Chip substrate reinforcing ring shaping method and device

Abstract

The invention discloses a chip substrate reinforcing ring shaping method and device, and relates to the technical field of chip substrate reinforcing ring shaping, and the method comprises the following steps: S1, positioning the position of a reinforcing ring; s2, loading shaping force to the edge of the product to the center in a gradient manner, and setting counter-acting force at the bottom of the product; s3, stabilizing the pressure after the shaping force is applied in place; and S4, the shaping force is released, and shaping of the reinforcing ring is completed. The inner contour and the outer contour of the stainless steel reinforcing ring can be precisely restrained, uniform shaping is achieved, wave-shaped distortion of the edge is avoided, and meanwhile the consistency and the stability of product morphology characteristics in batch production are guaranteed.

Description

Technical Field

[0001] This invention relates to the field of chip substrate reinforcing ring shaping technology, and more specifically to a method and apparatus for chip substrate reinforcing ring shaping. Background Technology

[0002] Currently, with the rapid development of the domestic semiconductor packaging industry, especially the large-scale application of computing chips, the precision requirements for components in computing chip packaging are becoming increasingly stringent. Chip substrate reinforcing rings are stainless steel reinforcing rings applied to computing chip substrates, and their morphology directly affects the packaging and testing quality of computing chips and the stability of subsequent processes.

[0003] In the actual production and processing of reinforcing rings, the product shaping process is a key step to ensure the dimensional accuracy and shape consistency of the product, which directly affects subsequent assembly and product performance.

[0004] Because PCB boards will experience slight natural warping under high soldering temperatures, in order to improve the mounting compatibility between the reinforcing ring and the PCB board, the reinforcing ring needs to match the slight warping of the PCB board in order to improve the chip packaging yield.

[0005] After the reinforcing ring is initially stamped (such as...) Figure 1 As shown), it is impossible to bond the reinforcing ring to the PCB board. To improve the bonding strength between the reinforcing ring and the PCB board, it is necessary to process pitting on its surface. However, the pitting process causes the reinforcing ring to bend (e.g., Figure 2 and Figure 4 As shown), the height difference between the reference planes is approximately 0.15-0.4 (e.g., ...). Figure 3 As shown, the height difference of the reference surface is measured as the difference between the lowest and highest points of the lower surface of the reinforcing ring. However, the height difference of the reference surface between the reinforcing ring and the PCB board needs to be no greater than 0.08, which makes it impossible to meet the mounting compatibility requirements between the reinforcing ring and the PCB board. Therefore, two shaping methods for the reinforcing ring have emerged on the market: roller leveling machines and punch presses. First, the reinforcing ring has pits evenly distributed on its surface. These pits are discontinuous interfaces of the ring surface. During the shaping process, the compressive stress will cause local stress concentration at the edge of the pits (the stress concentration factor is 1.5-2 times higher than that of the flat area). The pits cause uneven stress transmission, which increases the local arc deformation deviation and directly affects the shaping effect. Secondly, the reinforcing ring is also due to its unique shape (such as...) Figure 4 As shown), not only are the frame widths different, but the mechanical stiffness of the four corners is also much higher than that of the four straight edges (the corners are subject to bidirectional stress constraints, while the straight edges are subject to unidirectional stress constraints). During shaping, the plastic deformation resistance of the corners is greater, which can easily lead to problems such as the edge arc height being up to standard, the corner arc height being insufficient, or the corners being excessively deformed and slightly warped.

[0006] Currently, commonly used forming methods include roller forming and stamping forming.

[0007] When using roller-type shaping methods (such as...) Figures 5 to 7 As shown, the roller shaping method of the roller leveling machine is unevenly distributed along the radial direction of the product, and the inner and outer rings of the reinforcing ring are not sufficiently constrained, resulting in a wavy distortion of the overall state of the reinforcing ring after shaping, which cannot guarantee the overall shape and regularity of the product.

[0008] Using a punch press to shape the reinforcing ring is efficient, but due to the operating principle of the punch press and the influence of the mold, the punch press only makes instantaneous contact with the reinforcing ring and then resets, resulting in insufficient plastic deformation of the reinforcing ring; moreover, the punch cannot adapt to the height difference of the reference surface of the reinforcing ring, which is insufficient to cause the product to deform. Therefore, the punch press cannot complete this process during the product shaping process.

