Full-automatic online laser plate splitting machine

Abstract

The invention belongs to the technical field of laser plate splitting machines, and particularly relates to a full-automatic online laser plate splitting machine which comprises a bottom plate, a material conveying mechanism, a transferring mechanism, a laser cutting mechanism, a detecting mechanism and a discharging mechanism, and the material conveying mechanism, the transferring mechanism, the laser cutting mechanism, the detecting mechanism and the discharging mechanism are arranged on the bottom plate. The material conveying mechanism is used for conveying circuit boards to the transferring mechanism, the detection mechanism and the discharging mechanism, the laser cutting mechanism is used for cutting the circuit boards, the transferring mechanism is located below the laser cutting mechanism and used for conveying the circuit boards to move on stations of the material conveying mechanism and the laser cutting mechanism, and the detection mechanism is used for detecting the cut circuit boards. And the discharging mechanism is used for loading the detected circuit board. The full-automatic online laser board splitting machine is high in automation degree and high in size self-detection degree, and the consistency of production quality is guaranteed while the production efficiency is guaranteed.

Description

Technical Field

[0001] This invention belongs to the field of laser PCB depaneling technology, and particularly relates to a fully automatic online laser PCB depaneling machine. Background Technology

[0002] In the electronics manufacturing industry, PCB depaneling machines are crucial equipment used to separate multiple circuit boards into individual units. In the past, traditional manual board bending methods generated significant stress, severely impacting product quality, and have therefore been largely replaced by machine depaneling. Against this backdrop, various types of depaneling machines are now widely used in the market, including sliding blade, stamping, milling, laser, and saw blade machines. Among them, laser depaneling machines use a high-energy laser beam to perform non-contact cutting of circuit boards, achieving precise separation, and are particularly suitable for dividing connected circuit boards into individual units.

[0003] However, most existing laser PCB depaneling machines operate offline, requiring manual intervention for some processes, resulting in low depaneling efficiency. In contrast, a novel online laser PCB depaneling machine has been invented. It enables fully automated operation, achieving precise cutting and effectively eliminating stress generated during the cutting process, significantly reducing human error. This not only improves production efficiency but also ensures consistent product quality, better meeting the demands of modern electronics manufacturing for efficient and high-quality production. This online design solves the difficulties in automating existing laser PCB depaneling machines, greatly promoting technological progress in this field. Summary of the Invention

[0004] The purpose of this invention is to provide a fully automatic online laser PCB separator, which aims to solve the technical problem that most existing laser PCB separators are offline, requiring manual intervention to complete some processes, resulting in low PCB separator efficiency.

[0005] To achieve the above objectives, this invention provides a fully automatic online laser PCB separator, comprising a base plate and a material conveying mechanism, a transfer mechanism, a laser cutting mechanism, a detection mechanism, and a unloading mechanism mounted on the base plate. The material conveying mechanism transports circuit boards to the transfer mechanism, the detection mechanism, and the unloading mechanism. The laser cutting mechanism cuts the circuit boards. The transfer mechanism is located below the laser cutting mechanism and transports the circuit boards between the material conveying mechanism and the laser cutting mechanism. The detection mechanism detects the cut circuit boards, and the unloading mechanism loads the detected circuit boards.

[0006] Furthermore, the material handling mechanism includes a four-axis robot and two pick-up fixtures. The two pick-up fixtures are located at the drive end of the four-axis robot. The four-axis robot is used to drive the pick-up fixtures to move along the X-axis, Y-axis and Z-axis, and the four-axis robot drives the pick-up fixtures to rotate around their connection end with the four-axis robot. The pick-up fixtures are used to grip the circuit board.

[0007] Furthermore, the pick-up fixture includes a lifting cylinder, a mounting plate, and several suction nozzles. The lifting cylinder is located at the drive end of the four-axis robot, and the mounting plate is located at the drive end of the lifting cylinder. The lifting cylinder is used to drive the mounting plate to rise or fall. The rectangular array of suction nozzles is located at the lower end of the mounting plate, and the suction nozzles are used to pick up the circuit board.

[0008] Furthermore, the transfer mechanism includes an X-axis linear module, a Y-axis linear module, and a support fixture. The X-axis linear module is mounted on the base plate, and the Y-axis linear module is located at the drive end of the X-axis linear module. The X-axis linear module drives the Y-axis linear module to move along the X-axis direction. The support fixture is located at the drive end of the Y-axis linear module and drives the support fixture to move along the Y-axis direction. The support fixture supports the circuit board. The X-axis linear module and the Y-axis linear module cooperate to drive the support fixture to move on a plane parallel to the base plate.

[0009] Furthermore, a positioning CCD camera is also provided on one side of the support fixture, which is used to photograph the circuit board on the positioning support fixture.

