Appliance for manufacturing laminate, and method for manufacturing laminate

Abstract

A laminate manufacturing tool (10) is used when heating and pressurizing a pre-crimping laminate (1A) in which a metal base substrate (2), a resin composition (3A) in a semi-cured state, a circuit pattern (4) having a thickness of 0.8 mm or more, or a circuit body (C), which is a mounting body in which an electronic component is mounted on the circuit pattern (4), are laminated in a chamber (50). The laminated body manufacturing tool (10) is provided with: a base jig (11) on which a pre-crimping laminated body (1A) is mounted; a film (13) that covers at least the resin composition (3A) and the circuit body (C); and a cover jig (12) that sandwiches the film (13) between the cover jig (12) and the base jig (11), the base jig (11) having an exhaust port (11e) that exhausts the inside of the film (13) covering the resin composition (3A) and the circuit body (C), and the cover jig (12) having an opening (12a) that exposes the entire region of a covered portion (13a) of the film (13) covering the resin composition (3A) and the circuit body (C).

Description

Technical Field

[0001] This invention relates to an apparatus for manufacturing laminates and a method for manufacturing laminates. Background Technology

[0002] For a long time, as a circuit board for mounting electronic components such as semiconductor chips, a laminate containing a metal substrate, an insulating layer, and a circuit pattern has been known (see, for example, Patent Document 1). Such a laminate is manufactured, for example, by preparing a resin composition containing a resin and a filler, coating the resin composition onto a metal substrate and pre-curing it, then placing the circuit pattern on the resin composition and hot-pressing it.

[0003] In recent years, there has been an increase in the use of electronic components that carry high currents, such as high-brightness light-emitting diodes (LEDs) or power modules. In order to obtain a stack that can handle high currents and use such electronic components, it is effective to increase the thickness of the circuit pattern to reduce the resistance and ensure adequate heat dissipation when carrying high currents.

[0004] [Existing Technical Documents]

[0005] [Patent Literature]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2002-012653

[0007] [Patent Document 2] Japanese Patent Application Publication No. 2009-206225 Summary of the Invention

[0008] [The problem the invention aims to solve]

[0009] Furthermore, during the hot pressing process in the manufacture of laminates, the resin composition in contact with the conductive portions (metal portions) constituting the circuit pattern is pressurized. However, the gaps between adjacent conductive portions do not contact the resin composition, resulting in insufficient pressure on the resin composition in these gaps. In other words, during hot pressing, the pressure on the resin composition becomes uneven depending on whether it contacts the conductive portions. Here, in the gaps, insufficient pressure prevents the expulsion of gas contained within the resin composition, leading to numerous pores and potentially compromising insulation. This is particularly problematic when the circuit pattern is thickened, as the depth of the gaps increases, making insufficient pressure more pronounced and increasing the likelihood of this defect. Additionally, in the areas where conductive portions are present, the resin composition is forcefully pressed by the ends of the conductive portions (or a sharp pressure change occurs between the gaps and conductive portions, with the ends of the conductive portions as the boundary), which can sometimes cause cracking when forming an insulating layer.

[0010] Furthermore, when hot pressing surfaces with unevenness, a buffer material that functions to fill the unevenness is sometimes used (see, for example, Patent Document 2). However, when the depth of the gap increases as described, even this type of buffer material cannot fully penetrate the depth of the gap, and therefore sometimes insufficient pressure cannot be completely eliminated. This defect occurs more frequently, especially when the thickness of the circuit pattern is 0.8 mm or more.

[0011] In view of these problems, the object of the present invention is to provide an apparatus for manufacturing laminates and a method for manufacturing laminates, which can prevent defects in the insulating layer for laminates using circuit patterns with a thickness of 0.8 mm or more.

[0012] [Technical means to solve the problem]

[0013] This invention relates to an apparatus for manufacturing laminates, used in manufacturing laminates that sequentially stack a metal substrate, an insulating layer formed by curing a resin composition, a circuit pattern with a thickness of 0.8 mm or more, or a mounting body (i.e., a circuit body) on which electronic components are mounted, in order to heat and pressurize the laminated metal substrate, the semi-cured resin composition, and the circuit body in a cavity. The apparatus includes: a substrate clamp for mounting the pre-pressed laminate; a membrane covering at least the resin composition and the circuit body; and a cover clamp for holding the membrane between itself and the substrate clamp. The substrate clamp has an exhaust port for venting air from the interior of the membrane covering the resin composition and the circuit body, and the cover clamp has an opening that exposes the entire area of ​​the membrane covering the resin composition and the circuit body.

[0014] In the apparatus for manufacturing the laminate, the substrate fixture preferably includes: a receiving portion capable of disposing the pre-pressed laminate inside; and a peripheral surface located at the periphery of the receiving portion, situated between the back side of the resin composition and the surface of the circuit pattern when the pre-pressed laminate is disposed in the receiving portion.

[0015] Furthermore, in the apparatus for manufacturing the laminate, it is preferable that the pre-pressed laminate has the resin composition and the circuit body laminated on the surface side of the metal substrate, and a semi-cured second resin composition and a second circuit body with a thickness of 0.8 mm or more laminated on the back side of the metal substrate. The apparatus for manufacturing the laminate includes: a second film that at least covers the second resin composition and the second circuit body; and a second cover clamp that clamps the second film between itself and the substrate clamp. The second cover clamp has a second opening that exposes the entire area of ​​the second covered portion of the second film that covers the second resin composition and the second circuit body.

[0016] Additionally, the present invention also provides a method for manufacturing a laminate, using a laminate manufacturing apparatus. This apparatus is used when manufacturing a laminate in which a metal substrate, an insulating layer formed by curing a resin composition, a circuit pattern with a thickness of 0.8 mm or more, or a mounting body (i.e., a circuit body) on which electronic components are mounted, are sequentially stacked. The laminate is heated and pressurized within a chamber when the metal substrate, the semi-cured resin composition, and the circuit body are stacked. In this method, the laminate manufacturing apparatus includes: a substrate clamp for mounting the pre-pressed laminate; a membrane covering at least the resin composition and the circuit body; and a cover clamp holding the membrane between itself and the substrate clamp. The substrate clamp has an exhaust port for venting the interior of the film covering the resin composition and the circuit body, and the cover clamp has an opening that exposes the entire area of ​​the covered portion of the film covering the resin composition and the circuit body. The method of manufacturing the laminate includes the following steps: mounting the pre-pressed laminate onto the substrate clamp; covering at least the resin composition and the circuit body with the film; clamping the film with the substrate clamp and the cover clamp; and disposing the substrate clamp and the cover clamp holding the film in the chamber; venting the interior of the film from the exhaust port; increasing the temperature and pressure in the chamber; and heating and pressurizing the covered portion exposed at the opening.