[0009] In conclusion, the existing technology obviously has inconveniences and defects in practical use, so it is necessary to improve it. Summary of the Invention

[0011] In view of the shortcomings of the prior art, the present invention solves the problem that the reinforcing ring in the traditional technology is limited by its unique shape and surface pitting, which causes the overall state of the reinforcing ring after being shaped by the roller leveler to be wavy and distorted; while the punch press only makes instantaneous contact with the reinforcing ring and then resets, and the punch cannot adapt to the height difference of the reference surface of the reinforcing ring, which is insufficient to cause product deformation.

[0012] To address the above problems, the present invention provides the following technical solution: The method for shaping the reinforcing ring on a chip substrate includes the following steps: S1: Locate the position of the reinforcing ring; S2: Apply a shaping force from the product edge to the center in a gradient, and set a reaction force at the bottom of the product; S3: After the shaping force is applied in place, the pressure is stabilized; S4: Release the shaping force to strengthen the ring and complete the shaping.

[0013] As an optimized solution, step S1 includes positioning the bottom surface of the reinforcing ring on the reaction force side and positioning the outer wall of the reinforcing ring.

[0014] As an optimized solution, step S1 includes positioning the top surface of the reinforcing ring on the side of the forming force, or simultaneously positioning the inner hole of the reinforcing ring. As an optimized solution, in step S2, the shape of the pressure surface of the shaping force and the reaction force is symmetrical to the arc shape of the top and bottom surfaces of the reinforcing ring.

[0015] As an optimized solution, in step S2, the height difference between the reference surfaces of the forming force and the reaction force is greater than the height difference between the reference surfaces of the top and bottom surfaces of the qualified reinforcing ring.

[0016] As an optimized approach, in step S2, the forming force pressure is 100-200 tons. As an optimized solution, in step S3, during the voltage stabilization process, the deformation direction of the reinforcing ring is set opposite to the deformation direction before shaping.

[0017] As an optimized solution, in step S3, the voltage is stabilized for 2-5 seconds; The present invention also discloses a chip substrate reinforcing ring shaping device, including an arc-shaped upper shaping surface disposed opposite to the warping direction of the top surface of the reinforcing ring, and an arc-shaped lower shaping surface disposed opposite to the warping direction of the bottom surface of the reinforcing ring. The curved upper shaping surface is subjected to pressure by a press.

[0018] As an optimized solution, it also includes a lower positioning insert, wherein a lower shaping insert is slidably provided along the inner edge of the lower positioning insert, the upper surface of the lower shaping insert is the arc-shaped lower shaping surface, and a preset height difference less than the product thickness is provided between the arc-shaped lower shaping surface and the upper surface of the lower shaping insert; The upper shaping insert, which moves vertically upwards above the lower shaping insert, has a lower surface that is the arc-shaped upper shaping surface.

[0019] As an optimized solution, the lower surface of the upper shaping insert is provided with an inner hole positioning boss that matches the inner hole of the reinforcing ring.

[0020] As an optimized solution, the lower positioning insert is fixed to the inner hole of the lower template, and the inner hole of the lower template and the outer wall of the upper shaping insert form a positioning mating surface.

[0021] As an optimized solution, the lower positioning insert has an inner hole, and the lower shaping insert is slidably connected to the inner hole of the lower positioning insert along the vertical direction, and forms the outer wall positioning surface of the reinforcing ring through the inner hole of the lower positioning insert.

[0022] As an optimized solution, the arc-shaped upper shaping surface includes a solid fitting surface that covers the entire outer shape of the reinforcing ring.

[0023] As an optimized solution, the arc-shaped upper shaping surface includes an annular solid mating surface that matches the upper surface of the reinforcing ring.

[0024] As an optimized solution, the arc-shaped upper shaping surface includes a shaping structure formed by an array of shaping needles based on the area of ​​the upper surface of the reinforcing ring, and an annular gap shaping surface is formed between the lower surfaces of the shaping needles.

[0025] As an optimized solution, a gap is provided between adjacent shaping needles.

[0026] As an optimized solution, the cross-sectional shape of the shaping needle includes one of the following: circular, elliptical, or polygonal.

[0027] As an optimized solution, the upper shaping insert is connected to the press via an upper template assembly.

[0028] As an optimized solution, the press includes a hydraulic press.