[0010] Furthermore, the laser cutting mechanism includes a laser and a laser cutting head, with the laser cutting head connected to the laser and located above the transfer mechanism.

[0011] Furthermore, the testing mechanism includes a testing CCD camera, a testing hole is provided on the base plate, the testing CCD camera is located below the base plate, and the shooting end of the testing CCD camera is located inside the testing hole.

[0012] Furthermore, the feeding mechanism includes a board edge collection box, a good product turnover table, and a defective product placement table. The board edge collection box, the good product turnover table, and the defective product placement table are all set on the base plate and are used to load the material conveying mechanism to transport the cut circuit boards. The board edge collection box is used to collect the board edge waste of the circuit boards, the good product turnover table is used to place good circuit boards, and the defective product placement table is used to place defective circuit boards.

[0013] Furthermore, a dust removal mechanism is also provided on the base plate, which is used to clean dust and debris from the circuit board.

[0014] The fully automatic online laser PCB separator provided by this invention has at least one of the following technical effects: A material handling mechanism removes the circuit board (PCB) from the production line and moves it to a transfer mechanism. The transfer mechanism drives the PCB into the area below the laser cutting mechanism, which then begins PCB separation. After separation, the transfer mechanism automatically exits, and the material handling mechanism removes the separated product and the resulting PCB edge. The product is then transported to an inspection mechanism for dimensional inspection, and finally placed into a designated unloading mechanism for further processing, thus achieving automated operation. The fully automatic online laser PCB separator provided by this invention has a high degree of automation and high degree of self-inspection of dimensions, ensuring both production efficiency and consistent production quality. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a fully automatic online laser PCB separator provided in an embodiment of the present invention.

[0017] Figure 2 This is another structural schematic diagram of a fully automatic online laser depaneling machine provided in an embodiment of the present invention.

[0018] Reference numerals: 100, base plate; 110, inspection hole; 200, material handling mechanism; 210, four-axis robot; 220, pick-up fixture; 221, lifting cylinder; 222, mounting plate; 223, suction nozzle; 300, transfer mechanism; 310, X-axis linear module; 320, Y-axis linear module; 330, load-bearing fixture; 331, positioning CCD camera; 400, laser cutting mechanism; 410, laser; 420, laser cutting head; 500, inspection mechanism; 510, inspection CCD camera; 600, unloading mechanism; 610, plate edge collection box; 620, good product turnover table; 630, defective product placement table; 700, dust removal mechanism. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain embodiments of the present invention, and should not be construed as limiting the present invention.

[0020] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0023] In one embodiment of the present invention, reference is made to... Figures 1-2As shown, a fully automatic online laser PCB separator is provided, including a base plate 100 and a material conveying mechanism 200, a transfer mechanism 300, a laser cutting mechanism 400, an inspection mechanism 500, and a unloading mechanism 600 disposed on the base plate 100. The material conveying mechanism 200 is used to transport circuit boards to the transfer mechanism 300, the inspection mechanism 500, and the unloading mechanism 600. The laser cutting mechanism 400 is used to cut the circuit boards. The transfer mechanism 300 is located below the laser cutting mechanism 400 and is used to transport the circuit boards to move between the material conveying mechanism 200 and the laser cutting mechanism 400. The inspection mechanism 500 is used to inspect the cut circuit boards. The unloading mechanism 600 is used to load the inspected circuit boards. In this embodiment, the material handling mechanism 200 removes the circuit board (PCB) from the production line and moves it to the transfer mechanism 300. The transfer mechanism 300 drives the PCB into the area below the laser cutting mechanism 400, which then begins the PCB separation process. After separation, the transfer mechanism 300 automatically exits, and the material handling mechanism 200 removes the separated product and the resulting PCB edge. The product is then transported to the inspection mechanism 500 for dimensional inspection, and finally placed into the designated unloading mechanism 600 for further processing, thus achieving automated operation. The fully automatic online laser PCB separator provided by this invention features a high degree of automation and self-inspection of dimensions, ensuring both production efficiency and consistent product quality.

[0024] Specifically, refer to Figures 1-2As shown, the material handling mechanism 200 includes a four-axis robot 210 and two pick-up fixtures 220. The two pick-up fixtures 220 are disposed at the drive end of the four-axis robot 210. The four-axis robot 210 drives the pick-up fixtures 220 to move along the X, Y, and Z axes, and also drives the pick-up fixtures 220 to rotate around their connection end with the four-axis robot 210. The pick-up fixtures 220 are used to grip the circuit board. In this embodiment, the two pick-up fixtures 220 are disposed on the four-axis robot 210, so that the four-axis robot 210 moves the circuit board to the transfer mechanism 300. During the process of the transfer mechanism 300 driving the circuit board into the laser cutting mechanism 400 for cutting, the four-axis robot 210 can return to the circuit board loading position, the pick-up fixtures 220 pick up a new circuit board, and then move to one side of the transfer mechanism 300 to wait. When the laser cutting assembly completes the separation of the circuit board, the transfer mechanism 300 resets. The empty pick-up fixture 220 on the four-axis robot 210 first takes out the circuit board that has been separated from the transfer mechanism 300. Then, another pick-up fixture 220 puts the new circuit board into the transfer mechanism 300 for cutting the next board. At this time, the four-axis robot 210 passes the separated circuit board through the detection mechanism 500 for detection and the unloading mechanism 600 for unloading. After unloading is completed, the pick-up fixture 220 is driven again to pick up the new circuit board from the production line and wait on one side of the transfer mechanism 300.