[0017] In the method for manufacturing the laminate, it is preferable to include the following steps: the steps are performed before the substrate clamp holding the film and the cover clamp are arranged in the cavity, and the covered portion exposed at the opening is heated.

[0018] [The effects of the invention]

[0019] According to the apparatus for manufacturing laminates and the method for manufacturing laminates of the present invention, defects in the insulating layer can be prevented in laminates using circuit patterns with a thickness of 0.8 mm or more. Attached Figure Description

[0020] Figure 1 This is a diagram showing a laminate manufactured by a method for manufacturing a laminate according to an embodiment of the present invention.

[0021] Figure 2 This is a flowchart illustrating a method for manufacturing a laminate according to an embodiment of the present invention.

[0022] Figure 3 It means in Figure 1 A diagram showing one embodiment of the apparatus used in the method for manufacturing the laminated body.

[0023] Figure 4 This is a diagram showing another laminate manufactured by a method for manufacturing a laminate according to an embodiment of the present invention.

[0024] Figure 5 It means in Figure 4 A diagram showing one embodiment of the apparatus used in the method for manufacturing the laminated body.

[0025] Figure 6 This is a diagram showing a variation of an apparatus for manufacturing laminates. Detailed Implementation

[0026] Hereinafter, an embodiment of the apparatus for manufacturing laminates and the method for manufacturing laminates according to the present invention will be described with reference to the accompanying drawings. Furthermore, the accompanying drawings are schematic diagrams, and the thickness or width of each part, the ratio of each part to the other, etc., may sometimes differ from those in the actual embodiment. In addition, in the following description, for ease of understanding, the orientation shown in the illustrations is used, but the orientation of the apparatus for manufacturing laminates according to the present invention is not limited.

[0027] Figure 1 It is for use Figure 3 The diagram shows a laminate 1 manufactured by the laminar flow apparatus 10 and the chamber 50. The laminate 1 sequentially includes a metal substrate 2, an insulating layer 3, and a circuit body C. In this embodiment, the circuit body C includes a circuit pattern 4.

[0028] The metal substrate 2 is formed of metals such as copper, aluminum, and iron (which can be elemental metals or alloys). The metal substrate 2 can be a single-layer structure or a multi-layer structure; it can be composed of a single component or a combination of multiple components. In this embodiment, the metal substrate 2 is plate-shaped, but it can also be a heat sink with comb-shaped fins. Furthermore, the metal substrate 2 may include structures to improve the effect of dissipating heat to the outside; for example, a heat-conducting plate (vapor chamber) or heat pipe may be embedded in the metal plate.

[0029] The insulating layer 3 is formed from an insulating raw material and is disposed such that it covers the surface of the metal substrate 2. The insulating layer 3 may cover the entire surface of the metal substrate 2 or a portion of the surface.

[0030] The insulating layer 3 is formed of a resin composition containing a thermosetting resin. Examples of thermosetting resins include epoxy resin, phenolic resin, melamine resin, urea resin, unsaturated polyester resin, alkyd resin, cyanate ester resin, etc. One thermosetting resin may be used alone, or two or more may be used in combination.

[0031] As an epoxy resin, it can be used with all monomers, oligomers, and polymers having two or more epoxy groups within a single molecule, regardless of its molecular weight or molecular structure. Specific examples of such epoxy resins include: bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol M type epoxy resin (4,4'-(1,4-phenylenediisopridiene) bisphenol type epoxy resin), bisphenol P type epoxy resin (4,4'-(1,4-phenylenediisopridiene) bisphenol type epoxy resin), and bisphenol Z type epoxy resin (4,4'-cyclic epoxy group). Bisphenol-type epoxy resins, such as hexyldiene bisphenol type epoxy resin; phenolic varnish-type epoxy resins, including phenolic varnish-type epoxy resins, brominated phenolic varnish-type epoxy resins, cresol phenolic varnish-type epoxy resins, tetraphenolyl ethane type phenolic varnish-type epoxy resins, and phenolic varnish-type epoxy resins with condensed ring aromatic hydrocarbon structures; biphenyl-type epoxy resins; xylene-type epoxy resins, biphenyl aralkyl-type epoxy resins, and other aralkyl-type epoxy resins; naphthylene ether-type epoxy resins, naphthol-type epoxy resins, naphthalene-type epoxy resins, and naphthiodiol-type epoxy resins. Epoxy resins, including difunctional to tetrafunctional naphthalene-based epoxy resins, binaphthalene-based epoxy resins, and naphthalene-aralkyl-based epoxy resins, which contain a naphthalene skeleton; anthracene-type epoxy resins; phenoxy-type epoxy resins; dicyclopentadiene-type epoxy resins; norbornene-type epoxy resins; adamantane-type epoxy resins; fluorene-type epoxy resins; phosphorus-containing epoxy resins; alicyclic epoxy resins; aliphatic chain epoxy resins; bisphenol A phenolic varnish-type epoxy resins; bixylenol-type epoxy resins; triphenol methane-type epoxy resins; trihydroxyphenyl methane-type epoxy resins; and tetraphenol ethyl... Heterocyclic epoxy resins such as alkyl-type epoxy resins and triglycidyl isocyanurate; glycidyl amines such as N,N,N',N'-tetraglycidyl-m-xylenediamine, N,N,N',N'-tetraglycidyl-diaminomethylcyclohexane, and N,N-diglycidyl-aniline; copolymers of glycidyl (meth)acrylate with compounds having vinyl unsaturated double bonds; epoxy resins with butadiene structures; diglycidyl ethers of bisphenols; diglycidyl ethers of naphthols; and glycidyl ethers of phenols. As epoxy resins, one type can be used alone, or two or more types can be used in combination.

[0032] A curing agent is formulated into the resin composition of this embodiment. The curing agent is selected according to the type of thermosetting resin, and there is no particular limitation as long as it reacts with the resin. For example, amine-based curing agents, imidazole-based curing agents, phenol-based curing agents, etc., can be listed as curing agents when using epoxy resin.

[0033] In addition, fillers (inorganic fillers) are incorporated into the resin composition of this embodiment. The fillers are preferably those with excellent insulation and high thermal conductivity, such as alumina, silicon dioxide, aluminum nitride, boron nitride, silicon nitride, and magnesium oxide. One type of filler may be used alone, or two or more may be used in combination.