[0029] Compared with the prior art, the beneficial effects of the present invention are: This invention can precisely constrain the inner and outer contours of stainless steel reinforcing rings, achieving uniform shaping and avoiding edge wavy distortion. It also ensures the consistency and stability of product morphology characteristics during mass production. Specifically: The height difference between the inner hole of the lower shaping insert and the lower positioning insert is used to position the outer wall of the reinforcing ring, and the upper surface of the lower shaping insert supports the bottom surface of the reinforcing ring; the inner hole positioning boss of the lower surface of the shaping insert is used to position the inner hole of the reinforcing ring. By setting an arc-shaped upper shaping surface with a height difference greater than the top surface reference surface of the qualified product, and symmetrically aligning the arc-shaped upper shaping surface with the bending direction of the reinforcing ring, a shaping force is applied. Similarly, by setting an arc-shaped lower shaping surface with a height difference greater than the bottom surface reference surface of the qualified product, and symmetrically aligning the arc-shaped lower shaping surface with the bending direction of the reinforcing ring, a reaction force is applied to the reinforcing ring. This results in the reinforcing ring deforming in the opposite direction to its pre-shaping state during the shaping process, increasing the plastic deformation force of the reinforcing ring. This design leverages the significant height difference between the reference surfaces of the reinforcing ring before shaping. During the shaping process, the shaping surface on the arc first contacts the top edge of the reinforcing ring, and then contacts the center of the top surface. This achieves gradient loading of the shaping force, rather than the uniform force applied during planar flattening. After the mold is closed, it is stabilized for a certain period to increase the plastic deformation of the reinforcing ring. After the mold is opened, the springback of the stainless steel reinforcing ring allows it to return to the same bending direction as the product before shaping. However, the height difference between the reference surfaces during the shaping process will reach the same height difference as the reference surface matching the PCB board, thus completing the shaping of the reinforcing ring. The invention utilizes an arc-shaped lower shaping surface that matches the upper surface of the lower shaping insert with the bottom surface of the reinforcing ring, and an arc-shaped upper shaping surface that matches the lower surface of the lower shaping insert with the top surface of the reinforcing ring. With the cooperation of the press and related positioning structures, this invention overcomes the problem in traditional technology where the reinforcing ring is limited by its unique shape and surface pitting, leading to wavy distortion at the edge of the reinforcing ring after shaping by the roller leveling machine. In contrast, the stamping and shaping time of the punching mechanism is relatively short, which is insufficient to cause deformation of the product. Attached Figure Description

[0030] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0031] Figure 1 This is a schematic diagram of the initial shape of the reinforcing ring of the present invention; Figure 2 This is a schematic diagram of the structure of the reinforcing ring of the present invention after warping due to pitting during processing; Figure 3 This is a schematic diagram illustrating the height difference between the deformation point and the product reference surface after the reinforcing ring is machined to create pits according to the present invention. Figure 4 This is a schematic diagram showing the morphology measurement of the reinforcing ring after it has been processed to create pits. Figure 5 This is a schematic diagram showing the state of the reinforcing ring of the present invention during the shaping process by a roller leveling machine; Figure 6 This is a schematic diagram showing the state of the reinforcing ring of the present invention after it has been shaped by a roller leveling machine; Figure 7 This is a schematic diagram showing the morphology measurement of the reinforcing ring of the present invention after it has been shaped by a roller leveling machine; Figure 8 This is a schematic diagram of the structure of the reinforcing ring of the present invention after being shaped by the shaping method and device. Figure 9 This is a schematic diagram showing the morphology measurement of the reinforcing ring of the present invention after being shaped by the shaping method and device. Figure 10 This is a schematic diagram of the shaping device of the present invention; Figure 11 This is a schematic diagram of the solid bonding surface of the present invention; Figure 12 This is a schematic diagram of the structure of the annular solid bonding surface of the present invention; Figure 13 This is a schematic diagram of the structure of the shaping needle of the present invention.

[0032] In the diagram: 1-Lower positioning insert; 2-Lower shaping insert; 3-Reinforcing ring; 4-Upper shaping insert; 5-Inner hole positioning boss; 6-Arc-shaped lower shaping surface; 7-Arc-shaped upper shaping surface; 8-Lower template; 9-Lower fixing seat; 10-Lower mold base; 11-Lower shaping insert pad; 12-Upper shaping insert lower pad; 13-Upper shaping insert upper pad; 14-Upper shaping insert fixing seat; 15-Upper fixing seat; 16-Upper mold base; 17-Solid mating surface; 18-Annular solid mating surface; 19-Annular gap shaping surface; 20-Solid mating surface; 21-Annular solid mating surface; 22-Shaping pin. Detailed Implementation

[0033] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the technical solution of the present invention and are therefore intended to limit the scope of protection of the present invention.

