the transfer of the substrate P between the main body 100 and the support 204 can be eliminated. Therefore, it is possible to suppress the damage to devices such as TFTs formed on the substrate P caused by the discharge phenomenon of static electricity carried on the substrate P.

[0153] Furthermore, in this embodiment, the antistatic brush 500 is positioned opposite to the side of the substrate tray 201 that holds the substrate P. Since the side of the substrate tray 201 that holds the substrate P is covered by the substrate P, it is concerning that even with the antistatic brush 500 positioned opposite to the side of the substrate P, the static electricity carried on the substrate tray 201 may not be sufficiently eliminated. By positioning the antistatic brush 500 opposite to the side of the substrate tray 201 that holds the substrate P, the static electricity carried on the substrate tray 201 can be eliminated more reliably compared to the case where the antistatic brush 500 is positioned opposite to the side of the substrate P.

[0154] Furthermore, in this embodiment, the antistatic brush 500 does not contact the substrate tray 201. If the antistatic brush 500 comes into contact with the substrate tray 201 and becomes worn, there is a concern that dust may be generated within the exposure apparatus EX due to the wear, and this dust could cause poor exposure. Since the antistatic brush 500 does not contact the substrate tray 201, it is possible to suppress the generation of dust within the exposure apparatus EX due to wear, thereby suppressing the possibility of poor exposure caused by this dust.

[0155] Furthermore, the antistatic brush 500 extends in the Y-axis direction, which intersects the moving direction (X-axis direction) of the substrate tray 201. As a result, since the area occupied by the antistatic brush 500 in the X-axis direction can be reduced, the static electricity carried on the substrate tray 201 can be eliminated without increasing the size of the exposure apparatus EX.

[0156] Furthermore, in this embodiment, the substrate tray 201 has an electrostatic discharger 210b electrically connected to the base component 201a. Thus, even when the static electricity on the substrate tray 201 cannot be eliminated by the antistatic brush 500, the static electricity on the substrate tray 201 can be discharged into the air by the electrostatic discharger 210b.

[0157] Furthermore, according to this embodiment, the substrate tray 201 is a substrate tray 201 that supports a movable substrate P, and includes: a conductive base member 201a; an antistatic brush 210a, which is opposite to the substrate P and conducts static electricity carried by the substrate P to the base member 201a; and an electrostatic discharger 210b electrically connected to the base member 201a. Therefore, during the period when the substrate P is supported by the substrate tray 201, the static electricity carried by the substrate P can be conducted to the base member 201a by the antistatic brush 210a and discharged by the electrostatic discharger 210b. Thus, it is possible to suppress the damage to devices such as TFTs formed on the substrate P due to the discharge phenomenon of static electricity carried by the substrate P.

[0158] Furthermore, according to this embodiment, the mask box 600 includes: a box body 601 for accommodating the mask M, at least a portion of which is conductive; a mask support member 603 for conducting static electricity carried by the mask M to the conductive portion of the box body 601; and an antistatic brush 604; and an electrostatic discharger 602 electrically connected to the conductive portion to eliminate static electricity carried by the conductive portion. Thus, during the period when the mask M is housed in the mask box 600 ( Figure 10 Step S11 Figure 11 Step S35 Figure 11 In step S41), the static electricity carried by the mask M can be conducted to the box body 601 through the mask support member 603 and the static discharge brush 604 and discharged through the static discharger 602. Therefore, it is possible to suppress the situation where the pattern formed on the mask M is destroyed by the discharge phenomenon of the static electricity carried by the mask M.

[0159] In this embodiment, the main body 601 includes a first shell portion 601a having a bottom surface BS, and a second shell portion 601b having a top surface CS disposed opposite to the bottom surface BS, which is detachably disposed relative to the first shell portion 601a. ​​The first shell portion 601a is conductive, and a mask support member 603 is disposed on the bottom surface BS opposite to the mask M, conducting static electricity carried by the mask M to the first shell portion 601a. ​​An electrostatic discharger 602 is disposed on the outside of the first shell portion 601a to eliminate (discharge) static electricity carried by the first shell portion 601a. ​​Therefore, while the mask M is housed in the mask box 600, static electricity carried by the mask M can be conducted to the first shell portion 601a through the mask support member 603 and discharged by the electrostatic discharger 602, thus suppressing the possibility that the pattern formed on the mask M will be damaged due to the discharge of static electricity carried by the mask M.