[0034] Furthermore, a curing accelerator is formulated into the resin composition of this embodiment. The curing accelerator is not particularly limited, and examples include: benzoxazine compounds, borate complexes, zinc naphthenate, cobalt naphthenate, tin octoate, cobalt octoate, cobalt diacetylacetonate (II), cobalt triacetylacetonate (III), and other organometallic salts; phenol, bisphenol A, nonylphenol, and other phenolic compounds; tertiary amines; tertiary amine salts; phosphine; phosphonium salts, etc.

[0035] In addition, a solvent is incorporated into the resin composition of this embodiment. The solvent is not particularly limited, but examples include: N-methylpyrrolidone, dimethylacetamide, tetrafluoroisopropanol, methyl ethyl ketone, ethylene glycol acetate, propylene glycol monomethyl ether acetate, methyl isobutyl ketone, ethylene glycol monomethyl ether, tetrahydrofuran, chloroform, toluene, xylene, acetone, dioxane, dimethyl sulfoxide, etc.

[0036] The resin composition may also contain additives. Examples of additives include stabilizers, ion traps, and softening agents.

[0037] Circuit pattern 4 is obtained by forming a predetermined pattern using a conductive raw material. Examples of such raw materials include copper or aluminum plates. The thickness of the metal plate (the thickness of circuit pattern 4) is 0.8 mm or more. Furthermore, there is no particular upper limit to the thickness of the metal plate (the thickness of circuit pattern 4), but for example, it is 2.0 mm or less. Methods for forming the predetermined pattern using a metal plate include, for example, forming a mask pattern on the metal plate and removing the exposed portion of the metal plate by etching, or stamping the metal plate using a die.

[0038] The circuit body C may also be a mounting body for mounting electronic components (chips) on the circuit pattern 4, including wiring connecting the electronic components to the circuit pattern 4, or a mold covering the electronic components and wiring with synthetic resin. Furthermore, the thickness of the mounting body when covered by the mold is, for example, 5 mm.

[0039] Next, the structure of the laminate manufacturing apparatus 10 and the chamber 50 will be described. The laminate manufacturing apparatus 10 includes a base clamp 11, a cover clamp 12, and a membrane 13.

[0040] In this embodiment, the base clamp 11 is made of metal. Furthermore, in this embodiment, the base clamp 11 is generally rectangular, with a downwardly recessed receiving portion 11a located at its center. The receiving portion 11a is formed to accommodate... Figure 3 The size of the pre-crimping laminate 1A (details will be described later) is shown on the inner side. Furthermore, the upper surface (peripheral surface 11b) of the base clamp 11 located at the periphery of the receiving portion 11a is at the same height as the surface of the semi-cured resin composition 3A (details will be described later) included in the pre-crimping laminate 1A when the pre-crimping laminate 1A is placed in the receiving portion 11a. A pad 11c made of an elastic raw material (e.g., rubber or elastomer) is provided on the outer side of the peripheral surface 11b. The pad 11c covers the entire periphery of the receiving portion 11a. Additionally, although not shown in the figure, an internal thread for holding the cover clamp 12 on the base clamp 11 is provided on the outer side of the pad 11c. Furthermore, the base clamp 11 has a passage 11d that penetrates the side of the base clamp 11 and communicates with the receiving portion 11a. Here, the portion of the passage 11d that opens into the side of the base clamp 11 is referred to as a vent 11e.

[0041] In this embodiment, the cover clamp 12 is formed of metal. Furthermore, in this embodiment, the cover clamp 12 is formed as a cuboid with an overall thickness thinner than the base clamp 11, and has an opening 12a extending vertically through its center. The opening 12a, when viewed from above, is approximately the same size as the receiving portion 11a. In other words, the opening 12a is sized to expose the entire area of ​​the semi-cured resin composition 3A when viewed from above. In addition, the cover clamp 12 of this embodiment includes a through hole (not shown) at a position corresponding to the internal thread portion provided on the base clamp 11, through which the cover clamp 12 extends vertically. By inserting a screw (not shown) into the through hole and screwing the screw into the internal thread portion, the cover clamp 12 is held on the base clamp 11.

[0042] The membrane 13 is thin and flexible, for example, a fluoropolymer membrane can be used.

[0043] Furthermore, the chamber 50 includes a door (not shown) for opening / closing the chamber 50, or auxiliary devices (not shown) such as a heater, temperature sensor, compressor, and pressure sensor. In this embodiment, the chamber 50 is configured such that when the heater is energized while the door is closed, the temperature inside the chamber 50 rises. Here, the heater operates based on the temperature inside the chamber 50 measured by the temperature sensor, thereby setting the chamber 50 to a predetermined temperature state. Additionally, in this embodiment, the chamber 50 is configured such that when gas (air or nitrogen, etc.) pressurized by the compressor is supplied while the door is closed, the pressure inside the chamber 50 rises. Here, the compressor operates based on the pressure inside the chamber 50 (or the pressure of the supplied compressed air) measured by the pressure sensor, thereby setting the chamber 50 to a predetermined pressure state.

[0044] In addition, Figure 3 In this case, there is one laminate manufacturing apparatus 10 disposed in the chamber 50, but multiple laminate manufacturing apparatus 10 may be disposed in the chamber 50.

[0045] Next, refer to Figure 2 , Figure 3 The manufacturing method of the laminate 1 is described.

[0046] First, implement Figure 2 The first step is shown. In this first step, the thermosetting resin and the hardener are placed in a container and stirred at a specified temperature for a specified time. This allows the thermosetting resin and the hardener to react. Furthermore, depending on the temperature and stirring time, the thermosetting resin and hardener reacting in the first step can be in a prepolymer state. This prepolymer state can be chosen appropriately based on the desired degree of curing of the thermosetting resin in subsequent steps; it is not necessarily required that the thermosetting resin and hardener be in a prepolymer state in the first step.

[0047] In the second step, the stirred thermosetting resin is mixed with a hardener, filler, curing accelerator, and solvent to form a resin composition. Furthermore, the resin composition in the second step is in a semi-cured state.

[0048] Then, in the third step, the generated resin composition is applied to the surface of a thin substrate, which is then dried to allow the solvent to evaporate. There are no particular limitations on the substrate, as long as it can be peeled off from the resin composition in the subsequent steps; for example, a strip of polyethylene terephthalate (PET) sheet can be used. Furthermore, there are no particular limitations in performing the third step. When using an apparatus that includes: a feeding section for feeding out a strip of substrate; a coating section located downstream in the feeding direction for applying the resin composition to the surface of the substrate; and a heating section located upstream in the feeding direction for heating the passing resin composition at a predetermined temperature, the application and drying of the resin composition can be performed continuously, thus allowing for efficient execution of the third step, which is excellent in the aforementioned respects.