[0034] like Figures 8 to 13 As shown, the chip substrate reinforcing ring shaping device includes an arc-shaped upper shaping surface 7 arranged in the opposite direction to the warping direction of the top surface of the reinforcing ring 3, and an arc-shaped lower shaping surface 6 arranged in the opposite direction to the warping direction of the bottom surface of the reinforcing ring 3. The curved upper shaping surface 7 is pressurized by a press.

[0035] It also includes a lower positioning insert 1, and a lower shaping insert 2 is provided on the inner edge of the lower positioning insert 1. The upper surface of the lower shaping insert 2 is an arc-shaped lower shaping surface 6. There is a preset height difference between the arc-shaped lower shaping surface 6 and the upper surface of the lower shaping insert 2 that is smaller than the product thickness. The upper shaping insert 4 moves vertically above the lower shaping insert 2, and the lower surface of the upper shaping insert 4 is an arc-shaped upper shaping surface 7.

[0036] The lower surface of the upper shaping insert 4 is provided with an inner hole positioning boss 5 that matches the inner hole of the reinforcing ring 3.

[0037] The lower positioning insert 1 is fixed to the inner hole of the lower template 8, and the inner hole of the lower template 8 and the outer wall of the upper shaping insert 4 form a positioning mating surface.

[0038] The lower positioning insert 1 has an inner hole, and the lower shaping insert 2 is slidably connected to the inner hole of the lower positioning insert 1 along the vertical direction, and forms the outer wall positioning surface of the reinforcing ring 3 through the inner hole of the lower positioning insert 1.

[0039] The curved upper shaping surface 7 includes a solid mating surface that covers the entire outer shape of the reinforcing ring 3.

[0040] The curved upper shaping surface 7 includes an annular solid mating surface that matches the upper surface of the reinforcing ring 3.

[0041] The arc-shaped upper shaping surface 7 includes a shaping structure formed by an array of several shaping needles 22 arranged according to the area of ​​the upper surface of the reinforcing ring 3, and an annular gap shaping surface 19 is formed between the lower surfaces of the several shaping needles 22.

[0042] There is a gap between adjacent shaping needles 22.

[0043] The cross-sectional shape of the shaping needle 22 includes one of the following: circular, elliptical, or polygonal.

[0044] The upper shaping insert 4 is connected to the press via the upper template assembly.

[0045] Presses include hydraulic presses.

[0046] The upper shaping insert 4 and the center inner hole of the lower mold base 10 are in clearance fit, with a clearance range of 0.01-0.03mm, which improves the mold closing guidance accuracy.

[0047] The lower shaping insert 2 and the lower positioning insert 1 are connected by a sliding fit in the inner hole. The sliding fit gap is controlled at 0.008-0.015mm, which ensures that the lower shaping insert 2 moves smoothly up and down and avoids radial offset during the shaping process. At the same time, the bottom of the lower shaping insert 2 is precisely connected to the lower oil cylinder of the shaping equipment to realize the automatic product ejection function.

[0048] The upper shaping insert 4 and the upper mold base 16 are detachable and tightly fitted structures. The lower positioning insert 1 and the lower shaping insert 2 are both detachable structures. By replacing inserts of different specifications, different sizes of reinforcing rings 3 can be adapted, taking into account both assembly accuracy and versatility. The shaping design is a curved surface design to match the product, with a compensation of 0-1.5mm.

[0049] The matching gap between the outer diameter of the boss of the upper shaping insert 4 and the inner diameter of the inner ring of the reinforcing ring 3 is 0.005-0.01mm, and the matching gap between the inner diameter of the positioning groove of the lower positioning insert 1 and the outer diameter of the outer ring of the reinforcing ring 3 is 0.005-0.01mm, to ensure the positioning accuracy of the product.

[0050] The shaping surfaces of the upper shaping insert 4 and the lower shaping insert 2 can be adjusted according to the shape and precision requirements of the reinforcing ring 3, and the surface roughness Ra≤1.0μm, which not only meets the shaping requirements of the product, but also ensures the surface quality of the reinforcing ring 3 after shaping.