[0160] In this embodiment, the second housing portion 601b is conductive, and an antistatic brush 604 is disposed on the top surface CS of the second housing portion 601b, opposite to the mask M, to conduct static electricity carried by the mask M to the second housing portion 601b. The first housing portion 601a and the second housing portion 601b are electrically connected together when the second housing portion 601b is assembled to the first housing portion 601a. ​​Thus, static electricity carried by the mask M can be conducted to the second housing portion 601b via the antistatic brush 604, and discharged from the second housing portion 601b through the first housing portion 601a from the electrostatic discharger 602.

[0161] Furthermore, in this embodiment, the transport vehicle 700 for transporting the mask box 600 includes a mounting section 701 for placing the mask box 600, and an antistatic mechanism 710 for eliminating static electricity carried by the mask box 600 placed on the mounting section 701. Thus, during the transport of the mask box 600 ( Figure 10 Step S13 Figure 11 Step S39 can eliminate static electricity on the mask box 600, thus preventing the pattern formed on the mask M housed in the mask box 600 from being destroyed by static discharge.

[0162] Furthermore, in this embodiment, the static elimination mechanism 710 includes a first electrode component 711 electrically connected to a conductive portion (mask support 611) of the mask 600, and an electrostatic discharger 712 electrically connected to the first electrode component 711 to eliminate static electricity carried by the mask 600. Thus, during the transport of the mask 600, static electricity carried by the mask 600 can be discharged by the electrostatic discharger 712.

[0163] Furthermore, in this embodiment, the static elimination mechanism 710 has an electrode component 713 electrically connected to the first electrode component 711. When the transport vehicle 700 is positioned on the positioning frame 311, the electrode component 713 is connected to the second electrode component 312, which is disposed on the positioning frame 311 and grounded. Therefore, when the transport vehicle 700 is positioned on the positioning frame 311 ( Figure 10 Step S15) can release the static electricity carried by the mask box 600 to the ground.

[0164] Furthermore, in this embodiment, the mask buffer 310, capable of storing multiple mask cassettes 600, includes a shelf portion 320 for mounting the mask cassettes 600 and an antistatic mechanism for eliminating static electricity carried by the mask cassettes 600 mounted on the shelf portion 320. Specifically, the shelf portion 320 includes: a conductive box support member 320c that contacts and supports the conductive portion (mask cassette support portion 611) of the mask cassette 600 from below; and a conductive frame portion 320b to which the box support member 320c is fixed. The antistatic mechanism eliminates static electricity carried by the mask cassettes 600 by electrically connecting the box support member 320c and the frame portion 320b to ground the frame portion 320b. Thus, since the mask cassettes 600 can be stored in the mask buffer 310 for a period of time ( Figure 10 Step S17 Figure 11 Step S37) eliminates the static electricity carried by the mask box 600, thus preventing the pattern formed on the mask M housed in the mask box 600 from being destroyed by the static discharge phenomenon.

[0165] Furthermore, in this embodiment, the buffer arm 330 for removing the mask box 600 from the mask buffer 310 storing the mask box 600 and for inserting the mask box 600 into the mask buffer 310 includes: an arm portion 331 that is driven in a direction parallel to the surface of the mask M to remove the mask box 600 from the mask buffer 310 and insert the mask box 600 into the mask buffer 310; and an antistatic mechanism 340 for eliminating static electricity carried by the arm portion 331. The arm portion 331 is in communication with the mask box 600 while holding the mask box 600. Therefore, since it is possible to move the mask box 600 using the buffer arm 330 during the period ( Figure 10 Step S19) eliminates static electricity on the mask box 600, thereby preventing the pattern formed on the mask M housed in the mask box 600 from being destroyed by static discharge.

[0166] In this embodiment, the arm portion 331 includes a conductive main body portion 331a and a pedestal portion 331c electrically connected to the main body portion 331a and supporting the mask cassette 600. The static elimination mechanism 340 includes a third electrode component 341, which is electrically connected to the main body portion 331a and contacts a conductive portion (positioning portion 612) of the mask cassette 600 supported by the pedestal portion 331c, thereby conducting static electricity carried by the mask cassette 600 to the main body portion 331a. Thus, static electricity carried by the mask cassette 600 can be conducted to the main body portion 331a while the arm portion 331 supports the mask cassette 600.

[0167] In this embodiment, the buffer arm 330 includes a first frame 332 that holds a first drive mechanism 333 driving the arm portion 331 in the X-axis direction; and a second frame 334 that holds a second drive mechanism 335 driving the first frame 332 in the Y-axis direction, which is approximately orthogonal to the surface of the mask M. The static eliminator 340 includes a first static eliminator brush 342 opposite to the arm portion 331 and conducting static electricity carried by the arm portion 331 (main body portion 331a) to the first frame 332, and a second static eliminator brush 343 opposite to the first frame 332 and conducting static electricity carried by the first frame 332 to the second frame 334, the second frame 334 being grounded. Thus, static electricity conducted from the mask box 600 to the main body portion 331a can be released to the ground via the first static eliminator brush 342, the first frame 332, the second static eliminator brush 343, and the second frame 334.