[0025] Specifically, refer to Figures 1-2 As shown, the pick-up fixture 220 includes a lifting cylinder 221, a mounting plate 222, and several suction nozzles 223. The lifting cylinder 221 is located at the drive end of the four-axis robot 210, and the mounting plate 222 is located at the drive end of the lifting cylinder 221. The lifting cylinder 221 is used to drive the mounting plate 222 to rise or fall. The suction nozzles 223 are arranged in a rectangular array at the lower end of the mounting plate 222 and are used to pick up the circuit board. In this embodiment, the lifting cylinder 221 drives the mounting plate 222 to rise or fall, moving it closer to or away from the circuit board. By using the suction nozzles 223 to pick up the circuit board, scratches on the circuit board can be avoided. Furthermore, after the circuit board is separated into multiple boards, multiple circuit boards can be simultaneously picked up by the suction nozzles 223.

[0026] Specifically, refer to Figures 1-2As shown, the transfer mechanism 300 includes an X-axis linear module 310, a Y-axis linear module 320, and a support fixture 330. The X-axis linear module 310 is mounted on the base plate 100, and the Y-axis linear module 320 is mounted on the drive end of the X-axis linear module 310. The X-axis linear module 310 drives the Y-axis linear module 320 to move along the X-axis direction. The support fixture 330 is mounted on the drive end of the Y-axis linear module 320. The Y-axis linear module 320 drives the support fixture 330 to move along the Y-axis direction. The support fixture 330 supports the circuit board. The X-axis linear module 310 and the Y-axis linear module 320 cooperate to drive the support fixture 330 to move on a plane parallel to the base plate 100. In this embodiment, a support fixture 330 is used to support the circuit board. At the same time, the X-axis linear module 310 and the Y-axis linear module 320 cooperate to drive the support fixture 330 to move on a plane parallel to the base plate 100, so that the circuit board moves below the laser cutting mechanism 400 and cooperates with the laser cutting mechanism 400 to separate the circuit board.

[0027] Specifically, refer to Figures 1-2 As shown, a positioning CCD camera 331 is also provided on one side of the support fixture 330. The positioning CCD camera 331 is used to photograph the circuit board on the positioning support fixture 330. In this embodiment, the positioning CCD camera 331 performs visual positioning of the circuit board before it is cut. After positioning, it automatically adjusts the cutting position and cutting direction of the laser cutting mechanism 400. The degree of dimensional self-inspection is high, ensuring both production efficiency and consistent production quality.

[0028] Specifically, refer to Figures 1-2 As shown, the laser cutting mechanism 400 includes a laser 410 and a laser cutting head 420. The laser cutting head 420 is connected to the laser 410 and is located above the transfer mechanism 300. In this embodiment, the laser 410 emits laser light to the laser cutting head 420, and the laser cutting head 420 emits cutting laser light downwards to cut the circuit board on the carrier fixture 330.

[0029] Specifically, refer to Figures 1-2As shown, the inspection mechanism 500 includes an inspection CCD camera 510. A detection hole 110 is provided on the base plate 100. The inspection CCD camera 510 is positioned below the base plate 100, and its imaging end is located within the detection hole 110. In this embodiment, after the circuit board is separated, the material conveying mechanism 200 transports the separated circuit board to the inspection mechanism 500. The inspection CCD camera 510 inspects the already cut circuit board on the pick-up fixture 220 through the detection hole 110. After inspection, the separated circuit board is sent to the unloading mechanism 600 for unloading. Inspection before unloading ensures a high degree of dimensional self-inspection, guaranteeing both production efficiency and consistent production quality.