[0049] In the fourth step, the strip-shaped substrate coated with the resin composition is cut into a specified size to form a single sheet with the resin composition and the substrate stacked together. Furthermore, if a substrate pre-cut to a specified size is used in the third step, the fourth step can be omitted.

[0050] Then, in the fifth step, the resin composition coated on the substrate is heated at a specified temperature for a specified time. This increases the molecular weight (weight average molecular weight) of the semi-cured resin composition. Furthermore, while the molecular weight of the resin composition increases in subsequent steps, by increasing the molecular weight of the resin composition beforehand in the fifth step, the overall time required to manufacture the laminate 1 can be shortened. Additionally, if the required molecular weight of the resin composition has been ensured in steps prior to the fifth step, the fifth step can be omitted. As a specific example of implementing the fifth step, one could prepare multiple sheets laminated with the resin composition and the substrate, and heat these together in a furnace.

[0051] In the sixth step, the semi-cured resin composition is subjected to compressive force. Prior to the sixth step, the resin composition, having undergone drying in the third step, was in a state containing numerous voids. However, by implementing the sixth step, its density is increased and the voids are reduced, thereby achieving high insulation properties when formed into an insulating layer in subsequent steps. As a specific example of implementing the sixth step, one could exemplify this: overlapping the sheet with the metal substrate 2 in a state where the resin composition is in contact with the substrate. Figure 1The metal substrate 2 shown is placed inside, for example, a vacuum pressing apparatus. Then, under vacuum conditions and at a predetermined temperature inside the apparatus, the overlapped metal substrate 2 and the sheet are pressed together. This allows a semi-cured resin composition to be transferred onto the metal substrate 2 and subjected to compressive force. Furthermore, in the sixth step, the metal substrate 2 is not necessarily required; for example, a separately prepared substrate can be overlapped with the sheet and pressed together, or the sheet can be pressed separately.

[0052] Furthermore, by performing the step (eighth step) of hardening the semi-cured resin composition (described later), gas can be expelled from the resin composition. However, the inventors of this application conducted research and found that if the resin composition is over-cured, even performing the eighth step sometimes fails to sufficiently expel gas from the resin composition. Additionally, even when performing the eighth step when the resin composition has a low density and contains a large number of voids, it is sometimes difficult to completely reduce the voids to a level sufficient for voltage resistance. In view of this, the optimal range for the molecular weight (weight average molecular weight) and density of the resin composition was repeatedly studied. The results showed that the increase rate of the weight average molecular weight of the resin composition was good when it was 30% or less after the sixth step (after applying compressive force), based on the condition before the sixth step (before applying compressive force). Furthermore, the increase rate of the weight average molecular weight of the resin composition was further repeatedly studied, and a more preferred result was obtained when it was 25% or less, and an even more preferred result was obtained when it was 20% or less. Furthermore, regarding the density of the resin composition, a density of 85% or higher after the sixth process (after applying compressive force) is considered good, based on the actual density of the final formed insulation layer. Moreover, further repeated studies on the density of the resin composition yielded more favorable results at 90% or lower, and even more favorable results at 95% or lower. Additionally, the weight-average molecular weight is a polystyrene equivalent determined by gel permeation chromatography (GPC).

[0053] Then, in the seventh step, the substrate is peeled off from the semi-cured resin composition transferred to the metal substrate 2, or the substrate is peeled off from the resin composition after it has been transferred to the metal substrate 2 without the resin composition being transferred to it. Then, Figure 1 The circuit body C (circuit pattern 4) shown overlaps on the resin composition to form a pre-pressed laminate 1A (see reference). Figure 3 In the aforementioned process, a circuit pattern overlapping the resin composition can be heat-pressed to temporarily attach the circuit pattern to the resin composition. Furthermore, Figure 3 The symbol 3A shown indicates a resin composition in a semi-cured state.

[0054] In the eighth step, the semi-cured resin composition 3A, laminated on the pre-pressed laminate 1A, is cured. In this embodiment, a method is used... Figure 3 The apparatus 10 and chamber 50 shown are used for manufacturing laminated bodies. Figure 2 In steps 8a to 8e, as shown, gas is expelled from the semi-cured resin composition 3A while it is being cured. Furthermore, in... Figure 3 In this embodiment, the lamination manufacturing apparatus 10 is arranged inside the chamber 50. However, in this embodiment, the operation of the lamination manufacturing apparatus 10 is arranged to be performed outside the chamber 50 from step 8a to step 8c, taking into account workability.

[0055] In step 8a, the pre-pressing laminate 1A formed in step 7 is mounted on the laminate manufacturing fixture 10. Specifically, the pre-pressing laminate 1A is inserted into the receiving portion 11a of the substrate clamp 11 with the metal substrate 2 below it, thereby mounting the pre-pressing laminate 1A onto the substrate clamp 11. In this state, the peripheral surface 11b of the substrate clamp 11 is at the same height as the surface of the resin composition 3A.

[0056] After the pre-crimping laminate 1A is mounted on the base clamp 11, a covering film 13 is applied to cover the upper surface of the pre-crimping laminate 1A. At this time, the outer edge of the film 13 is positioned further outward than the gasket 11c. Thus, at least the surface of the circuit pattern 4 and the resin composition 3A in the pre-crimping laminate 1A is covered by the film 13. Then, a cover clamp 12 is mounted on the base clamp 11 using screws (not shown). This allows the film 13 to be clamped using the gasket 11c of the base clamp 11 and the cover clamp 12. In this state, the entire area of ​​the covered portion (hereinafter referred to as the covered portion 13a) of the film 13 covering the surface of the resin composition 3A and the circuit pattern 4 is exposed at the opening 12a.

[0057] In step 8b, for example, a heating pad (a pad with a built-in heater) is brought into contact with the membrane 13 through the opening 12a to heat the membrane 13. This softens the covered portion 13a. In this embodiment, the opening 12a is formed to be approximately the same size as the receiving portion 11a, and since the entire area of ​​the covered portion 13a is exposed, the entire area of ​​the covered portion 13a can be heated.

[0058] In step 8c, a pump (not shown) is connected to the vent 11e for suction. This allows venting of the membrane 13 through the passage 11d connected to the vent 11e and the receiving portion 11a, enabling the membrane 13 to follow the shape of the circuit pattern 4 and the surface of the resin composition 3A. In this embodiment, since the coated portion 13a is softened in step 8b, the coated portion 13a can further follow the shape of the circuit pattern 4 and the surface of the resin composition 3A.