[0168] Furthermore, in this embodiment, when the first antistatic brush 342 is located on the side closest to the mask buffer 310 in the X-axis direction and on the side closest to the second frame 334 in the X-axis direction, it conducts the static electricity carried by the arm 331 to the first frame 332. Thus, the static electricity carried by the mask box 600 can be eliminated when the mask box 600 is removed from the mask buffer 310 and when the mask box 600 is returned to the mask buffer 310.

[0169] Furthermore, according to this embodiment, the mask conveying mechanism 370 for conveying the mask M to the main body 100 includes a holding portion 371 for holding the mask M and an antistatic mechanism 380 for eliminating static electricity carried on the holding portion 371. Therefore, since the mask M can be conveyed by the mask conveying mechanism 370 within a short period of time ( Figure 10 Steps S20 and S23 Figure 11 Step S33) eliminates the static electricity carried by the mask box 600, thus preventing the pattern formed on the mask M housed in the mask box 600 from being destroyed by the static discharge phenomenon.

[0170] exist Figure 10 as well as Figure 11In the series of processes shown for mask M, when mask M is moved into PPD390 ( Figure 10 Step S21): When mounting the mask M on the mask stage 114 ( Figure 10 Step S25), when unloading the mask M from the mask stage 114 ( Figure 11 Step S31), and when removing the mask M from the mask box 600 ( Figure 11 Step S43) Conventionally, static electricity on the mask M is eliminated using an X-ray ion generator, etc., but in steps other than this, the process of eliminating static electricity on the mask M is not performed. According to this embodiment, in Figure 10 Step S21 Figure 10 Step S25 Figure 11 Step S31, and Figure 11 In all steps except step S43, measures are taken to eliminate static electricity on the mask M, thereby further suppressing the possibility that the pattern formed on the mask M will be destroyed due to static discharge.

[0171] It should be noted that, in the above embodiment, an X-ray ion generator may be provided instead of the antistatic brush 500. In this case, the X-ray ion generator can simply be provided such that it irradiates X-rays onto the side opposite to the side of the substrate P held by the substrate tray 201.

[0172] Furthermore, in the above embodiment, a conductive mask support member 603 is provided in the first housing portion 601a, and an antistatic brush 604 is provided in the second housing portion 601b. However, the antistatic brush 604 may be omitted, for example. Alternatively, if the antistatic brush 604 is provided, the mask support member 603 may be made non-conductive.

[0173] Alternatively, in the above embodiment, an antistatic brush that is electrically connected to the first housing portion 601a and has conductive bristles extending toward the mask M may also be provided in the first housing portion 601a.

[0174] Furthermore, in the buffer arm 330 of the above embodiment, the third electrode part 341 is electrically connected to the positioning part 612 of the mask box 600, but is not limited thereto. For example, the third electrode part 341 may be provided on the pedestal part 331c and electrically connected to the mask box support part 611 of the mask box 600.

[0175] Furthermore, in the above embodiment, it is described that the exposure device EX is an exposure device using a mask M. However, in terms of the mechanism for eliminating static electricity on the substrate P, it is also possible to apply it in a so-called maskless exposure device that replaces the mask M and forms a pattern, for example, by a spatial light modulator.

[0176] In addition, in the above embodiments, a portion of the static elimination mechanism can be omitted.

[0177] Alternatively, in the above embodiments, an electrostatic discharger can be installed on the grounded component, while the component can be set to be ungrounded.

[0178] Furthermore, in the above embodiment, the exposure apparatus EX is described as an exposure apparatus that transfers the pattern of the mask M to the substrate P, but the exposure apparatus EX may also be, for example, a semiconductor exposure apparatus that forms a pattern on the wafer formed by an intermediate mask.

[0179] The above embodiments are preferred embodiments of the present invention. However, they are not limited thereto, and various modifications can be made without departing from the spirit of the present invention.

[0180] Regarding the implementation methods described above, the following notes are further disclosed.

[0181] [Postscript 1]

[0182] A conveying device for conveying a mask to the main body of an exposure apparatus, comprising:

[0183] The holding part that holds the mask; and

[0184] An antistatic mechanism that eliminates static electricity carried by the holding part.