[0030] Specifically, refer to Figures 1-2 As shown, the unloading mechanism 600 includes a board edge collection box 610, a good product turnover table 620, and a defective product placement table 630. The board edge collection box 610, the good product turnover table 620, and the defective product placement table 630 are all mounted on the base plate 100 and are used to load the material conveying mechanism 200 to transport the cut circuit boards. The board edge collection box 610 is used to collect the board edge waste of the circuit boards, the good product turnover table 620 is used to place good circuit boards, and the defective product placement table 630 is used to place defective circuit boards. In this embodiment, after the circuit board is separated by the laser cutting mechanism 400, the pick-up fixture 220 picks up both the separated circuit board and its edges. Then, the edges are transported to the edge collection box 610 for unloading. After unloading, the remaining circuit boards are inspected by the inspection mechanism 500. Good products that pass the inspection are transported to the good product turnover table 620, while defective products that fail the inspection are transported to the defective product placement table 630. This achieves self-sorting, with a high degree of self-inspection of dimensions, ensuring both production efficiency and consistent production quality.

[0031] Specifically, refer to Figures 1-2 As shown, the base plate 100 is also equipped with a dust removal mechanism 700, which is used to clean dust and debris from the circuit board. In this embodiment, after the circuit board is detected as a good product by the inspection mechanism 500, it first enters the dust removal mechanism 700 for secondary dust removal before entering the good product turnover table 620. This ensures that the dust generated by the laser cutting mechanism 400 during the cutting of the circuit board is removed by the dust removal mechanism 700, thereby improving the quality of the circuit board separation.

[0032] The rest of this embodiment is the same as that in Embodiment 1. Features not explained in this embodiment are explained using the methods in Embodiment 1, and will not be repeated here.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fully automatic online laser PCB separator, characterized in that: The system includes a base plate and a material conveying mechanism, a transfer mechanism, a laser cutting mechanism, a testing mechanism, and a unloading mechanism mounted on the base plate. The material conveying mechanism is used to transport circuit boards to the transfer mechanism, the testing mechanism, and the unloading mechanism. The laser cutting mechanism is used to cut the circuit boards. The transfer mechanism is located below the laser cutting mechanism and is used to transport the circuit boards to move between the material conveying mechanism and the laser cutting mechanism. The testing mechanism is used to test the cut circuit boards. The unloading mechanism is used to load the tested circuit boards.

2. The fully automatic online laser PCB separator according to claim 1, characterized in that: The material handling mechanism includes a four-axis robot and two pick-up fixtures. The two pick-up fixtures are disposed at the drive end of the four-axis robot. The four-axis robot is used to drive the pick-up fixtures to move along the X-axis, Y-axis and Z-axis, and the four-axis robot drives the pick-up fixtures to rotate around their connection end with the four-axis robot. The pick-up fixtures are used to grip the circuit board.

3. The fully automatic online laser PCB separator according to claim 2, characterized in that: The picking fixture includes a lifting cylinder, a mounting plate, and several suction nozzles. The lifting cylinder is located at the drive end of the four-axis manipulator, and the mounting plate is located at the drive end of the lifting cylinder. The lifting cylinder is used to drive the mounting plate to rise or fall. Each suction nozzle is arranged in a rectangular array at the lower end of the mounting plate and is used to pick up circuit boards.

4. The fully automatic online laser PCB separator according to claim 1, characterized in that: The transfer mechanism includes an X-axis linear module, a Y-axis linear module, and a support fixture. The X-axis linear module is mounted on the base plate, and the Y-axis linear module is mounted on the drive end of the X-axis linear module. The X-axis linear module drives the Y-axis linear module to move along the X-axis direction. The support fixture is mounted on the drive end of the Y-axis linear module and drives the support fixture to move along the Y-axis direction. The support fixture supports the circuit board. The X-axis linear module and the Y-axis linear module cooperate to drive the support fixture to move on a plane parallel to the base plate.

5. The fully automatic online laser PCB separator according to claim 4, characterized in that: A positioning CCD camera is also provided on one side of the support fixture, which is used to photograph the circuit board on the support fixture.

6. The fully automatic online laser PCB separator according to claim 5, characterized in that: The laser cutting mechanism includes a laser and a laser cutting head, the laser cutting head being connected to the laser and located above the transfer mechanism.

7. The fully automatic online laser PCB separator according to claim 1, characterized in that: The detection mechanism includes a detection CCD camera, a detection hole is provided on the base plate, the detection CCD camera is located below the base plate, and the shooting end of the detection CCD camera is located inside the detection hole.

8. A fully automatic online laser PCB separator according to any one of claims 1 to 7, characterized in that: The feeding mechanism includes a board edge collection box, a good product turnover table, and a defective product placement table; the board edge collection box, the good product turnover table, and the defective product placement table are all mounted on the base plate and are used to load the material conveying mechanism to transport the cut circuit boards. The board edge collection box is used to collect the board edge waste of the circuit boards, the good product turnover table is used to place good circuit boards, and the defective product placement table is used to place defective circuit boards.

9. A fully automatic online laser PCB separator according to claim 8, characterized in that: The base plate is also equipped with a dust removal mechanism, which is used to clean dust and debris from the circuit board.

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