[0059] Thus, by making the membrane 13 follow the shape of the circuit pattern 4 and the surface of the resin composition 3A, the membrane 13 not only comes into close contact with the surface of the conductive portion (metal portion) constituting the circuit pattern 4, but also enters the gap portion located between adjacent conductive portions, and also comes into close contact with the resin composition 3A exposed in the gap portion.

[0060] Furthermore, the laminate manufacturing apparatus 10 of this embodiment includes a receiving portion 11a. The surface of the resin composition 3A in the pre-pressing laminate 1A, mounted on the laminate manufacturing apparatus 10, is aligned with the peripheral surface 11b, resulting in a state where there is almost no height difference between them. Therefore, when the film 13 is brought into close contact, the elongation of the film 13 can be suppressed, allowing it to make close contact with both the resin composition 3A and the peripheral surface 11b. In addition, since the metal substrate 2 is generally quite thick, a large step difference occurs between the surface of the resin composition 3A and the peripheral surface 11b when the receiving portion 11a is not provided. In this case, even if the interior of the film 13 is vented or the film 13 is heated, it is sometimes difficult to follow the shape of the step difference. Furthermore, by forcibly following the shape of the step difference, the elongation of the film 13 becomes a problem, and there is a possibility of the film 13 breaking. On the other hand, in this embodiment, as described above, the elongation of the film 13 between the surface of the resin composition 3A and the peripheral surface 11b can be suppressed, thus effectively preventing such an undesirable situation. Furthermore, in order to ensure the conformability of the film 13 and prevent breakage, with the pre-pressed laminate 1A disposed in the receiving portion 11a, the peripheral surface 11b is preferably located between the back surface 3b of the resin composition 3A and the surface of the circuit body C (the surface 4a of the circuit pattern 4 in this embodiment).

[0061] In step 8d, the door (not shown) included in chamber 50 is opened, and the laminate manufacturing apparatus 10, which has undergone step 8c, is placed inside chamber 50 before the door is closed. Furthermore, the heating pad is removed before placing the laminate manufacturing apparatus 10 inside chamber 50.

[0062] In step 8e, while a pump (not shown) connected to the exhaust port 11e is used for suction, the heater and compressor are operated, thereby increasing the temperature and pressure within the chamber 50. Furthermore, by maintaining the state at a specified temperature and pressure for a specified time, the semi-cured resin composition 3A can be cured. In this embodiment, during the stage of placement within the chamber 50, the membrane 13 follows the shape of the circuit pattern 4 and the surface of the resin composition 3A in advance to form close contact with them. That is, as described above, the membrane 13 not only forms close contact with the surfaces of the conductive portions constituting the circuit pattern 4, but also enters the gaps between the conductive portions and forms close contact with the resin composition 3A exposed in the gaps. Therefore, the temperature and pressure within the chamber 50 are also effectively applied to the resin composition 3A exposed in the gaps. Additionally, since the laminate manufacturing apparatus 10 includes an opening 12a, the entire area of ​​the covered portion 13a is exposed within the chamber 50. That is, the circuit pattern 4 and the entire surface of the resin composition 3A can be uniformly heated at a specified temperature and uniformly pressurized at a specified pressure. Through this action, the semi-cured resin composition 3A can be cured while more reliably expelling gases (gas contained in voids or residual solvent, volatile low molecular weight components, gases generated by accompanying reaction effects, etc.) from the entire area of ​​the resin composition 3A.

[0063] The laminate manufacturing apparatus 10 of this embodiment is configured to include an opening 12a and can be disposed within a chamber 50 for use. Therefore, it is suitable for simultaneously performing operations to harden a semi-cured resin composition 3A relative to multiple pre-pressed laminates 1A. That is, when the size of the opening 12a is reduced (to about the size of an exhaust port 11e) and pressurized and heated gas is supplied from the small opening 12a, for the operation of hardening the semi-cured resin composition 3A relative to multiple pre-pressed laminates 1A, the connection for supplying the pressurized and heated gas must be installed in each of the respective openings 12a, thus causing difficulties in terms of workability. On the other hand, according to the laminate manufacturing apparatus 10 of this embodiment, the temperature and pressure inside the chamber 50 are applied to the pre-pressed laminate 1A through the opening 12a. Therefore, for the operation of hardening the semi-cured resin composition 3A relative to the multiple pre-pressed laminates 1A, it is only necessary to arrange the multiple laminate manufacturing apparatus 10 with the pre-pressed laminates 1A installed in the chamber 50, thereby improving productivity.

[0064] Furthermore, when working with multiple pre-pressed laminates 1A, a modified laminate manufacturing tool 10, which has multiple receiving portions 11a in the base clamp 11 and multiple openings 12a in the cover clamp 12, can also be used. Additionally, as shown in the figure, when using multiple laminate manufacturing tools 10 for mounting one pre-pressed laminate 1A, a manifold connecting the vent ports 11e to each other can also be used.

[0065] When performing this 8e step, the pressure inside the chamber 50 is preferably 0.8 MPa or more and 3.0 MPa or less, the temperature inside the chamber 50 is preferably 100°C or more and 350°C or less, and the time for maintaining the increased pressure and temperature is preferably 1 minute or more and 90 minutes or less. Furthermore, the pressure and temperature inside the chamber 50 can be varied for the purpose of properly curing the resin composition 3A; they can be set to remain constant during the stated time period or to vary according to the passage of time.

[0066] Then, in the ninth step, the laminate 1 removed from chamber 50 is formally hardened. As a specific example of carrying out the ninth step, the laminate 1 removed from chamber 50 is placed in a heating furnace and heated at a predetermined temperature for a predetermined time. This formally hardens the semi-hardened resin composition 3A. Furthermore, the ninth step is performed when the formal hardening of the resin composition 3A in the eighth step is not yet complete; if the formal hardening of the resin composition 3A in the eighth step is complete, the ninth step can be omitted.

[0067] In the tenth step, the laminate 1 with the insulating layer 3 formed is cleaned and various inspections are performed after the resin composition 3A has reached a formally hardened state.

[0068] The laminate 1 manufactured through the first to tenth processes described above was inspected, and as explained in the embodiments described later, it was confirmed to have sufficient voltage resistance. Furthermore, even after repeated heating of the laminate 1, no peeling of the insulating layer 3 from the circuit pattern 4 was observed, indicating a satisfactory result.

[0069] The following describes embodiments of the present invention. However, the present invention is not limited to these embodiments.