[0185] [Postscript 2]

[0186] In the conveying device described in Appendix 1

[0187] The retaining portion has a conductive support portion that contacts the mask and supports the mask.

[0188] The static elimination mechanism eliminates the static electricity on the holding part by conducting the static electricity on the support part to other grounded components.

[0189] [Postscript 3]

[0190] In the conveying device described in Appendix 2

[0191] The retaining part includes an arm that is fixed to the supporting part and can be driven in a first direction parallel to the surface of the mask.

[0192] The static eliminator includes:

[0193] A connecting portion that electrically connects the support portion and the arm portion, and conducts static electricity carried by the support portion to the arm portion; and

[0194] The sixth static-eliminating component conducts the static electricity carried by the arm to the grounded frame that houses the arm.

[0195] [Postscript 4]

[0196] In the conveying device described in Appendix 3

[0197] The connecting part is a flexible plate-shaped component.

[0198] [Postscript 5]

[0199] In the conveying device described in Appendix 3 or Appendix 4

[0200] The sixth static-eliminating component conducts the static electricity carried by the arm to the frame when the holding part is holding the mask.

[0201] [Postscript 6]

[0202] In any of the following appendices 3 to 5, the conveying device

[0203] The sixth antistatic component is an antistatic brush with conductive bristles.

[0204] Explanation of reference numerals in the attached figures

[0205] 100 main body

[0206] 120 substrate carrier device

[0207] 121 Substrate Holding Section

[0208] 200 substrate transfer device

[0209] 201 substrate tray

[0210] 201a base components

[0211] 201b support components

[0212] 204 support section

[0213] 210a Antistatic Brush

[0214] 210b electrostatic discharger

[0215] 500 Antistatic Brush

[0216] EX Exposure Device

[0217] P-substrate.

Claims

1. An exposure apparatus comprising an antistatic unit that eliminates static electricity carried on a substrate support member during movement of the substrate support member supporting the substrate. The substrate support member has a conductive main body and a conductive component. The conductive component is positioned opposite the substrate supported by the substrate support member and conducts static electricity from the substrate to the main body. The static elimination section will conduct static electricity to the main body to eliminate it.

2. The exposure apparatus according to claim 1, wherein, The static elimination section is located in a third region between a first region for static elimination relative to the substrate and a second region different from the first region. During the period when the substrate support member moves in the third region, the static electricity carried by the substrate support member is eliminated.

3. The exposure apparatus according to claim 1 or 2, wherein, The static elimination section is positioned opposite to the side of the substrate support member that holds the substrate.

4. The exposure apparatus according to any one of claims 1 to 3, wherein, The static elimination part does not contact the substrate support component.

5. The exposure apparatus according to any one of claims 1 to 4, wherein, The static elimination unit is an ion generator.

6. The exposure apparatus according to any one of claims 1 to 4, wherein, The antistatic part is an antistatic brush with conductive bristles extending toward the substrate support member.

7. The exposure apparatus according to claim 6, wherein, The static elimination section extends in a direction that intersects the movement direction of the substrate support member.

8. The exposure apparatus according to any one of claims 1 to 7, wherein, The conductive component includes an antistatic brush that is electrically connected to the main body and has conductive bristles extending toward the substrate.

9. The exposure apparatus according to any one of claims 1 to 8, wherein, The conductive component includes a plurality of support components, which are electrically connected to the main body and in contact with the substrate to support the substrate.

10. The exposure apparatus according to any one of claims 1 to 9, wherein, The substrate support component has an electrostatic discharger that is electrically connected to the main body.

11. The exposure apparatus according to any one of claims 1 to 10, wherein, A conveying device is provided for conveying the substrate support component.

12. A substrate support member, which supports a movable substrate, comprising: The conductive main body; A conductive component opposite to the substrate and conducting static electricity from the substrate to the main body; and An electrostatic discharger electrically connected to the main body.

13. A substrate support member, which supports a movable substrate, comprising: The conductive main body; At least one of an antistatic brush and a conductive support member, wherein the antistatic brush is electrically connected to the main body and has conductive bristles extending toward the substrate, and the support member is electrically connected to the main body and contacts the substrate to support it; and An electrostatic discharger electrically connected to the main body.

14. An exposure apparatus comprising an antistatic unit that eliminates static electricity carried on a substrate support member during movement of the substrate support member supporting the substrate. The substrate support component includes: The conductive main body; and The substrate includes at least one of an antistatic brush and a conductive support member, wherein the antistatic brush is electrically connected to the main body and has conductive bristles extending toward the substrate, and the support member is electrically connected to the main body and contacts the substrate to support it. The static elimination section removes static electricity from the main body.

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