[0051] The lower mold base 10 is connected to the lower worktable of the machine tool. It has an inner hole in the center, which is adapted to the shape of the inner hole of the upper mold base 16. The inner hole is tightly connected to the lower positioning insert 1. The lower fixed base 9 supports the lower template 8. The bottom of the lower shaping insert 2 is connected to the lower oil cylinder of the shaping equipment through the lower shaping insert pad 11.

[0052] The upper fixed seat 15 is connected to the upper mold seat 16 by screws, and the upper mold seat 16 is fixed to the worktable of the forming equipment. The upper fixed seat 15 is tightly connected to the upper forming insert 4 through the upper forming insert fixed seat 14, the upper forming insert upper pad 13, and the upper forming insert lower pad 12, ensuring assembly accuracy and structural stability.

[0053] This invention also discloses a method for shaping the reinforcing ring 3 on a chip substrate, comprising the following steps: S1: Locate the position of reinforcing ring 3; S2: Apply a shaping force from the product edge to the center in a gradient, and set a reaction force at the bottom of the product; S3: After the shaping force is applied in place, the pressure is stabilized; S4: Release the shaping force and strengthen ring 3 to complete the shaping.

[0054] Step S1 includes positioning the bottom surface of the reinforcing ring 3 on the reaction force side and positioning the outer wall of the reinforcing ring 3.

[0055] Step S1 includes positioning the top surface of the reinforcing ring 3 on the side of the forming force, or simultaneously positioning the inner hole of the reinforcing ring 3. In step S2, the shape of the pressure surface of the shaping force and reaction force is symmetrical to the arc shape of the top and bottom surfaces of the reinforcing ring 3.

[0056] In step S2, the height difference between the reference surfaces of the forming force and the reaction force is greater than the height difference between the top and bottom surfaces of the qualified reinforcing ring 3.

[0057] In step S2, the forming force is 100-200 tons. In step S3, during the voltage stabilization process, the deformation direction of the reinforcing ring 3 is set opposite to the deformation direction before shaping.

[0058] Step S3, stabilize the voltage for 2-5 seconds; The working principle of this device is as follows: The height difference between the inner hole of the lower shaping insert 2 and the lower positioning insert 1 is used to position the outer wall of the reinforcing ring 3, and the upper surface of the lower shaping insert 2 supports the bottom surface of the reinforcing ring 3; the inner hole positioning boss 5 of the lower surface of the shaping insert is used to position the inner hole of the reinforcing ring 3. By setting an arc-shaped upper shaping surface 7 with a height difference greater than that of the top surface reference surface of the qualified product by the upper shaping insert 4, and setting the arc-shaped upper shaping surface 7 symmetrically with the bending direction of the reinforcing ring 3, a shaping force is applied; similarly, by setting an arc-shaped lower shaping surface 6 with a height difference greater than that of the bottom surface reference surface of the qualified product by the lower shaping insert 2, and setting the arc-shaped lower shaping surface 6 symmetrically with the bending direction of the reinforcing ring 3, a reaction force is applied to the reinforcing ring 3, so that during the shaping process, the reinforcing ring 3 will deform in the opposite direction to that before shaping, thus increasing the plastic deformation force of the reinforcing ring 3; Taking advantage of the large height difference between the reference surfaces of the reinforcing ring 3 before shaping, the shaping surface 7 on the arc first contacts the top edge of the reinforcing ring 3 and then contacts the center of the top surface of the reinforcing ring 3 during the shaping process. This achieves gradient loading of shaping force, rather than uniform force application for flattening a plane. After the mold is closed, it is pressed for a certain period of time to increase the plastic deformation of the reinforcing ring 3. After the mold is opened, the springback of the stainless steel reinforcing ring 3 enables the reinforcing ring 3 to return to the same bending direction as the product before shaping. However, the height difference between the reference surfaces will reach the height difference between the reference surfaces that match the PCB board during the shaping process, thus completing the shaping of the reinforcing ring 3. Among them, the arc-shaped lower shaping surface 6, which matches the upper surface of the lower shaping insert 2 with the bottom surface of the reinforcing ring 3, and the arc-shaped upper shaping surface 7, which matches the lower surface of the lower shaping insert 2 with the top surface of the reinforcing ring 3, under the cooperation of the press and related positioning structure, overcomes the problem that in traditional technology, the reinforcing ring 3 is limited by its unique shape and surface distribution of pits, which causes the edge of the reinforcing ring 3 after the roller leveling machine to easily form a wavy distortion, while the stamping mechanism of the punching mechanism has a relatively short stamping and shaping time for the product, which is not enough to cause the product to deform. This invention can precisely constrain the inner and outer contours of the stainless steel reinforcing ring 3, achieve uniform shaping, avoid edge wavy distortion, and at the same time ensure the consistency and stability of the product morphology characteristics in mass production.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