[0070] <Example>

[0071] Bisphenol A type epoxy resin (manufactured by DIC) is prepared as a thermosetting resin; diethyltoluenediamine (manufactured by Lonza) is prepared as a curing agent; alumina, boron nitride aggregates, and boron nitride micropowders are prepared as fillers; triphenylphosphine (manufactured by Beixing Chemical Industry Co., Ltd.) is prepared as a curing accelerator; and ethyl 3-ethoxypropionate is prepared as a solvent.

[0072] Then, the thermosetting resin and the curing agent are stirred at 70°C for 11 hours to make it into a prepolymer state (first step). Subsequently, the filler, curing accelerator, and solvent are added to the prepolymer state thermosetting resin and mixed using a mixer to generate a semi-cured resin composition (second step).

[0073] Here, the weight-average molecular weight of the resin composition after the second process is determined. The determined weight-average molecular weight is the polystyrene equivalent value determined by GPC (gel permeation chromatography). Additionally, tetrahydrofuran (THF) is used in the mobile phase for determination.

[0074] Measurement device: Waters e2695 separation module

[0075] Differential refractive index (RI) detector: Waters 2414 RI detector

[0076] Column: TSKgel guard column H

[0077] Column: TSKgel G1000H

[0078] Column: TSKgel G2000H

[0079] Column: TSKgel G3000H

[0080] Furthermore, the weight average molecular weight of the resin composition after the second process is 487.

[0081] Next, the generated resin composition is coated onto a strip of PET sheet and heated at 80°C for 40 minutes (third step). Afterward, the PET sheet coated with the resin composition is cut into specified sizes (fourth step). Then, the cut sheets are heated at 80°C for 20 minutes (fifth step).

[0082] Here, the weight-average molecular weight and density of the resin composition after the fifth process were determined. The method for determining the weight-average molecular weight was the same as that for the second process. The density was determined using an A&D electronic balance HR-250AZ and a specific gravity measuring kit AD-1653, following the Archimedes method. At this point, the weight-average molecular weight of the resin composition was 1700, and the density was 1.87 g / cm³. 3Furthermore, the solid density of the insulating layer when the resin composition is fully cured after the tenth step, as determined by the Archimedes method, is 2.10 g / cm³. 3 .

[0083] Then, the sheet from the fifth process is overlapped onto the metal substrate in a state where the resin composition is in contact with the metal substrate, and placed inside a vacuum pressing apparatus. Then, in a vacuum environment at 90°C inside the apparatus, the overlapped metal substrate and sheet are pressed at 23 MPa for 30 seconds (sixth process).

[0084] Here, the weight-average molecular weight and density of the resin composition after the sixth step are determined. The methods for determining the weight-average molecular weight and density are the same as those for the fifth step. At this point, the weight-average molecular weight of the resin composition is 1900, and the density is 2.00 g / cm³. 3 That is, in this embodiment, the increase rate of the weight average molecular weight in the resin composition is calculated as ((1900-1700) / 1700) × 100% based on the time before the compression force is applied, and is therefore 11.8%. Furthermore, in this embodiment, the density of the resin composition is calculated as (2.00 / 2.10) × 100% based on the actual density of the insulating layer after the compression force is applied, and is therefore 95.2%.

[0085] Subsequently, the PET sheet is peeled off from the semi-cured resin composition transferred to the metal substrate, and the circuit pattern (1 mm thick) is then overlapped to form a pre-pressing laminate (seventh step).

[0086] Then, as Figure 3 As shown, the pre-pressed laminate is installed in the laminate manufacturing apparatus (step 8a), the film is heated from the opening of the cover fixture (step 8b), the interior of the film covering the pre-pressed laminate is vented (step 8c), and then the laminate manufacturing apparatus with the pre-pressed laminate installed is placed in the chamber (step 8d). After that, the temperature and pressure in the chamber are increased while the interior of the film covering the pre-pressed laminate is vented (step 8e).

[0087] In step 8b, the membrane is heated to 110°C for 30 seconds. In step 8c, the membrane is heated to 110°C for 30 seconds while venting air from its interior. In step 8e, the temperature is 170°C for 10 minutes (the total time for heating up and holding at that temperature).

[0088] Next, the laminated material removed from the autoclave is heated at 185°C without pressure (atmospheric pressure) for 1 hour (step 9). Afterward, it is cleaned and subjected to the prescribed inspection (step 10).

[0089] Then, the laminates manufactured through the first to tenth processes were subjected to a withstand voltage test. Under the stated conditions, no abnormalities were found even when voltages of 3 kV to 9 kV were applied to the laminates, indicating a good result. Furthermore, after heating the manufactured laminates at 300°C for 5 minutes (after the first heating), internal inspection was performed using an ultrasonic flaw detector (SAT). No separation of the insulating layer from the circuit pattern was found in any of the laminates. Moreover, whether heated again at 300°C for 5 minutes (after the second heating) or further heated at 300°C for 5 minutes (after the third heating), no separation of the insulating layer from the circuit pattern was found in the manufactured laminates, indicating a good result.

[0090] This invention can also be used in manufacturing Figure 4 The laminate 21 shown is used in this embodiment. In addition to including the same structure as the metal substrate 2, insulating layer 3, and circuit body C (circuit pattern 4 in this embodiment), the laminate 21 also includes a second insulating layer 25 and a second circuit body 2C (second circuit pattern 26 in this embodiment) on the side opposite to the side of the metal substrate 22 where the insulating layer 23 and circuit pattern 24 are provided. The laminate 21 is composed of... Figure 5 The pre-crimping laminate 21A shown is manufactured as follows. The pre-crimping laminate 21A includes a resin composition 23A and a second resin composition 25A in a semi-cured state, which are formed by curing into an insulating layer 23 and a second insulating layer 25. The semi-cured resin composition 23A and the second resin composition 25A are manufactured using the same raw materials as the semi-cured resin composition 3A, and the circuit pattern 24 and the second circuit pattern 26 are manufactured using the same raw materials as the circuit pattern 4. Furthermore, the circuit body C and the second circuit body 2C can also be the aforementioned mounting body. This pre-crimping laminate 21A can be manufactured by setting the resin composition 3A in the pre-crimping laminate 1A, and setting the circuit pattern 24 and the second circuit pattern 26 in the step of setting the circuit pattern 4. That is, the pre-crimping laminate 21A can be manufactured by performing the first to seventh steps in the same way as the pre-crimping laminate 1A.

[0091] When manufacturing the laminate 21 from the pre-pressed laminate 21A, using Figure 5The laminate manufacturing apparatus 30 shown in this embodiment includes a base clamp 31, a cover clamp 32, a membrane 33, a second cover clamp 34, and a second membrane 35.

[0092] The base clamp 31 is shaped as if the bottom of the base clamp 11 were removed, and a receiving portion 31a, which is rectangular in shape when viewed from above and extends through the base clamp 31 in the vertical direction, is provided in the center. Moreover, the upper and lower surfaces (the upper peripheral surface 31b and the lower peripheral surface 31b) of the base clamp 31 located at the periphery of the receiving portion 31a are at the same height as the surfaces of the resin composition 23A and the second resin composition 25A when the pre-pressed laminate 21A is placed in the receiving portion 31a. Furthermore, similar to the laminate manufacturing apparatus 10, in this embodiment, to ensure the conformity of the membrane 33 and the second membrane 35 and to prevent breakage, when the laminate 21A is positioned in the receiving portion 31a before pressing, the upper peripheral surface 31b is preferably located between the back surface 23b of the resin composition 23A and the surface of the circuit body C (the surface 24a of the circuit pattern 24 in this embodiment), and the lower peripheral surface 31b is preferably located between the back surface 25b of the second resin composition 25A and the surface of the second circuit body 2C (the surface 26a of the second circuit pattern 26 in this embodiment). A pad 31c, formed of an elastic raw material and covering the entire circumference of the receiving portion 31a, is provided on the outer side of the peripheral surface 31b. Although not shown in the figure, an internal thread portion for holding the cover clamp 32 and the second cover clamp 34 on the base clamp 31 is provided on the outer side of the pad 31c. Furthermore, the base clamp 31 includes a passage 31d and an exhaust port 31e that have the same structure as the passage 11d and the exhaust port 11e.

[0093] In this embodiment, the cover clamp 32 and the second cover clamp 34 have the same shape as the cover clamp 12. Here, the opening provided in the central part of the cover clamp 32 is referred to as the opening 32a, and the opening provided in the second cover clamp 34 is referred to as the second opening 34a.

[0094] Furthermore, in the embodiment, membrane 33 and second membrane 35 are formed from the same raw material as membrane 13, and are thin and flexible.

[0095] When this pre-pressed laminate 21A is installed in the laminate manufacturing apparatus 30, after the pre-pressed laminate 21A is placed in the receiving portion 31a, the cover clamp 32 is installed in the base clamp 31 using screws (not shown) with the film 33 covering the surface of the circuit pattern 24 and the resin composition 23A. Furthermore, with the second film 35 covering the surface of the second circuit pattern 26 and the second resin composition 25A, the second cover clamp 34 is installed in the base clamp 31 using screws (not shown) (step 8a). In this state, at the opening 32a, the entire area of ​​the covered portion 33a of the film 33 covering the surface of the resin composition 23A and the circuit pattern 24 is exposed, and at the second opening 34a, the entire area of ​​the second covered portion 35a of the second film 35 covering the surface of the second resin composition 25A and the second circuit pattern 26 is exposed.

[0096] Then, the heating pad is brought into contact with the membrane 33 through the opening 32a to heat the membrane 33, and the second membrane 35 is brought into contact with the second opening 34a to heat the second membrane 35. A pump (not shown) is then connected to the exhaust port 31e for suction. This allows the membrane 33 to maintain close contact with the entire surface of the resin composition 23A, and also allows the second membrane 35 to maintain close contact with the entire surface of the second resin composition 25A (steps 8b and 8c).

[0097] Subsequently, the laminate manufacturing apparatus 30, having undergone the aforementioned process, is placed inside the chamber 50, and while suction is performed from the exhaust port 31e, the temperature and pressure inside the chamber 50 are increased. This allows gas to be expelled from the entire area of ​​the resin composition 23A and the second resin composition 25A, while simultaneously hardening the semi-cured resin composition 23A and the second resin composition 25A (steps 8d and 8e).

[0098] Then, as needed, a process is performed to formally harden the laminate 21 removed from chamber 50 (nine-step process), followed by cleaning or inspection (tenth-step process), thereby enabling manufacturing. Figure 4 The layered body 21 shown.

[0099] The foregoing has described one embodiment of the present invention, but the present invention is not limited to this specific embodiment. Various modifications and alterations can be made within the scope of the spirit of the invention as set forth in the claims, unless otherwise specified in the description. Furthermore, the effects described in the embodiment are merely illustrative of the effects produced by the present invention and do not imply that the effects of the present invention are limited to those effects.

[0100] For example Figure 3 The pad 11c shown is provided in the base clamp 11 in the embodiment described above, but it may also be provided in the cover clamp 12.

[0101] Furthermore, regarding the improved laminate manufacturing apparatus described above, which provides multiple receiving portions 11a in the base clamp 11 and multiple openings 12a in the cover clamp 12 when operating on multiple pre-pressed laminates, for example, it may also be as follows: Figure 6 It is constructed as shown in the apparatus 100 for manufacturing laminates.

[0102] Figure 6 The laminate manufacturing apparatus 100 shown is used to heat and pressurize the pre-pressed laminate 101A in place of the pre-pressed laminate 1A within the chamber 50. The pre-pressed laminate 101A includes a metal substrate 2, a semi-cured resin composition 3A, and a circuit pattern 4 (circuit body C) identical to those included in the pre-pressed laminate 1A. It also includes a semi-cured resin composition 103A and a circuit pattern 104 (circuit body C). Furthermore, a plurality of cylindrical fins 102a are provided on the lower surface of the metal substrate 102.

[0103] The laminate manufacturing apparatus 100 includes, in addition to the base clamp 111, cover clamp 112, and intermediate clamp 114, the aforementioned membrane ( Figure 6 (Not shown in the figure). The lamination manufacturing appliance 100 of this embodiment can install a total of four of the aforementioned pre-pressing laminates 101A.

[0104] In this embodiment, the base clamp 111 is made of metal and is generally rectangular in shape as shown in the figure. It has multiple (four in this embodiment) recessed receiving portions 111a that face downwards. The receiving portions 111a are sized to accommodate the pre-crushing laminate 101A and the intermediate clamp 114 on their inner sides. Furthermore, the upper surface (peripheral surface 111b) of the base clamp 111 located at the periphery of the receiving portion 111a is at the same height as the surface of the semi-cured resin composition 103A included in the pre-crushing laminate 101A, on which the intermediate clamp 114 is mounted, when the receiving portion 111a is placed. On the outer side of the peripheral surface 111b, a pad 111c made of an elastic raw material (such as rubber or an elastomer) is provided and surrounds the receiving portion 111a throughout its circumference. An internal thread 111f is provided on the outer side of the pad 111c for holding the cover clamp 112 on the base clamp 111. In addition, a passage 111d is provided inside the base clamp 111, which is connected to a plurality of receiving parts 111a respectively, and the passage 111d is connected to an exhaust port 111e provided on the side of the base clamp 111.