Claims

1. A method for shaping a reinforcing ring on a chip substrate, characterized in that: Includes the following steps, S1: Locate the position of the reinforcing ring (3); S2: Apply a shaping force from the edge of the product towards the center in a gradient, and set a reaction force at the bottom of the product; S3: After the shaping force is applied in place, the pressure is stabilized; S4: Release the shaping force and strengthen the ring (3) to complete the shaping.

2. The chip substrate reinforcing ring shaping method according to claim 1, characterized in that: Step S1 includes positioning the bottom surface of the reinforcing ring (3) on the reaction force side and positioning the outer wall of the reinforcing ring (3); This includes positioning the top surface of the reinforcing ring (3) on the side of the forming force, or simultaneously positioning the inner hole of the reinforcing ring (3).

3. The chip substrate reinforcing ring shaping method according to claim 1, characterized in that: In step S2, the shape of the pressure surface of the shaping force and the reaction force is symmetrical to the arc shape of the top and bottom surfaces of the reinforcing ring (3); In step S2, the height difference between the reference surfaces of the pressure surfaces of the shaping force and the reaction force is greater than the height difference between the top and bottom surfaces of the qualified reinforcing ring (3).

4. The chip substrate reinforcing ring shaping method according to claim 1, characterized in that: In step S3, during the voltage stabilization process, the deformation direction of the reinforcing ring (3) is set opposite to the deformation direction before shaping.

5. The chip substrate reinforcing ring shaping method according to claim 1, characterized in that: In step S2, the forming force is 100-200 tons; in step S3, the pressure is stabilized for 2-5 seconds.

6. A chip substrate reinforcing ring shaping device, characterized in that: It includes an arc-shaped upper shaping surface (7) that is set in the opposite direction of the warping of the top surface of the reinforcing ring (3), and an arc-shaped lower shaping surface (6) that is set in the opposite direction of the warping of the bottom surface of the reinforcing ring (3). The arc-shaped upper shaping surface (7) is subjected to pressure by a press.

7. The chip substrate reinforcing ring shaping device according to claim 6, characterized in that: It also includes a lower positioning insert (1), and a lower shaping insert (2) is provided in the lower positioning insert (1) along the vertical direction. The upper surface of the lower shaping insert (2) is the arc-shaped lower shaping surface (6). There is a preset height difference between the arc-shaped lower shaping surface (6) and the upper surface of the lower shaping insert (2) that is smaller than the product thickness. The upper shaping insert (4) is vertically raised and lowered above the lower shaping insert (2), and the lower surface of the upper shaping insert (4) is the arc-shaped upper shaping surface (7).

8. The chip substrate reinforcing ring shaping device according to claim 7, characterized in that: The lower surface of the upper shaping insert (4) is provided with an inner hole positioning boss (5) that matches the inner hole of the reinforcing ring (3). The lower positioning insert (1) is fixed to the inner hole of the lower template (8), and the inner hole of the lower template (8) and the outer wall of the upper shaping insert (4) form a positioning mating surface; The lower positioning insert (1) has an inner hole, and the lower shaping insert (2) is slidably connected to the inner hole of the lower positioning insert (1) along the vertical direction, and forms the outer wall positioning surface of the reinforcing ring (3) through the inner hole of the lower positioning insert (1).

9. The chip substrate reinforcing ring shaping device according to claim 6, characterized in that: The arc-shaped upper shaping surface (7) includes a solid fitting surface that covers the entire outer shape of the reinforcing ring (3). Alternatively, the arc-shaped upper shaping surface (7) may include an annular solid mating surface that matches the upper surface of the reinforcing ring (3). Or the arc-shaped upper shaping surface (7) includes a shaping structure formed by an array of a number of shaping needles (22) according to the area of ​​the upper surface of the reinforcing ring (3), and an annular gap shaping surface (19) is formed between the lower surfaces of the number of shaping needles (22).

10. The chip substrate reinforcing ring shaping device according to claim 6, characterized in that: The press includes a hydraulic press.

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