[0105] In this embodiment, the cover clamp 112 is made of metal and is generally rectangular in shape as shown in the figure. The cover clamp 112 includes a plurality of (four in this embodiment) openings 112a that extend through it in the vertical direction. The openings 112a are formed to be approximately the same size as the receiving portion 111a when viewed from above. In other words, the openings 112a are formed to expose the entire area of ​​the semi-cured resin composition 103A when viewed from above. In addition, the cover clamp 112 includes a through hole 112b that extends through the cover clamp 112 in the vertical direction at a position corresponding to the internal thread portion 111f provided on the base clamp 111.

[0106] In this embodiment, the intermediate clamp 114 is made of metal and is generally rectangular in shape as shown in the figure. The intermediate clamp 114 includes a plurality of circular holes (release holes 114a) that extend through it in the vertical direction. The fins 102a included in the metal substrate 102 are inserted into the release holes 114a. With the fins 102a inserted into the release holes 114a, the metal substrate 102 is supported by the intermediate clamp 114. In addition, one intermediate clamp 114 is prepared for one pre-press laminate 101A.

[0107] When heating and pressurizing multiple pre-pressed laminates 101A within the chamber 50 using this laminate manufacturing apparatus 100, the first to seventh steps described above are performed to prepare multiple pre-pressed laminates 101A. Then, intermediate clamps 114 are installed on each of the multiple pre-pressed laminates 101A, and the eighth to eighth steps described above are performed. Specifically, the pre-pressed laminate 101A with the intermediate clamps 114 installed is placed in the receiving portion 111a, and after covering the upper surface of the pre-pressed laminate 101A with a film (not shown), a screw (not shown) inserted into the through hole 112b is screwed into the internal thread portion 111f, thereby installing the cover clamp 112 onto the base clamp 111. At this time, the film is held by the gasket 111c and the cover clamp 112. Then, the heating pad is brought into contact with the membrane through the opening 112a to heat the membrane. A pump (not shown) is connected to the exhaust port 111e and suction is applied, thereby causing the membrane to follow the shape of the circuit pattern 104 and the surface of the resin composition 103A included in each pre-crimping laminate 101A. Afterwards, by performing steps from step 8d onwards, multiple pre-crimping laminates 101A can be heated and pressurized simultaneously.

[0108] Explanation of icon numbers

[0109] 1, 21: Layered bodies

[0110] 1A, 21A, 101A: Pre-pressed laminates

[0111] 2, 22, 102: Metal substrate

[0112] 3.23: Insulation layer

[0113] 3A, 23A, 103A: Resin compositions

[0114] 4, 24, 104: Circuit diagrams

[0115] 10, 30, 100: Equipment for manufacturing laminated bodies

[0116] 11, 31, 111: Base clamps

[0117] 11a, 31a, 111a: Containment Department

[0118] 11b, 31b, 111b: Peripheral plane

[0119] 11e, 31e, 111e: Exhaust port

[0120] 12, 32, 112: Cover clamps

[0121] 12a, 32a, 112a: Opening

[0122] 13, 33: Membrane

[0123] 13a, 33a: Covered part

[0124] 34: Second cover clamp

[0125] 34a: Second opening

[0126] 35: Second membrane

[0127] 35a: Second covered portion

[0128] 50: Chamber

[0129] C: Circuit body

[0130] 2C: Second circuit body

Claims

1. An apparatus for manufacturing a laminate, used in manufacturing a laminate in which a metal substrate, an insulating layer formed by curing a resin composition, and a circuit pattern with a thickness of 0.8 mm or more are sequentially stacked, or a mounting body (i.e., a circuit body) on which electronic components are mounted, is heated and pressurized in a chamber for pressing the laminate containing the metal substrate, the semi-cured resin composition, and the circuit body, wherein the apparatus comprises: A base clamp is used to install the pre-pressed laminate; A membrane, at least covering the resin composition and the circuit body; as well as A cover clamp holds the membrane between itself and the base clamp. The substrate clamp has an exhaust port for venting the interior of the film covering the resin composition and the circuit body. The cover clamp has an opening that exposes the entire area of ​​the film covering the resin composition and the circuit body.

2. The apparatus for manufacturing laminates according to claim 1, wherein... The base fixture includes: The receiving section is capable of housing the pre-pressed laminate on the inside; as well as The peripheral surface is located at the periphery of the receiving portion, and in the state where the receiving portion is provided with the pre-pressed laminate, it is located between the back side of the resin composition and the surface of the circuit body.

3. The apparatus for manufacturing laminates according to claim 1, wherein... The pre-pressing laminate consists of the resin composition and the circuit body laminated on the surface side of the metal substrate, and a semi-cured second resin composition and a second circuit body with a thickness of 0.8 mm or more laminated on the back side of the metal substrate. The apparatus for manufacturing the laminate includes: The second membrane at least covers the second resin composition and the second circuit body; as well as The second cover clamp holds the second membrane between itself and the base clamp. The second cover clamp has a second opening that exposes the entire area of ​​the second covered portion of the second film that covers the second resin composition and the second circuit body.

4. A method for manufacturing a laminate, using a laminate manufacturing apparatus, wherein the laminate manufacturing apparatus is used when manufacturing a laminate in which a metal substrate, an insulating layer formed by curing a resin composition, and a circuit pattern with a thickness of 0.8 mm or more are sequentially laminated, or a mounting body (i.e., a circuit body) on which electronic components are mounted, is heated and pressurized in a cavity, wherein the metal substrate, the semi-cured resin composition, and the circuit body are laminated. In the laminate manufacturing method... The apparatus for manufacturing the laminate includes: A base clamp is used to install the pre-pressed laminate; A membrane, at least covering the resin composition and the circuit body; as well as A cover clamp holds the membrane between itself and the base clamp. The substrate clamp has an exhaust port for venting the interior of the film covering the resin composition and the circuit body. The cover clamp has an opening that exposes the entire area of ​​the film covering the resin composition and the circuit body. The manufacturing method of the laminate includes the following steps: The pre-pressed laminate is mounted on the substrate clamp, and the membrane at least covers the resin composition and the circuit body. The membrane is held by the substrate clamp and the cover clamp. as well as The substrate clamp and the cover clamp that hold the membrane are arranged in the chamber. The interior of the membrane is vented from the exhaust port, and the temperature and pressure in the chamber are increased to heat and pressurize the covered portion exposed at the opening.

5. The method for manufacturing a laminate according to claim 4, comprising the steps of placing the substrate clamp holding the film and the cover clamp in the cavity, and heating the covered portion exposed at the opening.

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